Spliced screen fitting method

Abstract

The invention relates to a splicing screen fitting method. According to the splicing screen attaching method, the groove of the LCD panel is filled with the bi-component glue, vacuum defoaming treatment is carried out, bubbles in the groove are effectively eliminated, uniform filling of the glue is ensured, and therefore the sealing performance and the moisture-proof capacity of the splicing screen are enhanced. The method not only solves the problems of insufficient moisture resistance, incoherent visual effect, insufficient protection performance, non-uniform glue filling, bubble residue and the like caused by lack of effective sealing treatment in the existing spliced screen manufacturing process, but also improves the display effect, realizes more coherent visual experience, and improves the overall performance of the spliced screen.

Description

Technical Field

[0001] The present invention relates to the technical field of display screen manufacturing, and in particular to a splicing screen laminating method. Background Art

[0002] With the continuous development of display technology, splicing screens are widely used in commercial display, security monitoring, command and dispatch, etc. due to their flexibility and scalability. Liquid Crystal Display (LCD), as a traditional splicing screen, is composed of light emitting diodes (LEDs) spliced ​​together. In the actual splicing process, multiple LED light groups are closely arranged together and fixed by special splicing brackets or frames to ensure the flatness and stability of the entire screen. The edges of each LED light group will be aligned to reduce the splicing gap, thereby achieving a seamless visual effect.

[0003] Since the mainstream splicing screen manufacturing process mostly adopts a simple mechanical splicing method and lacks effective sealing treatment, there are physical gaps between the display units, resulting in the following technical problems: First, the gaps between the LED light groups are easily penetrated by water vapor in a humid environment, causing corrosion of the liquid crystal electrode and causing permanent damage to the liquid crystal display LCD; second, the display screen presents an incoherent visual effect due to the obvious splicing gap, affecting the user experience; third, in the use scenario with high humidity, the protection performance of the traditional splicing screen is insufficient, resulting in reduced equipment reliability and even failure to operate normally. Although some processes have tried to reduce the gap by physical fixation or local filling materials, they have not solved the problems of uneven glue filling and residual bubbles, resulting in limited improvement in waterproof performance. In addition, the conventional dispensing process is prone to internal defects in the glue layer due to improper control of glue viscosity and incomplete degassing, which further affects the bonding strength and long-term stability. These technical defects have severely restricted the application of traditional splicing screens in complex environments. Therefore, an innovative bonding process that can achieve efficient sealing and eliminate bubbles is urgently needed. Summary of the invention

[0004] Based on this, the present application provides a splicing screen bonding method, which solves the problem of moisture in the gaps of the LCD panel by dispensing glue in the groove of the LCD panel and performing vacuum degassing treatment, while realizing efficient and automated production.

[0005] A splicing screen bonding method comprises the following steps:

[0006] S01, uses two-component glue to fill the groove of the LCD panel;

[0007] S02, performing vacuum degassing treatment on the LCD panel after glue dispensing to eliminate bubbles in the groove of the LCD panel;

[0008] S03, baking the LCD panel after vacuum degassing;

[0009] S04, laminating the cover plate and the optical adhesive film;

[0010] S05, laminating the cover plate to the LCD panel;

[0011] S06, after the cover plate and the LCD panel are bonded together, a degassing process is performed.

[0012] Furthermore, filling the groove of the LCD panel with the two-component glue includes: injecting the glue evenly along the edge of the groove so that the glue fills the groove.

[0013] Furthermore, the dispensing speed of the two-component glue is 0.1-2g / s.

[0014] Furthermore, vacuum degassing of the LCD panel is carried out in a degassing machine, the degassing vacuum degree is less than -97 kpa, the degassing temperature is 20-30° C., and the degassing time is 1-5 minutes.

[0015] Furthermore, the LCD panel is baked at 50-80° C. for 10-30 minutes.

[0016] Furthermore, the cover plate and the optical adhesive film are bonded under vacuum conditions of less than -97 kPa, with a main pressure of 0.035 MPa, a back pressure of 0.02 MPa, a bonding time of 10 s, and a decompression delay time of 3 s.

[0017] Furthermore, the cover plate and the LCD panel are bonded under vacuum conditions of less than -97 kPa, with a main pressure of 0.05 MPa, a back pressure of 0.03 MPa, a delayed bonding time of 3 s, a bonding time of 10 s, and a decompression delay time of 3 s.

[0018] Furthermore, after the cover plate and the LCD panel are bonded together, degassing is performed in a degassing machine with a degassing pressure of 0.15 MPa, a degassing temperature of 20-30° C., and a degassing time of 5-15 minutes.

