Power conversion device

Abstract

The invention provides a power conversion device, and relates to the technical field of energy. The power conversion device provided by the invention comprises a box body, a main circuit board and a plurality of power conversion modules, the box body comprises a partition plate, the partition plate divides a cavity of the box body into a heat dissipation cavity and a power cavity which are arranged along a first direction, and the partition plate comprises a first hollow area. The power conversion module comprises a power conversion module and a heat dissipation assembly which are arranged in the first direction, and in the first direction, the projection of the power conversion module is located in the outline range of the first hollowed-out area. According to the invention, the main circuit board is located in the power cavity, and the power conversion module is detachably connected with the main circuit board. The heat dissipation assembly is located in the heat dissipation cavity and used for dissipating heat of the power conversion module. According to the design scheme of the power conversion device provided by the invention, the plurality of power conversion modules are detachably connected with the main circuit board, so that the maintenance convenience of the power conversion device is improved, and the maintenance cost of the power conversion device is reduced.

Description

Technical Field

[0001] The present application relates to the field of energy technology, and in particular to a power conversion device. Background Art

[0002] In recent years, with the increase in the power level of photovoltaic inverters, the performance of power conversion modules also needs to be enhanced simultaneously. On the one hand, it is necessary to make the power conversion module operate stably under higher current and voltage conditions, and on the other hand, it is also necessary to improve the heat dissipation efficiency of the power conversion module. In the current high-power photovoltaic inverter, multiple power conversion modules are fixedly connected to the same heat dissipation component by welding, and multiple power conversion modules are also fixed to the circuit board by welding. If one of the power conversion modules fails, the entire machine will be scrapped, and its maintenance cost is high. Summary of the invention

[0003] The present application provides a power conversion device to improve the maintenance convenience of the power conversion device, thereby reducing the maintenance cost of the power conversion device.

[0004] The power conversion device provided in the present application includes a housing, a main circuit board and a plurality of power conversion modules, wherein the housing is used to accommodate a plurality of power conversion modules and the main circuit board, the housing includes a partition, the partition divides the cavity of the housing into a power cavity and a heat dissipation cavity arranged along a first direction, and the partition includes a first hollow area. The power conversion module is attached to the partition and covers the first hollow area, the power conversion module includes a power conversion module and a heat dissipation assembly arranged along a first direction, and along the first direction, the projection of the power conversion module is located within the contour range of the first hollow area. In the present application, the main circuit board is located in the power cavity, and the power conversion module is detachably connected to the main circuit board, and is used to convert direct current from a photovoltaic module or an energy storage battery into alternating current. In addition, the heat dissipation assembly is located in the heat dissipation cavity, and is used to dissipate heat for the power conversion module. By adopting the setting method of the power conversion device provided in the present application, since multiple power conversion modules are respectively provided with heat dissipation components for dissipating heat for the power conversion modules, and each power conversion module can be detachably connected to the main circuit board through the power conversion module, when one of the power conversion modules fails, only the power conversion module including the failed power conversion module can be replaced, which is beneficial to improving the maintenance convenience of the power conversion device, thereby helping to reduce the maintenance cost of the power conversion device.

[0005] In a possible implementation of the present application, the power conversion module further includes a first sub-circuit board, one side of the first sub-circuit board is in contact with the surface of the power conversion module facing away from the heat dissipation component, and the other side of the first sub-circuit board includes a first current-passing terminal, which is fixed and electrically connected to the main circuit board. This not only facilitates the detachable connection between the power conversion module and the main circuit board, but also improves the current-passing capacity of the power conversion module by setting the first current-passing terminal of the first sub-circuit board, so that the power conversion module can meet the current-passing requirements of high-current application scenarios.

[0006] In a possible implementation of the present application, along the first direction, the projection of the power conversion module is located within the contour range of the first sub-circuit board connected thereto. This is conducive to reducing the board area occupied by the power conversion module on the main circuit board, thereby supporting the arrangement of more power conversion modules to improve the power density of the power conversion device.

[0007] In the present application, the first sub-circuit board also includes a first signal terminal, which is disposed on the other side of the first sub-circuit board, and the current value supported by the first signal terminal is smaller than the current value supported by the first current-passing terminal. The first sub-circuit board can also be used to transmit the signal of the power conversion module, which is beneficial to reduce the cables between the power conversion module and the main circuit board, thereby facilitating its assembly convenience.

[0008] In addition, the first sub-circuit board also includes a driving circuit, which is used to provide a driving level for the power conversion module, and the driving circuit is electrically connected to the main circuit board through the first signal terminal. In this way, the cable connection between the power conversion module and the main circuit board can be reduced while meeting the driving requirements of the power conversion module.

[0009] In a possible implementation of the present application, the heat dissipation assembly is detachably connected to the partition, and along the first direction, the projection of the first hollow area is located within the contour of the projection of the heat dissipation assembly. In this way, the power conversion module and the partition can be detachably connected to improve the maintenance convenience of the power conversion device. In addition, the heat dissipation assembly can also cover the first hollow area, so that the power cavity has a better sealing effect.

[0010] In addition, in the present application, a first sealing ring is provided between the heat dissipation assembly and the partition, and the first sealing ring is provided around the power conversion module, which is conducive to improving the sealing of the power cavity, so as to ensure the efficient operation of the main circuit board and other devices in the power cavity.

[0011] In a possible implementation of the present application, the heat dissipation assembly includes a housing and a liquid working medium contained in the housing. Along a first direction, the projection of the power conversion module is located within the contour range of the housing, and the power conversion module is in thermal contact with the liquid working medium. This solution can be used to achieve heat dissipation of the power conversion module by utilizing vapor-liquid two-phase heat exchange, which is conducive to improving the heat dissipation efficiency of the power conversion module.

[0012] In a possible implementation of the present application, the power conversion module is detachably connected to the heat dissipation module. In this way, when the power conversion module or the heat dissipation component in the power conversion module fails, only the failed part can be replaced, which is conducive to reducing the maintenance cost of the power conversion device.

[0013] In addition, a second sealing ring is provided between the power conversion module and the heat dissipation assembly, and along the first direction, the projection of the power conversion module covers the second sealing ring, so as to improve the sealing between the power conversion module and the heat dissipation assembly and reduce the risk of leakage of the liquid working medium.

[0014] In a possible implementation of the present application, the power conversion device further includes an inductor component, at least part of which is located in the heat dissipation cavity, the inductor is contained in the first housing, and the inductor component includes a second current terminal. The partition also includes a second hollow area, along the first direction, the projection of the second hollow area is located within the contour range of the projection of the first housing, the projection of the second current terminal is located within the contour range of the second hollow area, and the second current terminal is detachably connected to the main circuit board. In this solution, since the inductor component is also detachably connected to the main circuit board, it is conducive to improving the maintenance convenience of the power conversion device, and when the inductor component fails, it can only be replaced to reduce maintenance costs.

