Printed circuit board, optical sensor, and image forming apparatus

Abstract

The invention relates to a printed circuit board, an optical sensor, and an image forming apparatus. The printed circuit board includes a substrate and a conductive pattern. The pattern includes an electrode pad and a teaching pattern that teaches an installable range of the electronic component and includes a first line and a second line. The electronic component includes a first side surface extending in a first direction. The first line and the second line extend in the first direction. In a second direction, the first side surface is between the first line and the second line. In the first direction, the first line and the second line are each in a position different from a position of the first side surface.

Description

Technical Field

[0001] The present disclosure relates to a technology for facilitating mounting of electronic components on a printed circuit board, a printed circuit board, an optical sensor, and an image forming apparatus. Background Art

[0002] There are various types of electronic components in which the arrangement of electrodes or terminals is different. If the electronic component is not mounted in the correct position on the surface of the printed circuit board, the electronic component will not operate correctly. Therefore, a thin line indicating the position where the electrodes of the electronic component are arranged is formed on the surface of the printed circuit board by screen printing (Japanese Patent Laid-Open No. 2007-012771). Solder balls as ball grid array (BGA) type electrodes of the electronic component are arranged on the back side of the electronic component. Therefore, a confirmation line that allows the displacement of the position between the outline of the printed circuit board and the BGA to be confirmed with the naked eye is printed by screen printing (Japanese Patent Laid-Open No. 2000-133898).

[0003] The process of forming the line indicating the mounting position of the electronic component by screen printing is different from the process of forming the welding area (electrode pad) where the electronic component is to be mounted. Therefore, the displacement of the position of the line formed by screen printing relative to the welding area tends to be large. As a result, when the electronic component is arranged to be aligned with the line formed by screen printing, the electronic component is sometimes not arranged at the correct position on the printed circuit board. Summary of the invention

[0004] The present disclosure provides a printed circuit board, which includes: a substrate; and a conductive pattern, which is arranged on the substrate, the conductive pattern including: an electrode pad, on which an electronic component is to be mounted, and a first teach pattern, which teaches the mountable range of the electronic component and includes a first line and a second line, wherein when viewed from a direction orthogonal to the mounting surface of the printed circuit board, the electronic component includes a first side surface extending in a first direction, the first direction is a direction along the mounting surface, the first line and the second line extend in the first direction, in a second direction orthogonal to the first direction and the normal direction of the mounting surface, the first side surface is between the first line and the second line, and in the first direction, the position of the first line is different from the position of the first side surface, and the position of the second line is different from the position of the first side surface.

[0005] The present disclosure provides an optical sensor, which includes: a printed circuit board, the printed circuit board includes: a substrate; and a conductive pattern, the conductive pattern is arranged on the substrate, the conductive pattern includes: an electrode pad, an electronic component is to be mounted on the electrode pad, and a first teaching pattern, the first teaching pattern teaches the mountable range of the electronic component and includes a first line and a second line, wherein when viewed from a direction orthogonal to a mounting surface of the printed circuit board, the electronic component includes a first side surface extending in a first direction, the first direction is a direction along the mounting surface, the first line and the second line extend in the first direction, in a second direction orthogonal to the first direction and a normal direction of the mounting surface, the first side surface is between the first line and the second line, and in the first direction, the position of the first line is different from the position of the first side surface, and the position of the second line is different from the position of the first side surface, and the electronic component includes a chip-type light emitting element and a chip-type light receiving element.

[0006] The present disclosure provides an image forming device, the image forming device comprising: a conveying component for conveying a sheet along a conveying path; a detection component for detecting a timing of a sheet conveyed by the conveying component passing through or detecting a type of the sheet; and an image forming component for forming an image on the sheet, wherein the detection component comprises a printed circuit board, the printed circuit board comprising: a substrate; and a conductive pattern, the conductive pattern being arranged on the substrate, the conductive pattern comprising: an electrode pad, an electronic component is to be mounted on the electrode pad, and a first teaching pattern, the first teaching pattern teaching a mountable range of the electronic component and Includes a first line and a second line, wherein when viewed from a direction orthogonal to the mounting surface of the printed circuit board, the electronic component includes a first side surface extending in a first direction, the first direction is a direction along the mounting surface, the first line and the second line extend in the first direction, in a second direction orthogonal to the first direction and the normal direction of the mounting surface, the first side surface is between the first line and the second line, and in the first direction, the position of the first line is different from the position of the first side surface, and the position of the second line is different from the position of the first side surface, and the electronic component includes a chip-type light emitting element and a chip-type light receiving element.

[0007] Further features of the present disclosure will become apparent from the following description of exemplary embodiments (with reference to the attached drawings). BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figures 1A to 1C is a diagram illustrating a printed circuit board.

[0009] Figure 2 It is a pattern of markings printed on the surface of a printed circuit board by screen printing.

[0010] FIG. 3A to FIG. 3C is a diagram illustrating a printed circuit board.

[0011] FIG. 4A to FIG. 4C is a diagram illustrating a printed circuit board.

[0012] Figure 5 is a diagram illustrating a printed circuit board.

[0013] Figure 6 is a diagram illustrating a printed circuit board.

[0014] FIG. 7A to FIG. 7C is a diagram illustrating a printed circuit board.

[0015] FIG. 8A to FIG. 8C is a diagram illustrating a printed circuit board.

[0016] Fig. 9 is a diagram illustrating a printed circuit board.

[0017] FIG. 10A to FIG. 10C These are diagrams that suggest other shapes of teaching patterns.

[0018] Fig.11 is a diagram illustrating an optical sensor.

[0019] Fig.12 is a diagram illustrating an image forming apparatus. DETAILED DESCRIPTION

[0020] Hereinafter, the embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments are not intended to limit the scope of the claimed invention. A plurality of features are described in the embodiments, but are not limited to the invention requiring all such features, and a plurality of such features may be appropriately combined. In addition, in the accompanying drawings, the same reference numerals are given to the same or similar configurations, and their repeated descriptions are omitted.

[0021] <Example 1>

[0022] (1) Structure of printed circuit board

[0023] Figure 1A is a plan view of a printed circuit board 100 according to the first embodiment. Figure 1B is a cross-sectional view of the printed circuit board 100 along the cutting line HH. Figure 1C1 is a cross-sectional view of the printed circuit board 100 along the cutting line GG. "Z" indicates the height direction of the printed circuit board 100. "x" and "y" indicate directions parallel to the mounting surface of the printed circuit board 100. The electronic component 110 is mounted on the mounting surface of the printed circuit board 100. In this specification, lowercase letters such as a, b, c, and d may be added at the end of the reference numerals. These are added to distinguish identical or similar elements. Therefore, when describing matters common to identical or similar elements, lowercase letters may be omitted.

