Information processing apparatus, exposure apparatus, article manufacturing method, storage medium, and computer program product

Abstract

The invention relates to an information processing apparatus, an exposure apparatus, a method of manufacturing an article, a storage medium, and a computer program product. An information processing device is characterized by comprising: a prediction unit that, in an exposure device that exposes a substrate, predicts exposure results for each of a plurality of regions of the substrate when each of the regions is exposed under each of a plurality of mutually different conditions; a calculation unit that calculates, with respect to each of the plurality of regions, a difference in exposure results for each of the plurality of conditions predicted by the prediction unit; and a display control unit that performs control such that the exposure results for each of the plurality of conditions predicted by the prediction unit and the differences calculated by the calculation unit are displayed in parallel on a user interface for each of the plurality of regions.

Description

Technical Field

[0001] The present invention relates to an information processing device, an exposure device, a method for manufacturing an article, a storage medium and a computer program product. Background Art

[0002] The exposure device transfers more than 10 layers of patterns (circuit patterns) on the substrate in an overlapping manner. However, if the overlapping accuracy of the patterns between the layers is not good, defects may occur in the circuit characteristics. In such a case, the chip does not meet the expected characteristics, the chip becomes a defective product, and the yield rate is reduced. Therefore, it is necessary to accurately align (align) each of the multiple areas (shooting areas) to be exposed on the substrate with the pattern of the original.

[0003] In the exposure device, the alignment marks arranged in each area on the substrate are detected, and the areas on the substrate are aligned with the pattern of the original plate based on the position information of the alignment marks and the position information of the pattern of the original plate. Ideally, the highest precision alignment can be achieved by detecting the alignment marks for all areas on the substrate, but this is not realistic from the perspective of productivity. Therefore, as disclosed in Japanese Patent Publication No. 62-84516, the global alignment method has become the mainstream as the alignment method of the substrate and the original plate.

[0004] In the global alignment method, it is assumed that the relative positions of each area on the substrate can be expressed by a function model of the position coordinates of the area, and the positions of the alignment marks of multiple sampling areas arranged on the substrate are measured. Next, based on the assumed function model and the measurement results of the position of the alignment mark, the parameters of the function model are estimated using statistical calculation processing of regression analysis. Moreover, the position coordinates of each area in the stage coordinate system (the arrangement of the areas on the substrate) are calculated using the parameters and the function model to perform alignment. As disclosed in Japanese Patent Publication No. 6-349705, in the global alignment method, generally speaking, a polynomial model with the stage coordinates as variables is used, and scaling, rotation, uniform offset, etc. of a first-order polynomial of the stage coordinates are mainly used. In addition, in Japanese Patent Publication No. 3230271, a technology using a regression model that also considers the higher-order components of the arrangement of the areas on the substrate as parameters is also proposed. Summary of the invention

[0005] In the global alignment method, in order to achieve high-precision calibration with high throughput, it is necessary to perform tests while changing the number and configuration of sampling areas on the substrate for multiple function models to optimize the function model, the number and configuration of sampling areas, etc. However, in the prior art, there is no means to intuitively confirm the improvement effect under each condition, so it is difficult to identify the changes in each condition and it is impossible to judge the appropriateness of the change (optimization) of the condition.

[0006] The present invention provides a technique suitable for judging the appropriateness of conditions set for an exposure device for exposing a substrate.

[0007] An information processing device as an aspect of the present invention is characterized in that it comprises: a prediction unit, which, in an exposure device for exposing a substrate, predicts, for each of a plurality of different conditions, exposure results for each region when each of a plurality of regions of the substrate is exposed under the condition; a calculation unit, which calculates, for each of the plurality of regions, the difference between the exposure results for each of the plurality of conditions predicted by the prediction unit; and a display control unit, which controls so that, for each of the plurality of regions, the exposure results for each of the plurality of conditions predicted by the prediction unit and the difference calculated by the calculation unit are displayed side by side on a user interface.

[0008] An information processing device as another aspect of the present invention is characterized in that information related to a first exposure result under a first condition in an exposure device that exposes each of a plurality of areas of a substrate, information related to a second exposure result under a second condition in the exposure device, and information related to a change in the second exposure result relative to the first exposure result are displayed in parallel on a user interface.

