Silicon wafer cleaning and drying device and method

Abstract

The invention provides a silicon wafer cleaning and drying device and method. The silicon wafer cleaning and drying device comprises a shell and a drying unit. The drying unit comprises a drying tank, a tank cover, a first temperature regulator, a pipeline and an air extractor; the drying tank is arranged in the shell, an opening is formed in the upper portion of the drying tank, and the tank cover is movably connected with the drying tank and used for closing or opening the opening. A plurality of ventilation holes are evenly formed in the side wall of the drying groove, and the first temperature regulators are arranged in the ventilation holes. The pipeline is arranged at the bottom of the drying tank, the first end of the pipeline communicates with the interior of the drying tank, and the second end is connected with the air extractor. According to the silicon wafer cleaning and drying device, the air exhauster is used for controlling the air in the drying tank and exhausting the air out of the drying tank through the pipeline, and the air outside the drying tank enters the drying tank after being heated by the first temperature regulator of the ventilation hole, so that the air inside and outside the drying tank is circulated; therefore, the drying speed is accelerated under the condition of ensuring the uniform drying degree of the surface of the silicon wafer.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor and industrial technology, and in particular to a silicon wafer cleaning and drying device and method. Background Art

[0002] After cleaning the silicon wafer, the surface of the silicon wafer needs to be dried. Usually, the infrared heating lamps are installed in the infrared drying tank to dry the silicon wafer, which can easily lead to uneven heating on the surface of the silicon wafer, resulting in uneven drying of the surface of the silicon wafer. In addition, after the infrared drying tank has completed the drying of the silicon wafer, due to the high surface temperature of the silicon wafer, the robot arm is prone to violent shaking during the transportation of the silicon wafer, resulting in particle contamination on the surface of the silicon wafer. Summary of the invention

[0003] The embodiment of the present invention provides a silicon wafer cleaning and drying device and method, which is used to solve the problem in the prior art that drying silicon wafers in an infrared drying tank easily causes uneven heating on the surface of the silicon wafer, resulting in uneven drying degree on the surface of the silicon wafer.

[0004] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the present invention provides a silicon wafer cleaning and drying device, comprising:

[0006] Housing and drying unit;

[0007] The drying unit comprises: a drying tank, a tank cover, a first temperature regulator, a pipeline and an air extractor;

[0008] The drying tank is arranged in the housing, an opening is arranged above the drying tank, and the tank cover is movably connected to the drying tank and is used to close or open the opening;

[0009] A plurality of ventilation holes are evenly arranged on the side wall of the drying tank, and the first temperature regulator is arranged in the ventilation holes;

[0010] The pipeline is arranged at the bottom of the drying tank, and a first end of the pipeline is communicated with the interior of the drying tank, and a second end of the pipeline is connected to the air extractor.

[0011] Furthermore, at least one air suction port is provided at the first end of the pipeline, and each of the air suction ports is communicated with the bottom of the drying tank.

[0012] Furthermore, a first card comb is provided in the drying tank for carrying the silicon wafer during the drying process of the silicon wafer.

[0013] Furthermore, a plurality of first temperature collectors are evenly arranged in the drying tank.

[0014] Furthermore, the silicon wafer cleaning and drying device also includes:

[0015] Washing units and isolation windows;

[0016] The cleaning unit comprises: a cleaning tank and a lifting platform;

[0017] The cleaning tank is disposed in the housing, and the lifting platform is disposed in the cleaning tank, and is used to carry the silicon wafer during the cleaning process of the silicon wafer;

[0018] The isolation window is arranged close to the center of the shell, and the drying unit and the cleaning unit are respectively arranged on both sides of the isolation window.

[0019] Furthermore, the silicon wafer cleaning and drying device also includes:

[0020] A second temperature regulator and a second temperature collector;

[0021] A plurality of the second temperature regulators are disposed on the housing and located above the cleaning tank;

[0022] A plurality of the second temperature collectors are arranged in the cleaning tank.

