A macrochannel submodule packaging fixture

Abstract

This invention discloses a macrochannel submodule packaging fixture. A macrochannel heat dissipation base limiting mechanism is provided on the base plate of an inverted gate-shaped placement rack. Positioning frame limiting mechanisms are provided on the side plates of the placement rack. Pressure rods are fixedly connected to the upper part of the side plates of the placement rack. A row of spring pins is evenly arranged on the pressure rods, and a pressing block is pressed below the spring pins. The pressing block is located above the positioning frame. A macrochannel heat dissipation base and an insulating ceramic sheet with a metal film coated on its surface are placed between the positioning frame and the base plate of the placement rack. The macrochannel heat dissipation base is below the insulating ceramic sheet. The positioning frame includes two metal baffles on the left and right sides. Positioning partitions and metal blocks are spaced apart between the two metal baffles. A submodule receiving cavity is formed between the metal block and the positioning partitions. The shape of the pressing block is the same as the submodule receiving cavity. The submodules are separated by the positioning partitions, preventing mutual compression, accumulation of errors, and deviation of the metal film cutting lines on the chip and the insulating ceramic sheet.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor laser technology, and specifically relates to a macrochannel submodule packaging fixture.

[0002] This invention belongs to the category of Novel Components Semiconductor Laser Devices under the key direction of the core electronic industry in the new generation information technology industry, specifically in the category of Novel Industry Catalogue 1.3.3. Background Technology

[0003] The macrochannel submodule is constructed by welding two electrode plates and a semiconductor laser array chip. The two electrode plates sandwich the chip during welding, and serve as the positive and negative electrodes of the chip, respectively. Figure 1 As shown, the module dimensions are only 10mm × 2mm × 1mm. Assembling a macrochannel laser typically requires multiple such sub-modules to be connected in series and welded together to form a high-power macrochannel laser. During welding, the sub-modules need to be welded to an insulating ceramic sheet with a metal film coated on its surface. To ensure that the positive and negative terminals of the sub-modules do not short-circuit, the metal film is generally cut with a diamond blade, see [reference needed]. Figure 9 The chip is positioned precisely at the cut point, and the positive and negative electrodes are soldered to the metal film layer of the ceramic wafer. In this way, a cut line corresponds exactly to the position of a chip, allowing the sub-modules to be connected in series without short circuits. However, the following problems arise during the packaging process:

[0004] 1. Because the chip is very thin, only 0.135mm, the cumulative error between sub-modules can easily cause the chip and the cut line to deviate, causing the positive and negative terminals of the sub-module to be soldered to the same metal film, resulting in a short circuit.

[0005] 2. During submodule soldering, due to the close arrangement of the submodules, mutual compression is inevitable, causing some submodules to be lifted. These lifted submodules cannot contact the solder during soldering, resulting in soldering failure. In this case, when the submodule is powered on, it cannot dissipate heat in time, leading to submodule burnout. Summary of the Invention

[0006] To address the problems in existing technologies, such as the cumulative errors between sub-modules causing chip and cut lines to deviate, short circuits caused by soldering the positive and negative electrodes of the sub-modules to the same metal film, and the problem of sub-modules being lifted due to mutual compression, this invention provides a macrochannel sub-module packaging fixture.

[0007] The object of this invention is achieved in the following manner:

[0008] A macrochannel submodule packaging fixture includes a placement frame, a positioning frame, pressure blocks, pressure rods, and spring pins. The placement frame is an inverted gate shape. A macrochannel heat dissipation base limiting mechanism is provided on the bottom plate of the placement frame. Positioning frame limiting mechanisms are provided on the side plates of the placement frame. Pressure rods are fixedly connected to the upper part of the side plates of the placement frame. A row of spring pins is evenly arranged on the pressure rods. Each spring pin presses a pressure block below it. The number of pressure blocks is not less than the number of submodules. The pressure blocks are located above the positioning frame. A macrochannel heat dissipation base and an insulating ceramic sheet with a metal film coated on its surface are placed between the positioning frame and the bottom plate of the placement frame. The channel heat dissipation base is located below the insulating ceramic sheet. The positioning frame includes two metal baffles on the left and right, and positioning partitions and metal blocks are distributed between the two metal baffles. The metal blocks include a first metal block and a second metal block. One end of the positioning partition is detachably connected to the first metal block, and the other end is detachably connected to the second metal block. The first metal block, the second metal block and the positioning partition form a sub-module receiving cavity. The width of the first metal block and the second metal block is the same as the width of the sub-module, and the distance between the first metal block and the second metal block is the same as the length of the sub-module. The shape of the pressure block is the same as the sub-module receiving cavity.