[0009] As a further aspect of the present invention, the exposure device is an exposure device for exposing a substrate, and is characterized in that it has a processing unit, which includes: a prediction unit, which predicts, with respect to each of a plurality of different conditions, an exposure result for each area of ​​a plurality of areas of the substrate when the area is exposed under the condition; a calculation unit, which calculates, with respect to each of the plurality of areas, the difference between the exposure results for each of the plurality of conditions predicted by the prediction unit; and a display control unit, which controls so that, with respect to each of the plurality of areas, the exposure result for each of the plurality of conditions predicted by the prediction unit and the difference calculated by the calculation unit are displayed side by side on a user interface.

[0010] A method for manufacturing an article according to another aspect of the present invention is characterized by comprising: a step of exposing a substrate using the exposure device; a step of developing the exposed substrate; and a step of manufacturing an article based on the developed substrate.

[0011] A storage medium according to still another aspect of the present invention is a computer-readable storage medium storing a computer program, and is characterized in that each unit of the above-mentioned information processing device is implemented when the computer program is executed by a processor.

[0012] A computer program product according to still another aspect of the present invention is a computer program product including a computer program, wherein each unit of the above-mentioned information processing device is implemented when the computer program is executed by a processor.

[0013] Further objects and other aspects of the present invention will become more apparent from the following embodiments described with reference to the accompanying drawings.

[0014] According to the present invention, for example, it is possible to provide a technique suitable for determining the appropriateness of conditions set for an exposure device that exposes a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram showing the structure of an exposure apparatus which is one aspect of the present invention.

[0016] Figure 2 It is a schematic diagram showing the structure of the alignment optical system.

[0017] Figure 3 It is used to illustrate Figure 1 Flowchart of exposure processing in the exposure device shown.

[0018] Figure 4 It is a diagram showing the arrangement of the shot regions on the substrate.

[0019] Figure 5 : is a diagram showing an example of the relationship between the number of sampling points and the calibration residual.

[0020] Figure 6 This is a diagram showing an example of a screen displayed as a user interface on a display unit in the related art.

[0021] Figure 7 FIG. 1 is a diagram showing an example of a screen displayed as a user interface on the display unit in the present embodiment.

[0022] Figure 8 FIG. 1 is a diagram showing an example of a screen displayed as a user interface on the display unit in the present embodiment.

[0023] Fig. 9 FIG. 1 is a diagram showing an example of a screen displayed as a user interface on the display unit in the present embodiment.

[0024] Fig.10 It is a diagram showing the arrangement of the shot regions on the substrate.

[0025] Fig.11 FIG. 1 is a diagram showing an example of a screen displayed as a user interface on the display unit in the present embodiment.

[0026] Fig.12FIG. 1 is a diagram showing an example of a screen displayed as a user interface on the display unit in the present embodiment. DETAILED DESCRIPTION

[0027] The following detailed description of the embodiments is given with reference to the accompanying drawings. In addition, the following embodiments do not limit the invention involved in the claims. A plurality of features are described in the embodiments, but these plurality of features are not necessarily all required in the invention, and a plurality of features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference number is added to the same or similar structure, and repeated descriptions are omitted.

[0028] Figure 1 1 is a schematic diagram showing the structure of an exposure device 1 as one aspect of the present invention. The exposure device 1 is a photolithography device used in the manufacturing process of devices such as semiconductor elements. In this embodiment, the exposure device 1 projects a pattern of an original plate 2 (intermediate mask or mask) onto a substrate 4 via a projection optical system 3 to expose the substrate 4.

[0029] like Figure 1 As shown, the exposure device 1 includes: a projection optical system 3 for projecting (reduced projection) a pattern formed on the original plate 2; and a chuck 5 for holding a substrate 4 on which a base pattern and an alignment mark are formed in a previous process. In addition, the exposure device 1 includes: a substrate mounting table 6 for supporting the chuck 5 and positioning the substrate 4 at a predetermined position; an alignment optical system 7 for measuring the position of the alignment mark on the substrate; a control unit CN; a storage unit SU; and a display unit DP.

