A multi-chip power module with continuous and stable cooling operation

Abstract

The present invention relates to the technical field of power modules, and specifically to a multi-chip power module with continuous and stable cooling operation, including a module cover frame, the top of the module cover frame is fixedly connected to an upper shrink frame, the bottom of the module cover frame is fixedly connected to a lower shrink frame, the top of the upper shrink frame and the bottom of the lower shrink frame are both provided with a group of air control frames, and the back of the air control frame is provided with an air pipe. The present invention can enable the equipment to perform water-cooling and heat dissipation operations that are more efficiently adapted to multi-chip power modules by providing a module cover frame, an upper shrink frame, an air control frame, an air pipe, an air control pump, a telescopic air bag, a top pressure heat sink, a thermal conductive patch, a water-cooling valve, an air-cooling mesh slot, a water-cooling side frame, a water-cooling row, a water-cooling fan, and a water-cooling unit. In actual use, the staff first puts the multi-chip power module to be used as a whole into the module cover frame, installs and fixes it, and then starts the air control pump between the air pipes.

Description

Technical Field

[0001] The present invention relates to the technical field of power modules, in particular to a multi-chip power module with continuous and stable cooling operation. Background Art

[0002] A power semiconductor module is a combination of certain functions and modes. A power semiconductor module is a high-power electronic power device that is combined according to certain functions and then sealed into one. A power semiconductor module can achieve different functions according to the different packaged components. A power semiconductor module can be an air cooling module with air cooling, and a water cooling module with water cooling, etc. A power module is a power power electronic device that is combined according to certain functions and then sealed into a module. An intelligent power module is an advanced hybrid integrated power component with IGBT as the core. It consists of a high-speed, low-power die, an optimized gate drive circuit, and a fast protection circuit. The IGBT die in the IPM is of high-speed type, and the drive circuit is close to the IGBT, with a small drive delay, so the IPM has a fast switching speed and low loss. The IPM has an integrated real-time detection circuit that can continuously detect the IGBT current and temperature. When a serious overload or even a direct short circuit occurs, and the temperature is overheated, the IGBT will be softly shut down in a controlled manner and a fault signal will be issued at the same time. In addition, IPM also has functions such as bridge arm tube interlocking and drive power undervoltage protection. Although IPM is more expensive, due to the integrated drive and protection functions, IPM has the advantages of compact structure, high reliability and ease of use compared with simple IGBT.

[0003] For example, the patent document with the announcement number CN 118398581 B discloses a multi-chip power module with continuous and stable cooling operation, including a power module, a cooling module for dissipating heat from the power module, and a liquid supply module for supplying liquid to the cooling module. The power module includes a substrate and a plurality of chips arranged on the substrate, wherein the substrate and the chips are packaged in a housing, a cooling module includes a heat dissipation base plate bonded to the substrate, the bottom surface of the heat dissipation base plate vertically extends downward to form a plurality of bumps, and the bottom surface of the bumps is bonded to a heat dissipation block, and a liquid supply module includes a liquid inlet box and a liquid collection box fixed on both sides of the bumps, wherein the liquid inlet box is used to deliver the cooling medium into the cooling tank, and the liquid collection box is used to collect the cooling medium discharged from the cooling tank. The present invention sets the cooling medium flow rate in the cooling tank to be adjustable according to the heat generation of the corresponding chip, thereby improving the utilization rate of the cooling medium, thereby achieving more efficient cooling.

[0004] However, in actual use, due to the limitation of its own structure, this structure can only perform simple water cooling operation on multi-chip power modules. Its water cooling capacity is limited, which makes it impossible to cool each chip. In addition, some circuit boards adopt an upper and lower double-layer design. The upper and lower sets of water cooling equipment cannot perform more adaptive and efficient circulating water cooling operations. At the same time, while the equipment is performing water cooling of multiple chips in the power module, it cannot perform adaptive air cooling of the entire circuit board, and cannot meet the high-efficiency cooling of the multi-chip power module and the daily use needs. Therefore, it is urgent to design a multi-chip power module with continuous and stable cooling operation to solve the above problems. Summary of the invention

