Copper deposition process and system based on thin copper surface PCB (Printed Circuit Board)

Abstract

The invention provides a copper deposition process based on a thin copper surface PCB. The copper deposition process comprises the following steps that the thin copper surface PCB is soaked in a degumming cylinder for degumming treatment, so that hole walls in the thin copper surface PCB form a honeycomb-shaped micro-rough surface; and placing the thin copper surface PCB after the glue removal treatment in a pre-neutralization cylinder for pre-neutralization treatment. And the thin copper surface PCB subjected to the pre-neutralization treatment is placed in a neutralization cylinder to be subjected to neutralization treatment. And the thin copper surface PCB subjected to neutralization treatment is placed in an oil removal cylinder for oil removal treatment. And the thin copper surface PCB subjected to oil removal treatment is placed in a micro-etching cylinder for micro-etching treatment. And placing the thin copper surface PCB subjected to micro-etching treatment in an activation cylinder for activation treatment. And placing the activated thin-copper-surface PCB in a copper plating cylinder for copper plating treatment. Wherein the liquid medicine in the neutralization cylinder is a first neutralization solution, the liquid medicine in the pre-neutralization cylinder is a second neutralization solution, and the first neutralization solution and the second neutralization solution are both mixed solutions of a copper protection neutralizer and sulfuric acid.

Description

Technical Field

[0001] The present invention relates to the field of PCB production, and in particular to a copper deposition process and a system thereof based on a thin copper surface PCB. Background Art

[0002] The chemical copper plating of PCB is usually called copper plating or hole-through-treatment (PTH), and PTH is a self-catalytic redox reaction. Its purpose is to metallize the holes of multi-layer PCB boards and achieve electrical conduction between core layers.

[0003] At present, the pre-neutralization tank chemicals of the PTH process basically use sulfuric acid-hydrogen peroxide series. This series of chemicals is used to remove the potassium permanganate solution remaining in the previous process of the PCB board. However, when the thickness of the copper foil layer of the multi-layer PCB board (10μm) is thin, the copper surface of the PCB board is easily corroded by the sulfuric acid-hydrogen peroxide solution, which increases the roughness of the copper surface of the PCB board, causing the subsequent adsorption of activated palladium to increase, increasing unnecessary consumption of activation solution, and even causing the copper surface of the PCB board to be worn flat when the corrosion is excessive, seriously affecting the quality of the PCB board. Summary of the invention

[0004] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a copper deposition process and system based on a thin copper surface PCB board.

[0005] The purpose of this disclosure is achieved through the following technical solutions:

[0006] A copper deposition process based on a thin copper surface PCB board comprises the following steps:

[0007] The thin copper surface PCB board is immersed in a degumming tank for degumming treatment, so that the hole wall in the thin copper surface PCB board forms a honeycomb-shaped micro-rough surface;

[0008] Placing the thin copper surface PCB board after the degumming treatment in a pre-neutralization cylinder for pre-neutralization treatment;

[0009] Placing the pre-neutralized thin copper-surface PCB board in a neutralization tank for neutralization treatment;

[0010] Placing the neutralized thin copper-surface PCB board in a degreasing tank for degreasing;

[0011] Placing the degreased thin copper surface PCB board in a micro-etching tank for micro-etching treatment;

[0012] Placing the thin copper surface PCB board after micro-etching in an activation tank for activation treatment;

[0013] Placing the activated thin copper PCB board in a copperizing tank for copperizing treatment;

[0014] The liquid medicine in the neutralization tank is the first neutralization liquid, the liquid medicine in the pre-neutralization tank is the second neutralization liquid, and both the first neutralization liquid and the second neutralization liquid are a mixture of a copper-protecting neutralizer and sulfuric acid.

[0015] In one embodiment, after the step of immersing the thin copper surface PCB board in a degumming tank for degumming treatment, and before the step of placing the thin copper surface PCB board after the degumming treatment in a pre-neutralization tank for pre-neutralization treatment, the copper deposition process further includes the following steps:

[0016] When the copper ion concentration in the first neutralization liquid is greater than or equal to the first preset concentration value, the first neutralization liquid in the neutralization cylinder is transported to the pre-neutralization cylinder through an acid-resistant hose to form a second neutralization liquid, and the first neutralization liquid is re-configured in the neutralization cylinder.

[0017] In one embodiment, the first preset concentration value of the copper ion concentration in the first neutralization solution is 1.5 g / L.

[0018] In one embodiment, the copper-protecting neutralizing agent includes a surfactant and EDTA.

[0019] In one embodiment, the concentration of sulfuric acid in the first neutralization solution is 4% to 6%, and the concentration of the copper-protecting neutralizing agent in the first neutralization solution is 15% to 25%;

[0020] The concentration of sulfuric acid in the second neutralization solution is 4% to 6%, and the concentration of the copper-protecting neutralizing agent in the second neutralization solution is 10% to 15%.

[0021] In one embodiment, before the step of immersing the thin copper surface PCB board in a degumming tank for degumming treatment, the copper deposition process further includes the following steps:

[0022] The thin copper surface PCB board is immersed in a swelling cylinder for swelling treatment.

[0023] In one embodiment, after the step of placing the thin copper surface PCB board after the degreasing treatment in a micro-etching tank for micro-etching treatment, and before the step of placing the thin copper surface PCB board after the micro-etching treatment in an activation tank for activation treatment, the copper deposition process further includes the following steps:

[0024] The thin copper surface PCB board is placed in a prepreg tank for prepreg treatment.

[0025] In one embodiment, after the step of placing the thin copper surface PCB board after micro-etching treatment in an activation tank for activation treatment, and after the step of placing the thin copper surface PCB board after activation treatment in a copper treatment tank for copper treatment, the copper deposition process further includes the following steps:

[0026] The thin copper surface PCB board is placed in an acceleration cylinder for acceleration treatment.

[0027] A copper deposition system based on a thin copper surface PCB board, used for the copper deposition process based on a thin copper surface PCB board described in any of the above embodiments;

[0028] The copper deposition system comprises a degumming cylinder, a pre-neutralization cylinder, a neutralization cylinder, an oil removal cylinder, a micro-etching cylinder, an activation cylinder and a copper plating cylinder which are sequentially arranged along the board feeding direction.

[0029] In one embodiment, the copper deposition system further includes an acid-resistant hose, one end of which is connected to the liquid inlet of the pre-neutralization cylinder, and the other end of which is connected to the liquid outlet of the neutralization cylinder.

[0030] In one embodiment, the copper deposition system further includes a bulking cylinder, a pre-impregnation cylinder and an acceleration cylinder. The bulking cylinder is arranged adjacent to the degumming cylinder, the pre-impregnation cylinder is arranged between the micro-etching cylinder and the activation cylinder, and the acceleration cylinder is arranged between the activation cylinder and the copper plating cylinder.

[0031] Compared with the prior art, the present invention has at least the following advantages:

[0032] 1. By soaking the thin copper surface PCB board in the degumming tank for degumming treatment, the glue residue and pollutants on the surface and hole wall of the thin copper surface PCB board can be removed, and the cleanliness of the thin copper surface PCB board can be improved. At the same time, the degumming liquid in the degumming tank will also bite the base material of the thin copper surface PCB board, so that the hole wall of the thin copper surface PCB board forms a honeycomb-shaped micro-rough surface, which is conducive to the adsorption of the activation liquid, thereby increasing the bonding force of the copper layer, improving the copper deposition effect of the thin copper surface PCB board, and then effectively improving the yield rate of the thin copper surface PCB board.

[0033] 2. Since the degumming liquid contains alkaline potassium permanganate solution, by placing the thin copper surface PCB board after degumming treatment in a pre-neutralization cylinder for pre-neutralization treatment, the degumming liquid remaining on the surface of some thin copper surface PCB boards can be removed, and the pH value of the solution on the surface of the thin copper surface PCB board can be reduced, thereby reducing the activity of potassium permanganate. Then, by placing the thin copper surface PCB board after pre-neutralization treatment in a neutralization cylinder for neutralization treatment, the degumming liquid remaining on the surface of the thin copper surface PCB board can be removed, thereby reducing the side reactions in the subsequent steps. Further, the liquid medicine in the neutralization cylinder is the first neutralization liquid, and the liquid medicine in the pre-neutralization cylinder is the second neutralization liquid, and the first neutralization liquid and the second neutralization liquid are both mixed liquids of a copper-protecting neutralizer and sulfuric acid, wherein the copper-protecting neutralizer can not only remove the potassium permanganate reaction, but also will not corrode the copper surface of the thin copper surface PCB board, thereby avoiding excessive corrosion, reducing the roughness of the copper surface of the thin copper surface PCB board, thereby improving the yield rate of the thin copper surface PCB board, and reducing the consumption of the activation liquid.

