Exposure method and exposure system of direct-writing imaging type exposure equipment

Abstract

The invention discloses an exposure method and an exposure system of direct-writing imaging type exposure equipment. The method comprises the following steps: acquiring actual positions of at least two first mark points of a first surface; according to the deviation between the actual position of each first mark point and the theoretical position of each first mark point, the deviation condition of the first surface is determined, and exposure of the first surface is executed by adopting a preset exposure condition when the first surface is not deviated; after the exposure of the first surface is completed, obtaining the actual positions of at least two second mark points of the second surface; according to the deviation between the actual position of each second mark point and the theoretical position of each second mark point, the deviation condition of the second surface is determined; and when the second surface does not deviate, determining the deviation condition of the to-be-exposed plate according to the deviation between the actual position of each first mark point and the actual position of each second mark point, so that the exposure of the second surface is executed by adopting a preset exposure condition when the to-be-exposed plate does not deviate. By utilizing the method, the alignment precision and the exposure yield of the plate to be exposed are improved.

Description

Technical Field

[0001] The present invention relates to the technical field of exposure of direct writing imaging type exposure equipment, and in particular to an exposure method and an exposure system of direct writing imaging type exposure equipment. Background Art

[0002] In the field of electronic manufacturing, laser direct imaging (LDI) equipment is used to expose the board to be exposed. It uses laser to accurately transfer the design pattern to the board to be exposed, laying the foundation for subsequent processes. This process requires extremely high accuracy and directly affects the performance and reliability of the circuit board.

[0003] In double-sided exposure, alignment accuracy is an important indicator that affects exposure quality. It determines whether the board is offset by comparing the actual measured value of the single-sided mark point with the theoretical value. However, this method only considers the offset of one side alone, so that the alignment accuracy requirements of the front and back sides are both within the deviation range, but one side is positively offset and the other two sides are negatively offset, making the actual position points on the two sides far apart, resulting in reduced alignment accuracy on both sides. Ultimately, the exposure yield of the board to be exposed is very low, wasting the board to be exposed and reducing production capacity. Summary of the invention

[0004] The present invention provides an exposure method and an exposure system of a direct-writing imaging exposure device, which can confirm the deviation of the first side and the second side of a plate to be exposed, thereby determining the deviation of the plate to be exposed, and then expose the second side when the plate to be exposed is not deviated, thereby improving the alignment accuracy and exposure yield of the plate to be exposed, saving plates and reducing costs.

[0005] In a first aspect, the present invention provides an exposure method of a direct writing imaging exposure device, wherein a plate to be exposed of the exposure device comprises a first surface and a second surface which are opposite to each other in a thickness direction, and the first surface and the second surface are respectively provided with first marking points and second marking points which are aligned with each other, comprising:

[0006] Acquire actual positions of at least two first marking points of the first surface;

[0007] Determine the deviation of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and perform exposure of the first surface using a preset exposure condition when the first surface is not deviated;

[0008] After the exposure of the first surface is completed, obtaining actual positions of at least two second marking points on the second surface;

[0009] Determine the position deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point;

[0010] When the second side is not deviated, the deviation of the plate to be exposed is determined according to the deviation between the actual position of each first marking point and the actual position of each second marking point, so that the second side can be exposed using the preset exposure conditions when the plate to be exposed is not deviated.

[0011] Optionally, determining the deviation of the plate to be exposed according to the deviation between the actual position of each first marking point and the actual position of each second marking point includes:

[0012] Determine the deformation of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point;

[0013] When the deformation of the first surface and the second surface meets the preset deformation condition, determining the position offset of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point;

[0014] When there is no positional offset between the first surface and the second surface, it is determined that the plate to be exposed is not offset.

[0015] Optionally, the preset deformation condition includes the first surface and the second surface deforming in the same proportion;

[0016] Determining deformation conditions of the first surface and the second surface according to actual positions of the first marking points and the second marking points includes:

[0017] Determine a first expansion / contraction value between the first surfaces and a second expansion / contraction value between the second surfaces according to the actual positions of the first marking points and the actual positions of the second marking points;

[0018] Determine a first difference between the first expansion / contraction value and the second expansion / contraction value according to the first expansion / contraction value and the second expansion / contraction value;

[0019] When the first difference is within a first preset difference threshold range, it is determined that the first surface and the second surface are deformed in the same proportion.

[0020] Optionally, determining a first expansion / contraction value between the first surfaces and a second expansion / contraction value between the second surfaces according to the actual positions of the first marking points and the actual positions of the second marking points includes:

[0021] Determine a first distance between the actual positions of the first marking points according to the actual positions of the first marking points, so as to determine a first expansion and contraction value of the first surface;

[0022] According to the actual positions of the second marking points, a second distance between the actual positions of the second marking points is determined to determine the second expansion and contraction value of the second surface.

[0023] Optionally, the actual position of the first marking point includes a first transverse coordinate position in the first direction and a first longitudinal coordinate position in the second direction, and the actual position of the second marking point includes a second transverse coordinate position in the first direction and a second longitudinal coordinate position in the second direction, and the first direction and the second direction are perpendicular;

[0024] Determining the position offset between the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point includes:

[0025] Determine, based on the actual position of each first marking point and the actual position of each second marking point, a second difference between a first transverse coordinate position of the actual position of each first marking point and a second transverse coordinate position of the actual position of each second marking point, a third difference between a first longitudinal coordinate position of the actual position of each first marking point and a second longitudinal coordinate position of the actual position of each second marking point, and a third distance between the actual position of each first marking point and the actual position of each second marking point;

[0026] When the second difference is within the second preset difference threshold range, the third difference is within the third preset difference threshold range, and the third distance is within the third preset distance threshold range, it is determined that no positional offset occurs between the first surface and the second surface.

[0027] Optionally, before determining the displacement of the first surface according to the deviation between the actual position of the first marking point and the theoretical position of the first marking point, and exposing the first surface using a preset exposure condition when the first surface is not displaced, the method further includes:

[0028] Make sure that the first surface is not deformed.

[0029] Optionally, determining that the first surface is not deformed includes:

[0030] Collecting the actual positions of at least three third marking points on the first side of another plate to be exposed in the same batch;

[0031] Determine a fourth distance between the actual positions of the first marking points according to the actual positions of the first marking points, and determine a fifth distance between the actual positions of the third marking points according to the actual positions of the third marking points;

[0032] A fourth difference between the fourth distance and the fifth distance is determined according to the fourth distance and the fifth distance, and when the fourth difference is within a fourth preset difference threshold range, it is determined that the first surface of the plate to be exposed is not deformed.

