Electronic package and fabrication method thereof

Abstract

An electronic package and a manufacturing method thereof are provided, a first photoelectric element having a first optical fiber connection portion is disposed on an electronic module, and a second photoelectric element having a second optical fiber connection portion is disposed on a first step of a receiving portion at a lower position in a step-shaped bearing structure. And the electronic module is arranged on the second step of the stepped bearing structure and the second photoelectric element with the second optical fiber connecting part, so that the electronic module is electrically connected with the second photoelectric element with the second optical fiber connecting part. Therefore, according to the invention, two photoelectric elements with optical fiber connecting parts can be easily and vertically integrated, and the second photoelectric element can be stably carried through the step-shaped bearing structure.

Description

Technical Field

[0001] The present invention relates to an electronic packaging technology, and in particular to an electronic packaging component integrating multiple optoelectronic components and a manufacturing method thereof. Background Art

[0002] Due to the demand for increased switching bandwidth in optical engine (OE) modules, such as the plan to increase bandwidth eightfold from 12.8T to 102.4T by 2028, increasing the data throughput or data rate per unit time of OE modules within the limited space of devices such as switches and routers has become a necessary development project. For example, the data throughput or data rate per unit time of OE modules can be increased from 400G to over 1.6T.

[0003] Figure 1 FIG is a schematic cross-sectional view of a known semiconductor package 1 having a photoelectric element 16. Figure 1 As shown, the optical engine module 1a is disposed on a packaging substrate 18. The optical engine module 1a includes a cladding layer 15, an electronic integrated circuit (EIC) chip 11 and a plurality of conductive pillars 13 embedded in the cladding layer 15, a circuit structure 10 disposed on the upper side of the cladding layer 15, a wiring structure 14 disposed on the lower side of the cladding layer 15, and a single optoelectronic element 16 (such as a photoelectric chip (Photo IC, PIC)) disposed on the wiring structure 10. The optical engine module 1a is disposed on the packaging substrate 18 through a plurality of solder balls 17 via the wiring structure 14. The optoelectronic element 16 of the optical engine module 1a can be externally connected to an optical fiber (not shown).

[0004] However, the optical engine module 1a of the conventional semiconductor package 1 can only provide a single optoelectronic element 16 (and cannot provide multiple optoelectronic elements). Therefore, it is difficult to increase the data transmission volume or data rate of the optical engine module 1a per unit time, thereby failing to improve the operating performance or data transmission performance of the semiconductor package 1.

[0005] Therefore, how to overcome the above-mentioned problems of the prior art has become a topic that needs to be solved urgently. Summary of the Invention

[0006] In view of the various deficiencies of the above-mentioned known technologies, the present invention provides an electronic package, comprising: an electronic module; a first optoelectronic element having a first optical fiber connection portion, which is arranged on the electronic module and electrically connected to the electronic module; a stepped supporting structure having a receiving portion; and a second optoelectronic element having a second optical fiber connection portion, which is arranged on a first step of the receiving portion of the stepped supporting structure, and the first step of the receiving portion of the stepped supporting structure is lower than the second step of the stepped supporting structure; wherein the electronic module is arranged on the second step of the stepped supporting structure and the second optoelectronic element having the second optical fiber connection portion, and the electronic module is electrically connected to the second optoelectronic element having the second optical fiber connection portion.

[0007] The present invention further provides a method for manufacturing an electronic package, which includes: arranging a first optoelectronic element having a first optical fiber connection portion on an electronic module and electrically connecting the electronic module; arranging a second optoelectronic element having a second optical fiber connection portion on a first step of a receiving portion of a stepped supporting structure, wherein the first step of the receiving portion of the stepped supporting structure is lower than the second step of the stepped supporting structure; and arranging the electronic module on the second step of the stepped supporting structure and the second optoelectronic element having a second optical fiber connection portion, wherein the electronic module is electrically connected to the second optoelectronic element having the second optical fiber connection portion.

[0008] In the aforementioned electronic package and its manufacturing method, the electronic module has a first connection area and a second connection area. The first connection area of ​​the electronic module is electrically connected to the first optoelectronic element, and the second connection area of ​​the electronic module is electrically connected to the second optoelectronic element. The first optoelectronic element and the second optoelectronic element transmit signals to each other through the electronic module.

[0009] In the aforementioned electronic package and its manufacturing method, the electronic module has at least one first electronic element, and the first electronic element is combined with and electrically connected to a plurality of conductors.

