Positioning piece, wafer positioning device and wafer detection equipment

Abstract

The utility model relates to the technical field of semiconductor front channel detection, and relates to a wafer placing table, in particular to a positioning piece, a wafer positioning device and wafer detection equipment. Comprising a positioning seat, a base, a positioning shaft and a positioning sleeve movably sleeved on the positioning shaft, the protruding part is formed in the center position of the upper end face of the positioning sleeve and extends in the axial direction and the circumferential direction, the protruding part and the positioning sleeve are coaxially arranged, and a containing position is formed by the protruding part and the upper end face of the positioning sleeve; external force is provided for the driven disc to enable the driven disc to rotate relative to the fixed disc, and the plurality of positioning pieces are driven to move in opposite directions through the rotating motion of the driven disc, so that the size change of a positioning plane is realized, the transfer placement of a wafer to be detected on a machine table is realized, and the handover of the wafer is realized. And a corresponding structure is arranged on the positioning piece, so that the wafer can be positioned. The complexity of mechanism movement is reduced, and the overall control accuracy of the mechanism is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor front-end detection, and relates to a wafer placement table, in particular to a positioning member, a wafer positioning device and a wafer detection device. Background Art

[0002] In the prior art of wafer detection equipment, most of the time when the wafer is transferred from the EFEM robot to the workpiece table of the detection equipment, pin needles are used for transfer, that is, a plurality of pins that can move in the vertical direction are arranged around the chuck of the workpiece table. When the pins rise, they catch the wafer transmitted by the EFEM, and then descend to place the wafer on the chuck. This method can only perform material transfer, and the position of the wafer on the chuck mainly depends on the movement accuracy of the EFEM robot and the workpiece table, etc. Summary of the Invention

[0003] In view of this, an object of the present invention is to provide a positioning member, a wafer positioning device and a wafer detection device, which can realize the transfer and positioning of the wafer.

[0004] In a first aspect, a positioning member is provided, including: a positioning shaft and a horizontal end surface connected to one end of the positioning shaft, the positioning shaft being eccentric with respect to the end surface; a protruding portion is formed by extending axially and circumferentially at the center position of the end surface, the horizontal cross-sectional area of the protruding portion is smaller than the horizontal cross-sectional area of the end surface, and the protruding portion and the end surface form a placement position.

[0005] In some specific implementation manners, the positioning shaft includes a first shaft body and a second shaft body, the first shaft body is connected to the end surface, the second shaft body is connected to the first shaft body, and the second shaft body is eccentric with respect to the first shaft body.

[0006] In some specific implementation manners, the end surface is the upper end surface of a positioning sleeve sleeved on the first shaft body, and the positioning sleeve can rotate axially along the positioning shaft.

[0007] In some specific implementation manners, a through hole communicating with the first shaft body is opened on the side end of the positioning sleeve for fixing the relative position between the positioning sleeve and the first shaft body through an external fixing member.

[0008] In some specific implementation manners, a through hole is opened at the tail end of the second shaft body for realizing an active connection with an external fixing member through a fastening screw. A through hole is opened on the base for realizing an active connection with an external fixing member through a fastening screw.

[0009] In a second aspect, a wafer positioning device is provided, including: a fixed disk and a driven disk that are connected to each other and coaxially arranged, and the driven disk can rotate relative to the fixed disk by an external force; at least three positioning members as described in any one of the above, and at least three positioning members move along with the driven disk, and through the rotational movement of the driven disk, they can move towards each other relative to the center of the fixed disk. Based on the area-variable positioning space formed between the three protruding portions, and the sides of the three protruding portions selectively contact the edge of the wafer, and the placement position selectively contacts the bottom surface of the wafer; the movement towards each other includes moving towards each other and moving away from each other.

[0010] In some specific implementation manners, the positioning member is connected to the driven disk through a connecting member.

[0011] In some specific implementation manners, the connecting member includes an L-shaped connecting rod, a through hole for the second shaft body to pass through is opened at the end of the long side of the connecting rod, the connecting rod and the second shaft body are movably connected through a fastening screw, and the short side of the connecting rod is connected to the driven disk.

