Ultra-high precision alignment and face-changing method and equipment for end plate

Abstract

The present invention relates to an ultra-high precision alignment and face-changing method and equipment for end-sealing plates, comprising a frame, a base, a slide rail, an end-sealing plate, a plate-taking positioning and conveying mechanism, a plate-arranging positioning and conveying mechanism, a controller, a needle bed, a pad frame, a face-changing frame taking-and-placing mechanism, a face-changing table device and an extrusion servo mechanism; the needle bed is provided with a positioning pin, and four detection sensors are respectively provided at the four corners of the needle bed carrier plate, the extrusion carrier plate and the needle bed, which ensures the accuracy of the fit and facilitates timely adjustment of abnormal situations, and facilitates consistency in detection accuracy and repeated detection. The function of the pad frame positioning pin is to align the plate holes of the first end-sealing plate and the second end-sealing plate vertically so that the chip can be successfully face-changed. The thickness of the pad frame can control the chip protrusion to a consistent height, thereby improving the stability and accuracy of the face-changing. The quality and yield rate of the chip end-sealing are improved. The scrap rate and defective rate of the chip end-sealing are reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of end-sealing equipment, and in particular to an ultra-high-precision alignment and face-changing method and equipment for an end-sealing plate. Background Art

[0002] The production and manufacturing process of mlcc (chip multilayer ceramic capacitor) components requires multiple work sections to complete, and the finished product requires a terminal copper dipping process. The steps of the terminal copper dipping process are as follows: 1. Implant the chip into the terminal plate hole, and the A-end chip protrudes to a certain height; 2. The A-end chip of the terminal plate is leveled and the protruding height is consistent; 3. The A-end chip is dipped in copper and sealed; 4. The A-end chip terminal plate enters the drying furnace to dry the copper slurry; 5. After drying, the A-end chip is changed to protrude at the B-end, preparing for the next step of B-end copper dipping; 6. The B-end chip is leveled and protruded to a consistent height; 7. The B-end chip is dipped in copper and sealed; 8. The B-end chip terminal plate enters the drying furnace to dry the copper slurry; 9. The A / B end copper-bonded chips are unloaded to complete the terminal sealing process.

[0003] In step 5 of the above-mentioned semi-automatic production process, the chip refacing process is completed on the same end-sealing board: the first step is to place the A-end chip end-sealing board on the corresponding positioning pins of the carrier board for positioning; the second step is to use a needle bed to directly press the copper-bonded A-end chip from above the end-sealing board hole, and the A-end chip passes through the center of the end-sealing board hole to the bottom of the end-sealing board, so that the B-end of the chip that is not bonded with copper is exposed at an appropriate height from the board surface, and proceed to the next step 6 to level the chip protrusions to a consistent height.

[0004] The above 5-step production process has the following quality problems: 1. The depth of the end sealing plate hole is 8.9mm. Since rubber has the characteristic of "within the same hole diameter, the elasticity and clamping force of the central rubber are greater than those of the edge", the A-end of the chip with copper bonded is directly pressed down from above the end sealing plate hole, and pressed out through the center of the rubber to the bottom of the end sealing plate hole, which causes excessive friction on the side of the copper bonded end and easily creates the risk of exposed porcelain on the corners of the chip; 2. The diameter of the needle bed needle is smaller than the diameter of the end sealing plate hole and smaller than the diagonal of the chip. When the needle contacts the A-end chip with copper bonded and presses down, from the top of the plate hole through the center of the plate to the bottom of the plate hole, due to the high friction of the center hole, the top of the copper bonded end is prone to indentation damage; 3. Only the carrier plate has positioning pins to position the A-end end sealing plate, and the needle bed does not have positioning pins to position the A-end end sealing plate. During the downward pressure and surface changing process, it is easy to cause scratches and chip skew due to the offset position of the end. Summary of the Invention

[0005] In response to the problems and shortcomings of the existing technology, the present invention provides an ultra-high precision positioning and face-changing method and equipment for an end plate, so as to avoid the problems of exposed porcelain at the corners of the chip, cracks on the top of the chip, and inaccurate positioning of the end plate and the needle bed that easily causes the chip to be skewed during the face-changing.

[0006] The method for ultra-high precision alignment and face-changing of end plates includes the following steps:

[0007] (1) A needle bed is pre-placed on the carrier plate of the face-changing table. The needle bed is provided with a positioning pin. Four detection sensors are respectively provided on the carrier plate of the needle bed, the pressing carrier plate of the press table and the four corners of the needle bed. Positioning holes are provided on the first end plate and the second end plate, and a positioning pin is provided on the pad frame;

[0008] (2) The plate positioning and conveying mechanism places the first end-sealing plate with the chip sealed and dried on one side on the needle bed of the face-changing table carrier and aligns it with the center of the Y-axis, with the chip on the dried side facing upwards. The positioning hole of the first end-sealing plate corresponds to the positioning pin of the needle bed. The detection sensor of the needle bed adopts an accuracy of 0.1mm and a limited gap range. The detection sensor detects whether the first end-sealing plate is attached to the needle bed. The gap between the first end-sealing plate and the needle bed cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the first end-sealing plate is placed abnormally and sends an alarm signal. The staff handles the abnormality in time. If the gap is less than 0.1mm, it is determined to be qualified and proceed to the next step.

[0009] (3) Align the positioning pins of the gasket frame with the positioning holes of the first end plate, place them on the first end plate, and fit the gasket frame and the first end plate together;

[0010] (4) The face changing table moves from the pick-up and placement position of the pad frame to the press position. The movable carrier of the press transports the empty second end plate downward along the Z axis to the surface of the pad frame of the face changing table and fits it with it. The positioning hole of the second end plate corresponds to the positioning pin of the pad frame. The plate hole of the second end plate faces the plate hole of the first end plate. The detection sensor installed on the plate surface of the press out carrier of the press detects whether the second end plate fits on the pad frame. The gap between the second end plate and the pad frame cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the placement of the second end plate is abnormal and sends an alarm signal. The staff handles the abnormality in time; if the gap is less than 0.1mm, it is determined to be qualified and proceeds to the next step; the movable carrier continues to press down the specified distance until the chip of the first end plate is pressed upward into the plate hole of the second end plate. After the chip is pressed in, the movable carrier moves upward to the waiting position;

