Radio frequency device and packaging method thereof

Abstract

The invention discloses a radio frequency device and a packaging method thereof, the radio frequency device comprises a packaging substrate, a first type of component and a second type of component, and the packaging substrate comprises a first area and a second area; the first type of component is fixed on the packaging substrate through a preformed soldering lug and is located in the first area; the second type of component is fixed on the packaging substrate through a conductive film and is located in the second area; and the power of the first type of components is greater than that of the second type of components. According to the technical scheme of the embodiment of the invention, the micro-pitch packaging effect of the radio frequency device can be improved, the product size is further reduced, and the packaging cost is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of radio frequency devices, and in particular to a radio frequency device and a packaging method thereof. Background Art

[0002] For RF devices, during the packaging stage, conductive materials are usually used to attach components (chips) to the tube shell. In this way, while meeting the heat dissipation requirements of the RF device, the current generated by the chip can be conducted away during the operation of the RF device, ensuring RF performance and product reliability and reducing the risk of product burnout.

[0003] The packaging of RF devices is developing towards low-cost, micro-pitch packaging. Most existing technologies use silver glue, eutectic soldering and other methods for patching, but the silver glue / solder pads undergo solid-liquid state changes during sintering, which places certain requirements on the spacing between adjacent components. It is difficult to further reduce the spacing between adjacent components, resulting in limited micro-pitch packaging effects for RF devices. In addition, eutectic soldering often uses solder pads made of AuSn, AuSi and other materials, and the costs of gold and silver are relatively high, resulting in high packaging costs. Summary of the invention

[0004] The present invention provides a radio frequency device and a packaging method thereof, so as to improve the micro-pitch packaging effect of the radio frequency device, further reduce the product size and reduce the packaging cost.

[0005] In one aspect, the present invention provides a radio frequency device, comprising:

[0006] A packaging substrate, comprising a first region and a second region;

[0007] The first type of components are fixed on the packaging substrate through the preformed solder sheet and are located in the first area;

[0008] The second type of components are fixed on the packaging substrate through the conductive film and are located in the second area;

[0009] The power of the first type of components is greater than the power of the second type of components.

[0010] Optionally, the mounting process of the second type of components is performed before the mounting process of the first type of components.

[0011] Optionally, along a direction perpendicular to the plane where the packaging substrate is located, the thickness of the conductive film is greater than or equal to the thickness of the preform solder sheet.

[0012] Optionally, the number of preformed solder sheets is consistent with the number of first regions, and the number of conductive films is consistent with the number of second regions; at least one first-category component is disposed in one first region, and at least one second-category component is disposed in one second region;

[0013] The minimum spacing between two adjacent second-category components is smaller than the minimum spacing between two adjacent first-category components.

[0014] Optionally, the packaging substrate includes two second regions, and the two second regions are located on two opposite sides of the first region.

[0015] Optionally, the second region surrounds the first region.

[0016] On the other hand, based on the same inventive concept, the present invention also provides a packaging method for a radio frequency device, comprising:

[0017] A packaging substrate is provided; the packaging substrate comprises a first region and a second region;

[0018] Soldering the first type of components to the first area of ​​the package substrate through the preformed solder sheet;

[0019] Bonding the second type of components to the second area of ​​the packaging substrate through the conductive film;

[0020] Among them, the power of the first type of components is greater than the power of the second type of components.

[0021] The present invention also provides another packaging method for a radio frequency device, comprising:

[0022] A packaging substrate is provided; the packaging substrate comprises a first region and a second region;

[0023] Bonding the second type of components to the second area of ​​the packaging substrate through the conductive film;

[0024] Soldering the first type of components to the first area of ​​the package substrate through the preformed solder sheet;

[0025] Among them, the power of the first type of components is greater than the power of the second type of components.

