Automated Dust Removal Method, Equipment, Dust Removal Detector and Medium for Batch Chips

Abstract

This application relates to automatic cleaning technology and discloses an automatic dust removal method, device, dust removal detector and medium for a batch of chips, including: placing multiple cleaned chips into the detection area of the dust removal detector; controlling a motion camera to take images of the chips in the detection area one by one; synthesizing a chip image for each chip after capturing all the azimuth images of the same chip; for each obtained chip image, using image recognition technology to detect stains on the chip image; if stains are detected on the chip, recording the stain coordinates according to the chip position where the stains are located, and associating the stain coordinates with the chip area where the stains are located and the stain information; after completing the stain detection for all chips, generating a dust removal trajectory; controlling a manipulator to use a dust removal rod to remove the stains on each chip along the dust removal trajectory one by one. This application aims to achieve efficient and precise automatic dust removal for a batch of chips.

Description

Technical Field

[0001] The present application relates to the technical field of automatic cleaning, and particularly to an automatic dust removal method for a batch of chips, a control device, a dust removal detector, and a computer-readable storage medium. Background Art

[0002] In the semiconductor manufacturing industry, the cleanliness of chips has a crucial impact on the performance and reliability of products. With the progress of technology, the size of chips has been continuously reduced while their functions have become increasingly powerful, which makes any tiny stain on the chip surface may have a significant impact on its performance. Taking the photosensitive chip of a camera module as an example, if you want to ensure excellent imaging effects of the camera module, it is necessary to ensure a high degree of cleanliness, no dust, and no dirt in the area of the photosensitive chip.

[0003] During the chip production process, although cleaning equipment such as a centrifugal cleaning machine and a deionized water washing machine are used to clean the chips. However, even so, there will still be some dirt that is difficult to remove by general cleaning equipment after cleaning (for example, the centrifugal cleaning machine has a good removal effect on larger particles, but it is difficult to completely remove tiny particles, especially the dirt embedded on the chip surface; the deionized water washing machine has limited cleaning effect on some insoluble or strongly adherent dirt, such as organic residues; there may be water stains remaining on the surface of the cleaned chips, and these water stains may form water marks during the drying process, affecting the smoothness of the chip surface), resulting in defective products and further causing product scrapping.

[0004] The above content is only used to assist in understanding the technical solution of the present application, and does not represent an admission that the above content is prior art. Summary of the Invention

[0005] The main purpose of the present application is to provide an automatic dust removal method for a batch of chips, a control device, a dust removal detector, and a computer-readable storage medium, aiming to achieve efficient and precise automatic dust removal of a batch of chips.

[0006] To achieve the above object, the present application provides an automatic dust removal method for a batch of chips, including the following steps:

[0007] Place multiple cleaned chips into the detection area of a dust removal detector;

[0008] Control a moving camera to take images of the chips in the detection area one by one; wherein, the moving camera takes images of each aspect of each chip one by one, and after taking all the aspect images of the same chip, then takes images of the next chip;

[0009] After taking all the aspect images of the same chip, synthesize all the aspect images of the same chip to obtain a chip image of the same chip;

[0010] For each chip image obtained, stain detection is performed on the chip image using image recognition technology;

[0011] If a stain is detected on the chip, according to the chip position where the stain is located, the stain coordinates are recorded, and the stain coordinates are associated with the chip area where the stain is located and the stain information, where the stain information includes the area size and the color depth; and, the manipulator is controlled to move to the dust removal rod placement area to pick up the dust removal rod and move to the standby position;

[0012] After stain detection is completed for all chips, starting from the standby position of the manipulator, all stain coordinates are connected in sequence, and the shortest path is planned to generate a dust removal trajectory;

[0013] The manipulator is controlled to move along the dust removal trajectory to use the dust removal rod to remove the stains on each chip one by one; among them, according to the force upper limit value of the chip area where each stain is located and the stain information, the pressing force when the manipulator uses the dust removal rod to wipe the stain is adjusted.

[0014] To achieve the above object, the present application also provides a control device, the control device includes: a memory, a processor, and a computer program stored on the memory and executable on the processor, and when the computer program is executed by the processor, the steps of the automatic dust removal method for batch chips as described above are implemented.

[0015] To achieve the above object, the present application also provides a dust removal detector, the dust removal detector includes a control device, a motion camera, and a manipulator, and the motion camera and the manipulator are both communicatively connected to the control device and controlled by the control device; the control device is the control device as described above.

[0016] To achieve the above object, the present application also provides a computer-readable storage medium, and a computer program is stored on the computer-readable storage medium, and when the computer program is executed by a processor, the steps of the automatic dust removal method for batch chips as described above are implemented.

[0017] The automatic dust removal method, control device, dust removal detector, and computer-readable storage medium for batch chips provided by the present application realize efficient and accurate automatic dust removal of batch chips by combining image recognition, automatic mechanical operation, and shortest path planning, which not only improves the cleanliness of the chips, reduces the generation of defective products, but also can improve production efficiency and reduce production costs. This has important application value for the semiconductor manufacturing industry, especially products with extremely high cleanliness requirements such as camera modules. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the steps of the automatic dust removal method for batch chips in an embodiment of the present application;

[0019] Figure 2 Schematic diagram of the internal architecture of a control device according to an embodiment of the present application.

[0020] The implementation, functional features and advantages of the present application will be further described in conjunction with embodiments with reference to the accompanying drawings. Specific embodiments

[0021] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present application, and should not be construed as a limitation of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present application.

