Glass-based three-dimensional capacitor and manufacturing method thereof

Abstract

The embodiment of the invention provides a glass-based three-dimensional capacitor and a manufacturing method thereof, which are used for solving the defect that the performance of the existing glass-based three-dimensional capacitor is frequently reduced and even fails in high-frequency or high-power application. The first electrode layer and the second electrode layer of the glass-based three-dimensional capacitor are designed to be of a three-dimensional structure, the structure is compact, the integration degree is high, the larger specific surface area and the higher charge storage capacity can be provided, and the capacitance density is remarkably improved. More importantly, the first electrode layer and the second electrode layer have larger heat dissipation areas, high-heat-conduction-efficiency external heat dissipation path heat dissipation of heat generated by the electrode layers is achieved, and the medium base body takes away heat in the medium base body in time through an internal heat dissipation path where a cooling medium in the micro-channel flows. Through the double heat dissipation path design, the heat dissipation capability of the capacitor is remarkably improved, the thermal shock resistance and the thermal stability of the capacitor are enhanced, and the capacitor can continuously and stably work in a high-temperature environment.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of electronic devices, and in particular to a glass-based three-dimensional capacitor and a manufacturing method thereof. Background Art

[0002] In electronic circuits, capacitors are key components used to store charge, smooth voltage fluctuations, isolate DC signals, transmit AC signals, and filter high-frequency noise. Traditional capacitors usually use ceramic or organic materials as the matrix, and different material media give them unique electrical properties. However, due to the limitations of structural design, traditional capacitors are difficult to integrate directly into the substrate of microelectronic systems, but are installed through patch technology.

[0003] In order to improve the integration of capacitors, researchers proposed a three-dimensional integrated capacitor design based on glass substrates. This scheme uses through-glass via (TGV) technology to process micro blind holes on glass substrates, and metallizes the inner wall of the blind holes and the surface of the glass substrate. Through this design, the three-dimensional integrated capacitor not only has a compact structure, but also provides a large specific surface area, thereby significantly improving the capacitance density and integration, which is especially suitable for the high integration requirements of miniaturized RF systems.

[0004] However, in the process of implementing the technical solution in the embodiment of the present invention, the inventors found that in high-frequency or high-power applications, the existing glass-based three-dimensional capacitors have at least the following technical problems:

[0005] During use, the performance of existing glass-based three-dimensional capacitors often degrades or even fails, which constitutes an important constraint on the stability of high-frequency equipment and high-power systems. Summary of the invention

[0006] In view of this, an object of an embodiment of the present invention is to provide a glass-based three-dimensional capacitor and a manufacturing method thereof, so as to solve the technical problem that the existing glass-based three-dimensional capacitors often experience performance degradation or even failure in high-frequency or high-power applications.

[0007] In order to achieve the above purpose, the technical solutions adopted in the embodiments of the present invention are as follows:

[0008] In a first aspect, an embodiment of the present invention provides a glass-based three-dimensional capacitor, comprising:

[0009] a first glass substrate;

[0010] a second glass substrate;

[0011] The first glass substrate and the second glass substrate have the same size and structure;

[0012] A plurality of blind holes opening toward the respective first surfaces and a plurality of blind grooves opening toward the respective second surfaces are provided on the first glass substrate and the second glass substrate; wherein the first surface and the second surface are two surfaces on opposite sides;

[0013] The first surface of the first glass substrate and the inner wall of the blind hole thereof are metallized to form a first electrode layer;

[0014] The first surface of the second glass substrate and the inner wall of the blind hole thereof are metallized to form a second electrode layer;

[0015] The glass-based three-dimensional capacitor is obtained by aligning and bonding the second surfaces of the first glass substrate and the second glass substrate; the multiple blind grooves on the first glass substrate and the multiple blind grooves on the second glass substrate are aligned with each other to form multiple microchannels running through the two sides of the glass-based three-dimensional capacitor; the microchannels are used to remove the heat inside the glass-based three-dimensional capacitor through the flow of cooling medium.

[0016] Optionally, the first electrode layer and the second electrode layer include a metal electrode layer and a metal adhesion layer, wherein the metal adhesion layer is used to enhance the interface bonding strength between the metal electrode layer and the glass substrate.

[0017] Optionally, the material of the metal electrode layer is one of copper, nickel, silver and gold.

[0018] Optionally, the material of the metal adhesion layer is one of titanium, titanium nitride and titanium tungsten.

[0019] Optionally, the inner wall of the blind groove is metallized to form a heat dissipation metal layer.

[0020] In a second aspect, an embodiment of the present invention provides a method for manufacturing a glass-based three-dimensional capacitor, comprising the following steps:

[0021] The first glass substrate and the second glass substrate are first cleaned and then dried; the first glass substrate and the second glass substrate are two glass substrates with the same specifications and sizes;

[0022] On the dried first glass substrate and the second glass substrate, using laser irradiation technology to form a plurality of blind hole modified areas on the first surface and a plurality of blind groove modified areas on the second surface;

[0023] Placing the laser-modified first glass substrate and the second glass substrate into etching grooves of an etching device and performing etching treatment to form blind holes opened on the first surface and blind grooves opened on the second surface on the first glass substrate and the second glass substrate, respectively obtaining a first glass substrate and a second glass substrate;

[0024] By means of a film deposition process, a metal adhesion layer is firstly deposited on the inner wall of the blind hole and the first surface of the first glass substrate and the second glass substrate, and a metal electrode layer is then deposited on the metal adhesion layer to obtain a first electrode layer corresponding to the first glass substrate and a second electrode layer corresponding to the second glass substrate;

[0025] First, align the second surface of the first glass substrate with the second surface of the second glass substrate to ensure that the blind groove openings of the two glass substrates are aligned, and bond them together to form a microchannel structure; then use glass bonding technology to bond the first glass substrate and the second glass substrate into a three-dimensional capacitor body;

[0026] The first electrode lead terminal is manufactured on the first electrode layer by using the electrode contact manufacturing technology, and the second electrode lead terminal is manufactured on the second electrode layer, so as to obtain a glass-based three-dimensional capacitor with a microchannel heat dissipation structure.