[0034] 3. By placing the thin copper surface PCB board after neutralization treatment in the degreasing cylinder for degreasing treatment, the organic pollutants and oxide films on the board surface and holes of the thin copper surface PCB board are removed, and the charge in the holes of the thin copper surface PCB board is adjusted from negative charge to positive charge, thereby increasing the adsorption force of the thin copper surface PCB board on the activation liquid. Further, by placing the thin copper surface PCB board after degreasing treatment in the micro-etching cylinder for micro-etching treatment, the copper surface of the thin copper surface PCB board is slightly etched to ensure that the oxide on the copper surface is completely removed and the adhesion of the copper surface is improved. Then, by placing the thin copper surface PCB board after micro-etching treatment in the activation cylinder for activation treatment, the thin copper surface PCB board after degreasing treatment and micro-etching treatment has a better adsorption effect on the activation liquid, so that the activation liquid can quickly adhere to the board surface and hole wall of the thin copper surface PCB board. Finally, by placing the thin copper surface PCB board after activation treatment in the micro-etching cylinder for copper plating treatment, a thin copper surface PCB board with a better copper plating effect is obtained, thereby further improving the yield rate of the thin copper surface PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0036] Figure 1 The present invention is a flow chart of a copper deposition process based on a thin copper surface PCB board;

[0037] Figure 2 It is a structural schematic diagram of the copper deposition system based on the thin copper surface PCB board disclosed in the present invention;

[0038] Figure 3 for Figure 2 The schematic diagram of the partial structure of the copper deposition system based on the thin copper surface PCB board is shown;

[0039] Figure 4 for Figure 2 The schematic diagram of the partial structure of the copper deposition system based on the thin copper surface PCB board is shown;

[0040] Figure 5 for Figure 3 The schematic diagram of the partial structure of the copper deposition system based on the thin copper surface PCB board is shown;

[0041] Figure 6 This is an electron microscope image of the hole wall surface of a thin copper surface PCB board before the degumming process of the copper deposition process disclosed in the present invention;

[0042] Figure 7 This is an electron microscope image of the hole wall surface of a thin copper surface PCB board after the degumming treatment of the copper deposition process disclosed in the present invention;

[0043] Figure 8 The copper surface electron microscope image of the thin copper surface PCB board after the copper deposition process disclosed in the present invention is completed;

[0044] Fig. 9 This is an electron microscope image of the copper surface of a thin copper PCB board after the traditional copper deposition process is completed. DETAILED DESCRIPTION

[0045] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0046] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0047] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0048] The present disclosure provides a copper deposition process based on a thin copper surface PCB board, which includes the following steps: immersing the thin copper surface PCB board in a degumming tank for degumming treatment, so that the hole wall in the thin copper surface PCB board forms a honeycomb-shaped micro-rough surface. Placing the thin copper surface PCB board after the degumming treatment in a pre-neutralization tank for pre-neutralization treatment. Placing the thin copper surface PCB board after the pre-neutralization treatment in a neutralization tank for neutralization treatment. Placing the thin copper surface PCB board after the neutralization treatment in a degreasing tank for degreasing treatment. Placing the thin copper surface PCB board after the degreasing treatment in a micro-etching tank for micro-etching treatment. Placing the thin copper surface PCB board after the micro-etching treatment in an activation tank for activation treatment. Placing the thin copper surface PCB board after the activation treatment in a copper-plating tank for copper-plating treatment. Among them, the liquid medicine in the neutralization tank is the first neutralizing liquid, the liquid medicine in the pre-neutralization tank is the second neutralizing liquid, and the first neutralizing liquid and the second neutralizing liquid are both a mixture of a copper-protecting neutralizing agent and sulfuric acid.

[0049] The above copper deposition process based on the thin copper surface PCB board can remove the glue residue and pollutants on the surface and hole wall of the thin copper surface PCB board by immersing the thin copper surface PCB board in the degumming tank for degumming treatment, thereby improving the cleanliness of the thin copper surface PCB board. At the same time, the degumming liquid in the degumming tank will also corrode the base material of the thin copper surface PCB board, so that the hole wall in the thin copper surface PCB board forms a honeycomb-shaped micro-rough surface, which is conducive to the adsorption of the activation liquid, thereby increasing the bonding force of the copper layer, improving the copper deposition effect of the thin copper surface PCB board, and then effectively improving the yield rate of the thin copper surface PCB board.

[0050] Furthermore, since the degumming liquid contains an alkaline potassium permanganate solution, by placing the thin copper surface PCB board after degumming treatment in a pre-neutralization cylinder for pre-neutralization treatment, the degumming liquid remaining on the surface of the thin copper surface PCB board can be removed, and the pH value of the solution on the surface of the thin copper surface PCB board can be reduced, thereby reducing the activity of potassium permanganate. Then, by placing the thin copper surface PCB board after pre-neutralization treatment in a neutralization cylinder for neutralization treatment, the degumming liquid remaining on the surface of the thin copper surface PCB board is removed, and the side reactions in the subsequent steps are reduced. Further, the liquid medicine in the neutralization cylinder is the first neutralization liquid, and the liquid medicine in the pre-neutralization cylinder is the second neutralization liquid, and the first neutralization liquid and the second neutralization liquid are both a mixture of a copper-protecting neutralizer and sulfuric acid, wherein the copper-protecting neutralizer can not only remove the potassium permanganate reaction, but also will not corrode the copper surface of the thin copper surface PCB board, avoiding excessive corrosion, reducing the roughness of the copper surface of the thin copper surface PCB board, thereby improving the yield of the thin copper surface PCB board, and reducing the consumption of the activation liquid.

[0051] Furthermore, by placing the thin copper surface PCB board after the neutralization treatment in the degreasing cylinder for degreasing treatment, the organic pollutants and oxide films on the board surface and the holes of the thin copper surface PCB board are removed, and the charge in the holes of the thin copper surface PCB board is adjusted from negative charge to positive charge, thereby increasing the adsorption force of the thin copper surface PCB board on the activation liquid. Further, by placing the thin copper surface PCB board after the degreasing treatment in the micro-etching cylinder for micro-etching treatment, the copper surface of the thin copper surface PCB board is slightly etched to ensure that the oxide on the copper surface is completely removed and the adhesion of the copper surface is improved. Then, by placing the thin copper surface PCB board after the micro-etching treatment in the activation cylinder for activation treatment, the thin copper surface PCB board after the degreasing treatment and the micro-etching treatment has a better adsorption effect on the activation liquid, so that the activation liquid can quickly adhere to the board surface and the hole wall of the thin copper surface PCB board, and finally, by placing the thin copper surface PCB board after the activation treatment in the micro-etching cylinder for copper plating treatment, a thin copper surface PCB board with a better copper plating effect is obtained, thereby further improving the yield rate of the thin copper surface PCB board.

[0052] See also Figure 1 In order to better understand the copper deposition process based on the thin copper surface PCB board disclosed in the present invention, the copper deposition process based on the thin copper surface PCB board is further explained as follows:

[0053] A copper deposition process based on a thin copper surface PCB board according to one embodiment includes the following steps:

[0054] S11, immersing the thin copper surface PCB board in a degumming tank for degumming treatment, so that the hole wall in the thin copper surface PCB board forms a honeycomb-shaped micro-rough surface.

[0055] It should be noted that by placing thin copper-surface PCB boards in batches on the hanging basket of the overhead crane assembly, since the hanging basket is installed on the telescopic end of the telescopic drive component of the overhead crane assembly, and the telescopic drive component is installed on the moving part of the overhead crane assembly, the moving part moves on the slide rail to drive the thin copper-surface PCB boards to shuttle between multiple cylinders. In the present embodiment, firstly, the degumming liquid is configured in the degumming cylinder, that is, the raw material solution of the degumming liquid is added into the degumming cylinder, and then water is injected through the degumming pump installed on the degumming cylinder to mix the degumming liquid, so as to obtain the degumming liquid, and the moving part is driven to move on the slide rail so that the hanging basket is located directly above the degumming cylinder, and then the telescopic driving part is driven to perform telescopic operation so that the hanging basket is immersed in the degumming cylinder to perform degumming treatment on the thin copper surface PCB board, remove the glue residue and pollutants on the surface and hole wall of the thin copper surface PCB board, and at the same time, bite the substrate of the thin copper surface PCB board to form a honeycomb-shaped micro-rough surface on the hole wall of the thin copper surface PCB board, thereby improving the adsorption effect of the thin copper surface PCB board on the activation liquid, thereby increasing the bonding force of the copper layer, improving the copper deposition effect of the thin copper surface PCB board, and then effectively improving the yield rate of the thin copper surface PCB board.

[0056] In one embodiment, the degumming liquid is a mixture of potassium permanganate and sodium hydroxide, wherein the concentration of potassium permanganate is 50-70 g / L, and the concentration of sodium hydroxide is 35-45 g / L. It is understandable that by immersing the thin copper surface PCB board in the alkaline potassium permanganate solution, the glue residue and pollutants generated by the thin copper surface PCB board in the front-end process can be removed, and the alkaline potassium permanganate solution can bite the substrate, that is, bite the epoxy resin layer of the thin copper surface PCB board, so that the epoxy resin layer in the hole of the thin copper surface PCB board forms a honeycomb-shaped micro-rough surface, which improves the adsorption effect of the activation liquid, thereby increasing the bonding force of the copper layer, improving the copper deposition effect of the thin copper surface PCB board, and effectively improving the yield rate of the thin copper surface PCB board. Furthermore, in this embodiment, by controlling the concentration of potassium permanganate to 50-70 g / L and the concentration of sodium hydroxide to 35-45 g / L, the concentration of hexavalent manganese ions in the degumming liquid in the degumming tank is controlled below 25 g / L, so that the degumming rate can be controlled to 0.1-0.5 mg / cm 2 In this way, excessive etching is avoided while obtaining a honeycomb-shaped micro-rough surface with optimal adsorption of the activation liquid, wherein the roughness Ra value of the honeycomb-shaped micro-rough surface is 0.10 to 0.15 μm.