[0030] The control unit CN is composed of, for example, a computer (information processing device) including a CPU, a memory, etc., and generally controls each unit of the exposure device 1 according to a program stored in the storage unit SU, etc. The control unit CN functions as a processing unit that not only controls the exposure process of exposing the substrate 4 via the original plate 2, but also finds the arrangement (shooting area arrangement, area arrangement) of a plurality of shot regions (a plurality of regions on the substrate) on the substrate. In addition, in the present embodiment, as described later, the control unit CN also functions as an information processing device that provides an index for evaluating the exposure result in the exposure device 1 that exposes the substrate 4.

[0031] The storage unit SU stores programs and various information (data) required for performing exposure processing to control each unit of the exposure device 1 to expose the substrate 4. The storage unit SU also stores programs and various information (data) required for the control unit CN to obtain the shot area arrangement.

[0032] The display unit DP is a display device for displaying various information related to the exposure device 1. In the present embodiment, the display unit DP includes a touch panel, displays various user interfaces (screens), and accepts operations from the user. In addition, the display unit DP may be configured integrally with the exposure device 1 (in a common housing) or separately from the exposure device 1 (in an independent housing). For example, the display unit DP may be provided in a management room where a user who manages the exposure device 1 resides.

[0033] Figure 2 : is a schematic diagram showing the structure of the alignment optical system 7. The alignment optical system 7 has a function of optically detecting a mark (alignment mark) assigned to each shooting area of ​​the substrate 4 to obtain position measurement data. In the present embodiment, the alignment optical system 7 includes a light source 8, a beam splitter 9, lenses 10 and 13, and a sensor 14. The light from the light source 8 is reflected by the beam splitter 9, and illuminates the alignment mark 11 or 12 formed on the substrate 4 via the lens 10. The light diffracted by the alignment mark 11 or 12 is received by the sensor 14 via the lens 10, the beam splitter 9, and the lens 13.

[0034] Reference Figure 3 , the exposure process in the exposure device 1 is described. Here, the steps until the substrate 4 is aligned and exposed are described.

[0035] In S101 , the substrate 4 is carried into the exposure device 1 . The substrate 4 carried into the exposure device 1 is held by the chuck 5 supported by the substrate mounting table 6 .

[0036] In S102, pre-alignment is performed. Specifically, the alignment mark 11 for pre-alignment on the substrate is detected by the alignment optical system 7 to roughly find the position of the substrate 4. At this time, the alignment mark 11 is detected for multiple imaging areas of the substrate 4 to find the overall displacement of the substrate 4 and the first linear component (magnification, rotation).

[0037] In S103, fine alignment is performed. Specifically, first, based on the result of pre-alignment, the substrate stage 6 is driven to a position where the alignment mark 12 for fine alignment on the substrate can be detected by the alignment optical system 7. In addition, the alignment mark 12 of each of the plurality of shot areas provided on the substrate 4 is detected by the alignment optical system 7, and the overall displacement and the first-order linear component (magnification, rotation) of the substrate 4 are precisely calculated. At this time, by calculating the positions of a large number of shot areas, the higher-order deformation components of the arrangement of the shot areas of the substrate 4 can be precisely calculated. Thus, the precise position of each shot area of ​​the substrate 4, i.e., the arrangement of the shot areas, can be calculated.

[0038] In S104, the substrate 4 is exposed. Specifically, the substrate 4 is positioned via the substrate stage 6 according to the shot area arrangement obtained by fine alignment, and each shot area of ​​the substrate 4 is exposed. Thus, the pattern of the original plate 2 is transferred to each shot area of ​​the substrate 4 via the projection optical system 3.

[0039] In S105 , the substrate 4 is unloaded from the exposure device 1 .

[0040] In the present embodiment, when the substrate 4 is skewed, the high-order deformation component is corrected in the fine alignment (S103). Here, as a regression model for estimating the arrangement of the imaging regions, a 5-dimensional polynomial model is used as an example for description, but the present invention is not limited thereto. For example, as a regression model, an arbitrary degree model may be used, and other models other than polynomials (trigonometric function model, logarithmic model) may be used.

