Substrate placement apparatus, substrate processing apparatus, and position adjustment method

Abstract

The invention provides a substrate mounting apparatus, a substrate processing apparatus, and a position adjusting method. The position relation between the carrying surface of the carrying table and the lifting pins in the maximum descending state can be maintained regardless of temperature changes. A substrate mounting device is provided with: a mounting table having a mounting surface on which a substrate is mounted, and a plurality of through-holes that pass through the mounting surface in the vertical direction and open to the mounting surface; lifting pins which are provided in the through holes, can move in the vertical direction relative to the mounting table, and support the substrate from the lower surface side; and an adjustment mechanism provided in each of the through holes and capable of adjusting the position of the lifting pin in the vertical direction in the corresponding through hole, the lifting pin having a positioning portion supported from below by the adjustment mechanism.

Description

Technical Field

[0001] The present disclosure relates to a substrate mounting device, a substrate processing device, and a position adjustment method. Background Art

[0002] For example, in the manufacturing process of flat panel displays (FPDs) and semiconductors, various processes such as dry etching, sputtering, and CVD (chemical vapor deposition) are performed on glass substrates and semiconductor wafers as substrates to be processed. Such processes are performed, for example, with the substrate to be processed placed on a substrate stage provided in a chamber. In addition, when the substrate to be processed is sent into or out of the chamber, the substrate to be processed is lifted from the substrate stage using a plurality of lifting pins that are configured to protrude from the mounting surface of the substrate stage, that is, to be able to be raised and lowered relative to the mounting surface.

[0003] In addition, when various processes are performed on the substrate to be processed, each lifting pin descends and the substrate to be processed is placed on the loading surface. The loading surface has an electrostatic holding disk structure and a convex shape for supporting the substrate to be processed based on embossing or the like. Through a plurality of air holes penetrating the electrostatic holding disk structure, an inactive gas such as helium is supplied to exchange heat with the substrate to be processed. At this time, a small gap is generated between the substrate to be processed and the loading surface, and a heat transfer gas is supplied to the small gap. However, in order to uniformly remove the film of the substrate to be processed by etching, for example, it is necessary to make the temperature distribution of the substrate to be processed uniform. Therefore, in order to make the distribution of the heat transfer gas in the small gap uniform, it is preferable to set the distance between the substrate to be processed and the descending lifting pins to the same size as the distance between the substrate to be processed and the loading surface.

[0004] Correspondingly, there is known a technique for adjusting the position of a lift pin in the height direction so that the position of the tip of the lift pin coincides with the mounting surface (see, for example, Patent Document 1). The lift pin described in Patent Document 1 includes a cylinder and a cover covering the cylinder, and is configured to be able to adjust the height of the cover relative to the cylinder.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2020-17590 Summary of the invention

[0008] Problem that the invention aims to solve

[0009] The technology disclosed in the present disclosure can maintain the positional relationship between the mounting surface of the mounting table and each lift pin in the most descended state regardless of temperature changes.

[0010] Solutions for solving problems

[0011] One scheme of the technology disclosed in the present invention comprises: a loading table having a loading surface for loading a substrate and a plurality of through holes penetrating in the up-down direction and opening on the loading surface; a lifting pin provided in each of the through holes, capable of moving in the up-down direction relative to the loading table and supporting the substrate from the lower surface side; and an adjustment mechanism provided in each of the through holes, capable of adjusting the position of the lifting pin in the up-down direction in the corresponding through hole, the lifting pin having a positioning portion supported from below by the adjustment mechanism.

[0012] Effects of the Invention

[0013] According to the present disclosure, the positional relationship between the mounting surface of the mounting table and each lift pin in the most descended state can be maintained regardless of temperature changes. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram showing an example of a substrate processing apparatus.

[0015] Figure 2 It is an enlarged vertical cross-sectional view showing an example of a substrate mounting device included in the substrate processing apparatus.

[0016] Figure 3 Yes means Figure 2 A schematically enlarged view of an example of a region [B] surrounded by a double-dashed line in FIG.

[0017] Figure 4 It is an enlarged vertical cross-sectional view showing an example of a substrate mounting device included in the substrate processing apparatus.

[0018] Figure 5 This is an enlarged view showing an example of a cylindrical member of the adjustment mechanism included in the substrate mounting device.

[0019] Figure 6 This is an enlarged view showing an example of a minute gap provided on the placement surface of the substrate placement table.

[0020] Description of Reference Numerals

[0021] 1. Substrate mounting device; 2. Mounting table; 21. Mounting surface; 22. Through hole; 3. Lifting pin; 31. Diameter expansion portion; 5. Adjustment mechanism; 10. Substrate processing device; 20. Processing chamber; G. Substrate. DETAILED DESCRIPTION

[0022] However, in the technology of the above-mentioned Patent Document 1, the lift pin has a cover portion that contacts the substrate and a barrel portion that contacts the lifting mechanism in a detachable manner below the cover portion. When processing the substrate to be processed, the lift pin is separated from the lifting mechanism provided below the substrate mounting table, and contacts the substrate mounting table only by the weight of the lift pin or only by the weight of the lift pin and the surface pressure generated by the inert gas such as He. Therefore, due to the difference in thermal expansion caused by the temperature difference and thermal expansion coefficient difference between the substrate mounting table and the lifting mechanism during the processing, the position of the top of the cover portion of the lift pin sometimes deviates from the mounting surface. In addition, the lift pin may fall off in the middle of the vertical movement. Moreover, the product generated by the processing of the substrate to be processed adheres to the cover portion, making the actual diameter larger, and the lift pin may be hooked on the lift pin hole of the substrate mounting table in the middle of the descent. As a result, when the lifting mechanism is in a state of descent, the position of the top of the cover portion may not coincide with the mounting surface due to the fall of the lift pin.