[0027] Optionally, the step of first cleaning the first glass substrate and the second glass substrate is specifically as follows:

[0028] Using a mixed cleaning solution, preliminarily cleaning the first glass substrate and the second glass substrate;

[0029] The first glass substrate and the second glass substrate after the preliminary cleaning are cleaned again using ultrapure water.

[0030] Optionally, the step of obtaining a first electrode layer corresponding to the first glass substrate and a second electrode layer corresponding to the second glass substrate further includes:

[0031] A metal adhesion layer is first deposited on the inner wall of the blind groove through a deposition process, and then a heat dissipation metal layer is deposited.

[0032] Optionally, if the glass bonding technology used is glass paste bonding, the step of using the glass bonding technology to bond the first glass substrate and the second glass substrate into a three-dimensional capacitor body is specifically as follows:

[0033] Uniformly coating glass slurry on the second surface of the first glass substrate and the second glass substrate;

[0034] Aligning the second surface of the first glass substrate with the second surface of the second glass substrate, ensuring that the blind groove openings of the two glass substrates are aligned, and bonding them together to form a through microchannel structure;

[0035] An ultraviolet laser is used to scan and irradiate the glass paste in the bonding area between the first glass substrate and the second glass substrate, so that the glass paste is heated, melted and solidified, and the first glass substrate and the second glass substrate are bonded into a three-dimensional capacitor body.

[0036] Compared with the traditional capacitor that relies on the thermal conductivity of the material itself for heat dissipation, the glass-based three-dimensional capacitor in the embodiment of the present invention, the first electrode layer and the second electrode layer are both three-dimensional structure designs, which are not only compact and highly integrated, but also can provide a larger specific surface area and a higher charge storage capacity, significantly improving the capacitance density, so as to better meet the needs of high-frequency and high-power applications. More importantly, the first electrode layer and the second electrode layer have a larger heat dissipation area, realizing the high heat conduction efficiency external heat dissipation path of the heat generated by the electrode layer, and the dielectric matrix composed of the first glass matrix and the second glass matrix takes away the internal heat of the dielectric matrix in time through the internal heat dissipation path of the cooling medium flowing in the microchannel. Through this dual heat dissipation path design, the working heat generated by the first electrode layer, the second electrode layer and the dielectric matrix is ​​taken away in time and effectively, significantly improving the heat dissipation capacity of the capacitor, enhancing its thermal shock resistance and thermal stability, ensuring that the capacitor can continue to work stably in a high temperature environment, and effectively preventing the technical problem of performance degradation or even failure caused by heat accumulation due to insufficient heat dissipation.

[0037] Therefore, the glass-based three-dimensional capacitor in the embodiment of the present invention achieves a dual improvement in capacitance density and heat dissipation capacity by optimizing the electrode layer structure and forming a dual heat dissipation path, avoiding technical problems such as performance degradation or failure due to overheating, making it particularly suitable for application in high-frequency, high-power microelectronic systems to meet stringent performance requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0039] Figure 1 A schematic structural diagram of a glass-based three-dimensional capacitor in an embodiment of the present invention is shown;

[0040] Figure 2A schematic cross-sectional view showing a first glass substrate and a second glass substrate of a glass-based three-dimensional capacitor in an embodiment of the present invention is shown;

[0041] Figure 3 A schematic cross-sectional view of a first glass substrate and a second glass substrate that have been metallized to form an electrode layer in an embodiment of the present invention is shown;

[0042] Figure 4 A schematic flow chart of a method for manufacturing a glass-based three-dimensional capacitor in an embodiment of the present invention is shown.

[0043] The corresponding relationship between the reference numerals and component names in the figures is as follows:

[0044] A glass-based three-dimensional capacitor 100 comprises a first glass substrate 110 , a second glass substrate 120 , a microchannel 130 , a blind hole 140 , a blind groove 150 , a metal adhesion layer 160 , and a metal electrode layer 170 . DETAILED DESCRIPTION

[0045] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in combination with practical applications and with reference to the drawings of the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0046] The glass-based three-dimensional capacitor in the embodiment of the present invention is applied to microelectronic systems, and is particularly suitable for high-frequency or high-power miniaturized radio frequency systems.

[0047] Existing glass-based three-dimensional capacitors often experience technical problems such as performance degradation or even failure in high-frequency or high-power applications, which limits their application in high-frequency microelectronic systems.

[0048] Through in-depth research on the structural design of existing glass-based three-dimensional capacitors, the inventors found that the root cause of this technical problem is not that the increase in capacitance density and integration has caused the instability of electromagnetic properties, but that the glass material itself has poor thermal conductivity and insufficient heat dissipation capacity, which causes heat to accumulate in the dielectric matrix, thereby causing changes in the dielectric constant and dielectric loss, ultimately leading to a decrease in capacitor performance or even failure.

[0049] Further research found that the reason why the dielectric matrix of the existing glass-based three-dimensional capacitors is not equipped with a corresponding heat dissipation structure is mainly because the dielectric matrix is ​​an integrally formed thin sheet structure. Forming a heat dissipation structure in the dielectric matrix through side processing is not only technically difficult to implement, but also costly and does not meet the requirements of industrial production. As a result, no heat dissipation design is introduced into the dielectric matrix structure of the capacitor.

[0050] In the process of implementing the technical solution in the embodiment of the present invention, the inventors found that forming a microstructure on a substrate by micro-nano processing technology is a mature and universal solution. If the glass dielectric matrix of the three-dimensional capacitor adopts a technical solution consisting of two glass substrates of the same size and structure bonded together, each glass substrate can be micro-nano processed to form a plurality of groove microstructures that pass through the two sides. When bonding, the openings of the groove microstructures of the two glass substrates are aligned to form a plurality of microchannels for removing internal heat through the flow of cooling medium, thereby forming a heat dissipation structure on the glass dielectric matrix. Furthermore, by coating the metal electrode material on the opposite sides of the bonding surfaces of the two glass substrates constituting the glass dielectric matrix, two electrode layers of a glass-based three-dimensional capacitor can be formed.

[0051] Based on the above understanding, the inventors proposed a glass-based three-dimensional capacitor and a manufacturing method, which is used to manufacture a glass-based three-dimensional capacitor. The capacitor achieves a dual improvement in capacitance density and heat dissipation capacity by optimizing the electrode layer structure and forming a dual heat dissipation path, effectively reducing the risk of performance degradation or failure due to overheating, so that it can play a superior performance in high-frequency, high-power microelectronic systems and meet stringent application requirements.