[0023] Furthermore, the silicon wafer cleaning and drying device also includes:

[0024] The robot arm is used to place the silicon wafer in the cleaning tank for cleaning, transfer the silicon wafer from the cleaning tank to the drying tank, and transfer the silicon wafer from the drying tank out of the silicon wafer cleaning and drying device.

[0025] In a second aspect, an embodiment of the present invention provides a silicon wafer cleaning and drying method, which is applied to the silicon wafer cleaning and drying device as described above, comprising:

[0026] After placing the silicon wafer in the drying tank, moving the tank cover to close the drying tank;

[0027] Controlling the first temperature regulator and the air extractor to start, so that the pipeline sucks the air in the drying tank, and the air outside the drying tank is heated by the temperature control device in the ventilation hole and then enters the drying tank;

[0028] After the silicon wafer is dried, the first temperature regulator is turned off or the air passing through the ventilation hole is cooled by the first temperature regulator;

[0029] When the average value of the temperature collected by the first temperature collector is the same as the ambient temperature outside the housing, the first temperature regulator and the air extractor are turned off.

[0030] Furthermore, before placing the silicon wafer in the drying tank, the method further comprises:

[0031] Placing the silicon wafer in the cleaning tank for cleaning, controlling the second temperature regulator to start, heating the air above the cleaning tank until the average temperature collected by the second temperature collector is consistent with the temperature in the cleaning tank;

[0032] After the silicon wafer is cleaned, the silicon wafer is transferred from the cleaning tank to the drying tank by the robot arm.

[0033] Further, placing the silicon wafer in the cleaning tank for cleaning includes:

[0034] Controlling the lifting platform to rise above the level of the cleaning liquid in the cleaning tank;

[0035] After placing the silicon wafer on the lifting platform, controlling the lifting platform to descend until the silicon wafer is submerged in the cleaning liquid;

[0036] The method of transferring the silicon wafer from the cleaning tank to the drying tank by the robotic arm comprises:

[0037] The lifting platform is controlled to rise above the liquid level of the cleaning liquid in the cleaning tank, and the silicon wafer is placed in the drying tank after passing through the isolation window by the mechanical arm.

[0038] The beneficial effects of the present invention are:

[0039] The silicon wafer cleaning and drying device of the embodiment of the present invention is provided with ventilation holes on the side wall of the drying tank, a first temperature regulator in the ventilation holes, and a pipeline connected to the bottom of the drying tank. The air in the drying tank is drawn out of the drying tank through the pipeline by an exhaust fan, and the air outside the drying tank is heated by the first temperature regulator in the ventilation holes and then enters the drying tank, so that the air inside and outside the drying tank is circulated, thereby accelerating the drying speed while ensuring the uniform drying degree of the silicon wafer surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 A schematic diagram showing the structure of a silicon wafer cleaning and drying device according to an embodiment of the present invention;

[0041] Figure 2 A schematic diagram showing the steps of a silicon wafer cleaning and drying method according to an embodiment of the present invention. DETAILED DESCRIPTION

[0042] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will be described in detail in conjunction with the accompanying drawings and specific embodiments. In the following description, specific details such as specific configurations and components are provided only to help fully understand the embodiments of the present invention. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present invention. In addition, for clarity and brevity, the description of known functions and structures is omitted.

[0043] It should be understood that the references to "one embodiment" or "an embodiment" throughout the specification mean that the specific features, structures, or characteristics associated with the embodiment are included in at least one embodiment of the present invention. Therefore, the references to "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. In addition, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0044] Aiming at the problem that the drying of silicon wafers in an infrared drying tank in the prior art easily leads to uneven heating of the silicon wafer surface and uneven drying degree of the silicon wafer surface, the present invention provides a silicon wafer cleaning and drying device and method.