[0023] Hereinafter, an embodiment of the technology disclosed in the present invention will be described with reference to the accompanying drawings. However, the structure described in the following embodiments is only for illustration and is not limited to the structure. For example, each part included in the structure can be replaced with any structure that can perform the same function. In addition, any structure can also be added.

[0024] Figure 1 This is a schematic diagram showing an example of a substrate processing apparatus. Figure 1 (a) is a schematic cross-sectional view of a substrate processing apparatus. Figure 1 (b) is from Figure 1 A view viewed in the direction of arrow A in (a) (a top view of the substrate mounting table). Figure 1The substrate processing device 10 shown in (a) is, for example, a device used in the manufacturing process of a flat panel display (FPD) or a semiconductor. The substrate processing device 10 of the present embodiment can perform plasma processing on a glass substrate (hereinafter referred to as "substrate G") as a substrate to be processed. In addition, the substrate to be processed is not limited to a glass substrate, but may also be a semiconductor wafer. The substrate processing device 10 includes a substrate loading device 1, a processing chamber 20 in which the substrate loading device 1 is housed, an exhaust section (not shown) and a gas supply section (not shown) for regulating the pressure of the processing chamber 20, an antenna chamber 80 in which a high-frequency antenna for plasma-forming the supplied gas is housed, and a high-frequency power supply section (not shown). In the processing chamber 20, the substrate G is subjected to plasma processing while being mounted on the substrate loading device 1. The processing chamber 20 includes a container body 100 in the shape of a square tube with a bottom, a rectangular metal window 120, and a rectangular frame-shaped metal frame 110. The container body 100 is made of a conductive material such as aluminum, for example, and is electrically grounded. In addition, an opening is formed on the upper surface of the container body 100. The opening has a metal window 120 and a metal frame 110 described later provided to be insulated from the container body 100, and is hermetically sealed by a sealing member 111 provided between the container body 100 and the metal frame 110. A not-shown inlet and outlet port for carrying the substrate G in and out of the processing space 20 and a gate valve for opening and closing the inlet and outlet port are provided on the side wall of the container body 100. The metal frame 110 is made of a metal material such as aluminum and is provided on the upper surface side of the side wall of the container body 100. The space surrounded by the container body 100, the metal frame 110 and the metal window 120 becomes a processing space 20 where the mounting table 2 is stored and the substrate G is located during plasma processing. The processing container is configured to be able to reduce pressure by using an unillustrated gas supply unit and an exhaust unit connected to the processing space 20, thereby constituting the substrate processing device 10. In the substrate processing device 10, plasma processing is performed by using a high-frequency power supply supplied by an unillustrated high-frequency power supply unit from outside the antenna room 80 in the space above the metal window 120 to an unillustrated high-frequency antenna arranged in the antenna room 80.

[0025] The substrate mounting device 1 includes a mounting table 2 fixedly installed in a processing chamber 20. The mounting table 2 is installed so as to face the metal window 120. The mounting table 2 is installed on the bottom surface of the container body 100 via the leg portion 132, and the mounting table 2 is prevented from being bent even if the container body 100 is maintained in a vacuum by connecting the container body 100 to the lower surface of the mounting table 2 with an insulating bolt (not shown). The upper surface of the mounting table 2 is flat and serves as a mounting portion 21 on which the substrate G is mounted. Figure 6 FIG. 1 is an enlarged view showing an example of a small gap provided on the mounting surface of the substrate mounting table. Figure 6As shown, the mounting table 2 is provided with: a base 2a, which is made of a metal material such as stainless steel, aluminum, or a conductive material; and an electrostatic holding plate 2b, which holds the substrate G by electrostatic adsorption. The mounting portion 21 functions as a lower electrode during plasma processing. A high-frequency power supply unit (not shown) is connected to the base 2a. The high-frequency power supply unit supplies high-frequency power for bias to the base 2a, so that ions in the plasma generated in the processing space 20 can be attracted to the substrate G.

[0026] like Figure 1 As shown in (b), the mounting table 2 has a plurality of through holes 22 that penetrate in the vertical direction, that is, in the height direction of the mounting table 2 and open in the mounting portion 21. These through holes 22 are dispersedly arranged at positions overlapping with the substrate G when viewed from above. As described later, each through hole 22 is provided with a lifting pin 3 that supports the substrate G from the lower surface side. In addition, the number of through holes 22, the arrangement method (how to arrange), etc. are not limited to Figure 1 In addition, although the shape of the through hole 22 when viewed from above is Figure 1 In (b), it is a circle, but it is not limited to this. For example, it can also be a quadrilateral such as a square or a rectangle, an oval, etc.