[0026] Optionally, bonding the second type of components to the second area of ​​the package substrate through a conductive film includes:

[0027] Providing a conductive film, and cutting the conductive film according to the shape of the second region;

[0028] Pasting the cut conductive film to the second area of ​​the packaging substrate, and pasting the second type of components corresponding to the second area on the conductive film;

[0029] curing the conductive film at a first preset temperature;

[0030] Alternatively, bonding the second type of components to the second area of ​​the package substrate through a conductive film comprises:

[0031] Providing a conductive film, and pasting the second type of components corresponding to the second area onto the conductive film;

[0032] Cutting the conductive film, and pasting the cut conductive film with the second type of components pasted thereon to the corresponding second area;

[0033] The conductive film is cured at a first preset temperature.

[0034] Optionally, soldering the first type of components to the first area of ​​the package substrate through the preform solder sheet includes:

[0035] Placing a preform solder sheet on a first area of ​​a package substrate, and placing a first type of component on the preform solder sheet;

[0036] Sintering the solder preform at a second preset temperature to solder the first type of components to the first area of ​​the package substrate;

[0037] The second preset temperature is greater than the first preset temperature.

[0038] The technical solution of the embodiment of the present invention divides the components in the RF device into a first category of components and a second category of components with different powers, and fixes the first category of components with higher power to the first area of ​​the packaging substrate through a preformed solder sheet, and fixes the second category of components with lower power to the second area of ​​the packaging substrate through a conductive film. While ensuring normal conductive function, RF performance and product reliability, on the one hand, the heat dissipation requirements of high-power components can be met through eutectic welding. On the other hand, the conductive film is different from the preformed solder sheet and can maintain a stable state during sintering, thereby reducing the spacing between the second category components, improving the micro-pitch packaging effect of the RF device to a certain extent, and further reducing the product size. In addition, the cost of the conductive film is lower than that of the preformed solder sheet, thereby reducing the packaging cost.

[0039] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0041] Figure 1 is a schematic diagram of a top view of a radio frequency device provided by an embodiment of the present invention;

[0042] Figure 2 is along Figure 1A schematic diagram of the cross-sectional structure of the radio frequency device taken along line AA';

[0043] Figure 3 is a schematic diagram of a top view of another radio frequency device provided by an embodiment of the present invention;

[0044] Figure 4 is a schematic diagram of a top view of another radio frequency device provided by an embodiment of the present invention;

[0045] Figure 5 It is a schematic flow chart of a packaging method of a radio frequency device provided by an embodiment of the present invention;

[0046] Figure 6 It is a schematic flow chart of another method for packaging a radio frequency device provided by an embodiment of the present invention;

[0047] Figure 7 It is a schematic flow chart of another method for packaging a radio frequency device provided by an embodiment of the present invention;

[0048] Figure 8 It is a flow chart of another method for packaging a radio frequency device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0049] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0050] It is obvious to those skilled in the art that various modifications and changes can be made in the present application without departing from the spirit or scope of the present application. Therefore, the present application is intended to cover modifications and changes of the present application that fall within the scope of the corresponding claims (technical solutions for protection) and their equivalents. It should be noted that the implementation methods provided in the embodiments of the present application can be combined with each other without contradiction.

[0051] First of all, it should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left" and "right" are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly. In addition, the shapes and sizes of the components in the accompanying drawings do not reflect the true proportions, and the purpose is only to illustrate the content of the present invention.

[0052] Figure 1 is a schematic diagram of a top view of a radio frequency device provided by an embodiment of the present invention, Figure 2 is along Figure 1 The cross-sectional structure diagram of the radio frequency device taken at AA' is shown in FIG. Figure 1 and Figure 2 As shown, the RF device 10 provided in an embodiment of the present invention includes a packaging substrate 11, a first type of components 12 and a second type of components 13; the packaging substrate 11 includes a first area S1 and a second area S2; the first type of components 12 are fixed to the packaging substrate 11 through a preformed solder sheet 14 and are located in the first area S1; the second type of components 13 are fixed to the packaging substrate 11 through a conductive film 15 and are located in the second area S2; the power of the first type of components 12 is greater than the power of the second type of components 13.