[0005] The purpose of the present invention is to provide a multi-chip power module with continuous and stable cooling operation, so as to solve the problem that the existing structure proposed in the above background technology can only perform simple water cooling operation on the multi-chip power module during actual use due to the limitation of its own structure. Its water cooling capacity is limited, resulting in the inability to cool each chip. In addition, some circuit boards adopt an upper and lower double-layer design, and the upper and lower groups of water cooling equipment cannot perform more adaptive and efficient circulating water cooling operations. At the same time, while the equipment is performing water cooling of multiple chips in the power module, it cannot perform adaptive air cooling of the entire circuit board, and cannot meet the high-efficiency cooling of the multi-chip power module and the daily use needs.

[0006] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a multi-chip power module with continuous and stable cooling operation, comprising a module cover frame, the top of the module cover frame is fixedly connected to an upper shrink frame, the bottom of the module cover frame is fixedly connected to a lower shrink frame, a group of air control frames are arranged at the top of the upper shrink frame and the bottom of the lower shrink frame, an air supply pipe is arranged at the back of the air control frame, an air control pump is arranged at the center of the air supply pipe, a telescopic air bag is arranged between the upper and lower air control frames, one end of the telescopic air bag is fixedly connected to a top pressure heat sink, a thermal conductive patch is arranged on the surface of the top pressure heat sink, water cooling valves are arranged on both sides of the top pressure heat sink, and air cooling mesh slots are arranged at both ends of the top pressure heat sink;

[0007] Water-cooled side frames and diverter air frames, the two sides of the module cover frame are fixedly connected with water-cooled side frames, the two ends of the module cover frame are fixedly connected with diverter air frames, the front of the diverter air frame is fixedly connected with a fan seat, the front of the fan seat is provided with a heat dissipation fan, and handle grooves are opened on both sides of the fan seat.

[0008] Preferably, both ends of the back side of the diverter air frame are fixedly connected with plug-in ventilation seats, one end of the plug-in ventilation seat is provided with a first sealing ring, and the edge of the diverter air frame is provided with a second sealing ring.

[0009] Preferably, a water-cooling row is arranged on the front of the water-cooling side frame, and water-cooling fans are evenly arranged on the front of the water-cooling row.

[0010] Preferably, a water cooling unit is arranged on the back of the water-cooling side frame, plug-in frames are fixedly connected to both ends of the water cooling unit, and a dustproof net is arranged inside the plug-in frame.

[0011] Preferably, an adhesive plate is provided at the bottom of the thermally conductive patch, and an adhesive pad is provided on the surface of the top pressure heat sink.

[0012] Preferably, a shrinkage groove is provided inside the upper shrinkage frame, and first positioning rubber strips are provided at upper and lower ends of the shrinkage groove.

[0013] Preferably, pipe row grooves are provided on both sides of the inner wall of the shrinkage groove, and pipe outlet grooves are provided on both sides of the bottom of the upper shrinkage frame.

[0014] Preferably, lifting grooves are provided at the upper and lower ends of the module cover frame, ventilation grooves are provided at the front and rear ends of the module cover frame, and second positioning rubber strips are evenly arranged on the inner wall edge of the module cover frame.