[0027] Figure 2 It is an enlarged vertical cross-sectional view showing an example of a substrate mounting device included in the substrate processing apparatus. Figure 2 (a) is a diagram showing a state where the lift pins of the substrate mounting device are located at an initial position (home position). Figure 2 (b) is a diagram showing a state where the lift pins are in the process of moving upward or downward. Figure 2 (c) is a diagram showing a state where the lift pin is stopped at the uppermost position. Figure 3 Yes means Figure 2 A schematically enlarged view of an example of a region [B] surrounded by a double-dashed line in FIG. Figure 3 (a) is a diagram showing a state where the lift pin is located at the first position. Figure 3 (b) is a diagram showing a state where the lift pin is located at the second position.

[0028] like Figure 2 (a)~ Figure 2 As shown in (c), the lift pins 3 are supported so as to be movable in the vertical direction relative to the mounting table 2 in the through hole 22. Thus, the lift pins 3 can move in and out of the through hole 22. The lift pins 3 are used when the substrate G is sent into or out of the processing chamber 20. When the substrate G is sent into the processing chamber 20, each lift pin 3 is made to protrude from the mounting portion 21 of the mounting table 2 to the uppermost position, and the substrate G from the conveying arm (not shown) can be supported on each lift pin 3 in this state (see FIG. 1 ). Figure 2Then, each lifting pin 3 is lowered to the initial position (most lowered state) while maintaining the state of supporting the substrate G, so that the substrate G on the mounting table 2 can be subjected to plasma treatment (refer to Figure 2 In addition, when the substrate G after the plasma treatment is sent out from the processing chamber 20, each lifting pin 3 is protruded from the mounting portion 21 of the mounting table 2 to the uppermost position again, so that the substrate G is supported on each lifting pin 3 (refer to Figure 2 Then, the substrate G can be sent out by the conveying arm while maintaining this state.

[0029] The lifting pin 3 is composed of a cylindrical member. The lifting pin 3 has an expanded diameter portion (large diameter portion) 31, an intermediate portion (medium diameter portion) 32, and a reduced diameter portion (small diameter portion) 33, which are arranged in sequence from the upper side. The expanded diameter portion 31 is a portion where the outer diameter is expanded to the maximum. The reduced diameter portion 33 is a portion where the outer diameter is reduced to the minimum. The intermediate portion 32 is a portion where the outer diameter is between the expanded diameter portion and the reduced diameter portion. At least the upper surface 311 of the expanded diameter portion 31 of the lifting pin 3 is composed of a metal material such as stainless steel, aluminum, etc. The upper surface 311 functions as a lower electrode during plasma processing in the same manner as the carrier portion 21. In addition, in the present embodiment, the lifting pin 3 is composed of a solid body, but is not limited to this, and can also be composed of a hollow body, for example.

[0030] like Figure 2 (a)~ Figure 2 As shown in (c), a driving unit 4 for moving the lifting pins 3 in the vertical direction is provided on the lower side of each lifting pin 3. The structure of the driving unit 4 is not particularly limited, and for example, a structure having a motor or the like, a structure having a cylinder or the like, etc. can be used. Figure 1 As shown, the third connecting member 63 supporting the lifting pin 3 extends downwardly from the container body 100 through the through hole 100b provided in the bottom wall 100a of the container body 100, and is connected to the supporting member 40. The supporting member 40 is located outside the container body 100, and includes a conductive member 41 constituting an upper portion and an insulating member 42 provided below the supporting member 40. A conductive bellows 44 for isolating the vacuum atmosphere from the air atmosphere is provided between the conductive member 41 of the supporting member 40 and the lower surface 2c of the mounting table. A sliding member 46 is provided below the supporting member 40, and the sliding member 46 is guided in a vertical direction relative to the lower surface 100c of the container body 100 by a guide member 45 connected to the lower surface 100c of the container body 100. In addition, the lower surface of the sliding member 46 is connected to a direct-acting unit (not shown) composed of a combination of a ball screw and a motor, and can be raised and lowered in a vertical direction relative to the lower surface of the container body 100 by a drive unit control device (not shown).

[0031] When processing the substrate G, the lift pins 3 are lowered and the substrate G is placed on the placement portion 21. Figure 3 As shown in (a), at this time, a small gap SG is generated between the substrate G and the upper surface of the dielectric layer 2f of the supporting portion 21 described later, and a heat transfer gas Q is supplied to the small gap SG. However, in order to uniformly remove the film of the substrate G by etching, for example, it is necessary to make the temperature distribution of the substrate G uniform. Therefore, in order to make the distribution of the heat transfer gas Q in the small gap SG uniform, it is preferable to set the distance D1 between the substrate G and the lifting pin 3 at the initial position to the same size as the distance D2 between the substrate G and the upper surface of the dielectric layer 2f. In addition, the small gap SG can be generated by mounting the substrate G on a plurality of protrusions formed in a protruding shape on the supporting portion 21. For example, Figure 6 As shown, a plurality of convex portions 2d made of dielectric material are formed in a protruding shape on the surface of the base portion 2a of the mounting table, and these convex portions 2d are surrounded by insulating members 2e. The upper surface of the convex portion 2d is equal to or lower than the upper surface of the insulating member 2e. More preferably, the upper surface of the convex portion 2d is at the same height as the upper surface of the insulating member 2e, and when the substrate G is mounted on the mounting table 2, it is in contact with the upper surface of the insulating member 2e and the upper surface of the convex portion 2d. In addition, a thinner dielectric layer 2f made of the same dielectric material as the convex portion 2d is formed below the convex portion 2d, and the small gap SG refers to the gap between the upper surface of the convex portion 2d and the upper surface of the dielectric layer 2f.