[0012] In some specific implementation manners, a limiting channel is provided on the fixed disk, the positioning member is arranged in the limiting channel, and moves synchronously relative to the fixed disk in the limiting channel.

[0013] In some specific implementation manners, the limiting channel is an arc-shaped structure.

[0014] In some specific implementation manners, the power component includes any one of a lead screw stepping motor and a linear motor. The power component outputs a force in the linear motion direction and drives the driven disk to rotate.

[0015] In a second aspect, a wafer detection device is provided, including the wafer positioning device as described in any one of the above, and further including a carrying device; the carrying device includes a carrying shaft and a carrying table provided at the upper end of the carrying shaft. Channels are opened in the driven disk and the fixed disk, the carrying shaft passes through the channels, and the carrying table is placed above the fixed disk; a vacuum channel is opened in the carrying table, the vacuum channel is connected to an external vacuum generating device, and a negative pressure environment for adsorbing the wafer is formed on the surface of the carrying table; and when the bottom surface of the wafer contacts the placement position and the carrying table simultaneously, the negative pressure environment is controlled to change correspondingly.

[0016] In some specific implementation manners, by rotating the driven disk, multiple positioning members are driven to move along the limiting channel, an area-variable positioning space is formed between the multiple protruding portions of the multiple positioning members, and the sides of the protruding portions contact the edge of the wafer.

[0017] The embodiments of the present invention bring the following beneficial effects:

[0018] An embodiment of the present invention provides a positioning member, a wafer positioning device, and a wafer detection device. By applying an external force to the driven disk, the driven disk rotates relative to the fixed disk, and the rotation of the driven disk drives a plurality of positioning members to move towards each other, thereby realizing the change in the size of the positioning space, realizing the transfer and placement of the wafer to be detected on the machine table, and realizing the handover of the wafer. And by setting corresponding structures for the positioning members, the positioning of the wafer is realized. The complexity of the mechanism movement is reduced, and the overall control accuracy of the mechanism is improved.

[0019] Other features and advantages of the present disclosure will be described in the following specification, or, some features and advantages can be inferred from the specification or determined without doubt, or can be learned by implementing the above technologies of the present disclosure.

[0020] To make the above objects, features, and advantages of the present disclosure more obvious and understandable, the following specifically enumerates preferred embodiments and, in conjunction with the accompanying drawings, is described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the following drawings are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0022] Figure 1 Schematic structural diagram of the wafer positioning device provided by the embodiment of the present invention;

[0023] Figure 2 Schematic structural diagram of the positioning member provided by the embodiment of the present invention;

[0024] Figure 3 Schematic structural diagram of the fixed disk provided by the embodiment of the present invention;

[0025] Figure 4 Schematic structural diagram of the connecting member provided by the embodiment of the present invention;

[0026] Figure 5 Schematic structural diagram of the wafer detection device provided by the embodiment of the present invention.

[0027] ICON: 100 - wafer positioning device; 200 - wafer detection device; 300 - wafer;

[0028] 110 - fixed disk; 120 - driven disk; 130 - positioning member; 140 - connecting member; 150 - power component; 160 - channel; 210 - carrier; 220 - carrier shaft;

[0029] 111 - Limit channel; 112 - Extension base; 113 - Bushing;

[0030] 121 - Radial groove;

[0031] 131 - First shaft body; 132 - Second shaft body; 133 - Positioning sleeve; 134 - Protrusion; 135 - Fastening screw; 136 - Limit boss;

[0032] 141 - Connecting rod; 142 - Cam follower; 143 - Short shaft; 144 - Elbow; 145 - Pre - tightening spring. Detailed implementation manner

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0034] The wafer positioning device provided in the embodiments of the present application is applied to the scenario of semiconductor front - end detection, specifically for the scenario of detecting wafers. In this scenario, the detection method is to scan the wafer surface along a specific path by laser, obtain the optical information of each position on the wafer surface, and determine whether there are defects on the wafer surface based on this optical information. Among them, when the laser scans, the wafer is in a rotational motion state.

