Electronic component manufacturing apparatus

Abstract

The invention provides a manufacturing device of an electronic component, which can reduce small sheets which are not peeled off from an adhesive sheet. The support mechanism (2) supports an adhesive sheet (10) that adheres and holds a plurality of small sheets (20), which are materials for a plurality of electronic components, to the surface. The facing member (3) is disposed so as to face the back surface of the adhesive sheet (10). The nozzle (4) blows air between the adhesive sheet (10) supported by the support mechanism (2) and the facing member (3). Air is blown between the adhesive sheet (10) and the facing member (3) through the nozzle (4), thereby vibrating the adhesive sheet (10) and separating the plurality of small sheets (20) from the adhesive sheet (10).

Description

Technical Field

[0001] The present invention relates to an apparatus for manufacturing electronic components. Background Art

[0002] As a prior art document that discloses the structure of an external electrode forming device for a sheet-like electronic component, there is Japanese Patent Publication No. 2007-266208 (Patent Document 1). In the external electrode forming device described in Patent Document 1, the sheet-like component is attached to an adhesive material containing a plastically deformable heat-foaming adhesive, and the adhesive material is heated to thereby non-contactly peel the sheet-like component from the adhesive material.

[0003] Prior Art Literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2007-266208

[0006] When the adhesive material is plastically deformed to hold a chip, even if the adhesive material is heated to foam, a chip that is not separated from the adhesive material is generated. Summary of the invention

[0007] Problem that the invention aims to solve

[0008] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide an electronic component manufacturing apparatus capable of reducing small pieces that are not peeled off from an adhesive sheet.

[0009] Means used to solve problems

[0010] The manufacturing device of electronic components based on the present invention comprises a supporting mechanism, an opposing member and a nozzle. The supporting mechanism supports an adhesive sheet that adheres and holds a plurality of small pieces of materials for a plurality of electronic components on a surface. The opposing member is configured to be opposed to the back surface of the adhesive sheet. The nozzle blows air between the adhesive sheet supported by the supporting mechanism and the opposing member. By blowing air between the adhesive sheet and the opposing member through the nozzle, the adhesive sheet is vibrated and the plurality of small pieces are detached from the adhesive sheet.

[0011] Effects of the Invention

[0012] According to the present invention, the number of small pieces that are not peeled off from the adhesive sheet can be reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 is a flowchart showing a method for manufacturing an electronic component.

[0014] Figure 2 It is a perspective view showing the structure of an electronic component manufacturing apparatus according to one embodiment of the present invention.

[0015] Figure 3 Observed from the direction of arrow III Figure 2 A top view of an electronic component manufacturing apparatus.

[0016] Figure 4 Observed from the direction of arrow IV Figure 3 A side view of an electronic component manufacturing apparatus.

[0017] Figure 5 This is a perspective view showing a state where a functional sheet is attached to a small sheet.

[0018] Figure 6 This is a perspective view showing a state where a functional sheet is attached to a small sheet.

[0019] Description of Reference Numerals

[0020] 1 manufacturing device, 2 supporting mechanism, 3 opposing member, 4 nozzle, 5 box, 10 adhesive sheet, 20 small sheet, 21 one surface, 22 other surface, 30 functional sheet, 30 S main surface, 31 paste. DETAILED DESCRIPTION

[0021] Hereinafter, an electronic component manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings. In the following description of the embodiment, the same or corresponding parts in the drawings are denoted by the same reference numerals, and their description will not be repeated.

[0022] Hereinafter, an electronic component manufacturing apparatus according to an embodiment of the present invention will be described with reference to the drawings. Figure 1 The flowchart of the method for manufacturing an electronic component is shown. In the following description of the method for manufacturing an electronic component, the method for manufacturing a laminated ceramic capacitor is described, but the electronic component is not limited to the laminated ceramic capacitor, and may be a laminated ceramic coil, etc., as long as it is an electronic component manufactured from a small piece.

