ESD (Electro-Static Discharge) device with pin protection and application method

Abstract

The invention relates to an ESD device with pin protection and an application method. The ESD device comprises an ESD device body, and the left side and the right side of the ESD device body are each provided with a plurality of pins; the bottom surface of the ESD device body is detachably connected with a protection plate, and the left and right sides of the protection plate are provided with accommodating grooves for accommodating the pins in a one-to-one correspondence manner; the protection plate has a first installation state and a second installation state on the bottom surface of the ESD device body, and the protection plate in the first installation state is perpendicular to the protection plate in the second installation state; in a first mounting state, the plurality of pins are accommodated in the accommodating grooves in a one-to-one correspondence manner; in the second installation state, the containing groove is used for dissipating heat of the ESD device body, and meanwhile the protection plate provides support for the ESD device body; the pins can be protected in an omnibearing and multi-angle mode, and transportation and storage are convenient; in addition, supporting force can be provided for the ESD device body, the surface area of the ESD device body can be greatly increased, and the heat dissipation performance is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of ESD devices, and more particularly to an ESD device with pin protection and an application method thereof. Background Art

[0002] ESD devices are used to prevent electronic components or devices from being damaged by electrostatic fields. They are usually mounted on the surface of a circuit board. ESD devices usually include a substrate layer and a ceramic layer deposited on the substrate. The ceramic layer is composed of ceramic electrostatic discharge materials. Currently used ESD devices usually do not have pin protection capabilities themselves and require an additional protective shell to protect their pins. The protective shell will be equipped with pin protection grooves. Although the protective shell can be recycled and reused after use, there is still a problem of resource waste. At the same time, the improvement of the heat dissipation performance of the ESD device usually depends on the thermal conductivity of the material that constitutes it. While there are large limitations, the cost of high thermal conductivity insulating materials is also high, and the improvement of heat dissipation performance is also very limited. There is a need for an ESD device with pin protection that can take into account both pin protection and heat dissipation performance and an application method. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide an ESD device with pin protection and an application method of the ESD device with pin protection in view of the above-mentioned defects of the prior art.

[0004] The technical solution adopted by the present invention to solve its technical problem is: An ESD device with pin protection is constructed, which includes an ESD device body, wherein a plurality of pins are arranged on the left and right sides of the ESD device body; a protective plate is detachably connected to the bottom surface of the ESD device body, and a one-to-one receiving groove for receiving the pins is arranged on the left and right sides of the protective plate; the protective plate has a first installation state and a second installation state on the bottom surface of the ESD device body, and the protective plate in the first installation state is perpendicular to the protective plate in the second installation state; in the first installation state, a plurality of pins are received in the receiving groove in a one-to-one correspondence; in the second installation state, the receiving groove is used to dissipate heat for the ESD device body, and the protective plate provides support for the ESD device body.

[0005] In the ESD device with pin protection described in the present invention, the protection plate is composed of a heat-conducting layer and an elastic layer which are arranged vertically.

[0006] In the ESD device with pin protection of the present invention, the accommodating groove penetrates the heat conducting layer and the elastic layer.

[0007] The ESD device with pin protection of the present invention, wherein the heat conductive layer is laterally provided with a plurality of through holes, a spring is provided in the through hole, the middle of the spring is fixed in the through hole, and both ends of the spring are respectively connected to a movable rod; the ends of the movable rod are provided with insulating claws corresponding to the pins one by one; In the first installation state, the insulating claws clamp and fix the pins one by one, and the spring is in an undeformed state.

[0008] The ESD device with pin protection described in the present invention, wherein, in the second installation state, the two insulating claws connected to the same spring clamp the ESD device body, and the spring is in a deformed state.

[0009] In the ESD device with pin protection of the present invention, a heat absorption layer is provided on the upper surface of the heat conductive layer, and the surface of the heat absorption layer is connected to the plurality of accommodating grooves.

[0010] In the ESD device with pin protection of the present invention, the heat absorption layer is made of thermally conductive silica gel.

