Method for reducing damage of thick copper plate processing to drill bit in circuit board processing technology
By adding a hole ring at the PTH hole of the thick copper PCB board and opening negative copper points, the area of cutting between the drill nozzle and the metal copper surface is reduced, the damage problem of thick copper plate processing on the drill nozzle is solved, the life of the drill nozzle is extended, and the hole wall roughness and operation safety are improved.
Patent Information
- Application Number
- CN202311270421.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-09-28
- Publication Date
- 2025-03-28
AI Technical Summary
During processing, the drill nozzle and the metal copper surface are cut from each other, causing extremely high temperatures to damage the drill nozzle, shortening its life, and easy to pull out the copper wire, resulting in larger hole diameters and rough hole walls, making it difficult to meet customer requirements.
During engineering design, the PTH holes larger than 1.5MM were identified separately using Genesis 2000 software, and the hole ring was enlarged in the inner layer of the thick copper PCB board to form a hole ring with a single side of 0.4MM larger than the PTH hole. A negative copper dot with a single side of 0.15MM smaller than the PTH hole was opened in the inner copper skin of the hole ring or the PTH hole was located, and finally the PTH hole was drilled out using a drill nozzle.
By reducing the area of cutting between the drill tip and the metal copper surface, the life of the drill tip is extended, and it is restored to 2,000 drills to replace it once, reducing the problem of copper wire pulling, the hole wall roughness returns to normal, and the frequency of handling copper wires by operators is reduced by 80% to 90%, and minor damage caused by handling copper wires is eliminated.
Smart Images
Figure CN119730029A_ABST
Abstract
Description
Technical Field
[0001] The invention belongs to the technical field of PCB manufacturing, and in particular relates to a method for reducing the damage of a drill bit caused by thick copper plate processing in a circuit board processing technology. Background Art
[0002] Thick copper PCB board, because of its thick copper thickness, when processing, the drill bit drills on the thick copper surface, the metal cuts each other, which will generate extremely high temperature and cause great damage to the drill bit. Generally, the following problems will occur: 1. The life of the drill bit is greatly reduced, from 2,000 drill times to 1,800 drill times, or even lower, and the life is reduced by 10%~15%; 2. For PTH large holes larger than 1.5MM, copper wire is easily pulled out. The copper wire is wrapped around the drill bit, resulting in a larger hole diameter and a hole wall roughness that is difficult to meet customer requirements; 3. Operators need to handle copper wire frequently, which reduces efficiency. When handling copper wire, it is easy to scratch fingers and cause minor injuries due to the sharpness of the pulled copper wire. Summary of the invention
[0003] The object of the present invention is to provide a method for reducing the damage to a drill bit caused by processing a thick copper plate in a circuit board processing process, so as to solve the problems raised in the above-mentioned background technology.
[0004] To achieve the above object, the present invention provides the following technical solution: a method for reducing the damage to the drill bit caused by thick copper plate processing in a circuit board processing process, comprising the following steps: Step 1: During engineering design, use the Genesis 2000 software to identify PTH holes larger than 1.5MM separately; Step 2: When making the inner layer of the thick copper PCB board, enlarge the hole ring corresponding to the PTH hole to be larger than the PTH hole by more than 0.4MM on one side; Step 3: In the center of the hole ring, or in the copper sheet where the PTH hole is located, a negative copper point with a single side smaller than the PTH hole by 0.15MM is opened; Step 4: Drill the PTH hole using a drill bit.
[0005] Preferably, the hole ring is circular or polygonal in shape.
[0006] Preferably, the negative copper dots are through holes.
[0007] The technical effects and advantages of the present invention are as follows: the present invention identifies in advance the holes larger than the PTH holes on the thick copper plate PCB, and forms the negative copper points by etching before drilling, thereby reducing the area of mutual cutting between the drill bit and the metal copper surface, restoring the life of the drill bit to normal, reaching 2000 drilling times before replacing the drill bit, greatly reducing the problem of copper wire pulling, returning the roughness of the hole wall to normal, reducing the frequency of copper wire handling by operators by 80% to 90%, and almost eliminating the problem of minor injuries caused by scratching fingers. BRIEF DESCRIPTION OF THE DRAWINGS
[0008] Figure 1 It is a schematic diagram of the present invention; In the picture: 100 negative copper dots, 200pth holes, 300 hole rings. Implementation
[0009] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0010] The present invention provides Figure 1 A method for reducing damage to a drill bit during thick copper plate processing in a circuit board processing process is shown, comprising the following steps: Step 1: During engineering design, use the software Genesis 2000 to identify the PTH holes 200 larger than 1.5MM separately; Step 2: When making the inner layer of the thick copper PCB board, the hole ring 300 corresponding to the PTH hole 200 is enlarged to be larger than the PTH hole 200 by more than 0.4MM on one side; Step 3: In the center of the hole ring 300, or in the copper sheet where the PTH hole 200 is located, a negative copper point 100 is cut, which is 0.15MM smaller than the PTH hole 200 on one side; Step 4: Drill the PTH hole 200 using a drill bit.
[0011] Specifically, the hole ring 300 is circular or polygonal in shape.
[0012] Specifically, it is characterized in that: the negative copper point 100 is a through hole.
[0013] Working principle: When working, Genesis 2000 can be used to screen out PTH holes 200 with an aperture greater than 1.5MM, and then the corresponding hole ring 300 can be enlarged to be larger than the PTH hole 200 by more than 0.4MM on one side. This can ensure that when drilling, the adhesion between the surrounding copper sheet and the substrate is sufficient and the copper wire will not be pulled out. Then, in the copper sheet where the PTH hole 200 is located, etching is used to etch a negative copper point 100 that is 0.15MM smaller than the PTH hole 200 on one side through the solution. This negative copper point 100 is a through hole. After the through hole is obtained, when drilling again, the resistance to the drill bit will be reduced, making it easier to cut and the life of the drill bit will be extended.
[0014] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A method for reducing the damage to a drill bit caused by processing thick copper plates in a circuit board processing process, characterized in that: The following steps are involved: Step 1: During engineering design, use the Genesis 2000 software to identify PTH holes (200) larger than 1.5MM separately; Step 2: When manufacturing the inner layer of the thick copper PCB board, the hole ring (300) corresponding to the PTH hole (200) is enlarged to be larger than the PTH hole (200) by more than 0.4MM on one side; Step 3: In the center of the hole ring (300), or in the copper sheet where the PTH hole (200) is located, a negative copper point (100) is cut, which is 0.15MM smaller than the PTH hole (200); Step 4: Drill the PTH hole (200) using a drill bit.
2. The method for reducing damage to drill bit caused by thick copper plate processing in a circuit board processing process according to claim 1, characterized in that: The hole ring (300) is circular or polygonal in shape.
3. The method for reducing damage to drill bit caused by thick copper plate processing in a circuit board processing process according to claim 1, characterized in that: The negative copper point (100) is a through hole.