An automatic circuit board processing device and its usage method

Abstract

The present invention relates to the field of circuit board processing, and particularly to an automatic circuit board processing device and its usage method, including a copper deposition tank, a cover plate, etc.; a storage cavity is arranged inside the copper deposition tank; a cover plate is slidably connected to the front side of the copper deposition tank. The present invention realizes that the copper deposition tank is divided into multiple chambers by a partition plate, so that each circuit board is at the same solution depth for copper deposition, avoiding different copper deposition effects of the circuit board due to different solution depths, and improving the copper deposition effect on the circuit board; the solution scouring generated by the round holes is on the lower side of the circuit board, so that the water flows from the lower side of the circuit board to the front side and the rear side respectively, preventing the phenomenon of uneven copper deposition on the surface of the circuit board caused by air bubble accumulation, and improving the copper deposition effect of the device on the circuit board; the support tube provides support for the middle part of the circuit board, preventing the middle part of the circuit board from sagging downward, ensuring uniform adhesion of metallic copper on the surface of the circuit board, and improving the copper deposition effect of the device on the circuit board.

Description

Technical Field

[0001] The present invention relates to the field of printed circuit board processing, and particularly to an automated printed circuit board processing device and a method for using the same. Background Art

[0002] During the production of printed circuit boards, in the electroless copper plating process, a layer of metallic copper is attached when the printed circuit board is still a bare board, enabling the printed circuit board to have conductive functions. When performing electroless copper plating on the printed circuit board, most of the electroless copper plating baths use complexes formed by copper salts and other substances, and their properties are not as stable as those of pure copper salts. Moreover, considering the overall high height and large volume of the existing electroless copper plating baths, the solute distribution states in different regions of the bath are not always the same. For example, due to evaporation, the concentration of metal copper ions is higher in the part near the solution surface, while the concentration is lower in the deeper part, resulting in different electroless copper plating effects for printed circuit boards of the same batch, thereby affecting the quality of the finished printed circuit boards. At the same time, since the bare board not only needs to have metallic copper attached to its surface but also needs metallic copper attached to the holes opened on the bare board, and the existing method immerses the printed circuit board vertically into the solution, this method will cause air bubbles to get stuck at the holes when floating upward, resulting in poor metallic copper attachment at the holes. Although the problem of air bubbles getting stuck at the holes is reduced by the horizontal placement method, when the printed circuit board is placed horizontally, the surface tension between the liquid and the printed circuit board surface will cause air bubbles to attach to the side of the printed circuit board. At the same time, since the side of the printed circuit board is not smooth, it is more likely to cause air bubbles to be intercepted at the side position of the printed circuit board, and thus there is also a problem that air bubbles affect the uniform electroless copper plating of the printed circuit board.

[0003] At the same time, when the existing printed circuit board is horizontally placed and immersed in the solution, the contact area with the printed circuit board is reduced by supporting the printed circuit board at the four corners to avoid excessive support structures affecting the metallic copper attachment of the printed circuit board. However, when the overall size of the printed circuit board is large, this support method will cause the middle part of the printed circuit board to have no support and sink downward. The sunken printed circuit board will cause uneven metallic copper attachment during electroless copper plating, and at the same time, it will also cause poor metallic copper attachment ability at the sunken part, resulting in poor quality of the finished printed circuit board. Summary of the Invention

[0004] In order to overcome the situation that the existing printed circuit boards have different electroless copper plating effects at different depths in the solution, affecting the quality of the finished products, and the printed circuit boards will be interfered by air bubbles whether they are placed vertically or horizontally, resulting in uneven metallic copper attachment, and at the same time, using the four-corner support method to reduce the influence on the electroless copper plating of the printed circuit board will cause the middle part of the printed circuit board to sink downward, the present invention provides an automated printed circuit board processing device and a method for using the same.

