Dual-redundancy airborne electronic equipment

Abstract

The invention provides dual-redundancy airborne electronic equipment, and relates to the technical field of structural design of electronic equipment. Comprising a reinforcing frame, a plurality of groups of dual-redundancy assemblies fixed on the reinforcing frame, a non-redundancy assembly fixed on the reinforcing frame, a heat dissipation reinforcing structural member fixed on the reinforcing frame and used for heat dissipation, a panel arranged on the reinforcing frame and an external interface printed board assembly fixed on the panel, the multiple dual-redundancy assemblies are arranged in a mirror image mode with the horizontal center face of the electronic device as the reference, the single-channel printed board is parallel to the non-redundancy assembly, and the single-channel printed board and the non-redundancy assembly are perpendicular to the external interface printed board assembly. According to the airborne electronic equipment, the reliability of the printed board assembly of the dual-redundancy electronic equipment is improved, the effective layout area of the printed board is increased, the airborne electronic equipment is provided with a vibration isolation structure, the severe vibration environment resistance of the electronic equipment is effectively improved, and the weight of the electronic equipment is reduced from the overall structure.

Description

Technical Field

[0001] The invention relates to the technical field of electronic equipment structure design, and in particular provides a dual-redundancy airborne electronic equipment. Background Art

[0002] The current development of electronic equipment structural design technology has put forward requirements for electronic equipment to be smaller, lighter, and more densely assembled. Conventional electronic equipment structural design methods have high structural weight, large volume, and small effective layout area of ​​​​the printed circuit board. Under temperature and vibration environments, local stress concentration on the printed circuit board will lead to a decrease in the life of component solder joints. Summary of the invention

[0003] The purpose of this application is to propose an airborne electronic device that improves the reliability of a dual-redundancy electronic device printed circuit board assembly in response to the demand for miniaturization of electronic device structures in the prior art, so as to increase the effective layout area of ​​the printed circuit board.

[0004] In order to achieve the above-mentioned object, the present invention adopts the following technical scheme: a dual-redundancy airborne electronic device, the electronic device comprising: a reinforcement frame, a plurality of dual-redundancy components fixed on the reinforcement frame, a non-redundancy component fixed on the reinforcement frame, a heat dissipation reinforcement structure fixed on the reinforcement frame for heat dissipation, a panel arranged on the reinforcement frame, and an external interface printed circuit board assembly fixed on the panel,

[0005] The dual-redundancy printed circuit board assembly includes two single-channel printed circuit boards.

[0006] The plurality of dual-redundancy components are mirror-imaged with the horizontal center plane of the electronic device as a reference, and the single-channel printed circuit board is parallel to the non-redundancy component.

[0007] The single-channel printed circuit board, the non-redundant component and the external interface printed circuit board component are perpendicular.

[0008] The dual-redundancy airborne electronic equipment provided by the present invention also has the following technical feature: the single-channel printed circuit board, the non-redundancy component and the external interface printed circuit board component are interconnected via a flexible printed circuit board.

[0009] The dual-redundancy airborne electronic equipment provided by the present invention also has the following technical feature: the electronic equipment is also provided with mounting ears.

[0010] The dual-redundancy airborne electronic device provided by the present invention also has the following technical features: a mounting hole for connecting to a reinforcement frame is provided in the central area of ​​the single-channel printed circuit board; a boss for fixing the single-channel printed circuit board is provided in the center of the reinforcement frame; and the mounting hole is concentric with the boss.

[0011] The dual-redundancy airborne electronic equipment provided by the present invention also has the following technical feature: the distance between the edge of the single-channel printed circuit board and the reinforcement frame is 0.5-3 mm.

[0012] The dual-redundancy airborne electronic device provided by the present invention also has the following technical feature: the electronic device also includes a plurality of thermal conductive pads for dissipating heat from a single-channel printed circuit board.

[0013] The dual-redundancy airborne electronic equipment provided by the present invention also has the following technical features: the electronic equipment is also provided with a plurality of high manganese-based damping alloys for single-channel printed circuit board vibration reduction; the high manganese-based damping alloys are installed between the electronic equipment and the excitation source; and the high manganese-based damping alloys are semi-drum-shaped.

[0014] The dual-redundancy airborne electronic equipment provided by the present invention also has the following technical features: the contact surface between the reinforcement frame and the heat dissipation reinforcement structural component is provided with a mutually cooperating limiting structure, and sealing components are provided between the heat dissipation reinforcement structural component and the reinforcement frame and between the panel and the reinforcement frame.

