A process control method and device for a PCB spray etching process

Abstract

An embodiment of the present invention provides a process control method and device for a PCB spray etching process, including: obtaining microbubble parameters of the etching solution; obtaining the array position of the spray head and obtaining the size distribution map of the PCB substrate; calculating spray array flow distribution data based on the array position of the spray head and the size distribution map of the PCB substrate; adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate; performing an etching operation on the PCB substrate according to the spray array flow rate to obtain an etched PCB substrate; controlling to avoid the "pool effect" generated during the etching process, passing the wire surface down through the etching line, fundamentally solving the pool effect problem, and meeting the special requirements of products with strict impedance and strict line width tolerances; using new laminating, exposure processes, etching methods and processes to fundamentally solve the pool effect problem during the production of PCB in the spray etching process and improve the line width uniformity.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a process control method for a PCB spray etching process, a process control device for a PCB spray etching process, a computer device, and a storage medium. Background Art

[0002] In the PCB board manufacturing process, the pool effect refers to the phenomenon caused by the accumulation of the etching agent at the top of the PCB when spraying the etching agent. This pool becomes an obstacle to etching uniformity, making it more difficult to etch the center of the board than the sides. When spraying a single board, the etching agent becomes less effective the moment it touches the copper because it has already reacted. In the middle of the board, this accumulation occurs quickly because it is difficult for the etching agent to flow from the center to the side. Using the oscillating spray method also requires pushing the etching agent in the center of the board to the side. Therefore, without any measures to assist etching, the etching obtained in the center of the board is less than that at the edge. If attempting to process large-sized boards, this situation becomes very significant. Summary of the Invention

[0003] In view of the above problems, embodiments of the present invention are proposed to provide a process control device for a PCB spray etching process, a computer device, and a storage medium that overcome the above problems or at least partially solve the above problems.

[0004] To solve the above problems, embodiments of the present invention disclose a process control method for a PCB spray etching process, including:

[0005] Obtaining the microbubble parameters of the etching solution;

[0006] Obtaining the array position of the spray head and obtaining the size distribution map of the PCB substrate;

[0007] Calculating the spray array flow distribution data according to the array position of the spray head and the size distribution map of the PCB substrate;

[0008] Adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate;

[0009] Performing an etching operation on the PCB substrate according to the spray array flow rate to obtain an etched PCB substrate.

[0010] Preferably, the performing an etching operation on the PCB substrate according to the spray array flow rate to obtain an etched PCB substrate includes:

[0011] After performing the first film pressing on the PCB substrate, obtaining the PCB substrate after the first film pressing;

[0012] Perform a first double-sided exposure operation on the PCB substrate after the first film pressing to obtain a PCB substrate after the first double-sided exposure;

[0013] Perform an etching operation with the etched side of the PCB substrate facing down after the first double-sided exposure according to the spray array flow rate to obtain a PCB substrate after the first etching;

[0014] Perform secondary film pressing on the PCB substrate after the first etching to obtain a PCB substrate after secondary film pressing;

[0015] Control the PCB substrate after secondary film pressing to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure;

[0016] Perform an etching operation with the etched side of the PCB substrate facing down after the second double-sided exposure according to the spray array flow rate to obtain a PCB substrate after the second etching.

[0017] Preferably, the spray array flow rate distribution data calculated according to the array positions of the spray heads and the size distribution diagram of the PCB substrate includes:

[0018] Divide the size distribution diagram of the PCB substrate into multiple levels of circular diagrams;

[0019] Divide multiple circular array positions of the spray heads according to the multiple levels of circular diagrams;

[0020] Establish relationships with the spray flow rates respectively through the circular array positions of the multiple spray heads to obtain the spray array flow rate distribution data.

[0021] Preferably, adjusting the spray array flow rate distribution data according to the microbubble parameters to obtain the spray array flow rate includes:

[0022] Calculate a flow rate adjustment coefficient according to the microbubble parameters, the etching liquid density parameter, the water density parameter and the mixed density parameter;

[0023] Adjust the pressure data of the circular array positions in the spray array flow rate distribution data according to the flow rate adjustment coefficient to obtain the spray array flow rate.

[0024] Preferably, the method includes:

[0025] Obtain an etched liquid image of a high-speed camera of a transparent spray pipeline;

[0026] Identify the number of microbubbles from the etched liquid image of the high-speed camera and calculate the microbubble parameters.

[0027] An embodiment of the present invention discloses a process control device for a PCB spray etching process, including:

[0028] A first acquisition module, configured to acquire the microbubble parameters of the etching solution;

[0029] A second acquisition module, configured to acquire the array positions of the spray heads and the size distribution map of the PCB substrate;

[0030] A calculation module, configured to calculate the spray array flow distribution data according to the array positions of the spray heads and the size distribution map of the PCB substrate;

[0031] An adjustment module, configured to adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate;

[0032] An etching operation module, configured to perform an etching operation on the PCB substrate according to the spray array flow rate to obtain an etched PCB substrate.

