Double-sided display photoelectric glass module, handrail and preparation method of double-sided display photoelectric glass module

Abstract

The invention discloses a double-sided display photoelectric glass module, a handrail and a preparation method thereof, and the method comprises the following steps: cutting anti-reflection glass according to a preset size to obtain first glass and second glass with the same size; printing a first circuit on the first glass by adopting a silk-screen printing process, processing the first glass printed with the first circuit, the first LED lamp group and the first conductive layer into a first glass-based circuit board, and printing a second circuit on the second glass by adopting the silk-screen printing process, second glass printed with a second circuit, a second LED lamp set and a second conducting layer are processed into a second glass-based circuit board, and the first LED lamp set and the second LED lamp set are arranged in a staggered mode; and aligning the first glass-based circuit board and the second glass-based circuit board, and carrying out laminated sheet clamping to obtain the photoelectric glass module. Due to the fact that the first LED lamp set and the second LED lamp set are arranged in a staggered mode and are independently controlled through the first circuit and the second circuit, the requirement that the double-face display screen displays different contents can be met.

Description

Technical Field

[0001] The present application relates to the field of optoelectronic display technology, and in particular to a double-sided display optoelectronic glass module, a railing and a preparation method thereof. Background Art

[0002] LED photoelectric glass is a perfect combination of LED light source and glass. Patterns can be designed in advance inside the glass, and controllable changes can be achieved later through DMX (multi-channel digital transmission standard) full digital intelligent technology, freely controlling the brightness and changes of the LED light source. To be precise, LED photoelectric glass is a kind of LED light-embedded art glass. LED photoelectric glass in the prior art includes a base layer, an intermediate layer and a covering layer. The base layer is conductive glass, which has a conductive circuit and a power interface. The LED light emitter is arranged in the conductive circuit according to the pattern and effect to be displayed. The intermediate layer is a PVB (polyvinyl butyral) film, which is located between the base layer and the covering layer. The base layer, the intermediate layer and the covering layer are glued together through special treatment.

[0003] The current market lacks an effective solution to the double-sided display light pollution problem, and the existing technology of photoelectric glass railings is difficult to meet this specific demand in terms of manufacturing methods and material selection. Summary of the invention

[0004] In view of the above problems, the present application provides a double-sided display optoelectronic glass module, railing and preparation method thereof, and realizes the efficient production of double-sided display optoelectronic glass railings by optimizing material selection and production process, thus filling the market gap.

[0005] In a first aspect, the present application provides a method for preparing a double-sided display optoelectronic glass module, comprising the following steps:

[0006] Cutting the anti-reflection glass according to a preset size to obtain a first glass and a second glass of the same size;

[0007] Printing a first circuit on the first glass by screen printing, processing the first glass with the first circuit printed thereon, the first LED lamp group, and the first conductive layer into a first glass-based circuit board, and printing a second circuit on the second glass by screen printing, processing the second glass with the second circuit printed thereon, the second LED lamp group, and the second conductive layer into a second glass-based circuit board, the first LED lamp group comprising a plurality of first LED lamps, the plurality of first LED lamps being distributed in an array on the first glass-based circuit board, the second LED lamp group comprising a plurality of second LED lamps, the plurality of second LED lamps being distributed in an array on the second glass-based circuit board, and the first LED lamp group and the second LED lamp group being arranged alternately;

[0008] The first glass-based circuit board and the second glass-based circuit board are aligned and sandwiched to obtain the photovoltaic glass module.

[0009] Furthermore, before printing the first circuit and the second circuit, the method further includes:

[0010] The first glass and the second glass are cleaned with deionized water and a neutral cleaning agent until the number of particle contaminants on the surfaces of the cleaned first glass and the second glass is less than 10 per square centimeter.

[0011] Furthermore, printing a first circuit on the first glass by screen printing, and processing the first glass printed with the first circuit, the first LED lamp group, and the first conductive layer into a first glass-based circuit board includes:

[0012] Placing a large screen corresponding to the first circuit produced by the pattern transfer method on a working platform of a printing device to print a nano silver paste circuit;

[0013] After the nano silver paste circuit is printed, the first circuit is inspected by optical inspection and comparison equipment. After the first circuit is inspected and qualified, the first glass printed with the first circuit is baked at 240° C. for 5 minutes, and after the baking, it is sent to a glass tempering furnace for tempering;

[0014] Mounting the first LED lamp group and adding a first conductive layer at a first predetermined position on the tempered first glass to obtain a first glass-based circuit board;

[0015] Printing a second circuit on the second glass by screen printing, processing the second glass printed with the second circuit, the second LED lamp group, and the second conductive layer into a second glass-based circuit board includes:

[0016] Placing a large screen corresponding to the second circuit produced by the pattern transfer method on a working platform of a printing device to print a nano silver paste circuit;

[0017] After the nano silver paste circuit is printed, the second circuit is inspected by optical inspection and comparison equipment. After the second circuit is inspected and qualified, the second glass printed with the second circuit is baked at 240°C for 5 minutes, and after the baking, it is sent to a glass tempering furnace for tempering;

[0018] The second LED lamp group is mounted at a second predetermined position on the tempered second glass and a second conductive layer is added to obtain a second glass-based circuit board.