[0052] The technical solution of the present invention will be described below in conjunction with the accompanying drawings and embodiments.

[0053] Figure 1 A schematic cross-sectional view of a glass-based three-dimensional capacitor in an embodiment of the present invention is shown.

[0054] Figure 2 A schematic cross-sectional view of a first glass substrate and a second glass substrate of a glass-based three-dimensional capacitor in an embodiment of the present invention is shown.

[0055] Figure 3 A schematic cross-sectional view of a first glass substrate and a second glass substrate that have been metallized to form an electrode layer in an embodiment of the present invention is shown.

[0056] Now refer to Figure 1 , while combining Figure 2 , Figure 3 As shown, in an embodiment of the present invention, a glass-based three-dimensional capacitor is provided, comprising:

[0057] A first glass substrate 110;

[0058] A second glass substrate 120;

[0059] The first glass substrate 110 and the second glass substrate 120 have the same size and structure;

[0060] A plurality of blind holes 140 opening toward the respective first surfaces and a plurality of blind grooves opening toward the respective second surfaces are provided on the first glass substrate 110 and the second glass substrate 120; wherein the first surface and the second surface are two surfaces on opposite sides;

[0061] The first surface of the first glass substrate 110 and the inner wall of the blind hole thereof are metallized to form a first electrode layer;

[0062] The first surface of the second glass substrate 120 and the inner wall of the blind hole thereof are metallized to form a second electrode layer;

[0063] The glass-based three-dimensional capacitor 100 is obtained by aligning the second surfaces of the first glass substrate 110 and the second glass substrate 120 and performing mirror bonding; the multiple blind grooves 150 on the first glass substrate 110 and the multiple blind grooves 150 on the second glass substrate 120 are aligned with each other to form a plurality of microchannels 130 running through the two sides of the glass-based three-dimensional capacitor 100; the microchannels 130 are used to remove the heat inside the glass-based three-dimensional capacitor 100 through the flow of cooling medium.

[0064] The glass-based three-dimensional capacitor 100 in the embodiment of the present invention improves the existing one-piece dielectric substrate into one composed of the first glass substrate 110 and the second glass substrate 120 through mirror bonding, so as to facilitate the formation of a heat dissipation structure on the dielectric substrate. A plurality of blind holes 140 are opened under the first surface of the first glass substrate 110 and the second glass substrate 120, and the inner walls and the first surface of these blind holes are metallized to form a first electrode layer with a three-dimensional structure on the first glass substrate 110, and a second electrode layer with a three-dimensional structure is formed on the second glass substrate 120. The first electrode layer and the second electrode layer adopt a three-dimensional structure design, which greatly increases the specific surface area of ​​the electrode layer, improves the charge storage capacity, and achieves a higher capacitance density. At the same time, the increase in the specific surface area of ​​the electrode layer also improves its thermal conduction efficiency. The heat generated by the electrode layer can be quickly conducted to the outside, forming an effective external heat dissipation path, thereby improving the heat dissipation capacity.

[0065] In the process of forming the dielectric matrix, the openings of the blind grooves 150 of the first glass matrix 110 and the second glass matrix 120 are precisely aligned, and the glass dielectric matrix formed by bonding has a plurality of microchannels 130 running through both sides. The microchannels 130 are used to provide a flow channel for the circulation of the cooling medium, and the heat inside the dielectric matrix can be taken away by the flow of the cooling medium, forming an effective internal heat dissipation path.

[0066] During the operation of the glass-based three-dimensional capacitor 100, the heat generated by the first electrode layer and the second electrode layer is dissipated to the external environment with a higher heat conduction efficiency due to the increase in specific surface area; while the heat generated by the dielectric matrix composed of the first glass matrix 110 and the second glass matrix 120 is promptly taken away by the flow of the cooling medium in the microchannel 130, ensuring that the dielectric matrix always remains within the normal operating temperature range. Through this dual heat dissipation path, the thermal shock resistance and thermal stability of the capacitor are significantly improved, ensuring that the capacitor can continue to work stably in a high temperature environment.

[0067] The three-dimensional capacitor has a compact structure and high integration in terms of structural design. At the same time, the capacitance density is greatly improved by increasing the specific surface area of ​​the electrode to better meet the needs of high-frequency and high-power applications. More importantly, the external heat dissipation path formed by the electrode layer with a larger specific surface area realizes rapid heat dissipation of the electrode layer, and the internal heat dissipation path formed by the microchannel 130 of the cooling medium flow channel realizes rapid heat dissipation of the dielectric matrix. This dual heat dissipation path design significantly improves the heat dissipation capacity and efficiency of the capacitor, avoids heat accumulation, enhances the capacitor's resistance to thermal shock and thermal stability, ensures the reliable operation of the capacitor in a high temperature environment, and avoids the risk of performance degradation or even failure due to overheating of the dielectric matrix.

[0068] In the embodiment of the present invention, the material for making the first glass substrate 110 and the second glass substrate 120 is a glass material that can be used for capacitor manufacturing, such as borosilicate glass, quartz glass, and aluminosilicate glass, which has good insulation performance and high temperature resistance, and maintains stable physical and chemical properties in a high temperature environment. In practical applications, the selection of material types can be adjusted according to different application requirements to better meet the requirements of various high-frequency and high-power applications.

[0069] In an embodiment of the present invention, the first glass substrate 110 and the second glass substrate 120 have the same size and structure, and the two are mirror-bonded to form a dielectric substrate of a three-dimensional capacitor, which is used to provide mechanical support and electrical insulation for the first electrode layer and the second electrode layer.

[0070] A plurality of blind holes 140 opening toward the respective first surfaces and a plurality of blind grooves 150 opening toward the respective second surfaces are formed on the first glass substrate 110 and the second glass substrate 120. The first surface and the second surface are two surfaces on opposite sides.