[0035] In the actual detection scenario for the above - mentioned process, a wafer transportation unit and a wafer placement unit need to be configured. The wafer transportation unit is used to transport the wafer to be detected to the wafer placement unit. The wafer placement unit is a rotating table, and the rotational motion of the rotating table of the wafer placement unit is coordinated with the laser scanning to achieve the detection of the wafer surface.

[0036] Among them, when the wafer transportation unit transports the wafer to the placement unit, a wafer receiving and positioning device needs to be configured to receive the wafer to be detected in the transportation unit and place it above the rotating table, and then position the placed wafer to eliminate errors.

[0037] And the device for this is the wafer positioning device provided in this embodiment, which is used to receive and fix the wafer to be detected and cooperate with other mechanisms of the rotating table to achieve the transfer of the wafer. Compared with the prior art, its motion logic changes from the previous vertical - direction motion to planar motion, improving the motion accuracy of wafer transfer, and is configured with a positioning member with a specific structure, reducing the execution actions of wafer positioning and improving the overall operation accuracy.

[0038] Among them, the "wafer" in this embodiment generally refers to a substrate formed of semiconductor or non-semiconductor materials. Examples include (but are not limited to) single crystal silicon, gallium arsenide, gallium nitride, and indium phosphide. Such substrates can generally be found and / or processed in semiconductor manufacturing facilities. In some cases, the wafer may only include the substrate (i.e., a bare die). Alternatively, the wafer may include one or more different material layers formed on the substrate. The one or more layers formed on the wafer may be "patterned" or "unpatterned". For example, the wafer may include a plurality of bare dies with repeatable pattern features.

[0039] For the structure of the wafer positioning device according to the embodiment of the present application, please refer to Figure 1 , the wafer positioning device includes a fixed disk 110 and a driven disk 120, where the fixed disk is a non-movable mechanism, and the driven disk is a mechanism that can be moved by an external force.

[0040] Among them, the movement direction of the driven disk is a rotational movement relative to the fixed disk. Specifically, the driven disk rotates based on the axis of the fixed disk. Then, in this embodiment, the fixed disk and the driven disk are connected to each other and arranged coaxially.

[0041] Among them, it further includes at least three positioning members 130 in the same plane, and these positioning members can follow the rotational movement of the driven disk and can move towards each other relative to the center of the fixed disk. A plane is formed between the multiple positioning members, and this plane is a positioning space with a variable area.

[0042] Specifically, the formed space is used to place the wafer to be detected, that is, the wafer to be detected is placed at the positioning member, and the wafer transportation unit transports the wafer to be detected into this space to achieve the placement in the intermediate link of wafer transfer.

[0043] Regarding how the positioning member realizes the positioning and placement of the wafer, please refer to Figure 2 . The upper end surface of this positioning member is a plane. To achieve the placement of the wafer, a convex portion 134 is formed by extending along the axial and circumferential directions of this plane, and this convex portion is coaxially arranged with the positioning member.

[0044] Among them, the positioning and clamping of the wafer are realized through the placement position formed by this convex portion and the upper end surface of the positioning member. Specifically, for the placed wafer, the upper end surface of the positioning member provides a placement support surface for the wafer, and the side surface of the convex portion of the wafer contacts the edge of the wafer to provide wafer limit. Through the above two structures, the placement and clamping of the wafer can be realized, which is more stable than the planar placement by pins in the prior art.

[0045] Moreover, in the scenario of wafer inspection, the transfer and placement of wafers include at least the following processes: being transferred by the EFEM to the wafer positioning device, then being transported by the wafer positioning device to the wafer carrier 210, and the wafer positioning device positioning the wafer placed on the carrier.

[0046] In this embodiment, by providing the protrusions 134, a placement position for placing the wafer is formed between the protrusions and the plane of the positioning member. The three placement positions can receive the wafers transferred by the EFEM and cooperate with the wafer carrier for wafer placement. Moreover, the protrusions contact the side surface of the wafer, and the positioning of the wafer after transfer is achieved through the abutment with the wafer.

