Wiring board device and circuit module thereof

Abstract

The invention relates to a wiring board device and a circuit module thereof. The wiring board device comprises a multi-layer board structure, a main grounding part and the circuit module, the main ground is arranged in the multilayer board structure. The line module comprises two differential signal parts. The differential signal parts are all located on a core layer of the multilayer board structure, each differential signal part comprises a differential through hole pair and a plurality of grounding through holes, and the grounding through holes are arranged at intervals, surround the differential through hole pair and are electrically connected with the main ground. The patterns of the two differential signal parts are in mirror symmetry according to a hypothetical mirror ray, and the minimum linear distances from the two differential signal parts to the hypothetical mirror ray are equal to each other. Through the above structure, even if the distance between the components of the distribution board is too close, the transmission of the high-density high-speed signal array in the distribution board does not generate serious far-end crosstalk, thereby improving the signal integrity in the distribution board.

Description

Technical Field

[0001] The invention relates to a wiring board device, in particular to a wiring board device with a differential signal circuit and a circuit module thereof. Background Art

[0002] Generally speaking, in the field of circuit board design, as the integration of circuit boards continues to improve, the configuration between components becomes more closely spaced.

[0003] However, due to the close spacing between components on the circuit board, the transmission of a highly dense and high-speed signal array within the circuit board may seriously cause far-end crosstalk of the circuit board, thereby reducing the signal integrity within the circuit board.

[0004] It can be seen that the above technology still has inconveniences and defects, which is a problem that needs to be solved urgently in this industry. Summary of the invention

[0005] An object of the present invention is to provide a patch panel device and a circuit module thereof to solve the difficulties mentioned in the above prior art.

[0006] One embodiment of the present invention provides a wiring board device. The wiring board device includes a multilayer board structure, a main ground and a circuit module. The multilayer board structure includes a core layer and multiple board layers. The core layer is sandwiched between these board layers, and the thickness of the core layer is greater than the thickness of each board layer. The main ground is configured in the multilayer board structure. The multilayer board structure includes multiple board bodies stacked on each other. The main ground is configured in the multilayer board structure. The circuit module includes a first differential signal portion and a second differential signal portion. The first differential signal portion is located on one of the core layers, including a first differential through hole pair and multiple first grounding through holes. These first grounding through holes are arranged at intervals from each other and surround the first differential through hole pair, and are electrically connected to the main ground. The second differential signal portion is located on the core layer, including a second differential through hole pair and multiple second grounding through holes. These second grounding through holes are arranged at intervals from each other and surround the second differential through hole pair, and are electrically connected to the main ground. The pattern of the second differential signal portion is mirror symmetric to the pattern of the first differential signal portion according to an imaginary mirror line, and the minimum straight-line distance from the first differential signal portion to the imaginary mirror line is equal to the minimum straight-line distance from the second differential signal portion to the imaginary mirror line.

[0007] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, the first differential through hole pair includes a first positive channel and a first negative channel, and the first positive channel and the first negative channel are arranged in sequence along a first straight line direction, and the first straight line direction is parallel to or intersects the imaginary mirror ray.

[0008] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, there is a first imaginary line between the first positive channel and the first negative channel, the first imaginary line divides the pattern of the first differential signal portion into a first part and a second part, and the pattern of the first part and the pattern of the second part are mirror-symmetrical to each other according to the first imaginary line. The minimum straight-line distance from the first positive channel to the first imaginary line is equal to the minimum straight-line distance from the first negative channel to the first imaginary line.

[0009] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, the second differential through hole pair includes a second positive channel and a second negative channel, and the second positive channel and the second negative channel are arranged in sequence along a second linear direction, and the second linear direction is parallel to or intersects the first linear direction.

[0010] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, there is a second imaginary line between the second positive channel and the second negative channel, the second imaginary line divides the pattern of the second differential signal portion into a third part and a fourth part, and the pattern of the third part and the pattern of the fourth part are mirror-symmetrical to each other according to the second imaginary line. The minimum straight-line distance from the second positive channel to the second imaginary line is equal to the minimum straight-line distance from the second negative channel to the second imaginary line.

[0011] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, the pattern jointly presented by the first positive channel and the first negative channel of the first differential through hole pair and the pattern jointly presented by the second positive channel and the second negative channel of the second differential through hole pair are identical to each other; or the pattern jointly presented by the first positive channel and the first negative channel of the first differential through hole pair and the pattern jointly presented by the second positive channel and the second negative channel of the second differential through hole pair are mirror-symmetric to each other according to an imaginary mirror ray.

[0012] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, a first inter-electrode spacing is defined between the first positive electrode channel and the first negative electrode channel, and a first inter-hole spacing is defined between one of the first grounding through holes in the first portion and the first positive electrode channel. The first inter-hole spacing is not less than the first inter-electrode spacing and not more than twice the first inter-electrode spacing.