[0053] Among them, the packaging substrate 11 is used to carry the first type components 12 and the second type components 13. After the first type components 12 and the second type components 13 are mounted on the packaging substrate 11 and the wire bonding between the pads is completed, an airtight cover can be performed to complete the packaging and obtain a radio frequency device.

[0054] The first area S1 of the package substrate 11 is used to place the first type of components 12 with higher power, and the second area S2 of the package substrate 11 is used to place the second type of components 13 with lower power. Exemplarily, the first type of components 12 may be GaN components, and the second type of components 13 may be non-GaN components, such as capacitors, resistors, thin film loads, low-power chips or other passive devices.

[0055] Furthermore, the core idea of ​​the embodiment of the present invention is that, for the first type components 12 and the second type components 13 with different powers contained in the radio frequency device, different patch methods are used to fix them in different areas of the packaging substrate 11, so as to optimize the layout of the components, improve the area utilization of the packaging substrate, further reduce the product size, and reduce the packaging cost.

[0056] Specifically, for the first type components 12 with higher power, the present embodiment uses the preformed solder sheet 14 to fix them to the first area S1 of the package substrate 11, and for the second type components 13 with lower power, the present embodiment uses the conductive film 15 to fix them to the second area S2 of the package substrate 11. With such a configuration, while ensuring the normal conductive function, on the one hand, the heat dissipation requirements of high-power components can be met by eutectic welding, and on the other hand, the conductive film 15 is different from the preformed solder sheet 14 and can maintain a stable state during sintering, thereby reducing the spacing between the second type components 13, improving the micro-pitch packaging effect of the RF device to a certain extent, and further reducing the product size. In addition, the cost of the conductive film 15 is lower than that of the preformed solder sheet 14, thereby reducing the packaging cost.

[0057] Specifically, the first type of components 12 can be soldered to the packaging substrate 11 via the preformed solder sheet 14 , and the second type of components 13 can be bonded to the packaging substrate 11 via the conductive film 15 .

[0058] For example, the preformed solder sheet 14 can be a solder sheet made of AuSn, AuSi or the like. Figure 2 The lower surface of the first type component 12 is subjected to a thick gold process (for example, Au>0.5μm), and the upper surface of the package substrate 11 is gold plated, and then the preformed solder sheet 14 and the first type component 12 are sequentially stacked on the package substrate 11, and then placed in a sintering device for high-temperature sintering to solder the first type component 12 to the first area S1 of the package substrate 11. Exemplarily, the sintering temperature of this process can be 300°C to 330°C, and the sintering time is 10min to 30min.

[0059] Exemplarily, the conductive film 15 is mainly composed of a conductive layer and adhesive layers located on the upper and lower sides of the conductive layer. During packaging, the conductive film 15 can be first pasted between the second type component 13 and the packaging substrate 11 through the adhesive layer of the conductive film 15, and then the adhesive layer of the conductive film 15 is cured by using a sintering device to bond the second type component 13 to the second area S2 of the packaging substrate 11. Exemplarily, the sintering temperature of this process can be 25°C to 200°C, and the sintering time can be 30min to 60min.

[0060] It should be noted that the packaging substrate 11 may include at least one first region S1 and at least one second region S2. The embodiment of the present invention does not limit the number and layout of the first region S1 and the second region S2. Figure 1 The packaging substrate 11 including a first area S1 and a second area S2 is taken as an example for illustration.

[0061] It should also be noted that one or more first-category components 12 can be placed in a first area S1, and one or more first-category components 12 can be placed in a second area S2. The embodiment of the present invention does not limit the corresponding relationship between the quantity of the first area S1 and the first-category components 12, and the corresponding relationship between the quantity of the second area S2 and the second-category components 13. Figure 1 It is only taken as an example that a first area S1 is placed with a plurality of first-type components 12 and a second area S2 is placed with a plurality of second-type components 13.

[0062] It should also be noted that different first-category components 12 can share a preformed solder sheet 14, or respectively correspond to different preformed solder sheets 14, and different second-category components 13 can share a conductive film 15, or respectively correspond to different conductive films 15, and the embodiments of the present invention do not limit this.