[0015] In addition, the power conversion device further includes a capacitor assembly, at least part of which is located in the heat dissipation cavity, and the capacitor assembly includes a third current-passing terminal. The partition also includes a third hollow area, along the first direction, the projection of the third hollow area is located within the contour range of the projection of the capacitor assembly, the projection of the third current-passing terminal is located within the contour range of the third hollow area, and the third current-passing terminal is detachably connected to the main circuit board. In this way, the capacitor assembly can be detachably connected to the main circuit board to improve the maintenance convenience of the power conversion device.

[0016] In a possible implementation of the present application, the surface of the partition facing the power cavity includes a first positioning column, the main circuit board includes a first positioning hole, and the first positioning column is inserted into the first positioning hole. This is conducive to improving the positioning accuracy of the main circuit board in the box and the convenience of installing the main circuit board.

[0017] In addition, in the present application, the surface of the partition facing the heat dissipation cavity includes a second positioning column, and the heat dissipation assembly includes a second positioning hole. In this way, the second positioning column can be inserted into the second positioning hole to achieve the positioning of the power conversion module in the box. Since the main circuit board also uses the partition as a positioning reference, it is conducive to improving the assembly accuracy of the power conversion module and the main circuit board, thereby reducing the difficulty of assembling the power conversion device.

[0018] In a possible implementation of the present application, the box body further includes a peripheral side plate, which encloses the cavity of the box body. In addition, the edge of the partition is connected to the peripheral side plate, and the partition and the peripheral side plate are an integrally formed structure. This is conducive to simplifying the structure of the box body and making the positioning reference of each component in the power conversion device unique, that is, each component in the power conversion device uses the partition as a positioning reference to improve the positioning accuracy of each component, thereby reducing the manufacturing difficulty of the power conversion device. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 A schematic diagram of the structure of a traditional photovoltaic inverter provided in an embodiment of the present application;

[0020] Figure 2 A schematic diagram of the structure of a power conversion device provided in an embodiment of the present application;

[0021] Figure 3 An exploded view of a local structure of a power conversion device provided in an embodiment of the present application;

[0022] Figure 4 An exploded view of another partial structure of a power conversion device provided in an embodiment of the present application;

[0023] Figure 5 An exploded diagram of a structure of a power conversion module provided in an embodiment of the present application;

[0024] Figure 6 A schematic diagram of a power conversion module provided in an embodiment of the present application;

[0025] Figure 7 An exploded diagram of another structure of a power conversion module provided in an embodiment of the present application;

[0026] Figure 8 A schematic diagram of the structure of the main circuit board facing the partition provided in an embodiment of the present application;

[0027] Fig. 9 A schematic diagram of the structure of an inductor component provided in an embodiment of the present application;

[0028] Fig.10 A schematic diagram of the structure of a capacitor assembly provided in an embodiment of the present application;

[0029] Fig.11 A schematic diagram of the structure of a side of the partition of the box body provided in an embodiment of the present application facing the heat dissipation cavity;

[0030] Fig.12 An exploded diagram of a power conversion device provided in an embodiment of the present application;

[0031] Fig.13 for Fig.12 A schematic diagram of the structure shown at another angle;

[0032] Fig.14 A cross-sectional view of a power conversion device provided in an embodiment of the present application;

[0033] Figures 15a to 15g A schematic diagram of an assembly process of a power conversion device is provided for an embodiment of the present application;

[0034] Figures 16a to 16f A maintenance flow diagram of a power conversion device is provided for an embodiment of the present application.

[0035] Reference numerals:

[0036] 1-passive device; 101-inductor component; 1011-first housing; 10111-third positioning hole; 1012-inductor; 10121-second current-passing terminal;

[0037] 102-capacitor assembly; 1021-second housing; 10211-fourth positioning hole; 1022-capacitor; 1023-second sub-circuit board;

[0038] 10231-third current-passing terminal; 10232-third signal terminal;

[0039] 2-power conversion module; 201-first sub-circuit board; 2011-first current-passing terminal; 2012-first signal terminal; 202-power conversion module;

[0040] 2021-substrate; 2022-heat dissipation base plate; 2023-chip; 203-heat dissipation assembly; 2031-housing; 2032-mounting groove; 2033-second positioning hole;

[0041] 204-seal ring; 3-main circuit board; 301-first positioning hole; 302-second signal terminal; 4-box; 401-partition plate; 4011-first positioning column;

[0042] 4012-first hollow area; 4013-second positioning column; 4014-third positioning column; 4015-fourth positioning column; 4016-second hollow area;

[0043] 4017 - second hollow area; 402 - heat dissipation cavity; 403 - power cavity; 404 - peripheral side plate; 405 - first cover plate; 406 - second cover plate; 5 - screws; 6 - bus; 7 - fan; 8 - air-cooled heat dissipation component. DETAILED DESCRIPTION

[0044] In order to make the purpose, technical scheme and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as being limited to the embodiments described herein. The same reference numerals in the figures represent the same or similar structures, and thus their repeated description will be omitted. The words expressing position and direction described in the embodiments of the present application are all illustrated by taking the accompanying drawings as examples, but changes may be made as needed, and the changes made are all included in the scope of protection of the present application. The drawings of the embodiments of the present application are only used to illustrate the relative position relationship, and they do not represent the true proportion.

[0045] It should be noted that specific details are described in the following description to facilitate understanding of the present application. However, the present application can be implemented in a variety of other ways different from those described herein, and those skilled in the art can make similar extensions without violating the connotation of the present application.

[0046] In order to facilitate understanding of the power conversion device provided in the embodiment of the present application, its application scenario is first introduced below.

[0047] With the continuous development and widespread popularity of green energy, the importance of electric energy in people's daily lives has become increasingly prominent. In the process of transmitting and using electric energy, it is necessary to convert or adjust parameters such as the voltage or current of electric energy. Taking the photovoltaic power generation scenario as an example, the photovoltaic power generation system is a power generation system that uses the photovoltaic effect of semiconductor materials to convert solar energy into electric energy. The photovoltaic power generation system generally may include a photovoltaic module and a power conversion device, wherein the photovoltaic module can be used to convert solar energy into direct current, and the power conversion device can be used to convert the current of the direct current from the photovoltaic module, or it can also be used to convert the voltage of the direct current from the photovoltaic module, so that the photovoltaic power generation system can output alternating current that matches the power demand of external electrical equipment. Or in the energy storage scenario, the energy storage cabinet may include an energy storage battery and a power conversion device, wherein the power conversion device can be used to convert the direct current from the energy storage battery into alternating current and output it to the load. In the present application, the power conversion device includes a photovoltaic inverter and an energy storage converter. For ease of understanding, in the following embodiments of the present application, the power conversion device is a photovoltaic inverter as an example for explanation.