[0047] In the above process, the three precision control actions of transfer, placement, and positioning reduce the complexity of the mechanism movement based on the setting of the protrusions, thereby improving the overall control accuracy of the mechanism.

[0048] Regarding the above movement process, please refer to Figure 5 , which provides a wafer inspection device including the above-mentioned wafer positioning device and further including a carrier device. The rotation device includes a carrier shaft 220 and a carrier 210 provided at the upper end of the carrier shaft. It can be seen from the figure that the positioning member in the wafer positioning device contacts the wafer 300, placing the wafer in the wafer positioning device. This state is the state after wafer transfer, and the wafer is placed by the wafer positioning device above the carrier.

[0049] Please continue to refer to Figure 1 , in order to enable the passage of the carrier shaft in this embodiment, channels 160 are provided in the driven disk and the fixed disk. The carrier shaft passes through the channels, and the carrier is placed above the fixed disk.

[0050] Among them, a vacuum channel is provided on the carrier. The vacuum channel is connected to an external vacuum generating device. The vacuum generating device forms a negative pressure environment for adsorbing the wafer on the surface of the carrier, used for negatively vacuum adsorbing the wafer placed on the carrier, so as to fix the wafer on the carrier.

[0051] Among them, during the vacuum adsorption generation stage, after the wafer is placed on the carrier, that is, when the wafer is transferred from the positioning device to the carrier, the carrier performs vacuum adsorption to place and position the wafer. The placement is realized based on the placement position, and the positioning is realized based on the abutment between the protrusions of the positioning member and the edge of the wafer. When positioning, the carrier has received the wafer. At this time, the placement position of the positioning member should be lower than the upper surface of the carrier, and the wafer should not be higher than the protrusions, so that the protrusions can contact the edge of the wafer. Since three positioning members are provided in this embodiment and the three positioning members move synchronously, the slight deviation generated by the wafer above the carrier can be eliminated through the movement of the three positioning members.

[0052] It is worth noting that in the above process, because the wafer is in contact with the carrier during the deviation elimination process, the wafer needs to be moved in plane. Due to the existence of negative pressure adsorption, the plane movement will have movement resistance. If this movement resistance is large, it will cause wear at the contact point between the wafer and the carrier. Therefore, when positioning the wafer, it is necessary to change the vacuum environment on the carrier to reduce the wear of the wafer caused by movement.

[0053] Therefore, in this embodiment, a control component is provided in the vacuum generating device, and the negative pressure environment on the surface of the carrier is adjusted by the control component to reduce the wear on the wafer.

[0054] Specifically, when the edge of the wafer contacts the protrusion and the carrier platform at the same time, the negative pressure environment is controlled to be transformed into a positive pressure to reduce the wear on the back side of the wafer.

[0055] The following describes in detail how the wafer inspection device provided in this embodiment performs wafer handover, placement and positioning:

[0056] As the carrier table in the wafer inspection equipment descends with the carrier shaft, the positioning piece moves synchronously toward the center of the fixed plate to the material receiving position;

[0057] The external EFEM robot fork carries the wafer into the wafer inspection equipment, the robot descends and places the wafer on the shoulders of the three positioning parts, and the robot withdraws to the EFEM;

[0058] The carrier table rises along with the carrier shaft, so that the wafer is separated from the shoulders of the three positioning parts, and the rising position of the carrier table makes the wafer not higher than the upper surface position of the protruding part;

[0059] The positioning piece moves toward the center until the side of the raised part of the positioning piece contacts the edge of the wafer. During this process, the carrier table can apply a slight positive pressure to reduce the friction on the back of the wafer to achieve wafer positioning;

[0060] The carrier is subjected to negative pressure vacuum adsorption, and the wafer is adsorbed on the carrier;

[0061] The positioning parts move outward synchronously and no longer contact the edge of the wafer. The transfer, placement and positioning actions are completed, and the carrier table begins to rotate to perform the inspection procedure.