[0041] When the deformation of the substrate 4 is represented by a fifth-order polynomial model, the positional offset (ShiftX, ShiftY) of each imaging region is represented by the following equation (1). The positional offset of each imaging region can also be referred to as a correction value (alignment correction value) for correcting the positional offset.

[0042]

[0043] In the formula (1), x and y represent the position of the imaging region of the substrate 4. Based on the actual position measurement data of each imaging region of the substrate 4, k1 to k2 in the formula (1) are determined. 42 Then, the position offset of each imaging area is obtained based on the equation (1) that determines the coefficient.

[0044] In order to obtain position measurement data, the alignment optical system 7 is for example Figure 4 As shown, the alignment mark 12 assigned to a part of the shot regions, so-called sampling shot regions (sampling regions), among the plurality of shot regions on the substrate is detected. Figure 4 In the example, the number of sampling shooting areas is set to 23, but it is not limited thereto, and the number of sampling shooting areas can be, for example, about 4 to 50. By increasing the number of sampling shooting areas, higher-order deformation components of the substrate 4 can be corrected, and position measurement data (actual measurement values) of coordinates of singular points of each substrate can be obtained, so that higher-precision alignment can be achieved. Here, the singular point refers to a defective part on the substrate, for example, a part where the coating of the resist is uneven, a part where the outer periphery is skewed, a part directly above the lift pin of the elevator of the chuck 5, etc.

[0045] Figure 5This is a diagram showing an example of the relationship between the number of sampled shot areas (number of sampling points) in a specific device and the calibration residual which is an indicator of calibration accuracy, with the horizontal axis representing the number of sampling points and the vertical axis representing the calibration residual. In addition, the calibration residual refers to the error that cannot be eliminated by calibration when calibrating the arrangement (offset) of multiple shot areas on a substrate in alignment. Specifically, the calibration residual is the calibration residual when the positional offset of each of the multiple shot areas is corrected using the shot area arrangement estimated by the regression model based on the position measurement data obtained by measuring the alignment marks assigned to the sampled shot areas.

[0046] As reference Figure 5 It can be seen that the more the number of sampling shooting areas is, the lower the calibration residual is. Therefore, from the perspective of calibration accuracy (measurement accuracy), it is desirable to have a large number of sampling shooting areas for obtaining position measurement data. However, the increase in the number of sampling shooting areas is in a trade-off relationship with the measurement time (alignment time), so in practice, the number of sampling shooting areas needs to be determined in consideration of the calibration accuracy and productivity required for each device.

[0047] Figure 6 1 is a diagram showing an example of a screen 60 displayed as a user interface on the display unit DP when determining the number of sampling imaging regions in the prior art. The screen 60 is provided by the control unit CN. The screen 60 includes a display area DA1 that displays the relationship between the number of sampling imaging regions (the number of sampling points), the correction residual, and the productivity. In the display area DA1, a graph (dashed line) showing (the transition of) the correction residual relative to the number of sampling points and a graph (solid line) showing (the transition of) the productivity relative to the number of sampling points are displayed. The productivity is represented by the number of substrates processed per unit time (wph). The user can refer to the graph (the relationship between the number of sampling points, the correction residual, and the productivity) displayed in the display area DA1 and select (designate) the number of sampling points that allow the correction residual and the productivity. For example, when the mouse pointer is superimposed on the graph displayed in the display area DA1, the partial area 101 including the position of the mouse pointer is displayed in a specific color by a flip effect. By clicking the mouse in the above state, the user can select the number of sampling points corresponding to the partial area 101. As described above, in the present embodiment, the display area DA1 functions as an interface for the user to designate the number of sample imaging areas.