[0010] In the aforementioned electronic package and its manufacturing method, the electronic module has multiple conductive bumps, circuit structures, multiple conductive columns, wiring structures and multiple conductive elements, and the first optoelectronic element having a first optical fiber connection part is electrically connected to the second optoelectronic element having a second optical fiber connection part through multiple conductive bumps, circuit structures, multiple conductive columns, wiring structures and multiple conductive elements in sequence.

[0011] In the aforementioned electronic package and manufacturing method thereof, the second step of the stepped supporting structure is flush with or coplanar with the upper surface of the second optoelectronic component having the second optical fiber connecting portion.

[0012] In the aforementioned electronic package and its manufacturing method, the length or area of ​​the first step of the receiving portion of the stepped supporting structure is at least 2 / 3 of the length or area of ​​the supported second optoelectronic element.

[0013] In the aforementioned electronic package and manufacturing method thereof, the first optical fiber connection portion of the first optoelectronic component and the second optical fiber connection portion of the second optoelectronic component are located on the same side, and the first optical fiber connection portion faces the second optical fiber connection portion.

[0014] In the aforementioned electronic package and its manufacturing method, the first optical fiber connection portion of the first optoelectronic element and the second optical fiber connection portion of the second optoelectronic element are located on opposite sides.

[0015] In the aforementioned electronic package and its manufacturing method, the electronic package may include at least one second electronic component, which is disposed on the first optoelectronic component having the first optical fiber connecting portion and electrically connected to the first optoelectronic component.

[0016] In the aforementioned electronic package and its manufacturing method, the electronic package may include at least one third electronic component, which is disposed on the second optoelectronic component having the second optical fiber connecting portion and electrically connected to the second optoelectronic component.

[0017] As can be seen from the above, in the electronic package and its manufacturing method of the present invention, a first optoelectronic element having a first optical fiber connection portion is arranged on an electronic module, and a second optoelectronic element having a second optical fiber connection portion is arranged on a receiving portion of a stepped supporting structure, so that the electronic package can easily vertically integrate two optoelectronic elements having optical fiber connection portions, and can also improve or multiply the data transmission volume or data rate of the electronic package per unit time, and can also improve the operating performance or data transmission performance of the electronic package.

[0018] At the same time, the present invention can arrange the second optoelectronic component with a second optical fiber connection part on the first step of the receiving part at a lower position in the stepped supporting structure, so as to utilize the three-dimensional (3D) structure of the electronic package to vertically integrate the two optoelectronic components with optical fiber connection parts, and can also effectively maintain or not increase the overall height or volume of the electronic package.

[0019] Furthermore, the receiving portion of the stepped supporting structure of the present invention can stably support the second optoelectronic component, thereby preventing the second optoelectronic component from being suspended in the air and thereby avoiding the risk of tilt. Furthermore, the structure can also meet the high precision requirements of fiber attaching, thereby facilitating precise attachment of the second optical fiber connecting portion of the second optoelectronic component to an optical fiber (such as a busbar of an optical fiber cable), and is less likely to cause attachment failure between the second optical fiber connecting portion of the second optoelectronic component and the optical fiber. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic cross-sectional view of a conventional semiconductor package having an optoelectronic element.

[0021] Figures 2A to 2D It is a cross-sectional schematic diagram of the method for manufacturing the electronic package of the present invention.

[0022] Figure 3 FIG. 4 is another schematic cross-sectional view of the electronic package of the present invention.

[0023] Main component symbols

[0024] 1 Semiconductor Package

[0025] 1a Optical Engine Module

[0026] 10,20 Line Structure

[0027] 11 Electronic integrated circuit chips

[0028] 13,23 Conductive Column

[0029] 14,24 wiring structure

[0030] 15,25 cladding

[0031] 16 Photoelectric components

[0032] 17 solder balls

[0033] 18 Package substrate

[0034] 2,3 Electronic packaging

[0035] 2a Electronic module

[0036] 200 insulation layer

[0037] 201 line redistribution layer

[0038] 202 electrical contact pads

[0039] 21 First Electronic Components

[0040] 21a Active surface

[0041] 21b Non-active surface

[0042] 210 electrode pads

[0043] 211 protective film

[0044] 212,221,72,82 conductors

[0045] 212a, 23a, 23b end faces

[0046] 213 bonding layer

[0047] 22 conductive bumps

[0048] 25a first surface

[0049] 25b Second surface

[0050] 26 Conductive elements

[0051] 31 First Photoelectric Element

[0052] 32 first optical fiber connection portion

[0053] 41 Second photoelectric element

[0054] 42 second optical fiber connection portion

[0055] 50 stepped load-bearing structure

[0056] 51 Undertaking Department

[0057] 61 First Primer

[0058] 62 Second primer

[0059] 71 Second electronic component

[0060] 81 Third Electronic Components

[0061] 9 Loading plate

[0062] 90 release layer

[0063] 91 insulation layer

[0064] A. First connection area

[0065] B. Second connection area

[0066] H1 First Step

[0067] H2 Second step

[0068] L1, L2 length. DETAILED DESCRIPTION

[0069] The following describes the embodiments of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents described in this specification.