[0033] Preferably, the etching operation module includes:

[0034] A first film pressing sub-module, configured to perform a first film pressing on the PCB substrate to obtain a PCB substrate after the first film pressing;

[0035] A first double-sided exposure sub-module, configured to perform a first double-sided exposure operation on the PCB substrate after the first film pressing to obtain a PCB substrate after the first double-sided exposure;

[0036] A first etching sub-module, configured to perform an etching operation with the etched side facing down on the PCB substrate after the first double-sided exposure according to the spray array flow rate to obtain a PCB substrate after the first etching;

[0037] A second film pressing sub-module, configured to perform a second film pressing on the PCB substrate after the first etching to obtain a PCB substrate after the second film pressing;

[0038] A second double-sided exposure sub-module, configured to control the PCB substrate after the second film pressing to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure;

[0039] A second etching sub-module, configured to perform an etching operation with the etched side facing down on the PCB substrate after the second double-sided exposure according to the spray array flow rate to obtain a PCB substrate after the second etching.

[0040] Preferably, the calculation module includes:

[0041] A division sub-module, configured to divide the size distribution map of the PCB substrate into multiple levels of circular diagrams;

[0042] An array position sub-module, configured to divide the circular array positions of multiple spray heads according to the multiple levels of circular diagrams;

[0043] Establish a sub-module for establishing the relationship with the spray flow rate respectively at the annular array positions of multiple spray heads to obtain the spray array flow distribution data.

[0044] An embodiment of the present invention also discloses a computer device, including a memory and a processor. The memory stores a computer program, and when the processor executes the computer program, the steps of the process control of the above-mentioned PCB spray etching process are implemented.

[0045] An embodiment of the present invention also discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the process control of the above-mentioned PCB spray etching process are implemented.

[0046] The embodiments of the present invention include the following advantages:

[0047] In the embodiments of the present invention, the process control method for the PCB spray etching process includes: obtaining the microbubble parameters of the etching solution; obtaining the array positions of the spray heads and the size distribution map of the PCB substrate; calculating the spray array flow distribution data according to the array positions of the spray heads and the size distribution map of the PCB substrate; adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate; performing the etching operation on the PCB substrate according to the spray array flow rate to obtain the etched PCB substrate; controlling to avoid the "pool effect" generated during the etching process, adopting a special film pressing and etching method, splitting the single etching into single-sided etching. Each time during etching, the wire side faces down and passes through the etching line, fundamentally solving the pool effect problem and meeting the special requirements of products with strict impedance and strict line width tolerances; using new film pressing, exposure processes, etching methods and processes, fundamentally solving the pool effect problem during the production of PCB in the spray etching process and improving the line width uniformity. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0049] Figure 1 is a flowchart of the steps of an embodiment of the process control method for a PCB spray etching process according to an embodiment of the present invention;

[0050] Figure 2 is a schematic diagram of a spray device in an embodiment of the present invention;

[0051] Figure 3It is a schematic diagram of a spraying process of a PCB substrate in an embodiment of the present invention;

[0052] Figure 4 It is a schematic diagram of a size distribution diagram of a divided PCB substrate in an embodiment of the present invention;

[0053] Figure 5 It is a schematic diagram of the setting of some specific parameters in an embodiment of the present invention;

[0054] Figure 6 It is a structural block diagram of an embodiment of a process control device for a PCB spraying and etching process in an embodiment of the present invention;

[0055] Figure 7 It is an internal structure diagram of a computer device in an embodiment. Specific embodiments

[0056] In order to make the technical problems, technical solutions and beneficial effects solved by the embodiments of the present invention more clear, the following further describes the embodiments of the present invention in detail with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0057] In a core concept of an embodiment of the present invention, in the etching process of a PCB substrate, by controlling the flow rate of the annular array of the spray head and using the flow rate control method to control the generation of the "pool effect". On the other hand, by adjusting the content of microbubbles in the etching solution to obtain the actual spray array flow rate distribution data of the spray array to further avoid the "pool effect" generated during the etching process; in addition, it is also possible to control the first film pressing of the PCB substrate, the first double-sided exposure, the etching operation with the first etching surface facing down, the second film pressing, the second double-sided exposure, the etching operation with the second etching surface facing down, etc., to control and avoid the "pool effect" generated during the etching process, adopt special film pressing and etching methods, split the single etching into single-sided etching, and when etching each time, the wire surface passes through the etching line facing down, fundamentally solving the problem of the pool effect and meeting the special requirements of products with strict impedance and strict line width tolerances; using new film pressing, exposure processes, etching methods and processes to fundamentally solve the pool effect problem during the production of PCB in the spraying and etching process and improve the line width uniformity.