[0009] Both ends of the positioning partition are provided with connection holes, and the ends of the first metal block and the second metal block that are far apart from each other are also provided with connection holes. The positioning partition is connected to the first metal block by screws passing through the connection holes, and the positioning partition is connected to the second metal block by screws passing through the connection holes.

[0010] Positioning tips are provided at the ends of the first and second metal blocks that are adjacent to each other.

[0011] The macro channel heat dissipation base limiting mechanism includes a first screw hole set on the base plate of the placement rack, and a positioning screw passes through the first screw hole.

[0012] The positioning frame limiting mechanism includes second screw holes on both sides of the display stand. The screw holes on both sides are set at the same height, and positioning screws pass through the screw holes.

[0013] There are two parallel pressure bars.

[0014] Compared with the prior art, the present invention has the following advantages:

[0015] 1. Each submodule is separated by a positioning partition, preventing them from squeezing each other and avoiding or reducing soldering failures caused by the submodules being lifted and unable to contact the solder. The position of each submodule is fixed, preventing the accumulation of errors and avoiding deviation of the metal film cutting lines on the chip and the insulating ceramic sheet, which could cause short circuits caused by the positive and negative terminals of the submodules being soldered to the same metal film.

[0016] 2. The thickness of both the metal block and the positioning partition can be changed as needed, making it adaptable to a wide range of applications and flexible in its use.

[0017] 3. The pressure block will not tilt when it is clamped on the positioning frame. The pressure block provides the pressure required when the sub-module is packaged, so that the sub-module is subjected to uniform force. Spring pins are used to prevent insufficient pressure from the pressure block, which may cause poor soldering.

[0018] 4. Multiple sub-modules were clamped together and sintered successfully in one go, improving work efficiency. Attached Figure Description

[0019] Figure 1 This is a structural diagram of the macrochannel submodule.

[0020] Figure 2 This is a schematic diagram of the structure of the present invention.

[0021] Figure 3 This is a structural diagram of the display shelf.

[0022] Figure 4 This is a schematic diagram of the positioning frame.

[0023] Figure 5 This is a schematic diagram of the metal block.

[0024] Figure 6 This is a structural schematic diagram of the positioning partition.

[0025] Figure 7 This is a schematic diagram of the compaction block.

[0026] Figure 8 This is a structural diagram of a pressure rod.

[0027] Figure 9 This is a schematic diagram of the structure of an insulating ceramic sheet with a metal film coated on its surface. Detailed Implementation

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of the invention. After reading the contents of this invention, those skilled in the art can make various alterations or modifications to the invention, and these equivalent forms also fall within the scope defined by this invention.

[0029] like Figure 2-8As shown, a macrochannel submodule packaging fixture includes a placement frame 1, a positioning frame 4, pressure blocks 5, pressure rods 6, and spring pins 7. The placement frame 1 is an inverted door shape. A macrochannel heat dissipation base limiting mechanism is set on the bottom plate of the placement frame 1, and positioning frame limiting mechanisms are set on the side plates of the placement frame 1. The upper part of the side plates of the placement frame 1 is fixedly connected to both ends of the pressure rod 6 by screws passing through the third screw holes 13. A row of spring pins 7 is evenly arranged on the pressure rod 6, and a pressure block 5 is pressed under each spring pin 7. The number of pressure blocks is not less than the number of submodules. The pressure blocks 5 are located above the positioning frame 4. A macrochannel heat dissipation base 2 and an insulating ceramic sheet 3 with a metal film coated on its surface are placed between the positioning frame 4 and the bottom plate of the placement frame 1. 2. Below the insulating ceramic sheet 3, the positioning frame 4 includes two metal baffles 44 on the left and right, and a positioning partition 41 and a metal block 42 are distributed between the two metal baffles 44 at intervals. The metal block 42 includes a first metal block 421 and a second metal block 422. One end of the positioning partition 41 is detachably connected to the first metal block 421, and the other end is detachably connected to the second metal block 422. The first metal block 421, the second metal block 422 and the positioning partition 41 form a sub-module receiving cavity 43. The width of the first metal block 421 and the second metal block 422 is the same as the width of the sub-module, and the distance between the first metal block 421 and the second metal block 422 is the same as the length of the sub-module. The shape of the pressure block 5 is the same as that of the sub-module receiving cavity 43.