[0011] An application method of an ESD device with pin protection, using the ESD device with pin protection as described above, wherein the method comprises the following steps: When the chip is not assembled, the protection plate is in a first installation state on the bottom surface of the ESD device body, and the plurality of pins are accommodated in the accommodation grooves in a one-to-one correspondence; When assembling the chip, the protection plate is adjusted to the second installation state, the pins are exposed for welding, the receiving groove dissipates heat for the ESD device body, and the protection plate provides support for the ESD device body.

[0012] The beneficial effects of the present invention are as follows: when the chip is not assembled, the protective plate is in a first installation state on the bottom surface of the ESD device body, and a plurality of pins are accommodated in the accommodating groove one by one, which can provide protection for the pins in all directions and angles, and is convenient for transportation and storage; when the chip is assembled, the protective plate is adjusted to the second installation state, the pins are exposed for welding, and the accommodating groove dissipates heat for the ESD device body, and at the same time the protective plate provides support for the ESD device body, does not interfere with welding, and can not only provide support for the ESD device body, but also greatly increase the surface area of ​​the ESD device body, and significantly improve the heat dissipation performance; the overall structure is simple, the processing is convenient, and the cost is also low. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the present invention will be further described below in conjunction with the accompanying drawings and embodiments. The drawings described below are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work: Figure 1 It is a structural cross-sectional view of an ESD device with pin protection in a first installation state according to a preferred embodiment of the present invention; Figure 2 1 is a top view of an ESD device with pin protection in a first installation state according to a preferred embodiment of the present invention; Figure 3 It is a top view of the ESD device with pin protection in the second installation state according to a preferred embodiment of the present invention. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the following will be described clearly and completely in combination with the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are partial embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work belong to the protection scope of the present invention.

[0015] The ESD device with pin protection of the preferred embodiment of the present invention is as follows: Figure 1 See also Figure 2 and Figure 3 , including an ESD device body 1, a plurality of pins 10 are arranged on both sides of the left and right sides of the ESD device body 1; a protective plate 2 is detachably connected to the bottom surface of the ESD device body 1, and a receiving groove 20 corresponding to the pins 10 is arranged on the left and right sides of the protective plate 2; the protective plate 2 has a first installation state and a second installation state on the bottom surface of the ESD device body 1, and the protective plate 2 in the first installation state is perpendicular to the protective plate 2 in the second installation state; in the first installation state, a plurality of pins 10 are accommodated in the receiving groove 20 in a one-to-one correspondence; in the second installation state, the receiving groove 20 is used to dissipate heat for the ESD device body 1, and the protective plate 2 provides support for the ESD device body 1; When the chip is not assembled, the protection plate 2 is in a first installation state on the bottom surface of the ESD device body 1, and the plurality of pins 10 are accommodated in the accommodation grooves 20 one by one, which can provide protection for the pins 10 in all directions and angles, and is convenient for transportation and storage; When assembling the chip, the protection plate 2 is adjusted to the second installation state, the pins 10 are exposed for welding, and the receiving groove 20 dissipates heat for the ESD device body 1. At the same time, the protection plate 2 provides support for the ESD device body 1, which will not interfere with welding. It can not only provide support for the ESD device body 1, but also greatly increase the surface area of ​​the ESD device body 1, significantly improving the heat dissipation performance; The overall structure is simple, the processing is convenient, and the cost is also low.

[0016] Preferably, the protection plate 2 is composed of a heat-conducting layer 200 and an elastic layer 201 which are arranged vertically and distributedly, and the receiving groove 20 penetrates the heat-conducting layer 200 and the elastic layer 201 .

[0017] Preferably, a plurality of through holes 21 are transversely arranged on the heat conducting layer 200, a spring 22 is arranged in the through hole 21, the middle part of the spring 22 is fixed in the through hole 21, and both ends of the spring 22 are respectively connected to a movable rod 23; the ends of the movable rod 23 are provided with insulating claws 24 corresponding to the pins 10 one by one; In the first installation state, the insulating claws 24 clamp and fix the pins 10 one by one, and the springs 22 are in an undeformed state; In the second installation state, two insulating claws connected to the same spring clamp the ESD device body, and the spring is in a deformed state; In the first installation state, the insulating claw 24 is used to clamp the pin 10 to complete the connection between the ESD device body 1 and the protective plate 2, while in the second installation state, the spring is stretched and the ESD device body is clamped by the insulating claw. In this way, there is no need to change the structure of the ESD device body, and it has good applicability for ESD devices of different sizes, which is convenient for promotion and popularization. The insulating claw 24 can adopt the existing elastic claw style, which is not limited.