[0005] The technical solution is as follows: An automatic circuit board processing device includes a copper deposition tank, a cover plate, and a water pipe; a storage cavity is arranged in the copper deposition tank; a cover plate is slidably connected to the front side of the copper deposition tank; a water pipe is connected to each of the left and right sides of the copper deposition tank; each water pipe is connected to an external copper deposition solution delivery device; it further includes a partition plate, a top rod, an electric slider, an anti-foaming component, and a separation system; several sliding grooves are formed on the copper deposition tank; an electric slider is slidably connected to each sliding groove; a partition plate for making each circuit board at the same solution depth is arranged on each electric slider; several top rods for preventing air bubbles from adhering to the surface of the circuit board are slidably connected in the copper deposition tank; each top rod is provided with a communication groove, and the storage cavity is communicated with the communication groove; each top rod is provided with a support groove for supporting the circuit board, and the height of each support groove is greater than the thickness of the circuit board; an anti-foaming component for improving the air bubble elimination effect is connected in the copper deposition tank; a separation system for preventing incomplete copper deposition of the circuit board is connected in the copper deposition tank.

[0006] Further, the anti-foaming component includes a fixed plate, an electric push rod, a connecting rod, and a support pipe; a liquid discharge groove is formed at the lower part of the rear side of the copper deposition tank; a first communication cavity is arranged at the rear side of the copper deposition tank, and the first communication cavity is communicated with the liquid discharge groove; several first impurity discharge ports are arranged in the copper deposition tank, and each first impurity discharge port is communicated with the first communication cavity; several second impurity discharge ports are formed at the rear side of the cover plate; a liquid discharge pipe is arranged at the front side of the cover plate; a second communication cavity is formed in the cover plate; the liquid discharge pipe is communicated with each second impurity discharge port through the second communication cavity; a waste liquid recovery device is arranged at the rear side of the copper deposition tank, the liquid discharge groove is communicated with the waste liquid recovery device, and the liquid discharge pipe is communicated with the waste liquid recovery device through a hose; a fixed plate is fixedly connected to the upper side of the copper deposition tank; several electric push rods are fixedly connected to the fixed plate; the output end of each electric push rod penetrates through the fixed plate; a connecting rod is fixedly connected to the output end of each electric push rod; a blocking part is arranged at the lower side of each connecting rod; several support pipes for improving the air bubble elimination effect are commonly connected to several top rods, and two support pipes at the same horizontal height are arranged symmetrically front and back; each support pipe is located above the adjacent partition plate; each support pipe is communicated with the adjacent communication groove; several round holes are formed on each support pipe, and a diaphragm is arranged on each round hole; several liquid suction pipes are connected to the right side of the copper deposition tank; each liquid suction pipe is respectively located above a partition plate, and each liquid suction pipe is connected to an external liquid suction device.

[0007] Further, the upper side surface of each support pipe is flush with the lower side surface of the adjacent support groove.

[0008] Further, each first impurity discharge port is located at the rear side of the copper deposition tank.

[0009] Further, for all the support pipes located in the front, the round holes on them are located on the side facing the second impurity discharge port; for all the support pipes located in the front, the round holes on them are located on the side facing the first impurity discharge port; each round hole is set to be in a reduced orifice shape.

[0010] Further, each separator plate can be removed from the copper immersion tank.

[0011] Further, the outer sides of the copper immersion tank and the cover plate are both coated with an anti-rust coating.

[0012] Further, the separation system includes pressing plates and movable blocks; a plurality of pressing plates for preventing the support tubes from interfering with the attachment of copper deposition ions are fixedly connected to each connecting rod; a plurality of movable blocks are slidably connected to each ejector rod through springs; a plurality of rectangular grooves are formed in each ejector rod; every two relatively left and right movable blocks are jointly fixedly connected to the support tube; each support tube slides up and down in the adjacent rectangular grooves; a deformable waterproof film is arranged between each rectangular groove and the ejector rod.

[0013] Further, a rubber diaphragm is coated on each support tube.

[0014] A usage method of a circuit board automatic processing device includes the following steps:

[0015] S1: Loading. After pushing the cover plate upward to open it, the worker places each circuit board on the corresponding support groove, and then closes the cover plate.

[0016] S2: Liquid inlet. Through an external copper immersion solution conveying device, copper immersion solution is pumped into the water pipe, the solution enters the communication groove, then enters each support tube, and then the solution is pumped into the upper side of each separator plate by using the plugging part for copper deposition.

[0017] S3: Support adjustment. The support tubes are pushed by the pressing plates to alternately separate from the lower side of the circuit board, so that the contact surface between the support tubes and the circuit board is exposed, achieving the effect of uniform copper deposition on the lower side of the circuit board.