[0048] As the power of photovoltaic inverters increases, the number of circuit boards, passive devices, power conversion modules, cables and other structures inside the photovoltaic inverter chassis increases. Since the power conversion module generates a lot of heat during operation, a heat dissipation component is usually set for it to ensure the reliable operation of the power module. Figure 1 A schematic diagram of the structure of a traditional photovoltaic inverter provided in an embodiment of the present application. Figure 1 In the embodiment shown, the heat dissipation component 203 is an air-cooled heat dissipation component. In a specific application, the heat dissipation base plate of the power conversion module 202 is in thermal contact with the heat dissipation component 203, so that the heat generated by the power conversion module 202 can be transferred to the heat dissipation component 203. In addition, the wind blown by the fan can take away the heat on the surface of the heat dissipation component 203, thereby achieving heat dissipation of the power conversion module 202 by the heat dissipation component 203.

[0049] At present, in order to ensure the heat dissipation effect of the heat dissipation component 203 on the power conversion module 202, the power conversion module 202 and the heat dissipation component 203 are connected by welding. In addition, when the photovoltaic inverter includes multiple power conversion modules 202, the multiple power conversion modules 202 are all welded to the same heat dissipation component 203. In addition, in the traditional photovoltaic inverter, the passive device 1 (such as an inductor or a capacitor, etc.) and the power conversion module 202 are all welded to the main circuit board 3. When one of the power conversion modules 202 or the passive device 1 fails, the whole machine will be scrapped, and its maintenance cost is high.

[0050] In view of this, the power conversion device provided by the present application arranges the power conversion module and the heat dissipation component in a one-to-one correspondence, and makes the power conversion component detachably connected to the main circuit board, so as to improve the maintenance convenience of the power conversion device, thereby reducing the maintenance cost of the power conversion device. In order to facilitate the understanding of the power conversion device provided by the present application, it will be described in detail below with reference to the accompanying drawings.

[0051] Figure 2 A schematic diagram of the structure of a power conversion device provided in an embodiment of the present application. Figure 2 As shown, in this embodiment, the power conversion device includes a housing 4, a power conversion module 2 and a main circuit board 3, wherein the housing 4 includes a partition 401, and the partition 401 divides the cavity of the housing 4 into a power cavity 403 and a heat dissipation cavity 402 arranged along a first direction. The main circuit board 3 is located in the power cavity 403, and part of the power conversion module 2 is located in the heat dissipation cavity 402, and part of the power conversion module 2 passes through the partition 401 and extends to the power cavity 403, so as to be electrically connected to the main circuit board 3, thereby realizing the electrical connection between the power conversion module 2 and the main circuit board 3.

[0052] When specifically setting up the power conversion device provided by the present application, first refer to Figure 3 , Figure 3 The exploded view of the partial structure of the power conversion device provided in the embodiment of the present application. In the present embodiment, the box body 4 further includes a peripheral side plate 404, which is used to enclose the cavity of the box body 4, and the edge of the partition plate 401 is fixedly connected to the peripheral side plate 404 to divide the cavity into Figure 2 The heat dissipation cavity 402 and the power cavity 403 are shown in FIG. It is worth mentioning that in the present application, the peripheral side plate 404 and the partition plate 401 can be an integrally formed structure, which can be an integral structure formed by die casting, so as to simplify the structure of the box body 4.

[0053] Figure 4 This is an exploded view of another partial structure of the power conversion device provided in the embodiment of the present application. Figure 3 and Figure 4 , the partition 401 includes a first hollow area 4012, and the power conversion module 2 is attached to the partition 401 and covers the first hollow area 4012. In this embodiment, the power conversion device may include a plurality of power conversion modules 2, and the plurality of power conversion modules 2 may be arranged side by side. It is understood that in the present application, the number of the first hollow areas 4012 on the partition 401 is the same as that of the power conversion modules 2, so that the first hollow areas 4012 and the power conversion modules 2 are arranged in a one-to-one correspondence.

[0054] Figure 5 This is an exploded view of a structure of a power conversion module provided in an embodiment of the present application. Figure 5 As shown, the power conversion module 2 includes a power conversion module 202 and a heat dissipation component 203 arranged along a first direction, wherein the power conversion module 202 is used to convert direct current from a photovoltaic component or an energy storage battery into alternating current, and the heat dissipation component 203 is used to dissipate heat from the power conversion module 202. Figure 4 and Figure 5 , along the first direction, the projection of the power conversion module 202 is located within the contour range of the first hollow area 4012, and the power conversion module 202 is detachably connected to the main circuit board 3, thereby realizing the detachable connection between the power conversion module 2 and the main circuit board 3. In this way, when a power conversion module 2 fails, only the failed power conversion module 2 needs to be removed from the main circuit board 3 for replacement, which will not affect other power conversion modules 2, the main circuit board 3 and other devices arranged on the main circuit board 3, thereby facilitating the maintainability of the power conversion device.

[0055] It is understandable that, in the present application, the heat dissipation component 203 is located in the heat dissipation cavity 402 and is in thermal contact with the power conversion module 202 .

[0056] Reference Figure 6 , Figure 6Schematic diagram of a power conversion module provided in an embodiment of the present application. The power conversion module 202 includes a substrate 2021, a heat dissipation base plate 2022 and a chip 2023, wherein the substrate 2021 is fixedly connected to the heat dissipation base plate 2022, and the chip 2023 is located on the side of the substrate 2021 away from the heat dissipation base plate 2022. In order to achieve effective heat dissipation of the power conversion module 202, the heat dissipation base plate 2022 can be a plate-like structure with good heat dissipation performance such as a copper plate. Based on this, in the present application, the heat dissipation base plate 2022 of the power conversion module 202 can be in thermal contact with the heat dissipation component 203.

[0057] In the embodiment of the present application, the heat dissipation assembly 203 includes a shell 2031 and a liquid working medium contained in the shell 2031. At least a portion of the heat dissipation base plate 2022 can be embedded in the shell 2031, and the heat dissipation base plate 2022 is in thermal contact with the liquid working medium. In this way, the heat generated by the power conversion module 202 can be transferred to the liquid working medium through the heat dissipation base plate 2022, and the liquid working medium evaporates into gas when heated, and the gas can be recondensed into liquid when cooled and then flow back to the location of the heat dissipation base plate 2022, so that the heat dissipation of the power conversion module 202 can be achieved by using the vapor-liquid two-phase heat exchange, which is conducive to improving the heat dissipation efficiency of the power conversion module 2.

[0058] In this application, if Figure 5 and Figure 6 As shown, along the first direction, the projection of the power conversion module 202 is located within the contour range of the shell 2031 of the heat dissipation component 203, which can ensure a larger heat exchange area between the power conversion module 202 and the heat dissipation component 203, thereby facilitating improving the heat exchange efficiency between the power conversion module 202 and the heat dissipation component 203.

[0059] In addition, please refer to Figure 4 and Figure 5 , along the first direction, the projection of the first hollow area 4012 is located within the contour of the projection of the heat dissipation component 203, so that the heat dissipation component 203 can cover the first hollow area 4012. In addition, the heat dissipation component 203 can also be detachably connected to the partition 401, which can be connected by fasteners such as screws but is not limited to, so as to realize the detachable connection between the entire power conversion module 2 and the box body 4, which is conducive to improving the maintenance convenience of the power conversion device.