[0018] Preferably, a heat absorbing layer 202 is disposed on the upper surface of the heat conducting layer 200 , and the surface of the heat absorbing layer 202 is connected to the plurality of receiving grooves 20 , so as to ensure the heat absorbing and heat dissipating effects.

[0019] Preferably, the heat absorption layer 202 is made of thermally conductive silicone, and may also be made of materials such as graphene, which is not limited.

[0020] A method for applying an ESD device with pin protection, using the ESD device with pin protection as described above, wherein the method comprises the following steps: When the chip is not assembled, the protection plate is in a first installation state on the bottom surface of the ESD device body, and the plurality of pins are accommodated in the accommodation grooves one by one; When assembling the chip, the protection plate is adjusted to the second installation state, the pins are exposed for welding, the receiving groove dissipates heat for the ESD device body, and the protection plate provides support for the ESD device body; The pin protection performance is good, and it can not only provide support for the ESD device body, but also greatly increase the surface area of ​​the ESD device body, significantly improving the heat dissipation performance; the overall structure is simple, easy to process, and the cost is also low.

[0021] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the appended claims of the present invention.

Claims

1. An ESD device with pin protection, comprising an ESD device body, wherein a plurality of pins are arranged on both the left and right sides of the ESD device body; a protective plate is detachably connected to the bottom surface of the ESD device body, and a receiving groove for receiving the pins is arranged on the left and right sides of the protective plate; characterized in that: The protection plate has a first installation state and a second installation state on the bottom surface of the ESD device body, and the protection plate in the first installation state is perpendicular to the protection plate in the second installation state; in the first installation state, a plurality of pins are accommodated in the accommodation groove in a one-to-one correspondence; In the second installation state, the receiving groove is used to dissipate heat for the ESD device body, and the protection plate provides support for the ESD device body.

2. The ESD device with pin protection according to claim 1, characterized in that: The protective plate is composed of a heat-conducting layer and an elastic layer which are arranged vertically and horizontally.

3. The ESD device with pin protection according to claim 2, characterized in that: The receiving groove penetrates the heat conducting layer and the elastic layer.

4. The ESD device with pin protection according to claim 3, characterized in that: A plurality of through holes are transversely arranged on the heat conducting layer, a spring is arranged in the through hole, the middle part of the spring is fixed in the through hole, and both ends of the spring are respectively connected to a movable rod; the ends of the movable rod are provided with insulating claws corresponding to the pins one by one; In the first installation state, the insulating claws clamp and fix the pins one by one, and the spring is in an undeformed state.

5. The ESD device with pin protection according to claim 4, characterized in that: In the second installation state, the two insulating claws connected to the same spring clamp the ESD device body, and the spring is in a deformed state.

6. The ESD device with pin protection according to claim 2, characterized in that: A heat absorbing layer is disposed on the upper surface of the heat conducting layer, and the surface of the heat absorbing layer is communicated with the plurality of containing grooves.

7. The ESD device with pin protection according to claim 6, characterized in that: The heat absorption layer is made of heat-conductive silica gel.

8. An application method of an ESD device with pin protection, using the ESD device with pin protection as claimed in any one of claims 1 to 7, characterized in that: The method comprises the following steps: When the chip is not assembled, the protection plate is in a first installation state on the bottom surface of the ESD device body, and the plurality of pins are accommodated in the accommodation grooves in a one-to-one correspondence; When assembling the chip, the protection plate is adjusted to the second installation state, the pins are exposed for welding, the receiving groove dissipates heat for the ESD device body, and the protection plate provides support for the ESD device body.

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