[0018] S4: Liquid drainage and blanking. After the copper deposition is completed, first use a liquid pumping device to generate suction in the liquid pumping pipe, so that the copper immersion solution on each separator plate is pumped away, then lift the cover plate upward to open it, and finally take out the circuit board with copper deposition completed.

[0019] Compared with the prior art, the present invention has the following advantages: The present invention realizes that the copper immersion tank is divided into multiple chambers by the separator plates, so that each circuit board is at the same solution depth for copper deposition, avoiding the different copper deposition effects of the circuit boards due to different solution depths, and improving the copper deposition effect on the circuit boards;

[0020] The solution flushing generated through the round holes is on the lower side of the circuit board, so that the water flows forward and backward from the lower side of the circuit board respectively, preventing the phenomenon of uneven copper deposition on the surface of the circuit board caused by the accumulation of bubbles, and improving the copper deposition effect of the device on the circuit boards.

[0021] Provide support for the middle part of the circuit board through the support tube, prevent the middle part of the circuit board from sagging downward, ensure that the metallic copper adheres evenly to the surface of the circuit board, and improve the copper deposition effect of the equipment on the circuit board;

[0022] Push the support tube and the lower side of the circuit board to separate alternately through the pressing piece, avoid the support tube covering most areas of the lower side of the circuit board, and ensure that the copper deposition effect of the circuit board is more comprehensive. Brief Description of the Drawings

[0023] Figure 1 It is a three-dimensional structure schematic diagram of the circuit board automatic processing equipment and its using method of the present invention;

[0024] Figure 2 It is a cross-sectional view of the cover plate of the present invention;

[0025] Figure 3 It is a three-dimensional structure schematic diagram of the combination of the copper deposition tank, the ejector rod and the support tube of the present invention;

[0026] Figure 4 It is a three-dimensional structure schematic diagram of the combination of the connecting rod and the support tube of the present invention;

[0027] Figure 5 It is a cross-sectional view of the support tube of the present invention;

[0028] Figure 6 It is a front view of the partition board, the ejector rod and the connecting rod of the present invention;

[0029] Figure 7 It is a three-dimensional structure schematic diagram of the combination of the ejector rod and the connecting rod of the present invention;

[0030] Figure 8 It is a three-dimensional structure schematic diagram of the combination of the copper deposition tank, the ejector rod and the electric slider of the present invention;

[0031] Figure 9 It is a three-dimensional structure schematic diagram of the combination of the copper deposition tank and the partition board of the present invention;

[0032] Figure 10 It is a three-dimensional structure schematic diagram of the combination of the pressing piece and the movable block of the present invention;

[0033] Figure 11 It is a three-dimensional structure schematic diagram of the combination of the ejector rod, the support tube and the movable block of the present invention.

[0034] Reference numerals: 1 - copper deposition tank, 1001 - storage cavity, 1002 - drain tank, 1003 - first communication cavity, 1004 - chute, 1005 - first impurity discharge port, 1006 - liquid extraction pipe, 2 - cover plate, 2001 - drain pipe, 2002 - second impurity discharge port, 2003 - second communication cavity, 3 - water pipe, 4 - circuit board, 5 - partition plate, 6 - ejector rod, 6001 - communication groove, 6002 - support groove, 6003 - rectangular groove, 101 - fixing plate, 102 - electric push rod, 103 - connecting rod, 10301 - blocking part, 104 - electric slider, 105 - support pipe, 10501 - circular hole, 201 - pressing piece, 202 - movable block. Detailed implementation manners

[0035] The preferred technical solutions of the present invention will be described in detail below with reference to the accompanying drawings. Embodiment 1

[0036] An automatic processing device for circuit boards, as Figures 1-9 shown, includes a copper deposition tank 1, a cover plate 2 and a water pipe 3; a storage cavity 1001 is arranged in the copper deposition tank 1; the cover plate 2 is slidably connected to the front side of the copper deposition tank 1; a water pipe 3 is connected to both the left and right sides of the copper deposition tank 1; each water pipe 3 is connected to an external copper deposition solution conveying device;

[0037] It further includes a partition plate 5, an ejector rod 6, an electric slider 104, an antifoaming component and a separation system; four chutes 1004 are opened on the copper deposition tank 1; an electric slider 104 is slidably connected to each chute 1004; a partition plate 5 is arranged on each electric slider 104; four ejector rods 6 are slidably connected in the copper deposition tank 1; each ejector rod 6 is provided with a communication groove 6001, and the storage cavity 1001 is communicated with the communication groove 6001; each ejector rod 6 is provided with a support groove 6002, and the height of each support groove 6002 is greater than the thickness of the circuit board 4; an antifoaming component is connected in the copper deposition tank 1; a separation system is connected in the copper deposition tank 1.