[0058] The process control method for the PCB spray etching process provided by the embodiments of the present invention can be applied to an application environment including a terminal and a server. Among them, the terminal communicates with the server through a network. The terminal can be, but is not limited to, various personal computers, laptop computers, smart phones, tablet computers, and portable wearable devices. The operating system of the terminal can include Android, Harmony OS, IOS, Windows Phone, Windows, etc. The present invention does not impose too many restrictions on this. The server can be implemented by an independent server or a server cluster composed of multiple servers. The terminal is connected to a variety of semiconductor devices, and the embodiments of the present invention do not impose too many restrictions on this.

[0059] Referring to Figure 1 , a step flowchart of an embodiment of the process control method for the PCB spray etching process according to the embodiments of the present invention is shown, and specifically may include the following steps:

[0060] Step 101, obtaining the microbubble parameters of the etching solution;

[0061] In the embodiments of the present invention, the terminal can be a terminal connected to a variety of semiconductor devices. The semiconductor devices can include a variety of semiconductor devices, such as material pre-baking equipment, inner layer imaging equipment, etching equipment, drilling equipment, electroplating equipment, brownification equipment, etc. The embodiments of the present invention do not impose too many restrictions on the types of semiconductor devices; the terminal connected to the server can control the above-mentioned semiconductor devices to perform corresponding processing operations for various semiconductor materials.

[0062] Before or after the etching operation for the PCB substrate, other operations can also be included, such as stacking operation, lamination operation, electroplating operation, outer layer image etching operation, solder resist operation, immersion gold operation, heat-set text operation, forming operation, electrical testing operation, etc. The embodiments of the present invention do not impose too many restrictions on this.

[0063] Specifically applied to the embodiments of the present invention, the etching solution can include multiple different types of etching solutions. In terms of system classification, the specific etching solution can include etching solutions corresponding to different combinations of ferric chloride system, acidic copper chloride system, and alkaline copper chloride system. The embodiments of the present invention do not impose too many restrictions on this;

[0064] In terms of the main components, the main components of the etching solution can include ammonium fluoride, oxalic acid, sodium sulfate, hydrofluoric acid, sulfuric acid, nitric acid, bromic acid, sodium chloride and other main components. The embodiments of the present invention do not impose too many restrictions on this.

[0065] Such as Figure 2 As shown, the spray device in the etching equipment in the embodiments of the present invention can include multiple spray heads. The spray heads can be multi-column spray heads, and the spray array can be arranged in a rectangular shape.

[0066] In a spray process according to an embodiment of the present invention, as Figure 3 shown, the PCB substrate moves through a transfer device, and a spray device is arranged below the transfer device. The etching solution is sprayed onto the PCB substrate on the transfer device through the spray device, and the spray head in the spray device can change the tilt angle during spraying.

[0067] In an embodiment of the present invention, first, microbubble parameters of the etching solution can be obtained. The microbubble parameter refers to the proportion of the area of microbubbles in the etching solution to the area of the entire sampled image; the microbubble parameter characterizes the content of microbubbles with a diameter smaller than a preset diameter per unit area. For example, the microbubble parameter can be 0.02% or 0.035%.

[0068] In a specific implementation, the microbubble parameter can be obtained by means of high-speed photography of a transparent spray pipe to obtain an etching solution image including microbubbles, so as to identify the microbubble parameter of a certain etching solution. It should be noted that the above method for obtaining the microbubble parameter is only an example of an embodiment of the present invention, and other methods can also be used, such as measuring the microbubble parameter by means of a conductivity probe. The embodiments of the present invention do not limit this too much.

[0069] Step 102, obtain the array position of the spray head and obtain the size distribution map of the PCB substrate;

[0070] Further applied to an embodiment of the present invention, the array position of the spray head in the spray device can also be obtained. Specifically, the array position of the spray head can refer to the horizontal and vertical coordinates of the spray head. For example, the array position of a certain spray head can be expressed as (2, 3). Further, the size distribution map of the PCB substrate can also be obtained. The size distribution map can refer to the dimensions in the length direction and width direction of the PCB substrate.

[0071] Step 103, calculate the spray array flow distribution data according to the array position of the spray head and the size distribution map of the PCB substrate;

[0072] In an embodiment of the present invention, after obtaining the array position of the spray head and the size distribution map of the PCB substrate, the spray array flow distribution data can be calculated based on the two;

[0073] Specifically, the spray array flow distribution data can include the spray amount per unit time of each spray head in the spray array.

[0074] Specifically applied to the embodiments of the present invention, the calculation of the spray array flow distribution data according to the array positions of the spray heads and the size distribution diagram of the PCB substrate includes: dividing the size distribution diagram of the PCB substrate into circular diagrams of multiple levels; dividing the circular array positions of multiple spray heads according to the circular diagrams of multiple levels; establishing the relationship with the spray flow through the circular array positions of multiple spray heads respectively to obtain the spray array flow distribution data.