[0032] Therefore, the substrate mounting device 1 is configured to adjust the distance D1 between the substrate G and the lifting pins 3 at the initial position to the same size as the distance D2 between the substrate G and the upper surface of the dielectric layer 2f. The following describes the structure (position adjustment method) and its function. Figure 2 (a)~ Figure 2 As shown in (c), each through hole 22 is provided with an adjustment mechanism 5. The adjustment mechanism 5 is configured to be able to adjust the position of the lift pin 3 in the vertical direction in the through hole 22 provided with the adjustment mechanism 5. In this embodiment, the adjustment mechanism 5 is configured to be able to adjust the position of the lift pin 3 in the first position (refer to Figure 3 (a)) and the second position (refer to Figure 3 The position of the lift pin 3 in the vertical direction is adjusted between (b) and (c). In the first position, the upper surface 311 of the lift pin 3 is located at the same height as the upper surface of the dielectric layer 2f. In the second position, the upper surface 311 of the lift pin 3 is located below the upper surface of the dielectric layer 2f (the first position). Figure 3 (a) Figure 3As shown in (b), the adjustment mechanism 5 has a cylindrical member 51 supported to be movable in the vertical direction within the through hole 22 and a fixed member 52 fixed relative to the mounting table 2. The cylindrical member 51 is a cylindrical member penetrated by the lifting pin 3. An external thread 511 is formed on the outer peripheral portion of the cylindrical member 51. On the outer peripheral side of the cylindrical member 51, a cylindrical fixing member 52 is arranged concentrically with the cylindrical member 51. The fixing member 52 is penetrated by the lifting pin 3 in the same manner as the cylindrical member 51. An internal thread 521 threadedly engaged with the external thread 511 of the cylindrical member 51 is formed on the inner peripheral portion of the fixing member 52. Moreover, by changing the thread engagement amount between the external thread 511 of the cylindrical member 51 and the internal thread 521 of the fixing member 52, the position of the cylindrical member 51 in the vertical direction can be adjusted.

[0033] exist Figure 3 In the state shown in (a), the lower surface 312 of the enlarged diameter portion 31 of the lift pin 3 abuts against the upper surface (upper end) 512 of the cylindrical member 51. Thus, the lift pin 3 is positioned at the first position where the upper surface 311 of the lift pin 3 is at the same height as the upper surface of the dielectric layer 2f. It is preferred that the substrate G is processed in this state. Figure 3 In the state shown in (b), the lifting pin 3 is also Figure 3 Similarly, in the state shown in (a), the lower surface 312 of the enlarged diameter portion 31 abuts against the upper surface 512 of the cylindrical member 51, but the upper surface 311 of the enlarged diameter portion 31 is located at the second position below the upper surface of the dielectric layer 2f. Thus, in this embodiment, the enlarged diameter portion 31 is supported from below by the adjustment mechanism 5 and functions as a positioned positioning portion. In addition, regarding the method of changing the threaded engagement amount between the cylindrical member 51 and the fixing member 52, refer to Figure 4 (b) is described subsequently.

[0034] In addition, the cylindrical member 51 is made of a metal material. At least the portion of the fixing member 52 that is threadedly connected to the cylindrical member 51 has a metal material component 53 made of a metal material and a resin material component 54 made of a resin material. The constituent materials of the cylindrical member 51 and the metal material component 53 are not particularly limited, and metal materials such as stainless steel and aluminum can be cited as examples. Moreover, in the substrate mounting device 1, the mounting table 2, the cylindrical member 51, the metal material component 53, and the lifting pin 3 are made of a metal material, and the lifting pin 3 is thermally connected to the mounting table 2 by means of the cylindrical member 51 and the metal material component 53. Here, "thermal connection" refers to a state in which the components are in contact with each other and heat is rapidly transferred, that is, a state in which the heat transfer is relatively high. Moreover, the combination of being made of a metal material and being thermally connected can make the temperature distribution of the system having the mounting table 2, the cylindrical member 51, the metal material component 53, and the lifting pin 3 uniform. This can prevent the height of the upper surface 311 of the lift pin 3 from deviating from the height of the upper surface of the dielectric layer 2f due to a difference in thermal expansion between the mounting table 2 and the lift pin 3, thereby maintaining the Figure 3 In this way, in the substrate mounting device 1, the positional relationship between the mounting table 2 and the lifting pins 3 at the initial position can be maintained regardless of the temperature change. As a result, the distance D1 between the substrate G and the lifting pins 3 at the initial position can be set to the same size as the distance D2 between the substrate G and the upper surface of the dielectric layer 2f, so that the temperature distribution of the substrate G can be uniform.

[0035] In addition, in the present embodiment, the lift pin 3 is composed of one component. Thus, it is possible to prevent the lift pin 3 from partially falling off or getting caught in the through hole 22 during the up and down movement, thereby preventing the height of the upper surface 311 of the lift pin 3 at the initial position from deviating from the height of the upper surface of the dielectric layer 2f. In addition, in the present embodiment, the lift pin 3 is composed of one component, but it is not limited to this, and it can also be composed of multiple components. In the case where the lift pin 3 is composed of multiple components, it is preferred that the components are fixed to each other. In addition, in the case where the lift pin 3 is composed of multiple components, for example, the enlarged diameter portion 31 and the reduced diameter portion 33 may be composed of a metal material such as stainless steel, and the intermediate portion 32 may be composed of a resin material such as polyimide.