[0070] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for those skilled in the art to understand and read, and are not used to limit the limiting conditions for the implementation of the present invention. Therefore, they have no substantial technical significance. Any modification of the structure, change in the proportional relationship, or adjustment of the size should still fall within the scope of the technical content described in the present invention without affecting the efficacy and purpose that can be achieved by the present invention. At the same time, terms such as "upper", "lower", "one", "two", "first", "second", and "third" quoted in this specification are only for the convenience of description and are not used to limit the scope of the implementation of the present invention. Changes or adjustments in their relative relationships should also be regarded as the scope of the implementation of the present invention without substantially changing the technical content.

[0071] Figures 2A to 2D It is a cross-sectional schematic diagram of a method for manufacturing the electronic package 2 of the present invention.

[0072] like Figure 2A As shown, a plurality of conductive pillars 23 are first formed on a carrier board 9, and at least one or more (two in this embodiment) first electronic components 21 are disposed on the carrier board 9. The first electronic components 21 are combined with and electrically connected to a plurality of conductive bodies 212. In this disclosure, "at least one" means more than one (e.g., one, two, or three), and "more than one" means more than two (e.g., two, three, four, or ten or more).

[0073] In one embodiment, the carrier plate 9 may be a plate made of a semiconductor material (such as silicon or glass), and a release layer 90 and an insulating layer 91 such as a dielectric material or a solder mask are sequentially formed on the carrier plate 9 by, for example, coating, so that multiple conductive columns 23 are arranged on the insulating layer 91.

[0074] In one embodiment, the first electronic component 21 is an active component, a passive component, or a combination thereof, wherein the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, a capacitor, or an inductor.

[0075] In this embodiment, the first electronic component 21 is a semiconductor chip, such as a driver or a transimpedance amplifier (TIA), and may have an active surface 21a and an inactive surface 21b opposite each other. The inactive surface 21b of the first electronic component 21 is bonded or adhered to the insulating layer 91 via a bonding layer 213. The active surface 21a of the first electronic component 21 has a plurality of electrode pads 210 and is covered with a protective film 211, such as a passivation material. A plurality of conductors 212 are disposed within the protective film 211.

[0076] In one embodiment, the material forming the conductive pillar 23 is a metal material such as copper or a solder material, and the conductor 212 is a spherical shape such as a conductive line, a solder ball, or a columnar shape of a metal material such as a copper pillar, a solder bump, or a stud-shaped conductive part made by a wire bonding machine, but is not limited thereto.

[0077] Then, a covering layer 25 is formed on the insulating layer 91 of the carrier board 9 so that the covering layer 25 covers at least one (such as multiple) first electronic components 21 and multiple conductive pillars 23, wherein the covering layer 25 has a first surface 25a and a second surface 25b relative to each other, so that the covering layer 25 is bonded to the insulating layer 91 of the carrier board 9 with its second surface 25b, and the protective film 211, the end surfaces 212a of the multiple conductors 212 and the end surfaces 23a of the multiple conductive pillars 23 are exposed on the first surface 25a of the covering layer 25.

[0078] In one embodiment, the coating layer 25 is an insulating material, such as polyimide (PI), a dry film, an encapsulant such as epoxy, or a molding compound. For example, the coating layer 25 can be formed on the insulating layer 91 using a liquid compound, injection, lamination, or compression molding.

[0079] Furthermore, a planarization process can be performed to make the first surface 25a of the cladding layer 25, the protective film 211, the end surface 23a of the conductive pillar 23, and the end surface 212a of the conductor 212 flush or coplanar, so that the end surface 23a of the conductive pillar 23 and the end surface 212a of the conductor 212 are exposed on the first surface 25a of the cladding layer 25. For example, the planarization process can remove part of the material of the protective film 211, part of the material of the conductive pillar 23, part of the material of the conductor 212, and part of the material of the cladding layer 25 by grinding.

[0080] Furthermore, the other end surfaces 23 b of the plurality of conductive pillars 23 and the second surface 25 b of the cladding layer 25 may also be flush or coplanar.

