An electromagnetically shielded three-dimensional interconnect structure for convenient connection of radio frequency microsystems

Abstract

The present invention belongs to the technical field of radio frequency microsystems, and provides an electromagnetic shielding three-dimensional interconnection structure for radio frequency microsystems that is convenient to connect, including a first substrate and a second substrate, wherein the first substrate and the second substrate are arranged in parallel and separated by a preset interval; a plurality of groups of first vertical interconnection columns and second vertical interconnection columns are fixedly installed on the first substrate, wherein a group of first vertical interconnection columns is paired with two groups of second vertical interconnection columns, and the two groups of second vertical interconnection columns are located at and symmetrically distributed on both sides of the paired first vertical interconnection columns, so as to solve the technical problem in the prior art that the difficulty of conveying conductive silver glue to the connection between the vertical interconnection columns and the base increases after the vertical interconnection columns are first inserted into the interconnection base. The present invention arranges conductive silver glue in the interconnection base in advance, and can automatically fill the conductive silver glue into the connection between the second vertical interconnection columns and the second substrate when the second substrate is subsequently installed. The present invention can be widely used in connection scenarios of three-dimensional interconnection structures.

Description

Technical Field

[0001] The invention belongs to the technical field of radio frequency microsystems, and in particular relates to an electromagnetic shielding three-dimensional interconnection structure that is convenient for connection for radio frequency microsystems. Background Art

[0002] As an advanced integrated packaging technology under the trend of system miniaturization, RF microsystem integration technology has become a major basic technology that leads equipment development and promotes electronic technology innovation. It is an important technical platform that supports the transformation of electronic information equipment capabilities in the fields of sensing and communication. It is also one of the core technologies in current electronic information technology research.

[0003] As RF microsystems continue to develop in the direction of miniaturization, high density and high integration, the chip size continues to shrink, the bonding point size continues to decrease, the lead spacing continues to shorten, the bonding density is greatly improved, and the wire bonding has increasingly stringent requirements on the height, angle and arc length of the wire arc. Traditional wire bonding technology can no longer meet the needs. Although BGA solder ball technology realizes the interconnection between substrates, it occupies a large space, resulting in a large spacing between adjacent solder balls, and easily forms a solder short circuit, and cannot achieve narrow spacing interconnection, affecting the electromagnetic shielding effect of RF. In response to the above technical problems, the applicant has retrieved some prior art, such as the Chinese patent with patent announcement number CN117727741A. When in use, the vertical positioning column is inserted into the positioning hole between two adjacent substrates to realize the positioning function. The vertical interconnection column is first inserted into the interconnection base, and then the conductive glue is placed at the connection. The interconnection is realized by curing the conductive glue. Since the vertical interconnection column corresponds to the base one by one, and the base is distributed in depth, the vertical interconnection column is first inserted into the interconnection base, which increases the difficulty of transporting the conductive silver glue to the connection between the vertical interconnection column and the base, and increases the difficulty of connecting between the substrates. Summary of the invention

[0004] The purpose of the present invention is to provide an electromagnetic shielding three-dimensional interconnection structure that is easy to connect for a radio frequency microsystem, aiming to solve the technical problem in the prior art that the vertical interconnection column is first inserted into the interconnection base, which increases the difficulty of transporting the conductive silver glue to the connection between the vertical interconnection column and the base.

[0005] The present invention is implemented as follows: an electromagnetic shielding three-dimensional interconnection structure conveniently connected for a radio frequency microsystem comprises a first substrate and a second substrate, wherein the first substrate and the second substrate are arranged in parallel and separated by a preset distance;

[0006] A plurality of groups of first vertical interconnection columns and second vertical interconnection columns are fixedly mounted on the first substrate, each group of first vertical interconnection columns is paired with two groups of second vertical interconnection columns, the second vertical interconnection columns are symmetrically distributed on both sides of the first vertical interconnection columns, and the plurality of groups of the first vertical interconnection columns and the second vertical interconnection columns are arranged in a concentrically distributed frame structure, and the first vertical interconnection columns and the second vertical interconnection columns on each side line of the frame structure are linearly spaced and arranged linearly;

[0007] A plurality of interconnection bases corresponding to the positions of the first vertical interconnection columns are fixedly installed on the second substrate. The interconnection bases are cylindrical structures and their inner diameters are the same as the outer diameters of the first vertical interconnection columns. After installation, the first vertical interconnection columns extend into the corresponding interconnection bases and the second vertical interconnection columns contact the second substrate. A connection groove is provided on the surface of the second vertical interconnection column contacting the second substrate. Conductive silver glue is provided at multiple locations in the interconnection bases. An extrusion assembly is provided in the interconnection bases to push the conductive silver glue into the connection grooves. The extrusion assembly is driven by the first vertical interconnection column. The first vertical interconnection column and the second vertical interconnection column are both connected to the second substrate through the conductive silver glue.