[0011] (5) The face changing table moves from the pressing position to the face changing discharge position, the plate arrangement positioning and conveying mechanism moves to the top of the face changing discharge position, the Y-axis slide clamping cylinder opens the clamping hand, the Z-axis slide cylinder moves downward to the second end plate surface of the face changing table, the Y-axis slide clamping cylinder closes the clamping hand, the Z-axis slide cylinder moves upward, and the mechanical clamping hand of the plate arrangement positioning and conveying mechanism conveys the second end plate upward, the plate arrangement positioning and conveying mechanism moves from the face changing discharge position to the end sealing machine handover position, the face changing machine sends a receiving signal to the end sealing machine, waits for the end sealing machine to confirm the signal to complete the handover, and enters the next process to flatten the chips protruding from the second end plate;

[0012] (6) The face changing table moves from the face changing discharge position to the pad frame pick-up position, the movable carrier moves downward to the upper surface of the pad frame, the Y-axis slide clamp cylinder of the movable carrier closes and clamps the pad frame, and the movable carrier transports the pad frame upward to the waiting position to prepare for the next placement of the pad frame;

[0013] (7) The face-changing table moves from the pick-up and placement position of the pad frame to the press position. The movable carrier plate of the press moves downward to fit the surface above the first end plate where there is no chip. The Y-axis slide clamp cylinder closes and clamps the first end plate. The movable carrier plate rises back to the waiting position. At this time, the lower surface of the first end plate is transformed into the working surface, and its function is transformed into the function of the second end plate, preparing for the next face-changing work. The chip face-changing process is completed.

[0014] In the above step (4), the movable carrier plate is pressed downward for a distance of 8.9 mm to 9.6 mm.

[0015] The technical solution of the ultra-high precision alignment and face-changing method of the end plate described above is as follows:

[0016] The equipment for the ultra-high precision alignment and face-changing method of the end-sealing plate includes a frame, a base, a slide rail provided on the base, an end-sealing plate, a plate-taking positioning and conveying mechanism, a plate-arranging positioning and conveying mechanism, and a controller. The end-sealing plate is provided with a plurality of corresponding chip holes, and also includes a needle bed, a pad frame, a face-changing frame taking and placing mechanism, a face-changing table device, and a pressing servo mechanism.

[0017] The refacing table device is mounted on a slide rail, and the refacing table device includes a servo motor and a transmission mechanism, a movable slider, a refacing table carrier mounted on the movable slider, and a needle bed carrier mounted on the refacing table carrier; the needle bed is mounted on the needle bed carrier; a needle bed carrier positioning pin is provided on the needle bed carrier, and a first detection sensor is provided at each of the four corners of the needle bed carrier, and the first detection sensor is used to detect whether the placed first end sealing plate is in contact with the needle bed;

[0018] The needle bed includes a needle bed base plate, a needle bed movable plate, a guide rod seat, a movable guide rod arranged on the upper part of the guide rod seat and a return spring sleeved outside the movable guide rod, the movable guide rod passes through the needle bed base plate and the needle bed movable plate from bottom to top, a plurality of ejector pin holes are provided on the needle bed movable plate, a plurality of ejector pins are installed on the needle bed base plate, and the ejector pins correspond to the ejector pin holes, needle bed positioning holes are provided on both sides of the needle bed movable plate, and third detection sensors are provided at the four corner positions of the needle bed;

[0019] The end-sealing plate includes a first end-sealing plate with one side of the chip sealed and a second end-sealing plate to be embedded with a chip and sealed on the other side. The first end-sealing plate and the second end-sealing plate are provided with a plurality of chip holes, and both sides of the first end-sealing plate and the second end-sealing plate are provided with end-sealing plate positioning holes.

[0020] The gasket frame is a frame body with a rectangular hole in the middle. The area of ​​the rectangular hole is smaller than the area of ​​the first end sealing plate and the second end sealing plate, and the area of ​​the rectangular hole is larger than the area of ​​several chip hole gathering areas of the first end sealing plate and the second end sealing plate. Gasket frame positioning pins that are compatible with the positioning holes of the end sealing plates are provided on both sides of the gasket frame. The gasket frame is placed on the first end sealing plate to separate the first end sealing plate and the second end sealing plate. The thickness of the gasket frame is used to control the protruding height of the chip after the top pressure is replaced to achieve consistency.

[0021] Furthermore, the extrusion servo mechanism is installed on the machine base above the slide rail, and the extrusion servo mechanism includes a second guide rod seat, four second guide columns, a second fixed plate installed on the upper part of the four second guide columns, an end plate movable carrier slidably installed on the second guide columns, an extrusion carrier installed on the end plate movable carrier, a second drive motor installed on the upper part of the second fixed plate, a ball screw and a ball nut installed at the lower output end of the second drive motor, an end plate clamping cylinder and an end plate clamping hand installed at the lower part of the end plate movable carrier, the end plate clamping hand is used to clamp and place the end plate; an extrusion carrier is provided with an extrusion carrier positioning hole, the extrusion carrier positioning hole corresponds to the gasket frame positioning pin, and the four corners of the extrusion carrier are provided with second detection sensors, and the second detection sensor is used to detect whether the second end plate to be embedded in the chip face-changing sealing is attached to the gasket frame.

[0022] Furthermore, the face-changing frame pick-up and placement mechanism includes a first guide rod seat, four first guide posts, a first fixed plate mounted on the upper portion of the four first guide posts, a movable carrier plate of a gasket frame slidably mounted on the first guide posts, a first drive motor mounted on the upper portion of the first fixed plate, a ball screw and a ball nut mounted on the lower output end of the first drive motor, a gasket frame clamping cylinder and a gasket frame clamping hand mounted on the lower portion of the gasket frame movable carrier plate, wherein the gasket frame clamping hand is used to clamp and place the gasket frame. A positioning pin is provided on the gasket frame, and the gasket frame is placed vertically on the positioning hole of the end plate. The function of the gasket frame positioning pin is to align the plate holes of the two end plates vertically so that the chip can be successfully face-changed. The thickness of the gasket frame can control the uniform protrusion height of the chip.