[0081] like Figure 2B As shown, a circuit structure 20 is formed on the first surface 25 a of the cladding layer 25 , and the circuit structure 20 is electrically connected to the plurality of conductive pillars 23 and the plurality of conductors 212 .

[0082] In one embodiment, the circuit structure 20 includes multiple insulating layers 200 and multiple redistribution layers (RDLs) 201 disposed on the multiple insulating layers 200. The outermost insulating layer 200 can serve as a solder mask, and a portion of the outermost RDL 201 is exposed outside the solder mask to serve as electrical contact pads 202. Alternatively, the circuit structure 20 can include only a single insulating layer 200 and a single RDL 201.

[0083] In one embodiment, the material forming the circuit redistribution layer 201 is copper, and the material forming the insulating layer 200 is a dielectric material such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), or a solder mask material such as green paint or ink.

[0084] Next, a first optoelectronic component 31 (e.g., a photonic IC (PIC)) having a first optical fiber connection portion 32 is disposed on the circuit structure 20 and electrically connected to the circuit structure 20. The first optical fiber connection portion 32 of the first optoelectronic component 31 can be connected to an optical fiber or a bus (not shown) of an optical fiber cable to transmit optical signals.

[0085] In one embodiment, the first optoelectronic device 31 is electrically connected to the electrical contact pads 202 of the circuit structure 20 via a flip-chip process using a plurality of conductive bumps 22, such as solder balls, copper pillars, or other conductive bumps. Alternatively, the first optoelectronic device 31 can be electrically connected to the circuit structure 20 via a plurality of conductive wires (not shown) via wire bonding. There are numerous ways to electrically connect the first optoelectronic device 31 to the circuit structure 20, and these are not limited to the above.

[0086] In addition, a first underfill 61 may be formed between the first optoelectronic device 31 and the circuit structure 20 to cover the plurality of conductive bumps 22 .

[0087] Next, remove Figure 2A The carrier plate 9 and the release layer 90 thereon are shown, and the insulating layer 91 is retained. Then, a wiring structure 24 electrically connected to multiple conductive pillars 23 is formed on the insulating layer 91, and then multiple conductive elements 26 such as copper pillars or solder balls are combined on the wiring structure 24.

[0088] In one embodiment, a plurality of openings can be formed in the insulating layer 91 by laser so that the end surfaces 23b of the plurality of conductive pillars 23 are exposed in the plurality of openings of the insulating layer 91, and then the wiring structure 24 is combined with the end surfaces 23b of the plurality of conductive pillars 23 through the plurality of openings of the insulating layer 91, and then a plurality of conductive elements 26 such as copper pillars or solder balls are combined on the wiring structure 24.

[0089] Furthermore, by providing the carrier board 9 with the insulating layer 91 , the wiring structure 24 can be formed using the insulating layer 91 after the carrier board 9 is removed, thereby eliminating the need for disposing a dielectric layer. This can save process time and process steps, thereby reducing process costs.

[0090] In one embodiment, the above-mentioned circuit structure 20, first electronic component 21, conductor 212, conductive bump 22, conductive column 23, wiring structure 24, coating layer 25, conductive element 26 and / or insulating layer 91 can constitute an electronic module 2a, and the electronic module 2a can be defined with a first connection area A and a second connection area B in the vertical direction.

[0091] like Figure 2C As shown, a second optoelectronic element 41 (such as a optoelectronic chip, PIC for short) having a second optical fiber connecting portion 42 is arranged on the first step H1 of the receiving portion 51 of the stepped supporting structure 50, and the first step H1 of the receiving portion 51 of the stepped supporting structure 50 is lower than the second step H2 of the stepped supporting structure 50, and the second optical fiber connecting portion 42 of the second optoelectronic element 41 can be connected to the bus bar (omitted) of the optical fiber or optical fiber cable to transmit optical signals.

[0092] In one embodiment, the stepped support structure 50 can be in the form of a substrate (e.g., a stepped substrate). For example, the stepped support structure 50 is a package substrate having a core layer and a circuit structure, or a coreless circuit structure, wherein the circuit structure includes at least one insulating layer and at least one circuit layer coupled to the insulating layer, such as at least one fan-out redistribution layer (RDL). It should be understood that the stepped support structure 50 can also be other substrates, such as a lead frame, a wafer, or other carriers with metal routing, and is not limited to the above.