[0008] Further technical solution: A plurality of groups of positioning posts distributed at intervals are fixedly mounted on the first substrate, and positioning holes for the positioning posts to pass through are opened at positions corresponding to the positioning posts on the second substrate.

[0009] Further technical solution: A plurality of groups of bare chips are fixedly installed in the frame area surrounded by the first vertical interconnection column and the second vertical interconnection column on the first substrate, and a plurality of bare chip PADs are arranged on the upper surface of the bare chips. The bare chip PADs on different bare chips are connected through three-dimensional interconnection micro-columns, and the bare chip PADs are connected to the first substrate through the three-dimensional interconnection micro-columns and bonding fingers.

[0010] Further technical solution: a limiting plate with an annular structure is fixedly installed in the interconnection base, the limiting plate and the interconnection base are coaxially arranged and a second sealing metal foil is fixedly installed on the limiting plate, the second sealing metal foil closes the limiting plate, the area surrounded by the interconnection base, the second sealing metal foil, the limiting plate and the second substrate is filled with conductive silver glue, the end of the first vertical interconnection column is a conical structure and it pierces the second sealing metal foil when it extends into the interconnection base.

[0011] Further technical solution: two groups of symmetrically arranged cavities are opened on the inner wall of the interconnection base, the cavity is connected to a material guide groove with an L-shaped structure, the cavity and the material guide groove are filled with conductive silver glue, a positioning groove is opened and closed on the bottom surface of the connecting groove, the vertical section of the material guide groove extends into the positioning groove, one side surface of the material guide groove is in sliding contact with the inner wall of the positioning groove, a gap is set between the material guide groove and the inner wall of the positioning groove, a first sealing metal foil is set at the end of the material guide groove, and a first vertical interconnection column extends into the interconnection base to push the conductive silver glue in the cavity into the connecting groove.

[0012] Further technical solution: a clamping groove is provided on the side wall of the connecting groove, the material guide groove is located in the clamping groove, and the outer side surface of the material guide groove is in sliding contact with the inner wall of the clamping groove.

[0013] Further technical solution: The extrusion assembly includes grooves, which are provided in two groups and are opened on the inner wall of the interconnected base. The two groups of grooves are distributed corresponding to the cavity. A push plate is slidably installed in the cavity, and a push rod extending into the groove is fixedly installed on the push plate. A lifting frame is fixedly installed at one end of the two groups of push rods located in the groove, and the lifting frame is provided with an annular structure sleeved on the first vertical interconnected column.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. By pre-arranging the conductive silver glue in the interconnection base, the conductive silver glue can be automatically filled into the connection between the second vertical interconnection column and the second substrate when the second substrate is subsequently installed, so there is no need to fill the conductive silver glue into the connection position after the second vertical interconnection column, the first vertical interconnection column and the second substrate are connected, which reduces the process of connecting the second substrate with the first substrate, realizes the rapid connection of the second vertical interconnection column, the first vertical interconnection column and the second part, improves the installation speed of the second substrate and the first substrate, and reduces the installation difficulty of the second substrate.

[0016] 2. The prefabricated conductive silver glue can fully fill the connection between the second vertical interconnection column, the first vertical interconnection column and the second substrate with the conductive silver glue, thereby improving the stability of the connection between the second vertical interconnection column, the first vertical interconnection column and the second substrate.

[0017] 3. By pairing a group of first vertical interconnection columns with two groups of second vertical interconnection columns, and the three only need to be connected to the same group of interconnection bases, the number of interconnection bases on the second substrate is greatly reduced, avoiding the volume of the interconnection base affecting the distribution between the first vertical interconnection columns and the second vertical interconnection columns, and can further reduce the gap between the first vertical interconnection columns and the second vertical interconnection columns, further improving the electromagnetic shielding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0019] Figure 2 It is a schematic diagram of the structure of the bare chip in the present invention.

[0020] Figure 3 It is a schematic structural diagram of the first vertical interconnection column and the interconnection base in the present invention.