[0048] In addition, the screen 60 includes a display area DA2 that displays the configuration of the sampling shooting area on the substrate corresponding to the number of sampling points specified via the display area DA1, and a map 102 that represents the correction residual of each of the plurality of shooting areas on the substrate. In the present embodiment, when the number of sampling points is specified, the control unit CN determines (optimizes) the configuration (position) of the sampling shooting area corresponding to the specified number of sampling points according to a predetermined algorithm. In addition, the control unit CN predicts the correction residual of each shooting area using the shooting area arrangement estimated by the regression model based on the position measurement data obtained by measuring the alignment mark assigned to the determined sampling shooting area. The configuration of the sampling shooting area determined in this way and the predicted correction residual of each shooting area are displayed as a map 102 in the display area DA2.

[0049] exist Figure 6 , when "16" is specified as the number of sampling points via the graphic displayed in the display area DA1, the configuration of the corresponding sampling imaging areas and the map 102 representing the correction residual of each imaging area are displayed in the display area DA2. Figure 6 In the display area DA2, the correction residual of each imaging area is displayed as a vector (arrow). The user can identify the configuration of the sampling imaging area corresponding to the designated number of sampling points and the correction residual of each imaging area by referring to (confirming) the map 102 displayed in the display area DA2. Figure 6 ), the correction residuals of each shooting area under the specified number of sampling points (conditions) can be identified, but the change of the correction residuals of each shooting area under the current number of sampling points, that is, the improvement effect, cannot be identified. Here, the current number of sampling points refers to the number of sampling points set before the user specifies (changes) the number of sampling points. In this way, in the conventional technology, it is difficult to identify the change of the correction residuals of each shooting area for each number of sampling points, and it is impossible to judge the appropriateness of the specified number of sampling points (changes in the number of sampling points).

[0050] Therefore, in this embodiment, a user interface is provided that allows the change of the correction residual of each imaging area for each number of sampling points to be easily recognized via the display unit DP.

[0051] Figure 71 is a diagram showing an example of a screen 70 displayed as a user interface on the display unit DP when determining the number of sampling shooting areas in the present embodiment. The screen 70 is an interface provided by the control unit CN for providing an indicator for evaluating the correction residual (exposure result in the exposure device 1) of each shooting area. The screen 70 includes a display area DA1 that displays the relationship between the number of sampling shooting areas (the number of sampling points) and the correction residual and productivity, and a display area DA2 that displays a map 102, similar to the prior art. However, in the present embodiment, in addition to the map 102, the display area DA2 also displays a map 103 that shows the configuration of the sampling shooting areas on the substrate corresponding to the current number of sampling points and the correction residual of each of the multiple shooting areas on the substrate. In addition, in the present embodiment, the display area DA2 also displays a difference map 104 that shows the difference (improvement effect) between the correction residual of each shooting area shown in the map 102 and the correction residual of each shooting area shown in the map 103. Figure 7 In the figure, as the difference map 104, the difference between the correction residual of each shooting area shown in the map 102 and the correction residual of each shooting area shown in the map 103 is displayed by color, more specifically, by the shade (gradation) of the color. However, as the difference map 104, the difference between the correction residual of each shooting area shown in the map 102 and the correction residual of each shooting area shown in the map 103 may be displayed by the type of color (hue) instead of the shade of the color. In this case, for example, by changing the current number of sampling points to the specified number of sampling points, the shooting area with improved correction residual is displayed in blue, and the shooting area with unimproved correction residual is displayed in red. In addition, in the present embodiment, the map 103 shows the correction residual predicted based on the position measurement data obtained by the alignment optical system 7, for example, the position measurement data of the superimposed target layer as the base, but it is not limited to this. The measurement result of the target layer and the measurement result of the overlap after exposure may also be shown in the map 103 as the correction residual.

[0052] Thus, in this embodiment ( Figure 7 ), the correction residuals of each imaging region corresponding to the current number of sampling points and the designated number of sampling points, and the improvement effect as the difference between them can be identified. Therefore, in this embodiment, for each of the plurality of imaging regions on the substrate, the change in the correction residuals (improvement effect) for each number of sampling points (condition) can be easily identified, and the appropriateness of the designated number of sampling points (change in the number of sampling points) can be determined.