[0093] In one embodiment, the second step H2 of the stepped supporting structure 50 and the upper surface (e.g., the active surface) of the second photovoltaic element 41 may be flush or coplanar. For example, the height of the second step H2 of the stepped supporting structure 50 is approximately equal to the height of the first step H1 of the stepped supporting structure 50 plus the height of the second photovoltaic element 41. However, in other embodiments, the second step H2 of the stepped supporting structure 50 and the upper surface (e.g., the active surface) of the second photovoltaic element 41 may not be flush or coplanar, that is, there may be a slight height difference between them.

[0094] In one embodiment, the length L2 or area (such as the bearing area) of the first step H1 of the receiving portion 51 of the stepped supporting structure 50 is more than 2 / 3 of the length L1 or area of ​​the second photoelectric element 41, so that the first step H1 of the receiving portion 51 can stably bear or support the second photoelectric element 41, but is not limited thereto.

[0095] like Figure 2D As shown, Figure 2B The electronic module 2a electrically connected to the first optoelectronic element 31 having the first optical fiber connecting portion 32 is provided in Figure 2C On the second step H2 of the stepped supporting structure 50 and the second optoelectronic component 41 having the second optical fiber connecting portion 42, multiple conductive elements 26 of the second connection area B of the electronic module 2a are respectively electrically connected to the second step H2 of the stepped supporting structure 50 and the second optoelectronic component 41 having the second optical fiber connecting portion 42 to obtain the electronic package 2 of the present invention.

[0096] Furthermore, a second underfill 62 may be formed above the second optoelectronic element 41 and the second step H2 of the stepped supporting structure 50 to below the insulating layer 91 of the electronic module 2a, so as to cover the plurality of conductive elements 26 of the second connection region B of the electronic module 2a.

[0097] In one embodiment, the first optical fiber connection portion 32 of the first optoelectronic element 31 and the second optical fiber connection portion 42 of the second optoelectronic element 41 may both be located on the same side (such as the right side) of the electronic package 2 , and the first optical fiber connection portion 32 directly faces the second optical fiber connection portion 42 .

[0098] In one embodiment, the plurality of conductive bumps 22 in the first connection region A of the electronic module 2a are coupled to the circuit structure 20, the plurality of conductive pillars 23 are electrically connected to the circuit structure 20 and the wiring structure 24, and the wiring structure 24 is coupled to the plurality of conductive elements 26 in the second connection region B. Simultaneously, the first optoelectronic device 31 can be electrically connected to the second optoelectronic device 41 sequentially through the plurality of conductive bumps 22 in the first connection region A of the electronic module 2a, the circuit structure 20, the plurality of conductive pillars 23, the wiring structure 24, and the plurality of conductive elements 26 in the second connection region B.

[0099] In one embodiment, the first connection region A of the electronic module 2a can be electrically connected to a first optoelectronic component 31 having a first optical fiber connection portion 32, and the second connection region B of the electronic module 2a can be electrically connected to a second optoelectronic component 41 having a second optical fiber connection portion 42. Signals can be transmitted between the first optoelectronic component 31 having the first optical fiber connection portion 32 and the second optoelectronic component 41 having the second optical fiber connection portion 42 via the electronic module 2a. For example, signals can be transmitted between the first optoelectronic component 31 and the second optoelectronic component 41 via the plurality of conductive bumps 22, the circuit structure 20, the plurality of conductive pillars 23, the wiring structure 24 of the first connection region A of the electronic module 2a and the plurality of conductive elements 26 of the second connection region B.

[0100] In addition, in other manufacturing method embodiments, the second optoelectronic element 41 having the second optical fiber connection portion 42 can be first set on the stepped supporting structure 50, and then the electronic module 2a can be set on the second optoelectronic element 41 and the stepped supporting structure 50, and then the first optoelectronic element 31 having the first optical fiber connection portion 32 can be set on the electronic module 2a.

[0101] Figure 3 FIG. 1 is a cross-sectional view of an electronic package 3 according to another embodiment of the present invention. Figure 3 Electronic package 3 with Figure 2D The main technical differences between the electronic package 2 are as follows, and the rest of the technical content is the same as above. Figures 2A to 2D The detailed description is the same as that of , and will not be repeated here.

[0102] like Figure 3 As shown, the first optical fiber connection portion 32 of the first optoelectronic element 31 and the second optical fiber connection portion 42 of the second optoelectronic element 41 can be located on opposite sides of the electronic package 3. For example, the first optical fiber connection portion 32 and the second optical fiber connection portion 42 are respectively located on the first side (such as the left side) and the second side (such as the right side) of the electronic package 3.