[0021] Figure 4 It is a schematic cross-sectional structural diagram of the first vertical interconnection column and the interconnection base in the present invention.

[0022] Figure 5 for Figure 4 A magnified schematic diagram of the A1 region in the middle.

[0023] Figure 6 It is a schematic diagram of the structure of the first vertical interconnection column and the second vertical interconnection column in the present invention.

[0024] Figure 7 It is a schematic diagram of the structure of the interconnection base in the present invention.

[0025] Figure 8 It is a schematic diagram of the cross-sectional structure of the top of the interconnection base in the present invention.

[0026] Fig. 9 A schematic cross-sectional view of the interconnection base in the present invention.

[0027] In the accompanying drawings: 1. first substrate; 2. second substrate; 3. positioning column; 4. positioning hole; 5. first vertical interconnection column; 6. second vertical interconnection column; 7. interconnection base; 8. cavity; 9. push plate; 10. material guide groove; 11. first sealing metal foil; 12. groove; 13. ejector pin; 14. lifting frame; 15. limit plate; 16. second sealing metal foil; 17. connecting groove; 18. card slot; 19. positioning groove; 20. bare chip; 21. bare chip PAD; 22. three-dimensional interconnection micro-column; 23. bonding finger; 24. extrusion assembly. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0029] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0030] like Figure 1-Figure 9 As shown, an electromagnetic shielding three-dimensional interconnection structure convenient for connection for a radio frequency microsystem provided by the present invention comprises a first substrate 1 and a second substrate 2, the first substrate 1 and the second substrate 2 are arranged in parallel and separated by a preset interval, a plurality of groups of spaced positioning posts 3 are fixedly mounted on the first substrate 1, and positioning holes 4 for the positioning posts 3 to pass through are opened at positions corresponding to the positioning posts 3 on the second substrate 2;

[0031] A plurality of groups of first vertical interconnecting pillars 5 and second vertical interconnecting pillars 6 are fixedly mounted on the first substrate 1, each group of first vertical interconnecting pillars 5 is paired with two groups of second vertical interconnecting pillars 6, the second vertical interconnecting pillars 6 are symmetrically distributed on both sides of the first vertical interconnecting pillars 5, and the plurality of groups of first vertical interconnecting pillars 5 and second vertical interconnecting pillars 6 are arranged in a concentrically distributed frame structure, and the first vertical interconnecting pillars 5 and the second vertical interconnecting pillars 6 on each side line of the frame structure are linearly spaced and arranged linearly;

[0032] A plurality of interconnection bases 7 corresponding to the positions of the first vertical interconnection columns 5 are fixedly installed on the second substrate 2. The interconnection base 7 is a cylindrical structure and its inner diameter is the same as the outer diameter of the first vertical interconnection column 5. After installation, the first vertical interconnection column 5 extends into the corresponding interconnection base 7 and the second vertical interconnection column 6 contacts the second substrate 2. A connection groove 17 is provided on the surface of the second vertical interconnection column 6 in contact with the second substrate 2. Conductive silver glue is provided at multiple locations in the interconnection base 7. An extrusion assembly 24 is provided in the interconnection base 7 to push the conductive silver glue into the connection groove 17. The extrusion assembly 24 is driven by the first vertical interconnection column 5. The first vertical interconnection column 5 and the second vertical interconnection column 6 are both connected to the second substrate 2 through the conductive silver glue.

[0033] In actual application of this embodiment, a three-dimensional interconnection structure is installed in a frame structure formed by the first vertical interconnection column 5 and the second vertical interconnection column 6 on the first substrate 1, and then the second substrate 2 is aligned with the first substrate 1 and installed through the positioning column 3. After the second substrate 2 is installed, the first vertical interconnection column 5 extends into the corresponding interconnection base 7 and is connected to the second substrate 2 through a conductive silver glue in the interconnection base 7. At the same time, when the second substrate 2 is close to the first substrate 1, the first vertical interconnection column 5 drives the extrusion component 24, and the conductive silver glue at another location in the interconnection base 7 is squeezed and transported to the connection groove 17 through the extrusion component 24, so that the second vertical interconnection column 6 can be connected to the second substrate 2 through the conductive silver glue. The conductive silver glue can be cured later. The radio frequency signal is transmitted through the first vertical interconnection column 5 and the second vertical interconnection column 6 that form the internal frame structure, and the first vertical interconnection column 5 and the second vertical interconnection column 6 that form the external frame structure are used to transmit the ground signal. Since the gap between the first vertical interconnection column 5 and the second vertical interconnection column 6 is small, the internal radio frequency signal is difficult to propagate out of the gap, thereby forming electromagnetic shielding;

