Method and apparatus for controlling cosmetic device, cosmetic device, medium, and program

Abstract

The present application relates to the technical field of cosmetic equipment, and discloses a control method and device of cosmetic equipment, cosmetic equipment, a medium and a program. The semiconductor refrigerating sheet of the cosmetic equipment is controlled to be turned on and turned off in a working cycle to prevent temperature from continuously rising or falling. In the working process of the semiconductor refrigerating sheet, the current temperature of the metal guide head of the cosmetic equipment is detected, and it is judged whether the current temperature is within a target temperature range. If the current temperature is not within the target temperature range, the time proportion of the opening time and the closing time of the semiconductor refrigerating sheet in the working cycle is adjusted. The heating / cooling time of the semiconductor refrigerating sheet in each working cycle is reasonably controlled to prevent the temperature from changing too fast, thereby avoiding damage to the skin of the user and improving the user's body feeling when using.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of cosmetic equipment, in particular to a control method and device of cosmetic equipment, cosmetic equipment, medium and program. BACKGROUND

[0002] The cosmetic instrument products on the market almost all have heating function due to the need of dilating pores. When the contact temperature of the cosmetic instrument with the skin is higher than a certain temperature, there is a risk of low-temperature scald, wherein the low-temperature scald refers to a chronic scald caused by the body contacting a low-heat object of 41-45℃ for a long time. At the same time, continuous heating can cause the surface temperature of the cosmetic instrument in contact with the skin to be too high, which can seriously scald the skin and cause harm to the user. Therefore, the temperature control of the cosmetic instrument is very important.

[0003] At present, the traditional method adjusts the output power or voltage according to the current temperature of the cosmetic instrument to prevent scalding the user's skin. Although controlling the cosmetic instrument to cool down after warming up to a certain extent can prevent the temperature from being too high, there are still problems of the cosmetic instrument warming up too fast and the temperature fluctuating too much, which cannot stably maintain the temperature of the cosmetic instrument within a certain range, seriously affecting the user's body feeling and use experience. SUMMARY

[0004] Therefore, the present application provides a control method and device of cosmetic equipment, cosmetic equipment, medium and program to solve the problem that the traditional method cannot stably maintain the temperature of the cosmetic instrument within a certain range, seriously affecting the user's body feeling and use experience.

[0005] In a first aspect, the present application provides a control method of cosmetic equipment, the cosmetic equipment comprising a semiconductor refrigeration sheet and a metal guide head, the semiconductor refrigeration sheet being used for heating or refrigeration, the method comprising:

[0006] determining a working cycle of the semiconductor refrigeration sheet and a target temperature range corresponding to the metal guide head; wherein the working cycle is composed of an opening time and an off time of the semiconductor refrigeration sheet;

[0007] controlling the semiconductor refrigeration sheet to work in the working cycle, and detecting a current temperature of the metal guide head;

[0008] when it is detected that the current temperature is not in the target temperature range, adjusting the time proportion of the opening time and the off time of the semiconductor refrigeration sheet in the working cycle based on the current temperature and the target temperature range, and returning to the step of controlling the semiconductor refrigeration sheet to work in the working cycle.

[0009] Beneficial effects: the semiconductor cooling piece of the cosmetic device is controlled to cycle on and off in a working cycle to prevent temperature from continuously rising or falling. During the working process of the semiconductor cooling piece, the current temperature of the metal guide head of the cosmetic device is detected, and it is determined whether the current temperature is within the target temperature range. If the current temperature is not within the target temperature range, the time proportion of the on time and the off time of the semiconductor cooling piece in the working cycle is adjusted, the heating / cooling time of the semiconductor cooling piece in each working cycle is reasonably controlled, the temperature change is prevented from being too fast, and thus damage to the skin of the user is avoided, and the user's experience is improved.

[0010] In an optional embodiment, when the semiconductor cooling piece is used for heating, the time proportion of the on time and the off time of the semiconductor cooling piece in the working cycle is adjusted based on the current temperature and the target temperature range, including:

[0011] The target hot compress temperature is obtained according to the lower limit value of the target temperature range, and the first temperature difference reference value is calculated based on the difference between the upper limit value and the lower limit value of the target temperature range.

[0012] When it is detected that the current temperature is greater than the target hot compress temperature, and the temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, the time proportion of the heating on time of the semiconductor cooling piece in the working cycle is reduced, and the time proportion of the heating off time of the semiconductor cooling piece in the working cycle is increased.

[0013] Beneficial effects: in the embodiment of the present application, when the semiconductor cooling piece is used for heating, if the current temperature of the metal guide head exceeds the target hot compress temperature during heating, and the exceeded part is greater than the first temperature difference reference value during heating, the on time of the semiconductor cooling piece during heating in the working cycle is reduced and the off time is increased, the semiconductor cooling piece is controlled to cycle on and off according to the adjusted working cycle, the metal guide head is cooled, the temperature of the metal guide head is reasonably controlled, the temperature is prevented from rising too fast or fluctuating too much, and the user's skin is prevented from being scalded, thereby improving the user's experience.

[0014] In an optional embodiment, the method further includes:

[0015] When it is detected that the current temperature is greater than the first temperature threshold, the semiconductor cooling piece is controlled to be turned off; wherein the first temperature threshold is greater than the upper limit value of the target temperature range.

[0016] When it is detected that the off duration of the semiconductor cooling piece reaches the first preset duration, it is determined whether the current temperature is less than the target hot compress temperature.

[0017] If the current temperature is less than the target hot compress temperature, the semiconductor cooling piece is controlled to restart heating.

[0018] Beneficial effects: in the embodiment of the present application, when it is detected that the current temperature of the metal guide head exceeds the set first temperature threshold, the semiconductor cooling piece is first controlled to stop heating for a period of time, so that the metal guide head is rapidly cooled down, thereby avoiding damage to the user's skin, and when the stop heating time reaches the first preset time, the semiconductor cooling piece is restarted for heating, thereby re-entering the heating work flow, and the user's experience is improved.

[0019] In an optional implementation, the method further includes:

[0020] When it is detected that the current temperature is greater than the second temperature threshold, the semiconductor cooling piece is controlled to be turned off, and an alarm is given; wherein the second temperature threshold is greater than the first temperature threshold.

