PCB circuit manufacturing method and equipment

Abstract

The invention relates to a PCB circuit manufacturing method and equipment, and the method comprises the steps: enabling an etching and film-removing device, a positioning device, an AOI device and a code burning device to be connected through a logistics transmission line, carrying out the positioning of a PCB through a connection positioning step before AOI detection, achieving the collinear production of an inner-layer circuit or an outer-layer circuit and AOI, and enabling the production efficiency to be improved. And the production efficiency of the PCB is greatly improved. Meanwhile, by improving the positioning device and the AOI device, the accuracy and the detection efficiency of AOI image recognition are further improved. Compared with the prior art, the production efficiency is greatly improved, and the production cost is greatly reduced.

Description

Technical Field

[0001] The embodiments of the present invention relate to the technical field of PCB manufacturing, and in particular to a method and equipment for manufacturing a PCB board circuit. Background Art

[0002] Traditional AOI has insufficient detection capabilities, many problems such as false points, and slow production efficiency. The production capacity of an etching line requires about 6 AOI machines to complete. After etching, it is connected to the AOI. The AOI detection technology cannot achieve this speed. With the continuous iteration and upgrading of AOI devices, and the ability to scan horizontal lines up and down at the same time, production efficiency has been greatly improved. At present, AOI inspection technology can already match the technical requirements of etching connection.

[0003] Traditional AOI is designed as a single machine. When testing a board, the board is placed on the table and can only be tested on one side. After the test is completed, the second side is tested. The etching line is a horizontal line device, which requires simultaneous measurement of the upper and lower sides. The production efficiency is low and the labor cost is low. Summary of the invention

[0004] In view of the above problems, the embodiments of the present invention provide a PCB circuit manufacturing method and equipment to solve the problems of low production efficiency and low labor cost in the prior art that the traditional AOI is designed as a single machine, and when testing the board, the board is placed on the table and can only be tested on one side, and the second side is tested after the test is completed, while the etching line is a horizontal line device, and the upper and lower sides need to be measured at the same time.

[0005] According to one aspect of an embodiment of the present invention, a method for manufacturing a PCB circuit is provided, the method comprising: Etching and film removal: etching the copper layer of the PCB board with inner or outer circuits completed by the etching device, and removing the photosensitive film of the PCB board by the film removal device; Connecting and positioning, positioning the PCB board by means of a positioning device; AOI scanning, collecting the upper surface image and the lower surface image of the PCB board simultaneously through the AOI device to generate the inspection result; Burning code, according to the detection result, coding is performed on the PCB board by a burning code device; Wherein, the etching and film removal device, the positioning device, the AOI device and the burning code device are connected through a logistics transmission line.

[0006] In some optional embodiments, etching the copper layer by the etching device specifically includes: The PCB board is immersed in an etching solution, and the exposed copper layer of the PCB board is etched away by the etching solution, wherein the etching solution is any one of an acidic cupric chloride etching solution, an alkaline cupric chloride etching solution and a ferric chloride etching solution.

[0007] In some optional embodiments, the PCB board is subjected to a photosensitive film removal process by the film removal device, specifically comprising: The etched PCB board is immersed in a stripping solution, and the stripping solution is continuously stirred during the stripping process, so that the dry film of the PCB board is completely removed; wherein the stripping solution is an inorganic alkaline stripping solution or an organic alkaline stripping solution.

[0008] In some optional embodiments, after the etching and removing the film and before the connection and positioning, the method further includes: The PCB board is rinsed with clean water to remove impurities on the PCB board.

[0009] In some optional embodiments, the PCB board with the inner layer circuit completed is processed before etching and removing the film, and before etching and removing the film, it also includes: Pre-treatment: cleaning the cut PCB boards; Lamination: applying a dry film or a wet film to the cleaned and roughened copper surface; Exposure: Use an exposure device to expose the PCB board and transfer the inner layer circuit pattern on the exposure data to a dry film or wet film; Development: put the exposed PCB board into the developer to remove the unexposed dry film or wet film, leaving the exposed part to form a circuit pattern; Wherein, the pre-treatment, lamination, exposure and development are carried out in the logistics transmission line.