[0063] It should also be noted that the present embodiment does not limit the order of the mounting process of the first type components 12 and the mounting process of the second type components 13. The mounting process of the first type components 12 may be performed first (i.e., the first type components 12 are fixed to the first area S1 of the packaging substrate 11 through the preformed solder sheet 14), and then the mounting process of the second type components 13 may be performed (i.e., the second type components 13 are fixed to the second area S2 of the packaging substrate 11 through the conductive film 15). Alternatively, the mounting process of the second type components 13 may be performed first, and then the mounting process of the first type components 12 may be performed.

[0064] In summary, the embodiments of the present invention divide the components in the RF device into a first category of components and a second category of components with different powers, and fix the first category of components with higher power to the first area of ​​the packaging substrate through a preformed solder sheet, and fix the second category of components with lower power to the second area of ​​the packaging substrate through a conductive film. While ensuring normal conductive function, RF performance and product reliability, on the one hand, the heat dissipation requirements of high-power components can be met through eutectic welding. On the other hand, the conductive film is different from the preformed solder sheet and can maintain a stable state during sintering, thereby reducing the spacing between the second category components, improving the micro-pitch packaging effect of the RF device to a certain extent, and further reducing the product size. In addition, the cost of the conductive film is lower than that of the preformed solder sheet, thereby reducing the packaging cost.

[0065] On the basis of the above embodiment, as a feasible packaging method, optionally, the mounting process of the second type of components 13 is performed before the mounting process of the first type of components 12 .

[0066] Considering that when soldering the first type components 12, the preformed solder sheet 14 will squeeze solder toward the edge of the first type components 12 due to the high temperature, resulting in an increase in the occupied area, while the conductive film 15 does not have this phenomenon and can maintain stable performance and state under high temperature conditions, therefore, this embodiment sets the mounting process of the second type components 13 before the mounting process of the first type components 12, and can use the conductive film 15 to limit the area expansion of the preformed solder sheet 14 during sintering, which is beneficial to further reduce the spacing between the first type components 12 and the second type components 13, further improve the micro-pitch packaging effect, and further reduce the product size.

[0067] Continue to see Figure 2 Optionally, along a direction perpendicular to the plane where the package substrate 11 is located, the thickness of the conductive film 15 is greater than or equal to the thickness of the preform solder sheet 14. The thickness of the preform solder sheet 14 can be understood as the initial thickness of the preform solder sheet before sintering. Exemplarily, the thickness of the preform solder sheet 14 can be 50 μm to 80 μm, so that too much solder can be prevented from flowing out due to the preform solder sheet 14 being too thick.

[0068] In this embodiment, by setting the thickness of the conductive film 15 to be greater than or equal to the thickness of the preformed solder sheet 14, on the one hand, it can prevent different conductive materials from affecting each other during the packaging process; on the other hand, when the mounting process of the second type of component 13 is before the mounting process of the first type of component 12, by setting the thickness of the conductive film 15 to be thicker, the area expansion of the preformed solder sheet 14 during sintering can be better limited.

[0069] Optionally, the number of preformed solder sheets 14 is consistent with the number of first regions S1, and the number of conductive films 15 is consistent with the number of second regions S2; at least one first-type component 12 is arranged in a first region S1, and at least one second-type component 13 is arranged in a second region S2.

[0070] Specifically, the first region S1 and the preformed solder sheet 14 are arranged in a one-to-one correspondence, and the two can be of the same shape. The size of the preformed solder sheet 14 before high-temperature sintering is smaller than the size of the first region S1, as long as the preformed solder sheet 14 after sintering can be in contact with all the first-type components 12 in the first region S1. Specifically, when a first-type component 12 is arranged in a first region S1, the first-type component 12 and the preformed solder sheet 14 are arranged in a one-to-one correspondence. When a plurality of first-type components 12 are arranged in a first region S1, the plurality of first-type components 12 in the same first region S1 share a preformed solder sheet 14. Similarly, the second region S2 and the conductive film 15 are arranged in a one-to-one correspondence, and the two have the same shape and can be approximately equal in size, as long as the conductive film 15 is in contact with all the second-type components 13 in the second region S2. Specifically, when a second type component 13 is arranged in a second area S2, the second type component 13 and the conductive film 15 are arranged in a one-to-one correspondence; when a plurality of second type components 13 are arranged in a second area S2, the plurality of second type components 13 in the same second area S2 share a conductive film 15.