[0013] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, a second inter-hole spacing is defined between one of the first ground through holes in the second portion and the first negative electrode channel, and the second inter-hole spacing is equal to the first inter-hole spacing.

[0014] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, a second inter-electrode spacing is defined between the second positive electrode channel and the second negative electrode channel, and a third inter-hole spacing is defined between one of the second grounding through holes in the third portion and the second positive electrode channel. The third inter-hole spacing is not less than the second inter-electrode spacing and not more than twice the second inter-electrode spacing.

[0015] According to one or more embodiments of the present invention, in the above-mentioned wiring board device, a fourth inter-hole spacing is defined between one of the second ground through holes in the fourth portion and the second negative electrode channel, and the fourth inter-hole spacing is equal to the third inter-hole spacing.

[0016] An embodiment of the present invention provides a circuit module. The circuit module is arranged on a core layer of a multilayer board structure, and the wiring board device includes a first differential signal portion and a second differential signal portion. The first differential signal portion includes a first positive channel, a first negative channel and a plurality of first grounding through holes. The first positive channel and the first negative channel are arranged in sequence along a first axial direction, and a first inter-electrode spacing is defined between the first positive channel and the first negative channel, and the first grounding through holes are arranged at intervals and surround the first positive channel and the first negative channel. A first inter-hole spacing is defined between the first positive channel and one of the first grounding through holes that is closer to the first positive channel, and the first inter-hole spacing is not less than the first inter-electrode spacing and not greater than twice the first inter-electrode spacing. The first positive channel and one of the first grounding through holes that is closer to the first positive channel are arranged in sequence along a second axial direction. The second axial direction intersects the first axial direction and has a first angle with the first axial direction. A second inter-hole spacing that is the same as the first inter-hole spacing is defined between the first negative electrode channel and one of the first grounding through holes that is closer to the first negative electrode channel, and the first negative electrode channel and the one of the first grounding through holes that is closer to the first negative electrode channel are sequentially arranged along a third axial direction. The third axial direction intersects the first axial direction and has a second angle that is the same as the first angle with the first axial direction. The pattern of the second differential signal portion and the pattern of the first differential signal portion are mirror-symmetrical to each other according to an imaginary mirror line.

[0017] According to one or more embodiments of the present invention, in the above-mentioned circuit module, the second differential signal portion includes a second positive channel, a second negative channel and a plurality of second grounding through holes. The second positive channel and the second negative channel are sequentially arranged along a fourth axial direction, and a second inter-electrode spacing is defined between the second positive channel and the second negative channel, and the second grounding through holes are spaced apart from each other and surround the second positive channel and the second negative channel. A third inter-hole spacing is defined between the second positive electrode channel and one of the second grounding through holes that is closer to the second positive electrode channel, and the third inter-hole spacing is not less than the second inter-electrode spacing and not greater than twice the second inter-electrode spacing. The second positive electrode channel and one of the second grounding through holes that is closer to the second positive electrode channel are arranged in sequence along a fifth axial direction, the fifth axial direction intersects the fourth axial direction, and has a third angle with the fourth axial direction. A fourth inter-hole spacing with the same third inter-hole spacing is defined between the second negative electrode channel and one of the second grounding through holes that is closer to the second negative electrode channel, and the second negative electrode channel and one of the second grounding through holes that is closer to the second negative electrode channel are arranged in sequence along a sixth axial direction, the sixth axial direction intersects the fourth axial direction, and has a fourth angle with the fourth axial direction that is the same as the third angle.

[0018] According to one or more embodiments of the present invention, in the above-mentioned circuit module, the first axial direction is parallel to or intersects the imaginary mirror ray, and the fourth axial direction is parallel to or intersects the first axial direction.

[0019] According to one or more embodiments of the present invention, in the above-mentioned circuit module, there is a first imaginary line between the first positive channel and the first negative channel, the first imaginary line divides the pattern of the first differential signal portion into a first part and a second part, and the pattern of the first part and the pattern of the second part are mirror-symmetrical to each other according to the first imaginary line. The minimum straight-line distance from the first positive channel to the first imaginary line is equal to the minimum straight-line distance from the first negative channel to the first imaginary line.

[0020] According to one or more embodiments of the present invention, in the above-mentioned circuit module, there is a second imaginary line between the second positive channel and the second negative channel, the second imaginary line divides the pattern of the second differential signal portion into a third part and a fourth part, and the pattern of the third part and the pattern of the fourth part are mirror-symmetrical to each other according to the second imaginary line. The minimum straight-line distance from the second positive channel to the second imaginary line is equal to the minimum straight-line distance from the second negative channel to the second imaginary line.