[0034] By pre-arranging the conductive silver glue in the interconnection base 7, the conductive silver glue can be automatically filled into the connection between the second vertical interconnection column 6 and the second substrate 2 when the second substrate 2 is subsequently installed, so that it is not necessary to fill the conductive silver glue into the connection position after the second vertical interconnection column 6 and the first vertical interconnection column 5 are connected to the second substrate 2, thereby reducing the process of connecting the second substrate 2 with the first substrate 1, realizing the rapid connection between the second vertical interconnection column 6 and the first vertical interconnection column 5 and the second substrate 2, improving the installation speed of the second substrate 2 and the first substrate 1, and reducing the installation difficulty of the second substrate 2;

[0035] The prefabricated conductive silver glue can fully fill the connection between the second vertical interconnection column 6, the first vertical interconnection column 5 and the second substrate 2 with the conductive silver glue, thereby improving the stability of the connection between the second vertical interconnection column 6, the first vertical interconnection column 5 and the second substrate 2;

[0036] By pairing a group of first vertical interconnection columns 5 with two groups of second vertical interconnection columns 6, and the three only need to be connected to the same group of interconnection bases 7, the number of interconnection bases 7 on the second substrate 2 is greatly reduced, avoiding the volume of the interconnection base 7 affecting the distribution between the first vertical interconnection columns 5 and the second vertical interconnection columns 6, and being able to further reduce the gap between the first vertical interconnection columns 5 and the second vertical interconnection columns 6, thereby further improving the electromagnetic shielding effect.

[0037] like Figure 2 As shown, an electromagnetic shielding three-dimensional interconnection structure with convenient connection for a radio frequency microsystem provided by the present invention, a plurality of groups of bare chips 20 are fixedly installed in a frame-shaped area surrounded by a first vertical interconnection column 5 and a second vertical interconnection column 6 on a first substrate 1, and a plurality of bare chip PAD21 are arranged on the upper surface of the bare chip 20, and the bare chip PAD21 on different bare chips 20 are connected through a three-dimensional interconnection microcolumn 22, and the bare chip PAD21 is connected to the first substrate 1 through the three-dimensional interconnection microcolumn 22 and the bonding finger 23.

[0038] In actual application of this embodiment, multiple groups of bare chips 20 are fixedly installed in the frame area surrounded by the first vertical interconnection column 5 and the second vertical interconnection column 6, and the bare chips PAD21 are connected by the three-dimensional interconnection micro-columns 22, and the bare chip PAD21 and the first substrate 1 are connected by the three-dimensional interconnection micro-columns 22 and the bonding fingers 23, so that multi-level bonding can be achieved in a limited space, realizing three-dimensional interconnection in any space.

[0039] like Figure 4-Figure 9 As shown, an electromagnetic shielding three-dimensional interconnection structure that is easy to connect for a radio frequency microsystem provided by the present invention, a limiting plate 15 with an annular structure is fixedly installed in the interconnection base 7, the limiting plate 15 is coaxially arranged with the interconnection base 7 and a second sealing metal foil 16 is fixedly installed on the limiting plate 15, the second sealing metal foil 16 closes the limiting plate 15, the area surrounded by the interconnection base 7, the second sealing metal foil 16, the limiting plate 15 and the second substrate 2 is filled with conductive silver glue, the end of the first vertical interconnection column 5 is a conical structure and it pierces the second sealing metal foil 16 when it extends into the interconnection base 7.

[0040] Specifically, two groups of symmetrically arranged cavities 8 are opened on the inner wall of the interconnection base 7, and the cavity 8 is connected to the material guide groove 10 with an L-shaped structure. The cavity 8 and the material guide groove 10 are filled with conductive silver glue. A positioning groove 19 is opened and closed on the bottom surface of the connecting groove 17. The vertical section of the material guide groove 10 extends into the positioning groove 19. One side surface of the material guide groove 10 is in sliding contact with the inner wall of the positioning groove 19. A gap is set between the material guide groove 10 and the inner wall of the positioning groove 19. A first sealing metal foil 11 is set at the end of the material guide groove 10. The first vertical interconnection column 5 extends into the interconnection base 7 to push the conductive silver glue in the cavity 8 into the connecting groove 17.

