Liquid cooling radiator with splashing and two-phase flow circulation functions

Abstract

A liquid-cooled radiator with both splashing and two-phase flow circulation comprises a steam chamber element and a semi-open shell, the steam chamber element comprises an upper cover, a lower plate, a porous capillary structure and working fluid, the upper cover comprises an upper shell and is provided with a shell outer surface, the lower plate is provided with a lower outer surface used for making contact with a heat source, and the porous capillary structure is arranged between the upper shell and the shell outer surface. When the upper cover is connected to the lower plate, a closed air cavity is formed, the porous capillary structure and the working fluid are arranged in the closed air cavity, the semi-open shell is coupled to the lower plate to form a heat exchange cavity and comprises a spraying head, an input port and an output port, and cooling liquid flows in from the input port and is splashed on the outer surface of the shell of the upper cover along the spraying head. A spraying angle formed by the spraying direction of the cooling liquid sprayed by the spraying head and the outer surface of the shell is larger than or equal to 30 degrees; therefore, the overall heat dissipation efficiency is improved, the purpose of temperature equalization is better achieved, the temperature difference is reduced, the dual heat dissipation effect can be achieved, different liquid cooling radiators can be provided, and the application range is wider.

Description

Technical Field

[0001] The present invention relates to a liquid cooling radiator, and more particularly to a liquid cooling radiator which integrates a splash nozzle and has two-phase flow circulation. Background Art

[0002] The demand for electronic products is increasing day by day. In order to meet consumer demand and respond to the trend of big data, the performance requirements of chips used in electronic devices are also getting higher and higher. For the main heat source such as heat energy on AI chips, CPU or GPU, the power of a single chip has reached 500W or 700W, and there will even be design requirements for high-computing chip products with power exceeding 2,000W in the future. Generally speaking, the faster the computing speed of the chip, the more powerful its performance, but at the same time, the thermal design power and heat generation of the chip also increase greatly. If the heat of the chip cannot be effectively dissipated, it may cause the chip to overheat and cause the chip to work at a reduced frequency or even burn out. In addition, with the high power and multi-functional computing of high-computing chips, the temperature of the secondary heat sources configured around the high-computing chips gradually increases to match the overall high computing power function.

[0003] It is known that the common heat dissipation technologies are divided into air cooling technology and liquid cooling technology. The most commonly used air cooling technologies in the industry are heat pipes and vapor chambers (VC) plus heat sink fins. However, as the power of a single chip increases, heat pipes have almost reached their heat dissipation limit. Vapor chambers (VC) are generally flat plates that can be used to solve two-dimensional heat diffusion problems. However, as the power of the chip increases, the flat vapor chamber temperature plate element cannot meet the heat dissipation requirements, and a three-dimensional vapor chamber temperature plate element plus a heat sink fin structure is generated. The heat absorption zone and the condensation zone of the two-phase flow circulation are located on different planes, and the fan is forced to convect to increase the three-dimensional heat dissipation function. However, due to the design of high-computing power chips exceeding kilowatts, air cooling can no longer meet the actual heat dissipation application requirements.

[0004] In addition, conventional liquid cooling technologies mainly include cold plate liquid cooling technology and immersion liquid cooling technology. Cold plate liquid cooling is to install a cold plate cooling module on the high-computing power chip on the circuit motherboard, and then connect the circulating coolant to the water inlet and outlet of the cold plate cooling module. The microchannels in the water-cooling plate in the cold plate liquid cooling are used to exchange heat with the chip, and then the heated hot water is taken away from the water-cooling plate to achieve the purpose of lowering the chip temperature. The immersion liquid cooling technology is to directly immerse the entire circuit motherboard and electronic heating elements in a non-conductive liquid, and directly conduct the heat energy generated by the operation of the electronic device to the cooling liquid.

[0005] Since the heat source distribution inside the ultra-high power single package chip is uneven and the temperature difference is too large, the heat dissipation technology needs to consider not only solving the hot spot problem of the chip but also the problem of chip temperature uniformity. The conventional technology of simple air cooling or liquid cooling is difficult to meet both requirements.