[0021] Beneficial effects: in the embodiment of the present application, when the current temperature of the metal guide head exceeds the set second temperature threshold, it indicates that the temperature of the metal guide head is too high, at which time an alarm is directly given, and the semiconductor cooling piece is turned off, thereby avoiding scalding the user's skin.

[0022] In an optional implementation, when the semiconductor cooling piece is used for cooling, based on the current temperature and the target temperature range, the time proportion of the on time and the off time of the semiconductor cooling piece in the working cycle is adjusted, including:

[0023] The target cooling temperature is obtained according to the upper limit value of the target temperature range, and the second temperature difference reference value is calculated based on the difference between the upper limit value and the lower limit value of the target temperature range;

[0024] When it is detected that the current temperature is less than the target cooling temperature, and the temperature difference between the target cooling temperature and the current temperature is greater than the second temperature difference reference value, the time proportion of the cooling on time of the semiconductor cooling piece in the working cycle is reduced, and the time proportion of the cooling off time of the semiconductor cooling piece in the working cycle is increased.

[0025] Beneficial effects: in the embodiment of the present application, when the semiconductor cooling piece is used for cooling, if the current temperature of the metal guide head is lower than the target cooling temperature during cooling, and the insufficient part is greater than the second temperature difference reference value during cooling, then the on time of the semiconductor cooling piece during cooling in the working cycle is reduced and the off time is increased, the semiconductor cooling piece is controlled to cycle according to the adjusted working cycle to turn on and turn off, and the temperature of the metal guide head is controlled, thereby preventing the temperature from being too low or fluctuating too much, avoiding frostbite of the user's skin, and improving the user's experience.

[0026] In an optional implementation, the method further includes:

[0027] control the semiconductor refrigeration piece to be turned off when it is detected that the current temperature is less than a third temperature threshold; wherein the third temperature threshold is less than the lower limit of the target temperature range;

[0028] control the semiconductor refrigeration piece to be restarted for refrigeration when it is detected that the turning-off duration of the semiconductor refrigeration piece reaches a second preset duration.

[0029] control the semiconductor refrigeration piece to be restarted for refrigeration when it is detected that the turning-off duration of the semiconductor refrigeration piece reaches a second preset duration.

[0030] Beneficial effects: in the embodiment of the present application, when it is detected that the current temperature of the metal guide head is lower than the set third temperature threshold, the semiconductor refrigeration piece is first controlled to stop refrigeration for a period of time, so that the metal guide head is quickly heated, and damage to the skin of the user is avoided; when the refrigeration stopping duration reaches the second preset duration, the semiconductor refrigeration piece is restarted for refrigeration, and the refrigeration working process is re-entered, so that the user's sense of experience is improved.

[0031] In an alternative embodiment, the method further comprises:

[0032] control the semiconductor refrigeration piece to be turned off and perform an alarm when it is detected that the current temperature is less than a fourth temperature threshold; wherein the fourth temperature threshold is less than the third temperature threshold.

[0033] Beneficial effects: in the embodiment of the present application, when the current temperature of the metal guide head exceeds the set fourth temperature threshold, it indicates that the temperature of the metal guide head is too low, at which time an alarm is directly processed, and the semiconductor refrigeration piece is turned off, so that frostbite of the skin of the user is avoided.

[0034] In a second aspect, the present application provides a control device of a beauty device, the beauty device comprising a semiconductor refrigeration piece and a metal guide head, the semiconductor refrigeration piece being used for heating or refrigeration, the device comprising:

[0035] a first processing module configured to determine a working period of the semiconductor refrigeration piece and a target temperature range corresponding to the metal guide head; wherein the working period is composed of an opening time and a turning-off time of the semiconductor refrigeration piece;

[0036] a second processing module configured to control the semiconductor refrigeration piece to work in the working period and detect a current temperature of the metal guide head;

[0037] a third processing module configured to, when it is detected that the current temperature is not in the target temperature range, adjust time proportions of the opening time and the turning-off time of the semiconductor refrigeration piece in the working period based on the current temperature and the target temperature range, and return to the step of controlling the semiconductor refrigeration piece to work in the working period.

[0038] In a third aspect, the present application provides a cosmetic device, comprising a semiconductor refrigeration sheet, a metal guide head and a controller; the controller comprises a memory and a processor, the memory and the processor are connected to each other in communication, the memory stores computer instructions, and the processor executes the computer instructions to perform the control method of the cosmetic device according to the first aspect or any one of the corresponding embodiments thereof.

[0039] In an alternative embodiment, the cosmetic device is a cosmetic instrument.

[0040] In a fourth aspect, the present application provides a computer readable storage medium, which stores computer instructions for causing a computer to execute the control method of the cosmetic device according to the first aspect or any one of the corresponding embodiments thereof.

[0041] In a fifth aspect, the present application provides a computer program product comprising computer instructions for causing a computer to execute the control method of the cosmetic device according to the first aspect or any one of the corresponding embodiments thereof. BRIEF DESCRIPTION OF DRAWINGS

[0042] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the specific embodiments or prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and those skilled in the art can obtain other drawings according to these drawings without creative labor.

[0043] Figure 1 is a structural schematic diagram of a cosmetic device according to an embodiment of the present application;

[0044] Figure 2 is a flowchart of a control method of a cosmetic device according to an embodiment of the present application;

[0045] Figure 3 is a flowchart of another control method of a cosmetic device according to an embodiment of the present application;

[0046] Figure 4 is a flowchart of still another control method of a cosmetic device according to an embodiment of the present application;

[0047] Figure 5 is a flowchart of yet another control method of a cosmetic device according to an embodiment of the present application;

[0048] Figure 6 is a structural block diagram of a control device of a cosmetic device according to an embodiment of the present application;

[0049] Figure 7Fig. 1 is a schematic diagram of a hardware structure of a controller according to an embodiment of the present application. DETAILED DESCRIPTION

[0050] In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0051] The cosmetic instrument products on the market almost all have a heating function due to the need to dilate pores. Studies have shown that when the skin temperature is higher than 43 degrees Celsius, there is a risk of low-temperature scalding. At the same time, experiments have shown that continuous heating can cause the surface temperature of the cosmetic instrument in contact with the skin to exceed 90 degrees Celsius, which can cause serious skin scalding and harm to the user. Therefore, it is necessary to consider eliminating the situation of harm to the user and improving the product reputation.