[0071] The first electrode layer of the three-dimensional structure is formed by metallizing the inner wall of the blind hole and the first surface on the first glass substrate 110, and the second electrode layer of the three-dimensional structure is formed by metallizing the inner wall of the blind hole and the first surface on the second glass substrate 120. The first electrode and the second electrode layer are functional layers for storing charge in the three-dimensional capacitor. Compared with the electrode layer of the curved or planar structure, the first electrode layer and the second electrode layer of the three-dimensional structure have a larger specific surface area and a higher charge storage capacity, which significantly improves the capacitance density of the capacitor. At the same time, when the capacitor is working, the heat generated by the electrode layer is quickly dissipated through the external heat dissipation path with a larger specific surface area, thereby improving the heat dissipation capacity and heat dissipation efficiency of the electrode layer.

[0072] The blind groove 150 of the first glass substrate 110 and the blind groove 150 of the second glass substrate 120 are aligned during the bonding process, and the microchannels 130 that penetrate the two sides of the three-dimensional capacitor dielectric substrate are formed after bonding. By adding these microchannels 130 in the dielectric substrate, a path is provided for the flow of the cooling medium, forming an internal heat dissipation path, and timely dissipating the internal heat generated by the dielectric substrate when the capacitor is working.

[0073] In practical applications, both ends of the microchannel 130 are connected to an external cooling system through pipes to form a complete cooling loop.

[0074] This dual heat dissipation path formed by the combination of the external heat dissipation path brought by the three-dimensional electrode layer structure and the internal heat dissipation path brought by the microchannel 130 in the dielectric matrix significantly improves the heat dissipation capacity and efficiency of the capacitor, avoids heat accumulation, enhances the capacitor's resistance to thermal shock and thermal stability, ensures the capacitor's reliable operation in a high temperature environment, and avoids the risk of performance degradation or even failure due to overheating.

[0075] In the embodiment of the present invention, the opening of a plurality of blind holes 140 and blind grooves 150 on the first glass substrate 110 and the second glass substrate 120 is achieved by laser induced modification and chemical etching processes. Laser induced modification is used to form a graphic modified initial structure on the glass substrate, and chemical etching is used to further form a blind hole and blind groove structure with a smooth and uniform inner wall. Exemplarily, the diameter of the blind hole 140 is 15 to 80 microns and the depth is 200 to 600 microns; the width of the blind groove 150 is 100 to 400 microns and the depth is 200 to 600 microns.

[0076] The process used for metallizing the inner wall of the blind hole and the first surface to form the first electrode layer and the second electrode layer is a film deposition process, such as chemical vapor deposition, electroplating, atomic layer deposition (ALD), and physical vapor deposition (PVD). Among them, chemical vapor deposition is suitable for depositing a uniform metal adhesion layer 160 and a metal electrode layer 170, and can form a dense film on the surface of the glass substrate. Electroplating is suitable for depositing a thicker metal electrode layer 170, and can form a highly conductive metal layer on the surface of the glass substrate. Atomic layer deposition and physical vapor deposition can provide higher uniformity and adhesion, and are suitable for applications with high performance requirements. These film deposition processes can form a uniform, dense, and controllable thickness range of the metal electrode layer 170 on the inner wall of the blind hole.

[0077] The glass bonding technology used to form the dielectric substrate by mirror bonding the first glass substrate 110 and the second glass substrate 120 is one of hot compression bonding, hybrid bonding, and glass paste bonding. Among them, hot compression bonding is to firmly bond the first glass substrate 110 and the second glass substrate 120 together by heating and applying pressure; hybrid bonding is to firmly bond the first glass substrate 110 and the second glass substrate 120 together by chemical reaction and physical action; glass paste bonding is to firmly bond the first glass substrate 110 and the second glass substrate 120 together by irradiating ultraviolet light to melt the glass paste and then solidify it.

[0078] It should be understood that although increasing the density and depth of the blind holes 140 helps to expand the specific surface area of ​​the first electrode layer and the second electrode layer, thereby achieving a higher capacitance density at the same size, an excessively high blind hole density will reduce the effective area of ​​the bonding area, resulting in a decrease in bonding quality and an increased risk of component separation. At the same time, increasing the depth of the blind holes will make the intermediate dielectric layer thinner, reduce the breakdown voltage, and increase the probability of device failure. Therefore, when designing and manufacturing the glass-based three-dimensional capacitor 100, the density and depth of the blind holes must be carefully weighed to achieve a balance between capacitance performance and structural reliability.

[0079] Similarly, although increasing the width of the blind groove 150 can form the microchannel 130 structure with a larger flow rate and improve heat dissipation efficiency, an overly wide blind groove 150 will also reduce the effective area of ​​the bonding area, affect the bonding quality and increase the risk of component separation.

[0080] Therefore, in practical applications, the sizes of the blind hole 140 and the blind groove 150 should be reasonably determined according to specific requirements to achieve a balance between capacitance density, heat dissipation efficiency and bonding quality.

[0081] It can be seen that compared with the traditional capacitor that relies on the thermal conductivity of the material itself for heat dissipation, the glass-based three-dimensional capacitor in the embodiment of the present invention, the first electrode layer and the second electrode layer are both three-dimensional structure designs, which are not only compact and highly integrated, but also can provide a larger specific surface area and a higher charge storage capacity, significantly improving the capacitance density, so as to better meet the needs of high-frequency and high-power applications. More importantly, the first electrode layer and the second electrode layer have a larger heat dissipation area, realizing the high heat conduction efficiency external heat dissipation path of the heat generated by the electrode layer, and the dielectric matrix composed of the first glass matrix 110 and the second glass matrix 120 takes away the internal heat of the dielectric matrix in time through the internal heat dissipation path of the cooling medium flowing in the microchannel 130. Through this dual heat dissipation path design, the working heat generated by the first electrode layer, the second electrode layer and the dielectric matrix is ​​taken away in time and effectively, significantly improving the heat dissipation capacity of the capacitor, enhancing its thermal shock resistance and thermal stability, ensuring that the capacitor can continue to work stably in a high temperature environment, and effectively preventing the technical problem of performance degradation or even failure caused by heat accumulation due to insufficient heat dissipation.

[0082] Therefore, the glass-based three-dimensional capacitor in the embodiment of the present invention achieves a dual improvement in capacitance density and heat dissipation capacity by optimizing the electrode layer structure and forming a dual heat dissipation path, avoiding technical problems such as performance degradation or failure due to overheating, making it particularly suitable for application in high-frequency, high-power microelectronic systems to meet stringent performance requirements.