[0024] The printed circuit board 100 includes an insulating substrate 102, a conductive pattern 104, and a resist 101. The insulating substrate 102 is a glass epoxy resin or the like. The conductive pattern 104 is a copper foil or the like formed or stacked on the substrate 102. The resist 101 is an insulating layer formed or stacked on the conductive pattern 104. The portion of the conductive pattern 104 soldered to the electrode of the electronic component 110 is referred to as the electrode pads 107a and 107b. The electrode pads 107a and 107b may be referred to as a welding area. There is a solder 103 between the electronic component 110 and the electrode pads 107a and 107b. The electrodes 105a and 105b of the electronic component 110 are connected to the conductive pattern 104 through the solder 103 and conduct electricity.

[0025] The thickness of the conductive pattern 104 in the z direction is, for example, 35 um. um is an abbreviation for micrometer. The electrode pads 107a and 107b are parts of the conductive pattern 104. The resist 101 is an insulating layer provided on the upper layer of the printed circuit board 100 and the conductive pattern 104. The thickness of the resist 101 in the z direction is, for example, 30 um. The conductive pattern 104 is covered by the resist 101, but the shape of the conductive pattern 104 is visible. This is because the resist 101 is translucent.

[0026] The substrate 102 includes a first side 121a, a second side 121b, a third side 121c, and a fourth side 121d. The first side 121a and the third side 121c are parallel. The second side 121b and the fourth side 121d are parallel. The first side 121a and the second side 121b are orthogonal. In the specification, etc., adding ordinal auxiliary words such as first and second is only for convenience of description.

[0027] The electronic component 110 includes a first side surface 122a, a second side surface 122b, a third side surface 122c, and a fourth side surface 122d. The first side surface 122a and the third side surface 122c are parallel. The second side surface 122b and the fourth side surface 122d are parallel. The first side surface 122a and the second side surface 122b are orthogonal. The first side surface 122a, the second side surface 122b, the third side surface 122c, and the fourth side surface 122d extend in a direction along the mounting surface of the substrate 102 and the printed circuit board 100.

[0028] (2) Comparative example

[0029] Figure 2 A comparative example is illustrated. Silkscreen text 106 and silkscreen marks 108a to 108d are printed on resist 101. Silkscreen text 106 and silkscreen marks 108a to 108d are printed using, for example, non-conductive epoxy ink or the like. The thickness of silkscreen text 106 in the z direction is, for example, 30um. The process for printing silkscreen text 106 and silkscreen marks 108a to 108d is different from the process for forming conductive pattern 104.

[0030] Silk screen text 106 indicates the position number of the electric component (A100 as the position number of the electronic component 110 ). Silk screen marks 108 a to 108 d indicate the mountable range of the electronic component 110 on the printed circuit board 100 .

[0031] The silk screen marks 108a to 108d have an L shape. If the four corners of the electronic component 110 are positioned inside the silk screen marks 108a to 108d, the mounting position of the electronic component 110 is correct. However, the process for printing the silk screen marks 108a to 108d is different from the process for forming the conductive pattern 104. Therefore, the positions of the silk screen marks 108a to 108d relative to the conductive pattern 104 vary. As a result, even when the electronic component 110 is arranged inside the silk screen marks 108a to 108d, the electronic component 110 is shifted relative to the electrode pads 107a and 107b.

[0032] (3) Markings for teaching the installation positions of electronic components

[0033] (3-1) Alignment (positioning) of electronic components in the y direction

[0034] FIG. 3A to FIG. 3C 1 is a plan view illustrating the surface of the printed circuit board 100 , in which the illustration of the resist 101 is omitted. Figure 3AAn enlarged view of the teaching pattern 120a is illustrated. The teaching pattern 120a is a conductive pattern formed in the same process as the process for the conductive pattern 104. That is, the teaching pattern 120a and the electrode pads 107a and 107b are manufactured in the same process, so the positional relationship between the teaching pattern 120a and the electrode pads 107a and 107b is accurate. The teaching pattern 120a has a concave shape consisting of two parallel lines 131a and 132a and a line 133a. The line 133a connects the two lines 131a and 132a. The two imaginary lines 112a and 111a are lines illustrated for convenience of description, and are imaginary lines obtained by extending each of the two lines 131a and 132a. The two lines 131a and 132a and the two imaginary lines 112a and 111a are parallel to the second side surface 122b intersecting the first side surface 122a of the electronic component 110.

[0035] The two lines 131a and 132a and the two imaginary lines 112a and 111a indicate the mountable range of the electronic component 110 in the y direction. The line 131a and the imaginary line 112a indicate one limit position (upper limit position) in the mountable range of the electronic component 110. The line 132a and the imaginary line 111a indicate the other limit position (lower limit position) in the mountable range of the electronic component 110.

[0036] according to Figure 3A , the second side surface 122b of the electronic component 110 is positioned between the two lines 131a and 132a (two imaginary lines 112a and 111a) constituting the teaching pattern 120a. Therefore, it can be seen that the electronic component 110 is accurately arranged relative to the printed circuit board 100.

[0037] according to Figure 3B , the electronic component 110 is arranged to be displaced in the -y direction. The second side surface 122b of the electronic component 110 is not positioned between the two lines 131a and 132a (two imaginary lines 112a and 111a) constituting the teaching pattern 120a. Therefore, it can be seen that the electronic component 110 is not accurately arranged relative to the printed circuit board 100.

[0038] according to Figure 3C , the electronic component 110 is arranged to be shifted in the +y direction. The second side surface 122b of the electronic component 110 is not positioned between the two lines 131a and 132a (two imaginary lines 112a and 111a) constituting the teaching pattern 120a. Therefore, it can be seen that the electronic component 110 is not accurately arranged relative to the printed circuit board 100.

[0039] (3-2) Alignment of electronic components in the x-direction

[0040] FIG. 4A to FIG. 4C 1 is a plan view illustrating the surface of the printed circuit board 100 , in which the illustration of the resist 101 is omitted. Figure 4A An enlarged view of the teaching pattern 120b is illustrated. The teaching pattern 120b is a conductive pattern formed in the same process as the process for the conductive pattern 104. That is, the teaching pattern 120b and the electrode pads 107a and 107b are manufactured in the same process, so the positional relationship between the teaching pattern 120b and the electrode pads 107a and 107b is accurate. The teaching pattern 120b has a concave shape consisting of two parallel lines 131b and 132b and a line 133b. Line 133b connects the two lines 131b and 132b. The two imaginary lines 112b and 111b are lines illustrated for the convenience of description, and are imaginary lines obtained by extending each of the two lines 131b and 132b. The two lines 131b and 132b and the two imaginary lines 112b and 111b are parallel to the first side surface 122a of the electronic component 110.