[0038] The defoaming assembly includes a fixed plate 101, an electric push rod 102, a connecting rod 103 and a support pipe 105; a drain groove 1002 is formed in the lower part of the rear side of the copper deposition tank 1; a first communication cavity 1003 is arranged at the rear side of the copper deposition tank 1, and the first communication cavity 1003 is communicated with the drain groove 1002; a plurality of first impurity discharge ports 1005 are arranged in the copper deposition tank 1, and each first impurity discharge port 1005 is communicated with the first communication cavity 1003; a plurality of second impurity discharge ports 2002 are formed in the rear side of the cover plate 2; a drain pipe 2001 is arranged on the front side of the cover plate 2; a second communication cavity 2003 is formed in the cover plate 2; the drain pipe 2001 is communicated with each second impurity discharge port 2002 through the second communication cavity 2003; a waste liquid recovery device is arranged at the rear side of the copper deposition tank 1, the drain groove 1002 is communicated with the waste liquid recovery device, and the drain pipe 2001 is communicated with the waste liquid recovery device through a hose; the fixed plate 101 is fixedly connected to the upper side of the copper deposition tank 1; four electric push rods 102 are fixedly connected to the fixed plate 101; the output end of each electric push rod 102 penetrates through the fixed plate 101; a connecting rod 103 is fixedly connected to the output end of each electric push rod 102; a blocking part 10301 is arranged on the lower side of each connecting rod 103; a plurality of support pipes 105 are jointly connected by four ejector rods 6, and the two support pipes 105 at the same horizontal height are arranged symmetrically front and back; each support pipe 105 is located above the adjacent partition plate 5; each support pipe 105 is communicated with the adjacent communication groove 6001; a plurality of round holes 10501 are formed in each support pipe 105, and a diaphragm is arranged on each round hole 10501; a plurality of liquid extraction pipes 1006 are communicated with the right side of the copper deposition tank 1; each liquid extraction pipe 1006 is respectively located above a partition plate 5, and each liquid extraction pipe 1006 is connected to an external liquid extraction device.

[0039] The upper side surface of each support pipe 105 is flush with the lower side surface of the adjacent support groove 6002, preventing the middle part of the circuit board 4 from sagging without support and ensuring that the metallic copper adheres evenly to the surface of the circuit board 4.

[0040] Each first impurity discharge port 1005 is located at the rear side of the copper deposition tank 1.

[0041] For all the support pipes 105 located in the front, the round holes 10501 thereon are all located on the side facing the second impurity discharge port 2002; for all the support pipes 105 located in the front, the round holes 10501 thereon are all located on the side facing the first impurity discharge port 1005; each round hole 10501 is arranged in a constricted shape, increasing the flow rate of the solution ejected from the round hole 10501 and enhancing the defoaming effect on the side bubbles of the circuit board 4.

[0042] Each partition plate 5 can be detached from the copper deposition tank 1, facilitating the workers to directly wash the partition plate 5 and preventing impurities in the solution from adhering to the partition plate 5 and being difficult to clean.

[0043] The outer sides of the copper deposition tank 1 and the cover plate 2 are both coated with an anti-rust coating.