[0036] Here, for example, consider a case where the lift pins 3 are replaced with new lift pins 3. In this case, due to individual differences between the lift pins 3, there is a possibility that the height of the upper surface 311 of the lift pin 3 deviates from the height of the upper surface of the dielectric layer 2f, that is, the distance D1 and the distance D2 are different (for example, Figure 3In addition, in addition to individual differences among the lift pins 3, for example, the height of the upper surface 311 of the lift pin 3 may deviate from the height of the upper surface of the dielectric layer 2f over time (for example, Figure 3 Even if such a deviation occurs, by changing the threaded engagement amount between the cylindrical member 51 and the fixing member 52, Figure 3 The state shown in (a). The constituent material of the resin material constituent part 54 is not particularly limited, and for example, resin materials such as polyimide and fluororesin with heat resistance can be listed. As a result, it is possible to prevent the position of the cylindrical member 51 from being deviated due to the loosening of the threaded connection between the cylindrical member 51 and the fixed member 52. Preventing the position of the cylindrical member 51 from being deviated helps prevent the position of the upper surface 311 of the lifting pin 3 from being deviated. In addition, in the case where the fixed member 52 has a metal material constituent part 53 and a resin material constituent part 54, the fixed member 52 can be manufactured by, for example, two-color molding. In addition, in the present embodiment, the cylindrical member 51 (one of the cylindrical member 51 and the fixed member 52) is made of a metal material, and the fixed member 52 (the other) has a structure of a metal material constituent part 53 and a resin material constituent part 54, but it is not limited to this. For example, it is also possible to have a structure in which the fixed member 52 is made of a metal material and the cylindrical member 51 has a metal material constituent part 53 and a resin material constituent part 54.

[0037] like Figure 3 (a) Figure 3 As shown in (b), the adjustment mechanism 5 (substrate mounting device 1) is provided with a first sealing member 55 and a second sealing member 56. The first sealing member 55 is arranged concentrically with the lifting pin 3 between the lifting pin 3 and the portion of the fixed member 52 penetrated by the lifting pin 3. The first sealing member 55 is formed in a ring shape along the outer periphery of the lifting pin 3, and seals between the lifting pin 3 and the fixed member 52. The second sealing member 56 is arranged concentrically with the fixed member 52 between the mounting table 2 and the fixed member 52. The second sealing member 56 is formed in a ring shape along the outer periphery of the fixed member 52, and seals between the mounting table 2 and the fixed member 52. In addition, the constituent materials of the first sealing member 55 and the second sealing member 56 are not particularly limited, and for example, various rubber materials with heat resistance such as silicone rubber and fluororubber can be listed. As a result, the first sealing member 55 becomes compressed between the lifting pin 3 and the fixed member 52, and can fully seal between them. The first sealing member 55 is preferably not compressed to such an extent as to hinder the vertical movement of the lift pins 3. Similar to the first sealing member 55, the second sealing member 56 is compressed between the mounting table 2 and the fixing member 52, and can sufficiently seal therebetween.

[0038] As described above, a heat transfer gas Q is supplied to the small gap SG between the substrate G and the upper surface of the dielectric layer 2f. The heat transfer gas Q is a temperature regulating gas for adjusting the temperature of the substrate G, and is discharged to the small gap SG from the flow path 23 opened in the mounting portion 21. There is no particular limitation on the heat transfer gas Q, and for example, inert gases such as helium, nitrogen, and argon can be used. The heat transfer gas Q may enter the interior of the mounting table 2 through the through hole 22, that is, enter the interior of the mounting table 2 from the side of the mounting portion 21, but the first sealing member 55 and the second sealing member 56 can each block the entry (the flow of the heat transfer gas Q). Thus, for example, the heat transfer gas Q supplied to the small gap SG can be prevented from entering the interior of the mounting table 2 and being wasted. In addition, for example, the supply of the heat transfer gas Q to the small gap SG can be stopped according to the processing of the substrate G. In addition, as described above, in the substrate mounting device 1, the mounting table 2, the cylindrical member 51, the metal material component 53, and the lift pins 3 are made of metal materials, and the lift pins 3 are thermally connected to the mounting table 2 via the cylindrical member 51 and the metal material component 53. Therefore, in the substrate mounting device 1, the first sealing member 55 and the second sealing member 56 are prevented from interfering with the heat transfer between the lift pins 3 and the mounting table 2.

[0039] Figure 4 It is an enlarged vertical cross-sectional view showing an example of a substrate mounting device included in the substrate processing apparatus. Figure 4 (a) means from Figure 2 The state shown in (a) is a diagram showing a state in which the driving unit is about to further move the lifting pin downward. Figure 4 (b) is a diagram showing a state in which the position of the cylindrical member in the vertical direction, that is, the height of the cylindrical member is adjusted. Figure 4 (a)( Figure 2 (a)~ Figure 2 As shown in (c), the substrate mounting device 1 includes: a connecting mechanism (connecting portion) 6 that connects the lifting pin 3 and the driving portion 4; and a supporting member (supporting portion) 7 that supports the connecting mechanism 6 relative to the mounting table 2. The connecting mechanism 6 includes a first connecting member 61, a second connecting member 62, a third connecting member 63, an elastic member (urging member) 64, and a linear bushing 65. The supporting member 7 is formed in a cylindrical shape, and can accommodate and support the connecting mechanism 6 inside thereof.