[0019] Furthermore, before sandwiching the first glass-based circuit board and the second glass-based circuit board, the method further includes:

[0020] An aging test is performed on the first glass-based circuit board and the second glass-based circuit board respectively.

[0021] Furthermore, the first glass-based circuit board and the second glass-based circuit board are aligned and sandwiched to obtain the photovoltaic glass module, which includes:

[0022] A soft PVB film with a thickness in the range of [2.28,3.42] is selected to bond the first glass-based circuit board and the second glass-based circuit board, and the two bonded glass-based circuit boards are evacuated and sent into an autoclave to melt the PVB film.

[0023] In a second aspect, the present application provides a double-sided display optoelectronic glass module, wherein the optoelectronic glass module is prepared according to the preparation method described in the first aspect of the present application.

[0024] In a third aspect, the present application provides a method for preparing a double-sided display photoelectric glass railing, comprising the following steps:

[0025] A plurality of columns are arranged along the axis, and each column is provided with a groove;

[0026] The photovoltaic glass module according to the second aspect of the present application is clamped into the grooves of two adjacent columns, and the columns and the photovoltaic glass module are detachably locked by a locking piece.

[0027] Furthermore, after the photovoltaic glass module is clamped in the grooves of two adjacent columns, the method further includes:

[0028] The gap between the photoelectric glass module and the column is filled with a rubber pad, and the flatness of two adjacent photoelectric glass modules on the axis is adjusted with a fine-tuning screw.

[0029] Furthermore, the method further comprises:

[0030] Install transverse guardrails on multiple columns distributed along the axis.

[0031] In a fourth aspect, the present application provides a photoelectric glass railing with a double-sided display, wherein the photoelectric glass railing is prepared according to the method for preparing the photoelectric glass railing described in the third aspect of the present application.

[0032] Different from the prior art, the above technical solution involves a double-sided display optoelectronic glass module, a railing and a preparation method thereof, the method comprising: the method comprising: cutting the anti-reflection glass according to a preset size to obtain a first glass and a second glass of the same size; printing a first circuit on the first glass by a screen printing process, processing the first glass with the first circuit printed thereon, the first LED light group, and the first conductive layer into a first glass-based circuit board, and printing a second circuit on the second glass by a screen printing process, processing the second glass with the second circuit printed thereon, the second LED light group, and the second conductive layer into a second glass-based circuit board, the first LED light group and the second LED light group being staggered; aligning the first glass-based circuit board and the second glass-based circuit board and performing a sandwich bonding process to obtain an optoelectronic glass module. Since the first LED light group and the second LED light group are staggered and independently controlled by the first circuit and the second circuit, the requirements of displaying different contents on a double-sided display screen without interfering with each other can be met.

[0033] The above-mentioned records related to the invention content are only an overview of the technical solution of the present application. In order to enable ordinary technicians in the field to more clearly understand the technical solution of the present application, and then implement it according to the text of the specification and the contents recorded in the drawings, and to make the above-mentioned purpose and other purposes, features and advantages of the present application easier to understand, the following is an explanation in combination with the specific implementation mode and drawings of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The drawings are only used to illustrate the principles, implementation methods, applications, characteristics and effects of the specific embodiments of the present invention and other related contents, and shall not be considered as limiting the present application.

[0035] In the drawings of the specification:

[0036] Figure 1 This is a flow chart of a method for preparing a double-sided display optoelectronic glass module according to a first exemplary embodiment of the present application;

[0037] Figure 2 This is a flow chart of a method for preparing a double-sided display optoelectronic glass module according to a second exemplary embodiment of the present application;

[0038] Figure 3 This is a flow chart of a method for preparing a double-sided display optoelectronic glass module according to a third exemplary embodiment of the present application;

[0039] Figure 4 A flowchart of a method for preparing a double-sided display photovoltaic glass railing according to an exemplary embodiment of the present application;

[0040] Figure 5 This is a schematic diagram of the distribution of a first LED lamp group on a first glass-based circuit board according to an exemplary embodiment of the present application;

[0041] Figure 6 This is a schematic diagram of the distribution of a second LED lamp group on a second glass-based circuit board according to an exemplary embodiment of the present application;

[0042] Figure 7 A cross-sectional view of the structure of a first glass-based circuit board and a second glass-based circuit board before a bonding sheet is sandwiched therebetween according to an exemplary embodiment of the present application;

[0043] Figure 8 A cross-sectional view of a structure of a first glass-based circuit board and a second glass-based circuit board after a bonding sheet is sandwiched therebetween according to an exemplary embodiment of the present application;

[0044] Fig. 9 This is a front view of a structure of a first glass-based circuit board and a second glass-based circuit board with a bonding sheet sandwiched therebetween according to an exemplary embodiment of the present application;

[0045] Fig.10 This is a schematic structural diagram of a PCB circuit board involved in an exemplary embodiment of the present application;