[0010] In some optional embodiments, the PCB board with the outer layer circuit completed is processed before etching and removing the film, and before etching and removing the film, it also includes: Pre-treatment: cleaning the cut PCB boards; Lamination: applying a dry film on the cleaned and roughened copper surface; Exposure: Use an exposure device to expose the PCB board and transfer the outer layer circuit pattern on the exposure data to a dry film or a wet film; Development: Develop the exposed PCB board to remove the unexposed dry film and leave the exposed part to form a circuit pattern; Wherein, the pre-treatment, lamination, exposure and development are carried out in the logistics transmission line.

[0011] In some optional embodiments, in the connection positioning, the positioning is completed by aligning one side of the PCB board with the positioning line.

[0012] In some optional embodiments, in the burning code, the burning code device is arranged on a side of the logistics transmission line adjacent to the positioning line, and the burning code specifically includes: For the PCB boards of the current batch, when burning the first PCB board, the position of the burning code mark of the PCB board is detected to see if it is at the preset position. If so, no adjustment is made. Otherwise, the burning terminal position of the burning device is adjusted according to the distance between the burning code mark and the preset position.

[0013] According to another aspect of an embodiment of the present invention, a PCB circuit manufacturing device is provided, the device comprising: Etching device, used for etching the copper layer of the PCB board with completed inner layer circuit or outer layer circuit; Film removal device, used to remove the photosensitive film from the PCB board; A positioning device, used for positioning the PCB board; An AOI device is used to collect image information of the PCB board and generate a detection result; A coding device, used for coding the PCB board according to the detection result; And a logistics transmission line is used to connect the etching device, the film removal device, the positioning device, the AOI device and the AOI device.

[0014] In some optional embodiments, the positioning device includes a first positioning plate and a second positioning plate, the first positioning plate and the second positioning plate are located on both sides of the logistics transmission line, and the first positioning plate is driven by a driving motor to move along the direction of the second positioning plate, so that the PCB board is fixed at the position of the second positioning plate, wherein the second positioning plate is a positioning line; The AOI device comprises a first camera assembly, a second camera assembly, a first light source assembly, and a second light source assembly, wherein the first camera assembly and the first light source assembly are arranged above the logistics transmission line, and the second camera assembly and the second light source assembly are arranged below the logistics transmission line; when the PCB board is placed flat and enters the AOI scanning area, the upper surface image of the PCB board is collected by the first camera assembly, and the lower surface image of the PCB board is collected by the second camera assembly; the first camera assembly and the second camera assembly are connected to a detection host, and the detection host detects the upper surface image and the lower surface image to generate a detection result; The burning code device is provided with a burning terminal on one side adjacent to the logistics transmission line and the positioning line, and the burning code device is provided with a burning terminal adjacent to the PCB.

[0015] The invention discloses a PCB circuit manufacturing method and device, and has the following beneficial effects: the invention comprises the following steps: etching and film removal, wherein the copper layer of the PCB board with the inner layer circuit or the outer layer circuit completed is etched by an etching device, and the photosensitive film of the PCB board is removed by a film removal device; connection and positioning, wherein the PCB board is positioned by a positioning device; AOI scanning, wherein the upper surface image and the lower surface image of the PCB board are collected by the AOI device at the same time to generate a detection result; and coding, wherein the coding is performed on the PCB board by a coding burning device according to the detection result; wherein the etching and film removal device, the positioning device, the AOI device and the coding burning device are connected by a logistics transmission line.