[0083] In order to ensure that the first electrode layer and the second electrode layer can be firmly attached to the glass substrate, in a possible embodiment, the first electrode layer and the second electrode layer include a metal electrode layer 170 and a metal adhesion layer 160, wherein the metal adhesion layer 160 is used to enhance the interface bonding strength between the metal electrode layer 170 and the glass substrate.

[0084] In this embodiment, the metal electrode layer 170 is used to provide charge storage and release, and the metal adhesion layer 160 is used to enhance the interface bonding strength between the metal electrode layer and the glass substrate. In the specific implementation process, a layer of the metal adhesion layer 160 is first deposited on the surface of the glass substrate, and then the metal electrode layer 170 is deposited thereon, which can significantly improve the interface bonding strength of the metal electrode layer 170 and reduce interface defects and stress concentration. Through the strengthening effect of the metal adhesion layer 160, the metal electrode layer 170 can be more firmly attached to the glass substrate, ensuring the uniformity and reliability of its structure.

[0085] The material forming the metal electrode layer 170 is a material used to make a capacitor electrode layer. In a possible embodiment, the material of the metal electrode layer 170 is one of copper, nickel, silver, and gold. Among them, copper has excellent electrical conductivity and thermal conductivity, and is suitable for high-frequency and high-power applications. Nickel has good corrosion resistance and mechanical strength, and is suitable for harsh environments. Silver has the highest electrical conductivity and thermal conductivity, but is relatively expensive and is suitable for high-performance applications. Gold has excellent electrical conductivity and oxidation resistance, is more expensive, and is suitable for high-reliability applications. Although silver and gold are relatively expensive, their excellent electrical conductivity and chemical stability make them preferred in high-performance applications. These metal materials have high electrical conductivity and thermal conductivity, which can not only significantly improve the charge transfer capability of the metal electrode layer 170, but also optimize the heat dissipation performance of the capacitor, thereby comprehensively enhancing its overall performance.

[0086] The thickness of the metal electrode layer 170 is determined according to the design requirements of the capacitor to ensure that the metal electrode layer 170 has good conductivity and structural stability. Exemplarily, the thickness of the metal electrode layer 170 is 0.1 to 4 microns.

[0087] In order to ensure that the metal adhesion layer 160 can better enhance the interfacial bonding strength between the metal electrode layer 170 and the glass substrate, in a possible embodiment, the material of the metal adhesion layer 160 is one of titanium, titanium nitride, and titanium tungsten. Among them, titanium has good chemical stability and mechanical strength, and can effectively enhance the bonding strength between the metal electrode layer 170 and the glass substrate. Titanium nitride not only has the excellent properties of titanium, but also has higher hardness and wear resistance, and is suitable for high stress environments. Titanium tungsten alloy has excellent conductivity and mechanical strength, and can maintain stable performance under high temperature environment. Titanium is widely used because of its light weight and high strength, while titanium nitride and titanium tungsten are preferred because of their excellent wear resistance and high temperature stability. These materials can effectively enhance the interfacial bonding force between the metal electrode layer 170 and the glass substrate, and ensure the structural stability and performance reliability of the metal electrode layer 170 in long-term use.

[0088] The thickness of the metal adhesion layer 160 is determined according to the design requirements of the capacitor. For example, the thickness of the metal adhesion layer 160 is 0.01 to 0.3 micrometers.

[0089] In order to improve the heat dissipation capacity and heat dissipation efficiency of the microchannel, in a possible implementation, the inner wall of the blind groove 150 is metallized to form a heat dissipation metal layer. The material of the heat dissipation metal layer is a metal with high thermal conductivity and corrosion resistance, such as copper, nickel, aluminum or silver. Exemplarily, the thickness of the heat dissipation metal layer is 0.1 to 0.6 microns.

[0090] The heat dissipation metal layer can significantly enhance the efficiency of conducting heat from the inside of the dielectric matrix through the microchannel, thereby further improving the overall heat dissipation effect of the glass-based three-dimensional capacitor 100 .

[0091] The method of blind slot metallization is the same as that of blind hole metallization, except that the material used for the heat dissipation metal layer focuses on high thermal conductivity and corrosion resistance.

[0092] Figure 4 A schematic flow chart of a method for manufacturing a glass-based three-dimensional capacitor in an embodiment of the present invention is shown.

[0093] Now refer to Figure 4 As shown, the present invention also provides a method for manufacturing a glass-based three-dimensional capacitor in an embodiment, comprising the following steps:

[0094] S110, first cleaning the first glass substrate and then drying the second glass substrate; the first glass substrate and the second glass substrate are two glass substrates with the same specifications and sizes;

[0095] In an embodiment of the present invention, the material of the first glass substrate and the second glass substrate is a glass material that can be used for capacitor manufacturing, such as borosilicate glass, aluminosilicate glass, and quartz glass, which has good insulation and high temperature resistance, and maintains stable physical and chemical properties in a high temperature environment.

[0096] The specific implementation process of step S110 may be:

[0097] Prepare two glass substrates with the same specifications and sizes, a first glass substrate and a second glass substrate;

[0098] Use a mixed cleaning solution to decompose grease and other organic pollutants by chemical action, and perform preliminary cleaning on the first glass substrate and the second glass substrate to remove impurities and dirt on their surfaces. The mixed solution can be composed of ammonia water, hydrogen peroxide and water, or it can be composed of hydrogen chloride, hydrogen peroxide and water. The specific selection depends on actual needs. The preliminary cleaning method can be at least one of static immersion, ultrasonic cleaning, and spray cleaning. Exemplarily, the time for preliminary cleaning is 5 to 10 minutes.

[0099] Ultrapure water is used to re-clean the first glass substrate and the second glass substrate after preliminary cleaning by utilizing its high purity and cleaning ability, so as to completely remove residual detergent and other pollutants and ensure that the cleanliness of the glass surface meets the requirements.

[0100] The first glass substrate and the second glass substrate are dried after cleaning to ensure that there is no water residue on the surface. The drying method can be hot air drying, oven drying, vacuum drying or natural drying.