[0015] Preferably, pipe covers are provided at the four side corners of the module cover frame.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] The high-efficiency cooling multi-chip power module can enable the equipment to perform water-cooling and heat dissipation operations that are more efficiently adapted to the multi-chip power module by arranging a module cover frame, an upper shrinkage frame, an air control frame, an air supply pipe, an air control pump, a telescopic air bag, a top pressure heat sink, a thermal conductive patch, a water-cooling connection valve, an air-cooling mesh slot, a water-cooling side frame, a water-cooling row, a water-cooling fan, a water-cooling unit, an adhesive plate, an adhesive pad, a shrinkage slot, a first positioning rubber strip, a pipe slot, a pipe outlet slot, a lifting slot, a ventilation slot, a second positioning rubber strip, a lower shrinkage frame and a pipe cover. In actual use, the staff first puts the multi-chip power module to be used as a whole into the interior of the module cover frame for installation and fixation, and then starts the air control pump between the air supply pipes to inflate the telescopic air bag of the air control frame through the air supply pipe, and adaptably connects the top pressure heat sink at one end thereof to the top of the multi-chip power module inside the module cover frame, and performs positioning protection at the upper and lower lifting slots and the second positioning rubber strip inside the module cover frame, and firstly performs top pressure heat dissipation and heat dissipation. The surface of the hot plate can be positioned and pasted to the adhesive plate of the thermal conductive patch of the multi-chip power module through an adhesive pad, and the thermal conductive patch is then used to fit the chip for heat dissipation. At this time, it is only necessary to start the water-cooling units of the water-cooling side frames on both sides of the module cover frame, and cooperate with the water-cooling row and water-cooling fan on the front to achieve rapid water-cooling flow heat dissipation operation at the water-cooling valves on both sides of the top pressure heat dissipation plate. At the same time, the lower shrinkage frame and the upper shrinkage frame at the bottom of the module cover frame adopt the same design, and the air control frame is also designed with an upper and lower two-layer structure to ensure that the multi-chip power module inside the module cover frame can achieve efficient synchronous heat dissipation operation even if it is a double-layer design. In addition, the four corners of the pipe cover on the side of the module cover frame cooperate with the pipe outlet groove and the pipe outlet groove inside the upper shrinkage frame, so that the upper and lower top pressure heat dissipation plates and the water-cooling side frames on both sides can be circulated and connected to ensure that the water-cooling liquid is used for efficient circulation and heat dissipation, thereby realizing targeted and efficient water-cooling heat dissipation operation of the chips of the multi-chip power module, reflecting the practicality of the equipment design.

[0018] The multi-chip power module with high-efficiency cooling further improves the overall use effect of the equipment by arranging a module cover frame, a water-cooled side frame, a shunt air frame, a fan seat, a heat dissipation fan, a handle slot, a plug-in ventilation seat, a first sealing ring, a second sealing ring, a water-cooled row, a water-cooled fan, a water-cooled unit, a plug-in frame and a dust-proof net. In daily use, the staff can adaptably plug the shunt air frame into the plug-in frame on the side of the water-cooled unit through the plug-in ventilation seats at both ends of the back, and the first sealing ring at one end of the plug-in ventilation seat is sealed and docked at the plug-in frame. The second sealing ring at the back edge of the shunt air frame is also sealed and fixed on the front side of the module cover frame, and the dust-proof net inside the plug-in frame is used to filter the airflow. At this time, start the cooling fan on the front of the fan base, and the cooling airflow can be diverted and transported through the diversion wind frame to the inside of the module cover frame and the inside of the water-cooled side frames on both sides. On the one hand, it can realize the overall air-cooling and heat dissipation operation of the multi-chip power module circuit board inside the module cover frame, and on the other hand, it can cooperate with the water-cooling row and the water-cooling fan to speed up the heat dissipation efficiency of the water-cooling liquid inside the water-cooling unit, so that the heat dissipation capacity of the water-cooling liquid circulating up and down is improved. At the same time, when the cooling airflow passes through the inside of the module cover frame, it can directly pass through the air-cooling mesh slot on the front of the top pressure heat sink, so as to perform overall comprehensive air-cooling and heat dissipation operations for the multi-chip power module between the upper and lower top pressure heat sinks, reflecting the comprehensiveness of the equipment design. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a three-dimensional schematic diagram of the structure of the present invention;

[0020] Figure 2 It is an overall schematic diagram of the gas control frame and gas transmission pipe structure of the present invention;

[0021] Figure 3 It is an overall schematic diagram of the module cover frame structure of the present invention;

[0022] Figure 4 It is an overall schematic diagram of the water-cooled side frame structure of the present invention;

[0023] Figure 5 It is an overall schematic diagram of the split wind frame structure of the present invention;

[0024] Figure 6 It is an overall schematic diagram of the upper shrinkage frame structure of the present invention;

[0025] Figure 7 For the present invention Figure 1 A magnified schematic diagram of the structure at center A;

[0026] Figure 8 For the present invention Figure 2 A magnified schematic diagram of the structure at B in the figure.