[0060] In the embodiment of the present application, a first sealing ring (not shown in the figure) is further provided between the heat dissipation assembly 203 and the partition plate 401, and the first sealing ring is provided around the power conversion module 202. This can help improve the sealing of the power cavity 403 to ensure the efficient operation of the main circuit board 3 and other devices in the power cavity 403.

[0061] exist Figure 5In the illustrated embodiment, the power conversion module 202 and the heat dissipation assembly 203 can be connected by welding (e.g., laser welding) or the like, which can improve the sealing of the connection between the power conversion module 202 and the heat dissipation assembly 203 while ensuring the connection reliability between the power conversion module 202 and the heat dissipation assembly 203.

[0062] Reference Figure 7 , Figure 7 An exploded view of another structure of a power conversion module provided in an embodiment of the present application. In this embodiment, the power conversion module 202 is detachably connected to the heat dissipation assembly 203. Specifically, a second sealing ring 204 is provided between the power conversion module 202 and the heat dissipation assembly 203. In addition, the heat dissipation assembly 203 also includes a mounting groove 2032, and the mounting groove 2032 is used to install the second sealing ring 204 and the power conversion module 202. In this way, the second sealing ring 204 can be squeezed by the power conversion module 202, so that the second sealing ring 204 seals the gap between the power conversion module 202 and the heat dissipation assembly 203.

[0063] It is worth mentioning that in the present application, along the first direction, the projection of the power conversion module 202 covers the second sealing ring 204 , which is beneficial to improving the sealing reliability between the power conversion module 202 and the heat dissipation component 203 .

[0064] exist Figure 7 In the illustrated embodiment, the heat dissipation base plate 2022 of the power conversion module 202 and the housing 2031 of the heat dissipation assembly 203 can be connected by fasteners such as screws. In this way, when the power conversion module 202 or the heat dissipation assembly 203 fails, it can be easily replaced, thereby improving the maintainability of the power conversion device.

[0065] Considering that in the traditional solution, the flow rate between the power conversion module 202 and the main circuit board 3 is usually increased by adding power PINs. However, the improvement effect is relatively limited, and the power PIN occupies a large area. Based on this, in order to improve the flow capacity of the power conversion module 2, in this application, it can continue to refer to Figure 5 and Figure 7 The power conversion module 202 also includes a first sub-circuit board 201, such as Figure 4 As shown, the first sub-circuit board 201 is located in the power cavity 403. One side of the first sub-circuit board 201 is in contact with the surface of the power conversion module 202 that is away from the heat dissipation component 203, so as to realize the electrical connection between the power conversion module 202 and the first sub-circuit board 201. The present application does not limit the specific implementation method of the electrical connection between the power conversion module 202 and the first sub-circuit board 201, which can be realized by welding to improve the reliability of the electrical connection between the power conversion module 2 and the first sub-circuit board 201.

[0066] You can continue to refer to Figure 4 and Figure 5 , and the other side of the first sub-circuit board 201, that is, the side of the first sub-circuit board 201 away from the power conversion module 202, includes a first current-passing terminal 2011, and the first current-passing terminal 2011 is fixed and electrically connected to the main circuit board 3. Specifically, as Figure 5 and Figure 7 As shown, the first current-passing terminal 2011 may protrude from the surface of the first sub-circuit board 201. Figure 2 The first current-carrying terminal 2011 can be electrically connected to the main circuit board 3 via a screw 5, which not only realizes the electrical connection between the first sub-circuit board 201 and the main circuit board 3, but also helps to increase the current-carrying area between the first sub-circuit board 201 and the main circuit board 3, thereby meeting the current-carrying requirements of large currents.

[0067] It is worth mentioning that in the scenario where the flow area is required to be high, a busbar can be added between the first sub-circuit board 201 and the main circuit board 3, wherein one end of the busbar is electrically connected to the first sub-circuit board 201 by screws, and the other end of the busbar is electrically connected to the main circuit board 3 by screws. In this way, the flow area of ​​the busbar can be designed according to the use requirements in the actual scenario so that it meets the flow requirements between the first sub-circuit board 201 and the main circuit board 3. In some possible embodiments of the present application, the busbar can also be replaced with a flexible circuit board, etc., which can also meet the flow requirements between the first sub-circuit board 201 and the main circuit board 3 while realizing the detachable connection between the first sub-circuit board 201 and the main circuit board 3.

[0068] Since there is not only large current transmission but also small current transmission between the main circuit board 3 and the first sub-circuit board 201, Figure 5 and Figure 7 As shown, in the embodiment of the present application, the first sub-circuit board 201 may include a first signal terminal 2012, and the first signal terminal 2012 is also arranged on a side of the first sub-circuit board 201 away from the power conversion module 202, that is, the side where the first current-passing terminal 2011 is located. Figure 8 , Figure 8 The main circuit board 3 includes a second signal terminal 302 .

[0069] In the present application, the specific configuration of the first signal terminal 2012 and the second signal terminal 302 is not limited. For example, Figure 5 and Figure 7As shown, the first signal terminal 2012 and the second signal terminal 302 may be a board to board (BTB) connector. In some other embodiments of the present application, the first signal terminal 2012 may also be an OT terminal (or a round cold-pressed terminal), and the second signal terminal 302 is a bright copper area arranged on the main circuit board 3. In other possible embodiments of the present application, the first signal terminal 2012 and the second signal terminal 302 may also adopt other arrangement methods, which are not listed here one by one.

[0070] It is worth mentioning that, in the present application, the current value supported by the first signal terminal 2012 is smaller than the current value supported by the first current-passing terminal 2011. For example, in a possible embodiment, the first signal terminal 2012 can be used to support the transmission of a small current of 10A or less, and the first current-passing terminal 2011 can be used to support the transmission of a large current of 100A or more.

[0071] It is understood that in this application, Figure 5 or Figure 7 As shown, along the first direction, the projection of the power conversion module 202 is located within the contour range of the first sub-circuit board 201 connected thereto. This is conducive to reducing the board area occupied by the power conversion module 2 on the main circuit board 3, so that the power conversion device can support the arrangement of more power conversion modules 2 to improve the power density of the power conversion device.

[0072] As can be seen from the above introduction, the design scheme of the power conversion device provided by the present application can effectively reduce the cable connection between the main circuit board 3 and the power conversion module 2, which is conducive to improving the assembly convenience of the power conversion device. And compared with the prior art, in the power conversion device provided by the present application, the power conversion module 202 is electrically connected to the main circuit board 3 through the first sub-circuit board 201, which is conducive to improving the flow capacity of the power conversion module 2, thereby meeting the use requirements in large flow scenarios. In addition, it is also conducive to reducing the board area occupied by the power conversion module 2, thereby facilitating the reduction of the volume of the entire power conversion device.