[0022] In addition, if the description in the present application involves "first", "second", etc., it is only for descriptive purposes (such as for distinguishing the same or similar features), and should not be construed as indicating or implying its relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In addition, the technical solutions between the various embodiments may be combined with each other, but it must be based on the fact that those of ordinary skill in the art can implement them. When the combination of technical solutions appears to be contradictory or unable to be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0023] Referring to Figure 1 , in one embodiment, the automated dust removal method for a batch of chips includes:

[0024] Step S10: Place a plurality of cleaned chips into the detection area of a dust removal detector;

[0025] Step S20: Control a motion camera to take images of the chips in the detection area one by one; wherein, the motion camera takes images of each chip from all directions one by one, and after taking all the images of the same chip from all directions, then takes images of the next chip;

[0026] Step S30: After taking all the images of the same chip from all directions, synthesize all the images of the same chip to obtain a chip image of the same chip;

[0027] Step S40: After obtaining a chip image of each chip, use image recognition technology to detect stains on the chip image;

[0028] Step S50: If stains are detected on the chip, record the stain coordinates according to the chip position where the stains are located, and associate the stain coordinates with the chip area where the stains are located and the stain information, where the stain information includes the area size and color depth; and, control the manipulator to go to the dust removal rod placement area to pick up the dust removal rod and move it to the standby position;

[0029] Step S60: After completing the stain detection for all chips, starting from the standby position of the manipulator, connect all the stain coordinates in sequence and perform the shortest path planning to generate the dust removal trajectory;

[0030] Step S70: Control the manipulator to remove the stains on each chip one by one along the dust removal trajectory using the dust removal rod; among them, according to the force upper limit value of the chip area where each stain is located and the stain information, adjust the pressing force when the manipulator uses the dust removal rod to wipe the stains.

[0031] In this embodiment, the execution terminal of the embodiment can be a control device, or other devices or apparatuses that control the control device.

[0032] As described in step S10, after the chips produced in batches are cleaned by general cleaning equipment (such as a centrifugal cleaning machine and a deionized water washing machine), there may still be some tiny stains on the chip surface, which need to be further processed by an automated dust removal device.

[0033] Optionally, the washed chips can be transferred from the cleaning equipment to the detection area of the dust removal detector through a conveyor belt or other automated conveying devices. During the transfer process, it is necessary to ensure that the directions and positions of the chips are consistent to avoid collisions or stacking between the chips. Among them, the operator can place a cartridge loaded with multiple chips produced in the same batch into the relevant equipment, and then push each tray of chips from the cartridge into the conveyor belt through the feeding mechanism, and then the conveyor belt transfers the chips to the detection area of the dust removal detector.

[0034] Optionally, a lifting platform can be provided at the conveyor belt outlet of the detection area. The lifting platform is provided with multiple chip placement positions for receiving each chip to be detected and dust removed. Among them, the chips can be placed one by one on the corresponding positions of the lifting platform through a manipulator or a staff member wearing dust-proof gloves; each chip placement position of the lifting platform can also be provided with a vacuum hole, which can adsorb and fix each chip; the vacuum hole provides negative pressure through a vacuum pump to firmly adsorb the chip at the placement position to ensure that the chip will not shift during the detection and dust removal process.

[0035] Optionally, the lifting platform can lift a batch of chips to a shooting position suitable for the action camera to shoot.

[0036] The core task of step S10 is to safely and neatly place the cleaned chips into the detection area of the dust removal detector, preparing for subsequent image capture and stain detection. Through precise positioning, clean environment control, and automated or semi-automated chip placement methods, the stability and reliability of the chips during detection and dust removal can be ensured, thereby improving production efficiency and product quality.

[0037] As described in step S20, a motion camera takes all-round images of each chip in the detection area for subsequent stain detection.

[0038] The motion camera can use a high-resolution industrial camera, which can capture the minute details on the chip surface. Among them, the pixel and frame rate of the camera can be selected according to the size of the chip and the accuracy requirements of stain detection; the motion camera realizes multi-angle shooting through a motion control platform (such as an XY platform, a mechanical device that can move precisely in two mutually perpendicular directions (X direction and Y direction)).

[0039] In the detection area, the chips have been precisely placed in fixed positions through step S10. The motion camera can take images of the chips one by one according to the preset shooting sequence.

[0040] According to the arrangement order of the chips in the detection area, the motion camera first takes a picture of the first chip, and then moves to the next chip after completion. The control of the shooting sequence is completed by the control device to ensure that no chip is missed.

[0041] Among them, the motion camera needs to take images of multiple orientations of each chip, including the front and four sides. The number and position of the shooting angles are optimized according to the size and shape of the chip to ensure that every area on the chip surface can be covered.

[0042] After the motion camera completes the shooting of one orientation (such as the front), it adjusts its position through the motion control platform and moves to the next orientation (such as the side) for shooting. After all the orientation images of each chip are taken, the motion camera will move to the next chip.

[0043] The moving speed of the motion camera can be adjusted according to the size of the chip and the frame rate of the camera to ensure an efficient and stable shooting process.

[0044] The motion camera collects image data in real time during the shooting process and transmits it to the control system through a data cable. The captured image data is stored in the high-speed storage device of the control system, and a solid-state drive can be used to improve the reading and writing speed. The image files are named and classified according to the chip number and shooting orientation, facilitating subsequent stain detection and analysis.

[0045] The light source in the detection area needs to be stable, and the brightness, angle, and color temperature of the light source need to match the imaging characteristics of the action camera. Among them, a uniform LED light source can be used to avoid image shadows or overexposure caused by uneven light sources.

[0046] In step S20, the action camera takes images of each chip in the detection area one by one from multiple angles to ensure that the stains on the chip surface can be accurately captured.

[0047] As described in step S30, for each chip, a complete chip image is generated by synthesizing its images from different orientations to facilitate subsequent stain detection and analysis.

[0048] Read the multi-orientation image data of each chip taken in step S20 from the storage device. Since there may be slight position deviations during the shooting process, the images from different orientations need to be aligned to ensure the relative positions of the images are consistent.

[0049] Among them, use feature point matching or global alignment algorithms to align the images from different orientations to the same coordinate system.