[0044] After the existing circuit board 4 is lifted into the copper deposition tank 1 by an external lifting device, it reacts in the copper deposition tank 1 for a period of time and then the circuit board 4 is lifted, realizing the copper deposition process of the circuit board 4. During this process, considering that the concentration of metal ions and other reactants in the solution has a gradient at different depths, the concentration of metal copper ions is higher in the part close to the solution surface due to evaporation, while the concentration is lower in the deep part, resulting in different copper deposition effects of the circuit board 4. To avoid this phenomenon, a number of partition plates 5 are arranged in the copper deposition tank 1, so that the partition plates 5 divide the copper deposition tank 1 into multiple chambers. At this time, after the worker pushes the cover plate 2 upwards, the circuit boards 4 are respectively pushed into each chamber, and the four corners of each circuit board 4 are supported by the support grooves 6002. It should be noted that: each circuit board 4 is located above the adjacent partition plate 5. At this time, the worker first pushes the cover plate 2 downwards, and then pumps the copper deposition solution into the water pipe 3 through an external copper deposition solution conveying device, so that the solution fills the storage chamber 1001. Since the communication groove 6001 is communicated with the storage chamber 1001, the solution enters the communication groove 6001. As the solution level rises, the solution successively enters each support pipe 105. It should be noted that: since a diaphragm is arranged on each round hole 10501, that is, the solution will not flow out from the round hole 10501 after entering the support pipe 105. When all the support pipes 105 are filled with the solution, then start all the electric push rods 102 to contract, thereby driving the connecting rod 103 to move upwards, so that the blocking part 10301 blocks the lower side of the communication groove 6001. At this time, the connecting rod 103 continues to move upwards, and then compresses the solution in the communication groove 6001 by using the blocking part 10301, so that the pressure in the communication groove 6001 and the support pipe 105 increases, and then the diaphragm at the round hole 10501 is pushed open by the pressure, so that the solution is discharged from the round hole 10501 to the upper side of each partition plate 5. Subsequently, by controlling the reciprocating pushing and retracting of the electric push rod 102, the blocking part 10301 and the communication groove 6001 cooperate to form the function of a piston, and the solution is pressed into the upper side of each partition plate 5. When the solution on the upper side of each partition plate 5 submerges the circuit board 4, stop the electric push rod 102, so that the solution depth at which each circuit board 4 is located is kept the same, and then carry out the copper deposition process, avoiding different copper deposition effects of the circuit board 4 due to different solution depths, and improving the copper deposition effect of the circuit board 4. When the copper deposition of the circuit board 4 is completed, start an external liquid pumping device to generate a suction force on the liquid pumping pipe 1006, so that the copper deposition solution on each partition plate 5 is pumped away through the liquid pumping pipe 1006. At this time, then the worker pushes the cover plate 2 upwards to open it, and takes out the circuit board 4 with the copper deposition completed. At the same time, after opening the cover plate 2, the areas inside the copper deposition tank 1 that are difficult to clean can also be cleaned.

[0045] It is also considered that bubbles will be generated during the copper deposition reaction of the circuit board 4, and the circuit board 4 not only needs to adhere metal copper to its surface, but most importantly, the through holes opened in the circuit board 4 need to be adhered with metal copper. When the circuit board 4 is placed horizontally for copper deposition, bubbles can be discharged from any direction, reducing the possibility of bubbles adhering to the holes. However, the problem that comes with it is that bubbles tend to stay at the lower side of the circuit board 4, resulting in uneven adhesion of metal copper to the lower side of the circuit board 4. In order to avoid this phenomenon, the electric push rod 102 is started to contract at intervals, so that the circular hole 10501 discharges the solution at intervals, such as Figure 3 As shown, the solution flushed out from the circular hole 10501 is flushed on the lower side of the circuit board 4, so that the solution flows to the front and rear sides of the circuit board 4 respectively, and the bubbles staying on the lower side and the side of the circuit board 4 are taken away, thereby preventing the uneven copper deposition on the surface of the circuit board 4 caused by the accumulation of bubbles, and improving the copper deposition effect of the equipment on the circuit board 4.

[0046] It is also taken into consideration that, while supporting the four corners of the circuit board 4 by means of the support groove 6002, the contact area with the circuit board 4 is reduced, so that the metal copper covers the circuit board 4 more comprehensively. This support method will cause the middle part of the circuit board 4 to be concave downward without a support point. The concave circuit board 4 will cause uneven adhesion of the metal copper during copper deposition. At the same time, the metal copper at the concave part of the circuit board 4 has poor adhesion ability and is easy to fall off during subsequent use. The support tube 105 is used to provide support for the middle part of the circuit board 4, so that the circuit board 4 can be deposited with copper in a flat state, preventing the middle part of the circuit board 4 from being concave downward, ensuring that the metal copper is evenly adhered to the surface of the circuit board 4, and improving the copper deposition effect of the equipment on the circuit board 4.