[0101] In step S110 , the first glass substrate and the second glass substrate are first cleaned to remove surface pollutants, such as impurities and dirt, to facilitate subsequent laser modification processing.

[0102] S120, on the dried first glass substrate and the second glass substrate, using laser irradiation technology to form a plurality of blind hole modified regions on the first surface and a plurality of blind groove modified regions on the second surface;

[0103] The laser used in the embodiments of the present invention may be one of a femtosecond laser, a picosecond laser and a nanosecond laser. Among them, the nanosecond laser has a relatively low cost and is suitable for some occasions where the precision requirement is not high. The femtosecond and picosecond lasers can minimize the heat-affected zone and achieve a more precise processing effect due to their extremely short pulse width, and are suitable for applications with high precision requirements.

[0104] The working parameters of the laser include laser processing type, laser power, laser wavelength, laser focal length, scanning speed and repetition frequency. Among them, the laser focal length determines the size of the spot and the position of the focus. The scanning speed and repetition frequency determine the scanning path and energy density of the laser on the substrate. In practical applications, the working parameter settings of the laser need to be optimized according to the shape and size of the target microstructure.

[0105] The specific implementation process of step S120 may be:

[0106] The operating parameters of the laser are set according to the material properties and thickness of the first glass substrate and the second glass substrate and the specifications of the target blind holes and blind grooves. Usually, the selection range of the laser focal length parameter is 100 to 600 microns, and the selection range of the laser power parameter is 5 to 15 watts.

[0107] The dried first glass substrate is placed on a stage of a laser with its first surface facing upward; the laser is started, and the first surface of the first glass substrate is scanned and irradiated according to a preset scanning path to form a plurality of blind hole modified areas; after the first surface modification is completed, the first glass substrate is turned over so that its second surface faces upward, and the second surface is scanned and irradiated using the same laser parameters to form a plurality of blind groove modified areas.

[0108] The same laser modification steps as those for the first glass substrate are repeated to operate on the dried second glass substrate to form a blind hole modification region on the first surface thereof and a blind groove modification region on the second surface thereof.

[0109] It should be understood that the first glass substrate and the second glass substrate after laser modification need to be subjected to conventional cleaning treatment to remove debris or surface slag generated by laser irradiation.

[0110] In step S120, a laser is used to modify the materials in the prefabricated blind hole regions or prefabricated blind groove regions of the first glass substrate and the second glass substrate, so that a plurality of blind hole modified regions are formed on the first surface of the first glass substrate and the second glass substrate, and a plurality of blind groove modified regions are formed on the second surface, so as to facilitate subsequent selective etching of these modified regions.

[0111] S130, placing the first glass substrate and the second glass substrate after laser modification into an etching groove of an etching device, performing an etching process, forming a blind hole opened on the first surface and a blind groove opened on the second surface on the first glass substrate and the second glass substrate, respectively obtaining a first glass substrate and a second glass substrate;

[0112] In the embodiment of the present invention, etching processing refers to using a chemical etching solution to selectively remove the material with a changed lattice structure in the modified area to form a desired blind hole or blind groove microstructure.

[0113] The specific implementation process of step S130 may be:

[0114] A predetermined amount of etching solution is added to the etching tank of the etching equipment. The etching solution can be a hydrofluoric acid solution or an alkaline solution, and the specific selection of the etching solution is determined according to the process requirements.

[0115] The first glass substrate and the second glass substrate modified by laser are placed on an etching fixture, the etching fixture is placed in an etching groove, and it is ensured that the glass substrate is completely immersed in the etching liquid, the etching equipment is started, and the etching process is performed for a predetermined time, and finally a blind hole opening on the first surface and a blind groove opening on the second surface are formed on the first glass substrate and the second glass substrate, thereby obtaining a first glass substrate and a second glass substrate respectively.

[0116] Exemplarily, the diameter of the blind hole formed by etching is 15 to 80 microns, and the depth is 200 to 600 microns; the width of the blind groove is 100 to 400 microns, and the depth is 200 to 600 microns.

[0117] It should be understood that after etching is completed, the first glass substrate and the second glass substrate are taken out from the etching tank and subjected to conventional cleaning and drying treatments to enhance their interface bonding strength in the subsequent film deposition stage.

[0118] In step S130, the material with changed lattice structure in the blind hole and blind groove modified areas of the first glass substrate and the second glass substrate is selectively removed using an etching solution, and the glass material in the laser modified area is selectively removed to form corresponding blind hole and blind groove microstructures with smooth and uniform inner walls.

[0119] S140, first depositing a metal adhesion layer on the inner wall of the blind hole and the first surface of the first glass substrate and the second glass substrate through a film deposition process, and then depositing a metal electrode layer on the metal adhesion layer to obtain a first electrode layer corresponding to the first glass substrate and a second electrode layer corresponding to the second glass substrate;

[0120] The specific implementation process of step S140 may be:

[0121] A film deposition process is used to deposit a metal adhesion layer of a predetermined thickness on the inner wall of the blind hole, the inner wall of the blind groove, the first surface, and the second surface of the first glass substrate and the second glass substrate; the material of the metal adhesion layer is one of titanium, titanium nitride, and titanium tungsten. Exemplarily, the thickness of the metal adhesion layer is 0.01 to 0.3 microns.

[0122] A metal electrode layer of a predetermined thickness is deposited on the metal adhesion layer using a deposition process similar to that of the metal adhesion layer. The material of the metal electrode layer is one of copper, nickel, silver, and gold. Exemplarily, the thickness of the metal electrode layer is 0.1 to 4 microns.

[0123] Use a probe station or a resistance tester to check the electrical connectivity of the metal electrode layer on the first surface of the first glass substrate and the inner wall of the blind hole to ensure the functional integrity of the first electrode layer and the second electrode layer.

[0124] In an embodiment of the present invention, the film deposition process may specifically be one of chemical vapor deposition, electroplating, atomic layer deposition (ALD), and physical vapor deposition (PVD). The film deposition process can form the first electrode layer and the second electrode layer on the inner wall of the blind hole, which are uniform, dense, and have a controllable thickness range. Among them, chemical vapor deposition is suitable for depositing the uniform metal adhesion layer and the metal electrode layer, and can form a dense film on the surface of the glass substrate. Electroplating is suitable for depositing a thicker metal electrode layer, and can form a highly conductive metal layer on the surface of the glass substrate. Atomic layer deposition and physical vapor deposition can provide higher uniformity and adhesion, and are suitable for applications with high performance requirements.

