Penetration type air cooling heat dissipation structure

Abstract

The invention provides a penetration type air cooling heat dissipation structure, and relates to the technical field of electronic equipment structures, the heat dissipation structure is formed by encircling a heat dissipation case, an upper side plate assembly and a lower side plate, the upper side plate assembly comprises an upper side plate and a shunting partition plate, the upper side plate is provided with a ventilation groove, a groove opening extends inwards to form a flow guide structure, and the inner side of the upper side plate extends to form a flow guide wall; the two side edges of the flow dividing partition plate are fixedly connected with the side edges of the flow guiding wall, the middle of the flow dividing partition plate is provided with a flow dividing groove with the inverted-trapezoid-shaped section, a groove opening of the flow dividing groove right faces the lower portion of an outlet of the flow guiding structure, and a plurality of air outlet holes are formed in the flow dividing partition plate on the two sides of the flow dividing groove correspondingly. The air enters the ventilation module through the air outlet hole after passing through the gap between the outlet of the diversion structure and the opening of the diversion groove; cover plates are fixed to the two end faces of the diversion trench, and drainage holes are formed in the bottoms of the cover plates. All chips in the module can be cooled, the cooling capacity of forced air cooling is fully utilized, and the cooling effect is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment structures, and in particular to a penetrating air-cooling heat dissipation structure. Background Art

[0002] As the power consumption of electronic equipment increases, the current traditional air-cooling heat dissipation structure is: the chip is transferred to the outer surface of the module through heat conduction, and the heat on the module surface is taken away by cold air. This heat dissipation structure can only dissipate heat for the chip on one side of the printed circuit board, but not on the other side; and the cold air does not directly cool the chip itself. Due to the existence of thermal resistance along the path such as module structural parts and thermal pads, the heat dissipation effect is very limited when facing the heat dissipation of high-power chips. Summary of the invention

[0003] In view of this, the embodiment of the present application provides a penetrating air-cooling heat dissipation structure. The present invention conducts a flow-guiding design on the ventilation slots on the upper side panels of the chassis, and cooperates with the diversion baffle structure to blow cold air directly into the module while meeting the requirements of rain protection. This structure can dissipate heat from all chips inside the module, making full use of the heat dissipation capacity of forced air cooling and improving the heat dissipation effect.

[0004] The embodiment of the present application provides the following technical solution: a through-type air-cooling heat dissipation structure, the heat dissipation structure is composed of a heat dissipation chassis, an upper side panel assembly and a lower side panel, wherein:

[0005] The inner cavity of the heat dissipation chassis is divided into a plurality of heat dissipation channels by a partition, and a ventilation module is respectively arranged in each of the heat dissipation channels, and the ventilation module comprises a left cover plate, a right cover plate, and a printed circuit board and a chip assembly, the left cover plate and the right cover plate are connected to fix the printed circuit board and the chip assembly in the inner cavity of the cover plate, the outer walls of the left cover plate and the right cover plate are respectively provided with heat dissipation fins, and the tops of the left cover plate and the right cover plate are provided with a plurality of rows of ventilation holes corresponding to the positions of the upper side plate assembly;

[0006] The upper side plate assembly includes an upper side plate and a flow divider baffle, wherein a rectangular ventilation slot is respectively provided on the upper side plate at a position corresponding to each of the heat dissipation channels, and the notches on both sides of the rectangular ventilation slot respectively extend inwardly to form a flow guide structure, and flow guide walls are respectively extended from the inner side of the upper side plate at positions on both sides of the flow guide structure, and the flow guide walls on both sides form a flow guide slot, and the two side edges of the flow divider baffle are respectively fixedly connected to the side edges of the flow guide wall, and a flow divider slot with an inverted trapezoidal cross section is provided in the middle of the flow divider baffle, and the notch of the flow divider slot is directly below the outlet of the flow guide structure , and the slot width of the diverter slot is greater than the outlet width of the guide structure, and a plurality of air outlet holes are respectively provided on the diverter baffles on both sides of the diverter slot, and the positions of the air outlet holes and the positions of the ventilation holes are staggered with each other, so that the airflow enters from the rectangular ventilation slot, passes through the gap between the outlet of the guide structure on both sides and the slot of the diverter slot, and then enters the ventilation hole through the air outlet holes; cover plates are fixed on the end faces of both ends of the guide slot, and drainage holes are provided on the bottom of the cover plates, and the position of the drainage holes is located on the center line of the diverter slot in the width direction.