[0021] According to one or more embodiments of the present invention, in the above-mentioned circuit module, the pattern jointly presented by the first positive channel and the first negative channel is the same as the pattern jointly presented by the second positive channel and the second negative channel; or the pattern jointly presented by the first positive channel and the first negative channel and the pattern jointly presented by the second positive channel and the second negative channel are mirror-symmetric to each other based on an imaginary mirror ray.

[0022] Thus, through the above structure, even if the spacing between the components of the wiring board of the present invention is too close, the transmission of the high-density high-speed signal array in the wiring board will not cause serious far-end crosstalk, thereby improving the signal integrity in the wiring board.

[0023] The above description is only used to illustrate the problems to be solved by the present invention, the technical means to solve the problems, and the effects produced, etc. The specific details of the present invention will be introduced in detail in the following implementation methods and related drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to make the above and other objects, features, advantages and embodiments of the present invention more clearly understood, the accompanying drawings are described as follows:

[0025] Figure 1 A side view of a wiring board device according to an embodiment of the present invention;

[0026] Figure 2 for Figure 1 A top view of a line module of a patch panel device;

[0027] Figure 3 A top view of a circuit module according to an embodiment of the present invention;

[0028] Figure 4 A top view of a circuit module according to an embodiment of the present invention;

[0029] Figure 5 A top view of a circuit module according to an embodiment of the present invention;

[0030] Figure 6 FIG. 4 is a top view of a circuit module according to an embodiment of the present invention.

[0031]

Explanation of symbols

[0032] 10: Patch panel device

[0033] 100:Multilayer board structure

[0034] 110: Core layer

[0035] 120: Plate layer

[0036] 130: Main grounding

[0037] 140: Solder ball layer

[0038] 150: solder ball bump layer

[0039] 160: Conductive part

[0040] 200, 201, 202, 203, 204: Line modules

[0041] 210: first differential signal unit

[0042] 220: first differential through hole pair

[0043] 221: First positive channel

[0044] 222: First cathode channel

[0045] 223,223A: first grounding through hole

[0046] 230: First imaginary line

[0047] 231: Part 1

[0048] 232: Part 2

[0049] 240: Second differential signal unit

[0050] 250: second differential through hole pair

[0051] 251: Second positive channel

[0052] 252: Second cathode channel

[0053] 253,253A: Second grounding through hole

[0054] 260: Second imaginary line

[0055] 261: Part 3

[0056] 262: Part 4

[0057] 300: Imaginary mirror ray

[0058] D1~D6: Minimum straight-line distance

[0059] G1: The first inter-electrode spacing

[0060] G2: Second inter-electrode spacing

[0061] H1: Spacing between the first holes

[0062] H2: Spacing between the second holes

[0063] H3: Spacing between the third holes

[0064] H4: Spacing between the fourth holes

[0065] θ1~θ6: Angle

[0066] X,Y,Z: axis DETAILED DESCRIPTION

[0067] The following will disclose multiple embodiments of the present invention with the accompanying drawings. For the purpose of clear description, many practical details will be described together in the following description. However, it should be understood that these practical details should not be used to limit the present invention. In other words, in one embodiment of the present invention, these practical details are not necessary. In addition, in order to simplify the drawings, some conventional structures and components will be depicted in a simple schematic manner in the drawings.

[0068] Figure 1 FIG. 1 is a side view of a wiring panel device 10 according to an embodiment of the present invention. Figure 2 for Figure 1 FIG. 1 is a top view of the line module 200 of the wiring board device 10. Figure 1 and Figure 2 As shown, in this embodiment, the wiring board device 10 includes a multilayer board structure 100, a main ground 130 and a circuit module 200. The multilayer board structure 100 includes a core layer 110, a plurality of board layers (or insulating boards) 120, a solder ball layer 140 and a solder ball bump layer (C4 bump) 150. The board layers 120 are stacked one on another along a longitudinal direction (such as the Z axis), the core layer 110 is sandwiched between the board layers 120, and the thickness of the core layer 110 is greater than the thickness of each board layer 120. The solder ball layer 140 and the solder ball bump layer 150 are exposed on two outer sides of the board layers 120, the solder ball layer 140 includes a plurality of solder balls, and the solder ball bump layer 150 includes a plurality of solder ball bumps. The configuration surfaces of the core layer 110 and the board layers 120 are insulating materials, and the insulating materials are used for distributing and printing pattern circuits. The main ground 130 is disposed in the multilayer board structure 100. For example, the main ground 130 is a copper foil ground, which is located on one of the board layers 120 and extends along a horizontal direction (such as the X or Y axis). The circuit module 200 is disposed on the core layer 110, and the circuit module 200 is electrically connected to the solder ball layer 140 and the solder ball bump layer 150 on the outside thereof through the conductive portion (VIA) 160 in the board layer 120. The solder ball bump layer 150 is used to connect to a chip set (not shown) through a silicon interposer (not shown) to receive the differential signal of the chip set. Therefore, the solder ball bump layer 150 is called the proximal end (bump side) of the multilayer board structure 100. The solder ball layer 140 is used to connect to a circuit carrier (not shown) to exchange differential signals with the circuit carrier. Therefore, the solder ball layer 140 is called the distal end (ball side) of the multilayer board structure 100.