[0041] Two lines 131b and 132b and two imaginary lines 112b and 111b indicate the mountable range of the electronic component 110 in the x direction. The line 131b and the imaginary line 112b indicate the upper limit position in the mountable range of the electronic component 110. The line 132b and the imaginary line 111b indicate the lower limit position in the mountable range of the electronic component 110.

[0042] according to Figure 4A , the first side surface 122a of the electronic component 110 is positioned between the two lines 131b and 132b (two imaginary lines 112b and 111b) constituting the teaching pattern 120b. Therefore, it can be seen that the electronic component 110 is accurately arranged relative to the printed circuit board 100.

[0043] according to Figure 4B , the electronic component 110 is arranged to be shifted in the +x direction. The first side surface 122a of the electronic component 110 is not positioned between the two lines 131b and 132b (two imaginary lines 112b and 111b) constituting the teaching pattern 120b. Therefore, it can be seen that the electronic component 110 is not accurately arranged relative to the printed circuit board 100.

[0044] according to Figure 4C , the electronic component 110 is arranged to be displaced in the -x direction. The first side surface 122a of the electronic component 110 is not positioned between the two lines 131b and 132b (two imaginary lines 112b and 111b) constituting the teaching pattern 120b. Therefore, it can be seen that the electronic component 110 is not accurately arranged relative to the printed circuit board 100.

[0045] (3-3) Teaching pattern for positioning two side surfaces of electronic components

[0046] Figure 5 Another example of teaching patterns 120a and 120b is illustrated. The electronic component 110 is arranged so that the second side surface 122b and the fourth side surface 122d of the electronic component 110 are positioned between the two lines 131a and 132a (two imaginary lines 112a and 111a) constituting the teaching pattern 120a. Similarly, the electronic component 110 is arranged so that the first side surface 122a and the third side surface 122c of the electronic component 110 are positioned between the two lines 131b and 132b (two imaginary lines 112b and 111b) constituting the teaching pattern 120b. As described above, a single teaching pattern 120a can indicate the mountable range of the two side surfaces of the electronic component 110. In this case, the distance between the two lines 131a and 132a constituting the teaching pattern 120a is longer than the length of the first side surface 122a and longer than the length of the third side surface 122c.

[0047] Similarly, a single teaching pattern 120b may indicate the mountable range of both side surfaces of the electronic component 110. In this case, the distance between the two lines 131b and 132b constituting the teaching pattern 120b is longer than the length of the second side surface 122b and longer than the length of the fourth side surface 122d.

[0048] As described above, by arranging the electronic component 110 inside the teaching pattern 120a, the electronic component 110 is accurately positioned in the y direction. By arranging the electronic component 110 inside the teaching pattern 120b, the electronic component 110 is accurately positioned in the x direction.

[0049] (3-4) Another example of teaching pattern

[0050] Figure 6 The diagram shows that the teaching pattern 120a is implemented using two teaching patterns 601 and 602 and the teaching pattern 120b is implemented using two teaching patterns 603 and 604. Figure 6 , teaching pattern 601 teaches the installable range of the second side surface 122b of the electronic component 110. Teaching pattern 602 teaches the installable range of the fourth side surface 122d of the electronic component 110. Teaching pattern 603 teaches the installable range of the first side surface 122a of the electronic component 110. Teaching pattern 604 teaches the installable range of the third side surface 122c of the electronic component 110.

[0051] As described above, the teaching patterns 120a and 120b formed in the same process as that for the electrode pads 107a and 107b are used. Therefore, in the first embodiment, compared with the case of the silk screen marks 108a to 108d, the electronic component 110 can be accurately positioned relative to the electrode pads 107a and 107b. Instead of the silk screen marks 108a to 108d, a conductive pattern composed of the same shape (e.g., L shape) as the shape of the silk screen marks 108a to 108d can be used as the teaching pattern.

[0052] <Second Embodiment>

[0053] (1) Using a convex teaching pattern

[0054] In the first embodiment, the shapes of the teaching patterns 120a and 120b are both concave shapes. However, the shapes of the teaching patterns 120a and 120b may be other shapes as long as they can teach the installation position of the electronic component 110. Therefore, in the second embodiment, as the shapes of the teaching patterns 120a and 120b, convex shapes will be introduced. In the second embodiment, the description of matters that are the same as or similar to those of the first embodiment will be omitted and incorporated into the description of the first embodiment.

[0055] (2) Alignment in the y direction

[0056] FIG. 7A to FIG. 7C 1 is a plan view of the surface of the illustrated printed circuit board 100, in which the illustration of the resist 101 is omitted. The teaching pattern 120a includes two convex shapes (first convex shape 701 and second convex shape 702) protruding in the -x direction. These two convex shapes teach the mountable range of the second side surface 122b of the electronic component 110 in the y direction. That is, the two imaginary lines 112a and 111a indicating the space between the two convex shapes indicate the mountable range of the second side surface 122b in the y direction. These two convex shapes can be referred to as protrusions. The two imaginary lines 112a and 111a are parallel to the second side surface 122b. The two imaginary lines 112a and 111a are orthogonal to the y direction. Similarly, the second side surface 122b is orthogonal to the y direction.

[0057] according to Fig. 7A , the second side surface 122b of the electronic component 110 is arranged between two imaginary lines 111a and 112a extending in the -x direction from the two convex shapes forming the teaching pattern 120a. Therefore, the electronic component 110 is correctly mounted in the y direction. Figure 7B In the embodiment, the second side surface 122b of the electronic component 110 is arranged to be displaced in the -y direction relative to the teaching pattern 120a. Therefore, the electronic component 110 is not correctly mounted in the y direction. Figure 7C, the second side surface 122b of the electronic component 110 is arranged to be displaced in the +y direction relative to the teaching pattern 120a. Therefore, the electronic component 110 is not correctly installed in the y direction. Therefore, even if the teaching pattern 120a is implemented using two convex shapes, the installation position of the electronic component 110 in the y direction can be visually confirmed.

[0058] (2) Alignment in the x direction

[0059] FIG. 8A to FIG. 8C 1 is a plan view illustrating the surface of the printed circuit board 100, wherein the illustration of the resist 101 is omitted. The teaching pattern 120b includes two convex shapes (first convex shape 801 and second convex shape 802) protruding in the -y direction. The two convex shapes teach the mountable range of the first side surface 122a of the electronic component 110 in the x direction.