[0057] It should be noted that, since the degumming liquid treatment effect is limited, in order to adapt to the production needs of batch thin copper surface PCB boards while taking into account the yield rate of thin copper surface PCB boards, in this embodiment, the degumming liquid is treated at 40 to 50 m3 per liter. 2 The degumming liquid needs to be replaced after the board is removed. Specifically, the degumming liquid in the degumming tank is discharged into the waste liquid barrel through the degumming pump, and then the degumming tank and the degumming pump pipeline are flushed through the flushing operation to remove impurities and residual waste liquid in the degumming tank to ensure the purity of the degumming liquid in the degumming tank.

[0058] Furthermore, after the thin copper surface PCB board is debonded, the hanging basket is driven to rise by driving the telescopic driving member, and after the hanging basket is separated from the debonding cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket is moved to the top of the first water washing tank located between the debonding cylinder and the pre-neutralization cylinder, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the first water washing tank to remove the residual debonding liquid on the thin copper surface PCB board. In order not to affect the production efficiency of the copper deposition process line and to remove the residual debonding liquid on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the first water washing tanks is two, and the hanging baskets are sequentially passed into the first water washing tanks for immersion and cleaning through the overhead crane assembly.

[0059] S12, placing the thin copper surface PCB board after the debonding treatment in a pre-neutralization tank for pre-neutralization treatment.

[0060] In the present embodiment, after the water washing and soaking treatment, there is still glue removal liquid, i.e., alkaline potassium permanganate solution, on the thin copper surface PCB board. The telescopic driving part is driven to drive the hanging basket to rise. After the hanging basket leaves the first water washing tank, the moving part is driven to slide on the slide rail, so that the hanging basket moves to the top of the pre-neutralization cylinder, and then the telescopic driving part is driven to drive the hanging basket to descend, so that the hanging basket part is immersed in the pre-neutralization cylinder. The sulfuric acid and the copper protecting neutralizer in the second neutralization liquid can remove part of the alkaline potassium permanganate solution remaining on the thin copper surface PCB board, and adjust the pH value on the thin copper surface PCB board, i.e., the reaction of sulfuric acid and sodium hydroxide reduces the pH value on the thin copper surface PCB board, inhibits the activity of potassium permanganate, thereby avoiding the situation where the alkaline potassium permanganate over-etches the substrate of the thin copper surface PCB board, ensuring that the roughness Ra value of the honeycomb micro-rough surface is maintained between 0.1 and 0.5 μm, thereby ensuring that the thin copper surface PCB board has a good yield.

[0061] Furthermore, after the thin copper surface PCB board is pre-neutralized, the hanging basket is driven to rise by driving the telescopic drive member, and after the hanging basket is separated from the pre-neutralization cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket moves to the top of the second water washing tank located between the pre-neutralization cylinder and the neutralization cylinder, and then the telescopic drive member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the second water washing tank to remove the second neutralizing liquid remaining on the thin copper surface PCB board, to avoid the second neutralizing liquid from being brought into the neutralization cylinder to contaminate the first neutralizing liquid, and at the same time, the alkaline potassium permanganate solution on the thin copper surface PCB board can be further washed away. In order not to affect the production efficiency of the copper deposition process line, and at the same time to remove the second neutralizing liquid remaining on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the second water washing tanks is two, and the hanging basket is sequentially passed into the second water washing tank for immersion cleaning through the overhead crane assembly.

[0062] S13, placing the pre-neutralized thin copper PCB board in a neutralization tank for neutralization treatment.

[0063] In the present embodiment, after the pre-neutralization treatment and the water washing and soaking treatment, there is still glue removal liquid, i.e., alkaline potassium permanganate solution, on the thin copper surface PCB board. The telescopic driving part is driven to drive the hanging basket to rise. After the hanging basket is separated from the second water washing tank, the moving part is driven to slide on the slide rail, so that the hanging basket is moved to the top of the neutralization cylinder, and then the telescopic driving part is driven to drive the hanging basket to descend, so that the hanging basket part is immersed in the pre-neutralization cylinder. The sulfuric acid and copper protection neutralizer in the second neutralization liquid can remove the alkaline potassium permanganate solution remaining on the thin copper surface PCB board, reduce the side reactions in the subsequent steps, and also avoid the situation that the alkaline potassium permanganate over-etches the substrate of the thin copper surface PCB board, ensuring that the roughness Ra value of the honeycomb micro-rough surface is maintained between 0.1 and 0.5 μm, thereby ensuring that the thin copper surface PCB board has a good yield.

[0064] Furthermore, after the thin copper surface PCB board is neutralized, the telescopic driving member is driven to drive the hanging basket to rise, and after the hanging basket is separated from the neutralization cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket moves to the top of the third water washing tank located between the neutralization cylinder and the degreasing cylinder, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket is immersed in the third water washing tank to remove the first neutralizing liquid remaining on the thin copper surface PCB board, and avoid the first neutralizing liquid from being brought into the degreasing cylinder to contaminate the degreasing liquid. In order not to affect the production efficiency of the copper deposition process line, and at the same time to remove the first neutralizing liquid remaining on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the third water washing tanks is two, and the hanging basket is sequentially passed into the third water washing tank for immersion cleaning through the overhead crane assembly.

[0065] S14, placing the neutralized thin copper surface PCB board in a degreasing tank for degreasing treatment.

[0066] In the present embodiment, there are organic pollutants and oxide films on and in the holes of the thin copper surface PCB board after degreasing treatment and water washing and immersion treatment. The telescopic driving member is driven to drive the hanging basket to rise. After the hanging basket is separated from the third water washing tank, the moving member is driven to slide on the slide rail to move the hanging basket to the top of the degreasing cylinder. Then, the telescopic driving member is driven to drive the hanging basket to descend, and the hanging basket is immersed in the degreasing cylinder. The organic pollutants and oxide films are removed by the degreasing liquid. At the same time, the charge in the hole of the thin copper surface PCB board is adjusted from negative charge to positive charge, thereby increasing the adsorption force of the thin copper surface PCB board to the activation liquid, thereby enhancing the bonding force of the copper layer, so that the thin copper surface PCB board obtains a better copper deposition effect, thereby improving the yield rate of the thin copper surface PCB board.

[0067] In one embodiment, the degreasing liquid is a pore-forming agent M105D, which is a mixed solution of polyethylene glycol and sodium carbonate, wherein the concentration of the pore-forming agent M105D is 4-6%. It is understandable that sodium carbonate is a weak alkaline substance, which can release hydroxide ions when dissolved in water, making the degreasing liquid alkaline. In an alkaline environment, the negative charge on the surface of the hole wall of the thin copper surface PCB board will be affected by the hydroxide ions, and the charge will be neutralized or redistributed, thereby causing a change in the charge state of the hole wall, from a negative charge to a positive charge. Polyethylene glycol has good water solubility and chemical stability, which increases the dispersion effect of the degreasing liquid and increases the change in the charge state of the hole wall of the thin copper surface PCB board. Furthermore, sodium carbonate itself can undergo saponification reaction with oils and fats, and can also undergo chemical reaction with oxide film to dissolve or complex the oxide film, while polyethylene glycol has good emulsifying properties. The two complement each other to remove organic pollutants. In addition, polyethylene glycol has good permeability, which enables the degreasing liquid to penetrate into the tiny gaps on the surface of the hole wall of the thin copper surface PCB board, further removing organic pollutants and oxide film, thereby improving the cleanliness of the thin copper surface PCB board, so as to facilitate the smooth progress of the micro-etching process.

[0068] It should be noted that, since the chemical treatment effect of the degreasing liquid is limited, in order to adapt to the production needs of batch thin copper surface PCB boards while taking into account the yield of thin copper surface PCB boards, in this embodiment, when the copper ion concentration in the degreasing liquid reaches 2g / L, the degreasing function of the degreasing liquid will fail, and the degreasing liquid needs to be replaced. Specifically, the degreasing liquid in the degreasing cylinder is discharged into the waste liquid barrel through the degreasing pump, and then the pipelines of the degreasing cylinder and the degreasing pump are flushed through the flushing operation to remove impurities and residual waste liquid in the oil cylinder to ensure the purity of the degreasing liquid in the degreasing oil.

[0069] Furthermore, after the thin copper surface PCB board is degreased, the hanging basket is driven to rise by driving the telescopic driving member, and after the hanging basket is separated from the degumming cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket is moved to the top of the fourth water washing tank located between the degreasing cylinder and the micro-etching cylinder, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the fourth water washing tank to remove the residual degreasing liquid on the thin copper surface PCB board. In order not to affect the production efficiency of the copper deposition process line and to remove the residual degreasing liquid on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the fourth water washing tanks is two, and the hanging baskets are sequentially passed into the fourth water washing tanks for immersion cleaning through the overhead crane assembly.

[0070] S15, placing the degreased thin copper surface PCB board in a micro-etching tank for micro-etching treatment.