[0015] Beneficial Effects

[0016] The dual-redundancy airborne electronic equipment provided by the present invention improves the reliability of the dual-redundancy electronic equipment printed circuit board assembly and increases the effective layout area of ​​the printed circuit board. The airborne electronic equipment is provided with a vibration isolation structure, which effectively improves the ability of the electronic equipment to withstand harsh vibration environments and reduces the weight of the electronic equipment from the overall structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0018] Figure 1 A schematic diagram of the structure of an airborne electronic device provided by an embodiment of the present invention;

[0019] Figure 2 An exploded view of an airborne electronic device provided by an embodiment of the present invention

[0020] Figure 3 A schematic diagram of the structure of a reinforcement frame provided in an embodiment of the present invention;

[0021] Figure 4 A connection diagram of a printed circuit board assembly in an electronic device provided by an embodiment of the present invention;

[0022] Figure 5A schematic diagram of the connection between the printed circuit board assembly and the reinforcement frame in the electronic device provided by the embodiment of the present invention;

[0023] Figure 6 A schematic diagram of the installation of a high manganese-based damping alloy provided in an embodiment of the present invention;

[0024] Figure 7 A schematic structural diagram of a high manganese-based damping alloy provided in an embodiment of the present invention;

[0025] Figure 8 A schematic diagram of an electronic device support component provided by an embodiment of the present invention;

[0026] Fig. 9 This is a schematic diagram of the installation of the heat dissipation reinforcement structure provided in an embodiment of the present invention.

[0027] 1: reinforcement frame; 11: limiting structure; 12: convex step; 2: double redundant component; 21: single channel printed circuit board; 3: non-redundant component; 4: heat dissipation reinforcement structure; 5: panel; 6: external interface printed circuit board assembly; 7: flexible printed circuit board; 8: mounting ear piece; 9: thermal pad; 10: high manganese-based damping alloy; 11: components. DETAILED DESCRIPTION

[0028] The present application is further described in detail below in conjunction with the accompanying drawings and examples, but it should be noted that these implementation methods are not limitations of the present application, and equivalent changes or substitutions in functions, methods, or structures made by ordinary technicians in the field based on these implementation methods are all within the scope of protection of the present application.

[0029] In the description of the embodiments of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the creation of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the creation of the present application.

[0030] In addition, the terms "first", "second", "third", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the invention of this application, unless otherwise specified, the meaning of "plurality" is two or more.

[0031] The terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the invention of this application can be understood by specific circumstances.

[0032] like Figure 1-9 As shown, an embodiment of the present application provides a dual-redundancy airborne electronic device, the electronic device comprising: a reinforcement frame 1, a plurality of groups of dual-redundancy components 2 fixed on the reinforcement frame 1, a non-redundancy component 3 fixed on the reinforcement frame 1, a heat dissipation reinforcement structure 4 fixed on the reinforcement frame 1 for heat dissipation, a panel 5 arranged on the reinforcement frame 1, and an external interface printed circuit board assembly 6 fixed on the panel 5, the dual-redundancy printed circuit board assembly 2 comprises two single-channel printed circuit boards 21, and the plurality of dual-redundancy components 2 are mirror-set with the horizontal center plane of the electronic device as a reference, the single-channel printed circuit board 21 is parallel to the non-redundancy component 3, and the single-channel printed circuit board 21, the non-redundancy component 3 and the external interface printed circuit board assembly 6 are perpendicular.

[0033] In some embodiments, the single-channel printed circuit board 21 , the non-redundant component 3 , and the external interface printed circuit board component 6 are interconnected via a flexible printed circuit board 7 .

[0034] In some embodiments, the electronic device is further provided with a mounting ear piece 8 .

[0035] In some embodiments, a mounting hole for connecting to a reinforcement frame is provided in the center area of ​​the single-channel printed circuit board, a boss for fixing the single-channel printed circuit board is provided in the center of the reinforcement frame, the mounting hole is concentric with the boss and is fixed by bolts.

[0036] In some embodiments, the distance between the edge of the single-channel printed circuit board 21 and the reinforcement frame 1 is 0.5-3 mm.