[0050] Optionally, perform denoising on the captured images to reduce noise interference caused by the shooting environment or equipment. Among them, use filters (such as Gaussian filters, median filters) to smooth the images.

[0051] Perform geometric correction on the images to correct image deformation caused by lens distortion or shooting angle. For example, use a distortion correction algorithm (such as the undistort function in OpenCV) to correct the images.

[0052] Optionally, use a panoramic stitching algorithm (such as the OpenCV library in image stitching tools) to stitch the images from different orientations into a panoramic image. During the stitching process, the overlapping areas of the images need to be fused to ensure a smooth transition at the stitching points.

[0053] Or, perform fusion processing on the images from different perspectives to generate an image that comprehensively reflects the surface conditions of the chip. Among them, methods such as weighted average and maximum value fusion can be used to ensure that the synthesized image has rich details and no obvious stitching marks.

[0054] Optionally, perform contrast enhancement on the synthesized image to improve the visual effect of the image and make details such as stains more obvious. Among them, methods such as histogram equalization and adaptive histogram equalization can be used for enhancement.

[0055] Optionally, use a color correction algorithm to adjust the RGB components of the image and correct the color of the synthesized image to ensure that the hue and brightness of the image are uniform.

[0056] In step S30, by synthesizing all azimuth images of the same chip, an image comprehensively reflecting the surface condition of the chip is generated, providing high-quality image data for subsequent stain detection and analysis.

[0057] As described in step S40, for each chip image generated in step S30, image recognition technology is used to detect and analyze the stains on the chip surface. This process aims to identify whether there are stains on the chip surface and accurately locate and classify their positions, sizes, and types, providing a basis for subsequent stain treatment.

[0058] Obtain the synthesized chip image from step S30 as the input data for stain detection.

[0059] Optionally, convert the color image to a grayscale image to simplify the image processing process and reduce the computational complexity.

[0060] Optionally, perform binarization on the grayscale image to convert the image into a black-and-white binary image for easy extraction of the stain area. Among them, a threshold segmentation algorithm (such as the Otsu algorithm, adaptive threshold) is used to determine the binarization threshold.

[0061] Perform edge detection on the grayscale image to extract the edge information of the chip surface structure, providing a reference for stain detection. Among them, the Canny edge detection algorithm is used to identify the edge features in the chip image.

[0062] Optionally, perform enhancement processing on the grayscale image or binary image to improve the contrast and visibility of the stain area. Among them, methods such as histogram equalization and sharpening filters are used to enhance the image details.

[0063] Optionally, use morphological operations (such as erosion, dilation, opening operation, closing operation) to process the binary image to extract the stain area. Morphological operations can remove the noise in the image while retaining the shape and size of the stain.

[0064] Optionally, through the region growing algorithm, select seed points from the image and gradually grow regions similar to the seed points to identify the stain area. Among them, the region growing algorithm is suitable for the detection of stains with irregular shapes.

[0065] Optionally, perform connected component analysis on the binary image to identify and label the connected components (i.e., possible stain areas) in the image. Among them, the four-connected or eight-connected algorithm is used to label the stain area and calculate its area and position.

[0066] Alternatively, use a pre-trained convolutional neural network model to extract features and detect stains in the chip image; or, use an object detection algorithm to locate and classify the stains in the chip image. The object detection algorithm can simultaneously identify multiple stains and provide their location and category information.

[0067] Optionally, use an image segmentation algorithm (such as U-Net, Mask R-CNN) to accurately segment the stain area in the chip image. The image segmentation algorithm can generate pixel-level annotations of the stain area, improving the detection accuracy.

[0068] Optionally, set appropriate detection thresholds according to the characteristics of the stains on the chip surface to ensure the sensitivity and specificity of the detection.

[0069] Optionally, mark the detected stain area on the chip image, indicating its location, size, and type. Different colors or borders can be used to mark the stain area for subsequent visual inspection and processing.

[0070] Optionally, classify the stains into different types according to their characteristics (such as color, shape, material), such as particulate matter, liquid residue, oxide, etc.

[0071] Step S40 performs stain detection on the chip image through image recognition technology, accurately identifies the stain area on the chip surface, and analyzes its location, size, and type.

[0072] As described in step S50, for the chips detected with stains in step S40, it is necessary to accurately record the location information of the stains, associate it with the area information of the chips, and control the manipulator to prepare for the dust removal operation.

[0073] Record the chips with stains, and use the specific position of the chip in the detection area as the stain coordinates. Each chip has a specific position in the detection area, which can be represented by a coordinate system. At the same time, taking a reference point (such as the lower left corner or the center point) of the detection area as a reference, record the specific position coordinates of the chip, and this position coordinate will be used as the reference point for the subsequent stain coordinates to record the chip area where the stain is located.

[0074] Optionally, associate the stain coordinates with the chip area, area size, and color depth where the stain is located.

[0075] Optionally, according to the physical position of the chip, the chip can be divided into multiple functional areas (such as the core area, I / O area, etc.). The stress sensitivity of different areas is different, which will affect the subsequent adjustment of the dust removal intensity.

[0076] The area size of the stain determines the dust removal force to be applied. Larger stains require stronger cleaning force, while smaller stains can use lighter force (e.g., the upper limit of the force in the core area is less than that in the I / O area); the darkness of the stain color reflects the stubbornness of the stain. Darker stains may be more difficult to remove and require more cleaning times or greater force.

[0077] Optionally, the system will generate a stain record table, which includes information such as stain coordinates, the area it belongs to, area size, and color darkness. This record table will be used for subsequent dust removal operations and quality control.

[0078] When detecting the stains on the chip, it is necessary to control the manipulator to move to the dust removal rod placement area to prepare for clamping the dust removal rod. Among them, the manipulator can move between the dust removal rod placement area and the detection area of the dust removal detector.