[0071] In this embodiment, the hanging basket is driven to rise by driving the telescopic driving member. After the hanging basket leaves the fourth water washing tank, the moving member is driven to slide on the slide rail to move the hanging basket to the top of the micro-etching cylinder. Then, the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket is immersed in the micro-etching cylinder, and the copper surface of the thin copper surface PCB board is slightly etched by the micro-etching liquid to ensure that the oxide on the copper surface is completely removed while improving the adhesion of the copper surface.

[0072] In one embodiment, the micro-etching solution is a mixed solution of sodium persulfate and sulfuric acid, wherein the concentration of sodium persulfate is 60-100 g / L and the concentration of sulfuric acid accounts for 2-4%. It is understandable that sodium persulfate and sulfuric acid will react to produce hydrogen peroxide, and sulfuric acid will etch away the copper oxide on the surface of the copper surface, so that hydrogen peroxide can act on the copper, and by slightly etching the copper surface, the roughness of the copper surface is increased, thereby increasing the adsorption effect of the activation solution, thereby increasing the bonding force of the copper layer, and when the concentration of sodium persulfate is 60-100 g / L and the concentration of sulfuric acid accounts for 2-4%, the micro-etching amount of each thin copper surface PCB board is controlled at 0.5-1.0 μm, which can avoid the over-etching of the copper foil layer of the thin copper surface PCB board, thereby improving the yield rate of the thin copper surface PCB board.

[0073] It should be noted that, since the chemical treatment effect of the micro-etching solution is limited, in order to adapt to the production needs of batch thin copper surface PCB boards while taking into account the yield of thin copper surface PCB boards, in this embodiment, when the copper ion concentration in the micro-etching solution reaches 30g / L, the etching function of the micro-etching solution will fail, and the micro-etching solution needs to be replaced. Specifically, the micro-etching solution in the micro-etching cylinder is discharged into the waste liquid barrel through the micro-etching pump, and then the micro-etching cylinder and the micro-etching pump pipeline are flushed through the flushing operation to remove impurities and residual waste liquid in the micro-etching cylinder to ensure the purity of the micro-etching solution in the micro-etching cylinder.

[0074] Furthermore, after the thin copper surface PCB board is micro-etched, the hanging basket is driven to rise by driving the telescopic driving member, and after the hanging basket is separated from the degumming cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket is moved to the top of the fifth water washing tank located between the micro-etching tank and the pre-immersion tank, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the fifth water washing tank to remove the residual micro-etching liquid on the thin copper surface PCB board. In order not to affect the production efficiency of the copper deposition process line and to remove the residual micro-etching liquid on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the fifth water washing tanks is two, and the hanging basket is sequentially passed into the fifth water washing tank for immersion and cleaning through the overhead crane assembly.

[0075] In one embodiment, after the step of placing the degreasing thin copper surface PCB board in a micro-etching tank for micro-etching treatment, and before the step of placing the micro-etching thin copper surface PCB board in an activation tank for activation treatment, the copper deposition process further includes the following steps:

[0076] Place the thin copper surface PCB board in the prepreg tank for prepreg treatment.

[0077] It should be noted that after the water washing treatment, cleaning water and impurities still remain on the thin copper surface PCB board. The telescopic driving part is driven to drive the hanging basket to rise. After the hanging basket leaves the fifth water washing tank, the moving part is driven to slide on the slide rail to move the hanging basket to the top of the prepreg cylinder. Then the telescopic driving part is driven to drive the hanging basket to descend, so that the hanging basket part is immersed in the prepreg cylinder. The cleaning water and impurities remaining on the thin copper surface PCB board are removed by the prepreg liquid to avoid the cleaning water and impurities being brought into the activation cylinder to contaminate the activation liquid, thereby ensuring the purity of the activation liquid in the activation cylinder.

[0078] Further, in the present embodiment, the pre-dip solution is a mixture of sodium chloride and concentrated hydrochloric acid, wherein the concentration of sodium chloride is 180-220 g / L, and the concentration of concentrated hydrochloric acid accounts for 2-5%. It is understandable that by controlling the concentration of sodium chloride to 180-220 g / L and the concentration of concentrated hydrochloric acid to 2-5%, the specific gravity of the pre-dip solution will be controlled between 1.10-1.14, with a good sodium chloride completely dissolved, while the surface of the thin copper surface PCB board is leached to remove the residual cleaning water and impurities on the thin copper surface PCB board, and the acid equivalent concentration of the pre-dip solution will be controlled at 0.2-0.6N, so that the surface of the thin copper surface PCB board is filled with acidic pre-dip solution, and then the thin copper surface PCB board can quickly absorb the activation solution after being transferred to the activation cylinder, thereby improving the adsorption effect of the thin copper surface PCB board on the activation solution.

[0079] Furthermore, since the effect of the chemical treatment of the pre-dip liquid is limited, in order to adapt to the production needs of batches of thin copper surface PCB boards while taking into account the yield rate of thin copper surface PCB boards, in this embodiment, when the copper ion concentration in the pre-dip liquid reaches 1.0g / L, the pre-dip liquid needs to be replaced with a micro-etching liquid. Specifically, the pre-dip liquid in the pre-dip tank is discharged into a waste liquid barrel through a pre-dip pump, and then the pre-dip tank and the pipeline of the pre-dip pump are flushed through a flushing operation to remove impurities and residual waste liquid in the pre-dip tank, thereby ensuring the purity of the pre-dip liquid in the pre-dip tank.

[0080] S16, placing the thin copper surface PCB board after micro-etching in an activation tank for activation treatment.

[0081] In this embodiment, the hanging basket is driven to rise by driving the telescopic driving member. After the hanging basket is separated from the prepreg cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket is moved to the top of the activation cylinder, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the activation cylinder, so that the surface and hole wall of the thin copper surface PCB board can fully absorb the activation liquid, thereby improving the copper layer bonding strength of the thin copper surface PCB board during the subsequent copper treatment, thereby improving the copper deposition effect of the thin copper surface PCB board, and further improving the yield rate of the thin copper surface PCB board.

[0082] It should be noted that the activation solution is a mixture of activator M202 and concentrated hydrochloric acid, wherein activator M202 is a mixture of palladium chloride, stannous chloride and sodium chloride, the concentration of activator M202 accounts for 1.4% to 2.0%, and the concentration of concentrated hydrochloric acid accounts for 3% to 5%. It can be understood that activator M202 forms colloidal palladium with a negative charge in the activation solution, and the board surface and hole wall of the thin copper surface PCB board after degreasing treatment carry positive charges, which can effectively adsorb the colloidal palladium with a negative charge, and at the same time, the honeycomb-shaped micro-rough surface in the hole wall of the thin copper surface PCB board can further enhance the adsorption effect of colloidal palladium, so that the copper layer bonding force of the thin copper surface PCB board during the subsequent copper treatment can be improved, so that the thin copper surface PCB board can obtain a better copper deposition effect, thereby effectively improving the yield rate of the thin copper surface PCB board. In addition, the first neutralizing solution and the second neutralizing solution both use a copper-protecting neutralizing agent, which can prevent the roughness of the copper surface of the thin copper surface PCB from increasing during the pre-neutralization treatment and neutralization treatment steps, thereby avoiding unnecessary waste of activation liquid, improving the yield of the thin copper surface PCB while saving the loss of activation liquid, and reducing the production cost of the thin copper surface PCB.

[0083] Furthermore, since the potency of the activation liquid is limited, in order to meet the production needs of batches of thin copper surface PCB boards while taking into account the yield rate of thin copper surface PCB boards, in this embodiment, when the copper ion concentration in the activation liquid reaches 1.5g / L, the activation liquid needs to be replaced with a micro-etching liquid. Specifically, the activation liquid in the activation cylinder is discharged into a waste liquid barrel through an activation pump, and then the pipelines of the activation cylinder and the activation pump are flushed through a flushing operation to remove impurities and residual waste liquid in the activation cylinder, thereby ensuring the purity of the activation liquid in the activation cylinder.

[0084] Furthermore, after the thin copper surface PCB board is activated, the hanging basket is driven to rise by driving the telescopic driving member, and after the hanging basket is separated from the activation cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket is moved to the top of the sixth water washing tank located between the activation cylinder and the acceleration cylinder, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the sixth water washing tank to remove the residual activation liquid on the thin copper surface PCB board. In order not to affect the production efficiency of the copper deposition process line and to remove the residual activation liquid on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the sixth water washing tanks is two, and the hanging baskets are sequentially passed into the sixth water washing tanks for immersion and cleaning through the overhead crane assembly.

[0085] In one embodiment, after the step of placing the thin copper surface PCB board after micro-etching treatment in an activation tank for activation treatment, and after the step of placing the thin copper surface PCB board after activation treatment in a copper treatment tank for copper treatment, the copper deposition process further includes the following steps:

[0086] Place the thin copper PCB board in the acceleration cylinder for acceleration treatment.

[0087] It should be noted that the hanging basket is driven to rise by driving the telescopic driving member, and after the hanging basket leaves the sixth washing tank, the moving member is driven to slide on the slide rail, so that the hanging basket moves to the top of the acceleration cylinder, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket is immersed in the acceleration cylinder, and the acceleration liquid in the acceleration cylinder accelerates the dissolution of the colloidal palladium, so that the ions around the colloidal palladium are dissolve, and the palladium as the catalytic center is exposed, thereby improving the activity of the catalyst palladium nucleus, and at the same time, the effect of the activation liquid on the copper plating cylinder is minimized, so that the copper layer bonding strength of the thin copper surface PCB board in the subsequent copper plating treatment can be improved, and the copper deposition effect of the thin copper surface PCB board can be improved, thereby improving the yield rate of the thin copper surface PCB board.