[0027] In the figure: 1. module cover frame; 2. upper retractable frame; 3. air control frame; 4. air supply pipe; 5. air control pump; 6. telescopic air bag; 7. top pressure heat sink; 8. thermal conductive patch; 9. water cooling valve; 10. air cooling mesh slot; 11. water cooling side frame; 12. split wind frame; 13. fan seat; 14. heat dissipation fan; 15. handle slot; 16. plug-in ventilation seat; 17. first sealing ring; 18. second sealing ring; 19. water cooling row; 20. water cooling fan; 21. water cooling unit; 22. plug-in frame; 23. dust net; 24. adhesive plate; 25. adhesive pad; 26. retractable slot; 27. first positioning rubber strip; 28. pipe slot; 29. ​​pipe outlet slot; 30. lifting slot; 31. ventilation slot; 32. second positioning rubber strip; 33. lower retractable frame; 34. pipe cover. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] See also Figure 1-8 , an embodiment provided by the present invention:

[0030] A multi-chip power module with continuous and stable cooling operation comprises a module cover frame 1, the top of the module cover frame 1 is fixedly connected to an upper shrink frame 2, the bottom of the module cover frame 1 is fixedly connected to a lower shrink frame 33, a group of air control frames 3 are arranged at the top of the upper shrink frame 2 and the bottom of the lower shrink frame 33, an air supply pipe 4 is arranged at the back of the air control frame 3, an air control pump 5 is arranged at the center of the air supply pipe 4, a telescopic air bag 6 is arranged between the upper and lower air control frames 3, one end of the telescopic air bag 6 is fixedly connected to a top pressure heat sink 7, and the top pressure heat sink The surface of the plate 7 is provided with a heat conductive patch 8, water cooling valves 9 are provided on both sides of the top pressure heat sink 7, air cooling mesh grooves 10 are provided at both ends of the top pressure heat sink 7, a pasting plate 24 is provided at the bottom of the heat conductive patch 8, a pasting pad 25 is provided on the surface of the top pressure heat sink 7, a shrinkage groove 26 is provided inside the upper shrinkage frame 2, first positioning rubber strips 27 are provided at the upper and lower ends of the shrinkage groove 26, pipe grooves 28 are provided on both sides of the inner wall of the shrinkage groove 26, pipe outlet grooves 29 are provided on both sides of the bottom of the upper shrinkage frame 2, and the module cover frame 1 The upper and lower ends of the module cover frame 1 are provided with lifting grooves 30, the front and rear ends of the module cover frame 1 are provided with ventilation grooves 31, the inner wall edge of the module cover frame 1 is evenly provided with second positioning rubber strips 32, and the four corners of the side of the module cover frame 1 are provided with pipe covers 34. The air control pump 5 between the air pipes 4 is started to inflate the telescopic airbag 6 of the air control frame 3 through the air pipes 4, and the top pressure heat sink 7 at one end is adaptively connected to the top of the multi-chip power module inside the module cover frame 1. The upper and lower lifting grooves 3 inside the module cover frame 1 are 0 and the second positioning rubber strip 32 are used for positioning protection. The surface of the top-pressed heat sink 7 can be positioned and pasted with the adhesive pad 25 to fit the adhesive plate 24 of the thermal conductive patch 8 of the multi-chip power module. The thermal conductive patch 8 is then fitted with the chip for targeted heat dissipation. At this time, it is only necessary to start the water-cooling unit 21 of the water-cooling side frame 11 on both sides of the module cover frame 1, and cooperate with the water-cooling row 19 and the water-cooling fan 20 on the front side to realize the rapid water-cooling flow heat dissipation operation at the water-cooling valve 9 on both sides of the top-pressed heat sink 7.