[0019] Furthermore, the method further includes: before the cover plate and the LCD panel are attached to each other, pre-aligning the cover plate and the LCD panel to ensure the attachment accuracy.

[0020] Furthermore, it also includes: detecting the fit between the cover plate and the LCD panel, the detection is carried out using an optical detector, and the inspection standard is no bubbles, no foreign matter, and no scratches.

[0021] The above-mentioned splicing screen bonding method uses two-component glue to fill the groove of the LCD panel and performs vacuum degassing treatment, which effectively eliminates bubbles in the groove and ensures uniform filling of the glue, thereby enhancing the sealing performance and moisture-proof ability of the splicing screen. This method not only solves the problems of insufficient moisture-proof performance, inconsistent visual effects, insufficient protection performance, uneven glue filling and bubble residue caused by the lack of effective sealing treatment in the existing splicing screen manufacturing process, but also improves the display effect, achieves a more consistent visual experience, and improves the overall performance of the splicing screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 A splicing screen lamination and assembly flow chart provided by the present invention.

[0023] Figure 2 A flow chart of a splicing screen bonding method provided by the present invention.

[0024] Figure 3 A schematic diagram of glue dispensing in a groove of a spliced ​​screen LCD provided by the present invention.

[0025] The reference numerals in the specific implementation manner are as follows:

[0026] 1. LCD panel; 2. Tape; 3. Groove; 4. Glue A; 5. Glue B. DETAILED DESCRIPTION

[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0028] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0029] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0030] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0031] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0032] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0033] The present invention is described in detail below with reference to the accompanying drawings and specific embodiments.

[0034] The present application provides a splicing screen bonding method, which solves the problem of moisture in the gaps of the LCD panel by dispensing glue in the groove of the LCD panel and performing vacuum degassing treatment, while realizing efficient and automated production.

[0035] In order to facilitate understanding of the technical solution of the present application, a brief introduction to the splicing screen bonding process is first given.

[0036] Please refer to Figure 1 , Figure 1 This is a splicing screen bonding and assembly flow chart provided by the present invention. Because the splicing screen bonding process involves a complex production process, it is necessary to conduct quality inspection on the LCD panel and cover plate materials to ensure that all raw materials meet the production requirements. The LCD panel that passes the inspection will be taped around it. Next, a proper amount of glue is applied to the groove of the LCD panel. This step is crucial because it will directly affect the bonding strength and display effect of the panel. After the glue is applied, the LCD panel will undergo a degassing treatment. This process can effectively eliminate bubbles in the glue and ensure that the glue is evenly distributed, thereby avoiding uneven areas on the display screen. Subsequently, the LCD panel will enter the baking stage. The purpose of this step is to solidify the glue and form a stable bonding layer. After the baking is completed, the original tape around it is torn off to expose the edge of the panel.

[0037] At the same time, the cover plate will also go through a series of pre-treatment steps. First, the cover plate will be treated with plasma, which can clean the surface of the cover plate and increase its surface energy, thereby improving the bonding effect. Then, the cover plate will be attached with a layer of optical adhesive film, which can form an adhesive layer between the cover plate and the LCD panel.

[0038] After the cover plate and LCD panel are processed, they will be bonded. During the bonding process, it is necessary to ensure that no bubbles are generated, as this will affect the display effect of the screen. Therefore, after the bonding is completed, a degassing treatment will be performed to ensure that there are no bubbles in the screen. After the entire bonding process is completed, the spliced ​​screen will be quality inspected. This step includes checking the display effect, bonding strength and overall appearance of the screen to ensure that it meets the shipping standards.

[0039] refer to Figure 2 The splicing screen bonding method provided in this application includes the following steps:

[0040] S01, using two-component glue to fill the groove of the LCD panel.

[0041] Specifically, filling the groove of the LCD panel with two-component glue includes: uniformly injecting glue along the edge of the groove so that the glue fills the groove. The dispensing speed of the two-component glue is 0.1-2g / s. The two-component glue includes glue A (optical glue) and glue B (curing agent), and the viscosity of glue A ranges from 2000-3000cP.

[0042] The glue filling amount is calculated according to the formula Q=V×ρ×(1+α), where:

[0043] Q: Indicates the required glue filling amount, usually in grams (g) or milliliters (mL), depending on the density of the glue and usage habits.

[0044] V: represents the volume of the LCD panel groove, in cubic centimeters (cm³) or milliliters (mL), because the volume of 1 cm³ is equal to 1 mL.

[0045] ρ: represents the density of the glue, in grams per cubic centimeter (g / cm³). Density is an important physical property of glue, which affects the filling capacity of the glue and the physical properties after curing.