[0023] Furthermore, the plate-taking, positioning, and conveying mechanism includes a first bracket, a first transverse plate mounted on the first bracket, a first transverse slide and a first transverse cylinder mounted on the first transverse plate, a first transverse slide driven by the first transverse cylinder to slide on the first transverse slide, a first vertical slide and a first lifting slide cylinder mounted on the outside of the first transverse slide, a first lifting slide mounted on the first vertical slide, a first gripper device mounted on the first lifting slide and connected to the output end of the first lifting slide cylinder, the first gripper device including a first gripper cylinder, a first positioning plate, and a first end plate gripper. A lifting cylinder limiter is provided on the transverse slide.

[0024] Furthermore, the plate arrangement positioning and conveying mechanism includes a second bracket, a second transverse plate mounted on the second bracket, a second transverse slide rail and a second transverse cylinder mounted on the second transverse plate, a second transverse slide driven by the second transverse cylinder to slide on the second transverse slide rail, a second vertical slide rail and a second lifting slide cylinder mounted on the outside of the second transverse slide rail, a second lifting slide mounted on the second vertical slide rail, a second gripper device mounted on the second lifting slide rail and connected to the output end of the second lifting slide cylinder, the second gripper device including a second gripper cylinder, a second positioning pressure plate, and a second end plate gripper. A lifting cylinder limiter is provided on the second transverse slide rail.

[0025] Furthermore, the transmission mechanism of the face-changing table device includes a ball screw, a ball nut and a screw sleeve connected to the output end of the motor.

[0026] Furthermore, the first detection sensor, the second detection sensor and the third detection sensor all adopt optical fiber sensors, which include a light source, an optical fiber, a detector and a signal processor; the warning module includes a three-color light module or a sound warning module or a combination of the two.

[0027] Beneficial effects of the present invention:

[0028] 1. The needle bed carrier plate, the press plate of the press table and the four corners of the needle bed are respectively equipped with four detection sensors, and the accuracy of each sensor is 0.1 mm. The gap is limited to detect whether the placed end plate and the needle bed are in good alignment. If there is any abnormal alignment, the sensor will send an alarm signal, which not only ensures the accuracy of the alignment, but also facilitates timely adjustment of abnormal situations.

[0029] 2. The detection area for alignment is rectangular, and the detection sensors are distributed at the four corners, which improves the detection accuracy and facilitates consistency when repeated detection.

[0030] 3. The function of the positioning pins of the spacer frame is to align the plate holes of the first end plate and the second end plate vertically so that the chip can be successfully replaced; the thickness of the spacer frame can control the protruding height of the chip.

[0031] 4. The needle bed is installed on the positioning pins of the needle bed carrier plate and fixed accordingly, serving as the positioning base platform for the ultra-high precision alignment and face-changing device of the end plate, thereby improving the stability and accuracy of the face-changing.

[0032] 5. The repeat positioning accuracy is 0.02mm, which improves the quality and yield rate of chip end sealing and effectively reduces the scrap rate and defective rate of chip end sealing.

[0033] 6. It solves the problem of exposed ceramic on the chip corners caused by the previous chip refacing process on the same end plate; it avoids the problem of cracks on the chip end due to excessive contact pressure of the needle bed on the copper end chip; it avoids the problem of skewness caused by the needle bed not having corresponding positioning pins to accurately position the end plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Various other advantages and benefits will become apparent to those skilled in the art upon reading the detailed description of the preferred embodiment below. The accompanying drawings are for illustration purposes only and are not to be considered as limiting the present invention. Throughout the drawings, the same reference symbols are used to denote the same components. In the drawings:

[0035] Figure 1 A schematic diagram showing the structure of the face-changing frame pick-up and placement mechanism, face-changing table device, extrusion servo mechanism, machine base and slide rails of the ultra-high-precision alignment and face-changing equipment for end plates of the present invention is shown;

[0036] Figure 2 Shown Figure 1 A schematic structural diagram of a partial enlarged view of FIG;

[0037] Figure 3 Shown Figure 1 A schematic structural diagram of a partial enlarged view B;

[0038] Figure 4 It shows a schematic structural diagram of the carrier plate of the ultra-high precision alignment and face-changing equipment for end plates of the present invention;

[0039] Figure 5 It shows a schematic structural diagram of the carrier plate pressed out by the ultra-high precision alignment and face-changing equipment for end plates of the present invention;

[0040] Figure 6 It shows a schematic structural diagram of the needle bed of the ultra-high precision alignment and face-changing device for end plates of the present invention;

[0041] Figure 7 It shows a schematic structural diagram of the end plate gasket frame of the end plate ultra-high precision alignment and face-changing equipment of the present invention;

[0042] Figure 8 It shows a schematic structural diagram of the end plate of the ultra-high precision alignment and face-changing equipment for end plates of the present invention;

[0043] Figure 9 It shows a schematic structural diagram of the present invention when a needle bed, a spacer frame and an end plate are placed on the face changing table device of the ultra-high precision alignment face changing equipment for end plates;

[0044] Figure 10 Shown Figure 9 A schematic diagram of the three-dimensional structure when a carrier plate and a needle bed are pressed onto the structure;

[0045] Figure 11 Shown Figure 10 Schematic diagram of the decomposition structure;

[0046] Figure 12 It shows a schematic structural diagram of the face-changing frame taking-and-placing mechanism of the present invention when taking the padding strip frame;

[0047] Figure 13 Shown Figure 10 A structural diagram from an angle;

[0048] Figure 14 The figure shows the structure of the extrusion servo mechanism of the present invention when taking out the second end plate.

[0049] In the picture:

[0050] 01 - First detection sensor; 02 - Second detection sensor; 03 - Third detection sensor; 10 - Needle bed carrier plate positioning pin; 20 - Needle bed positioning hole; 26 - Machine base; 27 - Movable slider; 29 - Slide rail; 31 - Return spring; 40 - Guide rod seat; 41 - Cylinder for the gasket frame gripper; 42 - Movable gasket frame carrier; 43 - Gasket frame gripper; 50 - End plate positioning hole; 52-needle bed base plate; 53-needle bed movable plate; 60-end plate hole; 61-second guide rod seat; 62-second guide column; 63-second fixed plate; 64-end plate movable carrier plate; 65-second drive motor; 66-end plate clamping cylinder; 67-end plate clamping; 70-pad frame positioning pin; 80-pressing carrier plate positioning hole; 100-carrier plate; 200-needle bed; 300-end plate; 300-1-first end plate; 300-2-second end plate; 400-pad frame; 500-pressing carrier plate; 600-face changing platform carrier plate. DETAILED DESCRIPTION

[0051] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. Rather, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0052] The following preparations are required before the automatic face-changing process of the end plate ultra-high precision alignment face-changing method of this embodiment begins:

[0053] (1) The pad frame clamping cylinder 41 of the face frame pick-up and placement table needs to be opened, and the pad frame 400 is placed on the pad frame movable carrier plate 42. The pad frame positioning pins 70 of the pad frame 400 correspond to the positioning holes of the pad frame movable carrier plate 42. Close the pad frame clamping cylinder 41 to complete the work of placing the pad frame 400.