[0125] The material of the metal adhesion layer is one of titanium, titanium nitride, and titanium tungsten. These materials can effectively improve the interfacial bonding force between the metal electrode layer and the glass substrate, and ensure the structural stability and performance reliability of the metal electrode layer deposited on the metal adhesion layer in long-term use. Among them, titanium has good chemical stability and mechanical strength, and can effectively enhance the bonding strength between the metal electrode layer and the glass substrate. Titanium nitride not only has the excellent properties of titanium, but also has higher hardness and wear resistance, and is suitable for high stress environments. Titanium tungsten alloy has excellent conductivity and mechanical strength, and can maintain stable performance in high temperature environments. Titanium is widely used because of its light weight and high strength, while titanium nitride and titanium tungsten are preferred because of their excellent wear resistance and high temperature stability.

[0126] The material of the metal electrode layer is one of copper, nickel, silver and gold. These metal materials have high electrical conductivity and thermal conductivity, which can not only significantly improve the charge transfer capacity of the metal electrode layer, but also optimize the heat dissipation performance of the capacitor, thereby comprehensively enhancing its overall performance. Among them, copper has excellent electrical conductivity and thermal conductivity, and is suitable for high-frequency and high-power applications. Nickel has good corrosion resistance and mechanical strength, and is suitable for harsh environments. Silver has the highest electrical conductivity and thermal conductivity, but is more expensive and is suitable for high-performance applications. Gold has excellent electrical conductivity and oxidation resistance, and is suitable for high-reliability applications. Although silver and gold are more expensive, their excellent electrical conductivity and chemical stability make them preferred in high-performance applications.

[0127] The first electrode layer and the second electrode layer of the three-dimensional structure are formed on the first glass substrate and the second glass substrate through step S140. Compared with the electrode layer of the curved surface or the flat surface structure, the first electrode layer and the second electrode layer of the three-dimensional structure have a larger specific surface area and a higher charge storage capacity, which significantly improves the capacitance density of the capacitor. At the same time, the first electrode layer and the second electrode layer have a larger heat dissipation area, which improves the heat dissipation capacity and heat dissipation efficiency of the electrode layer.

[0128] In order to improve the heat dissipation performance of the microchannel formed by the blind groove, step S140 also includes first depositing a metal adhesion layer on the inner wall of the blind groove through a deposition process, and then depositing a heat dissipation metal layer.

[0129] The method of blind slot metallization is the same as that of blind hole metallization, except that the material used for the heat dissipation metal layer focuses on high thermal conductivity and corrosion resistance. The material of the heat dissipation metal layer is a metal with high thermal conductivity and corrosion resistance, such as copper, nickel, aluminum or silver.

[0130] In the embodiment of the present invention, the final thicknesses of the metal adhesion layer, the metal electrode layer and the heat dissipation metal layer are determined according to the design requirements and application scenarios of the glass-based three-dimensional capacitor to ensure that its electrical performance and mechanical stability meet actual needs.

[0131] It should be understood that after the first electrode layer and the second electrode layer are obtained, the first glass substrate and the second glass substrate need to be subjected to conventional annealing treatment to improve the density and interface bonding strength of the film layer.

[0132] 150, first aligning the second surface of the first glass substrate with the second surface of the second glass substrate, ensuring that the blind groove openings of the two glass substrates are aligned, and bonding them together to form a microchannel structure; then using glass bonding technology to bond the first glass substrate and the second glass substrate into a three-dimensional capacitor body;

[0133] In the embodiment of the present invention, aligning and bonding the second surface of the first glass substrate and the second surface of the second glass substrate together are achieved by using a bonding fixture.

[0134] The specific implementation process of step S150 may be:

[0135] Based on the alignment mark, a microscope or an image recognition system is used to align the second surface of the first glass substrate with the second surface of the second glass substrate, ensuring that the blind groove openings of the two glass substrates are aligned, and a predetermined pressure is applied to fit the two together to form a through microfluidic structure.

[0136] The first glass substrate and the second glass substrate are bonded into a three-dimensional capacitor body using a glass bonding technique.

[0137] In the embodiment of the present invention, the glass bonding technology is one of thermal compression bonding, hybrid bonding, and glass paste bonding. Among them, thermal compression bonding is to firmly bond the first glass substrate and the second glass substrate together by heating and applying pressure; hybrid bonding is to firmly bond the first glass substrate and the second glass substrate together by chemical reaction and physical action.

[0138] If the glass bonding technology used is glass paste bonding, step S150 is specifically as follows:

[0139] Uniformly coating glass slurry on the second surface of the first glass substrate and the second glass substrate;

[0140] Aligning the second surface of the first glass substrate with the second surface of the second glass substrate, ensuring that the blind groove openings of the two glass substrates are aligned, and bonding them together to form a through microchannel structure;

[0141] An ultraviolet laser is used to scan and irradiate the glass paste in the bonding area between the first glass substrate and the second glass substrate, so that the glass paste is heated, melted and solidified, and the first glass substrate and the second glass substrate are bonded into a three-dimensional capacitor body.

[0142] S160, using electrode contact manufacturing technology to manufacture a first electrode lead terminal on the first electrode layer, and to manufacture a second electrode lead terminal on the second electrode layer, to obtain a glass-based three-dimensional capacitor with a microchannel heat dissipation structure.

[0143] The electrode contact manufacturing technology in the embodiment of the present invention is used to form an electrode lead terminal on the metal electrode layer to provide an external connection point for the capacitor to ensure its normal use in the circuit. Usually, the electrode lead terminal is set at the center of the first electrode layer and the second electrode layer to reduce the lead inductance and resistance to meet the needs of high-frequency applications. The material of the electrode lead terminal can be one of gold, copper, nickel, and tin.

[0144] The electrode contact manufacturing technology may specifically be one of surface mounting and wire bonding.

[0145] The specific implementation process of step S160 may be:

[0146] The first electrode lead terminal is manufactured on the first electrode layer by adopting the electrode contact manufacturing technology.