[0033] Optionally, the deviation includes a point deviation and a spacing deviation; the actual position of the first marking point includes a first transverse coordinate position in a first direction and a first longitudinal coordinate position in a second direction, and the first direction and the second direction are perpendicular;

[0034] Determining the deviation of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point includes:

[0035] According to the actual position of each first marking point and the theoretical position of each first marking point, a fitting theoretical position of each first marking point formed by fitting the actual position of each first marking point and the theoretical position of each first marking point is determined; the fitting theoretical position of the first marking point includes a first fitting transverse coordinate position in the first direction and a first fitting longitudinal coordinate position in the second direction;

[0036] According to the actual position of each first marking point and the fitted theoretical position of each first marking point, determine the fifth difference between the first lateral position coordinate of the actual position of each first marking point and the first fitted lateral coordinate position of the fitted theoretical position of each first marking point, the sixth difference between the first longitudinal position coordinate of the actual position of each first marking point and the first fitted longitudinal coordinate position of the fitted theoretical position of each first marking point, and the sixth distance between the actual position of each first marking point and the fitted theoretical position of each first marking point;

[0037] When the fifth difference is within the fifth preset difference threshold range, the sixth difference is within the sixth preset difference threshold range, and the sixth distance is within the sixth preset distance threshold range, determining that no inching deviation occurs on the first surface;

[0038] Determine a seventh distance between the fitted theoretical positions of the first marking points according to the fitted theoretical positions of the first marking points, and determine an eighth distance between the actual positions of the first marking points according to the actual positions of the first marking points;

[0039] A seventh difference between the seventh distance and the eighth distance is determined, and when the seventh difference is within a seventh preset difference threshold range, it is determined that no spacing deviation occurs on the first surface, so as to determine that the first surface is not deviated.

[0040] Optionally, the deviation includes a point deviation and a spacing deviation; the actual position of the second marking point includes a second transverse coordinate position in the first direction and a second longitudinal coordinate position in the second direction, and the first direction and the second direction are perpendicular;

[0041] Determining the deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point includes:

[0042] According to the actual position of each second marking point and the theoretical position of each second marking point, a fitting theoretical position of each second marking point formed by fitting the actual position of each second marking point and the theoretical position of each second marking point is determined; the fitting theoretical position of the second marking point includes a second fitting transverse coordinate position in the first direction and a second fitting longitudinal coordinate position in the second direction;

[0043] According to the actual position of each second marking point and the fitted theoretical position of each second marking point, determine the eighth difference between the second lateral position coordinate of the actual position of each second marking point and the second fitted lateral coordinate position of the fitted theoretical position of each second marking point, the ninth difference between the second longitudinal position coordinate of the actual position of each second marking point and the second fitted longitudinal coordinate position of the fitted theoretical position of each second marking point, and the ninth distance between the actual position of each second marking point and the fitted theoretical position of each second marking point;

[0044] When the eighth difference is within the eighth preset difference threshold range, the ninth difference is within the ninth preset difference threshold range, and the ninth distance is within the ninth preset distance threshold range, it is determined that no inching deviation occurs on the second surface;

[0045] Determine a tenth distance between the fitted theoretical positions of the second marking points according to the fitted theoretical positions of the second marking points, and determine an eleventh distance between the actual positions of the second marking points according to the actual positions of the second marking points;

[0046] A tenth difference between the tenth distance and the eleventh distance is determined, and when the tenth difference is within a tenth preset difference threshold range, it is determined that no spacing deviation occurs on the second surface, so as to determine that the second surface is not deviated.

[0047] In a second aspect, the present invention provides an exposure system of a direct-write imaging exposure device, comprising an image acquisition module, an exposure module and a control module; the control module is used to execute the exposure method of the direct-write imaging exposure device.

[0048] The technical solution of the present invention obtains the actual positions of at least two first marking points on the first surface; determines the displacement of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and performs exposure of the first surface using the preset exposure conditions when the first surface is not displaced; after the first surface is exposed, obtains the actual positions of at least two second marking points on the second surface; determines the displacement of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point; when the second surface is not displaced, determines the displacement of the plate to be exposed according to the deviation between the actual position of each first marking point and the actual position of each second marking point, so as to perform exposure of the second surface using the preset exposure conditions when the plate to be exposed is not displaced. By using the above method, the displacement of the first surface and the second surface of the plate to be exposed is confirmed, so as to determine the displacement of the first surface and the second surface of the plate to be exposed, and the second surface is exposed when the plate to be exposed is not displaced, thereby improving the alignment accuracy and exposure yield of the plate to be exposed, saving plates, and reducing costs.

[0049] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0051] Figure 1 A flow chart of an exposure method of a direct writing imaging exposure device provided in Embodiment 1 of the present invention;

[0052] Figure 2 A flow chart of an exposure method of a direct writing imaging exposure device provided in Embodiment 2 of the present invention;

[0053] Figure 3 A flowchart of an exposure method of a direct writing imaging exposure device provided in Embodiment 3 of the present invention;

[0054] Figure 4 This is a schematic diagram of the structure of an electronic device provided in Embodiment 5 of the present invention. DETAILED DESCRIPTION

[0055] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0056] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0057] Embodiment 1

[0058] Figure 1The present invention provides a flowchart of an exposure method of a direct writing imaging exposure device according to the first embodiment of the present invention. The present embodiment can be applied to confirming the deviation of the first surface and the second surface of the plate to be exposed to improve the alignment accuracy of the plate to be exposed. The method can be performed by the exposure system of the direct writing imaging exposure device. The plate to be exposed of the direct writing imaging exposure device includes a first surface and a second surface that are mutually opposed in the thickness direction. The first surface and the second surface are respectively provided with a first marking point and a second marking point that are aligned with each other. Generally, when the first marking point is set on the first surface, at least two first marking points are set to ensure accuracy. When there are two first marking points, the two first marking points are respectively located at the center of the exposure device and at any vertex position of the exposure device; when there are three first marking points, the three first marking points are respectively located at any three vertex positions of the plate to be exposed. Similarly, when there are two second marking points on the second surface, the two second marking points are respectively located at the center of the exposure device and at any vertex position of the exposure device; when there are three second marking points on the second surface, the three second marking points are respectively located at any three vertex positions of the exposure device, and each first marking point is aligned with the second marking point. In addition, the plate to be exposed of the direct writing imaging exposure device may include various semiconductor and non-semiconductor exposure materials that require exposure operations, such as PCB boards, wafers, flexible circuit boards (FPCs) and flat panel displays (FPDs). For simple explanation, this application will be described later by taking the plate to be exposed of the direct writing imaging exposure device as a PCB board as an example. When setting the first marking point and the second marking point, a laser process can be used to punch holes at a preset edge position to form a through hole, and the positions at both ends of the through hole are the first marking point and the second marking point. It is also possible to use a laser marking device to mark the first surface before placing the PCB board to form a first marking point, then place the PCB board and align the first surface, and then mark the second surface after alignment to form a second marking point. The specific method can be determined according to the actual situation and is not limited here. The shapes of the common first marking point and the second marking point include graphics or graphic combinations, graphics include but are not limited to circles, triangles, rectangles or crosses, etc., graphic combinations include combinations formed by graphics, and the combination methods include but are not limited to a combination of a Chinese character, a four-petal plum blossom combination or a pentagon combination. When identifying and locating the first marker point and the second marker point, in addition to obtaining the actual position of the center point, the actual graphic parameters of the remaining position points except the center point can also be obtained. Specifically, if the first marker point and the second marker point are solid circles, the specific position (such as the center of the circle) and radius value of each first marker point and the second marker point can be obtained after positioning.In this implementation, the cross has twelve vertices, eight sides and one center point; the rectangle has four vertices, four sides and one center point; the circle has a center and a radius; in the combination of circles, in addition to the radius and center position of the three circles, the distance between the centers of the three circles is also included; in the combination of four-petal plum blossoms composed of a cross, in addition to the actual graphic parameters of the cross, the distance between the center points of the five cross graphics and the distance between the vertices of the five cross graphics are also included. The specific parameters can be determined according to the actual situation and are not limited here. Figure 1 As shown, the method includes:

[0059] S110. Obtain actual positions of at least two first marking points on the first surface.