[0054] (2) The end plate clamping cylinder of the pressing servo mechanism needs to be opened, and the second end plate 300-2 without the chip is placed on the end plate movable carrier 64. The positioning hole 50 of the second end plate 300-2 corresponds to the positioning pin of the end plate movable carrier 64. The end plate clamping cylinder 43 is closed to complete the work of placing the second end plate 300-2.

[0055] (3) Place the needle bed 200 of the corresponding model and specifications on the face-changing needle bed carrier 100 and fix it. The needle bed positioning hole 20 of the needle bed 200 needs to be fixed with the needle bed carrier positioning pin 10 of the face-changing needle bed carrier 100. Install the plate detection sensor 01 of the needle bed 200 to the corresponding hole position, and adjust the detection end plane of the sensor 01 to the same height as the plane of the needle bed 200. After completing the above three preparations, the equipment enters the standby production state.

[0056] The ultra-high precision alignment and face-changing method of the end plate of the present invention comprises the following steps:

[0057] (1) A needle bed is pre-placed on the carrier plate of the face-changing table. The needle bed is provided with a positioning pin. Four detection sensors are respectively provided on the carrier plate of the needle bed, the pressing carrier plate of the press table and the four corners of the needle bed. Positioning holes are provided on the first end plate and the second end plate, and a positioning pin is provided on the pad frame;

[0058] (2) The plate positioning and conveying mechanism places the first end-sealing plate with the chip sealed and dried on one side on the needle bed of the face-changing table carrier and aligns it with the center of the Y-axis, with the chip on the dried side facing upwards. The positioning hole of the first end-sealing plate corresponds to the positioning pin of the needle bed. The detection sensor of the needle bed adopts an accuracy of 0.1mm and a limited gap range. The detection sensor detects whether the first end-sealing plate is attached to the needle bed. The gap between the first end-sealing plate and the needle bed cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the first end-sealing plate is placed abnormally and sends an alarm signal. The staff handles the abnormality in time. If the gap is less than 0.1mm, it is determined to be qualified and proceed to the next step.

[0059] (3) Align the positioning pins of the gasket frame with the positioning holes of the first end plate, place them on the first end plate, and fit the gasket frame and the first end plate together;

[0060] (4) The face changing table moves from the pick-up and placement position of the pad frame to the press position. The movable carrier of the press transports the empty second end plate downward along the Z axis to the surface of the pad frame of the face changing table and fits it with it. The positioning hole of the second end plate corresponds to the positioning pin of the pad frame. The plate hole of the second end plate faces the plate hole of the first end plate. The detection sensor installed on the plate surface of the press out carrier of the press detects whether the second end plate fits on the pad frame. The gap between the second end plate and the pad frame cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the placement of the second end plate is abnormal and sends an alarm signal. The staff handles the abnormality in time; if the gap is less than 0.1mm, it is determined to be qualified and proceeds to the next step; the movable carrier continues to press down the specified distance until the chip of the first end plate is pressed upward into the plate hole of the second end plate. After the chip is pressed in, the movable carrier moves upward to the waiting position;

[0061] (5) The face changing table moves from the pressing position to the face changing discharge position, the plate arrangement positioning and conveying mechanism moves to the top of the face changing discharge position, the Y-axis slide clamping cylinder opens the clamping hand, the Z-axis slide cylinder moves downward to the second end plate surface of the face changing table, the Y-axis slide clamping cylinder closes the clamping hand, the Z-axis slide cylinder moves upward, and the mechanical clamping hand of the plate arrangement positioning and conveying mechanism conveys the second end plate upward, the plate arrangement positioning and conveying mechanism moves from the face changing discharge position to the end sealing machine handover position, the face changing machine sends a receiving signal to the end sealing machine, waits for the end sealing machine to confirm the signal to complete the handover, and enters the next process to flatten the chips protruding from the second end plate;

[0062] (6) The face changing table moves from the face changing discharge position to the pad frame pick-up position, the movable carrier moves downward to the upper surface of the pad frame, the Y-axis slide clamp cylinder of the movable carrier closes and clamps the pad frame, and the movable carrier transports the pad frame upward to the waiting position to prepare for the next placement of the pad frame;

[0063] (7) The face-changing table moves from the pick-up and placement position of the pad frame to the press position. The movable carrier plate of the press moves downward to fit the surface above the first end plate where there is no chip. The Y-axis slide clamp cylinder closes and clamps the first end plate. The movable carrier plate rises back to the waiting position. At this time, the lower surface of the first end plate is transformed into the working surface, and its function is transformed into the function of the second end plate, preparing for the next face-changing work. The chip face-changing process is completed.

[0064] In step (4), the movable carrier plate is pressed downward for a distance of 8.9 mm to 9.6 mm, for example, 8.9 mm, 9.0 mm, 9.1 mm, 9.2 mm, 9.3 mm, 9.4 mm, 9.5 mm, and 9.6 mm.