[0046] α: represents the overflow coefficient, which is a value between 0.05 and 0.1. This coefficient takes into account the glue overflow that may occur during the actual filling process. Since some glue may overflow from the groove during the filling process, or in order to ensure that the glue can fill the groove and form a uniform glue layer, a certain proportion of glue needs to be added, so this coefficient is introduced.

[0047] Specifically, first, the volume V of the LCD panel groove needs to be accurately measured or calculated. This can be obtained by directly measuring the dimensions of the groove (length, width, depth) and then calculating the volume, or using existing design data. The density ρ of the glue is another key parameter of the glue, which affects the filling amount of the glue and the physical properties after curing. The higher the density, the greater the filling amount of the glue, but it may also increase the hardness and brittleness of the glue. The overflow coefficient α is a safety factor used to compensate for glue overflow or uneven distribution that may occur during the filling process. By increasing α, it can be ensured that even if some glue overflows or is unevenly distributed, there is still enough glue in the groove to form a uniform glue layer. Substituting the groove volume V, glue density ρ and overflow coefficient α into the formula Q=V×ρ×(1+α), the required glue filling amount Q can be calculated.

[0048] For example, assuming that the volume V of the LCD panel groove is 100 cm³, the density ρ of the glue is 1.1 g / cm³, and the overflow coefficient α is selected as 0.08 (i.e., 8% overflow), the required glue filling amount Q is:

[0049] Q=100×1.1×(1+0.08)=100×1.1×1.08=118.8g

[0050] This means that in order to completely fill the groove and take into account possible overflow, about 118.8 grams of glue is required. Through this calculation method, the amount of glue used can be accurately controlled to avoid waste while ensuring the quality of the splicing screen.

[0051] S02, performing vacuum degassing treatment on the LCD panel after glue dispensing to eliminate bubbles in the groove of the LCD panel.

[0052] Specifically, the vacuum degassing of the LCD panel is carried out in a degassing machine, the degassing vacuum degree is less than -97kpa, the degassing temperature is 20-30°C, and the degassing time is 1-5 minutes. The vacuum degassing of the LCD panel is the whole machine degassing, that is, the entire LCD panel is placed in the degassing machine for degassing treatment.

[0053] S03, baking the LCD panel after vacuum degassing;

[0054] Specifically, the LCD panel is baked at 50-80° C. for 10-30 minutes.

[0055] S04, laminating the cover plate and the optical adhesive film;

[0056] Specifically, the cover plate and the optical adhesive film are bonded under the condition of vacuum degree <-97 kPa, the main pressure during bonding is 0.035 MPa, the back pressure is 0.02 MPa, the bonding time is 10 s, and the decompression delay time is 3 s.

[0057] S05, laminating the cover plate to the LCD panel;

[0058] Specifically, the cover plate and the LCD panel are bonded under vacuum conditions of less than -97 kPa, with a main pressure of 0.05 MPa, a back pressure of 0.03 MPa, a delayed bonding time of 3 s, a bonding time of 10 s, and a decompression delay time of 3 s.

[0059] S06, after the cover plate and the LCD panel are bonded together, a degassing process is performed.

[0060] Specifically, after the cover plate and the LCD panel are bonded together, degassing is performed in a degassing machine with a degassing pressure of 0.15 MPa, a degassing temperature of 20-30° C., and a degassing time of 5-15 minutes.

[0061] Furthermore, the cover plate after the incoming material inspection is subjected to plasma treatment.

[0062] Plasma treatment can improve the bonding effect between the cover plate and the LCD panel. In this step, the cover plate material is exposed to plasma, which is an ionized gas composed of ions, electrons and neutral particles. These active particles can react with molecules on the surface of the cover plate. The main purpose of plasma treatment is to clean the surface of the cover plate and increase its surface energy. During the production process, grease, dust or other organic contaminants may be adsorbed on the surface of the cover plate, which will hinder the effective bonding of the glue to the surface of the cover plate. Through plasma treatment, these contaminants can be effectively removed, thereby cleaning the surface. At the same time, the active particles in the plasma can also introduce new functional groups on the surface of the cover plate, such as hydroxyl, carboxyl, etc. These functional groups can increase the polarity of the surface of the cover plate and increase the interaction between it and the glue.

[0063] In addition, plasma treatment can also form a thin cross-linked layer on the surface of the cover plate, which can further enhance the bonding strength between the cover plate and the optical adhesive film. This treatment can ensure that the bond between the cover plate and the LCD panel is more secure and reduce the risk of bubbles and delamination during the bonding process.