[0069] In one embodiment, the wiring board device 10 is a circuit board substrate (PCB substrate) in a chip-on-wafer-on-substrate (CoWoS) package, however, the present invention is not limited thereto.

[0070] More specifically, the circuit module 200 includes a plurality of differential signal parts, two of which are hereinafter referred to as a first differential signal part 210 and a second differential signal part 240. The first differential signal part 210 is located on the core layer 110, and the first differential signal part 210 includes a first differential through hole pair 220 and a plurality of (for example, 6) first grounding through holes 223. These first grounding through holes 223 are arranged at intervals and surround the first differential through hole pair 220, and are electrically connected to the main ground 130. The first grounding through holes 223 play a key shielding role for the surrounding pattern formed by the first differential through hole pair 220, so as to reduce the aggravation of the magnetic field coupling between the differential signals, thereby improving the influence of the multilayer board structure 100 caused by the far-end crosstalk. The second differential signal part 240 is located on the core layer 110, and the second differential signal part 240 includes a second differential through hole pair 250 and a plurality of (for example, 6) second grounding through holes 253. The second grounding vias 253 are arranged at intervals and surround the second differential via pair 250, and are electrically connected to the main ground 130. The second grounding vias 253 play a key shielding role for the surrounding pattern formed by the second differential signal portion 240, so as to reduce the aggravation of the magnetic field coupling between the differential signals, thereby improving the influence of the multilayer board structure 100 caused by the far-end crosstalk.

[0071] The pattern of the second differential signal portion 240 and the pattern of the first differential signal portion 210 are mirror symmetric to each other according to an imaginary mirror ray 300 (for example, extending along the X-axis), and the minimum straight-line distance D1 from the first differential signal portion 210 to the imaginary mirror ray 300 is equal to the minimum straight-line distance D2 from the second differential signal portion 240 to the imaginary mirror ray 300.

[0072] More specifically, the first differential signal portion 210 includes a first positive electrode (e.g., P-pole) channel 221 and a first negative electrode (e.g., N-pole) channel 222. The first positive electrode channel 221 and the first negative electrode channel 222 are respectively arranged in the multilayer board structure 100 along the longitudinal direction (e.g., Z-axis) to serve as a conduit for transmitting the first differential signal. The first positive electrode channel 221 and the first negative electrode channel 222 are sequentially arranged along a first arrangement direction (e.g., Y-axis) on the core layer 110, and the first positive electrode channel 221 and the first negative electrode channel 222 are respectively spaced apart on the core layer 110, and the first arrangement direction (e.g., Y-axis) is orthogonal to the imaginary mirror ray 300 (e.g., X-axis) and is orthogonal to the longitudinal direction (e.g., Z-axis).

[0073] There is a first imaginary line 230 (e.g., extending along the X-axis) between the first positive channel 221 and the first negative channel 222. The first imaginary line 230 divides the pattern of the first differential signal portion 210 into a first portion 231 and a second portion 232, and the pattern of the first portion 231 and the pattern of the second portion 232 are mirror-symmetrical to each other according to the first imaginary line 230. The minimum straight-line distance D3 from the first positive channel 221 to the first imaginary line 230 is equal to the minimum straight-line distance D4 from the first negative channel 222 to the first imaginary line 230.

[0074] The second differential signal portion 240 includes a second positive electrode (e.g., P-pole) channel 251 and a second negative electrode (e.g., N-pole) channel 252. The second positive electrode channel 251 and the second negative electrode channel 252 are respectively arranged in the multilayer board structure 100 along the longitudinal direction (e.g., Z-axis) to serve as a conduit for the transmission of the second differential signal. The second positive electrode channel 251 and the second negative electrode channel 252 are sequentially arranged along the first arrangement direction (e.g., Y-axis) on the core layer 110, and the second positive electrode channel 251 and the second negative electrode channel 252 are respectively spaced apart on the core layer 110, and the first arrangement direction (e.g., Y-axis) is orthogonal to the imaginary mirror ray 300 (e.g., X-axis) and is orthogonal to the longitudinal direction (e.g., Z-axis).