[0016] Through the scheme of the present invention, the etching and film removal device, the positioning device, the AOI device and the burning code device are connected through the logistics transmission line, and the PCB board is positioned through the connection and positioning step before the AOI detection, so that the inner layer circuit or the outer layer circuit and the AOI are produced on the same line, which greatly increases the production efficiency of the PCB board. At the same time, the present application further improves the accuracy and detection efficiency of AOI image recognition by improving the positioning device and the AOI device. Compared with the prior art, the production efficiency is greatly improved and the production cost is greatly reduced.

[0017] The above description is only an overview of the technical solution of the embodiment of the present invention. In order to more clearly understand the technical means of the embodiment of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The accompanying drawings are only used to illustrate the embodiments and are not to be considered as limiting the present invention. In addition, the same reference symbols are used to represent the same components throughout the accompanying drawings. In the accompanying drawings: Figure 1 A schematic flow chart of a PCB circuit manufacturing method according to Embodiment 1 of the present invention is shown; Figure 2 A schematic structural diagram of a PCB circuit manufacturing device according to Embodiment 2 of the present invention is shown; Figure 3 A schematic structural diagram of a positioning device according to Embodiment 1 of the present invention is shown; Figure 4 The schematic diagram of the structure of the AOI device of Example 1 provided by the present invention is shown. DETAILED DESCRIPTION

[0019] Exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein.

[0020] Embodiment 1, See also Figure 1 According to one aspect of an embodiment of the present invention, a method for manufacturing a PCB circuit is provided, the method comprising: 110, etching and film removal, etching the copper layer of the PCB board with the inner layer circuit or the outer layer circuit completed by the etching device, and removing the photosensitive film of the PCB board by the film removal device; in step 110, etching the copper layer by the etching device specifically includes: immersing the PCB board in an etching solution, and etching away the exposed copper layer of the PCB board by the etching solution, wherein the etching solution is any one of an acidic copper chloride etching solution, an alkaline copper chloride etching solution and a ferric chloride etching solution. The photosensitive film is removed by the film removal device, specifically including: immersing the etched PCB board in a film stripping solution, and continuously stirring the film stripping solution during the film stripping process, so that the dry film of the PCB board is completely detached; wherein the film stripping solution is an inorganic alkaline film stripping solution or an organic alkaline film stripping solution.

[0021] 120, connection positioning, positioning the PCB board by a positioning device; in step 120, the positioning device includes a first positioning plate and a second positioning plate, the first positioning plate and the second positioning plate are located on both sides of the logistics transmission line, and the first positioning plate is driven by a driving motor to move along the direction of the second positioning plate, so that the PCB board is fixed at the position of the second positioning plate, wherein the second positioning plate is a positioning line. In the connection positioning, the positioning is completed by aligning one side of the PCB board with the positioning line.

[0022] 130, AOI scanning, the upper surface image and the lower surface image of the PCB board are collected simultaneously by the AOI device to generate a detection result; in step 130, the AOI device includes a first camera component, a second camera component, a first light source component, and a second light source component, the first camera component and the first light source component are arranged above the logistics transmission line, and the second camera component and the second light source component are located below the logistics transmission line; when the PCB board is placed flat and enters the AOI scanning area, the upper surface image of the PCB board is collected by the first camera component, and the lower surface image of the PCB board is collected by the second camera component; the first camera component and the second camera component are connected to the detection host and the detection host detects the upper surface image and the lower surface image to generate a detection result.

[0023] 140, burning code, according to the detection result, the code is printed on the PCB board by the burning code device; in step 140, during the burning code, the burning code device is set on the side adjacent to the logistics transmission line and the positioning line, and the burning code specifically includes: for the PCB boards of the current batch, when burning the code of the first PCB board, by detecting whether the position of the burning code mark of the PCB board is at the preset position, if so, no adjustment is made, otherwise, according to the distance between the burning code mark and the preset position, the burning terminal position of the burning code device is adjusted.