[0075] As Figure 4 shown, the size distribution diagram of the PCB substrate can be divided into circular diagrams of four levels, namely the first-level circular diagram, the second-level circular diagram, the third-level circular diagram, and the fourth-level circular diagram; further, divide the circular array positions of multiple spray heads according to the first-level circular diagram, the second-level circular diagram, the third-level circular diagram, and the fourth-level circular diagram. For example, it can also be divided into circular array positions of spray heads of four levels, such as the first spray head circular array position, the second spray head circular array position, the third spray head circular array position, and the fourth spray head circular array position; the first spray head circular array position corresponds to the first-level circular diagram of the size distribution diagram of the PCB substrate, that is, the position where the first spray head circular array position sprays corresponds to the position of the PCB substrate of the first-level circular diagram; the position where the second spray head circular array position sprays corresponds to the position of the PCB substrate of the second-level circular diagram; the position where the third spray head circular array position sprays corresponds to the position of the PCB substrate of the third-level circular diagram; the position where the fourth spray head circular array position sprays corresponds to the position of the PCB substrate of the fourth-level circular diagram, and the specific circular array positions are as Figure 2 shown;

[0076] And the spray flows of the circular array positions of spray heads at each level are different and can decrease gradually. For example, the spray volume of the first spray head circular array position is greater than that of the second spray head circular array position; the spray volume of the second spray head circular array position is greater than that of the third spray head circular array position, and the spray volume of the third spray head circular array position is greater than that of the fourth spray head circular array position, so that the spray array flow distribution data can be obtained. Through the spray array step-by-step flow control method in the embodiments of the present invention, the pool effect generated in the etching process can be effectively controlled. The above division method is only an example of the embodiments of the present invention, and the size distribution diagram of the PCB substrate and the circular array positions of the spray heads can also be divided into more other levels to achieve more refined flow control. The embodiments of the present invention do not limit this too much.

[0077] Step 104, adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow;

[0078] In the embodiments of the present invention, after obtaining the flow distribution data of the spray array, it is also necessary to adjust the flow distribution data of the spray array according to the microbubble parameters to obtain the flow rate of the spray array; further reducing the influence of the microbubbles of the etching solution on the flow rate of the spray array, and at the same time being beneficial to the flow control of the etching solution, improving the control efficiency, and increasing the reaction rate of the etching solution.

[0079] Specifically applied to the embodiments of the present invention, the adjusting the flow distribution data of the spray array according to the microbubble parameters to obtain the flow rate of the spray array includes: calculating a flow rate adjustment coefficient according to the microbubble parameters, the etching liquid density parameter, the water density parameter, and the mixed density parameter; adjusting the pressure data at the annular array position in the flow distribution data of the spray array according to the flow rate adjustment coefficient to obtain the flow rate of the spray array.

[0080] Specifically, the flow rate adjustment coefficient is calculated from the etching liquid density parameter and the water density parameter , the mixed density parameter , and the microbubble parameter . The expression of the flow rate adjustment coefficient is as follows;

[0081] This flow rate adjustment coefficient .

[0082] In the embodiments of the present invention, the flow rate adjustment coefficient is calculated according to the microbubble parameters, and then the pressure data at the annular array position in the flow distribution data of the spray array is fine-tuned according to the flow rate adjustment coefficient to obtain the flow rate of the spray array. Then, the flow rate of the spray array is applied to the spray flow rate at the annular array position of each grade of the spray head above. Among them, adjusting the flow rate of the spray array by increasing or decreasing the pressure is beneficial to the flow control of the etching solution, improving the control efficiency, and increasing the reaction rate of the etching solution.

[0083] Further applied to the embodiments of the present invention, the method includes: obtaining an etching solution image of a high-speed camera of a transparent spray pipe; identifying the number of microbubbles from the etching solution image of the high-speed camera and calculating the microbubble parameters.

[0084] Step 105, performing an etching operation on the PCB substrate according to the flow rate of the spray array to obtain an etched PCB substrate.

[0085] In the embodiments of the present invention, performing an etching operation on the PCB substrate through the flow rate of the spray array to obtain an etched PCB substrate. It should be noted that during the etching operation, the PCB substrate can also be subjected to multiple operations such as film pressing and double-sided exposure. The embodiments of the present invention do not impose too many restrictions on this;

[0086] In a specific example of an embodiment of the present invention, the etching operation of the PCB substrate according to the flow rate of the spray array to obtain the etched PCB substrate includes: after performing the first film pressing on the PCB substrate, obtaining the PCB substrate after the first film pressing; performing the first double-sided exposure operation on the PCB substrate after the first film pressing to obtain the PCB substrate after the first double-sided exposure; performing the etching operation with the etched surface of the PCB substrate after the first double-sided exposure facing down according to the flow rate of the spray array to obtain the PCB substrate after the first etching; performing the second film pressing on the PCB substrate after the first etching to obtain the PCB substrate after the second film pressing; controlling the PCB substrate after the second film pressing to perform the second double-sided exposure operation to obtain the PCB substrate after the second double-sided exposure; performing the etching operation with the etched surface of the PCB substrate after the second double-sided exposure facing down according to the flow rate of the spray array to obtain the PCB substrate after the second etching.