[0064] In some embodiments of the present application, plasma treatment is usually performed in a vacuum or low-pressure environment to ensure the activity of the plasma and the treatment effect. The treatment time and power can be adjusted according to the characteristics of the cover material and the required surface energy. After the plasma treatment is completed, the surface of the cover will become easier to bond, laying a good foundation for subsequent bonding.

[0065] Furthermore, the splicing screen bonding method also includes pre-aligning the cover plate and the LCD panel before bonding the cover plate and the LCD panel. This step can avoid problems such as misalignment and offset during the bonding process, thereby improving the bonding accuracy.

[0066] In some embodiments of the present application, pre-alignment uses high-precision alignment equipment, such as an optical alignment system or a mechanical alignment device, to ensure precise alignment of the cover plate and the LCD panel. These devices can be automated or semi-automated, depending on the configuration and requirements of the production line. The operator or automated system adjusts the position of the cover plate according to the positioning marks until the edge or specific area of ​​the cover plate and the LCD panel are aligned. After the initial alignment, an optical detector or other inspection tool is used to confirm the alignment to ensure that there is no misalignment or offset. If a problem is found, the position of the cover plate needs to be readjusted.

[0067] Furthermore, the method also includes a fitting detection step to detect the fitting of the cover plate and the LCD panel. The detection is performed using an optical detector, and the inspection standards are no bubbles, no foreign matter, and no scratches.

[0068] In some embodiments of the present application, the fit detection is performed using a high-precision optical detector, which can quickly scan the entire surface of the spliced ​​screen, automatically detect and identify any possible defects, such as bubbles, foreign matter, scratches and other problems. The optical detector uses optical principles to emit light of a specific wavelength, illuminate the surface of the spliced ​​screen, and capture the reflected light. According to the reflection, refraction and absorption of light, the detector can analyze whether there are unevenness or foreign matter on the screen surface. During the detection process, the system will compare the detected image with the preset standard image, automatically identify the parts that do not meet the standards, and mark them on the display screen for the operator to review and process.

[0069] In addition, to further improve the accuracy and reliability of detection, the detection step may also be combined with machine learning algorithms to identify and classify different types of defects through pre-trained models. This method can not only increase the speed of detection, but also reduce misjudgments caused by human factors. During the inspection process, if any problems such as bubbles or foreign matter are found, the operator needs to rework the problem area in time. Only when the spliced ​​screen meets the quality standards can it enter the next step of packaging and shipping.

[0070] Specifically, refer to Figure 3 In the actual production process, the splicing screen bonding method of this application follows the following steps:

[0071] First, the LCD panel and cover plate are inspected for incoming materials to ensure that they meet production requirements. After the LCD panel 1 is taped with tape 2 on all sides, a two-component glue is injected into its groove 3. This glue consists of glue A 4 and glue B 5, and has a specific viscosity range to ensure that the glue can evenly fill the groove. Next, the LCD panel 1 after glue dispensing is subjected to vacuum degassing treatment. This step is carried out in a degassing machine to eliminate bubbles in the glue by setting appropriate vacuum, temperature and time. Subsequently, the LCD panel 1 is baked within a specific temperature range to cure the glue and form a stable bonding layer. After the baking is completed, the tape 2 on all sides is torn off to expose the edge of the LCD panel. At the same time, the cover plate is also pre-treated, including plasma treatment to clean the surface and increase the surface energy to improve the bonding effect, and then the optical adhesive film is attached. After the cover plate and LCD panel are treated, the bonding operation is carried out to ensure that no bubbles are generated during the bonding process. After the bonding is completed, a degassing treatment is performed to ensure that there are no bubbles in the screen. Finally, the spliced ​​screen is quality inspected using an optical detector to ensure there are no bubbles, foreign matter, or scratches, ensuring that the spliced ​​screen meets the shipping standards.

[0072] Furthermore, in the embodiments of the present application, each step of the splicing screen bonding method is carefully optimized to select the best operating parameters. The optimization of these parameters is based on a comprehensive consideration of glue performance, material properties and process efficiency, aiming to improve the bonding quality, enhance the reliability and durability of the screen, and improve production efficiency.

[0073] In some embodiments of the present application, the dispensing speed of the two-component glue in step S01 is 0.1-2g / s. The two-component glue includes glue A (optical glue) and glue B (curing agent), and the viscosity of glue A ranges from 2000-3000cP. In this embodiment, preferably, the dispensing speed of the two-component glue is 1g / s, which is determined based on the rheological properties of the glue and the geometric shape of the groove of the LCD panel. The two-component glue includes glue A (optical glue) and glue B (curing agent), and the viscosity of glue A is 2500cP. This viscosity value can ensure that the glue will not be too thin and flow during the dispensing process, nor will it be too viscous to affect the flow, thereby achieving uniform distribution of the glue in the groove. Such dispensing speed and viscosity settings help to avoid bubbles in the glue during the bonding process, ensure good contact between the glue and the panel, and thus improve the uniformity and bonding strength of the bonding.