[0024] Among them, the etching and film removal device, the positioning device, the AOI device and the burning code device are connected through a logistics transmission line. Through the scheme of the present invention, the etching and film removal device, the positioning device, the AOI device and the burning code device are connected through a logistics transmission line, and the PCB board is positioned through the connection positioning step before the AOI detection, so that the inner layer circuit or the outer layer circuit and the AOI are produced on the same line, which greatly increases the production efficiency of the PCB board. At the same time, the present application further improves the accuracy and detection efficiency of AOI image recognition by improving the positioning device and the AOI device. Compared with the prior art, the production efficiency is greatly improved and the production cost is greatly reduced.

[0025] Embodiment 2: This embodiment further limits the embodiment 1. In this embodiment, the embodiment 1 can be applied to the inner layer circuit manufacturing as well as the outer layer circuit manufacturing.

[0026] In some optional embodiments, the PCB board with the inner layer circuit completed is processed after etching and film removal, and the inner layer circuit is manufactured by the following steps in the method: Pre-treatment: cleaning the cut PCB boards; Lamination: applying a dry film or a wet film to the cleaned and roughened copper surface; Exposure: Use an exposure device to expose the PCB board and transfer the inner layer circuit pattern on the exposure data to a dry film or wet film; Development: put the exposed PCB board into the developer to remove the unexposed dry film or wet film, leaving the exposed part to form a circuit pattern; Etching and film removal, etching the copper layer of the PCB board with the inner or outer circuits completed by an etching device, and removing the photosensitive film from the PCB board by a film removal device; wherein, the PCB board is immersed in an etching solution, and the exposed copper layer of the PCB board is etched away by the etching solution, wherein the etching solution is any one of an acidic copper chloride etching solution, an alkaline copper chloride etching solution, and a ferric chloride etching solution. The PCB board is subjected to a photosensitive film removal process by a film removal device, specifically including: immersing the etched PCB board in a film stripping solution, and continuously stirring the film stripping solution during the film stripping process, so that the dry film of the PCB board is completely detached; wherein the film stripping solution is an inorganic alkaline film stripping solution or an organic alkaline film stripping solution.

[0027] Connection positioning, positioning the PCB board through a positioning device; in the connection positioning, positioning is completed by aligning one side of the PCB board with the positioning line.

[0028] AOI scanning: The AOI device simultaneously collects the upper and lower surface images of the PCB board to generate the inspection results; Burning code, according to the detection result, the code is printed on the PCB board through the burning code device; in the burning code, the burning code device is set on the side adjacent to the logistics transmission line and the positioning line. The burning code specifically includes: for the current batch of PCB boards, when burning the first PCB board, by detecting whether the position of the burning code mark of the PCB board is at the preset position, if so, no adjustment is made, otherwise, according to the distance between the burning code mark and the preset position, the burning terminal position of the burning code device is adjusted.

[0029] Among them, the etching and film removal device, positioning device, AOI device and burning code device are connected through the logistics transmission line, and the pre-treatment, lamination, exposure and development are carried out in the logistics transmission line. The inner layer circuit production can be completed through the above, which greatly improves the production efficiency and greatly reduces the production cost compared with the existing technology.

[0030] In some optional embodiments, the PCB board with the outer layer circuit completed is processed after etching and film removal. The outer layer circuit is manufactured by the following steps in this method: Pre-treatment: cleaning of PCB board; Lamination: applying a dry film on the cleaned and roughened copper surface; Exposure: Use an exposure device to expose the PCB board and transfer the outer layer circuit pattern on the exposure data to a dry film or a wet film; Development: put the exposed PCB board into the developer to remove the unexposed dry film and leave the exposed part to form the circuit pattern; Etching and film removal, etching the copper layer of the PCB board with the inner or outer circuits completed by an etching device, and removing the photosensitive film from the PCB board by a film removal device; wherein, the PCB board is immersed in an etching solution, and the exposed copper layer of the PCB board is etched away by the etching solution, wherein the etching solution is any one of an acidic copper chloride etching solution, an alkaline copper chloride etching solution, and a ferric chloride etching solution. The PCB board is subjected to a photosensitive film removal process by a film removal device, specifically including: immersing the etched PCB board in a film stripping solution, and continuously stirring the film stripping solution during the film stripping process, so that the dry film of the PCB board is completely detached; wherein the film stripping solution is an inorganic alkaline film stripping solution or an organic alkaline film stripping solution.