[0007] According to one embodiment of the present application, a chamfer of at least 1 mm is provided at the opening of the rectangular ventilation slot on the upper side plate.

[0008] According to one embodiment of the present application, a chamfer of at least 2 mm is provided at the end of the slot of the diverter slot.

[0009] According to an embodiment of the present application, the diameter of the air outlet does not exceed 2 mm.

[0010] According to an embodiment of the present application, the width of the drainage hole is at least 1 / 2 of the bottom width of the diverter groove. Taking the bottom of the diverter groove as the height reference, the height of the drainage hole is at least 2.5 mm.

[0011] According to an embodiment of the present application, the center lines of the rectangular ventilation slot and the diverter slot in the width direction coincide with each other, and the slot width of the rectangular ventilation slot is 2 mm smaller than the maximum slot width of the corresponding diverter slot.

[0012] According to an embodiment of the present application, the depth of the guide structure is consistent with the depth of the diverter groove, and both do not exceed 2.5 mm.

[0013] According to an embodiment of the present application, the width of the heat dissipation fins on the ventilation module does not exceed 1 mm, and the diameter of the ventilation holes on the ventilation module does not exceed 2 mm.

[0014] According to an embodiment of the present application, the hole spacing of the ventilation holes is consistent with the arrangement spacing of the heat dissipation fins, and the center position of the ventilation holes is consistent with the center line position of the heat dissipation fins in the width direction.

[0015] Compared with the prior art, the beneficial effects that can be achieved by at least one of the above technical solutions adopted in the embodiments of this specification include at least the following: the embodiments of the present invention improve the ventilation slots on the upper side panels of the chassis and match the diversion baffles of corresponding sizes, and at the same time open ventilation holes on the top of the module structure. Under this structure, cold air can be blown directly into the module, and all heat sources can be directly cooled, which greatly improves the heat dissipation effect of forced air cooling, and at the same time prevents rainwater from entering the module and damaging components. The simulation verification shows that the heat dissipation capacity of this structure is greatly improved compared with the traditional air cooling structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 is a schematic diagram of the overall structure of an embodiment of the present invention;

[0018] Figure 2 Schematic diagram of the structure of the flow dividing baffle in the embodiment of the present invention;

[0019] Figure 3 is a schematic structural diagram of an upper side plate assembly in an embodiment of the present invention;

[0020] Figure 4 is a schematic structural diagram of a ventilation module in an embodiment of the present invention;

[0021] Figure 5 is a schematic diagram of the cross-sectional structure and airflow direction of an embodiment of the present invention;

[0022] Figure 6 yes Figure 5 A is an enlarged schematic diagram of the local structure at center A;

[0023] Among them, 1-upper side plate, 2-lower side plate, 3-drainage hole, 4-ventilation module, 5-diversion partition, 6-diversion groove, 7-air outlet, 8-rectangular ventilation groove, 9-guide structure, 10-heat sink fin, 11-ventilation hole, 12-chip, 13-printed circuit board. DETAILED DESCRIPTION

[0024] The embodiments of the present application are described in detail below with reference to the accompanying drawings.

[0025] The following describes the implementation methods of the present application through specific examples, and those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. The present application can also be implemented or applied through other different specific implementation methods, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that, in the absence of conflict, the following embodiments and the features in the embodiments can be combined with each other. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work belong to the scope of protection of the present application.

[0026] like Figure 1-Figure 6 As shown, an embodiment of the present invention provides a through-type air-cooling heat dissipation structure, which is composed of a heat dissipation chassis, an upper side panel assembly and a lower side panel 2, wherein:

[0027] The inner cavity of the heat dissipation chassis is divided into a plurality of heat dissipation channels by a partition, and a ventilation module 4 is respectively arranged in each of the heat dissipation channels, and the ventilation module 4 includes a left cover plate, a right cover plate, a printed circuit board 13 and a chip 12, the left cover plate and the right cover plate are connected to fix the printed circuit board 13 and the chip 12 in the inner cavity of the cover plate, and the outer walls of the left cover plate and the right cover plate are respectively provided with heat dissipation fins 10, and the tops of the left cover plate and the right cover plate are provided with a plurality of rows of ventilation holes 11 corresponding to the positions of the upper side plate components;