[0031] A water-cooled side frame 11 and a diverter air frame 12, the water-cooled side frames 11 are fixedly connected to both sides of the module cover frame 1, the diverter air frames 12 are fixedly connected to both ends of the module cover frame 1, the fan seat 13 is fixedly connected to the front of the diverter air frame 12, a heat dissipation fan 14 is arranged on the front of the fan seat 13, and handle grooves 15 are provided on both sides of the fan seat 13, plug-in ventilation seats 16 are fixedly connected to both ends of the back of the diverter air frame 12, a first sealing ring 17 is arranged at one end of the plug-in ventilation seat 16, and a second sealing ring 18 is arranged at the edge of the diverter air frame 12, a water-cooled row 19 is arranged on the front of the water-cooled row 19, and water-cooled fans 20 are evenly arranged on the front of the water-cooled row 19, and a water-cooled unit 21 is arranged on the back of the water-cooled side frame 11, and the water-cooled unit 21 A plug-in frame 22 is fixedly connected at both ends, and a dustproof net 23 is arranged inside the plug-in frame 22. The diverter air frame 12 is adaptively plugged into the plug-in frame 22 on the side of the water cooling unit 21 through the plug-in ventilation seats 16 at both ends of the back. The first sealing ring 17 at one end of the plug-in ventilation seat 16 performs a sealing docking at the plug-in frame 22, and the second sealing ring 18 at the back edge of the diverter air frame 12 is also sealed and fixed on the front side of the module cover frame 1. The dustproof net 23 inside the plug-in frame 22 performs an airflow filtering operation. At this time, the heat dissipation fan 14 on the front side of the fan seat 13 is started, and the heat dissipation airflow can be diverted and transported through the diverter air frame 12 to the inside of the module cover frame 1 and the inside of the water-cooled side frames 11 on both sides.

[0032] Working principle: When in use, the user first puts the multi-chip power module to be used into the module cover frame 1 as a whole, installs and fixes it, and then starts the air control pump 5 between the air pipes 4 to inflate the telescopic airbag 6 of the air control frame 3 through the air pipes 4, and adapts the top-pressure heat sink 7 at one end to the top of the multi-chip power module inside the module cover frame 1. The upper and lower lifting grooves 30 and the second positioning rubber strips 32 inside the module cover frame 1 are used for positioning and protection. The surface of the top-pressure heat sink 7 can be positioned and fixed with the adhesive pad 25 to the adhesive plate 24 of the thermal conductive patch 8 of the multi-chip power module, and the thermal conductive patch 8 is then specifically fitted with the chip. Heat dissipation, at this time, you only need to start the water cooling units 21 of the water cooling side frames 11 on both sides of the module cover frame 1, and cooperate with the water cooling row 19 and the water cooling fan 20 on the front side to achieve fast water cooling flow heat dissipation operation at the water cooling valves 9 on both sides of the top pressure heat sink 7. At the same time, the lower shrinkage frame 33 at the bottom of the module cover frame 1 adopts the same design as the upper shrinkage frame 2, and the air control frame 3 is also designed with an upper and lower two-layer structure to ensure that the multi-chip power module inside the module cover frame 1 can achieve efficient and synchronous heat dissipation operation even if it is a double-layer design. In addition, the four corners of the side pipe covers 34 of the module cover frame 1 cooperate with the outlet grooves 29 and the outlet grooves 29 inside the upper shrinkage frame 2, so that the upper and lower top pressure heat sinks 7 and the water cooling side frames 11 on both sides can be cooled. The circulation connection operation is carried out to ensure that the water-cooling liquid is used for efficient circulation and heat dissipation, thereby realizing targeted and efficient water-cooling and heat dissipation operation of the chips of the multi-chip power module. In the daily use process, the staff can adaptably plug the shunt wind frame 12 into the plug-in frame 22 on the side of the water-cooling unit 21 through the plug-in ventilation seats 16 at both ends of the back, and the first sealing ring 17 at one end of the plug-in ventilation seat 16 is sealed and docked at the plug-in frame 22. The second sealing ring 18 at the back edge of the shunt wind frame 12 is also sealed and fixed on the front side of the module cover frame 1. The dustproof net 23 inside the plug-in frame 22 is used to filter the airflow. At this time, the heat dissipation fan 14 on the front side of the fan seat 13 is started to dissipate the heat. The airflow is diverted and transported to the inside of the module cover frame 1 and the inside of the water-cooled side frames 11 on both sides through the diversion wind frame 12. On the one hand, it can realize the overall air-cooling and heat dissipation operation of the multi-chip power module circuit board inside the module cover frame 1. On the other hand, it can cooperate with the water-cooling row 19 and the water-cooling fan 20 to accelerate the heat dissipation efficiency of the water-cooling liquid inside the water-cooling unit 21, so that the heat dissipation capacity of the water-cooling liquid circulating up and down is improved. At the same time, when the heat dissipation airflow passes through the inside of the module cover frame 1, it can directly pass through the air-cooling mesh groove 10 on the front side of the top pressure heat sink 7, thereby performing an overall comprehensive air-cooling and heat dissipation operation for the multi-chip power module between the upper and lower top pressure heat sinks 7. The above is the entire working principle of the present invention.