[0031] Connection positioning, positioning the PCB board through a positioning device; in the connection positioning, positioning is completed by aligning one side of the PCB board with the positioning line.

[0032] AOI scanning: The AOI device simultaneously collects the upper and lower surface images of the PCB board to generate the inspection results; Burning code, according to the detection result, the code is printed on the PCB board through the burning code device; in the burning code, the burning code device is set on the side adjacent to the logistics transmission line and the positioning line. The burning code specifically includes: for the current batch of PCB boards, when burning the first PCB board, by detecting whether the position of the burning code mark of the PCB board is at the preset position, if so, no adjustment is made, otherwise, according to the distance between the burning code mark and the preset position, the burning terminal position of the burning code device is adjusted.

[0033] Among them, the etching and film removal device, positioning device, AOI device and burning code device are connected through the logistics transmission line, and the pre-treatment, lamination, exposure and development are carried out in the logistics transmission line. Through the above, the outer layer circuit can be made, which greatly improves the production efficiency and greatly reduces the production cost compared with the existing technology.

[0034] Embodiment 3: According to another aspect of the embodiment of the present invention, a PCB circuit manufacturing device is provided, and the PCB circuit manufacturing device 200 is used to perform the steps of embodiment 1 or embodiment 2 to manufacture a PCB board. The device includes: The etching and film removal device 210 is used to perform copper layer etching on the PCB board with completed inner layer circuits or outer layer circuits and to perform photosensitive film removal on the PCB board; A positioning device 220, used for positioning the PCB board; AOI device 230, used to collect image information of PCB board and generate inspection results; The coding device 240 is used to code the PCB board according to the detection result; And a logistics transmission line 250 is used to connect the etching device, the film removal device, the positioning device, the AOI device and the AOI device.

[0035] In some optional embodiments, the positioning device includes a first positioning plate 1 and a second positioning plate 2, the first positioning plate 1 and the second positioning plate 2 are located on both sides of the logistics transmission line 250, and the first positioning plate 1 is connected to the driving motor 3 and moves along the direction of the second positioning plate under the drive of the driving motor 3, so that the PCB board is fixed at the position of the second positioning plate, wherein the second positioning plate 2 is the positioning line 5; the other end of the second positioning plate 2 is connected to the fixing seat 4 for fixing.

[0036] The AOI device includes a first camera assembly 7, a second camera assembly 8, a first light source assembly 9, and a second light source assembly 10. The first camera assembly 8 and the first light source assembly 10 are arranged above the logistics transmission line, and the second camera assembly 7 and the second light source assembly 9 are arranged below the logistics transmission line. When the PCB board 6 is placed flat according to the positioning line 5 and enters the AOI scanning area, the upper surface image of the PCB board is collected by the first camera assembly, and the lower surface image of the PCB board is collected by the second camera assembly. The first camera assembly and the second camera assembly are connected to the detection host and the detection host detects the upper surface image and the lower surface image to generate the detection result. In the AOI device, the PCB enters the scanning area horizontally, and after the first light source assembly and the second light source assembly are lit, the upper surface image and the lower surface image of the PCB board are collected by the first camera assembly and the second camera assembly at the same time. The first camera assembly and the second camera assembly both have multiple cameras. After the PCB board is positioned by the positioning device, the detection accuracy of the AOI device is greatly improved.

[0037] The burning code device is provided with a burning terminal on one side adjacent to the logistics transmission line and the positioning line, and the burning terminal is provided adjacent to the PCB. The burning code device burns the first PCB board of the current batch of PCB boards by detecting whether the position of the burning code mark of the PCB board is at the preset position. If so, no adjustment is made. Otherwise, the position of the burning terminal of the burning code device is adjusted according to the distance between the burning code mark and the preset position.