[0028] The upper side plate assembly includes an upper side plate 1 and a flow dividing baffle 5. A rectangular ventilation slot 8 is respectively provided on the upper side plate 1 at a position corresponding to each of the heat dissipation channels. The notches on both sides of the rectangular ventilation slot 8 respectively extend inwardly to form a flow guiding structure 9. The inner side of the upper side plate 1 extends flow guiding walls at positions on both sides of the flow guiding structure 9. The flow guiding walls on both sides form a flow guiding slot. The two side edges of the flow dividing baffle 5 are respectively fixedly connected to the side edges of the flow guiding wall. A flow dividing slot 6 with an inverted trapezoidal cross section is provided in the middle of the flow dividing baffle 5. The notch of the flow dividing slot 6 is directly below the outlet of the flow guiding structure 9, and The slot width of the diverter slot 6 is larger than the outlet width of the guide structure 9, and a plurality of air outlet holes 7 are respectively provided on the diverter baffles 5 on both sides of the diverter slot 6, and the positions of the air outlet holes 7 and the positions of the ventilation holes 11 are staggered with each other, so that the airflow enters from the rectangular ventilation slot 8, passes through the gap between the outlet of the guide structure 9 on both sides and the slot of the diverter slot 6, and then enters the ventilation hole 11 through the air outlet holes 7; cover plates are fixed on the end faces of both ends of the guide slot, and a drainage hole 3 is provided on the bottom of the cover plate, and the position of the drainage hole 3 is located on the center line of the diverter slot 6 in the width direction.

[0029] The embodiment of the present invention designs the ventilation slots on the upper side panels of the air-cooled chassis to guide the flow, and cooperates with the diversion baffle structure, and at the same time opens ventilation holes in the module structure. If rainwater enters through the rectangular ventilation slots, it will be collected in the diversion slots, and finally discharged from the drainage holes at both ends of the diversion slots without entering the module, thereby avoiding damage to the internal components of the module. The airflow will flow through the outlet of the guide structure and the gap between the slots of the diversion slots, and finally flow out from the air outlet holes on both sides of the diversion slots into the ventilation module to achieve air-cooled heat dissipation. Under the premise of meeting the requirements of rain protection, the embodiment of the present invention directly introduces cold air into the module, and can directly cool all heat dissipation chips, greatly improving the heat dissipation effect of the forced air cooling of the chassis. This type of structure is easy to process, easy to implement in terms of technology, and has good application value in engineering.

[0030] In a specific implementation of the present embodiment, a chamfer of at least 1 mm is provided at the opening of the rectangular ventilation slot 8 on the upper side plate 1. A chamfer of at least 2 mm is provided at the end of the slot of the diverter slot 6. The aperture of the air outlet 7 does not exceed 2 mm. The width dimension of the drain hole 3 is at least 1 / 2 of the width of the bottom of the diverter slot 6. Taking the bottom of the diverter slot 6 as the height reference, the height dimension of the drain hole 3 is at least 2.5 mm. The rectangular ventilation slot 8 coincides with the center line of the diverter slot 6 in the width direction, and the slot width of the rectangular ventilation slot 8 is 2 mm smaller than the maximum slot width of the corresponding diverter slot 6. The depth of the guide structure 9 is consistent with the depth dimension of the diverter slot 6, and neither does not exceed 2.5 mm. The width of the heat dissipation fins 10 on the ventilation module 4 does not exceed 1 mm, and the aperture of the ventilation holes 11 on the ventilation module 4 does not exceed 2 mm. The hole spacing of the ventilation holes 11 is consistent with the arrangement spacing of the heat dissipation fins 10 , and the center position of the ventilation hole 11 is consistent with the center line position of the heat dissipation fin 10 in the width direction.

[0031] like Figure 1-Figure 6 As shown, a penetrating air-cooled heat dissipation structure of the present embodiment includes a chassis and a module body. The upper side panel of the chassis is welded together with the diverter baffle to form an upper side panel assembly. The top of the upper side panel is designed as a rectangular ventilation slot, the slot width is 2mm less than the maximum slot width of the diverter baffle, the guide structure at the bottom of the upper side panel is consistent with the depth of the groove of the diverter baffle, and the height is not more than 2.5mm. At the same time, the position of the drainage hole is consistent with the center line of the diverter slot in the width direction. The width of the drainage hole is at least 1 / 2 of the minimum width of the diverter slot. The opening position uses the bottom of the diverter slot as the height reference. The height dimension of the drainage hole should be greater than 2.5mm. On the one hand, it is conducive to the diversion of cold air and plays a role in reducing internal wind resistance. On the other hand, it promotes raindrops to flow out of the chassis smoothly through the drainage hole, preventing raindrops from flowing out of the diverter baffle with the cold air.