[0040] The first connecting member 61 has a cylindrical portion 611 and a flange portion 612 provided at the lower end of the cylindrical portion 611. The lower end of the reduced diameter portion 33 of the lift pin 3 is inserted into the inner side of the cylindrical portion 611. In addition, an internal thread 613 is formed on the inner circumference of the cylindrical portion 611. On the other hand, an external thread 331 is formed at the lower end of the reduced diameter portion 33 of the lift pin 3 to be threadedly engaged with the internal thread 613. Moreover, the lift pin 3 is connected to the first connecting member 61 (connecting mechanism 6) by threading the internal thread 613 and the external thread 331. The flange portion 612 is a portion that is enlarged relative to the outer diameter of the cylindrical portion 611.

[0041] The third connecting member 63 is arranged at a lower side than the first connecting member 61. The third connecting member 63 is composed of a cylindrical member, and its lower end is connected to the driving unit 4. The third connecting member 63 can move up and down together with the lifting pin 3 by the driving unit 4. A linear bushing 65 is arranged between the third connecting member 63 and the supporting member 7. The linear bushing 65 is fixed to the inner circumference of the supporting member 7, and guides the third connecting member 63 that moves up and down together with the lifting pin 3. As a result, the third connecting member 63 can move up and down smoothly. The smooth up and down movement of the third connecting member 63 contributes to the smooth up and down movement of the lifting pin 3.

[0042] The first connecting member 61 and the third connecting member 63 are connected by means of the second connecting member 62. The second connecting member 62 has a cylindrical portion 621, a cover portion 622 provided at the upper end of the cylindrical portion 621, and a protrusion 623 provided at the lower end of the cylindrical portion 621. The cylindrical portion 621 is formed into a bottomed cylindrical shape, and the first connecting member 61 is inserted into the cover portion 622. The cover portion 622 is formed into an annular shape along the circumference of the cylindrical portion 621, and the cylindrical portion 611 of the first connecting member 61 is slidably fitted inside the cover portion 622. The protrusion 623 is a portion protruding downward from the bottom of the cylindrical portion 621. The second connecting member 62 is connected to the third connecting member 63 by means of the protrusion 623.

[0043] The elastic member 64 is composed of a coil spring. The elastic member 64 is concentrically arranged on the outer periphery of the cylindrical portion 611 of the first connecting member 61 in the cylindrical portion 621 of the second connecting member 62. In addition, the elastic member 64 is compressed between the flange portion 612 of the first connecting member 61 and the cover portion 622 of the second connecting member 62. Figure 2 As shown in (a), the lift pin 3 can be stored in the through hole 22 by the driving unit 4 and returned to the initial position. At the initial position, the enlarged diameter portion 31 of the lift pin 3 abuts against the cylindrical member 51 of the adjustment mechanism 5. As a result, the distance D1 between the substrate G and the lift pin 3 at the initial position becomes the same as the distance D2 between the substrate G and the upper surface of the dielectric layer 2f. Figure 2In the state shown in (a), the lift pin 3 receives the force from the elastic member 64 via the first connecting member 61. As a result, the lift pin 3 is pulled downward, so that the expanded diameter portion 31 more reliably contacts the cylindrical member 51 of the adjustment mechanism 5. As a result, even if the lift pin 3 does not completely return to the initial position due to, for example, aging of the drive unit 4, the lift pin 3 can be returned to the initial position by the force of the elastic member 64, thereby ensuring the reproducibility of making the distance D1 the same size as the distance D2. In addition, in Figure 2 In the state shown in (a), the elastic member 64 is in an incompletely contracted state, and sufficient contraction margin is ensured. Figure 4 As shown in (a), from Figure 2 When the driving unit 4 further lowers the lifting pin 3 from the state shown in (a), the elastic member 64 can be further compressed because it ensures sufficient contraction margin. As a result, the driving unit 4 can prevent the lifting pin 3 from being excessively pulled by the lifting pin 3, thereby preventing the lifting pin 3 from being deformed such as elongation and breakage. In this way, the elastic member 64 also functions as a relaxation unit for relaxing the pulling force of the driving unit 4 on the lifting pin 3. Here, the container body 100 and the mounting table 2 each have a separate water path (not shown) inside, and are separately connected to an external temperature control unit (not shown) by a pipeline (not shown) such as a heat-resistant hose, so that a temperature control refrigerant circulates, and the temperature obtained from a temperature measuring device (not shown) such as a thermocouple separately provided for the container body 100 and the mounting table 2 is monitored, and the temperature of the circulating temperature control refrigerant is separately adjusted by the external temperature control unit, thereby performing temperature management. For example, when the temperature of the container body is managed at 110°C and the temperature of the mounting table 2 is managed at 30°C, the temperature of the third connecting member 63 is higher than the temperature of the mounting table 2 due to the influence of the temperature of the container body 100 via the guide member 45. In addition, when the temperature of the container body 100 is managed at 80°C and the temperature of the mounting table 2 is managed at 110°C, the temperature of the third connecting member 63 is lower than the temperature of the mounting table 2 due to the influence of the temperature of the container body 100 via the guide member 45.