[0033] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] The technical features of the above embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] The above is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A multi-chip power module with continuous and stable cooling operation, comprising a module cover frame (1), characterized in that: The top of the module cover frame (1) is fixedly connected to an upper shrink frame (2), the bottom of the module cover frame (1) is fixedly connected to a lower shrink frame (33), a group of air control frames (3) are arranged at the top of the upper shrink frame (2) and the bottom of the lower shrink frame (33), an air supply pipe (4) is arranged at the back of the air control frame (3), an air control pump (5) is arranged at the center of the air supply pipe (4), a telescopic air bag (6) is arranged between the upper and lower air control frames (3), one end of the telescopic air bag (6) is fixedly connected to a top pressure heat sink (7), a surface of the top pressure heat sink (7) is provided with a heat conductive patch (8), water cooling valves (9) are arranged on both sides of the top pressure heat sink (7), and air cooling mesh slots (10) are arranged at both ends of the top pressure heat sink (7); A water-cooled side frame (11) and a diverter air frame (12), wherein the water-cooled side frames (11) are fixedly connected to both sides of the module cover frame (1), the diverter air frames (12) are fixedly connected to both ends of the module cover frame (1), the front of the diverter air frame (12) is fixedly connected to a fan seat (13), a heat dissipation fan (14) is arranged on the front of the fan seat (13), and handle grooves (15) are arranged on both sides of the fan seat (13).

2. A multi-chip power module with continuous and stable cooling operation according to claim 1, characterized in that: The two ends of the back side of the split air frame (12) are fixedly connected to plug-in ventilation seats (16), one end of the plug-in ventilation seat (16) is provided with a first sealing ring (17), and the edge of the split air frame (12) is provided with a second sealing ring (18).

3. The multi-chip power module with continuous and stable cooling operation according to claim 1, characterized in that: A water cooling row (19) is arranged on the front of the water cooling side frame (11), and water cooling fans (20) are evenly arranged on the front of the water cooling row (19).

4. The multi-chip power module with continuous and stable cooling operation according to claim 1, characterized in that: A water cooling unit (21) is arranged on the back of the water-cooling side frame (11), plug-in frames (22) are fixedly connected to both ends of the water cooling unit (21), and a dustproof net (23) is arranged inside the plug-in frame (22).

5. The multi-chip power module with continuous and stable cooling operation according to claim 1, characterized in that: An adhesive plate (24) is provided at the bottom of the thermal conductive patch (8), and an adhesive pad (25) is provided on the surface of the top pressure heat sink (7).

6. The multi-chip power module with continuous and stable cooling operation according to claim 1, characterized in that: A shrinkage groove (26) is provided inside the upper shrinkage frame (2), and first positioning rubber strips (27) are provided at the upper and lower ends of the shrinkage groove (26).

7. The multi-chip power module with continuous and stable cooling operation according to claim 6, characterized in that: Pipe discharge grooves (28) are provided on both sides of the inner wall of the shrinkage groove (26), and pipe outlet grooves (29) are provided on both sides of the bottom of the upper shrinkage frame (2).

8. The multi-chip power module with continuous and stable cooling operation according to claim 1, characterized in that: The upper and lower ends of the module cover frame (1) are provided with lifting grooves (30), the front and rear ends of the module cover frame (1) are provided with ventilation grooves (31), and the inner wall edge of the module cover frame (1) is evenly provided with second positioning rubber strips (32).

9. The multi-chip power module with continuous and stable cooling operation according to claim 1, characterized in that: Pipe covers (34) are provided at the four corners of the side surfaces of the module cover frame (1).

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