[0023] like Figure 1 As shown in FIG. 1 , when manufacturing a laminated ceramic capacitor, first, a ceramic dielectric slurry is prepared (step S1). Specifically, ceramic dielectric powder, additive powder, binder resin, and solvent are dispersed and mixed to prepare the ceramic dielectric slurry. The ceramic dielectric powder is, for example, BaTiO 3 、CaTiO 3 、SrTiO 3 、CaZrO 3 or CaHfO 3The dielectric particles of the perovskite structure are as follows. The added powder contains, for example, at least any one of Si compounds, Mg compounds, Mn compounds, Fe compounds, Cr compounds, Ni compounds and Co compounds. As the binder resin, polyurethane resin, urea resin, melamine resin, epoxy resin, vinyl acetate resin, acrylic resin system, or water-based polymers such as polyvinyl alcohol (PVA) or polyvinyl butyral (PVB) can be used. These can be used as a monomer or as a mixture of two or more. The ceramic dielectric slurry can be either solvent-based or water-based. In the case of setting the ceramic dielectric slurry as a water-based coating, the ceramic dielectric slurry is prepared by mixing a water-soluble binder and a dispersant, etc., with a dielectric raw material dissolved in water.

[0024] Next, a ceramic dielectric sheet is formed (step S2). Specifically, the ceramic dielectric slurry is formed into a sheet on a carrier film using a die coater, a gravure coater, a micro gravure coater, etc. and dried to form a ceramic dielectric sheet. From the perspective of miniaturization and high capacity of the stacked ceramic capacitor, the thickness of the ceramic dielectric sheet is preferably 0.2 μm or more and 10 μm or less.

[0025] Next, a master sheet is formed (process S3). Specifically, a master sheet having a given internal electrode pattern is formed by applying a conductive paste to a ceramic dielectric sheet so that it has a given pattern. The conductive paste contains Ni powder, a solvent, a dispersant, an adhesive, etc., and is modulated to have a fixed viscosity. As an adhesive, polyvinyl butyral (PVB) or polyvinyl alcohol (PVA) is used. As a method for applying the conductive paste, screen printing, inkjet or gravure printing can be used. From the perspective of miniaturization and high capacity of stacked ceramic capacitors, the thickness of the internal electrode pattern is preferably greater than 0.2μm and less than 10μm. In addition, as a master sheet, in addition to preparing a master sheet with an internal electrode pattern, a ceramic dielectric sheet that has not undergone the above-mentioned process S3 is also prepared.

[0026] Next, a plurality of master sheets are stacked (process S4). Specifically, a given number of master sheets including only ceramic dielectric sheets without forming an internal electrode pattern are stacked so that, for example, the thickness becomes greater than 0.5 μm and less than 5 μm. On top of them, a given number of master sheets with internal electrode patterns are stacked. The number of stacked master sheets with internal electrode patterns is, for example, greater than 5 sheets and less than 1500 sheets. Furthermore, a given number of master sheets including only ceramic dielectric sheets without forming an internal electrode pattern are stacked on top of them so that, for example, the thickness becomes greater than 0.5 μm and less than 10 μm. Thus, a master sheet group is formed.

[0027] Next, the mother sheet group is pressed to form a dielectric block (step S5). Specifically, the mother sheet group is pressed and pressed in the stacking direction by isostatic pressing or rigid pressing to form a dielectric block. At this time, the ceramic dielectric sheets are pressed at a given temperature so that the ceramic dielectric sheets are closely attached to each other. In addition, by arranging a fixed thickness of the ceramic dielectric sheet in the outermost layer in the stacking direction and pressing, the dielectric sheet on which the internal electrode pattern is formed can be protected.