[0045] like Figure 1 As shown, an embodiment of the present invention provides a silicon wafer cleaning and drying device, comprising:

[0046] Shell 1 and drying unit;

[0047] The drying unit comprises: a drying tank 21, a tank cover 22, a first temperature regulator 23, a pipeline 24 and an air extractor 25;

[0048] The drying tank 21 is disposed in the housing 1, an opening is disposed above the drying tank 21, and the tank cover 22 is movably connected to the drying tank 21 for closing or opening the opening;

[0049] A plurality of ventilation holes 26 are evenly arranged on the side wall of the drying tank 21, and the first temperature regulator 23 is arranged in the ventilation hole 26;

[0050] The pipeline 24 is disposed at the bottom of the drying tank 21 , and a first end of the pipeline 24 is communicated with the interior of the drying tank 21 , and a second end of the pipeline 24 is connected to the air extractor 25 .

[0051] Optionally, the first temperature regulator is a one-way heating regulator of an infrared heating lamp, or a two-way temperature regulator capable of heating and cooling;

[0052] Wherein, the infrared heating lamp is used to heat the air passing through the ventilation hole;

[0053] The temperature regulator is used to heat or cool the air passing through the ventilation hole.

[0054] Optionally, the ventilation holes are arranged at multiple heights in the drying tank;

[0055] That is, the ventilation holes are arranged in multiple layers in the drying tank.

[0056] Optionally, a first temperature regulator is disposed in each of the ventilation holes.

[0057] It should be noted that the size of the ventilation hole is larger than the size of the first temperature regulator to ensure that air can enter the drying tank through the ventilation hole.

[0058] The silicon wafer cleaning and drying device of the embodiment of the present invention is provided with multiple layers of ventilation holes in the drying tank, which can enable air to circulate in and out of the drying tank at different heights; by providing the first temperature regulator in each ventilation hole, the first temperature regulator can heat or cool the air at different heights in the drying tank, so that the air at different heights in the drying tank maintains a consistent temperature, thereby maintaining the overall temperature of the silicon wafer consistent, and avoiding excessive local temperature of the silicon wafer.

[0059] Optionally, the slot cover is connected to the side wall of the drying slot near the opening end through a rotatable connecting piece, and the drying slot is sealed or opened by rotating the slot cover;

[0060] Specifically, when a silicon wafer is placed in or taken out of the drying tank, the tank cover is opened; when the drying tank is in operation, the tank cover is closed.

[0061] The silicon wafer cleaning and drying device of the embodiment of the present invention is provided with ventilation holes on the side wall of the drying tank, a first temperature regulator in the ventilation holes, and a pipeline connected to the bottom of the drying tank. The air in the drying tank is drawn out of the drying tank through the pipeline by an exhaust fan, and the air outside the drying tank is heated by the first temperature regulator in the ventilation holes and then enters the drying tank, so that the air inside and outside the drying tank is circulated, thereby accelerating the drying speed while ensuring the uniform drying degree of the silicon wafer surface.

[0062] Optionally, at least one air suction port 241 is disposed at the first end of the pipeline 24 , and each of the air suction ports 241 is communicated with the bottom of the drying tank 21 .

[0063] Optionally, when there is only one air suction port, the area of ​​the air suction port is greater than half of the bottom area of ​​the drying tank.

[0064] Optionally, a first card comb 27 is further provided in the drying tank 21 for carrying the silicon wafer during the drying process.

[0065] Optionally, a plurality of first temperature collectors 28 are evenly arranged in the drying tank 21 .

[0066] Optionally, the first temperature collector is used to collect the target temperature in the drying tank.

[0067] The silicon wafer cleaning and drying device of the embodiment of the present application, through the target temperature collected by the first temperature collector, can not only control the temperature in the drying tank during the drying process to avoid the influence of excessive temperature on the silicon wafer, but also monitor the temperature in the drying tank after the drying is completed, and take out the silicon wafer from the drying tank when the temperature in the drying tank drops to the ambient temperature, thereby reducing particle contamination caused by the silicon wafer temperature being higher than the ambient temperature.

[0068] Optionally, the silicon wafer cleaning and drying device further comprises:

[0069] Cleaning unit and isolation window 3;

[0070] The cleaning unit comprises: a cleaning tank 41 and a lifting platform 42;

[0071] The cleaning tank 41 is disposed in the housing 1, and the lifting platform 42 is disposed in the cleaning tank 41 for carrying the silicon wafer during the cleaning process of the silicon wafer;

[0072] The isolation window 3 is disposed close to the center of the housing 1 , and the drying unit and the cleaning unit are disposed on both sides of the isolation window, respectively.