[0052] Therefore, in order to solve the problem of skin scalding / frostbite caused by over-temperature of the cosmetic device, the embodiments of the present application provide a control method of a cosmetic device to achieve gentle control at a higher / lower temperature, prevent the cosmetic instrument from heating / cooling too fast and temperature fluctuation being too large, and make the user feel more comfortable and have good and effective results.

[0053] According to the embodiments of the present application, a cosmetic device is provided, as shown in Figure 1 The cosmetic device includes a controller, a semiconductor refrigeration sheet and a metal guide head. The controller and the semiconductor refrigeration sheet are located inside the cosmetic device, which is not shown in Figure 1 . The metal guide head directly contacts the skin, and the semiconductor refrigeration sheet heats / cooling the metal guide head, which is transmitted to the skin. Exemplarily, the cosmetic device can be a cosmetic instrument.

[0054] Specifically, the semiconductor refrigeration sheet is controlled to heat / cool by the controller, such as an MCU. Since the metal guide head of the cosmetic device directly contacts the skin, its temperature control is extremely important. If the temperature is too high, it can cause skin scalding. In the national standard GB4706.10-2008, the requirement of "the temperature rise of the part in contact with the skin or hair shall not exceed the temperature rise limit value for normal use of the continuously held handle" is added in the 11.8; and in the national standard GB4706.1-2005, the requirement of the temperature rise of the metal handle not exceeding 35K is added. However, in practice, when the semiconductor refrigeration sheet continuously heats, the temperature of the metal guide head will quickly rise. Experiments have verified that the temperature can reach more than 90 degrees Celsius, which can further cause skin scalding.

[0055] In the embodiment of the present application, the controller is used to control the working process of the semiconductor refrigeration sheet, so as to control the temperature of the metal guide head in direct contact with the skin, to achieve gentle control at a high temperature, prevent rapid temperature rise and large temperature fluctuation, and further avoid scalding the human skin.

[0056] The working principle and specific working process of the controller can be seen from the detailed description of the method embodiment below, which will not be repeated here.

[0057] According to the embodiment of the present application, a control method of a beauty device is provided. It should be noted that the steps shown in the flowchart of the accompanying drawings can be executed in a computer system such as a set of computer executable instructions, and although the logical order is shown in the flowchart, in some cases, the steps shown or described can be executed in an order different from here.

[0058] In the embodiment, a control method of a beauty device is provided, which can be used for a beauty device such as a beauty instrument, etc. Figure 1 as shown in the accompanying drawings, Figure 2 is a flowchart of the control method of the beauty device according to the embodiment of the present application, as shown in the accompanying drawings, the flow includes the following steps: Figure 2

[0059] Step S201, determine the working period of the semiconductor refrigeration sheet and the target temperature range corresponding to the metal guide head.

[0060] Specifically, the working period [a, b] of the semiconductor refrigeration sheet is composed of the on time a and the off time b of the semiconductor refrigeration sheet, and the semiconductor refrigeration sheet will work in cycles according to the working period [a, b], in each working period, the semiconductor refrigeration sheet first works for a period of time according to the on time a, and then stops working for a period of time according to the off time b, and then enters the next working period, which can prevent the temperature of the metal guide head from rising / falling too fast or fluctuating too much.

[0061] It should be noted that the semiconductor refrigeration sheet can be used for heating and cooling, and the working principle of the semiconductor refrigeration sheet is mainly based on the Peltier effect in the thermoelectric effect. When electric current passes through a thermocouple composed of N-type semiconductor material and P-type semiconductor material, heat transfer will occur between the two ends, and heat will be transferred from one end to the other end, so as to generate temperature difference to form cold and hot ends, and realize refrigeration. Conversely, if the direction of the electric current is changed, the direction of the heat transfer will also be changed, so as to realize heating.

[0062] ​In the embodiment, the working modes of the beauty device include a hot compress mode, a cold compress mode, etc., the metal guide head corresponds to a target temperature range in different modes, and the semiconductor refrigeration sheet corresponds to a working cycle in different modes. For example, when the user starts the hot compress mode, the semiconductor refrigeration sheet is mainly used for heating; and when the user starts the cold compress mode, the semiconductor refrigeration sheet is mainly used for refrigeration. It should be noted that the target temperature range can be set according to the actual application scene and the human body adaptation condition.

[0063] In step S202, the semiconductor refrigeration sheet is controlled to work in the working cycle, and the current temperature of the metal guide head is detected.

[0064] Specifically, the semiconductor refrigeration sheet is controlled to be turned on and turned off according to the currently determined working cycle. During the working of the semiconductor refrigeration sheet, the current temperature of the metal guide head can be detected in real time through a temperature sensing bag, a temperature sensor, etc., and it is determined whether the current temperature is in the target temperature range. If the current temperature is not in the target temperature range, step S203 is performed.

[0065] In step S203, when it is detected that the current temperature is not in the target temperature range, the time proportion of the turn-on time and the turn-off time of the semiconductor refrigeration sheet in the working cycle is adjusted based on the current temperature and the target temperature range, and step S202 is returned.

[0066] Specifically, according to the gap between the current temperature and the target temperature range, a corresponding mode is selected to adjust the time proportion of the turn-on time and the turn-off time of the semiconductor refrigeration sheet in the working cycle, so as to adjust the heating / refrigeration time proportion of the semiconductor refrigeration sheet, maintain the temperature of the metal guide head in the target temperature range, prevent the temperature from changing too fast, thereby avoiding damage to the user's skin and improving the user's body feeling during use.

[0067] The control method of the beauty device provided in the embodiment controls the semiconductor refrigeration sheet of the beauty device to be turned on and turned off in the working cycle, prevents the temperature from continuously rising / falling, detects the current temperature of the metal guide head of the beauty device during the working of the semiconductor refrigeration sheet, and determines whether the current temperature is in the target temperature range of the beauty device. If the current temperature is not in the target temperature range, the time proportion of the turn-on time and the turn-off time of the semiconductor refrigeration sheet in the working cycle is adjusted, the heating / refrigeration time of the semiconductor refrigeration sheet in each working cycle is reasonably controlled, the temperature is prevented from changing too fast, thereby avoiding damage to the user's skin and improving the user's body feeling during use.