[0028] Next, a dielectric block is attached to the adhesive sheet (step S6). The adhesive sheet has an adhesive layer on the surface and a base material layer on the back. The adhesive sheet may also be an adhesive sheet in which the surface area of ​​the adhesive layer is increased and the adhesive layer loses its adhesive holding force. The adhesive sheet may also be a long sheet. The maximum dimension of the thickness of the adhesive sheet in a state in which the adhesive holding force is lost is preferably greater than 0.2 mm and less than 0.5 mm.

[0029] Next, the dielectric block adhered to the adhesive sheet is cut to form small pieces (step S7). Specifically, the dielectric block is cut into a matrix shape by press cutting, dicing or laser cutting, and is singulated into a plurality of small pieces. Through step S7, an adhesive sheet is prepared in which a plurality of small pieces are adhered to the surface in a state of being closely arranged. The internal electrodes are exposed on the side surfaces of each of the plurality of small pieces.

[0030] Next, the small pieces are separated from the adhesive sheet (step S8 ). Here, the structure of the electronic component manufacturing apparatus according to one embodiment of the present invention, which is used when the small pieces are separated from the adhesive sheet, will be described. Figure 2 It is a perspective view showing the structure of an electronic component manufacturing apparatus according to one embodiment of the present invention. Figure 3 Observed from the direction of arrow III Figure 2 A top view of an electronic component manufacturing apparatus. Figure 4 Observed from the direction of arrow IV Figure 3 A side view of an electronic component manufacturing apparatus.

[0031] like Figures 2 to 4As shown, an electronic component manufacturing device 1 according to one embodiment of the present invention comprises a supporting mechanism 2, an opposing member 3 and a nozzle 4. The supporting mechanism 2 supports an adhesive sheet 10 that adheres and holds a plurality of small pieces, which are materials of a plurality of electronic components, on a surface. The adhesive sheet 10 loses its adhesive holding force when supported by the supporting mechanism 2. The supporting mechanism 2 supports the adhesive sheet 10 by any one of vacuum suction, electrostatic adsorption, adhesion or mechanical means. In the present embodiment, the supporting mechanism 2 supports the adhesive sheet 10 so as to impart a fixed tension to the adhesive sheet 10. Below the adhesive sheet 10, a box 5 for recovering a plurality of small pieces 20 detached from the adhesive sheet 10 is provided. The box 5 is preferably made of resin so as not to damage the small pieces 20.

[0032] The opposing member 3 is arranged to face the back side of the adhesive sheet 10. In the present embodiment, the opposing member 3 is a flat plate having a rectangular surface facing the back side of the adhesive sheet 10. The surface of the opposing member 3 facing the back side of the adhesive sheet 10 has an area of, for example, 0.01 m 2 Above and 0.5m 2 However, the shape of the opposing member 3 is not limited to a rectangular flat plate, and may be a flat plate whose surface facing the back side of the adhesive sheet 10 is circular. In this case, the diameter of the surface facing the back side of the adhesive sheet 10 is, for example, greater than 3 cm and less than 100 cm.

[0033] When observed from a direction orthogonal to the back side of the adhesive sheet 10, it is preferred that at least a portion of the opposing member 3 is configured to overlap with a region of the adhesive sheet 10 where a plurality of small pieces 20 are adhesively retained, and it is more preferred that the entire opposing member 3 is configured to overlap with a region of the adhesive sheet 10 where a plurality of small pieces 20 are adhesively retained.

[0034] The area of ​​the region where the opposing member 3 is projected onto the adhesive sheet 10 in a direction perpendicular to the back surface of the adhesive sheet 10 may be smaller, the same as, or larger than the area of ​​the region where the plurality of small pieces 20 are adhesively held in the adhesive sheet 10 .

[0035] Figure 4 The shortest distance L between the back surface of the adhesive sheet 10 shown and the opposing member 3 is preferably 0 mm or more and 3 mm or less. The corners and ridges of the opposing member 3 on the side facing the back surface of the adhesive sheet 10 are preferably rounded. The opposing member 3 is fixed to a support portion not shown.