[0046] Fig.11 This is a schematic structural diagram of a PCB circuit board and a first conductive layer after installation according to an exemplary embodiment of the present application;

[0047] Fig.12 This is a structural schematic diagram of a PCB circuit board, a first conductive layer, and a second conductive layer involved in an exemplary embodiment of the present application after all of them are installed;

[0048] Fig.13 A rear view of a double-sided display optoelectronic glass module according to an exemplary embodiment of the present application;

[0049] Fig.14 This is an elevation view of a double-sided display optoelectronic glass module according to an exemplary embodiment of the present application;

[0050] Fig.15 A side view of a double-sided display optoelectronic glass module according to an exemplary embodiment of the present application;

[0051] The reference numerals in the above drawings are described as follows: 1. Photoelectric glass module;

[0052] 10. A first glass-based circuit board;

[0053] 101. a first LED light group;

[0054] 1011. a first LED lamp;

[0055] 20. A second glass-based circuit board;

[0056] 201, second LED lamp group;

[0057] 2011, second LED lamp;

[0058] 30. Soft PVB film;

[0059] 40. PCB circuit board;

[0060] 401, signal pad;

[0061] 402, positive electrode pad;

[0062] 403, negative electrode pad;

[0063] 404, first positioning hole;

[0064] 50. Pad;

[0065] 501, welding position;

[0066] 502, threading position;

[0067] 503, second positioning hole;

[0068] 60. First pad;

[0069] 70. Second pad;

[0070] 80. FPC soft circuit board;

[0071] 801, a first FPC soft circuit board;

[0072] 802, a second FPC soft circuit board;

[0073] 90. Plug;

[0074] 1001, terminal cover;

[0075] 1002, terminal side cover;

[0076] 1003. Terminal base. DETAILED DESCRIPTION

[0077] In order to explain in detail the possible application scenarios, technical principles, specific schemes that can be implemented, and the purposes and effects that can be achieved, the following is a detailed description of the specific embodiments listed in conjunction with the accompanying drawings. The embodiments described herein are only used to more clearly illustrate the technical solutions of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0078] Reference to "embodiment" herein means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The term "embodiment" appearing in various places in the specification does not necessarily refer to the same embodiment, nor does it particularly limit its independence or association with other embodiments. In principle, in the present application, as long as there is no technical contradiction or conflict, the various technical features mentioned in the embodiments can be combined in any way to form a corresponding implementable technical solution.

[0079] Unless otherwise defined, the technical terms used in this document have the same meanings as those generally understood by those skilled in the art to which this application belongs; the use of relevant terms in this document is only for describing specific embodiments and is not intended to limit this application.

[0080] In the description of this application, the term "and / or" is an expression used to describe the logical relationship between objects, indicating that three relationships may exist, for example, A and / or B, which means: A exists, B exists, and A and B exist at the same time. In addition, the character " / " in this article generally indicates that the objects before and after are in an "or" logical relationship.

[0081] In the present application, terms such as “first” and “second” are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.

[0082] Without further limitations, in this application, the words "include", "comprises", "has" or other similar open-ended expressions used in sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.

[0083] In this application, expressions such as "greater than", "less than", "exceed" and the like are understood to exclude the number itself; expressions such as "above", "below", "within" and the like are understood to include the number itself. In addition, in the description of the embodiments of this application, "multiple" means more than two (including two), and similar expressions related to "multiple" are also understood in this way, such as "multiple groups", "multiple times", etc., unless otherwise clearly and specifically limited.

[0084] In the description of the embodiments of the present application, space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present application or facilitating the reader's understanding, and do not indicate or imply that the referred device or component must have a specific position, a specific orientation, or be constructed or operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of the present application.

[0085] Unless otherwise expressly specified or limited, in the description of the embodiments of the present application, the terms such as "install", "connect", "connect", "fix", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For technicians in the technical field to which the present application belongs, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0086] like Figure 1 As shown, in a first aspect, the present application provides a method for preparing a double-sided display optoelectronic glass module, comprising the following steps:

[0087] Step S101: cutting the anti-reflection glass according to a preset size to obtain a first glass and a second glass of the same size.

[0088] In step S101, the anti-reflection glass can use transparent white special anti-reflection glass or AR coated high-transmittance glass with a length of 1200mm, a height of 800mm and a thickness of 6mm as the basic material. The visible light transmittance of the glass is required to reach more than 85%. The low reflectivity is achieved by coating a multi-layer optical film on the glass surface (the thickness of each film is at the nanometer level, accurately controlled between 50-500nm, and the reflection and transmission properties are adjusted according to different optical interference principles), so that the front reflection of the light intensity can be controlled within 10%, and the average reflectivity does not exceed 8% in the visible light band with a wavelength range of 400-700nm.

[0089] The refractive index of the special anti-reflection glass is set in the range of 1.5-1.6, the Mohs hardness reaches 6-7, and the thickness is selected in the range of 10-14mm, so as to take into account both optical and mechanical properties. It ensures that when displaying on both sides, the display content can be clearly seen from both sides, has good transparency, and is visually close to ordinary transparent glass. It can realize the display function without causing obvious obstruction to the surrounding environment.