[0088] Further, in this embodiment, the accelerating liquid is an ammonium bicarbonate solution, wherein the concentration of ammonium bicarbonate is 8 to 12 g / L. It is understandable that the concentration of ammonium bicarbonate is between 8 and 12 g / L, and the pH of the accelerating liquid is controlled between 8.2 and 9.3, which can accelerate the dissolution speed of the ions around the colloidal palladium, make the colloidal palladium dissolution more thorough, maximize the activity of the catalyst palladium nucleus, and reduce the impact of the colloid introduced into the copper treatment cylinder on the copper treatment, thereby improving the copper deposition effect of the thin copper surface PCB board. Specifically, ammonium bicarbonate provides an alkaline environment for the accelerating liquid, and the alkaline environment helps to improve the surface charge state of the colloidal palladium particles and reduce their stability. At the same time, ammonium bicarbonate will produce ammonia and carbon dioxide in the solution. These gases will form tiny bubbles in the solution, forming local disturbances around the colloidal palladium particles, destroying the electrostatic repulsion and steric hindrance effect between the colloidal palladium particles, thereby accelerating the dissolution of the ions around the colloidal palladium.

[0089] Furthermore, since the treatment effect of the accelerating liquid is limited, in order to adapt to the production demand of batch thin copper surface PCB boards while taking into account the yield rate of thin copper surface PCB boards, in this embodiment, the accelerating liquid is used to treat 20m 2 The acceleration fluid needs to be replaced after the board is replaced. Specifically, the acceleration fluid in the acceleration cylinder is discharged into the waste liquid barrel through the acceleration pump, and then the pipelines of the acceleration cylinder and the acceleration pump are flushed through the flushing operation to remove impurities and residual waste liquid in the acceleration cylinder to ensure the purity of the acceleration fluid in the acceleration cylinder.

[0090] Furthermore, after the thin copper surface PCB board is accelerated, the hanging basket is driven to rise by driving the telescopic driving member, and the hanging basket drives the moving member to slide on the slide rail after leaving the activation cylinder, so that the hanging basket moves to the top of the seventh water washing tank located between the acceleration cylinder and the copperizing cylinder, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the seventh water washing tank to remove the acceleration liquid remaining on the thin copper surface PCB board. In order not to affect the production efficiency of the copper deposition process line and to remove the acceleration liquid remaining on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the seventh water washing tanks is two, and the hanging basket is sequentially passed into the seventh water washing tank for immersion and cleaning through the overhead crane assembly.

[0091] S17, placing the activated thin copper surface PCB board in a copperizing tank for copperizing treatment.

[0092] In this embodiment, the hanging basket is driven to rise by driving the telescopic driving member. After the hanging basket is separated from the seventh washing tank, the moving member is driven to slide on the slide rail to move the hanging basket to the top of the activation cylinder. Then, the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket is immersed in the copper-plating cylinder, so that the surface and hole wall of the thin copper-surface PCB board can be fully contacted with the copper-plating liquid, and a copper layer is deposited on the surface and hole wall of the thin copper-surface PCB board under the catalysis of the catalyst palladium core.

[0093] Further, in this embodiment, the copper solution is a mixed solution of copper sulfate, sodium hydroxide, potassium sodium tartrate, polyethylene glycol and formaldehyde, wherein the concentration of copper ions is 1.5-2.3 g / L, the concentration of sodium hydroxide is 9-15 g / L, and the concentration of formaldehyde is 5-8 g / L. It can be understood that under this concentration condition, the copper layer deposition thickness can be controlled to 0.3-0.6 μm, so that the thin copper surface PCB board can obtain a better copper deposition effect. Specifically, copper sulfate provides copper ions for the copper plating solution, the addition of sodium hydroxide can not only adjust the pH value, but also enable the formaldehyde reducing agent to fully exert its reducing effect, thereby promoting the chemical copper plating reaction. Potassium sodium tartrate, as a chelating agent, can form a stable complex with copper ions to prevent spontaneous reduction of copper ions in the plating solution. It can also control the speed of the copper plating reaction, thereby making the formation of the coating more uniform and dense. The role of polyethylene glycol is to prevent the occurrence of electrodeposition during the copper plating process, thereby helping to obtain a flatter and smoother copper plating layer, while improving the fluidity of the copper plating solution, thereby making the copper plating layer more uniform.

[0094] Furthermore, since the treatment effect of the copper solution is limited, in order to adapt to the production demand of batch thin copper surface PCB boards while taking into account the yield rate of thin copper surface PCB boards, in this embodiment, the copper solution is treated at 65 to 75 m3 per liter. 2The copper-plating liquid needs to be replaced after the board is replaced. Specifically, the copper-plating liquid in the copper-plating tank is discharged into the waste liquid barrel through the copper-plating pump, and then the copper-plating tank and the pipes of the copper-plating pump are flushed by flushing operation to remove impurities and residual waste liquid in the copper-plating tank to ensure the purity of the copper-plating liquid in the copper-plating tank.

[0095] Furthermore, after the copper plating treatment of the thin copper surface PCB board, the hanging basket is driven to rise by driving the telescopic driving member, and after the hanging basket is separated from the copper plating cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket is moved to the top of the eighth water washing tank arranged near the copper plating tank, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the eighth water washing tank to remove the copper plating liquid remaining on the thin copper surface PCB board. In order not to affect the production efficiency of the copper plating process line, and at the same time to remove the copper plating liquid remaining on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the eighth water washing tank is two, and the hanging basket is sequentially passed into the eighth water washing tank for immersion and cleaning through the overhead crane assembly, so that a thin copper surface PCB board with a good copper plating effect can be obtained.

[0096] In one embodiment, after the step of immersing the thin copper surface PCB board in a degumming tank for degumming treatment, and before the step of placing the degummed thin copper surface PCB board in a pre-neutralization tank for pre-neutralization treatment, the copper deposition process further includes the following steps:

[0097] When the copper ion concentration in the first neutralization liquid is greater than or equal to the first preset concentration value, the first neutralization liquid in the neutralization cylinder is transported to the pre-neutralization cylinder through an acid-resistant hose to form a second neutralization liquid, and the first neutralization liquid is re-configured in the neutralization cylinder.

[0098] It should be noted that, since one end of the acid-resistant hose is connected to the neutralization cylinder and the other end of the acid-resistant hose is movably connected to the pre-neutralization pump, when the copper ion concentration in the first neutralization liquid is greater than or equal to the first preset concentration value, that is, the neutralization effect of the first neutralization liquid decreases, the acid-resistant hose is connected to the pre-neutralization pump, and the pre-neutralization pump is driven to discharge the first neutralization liquid in the neutralization cylinder into the pre-neutralization cylinder to form a second neutralization liquid, thereby realizing the waste liquid recycling of the first neutralization liquid. This can not only avoid the over-corrosion of the copper surface during the pre-neutralization and neutralization processes, but also reduce the cost output of materials, improve the yield rate of thin copper surface PCB boards, and reduce the production cost of thin copper surface PCB boards.

[0099] In one embodiment, the first preset concentration value of the copper ion concentration in the first neutralization solution is 1.5 g / L. It is understandable that when the copper ion concentration in the first neutralization solution reaches 1.5 g / L, the neutralization treatment effect will drop sharply, and it is impossible to cope with the mass production of thin copper surface PCB boards, thereby failing to ensure the yield rate of thin copper surface PCB boards. However, the first neutralization solution still has a neutralization treatment effect, so the waste liquid of the first neutralization solution is discharged into the pre-neutralization cylinder for reuse, so as to maximize the material utilization rate while matching the production needs of batch thin copper surface PCB boards, thereby ensuring that the thin copper surface PCB has a high production efficiency and yield rate.

[0100] Further, when the copper ion concentration in the second neutralizing solution is too high, the neutralization treatment effect of the second neutralizing solution will fail. In the present embodiment, when the copper ion concentration in the second neutralizing solution is greater than or equal to the second preset concentration value, the second neutralizing solution in the pre-neutralization cylinder is discharged to the waste liquid bucket through the acid-resistant hose, and then the first neutralizing solution in the neutralization cylinder is transported to the pre-neutralization cylinder by the acid-resistant hose to form a new second neutralizing solution, and a new first neutralizing solution is configured in the neutralization cylinder. It can be understood that in order to match the production requirements of batches of thin copper surface PCB boards, the waste of materials is reduced at the same time. Even if the copper ion concentration of the first neutralizing solution is less than the first preset concentration value, the first neutralizing solution is also discharged into the pre-neutralization cylinder to form a new second neutralizing solution. The whole process needs to be discharged and transported by the acid-resistant hose to ensure the stability of the discharge and transportation, and after the first neutralizing solution is completely discharged into the pre-neutralization cylinder to form a new second neutralizing solution, a new first neutralizing solution is reconfigured in the neutralization cylinder to ensure the stable copper deposition process of the thin copper surface PCB board.