[0075] A second imaginary line 260 is provided between the second positive channel 251 and the second negative channel 252. The second imaginary line 260 divides the pattern of the second differential signal portion 240 into a third portion 261 and a fourth portion 262, and the pattern of the third portion 261 and the pattern of the fourth portion 262 are mirror-symmetrical to each other according to the second imaginary line 260. The minimum straight-line distance D5 from the second positive channel 251 to the second imaginary line 260 is equal to the minimum straight-line distance D6 from the second negative channel 252 to the second imaginary line 260.

[0076] Therefore, since the imaginary mirror ray 300 is between the first imaginary line 230 and the second imaginary line 260 and is parallel to the first imaginary line 230 and the second imaginary line 260, in this embodiment, the first portion 231, the second portion 232, the third portion 261 and the fourth portion 262 are linearly arranged in sequence along the first arrangement direction (such as the Y axis) ( Figure 2 ).

[0077] In this embodiment, the order from left to right of the first positive channel 221 and the first negative channel 222 of the first differential through hole pair 220 is the same as the order from left to right of the second positive channel 251 and the second negative channel 252 of the second differential through hole pair 250, that is, the first negative channel 222 and the second positive channel 251 are located between the first positive channel 221 and the second negative channel 252. However, the present invention is not limited thereto, and in other embodiments, the order from left to right of the first positive channel 221 and the first negative channel 222 may be opposite to the order from left to right of the second positive channel 251 and the second negative channel 252, that is, the first negative channel 222 and the second negative channel 252 are located between the first positive channel 221 and the second positive channel 251.

[0078] In this way, since the second differential signal unit 240 and the first differential signal unit 210 are mirror symmetry patterns according to the imaginary mirror line 300, this embodiment can reduce the chance of severe far-end crosstalk caused by the transmission of a high-density high-speed signal array on the wiring board, thereby improving the signal integrity within the wiring board.

[0079] Figure 3 FIG. 2 is a top view of a circuit module 201 according to an embodiment of the present invention. Figure 3 As shown, the line module 201 of this embodiment is Figure 2 The circuit module 200 is substantially the same as the circuit module 200, with the difference that the pattern of the first portion 231 and the pattern of the second portion 232 are not mirror symmetrical to each other (or are called non-mirror symmetrical patterns), and the pattern of the third portion 261 and the pattern of the fourth portion 262 are not mirror symmetrical to each other (or are called non-mirror symmetrical patterns).

[0080] More specifically, there are five first grounding through holes 223 in the first portion 231, which are arranged in a U shape, and there are three first grounding through holes 223 in the second portion 232, which are arranged in a V shape. All the first grounding through holes 223 of the first differential signal portion 210 surround the first differential through hole pair 220. There are three second grounding through holes 253 in the third portion 261, which are arranged in a V shape, and there are five second grounding through holes 253 in the fourth portion 262, which are arranged in a U shape, and all the second grounding through holes 253 of the second differential signal portion 240 surround the second differential through hole pair 250.

[0081] In this way, since the imaginary mirror line 300 is parallel to the first imaginary line 230 and the second imaginary line 260, and the second differential signal portion 240 and the first differential signal portion 210 are mirror symmetry patterns according to the imaginary mirror line 300, the present embodiment can further reduce the chance of severe far-end crosstalk caused by the transmission of a high-density high-speed signal array on a wiring board, thereby improving the signal integrity within the wiring board.

[0082] Figure 4 FIG. 2 is a top view of a circuit module 202 according to an embodiment of the present invention. Figure 4 As shown, the circuit module 202 of this embodiment is Figure 2 The circuit module 200 is substantially the same as the circuit module 200 of FIG. 1 , except that the first positive electrode channel 221 and the first negative electrode channel 222 are sequentially arranged along a second arrangement direction (such as the X axis) on the core layer 110, and the second arrangement direction (such as the X axis) is parallel to the imaginary mirror ray 300 (such as the X axis) and is orthogonal to the longitudinal direction (such as the Z axis). The second positive electrode channel 251 and the second negative electrode channel 252 are sequentially arranged along the second arrangement direction (such as the X axis) on the core layer 110. In addition, the first portion 231 and the third portion 261 are sequentially arranged along the first arrangement direction (such as the Y axis), and the second portion 232 and the fourth portion 262 are sequentially arranged along the first arrangement direction (such as the Y axis).

[0083] In this way, since the imaginary mirror ray 300 is orthogonal to the first imaginary line 230 and the second imaginary line 260, and the second differential signal portion 240 and the first differential signal portion 210 are mirror symmetry patterns according to the imaginary mirror ray 300, the present embodiment can further reduce the chance of severe far-end crosstalk caused by the transmission of a high-density high-speed signal array on a wiring board, thereby improving the signal integrity within the wiring board.