[0006] Therefore, in order to solve the hot spot problem and temperature uniformity problem caused by the increasing chip power and power density and the uneven power distribution of the chip itself in the conventional technology, it is necessary to provide a more efficient chip heat dissipation and heat distribution solution to improve the overall heat dissipation efficiency of the chip. Summary of the invention

[0007] In view of this, the purpose of the present invention is to provide a liquid-cooled radiator with both splashing and two-phase flow circulation. It has a simple structure and is easy to operate and maintain. It can overcome the defects of the prior art, improve the overall heat dissipation efficiency, better achieve the purpose of temperature uniformity, reduce temperature differences, and achieve dual heat dissipation effects. Different liquid-cooled radiators can be provided, which are more widely applicable.

[0008] To achieve the above object, the present invention discloses a liquid cooling radiator with both splashing and two-phase flow circulation, which is characterized by comprising:

[0009] A vapor chamber element, comprising:

[0010] An upper cover includes an upper shell having an inner shell surface and an outer shell surface;

[0011] A lower plate is disposed relative to the upper cover, the lower plate having a lower inner surface and a lower outer surface, a closed air cavity is formed when the upper cover is joined to the lower plate, and the lower outer surface of the lower plate is used to contact a heat source;

[0012] a porous capillary structure, continuously disposed on the inner surface of the housing and the lower inner surface located in the closed air cavity; and

[0013] A working fluid is disposed in the sealed air cavity, and the pressure of the sealed air cavity is less than one atmospheric pressure; and

[0014] A semi-open shell is coupled to the lower plate of the vapor chamber element to form a heat exchange chamber. The semi-open shell includes a spray head and has an input port and an output port. The input port is used to input a cooling liquid. The spray head is connected to the input port to first spray the cooling liquid on the outer surface of the shell of the upper cover, and then flows through the heat exchange chamber and outputs the cooling liquid through the output port. The spray direction of the cooling liquid sprayed by the spray head forms a spray angle with the outer surface of the shell that is greater than or equal to 30 degrees.

[0015] The steam chamber element is a three-dimensional steam chamber element, the upper shell further has a recessed opening and an annular shell cavity, and the recessed opening and the heat exchange cavity are interconnected.

[0016] The spray head is used to spray the cooling liquid onto the outer surface of the shell of the upper cover located in the concave opening.

[0017] When the upper cover is connected to the lower plate, the annular shell cavity forms the closed air cavity.

[0018] The semi-open shell further has a top plate and a side plate, the input port is arranged on the top plate, and the output port is arranged on the side plate.

[0019] Wherein, the shower head is arranged on the top plate and located in the heat exchange cavity.

[0020] The spray head has a spray port, which is located in the recessed opening and is used to spray the cooling liquid onto the outer surface of the shell of the upper cover located in the recessed opening.

[0021] The semi-open shell further has a top plate and a side plate, the top plate is provided with a flow channel and has a top plate side end, the input port is provided at the top plate side end, the flow channel is used to connect the input port and the sprinkler head, and the output port is provided at the side plate.

[0022] The upper shell further has a nozzle sealing structure, which is formed by pre-setting a liquid nozzle on the upper shell, injecting the working fluid into the closed air cavity through the liquid nozzle, and then sealing the liquid nozzle.

[0023] The invention also comprises a plurality of supporting columns with porous capillary structures, which are respectively arranged between the upper shell and the lower plate.

[0024] In summary, the present invention provides a liquid-cooled radiator with both splashing and two-phase flow circulation. First, by placing a spray head in a semi-open shell, the coolant can be directly splashed along the spray head and impact the outer surface of the shell of the upper cover in the recessed opening, so that the coolant can directly impact the recessed opening corresponding to the hot spot close to the heat source. Therefore, when the coolant is splashed from the spray head at the recessed opening, the coolant can directly splash and impact the outer surface of the shell of the upper cover, further more effectively performing the liquid cooling cycle. At the same time, when the heat source generates heat due to operation, the lower plate of the vapor chamber element that is preferentially close to the heat source can directly perform a two-phase flow circulation through the porous capillary structure, support column and working fluid inside the lower plate to take away the heat through phase change. Further, the lower plate as a whole can also achieve a uniform heat effect, thereby reducing the temperature difference on the heat source.