[0060] according to Fig. 8A , the first side surface 122a of the electronic component 110 is arranged between two imaginary lines 111b and 112b extending in the -y direction from two convex shapes forming the teaching pattern 120b. Therefore, the electronic component 110 is correctly mounted in the x direction. Figure 8B In the embodiment, the first side surface 122a of the electronic component 110 is arranged to be displaced in the +x direction relative to the teaching pattern 120b. Therefore, the electronic component 110 is not correctly mounted in the x direction. Figure 8C , the first side surface 122a of the electronic component 110 is arranged to be displaced in the -x direction relative to the teaching pattern 120b. Therefore, the electronic component 110 is not correctly installed in the x direction. Therefore, even if the teaching pattern 120b is implemented using two convex shapes, the installation position of the electronic component 110 in the x direction can be visually confirmed.

[0061] Similar to the first embodiment, in the second embodiment, the teaching patterns 120a and 120b formed in the same process as the process for the electrode pads 107a and 107b are adopted. Therefore, in the second embodiment, compared with the case of the silk screen marks 108a to 108d, the electronic component 110 can be accurately positioned relative to the electrode pads 107a and 107b.

[0062] The method of confirming whether the electronic component 110 is installed in the correct position may be visual observation of a person or image processing using a camera. The distance between the teaching patterns 120a and 120b and the electronic component 110 is set short (e.g., 10 mm or less). However, the distance is arbitrary as long as the installation position of the electronic component 110 can be identified by the teaching patterns 120a and 120b.

[0063] <Third Embodiment>

[0064] In the second embodiment, the teaching patterns 120a and 120b are each implemented using two convex shapes, but this is only an example. In the third embodiment, other shapes of the teaching patterns 120a and 120b will be introduced.

[0065] (1) Teaching pattern formed using a single convex shape

[0066] Fig. 9 1 is a plan view illustrating the surface of the printed circuit board 100, in which the illustration of the resist 101 is omitted. The teaching patterns 120a and 120b are each implemented by a single convex shape. Therefore, the extension lines of the two outer edges forming the convex shape can form two imaginary lines (a pair of imaginary lines 111a and 112a, and a pair of imaginary lines 111b and 112b).

[0067] (2) Other examples of concave and convex shapes

[0068] FIG. 10A to FIG. 10C is an enlarged view of the teaching patterns 120a and 120b. Fig. 10A In the embodiment, the teaching patterns 120a and 120b are represented as teaching pattern 120. The imaginary lines 111a, 112a, 111b and 112b are represented as imaginary lines 111 and 112. In the first embodiment, the depressions of the teaching patterns 120a and 120b are rectangular. However, the shape of the depressions may be semicircular. Fig. 10B As shown in FIG. 1 , the depressions of the teaching patterns 120 a and 120 b may be triangular. The depressions may be semicircular, etc.

[0069] exist Fig. 7A and Fig. 8A In the example, the teaching patterns 120a and 120b are each formed using two convex shapes. The two convex shapes are rectangular. Fig. 10C As shown in , the two convex shapes may be triangles. In this case, two imaginary lines 111 and 112 extend from the vertices of the triangle in the y direction or the x direction.

[0070] As described above, it is sufficient if the teaching patterns 120 a and 120 b have shapes that enable conceptualization of the two imaginary lines 111 and 112 that define the mountable range of the electronic component 110 .

[0071] In the first to third embodiments, the combination of the shape of the teaching pattern 120a and the shape of the teaching pattern 120b is a pair of convex shapes and convex shapes or a pair of concave shapes and concave shapes. However, these are just examples. A configuration in which the shape of the teaching pattern 120a is a convex shape and the shape of the teaching pattern 120b is a concave shape can be adopted. On the contrary, a configuration in which the shape of the teaching pattern 120a is a concave shape and the shape of the teaching pattern 120b is a convex shape can be adopted. The case of the convex shape and the case of the concave shape can be any shape implied in the first to third embodiments.

[0072] <Fourth Embodiment>

[0073] In the fourth embodiment, some cases in which the printed circuit board 100 described in the first to third embodiments can be applied will be described.

[0074] (1) Optical sensor

[0075] Fig.11 An optical sensor 1100 is illustrated. An LED 1101 as a chip-type light emitting element and a chip-type PD 1102 as a light receiving element are mounted on a mounting surface of a printed circuit board 100. LED is an abbreviation of a light emitting diode. PD is an abbreviation of a photodiode.

[0076] An aperture 1120 is also provided on the mounting surface of the printed circuit board 100. The aperture 1120 is an optical aperture. The aperture 1120 includes openings 1121a and 1121b and a light shielding wall 1122. The light shielding wall 1122 is provided to surround each of the LED 1101 and the PD 1102, thereby preventing light from the LED 1101 from directly entering the PD 1102.

[0077] The opening 1121a is an opening for allowing light output from the LED 1101 to pass through. The opening 1121b is an opening for allowing light coming from the outside to pass through. The aperture 1120 serves to narrow the light output from the LED 1101 and the light coming from the outside. Thus, the light receiving performance of the optical sensor 1100 is improved.

[0078] The reflective plate 1140 is arranged to face the printed circuit board 100. The light output from the LED 1101 irradiates the reflective plate 1140 along the optical path 1160. The light is reflected by the reflective plate 1140, and the reflected light enters the PD 1102 along the optical path 1170. The PD 1102 outputs a signal corresponding to the received light. When the light is blocked by an object (such as a sheet), the level of the signal output from the PD 1102 changes. Therefore, the optical sensor 1100 can be used as a sensor for detecting the presence of an object. In addition, the PD 1102 detects the light reflected from the object and outputs a signal corresponding to the surface characteristics of the object. Therefore, the optical sensor 1100 can be used as a sensor for detecting the surface characteristics (e.g., the roughness of the surface of the sheet, the presence or absence of a coating, etc.) or type (e.g., gram weight) of the object.

[0079] (2) Image forming device

[0080] Fig.12 An electrophotographic image forming apparatus 1200 is illustrated. The photosensitive drum 18 is an image carrying member including a photosensitive layer such as an organic photoconductor. The photosensitive drum 18 rotates in the arrow direction at a predetermined process speed. The charging roller 2 charges the surface of the photosensitive drum 18 so that the potential on the surface of the photosensitive drum 18 becomes a predetermined potential. The laser beam scanner 3 exposes the surface of the photosensitive drum 18 by outputting a laser beam according to an image signal, thereby forming an electrostatic latent image.

[0081] The developer container 5 contains the toner 4. The developer carrying member 6 develops the electrostatic latent image using the toner 4, thereby forming a toner image. The developer carrying member 6 may be referred to as a developing roller or a developing sleeve.