[0053] In this embodiment, in order to Figure 7) is displayed on the display unit DP as a user interface, and the control unit CN functions as a prediction unit, a calculation unit, and a display control unit as described below. As described above, when the number of sampling points is specified, the control unit CN determines the arrangement of the sampling shooting area corresponding to the specified number of sampling points according to a predetermined algorithm, and also obtains the arrangement of the sampling shooting area corresponding to the current number of sampling points. Next, the control unit CN functions as a prediction unit, and predicts the correction residual (exposure result of each area) of each of the specified number of sampling points and the current number of sampling points (a plurality of conditions different from each other) as described above. Thus, a map 102 and a map 103 are generated. In addition, the control unit CN functions as a calculation unit, and calculates the difference of the predicted correction residual for each of the specified number of sampling points and the current number of sampling points for each shooting area. Thus, a difference map 104, which is the difference between the map 102 and the map 103, is generated. Furthermore, the control unit CN functions as a display control unit, and controls so that the predicted correction residual for each of the specified number of sampling points and the current number of sampling points and the difference between them are displayed in parallel on the display unit DP for each shooting area. As a result, a screen 70 displaying the map 102, the map 103, and the difference map 104 in parallel is displayed on the display unit DP as a user interface.

[0054] Alternatively, instead of using colors, Figure 8 As shown, the magnitude of the difference between the correction residual of each imaging region shown in the map 102 and the correction residual of each imaging region shown in the map 103 is shown by a vector. Figure 8 In the figure, as a difference map 105, the magnitude of the difference between the correction residual of each imaging area shown in the map 102 and the correction residual of each imaging area shown in the map 103 is displayed by a vector (vector expression indicated by an arrow). In this way, the difference map 105 may be displayed in the display area DA2 of the screen 70 instead of the difference map 104. Thus, the tendency of the change of the correction residual of each imaging area for each sampling point number can be easily recognized. For example, when there is a singular point on the substrate, the tendency of the change of the correction residual changes only in the imaging area where the singular point exists, so it is useful to recognize the singular point existing on the substrate.

[0055] In addition, you can also Fig. 9 As shown, the difference between the correction residual of each imaging region shown in the map 102 and the correction residual of each imaging region shown in the map 103 is shown in the graph 106. Fig.10 As shown in FIG. 1 , the number of shot regions on the substrate is considered to be “66”, and each shot region is identified by a shot region number. In this case, Fig. 9In the graph 106 shown, for each imaging area number (i.e., for each imaging area), the magnitude of the difference between the correction residual of each imaging area shown in the map 102 and the correction residual of each imaging area shown in the map 103 is displayed as a graph (numerical value). In addition, in the graph 106, the correction residual of each imaging area shown in the map 102 and the correction residual of each imaging area shown in the map 103 are also displayed as a graph (numerical value). In this way, the graph 106 may be displayed in the display area DA2 of the screen 70 instead of the difference map 104 or 105. In this way, the tendency of the change of the correction residual of each imaging area for each number of sampling points can be numerically recognized.

[0056] In addition, in reference Figures 7 to 9 In the embodiment described, the condition specified by the user is set as the number of sampling shooting areas, but it is not limited to this. For example, the condition specified by the user may also be the location of the sampling shooting area. Specifically, Fig.11 As shown, when the position (arrangement) of a part of the sampling shooting areas shown in the mapping 102 is arbitrarily changed, a mapping 107 including the arrangement of the sampling shooting areas reflecting the above-mentioned change is displayed in the display area DA2. In addition, for example, the position of the sampling shooting area can be changed by overlapping and dragging the mouse pointer to the sampling shooting area of ​​the object. When the position of the sampling shooting area is changed, the control unit CN predicts the correction residual of each shooting area based on the position measurement data obtained by measuring the alignment mark assigned to the changed sampling shooting area using the shooting area arrangement inferred by the regression model. The mapping 107 also shows the correction residual of each shooting area predicted in this way. In addition, in the display area DA2, a difference map 108 showing the difference (improvement effect) between the correction residual of each shooting area shown in the mapping 102 and the correction residual of each shooting area shown in the mapping 107 is also displayed. Fig.11 In the above, the correction residuals of each imaging area corresponding to the position (arrangement) of the sampling imaging area before and after the change, and the improvement effect as the difference between them can be identified. In this way, the condition specified by the user can also be information related to the sampling imaging area, that is, at least one of the number and position of the sampling imaging area.