[0071] In a specific embodiment, a plurality of first-category components 12 may be optionally arranged in a first area S1, and a plurality of second-category components 13 may be optionally arranged in a second area S2. In this case, the plurality of first-category components 12 in the same first area S1 may share a preformed solder sheet 14, and the plurality of second-category components 13 in the same second area S2 may share a conductive film 15. Such an arrangement can reduce the difficulty of patch processing, reduce the waste of area utilization of the packaging substrate 11 caused by patch errors, and improve patch processing efficiency.

[0072] Further optionally, the minimum distance between two adjacent second-category components 13 is smaller than the minimum distance between two adjacent first-category components 12 .

[0073] Taking a first region S1 in which a plurality of first-category components 12 are arranged as an example, there is a certain distance between any two adjacent first-category components 12. For two different first-category components 12, the distance may be the same or different. The minimum spacing between the above two adjacent first-category components 12 may be understood as the minimum value in the set consisting of the distances between all two adjacent first-category components 12. Similarly, the minimum spacing between two adjacent second-category components 13 may be understood as the minimum value in the set consisting of the distances between all two adjacent second-category components 13.

[0074] The embodiment of the present invention fixes the second-type components 13 on the packaging substrate 11 through the conductive film 15, and can use the stability of the conductive film 14 to reduce the spacing between the second-type components 13, so that the minimum spacing between two adjacent second-type components 13 is smaller than the minimum spacing between two adjacent first-type components 12, thereby improving the micro-pitch packaging effect.

[0075] It should be noted that, when only one first-type component 12 is set in a first area S1 and only one second-type component 13 is set in a second area S2, multiple first areas S1 can be set adjacent to each other, and multiple second areas S2 can be set adjacent to each other. In this way, based on the patch advantage of the conductive film 14, the minimum spacing between two adjacent second-type components 13 can also be made smaller than the minimum spacing between two adjacent first-type components 12, thereby reducing the spacing between some components and improving the micro-pitch packaging effect.

[0076] Exemplarily, the distance between two adjacent first-type components 12 before welding can be less than 50 μm, and the distance between two adjacent first-type components 12 after welding can be greater than or equal to 50 μm to avoid mutual influence between adjacent first-type components 12. The distance between two adjacent second-type components 13 can be less than 50 μm. When the number of second-type components 13 is large, the distance between two adjacent second-type components 13 can also be set to be less than 30 μm. Since the state of the conductive film 15 is stable, the distance between adjacent second-type components 13 can be appropriately reduced, the area utilization rate of the package substrate 11 can be improved, the micro-pitch packaging effect can be improved, and the product size can be further reduced.

[0077] Figure 3 is a schematic diagram of a top view of another radio frequency device provided in an embodiment of the present invention, such as Figure 3 As shown, optionally, the package substrate 11 includes two second areas S2, and the two second areas S2 are separated on opposite sides of the first area S1. In this way, the conductive film 15 can be separated on opposite sides of the preform solder sheet 14. When the mounting process of the second type of components 13 is before the mounting process of the first type of components 12, the conductive film 15 existing on the package substrate 11 can be used to limit the expansion of the intermediate preform solder sheet 14 to both sides during sintering during the mounting process of the first type of components 12, which is conducive to further reducing the spacing between the first type of components 12 and the second type of components 13, further improving the micro-pitch packaging effect, and further reducing the product size.