[0025] Compared with the conventional technology, the liquid-cooled heat sink provided by the present invention with both splashing and two-phase flow circulation has the following advantages: First, when the cooling liquid splashes at the recessed opening, the cooling liquid can directly impact the position of the corresponding hot spot to directly exchange heat, and efficiently take away the heat energy. At the same time, the vapor chamber element performs a two-phase flow circulation through the phase change of the working fluid, and the lower plate simultaneously performs heat conduction to further achieve the purpose of uniform temperature of the chip, thereby reducing the temperature difference of the entire chip. Furthermore, the cooling liquid flows along the heat exchange cavity, and at this time the upper cover of the vapor chamber element also serves as the condensation end, and the heat energy absorbed by the condensation end of the three-dimensional vapor chamber element is taken away through the cooling liquid. Finally, the cooling liquid outputs all the heat energy that is heat exchanged in the heat exchange ring cavity from the output port. Therefore, the liquid-cooled heat sink provided by the present invention with both splashing and two-phase flow circulation can simultaneously achieve a dual heat dissipation effect through the two-phase flow circulation inside the vapor chamber element and the liquid cooling circulation in the heat exchange cavity. Furthermore, the present invention can effectively provide heat dissipation efficiency and can be applied to future higher-power heat sources. When there is more than one set of hot spots in the heat source, the present invention can also provide a liquid cooling radiator corresponding to the specifications of each heat source. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A cross-sectional view of a liquid-cooled heat sink with both splashing and two-phase flow circulation according to a specific embodiment of the present invention is shown.

[0027] Figure 2 Shows the Figure 1 Schematic diagram of the structure of the vapor chamber element.

[0028] Figure 3 Shows the Figure 1 Schematic diagram of the structure of the lower plate.

[0029] Figure 4 A schematic diagram of a liquid cooling radiator with both splashing and two-phase flow circulation according to another specific embodiment of the present invention is shown.

[0030] Figure 5 A schematic diagram of a liquid cooling radiator with both splashing and two-phase flow circulation according to another specific embodiment of the present invention is shown.

[0031] Figure 6 A schematic diagram of a liquid cooling radiator with both splashing and two-phase flow circulation according to another specific embodiment of the present invention is shown. DETAILED DESCRIPTION

[0032] In order to make the advantages, spirit and features of the present invention easier and clearer to understand, the following will be described and discussed in detail with reference to the accompanying drawings and specific embodiments. It should be noted that these specific embodiments are only representative embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, the components in the figure are only used to express their relative positions and are not drawn according to their actual proportions. The step numbers of the present invention are only used to separate different steps and do not represent the order of the steps, so it is necessary to explain them first.

[0033] See also Figure 1 , Figure 1 A cross-sectional view of a liquid cooling radiator with both splashing and two-phase flow circulation according to a specific embodiment of the present invention is shown. Figure 1 As shown, the present invention provides a liquid cooling radiator 1 with both splashing and two-phase flow circulation, including a vapor chamber element 10 and a semi-open shell 30. The vapor chamber element 10 includes an upper cover 101, a lower plate 103, a porous capillary structure 104 and a working fluid 105. The upper cover 101 further includes an upper shell 1011, wherein the upper shell 1011 has a shell inner surface 1012 and a shell outer surface 1013. The lower plate 103 is arranged at a position relative to the upper cover 101 and has a lower inner surface 1031 and a lower outer surface 1032. When the upper cover 101 and the lower plate 103 are joined, a closed air cavity 106 is formed inside the upper shell 1011, and the porous capillary structure 104 is continuously arranged on the shell inner surface 1012 and the lower inner surface 1031 located in the closed air cavity 106. The working fluid 105 is arranged in the closed air cavity 106. The lower outer surface 1032 of the lower plate 103 is used to contact the heat source 90. The semi-open shell 30 is coupled to the lower plate 103 of the vapor chamber element 10 to form a heat exchange chamber 301. The semi-open shell 30 includes a spray head 302 and has an input port 303 and an output port 304. The input port 303 is used to input the coolant, and the spray head 302 is connected to the input port 303 to first spray the coolant on the outer shell surface 1013 of the upper cover 101, and then flow through the heat exchange chamber 301 and flow out through the output port 304. Please note that a spray angle J is formed between the spray head 302 and the outer shell surface 1013 of the liquid-cooled radiator 1 with both spraying and two-phase flow circulation in this embodiment. In practice, the spray angle J of this embodiment is 90 degrees, but is not limited thereto. The spray angle J needs to be greater than or equal to 30 degrees to ensure that the coolant can be effectively aligned and sprayed onto the outer surface 1013 of the housing when spraying from the spray head 302. And the pressure of the closed air cavity is less than one atmosphere.