[0068] In the embodiment, a control method of a beauty device is provided, which can be used for a beauty device such as a beauty instrument, etc., as shown in Figure 1 When the semiconductor refrigeration sheet is used for heating, Figure 3is a flowchart of a control method of a cosmetic device according to an embodiment of the present application, as shown in the figure, the flow includes the following steps: Figure 3

[0069] Step S301, determine the working period of the semiconductor refrigeration piece and the target temperature range corresponding to the metal guide head. For details, please refer to step S201 of the embodiment shown in Figure 2 , which will not be repeated here.

[0070] Step S302, control the semiconductor refrigeration piece to work in the working period, and detect the current temperature of the metal guide head. For details, please refer to step S202 of the embodiment shown in Figure 2 , which will not be repeated here.

[0071] Step S303, when it is detected that the current temperature is not in the target temperature range, based on the current temperature and the target temperature range, adjust the time proportion of the on time and the off time of the semiconductor refrigeration piece in the working period, and return to step S302.

[0072] Specifically, when the semiconductor refrigeration piece is used for heating, the above step S303 includes:

[0073] Step S3031, obtain a target hot compress temperature according to the lower limit value of the target temperature range, and calculate a first temperature difference reference value based on the difference between the upper limit value and the lower limit value of the target temperature range.

[0074] Specifically, when the semiconductor refrigeration piece is used for heating, the target temperature range corresponding to the metal guide head can be [T R , T R + ΔT R ], the lower limit value of the range is the target hot compress temperature T R , and the difference between the upper limit value and the lower limit value of the range is the first temperature difference reference value ΔT R . Among them, according to the human skin bearing capacity, the target hot compress temperature T R is generally valued in the range of 38-42℃, which can be set according to the actual scene.

[0075] Step S3032, when it is detected that the current temperature is greater than the target hot compress temperature, and the temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, reduce the time proportion of the heating on time of the semiconductor refrigeration piece in the working period, and increase the time proportion of the heating off time of the semiconductor refrigeration piece in the working period, and return to step S302.

[0076] Specifically, if it is detected that the current temperature T>T R , and the temperature difference ΔT1 between the current temperature T and the target hot compress temperature T R is greater than ΔT R ​If yes, the on-time a of the semiconductor refrigeration piece in the heating period of the working cycle is reduced, and the off-time b of the semiconductor refrigeration piece is increased, the working cycle is updated, and the step S302 is returned, the semiconductor refrigeration piece is controlled to be turned on and turned off according to the adjusted working cycle, and the metal guide head is cooled to control the current temperature in the target temperature range.

[0077] Specifically, if the current temperature T < T R , the semiconductor refrigeration piece is continuously controlled to heat according to the current working cycle, so that the metal guide head reaches the target hot compress temperature T R .

[0078] In the embodiment of the present application, when the semiconductor refrigeration piece is used for heating, if the current temperature of the metal guide head exceeds the target hot compress temperature in the heating period, and the exceeding part is greater than the first temperature difference reference value in the heating period, the on-time of the semiconductor refrigeration piece in the heating period of the working cycle is reduced, and the off-time is increased, the semiconductor refrigeration piece is controlled to be turned on and turned off according to the adjusted working cycle, and the metal guide head is cooled to control the temperature of the metal guide head, prevent the temperature from rising too fast or the temperature fluctuation from being too large, avoid scalding the user's skin, and thus improve the user's experience.

[0079] In step S304, when it is detected that the current temperature is greater than the first temperature threshold, the semiconductor refrigeration piece is controlled to be turned off; wherein the first temperature threshold is greater than the upper limit of the target temperature range.

[0080] Specifically, when it is detected that the current temperature T > the first temperature threshold T1, the semiconductor refrigeration piece is turned off, the heating is stopped, and the off-time t of the semiconductor refrigeration piece is recorded. It should be noted that the first temperature threshold T1 > T R + ΔT R According to the human skin bearing capacity, the first temperature threshold T1 is generally in the range of 43℃-48℃, and the embodiment of the present application is not limited thereto.

[0081] In step S305, when it is detected that the off-time of the semiconductor refrigeration piece reaches the first preset time t1, it is judged whether the current temperature of the metal guide head is less than the target hot compress temperature.

[0082] Specifically, when it is detected that the off-time t of the semiconductor refrigeration piece reaches the first preset time t1, it is judged whether the current temperature of the metal guide head is less than the target hot compress temperature T R If yes, the step S306 is executed; otherwise, the step S307 is executed.

[0083] It should be noted that the first preset time t1 is the minimum restart heating time, which is generally set to 5s-40s, so as to avoid frequently turning on and off the semiconductor refrigeration piece when the temperature fluctuates, and thus cause poor temperature control effect and large temperature fluctuation.

[0084] Step S306, if the current temperature is less than the target hot compress temperature, control the semiconductor refrigeration piece to restart heating.

[0085] Specifically, if the current temperature of the metal guide head decreases to the target hot compress temperature T R The semiconductor refrigeration piece is restarted to heat.

[0086] In the embodiment of the present application, when it is detected that the current temperature of the metal guide head exceeds the set first temperature threshold, the semiconductor refrigeration piece is first controlled to stop heating for a period of time to rapidly cool the metal guide head, so as to avoid causing damage to the user's skin. When the heating stop time reaches the first preset time length, the semiconductor refrigeration piece is restarted to heat, and the heating working process is re-entered, so as to improve the user's feeling.

[0087] Step S307, when it is detected that the current temperature is greater than the second temperature threshold, control the semiconductor refrigeration piece to be turned off and alarm; wherein the second temperature threshold is greater than the first temperature threshold.

[0088] Specifically, no matter what the situation is, as long as it is detected that the current temperature of the metal guide head is greater than the second temperature threshold T2, alarm processing is performed, and the semiconductor refrigeration piece is turned off. It should be noted that the second temperature threshold T2 is greater than the first temperature threshold T1, and according to the human skin bearing capacity, the second temperature threshold T2 is generally valued in the range of 49-60℃, and the embodiment of the present application is not limited thereto.