[0082] By the rotation of the photosensitive drum 18, the toner image is transferred to the transfer unit 19. The transfer unit 19 is composed of the photosensitive drum 18 and the transfer roller 7. The sheet cassette 11 is a storage box for accommodating a large number of sheets 8. The feed roller 12 feeds a sheet 8 from the sheet cassette 11 to the conveying path 10. The conveying roller 13 conveys the sheet 8 to the transfer unit 19 along the conveying path 10. The sheet sensor 16 is arranged on the downstream side of the conveying roller 13. The sheet sensor 16 is implemented by an optical sensor 1100. The laser beam scanner 3 outputs a laser beam based on the timing at which the sheet sensor 16 detects the leading end of the sheet 8. Therefore, the timing at which the toner image arrives at the transfer unit 19 is synchronized with the timing at which the sheet 8 arrives.

[0083] The transfer unit 19 transfers the toner image from the photosensitive drum 18 to the sheet 8. The cleaning container 9 collects the toner 4 remaining on the photosensitive drum 18. The photosensitive drum 18, the charging roller 2, the developer container 5 and the cleaning container 9 are provided in an integrated manner and may be referred to as a process cartridge.

[0084] The sheet 8 is conveyed from the transfer unit 19 to the fixing device 17. Heat and pressure are applied to the toner image and the sheet 8 by the fixing device 17, and the toner image is fixed to the sheet 8. The discharge roller 14 discharges the sheet 8 to the outside of the image forming apparatus 1200. The toner 4 is fixed to the sheet 8 while being heated and pressurized by the fixing device 17. Thus, the printed matter composed of the sheet 8 and the toner image can be subjected to antibacterial treatment.

[0085] exist Fig.12 , an image forming apparatus 1200 that forms a monochrome image is illustrated, but the technical concept of the present invention can also be applied to an image forming apparatus that forms a full-color image. In addition, the sheet 8 may be pre-printed paper on which printing has been performed.

[0086] The optical sensor 1100 installed in the image forming apparatus 1200 as the sheet sensor 16 irradiates light from the LED 1101 mounted on the printed circuit board 100 to the reflection plate 1140, and receives the light reflected from the reflection plate 1140 using the PD 1102. In such an optical sensor 1100, since the mounting positions of the LED 1101 and the PD 1102, which are chip-type electronic components, are shifted, the amount of received light may decrease, or the detection accuracy of the sheet P or the surface characteristics may decrease.

[0087] Therefore, the teaching pattern 120 as the conductive pattern described in the first to third embodiments is adopted. Therefore, compared with the case of the screen-printed mark (screen marks 108a to 108d), the installation positions of the LED 1101 and the PD 1102 are each accurate, thereby improving the detection accuracy. In addition, since the stray light caused by the screen reflected light is reduced, the detection accuracy of the optical sensor 1100 is improved. Since the position of the sheet P can be accurately determined, the image forming device 1200 can be able to form a toner image at an accurate position on the sheet P. The sheet sensor 16 can be used as a medium sensor for detecting the surface characteristics, type (e.g., cardboard, thin paper, plain paper, coated paper), etc. of the sheet S. In this case, the image forming device 1200 can be able to accurately control the density of the toner image or the fixing temperature of the fixing device 17 based on the detection result of the sheet sensor 16.

[0088] <Technical Concepts Derived from the Embodiments>

[0089] (Item 1) A printed circuit board (100), characterized by comprising:

[0090] a substrate (102); and

[0091] a conductive pattern (104), the conductive pattern (104) being arranged on the substrate,

[0092] The conductive pattern (104) comprises:

[0093] an electrode pad (107a) on which an electronic component (110) is to be mounted, and

[0094] a first teaching pattern (120a; 120b), the first teaching pattern (120a; 120b) teaching the mountable range of the electronic component and comprising a first line (131a; 131b) and a second line (132a; 132b),

[0095] in

[0096] When viewed from a direction orthogonal to a mounting surface of the printed circuit board (100), the electronic component (110) comprises a first side surface (122a; 122b; 122c; 122d) extending in a first direction, the first direction being a direction along the mounting surface,

[0097] The first line (131a; 131b) and the second line (132a; 132b) extend in the first direction,

[0098] In a second direction orthogonal to the first direction and the normal direction of the mounting surface, the first side surface (122a; 122b; 122c; 122d) is between the first line (131a; 131b) and the second line (132a; 132b), and

[0099] In the first direction, the position of the first line (131a; 131b) is different from the position of the first side surface (122a; 122b; 122c; 122d), and the position of the second line (132a; 132b) is different from the position of the first side surface (122a; 122b; 122c; 122d).

[0100] As described in the first to third embodiments, the teaching patterns 120a and 120b are formed near the electrode pads 107a or near the electrode pads 107b, and have a predetermined shape for teaching the mountable range of the electronic component 110 relative to the electrode pads 107a and 107b. Thus, it becomes easier to confirm that the electronic component 110 is correctly mounted at the predetermined position.

[0101] according to Figure 3A , Figure 4A , Figure 5 , Figure 6 , Fig. 7A , Fig. 8A , Fig. 9 as well as FIG. 10A to FIG. 10C, lines 131a, 131b, 132a, and 132b and imaginary lines 111 and 112 are illustrated. Lines 131a, 131b, 132a, and 132b and imaginary lines 111 and 112 are examples of at least two lines (a first line and a second line) that teach the mountable range of the electronic component 110. Therefore, at least two lines are useful for visually teaching the mountable range of the electronic component.

[0102] When viewed in a direction orthogonal to the mounting surface of the printed circuit board (e.g., -z direction), the electronic component may include a first side surface extending in a first direction (e.g., x direction or y direction), the first direction being a direction along the mounting surface. Here, the first line and the second line extend in the first direction. There is a second direction orthogonal to the first direction and orthogonal to the normal direction of the mounting surface (e.g., y direction or x direction). In the second direction, the first side surface may be between the first line and the second line. In addition, in the first direction, the first line and the second line may each be at a position different from the position of the first side surface. In the second direction, the first line and the second line may each be at a position different from the position of the first side surface.

[0103] Lines 131a and 131b and the imaginary line 112 are examples of first lines indicating a first limit position (upper limit position). Lines 132a and 132b and the imaginary line 111 are examples of second lines indicating a second limit position (lower limit position).

[0104] (Item 2) The printed circuit board according to Item 1, wherein

[0105] The first line and the second line are each located on the same side relative to the electronic component in the first direction.

[0106] like Figure 3A As shown in and the like, the first line and the second line may each be located on the same side relative to the electronic component in the first direction.

[0107] (Item 3) The printed circuit board according to Item 2, wherein

[0108] The printed circuit board includes a first side, and

[0109] The first line is a line parallel to a direction orthogonal to the first side.

[0110] For example, the line 131 a and the imaginary line 112 a are lines parallel to the x direction which is orthogonal to the first side 121 a .