[0090] For the first glass and the second glass that have been cut, the present application also performs edge grinding. The roughness Ra of the glass edge after edge grinding does not exceed 0.8μm, ensuring smooth edges and avoiding stress concentration during subsequent installation and use, which may cause glass breakage.

[0091] Step S102: Print a first circuit on the first glass using a screen printing process, and process the first glass with the first circuit printed on it, the first LED light group, and the first conductive layer into a first glass-based circuit board; and print a second circuit on the second glass using a screen printing process, and process the second glass with the second circuit printed on it, the second LED light group, and the second conductive layer into a second glass-based circuit board.

[0092] In step S102, the first LED light group includes a plurality of first LED lights, which are distributed in an array on the first glass-based circuit board; the second LED light group includes a plurality of second LED lights, which are distributed in an array on the second glass-based circuit board; and the first LED light group and the second LED light group are arranged alternately.

[0093] When the first LED light group and the second LED light group are staggered, the edge distances of the first LED light group and the second LED light group can be designed to be 10 mm and 20 mm respectively. In this way, when the first glass-based circuit board and the second glass-based circuit board are buckled against each other, the positions of the LED lights on the front and back sides can be staggered, so that the two sides are displayed without blocking each other, thereby achieving a double-sided display effect.

[0094] When processing the first glass-based circuit board and the second glass-based circuit board, the main materials used may include a special anti-reflective transparent white glass-based single-sided nano-silver circuit board (reference dimensions are 1200mm in length, 800mm in height, and 6mm in thickness), an internally controlled IC-type LED lamp group packaged as a 2026 single-line return-to-zero code control protocol, a 200-ohm chip resistor packaged as 1206, a 10A high-current jumper packaged as 1312, three FPC soft circuit boards with only conductive connection functions, and wiring terminals dedicated to optoelectronic glass.

[0095] Step S103: aligning the first glass-based circuit board and the second glass-based circuit board and performing sandwich bonding to obtain the photovoltaic glass module.

[0096] Since the first LED light group and the second LED light group are arranged alternately and are independently controlled by the first circuit and the second circuit, the requirement of displaying different contents on a double-sided display screen without interfering with each other can be met.

[0097] In some embodiments, before printing the first circuit and the second circuit, the method further includes:

[0098] The first glass and the second glass are cleaned with deionized water and a neutral cleaning agent until the number of particle contaminants on the surfaces of the cleaned first glass and the second glass is less than 10 per square centimeter.

[0099] In this embodiment, the cut and edged glass can be placed in a professional glass cleaning device and cleaned with deionized water and a neutral detergent for no less than 5 minutes to ensure that impurities, dust, oil stains, etc. on the glass surface are completely removed. After cleaning, the number of particulate contaminants on the glass surface does not exceed 10 per square centimeter, thus preparing for the subsequent assembly process.

[0100] In some embodiments, Figure 2 The first circuit is printed on the first glass by screen printing, and the first glass printed with the first circuit, the first LED lamp group, and the first conductive layer are processed into a first glass-based circuit board, including:

[0101] Step S201: placing a large screen corresponding to the first circuit produced by the pattern transfer method on a working platform of a printing device to print a nano silver paste circuit;

[0102] Step S202: After the nano silver paste circuit is printed, the first circuit is inspected by an optical inspection and comparison device. After the first circuit is inspected and qualified, the first glass printed with the first circuit is baked at 240° C. for 5 minutes, and after baking, it is sent to a glass tempering furnace for tempering;

[0103] Step S203: mounting the first LED lamp group and adding a first conductive layer at a first predetermined position on the tempered first glass to obtain a first glass-based circuit.

[0104] In some embodiments, Figure 3 As shown, the second circuit is printed on the second glass by screen printing, and the second glass printed with the second circuit, the second LED lamp group, and the second conductive layer are processed into a second glass-based circuit board, including:

[0105] Step S301: placing a large screen corresponding to the second circuit produced by the pattern transfer method on a working platform of a printing device to print a nano silver paste circuit;

[0106] Step S302: After the nano silver paste circuit is printed, the second circuit is inspected by optical detection and comparison equipment. After the second circuit is inspected and qualified, the second glass printed with the second circuit is baked at 240° C. for 5 minutes, and after baking, it is sent to a glass tempering furnace for tempering;

[0107] Step S303: mounting the second LED lamp group and adding a second conductive layer at a second predetermined position on the tempered second glass to obtain a second glass-based circuit board.