[0037] In some embodiments, the electronic device further comprises a plurality of thermal pads 9 for dissipating heat from the single-channel printed circuit board 21. The thermal pads 9 are mounted on a surface with a heat flux density greater than 0.1 W / cm 2 Between the top surface of the component 11 and the heat dissipation reinforcement structure 4 on both sides, the side length of the thermal pad 9 is the same as the side length of the component. The thermal pad 9 has double-sided adhesive, and the body resistance is ≥1×10 10 Ω·cm, during assembly, ensure that the two surfaces of the thermal pad 9 are closely attached to the components 11 and structural parts and the compression does not exceed 30%, and the wall thickness is 0.3-3mm.

[0038] In some embodiments, the electronic device is further provided with a plurality of high manganese-based damping alloys 10 for vibration reduction of a single-channel printed circuit board 21, the high manganese-based damping alloys 10 are installed between the electronic device and the excitation source, and the high manganese-based damping alloys 10 are semi-drum-shaped. The diameter of the high manganese-based damping alloy 10 does not exceed 25 mm, the total thickness does not exceed 3.5 mm, the weight of a single one does not exceed 3.5 g, and the average vibration isolation rate of 50-2000 Hz is greater than 30%.

[0039] In some embodiments, the contact surface between the reinforcement frame 1 and the heat dissipation reinforcement structure 4 is provided with a mutually matching limiting structure 11, and a seal is provided between the heat dissipation reinforcement structure 4 and the reinforcement frame 1, and between the panel 5 and the reinforcement frame 1. The reinforcement frame 1 is provided with a convex step 12 for limiting the vertical constraint release surface freedom of the non-redundant component 3, the convex step has a width of 0.5 to 3 mm, a height of 0.5 to 3 mm, a diameter not less than twice the diameter of the screw, and is in the same plane as the surrounding bosses.

[0040] The above is only a preferred embodiment of the present application and is not intended to limit the present application. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present application shall be included in the protection scope of the present application. The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and variations can be made without departing from the technical principles of the present application, and these improvements and variations should also be regarded as the protection scope of the present application.

Claims

1. A dual-redundancy airborne electronic device, characterized in that: The electronic device comprises: a reinforcement frame, a plurality of groups of dual-redundancy components fixed on the reinforcement frame, a non-redundancy component fixed on the reinforcement frame, a heat dissipation reinforcement structural member fixed on the reinforcement frame for heat dissipation, a panel arranged on the reinforcement frame, and an external interface printed circuit board assembly fixed on the panel. The dual-redundancy printed circuit board assembly includes two single-channel printed circuit boards. The plurality of dual-redundant components are mirror-imaged with the horizontal center plane of the electronic device as a reference. The single channel printed circuit board is parallel to the non-redundant component, The single-channel printed circuit board, the non-redundant component and the external interface printed circuit board component are perpendicular.

2. The dual-redundancy airborne electronic device according to claim 1, characterized in that: The single-channel printed circuit board, the non-redundant component and the external interface printed circuit board component are interconnected through a flexible printed circuit board.

3. The dual-redundancy airborne electronic device according to claim 1, characterized in that: The electronic device is also provided with a mounting ear piece.

4. The dual-redundancy airborne electronic device according to claim 1, characterized in that: A mounting hole for connecting with the reinforcement frame is provided in the central area of ​​the single-channel printed circuit board, a boss for fixing the single-channel printed circuit board is provided in the center of the reinforcement frame, and the mounting hole is concentric with the boss.

5. The dual-redundancy airborne electronic device according to claim 1, characterized in that: The distance between the edge of the single-channel printed circuit board and the reinforcement frame is 0.5-3 mm.

6. The dual-redundancy airborne electronic device according to claim 1, characterized in that: The electronic device also includes a plurality of thermal pads for dissipating heat from the single-channel printed circuit board.

7. The dual-redundancy airborne electronic device according to claim 1, characterized in that: The electronic device is also provided with a plurality of high manganese-based damping alloys for single-channel printed circuit board vibration reduction. The high manganese-based damping alloys are installed between the electronic device and the excitation source, and the high manganese-based damping alloys are semi-drum-shaped.

8. The dual-redundancy airborne electronic device according to claim 1, characterized in that: The contact surfaces between the reinforcement frame and the heat dissipation reinforcement structural component are provided with mutually matching limiting structures, and sealing components are provided between the heat dissipation reinforcement structural component and the reinforcement frame, and between the panel and the reinforcement frame.

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