[0111] (Item 4) The printed circuit board according to Item 3, wherein

[0112] The second line is a line parallel to a direction orthogonal to the first side.

[0113] For example, the line 132 a and the imaginary line 111 a are lines parallel to the x direction which is orthogonal to the first side 121 a .

[0114] (Item 5) The printed circuit board according to any one of Items 1 to 4, wherein

[0115] The first teaching pattern includes a shape that is recessed in a direction from a first side of the printed circuit board toward the electrode pad.

[0116] like Figure 3A As shown in FIG. 1 , the teaching pattern 120 a includes a shape that is recessed in a direction from the side 121 a toward the electrode pad 107 a of the printed circuit board 100 .

[0117] (Item 6) The printed circuit board according to Item 5, wherein

[0118] The shapes of the depressions include:

[0119] the first line and the second line, and

[0120] a third line connecting the first line and the second line and parallel to the first side,

[0121] The first line indicates an upper limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component, and

[0122] The second line indicates a lower limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component.

[0123] like Figure 3A As shown in , lines 131a and 132a are examples of the first line and the second line. Line 133a is an example of the third line. Line 131a may indicate an upper limit position in a direction parallel to the first side of the printed circuit board in the mountable range of the electronic component. Line 132a may indicate a lower limit position in a direction parallel to the first side of the printed circuit board in the mountable range of the electronic component.

[0124] (Item 7) The printed circuit board according to any one of Items 1 to 4, wherein

[0125] The first teaching pattern includes a shape protruding in a direction from the electrode pad toward a first side of the printed circuit board.

[0126] like Fig. 7A and Fig. 9 As shown in and etc., the teaching pattern 120a may include a shape protruding in the -x direction.

[0127] (Item 8) The printed circuit board according to Item 7, wherein

[0128] The shapes highlighted include:

[0129] the first line and the second line being orthogonal to the first side, and

[0130] a third line connecting the first line and the second line and parallel to the first side,

[0131] The first line indicates an upper limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component, and

[0132] The second line indicates a lower limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component.

[0133] like Fig. 9 As shown in FIG. 1 , the convex-shaped teaching pattern 120 a includes a first line 131 a , a second line 132 a , and a third line 133 a . The first line 131 a and the second line 132 a indicate the limit positions of the mountable range of the electronic component 110 .

[0134] (Item 9) The printed circuit board according to any one of Items 1 to 4, wherein

[0135] The first teaching pattern includes at least two convex shapes protruding in a direction from the electrode pad toward a first side of the printed circuit board.

[0136] like Fig. 7A As shown in FIG, the teaching pattern 120 a includes two convex shapes protruding in the −x direction.

[0137] (Item 10) The printed circuit board according to Item 9, wherein

[0138] The at least two convex shapes include a first convex shape and a second convex shape,

[0139] The first convex shape indicates an upper limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component, and

[0140] The second convex shape indicates a lower limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component.

[0141] like Fig. 7A As shown in , the teaching pattern 120a may include a first convex shape 701 and a second convex shape 702. The first convex shape 701 indicates the upper limit position of the mountable range of the electronic component. The second convex shape 702 indicates the lower limit position of the mountable range of the electronic component. Fig. 8A As shown in FIG. 1 , the teaching pattern 120 b may include a first convex shape 801 and a second convex shape 802. The first convex shape 801 and the second convex shape 802 may indicate an upper limit position and a lower limit position, respectively.

[0142] like Figure 1A-Figure 1C As shown in FIG. 1 , the electronic component 110 includes four side surfaces 122a to 122d in a plan view. When the electronic component 110 is a BGA type, the ball grid is arranged on the bottom side of the electronic component 110. The model number of the electronic component 110, etc. is printed or engraved on the upper surface of the electronic component 110.

[0143] (Item 11) The printed circuit board according to any one of Items 1 to 10, wherein

[0144] The electronic component includes a second side surface, a third side surface, and a fourth side surface,

[0145] The first side surface is parallel to the third side surface,

[0146] The second side surface is parallel to the fourth side surface, and

[0147] The mountable range of the electronic component is a range that the first side surface and the third side surface of the printed circuit board can take when the printed circuit board is viewed in a plan view.

[0148] like Figure 5 As shown in , the mountable range of the electronic component 110 taught by the teaching pattern 120a can be the range that the side surface 122b and the side surface 122d of the electronic component 110 can take. In addition, the mountable range of the electronic component 110 taught by the teaching pattern 120b can be the range that the side surface 122a and the side surface 122c of the electronic component 110 can take.

[0149] (Item 12) The printed circuit board according to any one of Items 1 to 11, wherein

[0150] The conductive pattern further comprises:

[0151] a second teaching pattern including a predetermined shape for teaching a mountable range of the electronic component with respect to the electrode pad,

[0152] The first teaching pattern teaches the mountable range of the electronic component in a direction parallel to the first side of the printed circuit board, and

[0153] The second teaching pattern teaches a mountable range of the electronic component in a direction orthogonal to the first side of the printed circuit board.

[0154] The teaching pattern 120a indicates the installable range of the electronic component 110 in the y direction. The teaching pattern 120b indicates the installable range of the electronic component 110 in the x direction. Thus, it is easy to confirm that the electronic component 110 is arranged at an accurate position not only in the y direction but also in the x direction.

[0155] (Item 13) The printed circuit board according to Item 12, wherein

[0156] The first teaching pattern includes a shape protruding in a direction from the electrode pad toward the first side of the printed circuit board, and

[0157] The second teaching pattern includes a shape protruding in a direction from a second side orthogonal to the first side of the printed circuit board toward the electrode pad.

[0158] like Fig. 7A and Fig. 9 As shown in , the teaching pattern 120a may include a shape protruding in the -x direction. Fig. 8A and Fig. 9 As shown in , the teaching pattern 120 b may include a shape protruding in the −y direction.

[0159] (Item 14) The printed circuit board according to Item 12, wherein

[0160] The first teaching pattern includes a shape that is recessed in a direction from the first side of the printed circuit board toward the electrode pad.

[0161] The second teaching pattern includes a shape protruding in a direction from a second side orthogonal to the first side of the printed circuit board toward the electrode pad.

[0162] like Figure 3A As shown in FIG. 1 , the teaching pattern 120 a includes a shape that is concave in the x direction. Fig. 8A and Fig. 9 As shown in FIG. 1 , the teaching pattern 120 b may include a shape protruding in the −y direction. Therefore, the teaching pattern 120 a having a concave shape and the teaching pattern 120 b having a convex shape may be combined.

[0163] (Item 15) The printed circuit board according to Item 12, wherein

[0164] The first teaching pattern includes a shape that is recessed in a direction from the first side of the printed circuit board toward the electrode pad, and

[0165] The second teaching pattern includes a shape that is recessed in a direction from a second side orthogonal to the first side of the printed circuit board toward the electrode pad.