[0108] In the present application, since the circuit design schemes corresponding to the first glass and the second glass are the same, only the same circuit screen needs to be used for image transfer during production. Specifically, a large-scale LED matrix circuit scheme RX-274 format Gerber file is designed, and a large-scale screen (size is 2mx1.6m) is made by a graphic transfer method and placed on a working platform of a printing device, and the nano-silver paste circuit is printed according to the principle that the scraper pressure is not greater than 1 / 4 of the actual stress limit of the screen. After printing, the circuit is checked by SPI (optical detection and comparison equipment) to ensure that there are no open circuits, short circuits, missing prints, offset-related and other quality problems before proceeding. Put it into the drying tunnel furnace and bake it at 240℃ for about 5 minutes. Finally, send the dried glass-based circuit board to the large glass tempering furnace for tempering. During tempering, the high temperature of 695℃ in the furnace shall not exceed 15 seconds, and the hot air shall be kept warm for 30 seconds. Other specific parameters can refer to the normal glass tempering coefficient. During the tempering process, the nano silver material and the indium tin alloy and glass powder in the material can be fully combined with the glass silicon oxide material to achieve the performance of the PCB circuit board; then, through the conventional SMT process, the corresponding first LED lamp and the second LED lamp are attached to the first circuit and the second circuit according to the designed arrangement position of the first LED lamp group and the second LED lamp group, and the corresponding conductive layer. The conductive layer specifically includes the 1206 patch 200 ohm resistor and the 1312 package 10A high current jumper required for the external circuit. Finally, three FPC soft circuit boards with only conduction connection function are attached respectively. After the reflow oven is completed and cooled, the PCBA of the first glass-based circuit board or the second glass-based circuit board is completed.

[0109] In some embodiments, before laminating the first glass-based circuit board and the second glass-based circuit board, the method further includes: performing an aging test on the first glass-based circuit board and the second glass-based circuit board respectively.

[0110] The first glass-based circuit board or the second glass-based circuit board that has completed PCBA is placed in the aging workshop, and connected to the dedicated LED lamp bead aging and lighting equipment through the welded external connector of the FPC soft circuit board. The aging plan mainly adopts the method of high and low current impact to light up red, green, blue (RGB primary colors), and white (mixed color) in transient mode for 3 seconds each, and then light up red, green, blue (RGB primary colors), and white (mixed color) in a gradual mode from dark to bright for 5 seconds each, and finally light up red, green, blue (RGB primary colors), and white (mixed color) in flash mode for 3 seconds each, and automatically cycle power on for aging in sequence. After each lighting time exceeds 8 hours, the power is turned off for half an hour to check whether there is any LED lamp bead failure that needs to be replaced. After confirming that there is no fault, continue to power on for aging until the total aging time reaches 168 hours to complete the aging process of the entire semi-finished product. Only the semi-finished products that have completed half of the total aging time can be labeled and enter the next process.

[0111] In some embodiments, the first glass-based circuit board and the second glass-based circuit board are aligned and sandwiched to obtain the photovoltaic glass module, including: selecting a soft PVB film with a thickness in the range of [2.28,3.42] to bond the first glass-based circuit board and the second glass-based circuit board, and evacuating the two bonded glass-based circuit boards and sending them into an autoclave to melt the PVB film.

[0112] The semi-finished products that have been half-aged are laminated. First, a relatively soft PVB film with a thickness between 2.28mm-3.42 is selected. Usually, a 2.28mm thick high-transmittance soft PVB film is selected. Place a piece of semi-finished photoelectric glass with the lamp beads facing up and a layer of PVB film on the surface. Then place another piece of semi-finished photoelectric glass with the lamp beads facing down on the surface. Pay attention to adjusting the alignment accuracy of the two pieces of glass. The four corners should be fixed with high-fiber traceless tape, and the two exposed pieces of glass should be fixed separately. The FPC soft circuit board at the end of the line is fixed to the back of the glass with seamless tape for protection. After cutting off the excess surrounding PVB film, it can be packed in a vacuum bag and evacuated. Then it is directly sent into the autoclave. The high temperature and high pressure environment in the autoclave is used to heat the glass and melt the PVB film. The parameters and time are adjusted (the temperature is controlled between 120-130℃, the heating speed is controlled at 5℃ / minute, the pressure is maintained at 1.0-1.5MPa, and the total insulation time is 6 hours); the two pieces of glass are completely bonded to the PVB film to complete the lamination.

[0113] In a second aspect, the present application provides a double-sided display optoelectronic glass module, wherein the optoelectronic glass module is prepared according to the preparation method described in the first aspect of the present application.

[0114] The prepared photovoltaic glass module and its related components are as follows: Figure 5-Figure 15 shown.

[0115] like Figure 5 FIG. 1 is a schematic diagram showing the distribution of the first LED lamp group 101 on the first glass-based circuit board 10 according to an exemplary embodiment of the present application. Figure 6 FIG. 2 is a schematic diagram showing the distribution of a second LED lamp group 201 on a second glass-based circuit board 20 according to an exemplary embodiment of the present application;

[0116] like Figure 7 As shown, it is a cross-sectional view of the structure before the first glass-based circuit board and the second glass-based circuit board are sandwiched by the adhesive sheet. A first LED lamp group 101 is arranged on the first glass-based circuit board 10, and the first LED lamp group 101 includes a plurality of first LED lamps 1011 arranged in an array. A second LED lamp group 201 is arranged on the second glass-based circuit board 20, and the second LED lamp group 201 includes a plurality of second LED lamps 2011 arranged in an array. When the first glass-based circuit board 10 and the second glass-based circuit board 20 are aligned, the distribution of the first LED lamps 1011 and the second LED lamps 2011 are staggered. The first glass-based circuit board 10 and the second glass-based circuit board 20 are also laminated by a flexible PVB film 30. The schematic diagram of the structure after lamination is shown in FIG. Figure 8 shown.