[0089] In the embodiment of the present application, when the current temperature of the metal guide head exceeds the set second temperature threshold, it indicates that the temperature of the metal guide head is too high, and at this time, alarm processing is directly performed, and the semiconductor refrigeration piece is turned off, so as to avoid scalding the user's skin.

[0090] The control method of the beauty device provided in the embodiment controls the semiconductor refrigeration piece of the beauty device to cycle on and off in a working cycle to prevent the temperature from continuously rising. In the working process of the semiconductor refrigeration piece, the current temperature of the metal guide head of the beauty device is detected, and it is judged whether the current temperature is within the target temperature range. If the current temperature of the metal guide head exceeds the target hot compress temperature, and the exceeding part is greater than the first temperature difference reference value, then the on time of the semiconductor refrigeration piece in the working cycle is reduced and the off time is increased, the heating time of the semiconductor refrigeration piece in each working cycle is reasonably controlled, the temperature is prevented from rising too fast, and thus scalding of the user's skin is avoided, and the user's feeling during use is improved.

[0091] In the embodiment, a control method of a beauty device is provided, which can be used for a beauty device such as a beauty instrument, etc. Figure 1 As shown in the beauty device, such as a beauty instrument, etc., when the semiconductor refrigeration piece is used for refrigeration, Figure 4is a flowchart of a control method of a cosmetic device according to an embodiment of the present application, as shown in the figure, the flow includes the following steps: Figure 4

[0092] Step S401, determine the working period of the semiconductor refrigeration piece and the target temperature range corresponding to the metal guide head. For details, please refer to step S201 of the embodiment shown in Figure 2 , which will not be repeated here.

[0093] Step S402, control the semiconductor refrigeration piece to work in the working period, and detect the current temperature of the metal guide head. For details, please refer to step S202 of the embodiment shown in Figure 2 , which will not be repeated here.

[0094] Step S403, when it is detected that the current temperature is not in the target temperature range, based on the current temperature and the target temperature range, adjust the time proportion of the on time and the off time of the semiconductor refrigeration piece in the working period, and return to step S402.

[0095] Specifically, when the semiconductor refrigeration piece is used for refrigeration, the above step S403 includes:

[0096] Step S4031, obtain a target cooling temperature according to the upper limit value of the target temperature range, and calculate a second temperature difference reference value based on the difference between the upper limit value and the lower limit value of the target temperature range.

[0097] Specifically, when the semiconductor refrigeration piece is used for refrigeration, the target temperature range corresponding to the metal guide head can be [T L -ΔT L , T L ], the upper limit value of the range is the target cooling temperature T L , and the difference between the upper limit value and the lower limit value of the range is the second temperature difference reference value ΔT L . Wherein, the target cooling temperature T L can be set according to the human body bearing capacity and the actual scene.

[0098] Step S4032, when it is detected that the current temperature is less than the target cooling temperature, and the temperature difference between the target cooling temperature and the current temperature is greater than the second temperature difference reference value, reduce the time proportion of the refrigeration on time of the semiconductor refrigeration piece in the working period, and increase the time proportion of the refrigeration off time of the semiconductor refrigeration piece in the working period, and return to step S402.

[0099] Specifically, if it is detected that the current temperature T L and the temperature difference ΔT2 between the target cooling temperature T L and the current temperature T is greater than ΔT L ​If the on-time 'a' of the thermoelectric cooler during cooling is reduced and the off-time 'b' of the thermoelectric cooler is increased, the working cycle is updated, and the process returns to step S402. The thermoelectric cooler is then controlled to cycle on and off according to the adjusted working cycle, thereby heating the metal conductor and ensuring that the current temperature is within the target temperature range.

[0100] Specifically, if the detected current temperature T>T L Then, the semiconductor cooling chip continues to cool according to the current working cycle, so that the metal guide reaches the target cooling temperature T. L .

[0101] In this embodiment of the invention, when the thermoelectric cooler is used for cooling, if the current temperature of the metal probe is lower than the target cooling temperature and the insufficient part is greater than the second temperature difference reference value during cooling, then the on-time of the thermoelectric cooler during cooling in the working cycle is reduced and the off-time is increased. The thermoelectric cooler is controlled to cycle on and off according to the adjusted working cycle to heat up the metal probe, reasonably control the temperature of the metal probe, prevent excessive cooling or large temperature fluctuations, avoid frostbite to the user's skin, and thus improve the user experience.

[0102] Step S404: When the current temperature is detected to be lower than the third temperature threshold, the semiconductor cooling chip is controlled to turn off; wherein the third temperature threshold is lower than the lower limit of the target temperature range.

[0103] Specifically, when the current temperature T is detected to be less than the third temperature threshold T3, the thermoelectric cooler is turned off, cooling is stopped, and the off-time t of the thermoelectric cooler is recorded. It is important to note that the third temperature threshold T3... <T L -ΔT L The third temperature threshold T3 can be set according to the tolerance of human skin.

[0104] Step S405: When the off-time of the semiconductor cooling chip is detected to reach the second preset time, determine whether the current temperature is greater than the target cooling temperature.

[0105] Specifically, when the off-time t of the semiconductor cooling chip is detected to reach the second preset time t2, it is determined whether the current temperature of the metal contactor has risen to the target cooling temperature T. L If so, proceed to step S406; otherwise, proceed to step S407.

[0106] Step S406: If the current temperature is higher than the target cooling temperature, control the semiconductor cooling chip to restart for cooling.

[0107] Specifically, if the current temperature of the metal probe rises to the target cooling temperature T after a second preset time t2...L Then, the semiconductor cooling piece is restarted to cool.

[0108] In the embodiment of the present application, when it is detected that the current temperature of the metal guide head is lower than the third temperature threshold, the semiconductor cooling piece is first controlled to stop cooling for a period of time to quickly raise the temperature of the metal guide head, so as to avoid causing damage to the skin of the user, and when the length of time of stopping cooling reaches the second preset length of time, the semiconductor cooling piece is restarted to cool, and the cooling working process is reentered, so as to improve the user's feeling.