[0079] Among them, a vision system can be used to assist the manipulator in clamping the dust removal rod to ensure the accuracy of clamping. For example, control the jaws of the manipulator to accurately move above the dust removal rod, and then lower and clamp the dust removal rod. After clamping the dust removal rod, the manipulator needs to move to a predetermined standby position to prepare for the dust removal operation. The standby position is usually a safe position to ensure that the manipulator will not interfere with the chip or other devices before dust removal.

[0080] Step S50 prepares for subsequent dust removal operations by recording the stain coordinates of the detected stained chips and controlling the manipulator.

[0081] As described in step S60, after completing the stain detection of all chips, the system needs to collect the coordinate information of all stains and generate a stain list.

[0082] Each item in the stain list includes information such as the coordinates of the stain, the chip area where it is located, area size, and color darkness. At the same time, record the coordinate of the standby position of the manipulator as the starting point of the shortest path planning.

[0083] Optionally, use the shortest path planning algorithm (such as Dijkstra algorithm or A* algorithm) to generate the optimal dust removal trajectory. The input includes the standby position coordinates and all stain coordinates, and the output is the shortest path starting from the standby position, passing through all stain coordinates in sequence, and returning to the standby position or the end point.

[0084] Generate a detailed dust removal trajectory according to the path generated by the shortest path planning algorithm. The dust removal trajectory includes the order of each stain coordinate, the movement path of the manipulator, and the cleaning order of each stain.

[0085] After generating the dust removal trajectory, the number of dust removal rods to be replaced can also be calculated based on the total area of the stains to be cleaned and the upper limit of the cleaning area of a single dust removal rod, and the number of times the robotic arm needs to return to the dust removal rod placement area during the process can be obtained. On this basis, combined with the position of the dust removal rod placement area, the dust removal trajectory is updated and adjusted.

[0086] Among them, according to the specifications and usage conditions of the dust removal rods, the maximum area that each dust removal rod can clean is determined. Calculate the number of dust removal rods to be replaced:

[0087] The number of replacements required = ⌈total area to be cleaned / upper limit of the cleaning area of a single dust removal rod⌉;

[0088] Among them, ⌈x⌉ represents rounding up.

[0089] That is, the number of times the robotic arm returns to the dust removal rod placement area during the process is obtained.

[0090] According to the stain coordinates, all stains are sorted by position. When planning the dust removal trajectory, according to the number of dust removal rods to be replaced, the number of times and the specific positions of the robotic arm returning to the dust removal rod placement area during the process are determined.

[0091] That is, in the dust removal trajectory, a path segment for the robotic arm to return to the dust removal rod placement area is inserted. For example, if one dust removal rod needs to be replaced, a suitable intermediate position is selected in the dust removal trajectory to insert a path segment returning to the dust removal rod placement area. Combined with the position of the dust removal rod placement area, the dust removal trajectory is updated and adjusted, that is, combined with the path segment of the mid - journey return, the shortest path of the robotic arm is re - planned to ensure the shortest total movement distance. According to the re - planned path, the dust removal trajectory is adjusted to ensure that each step is optimized.

[0092] Assume:

[0093] The total area of the stains to be cleaned is 100 square millimeters, the upper limit of the cleaning area of a single dust removal rod is 40 square millimeters; the position of the dust removal rod placement area is (0, 0); the coordinate positions of all stains are (10, 10), (20, 20), (30, 30), (40, 40), (50, 50).

[0094] The number of replacements required = ⌈100 / 40⌉ = 3.

[0095] Assume that each time the dust removal rod is replaced, it can clean 40 square millimeters. Then, it is necessary to return the dust removal rod placement area when 40 square millimeters and 80 square millimeters have been cleaned. According to the stain distribution, if the total stain area at the first and second positions does not exceed 40 square millimeters, and the total stain area at the first, second, and third positions exceeds 40 square millimeters, then it is possible to return once after cleaning the positions (10, 10) and (20, 20); if the stain area at the third position does not exceed 40 square millimeters, the total stain area at the third and fourth positions exceeds 40 square millimeters, and the total stain area at the fourth and fifth positions does not exceed 40 square millimeters, then it is possible to return once after cleaning the position (30, 30).

[0096] Among them, use the shortest path algorithm (such as Dijkstra's algorithm) to recalculate the total movement path of the manipulator to ensure the shortest total movement distance. This can effectively optimize the dust removal trajectory of the manipulator, reduce ineffective movements, and improve the dust removal efficiency.

[0097] As described in step S70, control the manipulator to move along the generated dust removal trajectory, and use the dust removal rod to remove the stains on each chip one by one. According to the force limit value and stain information of each stain, dynamically adjust the pressing force of the manipulator.

[0098] According to the dust removal trajectory generated in step S60, the control system moves the manipulator along the predetermined path to the coordinate position of each stain in turn.

[0099] After the manipulator reaches the coordinates of each stain, the control system will control the manipulator to use the dust removal rod to remove the stains in the corresponding chip area.

[0100] Among them, each chip area has a force limit value, which represents the maximum pressure that can be borne in this area. Exceeding this pressure may cause chip damage.

[0101] Optionally, according to the area size and color depth of the stain, the system needs to adjust the pressing force of the manipulator. For example, stubborn stains with a darker color may require a greater pressing force, while stains with a lighter color can use a smaller pressing force.

[0102] Optionally, set the proportionality coefficient of the pressing force according to the stain area and color depth. For example, the larger the stain area, the greater the corresponding pressing force; the darker the color, the greater the corresponding pressing force.

[0103] Among them, set the upper limit constraint to ensure that the calculated pressing force does not exceed the force limit of this chip area. The algorithm example is as follows:

[0104] Pressing force = basic pressure + (area coefficient × stain area) + (color coefficient × color depth).

[0105] Among them, the base pressure is a default value, and the area coefficient and color coefficient are parameters determined through experiments.