[0036] The nozzles 4 blow air between the adhesive sheet 10 supported by the support mechanism 2 and the opposing member 3. In the present embodiment, three pairs of nozzles 4 are arranged line-symmetrically with respect to the center of the long side direction of the opposing member 3 when viewed from a direction perpendicular to the back side of the adhesive sheet 10. In addition, the number of nozzles 4 arranged is not limited to six, and it can be one or more. Figure 4 As shown, the inclination angle θ of the nozzle 4 relative to the back side of the adhesive sheet 10 is preferably 1° or more and 45° or less, and is more preferably 16° or more and 45° or less from the viewpoint of suppressing the interference between the nozzle 4 and the adhesive sheet 10. The shortest distance from the front end of the nozzle 4 to the back side of the adhesive sheet 10 is preferably 3mm or more and 20mm or less. The nozzle 4 is connected to a supply source for supplying air. The pressure of the air supplied from the supply source to the nozzle 4 is preferably 0.3MPa or more and 1MPa or less.

[0037] Here, the operation of the electronic component manufacturing device 1 is described. First, the adhesive sheet 10 supported by the support mechanism 2 is heated or cooled to a temperature exceeding a threshold value, so that it loses its adhesive holding force. Even in a state where the adhesive sheet 10 loses its adhesive holding force, there are still some small pieces 20 that are still held on the adhesive sheet 10 among the plurality of small pieces 20.

[0038] Next, if Figure 4 As shown, in a state where the adhesive sheet 10 having lost its adhesive holding force is supported by the support mechanism 2, air is blown between the adhesive sheet 10 and the opposing member 3 through the nozzle 4, thereby vibrating the adhesive sheet 10 and causing a plurality of small pieces 20 to detach from the adhesive sheet 10. Specifically, the adhesive sheet 10 vibrates in the vertical direction by convection of the air blown between the adhesive sheet 10 and the opposing member 3. The small pieces 20 that were once held by the adhesive sheet 10 are detached from the adhesive sheet 10 by this vibration. The plurality of small pieces 20 detached from the adhesive sheet 10 are recovered in the box 10.

[0039] Next, a functional sheet is attached to the recovered small sheets 20 . Figure 5 This is a perspective view showing a state where a functional sheet is attached to a small sheet. Figure 6 1 is a perspective view showing a state where a functional sheet is attached to a small sheet. Figure 5 as well as Figure 6 As shown, the small piece 20 has one face 21 and the other face 22. On the side of the one face 21, a paste 31 is applied. The paste 31 has conductivity or adhesiveness.

[0040] In a state where one surface 21 of the small sheet 20 and the main surface 30S of the functional sheet 30 are facing each other, the small sheet 20 is pressed from the other surface 22 side to the functional sheet 30, thereby the functional sheet 30 is attached to the one surface 21 of the small sheet 20. The functional sheet 30 is, for example, a conductive sheet. Thereafter, the paste 31 and the functional sheet 30 are dried. Similarly, the paste 31 is applied to the other surface 22, and after the functional sheet 30 is attached, it is dried.

[0041] like Figure 1As shown, the small pieces are then fired (step S9). Specifically, the small pieces are heated to fire the dielectric material and the conductive material contained in the small pieces to form a laminate. The firing temperature is appropriately set according to the dielectric material and the conductive material.

[0042] Next, external electrodes are formed (step S10 ). For example, Ni plating and Sn plating are sequentially performed on the laminate to form a plating layer, thereby forming external electrodes on the outer surface of the laminate.

[0043] Through the above-described series of steps, a multilayer ceramic capacitor can be manufactured.

[0044] (Experimental example)

[0045] Hereinafter, the experimental results of the detachment test of the small piece from the adhesive sheet by changing various parameters will be described.