[0087] That is, in the embodiment of the present invention, the etched surface of the PCB substrate in the etching operation faces downward, while the spray head faces upward, which can avoid the "pool effect" generated during the etching process. By adopting a special film pressing method and etching method, the single etching is split into single-sided etching. Each time during etching, the wire side faces down when passing through the etching line, fundamentally solving the pool effect problem and meeting the special requirements of products with strict impedance and strict line width tolerances; using new film pressing, exposure processes, etching methods and processes to fundamentally solve the pool effect problem during the production of PCB in the spray etching process and improve the line width uniformity. Some specific parameter settings are as Figure 5 shown. Specifically, during the first etching operation, only the top surface circuit and the NPTH (Non-Plated Through Hole) holes on the bottom surface are etched. During the second etching operation, the bottom surface circuit is etched, the NPTH holes are all covered with dry film and not etched, the entire surface of the top surface circuit that has been etched is exposed and not etched, and no openings are added. During etching, the side that needs to be etched is always placed facing down when passing through the etching equipment; after the first etching, the second film pressing is performed.

[0088] In the embodiments of the present invention, the process control method for the PCB spray etching process includes: obtaining the microbubble parameters of the etching solution; obtaining the array positions of the spray heads and the size distribution map of the PCB substrate; calculating the spray array flow distribution data according to the array positions of the spray heads and the size distribution map of the PCB substrate; adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate; performing the etching operation on the PCB substrate according to the spray array flow rate to obtain the etched PCB substrate; controlling to avoid the "pool effect" generated during the etching process, adopting a special film pressing and etching method, splitting the single etching into single-sided etching, and when etching each time, the wire side faces down and passes through the etching line, fundamentally solving the pool effect problem and meeting the special requirements of products with strict impedance and strict line width tolerances; using new film pressing, exposure processes, etching methods and processes to fundamentally solve the pool effect problem during the production of PCB in the spray etching process and improve the line width uniformity.

[0089] It should be noted that for the method embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the embodiments of the present invention are not limited by the described action sequences, because according to the embodiments of the present invention, some steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily essential for the embodiments of the present invention.

[0090] Refer to Figure 6 , which shows the structural block diagram of an embodiment of the process control device for the PCB spray etching process in the embodiments of the present invention, and specifically may include the following modules:

[0091] The first acquisition module 301 is used to obtain the microbubble parameters of the etching solution;

[0092] The second acquisition module 302 is used to obtain the array positions of the spray heads and the size distribution map of the PCB substrate;

[0093] The calculation module 303 is used to calculate the spray array flow distribution data according to the array positions of the spray heads and the size distribution map of the PCB substrate;

[0094] The adjustment module 304 is used to adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate;

[0095] The etching operation module 305 is used to perform the etching operation on the PCB substrate according to the spray array flow rate to obtain the etched PCB substrate.

[0096] Preferably, the etching operation module includes:

[0097] The first laminating sub-module is used to obtain the PCB substrate after the first lamination for the PCB substrate after the first lamination;

[0098] The first double-sided exposure sub-module is used to perform the first double-sided exposure operation on the PCB substrate after the first lamination to obtain the PCB substrate after the first double-sided exposure;

[0099] The first etching sub-module is used to perform an etching operation with the etched surface facing down on the PCB substrate after the first double-sided exposure according to the spray array flow rate to obtain the PCB substrate after the first etching;

[0100] The secondary laminating sub-module is used to perform secondary lamination on the PCB substrate after the first etching to obtain the PCB substrate after secondary lamination;

[0101] The second double-sided exposure sub-module is used to control the PCB substrate after the secondary lamination to perform the second double-sided exposure operation to obtain the PCB substrate after the second double-sided exposure;

[0102] The second etching sub-module is used to perform an etching operation with the etched surface facing down on the PCB substrate after the second double-sided exposure according to the spray array flow rate to obtain the PCB substrate after the second etching.

[0103] Preferably, the calculation module includes:

[0104] The division sub-module is used to divide the size distribution diagram of the PCB substrate into circular diagrams of multiple levels;

[0105] The array position sub-module is used to divide the circular array positions of multiple spray heads according to the circular diagrams of multiple levels;

[0106] The establishment sub-module is used to establish the relationship with the spray flow rate respectively through the circular array positions of multiple spray heads to obtain the spray array flow rate distribution data.

[0107] Preferably, the adjustment module includes:

[0108] The flow rate adjustment coefficient sub-module is used to calculate the flow rate adjustment coefficient according to the microbubble parameters, etching liquid density parameters, water density parameters and mixed density parameters;

[0109] The adjustment sub-module is used to adjust the pressure data of the circular array positions in the spray array flow rate distribution data according to the flow rate adjustment coefficient to obtain the spray array flow rate.

[0110] Preferably, the device includes:

[0111] The third acquisition module is used to acquire the etching liquid image of the high-speed camera of the transparent spray pipeline;

[0112] A calculation sub-module, configured to identify the number of micro-bubbles from the etching solution image captured by the high-speed camera and calculate the micro-bubble parameters.