[0060] Specifically, after the first marking point is determined, the actual positions of at least two first marking points of the first surface acquired by the image acquisition module and other devices are acquired. When there are two first marking points, the actual positions of the two first marking points are acquired; when there are three first marking points, the actual positions of the three first marking points are acquired; when there are four first marking points, the actual positions of the four first marking points are acquired. The actual position of the first marking point may be an actual coordinate position including a horizontal coordinate and a vertical coordinate.

[0061] S120, determining the displacement of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and executing the exposure procedure of the first surface using a preset exposure condition when the first surface is not displaced.

[0062] Specifically, after collecting the actual positions of at least two first marking points on the first surface, since each first marking point has a corresponding initial theoretical position and the actual position of the first marking point after marking, the deviation of the first surface of the PCB board can be determined according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point. In this embodiment, when it is determined that the actual position of the first marking point is within the preset deviation range of the theoretical position of the first marking point, it can be determined that the first surface has not been deviated, wherein the preset deviation range can be determined according to the actual situation and is not limited here. In addition, the deviation of the marking point is usually caused by the deviation of the placement position of the plate to be exposed or the deformation of the plate to be exposed. Therefore, the calculation method of the JEPE value can also be used to fit the actual position and theoretical position of the first marking point to form a new fitting theoretical position of the first marking point. According to the deviation between the fitting theoretical position and the actual position of the first marking point, when the deviation is within the preset deviation range, it can be determined that the first surface has not been deviated. Among them, the JE value can be used to determine the position information of the PCB board, and the PE value can be used to determine the deformation information of the PCB board. At the same time, the above two methods can also be used to simultaneously determine the deviation of the first surface. When both conditions are met, it can be determined that the first surface has not been deviated. No limitation is made here. When it is determined that the first surface has not been deviated, it indicates that the first surface meets the exposure requirements, and then the exposure program is run to instruct the exposure module to use the preset exposure conditions to expose the first surface. The preset exposure conditions can be actually determined according to the actual exposure requirements, and no limitation is made here. For example, according to the deviation, after the exposure pattern is transformed, the deformed exposure pattern is transferred to the PCB board to be exposed. The exposure pattern transformation methods include scaling, mirroring, local deformation, rotation or inversion, etc.

[0063] S130. After the exposure of the first surface is completed, obtain the actual positions of at least two second marking points on the second surface.

[0064] Specifically, after the first side is exposed, the PCB board is turned over to expose the second side of the PCB board. Before the second side is exposed, it is necessary to determine the offset of the second side and the relative offset between the theoretical position of the PCB board to be exposed and the second side. At this time, the actual positions of at least two second marking points of the second side acquired by the image acquisition module and other devices can be obtained. When there are three second marking points, the actual positions of the three second marking points are acquired. When there are four second marking points, the actual positions of the four second marking points are acquired. The number of the second marking points is the same as that of the first marking points, and the actual position of the second marking point can also be the actual coordinate position including the horizontal coordinate and the vertical coordinate.

[0065] S140, determining the displacement of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point.

[0066] Specifically, after collecting the actual positions of at least three second marking points on the second surface, since each second marking point has a corresponding initial theoretical position and the actual position of the second marking point after marking is completed, the deviation between the actual position of each second marking point and the theoretical position of each second marking point is used to determine the displacement of the second surface of the PCB board. In this embodiment, when it is determined that the actual position of the second marking point is within the preset deviation range of the theoretical position of the second marking point, it can be determined that the first surface has not been displaced, wherein the preset deviation range can be determined according to actual conditions and is not limited here. In addition, similar to the first surface, the JEPE value calculation method can also be used to determine the displacement of the second surface. At the same time, the above two methods can also be used to simultaneously determine the displacement of the second surface. When both conditions are met, it can be determined that the second surface has not been displaced.

[0067] S150. When the second surface is not deviated, the deviation of the plate to be exposed is determined according to the deviation between the actual position of each first marking point and the actual position of each second marking point, so as to perform exposure of the second surface using preset exposure conditions when the plate to be exposed is not deviated.

[0068] Specifically, when it is determined that the second surface is not offset, it is also necessary to determine the relative deviation between the first surface and the second surface. In this embodiment, the deformation and positional offset of the first surface and the second surface can be determined based on the deviation between the actual position of each first mark point and the actual position of each corresponding second mark point. When the deformation of the first surface and the second surface meets the preset deformation condition and the first surface and the second surface are not offset, it indicates that the PCB board is not offset. Then, the second surface can be exposed using the preset exposure condition to ensure that the exposure pattern is accurately transferred to the PCB board, thereby improving the exposure accuracy of the PCB board. The preset exposure condition for exposing the second surface here can be the same as or different from the preset exposure condition for exposing the first surface. When they are different, it includes that the preset pattern of the second surface during exposure is different from that of the first surface, and that the exposure pattern transformation method of the second surface is different from that of the first surface.

[0069] The technical solution of the embodiment of the present invention is as follows: by obtaining the actual positions of at least two first marking points on the first surface; determining the displacement of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and using the preset exposure conditions to perform exposure of the first surface when the first surface is not displaced; after the exposure of the first surface is completed, obtaining the actual positions of at least two second marking points on the second surface; determining the displacement of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point; when the second surface is not displaced, determining the displacement of the exposure device according to the deviation between the actual position of each first marking point and the actual position of each second marking point, so as to use the preset exposure conditions to perform exposure of the second surface when the exposure device is not displaced. By utilizing the above method, the misalignment of the first surface and the second surface of the plate to be exposed is determined respectively, and the relative offset between the first surface and the second surface is confirmed, thereby determining the misalignment of the plate to be exposed. Compared with the existing method of only confirming the misalignment of the first surface and the second surface, which still leads to low alignment accuracy when both the first surface and the second surface are within the preset deviation range, the present application improves the alignment accuracy and exposure yield of the plate to be exposed by confirming the relative offset between the first surface and the second surface, and when the first surface or the second surface is misaligned, the plate is withdrawn, the plate is re-placed, and then the plate to be exposed is re-inspected and exposed, thereby saving plates and reducing costs.

[0070] Embodiment 2

[0071] Figure 2 This is a flow chart of an exposure method of a direct writing imaging exposure device provided in the second embodiment of the present invention. The specific implementation method of this embodiment and the above embodiment S150, determining the deviation of the plate to be exposed according to the deviation between the actual position of each first marking point and the actual position of each second marking point, is refined as follows:

[0072] Determine the deformation of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point;

[0073] When the deformation of the first surface and the second surface meets the preset deformation condition, determining the position offset of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point;

[0074] When there is no positional offset between the first surface and the second surface, it is determined that the plate to be exposed is not offset.

[0075] For details not yet provided in this embodiment, please refer to the above embodiments, which will not be described in detail here.

[0076] like Figure 2 As shown, the method includes:

[0077] S210: Obtain actual positions of at least two first marking points on the first surface.

[0078] The actual position of the first marking point includes a first transverse coordinate position in a first direction and a first longitudinal coordinate position in a second direction, and the first direction and the second direction are perpendicular.

[0079] S220, determining the displacement of the first surface according to the deviation between the actual position of each first marking point and the theoretical position of each first marking point, and performing exposure of the first surface using a preset exposure condition when the first surface is not displaced.