[0117] like Fig. 9 The figure shows a cross-sectional view of the structure after the first glass-based circuit board and the second glass-based circuit board are sandwiched with a glue sheet. The red and blue colors in the figure represent the first LED light group 101 and the second LED light group 201, respectively. It is not difficult to see that the two light groups are staggered so that the front and back sides do not interfere with each other when displaying the picture, thereby meeting the needs of more application scenarios.

[0118] like Fig.10 , Fig.11 and Fig.12 As shown, the connecting circuits in the glass-based circuit board include an FPC soft circuit board 80 and a PCB circuit board 40. The FPC soft circuit board 80 is a conductive layer. The first conductive layer corresponding to the first glass-based circuit board is a first FPC soft circuit board 801. The second conductive layer corresponding to the second glass-based circuit board is a second FPC soft circuit board 802. The PCB circuit board 40 is only used for switching circuits. The FPC soft circuit boards designed to be used only for switching circuits and the exposed connection terminals of the two sheets of optoelectronic glass are butt-welded to each other in a sandwich manner, and after the butt-welding is completed, an insulating pad is used to protect the double-sided solder joints.

[0119] The structural diagram of the PCB circuit board 40 and the pad 50 (made of insulating material) is shown in FIG. Fig.10As shown, the PCB circuit board 40 includes a signal pad 401, a positive pad 402, a negative pad 403 and a first positioning hole 404, and the pad 50 includes a welding position 501, a threading position 502 and a second positioning hole 503. The positions of the first positioning hole 404 and the second positioning hole 503 correspond to each other, so that the PCB circuit board 40 and the pad 50 are better assembled together. The schematic diagram of the PCB circuit board 40, the pad 50 and the FPC soft circuit board 80 after assembly is shown in FIG. Fig.11 The assembled circuit structure is protected by the terminal base, specifically, the circuit structure is encapsulated in a relatively closed space by the terminal upper cover 1001, the terminal side cover 1002, the terminal base 1003 and the edge of the optoelectronic glass module.

[0120] Preferably, the number of insulating pads 50 is two, including a first pad 60 and a second pad 70, and the PCB circuit board 40, the first conductive layer (i.e., the first FPC soft circuit board 801), the second conductive layer (i.e., the second FPC soft circuit board 802), the first pad 60, and the second pad 70 are all installed as shown in the structural diagram. Fig.12 shown.

[0121] like Figure 13-15 As shown, the back of the photovoltaic glass module 1 is provided with an outlet terminal and a plug 90 , and the plug 90 is protruded from the screen body to facilitate subsequent connection.

[0122] like Figure 4 As shown, when producing the optoelectronic glass module for double-sided display, in addition to the material preparation, glass processing, cutting and grinding, cleaning, LED circuit design, circuit processing, semi-test aging, and lamination mentioned above, the glass substrate obtained after lamination also needs to be assembled with wiring terminals and tested as a finished product.

[0123] The assembly of the terminal specifically includes: transferring the semi-finished photoelectric glass after lamination in the autoclave to the component assembly workshop, welding the designed PCB circuit board only for the switching circuit and the two exposed terminal FPC soft circuit boards of the photoelectric glass (the FPC circuit board has no external circuit parts, and its main function is only to connect the positive and negative poles of the internal power supply and the signal of the photoelectric glass) to each other in a sandwich manner, and after the welding is completed, use an insulating pad to protect the double-sided solder joints, and screw the two insulating pads to the waterproof terminal base with screws, and then weld them. Connect the GX16-6 plug line, buckle the waterproof terminal cover and side cover and tighten the screws to fix. After completing these steps, test the welding continuity rate with a meter. After confirming that there is no problem with the welding, perform the circuit connection and lighting test. Only when it can be normally touched and lit can the R, B, G primary colors and mixed white light switching test for more than 10 seconds be performed. Only when there are no quality problems such as failure to light up, partial non-lighting or flickering can the waterproof terminal be potted with glue. Let it stand for about 24 hours until the potting glue solidifies, then inspect and label it and transfer it to the finished product inspection workshop.