[0041] Specifically, a clamping groove 18 is formed on the side wall of the connecting groove 17 , and the material guiding groove 10 is located in the clamping groove 18 , and the outer side surface of the material guiding groove 10 is in sliding contact with the inner wall of the clamping groove 18 .

[0042] Specifically, the extrusion assembly 24 includes grooves 12, and two groups of grooves 12 are provided and opened on the inner wall of the interconnection base 7. The two groups of grooves 12 are distributed corresponding to the cavity 8. A push plate 9 is slidably installed in the cavity 8, and a push rod 13 extending into the groove 12 is fixedly installed on the push plate 9. A lifting frame 14 is fixedly installed at one end of the two groups of push rods 13 located in the groove 12, and the lifting frame 14 is provided with an annular structure sleeved on the first vertical interconnection column 5.

[0043] In actual application of this embodiment, when the second substrate 2 moves toward the first substrate 1, it is positioned by the positioning pillars 3, and at the same time, the first vertical interconnection pillars 5 and the interconnection base 7 can also be positioned, thereby improving the positioning accuracy when the first substrate 1 is connected to the second substrate 2;

[0044] After the first vertical interconnection column 5 enters the interconnection base 7, the vertical section of the guide groove 10 enters the positioning groove 19. Since the surface of one side of the guide groove 10 is in sliding contact with the inner wall of the positioning groove 19, the position of the second substrate 2 can be further positioned through the guide groove 10 and the positioning groove 19, further improving the positioning accuracy when the first substrate 1 and the second substrate 2 are connected. After the upper end of the first vertical interconnection column 5 enters the interconnection base 7, it will pass through the annular structure of the lifting frame 14. After that, when the second substrate 2 continues to approach the first substrate 1, the tip of the first vertical interconnection column 5 will pierce the second sealing metal foil 16. At this time, the second sealing metal foil 16 will be attached to the surface of the first vertical interconnection column 5, and the conductive silver glue is in a viscous state, so the conductive silver glue will not flow downward;

[0045] When the first vertical interconnection column 5 contacts the end of the lifting frame 14, it will push the lifting frame 14 to move in the direction close to the second substrate 2. The lifting frame 14 drives the push plate 9 to move through the push rod 13. The push plate 9 pushes the conductive silver glue above it to flow. Since the cavity 8 and the guide groove 10 are full of conductive silver glue, the conductive silver glue will squeeze the first sealing metal foil 11 so that the first sealing metal foil 11 is separated from the end of the guide groove 10. At this time, the conductive silver glue in the guide groove 10 can enter the positioning groove 19. As the push plate 9 continues to move, the conductive silver glue in the cavity 8 is pushed to continue to enter the positioning groove 19. The conductive silver glue in the positioning groove 19 will move upward and fill the connecting groove 17. The second substrate 2 reaches the set position after contacting the second vertical interconnection column 6. At this time, the connecting groove 17 The conductive silver glue is filled inside, and then the conductive silver glue is solidified. The second vertical interconnection column 6 and the first vertical interconnection column 5 can be connected to the second substrate 2 through the conductive silver glue. By pre-arranging the conductive silver glue in the interconnection base 7, the conductive silver glue can be automatically filled into the connection between the second vertical interconnection column 6 and the second substrate 2 when the second substrate 2 is installed later. Therefore, there is no need to fill the conductive silver glue into the connection position after the second vertical interconnection column 6 and the first vertical interconnection column 5 are connected to the second substrate 2, which reduces the difficulty of installing the second substrate 2 and improves the stability of the connection between the second vertical interconnection column 6 and the first vertical interconnection column 5 and the second substrate 2, realizes the rapid connection between the second vertical interconnection column 6 and the first vertical interconnection column 5 and the second substrate 2, and improves the installation speed of the second substrate 2 and the first substrate 1.