[0080] S230: After the exposure of the first surface is completed, obtain the actual positions of at least two second marking points on the second surface.

[0081] The actual position of the second marking point includes a second transverse coordinate position in the first direction and a second longitudinal coordinate position in the second direction.

[0082] S240: Determine the displacement of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point.

[0083] S250: When the second surface is not deviated, the deformation of the first surface and the second surface is determined according to the actual position of each first marking point and the actual position of each second marking point.

[0084] Among them, this step can be further refined as follows: according to the actual positions of each first marking point and the actual positions of each second marking point, determine the first expansion and contraction value between the first surfaces and the second expansion and contraction value of the second surface; according to the first expansion and contraction value and the second expansion and contraction value, determine the first difference between the first expansion and contraction value and the second expansion and contraction value; when the first difference is within the first preset difference threshold range, determine that the first surface and the second surface undergo the same proportional deformation.

[0085] The expansion and shrinkage value refers to the change in the size of the PCB board due to the influence of material properties and process parameters during the lamination process. Under normal circumstances, when the first and second sides of the PCB board are subjected to the same exposure process, the expansion and shrinkage values ​​of the first and second sides are the same, that is, the first and second sides undergo the same proportional deformation.

[0086] Specifically, when confirming the offset of the PCB board, in order to ensure exposure accuracy and improve exposure yield, it is also necessary to confirm the offset of the first surface and the second surface. The offset includes the confirmation of the deformation and the position offset. First, the deformation of the first surface and the second surface is confirmed. In this embodiment, the first distance between the actual positions of the first marking points on the first surface is determined. After the first distance is determined, the first distance can represent the first expansion and contraction value of the first surface. After the first expansion and contraction value is determined, the second distance between the actual positions of the second marking points aligned with the first marking point is calculated, and the second distance can represent the second expansion and contraction value of the second surface. After determining the first expansion and contraction value and the second expansion and contraction value, the first expansion and contraction value and the second expansion and contraction value are calculated for difference, that is, the first distance and the second distance are subtracted to obtain a first difference, and it is determined whether the first difference is within the first preset difference threshold range. When the first difference is within the first preset difference threshold range, it indicates that the deformation amount of the first surface and the second surface is the same, that is, the first surface and the second surface are deformed in the same proportion, which can be the same proportion of expansion or the same proportion of contraction, and it can also indicate that the deformation amount of the first surface and the second surface are both 0. Because the first surface and the second surface of the PCB board are exposed in the same exposure process, the deformation of the first surface and the second surface should be the same under normal circumstances. When the first marking points and the second marking points each include three, the first difference needs to be determined three times. After the deformation of the actual positions of the two first marking points and the actual positions of the two aligned second marking points is determined, the deformation between the actual positions of the remaining two first marking points on the first side of the PCB board and the actual positions of the remaining second marking points on the second side needs to be determined. When it is determined after three calculations that the first difference is within the first preset difference threshold range, it indicates that the first side and the second side are deformed in the same proportion and the preset deformation condition is reached. At this time, the position offset of the first side and the second side is confirmed. When it is determined that the first difference is not within the first preset difference threshold range, if the first difference is greater than the upper limit of the first preset difference threshold range, it indicates that the difference in expansion and contraction between the first side and the second side is too large, and the deformation of the first side and the second side is different, then the confirmation of the exposure of the second side of the PCB board is stopped, and the board withdrawal process is carried out.

[0087] S260: When the deformation of the first surface and the second surface meets a preset deformation condition, determine the position offset of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point.

[0088] Among them, this step can be refined as: according to the actual position of each first marking point and the actual position of each second marking point, determine the second difference between the first horizontal coordinate position of the actual position of each first marking point and the second horizontal coordinate position of the actual position of each second marking point, the third difference between the first longitudinal coordinate position of the actual position of each first marking point and the second longitudinal coordinate position of the actual position of each second marking point, and the third distance between the actual position of each first marking point and the actual position of each second marking point; when the second difference is within the second preset difference threshold range, the third difference is within the third preset difference threshold range, and the third distance is within the third preset distance threshold range, it is determined that there is no position offset between the first surface and the second surface.

[0089] Specifically, after the deformation of the first surface and the second surface is determined, the position offset needs to be determined. That is, when confirming the position offset of the first surface and the second surface, the first horizontal coordinate position of the actual position of each first mark point and the actual position of the second mark point can be subtracted from the second horizontal coordinate position of the actual position of each second mark point aligned therewith to obtain a second difference. It is also necessary to subtract the first longitudinal coordinate position of the actual position of each first mark point from the second longitudinal coordinate position of the actual position of each second mark point aligned therewith to obtain a third difference. After calculating the second difference and the third difference, for accurate judgment, it is necessary to calculate the third distance between the actual position of each first mark point and the actual position of each second mark point aligned with it. After calculating the third distance, confirm whether the second difference is within the second preset difference threshold range, whether the third difference is within the third preset difference threshold range, and whether the third distance is within the third preset distance threshold range. When it is determined that the second difference is within the second preset difference threshold range, the third difference is within the third preset difference threshold range, and the third distance is within the third preset distance threshold range, it indicates that the actual position of each first mark point on the first surface and the actual position of each second mark point on the second surface are both in an aligned state, the first surface and the second surface have not been offset, and the PCB board has not been offset. When it is determined that the second difference is outside the second preset difference threshold range, or the third difference is outside the third preset difference threshold range, or the third distance is outside the third preset distance threshold range, it indicates that the actual position of each first mark point on the first surface and the actual position of each second mark point on the second surface are not in an aligned state, and the first surface and the second surface have been offset, then the second surface is not exposed and the board removal process is executed.

[0090] Similarly, when the first marking point and the second marking point each include three, the second difference, the third difference, and the third distance need to be determined three times. Only when it is determined that the three second differences, the three third differences, and the three third distances all meet the corresponding preset conditions, it is indicated that the first surface and the second surface have not been offset. When any at least one of the second difference, the third difference, or the third distance does not meet the corresponding preset condition, it indicates that the first surface and the second surface have been offset, and the second surface is not exposed.

[0091] S270, when there is no positional offset between the first surface and the second surface, determine that the plate to be exposed is not offset, so as to perform exposure of the second surface using a preset exposure condition when the plate to be exposed is not offset.

[0092] Specifically, when it is determined that there is no positional offset between the first surface and the second surface, indicating that the PCB board is not offset, the second surface can be exposed using an exposure process under preset exposure conditions. The preset exposure conditions of the second surface may be the same as or different from the preset exposure conditions of the first surface, which is determined according to actual conditions and is not limited here.