[0065] The preferred embodiment of the present invention is as follows Figure 1-14As shown, the equipment adopts the ultra-high precision alignment and face-changing method of the sealing end plate, including a frame, a machine base 26, a slide rail 29 provided on the machine base 26, a sealing end plate 300, a plate taking and positioning conveying mechanism, a plate arrangement and positioning conveying mechanism and a controller, a plurality of chip holes 60 are provided on the sealing end plate 300, and also includes a needle bed 200, a pad frame 400, a face-changing frame taking and placing mechanism, a face-changing table device and an extrusion servo mechanism. The extrusion servo mechanism is installed on the machine base 26 above the slide rail 29, and the extrusion servo mechanism includes a second guide rod seat 61, four second guide columns 62, a second fixed plate 63 installed on the upper part of the four second guide columns 62, and a sealing end plate 63 slidably installed on the second guide column 62. The end plate movable carrier 64, the extrusion carrier 500 installed on the end plate movable carrier 64, the second drive motor 65 installed on the upper part of the second fixed plate 63, the ball screw and ball nut installed at the lower output end of the second drive motor 65, the end plate clamping cylinder 66 and the end plate clamping hand 67 installed at the lower part of the end plate movable carrier 64, the end plate clamping hand 67 is used to clamp and place the end plate 300; the extrusion carrier 500 is provided with an extrusion carrier positioning hole 80, and the four corners of the extrusion carrier 500 are provided with a second detection sensor 02, the second detection sensor is used to detect whether the second end plate 300-2 to be embedded in the chip for face-changing and end-sealing is fitted on the pad frame 400.

[0066] The face-changing table device of this embodiment is installed on the slide rail 29, and the face-changing table device includes a servo motor and a transmission mechanism, a movable slider 27, a face-changing table carrier 600 installed on the movable slider 27, and a needle bed carrier 100 installed on the face-changing table carrier 600; the needle bed 200 is installed on the needle bed carrier 100; the needle bed carrier 100 is provided with a needle bed carrier positioning pin 10, and the four corners of the needle bed carrier 100 are provided with a first detection sensor 01, and the first detection sensor 01 is used to detect whether the placed first end sealing plate 300-1 is in contact with the needle bed 200.

[0067] like Figure 7 、 11 As shown, the end sealing plate 300 of this embodiment includes a first end sealing plate 300-1 on which one side of the chip has been sealed and a second end sealing plate 300-2 ready for embedding the chip and sealing the other side. A number of chip holes 60 are correspondingly provided on the first end sealing plate 300-1 and the second end sealing plate 300-2, and end sealing plate positioning holes 50 are provided on both sides of the first end sealing plate 300-1 and the second end sealing plate 300-2.

[0068] like Figure 6As shown, the needle bed 200 of this embodiment includes a needle bed base plate 52, a needle bed movable plate 53, four guide rod seats 40, a movable guide rod 30 arranged on the upper part of the guide rod seat 40, and a return spring 31 sleeved on the outside of the movable guide rod. The function of the return spring 31 is to move the needle bed movable plate 53 close to the needle bed base plate 52 when under pressure, and to separate the movable plate 53 and the needle bed base plate 52 when the pressure is released. The movable guide rod passes through the needle bed base plate 52 and the needle bed movable plate 53 from bottom to top. A plurality of ejector pin holes 54 are provided on the needle bed movable plate 53. Ejectors are installed on the needle bed base plate 52, and the ejector pins correspond to the ejector pin holes 54. Needle bed positioning holes 20 are provided on both sides of the needle bed movable plate 53. A third detection sensor 03 is provided at each of the four corner positions on the needle bed 200. The four guide rod seats 40 in the needle bed 200 of this embodiment are accessories for fixing the needle bed movable plate 53. They are fixed to the left and right sides of the needle bed carrier plate 100 in pairs, but are not limited to other installation positions; as shown in FIG. Figure 8 As shown, the spacer frame 400 is a frame with a rectangular hole in the center. The area of ​​this rectangular hole is smaller than that of the first and second end-blocking plates 300-1, 300-2, but larger than the area of ​​the chip holes clustered in the first and second end-blocking plates 300-1, 300-2. Spacer frame 400 is provided with spacer frame locating pins 70 on both sides, which mate with the end-blocking plate locating holes 50. The spacer frame 400 is placed on the first end-blocking plate 300-1 to separate the first and second end-blocking plates 300-1, 300-2. The thickness of the spacer frame 400 is used to control the height of the chip protrusion after the plate is replaced.

[0069] like Figure 4 、 5 As shown, in this embodiment, a needle bed carrier plate 100 is provided with a needle bed carrier plate positioning pin 10, and the four corners of the needle bed carrier plate 100 are provided with a first detection sensor 01, and the first detection sensor 01 is used to detect whether the placed first end plate 300-1 is attached to the needle bed 200. The gap between the first end plate 300-1 and the needle bed 200 cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the placement of the first end plate 300-1 is abnormal and sends an alarm signal. The staff handles the abnormality in time. If the gap is less than 0.1mm, it is determined to be qualified and proceeds to the next step; press out the carrier plate 50 0 is provided with an extrusion carrier plate positioning hole 80, which corresponds to the gasket frame positioning pin 70. The four corners of the extrusion carrier plate 500 are provided with a second detection sensor 02, and the second detection sensor is used to detect whether the placed second end sealing plate 300-2 is fitted on the gasket frame 400; the gap between the second end sealing plate 300-2 and the gasket frame 400 cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the placement of the second end sealing plate 300-2 is abnormal and sends an alarm signal. The staff will deal with the abnormality in time. If the gap is less than 0.1mm, it will be determined to be qualified and proceed to the next step.

[0070] In a preferred embodiment of the present invention, the diameters of the needle bed carrier plate locating pin 10, the extruded carrier plate locating hole 80, the needle bed locating hole 20 and the pad frame locating pin 70 are all 6.28 mm, and the diameter of the end plate locating hole is 6.3 mm, but the diameter size is not limited thereto and can also be smaller or larger, such as in the range of 4.5 mm-10 mm.

[0071] In this embodiment, the gasket frame 400 is placed on the first end plate 300-1 to separate the first end plate 300-1 and the second end plate 300-2. Gasket frame positioning pins 70 are provided on both sides of the gasket frame 400 to match the end plate positioning holes 50 provided on both sides of the end plates.

[0072] like Figure 12 、 13 As shown, the face-changing frame placement mechanism of this embodiment includes a first guide rod seat 40, four first guide posts 45, a first fixed plate 46 mounted on the upper portion of the four first guide posts 45, a strip frame movable carrier plate 42 slidably mounted on the first guide posts 45, a first drive motor 47 mounted on the upper portion of the first fixed plate 46, a ball screw and ball nut mounted on the lower output end of the first drive motor 47, a strip frame clamping cylinder 41 and a strip frame clamping hand 43 mounted on the lower portion of the strip frame movable carrier plate 42, and the strip frame clamping hand 43 is used to clamp and place the strip frame 400. The strip frame 400 is placed vertically on the positioning hole of the end plate 300-1. The positioning pin 70 of the strip frame 400 is used to align the plate holes of the end plate 300-1 and the end plate 300-2 so that the chip can be successfully face-changed. The thickness of the strip frame can control the uniform protrusion height of the chip.