[0073] Optionally, the cleaning liquid in the cleaning tank is ultrapure water.

[0074] The silicon wafer cleaning and drying device of the embodiment of the present application, by providing the isolation window, can enable the cleaning unit and the drying unit to operate independently without affecting each other, thereby improving the cleaning and drying efficiency of the silicon wafer.

[0075] Optionally, the silicon wafer cleaning and drying device further comprises:

[0076] A second temperature regulator 43 and a second temperature collector 44;

[0077] A plurality of the second temperature regulators 43 are disposed on the housing 1 and located above the cleaning tank 41;

[0078] A plurality of the second temperature collectors 44 are disposed in the cleaning tank 41 .

[0079] It should be noted that the silicon wafer is cleaned with hot ultrapure water in the cleaning tank; after cleaning, the temperature of the silicon wafer is the same as the temperature of the ultrapure water, and the silicon wafer is taken out of the cleaning tank. However, the temperature above the cleaning tank is lower than that of the silicon wafer, which causes water droplets to condense on the surface of the silicon wafer, thereby contaminating the silicon wafer.

[0080] The silicon wafer cleaning and drying device of the embodiment of the present application confirms the temperature of the ultrapure water in the cleaning tank by the second temperature collector, and is able to heat the air above the cleaning tank by arranging the second temperature regulator above the cleaning tank, so that the temperature of the air above the cleaning tank is consistent with the temperature in the cleaning tank, thereby avoiding condensation into water droplets on the surface of the silicon wafer when the silicon wafer is taken out of the cleaning tank, thereby reducing contamination.

[0081] Optionally, the silicon wafer cleaning and drying device further comprises:

[0082] The robot arm is used to place the silicon wafer in the cleaning tank 41 for cleaning, transfer the silicon wafer from the cleaning tank 41 to the drying tank 21, and transfer the silicon wafer from the drying tank 21 out of the silicon wafer cleaning and drying device.

[0083] Optionally, the number of the robotic arm is one;

[0084] The robot arm is used to place the silicon wafer in the cleaning tank, transfer the silicon wafer from the cleaning tank to the drying tank, and transfer the silicon wafer from the drying tank out of the silicon wafer cleaning and drying device.

[0085] Optionally, the mechanical arm comprises: a first mechanical arm and a second mechanical arm;

[0086] The first robot arm is used to place the silicon wafer in the cleaning tank and transfer the silicon wafer from the cleaning tank to the drying tank;

[0087] The second robot arm is used to transfer the silicon wafer from the drying tank to the silicon wafer cleaning and drying device.

[0088] like Figure 2 As shown, an embodiment of the present invention provides a silicon wafer cleaning and drying method, which is applied to the silicon wafer cleaning and drying device as described above, and includes the following steps:

[0089] Step 201, after placing the silicon wafer in the drying tank, move the tank cover to close the drying tank;

[0090] Step 202, controlling the first temperature regulator and the air extractor to start, so that the pipeline sucks the air in the drying tank, and the air outside the drying tank is heated by the temperature control device in the ventilation hole and then enters the drying tank;

[0091] Step 203, after the silicon wafer is dried, the first temperature regulator is turned off or the air passing through the ventilation hole is cooled by the first temperature regulator;

[0092] Step 204: When the average value of the temperature collected by the first temperature collector is the same as the ambient temperature outside the housing, turn off the first temperature regulator and the air extractor.

[0093] In the embodiment of the present invention, the first temperature regulator is an infrared heating tube;

[0094] During the process of drying the silicon wafers, the temperature in the drying tank is heated by the first temperature regulator; after the silicon wafers are dried, the first temperature regulator is turned off, but the vacuum fan is kept running to keep the air in the drying tank circulating with the air outside the drying tank, thereby cooling the silicon wafers.