[0093] The technical solution of the embodiment of the present invention is to determine the deformation of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point when the second surface is not offset; determine the position offset of the first surface and the second surface according to the actual position of each first marking point and the actual position of each second marking point when the deformation of the first surface and the second surface meets the preset deformation condition; and determine that the PCB board is not offset when the first surface and the second surface do not have a position offset, so as to expose the second surface using the preset exposure condition when the PCB board is not offset. By using the above method, the deformation of the first surface and the second surface is determined according to the expansion and shrinkage value, and the position offset of the first surface and the second surface is determined according to the actual position of each first marking point and the actual position of each second marking point. The second surface is exposed only when it is determined that the first surface and the second surface are deformed in the same proportion and no position offset occurs. Compared with the JEPE value that uses the fitted theoretical position coordinates to calculate the deformation, this embodiment uses the expansion and shrinkage value to directly compare the coordinate information of the actual marking points of the first surface and the second surface before exposing the second surface, and the data acquisition is more accurate. The deformation of the plate on the second surface is directly determined by the expansion and shrinkage value. Therefore, the position offset and deformation amount of the second surface are clearer, and the exposure pattern conversion when the second surface is exposed is more accurate, thereby improving the alignment accuracy of the plate to be exposed, improving production efficiency, and being able to timely discover potential problems during the exposure process, prompting the staff to make corresponding processing operations, avoiding bringing error terms into the exposure process, resulting in unqualified plates to be exposed. In addition, the expansion and contraction values ​​can be used to determine whether the first surface and the second surface deform in the same proportion. In this way, in actual production, the deviation thresholds of the first surface and the second surface can be increased, thereby greatly reducing the defective rate of the plate to be exposed, allowing more plate to be exposed to be used, saving plate materials, and improving the exposure yield of the plate to be exposed.

[0094] Embodiment 3

[0095] Figure 3 This is a flow chart of an exposure method of a direct writing imaging exposure device provided in Embodiment 3 of the present invention. This embodiment adds the following steps to S120 in the above embodiment, before determining the deviation of the first surface according to the deviation between the actual position of the first marking point and the theoretical position of the first marking point, and performing exposure of the first surface using the preset exposure conditions when the first surface is not deflected:

[0096] Make sure that the first surface is not deformed.

[0097] Further, the specific implementation method of S120, determining the deviation of the first surface according to the deviation between the actual position of the first marking point and the theoretical position of the first marking point, is refined as follows:

[0098] According to the actual position of each first marking point and the theoretical position of each first marking point, a fitting theoretical position of each first marking point formed by fitting the actual position of each first marking point and the theoretical position of each first marking point is determined; the fitting theoretical position of the first marking point includes a first fitting transverse coordinate position in the first direction and a first fitting longitudinal coordinate position in the second direction;

[0099] According to the actual position of each first marking point and the fitted theoretical position of each first marking point, determine the fifth difference between the first lateral position coordinate of the actual position of each first marking point and the first fitted lateral coordinate position of the fitted theoretical position of each first marking point, the sixth difference between the first longitudinal position coordinate of the actual position of each first marking point and the first fitted longitudinal coordinate position of the fitted theoretical position of each first marking point, and the sixth distance between the actual position of each first marking point and the fitted theoretical position of each first marking point;

[0100] When the fifth difference is within the fifth preset difference threshold range, the sixth difference is within the sixth preset difference threshold range, and the sixth distance is within the sixth preset distance threshold range, determining that no inching deviation occurs on the first surface;

[0101] Determine a seventh distance between the fitted theoretical positions of the first marking points according to the fitted theoretical positions of the first marking points, and determine an eighth distance between the actual positions of the first marking points according to the actual positions of the first marking points;

[0102] A seventh difference between the seventh distance and the eighth distance is determined, and when the seventh difference is within a seventh preset difference threshold range, it is determined that no spacing deviation occurs on the first surface, so as to determine that the first surface is not deviated.

[0103] Further, the specific implementation method of S140, determining the deviation of the second surface according to the deviation between the actual position of each second marking point and the theoretical position of each second marking point, is refined as follows:

[0104] According to the actual position of each second marking point and the theoretical position of each second marking point, a fitting theoretical position of each second marking point formed by fitting the actual position of each second marking point and the theoretical position of each second marking point is determined; the fitting theoretical position of the second marking point includes a second fitting transverse coordinate position in the first direction and a second fitting longitudinal coordinate position in the second direction;

[0105] According to the actual position of each second marking point and the fitted theoretical position of each second marking point, determine the eighth difference between the second lateral position coordinate of the actual position of each second marking point and the second fitted lateral coordinate position of the fitted theoretical position of each second marking point, the ninth difference between the second longitudinal position coordinate of the actual position of each second marking point and the second fitted longitudinal coordinate position of the fitted theoretical position of each second marking point, and the ninth distance between the actual position of each second marking point and the fitted theoretical position of each second marking point;

[0106] When the eighth difference is within the eighth preset difference threshold range, the ninth difference is within the ninth preset difference threshold range, and the ninth distance is within the ninth preset distance threshold range, it is determined that no inching deviation occurs on the second surface;

[0107] Determine a tenth distance between the fitted theoretical positions of the second marking points according to the fitted theoretical positions of the second marking points, and determine an eleventh distance between the actual positions of the second marking points according to the actual positions of the second marking points;

[0108] A tenth difference between the tenth distance and the eleventh distance is determined, and when the tenth difference is within a tenth preset difference threshold range, it is determined that no spacing deviation occurs on the second surface, so as to determine that the second surface is not deviated.

[0109] For details not yet provided in this embodiment, please refer to the above embodiments, which will not be described in detail here.

[0110] like Figure 3 As shown, the method includes:

[0111] S310: Determine that the first surface is not deformed.

[0112] Among them, this step can be further refined into: collecting the actual positions of at least three third marking points on the first side of another plate to be exposed in the same batch; determining the fourth distance between the actual positions of each first marking point according to the actual position of each first marking point, and determining the fifth distance between the actual positions of each third marking point according to the actual position of each third marking point; determining the fourth difference between the fourth distance and the fifth distance according to the fourth distance and the fifth distance, and when the fourth difference is within the fourth preset difference threshold range, determining that the first side of the plate to be exposed has not been deformed.

[0113] Specifically, before exposing the first surface, it is necessary to determine the deformation of the first surface. In this embodiment, since the PCB board is not exposed one at a time, but a batch is exposed using the same exposure process, the deformation degree of multiple PCB boards in the same batch should be the same after the same process, and the deformation of the first surface can be determined by using the remaining PCB boards in the same batch. In other words, take another PCB board in the same batch, collect the actual position of the third marking point on the first surface of the PCB board, the number of the first marking point and the third marking point is the same, and 3 are taken as an example. The positions of the three first marking points and the three third marking points on the first surface of different PCB boards are the same. After collecting the actual positions of the three third marking points, calculate the three fifth distances between the actual positions of the three third marking points. And calculate the three fourth distances between the actual positions of the three first marking points, each fourth distance can represent the expansion and contraction value of the first surface of the PCB board, and each fifth distance can represent the expansion and contraction value of the first surface of another PCB board. After calculating the fourth distance and the fifth distance, each fourth distance and each fifth distance are respectively subtracted to obtain three fourth difference values, and it is determined whether each fourth difference value is within the fourth preset difference threshold range. When the three fourth difference values ​​are within the fourth preset difference threshold range, it indicates that the expansion and contraction of the first sides of the two PCB boards are the same, which means that the first side of the PCB board has not undergone unpredictable deformation, and the first side can be subsequently exposed. When one of the three fourth difference values ​​is not within the fourth preset difference threshold range, it indicates that the expansion and contraction of the first sides of the two PCB boards are different, which means that the first side of the PCB board has undergone deformation, and the first side cannot be subsequently exposed. By collecting the fourth difference value and comparing it with the same batch of plates, it can be determined whether the PCB board has undergone unpredictable deformation. When deformation occurs, the plate is directly withdrawn for processing without exposing the first side, which can save the processing time of the plate and improve the exposure efficiency.