[0106] Optionally, if the calculated pressing force is less than or equal to the upper limit of the force borne, the calculated pressing force is directly adopted; if the calculated pressing force is greater than the upper limit of the force borne, a value less than the upper limit of the force borne is set as the pressing force parameter.

[0107] The control system adjusts the pressing force of the manipulator in real time according to the upper limit of the force borne by each stain and the stain information. A force feedback system or a pressure sensor can be used to ensure that the pressing force of the manipulator is appropriate when erasing the stain, neither damaging the chip nor effectively removing the stain.

[0108] Optionally, after the dust removal rod is used multiple times, the system can automatically detect the cleanliness of the dust removal rod and automatically replace it with a new one when necessary to ensure the dust removal effect. Among them, a vision system can be used to assist in detecting the cleanliness of the dust removal rod, and the dust removal rod can be automatically replaced by the manipulator.

[0109] During the dust removal process, the system can monitor the pressing force of the manipulator and the dust removal effect in real time. If it is detected that the pressing force exceeds the upper limit of the force borne or the dust removal effect is not ideal, the system can adjust the pressing force of the manipulator in real time.

[0110] In one embodiment, through the combination of image recognition, automated mechanical operation, and shortest path planning, efficient and precise automated dust removal of batch chips is achieved, which not only improves the cleanliness of the chips, reduces the generation of defective products, but also improves production efficiency and reduces production costs. This has important application value for the semiconductor manufacturing industry, especially for products with extremely high cleanliness requirements such as camera modules.

[0111] In one embodiment, on the basis of the above embodiment, the automated dust removal method for batch chips further includes:

[0112] When the stain area is greater than or equal to the preset area, during the process of the dust removal rod wiping the stain once by the manipulator control, after the dust removal rod contacts the chip surface with the first pressing force, the pressing force is gradually increased, and the dust removal rod is rolled towards the center point of the stain until the dust removal rod reaches the center point of the stain with the second pressing force; among them, the second pressing force is the upper limit of the force borne by the chip area;

[0113] While controlling the dust removal rod to continue rolling forward from the center point of the stain, the pressing force is gradually decreased until the dust removal rod leaves the stain area with the first pressing force;

[0114] Among them, during the process of controlling the rolling of the dust removal rod, the rolling speed is adjusted according to the color depth of the stain within the preset speed range.

[0115] In this embodiment, a more sophisticated dust removal strategy is introduced for larger stains (area greater than or equal to the preset area), that is, by adjusting the pressing force and rolling speed of the dust removal rod, large-area stains can be removed more effectively while protecting the chip from damage caused by excessive pressure.

[0116] For the detected stain, if its area is greater than or equal to the preset threshold, the system will recognize that it is a stain of a larger area and requires special processing methods.

[0117] The robot will accurately position the dust removal rod to the edge of the stain based on the recorded chip location of the stain.

[0118] The dust removal rod first contacts the chip surface with a first pressing force, and this pressure value is pre-set to ensure that no damage is caused to the chip. The first pressing force can be a pre-set or calculated pressing force that is less than the upper limit of the force.

[0119] After the dust removal stick touches the surface, it will gradually increase the pressing force while rolling towards the center of the stain. When the dust removal stick reaches the center of the stain, the pressing force reaches the second pressing force, which is the upper limit of the force in the chip area to ensure that it does not exceed the chip's bearing capacity. This gradual pressurization method helps to gradually and deeply remove the stain and avoid applying too much pressure at one time.

[0120] After that, the dust removal rod continues to roll forward from the center point while gradually reducing the pressing force until it leaves the stained area with the first pressing force. This ensures that no unnecessary pressure is applied to the chip surface after cleaning is completed.

[0121] As the dust removal rod rolls, its speed will be adjusted within a preset speed range. The system can also adjust the rolling speed accordingly based on the color of the stain, such as slowing down for darker stains to ensure more thorough cleaning, and speeding up for lighter stains to improve cleaning efficiency.

[0122] Optionally, within a preset speed range, the higher the color depth, the slower the speed. A speed range is pre-set to allow the dust removal rod to roll and clean within a certain speed range.

[0123] By gradually increasing pressure and then reducing pressure from the edge to the center, a large area of ​​stains can be effectively removed to ensure that the stains are completely removed. At the same time, while controlling the dust removal rod to gradually leave the stained area, the gradual reduction of pressure can avoid vibration or impact caused by the dust removal rod losing contact with the chip surface, which can effectively reduce the mechanical stress on the chip surface and protect the chip surface from damage.

[0124] Meanwhile, adjust the rolling speed according to the color depth of the stain, which can optimize the cleaning for different pollution levels and improve the cleaning effect.

[0125] In one embodiment, based on the above embodiment, the automated dust removal method for the batch of chips further includes:

[0126] When the stain area is smaller than the preset area, the dust removal rod is controlled by the manipulator to wipe the stain area horizontally at a predetermined speed;

[0127] Among them, the pressing force used during horizontal wiping is less than the upper limit of the force on the chip area; the predetermined speed is set according to the color depth of the stain.

[0128] In this embodiment, when the stain area is smaller than the preset area, the manipulator controls the dust removal rod to perform horizontal wiping cleaning. Horizontal wiping means that the dust removal rod moves horizontally in the stain area with a relatively low pressing force, rather than rolling. The pressing force used during horizontal wiping should be less than the upper limit of the force on the chip area to ensure that the chip is not damaged.

[0129] Optionally, according to the color depth of the stain, it can be adjusted within a preset pressure range. For example, for stains with a darker color, the pressing force can be appropriately increased, but not exceeding the upper limit; for stains with a lighter color, the pressing force can be appropriately reduced.

[0130] Preset a speed range, and the speed of the dust removal rod during horizontal wiping in the stain area should be adjusted according to the color depth of the stain. The higher the color depth, the slower the speed: for stains with a darker color, the horizontal wiping speed of the dust removal rod should be slower to ensure that the stain is completely removed; for stains with a lighter color, the horizontal wiping speed of the dust removal rod can be increased to improve the cleaning efficiency.