[0073] The plate picking, positioning and conveying mechanism of this embodiment includes a first bracket, a first transverse plate mounted on the first bracket, a first transverse slide and a first transverse cylinder mounted on the first transverse plate, a first transverse slide driven by the first transverse cylinder to slide on the first transverse slide, a first vertical slide and a first lifting slide cylinder mounted on the outside of the first transverse slide, a first lifting slide mounted on the first vertical slide, a first gripping device mounted on the first lifting slide and connected to the output end of the first lifting slide cylinder, the first gripping device includes a first gripping cylinder, a first positioning pressure plate and a first end plate gripper. A first lifting cylinder limiter is provided on the first transverse slide. Conventional equipment can be used for the plate picking, positioning and conveying mechanism, and therefore it is omitted in the illustration of this embodiment.

[0074] The plate arrangement positioning and conveying mechanism of this embodiment includes a second bracket, a second transverse plate mounted on the second bracket, a second transverse slide rail and a second transverse cylinder mounted on the second transverse plate, a second transverse slide driven by the second transverse cylinder to slide on the second transverse slide rail, a second vertical slide rail and a second lifting slide cylinder mounted on the outside of the second transverse slide rail, a second lifting slide mounted on the second vertical slide rail, a second gripping device mounted on the second lifting slide rail and connected to the output end of the second lifting slide cylinder, the second gripping device includes a second gripping cylinder, a second positioning pressure plate and a second end plate gripper. A second lifting cylinder limiter is provided on the second transverse slide. Conventional equipment can be used for the plate arrangement positioning and conveying mechanism, so it is omitted in the illustration of this embodiment.

[0075] The transmission mechanism of the resurfacing table device in this embodiment includes a ball screw, a ball nut and a screw sleeve connected to the output end of the servo motor. The X-axis direction of the resurfacing table is achieved by using the servo motor to rotate the ball screw to apply force to the resurfacing table carrier 600 to move it to the corresponding position.

[0076] The first detection sensor 01, the second detection sensor 02, and the third detection sensor 03 are all optical fiber sensors, which include a light source, an optical fiber, a detector, and a signal processor; the warning module includes a three-color light module or a sound warning module or a combination of the two.

[0077] The working principle of the equipment for the ultra-high precision alignment and face-changing method of the end plate of the present invention is as follows:

[0078] (1) The plate taking positioning and conveying mechanism moves to the top of the drying furnace end plate discharge position, the first gripper cylinder opens, the first lifting slide cylinder moves downward to the drying furnace discharge position, the end plate 300-1 with the chip facing upward is at the discharge position, the first gripper cylinder that has been opened enters the middle position of the side of the end plate 300-1, the first gripper cylinder closes and clamps the end plate 300-1, and during the closing process of the first gripper cylinder, the end plate 300-1 is adjusted to align with the Y-axis center of the face-changing table carrier 600, and the first lifting slide cylinder returns to the origin height upward; the plate taking positioning and conveying mechanism of this embodiment has precise positioning in the Y / X axis direction, first positioning in the Y axis direction, and then positioning in the X axis direction;

[0079] (2) Adjust the cylinder limit device so that the plate taking positioning and conveying mechanism moves to the plate placing position and is consistent with the X-axis center of the needle bed 200 of the face changing table. The plate taking positioning and conveying mechanism moves to the face changing table plate placing position. The first lifting slide cylinder moves downward to the face changing table needle bed 200. The end plate positioning hole 50 corresponds to the needle bed positioning hole 20. The first clamping cylinder opens the clamping hand. The first lifting slide cylinder moves upward to the original position, and the plate taking positioning and conveying mechanism returns to the top of the discharge position. The needle bed 200 detection sensor 03 detects whether the first end plate 300-1 is positioned accurately and fits on the needle bed 200. The gap between the end plate 300-1 and the needle bed 200 cannot be greater than 0.1mm. If one or more of the third detection sensors 03 detects a gap greater than 0.1mm, the system determines that the first end plate 300-1 is placed abnormally and sends an alarm signal. If all the third detection sensors 03 detect a gap less than 0.1mm, it is determined to be qualified and proceed to the next step.

[0080] (3) The face changing table device moves from the board placement position to the pad frame placement position. The pad frame placement table transports the pad frame 400 and moves it downward along the Z axis until it fits with the first end plate 300-1 of the face changing table needle bed 200. The positioning pin 70 of the pad frame 400 corresponds to the positioning hole 50 of the first end plate 300-1. The pad frame clamping cylinder of the pad frame movable carrier plate 42 opens to release the pad frame 400. The pad frame movable carrier plate 42 moves upward to the waiting position.

[0081] (4) The refacing table device moves from the pick-up and placement position of the pad frame to the pressing position, and the end plate movable carrier 64 of the pressing servo mechanism transports the second end plate 300-2 to move downward along the Z axis until it fits with the surface of the pad frame 400 of the refacing table. The positioning hole 50 of the second end plate 300-2 corresponds to the positioning pin 70 of the pad frame 400. The function of the positioning pin 70 is to align the plate holes of the first end plate 300-1 and the second end plate 300-2 vertically so that the chip can be refaced successfully. The thickness of the pad frame 400 can control the chip to protrude to a consistent height. The end plate clamping cylinder opens to release the second end plate 300-2. The press presses out the carrier plate 500. The board surface detection sensor 02 detects whether the second end plate 300-2 is attached to the pad frame 400. The gap between the second end plate 300-2 and the pad frame 400 cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the second end plate 300-2 is placed abnormally and sends an alarm signal. If the gap is less than 0.1mm, it is determined to be qualified and proceed to the next step. The end plate movable carrier 64 continues to press downward in the Z-axis by a distance between 8.9 mm and 9.6 mm, such as 8.9 mm, 9.0 mm, 9.1 mm, 9.2 mm, 9.3 mm, 9.4 mm, 9.5 mm, or 9.6 mm, to press the chip on the first end plate 300-1 upward into the plate hole of the second end plate 300-2. The end plate movable carrier 64 moves upward to the waiting position, the needle bed needles exit the end plate holes, and the needle bed movable plate 53 returns to its original height, completing the direction change.