[0124] The finished product test specifically includes: Inspection is responsible for checking the double-sided display photoelectric glass products that are labeled and allowed to flow in the previous process. After confirming that they are correct, the tester connects the GX16-6 aviation plugs of the terminal of multiple double-sided display photoelectric glass to the professional LED power control integrated lighting equipment. The test process is similar to the product half-test plan, but the total aging time of the finished product test does not exceed 72 hours. During the total time, the power is cut off for half an hour every 8 hours to check whether there is any fault in the LED lamp beads. If there is no fault, it will be powered on again to continue the test. The finished product test aging plan also adopts high and low current shocks in turn. Light up red, green, blue (RGB three primary colors), and white (mixed color) in transient mode for 3 seconds each, then light up red, green, blue (RGB three primary colors), and white (mixed color) in a gradual mode from dark to bright for 5 seconds each, and finally light up red, green, blue (RGB three primary colors), and white (mixed color) in a flash mode for 3 seconds each, and automatically cycle through power-on aging and continuously light up until the total aging time reaches 72 hours to complete the aging process of the entire finished product test. Only the finished product that has completed the total aging time of the finished product test can be labeled and put into storage, thus completing the production of the entire double-sided display photoelectric glass railing display product;

[0125] In a third aspect, the present application provides a method for preparing a double-sided display photoelectric glass railing, comprising the following steps:

[0126] A plurality of columns are arranged along the axis, and each column is provided with a groove;

[0127] The photovoltaic glass module according to the second aspect of the present application is clamped into the grooves of two adjacent columns, and the columns and the photovoltaic glass module are detachably locked by a locking piece.

[0128] In the present application, the detachable locking includes threaded connection, pin connection, key connection and snap connection, etc.

[0129] like Figure 4 As shown, during the preparation process of the photoelectric glass railing with double-sided display, after the guardrail is assembled, installation and debugging are required. The installation and debugging are mainly aimed at testing the functions of the display control system of the photoelectric glass with double-sided display and the relevant performance of the railing.

[0130] Specifically, the assembled photovoltaic glass screen (i.e., the photovoltaic glass module mentioned above) can be inserted into the groove of the fixed steel component (i.e., the column), and the flatness of the screen can be adjusted using fine-tuning screws (the adjustment accuracy of the fine-tuning screws reaches 0.1mm) to make the fitting gap between the surface of the photovoltaic glass and the steel component uniform and less than 0.5mm. Then, the screen is firmly connected to the fixed steel component through a stainless steel bolt group. The tightening torque of the bolts is set within the specified range according to relevant standards to ensure the reliability and stability of the connection. According to the needs, the single-piece double-sided display photovoltaic glass screen is fixed to the railing fastening assembly in turn, and fixed one by one to meet the length requirements of the railing.

[0131] The display control system of the present application mainly includes a power supply and a control card. The display control card includes a main control chip (for example, a high-performance chip using an ARM architecture, with a main frequency of more than 1 GHz, and multi-channel data processing capabilities, which can simultaneously process front and back display data). The LED lamp beads in the glass-based circuit solution can adopt a single-line return-to-zero code control method (which can realize independent and precise adjustment of the brightness, color, etc. of the LED dot matrix in different areas, with an adjustment accuracy of 256 levels of grayscale control). The lamp bead spacing of the photoelectric glass for the front display is 20mm, and high color rendering index and high brightness LED lamp beads are used. The color rendering index Ra≥90, the brightness of a single lamp bead can reach 10-15 lumens, and the light uniformity reaches more than 97.5%. The photoelectric glass for the back display is configured similarly to the photoelectric glass for the front display. The power supply equipment of the main control display system is connected to the photoelectric glass display screens on the front and back respectively through the Gx16-6 interface of the wiring terminal, and together they constitute a display control system to achieve precise control of the double-sided display; each power supply equipment of the main control display system is connected to the double-sided display photoelectric glass screen at the corresponding position of the railing, and multiple power supply equipment of the main control display system are connected and communicated with each other by network cables. The double-sided video playback function can be realized by connecting the network cables to the main control display system.

[0132] After assembly, the assembled double-sided display photoelectric glass railing can be fully debugged and tested. First, check the display effect. By playing videos and image files of different formats and resolutions, observe the double-sided display from different angles and distances to ensure that the picture is clear, colorful, and has no flicker, no smear and other abnormal phenomena. Then test the stability of the electronic control system, run it continuously for more than 24 hours, and monitor whether there are any faults such as freezes, data loss, and display errors.

[0133] Conduct a simulated display test on the control system, input different images and video signals, and check whether the brightness, color, resolution and other parameters of the front and back display screens meet the design requirements. The brightness error is controlled within ±10%, the color deviation △E does not exceed 5 (measured using the internationally accepted CIE1976 color space standard), and the resolution reaches the high-definition standard (such as 1920×1080 and above). At the same time, check the response time of display mode switching, requiring the switching time to be no more than 1 second to ensure the good realization of the display function.

[0134] Check the installation firmness of the railings by applying a certain external force (such as simulating wind loads, human impacts, etc., the magnitude of the external force is set according to the design load standard corresponding to the railing application scenario), check whether the connection parts are loose, whether the glass has signs of displacement or damage. At the same time, reconfirm the optical performance of the photoelectric glass to ensure that parameters such as visible light transmittance and reflectivity are still within the qualified range, ensure that the railings can work normally in different display modes, and that the double-sided display is clear and stable without light interference and other problems.

[0135] In some embodiments, after the optoelectronic glass module is clamped in the grooves of two adjacent columns, the method further includes: filling the gap between the optoelectronic glass module and the columns with a rubber pad, and adjusting the flatness of two adjacent optoelectronic glass modules on the axis with a fine-tuning screw.