[0034] Please also read Figure 1 as well as Figure 2 , Figure 2 Shows the Figure 1 Schematic diagram of the structure of the vapor chamber element. Figure 1 as well as Figure 2 As shown, the vapor chamber element 10 in a liquid cooling radiator 1 with both splashing and two-phase flow circulation of the present invention is a three-dimensional vapor chamber element 100. The upper shell 1011 further has a recessed opening 1014 and an annular shell cavity 1015. When the upper cover 101 is connected to the lower plate 103, the annular shell cavity 1015 forms a closed air cavity 1016. The recessed opening 1014 and the heat exchange cavity 301 are mutually connected, and the semi-open shell 30 further has a top plate 305 and a side plate 306. The input port 303 is arranged on the top plate 305; the output port 304 is arranged on the side plate 306. The spray head 302 is arranged on the top plate 305 and is located in the heat exchange cavity 301. Therefore, when the coolant splashes downward from the spray head 302, the coolant further splashes the outer surface 1013 of the shell of the upper cover 101 located in the recessed opening 1014. Please note that in practice, the vapor chamber element in the liquid cooling radiator 1 with both splashing and two-phase flow circulation of the present invention uses a three-dimensional vapor chamber element, but is not limited thereto, and a two-dimensional vapor chamber element may also be used. In addition, the input port in this specific embodiment is set on the top plate of the semi-open shell; the output port is set on the side plate, but the positions of the input port and the output port are not limited thereto and can be designed according to actual needs.

[0035] Please also read Figure 1 , Figure 2 as well as Figure 3 , Figure 3 Shows the Figure 1 Schematic diagram of the structure of the lower plate. Figure 1 , Figure 2 as well as Figure 3 As shown, the porous capillary structure 104 inside the vapor chamber element 10 can be formed by first laying metal powder or metal mesh on the inner surface 1012 of the shell and the lower inner surface 1031 of the lower plate 103 corresponding to the upper shell 1011, and then sintering to form the porous capillary structure 104. Further, a plurality of support columns 107 with porous capillary structures are placed on the lower plate 103, and then the upper cover 101 and the lower plate 103 are welded and airtightly joined, and then the porous capillary structure 104 is formed. Figure 2 After the liquid injection port 1017 in the injection port sealing structure 1016 shown in the figure injects the working fluid 105 into the closed air cavity 106, the liquid injection port 1017 is finally sealed and evacuated to form the vapor chamber element 10. Further, when the heat source 90 generates heat due to operation, the lower plate 103 of the vapor chamber element 10, which is first closely attached to the heat source 90, can directly conduct a two-phase flow circulation through the porous capillary structure 104, the support column 107 and the working fluid 105 inside the lower plate 10 to immediately remove the heat through the phase change. Furthermore, the lower plate 103 as a whole can also achieve the effect of uniform heating at the same time, thereby reducing the temperature difference on the heat source 90.