[0073] In a possible embodiment of the present application, the first sub-circuit board 201 also includes a driving circuit, which can be electrically connected to the main circuit board 3 through the above-mentioned first signal terminal 2012, which is beneficial to reduce the cable connection between the main circuit board 3 and the power conversion module 2, thereby improving the assembly efficiency of the power conversion device.

[0074] In the present application, the driving circuit is used to provide a driving level for the power conversion module 202 and to absorb electrical stress. In practical applications, the driving circuit may include a driving chip and a resistor-capacitor-magnetic device, etc., wherein the driving chip may provide a driving level for an insulated-gate bipolar transistor (IGBT) and a metal-oxide semiconductor (MOS) in the power conversion module 202 through a resistor-capacitor-magnetic device, and may be used to absorb electrical stress to realize the power conversion function of the power conversion module 2.

[0075] There are also some passive components in the power conversion device that are also electrically connected to the main circuit board 3, such as capacitors and inductors. The arrangement of these components is similar to that of the power conversion module 2 described above. Figure 3 As shown, the power conversion device further includes an inductor component 101 . Fig. 9 A schematic diagram of the structure of the inductor assembly provided in the embodiment of the present application. Fig. 9 As shown, the inductor assembly 101 includes a first housing 1011 and an inductor 1012, and the inductor 1012 is accommodated in the first housing 1011. The present application does not limit the number of inductors 1012 in the inductor assembly 101, which can be one or more, and can be specifically set according to the function to be achieved by the power conversion device.

[0076] like Fig. 9 As shown, the inductor 1012 includes a second current-carrying terminal 10121 . The second current-carrying terminal 10121 can be configured with reference to the first current-carrying terminal 2011 , and will not be described in detail herein.

[0077] In order to realize the electrical connection between the inductor 1012 and the main circuit board 3, please continue to refer to Figure 3 , the partition 401 also includes a second hollow area 4016, and as Figure 4 As shown, along the first direction, the projection of the second current-carrying terminal 10121 falls within the contour range of the second hollow area 4016 , so that the second current-carrying terminal 10121 can be detachably electrically connected to the main circuit board 3 through the second hollow area 4016 .

[0078] In addition, the first housing 1011 is located in the heat dissipation cavity 402, and along the first direction, the projection of the second hollow area 4016 is located within the contour range of the projection of the first housing 1011. In this way, the first housing 1011 can cover the second hollow area 4016 to ensure the sealing of the power cavity 403. In addition, a sealing ring sleeved on the inductor 1012 can be provided between the first housing 1011 and the partition 401, and the first housing 1011 can press the sealing ring against the partition 401, thereby improving the sealing effect of the power cavity 403.

[0079] It is understandable that, in this embodiment, the first housing 1011 can also be detachably connected to the partition 401. In this way, while the inductor assembly 101 can be installed in the box 4, it is also helpful to improve the maintenance convenience of the inductor assembly 101, thereby improving the maintenance convenience of the entire power conversion device and helping to reduce maintenance costs.

[0080] In other words, at least part of the inductor component 101 is located in the heat dissipation cavity, and along the first direction, the projection of the second hollow area 4016 is located within the contour of the inductor component 101, so that the inductor component 101 can block the second hollow area 4016. In addition, along the first direction, the projection of the second through-current terminal 10121 of the inductor component 101 is located within the second hollow area 4016, so that the inductor component 101 is detachably connected to the main circuit board 3 through the detachable connection of the second through-current terminal 10121 to the main circuit board 3, thereby realizing the detachable connection between the inductor component 101 and the main circuit board 3.

[0081] You can continue to refer to Figure 3 The power conversion device also includes a capacitor component 102. Fig.10 A schematic diagram of the structure of a capacitor assembly provided in an embodiment of the present application. Fig.10 As shown, the capacitor assembly 102 includes a second housing 1021 and a capacitor 1022, wherein the capacitor 1022 is accommodated in the second housing 1021, and the second housing 1021 is located in the heat dissipation cavity 402. The present application does not limit the number of capacitors 1022 in the capacitor assembly 102, which can be one or more, and can be specifically set according to the function to be achieved by the power conversion device.

[0082] In order to realize the electrical connection between the capacitor 1022 and the main circuit board 3, please continue to refer to Figure 3 , the partition 401 also includes a third hollow area 4017. In addition, refer to Figure 3 and Figure 4 It can be understood that, along the first direction, the projection of the capacitor 1022 is located within the contour range of the third hollow area 4017 , so that the capacitor 1022 can be detachably connected to the main circuit board 3 through the third hollow area 4017 .

[0083] In the present application, the specific connection method between the capacitor assembly 102 and the main circuit board 3 can refer to the connection method between the power conversion module 2 and the main circuit board 3 described above. Fig.10As shown, the capacitor assembly 102 also includes a second sub-circuit board 1023, wherein one side of the second sub-circuit board 1023 is electrically connected to the capacitor 1022, and the other side of the second sub-circuit board 1023 includes a third current-passing terminal 10231 and a third signal terminal 10232, wherein the third current-passing terminal 10231 can be set with reference to the first current-passing terminal 2011, and the third signal terminal 10232 can be set with reference to the first signal terminal 2012, which will not be described in detail here.

[0084] It is understandable that if Figure 4 As shown, the second sub-circuit board 1023 is located in the power cavity 403, and the second sub-circuit board 1023 can be detachably connected to the main circuit board 3 to achieve a detachable connection between the capacitor assembly 102 and the main circuit board 3. In the present application, by setting the second sub-circuit board 1023, it is convenient to achieve a detachable connection between the capacitor assembly 102 and the main circuit board 3, and the board area of ​​the capacitor assembly 102 can be reduced. In addition, it is also beneficial to improve the current carrying capacity of the capacitor assembly 102, so as to meet the use requirements of large current flow scenarios.

[0085] In other words, at least part of the capacitor assembly 102 is located in the heat dissipation cavity, and along the first direction, the projection of the third hollow area 4017 is located within the contour range of the capacitor assembly 102, so that the capacitor assembly 102 can block the third hollow area 4017. In addition, along the first direction, the projection of the third through-current terminal 10231 of the capacitor assembly 102 is located within the third hollow area 4017, so that the capacitor assembly 102 can be detachably connected to the main circuit board 3 through the detachable connection of the third through-current terminal 10231 to the main circuit board 3, thereby realizing the detachable connection of the capacitor assembly 102 to the main circuit board.

[0086] From the above introduction, it can be seen that the design method of the power conversion device provided in the present application is adopted. Since the devices such as the power conversion module 2, the inductor component 101 and the capacitor component 102 can be detachably connected to the main circuit board 3, it is beneficial to improve the maintainability of the power conversion device, thereby reducing the maintenance cost.