[0030] The thickness of the positioning partition 41 is 0.05-0.1mm. The machining accuracy of each component is 0.01mm.

[0031] The detachable connection refers to the following: both ends of the positioning partition 41 are provided with connection holes, and the ends of the first metal block 421 and the second metal block 422 that are far apart from each other are also provided with connection holes. Screws pass through the connection holes between the positioning partition 41 and the first metal block 421 to fix them together. Similarly, the other end of the positioning partition 41 is also fixed to the second metal block 422 with screws. If it is necessary to replace the positioning partition 41 or metal block 42 with different thicknesses, the screws can be unscrewed for easy disassembly.

[0032] Furthermore, positioning tips 420 are provided at the adjacent ends of the first metal block 421 and the second metal block 422. The distance between the two positioning tips 420 is the length of the sub-module. The shape of the pressure block 5 is the same as that of the sub-module receiving cavity 43, such as... Figure 7 As shown, this special shape is designed to ensure that the pressure block 5 will not tilt when pressing the sub-module, ensuring that the sub-module is subjected to uniform force and that no cold solder joints are produced.

[0033] Furthermore, the macrochannel heat dissipation base limiting mechanism includes a first screw hole 11 provided on the base plate of the placement frame 1, through which a positioning screw passes. The existing macrochannel heat dissipation base has inlet and outlet water holes, as well as multiple mounting holes. The positioning screw passes through the first screw hole 11 and the mounting holes of the macrochannel heat dissipation base to fix the macrochannel heat dissipation base in place.

[0034] The positioning frame limiting mechanism includes second screw holes 12 on both side plates of the display stand 1. The screw holes 12 on both side plates are set at the same height, and positioning screws pass through the screw holes 12. The positioning screws pass through the second screw holes 12 on both side plates of the display stand 1 to fix the positioning frame 4 from the left and right ends.

[0035] The first metal block 421, the second metal block 422 and the positioning partition 41 form a sub-module receiving cavity 43. A sub-module can be placed between every two positioning partitions 41. If there is a deviation in the cutting line of the metal film on the chip and the ceramic sheet, it can be adjusted by replacing the positioning partitions 41 of different thicknesses.

[0036] Submodule 8 requires a certain amount of pressure during encapsulation, which is provided by pressure block 5 to ensure even stress distribution on the submodule. The purpose of using spring ejector pin 7 after pressure block 5 is to prevent insufficient pressure from the pressure block, which could lead to poor soldering. Furthermore, the pressure provided by spring ejector pin 7 is adjustable; simply replace the spring ejector pin with one of different pressure ratings. The submodule withstands an overall pressure of 10-200 g / cm³. 2 .

[0037] Furthermore, there are two parallel pressure rods 6. The purpose of using two pressure rods 6 is to have a spring pin 7 at each end of a pressure block 5 to press it down, ensuring that the pressure block 5 is subjected to uniform force and that the submodule is subjected to uniform force.

[0038] The usage method of the macro channel submodule packaging fixture includes the following steps:

[0039] S1. Secure the macro channel heat dissipation base 2 to the placement rack 1 with screws;

[0040] S2. Place a ceramic sheet 3 with a metal film coated on its surface on the macrochannel base 2, with evenly distributed cutting lines 31 on the metal film. Place solder between the macrochannel base 2 and the ceramic sheet 3 with the metal film coated on its surface. The upper surface of the ceramic sheet 3 has solder pre-formed by thermal evaporation.

[0041] S3. Assemble the positioning frame 4. Arrange positioning partitions 41 and metal blocks 42 at intervals between the left and right metal baffles 44. Fix the metal baffles 44, metal blocks 42 and positioning partitions 41 with screws. The metal baffles 44 are located on the outermost side of the positioning frame and act as positioning plates. Their thickness can be selected according to the width of the macro channel base. The first metal block 421, the second metal block 422 and the two positioning partitions 41 form a sub-module receiving cavity 43.

[0042] S4. Place the positioning frame 4 on the ceramic sheet 3 with a metal film on its surface, place the sub-module in the sub-module receiving cavity 43, and check whether the chip of the sub-module is deviated from the cutting line of the metal film. If there is no deviation, use screws to pass through the connecting holes on both sides of the placement frame 1 to fix the left and right sides of the positioning frame 4, and press it down with the pressure block 5. If there is a deviation, disassemble the positioning frame 4 partially or completely, replace it with a positioning partition 41 or metal block 42 of appropriate thickness, reassemble the positioning frame 4, and then fix the reassembled positioning frame 4 on the placement frame 1.