[0166] like Figure 3A As shown in , the teaching pattern 120a may include a shape that is recessed in the +x direction. Figure 4A As shown in , the teaching pattern 120 b may include a shape that is recessed in the +y direction.

[0167] (Item 16) The printed circuit board according to Item 12, wherein

[0168] The first teaching pattern includes a shape protruding in a direction from the electrode pad toward the first side of the printed circuit board, and

[0169] The second teaching pattern includes a shape that is recessed in a direction from a second side orthogonal to the first side of the printed circuit board toward the electrode pad.

[0170] like Fig. 7A and Fig. 9 As shown in , the teaching pattern 120a may include a shape protruding in the -x direction. Figure 4A As shown in , the teaching pattern 120b may include a shape that is concave in the +y direction. Therefore, the teaching pattern 120a having a convex shape and the teaching pattern 120b having a concave shape may be combined.

[0171] (Item 17) A printed circuit board according to any one of Items 1 to 11, wherein

[0172] The electronic component includes a second side surface, a third side surface, and a fourth side surface,

[0173] The first side surface is parallel to the third side surface,

[0174] The second side surface is parallel to the fourth side surface, and

[0175] The conductive pattern further includes a second teaching pattern,

[0176] The first teaching pattern indicates a mountable range of the electronic component for the first side surface, and

[0177] The second teaching pattern indicates a mountable range of the electronic component with respect to the third side surface.

[0178] like Figure 6As shown in , the teaching pattern 601 indicates the mountable range of the electronic component 110 for the side surface 122b. The teaching pattern 602 indicates the mountable range of the electronic component 110 for the side surface 122d. The teaching pattern 603 indicates the mountable range of the electronic component 110 for the side surface 122a. The teaching pattern 604 indicates the mountable range of the electronic component 110 for the side surface 122c. In this way, a plurality of teaching patterns 120 indicating the alignment of the electronic component 110 in the y direction can be provided. Similarly, a plurality of teaching patterns 120 indicating the alignment of the electronic component 110 in the x direction can be provided.

[0179] (Item 18) A printed circuit board according to any one of Items 1 to 11, wherein

[0180] The electronic component includes a second side surface, a third side surface, and a fourth side surface,

[0181] The first side surface is parallel to the third side surface,

[0182] The second side surface is parallel to the fourth side surface, and

[0183] The conductive pattern further includes a second teaching pattern,

[0184] The first teaching pattern indicates a mountable range of the electronic component for the first side surface, and

[0185] The second teaching pattern indicates a mountable range of the electronic component with respect to the second side surface.

[0186] like Figure 3A As shown in FIG. 1 and FIG. 2 , the teaching pattern 120a indicates the mountable range of the electronic component 110 for the side surface 122b. Figure 4A As shown in , etc., the teaching pattern 120b indicates the mountable range of the electronic component 110 for the side surface 122a.

[0187] (Item 19) An optical sensor (1100), characterized by comprising:

[0188] A printed circuit board (100) as specified in item 1-18, and

[0189] The electronic component includes a chip-type light-emitting element and a chip-type light-receiving element.

[0190] like Fig.11 As shown in , the electronic component 110 may be an LED 1101 or a PD 1102. Thereby, the mounting position of the LED 1101 or the PD 1102 becomes accurate, and a reduction in the amount of light received by the optical sensor 1100 can be suppressed.

[0191] (Item 20) An image forming apparatus (1200), characterized by comprising:

[0192] a conveying member for conveying the sheet along a conveying path;

[0193] a detecting member for detecting a timing at which a sheet conveyed by the conveying member passes or detecting a type of the sheet; and

[0194] An image forming component for forming an image on a sheet, wherein the detection component comprises a printed circuit board (100) as specified in item 1-18, and

[0195] The electronic component includes a chip-type light-emitting element and a chip-type light-receiving element.

[0196] The conveying roller 13 is an example of a conveying rotating member. The photosensitive drum 18, the transfer unit 19, etc. are examples of image forming units. By adopting the optical sensor 1100 as the sheet sensor 16, the image forming device 1200 can be controlled with high accuracy. For example, the formation position of the colorant image on the sheet 8 can be more accurate. In addition, the fixing temperature of the fixing device 17 adjusted according to the surface characteristics or type of the sheet 8 can be controlled more accurately. As a result, the density and tone characteristics of the colorant image to be formed on the sheet 8 can be improved.

[0197] Other embodiments

[0198] Embodiments of the present invention may also be implemented by reading and executing computer executable instructions (e.g., one or more programs) recorded on a storage medium (which may also be more completely referred to as a 'non-transitory computer-readable storage medium') to perform one or more of the functions of the above-mentioned embodiments and / or a computer of a system or device including one or more circuits (e.g., an application-specific integrated circuit (ASIC)) for performing one or more of the functions of the above-mentioned embodiments, and by a computer of the system or device, for example, reading and executing computer executable instructions from a storage medium to perform one or more of the functions of the above-mentioned embodiments and / or controlling one or more circuits to perform one or more of the functions of the above-mentioned embodiments. The computer may include one or more processors (e.g., a central processing unit (CPU), a microprocessing unit (MPU)), and may include a network of separate computers or separate processors to read and execute computer executable instructions. Computer executable instructions may be provided to the computer, for example, from a network or a storage medium. The storage medium may include, for example, a hard disk, a random access memory (RAM), a read-only memory (ROM), a storage device of a distributed computing system, an optical disk (such as a compact disk (CD), a digital versatile disk (DVD), or a Blu-ray disk (BD)) TM), one or more of flash memory devices, memory cards, etc.

[0199] The embodiments of the present invention may also be implemented by providing software (program) for performing the functions of the above-described embodiments to a system or device via a network or various storage media, and a computer or a central processing unit (CPU) or a microprocessing unit (MPU) of the system or device reads and executes the program.

[0200] While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments.The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

Claims

1. A printed circuit board (100), characterized in that include: substrate(102); as well as a conductive pattern (104), the conductive pattern (104) being arranged on the substrate, The conductive pattern (104) comprises: an electrode pad (107a) on which an electronic component (110) is to be mounted, and a first teaching pattern (120a; 120b), the first teaching pattern (120a; 120b) teaching the mountable range of the electronic component and comprising a first line (131a; 131b) and a second line (132a; 132b), in When viewed from a direction orthogonal to a mounting surface of the printed circuit board (100), the electronic component (110) comprises a first side surface (122a; 122b; 122c; 122d) extending in a first direction, the first direction being a direction along the mounting surface, The first line (131a; 131b) and the second line (132a; 132b) extend in the first direction, In a second direction orthogonal to the first direction and the normal direction of the mounting surface, the first side surface (122a; 122b; 122c; 122d) is between the first line (131a; 131b) and the second line (132a; 132b), and In the first direction, the position of the first line (131a; 131b) is different from the position of the first side surface (122a; 122b; 122c; 122d), and the position of the second line (132a; 132b) is different from the position of the first side surface (122a; 122b; 122c; 122d).