[0047] In order to further reduce the influence of bubbles on the circuit board 4, after the circuit board 4 has been soaked for a period of time, the two electric sliders 104 on the front side are started to slide upward on the slide groove 1004, and the two electric push rods 102 on the front side are started to contract, so that the front push rod 6 and the connecting rod 103 move upward synchronously, thereby driving the front side of the circuit board 4 to tilt upward, so that the front half of the circuit board 4 gradually floats out of the liquid surface, so that a small amount of bubbles remaining on the lower side of the circuit board 4 come into contact with the air to burst the bubbles, and then the front electric slider 104 and the electric push rod 102 are reset, and the rear electric slider 104 and the electric push rod 102 are started to tilt the rear side of the circuit board 4 upward, and this reciprocating process is repeated to completely remove the remaining bubbles, and then the circuit board 4 is re-immersed in the solution to continue copper deposition, thereby further reducing the phenomenon of uneven copper deposition caused by bubbles.

[0048] In the above process, it is also considered that during the copper deposition process, impurities are likely to float on the upper side of the circuit board 4, and the impurities will also affect the copper deposition of the circuit board 4. When the front side or the rear side of the circuit board 4 is warped, an external copper deposition solution conveying device is started to pump the copper deposition solution into the water pipe 3, and at the same time, the solution is discharged into the upper side of each partition plate 5 through the round holes 10501. At this time, the liquid level of the solution gradually rises above the first impurity discharge port 1005 and the second impurity discharge port 2002, so that the solution flows backward through the first impurity discharge port 1005 and the second impurity discharge port 2002 into the first communication cavity 1003 and the second communication cavity 2003 and overflows, and finally flows through the liquid discharge groove 1002 and the liquid discharge pipe 2001 to the waste liquid recovery device for collection. Since the circuit board 4 continuously consumes metal ions in the solution during copper deposition, the solution on the upper side of the partition plate 5 can be replaced by the above method, so that the metal ions in the solution are always sufficient, improving the copper deposition effect of the device on the circuit board 4. During the flow of the solution, the impurities remaining on the upper side of the circuit board 4, under the action of the flow of the solution and the inclination of the circuit board 4, make the impurities unable to stay on the upper side of the circuit board 4 to interfere with the attachment of metal copper ions, thereby improving the copper deposition effect of the device on the circuit board 4. Example 2

[0049] Based on Example 1, as Figure 1 、 Figure 10 and Figure 11 shown, the separation system includes a pressing piece 201 and a movable block 202; several pressing pieces 201 are fixedly connected to each connecting rod 103; several movable blocks 202 are slidably connected to each ejector rod 6 through springs; several rectangular grooves 6003 are formed in each ejector rod 6; every two relatively left and right movable blocks 202 are jointly fixedly connected to the support pipe 105; each support pipe 105 slides up and down in the adjacent rectangular grooves 6003; a deformable waterproof film is arranged between each rectangular groove 6003 and the ejector rod 6, and the rectangular groove 6003 is always covered by the waterproof film to prevent the solution from flowing back into the communication groove 6001.

[0050] Each support pipe 105 is coated with a rubber diaphragm to prevent the support pipe 105 from knocking and damaging the circuit board 4 when it resets.

[0051] When the support tube 105 is used to support the middle part of the circuit board 4, although the problem of poor copper deposition effect caused by the depression of the circuit board 4 is solved, the overall contact area between the support tube 105 and the circuit board 4 is relatively large, resulting in more parts of the lower side of the circuit board 4 being blocked by the support tube 105, making the large area of metal copper attached to the lower side of the circuit board 4 poor. In order to avoid this phenomenon, the two electric push rods 102 on the front side are started to extend downward, thereby pushing the connecting rod 103 to move downward, thereby driving the pressing sheet 201 to squeeze the movable block 202 to move downward, so that the spring between the movable block 202 and the ejector rod 6 is compressed, and at the same time drives all the ejector rods 6 on the front side Move downward a short distance to separate the front support tube 105 from the lower side of the circuit board 4. After the circuit board 4 has been copper-plated for a period of time, the front electric push rod 102 is controlled to reset, so that the movable block 202 is reset under the action of the spring, and then the support tube 105 is re-fitted with the lower side of the circuit board 4 to support the circuit board 4. Then the rear electric push rod 102 is started to extend downward, and the rear support tube 105 is separated from the lower side of the circuit board 4 in the above manner. In this way, the support tube 105 is alternately separated from the circuit board 4 by reciprocating, so as to avoid the support tube 105 covering most of the lower side of the circuit board 4, thereby ensuring that the copper plating effect of the circuit board 4 is more comprehensive.