[0114] S311. Obtain actual positions of at least two first marking points of the first surface.

[0115] The actual position of the first marking point includes a first transverse coordinate position in a first direction and a first longitudinal coordinate position in a second direction, and the first direction and the second direction are perpendicular.

[0116] S312. Determine, according to the actual position of each first marking point and the theoretical position of each first marking point, a fitted theoretical position of each first marking point formed by fitting the actual position of each first marking point and the theoretical position of each first marking point.

[0117] The fitted theoretical position of the first marking point includes a first fitted transverse coordinate position in the first direction and a first fitted longitudinal coordinate position in the second direction.

[0118] Specifically, when determining the deviation of the first surface, the JEPE value can be used for calculation, that is, the actual position of each first mark point and the theoretical position of each first mark point are used to fit the actual position of each first mark point and the theoretical position of each first mark point. Factors that can be considered during fitting include but are not limited to the test results of the previous process, PCB board materials, photoresist materials, and previous experience of exposing the same type of PCB board, etc. After fitting, a new fitting theoretical position of the first mark point will be formed. When there are three first mark points, there are also three fitting theoretical positions of the first mark point, and the fitting theoretical position of the first mark point includes a first fitting horizontal coordinate position in the first direction and a first fitting vertical coordinate position in the second direction.

[0119] S313. According to the actual position of each first marking point and the fitted theoretical position of each first marking point, determine the fifth difference between the first horizontal position coordinate of the actual position of each first marking point and the first fitted horizontal coordinate position of the fitted theoretical position of each first marking point, the sixth difference between the first longitudinal position coordinate of the actual position of each first marking point and the first fitted longitudinal coordinate position of the fitted theoretical position of each first marking point, and the sixth distance between the actual position of each first marking point and the fitted theoretical position of each first marking point.

[0120] S314: When the fifth difference is within the fifth preset difference threshold range, the sixth difference is within the sixth preset difference threshold range, and the sixth distance is within the sixth preset distance threshold range, determine that no inching deviation occurs on the first surface.

[0121] Specifically, after determining the fitting theoretical position of each first marking point, it is necessary to determine the jog deviation (JE) of the first surface. That is to say, by using the actual position of each first marking point and the fitting theoretical position of each first marking point, the fifth difference between the first horizontal position coordinate of the actual position of each first marking point and the first fitting horizontal coordinate position of the fitting theoretical position of each first marking point, the sixth difference between the first vertical position coordinate of the actual position of each first marking point and the first fitting vertical coordinate position of the fitting theoretical position of each first marking point, and the sixth distance between the actual position of each first marking point and the fitting theoretical position of each first marking point are calculated. When the number of first marking points is three, the calculated fifth difference, sixth difference and sixth distance are also three. After determining the fifth difference, sixth difference and sixth distance, it is determined whether each fifth difference is within the fifth preset difference threshold range, whether each sixth difference is within the sixth preset difference threshold range, and whether each sixth distance is within the sixth preset distance threshold range. When each fifth difference is within the fifth preset difference threshold range, each sixth difference is within the sixth preset difference threshold range, and each sixth distance is within the sixth preset distance threshold range, it indicates that the inching deviation of the first surface of the PCB board is within the normal deviation range, and it can be determined that no inching deviation occurs on the first surface. When at least one of the fifth difference values ​​is outside the fifth preset difference threshold range, or at least one of the sixth difference values ​​is within the sixth preset difference threshold range, or at least one of the sixth distances is outside the sixth preset distance threshold range, it indicates that the inching deviation of the first surface is outside the normal deviation range, that is, the deviation is too large, and it is determined that there is a inching error on the first surface, and the exposure process for the first surface is stopped.

[0122] S315. Determine a seventh distance between the fitted theoretical positions of the first marking points according to the fitted theoretical positions of the first marking points, and determine an eighth distance between the actual positions of the first marking points according to the actual positions of the first marking points.

[0123] S316: Determine a seventh difference between the seventh distance and the eighth distance, and when the seventh difference is within a seventh preset difference threshold range, determine that no spacing deviation occurs on the first surface, so as to determine that the first surface is not deviated.

[0124] Specifically, when it is determined that there is no jog deviation on the first surface, it is also necessary to determine whether there is a spacing error (PE) on the first surface, that is, according to the calculated fitting theoretical positions of each first mark point, the seventh distance between the fitting theoretical positions of each first mark point can be determined. According to the actual positions of each first mark point collected, the eighth distance between the actual positions of each first mark point can be determined. After determining the seventh distance and the eighth distance, the seventh distance and the eighth distance are subtracted to obtain the seventh difference. Determine whether the seventh difference is within the seventh preset difference threshold range. When it is determined that the seventh difference is within the seventh preset difference threshold range, it indicates that the spacing deviation of the first surface is within the normal deviation range, and it can be considered that there is no spacing deviation on the first surface. When it is determined that the seventh difference is outside the seventh preset difference threshold range, there is a spacing deviation on the first surface, and the first surface is offset. That is, only when it is determined that there is no jog deviation and spacing deviation on the first surface, it can be determined that there is no offset on the first surface. When it is determined that there is a jog deviation or spacing deviation on the first surface, it indicates that there is offset on the first surface, and the exposure of the first surface is stopped at this time.

[0125] S317: After the exposure of the first surface is completed, the actual positions of at least two second marking points on the second surface are obtained.

[0126] S318. Determine, according to the actual position of each second marking point and the theoretical position of each second marking point, a fitted theoretical position of each second marking point formed by fitting the actual position of each second marking point and the theoretical position of each second marking point.

[0127] The fitted theoretical position of the second marking point includes a second fitted transverse coordinate position in the first direction and a second fitted longitudinal coordinate position in the second direction.

[0128] Specifically, when determining the deviation of the second surface, the JEPE value can also be used for calculation, that is, the actual position of each second mark point and the theoretical position of each second mark point are used to fit the actual position of each second mark point and the theoretical position of each second mark point, and the factors considered during fitting include but are not limited to the test results of the previous process, the PCB board material, the photoresist material, and the experience of previously exposing the same type of PCB board, etc. After fitting, a new fitting theoretical position of the second mark point will be formed. When there are three second mark points, there are also three fitting theoretical positions of the second mark point, and the fitting theoretical position of the second mark point includes the second fitting horizontal coordinate position in the first direction and the second fitting vertical coordinate position in the second direction.

[0129] S319. According to the actual position of each second marking point and the fitted theoretical position of each second marking point, determine the eighth difference between the second horizontal position coordinate of the actual position of each second marking point and the second fitting horizontal coordinate position of the fitted theoretical position of each second marking point, the ninth difference between the second vertical position coordinate of the actual position of each second marking point and the second fitting vertical coordinate position of the fitted theoretical position of each second marking point, and the ninth distance between the actual position of each second marking point and the fitted theoretical position of each second marking point.

[0130] S320: When the eighth difference is within the eighth preset difference threshold range, the ninth difference is within the ninth preset difference threshold range, and the ninth distance is within the ninth preset distance threshold range, it is determined that no inching deviation occurs on the second surface.