[0095] In the embodiment of the present invention, the first temperature regulator;

[0096] During the process of drying the silicon wafers, the temperature in the drying tank is heated by the first temperature regulator; after the silicon wafers are dried, the temperature in the drying tank is cooled by the first temperature regulator, and the vacuum fan is kept running to keep the air in the drying tank in circulation with the air outside the drying tank, thereby cooling the silicon wafers.

[0097] The silicon wafer cleaning and drying method of the embodiment of the present invention takes the silicon wafer out of the drying tank only when the temperature in the drying tank drops to the same as the ambient temperature, thereby avoiding severe shaking of the silicon wafer due to excessively high temperature during the process of the robot arm transporting the silicon wafer, thereby reducing the contaminated particles on the surface of the silicon wafer.

[0098] Optionally, before placing the silicon wafer in the drying tank, the method further comprises:

[0099] Placing the silicon wafer in the cleaning tank for cleaning, controlling the second temperature regulator to start, heating the air above the cleaning tank until the average temperature collected by the second temperature collector is consistent with the temperature in the cleaning tank;

[0100] After the silicon wafer is cleaned, the silicon wafer is transferred from the cleaning tank to the drying tank by the robot arm.

[0101] It should be noted that the silicon wafer is cleaned with hot ultrapure water in the cleaning tank; after cleaning, the temperature of the silicon wafer is the same as the temperature of the ultrapure water, and the silicon wafer is taken out of the cleaning tank. However, the temperature above the cleaning tank is lower than that of the silicon wafer, which causes water droplets to condense on the surface of the silicon wafer, thereby contaminating the silicon wafer.

[0102] The silicon wafer cleaning and drying method of the embodiment of the present application confirms the temperature of the ultrapure water in the cleaning tank by the second temperature collector, and heats the air above the cleaning tank by setting the second temperature regulator above the cleaning tank, so that the temperature of the air above the cleaning tank is consistent with the temperature in the cleaning tank, thereby avoiding condensation into water droplets on the surface of the silicon wafer when the silicon wafer is taken out of the cleaning tank, thereby reducing contamination.

[0103] Optionally, placing the silicon wafer in the cleaning tank for cleaning includes:

[0104] Controlling the lifting platform to rise above the level of the cleaning liquid in the cleaning tank;

[0105] After placing the silicon wafer on the lifting platform, controlling the lifting platform to descend until the silicon wafer is submerged in the cleaning liquid;

[0106] The method of transferring the silicon wafer from the cleaning tank to the drying tank by the robotic arm comprises:

[0107] The lifting platform is controlled to rise above the liquid level of the cleaning liquid in the cleaning tank, and the silicon wafer is placed in the drying tank after passing through the isolation window by the mechanical arm.

[0108] The present application also provides a silicon wafer cleaning and drying device, including:

[0109] A moving module, used for placing the silicon wafer in the drying tank and then moving the tank cover to close the drying tank;

[0110] A drying module, used for controlling the first temperature regulator and the air extractor to start, so that the pipeline sucks the air in the drying tank, and the air outside the drying tank is heated by the temperature control device in the ventilation hole and then enters the drying tank;

[0111] A cooling module, used for closing the first temperature regulator or cooling the air passing through the ventilation hole through the first temperature regulator after the silicon wafer is dried;

[0112] The processing module is used to turn off the first temperature regulator and the air extractor when the average value of the temperature collected by the first temperature collector is the same as the ambient temperature outside the shell.

[0113] In addition, a specific embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, the steps of the above-mentioned silicon wafer cleaning and drying method are implemented. And the same technical effect can be achieved, so it will not be repeated here to avoid repetition.

[0114] The embodiment of the present application also provides a computer program product, including computer instructions. When the computer instructions are executed by a processor, the various processes of the above-mentioned silicon wafer cleaning and drying method embodiment are implemented, and the same technical effect can be achieved. To avoid repetition, they are not repeated here.

[0115] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary personnel in this technical field, several improvements and modifications can be made without departing from the principles described in the present invention. These improvements and modifications are also within the scope of protection of the present invention.