[0062] The carrier device in the wafer inspection device in this embodiment is the final wafer placement position, which can realize vertical movement and rotational movement. The vertical movement of the carrier device is used to transfer the wafer placed on the positioning device to the carrier, and the rotational movement is to rotate the wafer on the carrier and cooperate with the optical device to perform wafer inspection.

[0063] As can be seen from the above structure, the wafer positioning device provided in the embodiments of the present application can achieve transfer, placement, and positioning by setting the protrusions.

[0064] Please refer to again Figure 2 , because the three protrusions determine the position of the wafer, and the ideal position of the wafer should be as concentric as possible with the device for receiving the wafer. Therefore, each positioning member should be able to achieve fine adjustment.

[0065] To achieve the above purpose, the positioning member in this embodiment includes a positioning shaft and a horizontal end surface connected to one end of the positioning shaft. The positioning shaft is eccentric with respect to this end surface. Therefore, the horizontal position of the end surface and the protrusions provided on the end surface can be adjusted by adjusting the axis position of the positioning shaft.

[0066] Specifically, this positioning shaft includes a first shaft body 131 and a second shaft body 132. The second shaft body is an eccentric structure with respect to the second shaft body. And a through hole is opened at the bottom of the second shaft body, and the connection between the positioning member and the connecting member 140 can be realized through the fastening screw 135.

[0067] Specifically, the second shaft body and the first shaft body are relatively eccentrically arranged. When eccentric adjustment is required, after loosening the fastening screw, the second shaft body is rotated by a certain stroke, and the position of the positioning member can be finely adjusted by adjusting the eccentricity. Among them, the rotation of the fastening screw is determined according to the required eccentricity, and the eccentricity is determined according to the position difference of the positioning member on the plane. The above adjustment process will not be elaborated in this embodiment.

[0068] The upper end surface of the positioning shaft is the upper end surface of the positioning sleeve 133 sleeved on the first shaft body. The protrusion 134 is provided at the upper end surface of the positioning sleeve 133, and the protrusion is coaxially arranged with the positioning sleeve.

[0069] Among them, to realize the fixed connection between the positioning member and the connecting member, only using the fastening screw cannot fully achieve it. Therefore, the diameter of the first shaft body in this embodiment is larger than the diameter of the second shaft body. And because the second shaft body passes through the through hole of the connecting member, the diameter of the first shaft body is also larger than the through hole of the connecting member to form a limiting boss 136, realizing the fixation between the positioning member and the connecting member.

[0070] And in this embodiment, a space is formed between the limiting boss and the positioning sleeve, and this space should be at least larger than the thickness of the fixed disk, so as to realize that the positioning member can move in the limiting channel.

[0071] In this embodiment, the three positioning members with the above structure perform the same movement relative to the fixed disk within the same movement time. Their movement paths and movement states are the same, and their movement strokes, starting positions relative to the fixed disk, and ending positions relative to the fixed disk are also the same. By the opposite movement of the positioning members, the positioning space always maintains the same central position, and only the relative positions of the positioning members cause corresponding changes in the area of the positioning space.

[0072] In order to achieve the opposite movement of the above three positioning members, and the same movement paths and movement states during the movement process, as well as the same movement strokes, starting positions relative to the fixed disk, and ending positions relative to the fixed disk, the embodiment of the present application sets a limiting channel on the fixed disk. The positioning members are arranged in the limiting channel and perform opposite movement relative to the fixed disk within the limiting channel.

[0073] Refer to Figure 3 , regarding the structure of the fixed disk and the limiting channel 111, for the limiting channel being an arc structure, and in order to ensure the opposite movement relationship among the three positioning members, there is a specific positional relationship among the above multiple limiting channels.

[0074] Specifically, the circles formed by any corresponding points in the multiple limiting channels are concentric with the fixed disk. For example, the circle formed by the center points of the first limiting channel, the second limiting channel, and the third limiting channel has the center of the fixed disk as its center. Moreover, the circle formed by the centers of the arc structures of the above three limiting channels is also concentric with the fixed disk.