[0113] For the device embodiment, since it is basically similar to the method embodiment, the description is relatively simple. For related parts, refer to the partial description of the method embodiment.

[0114] For the specific limitations on the process control device for the PCB spray etching process, reference can be made to the limitations on the process control method for the PCB spray etching process in the foregoing text, which will not be elaborated here. Each module in the above-mentioned process control device for the PCB spray etching process can be implemented in whole or in part by software, hardware, and their combination. The above-mentioned modules can be embedded in the processor in the computer device in hardware form or be independent of it, or be stored in the memory in the computer device in software form, so as to facilitate the processor to call and execute the operations corresponding to the above-mentioned modules.

[0115] The above-provided process control device for the PCB spray etching process can be used to execute the process control method for the PCB spray etching process provided in any of the above embodiments, and has corresponding functions and beneficial effects.

[0116] In one embodiment, a computer device is provided. The computer device can be a terminal, and its internal structural diagram can be as Figure 7 shown. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected through a system bus. Among them, the processor of the computer device is used to provide computing and control capabilities. The memory of the computer device includes a non-volatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of the operating system and the computer program in the non-volatile storage medium. The network interface of the computer device is used to communicate with an external terminal through a network connection. When the computer program is executed by the processor, it realizes a method for simulating the daylighting rate. The display screen of the computer device can be a liquid crystal display screen or an electronic ink display screen. The input device of the computer device can be a touch layer covering the display screen, or a button, a trackball, or a touchpad provided on the housing of the computer device, or an external keyboard, a touchpad, or a mouse, etc.

[0117] Those skilled in the art can understand that Figure 7 the structure shown in

[0118] In one embodiment, a computer device is provided, including a memory and a processor. A computer program is stored in the memory. When the processor executes the computer program, the following steps are implemented:

[0119] Obtain the microbubble parameters of the etching solution;

[0120] Obtain the array position of the spray head and obtain the size distribution map of the PCB substrate;

[0121] Calculate the spray array flow distribution data according to the array position of the spray head and the size distribution map of the PCB substrate;

[0122] Adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate;

[0123] Perform an etching operation on the PCB substrate according to the spray array flow rate to obtain an etched PCB substrate.

[0124] Preferably, the performing an etching operation on the PCB substrate according to the spray array flow rate to obtain an etched PCB substrate includes:

[0125] After performing a first film pressing on the PCB substrate, obtain the PCB substrate after the first film pressing;

[0126] Perform a first double-sided exposure operation on the PCB substrate after the first film pressing to obtain the PCB substrate after the first double-sided exposure;

[0127] Perform an etching operation with the etched side down on the PCB substrate after the first double-sided exposure according to the spray array flow rate to obtain the PCB substrate after the first etching;

[0128] Perform a second film pressing on the PCB substrate after the first etching to obtain the PCB substrate after the second film pressing;

[0129] Control the PCB substrate after the second film pressing to perform a second double-sided exposure operation to obtain the PCB substrate after the second double-sided exposure;

[0130] Perform an etching operation with the etched side down on the PCB substrate after the second double-sided exposure according to the spray array flow rate to obtain the PCB substrate after the second etching.

[0131] Preferably, the calculating the spray array flow distribution data according to the array position of the spray head and the size distribution map of the PCB substrate includes:

[0132] Divide the size distribution map of the PCB substrate into multiple levels of circular diagrams;

[0133] Divide the circular array positions of multiple spray heads according to the circular diagram of the multiple levels;

[0134] Establish the relationship with the spray flow rate respectively through the circular array positions of multiple spray heads to obtain the spray array flow distribution data.

[0135] Preferably, the adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate includes:

[0136] Calculate the flow rate adjustment coefficient according to the microbubble parameters, the etching liquid density parameter, the water density parameter and the mixed density parameter;

[0137] Adjust the pressure data of the circular array position in the spray array flow distribution data according to the flow rate adjustment coefficient to obtain the spray array flow rate.

[0138] Preferably, the method includes:

[0139] Obtain the etching liquid image of the high-speed camera of the transparent spray pipeline;

[0140] Identify the number of microbubbles from the etching liquid image of the high-speed camera and calculate the microbubble parameters.

[0141] In one embodiment, a computer-readable storage medium is provided, on which a computer program is stored. When the computer program is executed by a processor, the following steps are implemented:

[0142] Obtain the microbubble parameters of the etching liquid;

[0143] Obtain the array positions of the spray heads and obtain the size distribution diagram of the PCB substrate;

[0144] Calculate the spray array flow distribution data according to the array positions of the spray heads and the size distribution diagram of the PCB substrate;

[0145] Adjust the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow rate;

[0146] Perform the etching operation on the PCB substrate according to the spray array flow rate to obtain the etched PCB substrate.