[0109] In step S407, when it is detected that the current temperature is less than the fourth temperature threshold, the semiconductor cooling piece is turned off, and an alarm is given; wherein the fourth temperature threshold is less than the third temperature threshold.

[0110] Specifically, as long as it is detected that the current temperature of the metal guide head is less than the fourth temperature threshold T4, an alarm is given, and the semiconductor cooling piece is turned off. It should be noted that the fourth temperature threshold T4 is less than the third temperature threshold T3, and the fourth temperature threshold T4 can be set according to the bearing capacity of the human skin.

[0111] In the embodiment of the present application, when the current temperature of the metal guide head exceeds the fourth temperature threshold, it indicates that the temperature of the metal guide head is too low, at this time, an alarm is directly given, and the semiconductor cooling piece is turned off, so as to avoid freezing the skin of the user.

[0112] The control method of the beauty device provided in the embodiment controls the semiconductor cooling piece of the beauty device to be turned on and turned off in a working cycle to prevent the temperature from continuously decreasing, detects the current temperature of the metal guide head of the beauty device in the working process of the semiconductor cooling piece, and judges whether the current temperature is within the target temperature range, if the current temperature of the metal guide head is lower than the target cooling temperature, and the insufficient part is greater than the second temperature difference reference value, the on time of the semiconductor cooling piece in the working cycle is reduced, and the off time is increased, the cooling time of the semiconductor cooling piece in each working cycle is reasonably controlled, the temperature is prevented from decreasing too fast, so as to avoid freezing the skin of the user, and the user's feeling during use is improved.

[0113] Next, taking the beauty device as a beauty instrument and the semiconductor cooling piece for heating as an example, the control method of the beauty device of the present application is described in detail in combination with a specific application example, as shown in FIG. 8, the application example specifically includes the following steps: Figure 5

[0114] Step 1, after starting, preset the related control parameters: target heating temperature T R , first temperature threshold T1, second temperature threshold T2, first temperature difference reference value ΔT R , heating on time a and heating off time b of the semiconductor cooling piece in the working cycle, and first preset length of time t1.​

[0115] Step 2, turn on the semiconductor refrigerating sheet to heat.

[0116] Step 3, detect the current temperature T of the metal guide head, and determine whether T is less than or equal to the target hot compress temperature T R , maintain heating; if T>T R , let ΔT1=T-T R , determine whether ΔT1is greater than the first temperature difference reference value ΔT R , if ΔT1is not greater than the first temperature difference reference value ΔT R , set the semiconductor heating on time in the working cycle as a, and the semiconductor heating off time in the cycle as b, and control the semiconductor refrigerating sheet to heat in cycles [a, b], in each cycle [a, b], the semiconductor refrigerating sheet first heats for a time according to the on time a, and then stops heating for a time according to the off time b; if ΔT1is greater than the first temperature difference reference value ΔT R , a-- and b++, keep the whole cycle length unchanged, and then control the semiconductor refrigerating sheet to heat in cycles [a, b] with the updated cycles. R , t R +Δt R ].

[0117] Step 4, detect whether the current temperature t is greater than the first temperature threshold T1, if yes, turn off the heating, and time the off duration t of the semiconductor refrigerating sheet, when the off duration t reaches the first preset duration t1, determine whether the current temperature has dropped to the target hot compress temperature T R , if yes, restart the heating; if the current temperature T is less than or equal to the first temperature threshold T1, go to the next step.

[0118] Step 5, no matter what the situation is, detect whether the current temperature T is greater than the second temperature threshold T2, if yes, alarm.

[0119] The above application example proposes a temperature control method, which can solve the problem of skin scalding caused by over-temperature of the beauty instrument, and achieve gentle control at a high temperature, prevent rapid temperature rise and large temperature fluctuation, and make the user feel more comfortable and have good effect.

[0120] In the embodiment, a control device of a beauty instrument is also provided, which is used to realize the above embodiments and preferred embodiments, and has been described above. As used below, the term "module" can be a combination of software and / or hardware that realizes a predetermined function. Although the device described in the following embodiments is preferably realized in software, realization in hardware, or a combination of software and hardware is also possible and contemplated.

[0121] The embodiment provides a control device of a beauty device, as shown in the accompanying drawings, comprising: Figure 6

[0122] The first processing module 601 is configured to determine a working period of the semiconductor cooling sheet and a target temperature range corresponding to the metal guide head; wherein the working period is composed of an opening time and an off time of the semiconductor cooling sheet;

[0123] The second processing module 602 is configured to control the semiconductor cooling sheet to work in the working period and detect a current temperature of the metal guide head;

[0124] The third processing module 603 is configured to, when it is detected that the current temperature is not in the target temperature range, adjust a time ratio of the opening time and the off time of the semiconductor cooling sheet in the working period based on the current temperature and the target temperature range, and return to the step of controlling the semiconductor cooling sheet to work in the working period.

[0125] In some optional embodiments, when the semiconductor cooling sheet is used for heating, the third processing module 603 is further configured to:

[0126] obtain a target hot compress temperature according to a lower limit value of the target temperature range, and calculate a first temperature difference reference value based on a difference between an upper limit value and the lower limit value of the target temperature range;

[0127] when it is detected that the current temperature is greater than the target hot compress temperature, and a temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, reduce a time ratio of the heating opening time of the semiconductor cooling sheet in the working period, and increase a time ratio of the heating off time of the semiconductor cooling sheet in the working period.

[0128] In some optional embodiments, the device is further configured to:

[0129] when it is detected that the current temperature is greater than a first temperature threshold, control the semiconductor cooling sheet to be off; wherein the first temperature threshold is greater than an upper limit value of the target temperature range;

[0130] when it is detected that the off duration of the semiconductor cooling sheet reaches a first preset duration, determine whether the current temperature is less than a target hot compress temperature;

[0131] if the current temperature is less than the target hot compress temperature, control the semiconductor cooling sheet to restart heating.