[0036] In practice, the lower outer surface 1032 of the lower plate 103 in the vapor chamber element 10 serves as a heat absorbing end to preferentially receive heat energy emitted from the heat source 90, and then the working fluid 105 inside the vapor chamber element 10 undergoes a phase change to a gaseous working fluid 105 due to heat absorption. Further, the gaseous working fluid 105 drifts upward to the condensation end, and then changes from the gaseous working fluid 105 back to the liquid working fluid 105, and finally flows back from top to bottom along the porous capillary structure 104 inside the vapor chamber element 10 to the lower inner surface 1031 of the closed air cavity 106 by capillary phenomenon to complete a two-phase flow cycle. In practice, the working fluid can be water; or a mixture of water and ethylene glycol or propylene glycol.

[0037] For further information, please refer to Figure 1 ,like Figure 1 As shown, Figure 1 The dotted arrow in the figure indicates the coolant flow direction F. After the coolant flows in from the input port 303 of the top plate 305, it is then directly splashed along the spray head 302 and impacts the outer shell surface 1013 of the upper cover 101 in the recessed opening 1014. This recessed opening 1014 corresponds to the relative position of the heat source 90. Therefore, when the coolant is directly splashed to the recessed opening 1014, it can directly impact the place with the highest temperature to dissipate heat. Then the coolant flows through the heat exchange cavity 301 and finally flows out from the output port 304, completing a liquid cooling cycle of heat exchange. In practice, the coolant can be water or an aqueous solution of water and alcohol, but is not limited to this.

[0038] In summary, when the liquid-cooled heat sink 1 with both splashing and two-phase flow circulation of the present invention is installed on the heat source 90 in actual application, the two-phase flow circulation inside the three-dimensional vapor chamber element 100 can not only achieve temperature uniformity and heat dissipation, but also directly splash and impact the recessed opening 1014 through the coolant, so that the coolant can directly dissipate heat at the place with the highest temperature, thereby greatly increasing the overall heat dissipation efficiency.

[0039] In practical applications, the heat source 90 may be an AI chip, a CPU or a GPU, or a high-computing power chip with a single power of more than 1,000W, and all of these high-computing power chips have core heating hot spots when actually operating. Therefore, the liquid-cooled radiator with both splashing and two-phase flow circulation of the present invention can effectively dissipate heat for the hot spots with the highest temperature on the heat source. Even when the future high-computing power chip may include two or more hot spots, the liquid-cooled radiator with both splashing and two-phase flow circulation of the present invention can also splash the coolant to each hot spot for heat dissipation for each future hot spot or a high-computing power chip with higher power. Therefore, the vapor chamber element 10 of the liquid-cooled radiator 1 with both splashing and two-phase flow circulation of the present invention can also be designed according to the actual position and number of the hot spots in the heat source, and the recessed opening 1014 of the vapor chamber element 10 can be designed as a round hole type or the cross-sectional shape can be square, rectangular, or elliptical. Even when the hot spot is not in the middle of the heat source but is located near one side, the recessed opening can also be set at the corresponding position according to the hot spot.

[0040] Furthermore, when the liquid cooling radiator is installed in an electronic device, if the electronic device has a height restriction, the input port cannot be directly placed above the top plate. Therefore, the present invention further provides other types of liquid cooling radiators with both splashing and two-phase flow circulation. Figure 4 , Figure 4 FIG. 1 is a schematic diagram showing a liquid cooling radiator with both splashing and two-phase flow circulation according to another specific embodiment of the present invention. Figure 4 As shown, the semi-open shell 30 of the liquid cooling radiator 2 with both splashing and two-phase flow circulation of the present invention further has a top plate 305' and a side plate 306. The top plate 305' is further provided with a flow channel 307 and has a top plate side end 3051. The input port 303 is provided at the top plate side end 3051, the flow channel 307 connects the input port 303 and the spray head 302, and the output port 304 is provided at the side plate 306. After the coolant flows in from the input port 303, it flows along the flow channel 307 to the spray head 202, and further the coolant directly splashes and impacts the recessed opening 1014, and absorbs the heat energy of the heat source 90 therefrom, then takes away the heat and flows through the heat exchange cavity 301, and finally flows out from the output port 304 of the side plate 306 to complete a liquid cooling cycle. In practice, the top plate side end is provided on the right side of the top plate, but the setting position is not limited thereto, and the output port can also be provided in the top plate.