[0147] Preferably, the performing the etching operation on the PCB substrate according to the spray array flow rate to obtain the etched PCB substrate includes:

[0148] After performing the first film pressing on the PCB substrate, obtain the PCB substrate after the first film pressing;

[0149] Perform the first double-sided exposure operation on the PCB substrate after the first film pressing to obtain the PCB substrate after the first double-sided exposure;

[0150] Perform an etching operation with the etched side of the PCB substrate facing down after the first double-sided exposure according to the spray array flow rate, to obtain the PCB substrate after the first etching;

[0151] Perform secondary film pressing on the PCB substrate after the first etching, to obtain the PCB substrate after secondary film pressing;

[0152] Control the PCB substrate after secondary film pressing to perform a second double-sided exposure operation, to obtain the PCB substrate after the second double-sided exposure;

[0153] Perform an etching operation with the etched side of the PCB substrate facing down after the second double-sided exposure according to the spray array flow rate, to obtain the PCB substrate after the second etching.

[0154] Preferably, the spray array flow rate distribution data calculated according to the array positions of the spray heads and the size distribution diagram of the PCB substrate includes:

[0155] Divide the size distribution diagram of the PCB substrate into multiple levels of circular diagrams;

[0156] Divide multiple circular array positions of the spray heads according to the multiple levels of circular diagrams;

[0157] Establish relationships with the spray flow rates respectively through the circular array positions of the multiple spray heads, to obtain the spray array flow rate distribution data.

[0158] Preferably, the adjusting the spray array flow rate distribution data according to the microbubble parameters to obtain the spray array flow rate includes:

[0159] Calculate a flow rate adjustment coefficient according to the microbubble parameters, the etching liquid density parameter, the water density parameter and the mixed density parameter;

[0160] Adjust the pressure data at the circular array positions in the spray array flow rate distribution data according to the flow rate adjustment coefficient, to obtain the spray array flow rate.

[0161] Preferably, the method includes:

[0162] Obtain an etched liquid image of a high-speed camera of a transparent spray pipeline;

[0163] Identify the number of microbubbles from the high-speed camera's etched liquid image, and calculate the microbubble parameters.

[0164] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above methods. Among them, any reference to a memory, storage, database, or other medium used in the various embodiments provided in the present application can include non-volatile and / or volatile memories. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), Rambus direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and Rambus dynamic RAM (RDRAM), etc.

[0165] Each embodiment in this specification is described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts among the various embodiments can be referred to each other.

[0166] Those skilled in the art should understand that the embodiments of the present invention can be provided as a method, apparatus, or computer program product. Therefore, the embodiments of the present invention can take the form of an all-hardware embodiment, an all-software embodiment, or an embodiment combining software and hardware aspects. Moreover, the embodiments of the present invention can take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk memory, CD-ROM, optical memory, etc.) containing computer-usable program code.

[0167] The embodiments of the present invention are described with reference to the flowcharts and / or block diagrams of apparatuses, terminal devices (systems), and computer program products according to the embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, and the combination of processes and / or blocks in the flowcharts and / or block diagrams can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing terminal devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing terminal devices generate for implementing the processesFigure 1 one or more processes and / or blocks Figure 1 means for the functions specified in one or more blocks

[0168] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing terminal device to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured article including the instruction method, and the instruction method realizes the process Figure 1 one or more processes and / or blocks Figure 1 the functions specified in one or more blocks

[0169] These computer program instructions can also be loaded onto a computer or other programmable data processing terminal device, so that a series of operating steps are executed on the computer or other programmable terminal device to produce a computer-implemented process. Thus, the instructions executed on the computer or other programmable terminal device provide for realizing the process Figure 1 one or more processes and / or blocks Figure 1 the steps of the functions specified in one or more blocks

[0170] Although the preferred embodiments of the embodiments of the present invention have been described, those skilled in the art can make additional changes and modifications once they know the basic creative concepts. Therefore, the appended claims are intended to be construed to include the preferred embodiments and all changes and modifications falling within the scope of the embodiments of the present invention.

[0171] Finally, it should also be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, device, article or terminal device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, device, article or terminal device. Without further limitation, an element defined by the statement "including an..." does not exclude the presence of another identical element in the process, device, article or terminal device including the element.

[0172] The above has introduced in detail a process control method for a PCB spray etching process, a process control device for a PCB spray etching process, a computer device, and a storage medium. In this article, specific examples are used to elaborate on the principle and implementation manner of the present invention. The description of the above embodiments is only used to help understand the method and its core idea of the present invention; at the same time, for those of ordinary skill in the art, according to the idea of the present invention, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present invention.