[0103] The electronic package 3 may further include a plurality of conductors 221, at least one (e.g., multiple) second electronic components 71 and / or at least one (e.g., multiple) third electronic components 81, the plurality of conductors 221 being arranged between the plurality of conductive bumps 22 and the first photoelectric component 31 and electrically connecting the plurality of conductive bumps 22 and the first photoelectric component 31, the second electronic component 71 being arranged on the first photoelectric component 31 having the first optical fiber connection portion 32 and electrically connecting the first photoelectric component 31, and the third electronic component 81 being arranged on the second photoelectric component 41 having the second optical fiber connection portion 42 and electrically connecting the second photoelectric component 41.

[0104] In one embodiment, the conductor 221 is a spherical conductive element such as a conductive trace, a solder ball, a metal pillar such as a copper pillar or a solder bump, or a pin-shaped conductive element made by a wire bonding machine. The second electronic component 71 or the third electronic component 81 is an active component, a passive component, or a combination thereof, where the active component is, for example, a semiconductor chip, and the passive component is, for example, a resistor, capacitor, or inductor.

[0105] In one embodiment, the second electronic component 71 is electrically connected to the first optoelectronic component 31 in a flip-chip manner via a plurality of conductive bodies 72, such as solder balls, copper pillars, or other conductive bodies, and the third electronic component 81 is electrically connected to the second optoelectronic component 41 in a flip-chip manner via a plurality of conductive bodies 82, such as solder balls, copper pillars, or other conductive bodies. For example, the active surface of the second electronic component 71 is bonded to the active surface of the first optoelectronic component 31, and the active surface of the third electronic component 81 is bonded to the active surface of the second optoelectronic component 41. There are many ways to electrically connect the second electronic component 71 and the third electronic component 81 to the first optoelectronic component 31 and the second optoelectronic component 41, respectively, and are not limited to the above.

[0106] The present invention also provides an electronic package 2, 3, which includes: an electronic module 2a; a first optoelectronic element 31 having a first optical fiber connection part 32, which is arranged on the electronic module 2a and electrically connected to the electronic module 2a; a stepped supporting structure 50, which has a receiving part 51; and a second optoelectronic element 41 having a second optical fiber connection part 42, which is arranged on the first step H1 of the receiving part 51 of the stepped supporting structure 50, and the first step H1 of the receiving part 51 of the stepped supporting structure 50 is lower than the second step H2 of the stepped supporting structure 50; wherein, the electronic module 2a is arranged on the second step H2 of the stepped supporting structure 50 and the second optoelectronic element 41 having the second optical fiber connection part 42, and the electronic module 2a is electrically connected to the second optoelectronic element 41 having the second optical fiber connection part 42.

[0107] In one embodiment, the electronic module 2a may have a first connection area A and a second connection area B, the first connection area A of the electronic module 2a is electrically connected to the first optoelectronic element 31 having the first optical fiber connection part 32, and the second connection area B of the electronic module 2a is electrically connected to the second optoelectronic element 41 having the second optical fiber connection part 42.

[0108] In one embodiment, the electronic module 2 a may include at least one first electronic component 21 and a plurality of conductors 212 , and the first electronic component 21 is combined with and electrically connected to the plurality of conductors 212 .

[0109] In one embodiment, the electronic module 2a may have multiple conductive bumps 22, a circuit structure 20, multiple conductive columns 23, a wiring structure 24 and multiple conductive elements 26, and a first optoelectronic element 31 having a first optical fiber connection portion 32 is electrically connected to a second optoelectronic element 41 having a second optical fiber connection portion 42 through multiple conductive bumps 22, a circuit structure 20, multiple conductive columns 23, a wiring structure 24 and multiple conductive elements 26 in sequence.

[0110] In one embodiment, the second step H2 of the stepped supporting structure 50 is flush with or coplanar with the upper surface of the second optoelectronic component 41 having the second optical fiber connecting portion 42 , but the present invention is not limited thereto.

[0111] In one embodiment, the length L2 or area of ​​the first step H1 of the receiving portion 51 of the stepped supporting structure 50 may be greater than 2 / 3 of the length L1 or area of ​​the supported second photoelectric element 41 , but is not limited thereto.

[0112] In one embodiment, the first optical fiber connection portion 32 of the first optoelectronic component 31 and the second optical fiber connection portion 42 of the second optoelectronic component 41 are located on the same side of the electronic package 2 , and the first optical fiber connection portion 32 faces the second optical fiber connection portion 42 .