[0044] By using a rubber material such as polyurethane rubber having high heat insulation as the constituent material of the elastic member 64, the heat transfer from the third connecting member 63 can also be reduced. When durability is given priority, it is preferable to use austenitic stainless steel. When a rubber material is used as the constituent material of the elastic member 64, the heat input and output between the lifting pin 3 and the driving part 4 can be suppressed, thereby suppressing the temperature change of the lifting pin 3. In addition, by using a resin material such as polyimide having high heat resistance as the constituent material of the first connecting member 61, the second connecting member 62, and the third connecting member 63, it is possible to reduce heat transfer. When durability is given priority, it is preferable to use various metal materials such as stainless steel or aluminum.

[0045] Next, refer to Figure 4 (b) Figure 5 A method of adjusting the vertical position of the cylindrical member 51 of the adjustment mechanism 5 , that is, the height of the cylindrical member 51 , will be described. Figure 5 This is an enlarged view showing an example of a cylindrical member of the adjustment mechanism included in the substrate mounting device. Figure 5 (a) is an enlarged vertical cross-sectional view showing an example of a cylindrical member. Figure 5 (b) is an enlarged top view showing an example of a cylindrical member. Figure 5 (a) Figure 5 As shown in (b), a pair of grooves 513 are provided on the upper surface 512 of the cylindrical member 51. The pair of grooves 513 are arranged on opposite sides of the central axis O51 of the cylindrical member 51. The jig 30 is engaged with the pair of grooves 513 at the same time. In this embodiment, the jig 30 is a flat-blade screwdriver.

[0046] [1] When adjusting the height of the cylindrical member 51, the antenna chamber 80 above is lifted from the metal window 110, and the antenna chamber 80 is separated from the processing chamber 20, so that the processing chamber 20 is opened.

[0047] [2] Then, Figure 4 As shown in (b), the lift pin 3 is pulled out from the through hole 22 (cylindrical member 51). As described above, the lift pin 3 is connected to the first connecting member 61 of the connecting mechanism 6 by screwing. The lift pin 3 can be pulled out by releasing the screw connection between the lift pin 3 and the first connecting member 61.

[0048] [3] Next, the jig 30 is set to an engaged state in which the groove 513 of the cylindrical member 51 is engaged from the upper side. Then, while maintaining this engaged state, the cylindrical member 51 is rotated around its central axis O51 using the jig 30. By this rotation, the amount of thread engagement between the cylindrical member 51 and the fixed member 52 changes, and the height position of the cylindrical member 51 can be adjusted. For example, by rotating the cylindrical member 51 in one direction around the central axis O51, the amount of thread engagement between the cylindrical member 51 and the fixed member 52 increases, and the height position of the cylindrical member 51 can be adjusted to be lower. In addition, by rotating the cylindrical member 51 around the central axis O51 in a direction opposite to the above direction, the amount of thread engagement between the cylindrical member 51 and the fixed member 52 decreases, and the height position of the cylindrical member 51 can be adjusted to be higher. In addition, it is preferable to know in advance the rotation angle of the cylindrical member 51 per unit height (unit: deg / μm).

[0049] [4] Next, the jig 30 is removed, and the lift pin 3 is inserted into the through hole 22 so that the lift pin 3 and the first connecting member 61 are connected to the limit of connection.

[0050] [5] Next, confirm whether the upper surface 311 of the lifting pin 3 and the upper surface of the dielectric layer 2f are at the same height. Use a micrometer to confirm the height. Then, if the result of this confirmation is that the upper surface 311 and the upper surface of the dielectric layer 2f are at the same height, the opening of the processing chamber 20 is closed to complete the height adjustment of the cylindrical member 51. On the other hand, if the upper surface 311 and the upper surface of the dielectric layer 2f are not at the same height, repeat steps [2] to [5] until the upper surface 311 and the upper surface of the dielectric layer 2f are at the same height.

[0051] In addition, although a flat-blade screwdriver is used as the jig 30 in the present embodiment, the present invention is not limited thereto, and for example, a cross-shaped screwdriver may be used depending on the arrangement and shape of the groove 513 .

[0052] In addition, in the present embodiment, the height of the cylindrical member 51 is adjusted in such a manner that the position of the upper surface 311 of the lifting pin 3 is at the same height as the upper surface of the dielectric layer 2f, but of course, the height of the cylindrical member 51 can also be adjusted in such a manner that the position of the upper surface 311 is lowered toward the lower surface 2c side of the mounting table 2 in order to adjust the temperature of the substrate G.

[0053] In addition, in this embodiment, an inductively coupled plasma apparatus having a metal window is described as a substrate processing apparatus, but the present invention is not limited thereto, and an inductively coupled plasma apparatus having a dielectric window instead of a metal window may be used. In addition, the plasma generation method used in the substrate processing apparatus is not limited to inductively coupled plasma, and the substrate processing apparatus may use other plasma generation methods such as capacitively coupled plasma and microwave plasma.