[0131] Specifically, after determining the fitting theoretical position of each second marking point, it is necessary to determine the jog deviation (JE) of the second surface. That is to say, by using the actual position of each second marking point and the fitting theoretical position of each second marking point, the eighth difference between the second horizontal position coordinate of the actual position of each second marking point and the second fitting horizontal coordinate position of the fitting theoretical position of each second marking point, the ninth difference between the second vertical position coordinate of the actual position of each second marking point and the second fitting vertical coordinate position of the fitting theoretical position of each second marking point, and the ninth distance between the actual position of each second marking point and the fitting theoretical position of each second marking point are calculated. When the number of second marking points is three, the calculated eighth difference, ninth difference and ninth distance are also three. After determining the eighth difference, ninth difference and ninth distance, it is determined whether each eighth difference is within the eighth preset difference threshold range, whether each ninth difference is within the ninth preset difference threshold range, and whether each ninth distance is within the ninth preset distance threshold range. When each eighth difference is within the eighth preset difference threshold range, each ninth difference is within the ninth preset difference threshold range, and each ninth distance is within the ninth preset distance threshold range, it indicates that the inching deviation of the second surface of the PCB board is within the normal deviation range, and it can be determined that no inching deviation occurs on the second surface. When at least one of the eighth difference values ​​is outside the eighth preset difference threshold range, or at least one of the ninth difference values ​​is within the ninth preset difference threshold range, or at least one of the ninth distances is outside the ninth preset distance threshold range, it indicates that the inching deviation of the second surface is outside the normal deviation range, that is, the deviation is too large, and it is determined that there is a inching error on the second surface, and the exposure process for the second surface is stopped.

[0132] S321. Determine the tenth distance between the fitted theoretical positions of the second marking points according to the fitted theoretical positions of the second marking points, and determine the eleventh distance between the actual positions of the second marking points according to the actual positions of the second marking points.

[0133] S322, determining a tenth difference between the tenth distance and the eleventh distance, and when the tenth difference is within a tenth preset difference threshold range, determining that no spacing deviation occurs on the second surface, so as to determine that the second surface is not deviated.

[0134] Specifically, when it is determined that there is no jog deviation on the second surface, it is also necessary to determine whether there is a spacing error (PE) on the second surface, that is, according to the calculated fitting theoretical positions of each second mark point, the tenth distance between the fitting theoretical positions of each second mark point can be determined. Similarly, according to the actual positions of each second mark point collected, the eleventh distance between the actual positions of each second mark point can be determined. After determining the tenth distance and the eleventh distance, the tenth distance and the eleventh distance are subtracted to obtain the tenth difference, and it is determined whether the tenth difference is within the tenth preset difference threshold range. When it is determined that the tenth difference is within the tenth preset difference threshold range, it indicates that the spacing deviation of the second surface is within the normal deviation range, and it can be considered that there is no spacing deviation on the second surface. When it is determined that the tenth difference is outside the tenth preset difference threshold range, there is a spacing deviation on the second surface, and the second surface is offset. That is, only when it is determined that there is no jog deviation and spacing deviation on the second surface, it can be determined that there is no offset on the second surface. When it is determined that there is a jog deviation or spacing deviation on the second surface, it indicates that there is offset on the second surface, and the exposure of the second surface is stopped at this time.

[0135] S323. When the second surface is not deviated, the deviation of the plate to be exposed is determined according to the deviation between the actual position of each first marking point and the actual position of each second marking point, so as to perform exposure of the second surface using the preset exposure conditions when the plate to be exposed is not deviated.

[0136] The technical solution of the embodiment of the present invention quickly realizes the offset of the first surface and the second surface by fitting the coordinate positions, and before exposing the first surface, determines that the first surface has not undergone unpredictable deformation, thereby improving the exposure alignment accuracy of the plate to be exposed and saving plate and production costs.

[0137] Embodiment 4

[0138] Based on the same inventive concept, the present invention provides an exposure system for a direct-writing imaging exposure device, comprising an image acquisition module, an exposure module and a control module; the image acquisition module is used to acquire the actual positions of a first marking point and a second marking point, the exposure module is used to expose the first surface and the second surface of the exposure device, and the control module is used to execute the exposure method of the above-mentioned direct-writing imaging exposure device.

[0139] The above system can execute the exposure method of the direct writing imaging exposure device provided by all the above embodiments of the present invention, and has the corresponding functional modules and beneficial effects of executing the above methods. For technical details not described in detail in this embodiment, please refer to the methods provided by all the above embodiments of the present invention.

[0140] Embodiment 5

[0141] Figure 4 A schematic diagram of the structure of an electronic device 10 provided for Embodiment 5 of the present invention. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device may also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices (such as helmets, glasses, watches, etc.) and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0142] like Figure 4 As shown, the electronic device 10 includes at least one processor 11, and a memory connected to the at least one processor 11, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., wherein the memory stores a computer program that can be executed by at least one processor, and the processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or the computer program loaded from the storage unit 18 to the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0143] A number of components in the electronic device 10 are connected to the I / O interface 15, including: an input unit 16, such as a keyboard, a mouse, etc.; an output unit 17, such as various types of displays, speakers, etc.; a storage unit 18, such as a disk, an optical disk, etc.; and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0144] The processor 11 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 executes the various methods and processes described above, such as the exposure method of the direct-write imaging exposure device.

[0145] In some embodiments, the exposure method of the direct-write imaging exposure device can be implemented as a computer program, which is tangibly contained in a computer-readable storage medium, such as a storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed on the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the back side alignment method described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to execute the exposure method of the direct-write imaging exposure device in any other appropriate manner (for example, by means of firmware).

[0146] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0147] Computer programs for implementing the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that when the computer program is executed by the processor, the functions / operations specified in the flow chart and / or block diagram are implemented. The computer program may be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0148] In the context of the present invention, a computer-readable storage medium may be a tangible medium that may contain or store a computer program for use by or in combination with an instruction execution system, device or equipment. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, devices or equipment, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0149] To provide interaction with a user, the systems and techniques described herein may be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and a pointing device (e.g., a mouse or trackball) through which the user can provide input to the electronic device. Other types of devices may also be used to provide interaction with the user; for example, the feedback provided to the user may be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user may be received in any form (including acoustic input, voice input, or tactile input).

[0150] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.

[0151] A computing system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The client and server relationship is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services.

[0152] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps described in the present invention can be executed in parallel, sequentially or in different orders, as long as the desired results of the technical solution of the present invention can be achieved, and this document does not limit this.

[0153] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. An exposure method of a direct writing imaging exposure device, characterized in that: The plate to be exposed of the exposure device comprises a first surface and a second surface which are opposite to each other in the thickness direction, and the first surface and the second surface are respectively provided with a first marking point and a second marking point which are aligned with each other, including: Acquire actual positions of at least two first marking points of the first surface; Determining the deviation of the first surface according to the deviation between the actual position of each of the first marking points and the theoretical position of each of the first marking points, and performing exposure of the first surface using a preset exposure condition when the first surface is not deflected; After the exposure of the first surface is completed, obtaining actual positions of at least two second marking points on the second surface; Determining the deviation of the second surface according to the deviation between the actual position of each of the second marking points and the theoretical position of each of the second marking points; When the second surface is not deviated, the deviation of the plate to be exposed is determined according to the deviation between the actual position of each of the first marking points and the actual position of each of the second marking points, and the exposure of the second surface is performed using the preset exposure conditions when the plate to be exposed is not deviated.