[0131] For example, for stains with a darker color, the pressing force can be set to 90% of the upper limit; for stains with a lighter color, the pressing force can be set to 70% of the upper limit; for stains with a darker color, the horizontal wiping speed can be set to 10 mm / s; for stains with a lighter color, the horizontal wiping speed can be set to 30 mm / s.

[0132] For small-area stains, the horizontal wiping cleaning method can complete the cleaning task more quickly and efficiently. Adjust the pressing force and speed according to the color depth of the stain to ensure the maximization of the cleaning effect.

[0133] By adopting the horizontal wiping cleaning method when dealing with small-area stains and dynamically adjusting the pressing force and speed according to the color depth of the stain, the cleaning effect can be significantly improved, while protecting the chip surface from damage. This refined control method is particularly suitable for high-precision manufacturing environments with extremely high requirements for cleanliness.

[0134] In one embodiment, based on the above embodiment, after the step of controlling the manipulator to remove the stains on each chip one by one along the dust removal trajectory using the dust removal rod, the following steps are further included:

[0135] After erasing the stains at all stain coordinates, control the moving camera to take a re-inspection image for each stain coordinate along the dust removal trajectory;

[0136] Detect whether the chip stains have been successfully erased based on the re-inspection image;

[0137] If so, determine the corresponding chip as a qualified product;

[0138] If not, control the manipulator to use the dust removal rod to perform a stain erasing operation on the corresponding chip again.

[0139] In this embodiment, in order to ensure that the stains on each chip are completely removed, a re-inspection mechanism is introduced. After the manipulator completes the erasing operation at all stain coordinates, the moving camera takes a re-inspection shot at each stain coordinate position to check whether the stains have been successfully removed. If it is found that there are still stains, the manipulator will be controlled to perform the erasing operation again.

[0140] After erasing the stains at all stain coordinates, control the moving camera to take a re-inspection image for each stain coordinate along the dust removal trajectory. After the manipulator completes all stain erasing, the moving camera moves along the same dust removal trajectory to take pictures at each stain coordinate position.

[0141] At each stain coordinate position, take a re-inspection image to check whether the stains have been successfully removed. Based on the re-inspection image, use image recognition technology to detect whether the chip stains have been successfully erased.

[0142] Optionally, if the re-inspection image shows that the stains have been successfully erased, determine the corresponding chip as a qualified product.

[0143] Optionally, if the re-inspection image shows that the stains have not been successfully erased, control the manipulator to use the dust removal rod to perform a stain erasing operation on the corresponding chip again. For example, control the manipulator to move to the position where the stain has not been removed again and use the dust removal rod to perform an additional erasing operation.

[0144] Optionally, for stains that are difficult to remove, multiple cleaning attempts can be set, and re-inspection is performed after each cleaning until the stains are removed or the maximum number of cleaning times is reached; if the stains are still not removed after multiple cleaning attempts, the system can mark the chip as unqualified and handle it separately.

[0145] After the manipulator completes all stain erasure operations, a motion camera is used to perform a re-inspection shot, and based on the re-inspection images, it is judged whether the stains have been successfully removed, which can effectively improve the cleaning quality and ensure that each chip meets the cleaning standard. For the stains that are not cleaned thoroughly, by controlling the manipulator to perform the erasure operation again, a closed-loop management of the cleaning process is achieved, improving production efficiency and product quality.

[0146] In one embodiment, based on the above embodiment, the step of controlling the manipulator to use a dust removal rod to perform the stain erasure operation on the corresponding chip again includes:

[0147] Remove the stain coordinates associated with the chips determined to be qualified products from the dust removal trajectory and update the dust removal trajectory;

[0148] Based on the updated dust removal trajectory, control the manipulator to use a dust removal rod to uniformly perform the stain erasure on the chips where the stains have not been successfully erased again.

[0149] In this embodiment, during the re-inspection process, if it is found that the stains on some chips have not been successfully erased, the system will update the dust removal trajectory and only perform the erasure operation on the chips with uncleaned stains again. This can improve the cleaning efficiency and reduce unnecessary operations.

[0150] After the re-inspection is completed, the system will delete all the stain coordinates determined to be qualified products from the original dust removal trajectory. Then, based on the remaining uncleaned stain coordinates, a new dust removal trajectory is regenerated to ensure that the manipulator only operates on the chips with uncleaned stains, avoiding repeated cleaning of the qualified chips and improving the efficiency.

[0151] Based on the updated dust removal trajectory, control the manipulator to use a dust removal rod to uniformly perform the stain erasure on the chips where the stains have not been successfully erased again. That is, the manipulator moves to the positions of the chips with uncleaned stains in sequence according to the updated dust removal trajectory, and at the same time uses a dust removal rod to perform a unified cleaning operation on each chip with uncleaned stains.

[0152] Among them, according to the force upper limit value and stain information (area size and color depth) of each uncleaned stain, the pressing force of the manipulator is dynamically adjusted to ensure the cleaning effect. Ensure that the uncleaned stains can be completely removed, while reducing unnecessary operations and improving the cleaning efficiency.

[0153] By updating the dust removal trajectory, the system can perform centralized cleaning on the chips with uncleaned stains, avoiding repeated operations and improving the cleaning efficiency. At the same time, through multiple cleanings and re-inspections, it is ensured that all stains are completely removed, improving the product quality. This combines dynamic path planning, precise cleaning, and automated closed-loop management, and is especially suitable for the high-precision manufacturing field with extremely high requirements for cleanliness.