[0078] Figure 4 is a schematic diagram of a top view of another radio frequency device provided by an embodiment of the present invention, such as Figure 4As shown, optionally, the second area S2 surrounds the first area S1. In this way, the conductive film 15 can surround the preformed solder sheet 14. When the mounting process of the second type of components 13 is before the mounting process of the first type of components 12, the conductive film 15 existing on the packaging substrate 11 can be used to limit the expansion of the intermediate preformed solder sheet 14 to the surroundings during sintering during the mounting process of the first type of components 12, which is conducive to further reducing the spacing between the first type of components 12 and the second type of components 13, further improving the micro-pitch packaging effect, and further reducing the product size.

[0079] It should be noted that the above embodiment is only based on the fact that the mounting process of the second type components 13 is before the mounting process of the first type components 12, and the first area S1, the second area S2, the preformed solder sheet 14, the conductive film 15, and the arrangement of the first type components 12 and the second type components 13 are described in detail. When the mounting process of the first type components 12 is before the mounting process of the second type components 13, the above arrangement is also applicable and will not be repeated here.

[0080] Based on the same inventive concept, the present invention further provides a packaging method for a radio frequency device. The radio frequency device of any of the above embodiments can be obtained by adopting this packaging method, and the similarities will not be repeated here. Figure 5 is a schematic diagram of a process flow of a packaging method for a radio frequency device provided by an embodiment of the present invention, such as Figure 5 As shown, the packaging method may include the following steps:

[0081] S110, providing a packaging substrate; the packaging substrate includes a first area and a second area.

[0082] S120, soldering the first type of components to the first area of ​​the packaging substrate through the preformed solder sheet.

[0083] S130, bonding the second type of components to the second area of ​​the packaging substrate through the conductive film.

[0084] Among them, the power of the first type of components is greater than the power of the second type of components.

[0085] After the above-mentioned patch is completed, the subsequent common packaging processes, such as bonding, airtight capping, etc., can be continued, which will not be explained in detail here.

[0086] The packaging method provided by the embodiment of the present invention divides the packaging substrate into a plurality of first areas and second areas, and welds the first type of components to the first area of ​​the packaging substrate through preformed solder sheets, and bonds the second type of components to the second area of ​​the packaging substrate through a conductive film. While ensuring normal conductive function, radio frequency performance and product reliability, on the one hand, the heat dissipation requirements of high-power components can be met through eutectic welding. On the other hand, the conductive film is different from the preformed solder sheet and can maintain a stable state during sintering, thereby reducing the spacing between the second type of components, improving the micro-pitch packaging effect of the radio frequency device to a certain extent, and further reducing the product size. In addition, the cost of the conductive film is lower than that of the preformed solder sheet, thereby reducing the packaging cost.

[0087] Figure 6 is a flow chart of another method for packaging a radio frequency device provided by an embodiment of the present invention, such as Figure 6 As shown, the packaging method may include the following steps:

[0088] S210, providing a packaging substrate; the packaging substrate includes a first area and a second area.

[0089] S220, bonding the second type of components to the second area of ​​the packaging substrate through the conductive film.

[0090] S230, soldering the first type of components to the first area of ​​the packaging substrate through the preformed solder sheet.

[0091] Among them, the power of the first type of components is greater than the power of the second type of components.

[0092] This embodiment is different from the above embodiment ( Figure 5 ) is that the order of mounting the first type of components and the second type of components is different. Specifically, in this embodiment, by first performing the mounting process of the second type of components and then performing the mounting process of the first type of components, the conductive film can be used to limit the area expansion of the preformed solder sheet during sintering, thereby further reducing the spacing between the first type of components and the second type of components, further improving the micro-pitch packaging effect, and further reducing the product size.

[0093] Based on the scheme that the mounting process of the second type of components precedes the mounting process of the first type of components, the mounting process of the first type of components and the second type of components is further refined below. The specific mounting process of the first type of components / the second type of components provided below is also applicable to the case where the mounting process of the first type of components precedes the mounting process of the second type of components, and will not be described in detail. For example, Figure 7 is a flow chart of another method for packaging a radio frequency device provided by an embodiment of the present invention, such as Figure 7 As shown, the packaging method may include the following steps:

[0094] S310, providing a packaging substrate; the packaging substrate includes a first area and a second area.