[0054] The preferred embodiments of the present disclosure are described above, but the present disclosure is not limited to the above-mentioned embodiments, and various deformations and changes can be made within the scope of the main purpose. In addition, the lifting pin 3 can move in the up-down direction relative to the mounting table 2 in the above-mentioned embodiment, but it is not limited to this. For example, the lifting pin 3 can be set in a fixed state, and the mounting table 2 can move in the up-down direction relative to the lifting pin 3. In this case, the lifting pin 3 can also move in and out of the through hole 22. In this way, the lifting pin 3 only needs to be able to move in the up-down direction relative to the mounting table 2.

Claims

1. A substrate mounting device, wherein: The substrate mounting device comprises: A mounting table having a mounting surface on which a substrate is mounted and a plurality of through holes penetrating in a vertical direction and opening on the mounting surface; a lifting pin provided in each of the through holes, capable of moving in the up-down direction relative to the mounting table and supporting the substrate from the lower surface side; as well as an adjustment mechanism, which is provided in each of the through holes and can adjust the position of the lift pin in the corresponding through hole in the up-down direction, The lift pin has a positioning portion supported from below by the adjustment mechanism.

2. The substrate mounting device according to claim 1, wherein: The lifting pin is composed of a cylindrical member and has an expanded diameter portion formed by expanding the outer diameter of the cylindrical member. The expanded diameter portion functions as the positioning portion.

3. The substrate mounting device according to claim 2, wherein: The adjustment mechanism includes a cylindrical member through which the lifting pin penetrates. The positioning of the lift pin is performed by causing the enlarged diameter portion to abut against the upper end of the cylindrical member.

4. The substrate mounting device according to claim 3, wherein: The cylindrical member is supported so as to be movable in the vertical direction in the corresponding through hole. By rotating the cylindrical member about its central axis using the jig in an engaged state in which the jig is engaged from the upper side of the cylindrical member, the position of the cylindrical member in the vertical direction can be adjusted.

5. The substrate mounting device according to claim 4, wherein: The adjustment of the cylindrical member is performed in a state where the lifting pin is pulled out from the cylindrical member. A groove for engaging the jig is provided at the upper end of the cylindrical member.

6. The substrate mounting device according to claim 1, wherein: The adjustment mechanism comprises: a cylindrical member through which the lifting pin passes; and a fixing member fixed to the mounting table at the outer peripheral side of the cylindrical member and screwed to the cylindrical member. The cylindrical member can adjust the position in the vertical direction by changing the amount of threaded engagement with the fixing member.

7. The substrate mounting device according to claim 6, wherein: At least a portion of one of the cylindrical member and the fixing member that is threadedly engaged with the other member is made of a metal material and a resin material.

8. The substrate mounting device according to claim 7, wherein: The other component is made of a metallic material.

9. The substrate mounting device according to claim 6, wherein: The fixing member has a portion penetrated by the lifting pin, The substrate mounting device comprises: a first sealing member that seals between the lift pin and a portion of the fixed member through which the lift pin penetrates; and The second sealing member seals a space between the mounting table and the fixing member.

10. The substrate mounting device according to claim 9, wherein: supplying a temperature regulating gas for regulating the temperature of the substrate between the mounting surface and the substrate, The first sealing member and the second sealing member are each capable of blocking the flow of the temperature regulating gas from the placement surface side.

11. The substrate mounting device according to claim 1, wherein: The substrate mounting device comprises: a driving unit disposed on the lower side of the lifting pin and moving the lifting pin in the up-down direction; and a connecting portion connecting the lifting pin and the driving portion, The connecting portion includes an elastic member, and when the lift pin is received in the corresponding through hole, the elastic member biases the lift pin downward so that the lift pin comes into contact with the adjustment mechanism.

12. The substrate mounting device according to claim 11, wherein: The elastic member also functions as a relaxing portion that relaxes a pulling force applied to the lift pin by the driving portion when the driving portion lowers the lift pin.

13. The substrate mounting device according to claim 11, wherein: The lift pin and the connection portion are connected by screwing.

14. The substrate mounting device according to claim 1, wherein: The mounting table is arranged in a fixed state. The lift pins are configured to be movable in a vertical direction relative to the mounting table.

15. The substrate mounting device according to claim 1, wherein: The mounting table and the lift pins are each made of a metal material including at least stainless steel or aluminum.

16. A substrate processing device, wherein: The substrate processing device comprises: a substrate mounting device on which a substrate is mounted; and a processing chamber that accommodates the substrate mounting device and processes the substrate in the processing chamber, The substrate mounting device comprises: A mounting table having a mounting surface on which a substrate is mounted and a plurality of through holes penetrating in a vertical direction and opening on the mounting surface; a lifting pin provided in each of the through holes, capable of moving in the up-down direction relative to the mounting table and supporting the substrate from the lower surface side; as well as an adjustment mechanism, which is provided in each of the through holes and can adjust the position of the lift pin in the corresponding through hole in the up-down direction, The lift pin has a positioning portion supported from below by the adjustment mechanism.

17. A position adjustment method, which is a method for adjusting the position of a lift pin of a substrate processing device, The substrate processing device comprises: A mounting table having a mounting surface on which a substrate is mounted and a plurality of through holes penetrating in a vertical direction and opening on the mounting surface; The lifting pins are provided in the through holes, are movable in the up-down direction relative to the mounting table, and support the substrate from the lower surface side; and an adjustment mechanism, which is provided in each of the through holes and can adjust the position of the lift pin in the corresponding through hole in the up-down direction, In this position adjustment method, The adjustment mechanism supports the lift pin from below to position the lift pin.

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