[0041] Next, the number of shower heads is not limited to one set. The present invention further provides other types of liquid cooling radiators with both splashing and two-phase flow circulation. Figure 5 , Figure 5 FIG. 1 is a schematic diagram showing a liquid cooling radiator with both splashing and two-phase flow circulation according to another specific embodiment of the present invention. Figure 5As shown, the present invention provides a liquid cooling radiator 3 with both splashing and two-phase flow circulation, which includes a vapor chamber element 10 and a semi-open shell 30. The semi-open shell 30 is coupled to the lower plate 103 of the vapor chamber element 10 to form a heat exchange chamber 301, and the semi-open shell 30 further includes three groups of spray heads 302 and has an input port 303 and an output port 304. After the coolant flows in from the input port 303 of the top plate 305, it is then simultaneously splashed along the three groups of spray heads 302 onto the outer shell surface 1013 of the upper cover 101 and the recessed opening 1014. Therefore, when the coolant is directly splashed along the three groups of spray heads 302 onto the upper cover 101, the heat energy absorbed by the vapor chamber element 10 can be taken away at the same time. In addition to directly impacting the place with the highest temperature for heat dissipation, the coolant can also further impact the outer shell surface 1013 of the upper cover 101 to achieve the effect of average heat dissipation and uniform temperature. The other devices of this specific embodiment are substantially the same as the devices corresponding to the above specific embodiments, so they are not described in detail here. In addition, the number of the shower heads in this specific embodiment is 3, but it is not limited thereto.

[0042] See also Figure 6 , Figure 6 FIG. 1 is a schematic diagram showing a liquid cooling radiator with both splashing and two-phase flow circulation according to another specific embodiment of the present invention. Figure 6 As shown, the present invention provides a liquid-cooled radiator 4 having both splashing and two-phase flow circulation, the spray head 302 having a spray port 3020, the spray port 3020 being located relative to the recessed opening 1014, and being used to spray the coolant on the outer shell surface 1013 of the upper cover 101 located in the recessed opening 1014. In practice, the spray port can be drilled out of the flow channel of the spray port in a semi-open shell using a Computer Numerical Control (CNC) processing machine, and the number of spray ports in this specific embodiment is 3, but the number and aperture can be designed according to actual needs. The liquid-cooled radiator 4 having both splashing and two-phase flow circulation in this specific embodiment also performs heat dissipation simultaneously through the two-phase flow circulation of the working fluid 105 inside the vapor chamber element 10 and the liquid cooling circulation of the coolant in the heat exchange chamber 301, and its operation method is the same as that of the present invention. Figure 1 The liquid cooling radiator 1 with both splashing and two-phase flow circulation is the same and will not be described in detail here.

[0043] In summary, the present invention provides a liquid-cooled radiator with both splashing and two-phase flow circulation. First, by placing a spray head in a semi-open shell, the coolant can be directly splashed along the spray head and impact the outer surface of the shell of the upper cover in the recessed opening, so that the coolant can directly impact the recessed opening corresponding to the hot spot close to the heat source. Therefore, when the coolant is splashed from the spray head at the recessed opening, the coolant can directly splash and impact the outer surface of the shell of the upper cover, further more effectively performing the liquid cooling cycle. At the same time, when the heat source generates heat due to operation, the lower plate of the vapor chamber element that is preferentially close to the heat source can directly perform a two-phase flow circulation through the porous capillary structure, support column and working fluid inside the lower plate to take away the heat through phase change. Further, the lower plate as a whole can also achieve a uniform heat effect, thereby reducing the temperature difference on the heat source.