[0132] In some optional embodiments, the device is further configured to:

[0133] when it is detected that the current temperature is greater than a second temperature threshold, control the semiconductor cooling sheet to be off and perform an alarm; wherein the second temperature threshold is greater than the first temperature threshold. ​

[0134] In some optional embodiments, when the semiconductor refrigeration sheet is used for refrigeration, the third processing module 603 is further configured to:

[0135] obtain a target cold compress temperature according to an upper limit value of the target temperature range, and calculate a second temperature difference reference value based on a difference between the upper limit value and a lower limit value of the target temperature range;

[0136] When it is detected that the current temperature is less than the target cold compress temperature, and a temperature difference between the target cold compress temperature and the current temperature is greater than the second temperature difference reference value, reduce a time ratio of the refrigeration-on time of the semiconductor refrigeration sheet in the working cycle, and increase a time ratio of the refrigeration-off time of the semiconductor refrigeration sheet in the working cycle.

[0137] In some optional embodiments, the device is further configured to:

[0138] When it is detected that the current temperature is less than a third temperature threshold, control the semiconductor refrigeration sheet to be turned off; wherein the third temperature threshold is less than the lower limit value of the target temperature range;

[0139] When it is detected that the turning-off duration of the semiconductor refrigeration sheet reaches a second preset duration, determine whether the current temperature is greater than the target cold compress temperature;

[0140] If the current temperature is greater than the target cold compress temperature, control the semiconductor refrigeration sheet to be restarted for refrigeration.

[0141] In some optional embodiments, the device is further configured to:

[0142] When it is detected that the current temperature is less than a fourth temperature threshold, control the semiconductor refrigeration sheet to be turned off and perform an alarm; wherein the fourth temperature threshold is less than the third temperature threshold.

[0143] Further function descriptions of each of the above modules and units are the same as those of the above corresponding embodiments, and will not be described here.

[0144] The control device of the beauty device in the embodiment is presented in the form of a functional unit. The unit herein refers to an ASIC (Application Specific Integrated Circuit) circuit, a processor and a memory executing one or more software or fixed programs, and / or other devices that can provide the above functions.

[0145] The embodiment of the present application also provides a controller having the above Figure 6 control device of the beauty device.

[0146] Please refer to Figure 7 , Figure 7 is a structural schematic diagram of a controller provided by an optional embodiment of the present application, as shown inFigure 7 As shown, the controller includes one or more processors 10, memory 20, and interfaces 50 for coupling various components including high speed interfaces and low speed interfaces. The various components communicate over a bus that is connected to the one or more processors 10. The one or more processors 10 can process instructions for execution within the controller, including instructions stored in the memory 20 or on storage devices to display graphical information for a GUI on an external input / output device, such as a display device coupled to one of the interfaces. In some embodiments, multiple processors and / or multiple buses can be employed. Figure 6 The processor 10 is used as an example in the following description.

[0147] The processor 10 can be a central processing unit, a network processor, or a combination thereof. The processor 10 can further include a hardware chip. The hardware chip can be an application specific integrated circuit, a programmable logic device, or a combination thereof. The programmable logic device can be a complex programmable logic device, a field programmable logic device, a general array logic, or any combination thereof.

[0148] The memory 20 stores instructions that are executable by the at least one processor 10 to cause the at least one processor 10 to perform the methods illustrated in the above embodiments.

[0149] The memory 20 can include a program storage area and a data storage area. The program storage area can store an operating system, application programs required by at least one function, and the like. The data storage area can store data created according to the use of the controller, and the like. In addition, the memory 20 can include a high speed random access memory, and can further include a non-transitory memory, such as at least one magnetic disk storage device, a flash memory device, or other non-transitory solid state memory device. In some alternative embodiments, the memory 20 can optionally include a memory that is remotely located with respect to the processor 10, and these remote memories can be connected to the controller through a network. Examples of the network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and a combination thereof.

[0150] The memory 20 can include a volatile memory, such as a random access memory, and can also include a non-volatile memory, such as a flash memory, a hard disk, or a solid state disk. The memory 20 can further include a combination of the above-mentioned types of memories.

[0151] The controller further includes input devices 30 and output devices 40. The processor 10, the memory 20, the input devices 30, and the output devices 40 can be connected through a bus or other means,Figure 7 The bus connection is taken as an example.

[0152] The input device 30 can receive inputted digital or character information, and generate key signal inputs related to user settings and function controls of the controller, such as a touch screen, a keypad, a mouse, a trackpad, a touchpad, a pointing stick, one or more mouse buttons, a trackball, a joystick, etc. The output device 40 can include a display device, an auxiliary lighting device (e.g., an LED), a tactile feedback device (e.g., a vibration motor), etc. The display device includes, but is not limited to, a liquid crystal display, a light emitting diode, a display, and a plasma display. In some alternative embodiments, the display device can be a touch screen.

[0153] The embodiments of the present application further provide a computer readable storage medium, and the method according to the embodiments of the present application can be implemented in hardware, firmware, or recorded in a storage medium, or stored in a remote storage medium or a non-transitory machine readable storage medium and downloaded from a network and stored in a local storage medium, so that the method described herein can be processed by such software on a storage medium using a general purpose computer, a special purpose processor, or programmable or special hardware. The storage medium can be a magnetic disk, an optical disk, a read-only memory, a random access memory, a flash memory, a hard disk, or a solid state disk, etc. Further, the storage medium can also include a combination of the above-mentioned memories. It can be understood that the computer, the processor, the microprocessor controller, or the programmable hardware includes a storage component that can store or receive software or computer code, which, when accessed and executed by the computer, the processor, or the hardware, implements the method shown in the above embodiments.

[0154] Part of the present application can be applied as a computer program product, for example, computer program instructions, when executed by a computer, the operation of the computer can invoke or provide the method and / or technical solutions according to the present application. Those skilled in the art should understand that the form of computer program instructions in computer readable medium includes but is not limited to source file, executable file, installation package file, etc. Correspondingly, the way of computer program instructions executed by computer includes but is not limited to: the computer directly executes the instructions, or the computer compiles the instructions and then executes the corresponding compiled program, or the computer reads and executes the instructions, or the computer reads and installs the instructions and then executes the corresponding installed program. Here, the computer readable medium can be any available computer readable storage medium or communication medium accessible to the computer.

[0155] While embodiments of the application have been described in connection with the preferred embodiments of the various figures, those of ordinary skill in the art will appreciate that various modifications and changes can be made without departing from the spirit and scope of the application, and that such modifications and changes fall within the scope of the appended claims.