[0087] It is understandable that in order to realize the connection between the power conversion module 2, the inductor component 101 and the capacitor component 102 and the main circuit board 3, it is necessary to determine their installation positions. In the traditional scheme, during the assembly process of the power conversion device, it is necessary to perform multiple positioning such as positioning of the main circuit board 3 and the box body, positioning of the passive components and the main circuit board 3, and positioning of the power conversion module 2 and the main circuit board 3. Since the positioning reference of each step is not unique, for example, the positioning reference of the main circuit board 3 is the box body, and the positioning reference of the passive components and the power conversion module 2 is the main circuit board 3, this will lead to a large cumulative tolerance in the assembly process.

[0088] In order to solve the above problems, in this application, you can continue to refer to Figure 4 , the surface of the partition 401 facing the power cavity 403 includes a first positioning column 4011. It can be understood that the first positioning column 4011 and the partition 401 can be an integrally formed structure, for example, the first positioning column 4011 can be a columnar structure obtained by stamping on the partition 401. In addition, when the partition 401 and the surrounding side plate 404 are an integrally formed structure, the first positioning column 4011 can be directly die-casted during the processing of the partition 401 and the surrounding side plate 404, which is conducive to simplifying the processing steps of the power conversion device.

[0089] In addition, refer to Figure 4 The main circuit board 3 includes a first positioning hole 301 . It can be understood that the first positioning column 4011 can be inserted into the first positioning hole 301 , so that the main circuit board 3 can be positioned in the box body 4 .

[0090] It is worth mentioning that in the present application, there are at least two first positioning columns 4011 and at least two first positioning holes 301. Figure 4 In the illustrated embodiment, there are two first positioning posts 4011 and two first positioning holes 301, and the two first positioning posts 4011 are inserted into the two first positioning holes 301 in a one-to-one correspondence, thereby improving the positioning accuracy of the main circuit board 3 in the box body 4.

[0091] In addition, in the embodiment of the present application, at least one positioning hole 301 may be a long hole, which can absorb the matching error between the plurality of first positioning columns 4011 and the plurality of first positioning holes 301 .

[0092] As described above, the power conversion module 202 can be connected to the main circuit board 3 through the first hollow area 4012 of the partition 401. It can be understood that the first hollow area 4012 can be used to limit the position of the power conversion module 2 on the box body 4 to achieve the initial positioning of the power conversion module 2.

[0093] Can be referred to together Figure 5 and Figure 7 In the present application, the heat dissipation assembly 203 further includes a second positioning hole 2033. In addition, referring to Fig.11 , Fig.11 Schematic diagram of the structure of the side of the partition of the box body facing the heat dissipation cavity provided in the embodiment of the present application. In this embodiment, the surface of the partition 401 facing the heat dissipation cavity 402 also includes a second positioning column 4013, which is also referred to in Figure 5 and Fig.11 It is understood that the second positioning column 4013 is inserted into the second positioning hole 2033, so that the power conversion module 2 can be positioned on the box 4. It is understood that the specific configuration of the second positioning column 4013 is similar to the first positioning column 4011, which will not be described in detail here.

[0094] As can be seen from the above description, the power conversion module 2 is attached to the partition 401 and covers the first hollow area 4012, and along the first direction, the projection of the power conversion module 202 is located within the contour range of the first hollow area 4012. Based on this, it can be understood that when assembling the power conversion module 2, it can be first installed in the first hollow area 4012 to achieve the initial positioning of the power conversion module 2, and then the second positioning column 4013 is inserted into the second positioning hole 2033 to improve the positioning accuracy of the power conversion module 2 in the box 4.

[0095] It is understandable that, since both the power conversion module 2 and the main circuit board 3 use the box body 4 as a positioning reference, or use the partition 401 as a positioning reference, their positioning references are the same. This makes it easy to set the positions of the first positioning column 4011 and the second positioning column 4013 according to the connection relationship and relative position relationship between the power conversion module 2 and the main circuit board 3, thereby facilitating the improvement of the positioning accuracy of the setting positions of the power conversion module 2 and the main circuit board 3 in the box body 4, which is conducive to reducing the assembly error of the power conversion module 2 and the main circuit board 3, thereby facilitating the reduction of the assembly difficulty of the power conversion device and improving the manufacturability of the power conversion device.

[0096] In the embodiment of the present application, since the positioning accuracy between the power conversion module 2 and the main circuit board 3 is high, it provides the possibility of realizing a detachable connection between the main circuit board 3 and the first sub-circuit board 201. Specifically, the first current-passing terminal 2011 and the first signal terminal 2012 can be positioned by the first positioning column 4011 and the second positioning column 4013. In the process of assembling the main circuit board 3 and the power conversion module 2 with the box 4, while realizing the alignment of the first positioning column 4011 with the first positioning hole 301 of the main circuit board 3 and the alignment of the second positioning column 4013 with the second positioning hole 2033 of the heat dissipation component 203, the alignment of the first current-passing terminal 2011 with the current-passing position of the main circuit board 3 (for example, the bright copper area) and the alignment of the first signal terminal 2012 with the second signal terminal 302 (for example, the alignment of the OT terminal with the bright copper area) is also completed, so that after the main circuit board 3 and the power conversion module 2 are installed in place, the main circuit board 3 can be detachably connected to the first sub-circuit board 201, which is conducive to reducing the difficulty of assembly.

[0097] In addition, if Fig.11 As shown, the surface of the partition 401 facing the heat dissipation cavity 402 further includes a third positioning column 4014, and the first housing 1011 of the inductor assembly 101 includes Fig. 9The third positioning hole 10111 shown in the figure, the third positioning column 4014 is inserted into the third positioning hole 10111 to realize the positioning of the inductor component 101 in the box body 4. It can be seen that the positioning reference of the inductor component 101 in the box body 4 is also the partition 401. When the inductor component 101 is installed in the box body 4, while realizing the alignment of the third positioning column 4014 and the third positioning hole 10111, the second current-passing terminal 10121 of the inductor 1012 of the inductor component 101 and the current-passing position of the main circuit board 3 are also realized. Therefore, after the main circuit board 3 and the inductor component 101 are installed in place, the main circuit board 3 and the inductor component 101 can be detachably connected, which helps to reduce the difficulty of assembly. Please continue to refer to Fig.11 The surface of the partition 401 facing the heat dissipation cavity 402 also includes a fourth positioning column 4015, and the second housing 1021 includes Fig.10 The fourth positioning hole 10211 shown in the figure, the fourth positioning column 4015 is inserted into the fourth positioning hole 10211 to realize the positioning of the capacitor assembly 102 in the box body 4.

[0098] Since the positioning reference of the capacitor assembly 102 in the housing 4 is also the partition 401, the positioning accuracy between the capacitor assembly 102 and the main circuit board 3 is high. It provides the possibility of realizing a detachable connection between the main circuit board 3 and the second sub-circuit board 1023. Specifically, the third through-current terminal 10231 and the third signal terminal 10232 of the second sub-circuit board 1023 can be positioned by the fourth positioning column 4015 and the fourth positioning hole 10211. When the capacitor assembly 102 is installed in the housing 4, while realizing the alignment of the fourth positioning column 4015 and the fourth positioning hole 10211, the alignment of the third through-current terminal 10231 of the capacitor assembly 102 and the through-current position of the main circuit board 3 is also realized, and the alignment of the third signal terminal 10232 and the signal terminal of the main circuit board 3 is realized, so that after the main circuit board 3 and the capacitor assembly 102 are installed in place, the main circuit board 3 and the capacitor assembly 102 can be detachably connected, which is conducive to reducing the difficulty of assembly.