[0043] S5. Install the spring pins 7 one by one on the pressure rods 6, and then fix the two ends of the pressure rods 6 to the upper part of the two side walls of the placement frame 1 with screws. The spring pins 7 press down on the pressure block 5, and then the further sealing operation can be carried out.

[0044] The macrochannel submodule packaging fixture disclosed in this invention has the following advantages:

[0045] 1. Each submodule is separated by a positioning partition, preventing them from squeezing each other and avoiding or reducing soldering failures caused by the submodules being lifted and unable to contact the solder. The position of each submodule is fixed, preventing the accumulation of errors and avoiding deviation of the metal film cutting lines on the chip and the insulating ceramic sheet, which could cause short circuits caused by the positive and negative terminals of the submodules being soldered to the same metal film.

[0046] 2. The thickness of both the metal block and the positioning partition can be changed as needed, making it adaptable to a wide range of applications and flexible in its use.

[0047] 3. The pressure block will not tilt when it is clamped on the positioning frame. The pressure block provides the pressure required when the sub-module is packaged, so that the sub-module is subjected to uniform force. Spring pins are used to prevent insufficient pressure from the pressure block, which may cause poor soldering.

[0048] 4. Multiple sub-modules were clamped together and sintered successfully in one go, improving work efficiency.

[0049] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several changes and improvements without departing from the overall concept of the present invention, and these should also be considered within the scope of protection of the present invention.

Claims

1. A macrochannel submodule packaging fixture, characterized in that: The system includes a placement rack (1), a positioning frame (4), a pressure block (5), a pressure rod (6), and spring pins (7). The placement rack (1) is an inverted door shape. A macro channel heat dissipation base limiting mechanism is set on the bottom plate of the placement rack (1). A positioning frame limiting mechanism is set on the two side plates of the placement rack (1). A pressure rod (6) is fixedly connected to the upper part of the two side wall plates of the placement rack (1). A row of spring pins (7) is evenly arranged on the pressure rod (6). A pressure block (5) is pressed under each spring pin (7). The number of pressure blocks is not less than the number of sub-modules. The pressure blocks (5) are located above the positioning frame (4). A macro channel heat dissipation base (2) and an insulating ceramic sheet (3) with a metal film on its surface are placed between the positioning frame (4) and the bottom plate of the placement rack (1). Cutting lines (31) are evenly distributed on the metal film. The chips of the sub-modules correspond to the cutting lines of the metal film. The macro channel heat dissipation base (2) Below the insulating ceramic sheet (3), the positioning frame (4) includes two metal baffles (44) on the left and right, a positioning partition (41) and a metal block (42) distributed between the two metal baffles (44). The metal block (42) includes a first metal block (421) and a second metal block (422). One end of the positioning partition (41) is detachably connected to the first metal block (421), and the other end is detachably connected to the second metal block (422). The first metal block (421), the second metal block (422) and the positioning partition (41) form a sub-module receiving cavity (43). The width of the first metal block (421) and the second metal block (422) is the same as the width of the sub-module. The distance between the first metal block (421) and the second metal block (422) is the same as the length of the sub-module. The shape of the pressure block (5) is the same as the sub-module receiving cavity (43).

2. The macrochannel submodule packaging fixture according to claim 1, characterized in that: The positioning partition (41) has connection holes at both ends. The first metal block (421) and the second metal block (422) are also provided with connection holes at their ends that are far apart from each other. The positioning partition (41) and the first metal block (421) are connected by screws passing through the connection holes. The positioning partition (41) and the second metal block (422) are connected by screws passing through the connection holes.

3. The macrochannel submodule packaging fixture according to claim 1, characterized in that: Positioning tips (420) are provided at the adjacent ends of the first metal block (421) and the second metal block (422).

4. The macrochannel submodule packaging fixture according to claim 1, characterized in that: The macro channel heat dissipation base limiting mechanism includes a first screw hole (11) set on the base plate of the placement frame (1), and a positioning screw passes through the first screw hole (11).

5. The macrochannel submodule packaging fixture according to claim 1, characterized in that: The positioning frame limiting mechanism includes second screw holes (12) set on both sides of the placement frame (1). The screw holes (12) on both sides are set at the same height, and positioning screws pass through the screw holes (12).

6. The macrochannel submodule packaging fixture according to claim 1, characterized in that: The pressure bar (6) has two parallel rods.

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