[0154] In one embodiment, based on the above embodiment, after the step of detecting whether the stain on the chip for re-inspection image has been successfully erased, the following steps are further included:

[0155] When a chip with a stain that has not been successfully erased is detected, it is detected whether the dust removal round has reached a preset round;

[0156] If the dust removal round has not reached the preset round, then execute the step of controlling the manipulator to use a dust removal rod to perform the stain erasing operation on the corresponding chip again;

[0157] If the dust removal round has reached the preset round, then a chip with an unchanged stain before and after erasure is determined as a product to be confirmed; a chip with a changed stain before and after erasure is determined as a non-conforming product; and, end the automated dust removal operation for the current batch of chips.

[0158] In this embodiment, the system will record the dust removal round of each chip. After each cleaning operation, the round counter is incremented by one. When a chip with an uncleaned stain is detected, the system will check whether the current dust removal round has reached the preset round.

[0159] If the dust removal round has not reached the preset round, then execute the step of controlling the manipulator to use a dust removal rod to perform the stain erasing operation on the corresponding chip again.

[0160] If the dust removal round has reached the preset round, then a chip with an unchanged stain before and after erasure is determined as a product to be confirmed; a chip with a changed stain before and after erasure is determined as a non-conforming product; and, end the automated dust removal operation for the current batch of chips.

[0161] Among them, for a chip with an unchanged stain after multiple cleanings, the system determines it as a product to be confirmed, and such chips may require manual inspection or further processing; for a stain that has changed but not been completely removed after multiple cleanings, the system determines it as a non-conforming product.

[0162] In this way, by setting a preset round, it is possible to prevent the system from infinitely attempting to clean, avoiding resource waste and mechanical wear. The setting of the round can be adjusted according to the actual production situation to flexibly handle different types of stains.

[0163] By detecting the change of the stain before and after erasure, the chips are accurately classified to avoid misjudgment. For chips that are difficult to judge, they are marked as products to be confirmed, which is convenient for manual inspection or subsequent processing.

[0164] In one embodiment, by detecting whether the dust removal round has reached the preset round, the system can dynamically adjust the cleaning strategy, reduce unnecessary operations, and improve the cleaning efficiency. For chips that have reached the preset round, the system will classify and process them according to the change of the stain.

[0165] In one embodiment, based on the above embodiment, the automated dust removal method for the batch of chips further includes:

[0166] Generating the dust removal results for each chip and displaying the dust removal results on a relevant display device; and sorting the qualified products, unqualified products, and products to be confirmed, and conveying the qualified products to the downstream equipment of the dust removal detector or storing them in a cartridge, conveying the unqualified products to the manual dust removal area, and conveying the products to be confirmed to the manual inspection area.

[0167] In this embodiment, the system will record the cleaning times, stain information (position, area, color, etc.), and re-inspection results of each chip. Based on the cleaning history, a dust removal result report for each chip is generated, including the following content: chip number or unique identifier, stain removal situation (removed, not removed, partially removed), and final judgment result (qualified product, unqualified product, product to be confirmed).

[0168] It should be understood that chips that are not found to have stains during the initial image inspection can be directly determined as qualified products.

[0169] Optionally, the dust removal results are displayed in real time on a display screen, an industrial control computer, or a mobile device on the production line. The display content may include: the cleaning statistical information of the current batch of chips (qualified rate, unqualified rate, rate to be confirmed), the detailed cleaning results of each chip (number, cleaning times, judgment result), and the prompt information of abnormal chips (such as the chip number and position of the chips with stains not removed).

[0170] Optionally, a manipulator, a conveyor belt, or a sorting robot is used to classify the chips according to the judgment results of the chips. Among them, the chips determined to be qualified products are directly conveyed to the downstream equipment or stored in a cartridge; the chips determined to be unqualified products are conveyed to the manual dust removal area for further processing; the chips determined to be products to be confirmed are conveyed to the manual inspection area for manual inspection.

[0171] By generating the dust removal results and displaying them on relevant devices, and sorting and conveying the qualified products, unqualified products, and products to be confirmed, the system realizes the high efficiency, transparency, and traceability of the production process. This solution combines automated cleaning, precise classification, and real-time monitoring, and is particularly suitable for the high-precision manufacturing field with extremely high requirements for cleanliness and production efficiency.

[0172] In addition, an embodiment of the present application also provides a control device, and the internal architecture of the control device can be as Figure 2As shown, it includes a processor, a memory, a communication interface, and an input interface connected by a system bus. Among them, the processor is used to provide computing and control capabilities. The memory includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system, a computer program, and a database. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The database is used to store data called by the computer program. The communication interface is used to communicate with an external terminal for data. The input interface is used to receive signals input by an external device. When the computer program is executed by the processor, it implements an automated dust removal method for batch chips as described in the above embodiments.

[0173] Those skilled in the art can understand that Figure 2 the structure shown in is only a block diagram of a part of the structure related to the solution of the present application, and does not constitute a limitation on the control device to which the solution of the present application is applied. For example, in some alternative embodiments, the control device may further include an output interface (not shown in the figure), and the output interface is also connected to the system bus and is used to output corresponding signals to external devices.

[0174] In addition, an embodiment of the present application also provides a dust removal detector, which includes a control device, a motion camera, and a manipulator. The motion camera and the manipulator are both communicatively connected to the control device and are controlled by the control device. The specific structure of the control device refers to the above embodiments. Since this dust removal detector adopts all the technical solutions of the above embodiments, it at least has all the technical effects brought by the technical solutions of the above embodiments, and will not be elaborated here one by one.

[0175] In addition, the present application also proposes a computer-readable storage medium, which includes a computer program. When the computer program is executed by a processor, it implements the steps of the automated dust removal method for batch chips as described in the above embodiments. It can be understood that the computer-readable storage medium in this embodiment can be a volatile readable storage medium or a non-volatile readable storage medium.