Claims

1. A control method of a cosmetic device, characterized by, The cosmetic device comprises a semiconductor refrigeration sheet for heating or refrigeration and a metal guide head, and the method comprises: determining a working cycle of the semiconductor refrigeration sheet and a target temperature range corresponding to the metal guide head; wherein the working cycle [a, b] of the semiconductor refrigeration sheet is composed of an opening time a and an off time b of the semiconductor refrigeration sheet, and in each working cycle, the semiconductor refrigeration sheet first works for a period of time according to the opening time a and then stops working for a period of time according to the off time b; controlling the semiconductor refrigeration sheet to work in the working cycle and detecting a current temperature of the metal guide head; when it is detected that the current temperature is not in the target temperature range, adjusting a time ratio of the opening time and the off time of the semiconductor refrigeration sheet in the working cycle based on the current temperature and the target temperature range, and returning to the step of controlling the semiconductor refrigeration sheet to work in the working cycle; when the semiconductor refrigeration sheet is used for heating, the adjusting of the time ratio of the opening time and the off time of the semiconductor refrigeration sheet in the working cycle based on the current temperature and the target temperature range comprises: obtaining a target hot compress temperature according to a lower limit value of the target temperature range, and calculating a first temperature difference reference value based on a difference between an upper limit value and the lower limit value of the target temperature range; when it is detected that the current temperature is greater than the target hot compress temperature and a temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, reducing a time ratio of a heating opening time of the semiconductor refrigeration sheet in the working cycle and increasing a time ratio of a heating off time of the semiconductor refrigeration sheet in the working cycle.

2. The method of claim 1, wherein, The method further comprises: when it is detected that the current temperature is greater than a first temperature threshold, controlling the semiconductor refrigeration sheet to be off; wherein the first temperature threshold is greater than an upper limit value of the target temperature range; when it is detected that a length of time during which the semiconductor refrigeration sheet is off reaches a first preset length of time, judging whether the current temperature is less than the target hot compress temperature; if the current temperature is less than the target hot compress temperature, controlling the semiconductor refrigeration sheet to restart heating.

3. The method of claim 2, wherein, The method further comprises: when it is detected that the current temperature is greater than a second temperature threshold, controlling the semiconductor refrigeration sheet to be off and performing an alarm; wherein the second temperature threshold is greater than the first temperature threshold.

4. The method of claim 1, wherein, when the semiconductor refrigeration sheet is used for refrigeration, the adjusting of the time ratio of the opening time and the off time of the semiconductor refrigeration sheet in the working cycle based on the current temperature and the target temperature range comprises: obtaining a target cold compress temperature according to an upper limit value of the target temperature range, and calculating a second temperature difference reference value based on a difference between the upper limit value and a lower limit value of the target temperature range; when it is detected that the current temperature is less than the target cold compress temperature and a temperature difference between the target cold compress temperature and the current temperature is greater than the second temperature difference reference value, reducing a time ratio of a refrigeration opening time of the semiconductor refrigeration sheet in the working cycle and increasing a time ratio of a refrigeration off time of the semiconductor refrigeration sheet in the working cycle.

5. The method of claim 4, wherein, The method further comprises: control the semiconductor refrigeration piece to be turned off when it is detected that the current temperature is less than a third temperature threshold value, wherein the third temperature threshold value is less than a lower limit value of the target temperature range; determine whether the current temperature is greater than the target cold compress temperature when it is detected that the semiconductor refrigeration piece is turned off for a second preset time length; control the semiconductor refrigeration piece to be restarted for refrigeration if the current temperature is greater than the target cold compress temperature.

6. The method of claim 5, wherein, control the semiconductor refrigeration piece to be turned off and perform an alarm when it is detected that the current temperature is less than a fourth temperature threshold value, wherein the fourth temperature threshold value is less than the third temperature threshold value.

7. A control device of a cosmetic apparatus, characterized by, The cosmetic device comprises a semiconductor refrigeration piece and a metal guide head, the semiconductor refrigeration piece is used for heating or refrigeration, and the device comprises: a first processing module configured to determine a working period of the semiconductor refrigeration piece and a target temperature range corresponding to the metal guide head, wherein the working period [a, b] of the semiconductor refrigeration piece is composed of an on time a and an off time b of the semiconductor refrigeration piece, and in each working period, the semiconductor refrigeration piece first works for a period of time according to the on time a and then stops working for a period of time according to the off time b; a second processing module configured to control the semiconductor refrigeration piece to work in the working period and detect a current temperature of the metal guide head; a third processing module configured to, when it is detected that the current temperature is not in the target temperature range, adjust time proportions of the on time and the off time of the semiconductor refrigeration piece in the working period based on the current temperature and the target temperature range, and return to the step of controlling the semiconductor refrigeration piece to work in the working period; when the semiconductor refrigeration piece is used for heating, the third processing module is further configured to: obtain a target hot compress temperature according to a lower limit value of the target temperature range, and calculate a first temperature difference reference value based on a difference between an upper limit value and the lower limit value of the target temperature range; when it is detected that the current temperature is greater than the target hot compress temperature and a temperature difference between the current temperature and the target hot compress temperature is greater than the first temperature difference reference value, reduce a time proportion of a heating on time of the semiconductor refrigeration piece in the working period and increase a time proportion of a heating off time of the semiconductor refrigeration piece in the working period.

8. A cosmetic device characterized by The cosmetic device comprises a semiconductor refrigeration piece, a metal guide head and a controller, and the semiconductor refrigeration piece is used for heating or refrigeration. The controller comprises a memory and a processor, the memory and the processor are communicatively connected with each other, the memory stores computer instructions, and the processor executes the computer instructions to perform the control method of the cosmetic device according to any one of claims 1 to 6.

9. The cosmetic device of claim 8, wherein, The cosmetic device is a cosmetic instrument.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions, and the computer instructions are used to make a computer execute the control method of the cosmetic device according to any one of claims 1 to 6.

11. A computer program product, characterised in that, The computer instructions are used to make a computer execute the control method of the cosmetic device according to any one of claims 1 to 6.

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