[0084] Figure 5 FIG. 2 is a top view of a circuit module 203 according to an embodiment of the present invention. Figure 5 As shown, the circuit module 203 of this embodiment is Figure 1The circuit module 200 is substantially the same as the circuit module 200 of the embodiment of the present invention, except that the first imaginary line 230 (e.g., extending along the X-axis) defined between the first positive channel 221 and the first negative channel 222 has an angle θ1 of 45° with the imaginary mirror ray 300, and the second imaginary line 260 (e.g., extending along the Y-axis) defined between the second positive channel 251 and the second negative channel 252 has an angle θ2 of 45° with the imaginary mirror ray 300, so that the first imaginary line 230 and the second imaginary line 260 are orthogonal to each other. The sequential arrangement direction of two of the first grounding through holes 223A of the second portion 232 and the sequential arrangement direction of two of the second grounding through holes 253A of the third portion 261 are parallel to each other, and are parallel to each other with the imaginary mirror ray 300.

[0085] In this way, since the imaginary mirror ray 300 intersects the first imaginary line 230 and the second imaginary line 260, and the second differential signal portion 240 and the first differential signal portion 210 are mirror symmetry patterns according to the imaginary mirror ray 300, the present embodiment can further reduce the chance of severe far-end crosstalk caused by the transmission of a high-density high-speed signal array of a wiring board, thereby improving the signal integrity within the wiring board.

[0086] Figure 6 FIG. 2 is a top view of a circuit module 204 according to an embodiment of the present invention. Figure 6 As shown, the circuit module 204 of this embodiment can be used in the circuit modules 200-203 of the above-mentioned embodiments. The number of first grounding through holes 223 of the circuit module 204 of this embodiment is 4, a first inter-electrode spacing G1 is defined between the first positive electrode channel 221 and the first negative electrode channel 222, and a first inter-hole spacing H1 is defined between each first grounding through hole 223 in the first part 231 and the first positive electrode channel 221. A second inter-hole spacing H2 is defined between each first grounding through hole 223 in the second part 232 and the first negative electrode channel 222, the first inter-hole spacing H1 is greater than or equal to (i.e. not less than) the first inter-electrode spacing G1, and less than or equal to (i.e. not greater than) twice the first inter-electrode spacing G1, and the second inter-hole spacing H2 is equal to the first inter-hole spacing H1.

[0087] It should be defined that the first positive electrode channel 221, the first negative electrode channel 222 and the first grounding through hole 223 are respectively circular, the first inter-electrode spacing G1 is the length of the line between the center of the first positive electrode channel 221 and the center of the first negative electrode channel 222, the first inter-hole spacing H1 is the length of the line between the center of the first positive electrode channel 221 and the center of the first grounding through hole 223, and the second inter-hole spacing H2 is the length of the line between the center of the first negative electrode channel 222 and the center of the first grounding through hole 223.

[0088] In addition, the line connecting the first positive channel 221 to the first grounding through hole 223 and the first arrangement direction (eg, Y axis) have an angle θ3. The line connecting the first negative channel 222 to the first grounding through hole 223 and the first arrangement direction (eg, Y axis) have an angle θ4, which is the same as the angle θ3.

[0089] Similarly, if Figure 6 As shown, there are four second grounding through holes 253, a second inter-electrode spacing G2 is defined between the second positive electrode channel 251 and the second negative electrode channel 252, and a third inter-hole spacing H3 is defined between each second grounding through hole 253 in the third portion 261 and the second positive electrode channel 251. A fourth inter-hole spacing H4 is defined between each second grounding through hole 253 in the fourth portion 262 and the second negative electrode channel 252, the third inter-hole spacing H3 is greater than or equal to (i.e. not less than) the second inter-electrode spacing G2, and less than or equal to (i.e. not greater than) twice the second inter-electrode spacing G2, and the fourth inter-hole spacing H4 is equal to the third inter-hole spacing H3.

[0090] It should be defined that the second positive electrode channel 251, the second negative electrode channel 252 and the second grounding through hole 253 are respectively circular, the second inter-electrode spacing G2 is the length of the line between the center of the second positive electrode channel 251 and the center of the second negative electrode channel 252, the third inter-hole spacing H3 is the length of the line between the center of the second positive electrode channel 251 and the center of the second grounding through hole 253 in the third part 261, and the fourth inter-hole spacing H4 is the length of the line between the center of the second negative electrode channel 252 and the center of one of the second grounding through holes 253 in the fourth part 262.

[0091] In addition, the line connecting the second positive channel 251 to the second grounding through hole 253 and the first arrangement direction (eg, Y axis) have an angle θ5. The line connecting the second negative channel 252 to the second grounding through hole 253 and the first arrangement direction (eg, Y axis) have an angle θ6, which is the same as the angle θ5.