[0176] In summary, for the automated dust removal method, control device, dust removal detector, and computer-readable storage medium provided in the embodiments of the present application, by combining image recognition, automated mechanical operation, and shortest path planning, efficient and precise automated dust removal of batch chips is achieved. This not only improves the cleanliness of the chips, reduces the generation of defective products, but also can improve production efficiency and reduce production costs. This has important application value for the semiconductor manufacturing industry, especially products with extremely high cleanliness requirements such as camera modules.

[0177] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium provided in this application and used in the embodiments can include non-volatile and / or volatile memories. Non-volatile memories can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memories can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in various forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0178] It should be noted that in this article, the term "including", "comprising", or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, apparatus, article, or method including a series of elements not only includes those elements but also includes other elements not explicitly listed, or further includes elements inherent to such process, apparatus, article, or method. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of another identical element in the process, apparatus, article, or method including that element.

[0179] The above are only the preferred embodiments of this application, and do not limit the patent scope of this application accordingly. Any equivalent structure or equivalent process transformation made by using the specification and drawings of this application, or directly or indirectly applied in other related technical fields, shall be equally included in the patent protection scope of this application.

Claims

1. An automated dust removal method for batch chips, characterized in that: include: Place the cleaned chips into the detection area of ​​the dust removal detection machine; Controlling the motion camera to take images of the chips in the detection area one by one; wherein the motion camera takes images of each direction of each chip one by one, and after taking images of all directions of the same chip, takes images of the next chip; After all the orientation images of the same chip are obtained by shooting, all the orientation images of the same chip are synthesized to obtain a chip image of the same chip; Each time a chip image of a chip is obtained, the chip image is subjected to stain detection using image recognition technology; If stains are detected on the chip, the stain coordinates are recorded according to the chip position where the stain is located, and the stain coordinates are associated with the chip area where the stain is located and the stain information, wherein the stain information includes the area size and color depth; and the robot is controlled to go to the dust removal rod placement area to clamp the dust removal rod and move it to the standby position; After completing the stain detection on all chips, the robot's standby position is used as the starting point to connect all the stain coordinates in sequence, and the shortest path planning is performed to generate the dust removal trajectory; The robot is controlled to remove chip stains one by one along the dust removal track using a dust removal rod; wherein, according to the force upper limit value and stain information of the chip area where each stain is located, the pressing force of the robot when using the dust removal rod to wipe the stain is adjusted; the automated dust removal method for batch chips also includes: When the stain area is greater than or equal to the preset area, the dust removal rod is controlled by the robot to perform a single wipe of the stain, so that the dust removal rod contacts the chip surface with a first pressing force, and then gradually increases the pressing force, and rolls the dust removal rod toward the center of the stain until the dust removal rod reaches the center of the stain with a second pressing force; wherein the second pressing force is the upper limit of the force of the chip area; while controlling the dust removal rod to continue rolling forward from the center of the stain, the pressing force is gradually reduced until the dust removal rod leaves the stain area with the first pressing force, so as to reduce the mechanical stress generated by the dust removal rod on the chip surface; wherein, in the process of controlling the dust removal rod to roll, the rolling speed is also adjusted within the preset speed range according to the color depth of the stain; When the stain area is smaller than the preset area, the dust removal rod is controlled by the robot to wipe the stain area at a preset speed; wherein the pressing force used during the wiping is smaller than the upper limit of the force of the chip area; and the preset speed is set according to the color depth of the stain.

2. The automated dust removal method for batch chips according to claim 1, characterized in that: After the step of controlling the manipulator to remove chip stains one by one along the dust removal track using the dust removal rod, the method further includes: After the stain erasure of all stain coordinates is completed, the motion camera is controlled to take a re-inspection image for each stain coordinate along the dust removal track; Detect whether the chip stains have been successfully erased based on the re-inspection image; If yes, the corresponding chip is judged as qualified; If not, the robot arm is controlled to use the dust removal rod to perform the stain erasing operation on the corresponding chip again.

3. The automated dust removal method for batch chips according to claim 2, characterized in that: The step of controlling the manipulator to use the dust removal rod to perform a stain erasing operation on the corresponding chip again comprises: The contamination coordinates associated with the chip determined as a qualified product are removed from the dust removal track, and the dust removal track is updated; Based on the updated dust removal trajectory, the robot is controlled to use the dust removal rod to uniformly erase the stains on the chips that have not been successfully erased.

4. The automated dust removal method for batch chips according to claim 2 or 3, characterized in that: After the step of detecting whether the chip stains are successfully erased based on the re-inspection image, the method further includes: When it is detected that there is a chip whose stains have not been successfully erased, it is detected whether the dust removal rounds have reached the preset rounds; If the dust removal rounds do not reach the preset rounds, the step of controlling the manipulator to use the dust removal rod to perform the stain erasing operation on the corresponding chip again is executed; If the dust removal rounds have reached the preset rounds, the chips whose stains have not changed before and after erasure are determined as pending products; the chips whose stains have changed before and after erasure are determined as unqualified products; and the automated dust removal operation of the current batch of chips is terminated.

5. The automated dust removal method for batch chips according to claim 4, characterized in that: The automated dust removal method for batch chips also includes: Generate dust removal results for each chip and display the dust removal results on relevant display devices; sort qualified products, unqualified products and products to be confirmed, and transport qualified products to downstream equipment of the dust removal inspection machine or store them in material boxes, transport unqualified products to the manual dust removal area, and transport unqualified products to the manual inspection area.

6. A control device, characterized in that: The control device includes a memory, a processor, and a computer program stored in the memory and executable on the processor. When the computer program is executed by the processor, the steps of the automated dust removal method for batch chips as described in any one of claims 1 to 5 are implemented.

7. A dust removal detection machine, characterized in that: The dust removal detection machine includes a control device, a motion camera and a manipulator, and the motion camera and the manipulator are both connected to the control device in communication and are controlled by the control device; the control device is the control device as described in claim 6.

8. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the automated dust removal method for batch chips according to any one of claims 1 to 5 are implemented.

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