[0082] (5) The face changing table device moves from the pressing position to the face changing discharge position, the plate arrangement positioning and conveying mechanism moves to the top of the face changing discharge position, the second gripper cylinder opens the gripper, the second lifting slide cylinder moves downward to the second end plate 300-2 of the face changing table, the second gripper cylinder closes the gripper, the second lifting slide cylinder conveys the second end plate 300-2 upward, the plate arrangement positioning and conveying mechanism moves from the face changing discharge position to the end sealing machine handover position, the face changing machine sends a receiving signal to the end sealing machine, waits for the end sealing machine to confirm the signal to complete the handover, and enters the next process of the second end plate 300-2 chip flattening protrusion height;

[0083] (6) The face changing table device moves from the face changing discharge position to the padding frame pick-up and placement position, and the padding frame movable carrier plate 42 moves downward to the upper surface of the padding frame 400. The Y-axis slide clamping cylinder 41 of the padding frame movable carrier plate 42 closes and clamps the padding frame 400. The padding frame movable carrier plate 42 transports the padding frame 400 upward to the waiting position to prepare for the next placement of the padding frame 400.

[0084] (7) The resurfacing table moves from the pick-up and placement position of the pad frame to the pressing position. The end plate movable carrier 64 of the pressing servo mechanism moves downward to the surface above the first end plate 300-1, which has no chips. The end plate clamping cylinder closes and clamps the first end plate 300-1. The end plate movable carrier 64 rises back to the waiting position. The first end plate 300-1 switches a working surface to become the second end plate 300-2 to prepare for the next resurfacing work. The above completes the chip resurfacing process.

[0085] In this embodiment, the detection sensors of the carrier plate 100, the extrusion carrier plate 500 and the needle bed 200 adopt a limited range of precision of 0.1 mm gap, and are not limited to using other sensors with higher precision.

[0086] The foregoing description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be readily conceived by a person skilled in the art within the technical scope disclosed herein are intended to be encompassed within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the scope of protection of the claims.

Claims

1. The ultra-high precision alignment and face-changing method for end-sealing plates is characterized by The steps include: (1) A needle bed is pre-placed on the carrier plate of the face-changing table. The needle bed is provided with a positioning pin. Four detection sensors are respectively provided on the carrier plate of the needle bed, the pressing carrier plate of the press table and the four corners of the needle bed. Positioning holes are provided on the first end plate and the second end plate, and a positioning pin is provided on the pad frame; (2) The plate positioning and conveying mechanism places the first end-sealing plate with the chip sealed and dried on one side on the needle bed of the face-changing table carrier, with the chip on the dried side facing up. The positioning hole of the first end-sealing plate corresponds to the positioning pin of the needle bed. The detection sensor of the needle bed adopts an accuracy of 0.1mm and a limited gap range. The detection sensor detects whether the first end-sealing plate is attached to the needle bed. The gap between the first end-sealing plate and the needle bed cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the first end-sealing plate is placed abnormally and sends an alarm signal. The staff handles the abnormality in time. If the gap is less than 0.1mm, it is determined to be qualified and proceed to the next step. (3) Align the positioning pins of the gasket frame with the positioning holes of the first end plate, place them on the first end plate, and fit the gasket frame and the first end plate together; (4) The face changing table moves from the strip frame placement position to the press position. The movable carrier of the press moves the empty second end plate to the surface of the strip frame of the face changing table and fits it with the strip frame. The positioning holes of the second end plate correspond to the positioning pins of the strip frame. The plate holes of the second end plate face the plate holes of the first end plate. The detection sensor installed on the plate surface of the press plate detects whether the second end plate fits on the strip frame. The gap between the second end plate and the strip frame cannot be greater than 0.1mm. If the gap is greater than 0.1mm, the system determines that the second end plate is placed abnormally, and an alarm signal is issued, and the staff handles the abnormality in time. If the gap is less than 0.1mm, it is judged as qualified and proceeds to the next step; the movable carrier continues to press down the specified distance until the chip of the first end plate is pressed upward into the plate hole of the second end plate. After the chip is pressed in, the movable carrier moves upward to the waiting position; (5) The face-changing table moves from the pressing position to the face-changing discharge position, the plate arrangement positioning and conveying mechanism moves to the top of the face-changing discharge position, the mechanical gripper of the plate arrangement positioning and conveying mechanism conveys the second end-sealing plate upward, and the plate arrangement positioning and conveying mechanism moves from the face-changing discharge position to the end-sealing machine handover position. The face-changing machine sends a receiving signal to the end-sealing machine, waits for the end-sealing machine to confirm the signal to complete the handover, and then enters the next process to level the chips protruding from the second end-sealing plate; (6) The face changing table moves from the face changing discharge position to the pad frame pick-up position, the movable carrier moves downward to the upper surface of the pad frame, the sliding clamp cylinder of the movable carrier closes and clamps the pad frame, and the movable carrier transports the pad frame upward to the waiting position to prepare for the next placement of the pad frame; (7) The face-changing table moves from the pick-up and placement position of the pad frame to the press position. The movable carrier plate of the press moves downward to fit the surface above the first end plate where there is no chip. The sliding clamp cylinder closes and clamps the first end plate. The movable carrier plate rises back to the waiting position. At this time, the lower surface of the first end plate is transformed into the working surface, and its function is transformed into the function of the second end plate, preparing for the next face-changing work. The chip face-changing process is completed.

2. The method for ultra-high precision alignment and replacement of end plates according to claim 1, characterized in that: In step (4), the movable carrier plate is pressed downward for a distance of 8.9 mm to 9.6 mm.