2. The exposure method according to claim 1, characterized in that: Determining the deviation of the plate to be exposed according to the actual position of each of the first marking points and the actual position of each of the second marking points includes: Determining deformation conditions of the first surface and the second surface according to actual positions of the first marking points and actual positions of the second marking points; When the deformation of the first surface and the second surface meets a preset deformation condition, determining the position offset of the first surface and the second surface according to the actual position of each of the first marking points and the actual position of each of the second marking points; When there is no positional offset between the first surface and the second surface, it is determined that the plate to be exposed is not offset.

3. The exposure method according to claim 2, characterized in that: The preset deformation condition includes the first surface and the second surface deforming in the same proportion; Determining deformation conditions of the first surface and the second surface according to actual positions of the first marking points and the second marking points includes: Determine a first expansion / contraction value of the first surface according to the actual position of each of the first marking points; determine a second expansion / contraction value of the second surface according to the actual position of each of the second marking points; Determining a first difference between the first expansion / contraction value and the second expansion / contraction value according to the first expansion / contraction value and the second expansion / contraction value; When the first difference is within a first preset difference threshold range, it is determined that the first surface and the second surface are deformed in the same proportion.

4. The exposure method according to claim 3, characterized in that: Determining a first expansion / contraction value between the first surfaces and a second expansion / contraction value of the second surfaces according to actual positions of the first marking points and actual positions of the second marking points includes: Determine, according to the actual positions of the first marking points, a first distance between the actual positions of the first marking points, so as to determine a first expansion / contraction value of the first surface; According to the actual positions of the second marking points, a second distance between the actual positions of the second marking points is determined to determine a second expansion and contraction value of the second surface.

5. The exposure method according to claim 2, characterized in that: The actual position of the first marking point includes a first horizontal coordinate position in a first direction and a first vertical coordinate position in a second direction, and the actual position of the second marking point includes a second horizontal coordinate position in the first direction and a second vertical coordinate position in the second direction, and the first direction is perpendicular to the second direction; Determining the position offset between the first surface and the second surface according to the actual position of each of the first marking points and the actual position of each of the second marking points includes: Determine, according to the actual position of each of the first marking points and the actual position of each of the second marking points, a second difference between the first horizontal coordinate position of the actual position of each of the first marking points and the second horizontal coordinate position of the actual position of each of the second marking points, a third difference between the first longitudinal coordinate position of the actual position of each of the first marking points and the second longitudinal coordinate position of the actual position of each of the second marking points, and a third distance between the actual position of each of the first marking points and the actual position of each of the second marking points; When the second difference is within a second preset difference threshold range, the third difference is within a third preset difference threshold range, and the third distance is within a third preset distance threshold range, it is determined that no position offset occurs between the first surface and the second surface.

6. The exposure method according to claim 1, characterized in that: Determining the deviation of the first surface according to the deviation between the actual position of the first marking point and the theoretical position of the first marking point, and before exposing the first surface using a preset exposure condition when the first surface is not deflected, the method further includes: It is determined that the first surface is not deformed.

7. The exposure method according to claim 6, characterized in that: Determining that the first surface is not deformed includes: Acquire the actual positions of at least two third marking points on the first side of another plate to be exposed in the same batch; Determine a fourth distance between the actual positions of the first marking points according to the actual positions of the first marking points, and determine a fifth distance between the actual positions of the third marking points according to the actual positions of the third marking points; A fourth difference between the fourth distance and the fifth distance is determined according to the fourth distance and the fifth distance, and when the fourth difference is within a fourth preset difference threshold range, it is determined that the first surface of the to-be-exposed plate is not deformed.

8. The exposure method according to claim 1, characterized in that: The deviation includes a point deviation and a spacing deviation; the actual position of the first marking point includes a first transverse coordinate position in a first direction and a first longitudinal coordinate position in a second direction, and the first direction is perpendicular to the second direction; Determining the deviation of the first surface according to the deviation between the actual position of each of the first marking points and the theoretical position of each of the first marking points includes: According to the actual position of each of the first marking points and the theoretical position of each of the first marking points, determining the fitted theoretical position of each of the first marking points formed by fitting the actual position of each of the first marking points and the theoretical position of each of the first marking points; the fitted theoretical position of the first marking point includes a first fitted horizontal coordinate position in the first direction and a first fitted vertical coordinate position in the second direction; According to the actual position of each of the first marking points and the fitted theoretical position of each of the first marking points, determine a fifth difference between the first lateral position coordinate of the actual position of each of the first marking points and the first fitted lateral coordinate position of the fitted theoretical position of each of the first marking points, a sixth difference between the first longitudinal position coordinate of the actual position of each of the first marking points and the first fitted longitudinal coordinate position of the fitted theoretical position of each of the first marking points, and a sixth distance between the actual position of each of the first marking points and the fitted theoretical position of each of the first marking points; When the fifth difference is within a fifth preset difference threshold range, the sixth difference is within a sixth preset difference threshold range, and the sixth distance is within a sixth preset distance threshold range, it is determined that the first surface does not have the inching deviation; Determine a seventh distance between the fitted theoretical positions of the first marking points according to the fitted theoretical positions of the first marking points, and determine an eighth distance between the actual positions of the first marking points according to the actual positions of the first marking points; A seventh difference between the seventh distance and the eighth distance is determined, and when the seventh difference is within a seventh preset difference threshold range, it is determined that the first surface does not have the spacing deviation, so as to determine that the first surface is not deviated.

9. The exposure method according to claim 1, characterized in that: The deviation includes a point deviation and a spacing deviation; the actual position of the second marking point includes a second transverse coordinate position in a first direction and a second longitudinal coordinate position in a second direction, the first direction and the second direction being perpendicular; Determining the deviation of the second surface according to the deviation between the actual position of each of the second marking points and the theoretical position of each of the second marking points includes: According to the actual position of each second marking point and the theoretical position of each second marking point, determining the fitted theoretical position of each second marking point formed by fitting the actual position of each second marking point and the theoretical position of each second marking point; the fitted theoretical position of the second marking point includes the second fitted horizontal coordinate position of the first direction and the second fitted vertical coordinate position of the second direction; According to the actual position of each of the second marking points and the fitted theoretical position of each of the second marking points, determine an eighth difference between the second lateral position coordinate of the actual position of each of the second marking points and the second fitted lateral coordinate position of the fitted theoretical position of each of the second marking points, a ninth difference between the second longitudinal position coordinate of the actual position of each of the second marking points and the second fitted longitudinal coordinate position of the fitted theoretical position of each of the second marking points, and a ninth distance between the actual position of each of the second marking points and the fitted theoretical position of each of the second marking points; When the eighth difference is within an eighth preset difference threshold range, the ninth difference is within a ninth preset difference threshold range, and the ninth distance is within a ninth preset distance threshold range, determining that the second surface does not have the inching deviation; Determine, according to the fitted theoretical positions of the second marking points, a tenth distance between the fitted theoretical positions of the second marking points, and according to the actual positions of the second marking points, determine an eleventh distance between the actual positions of the second marking points; A tenth difference between the tenth distance and the eleventh distance is determined, and when the tenth difference is within a tenth preset difference threshold range, it is determined that the second surface does not have the spacing deviation, so as to determine that the second surface is not deviated.

10. An exposure system of a direct writing imaging exposure device, characterized in that: It comprises an image acquisition module, an exposure module and a control module; the control module is used to execute the exposure method of the direct writing imaging exposure device according to any one of claims 1 to 9.

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