[0092] Thus, due to the configuration variables of the first ground through hole 223, the first positive channel 221 and the first negative channel 222, the second positive channel 251, the second negative channel 252 and the second negative channel 253, and the second differential signal portion 240 and the first differential signal portion 210 being mirror symmetry patterns according to the imaginary mirror ray 300, the present embodiment can further reduce the chance of severe far-end crosstalk caused by the transmission of a high-density high-speed signal array of a wiring board, thereby improving the signal integrity within the wiring board.

[0093] Thus, through the above structure, even if the spacing between the components of the wiring board of the present invention is too close, the transmission of the high-density high-speed signal array in the wiring board will not cause serious far-end crosstalk, thereby improving the signal integrity in the wiring board.

[0094] Finally, the above disclosed embodiments are not intended to limit the present invention. Anyone skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, and all of them can be protected by the present invention. Therefore, the scope of protection of the present invention shall be determined by the definition of the attached claims.

Claims

1. A wiring board device, characterized in that: Include: A multi-layer board structure, comprising a core layer and a plurality of board layers, wherein the core layer is sandwiched between the plurality of board layers, and the thickness of the core layer is greater than the thickness of each of the plurality of board layers; A main ground is disposed in the multilayer board structure; and A line module, comprising: A first differential signal portion, located on the core layer, comprises a first differential through-hole pair and a plurality of first ground through-holes, wherein the plurality of first ground through-holes are arranged at intervals and surround the first differential through-hole pair and are electrically connected to the main ground; as well as a second differential signal portion, located on the core layer, comprising a second differential through hole pair and a plurality of second ground through holes, wherein the plurality of second ground through holes are arranged at intervals and surround the second differential through hole pair and are electrically connected to the main ground; The pattern of the second differential signal portion and the pattern of the first differential signal portion are mirror-symmetric to each other according to an imaginary mirror line, and the minimum straight-line distance from the first differential signal portion to the imaginary mirror line is equal to the minimum straight-line distance from the second differential signal portion to the imaginary mirror line.

2. The wiring board device according to claim 1, wherein: The first differential through hole pair includes a first positive electrode channel and a first negative electrode channel, and the first positive electrode channel and the first negative electrode channel are arranged in sequence along a first straight line direction, and the first straight line direction is parallel to or intersects the imaginary mirror ray.

3. The wiring board device according to claim 2, characterized in that There is a first imaginary line between the first positive channel and the first negative channel, the first imaginary line divides the pattern of the first differential signal portion into a first part and a second part, and the pattern of the first part and the pattern of the second part are mirror-symmetrical to each other according to the first imaginary line. The minimum straight-line distance from the first positive electrode channel to the first imaginary line is equal to the minimum straight-line distance from the first negative electrode channel to the first imaginary line.

4. The wiring board device according to claim 3, characterized in that The second differential through hole pair includes a second positive electrode channel and a second negative electrode channel, and the second positive electrode channel and the second negative electrode channel are arranged in sequence along a second linear direction, and the second linear direction is parallel to or intersects the first linear direction.

5. The wiring board device according to claim 4, characterized in that There is a second imaginary line between the second positive electrode channel and the second negative electrode channel, and the second imaginary line divides the pattern of the second differential signal portion into a third part and a fourth part, and the pattern of the third part and the pattern of the fourth part are mirror-symmetrical to each other according to the second imaginary line. The minimum straight-line distance from the second positive electrode channel to the second imaginary line is equal to the minimum straight-line distance from the second negative electrode channel to the second imaginary line.

6. The wiring board device according to claim 4, characterized in that wherein a pattern jointly presented by the first positive electrode channel and the first negative electrode channel of the first differential through hole pair is identical to a pattern jointly presented by the second positive electrode channel and the second negative electrode channel of the second differential through hole pair; or The pattern jointly presented by the first positive electrode channel and the first negative electrode channel of the first differential through hole pair and the pattern jointly presented by the second positive electrode channel and the second negative electrode channel of the second differential through hole pair are mirror-symmetrical to each other according to the imaginary mirror ray.

7. The wiring board device according to claim 3, characterized in that A first inter-electrode distance is defined between the first positive electrode channel and the first negative electrode channel, and a first inter-hole distance is defined between one of the plurality of first grounding through holes in the first portion and the first positive electrode channel. The first inter-hole spacing is not less than the first inter-electrode spacing and not greater than twice the first inter-electrode spacing.

8. The wiring board device according to claim 7, wherein: A second inter-hole spacing is defined between one of the plurality of first grounding through holes in the second portion and the first negative electrode channel, and the second inter-hole spacing is equal to the first inter-hole spacing.

9. The wiring board device according to claim 5, characterized in that A second inter-electrode distance is defined between the second positive electrode channel and the second negative electrode channel, and a third inter-hole distance is defined between one of the plurality of second grounding through holes in the third portion and the second positive electrode channel. The third inter-hole spacing is not less than the second inter-electrode spacing and not greater than twice the second inter-electrode spacing.