[0075] Through the above structure, it can be ensured that the three positioning members perform corresponding synchronous movement, and the formed positioning space is concentric with the fixed disk.

[0076] In summary, for the wafer positioning device provided by the embodiment of the present application, an external force is applied to the driven disk to make it rotate relative to the fixed disk, and the positioning members connected to the driven disk perform synchronous movement. And through the limiting channel set on the fixed disk, the movement of the positioning members changes from the rotational movement of the driven disk to move along the arc structure of the limiting channel, so that relative movement is formed among the multiple positioning members, and the size of the positioning space changes.

[0077] Among them, when the driven disk rotates clockwise, the positioning members move along the limiting channel towards the center of the fixed disk, making the area of the positioning dimension smaller. When the driven disk rotates counterclockwise, the positioning members move along the limiting channel in a path away from the center of the fixed disk, making the area of the positioning space larger.

[0078] Please refer to again Figure 1, for the external fixing member connected by fastening screws in this embodiment, it is a connecting member. The positioning member is connected to the connecting member by fastening screws, and the connecting member is also connected to the driven disk. Through this connection structure, the connecting member can be driven by the driven disk to drive the positioning member to move.

[0079] Please refer to Figure 4 , regarding the specific structure of the connecting member, it includes a connecting rod 141 and a cam follower 142 fixedly connected to one end of the connecting rod. The other end of the connecting rod is connected to the positioning member by a fastening screw, and the cam follower is connected to the driven disk.

[0080] Among them, the connecting rod in this embodiment adopts an L-shaped structure. The setting of the L-shaped structure is used to change the movement path of the positioning member, that is, to change the movement path of the driven disk so that the rotational movement path of the driven disk changes, enabling the positioning member to move relative to the center of the fixed disk.

[0081] A groove is provided on the driven disk. This groove extends towards the center of the driven disk to form a radial groove, and the cam follower is arranged in this groove.

[0082] In order to make the state of the connecting rod more stable during movement and the movement of the positioning member more conform to the trajectory of the arc-shaped limiting channel, in this embodiment, a short shaft 143 connected to the fixed disk is provided at the elbow 144 of the connecting rod, and a bearing is arranged between the short shaft and the fixed disk. When the driven disk rotates relative to the fixed disk, the driven disk pushes the cam follower through the radial groove 121, causing the connecting rod to drive the positioning member to rotate around the bearing at its elbow, thereby realizing the positioning member approaching or departing from the center of the fixed disk.

[0083] Since there is a gap between the radial groove of the driven disk and the cam follower, it will affect the repeatability accuracy of the mechanism.

[0084] To solve this problem, a pre-tightening mechanism is also provided in this embodiment. It is connected to one side of the short end of the connecting rod and is used to provide a tensile force to the connecting rod, so that the cam follower fits against one side in the radial groove, reducing the accuracy impact caused by the gap.

[0085] And for the pre-tightening mechanism, as long as it can provide a tensile force to the connecting rod. In a realizable manner, the pre-tightening mechanism includes a pre-tightening spring 145. One end of the pre-tightening spring is connected to the connecting rod, and the other end is connected to the fixed disk. When the driven disk rotates relative to the fixed disk, the pre-tightening spring is stretched, and its spring force makes the radial groove of the driven disk and the pushing cam follower always have and only have one side in contact, thereby eliminating the transmission gap.

[0086] Regarding the above-mentioned wafer positioning device, by setting the connecting member, the positioning member can move correspondingly when the driven disk moves.

[0087] In this embodiment, for the above-mentioned wafer positioning device, the rotational movement of the driven disk is achieved based on an external force, and this external force can include various power components.

[0088] Please refer to again Figure 1 , in this embodiment, the power component 150 includes any one of a lead screw stepper motor and a linear motor. Among them, the lead screw stepper motor is preferably selected. The lead screw stepper motor outputs a force in the linear motion direction and drives the driven disk to rotate.