[0099] It is understandable that, in practical applications, the inductor assembly 101 and the capacitor assembly 102 can be assembled with the housing 4 as a whole to improve the assembly and maintenance efficiency of the power conversion device.

[0100] The above only introduces the main components of the power conversion device provided by the present application. In practical applications, the power conversion device also includes other structural components. Fig.12 , Fig.12 This is an exploded view of a power conversion device provided in an embodiment of the present application, which can be used to show the structure in the heat dissipation cavity. Fig.12As shown, the box body 4 also includes a first cover plate 405 and a second cover plate 406 that are relatively arranged, and the surrounding side plate 404 is located between the first cover plate 405 and the second cover plate 406. The first cover plate 405 covers the opening of the heat dissipation cavity 402 and is detachably connected to the surrounding side plate 404. Exemplarily, the first cover plate 405 and the surrounding side plate 404 are detachably connected by screws.

[0101] Fig.13 for Fig.12 The schematic diagram of the structure shown in FIG. 4 is another perspective view, which is used to illustrate the positional relationship between the second cover plate 406 and the power cavity 403. Fig.13 As shown, the second cover plate 406 is disposed on the opening of the power cavity 403 and is detachably connected to the peripheral side plate 404 . For example, the second cover plate 406 is detachably connected to the peripheral side plate 404 via screws.

[0102] You can continue to refer to Fig.12 In the present application, the power conversion device further includes a fan 7. In addition, the heat dissipation component 203, the first housing 1011 and the second housing 1021 may respectively include heat dissipation teeth, so that the air flow in the box body 4 can be driven by the fan 7 to achieve heat dissipation of the power conversion module 2, the inductor component 101 and the capacitor component 102.

[0103] It is worth mentioning that Fig.14 As shown, Fig.14 A cross-sectional view of a power conversion device provided in an embodiment of the present application. In this embodiment, the fan 7 can be located between the capacitor assembly 102 and the heat dissipation assembly 203, and the air outlet of the fan 7 faces the heat dissipation teeth of the heat dissipation assembly 203. This can help improve the heat dissipation efficiency of the heat dissipation assembly 203, thereby improving the heat dissipation efficiency of the power conversion module 2.

[0104] In addition to the above structure, the power conversion device may also include Figure 2 The air-cooled heat dissipation component 8 shown in the figure can be used to provide a circulation channel for the air flow in the box 4. The present application does not limit the specific setting position of the air-cooled heat dissipation component 8 in the box 4. It can be set according to the layout space in the box 4 and the heat dissipation requirements.

[0105] After understanding the basic structure of the power conversion device provided by the present application, Figures 15a to 15g The assembly process of the power conversion device is described as an example.

[0106] The first step is to place the box 4 on the assembly operating table. Fig.15a Only the side plate 404 and the partition plate 401 of the box body 4 are shown, and at this time, the heat dissipation cavity 402 is far away from the assembly operation table relative to the power cavity 403 ( Fig.15aThat is to say, in this embodiment, the components located in the heat dissipation cavity 402 are installed first.

[0107] The second step is to position and install the components in the heat dissipation cavity 402. In this step, refer to Figure 7 and Fig.11 , the second positioning column 4013 is inserted into the second positioning hole 2033 of the heat dissipation assembly 203 of the power conversion module 2 to realize the positioning of the power conversion module 2 in the box body 4. In addition, in order to improve the structural reliability, the power conversion module 2 and the partition 401 can be fixed by screws, and specifically, the heat dissipation assembly 203 and the partition 401 can be fixed by screws.

[0108] Then place the inductor component 101 in the heat dissipation cavity 402 and refer to Fig. 9 and Fig.11 The third positioning column 4014 is inserted into the third positioning hole 10111 to realize the positioning of the inductor assembly 101 in the box 4. Similarly, the first housing 1011 of the inductor assembly 101 can be fixed to the partition 401 by screws to realize the fixed connection between the inductor assembly 101 and the box 4.

[0109] In addition, refer to Fig.10 and Fig.11 , and then place the capacitor assembly 102 in the heat dissipation cavity 402, and insert the fourth positioning column 4015 into the fourth positioning hole 10211 to realize the positioning of the capacitor assembly 102 in the box body 4. The second housing 1021 of the capacitor assembly 102 can also be fixed to the partition 401 by screws to realize the fixed connection between the capacitor assembly 102 and the box body 4.

[0110] In addition, the fan 7 and the air-cooling heat dissipation component 8 and other components can be placed in the heat dissipation cavity 402, and fixed to the box body 4 by screws to obtain the following Fig.15b The structure shown.

[0111] It is understandable that the installation order of the above-mentioned components in the heat dissipation cavity 402 is not limited to this, and it can be selected according to the actual processing production line.

[0112] The third step is to install the first cover plate 405, such as Fig.15c As shown, the first cover plate 405 is covered at the opening of the heat dissipation cavity 402, and the first cover plate 405 is fixedly connected to the peripheral side plate 404 to encapsulate the heat dissipation cavity 402. It is worth mentioning that in the present application, the first cover plate 405 and the peripheral side plate 404 can be detachably connected by screws or the like.

[0113] Step 4: Rotate the structure assembled in step 3 by 180° so that it is in Fig.15dIn the state shown, the first cover plate 405 is in contact with the assembly operation table, and the power cavity 403 is away from the assembly operation table relative to the heat dissipation cavity 402, and then the components in the power cavity 403 can be assembled.

[0114] Step 5: Position and install the main circuit board 3. Figure 4 , the main circuit board 3 is placed in the power cavity 403, and the first positioning column 4011 is inserted into the first positioning hole 301, so as to realize the positioning of the main circuit board 3 in the box body 4, so as to obtain the following Fig.15e The structure shown.

[0115] Step 6: Fig.15f As shown, the main circuit board 3 is connected to the first sub-circuit board 201 of the power conversion module 2, the capacitor component 102 and the inductor component 101. Since the power conversion module 2, the capacitor component 102 and the inductor component 101 are all fixedly connected to the partition 401 and they can all be fixedly connected to the main circuit board 3 by screws, there is no need to fix the main circuit board 3 and the box 4 separately.

[0116] Step 7: Install the second cover plate 406, such as Figure 15g As shown, the second cover plate 406 is covered at the opening of the power cavity 403 , and the second cover plate 406 is fixedly connected to the peripheral side plate 404 , wherein the second cover plate 406 and the peripheral side plate 404 can be detachably connected by screws or the like.