[0101] In one embodiment, the copper protection neutralizer includes a surfactant and EDTA. It is understandable that the surfactant can increase the wettability and permeability of the copper protection neutralizer, so as to help improve the wettability and permeability of the first neutralizing solution and the second neutralizing solution to cover the tiny gaps in the hole wall of the thin copper surface PCB board. At the same time, the surfactant and EDTA will form a protective film on the copper surface of the thin copper surface PCB board, which not only does not corrode the copper surface, but also can further prevent the corrosion of the copper surface by alkaline potassium permanganate, thereby achieving an excellent copper protection effect. Further, EDTA and sulfuric acid jointly neutralize the sodium hydroxide in the alkaline potassium permanganate solution to reduce the pH value of the residual alkaline potassium permanganate solution, thereby reducing the activity of potassium permanganate. Further, in this embodiment, the surfactant is an alcohol ether compound, and the alcohol ether compound is a fatty alcohol polyoxyethylene ether or an alkylphenol polyoxyethylene ether. Among them, alcohol ether compounds can dissolve and disperse the residues in the alkaline potassium permanganate solution and the formed colloidal particles or precipitates, thereby preventing these substances from being deposited on the copper surface and causing corrosion, so that the roughness of the copper surface of the thin copper surface PCB board is lower after pre-neutralization treatment and neutralization treatment, ensuring the stability of the copper foil layer of the thin copper surface PCB board, thereby improving the yield rate of the thin copper surface PCB board.

[0102] In one embodiment, the concentration of sulfuric acid in the first neutralization solution is 4% to 6%, and the concentration of the copper-protecting neutralizer in the first neutralization solution is 15% to 25%;

[0103] The concentration of sulfuric acid in the second neutralization solution is 4% to 6%, and the concentration of the copper-protecting neutralizer in the second neutralization solution is 10% to 15%.

[0104] It is understandable that the difference between the first neutralizing solution and the second neutralizing solution is the concentration of the copper-protecting neutralizing agent, and the second neutralizing solution is formed by the waste liquid discharge of the first neutralizing solution. As the processing volume increases, the concentrations of the copper-protecting neutralizing agent in the first neutralizing solution and the second neutralizing solution are inconsistent. In this embodiment, the waste liquid of the first neutralizing solution is used as the second neutralizing solution to improve the utilization rate of materials and reduce the production cost of thin copper surface PCB boards.

[0105] In one embodiment, before the step of immersing the thin copper surface PCB board in a degumming tank for degumming treatment, the copper deposition process further includes the following steps:

[0106] The thin copper surface PCB board is immersed in the swelling cylinder for swelling treatment.

[0107] It should be noted that before the thin copper surface PCB board is degummed, the moving part is driven to slide on the slide rail to move the hanging basket to the top of the bulking cylinder, and then the telescopic driving part is driven to drive the hanging basket to descend, so that the hanging basket is immersed in the bulking cylinder, and the base material of the thin copper surface PCB board is softened and expanded by the bulking liquid, which helps the alkaline potassium permanganate solution to remove the glue residue and pollutants generated by the front-end drilling process, increases the biting effect of the degumming liquid, and improves the degumming effect.

[0108] Further, in the present embodiment, the leavening liquid is an aqueous solution of leavening agent M1601, wherein the concentration of leavening agent M1601 accounts for 35% to 45%. Further, leavening agent M1601 is a mixture of diethylene glycol and o-cresolphthalein complexing agent. It is understandable that diethylene glycol can dissolve some organic components in the glue residue, and o-cresolphthalein complexing agent can form a complex with the metal ions in the glue residue, thereby changing the chemical properties of the glue residue, thereby making the glue residue soft. In addition, diethylene glycol also has good permeability. Diethylene glycol can penetrate into the tiny pores in the hole wall of the thin copper surface PCB board to destroy the glue residue structure in the pores, which helps to improve the treatment effect of the glue removal liquid on the glue residue in the tiny gaps in the hole wall of the thin copper surface PCB board, and further improve the yield rate of the thin copper surface PCB board.

[0109] Furthermore, since the treatment effect of the bulking liquid is limited, in order to meet the production needs of batches of thin copper PCB boards while taking into account the yield rate of thin copper PCB boards, in this embodiment, the bulking liquid is used to treat 40 to 50 m3 of PCB per liter. 2 After the board is replaced, the leavening liquid needs to be replaced. Specifically, the leavening liquid in the leavening cylinder is discharged into the waste liquid barrel through the leavening pump, and then the pipes of the leavening cylinder and the leavening pump are flushed through the flushing operation to remove impurities and residual waste liquid in the leavening cylinder to ensure the purity of the leavening liquid in the leavening cylinder.

[0110] Furthermore, after the thin copper surface PCB board is bulked, the telescopic driving member is driven to drive the hanging basket to rise, and after the hanging basket is separated from the bulking cylinder, the moving member is driven to slide on the slide rail, so that the hanging basket is moved to the top of the ninth water washing tank located between the bulking cylinder and the degumming cylinder, and then the telescopic driving member is driven to drive the hanging basket to descend, so that the hanging basket member is immersed in the ninth water washing tank to remove the residual bulking liquid on the thin copper surface PCB board. In order not to affect the production efficiency of the copper deposition process line and to remove the residual bulking liquid on the thin copper surface PCB board to the greatest extent, in this embodiment, the number of the ninth water washing tanks is two, and the hanging baskets are sequentially passed into the ninth water washing tanks for immersion and cleaning through the overhead crane assembly.

[0111] See also Figures 3 to 5 The present disclosure further provides a copper deposition system 10 based on a thin copper surface PCB board, which is used in the copper deposition process based on a thin copper surface PCB board described in any of the above embodiments;

[0112] The copper deposition system 10 includes a degumming tank 100, a pre-neutralization tank 200, a neutralization tank 300, a degreasing tank 400, a micro-etching tank 500, an activation tank 600 and a copper-plating tank 700 which are sequentially arranged along the board feeding direction.

[0113] In this embodiment, by immersing the thin copper surface PCB board in the degumming tank 100 for degumming treatment, the glue residue and pollutants on the surface and hole wall of the thin copper surface PCB board can be removed, thereby improving the cleanliness of the thin copper surface PCB board. At the same time, the degumming liquid in the degumming tank 100 will also corrode the substrate of the thin copper surface PCB board, so that the hole wall in the thin copper surface PCB board forms a honeycomb-shaped micro-rough surface, which is conducive to the adsorption of the activation liquid, thereby increasing the bonding force of the copper layer, improving the copper deposition effect of the thin copper surface PCB board, and then effectively improving the yield rate of the thin copper surface PCB board.

[0114] Furthermore, since the degumming liquid contains an alkaline potassium permanganate solution, the degumming liquid remaining on the surface of the thin copper surface PCB board can be removed by placing the degumming-treated thin copper surface PCB board in a pre-neutralization cylinder 200 for pre-neutralization treatment, and the pH value of the solution on the surface of the thin copper surface PCB board can be reduced, thereby reducing the activity of potassium permanganate. The degumming liquid remaining on the surface of the thin copper surface PCB board can be removed by placing the pre-neutralized thin copper surface PCB board in a neutralization cylinder 300 for neutralization treatment, thereby reducing the occurrence of side reactions in subsequent steps. Furthermore, the liquid medicine in the neutralization cylinder 300 is the first neutralization liquid, and the liquid medicine in the pre-neutralization cylinder 200 is the second neutralization liquid, and both the first neutralization liquid and the second neutralization liquid are a mixture of a copper-protecting neutralizer and sulfuric acid, wherein the copper-protecting neutralizer can not only remove the potassium permanganate reaction, but also will not corrode the copper surface of the thin copper surface PCB board, thus avoiding excessive corrosion, reducing the roughness of the copper surface of the thin copper surface PCB board, thereby improving the yield of the thin copper surface PCB board, and reducing the consumption of activation liquid.

[0115] Furthermore, the thin copper surface PCB board after the neutralization treatment is placed in the degreasing cylinder 400 for degreasing treatment, and the organic pollutants and oxide films on the board surface and in the holes of the thin copper surface PCB board are removed, and the charge in the holes of the thin copper surface PCB board is adjusted from negative charge to positive charge, thereby increasing the adsorption capacity of the thin copper surface PCB board to the activation liquid. Furthermore, the thin copper surface PCB board after the degreasing treatment is placed in the micro-etching cylinder 500 for micro-etching treatment, and the copper surface of the thin copper surface PCB board is slightly etched to ensure that the oxide on the copper surface is completely removed while improving the adhesion of the copper surface. Then, the thin copper surface PCB board after micro-etching treatment is placed in the activation tank 600 for activation treatment. The thin copper surface PCB board after degreasing treatment and micro-etching treatment has a better adsorption effect on the activation liquid, so that the activation liquid can quickly adhere to the board surface and hole wall of the thin copper surface PCB board. Finally, the thin copper surface PCB board after activation treatment is placed in the micro-etching tank 500 for copper plating treatment to obtain a thin copper surface PCB board with a better copper plating effect, thereby further improving the yield rate of the thin copper surface PCB board.