[0147] The electrode contact manufacturing technology is adopted to manufacture the second electrode lead terminal on the second electrode layer.

[0148] Finally, a glass-based three-dimensional capacitor with a microchannel heat dissipation structure is obtained.

[0149] The method for manufacturing a glass-based three-dimensional capacitor in an embodiment of the present invention is used to manufacture a glass-based three-dimensional capacitor, which is applied to microelectronic systems, and is particularly suitable for high-frequency or high-power miniaturized radio frequency systems.

[0150] It should be understood that the glass-based three-dimensional capacitor in the embodiment of the method for manufacturing a glass-based three-dimensional capacitor of the present invention is the method for manufacturing a glass-based three-dimensional capacitor in the embodiment of the glass-based three-dimensional capacitor of the present invention. For the convenience and simplicity of description, the assembly structure of the glass-based three-dimensional capacitor manufactured in the embodiment of the method for manufacturing a glass-based three-dimensional capacitor of the present invention can refer to the relevant description in the embodiment of the glass-based three-dimensional capacitor, and will not be repeated here.

Claims

1. A glass-based three-dimensional capacitor, characterized in that: include: A first glass substrate (110); A second glass substrate (120); The first glass substrate (110) and the second glass substrate (120) have the same size and structure; A plurality of blind holes (140) opening toward the respective first surfaces and a plurality of blind grooves opening toward the respective second surfaces are provided on the first glass substrate (110) and the second glass substrate (120); wherein the first surface and the second surface are two surfaces on opposite sides; The first surface of the first glass substrate and the inner wall of the blind hole thereof are metallized to form a first electrode layer; The first surface of the second glass substrate (120) and the inner wall of the blind hole thereof are metallized to form a second electrode layer; The glass-based three-dimensional capacitor (100) is obtained by aligning and bonding the second surfaces of the first glass substrate (110) and the second glass substrate (120) together, and performing mirror bonding; the plurality of blind grooves (150) on the first glass substrate (110) and the plurality of blind grooves (150) on the second glass substrate (120) are aligned with each other to form a plurality of microchannels (130) that penetrate through two sides of the glass-based three-dimensional capacitor (100); the microchannels (130) are used to remove heat from the inside of the glass-based three-dimensional capacitor (100) through the flow of a cooling medium.

2. The glass-based three-dimensional capacitor according to claim 1, characterized in that: The first electrode layer and the second electrode layer include a metal electrode layer (170) and a metal adhesion layer (160), wherein the metal adhesion layer (160) is used to enhance the interface bonding strength between the metal electrode layer (170) and the glass substrate.

3. The glass-based three-dimensional capacitor according to claim 2, characterized in that: Optionally, the material of the metal electrode layer (170) is one of copper, nickel, silver and gold.

4. The glass-based three-dimensional capacitor according to claim 2, characterized in that: Optionally, the material of the metal adhesion layer (160) is one of titanium, titanium nitride and titanium tungsten.

5. The glass-based three-dimensional capacitor according to any one of claims 1 to 4, characterized in that: The inner wall of the blind groove (150) is metallized to form a heat dissipation metal layer.

6. A method for manufacturing a glass-based three-dimensional capacitor, characterized in that: The following steps are involved: Firstly, the first glass substrate and the second glass substrate are cleaned and then dried; The first glass substrate and the second glass substrate are two glass substrates with the same specifications and sizes; On the dried first glass substrate and the second glass substrate, using laser irradiation technology to form a plurality of blind hole modified areas on the first surface and a plurality of blind groove modified areas on the second surface; Placing the laser-modified first glass substrate and the second glass substrate into etching grooves of an etching device and performing etching treatment to form blind holes opened on the first surface and blind grooves opened on the second surface on the first glass substrate and the second glass substrate, respectively obtaining a first glass substrate and a second glass substrate; By means of a film deposition process, a metal adhesion layer is firstly deposited on the inner wall of the blind hole and the first surface of the first glass substrate and the second glass substrate, and a metal electrode layer is then deposited on the metal adhesion layer to obtain a first electrode layer corresponding to the first glass substrate and a second electrode layer corresponding to the second glass substrate; First, align the second surface of the first glass substrate with the second surface of the second glass substrate to ensure that the blind groove openings of the two glass substrates are aligned, and bond them together to form a microchannel structure; then use glass bonding technology to bond the first glass substrate and the second glass substrate into a three-dimensional capacitor body; The first electrode lead terminal is manufactured on the first electrode layer by using the electrode contact manufacturing technology, and the second electrode lead terminal is manufactured on the second electrode layer, so as to obtain a glass-based three-dimensional capacitor with a microchannel heat dissipation structure.

7. The method for manufacturing a glass-based three-dimensional capacitor according to claim 6, characterized in that: The steps of first cleaning the first glass substrate and the second glass substrate are specifically as follows: Using a mixed cleaning solution, preliminarily cleaning the first glass substrate and the second glass substrate; The first glass substrate and the second glass substrate after the preliminary cleaning are cleaned again using ultrapure water.

8. The method for manufacturing a glass-based three-dimensional capacitor according to claim 6 or 7, characterized in that: The step of obtaining a first electrode layer corresponding to the first glass substrate and a second electrode layer corresponding to the second glass substrate further includes: A metal adhesion layer is first deposited on the inner wall of the blind groove through a deposition process, and then a heat dissipation metal layer is deposited.

9. The method for manufacturing a glass-based three-dimensional capacitor according to claim 6 or 7, characterized in that: If the glass bonding technology used is glass paste bonding, the steps of using the glass bonding technology to bond the first glass substrate and the second glass substrate into a three-dimensional capacitor body are specifically as follows: Uniformly coating glass slurry on the second surface of the first glass substrate and the second glass substrate; Aligning the second surface of the first glass substrate with the second surface of the second glass substrate, ensuring that the blind groove openings of the two glass substrates are aligned, and bonding them together to form a through microchannel structure; An ultraviolet laser is used to scan and irradiate the glass paste in the bonding area between the first glass substrate and the second glass substrate, so that the glass paste is heated, melted and solidified, and the first glass substrate and the second glass substrate are bonded into a three-dimensional capacitor body.

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