[0032] On the other hand, a large number of ventilation hole structures are provided on the top of the left and right cover plates of the ventilation module. The positions of the ventilation holes are staggered with the air outlet holes on both sides of the diversion baffle, which can further prevent raindrops from entering the module. The hole spacing between the ventilation holes on the top of the module is consistent with the arrangement spacing of the fins on the left and right cover plates, and the center position of the ventilation hole is consistent with the center line position in the width direction of the fin. This structure can perform secondary diversion of the cold air. At the same time, part of the cold air exchanges heat with the outer surface of the module, and the other part directly enters the module to perform convection heat exchange with the hot end chip, ensuring uniform heat distribution and fully utilizing the air cooling heat dissipation capacity.

[0033] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A penetrating air-cooling heat dissipation structure, characterized in that: The heat dissipation structure is composed of a heat dissipation chassis, an upper side panel assembly and a lower side panel, wherein: The inner cavity of the heat dissipation chassis is divided into a plurality of heat dissipation channels by a partition, and a ventilation module is respectively arranged in each of the heat dissipation channels, and the ventilation module comprises a left cover plate, a right cover plate, and a printed circuit board and a chip assembly, the left cover plate and the right cover plate are connected to fix the printed circuit board and the chip assembly in the inner cavity of the cover plate, the outer walls of the left cover plate and the right cover plate are respectively provided with heat dissipation fins, and the tops of the left cover plate and the right cover plate are provided with a plurality of rows of ventilation holes corresponding to the positions of the upper side plate assembly; The upper side plate assembly includes an upper side plate and a flow divider baffle, wherein a rectangular ventilation slot is respectively provided on the upper side plate at a position corresponding to each of the heat dissipation channels, and the notches on both sides of the rectangular ventilation slot respectively extend inwardly to form a flow guide structure, and flow guide walls are respectively extended from the inner side of the upper side plate at positions on both sides of the flow guide structure, and the flow guide walls on both sides form a flow guide slot, and the two side edges of the flow divider baffle are respectively fixedly connected to the side edges of the flow guide wall, and a flow divider slot with an inverted trapezoidal cross section is provided in the middle of the flow divider baffle, and the notch of the flow divider slot is directly below the outlet of the flow guide structure , and the slot width of the diverter slot is greater than the outlet width of the guide structure, and a plurality of air outlet holes are respectively provided on the diverter baffles on both sides of the diverter slot, and the positions of the air outlet holes and the positions of the ventilation holes are staggered with each other, so that the airflow enters from the rectangular ventilation slot, passes through the gap between the outlet of the guide structure on both sides and the slot of the diverter slot, and then enters the ventilation hole through the air outlet holes; cover plates are fixed on the end faces of both ends of the guide slot, and drainage holes are provided on the bottom of the cover plates, and the position of the drainage holes is located on the center line of the diverter slot in the width direction.

2. The penetrating air-cooling heat dissipation structure according to claim 1 is characterized in that: The rectangular ventilation slot opening on the upper side plate is provided with a chamfer of at least 1 mm.

3. The penetrating air-cooling heat dissipation structure according to claim 1 is characterized in that: The notch end of the diverter groove is provided with a chamfer of at least 2 mm.

4. The penetrating air-cooling heat dissipation structure according to claim 1 is characterized in that: The diameter of the air outlet hole does not exceed 2 mm.

5. The penetrating air-cooling heat dissipation structure according to claim 1 is characterized in that: The width of the drainage hole is at least 1 / 2 of the width of the bottom of the diverter groove. Taking the bottom of the diverter groove as the height reference, the height of the drainage hole is at least 2.5 mm.

6. The penetrating air-cooling heat dissipation structure according to claim 1 is characterized in that: The center lines of the rectangular ventilation slot and the diverter slot in the width direction coincide with each other, and the slot width of the rectangular ventilation slot is 2 mm smaller than the maximum slot width of the corresponding diverter slot.

7. The penetrating air-cooling heat dissipation structure according to claim 1 is characterized in that: The depth of the guide structure is consistent with the depth of the diverter groove, and both are less than 2.5 mm.

8. The penetrating air-cooling heat dissipation structure according to claim 1, characterized in that: The width of the heat dissipation fins on the ventilation module does not exceed 1 mm, and the diameter of the ventilation holes on the ventilation module does not exceed 2 mm.

9. The penetrating air-cooling heat dissipation structure according to claim 1 or 8, characterized in that: The hole spacing of the ventilation holes is consistent with the arrangement spacing of the heat dissipation fins, and the center position of the ventilation holes is consistent with the center line position of the heat dissipation fins in the width direction.

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