Claims

1. A process control method for PCB spray etching process, characterized in that, Including: Obtaining the microbubble parameters of the etching solution; the microbubble parameters refer to the proportion of the microbubble area in the etching solution to the area of the entire sampled image; Obtaining the array positions of the spray heads and obtaining the size distribution map of the PCB substrate; Calculating the spray array flow distribution data according to the array positions of the spray heads and the size distribution map of the PCB substrate; Adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; Performing an etching operation on the PCB substrate according to the spray array flow to obtain an etched PCB substrate; The calculating the spray array flow distribution data according to the array positions of the spray heads and the size distribution map of the PCB substrate includes: Dividing the size distribution map of the PCB substrate into circular diagrams of multiple levels; Dividing the circular array positions of multiple spray heads according to the circular diagrams of multiple levels; Establishing the relationship with the spray flow through the circular array positions of multiple spray heads respectively to obtain the spray array flow distribution data; The adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow includes: Calculating a flow adjustment coefficient according to the microbubble parameters, the etching liquid density parameter, the water density parameter and the mixed density parameter; Adjusting the pressure data of the circular array positions in the spray array flow distribution data according to the flow adjustment coefficient to obtain the spray array flow; Flow adjustment coefficient is calculated from the etching liquid density parameter , the water density parameter , the mixed density parameter , and the microbubble parameter . The expression of the flow adjustment coefficient is as follows; This flow adjustment coefficient .

2. The method according to claim 1, wherein The performing an etching operation on the PCB substrate according to the spray array flow to obtain an etched PCB substrate includes: After performing the first film pressing on the PCB substrate, obtaining the PCB substrate after the first film pressing; Performing the first double-sided exposure operation on the PCB substrate after the first film pressing to obtain the PCB substrate after the first double-sided exposure; Performing an etching operation with the etched surface facing down on the PCB substrate after the first double-sided exposure according to the spray array flow to obtain the PCB substrate after the first etching; Performing a second film pressing on the PCB substrate after the first etching to obtain the PCB substrate after the second film pressing; Controlling the PCB substrate after the second film pressing to perform the second double-sided exposure operation to obtain the PCB substrate after the second double-sided exposure; Performing an etching operation with the etched surface facing down on the PCB substrate after the second double-sided exposure according to the spray array flow to obtain the PCB substrate after the second etching.

3. The method according to claim 1, wherein The method includes: Obtaining an etching solution image of a high-speed camera of a transparent spray pipeline; Identifying the number of microbubbles from the etching solution image of the high-speed camera and calculating the microbubble parameters.

4. A process control device for a PCB spray etching process, characterized in that, Including: A first obtaining module for obtaining the microbubble parameters of the etching solution; the microbubble parameters refer to the proportion of the microbubble area in the etching solution to the area of the entire sampled image; A second obtaining module for obtaining the array positions of the spray heads and obtaining the size distribution map of the PCB substrate; A calculating module for calculating the spray array flow distribution data according to the array positions of the spray heads and the size distribution map of the PCB substrate; An adjusting module for adjusting the spray array flow distribution data according to the microbubble parameters to obtain the spray array flow; An etching operation module for performing an etching operation on a PCB substrate according to the spray array flow rate to obtain an etched PCB substrate; The calculation module includes: A division sub-module for dividing the size distribution diagram of the PCB substrate into multiple levels of circular diagrams; An array position sub-module for dividing the circular array positions of multiple spray heads according to the multiple levels of circular diagrams; A relationship establishment sub-module for establishing the relationship with the spray flow rate respectively through the circular array positions of multiple spray heads to obtain spray array flow distribution data; The adjustment module includes: A flow rate adjustment coefficient sub-module for calculating a flow rate adjustment coefficient according to micro-bubble parameters, etching liquid density parameters, water density parameters and mixed density parameters; An adjustment sub-module for adjusting the pressure data of the circular array positions in the spray array flow distribution data according to the flow rate adjustment coefficient to obtain the spray array flow rate; Flow adjustment coefficient is calculated from the etching liquid density parameter and the water density parameter , the mixed density parameter , and the microbubble parameter . The expression for the flow adjustment coefficient is as follows; The flow rate adjustment coefficient .

5. The device according to claim 4, characterized in that The etching operation module includes: A first film pressing sub-module for performing a first film pressing on the PCB substrate to obtain a PCB substrate after the first film pressing; A first double-sided exposure sub-module for performing a first double-sided exposure operation on the PCB substrate after the first film pressing to obtain a PCB substrate after the first double-sided exposure; A first etching sub-module for performing an etching operation with the etched surface facing down on the PCB substrate after the first double-sided exposure according to the spray array flow rate to obtain a PCB substrate after the first etching; A second film pressing sub-module for performing a second film pressing on the PCB substrate after the first etching to obtain a PCB substrate after the second film pressing; A second double-sided exposure sub-module for controlling the PCB substrate after the second film pressing to perform a second double-sided exposure operation to obtain a PCB substrate after the second double-sided exposure; A second etching sub-module for performing an etching operation with the etched surface facing down on the PCB substrate after the second double-sided exposure according to the spray array flow rate to obtain a PCB substrate after the second etching.

6. A computer device, comprising a memory and a processor, the memory storing a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the process control method for the PCB spray etching process described in any one of claims 1 to 3.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the process control method for the PCB spray etching process described in any one of claims 1 to 3.

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