Claims

1. A silicon wafer cleaning and drying device, characterized in that: include: Housing and drying unit; The drying unit comprises: a drying tank, a tank cover, a first temperature regulator, a pipeline and an air extractor; The drying tank is arranged in the housing, an opening is arranged above the drying tank, and the tank cover is movably connected to the drying tank and is used to close or open the opening; A plurality of ventilation holes are evenly arranged on the side wall of the drying tank, and the first temperature regulator is arranged in the ventilation holes; The pipeline is arranged at the bottom of the drying tank, and the first end of the pipeline is communicated with the interior of the drying tank, and the second end of the pipeline is connected to the air extractor, and the air extractor is arranged outside the shell.

2. The silicon wafer cleaning and drying device according to claim 1, characterized in that: The first end of the pipeline is provided with at least one air suction port, and each of the air suction ports is communicated with the bottom of the drying tank.

3. The silicon wafer cleaning and drying device according to claim 1, characterized in that: A first card comb is also provided in the drying tank for carrying the silicon wafer during the drying process.

4. The silicon wafer cleaning and drying device according to claim 1, characterized in that: A plurality of first temperature collectors are evenly arranged in the drying tank.

5. The silicon wafer cleaning and drying device according to claim 1, characterized in that: Also includes: Washing unit and isolation windows; The cleaning unit comprises: a cleaning tank and a lifting platform; The cleaning tank is disposed in the housing, and the lifting platform is disposed in the cleaning tank, and is used to carry the silicon wafer during the cleaning process of the silicon wafer; The isolation window is arranged close to the center of the shell, and the drying unit and the cleaning unit are respectively arranged on both sides of the isolation window.

6. The silicon wafer cleaning and drying device according to claim 5, characterized in that: Also includes: , a second temperature regulator and a second temperature collector; A plurality of the second temperature regulators are disposed on the housing and located above the cleaning tank; A plurality of the second temperature collectors are arranged in the cleaning tank.

7. The silicon wafer cleaning and drying device according to claim 6, characterized in that: Also includes: The robot arm is used to place the silicon wafer in the cleaning tank for cleaning, transfer the silicon wafer from the cleaning tank to the drying tank, and transfer the silicon wafer from the drying tank out of the silicon wafer cleaning and drying device.

8. A silicon wafer cleaning and drying method, applied to the silicon wafer cleaning and drying device according to any one of claims 1 to 7, characterized in that: include: After placing the silicon wafer in the drying tank, moving the tank cover to close the drying tank; Controlling the first temperature regulator and the air extractor to start, so that the pipeline sucks the air in the drying tank, and the air outside the drying tank is heated by the temperature control device in the ventilation hole and then enters the drying tank; After the silicon wafer is dried, the first temperature regulator is turned off or the air passing through the ventilation hole is cooled by the first temperature regulator; When the average value of the temperature collected by the first temperature collector is the same as the ambient temperature outside the housing, the first temperature regulator and the air extractor are turned off.

9. The silicon wafer cleaning and drying method according to claim 8, characterized in that: Before placing the silicon wafer in the drying tank, the method further comprises: Placing the silicon wafer in the cleaning tank for cleaning, controlling the second temperature regulator to start, heating the air above the cleaning tank until the average temperature collected by the second temperature collector is consistent with the temperature in the cleaning tank; After the silicon wafer is cleaned, the silicon wafer is transferred from the cleaning tank to the drying tank by the robot arm.

10. The method for cleaning and drying a silicon wafer according to claim 9, characterized in that: Placing the silicon wafer in the cleaning tank for cleaning, comprising: Controlling the lifting platform to rise above the level of the cleaning liquid in the cleaning tank; After placing the silicon wafer on the lifting platform, controlling the lifting platform to descend until the silicon wafer is submerged in the cleaning liquid; The method of transferring the silicon wafer from the cleaning tank to the drying tank by the robotic arm comprises: The lifting platform is controlled to rise above the liquid level of the cleaning liquid in the cleaning tank, and the silicon wafer is placed in the drying tank after passing through the isolation window by the mechanical arm.

Images