2. The printed circuit board according to claim 1, wherein The first line and the second line are each located on the same side relative to the electronic component in the first direction.

3. The printed circuit board according to claim 2, wherein The printed circuit board includes a first side, and The first line is a line parallel to a direction orthogonal to the first side.

4. The printed circuit board according to claim 3, wherein The second line is a line parallel to a direction orthogonal to the first side.

5. The printed circuit board according to claim 1, wherein The first teaching pattern includes a shape that is recessed in a direction from a first side of the printed circuit board toward the electrode pad.

6. The printed circuit board according to claim 5, wherein The shapes of the depressions include: the first line and the second line, and a third line connecting the first line and the second line and parallel to the first side, The first line indicates an upper limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component, and The second line indicates a lower limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component.

7. The printed circuit board according to claim 1, wherein The first teaching pattern includes a shape protruding in a direction from the electrode pad toward a first side of the printed circuit board.

8. The printed circuit board according to claim 7, wherein The shapes highlighted include: the first line and the second line being orthogonal to the first side, and a third line connecting the first line and the second line and parallel to the first side, The first line indicates an upper limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component, and The second line indicates a lower limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component.

9. The printed circuit board according to claim 1, wherein The first teaching pattern includes at least two convex shapes protruding in a direction from the electrode pad toward a first side of the printed circuit board.

10. The printed circuit board according to claim 9, wherein The at least two convex shapes include a first convex shape and a second convex shape, The first convex shape indicates an upper limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component, and The second convex shape indicates a lower limit position in a direction parallel to the first side of the printed circuit board in a mountable range of the electronic component.

11. The printed circuit board according to any one of claims 1 to 10, wherein The electronic component includes a second side surface, a third side surface, and a fourth side surface, The first side surface is parallel to the third side surface, The second side surface is parallel to the fourth side surface, and The mountable range of the electronic component is a range that the first side surface and the third side surface of the printed circuit board can take when the printed circuit board is viewed in a plan view.

12. The printed circuit board according to any one of claims 1 to 10, wherein The conductive pattern further comprises: a second teaching pattern including a predetermined shape for teaching a mountable range of the electronic component with respect to the electrode pad, The first teaching pattern teaches the mountable range of the electronic component in a direction parallel to the first side of the printed circuit board, and The second teaching pattern teaches a mountable range of the electronic component in a direction orthogonal to the first side of the printed circuit board.

13. The printed circuit board according to claim 12, wherein The first teaching pattern includes a shape protruding in a direction from the electrode pad toward the first side of the printed circuit board, and The second teaching pattern includes a shape protruding in a direction from a second side orthogonal to the first side of the printed circuit board toward the electrode pad.

14. The printed circuit board according to claim 12, wherein The first teaching pattern includes a shape that is recessed in a direction from the first side of the printed circuit board toward the electrode pad, and The second teaching pattern includes a shape protruding in a direction from a second side orthogonal to the first side of the printed circuit board toward the electrode pad.

15. The printed circuit board according to claim 12, wherein The first teaching pattern includes a shape that is recessed in a direction from the first side of the printed circuit board toward the electrode pad, and The second teaching pattern includes a shape that is recessed in a direction from a second side orthogonal to the first side of the printed circuit board toward the electrode pad.

16. The printed circuit board according to claim 12, wherein The first teaching pattern includes a shape protruding in a direction from the electrode pad toward the first side of the printed circuit board, and The second teaching pattern includes a shape that is recessed in a direction from a second side orthogonal to the first side of the printed circuit board toward the electrode pad.

17. The printed circuit board according to any one of claims 1 to 10, wherein The electronic component includes a second side surface, a third side surface, and a fourth side surface, The first side surface is parallel to the third side surface, The second side surface is parallel to the fourth side surface, and The conductive pattern further includes a second teaching pattern, The first teaching pattern indicates a mountable range of the electronic component for the first side surface, and The second teaching pattern indicates a mountable range of the electronic component with respect to the third side surface.

18. The printed circuit board according to any one of claims 1 to 10, wherein The electronic component includes a second side surface, a third side surface, and a fourth side surface, The first side surface is parallel to the third side surface, The second side surface is parallel to the fourth side surface, and The conductive pattern further includes a second teaching pattern, The first teaching pattern indicates a mountable range of the electronic component for the first side surface, and The second teaching pattern indicates a mountable range of the electronic component with respect to the second side surface.

19. An optical sensor comprising: A printed circuit board, the printed circuit board comprising: substrate; and a conductive pattern arranged on the substrate, The conductive pattern comprises: an electrode pad on which an electronic component is to be mounted, and a first teaching pattern, the first teaching pattern teaching the mountable range of the electronic component and including a first line and a second line, in When viewed from a direction orthogonal to the mounting surface of the printed circuit board, the electronic component includes a first side surface extending in a first direction, the first direction being a direction along the mounting surface, The first line and the second line extend in the first direction, In a second direction orthogonal to the first direction and the normal direction of the mounting surface, the first side surface is between the first line and the second line, and In the first direction, the position of the first line is different from the position of the first side surface, and the position of the second line is different from the position of the first side surface, and The electronic component includes a chip-type light-emitting element and a chip-type light-receiving element.

20. An image forming device comprising: a conveying member for conveying the sheet along a conveying path; a detection component for detecting a timing of a sheet conveyed by the conveying component passing through or detecting a type of the sheet; as well as An image forming component, the image forming component is used to form an image on a sheet, wherein the detection component includes a printed circuit board, and the printed circuit board includes: substrate; and a conductive pattern arranged on the substrate, The conductive pattern comprises: an electrode pad on which an electronic component is to be mounted, and a first teaching pattern, the first teaching pattern teaching the mountable range of the electronic component and including a first line and a second line, in When viewed from a direction orthogonal to the mounting surface of the printed circuit board, the electronic component includes a first side surface extending in a first direction, the first direction being a direction along the mounting surface, The first line and the second line extend in the first direction, In a second direction orthogonal to the first direction and the normal direction of the mounting surface, the first side surface is between the first line and the second line, and In the first direction, the position of the first line is different from the position of the first side surface, and the position of the second line is different from the position of the first side surface, and The electronic component includes a chip-type light-emitting element and a chip-type light-receiving element.

Images