[0074] In some embodiments of the present application, in step S02, vacuum degassing of the LCD panel is carried out in a degassing machine, the degassing vacuum degree is less than -97kpa, the degassing temperature is 20-30°C, and the degassing time is 1-5 minutes. In the present embodiment, preferably, vacuum degassing of the LCD panel is carried out in a degassing machine, the degassing vacuum degree is less than -97kpa, the degassing temperature is 25°C, and the degassing time is 1 minute. These parameters are set to achieve the best degassing effect in the shortest time while avoiding thermal damage to the LCD panel. The setting of the vacuum degree helps to extract air from the glue, while the appropriate temperature and time ensure the stability of the glue during the degassing process and prevent the glue from being degraded due to excessive heating.

[0075] In some embodiments of the present application, in step S03, the LCD panel is baked at 50-80°C for 10-30 minutes. In this embodiment, preferably, the LCD panel is baked at 70°C for 18 minutes. This combination of temperature and time is determined based on the curing characteristics of the glue, and is intended to ensure that the glue can be fully cured to form a stable adhesive layer, while avoiding panel damage or glue performance degradation caused by excessive temperature or excessive time.

[0076] In some embodiments of the present application, in step S06, after the cover plate and the LCD panel are bonded, degassing is carried out in a degassing machine, with a degassing pressure of 0.15 MPa, a degassing temperature of 20-30°C, and a degassing time of 5-15 minutes. In this embodiment, preferably, after the cover plate and the LCD panel are bonded, degassing is carried out in a degassing machine, with a degassing pressure of 0.15 MPa, a degassing temperature of 25°C, and a degassing time of 10 minutes. These parameters are set to reduce thermal stress on the screen while ensuring the degassing effect, and to avoid deformation or damage to the screen caused by excessive temperature or pressure. Appropriate degassing time helps to ensure that the bubbles in the glue are completely removed, thereby improving the display quality and service life of the screen.

[0077] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0078] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A splicing screen bonding method, characterized in that: The following steps are involved: S01, uses two-component glue to fill the groove of the LCD panel; S02, performing vacuum degassing treatment on the LCD panel after glue dispensing to eliminate bubbles in the groove of the LCD panel; S03, baking the LCD panel after vacuum degassing; S04, laminating the cover plate and the optical adhesive film; S05, laminating the cover plate to the LCD panel; S06, after the cover plate and the LCD panel are bonded together, a degassing process is performed.

2. A splicing screen bonding method according to claim 1, characterized in that: Filling the groove of the LCD panel with two-component glue includes: uniformly injecting glue along the edge of the groove so that the glue fills the groove.

3. A splicing screen bonding method according to claim 2, characterized in that: The dispensing speed of the two-component glue is 0.1-2g / s.

4. A splicing screen bonding method according to claim 1, characterized in that: The vacuum degassing of the LCD panel is carried out in a degassing machine, the degassing vacuum degree is less than -97 kpa, the degassing temperature is 20-30° C., and the degassing time is 1-5 minutes.

5. A splicing screen bonding method according to claim 1, characterized in that: The LCD panel is baked at 50-80° C. for 10-30 minutes.

6. A splicing screen bonding method according to claim 1, characterized in that: The cover plate and the optical film are bonded under vacuum conditions of <-97 kPa. The main pressure is 0.035 MPa, the back pressure is 0.02 MPa, the bonding time is 10 s, and the decompression delay time is 3 s.

7. A splicing screen bonding method according to claim 1, characterized in that: The cover plate and LCD panel are bonded under vacuum degree <-97kpa. The main pressure is 0.05mpa, the back pressure is 0.03mpa, the delayed pressing time is 3s, the pressing time is 10s, and the decompression delay time is 3s.

8. A splicing screen bonding method according to claim 1, characterized in that: After the cover plate is attached to the LCD panel, degassing is performed in a degassing machine with a degassing pressure of 0.15 MPa, a degassing temperature of 20-30° C., and a degassing time of 5-15 minutes.

9. A splicing screen bonding method according to claim 1, characterized in that: Also includes: Before the cover plate and the LCD panel are attached, the cover plate and the LCD panel are pre-aligned to ensure the attachment accuracy.

10. A splicing screen bonding method according to claim 1, characterized in that: Also includes: The fit between the cover plate and the LCD panel is detected by an optical detector, and the inspection standard is no bubbles, no foreign matter, and no scratches.

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