[0057] In addition, in the present embodiment, the maps 102 and 103 represent the calibration residuals predicted from the statistical values ​​(average values, etc.) of the position measurement data obtained from each of the plurality of substrates for each of the plurality of different conditions (the number or positions of the sampling imaging regions). It is also possible to display the calibration residuals of each substrate under the same condition predicted from the position measurement data obtained from each of the plurality of substrates and their differences as maps.

[0058] In addition, the present invention has been described above by taking the evaluation of the correction residual (improvement effect) of the information on the sampled imaging regions, specifically the number and position of the sampled imaging regions, as an example in fine alignment, but the present invention is not limited to this.

[0059] For example, the present invention can also be used to evaluate the positional deviation in the height direction of each imaging area for the focus control parameter for controlling the position in the height direction of the substrate when exposing the substrate (improvement effect). Specifically, in the control unit CN, the positional deviation in the height direction of each imaging area is predicted for each of the current (before change) focus control parameter and the designated (after change) focus control parameter. Thus, Fig.12 As shown, a mapping 111 and a mapping 112 are generated, which represent the positional offset in the height direction of each shooting area corresponding to the current focus control parameter and the designated focus control parameter, respectively. In addition, the control unit CN calculates the difference in the predicted positional offset in the height direction for the current focus control parameter and the designated focus control parameter, respectively, for each shooting area. Thus, a difference mapping 113 is generated as the difference between the mapping 111 and the mapping 112. Furthermore, the control unit CN performs control so that, for each shooting area, the predicted positional offset in the height direction for the current focus control parameter and the designated focus control parameter, respectively, and their difference are displayed in parallel on the display unit DP. Thus, as shown Fig.12 As shown, as a user interface, a screen 80 showing the map 111, the map 112, and the difference map 113 in parallel is displayed on the display unit DP. Fig.12 In the figure, the positional deviation and the size of the difference in the height direction of each shooting area are displayed using color depth (gradient).

[0060] In this way, Fig.12 In the above, the positional offset in the height direction of each imaging area corresponding to the current focus control parameter and the designated focus control parameter, and the improvement effect as the difference between them can be identified. Therefore, the change in the positional offset in the height direction (improvement effect) of each focus control parameter (condition) can be easily identified for each of the plurality of imaging areas on the substrate, and the appropriateness of the designated focus control parameter can be determined.

[0061] The manufacturing method of the article in the embodiment of the present invention is suitable for manufacturing articles such as semiconductor elements, liquid crystal display elements, flat panel displays, MEMS, etc. The above-mentioned manufacturing method includes: a process of exposing a substrate coated with a photosensitive agent using the above-mentioned exposure device 1; and a process of developing the exposed photosensitive agent. In addition, the pattern of the developed photosensitive agent is used as a mask, and an etching process, an ion implantation process, etc. are performed on the substrate to form a circuit pattern on the substrate. These exposure, development, etching and other processes are repeated to form a circuit pattern consisting of multiple layers on the substrate. In the post-process, the substrate with the circuit pattern is cut (processed), and the chip is mounted, bonded, and inspected. In addition, the above-mentioned manufacturing method may include other well-known processes (oxidation, film formation, evaporation, doping, planarization, resist stripping, etc.). Compared with the past, the manufacturing method of the article in this embodiment is more advantageous in at least one of the performance, quality, productivity and production cost of the article.

[0062] The present invention can also be realized by providing a program that realizes one or more functions of the above-mentioned embodiments to a system or device via a network or a storage medium, and one or more processors in a computer of the system or device read out and execute the program. In addition, it can also be realized by a circuit (such as an ASIC) that realizes one or more functions.

[0063] The embodiments of the present invention may also be implemented by providing software (program) for executing the functions of the above embodiments to a system or device via a network or various storage media, and a computer or a central processing unit (CPU) or a microprocessing unit (MPU) of the system or device reads and executes the program.

[0064] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are attached to disclose the scope of the invention.