[0113] In one embodiment, the first optical fiber connection portion 32 of the first optoelectronic component 31 and the second optical fiber connection portion 42 of the second optoelectronic component 41 are located on opposite sides of the electronic package 3 .

[0114] In one embodiment, the electronic package 3 may include at least one second electronic component 71 located on the first optoelectronic component 31 having the first optical fiber connecting portion 32 and electrically connected to the first optoelectronic component 31 .

[0115] In one embodiment, the electronic package 3 may include at least one third electronic component 81 located on the second optoelectronic component 41 having the second optical fiber connecting portion 42 and electrically connected to the second optoelectronic component 41 .

[0116] In summary, the electronic package and the manufacturing method thereof of the present invention have at least the following features, advantages or technical effects.

[0117] First, the present invention can dispose a first optoelectronic component having a first optical fiber connection portion on an electronic module, and dispose a second optoelectronic component having a second optical fiber connection portion on a receiving portion of a stepped support structure. This facilitates the vertical integration of two optoelectronic components having optical fiber connections into an electronic package, thereby increasing or multiplying the data transmission volume or data rate per unit time of the electronic package, and improving the operating performance or data transmission performance of the electronic package.

[0118] 2. The present invention can dispose a second optoelectronic component having a second optical fiber connection portion on the first step of a receiving portion at a lower position in a stepped supporting structure, thereby utilizing the three-dimensional (3D) structure of the electronic package to vertically integrate two optoelectronic components having optical fiber connection portions, and can also effectively maintain or not increase the overall height or volume of the electronic package.

[0119] Third, the receiving portion of the stepped supporting structure of the present invention can stably support the second optoelectronic component, thereby preventing the second optoelectronic component from being suspended and potentially tilting. Furthermore, the structure can meet the high-precision requirements of fiber attaching, facilitating precise bonding between the second optical fiber connector of the second optoelectronic component and an optical fiber (such as a busbar of an optical fiber cable), while also minimizing the risk of bonding failure between the second optical fiber connector of the second optoelectronic component and the optical fiber.

[0120] 4. The present invention can electrically connect the first connection area and the second connection area of ​​the electronic module to the first optoelectronic element and the second optoelectronic element respectively, so that the first optoelectronic element and the second optoelectronic element can effectively transmit signals to each other through the electronic module.

[0121] 5. The present invention enables the second step of the stepped supporting structure to be flush or coplanar with the upper surface of the second optoelectronic component having the second optical fiber connection portion, so that the electronic package can not only vertically integrate the two optoelectronic components having the optical fiber connection portions, but also effectively maintain or not increase the overall height or volume of the electronic package.

[0122] 6. The present invention can make the length or area of ​​the receiving portion (first step) of the stepped supporting structure more than 2 / 3 of the length or area of ​​the supported second photoelectric element, so that the receiving portion of the stepped supporting structure can stably support the second photoelectric element.

[0123] 7. The present invention can dispose the first optical fiber connection portion of the first optoelectronic component and the second optical fiber connection portion of the second optoelectronic component on the same side or opposite sides, so that the first optical fiber connection portion and the second optical fiber connection portion can be easily connected to the busbar of optical fibers or optical fiber cables on the same side or opposite sides of the electronic package.

[0124] 8. The present invention can dispose at least one (e.g., multiple) electronic components on a first optoelectronic component having a first optical fiber connection portion or a second optoelectronic component having a second optical fiber connection portion, so that the electronic package can easily vertically integrate more electronic components and improve the overall performance of the electronic package.

[0125] The above embodiments are intended to illustrate the principles and effects of the present invention and are not intended to limit the present invention. Any person skilled in the art may modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be as set forth in the appended claims.

Claims

1. An electronic package, comprising: Electronic modules; a first optoelectronic component having a first optical fiber connecting portion, which is disposed on the electronic module and electrically connected to the electronic module; A stepped bearing structure having a receiving portion; as well as A second optoelectronic element having a second optical fiber connecting portion, which is disposed on a first step of the receiving portion of the stepped supporting structure, and the first step of the receiving portion of the stepped supporting structure is lower than a second step of the stepped supporting structure; The electronic module is arranged on the second step of the stepped supporting structure and the second optoelectronic element having the second optical fiber connecting portion, and the electronic module is electrically connected to the second optoelectronic element having the second optical fiber connecting portion.

2. The electronic package according to claim 1, wherein: The electronic module has a first connection area and a second connection area, the first connection area of ​​the electronic module is electrically connected to the first optoelectronic element, the second connection area of ​​the electronic module is electrically connected to the second optoelectronic element, and the first optoelectronic element and the second optoelectronic element transmit signals to each other through the electronic module.