[0044] Compared with the conventional technology, the liquid-cooled heat sink provided by the present invention with both splashing and two-phase flow circulation has the following advantages: First, when the cooling liquid splashes at the recessed opening, the cooling liquid can directly impact the position of the corresponding hot spot to directly exchange heat, and efficiently take away the heat energy. At the same time, the vapor chamber element performs a two-phase flow circulation through the phase change of the working fluid, and the lower plate simultaneously performs heat conduction to further achieve the purpose of uniform temperature of the chip, thereby reducing the temperature difference of the entire chip. Furthermore, the cooling liquid flows along the heat exchange cavity, and at this time the upper cover of the vapor chamber element also serves as the condensation end, and the heat energy absorbed by the condensation end of the three-dimensional vapor chamber element is taken away through the cooling liquid. Finally, the cooling liquid outputs all the heat energy that is heat exchanged in the heat exchange ring cavity from the output port. Therefore, the liquid-cooled heat sink provided by the present invention with both splashing and two-phase flow circulation can simultaneously achieve a dual heat dissipation effect through the two-phase flow circulation inside the vapor chamber element and the liquid cooling circulation in the heat exchange cavity. Furthermore, the present invention can effectively provide heat dissipation efficiency and can be applied to future higher-power heat sources. When there is more than one set of hot spots in the heat source, the present invention can also provide a liquid cooling radiator corresponding to the specifications of each heat source.

[0045] The above detailed description of the preferred embodiments is intended to more clearly describe the features and spirit of the present invention, rather than to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and arrangements with equivalents within the scope of the patent scope to be applied for by the present invention. Therefore, the scope of the patent scope applied for by the present invention should be interpreted in the broadest sense based on the above description, so as to cover all possible changes and arrangements with equivalents.

Claims

1. A liquid cooling radiator with both splashing and two-phase flow circulation, characterized in that Contains: A vapor chamber element, comprising: An upper cover includes an upper shell having an inner shell surface and an outer shell surface; A lower plate is disposed relative to the upper cover, the lower plate having a lower inner surface and a lower outer surface, a closed air cavity is formed when the upper cover is joined to the lower plate, and the lower outer surface of the lower plate is used to contact a heat source; A multi-porous capillary structure is continuously disposed on the inner surface of the shell and the lower inner surface located in the closed air cavity; as well as A working fluid is disposed in the sealed air cavity, and the pressure of the sealed air cavity is less than one atmospheric pressure; and A semi-open shell is coupled to the lower plate of the vapor chamber element to form a heat exchange chamber. The semi-open shell includes a spray head and has an input port and an output port. The input port is used to input a cooling liquid. The spray head is connected to the input port to first spray the cooling liquid on the outer surface of the shell of the upper cover, and then flows through the heat exchange chamber and outputs the cooling liquid through the output port. The spray direction of the cooling liquid sprayed by the spray head forms a spray angle with the outer surface of the shell that is greater than or equal to 30 degrees.

2. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 1, characterized in that: The steam chamber element is a three-dimensional steam chamber element. The upper shell further has a recessed opening and an annular shell cavity, and the recessed opening and the heat exchange cavity are interconnected.

3. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 2, characterized in that: The spray head is used for spraying the cooling liquid on the outer surface of the shell of the upper cover located in the concave opening.

4. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 2, characterized in that: When the upper cover is coupled to the lower plate, the annular shell cavity forms the closed air cavity.

5. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 2, characterized in that: The semi-open shell further has a top plate and a side plate. The input port is arranged on the top plate, and the output port is arranged on the side plate.

6. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 5, characterized in that: The shower head is arranged on the top plate and is located in the heat exchange cavity.

7. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 6, characterized in that: The spray head has a spray port, which is located in the concave opening and is used for spraying the cooling liquid onto the outer surface of the shell of the upper cover located in the concave opening.

8. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 2, characterized in that: The semi-open shell further has a top plate and a side plate, the top plate is provided with a flow channel and has a top plate side end, the input port is provided at the top plate side end, the flow channel is used to connect the input port and the sprinkler head, and the output port is provided at the side plate.

9. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 1, characterized in that: The upper shell further has a nozzle sealing structure, which is formed by pre-setting a liquid nozzle on the upper shell, injecting the working fluid into the closed air cavity through the liquid nozzle, and then sealing the liquid nozzle.

10. The liquid cooling radiator with both splashing and two-phase flow circulation as claimed in claim 1, characterized in that: The invention also comprises a plurality of supporting columns with porous capillary structures, which are respectively arranged between the upper shell and the lower plate.

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