[0038] The present invention comprises the following steps: etching and removing film, etching the copper layer of a PCB board with inner layer circuits or outer layer circuits through an etching device, and removing the photosensitive film of the PCB board through a film removing device; connection positioning, positioning the PCB board through a positioning device; AOI scanning, collecting the upper surface image and the lower surface image of the PCB board through the AOI device at the same time to generate a detection result; and burning code, coding the PCB board through a code burning device according to the detection result; wherein the film etching and removing device, the positioning device, the AOI device and the code burning device are connected through a logistics transmission line.

[0039] Through the scheme of the present invention, the etching and film removal device, the positioning device, the AOI device and the burning code device are connected through the logistics transmission line, and the PCB board is positioned through the connection and positioning step before the AOI detection, so that the inner layer circuit or the outer layer circuit and the AOI are produced on the same line, which greatly increases the production efficiency of the PCB board. At the same time, the present application further improves the accuracy and detection efficiency of AOI image recognition by improving the positioning device and the AOI device. Compared with the prior art, the production efficiency is greatly improved and the production cost is greatly reduced.

[0040] In the description provided herein, a large number of specific details are described. However, it is understood that embodiments of the present invention can be practiced without these specific details. Similarly, in order to simplify the present invention and help understand one or more of the various inventive aspects, in the above description of exemplary embodiments of the present invention, the various features of the embodiments of the present invention are sometimes grouped together into a single embodiment, figure, or description thereof. Wherein, the claims that follow the specific embodiment are hereby expressly incorporated into the specific embodiment, wherein each claim itself is a separate embodiment of the present invention.

[0041] Those skilled in the art will appreciate that the modules in the device in the embodiment may be adaptively changed and arranged in one or more devices different from the embodiment. The modules or units or components in the embodiment may be combined into one module or unit or component, and further may be divided into multiple submodules or subunits or subcomponents. Except that at least some of such features and / or processes or units are mutually exclusive.

[0042] It should be noted that the above embodiments illustrate the present invention rather than limit it, and that those skilled in the art may design alternative embodiments without departing from the scope of the appended claims. In the claims, any reference symbol between brackets shall not be construed as a limitation on the claims. The word "comprising" does not exclude the presence of elements or steps not listed in the claims. The word "one" or "an" preceding an element does not exclude the presence of multiple such elements. The present invention may be implemented with the aid of hardware comprising several different elements and with the aid of appropriately programmed computers. In a unit claim that lists several systems, several of these systems may be embodied by the same hardware item. The use of the words first, second, and third, etc. does not indicate any order. These words may be interpreted as names. The steps in the above embodiments, unless otherwise specified, should not be understood as limitations on the order of execution.

Claims

1. A PCB circuit manufacturing method, characterized in that: The method comprises: Etching and film removal: etching the copper layer of the PCB board with inner or outer circuits completed by the etching device, and removing the photosensitive film of the PCB board by the film removal device; Connecting and positioning, positioning the PCB board by means of a positioning device; AOI scanning, collecting the upper surface image and the lower surface image of the PCB board simultaneously through the AOI device to generate the inspection result; Burning code, according to the detection result, coding is performed on the PCB board by a burning code device; Wherein, the etching and film removal device, the positioning device, the AOI device and the burning code device are connected through a logistics transmission line.

2. The PCB circuit manufacturing method according to claim 1, characterized in that: Etching the copper layer by the etching device specifically includes: The PCB board is immersed in an etching solution, and the exposed copper layer of the PCB board is etched away by the etching solution, wherein the etching solution is any one of an acidic cupric chloride etching solution, an alkaline cupric chloride etching solution and a ferric chloride etching solution.

3. The PCB circuit manufacturing method according to claim 2, characterized in that: The PCB board is subjected to a photosensitive film removal process by the film removal device, which specifically includes: The etched PCB board is immersed in a stripping solution, and the stripping solution is continuously stirred during the stripping process, so that the dry film of the PCB board is completely removed; wherein the stripping solution is an inorganic alkaline stripping solution or an organic alkaline stripping solution.