[0052] A method for using circuit board automated processing equipment comprises the following steps:

[0053] S1: Loading, after pushing the cover plate 2 upwards and opening it, the worker places each circuit board 4 on the corresponding support groove 6002, and then closes the cover plate 2;

[0054] S2: Liquid inlet: The copper deposition solution is pumped into the water pipe 3 through an external copper deposition solution delivery device, so that the solution enters the connecting groove 6001, and then enters each support tube 105, and then the sealing part 10301 is used to pump the solution into the upper side of each partition plate 5 for copper deposition;

[0055] S3: Support adjustment, by pushing the support tube 105 back and forth and alternately separating from the lower side of the circuit board 4 through the pressing sheet 201, so that the contact surface between the support tube 105 and the circuit board 4 is exposed, so as to achieve the effect of uniform copper deposition on the lower side of the circuit board 4;

[0056] S4: Draining and unloading. After the copper deposition is completed, the liquid extraction device is used to make the liquid extraction tube 1006 produce suction. After the copper deposition solution on each partition plate 5 is extracted, the cover plate 2 is lifted up and opened, and finally the circuit board 4 after the copper deposition is completed is taken out.

[0057] It should be understood that this embodiment is only used to illustrate the present invention and is not used to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms also fall within the scope limited by the appended claims of the application.

Claims

1. An automatic circuit board processing device, comprising a copper deposition tank (1), a cover plate (2) and a water pipe (3); a storage cavity (1001) is arranged inside the copper deposition tank (1); a cover plate (2) is slidably connected to the front side of the copper deposition tank (1); one water pipe (3) is communicated with each of the left and right sides of the copper deposition tank (1); each water pipe (3) is connected to an external copper deposition solution conveying device; it is characterized in that, It also includes a partition plate (5), a top rod (6), an electric slider (104), a defoaming component and a separation system; a plurality of chutes (1004) are formed in the copper deposition tank (1); an electric slider (104) is slidably connected to each chute (1004); a partition plate (5) for making each circuit board (4) at the same solution depth is arranged on each electric slider (104); a plurality of top rods (6) for preventing bubbles from adhering to the surface of the circuit board (4) are slidably connected in the copper deposition tank (1); each top rod (6) is provided with a communication groove (6001), and the storage cavity (1001) is communicated with the communication groove (6001); each top rod (6) is provided with a support groove (6002) for supporting the circuit board (4), and the height of each support groove (6002) is greater than the thickness of the circuit board (4); a defoaming component for improving the defoaming effect is connected in the copper deposition tank (1); a separation system for preventing incomplete copper deposition of the circuit board (4) is connected in the copper deposition tank (1).