Claims

1. An information processing device, characterized in that: have: A prediction unit, in an exposure device for exposing a substrate, predicts, for each of a plurality of conditions different from each other, an exposure result of each region when each of a plurality of regions of the substrate is exposed under the condition; a calculation unit that calculates, for each of the plurality of areas, a difference in exposure results for each of the plurality of conditions predicted by the prediction unit; as well as The display control unit controls so that, for each of the plurality of areas, the exposure result for each of the plurality of conditions predicted by the prediction unit and the difference calculated by the calculation unit are displayed in parallel on the user interface.

2. The information processing device according to claim 1, characterized in that The prediction unit predicts, as the exposure result, a correction residual when correcting positional deviations of each of the plurality of regions by using an arrangement of the plurality of regions estimated using a regression model based on position measurement data obtained by measuring a flag assigned to a sampling region among the plurality of regions, The conditions include information related to the sampling area.

3. The information processing device according to claim 2, characterized in that: The information related to the sampling areas includes at least one of the number and the location of the sampling areas.

4. The information processing device according to claim 3, characterized in that: The plurality of conditions include a first number of the sampling regions and a second number of the sampling regions that is different from the first number, The first number is the current number of the sampling area. The second number is the number of the sampling areas specified by the user.

5. The information processing device according to claim 4, characterized in that The user interface includes an interface for specifying the number of the sampling areas.

6. The information processing device according to claim 1, characterized in that The prediction unit predicts a positional deviation in the height direction of each of the plurality of regions as the exposure result based on a focus control parameter for controlling the position in the height direction of the substrate when exposing the substrate. The conditions include the focus control parameters.

7. The information processing device according to claim 1, characterized in that: The display control unit performs control so that the size of the difference calculated by the calculation unit is displayed in color for each of the plurality of areas in the user interface.

8. The information processing device according to claim 1, characterized in that The display control unit performs control so that the magnitude of the difference calculated by the calculation unit is displayed as a vector for each of the plurality of regions in the user interface.

9. The information processing device according to claim 1, characterized in that: The display control unit performs control so that the magnitude of the difference calculated by the calculation unit is displayed as a graph on the user interface for each of the plurality of regions.

10. An information processing device, characterized in that: Information related to a first exposure result under a first condition in an exposure device that exposes each of multiple areas of a substrate, information related to a second exposure result under a second condition in the exposure device, and information related to a change in the second exposure result relative to the first exposure result are displayed side by side on a user interface.

11. The information processing device according to claim 10, characterized in that: Regarding each of the plurality of areas, information related to the first exposure result, information related to the second exposure result, and information related to the change are displayed in parallel on a user interface.

12. The information processing device according to claim 10, characterized in that: The first condition and the second condition include a condition related to at least one of the number of sampling regions selected from the plurality of regions and the arrangement of the sampling regions.

13. The information processing device according to claim 10, characterized in that: The information about the first exposure result and the information about the second exposure result include a correction residual when the position of each of the plurality of regions is corrected.

14. The information processing device according to claim 10, characterized in that: The information related to the change includes a difference between the first exposure result and the second exposure result.

15. An exposure device for exposing a substrate, characterized in that: A processing unit is provided, the processing unit comprising: a prediction unit that predicts, for each of a plurality of conditions that are different from each other, an exposure result of each region when each of a plurality of regions of the substrate is exposed under the condition; a calculation unit that calculates, for each of the plurality of areas, a difference in exposure results for each of the plurality of conditions predicted by the prediction unit; and The display control unit controls so that, for each of the plurality of areas, the exposure result for each of the plurality of conditions predicted by the prediction unit and the difference calculated by the calculation unit are displayed in parallel on the user interface.

16. A method for manufacturing an article, characterized in that: have: A step of exposing a substrate using the exposure device according to claim 15; A step of developing the exposed substrate; and A process of manufacturing an article based on the developed substrate.

17. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, each unit of the information processing device according to claim 1 is implemented.

18. A computer program product, comprising a computer program, characterized in that When the computer program is executed by the processor, each unit of the information processing device according to claim 1 is realized.

Images