[0116] like Figure 2 As shown, in one embodiment, the copper deposition system 10 further includes an acid-resistant hose 800, one end of which is connected to the liquid inlet of the pre-neutralization cylinder 200, and the other end of which is connected to the liquid outlet of the neutralization cylinder 300. It can be understood that the first neutralization liquid still has a neutralization treatment effect after being scrapped. In order to reduce the waste of materials and reduce the roughness of the copper surface during the pre-neutralization treatment process, the waste liquid of the first neutralization liquid is discharged from the acid-resistant hose 800 to the pre-neutralization cylinder 200 for recycling, thereby improving the utilization rate of materials and improving the yield rate of thin copper surface PCB boards.

[0117] like Figure 2As shown, in one embodiment, the copper deposition system 10 further includes a bulking cylinder 900, a pre-preg cylinder 1000 and an acceleration cylinder 1100, wherein the bulking cylinder 900 is arranged adjacent to the degumming cylinder 100, the pre-preg cylinder 1000 is arranged between the micro-etching cylinder 500 and the activation cylinder 600, and the acceleration cylinder 1100 is arranged between the activation cylinder 600 and the copper-plating cylinder 700. It can be understood that by immersing the thin copper surface PCB board in the bulking cylinder 900 for bulking treatment, the substrate of the thin copper surface PCB board can be softened and bulked, which helps the alkaline potassium permanganate solution to remove the glue residue and pollutants generated by the front-end drilling process, increases the gnawing effect of the degumming liquid, and improves the degumming effect. Further, by placing the thin copper surface PCB board in the pre-preg cylinder 1000 for pre-preg treatment, the pre-preg liquid can remove the residual cleaning water and impurities of the thin copper surface PCB board, avoid the cleaning water and impurities from being brought into the activation cylinder 600 to contaminate the activation liquid, and ensure the purity of the activation liquid in the activation cylinder 600. Furthermore, by placing the thin copper surface PCB board in the acceleration cylinder 1100 for acceleration treatment, the acceleration liquid accelerates the dissolution of the colloidal palladium, so that the ions around the colloidal palladium are dissolved to expose the palladium as the catalytic center, thereby improving the activity of the catalyst palladium nucleus, and at the same time, the effect of the activation liquid on the copper plating cylinder 700 is reduced to a minimum, so that the copper layer bonding strength of the thin copper surface PCB board in the subsequent copper plating treatment can be improved, the copper deposition effect of the thin copper surface PCB board can be improved, and thus the yield rate of the thin copper surface PCB board can be improved.

[0118] like Figure 3 As shown, in one embodiment, a degumming pump 110 is provided on the degumming cylinder 100, one end of the degumming pump 110 is connected to the degumming cylinder 100, and the other end of the degumming pump 110 is used to be movably connected to the water inlet pipe or the liquid discharge pipe. It can be understood that the degumming liquid waste is discharged through the degumming pump 110, the degumming pump 110 and the degumming cylinder 100 are rinsed through the water inlet pipe, and after the rinsing is completed, the raw materials of the degumming liquid are added to the degumming cylinder 100, and then water is input through the water inlet pipe for dilution and configuration to obtain new degumming liquid.

[0119] As shown in the figure, in one embodiment, a pre-neutralization pump 210 is provided on the pre-neutralization cylinder 200, one end of the pre-neutralization pump 210 is connected to the pre-neutralization cylinder 200, and the other end of the pre-neutralization pump 210 is used to communicate with the water inlet pipe or the liquid discharge pipe. It can be understood that the second neutralization liquid waste is discharged through the pre-neutralization pump 210, and the pre-neutralization pump 210 and the pre-neutralization cylinder 200 are flushed through the water inlet pipe.

[0120] like Figure 3As shown, in one embodiment, a neutralization pump 310 is provided on the neutralization cylinder 300, one end of the neutralization pump 310 is connected to the neutralization cylinder 300, and the other end of the neutralization pump 310 is used to be movably connected to the other end of the water inlet pipe or the acid-resistant hose 800. It can be understood that the first neutralization liquid waste is discharged into the pre-neutralization cylinder 200 through the neutralization pump 310 and the acid-resistant hose 800 to form a second neutralization liquid, so that the waste liquid of the first neutralization liquid is reused, and then the neutralization pump 310 and the neutralization cylinder 300 are rinsed through the water inlet pipe, and after the rinsing is completed, the raw materials of the first neutralization liquid are added to the neutralization cylinder 300, and then water is input through the water inlet pipe for dilution and configuration to obtain a new first neutralization liquid.

[0121] like Figure 3 As shown, in one embodiment, a de-oiling cylinder 400 is provided with a de-oiling pump 410, one end of the de-oiling pump 410 is connected to the de-oiling cylinder 400, and the other end of the de-oiling pump 410 is used to be movably connected to a water inlet pipe or a liquid discharge pipe. It can be understood that the de-oiling liquid waste is discharged through the de-oiling pump 410, and the de-oiling pump 410 and the de-oiling cylinder 400 are rinsed through the water inlet pipe, and after the rinsing is completed, the raw material of the de-oiling liquid is added to the de-oiling cylinder 400, and then water is input through the water inlet pipe for dilution and configuration to obtain a new de-oiling liquid.

[0122] like Figure 4 As shown, in one embodiment, a micro-etching tank 500 is provided with a micro-etching pump 510, one end of the micro-etching pump 510 is connected to the micro-etching tank 500, and the other end of the micro-etching pump 510 is used to be movably connected to a water inlet pipe or a liquid discharge pipe. It can be understood that the micro-etching liquid waste is discharged through the micro-etching pump 510, and the micro-etching pump 510 and the micro-etching tank 500 are rinsed through the water inlet pipe, and after the rinsing is completed, the raw materials of the micro-etching liquid are added to the micro-etching tank 500, and then water is input through the water inlet pipe for dilution and configuration to obtain new micro-etching liquid.

[0123] like Figure 4 As shown, in one embodiment, a presoak pump 1010 is provided on the presoak cylinder 1000, one end of the presoak pump 1010 is connected to the presoak cylinder 1000, and the other end of the presoak pump 1010 is used to be movably connected to the water inlet pipe or the liquid discharge pipe. It can be understood that the presoak liquid waste is discharged through the presoak pump 1010, the presoak pump 1010 and the presoak cylinder 1000 are rinsed through the water inlet pipe, and after the rinsing is completed, the raw materials of the presoak liquid are added to the presoak cylinder 1000, and then water is input through the water inlet pipe for dilution and configuration to obtain a new presoak liquid.

[0124] like Figure 4As shown, in one embodiment, an activation pump 610 is provided on the activation cylinder 600, one end of the activation pump 610 is connected to the activation cylinder 600, and the other end of the activation pump 610 is used to be movably connected to the water inlet pipe or the liquid discharge pipe. It can be understood that the waste liquid of the activation liquid is discharged through the activation pump 610, the activation pump 610 and the activation cylinder 600 are rinsed through the water inlet pipe, and after the rinsing is completed, the raw materials of the activation liquid are added to the activation cylinder 600, and then water is input through the water inlet pipe for dilution and configuration to obtain new activation liquid.

[0125] like Figure 4 As shown, in one embodiment, an acceleration pump 1110 is provided on the acceleration cylinder 1100, one end of the acceleration pump 1110 is connected to the acceleration cylinder 1100, and the other end of the acceleration pump 1110 is used to be movably connected to the water inlet pipe or the liquid discharge pipe. It can be understood that the waste liquid of the acceleration liquid is discharged through the acceleration pump 1110, and the acceleration pump 1110 and the acceleration cylinder 1100 are flushed through the water inlet pipe, and after the flushing is completed, the raw materials of the acceleration liquid are added to the acceleration cylinder 1100, and then water is input through the water inlet pipe for dilution and configuration to obtain new acceleration liquid.

[0126] like Figure 4 As shown, in one embodiment, a copper-plating cylinder 700 is provided with a copper-plating pump 710, one end of the copper-plating pump 710 is communicated with the copper-plating cylinder 700, and the other end of the copper-plating pump 710 is used to be movably communicated with a water inlet pipe or a liquid discharge pipe. It is understandable that the waste liquid of the copper-plating liquid is discharged through the copper-plating pump 710, and the copper-plating pump 710 and the copper-plating cylinder 700 are rinsed through the water inlet pipe, and after the rinsing is completed, the raw materials of the copper-plating liquid are added into the copper-plating cylinder 700, and then water is input through the water inlet pipe for dilution and configuration to obtain a new copper-plating liquid.

[0127] like Figure 3 As shown, in one embodiment, a bulking pump 910 is provided on the bulking cylinder 900, one end of the bulking pump 910 is connected to the bulking cylinder 900, and the other end of the bulking pump 910 is used to be movably connected to the water inlet pipe or the liquid discharge pipe. It can be understood that the waste bulking liquid is discharged through the bulking pump 910, the bulking pump 910 and the bulking cylinder 900 are rinsed through the water inlet pipe, and after the rinsing is completed, the raw materials of the bulking liquid are added to the bulking cylinder, and then water is input through the water inlet pipe for dilution and configuration to obtain new bulking liquid.