3. The electronic package according to claim 1, wherein: The electronic module has at least one first electronic element, and the first electronic element is combined with and electrically connected to a plurality of conductors.

4. The electronic package according to claim 1, wherein: The electronic module has a circuit structure, multiple conductive columns, a wiring structure and multiple conductive elements, and the first optoelectronic element having the first optical fiber connection part is electrically connected to the second optoelectronic element having the second optical fiber connection part through the circuit structure, multiple conductive columns, wiring structure and multiple conductive elements in sequence.

5. The electronic package according to claim 1, wherein: The second step of the stepped supporting structure is flush with or coplanar with the upper surface of the second optoelectronic element having the second optical fiber connecting portion.

6. The electronic package according to claim 1, wherein: The length or area of ​​the first step of the receiving portion of the stepped supporting structure is greater than 2 / 3 of the length or area of ​​the second photoelectric element supported thereon.

7. The electronic package according to claim 1, wherein: The first optical fiber connection portion of the first optoelectronic element and the second optical fiber connection portion of the second optoelectronic element are located on the same side, and the first optical fiber connection portion faces the second optical fiber connection portion.

8. The electronic package according to claim 1, wherein: The first optical fiber connection portion of the first optoelectronic element and the second optical fiber connection portion of the second optoelectronic element are located on opposite sides. 9 . The electronic package according to claim 1 , further comprising at least one second electronic component, which is disposed on the first optoelectronic component having the first optical fiber connecting portion and is electrically connected to the first optoelectronic component. 10 . The electronic package according to claim 1 , further comprising at least one third electronic component, wherein the third electronic component is disposed on the second optoelectronic component having the second optical fiber connecting portion and is electrically connected to the second optoelectronic component.

11. A method for manufacturing an electronic package, comprising: Disposing a first optoelectronic component having a first optical fiber connecting portion on the electronic module and electrically connecting the electronic module; Disposing a second optoelectronic component having a second optical fiber connecting portion on a first step of a receiving portion of a stepped supporting structure, wherein the first step of the receiving portion of the stepped supporting structure is lower than a second step of the stepped supporting structure; and The electronic module is arranged on the second step of the stepped supporting structure and the second optoelectronic component having the second optical fiber connecting portion, wherein the electronic module is electrically connected to the second optoelectronic component having the second optical fiber connecting portion.

12. The method for manufacturing an electronic package according to claim 11, wherein: The electronic module has a first connection area and a second connection area, the first connection area of ​​the electronic module is electrically connected to the first optoelectronic component having the first optical fiber connection part, and the second connection area of ​​the electronic module is electrically connected to the second optoelectronic component having the second optical fiber connection part.

13. The method for manufacturing an electronic package according to claim 11, wherein: The electronic module has at least one first electronic element, and the first electronic element is combined with and electrically connected to a plurality of conductors.

14. The method for manufacturing an electronic package according to claim 11, wherein: The electronic module has a circuit structure, multiple conductive columns, a wiring structure and multiple conductive elements, and the first optoelectronic element having the first optical fiber connection part is electrically connected to the second optoelectronic element having the second optical fiber connection part through the circuit structure, multiple conductive columns, wiring structure and multiple conductive elements in sequence.

15. The method for manufacturing an electronic package according to claim 11, wherein: The second step of the stepped supporting structure is flush with or coplanar with the upper surface of the second optoelectronic element having the second optical fiber connecting portion.

16. The method for manufacturing an electronic package according to claim 11, wherein: The length or area of ​​the first step of the receiving portion of the stepped supporting structure is greater than 2 / 3 of the length or area of ​​the second photoelectric element supported thereon.

17. The method for manufacturing an electronic package according to claim 11, wherein: The first optical fiber connection portion of the first optoelectronic element and the second optical fiber connection portion of the second optoelectronic element are located on the same side, and the first optical fiber connection portion faces the second optical fiber connection portion.

18. The method for manufacturing an electronic package according to claim 11, wherein: The first optical fiber connection portion of the first optoelectronic element and the second optical fiber connection portion of the second optoelectronic element are located on opposite sides. 19 . The method for manufacturing an electronic package according to claim 11 , further comprising disposing at least one second electronic component on the first optoelectronic component having the first optical fiber connecting portion and electrically connecting the first optoelectronic component. 20 . The method for manufacturing an electronic package according to claim 11 , further comprising disposing at least one third electronic component on the second optoelectronic component having the second optical fiber connecting portion and electrically connecting the second optoelectronic component.

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