[0095] Specifically, the packaging substrate can be divided into several first areas and several second areas according to the type, size and other parameters of the components included in the RF device. The first areas are used to carry the first type of components with higher power, and the second areas are used to carry the second type of components with lower power.

[0096] S320, providing a conductive film, and cutting the conductive film according to the shape of the second region.

[0097] Specifically, the conductive film corresponds to the second regions one by one, and the conductive film can be cut according to the shape of each second region so that the size of the conductive film is substantially consistent with the size of the second region, so as to paste the corresponding second type components.

[0098] S330, pasting the cut conductive film to the second area of ​​the packaging substrate, and pasting the second type of components corresponding to the second area on the conductive film.

[0099] Specifically, as described above, the conductive film includes an adhesive layer. After removing the protective layer on the surface of the adhesive layer on one side, the cut conductive film can be pasted on the second area of ​​the packaging substrate. After removing the protective layer on the surface of the adhesive layer on the other side, several second-type components corresponding to the second area can be pasted on the conductive film.

[0100] Optionally, the size of the second area is slightly larger than the size that the second type components corresponding to the second area need to occupy. The size that the second type components need to occupy can be understood as the size of the minimum area that needs to be occupied according to the layout of each second type component. When the second type components are pasted on the conductive film, errors are inevitable. By setting the size of the second area to be slightly larger than the size that the second type components corresponding to the second area need to occupy, it can be ensured that the size of the conductive film is sufficient to cover each second type component corresponding to the second area, thereby ensuring the performance of the RF device.

[0101] S340, curing the conductive film at a first preset temperature.

[0102] Specifically, the package substrate with the second type of components and the conductive film attached thereto can be placed in a sintering device, and the sintering temperature can be set to a first preset temperature to cure the conductive film (cure the adhesive layer) so that the second type of components are bonded to the package substrate through the conductive film. Exemplarily, the first preset temperature can be 200° C. and the time can be 60 minutes.

[0103] S350, placing the preformed solder sheet on the first area of ​​the packaging substrate, and placing the first type of components on the preformed solder sheet.

[0104] The preformed solder sheet may be a solder sheet made of AuSn, AuSi, etc. To achieve soldering, a gold layer is plated on the package substrate. Before placing the first type of components on the preformed solder sheet, a thick gold process (i.e., gold plating) is also required on the back of the first type of components.

[0105] S360, sintering the preformed solder sheet at a second preset temperature to solder the first type of components to the first area of ​​the packaging substrate; wherein the second preset temperature is greater than the first preset temperature.

[0106] Specifically, during high-temperature sintering, the gold on the back of the first-type components, the preformed solder sheet, and the package substrate melts and fuses, and becomes solid after the temperature is lowered, thereby soldering the first-type components to the package substrate. Exemplarily, the second preset temperature can be 300° C. to 330° C., and the time is 10 min to 30 min.

[0107] Figure 8 is a flow chart of another method for packaging a radio frequency device provided by an embodiment of the present invention, and Figure 7 The difference between the packaging methods shown is that the mounting process of the second type of components is different, and the other similarities will not be repeated. Figure 8 As shown, the packaging method may include the following steps:

[0108] S410, providing a packaging substrate; the packaging substrate includes a first area and a second area.

[0109] S420, providing a conductive film, and pasting the second type of components corresponding to the second area onto the conductive film.

[0110] S430, cutting the conductive film, and pasting the cut conductive film with the second type of components pasted thereon to the corresponding second area.

[0111] S440, curing the conductive film at a first preset temperature.

[0112] S450, placing the preformed solder sheet on the first area of ​​the packaging substrate, and placing the first type of components on the preformed solder sheet.

[0113] S460, sintering the preformed solder sheet at a second preset temperature to solder the first type of components to the first area of ​​the packaging substrate; wherein the second preset temperature is greater than the first preset temperature.