[0136] In some embodiments, the method further comprises: installing transverse guardrails on a plurality of columns distributed along the axis. The installation of the guardrails can make the photovoltaic glass module distributed along the axis more stable and improve safety.

[0137] In a fourth aspect, the present application provides a photoelectric glass railing with a double-sided display, wherein the photoelectric glass railing is prepared according to the method for preparing the photoelectric glass railing described in the third aspect of the present application.

[0138] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concept of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.

Claims

1. A method for preparing a double-sided display optoelectronic glass module, characterized in that: The following steps are involved: Cutting the anti-reflection glass according to a preset size to obtain a first glass and a second glass of the same size; Printing a first circuit on the first glass by screen printing, processing the first glass with the first circuit printed thereon, the first LED lamp group, and the first conductive layer into a first glass-based circuit board, and printing a second circuit on the second glass by screen printing, processing the second glass with the second circuit printed thereon, the second LED lamp group, and the second conductive layer into a second glass-based circuit board, the first LED lamp group comprising a plurality of first LED lamps, the plurality of first LED lamps being distributed in an array on the first glass-based circuit board, the second LED lamp group comprising a plurality of second LED lamps, the plurality of second LED lamps being distributed in an array on the second glass-based circuit board, and the first LED lamp group and the second LED lamp group being arranged alternately; The first glass-based circuit board and the second glass-based circuit board are aligned and sandwiched to obtain the photovoltaic glass module.

2. The method for preparing a double-sided display optoelectronic glass module according to claim 1, characterized in that: Before printing the first circuit and the second circuit, the method further includes: The first glass and the second glass are cleaned with deionized water and a neutral cleaning agent until the number of particle contaminants on the surfaces of the cleaned first glass and the second glass is less than 10 per square centimeter.

3. The method for preparing a double-sided display optoelectronic glass module according to claim 1 or 2, characterized in that: Printing a first circuit on the first glass by screen printing, processing the first glass printed with the first circuit, the first LED lamp group, and the first conductive layer into a first glass-based circuit board includes: Placing a large screen corresponding to the first circuit produced by the pattern transfer method on a working platform of a printing device to print a nano silver paste circuit; After the nano silver paste circuit is printed, the first circuit is inspected by optical inspection and comparison equipment. After the first circuit is inspected and qualified, the first glass printed with the first circuit is baked at 240° C. for 5 minutes, and after the baking, it is sent to a glass tempering furnace for tempering; Mounting the first LED lamp group and adding a first conductive layer at a first predetermined position on the tempered first glass to obtain a first glass-based circuit board; Printing a second circuit on the second glass by screen printing, processing the second glass printed with the second circuit, the second LED lamp group, and the second conductive layer into a second glass-based circuit board includes: Placing a large screen corresponding to the second circuit produced by the pattern transfer method on a working platform of a printing device to print a nano silver paste circuit; After the nano silver paste circuit is printed, the second circuit is inspected by optical inspection and comparison equipment. After the second circuit is inspected and qualified, the second glass printed with the second circuit is baked at 240°C for 5 minutes, and after the baking, it is sent to a glass tempering furnace for tempering; The second LED lamp group is mounted at a second predetermined position on the tempered second glass and a second conductive layer is added to obtain a second glass-based circuit board.

4. The method for preparing a double-sided display optoelectronic glass module according to claim 1, characterized in that: Before sandwiching the first glass-based circuit board and the second glass-based circuit board, the method further includes: An aging test is performed on the first glass-based circuit board and the second glass-based circuit board respectively.

5. The method for preparing a double-sided display optoelectronic glass module according to claim 1, characterized in that: The first glass-based circuit board and the second glass-based circuit board are aligned and sandwiched to obtain the photovoltaic glass module, which includes: A soft PVB film with a thickness in the range of [2.28,3.42] is selected to bond the first glass-based circuit board and the second glass-based circuit board, and the two bonded glass-based circuit boards are evacuated and sent into an autoclave to melt the PVB film.

6. A double-sided display optoelectronic glass module, characterized in that: The photovoltaic glass module is prepared according to the preparation method according to any one of claims 1 to 5.

7. A method for preparing a double-sided display photoelectric glass railing, characterized in that: The following steps are involved: A plurality of columns are arranged along the axis, and each column is provided with a groove; The photovoltaic glass module as claimed in claim 6 is clamped into the grooves of two adjacent columns, and the columns and the photovoltaic glass module are detachably locked by a locking piece.

8. The method for preparing the double-sided display photoelectric glass railing according to claim 7, characterized in that: After the photovoltaic glass module is clamped in the grooves of two adjacent columns, the method further includes: The gap between the photoelectric glass module and the column is filled with a rubber pad, and the flatness of two adjacent photoelectric glass modules on the axis is adjusted with a fine-tuning screw.

9. The method for preparing the double-sided display photoelectric glass railing according to claim 7, characterized in that: The method further comprises: Install transverse guardrails on multiple columns distributed along the axis.

10. A double-sided display photoelectric glass railing, characterized in that: The photoelectric glass railing is prepared according to the method for preparing a photoelectric glass railing according to any one of claims 7 to 9.

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