[0046]

Table 1

[0047] parameter value The maximum thickness of the adhesive sheet that has lost its adhesive holding power 0.27mm Adhesive sheet area <![CDATA[0.27m 2 ]]> The weight of a small piece 0.001g The tilt angle θ of the nozzle relative to the back side of the adhesive sheet 25° The shortest distance from the tip of the nozzle to the back of the adhesive sheet 10mm The pressure of the air supplied to the nozzle 0.4MPa Thickness of opposing member 5mm The length of one side of the surface of the opposing member facing the back surface of the adhesive sheet 20mm Shape of opposing member Square flat plate The shortest distance L between the back surface of the adhesive sheet and the opposing member 0.02mm

[0048]

Table 2

[0049]

[0050] Table 1 summarizes the basic parameters. Table 2 summarizes the parameters changed from the basic parameters in Experimental Examples 1 to 4. In each of Experimental Examples 1 to 4, the parameters shown in Table 1 were used in addition to the changed parameters shown in Table 2.

[0051] As shown in Table 2, in Experimental Example 1, the maximum dimension of the thickness of the adhesive sheet 10 in a state where the adhesive holding force was lost was changed to perform a detachment test, and it was visually confirmed whether all the small pieces 20 were detached from the adhesive sheet 10. As a result, it was confirmed that when the maximum dimension of the thickness of the adhesive sheet 10 in a state where the adhesive holding force was lost was 0.2 mm or more and 0.5 mm or less, all the small pieces 20 were detached from the adhesive sheet 10. When the maximum dimension of the thickness of the adhesive sheet 10 in a state where the adhesive holding force was lost was 0.1 mm, the adhesive sheet 10 was broken, or excessive vibration occurred, and defects were observed in the small pieces 20. When the maximum dimension of the thickness of the adhesive sheet 10 in a state where the adhesive holding force was lost was 0.6 mm, the vibration of the adhesive sheet 10 became weak, and small pieces 20 that were not detached from the adhesive sheet 10 were observed.

[0052] In Experimental Example 2, the detachment test was performed by changing the inclination angle θ of the nozzle 4 relative to the back of the adhesive sheet 10, and visually confirming whether all the small pieces 20 were detached from the adhesive sheet 10. As a result, it was confirmed that when the inclination angle θ of the nozzle 4 relative to the back of the adhesive sheet 10 was greater than 1° and less than 45°, all the small pieces 20 were detached from the adhesive sheet 10. When the inclination angle θ of the nozzle 4 relative to the back of the adhesive sheet 10 was 0°, the nozzle 4 and the adhesive sheet 10 interfered and the experiment could not be performed. When the inclination angle θ of the nozzle 4 relative to the back of the adhesive sheet 10 was 50°, the vibration of the adhesive sheet 10 became weak, and the small pieces 20 that did not detach from the adhesive sheet 10 were observed.

[0053] In Experimental Example 3, the pressure of the air supplied to the nozzle 4 was changed to perform a detachment test, and it was visually confirmed whether all the small pieces 20 were detached from the adhesive sheet 10. As a result, it was confirmed that when the pressure of the air supplied to the nozzle 4 was 0.3 MPa or more and 1 MPa or less, all the small pieces 20 were detached from the adhesive sheet 10. When the pressure of the air supplied to the nozzle 4 was 0.2 MPa, the vibration of the adhesive sheet 10 became weak, and the small pieces 20 that were not detached from the adhesive sheet 10 were observed. When the pressure of the air supplied to the nozzle 4 was 1.1 MPa, the adhesive sheet 10 was broken, or excessive vibration occurred, so that defects were observed in the small pieces 20.

[0054] In Experimental Example 4, the detachment test was performed by changing the shortest distance L between the back side of the adhesive sheet 10 and the opposing member 3, and it was visually confirmed whether all the small pieces 20 were detached from the adhesive sheet 10. As a result, it was confirmed that when the shortest distance L between the back side of the adhesive sheet 10 and the opposing member 3 was greater than 0 mm and less than 3 mm, all the small pieces 20 were detached from the adhesive sheet 10. Even when the shortest distance L between the back side of the adhesive sheet 10 and the opposing member 3 was 0 mm, the air blown from the nozzle 4 into between the back side of the adhesive sheet 10 and the opposing member 3 was allowed to enter, and it was confirmed that all the small pieces 20 were detached from the adhesive sheet 10. When the shortest distance L between the back side of the adhesive sheet 10 and the opposing member 3 was 4 mm, the vibration of the adhesive sheet 10 became weak, and the small pieces 20 that had not detached from the adhesive sheet 10 were observed.