[0089] Please refer to again Figure 3 and Figure 4 , regarding the connection relationship between the fixed disk and the driven disk, the fixed disk and the driven disk are coaxially arranged, and the extension seat 112 of the driven disk and the fixed disk are connected by a bushing 112 or a bearing. Through this structure, the fixation of the fixed disk and the movement of the driven disk relative to the fixed disk can be achieved.

[0090] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0091] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A positioning member, characterized in that: include: A positioning shaft and a horizontal end face connected to one end of the positioning shaft, wherein the positioning shaft is eccentric with respect to the end face; a protrusion is formed by extending axially and circumferentially at the center of the end face, wherein the horizontal cross-sectional area of ​​the protrusion is smaller than the horizontal cross-sectional area of ​​the end face, and the protrusion and the end face form a placement position.

2. The positioning member according to claim 1, characterized in that: The positioning shaft includes a first shaft body and a second shaft body, the first shaft body is connected to the end surface, and the second shaft body is eccentric with respect to the first shaft body.

3. The positioning member according to claim 2, characterized in that: The end surface is the upper end surface of a positioning sleeve sleeved on the first shaft body, and the positioning sleeve can rotate along the axial direction of the positioning shaft.

4. The positioning member according to claim 3, characterized in that: A through hole communicating with the first shaft body is provided at a side end of the positioning sleeve, and is used to fix the relative position between the positioning sleeve and the first shaft body through a fixing member.

5. The positioning member according to claim 2, characterized in that: A through hole is provided at the rear end of the second shaft body for realizing a movable connection with an external connecting member by means of a fastening screw.

6. A wafer positioning device, characterized in that: include: A fixed disk and a driven disk connected to each other and coaxially arranged, wherein the driven disk can rotate relative to the fixed disk by an external force; At least three positioning members according to any one of claims 1 to 5 are in the same plane, and at least three of the positioning members follow the movement of the driven disk, and can move toward each other relative to the center of the fixed disk through the rotational movement of the driven disk, based on forming a positioning space with a variable area between the three protrusions, and the side edges of the three protrusions selectively contact the edge of the wafer, and the placement position selectively contacts the bottom surface of the wafer; the movement toward each other includes movement toward each other and movement away from each other.

7. The wafer positioning device according to claim 6, characterized in that: The positioning member is connected to the driven disk via a connecting member.

8. The wafer positioning device according to claim 7, characterized in that: The connecting member includes an L-shaped connecting rod, a through hole for the second shaft to pass through is opened at the long end of the connecting rod, the connecting rod and the second shaft are movably connected by a fastening screw, and the short end of the connecting rod is connected to the driven disk.

9. The wafer positioning device according to claim 6, characterized in that: A limiting channel is provided on the fixed disk, and the positioning member is arranged in the limiting channel and moves synchronously relative to the fixed disk in the limiting channel.

10. The wafer positioning device according to claim 9, characterized in that: The limiting channel is an arc-shaped structure.

11. The wafer positioning device according to claim 6, characterized in that: The external force is provided by a power component, and the power component includes any one of a screw stepper motor and a linear motor. The power component outputs a force in a linear motion direction and drives the driven disk to rotate.

12. A wafer inspection device, characterized in that: The wafer positioning device comprises the wafer positioning device as described in any one of claims 6 to 11, and also comprises a carrying device; the carrying device comprises a carrying shaft and a carrying platform arranged at the upper end of the carrying shaft, a channel is opened in the driven disk and the fixed disk, the carrying shaft passes through the channel, and the carrying platform is placed above the fixed disk; a vacuum channel is opened on the carrying platform, the vacuum channel is connected to an external vacuum generating device, a negative pressure environment for adsorbing the wafer is formed on the surface of the carrying platform, and the negative pressure environment is controlled to change accordingly when the edge of the wafer contacts the protrusion and the carrying platform at the same time.

13. The wafer inspection device according to claim 12, characterized in that: The driven disk is rotated to drive the plurality of positioning members to move along the limiting channel, and a positioning space with a variable area is formed between the plurality of protrusions of the plurality of positioning members, and the side edges of the protrusions are in contact with the edge of the wafer.

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