[0128] like Figure 3 and Figure 5As shown, in one embodiment, the copper deposition system 10 also includes an overhead crane assembly 1200, and the overhead crane assembly 1200 includes a slide rail 1210, a moving part 1220, a telescopic driving part 1230 and a hanging basket 1240. The slide rail 1210 is arranged above the degumming cylinder 100, the pre-neutralization cylinder 200, the neutralization cylinder 300, the deoiling cylinder 400, the micro-etching cylinder 500, the pre-impregnation cylinder 1000, the activation cylinder 600, the acceleration cylinder 1100 and the copper plating cylinder 700. The moving part 1220 is slidably connected to the slide rail 1210, the telescopic driving part 1230 is installed on the moving part 1220, and the hanging basket 1240 is installed on the telescopic end of the telescopic driving part 1230. The hanging basket 1240 is used to load thin copper surface PCB boards. It can be understood that by driving the moving member 1220 to slide on the slide rail 1210, the hanging basket 1240 can shuttle between the cylinders, and then by driving the telescopic driving member 1230 to output, the hanging basket 1240 is driven to approach or move away from the cylinders, so as to realize the automatic copper deposition of the thin copper surface PCB board and improve the production efficiency of the thin copper surface PCB board. Further, in this embodiment, the slide rail 1210 is an annular slide rail 1210, and the moving member 1220 is an electric drive moving member 1220.

[0129] like Figures 2 to 4 As shown, in one embodiment, the copper deposition system 10 further includes a water washing component 1300, and the water washing component 1300 includes a first water washing tank 1310, a second water washing tank 1320, a third water washing tank 1330, a fourth water washing tank 1340, a fifth water washing tank 1350, a sixth water washing tank 1360, a seventh water washing tank 1370, an eighth water washing tank 1380 and a ninth water washing tank 1390. The first water washing tank 1310 is arranged between the degumming tank 100 and the pre-neutralization tank 200, the second water washing tank 1320 is arranged between the pre-neutralization tank 200 and the neutralization tank 300, and the The third water washing tank 1330 is arranged between the neutralization tank 300 and the oil removal tank 400, the fourth water washing tank 1340 is arranged between the oil removal tank 400 and the micro-etching tank 500, the fifth water washing tank 1350 is arranged between the micro-etching tank 500 and the pre-soaking tank 1000, the sixth water washing tank 1360 is arranged between the activation tank 600 and the acceleration tank 1100, the seventh water washing tank 1370 is arranged between the acceleration tank 1100 and the copper-melting tank 700, the eighth water washing tank 1380 is arranged adjacent to the copper-melting tank 700, and the ninth water washing tank 1390 is arranged between the bulking tank 900 and the glue removal tank 100. It can be understood that by arranging water washing tanks between corresponding processing steps, the contamination of liquids between the various tanks is avoided, and the purity of the liquids in each tank is ensured. In this embodiment, the number of the first water washing tank 1310, the second water washing tank 1320, the third water washing tank 1330, the fourth water washing tank 1340, the fifth water washing tank 1350, the sixth water washing tank 1360, the seventh water washing tank 1370, the eighth water washing tank 1380 and the ninth water washing tank 1390 is two.

[0130] See also Figures 6 to 9 ,in Figure 6 , Figure 7 and Figure 8 is a schematic diagram of a thin copper surface PCB board using the copper deposition process disclosed in the present invention. Figure 6 This is an electron microscope image of the hole wall surface of a thin copper surface PCB board before the degumming process of the copper deposition process disclosed in the present invention. Figure 7 This is an electron microscope image of the hole wall surface of a thin copper surface PCB board after the degumming process of the copper deposition process disclosed in the present invention. Figure 8 This is an electron microscope image of the copper surface of a thin copper surface PCB board after the copper deposition process disclosed in the present invention is completed. Fig. 9 This is an electron microscope image of the copper surface of a thin copper PCB board after the traditional copper deposition process. Figure 6 and Figure 7 It can be seen that a honeycomb-shaped micro-rough surface is formed in the hole wall of the thin copper surface PCB board after the debonding treatment, which can increase the adsorption of the thin copper surface PCB board to the activation liquid. Figure 8 and Fig. 9 It can be seen that the copper surface of the thin copper surface PCB board prepared by the traditional copper deposition process is relatively rough, that is, its copper foil layer is corroded, which reduces the quality of the thin copper surface PCB board. The copper surface of the thin copper surface PCB board obtained by copper deposition treatment of the thin copper surface PCB board using the copper deposition process and system disclosed in the present invention is relatively smooth, and its copper foil layer is basically not corroded. This also shows that the copper protection neutralizer-sulfuric acid combination disclosed in the present invention can significantly reduce the roughness of the copper surface of the thin copper surface PCB board compared to the traditional hydrogen peroxide-sulfuric acid combination, avoid over-corrosion, and greatly improve the quality of the thin copper surface PCB board, thereby improving the yield rate of the thin copper surface PCB board. In addition, the copper deposition process and system disclosed in the present invention can not only reduce the production cost of the thin copper surface PCB board, but also improve the production efficiency and yield rate of the thin copper surface PCB board.

[0131] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the disclosed patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the disclosed patent shall be subject to the attached claims.

Claims

1. A copper deposition process based on a thin copper surface PCB board, characterized in that: The steps include: The thin copper surface PCB board is immersed in a degumming tank for degumming treatment, so that the hole wall in the thin copper surface PCB board forms a honeycomb-shaped micro-rough surface; Placing the thin copper surface PCB board after the degumming treatment in a pre-neutralization cylinder for pre-neutralization treatment; Placing the pre-neutralized thin copper-surface PCB board in a neutralization tank for neutralization treatment; Placing the neutralized thin copper-surface PCB board in a degreasing tank for degreasing; Placing the degreased thin copper surface PCB board in a micro-etching tank for micro-etching treatment; Placing the thin copper surface PCB board after micro-etching in an activation tank for activation treatment; Placing the activated thin copper PCB board in a copperizing tank for copperizing treatment; The liquid medicine in the neutralization tank is the first neutralization liquid, the liquid medicine in the pre-neutralization tank is the second neutralization liquid, and both the first neutralization liquid and the second neutralization liquid are a mixture of a copper-protecting neutralizer and sulfuric acid.

2. The copper deposition process based on a thin copper surface PCB board according to claim 1, characterized in that: After the step of immersing the thin copper surface PCB board in the degumming tank for degumming treatment, and before the step of placing the degummed thin copper surface PCB board in the pre-neutralization tank for pre-neutralization treatment, the following steps are also included: When the copper ion concentration in the first neutralization liquid is greater than or equal to the first preset concentration value, the first neutralization liquid in the neutralization cylinder is transported to the pre-neutralization cylinder through an acid-resistant hose to form a second neutralization liquid, and the first neutralization liquid is re-configured in the neutralization cylinder.

3. The copper deposition process based on a thin copper surface PCB board according to claim 2, characterized in that: The first preset concentration value of the copper ion concentration in the first neutralization solution is 1.5 g / L.

4. The copper deposition process based on a thin copper surface PCB board according to claim 1, characterized in that: The copper-protecting neutralizing agent comprises a surfactant and EDTA.

5. The copper deposition process based on a thin copper surface PCB board according to claim 1, characterized in that: The sulfuric acid concentration in the first neutralization solution accounts for 4% to 6%, and the copper-protecting neutralizer concentration in the first neutralization solution accounts for 15% to 25%; The concentration of sulfuric acid in the second neutralization solution is 4% to 6%, and the concentration of the copper-protecting neutralizing agent in the second neutralization solution is 10% to 15%.

6. The copper deposition process based on a thin copper surface PCB board according to claim 1, characterized in that: Before the step of soaking the thin copper surface PCB board in the degumming tank for degumming treatment, the following steps are also included: The thin copper surface PCB board is immersed in a swelling cylinder for swelling treatment.

7. The copper deposition process based on a thin copper surface PCB board according to claim 1, characterized in that: After the step of placing the degreasing thin copper surface PCB board in a micro-etching tank for micro-etching treatment, and before the step of placing the micro-etching thin copper surface PCB board in an activation tank for activation treatment, the following steps are also included: The thin copper surface PCB board is placed in a prepreg tank for prepreg treatment.

8. The copper deposition process based on a thin copper surface PCB board according to claim 1, characterized in that: After the step of placing the thin copper surface PCB board after micro-etching treatment in an activation tank for activation treatment, and after the step of placing the thin copper surface PCB board after activation treatment in a copper treatment tank for copper treatment, the following steps are also included: The thin copper surface PCB board is placed in an acceleration cylinder for acceleration treatment.

9. A copper deposition system based on a thin copper surface PCB board, characterized in that: Used to perform the copper deposition process based on a thin copper surface PCB board as described in any one of claims 1 to 8; The copper deposition system comprises a degumming cylinder, a pre-neutralization cylinder, a neutralization cylinder, an oil removal cylinder, a micro-etching cylinder, an activation cylinder and a copper plating cylinder which are sequentially arranged along the board feeding direction.

10. The copper deposition system based on thin copper surface PCB board according to claim 9, characterized in that: The copper deposition system further includes an acid-resistant hose, one end of which is connected to the liquid inlet of the pre-neutralization cylinder, and the other end of which is connected to the liquid outlet of the neutralization cylinder; and / or, The copper deposition system also includes a bulking cylinder, a pre-impregnation cylinder and an acceleration cylinder. The bulking cylinder is arranged adjacent to the degumming cylinder, the pre-impregnation cylinder is arranged between the micro-etching cylinder and the activation cylinder, and the acceleration cylinder is arranged between the activation cylinder and the copperizing cylinder.

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