[0046] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0047] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An electromagnetic shielding three-dimensional interconnection structure for a radio frequency microsystem that is convenient to connect, comprising a first substrate (1) and a second substrate (2), characterized in that: The first substrate (1) and the second substrate (2) are arranged in parallel and separated by a preset distance; A plurality of groups of first vertical interconnecting columns (5) and second vertical interconnecting columns (6) are fixedly mounted on the first substrate (1), each group of first vertical interconnecting columns (5) is paired with two groups of second vertical interconnecting columns (6), the second vertical interconnecting columns (6) are symmetrically distributed on both sides of the first vertical interconnecting columns (5), and the plurality of groups of the first vertical interconnecting columns (5) and the second vertical interconnecting columns (6) are arranged in a concentrically distributed frame-type structure, and the first vertical interconnecting columns (5) and the second vertical interconnecting columns (6) on each side line of the frame-type structure are arranged linearly and spaced apart from each other; A plurality of interconnection bases (7) corresponding to the positions of the first vertical interconnection pillars (5) are fixedly mounted on the second substrate (2); the interconnection bases (7) are cylindrical structures and their inner diameters are the same as the outer diameters of the first vertical interconnection pillars (5); after installation, the first vertical interconnection pillars (5) extend into the corresponding interconnection bases (7) and the second vertical interconnection pillars (6) are in contact with the second substrate (2); a connection groove (17) is provided on the surface of the second vertical interconnection pillars (6) in contact with the second substrate (2); conductive silver glue is provided at a plurality of locations in the interconnection bases (7); an extrusion assembly (24) is provided in the interconnection bases (7) for pushing the conductive silver glue into the connection grooves (17); the extrusion assembly (24) is driven by the first vertical interconnection pillars (5); the first vertical interconnection pillars (5) and the second vertical interconnection pillars (6) are both connected to the second substrate (2) via the conductive silver glue; The inner wall of the interconnection base (7) is provided with two groups of symmetrically arranged cavities (8), the cavities (8) are connected with a material guide groove (10) of an L-shaped structure, the cavities (8) and the material guide groove (10) are both filled with conductive silver glue, the inner bottom surface of the connection groove (17) is provided with a positioning groove (19), the vertical section of the material guide groove (10) extends into the positioning groove (19), the surface of one side of the material guide groove (10) is in sliding contact with the inner wall of the positioning groove (19), a gap is provided between the material guide groove (10) and the inner wall of the positioning groove (19), a first sealing metal foil (11) is provided at the end of the material guide groove (10), and a first vertical interconnection column (5) extends into the interconnection base (7) to push the conductive silver glue in the cavity (8) into the connection groove (17); A clamping groove (18) is provided on the side wall of the connecting groove (17), the material guide groove (10) is located in the clamping groove (18), and the outer side surface of the material guide groove (10) is in sliding contact with the inner wall of the clamping groove (18); The extrusion assembly (24) comprises grooves (12), two groups of grooves (12) are provided and are opened on the inner wall of the interconnection base (7), the two groups of grooves (12) are distributed corresponding to the cavity (8), a push plate (9) is slidably installed in the cavity (8), a push rod (13) extending into the groove (12) is fixedly installed on the push plate (9), a lifting frame (14) is fixedly installed at one end of the two groups of push rods (13) located in the groove (12), and the lifting frame (14) is provided with a ring structure sleeved on the first vertical interconnection column (5).

2. The electromagnetic shielding three-dimensional interconnection structure for convenient connection of a radio frequency microsystem according to claim 1, characterized in that: A plurality of groups of spaced-apart positioning posts (3) are fixedly mounted on the first substrate (1), and positioning holes (4) for the positioning posts (3) to pass through are provided at positions corresponding to the positioning posts (3) on the second substrate (2).

3. The electromagnetic shielding three-dimensional interconnection structure for convenient connection of a radio frequency microsystem according to claim 1, characterized in that: A plurality of groups of bare chips (20) are fixedly mounted in a frame-shaped area enclosed by first vertical interconnection pillars (5) and second vertical interconnection pillars (6) on the first substrate (1); a plurality of bare chip PADs (21) are arranged on the upper surfaces of the bare chips (20); the bare chip PADs (21) on different bare chips (20) are connected via three-dimensional interconnection micro-pillars (22); and the bare chip PADs (21) are connected to the first substrate (1) via the three-dimensional interconnection micro-pillars (22) and bonding fingers (23).

4. The electromagnetic shielding three-dimensional interconnection structure for convenient connection of a radio frequency microsystem according to claim 1, characterized in that: A limiting plate (15) of an annular structure is fixedly installed in the interconnection base (7), the limiting plate (15) and the interconnection base (7) are coaxially arranged and a second sealing metal foil (16) is fixedly installed on the limiting plate (15), the second sealing metal foil (16) seals the limiting plate (15), the area surrounded by the interconnection base (7), the second sealing metal foil (16), the limiting plate (15) and the second substrate (2) is filled with conductive silver glue, and the end of the first vertical interconnection column (5) is a conical structure and pierces the second sealing metal foil (16) when it extends into the interconnection base (7).

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