[0055] The above experimental results confirm that the nozzle 4 blows air between the adhesive sheet 10 that has lost its adhesive holding force and the opposing member 3 to vibrate the adhesive sheet 10 and detach the plurality of small pieces 20 from the adhesive sheet 10 , thereby reducing the number of small pieces 20 that are not peeled off from the adhesive sheet 10 .

[0056] (Note)

[0057] Those skilled in the art will appreciate that the above-described exemplary embodiments are specific examples of the following aspects.

[0058] <1> An electronic component manufacturing device comprising:

[0059] A support mechanism that supports an adhesive sheet that adheres and holds a plurality of small pieces of material for a plurality of electronic components on a surface;

[0060] an opposing member arranged to oppose the back surface of the adhesive sheet; and

[0061] a nozzle for blowing air between the adhesive sheet supported by the supporting mechanism and the opposing member,

[0062] The nozzle blows air between the adhesive sheet and the facing member to vibrate the adhesive sheet and detach the plurality of small pieces from the adhesive sheet.

[0063] <2> According to <1> The electronic component manufacturing device, wherein:

[0064] The shortest distance between the adhesive sheet supported by the support mechanism and the opposing member is greater than or equal to 0 mm and less than or equal to 3 mm.

[0065] <3> according to <1> or <2> The electronic component manufacturing device, wherein:

[0066] The pressure of the air supplied to the nozzle is 0.3 MPa or more and 1 MPa or less.

[0067] <4> according to <1> to <3> The electronic component manufacturing device according to any one of claims , wherein:

[0068] The nozzle has an inclination angle of 1° or more and 45° or less with respect to the back surface of the adhesive sheet.

[0069] <5> according to <1> to <4> The electronic component manufacturing device according to any one of claims , wherein:

[0070] The maximum dimension of the thickness of the adhesive sheet in a state where the adhesive holding force is lost is 0.2 mm or more and 0.5 mm or less.

[0071] In the description of the above-mentioned embodiments, combinable structures may be combined with each other.

[0072] The embodiments disclosed this time should be considered in all respects as illustrative and non-restrictive. The scope of the present invention is indicated by the claims rather than the above description, and is intended to include all modifications within the meaning and scope equivalent to the claims.

Claims

1. An electronic component manufacturing device comprising: A support mechanism that supports an adhesive sheet that adheres and holds a plurality of small pieces of material for a plurality of electronic components on a surface; an opposing member arranged to oppose the back surface of the adhesive sheet; and a nozzle for blowing air between the adhesive sheet supported by the supporting mechanism and the opposing member, The nozzle blows air between the adhesive sheet and the facing member to vibrate the adhesive sheet and detach the plurality of small pieces from the adhesive sheet.

2. The electronic component manufacturing device according to claim 1, wherein: The shortest distance between the adhesive sheet supported by the support mechanism and the opposing member is greater than or equal to 0 mm and less than or equal to 3 mm.

3. The electronic component manufacturing device according to claim 1 or 2, wherein: The pressure of the air supplied to the nozzle is 0.3 MPa or more and 1 MPa or less.

4. The electronic component manufacturing apparatus according to any one of claims 1 to 3, wherein: The nozzle has an inclination angle of 1° or more and 45° or less with respect to the back surface of the adhesive sheet.

5. The electronic component manufacturing apparatus according to any one of claims 1 to 4, wherein: The maximum dimension of the thickness of the adhesive sheet in a state where the adhesive holding force is lost is 0.2 mm or more and 0.5 mm or less.

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