3. An apparatus adopting the method for ultra-high precision alignment and face-changing of end plates as claimed in any one of claims 1 to 2, comprising a frame, a machine base (26), a slide rail (29) provided on the machine base (26), an end plate (300), a needle bed (200), a plate taking and positioning conveying mechanism, a plate arrangement and positioning conveying mechanism and a controller, wherein the end plate (300) is provided with a plurality of chip holes (60) correspondingly, and is characterized in that: It also includes a padding frame (400), a face changing frame pick-up and placement mechanism, a face changing table device and a pressing servo mechanism, wherein: The face-changing table device is mounted on a slide rail (29), and comprises a servo motor and a transmission mechanism, a movable slider (27), a face-changing table carrier (600) mounted on the movable slider (27), and a needle bed carrier (100) mounted on the face-changing table carrier (600); a needle bed carrier positioning pin (10) is provided on the needle bed carrier (100), and the needle bed (200) is mounted on the needle bed carrier (100); four corners of the needle bed carrier (100) are each provided with a first detection sensor (01), and the first detection sensor (01) is used to detect whether the placed first end-sealing plate (300-1) is attached to the needle bed (200); The needle bed (200) includes a needle bed base plate (52), a needle bed movable plate (53), a guide rod seat (40), a movable guide rod arranged on the upper part of the guide rod seat (40), and a return spring (31) sleeved outside the movable guide rod, the movable guide rod passes through the needle bed base plate (52) and the needle bed movable plate (53) from bottom to top, a plurality of ejector pin holes (54) are provided on the needle bed movable plate (53), a plurality of ejector pins are installed on the needle bed base plate, and the ejector pins correspond to the ejector pin holes (54), needle bed positioning holes (20) are provided on both sides of the needle bed movable plate (53), and a third detection sensor (03) is provided at each of the four corner positions on the needle bed (200); The end-sealing plate (300) comprises a first end-sealing plate (300-1) on which one side of the chip has been sealed, and a second end-sealing plate (300-2) to be embedded with a chip and sealed on the other side, wherein the first end-sealing plate (300-1) and the second end-sealing plate (300-2) are respectively provided with a plurality of chip holes (60), and both sides of the first end-sealing plate (300-1) and the second end-sealing plate (300-2) are provided with end-sealing plate positioning holes (50); The pad frame (400) is a frame body with a rectangular hole in the middle, the area of ​​the rectangular hole is smaller than the area of ​​the first end plate (300-1) and the second end plate (300-2), and the area of ​​the rectangular hole is larger than the area of ​​the chip hole gathering area of ​​the first end plate (300-1) and the second end plate (300-2). Pad frame positioning pins (70) that are compatible with the end plate positioning holes (50) are provided on both sides of the pad frame (400). The pad frame (400) is placed on the first end plate (300-1) and is used to separate the first end plate (300-1) and the second end plate (300-2). The thickness of the pad frame (400) is used to control the protruding height of the chip after the top pressure is replaced so as to achieve consistency.

4. The device for ultra-high precision alignment and face-changing of end plates according to claim 3 is characterized in that: The extrusion servo mechanism is mounted on the machine base (26) above the slide rail (29), and comprises a second guide rod seat (61), four second guide posts (62), a second fixed plate (63) mounted on the upper portion of the four second guide posts (62), a sealing plate movable carrier (64) slidably mounted on the second guide posts (62), an extrusion carrier (500) mounted on the sealing plate movable carrier (64), a second drive motor (65) mounted on the upper portion of the second fixed plate (63), and a ball screw mounted on the output end of the lower portion of the second drive motor (65). Rod and ball nut, end plate clamping cylinder (66) and end plate clamping hand (67) installed at the lower part of the end plate movable carrier (64), the end plate clamping hand is used to clamp and place the end plate; the extrusion carrier (500) is provided with an extrusion carrier positioning hole (80), the extrusion carrier positioning hole (80) corresponds to the pad frame positioning pin (70), and the four corners of the extrusion carrier (500) are provided with a second detection sensor (02), the second detection sensor is used to detect whether the second end plate (300-2) to be embedded in the chip face-changing end is attached to the pad frame (400).

5. The device for ultra-high precision alignment and face-changing of end plates according to claim 3 is characterized in that: The face-changing frame pick-up and placement mechanism is installed on the machine base (26) above the slide rail (29), and the face-changing frame pick-up and placement mechanism includes a first guide rod seat (40), four first guide columns (45), a first fixed plate (46) installed on the upper part of the four first guide columns (45), a pad frame movable carrier plate (42) slidably installed on the first guide columns (45), a first drive motor (47) installed on the upper part of the first fixed plate (46), a ball screw and a ball nut installed at the lower output end of the first drive motor (47), a pad frame clamp cylinder (41) and a pad frame clamp (43) installed on the lower part of the pad frame movable carrier plate (42), and the pad frame clamp is used to clamp and place the pad frame (400).

6. The device for ultra-high precision alignment and face-changing of end plates according to claim 3, characterized in that: The plate picking, positioning and conveying mechanism includes a first bracket, a first transverse plate installed on the first bracket, a first transverse slide and a first transverse cylinder installed on the first transverse plate, a first transverse slide driven by the first transverse cylinder to slide on the first transverse slide, a first vertical slide and a first lifting slide cylinder installed on the outside of the first transverse slide, a first lifting slide installed on the first vertical slide, a first clamping device installed on the first lifting slide and connected to the output end of the first lifting slide cylinder, and the first clamping device includes a first clamping cylinder, a first positioning pressure plate and a first end plate clamp.

7. The device for ultra-high precision alignment and face-changing of end plates according to claim 3, characterized in that: The plate positioning and conveying mechanism includes a second bracket, a second transverse plate installed on the second bracket, a second transverse slide rail and a second transverse cylinder installed on the second transverse plate, a second transverse slide driven by the second transverse cylinder to slide on the second transverse slide rail, a second vertical slide rail and a second lifting slide cylinder installed on the second transverse slide, a second lifting slide installed on the second vertical slide rail, a second clamping device installed on the second lifting slide and connected to the output end of the second lifting slide cylinder, and the second clamping device includes a second clamping cylinder, a second positioning pressure plate and a second end plate clamp.

8. The device for ultra-high precision alignment and face-changing of end plates according to claim 3 is characterized in that: The transmission mechanism of the face-changing table device includes a ball screw, a ball nut and a screw sleeve connected to the output end of the motor.

9. The device for ultra-high precision alignment and face-changing of end plates according to claim 3, characterized in that: The first detection sensor (01), the second detection sensor (02) and the third detection sensor (03) all adopt optical fiber sensors, which include a light source, an optical fiber, a detector and a signal processor; the warning module includes a three-color light module or a sound warning module or a combination of the two.

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