[0114] In this embodiment, when performing patch mounting of second-category components, the second-category components corresponding to the second area are first pasted on the conductive film, and then the conductive film is cut, and then the conductive film is pasted on the second area corresponding to the packaging substrate. In this way, the conductive film can be cut according to the actual layout of the second-category components. Compared with cutting the conductive film first and then pasting the second-category components, the influence of errors can be reduced, the area utilization rate of the packaging substrate is further improved, and the product size is further reduced.

[0115] Optionally, the distance between the edge of the conductive film and the second type component closest to the edge is 0 to 100 μm. Specifically, since the second type components have been pasted on the conductive film, when cutting the conductive film, the edge of the conductive film can be as close as possible to the outermost edge of the second type component to reduce the occupied area and improve the area utilization of the package substrate.

[0116] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A radio frequency device, characterized in that: include: A packaging substrate, comprising a first region and a second region; A first type of component is fixed on the packaging substrate through a preformed solder sheet and is located in the first area; The second type of components are fixed on the packaging substrate through a conductive film and are located in the second area; The power of the first category of components is greater than the power of the second category of components.

2. The radio frequency device according to claim 1, characterized in that: The mounting process of the second type of components is before the mounting process of the first type of components.

3. The radio frequency device according to claim 1 or 2, characterized in that: Along a direction perpendicular to a plane where the packaging substrate is located, a thickness of the conductive film is greater than or equal to a thickness of the preformed solder sheet.

4. The radio frequency device according to claim 1 or 2, characterized in that: The number of the preformed solder sheets is consistent with the number of the first regions, and the number of the conductive films is consistent with the number of the second regions; at least one first-type component is disposed in one of the first regions, and at least one second-type component is disposed in one of the second regions; The minimum spacing between two adjacent components of the second category is smaller than the minimum spacing between two adjacent components of the first category.

5. The radio frequency device according to claim 4, characterized in that: The packaging substrate includes two second regions, and the two second regions are located at two opposite sides of the first region.

6. The radio frequency device according to claim 4, characterized in that: The second area surrounds the first area.

7. A packaging method for a radio frequency device, characterized in that: include: Providing a packaging substrate; The packaging substrate includes a first area and a second area; Soldering the first type of components to the first area of ​​the packaging substrate through a preformed solder sheet; Bonding the second type of components to the second area of ​​the packaging substrate through a conductive film; Among them, the power of the first type of components is greater than the power of the second type of components.

8. A method for packaging a radio frequency device, characterized in that: include: Providing a packaging substrate; The packaging substrate includes a first area and a second area; Bonding the second type of components to the second area of ​​the packaging substrate through a conductive film; Soldering the first type of components to the first area of ​​the packaging substrate through a preformed solder sheet; Among them, the power of the first type of components is greater than the power of the second type of components.

9. The packaging method according to claim 7 or 8, characterized in that: The step of bonding the second type of components to the second area of ​​the packaging substrate through the conductive film includes: Providing a conductive film, and cutting the conductive film according to the shape of the second region; Pasting the cut conductive film to the second area of ​​the packaging substrate, and pasting the second type of components corresponding to the second area on the conductive film; curing the conductive film at a first preset temperature; Alternatively, the step of bonding the second type of components to the second region of the packaging substrate through a conductive film includes: Providing a conductive film, and pasting the second-type components corresponding to the second area onto the conductive film; Cutting the conductive film, and pasting the cut conductive film with the second type of components pasted thereon to the corresponding second area; The conductive film is cured at a first preset temperature.

10. The packaging method according to claim 9, characterized in that: The step of soldering the first type of components to the first area of ​​the packaging substrate by using a preform solder sheet includes: Placing the preform solder sheet on the first area of ​​the packaging substrate, and placing the first type of components on the preform solder sheet; Sintering the solder preform at a second preset temperature to solder the first type of components to the first area of ​​the packaging substrate; Wherein, the second preset temperature is greater than the first preset temperature.

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