10. The wiring board device according to claim 9, wherein: A fourth inter-hole spacing is defined between one of the plurality of second grounding through holes in the fourth portion and the second negative electrode channel, and the fourth inter-hole spacing is equal to the third inter-hole spacing.

11. A circuit module, arranged on a core layer of a multilayer board structure, characterized in that: Include: A first differential signal portion includes a first positive channel, a first negative channel and a plurality of first grounding through holes, wherein the first positive channel and the first negative channel are sequentially arranged along a first axial direction, and a first inter-electrode spacing is defined between the first positive channel and the first negative channel, and the plurality of first grounding through holes are spaced apart from each other and surround the first positive channel and the first negative channel, wherein a first inter-hole spacing is defined between the first positive electrode channel and one of the plurality of first grounding through holes closer to the first positive electrode channel, and the first inter-hole spacing is not less than the first inter-electrode spacing and not greater than twice the first inter-electrode spacing, the first positive electrode channel and the one of the plurality of first grounding through holes closer to the first positive electrode channel are sequentially arranged along a second axial direction, the second axial direction intersects the first axial direction and has a first angle with the first axial direction, the first negative electrode channel and the one of the plurality of first grounding through holes closer to the first negative electrode channel are defined with a second inter-hole spacing that is the same as the first inter-hole spacing, and the first negative electrode channel and the one of the plurality of first grounding through holes closer to the first negative electrode channel are sequentially arranged along a third axial direction, the third axial direction intersects the first axial direction and has a second angle with the first axial direction that is the same as the first angle; and A second differential signal portion, wherein a pattern of the second differential signal portion and a pattern of the first differential signal portion are mirror-symmetric to each other according to an imaginary mirror line.

12. The circuit module according to claim 11, characterized in that: The second differential signal portion includes a second positive electrode channel, a second negative electrode channel and a plurality of second grounding through holes, wherein the second positive electrode channel and the second negative electrode channel are sequentially arranged along a fourth axial direction, and a second inter-electrode spacing is defined between the second positive electrode channel and the second negative electrode channel, and the plurality of second grounding through holes are spaced apart from each other and surround the second positive electrode channel and the second negative electrode channel. A third inter-hole spacing is defined between the second positive electrode channel and one of the plurality of second grounding through holes closer to the second positive electrode channel, and the third inter-hole spacing is not less than the second inter-electrode spacing and not greater than twice the second inter-electrode spacing. The second positive electrode channel and one of the plurality of second grounding through holes closer to the second positive electrode channel are sequentially arranged along a fifth axial direction, the fifth axial direction intersects the fourth axial direction, and has a third angle with the fourth axial direction. A fourth inter-hole spacing, which is the same as the third inter-hole spacing, is defined between the second negative electrode channel and one of the plurality of second grounding through holes closer to the second negative electrode channel. The second negative electrode channel and one of the plurality of second grounding through holes closer to the second negative electrode channel are sequentially arranged along a sixth axial direction, the sixth axial direction intersects the fourth axial direction, and has a fourth angle, which is the same as the third angle, with the fourth axial direction.

13. The circuit module according to claim 12, characterized in that: The first axial direction is parallel to or intersects the imaginary mirror ray, and the fourth axial direction is parallel to or intersects the first axial direction.

14. The circuit module according to claim 11, characterized in that: There is a first imaginary line between the first positive channel and the first negative channel, the first imaginary line divides the pattern of the first differential signal portion into a first part and a second part, and the pattern of the first part and the pattern of the second part are mirror-symmetrical to each other according to the first imaginary line. The minimum straight-line distance from the first positive electrode channel to the first imaginary line is equal to the minimum straight-line distance from the first negative electrode channel to the first imaginary line.

15. The circuit module according to claim 13, characterized in that: There is a second imaginary line between the second positive electrode channel and the second negative electrode channel, and the second imaginary line divides the pattern of the second differential signal portion into a third part and a fourth part, and the pattern of the third part and the pattern of the fourth part are mirror-symmetrical to each other according to the second imaginary line. The minimum straight-line distance from the second positive electrode channel to the second imaginary line is equal to the minimum straight-line distance from the second negative electrode channel to the second imaginary line.

16. The circuit module according to claim 12, characterized in that: wherein a pattern jointly presented by the first positive electrode channel and the first negative electrode channel is identical to a pattern jointly presented by the second positive electrode channel and the second negative electrode channel; or The pattern jointly presented by the first positive electrode channel and the first negative electrode channel and the pattern jointly presented by the second positive electrode channel and the second negative electrode channel are mirror-symmetrical to each other according to the imaginary mirror ray.

Images