4. The PCB circuit manufacturing method according to claim 3, characterized in that: After the etching and film removal, and before the connection and positioning, the method further comprises: The PCB board is rinsed with clean water to remove impurities on the PCB board.

5. The PCB circuit manufacturing method according to claim 3, characterized in that: The PCB board with the inner layer circuit is processed before etching and film removal. Before etching and film removal, it also includes: Pre-treatment: cleaning the cut PCB boards; Lamination: applying a dry film or a wet film to the cleaned and roughened copper surface; Exposure: Use an exposure device to expose the PCB board and transfer the inner layer circuit pattern on the exposure data to a dry film or wet film; Development: put the exposed PCB board into the developer to remove the unexposed dry film or wet film, leaving the exposed part to form a circuit pattern; Wherein, the pre-treatment, lamination, exposure and development are carried out in the logistics transmission line.

6. The PCB circuit manufacturing method according to claim 3, characterized in that: The PCB board with the outer layer circuit is processed before etching and film removal, and before etching and film removal, it also includes: Pre-treatment: cleaning the cut PCB boards; Lamination: applying a dry film on the cleaned and roughened copper surface; Exposure: Use an exposure device to expose the PCB board and transfer the outer layer circuit pattern on the exposure data to a dry film or a wet film; Development: Develop the exposed PCB board to remove the unexposed dry film and leave the exposed part to form a circuit pattern; Wherein, the pre-treatment, lamination, exposure and development are carried out in the logistics transmission line.

7. The PCB circuit manufacturing method according to claim 1, characterized in that: In the connection positioning, positioning is completed by aligning one side of the PCB board with the positioning line.

8. The method for manufacturing a printed circuit board with a packaging area according to claim 7, characterized in that: In the burning code, the burning code device is arranged on a side of the logistics transmission line adjacent to the positioning line, and the burning code specifically includes: For the PCB boards of the current batch, when burning the first PCB board, the position of the burning code mark of the PCB board is detected to see if it is at the preset position. If so, no adjustment is made. Otherwise, the burning terminal position of the burning device is adjusted according to the distance between the burning code mark and the preset position.

9. A PCB circuit manufacturing device, characterized in that: The device comprises: Etching device, used for etching the copper layer of the PCB board with completed inner layer circuit or outer layer circuit; Film removal device, used to remove the photosensitive film from the PCB board; A positioning device, used for positioning the PCB board; An AOI device is used to collect image information of the PCB board and generate a detection result; A coding device, used for coding the PCB board according to the detection result; And a logistics transmission line is used to connect the etching device, the film removal device, the positioning device, the AOI device and the AOI device.

10. A PCB circuit manufacturing device according to claim 9, characterized in that: The positioning device includes a first positioning plate and a second positioning plate, the first positioning plate and the second positioning plate are located on both sides of the logistics transmission line, and the first positioning plate is driven by a driving motor to move along the direction of the second positioning plate, so that the PCB board is fixed at the position of the second positioning plate, wherein the second positioning plate is a positioning line; The AOI device comprises a first camera assembly, a second camera assembly, a first light source assembly, and a second light source assembly, wherein the first camera assembly and the first light source assembly are arranged above the logistics transmission line, and the second camera assembly and the second light source assembly are arranged below the logistics transmission line; when the PCB board is placed flat and enters the AOI scanning area, the upper surface image of the PCB board is collected by the first camera assembly, and the lower surface image of the PCB board is collected by the second camera assembly; the first camera assembly and the second camera assembly are connected to a detection host, and the detection host detects the upper surface image and the lower surface image to generate a detection result; The burning code device is provided with a burning terminal on one side adjacent to the logistics transmission line and the positioning line, and the burning code device is provided with a burning terminal adjacent to the PCB.

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