[0117] In this way, the assembly of the power conversion device is realized, and from the introduction of its assembly steps above, it can be understood that the setting method of the power conversion device provided in the embodiment of the present application, since each component uses the partition 401 as a positioning reference, it can effectively reduce the assembly error, thereby reducing the assembly difficulty of the power conversion device, so as to improve the manufacturability of the power conversion device, and is conducive to improving the product yield of the power conversion device.

[0118] In practical applications, the power conversion device is Fig.16a Next, the maintenance process of the power conversion device is introduced by taking the failure of the power conversion module as an example.

[0119] The first step, such as Fig.16b As shown, the second cover plate 406 is removed.

[0120] The second step is, Fig.16c As shown, the screw connection between the main circuit board 3 and the power conversion module 2 is disconnected.

[0121] The third step is Fig.16d As shown, the first cover plate 405 is removed.

[0122] The fourth step is Fig.16e As shown, the failed power conversion module 2 is removed.

[0123] Step 5: Fig.16f As shown, the power conversion module 2 is replaced and the first cover plate 405 is reinstalled on the peripheral side plate 404 .

[0124] Step 6: Fig.16a As shown, the replaced power conversion module 2 is reconnected to the main circuit board 3 , and the second cover plate 406 is reinstalled on the peripheral side plate 404 .

[0125] This completes the maintenance of the power conversion device. It is worth mentioning that when the power conversion module 2 adopts Figure 7 In the arrangement shown, if any of the power conversion module 202 and the heat dissipation assembly 203 of the power conversion module 2 fails, only the failed part can be replaced, thereby reducing maintenance costs.

[0126] Since the power conversion device includes multiple power conversion modules 2, by adopting the design scheme provided in the present application, if one of the power conversion modules 2 fails, only the failed power conversion module 2 needs to be replaced, which can avoid scrapping of the entire device.

[0127] In the above Figures 16a to 16f In the illustrated embodiment, only the failure of the power conversion module 2 is taken as an example to introduce its on-site maintenance process. When other key components in the power conversion device, such as the inductor component 101, the capacitor component 102, the air-cooled heat dissipation component 8 or the main circuit board 3 in the power cavity 403 fail, the maintenance process is similar and will not be described in detail here.

[0128] It can be seen that the configuration method of the power conversion device provided in the embodiment of the present application can not only reduce the difficulty of assembling the power conversion device, but also help improve its later maintainability.

[0129] In the various embodiments of the present application, unless otherwise specified or there is a logical conflict, the terms and / or descriptions between different embodiments are consistent and can be referenced to each other, and the technical features in different embodiments can be combined to form new embodiments according to their internal logical relationships.

[0130] It is understood that the various numbers involved in the embodiments of the present application are only for the convenience of description and are not used to limit the scope of the embodiments of the present application. The size of the sequence number of the above-mentioned processes does not mean the order of execution, and the execution order of each process should be determined by its function and internal logic.

Claims

1. A power conversion device, characterized in that: It includes a box, a main circuit board and multiple power conversion modules, among which: The box is used to accommodate the plurality of power conversion modules and the main circuit board, the box includes a partition, the partition divides the box into a power cavity and a heat dissipation cavity arranged along a first direction, and the partition includes a first hollow area; The main circuit board is located in the power cavity; The power conversion module is attached to the partition and covers the first hollow area. The power conversion module includes a power conversion module and a heat dissipation component arranged along the first direction. Along the first direction, the projection of the power conversion module is located within the contour of the first hollow area. The power conversion module is detachably connected to the main circuit board and is used to convert direct current from a photovoltaic component or an energy storage battery into alternating current. The heat dissipation component is located in the heat dissipation cavity and is used to dissipate heat for the power conversion module.

2. The power conversion device according to claim 1, characterized in that: The power conversion module also includes a first sub-circuit board, one side of which is in contact with the surface of the power conversion module facing away from the heat dissipation component, and the other side of the first sub-circuit board includes a first current-passing terminal, which is fixed and electrically connected to the main circuit board.

3. The power conversion device according to claim 2, characterized in that: Along the first direction, the projection of the power conversion module is located within the outline of the first sub-circuit board connected thereto.

4. The power conversion device according to claim 2 or 3, characterized in that: The first sub-circuit board further includes a first signal terminal, which is disposed on the other side of the first sub-circuit board. The current value supported by the first signal terminal is smaller than the current value supported by the first current-passing terminal.

5. The power conversion device according to claim 4, characterized in that: The first sub-circuit board also includes a driving circuit, which is used to provide a driving level for the power conversion module. The driving circuit is electrically connected to the main circuit board through the first signal terminal.

6. The power conversion device according to any one of claims 1 to 5, characterized in that: The heat dissipation component is detachably connected to the partition, and along the first direction, the projection of the first hollow area is located within the contour range of the projection of the heat dissipation component.

7. The power conversion device according to any one of claims 1 to 6, characterized in that: A first sealing ring is arranged between the heat dissipation component and the partition, and the first sealing ring is arranged around the power conversion module.

8. The power conversion device according to any one of claims 1 to 7, characterized in that: The heat dissipation assembly includes a shell and a liquid working medium contained in the shell; along the first direction, the projection of the power conversion module is located within the contour range of the shell, and the power conversion module is in thermal contact with the liquid working medium.

9. The power conversion device according to claim 8, characterized in that: The power conversion module is detachably connected to the heat dissipation component.

10. The power conversion device according to any one of claims 1 to 9, characterized in that: The power conversion device also includes an inductor component, at least part of which is located in the heat dissipation cavity, and the inductor component includes a second current terminal; the partition also includes a second hollow area, along the first direction, the projection of the second hollow area is located within the contour of the projection of the inductor component, the projection of the second current terminal is located within the contour of the second hollow area, and the second current terminal is detachably connected to the main circuit board.

11. The power conversion device according to any one of claims 1 to 10, characterized in that: The power conversion device also includes a capacitor assembly, at least part of which is located in the heat dissipation cavity, and the capacitor assembly includes a third current terminal; the partition also includes a third hollow area, along the first direction, the projection of the third hollow area is located within the contour of the projection of the second shell, the projection of the third current terminal is located within the contour of the third hollow area, and the third current terminal is detachably connected to the main circuit board.

12. The power conversion device according to any one of claims 1 to 11, characterized in that: The surface of the partition facing the power cavity includes a first positioning column, the main circuit board includes a first positioning hole, and the first positioning column is inserted into the first positioning hole.

13. The power conversion device according to claim 12, characterized in that: The first positioning column and the partition are an integrally formed structure.

14. The power conversion device according to claim 12 or 13, characterized in that: The surface of the partition facing the heat dissipation cavity includes a second positioning column, the heat dissipation component includes a second positioning hole, and the second positioning column is inserted into the second positioning hole.

15. The power conversion device according to any one of claims 1 to 14, characterized in that: The box body also includes a peripheral side plate, which is used to enclose a cavity of the box body; the edge of the partition is connected to the peripheral side plate, and the partition and the peripheral side plate are an integrally formed structure.

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