2. An automatic circuit board processing device according to claim 1, characterized in that, The defoaming component includes a fixed plate (101), an electric push rod (102), a connecting rod (103), and a support pipe (105); a liquid discharge groove (1002) is opened at the lower part of the rear side of the copper deposition tank (1); a first communication cavity (1003) is arranged at the rear side of the copper deposition tank (1), and the first communication cavity (1003) is communicated with the liquid discharge groove (1002); a plurality of first impurity discharge ports (1005) are arranged in the copper deposition tank (1), and each first impurity discharge port (1005) is communicated with the first communication cavity (1003); a plurality of second impurity discharge ports (2002) are opened at the rear side of the cover plate (2); a liquid discharge pipe (2001) is arranged at the front side of the cover plate (2); a second communication cavity (2003) is opened in the cover plate (2); the liquid discharge pipe (2001) is communicated with each second impurity discharge port (2002) through the second communication cavity (2003); a waste liquid recovery device is arranged at the rear side of the copper deposition tank (1), the liquid discharge groove (1002) is communicated with the waste liquid recovery device, and the liquid discharge pipe (2001) is communicated with the waste liquid recovery device through a hose; the fixed plate (101) is fixedly connected to the upper side of the copper deposition tank (1); a plurality of electric push rods (102) are fixedly connected to the fixed plate (101); the output end of each electric push rod (102) penetrates through the fixed plate (101); a connecting rod (103) is fixedly connected to the output end of each electric push rod (102); a blocking part (10301) is arranged at the lower side of each connecting rod (103); a plurality of support pipes (105) for improving the bubble elimination effect are commonly connected by a plurality of ejector rods (6), and two support pipes (105) at the same horizontal height are arranged symmetrically front and back; each support pipe (105) is located above the adjacent partition plate (5); each support pipe (105) is communicated with the adjacent communication groove (6001); a plurality of round holes (10501) are opened on each support pipe (105), and a diaphragm is arranged on each round hole (10501); a plurality of liquid suction pipes (1006) are communicated with the right side of the copper deposition tank (1); each liquid suction pipe (1006) is located above a partition plate (5) respectively, and each liquid suction pipe (1006) is connected to an external liquid suction device.

3. An automatic circuit board processing device according to claim 2, characterized in that, The upper side surface of each support pipe (105) is flush with the lower side surface of the adjacent support groove (6002).

4. An automatic circuit board processing device according to claim 2, characterized in that, Each first impurity discharge port (1005) is located at the rear side of the copper deposition tank (1).

5. An automatic circuit board processing device according to claim 3, characterized in that, For all the support pipes (105) located in the front, the round holes (10501) thereon are all located on the side facing the second impurity discharge port (2002); for all the support pipes (105) located in the front, the round holes (10501) thereon are all located on the side facing the first impurity discharge port (1005); each round hole (10501) is arranged in a reduced opening shape.

6. An automatic circuit board processing device according to claim 4, characterized in that Each partition plate (5) can be removed from the copper deposition tank (1).

7. An automatic circuit board processing device according to claim 6, characterized in that, The outer side surfaces of the copper deposition tank (1) and the cover plate (2) are both coated with an anti-rust coating.

8. An automatic circuit board processing device according to claim 5, characterized in that, The separation system includes a pressing sheet (201) and a movable block (202); a plurality of pressing sheets (201) for preventing the support pipe (105) from interfering with the attachment of copper deposition ions are fixedly connected to each connecting rod (103); a plurality of movable blocks (202) are slidably connected to each ejector rod (6) through springs; a plurality of rectangular grooves (6003) are formed in each ejector rod (6); every two relatively left and right movable blocks (202) are fixedly connected to the support pipe (105) together; each support pipe (105) slides up and down in the adjacent rectangular groove (6003); a deformable waterproof film is arranged between each rectangular groove (6003) and the ejector rod (6).

9. An automatic circuit board processing device according to claim 8, characterized in that, A rubber membrane is coated on each support pipe (105).

10. A method for using an automatic processing device for a circuit board, characterized in that: The operation method uses the circuit board automatic processing equipment described in claim 9, and includes the following steps: S1: Loading. After the cover plate (2) is pushed up and opened, the worker places each circuit board (4) on the corresponding support groove (6002), and then closes the cover plate (2). S2: Liquid inlet. The copper deposition solution is pumped into the water pipe (3) through an external copper deposition solution conveying device, so that the solution enters the communication groove (6001), then enters each support pipe (105), and then the solution is pumped into the upper side of each partition plate (5) by using the blocking part (10301) for copper deposition. S3: Support adjustment. The support pipe (105) is pushed by the pressing sheet (201) to reciprocally and alternately separate from the lower side of the circuit board (4), so that the contact surface between the support pipe (105) and the circuit board (4) is exposed, and the effect of uniform copper deposition on the lower side of the circuit board (4) is achieved. S4: Liquid discharge and blanking. After the copper deposition is completed, first use the liquid pumping device to generate suction in the liquid pumping pipe (1006), and after the copper deposition solution on each partition plate (5) is pumped away, then lift the cover plate (2) upward to open it, and finally take out the circuit board (4) with the copper deposition completed.

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