A compact, high-efficiency, GW-class high-power microwave system suitable for the X-band

Abstract

This invention discloses a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band, relating to the field of high-power microwave transmission and radiation technology. It includes a mode converter dynamic electromagnetic protection component. With the cooperation of this component, the double-layer shielded absorbing arc plate dynamically adjusts its left and right shielding absorption direction for electromagnetic waves based on the direction of the interference signal detected by the built-in current sensor. This reduces interference and generates a signal opposite to the interference signal, dynamically adjusting its phase and amplitude to cancel out the interference signal, thus achieving dynamic interference elimination. The system enables mutual conversion between circular waveguide TM mode and rectangular waveguide TE mode, and can change the microwave propagation direction while effectively reducing the strong electromagnetic interference generated by high-power microwave signals on surrounding electronic equipment, thus ensuring its stable operation under high-power signals.

Description

Technical Field

[0001] This invention relates to the field of high-power microwave transmission and radiation technology, specifically to a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band. Background Technology

[0002] For a long time, microwave energy in the low-frequency and low-power range has been the focus of research. However, with the urgent need for microwave technology in military technology, people have begun to study high-power microwaves more and more deeply. Domestic researchers have uniformly defined electromagnetic waves with power greater than 100MW and frequency between 1 and 300GHz as high-power microwaves (HPW). Therefore, for HPW, designing a suitable and efficient high-power microwave system is the main research direction. High-power microwave systems are usually divided into three parts: (1) microwave source, which is mainly responsible for generating high-power microwaves. (2) microwave transmission, which on the one hand constrains the performance of the microwave source, and on the other hand provides a matching feed to the transmitter. This part also affects the complexity, efficiency and output microwave mode of the entire system. (3) microwave transmission and reception, which realizes the effective radiation of the input microwave. Each part needs to further improve the power tolerance to meet the application requirements of higher power microwave systems.

[0003] However, in the current technology, during the operation of conventional high-power microwave circular waveguide transmission systems, the presence of many higher-order modes in the circular waveguide during transmission can cause strong electromagnetic interference to surrounding electronic equipment, affecting its normal operation and thus impacting antenna feeding and maximum power tolerance. Furthermore, the TM01 mode of the circular waveguide used for microwave transmission has an axial radiation pattern of 0, meaning it radiates no energy along the axial direction, which is mismatched with the required radiation mode of the antenna, resulting in low energy transmission and conversion efficiency. In conventional microwave transmitting and receiving systems, the feeding network and antenna array are usually located on different layers to reduce volume, but achieving transverse electromagnetic wave feeding of the upper antenna requires a long, tortuous waveguide structure, increasing size and loss. Therefore, there is a need to propose a compact, high-efficiency, GW-level high-power microwave system suitable for the X-band. Summary of the Invention

[0004] The purpose of this invention is to provide a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band, addressing the aforementioned issues in the background. In conventional high-power microwave circular waveguide transmission systems, the presence of numerous higher-order modes during transmission leads to energy loss and abrupt changes in the electric field, affecting antenna feeding and maximum power tolerance. Furthermore, the TM01 mode of the circular waveguide used for microwave transmission has an axial radiation pattern of zero, radiating no energy along the axial direction, which is mismatched with the required antenna radiation mode, resulting in low energy transmission and conversion efficiency. In conventional microwave transmitting and receiving systems, the feeding network and antenna array are typically located on different layers to reduce volume; however, achieving transverse electromagnetic wave feeding of the upper antenna requires a long, tortuous waveguide structure, increasing size and loss.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band, comprising:

[0006] The mode converter dynamic electromagnetic protection component is installed on the side of the rectangular waveguide. It is used to realize the mutual conversion between the circular waveguide TM mode and the rectangular waveguide TE mode. At the same time, it can change the microwave propagation direction and dynamically perform fixed-point and directional protection based on the working direction of the electromagnetic interference signal detected by the built-in current sensor. It also actively generates a signal opposite to the interference signal to cancel it out and eliminate interference.

[0007] The five-stage cascaded T-shaped 1-to-2 power divider is installed at both ends of a rectangular waveguide and connected to the docking cavity end. It is used to improve the overall high-mode conversion rate through the internal adaptive low-power and high-efficiency amplification structure.

[0008] The cavity slot antenna is mounted on the surface of a five-stage cascaded T-shaped one-to-two power divider to form a rectangular waveguide feed, and the resulting 8×8 planar array is connected in sequence with other components to form a large-scale microwave transmission and radiation structure.

[0009] The load dynamic conductor is embedded on the left and right surfaces of the rectangular waveguide and forms an active adjustment with the terminal connector of the five-stage cascaded T-shaped one-to-two power divider.

[0010] The multi-band signal component is installed symmetrically on the inner side of a five-stage cascaded T-shaped power divider to form a multi-band signal operation, ensuring that the response signal is effectively transmitted in different frequency bands and achieving full-band interference suppression.

[0011] Preferably, the mode converter dynamic electromagnetic protection component includes:

[0012] The system includes a large-diameter circular waveguide, a tapered waveguide, a short-circuited small-diameter circular waveguide, a power-tolerant chamfered waveguide, and a front-end circular waveguide. A docking waveguide ring is installed at the connection end of the large-diameter circular waveguide and the front-end circular waveguide. The tapered waveguide is integrally formed on the side end of the large-diameter circular waveguide and is synchronously formed with the short-circuited small-diameter circular waveguide. Circular waveguide generating ends are installed inside the large-diameter circular waveguide, the tapered waveguide, and the short-circuited small-diameter circular waveguide. An output control motor is installed on the sidewall surface of the large-diameter circular waveguide. A gear and a locking rod are respectively connected to the bottom output end of the output control motor, and the locking rod and gear are installed together.

[0013] Preferably, the gear component has a synchronous rotating tooth meshing at its side end. Multiple sets of engagement grooves are formed around the surface of the synchronous rotating tooth. The engagement rod and the multiple sets of engagement grooves form a rotatable engagement. A connecting L-rod is fastened to the side end of the synchronous rotating tooth. A rotating positive charge accumulating ring is fastened to the bottom of the connecting L-rod. Multiple sets of mounting frames are fastened to the rotating positive charge accumulating ring and the bottom of the synchronous rotating tooth. Miniature electromagnetic guide rods are symmetrically installed at the left and right ends inside the multiple sets of mounting frames.

[0014] Preferably, the side end of the miniature electromagnetic rod is connected to a segment ball via a contact block. The bottom of the segment ball is rotatably connected to a double-layer shielded wave-absorbing arc plate. The top surface of the segment ball is rotatably connected to a connecting rod. The connecting rod is fastened to the bottom wall side surface of the rotating positive charge accumulation ring and the synchronous rotating tooth. The synchronous rotating tooth is equally divided and fastened to a top L rod. An annular rotating rail is installed on the top of the top L rod. A sliding position saddle is slidably connected inside the annular rotating rail. A slot frame is fastened to the side surface of the sliding position saddle. A rotating hoop is rotatably connected inside the slot of the slot frame.

[0015] Preferably, an angle rotation motor is installed on the side end of the slot frame, a miniature pneumatic telescopic rod is installed inside the slot frame, a protective shielding arc wave plate is fastened to the side end of the miniature pneumatic telescopic rod, the protective shielding arc wave plate and the double-layer shielding wave-absorbing arc plate have the same structure, a rotator section is fastened to the top end of the top L rod, and active signal wave generators are equally distributed on the circumferential surface of the rotator section.

[0016] Preferably, a metal high guide rod is installed inside the load dynamic conductor, and a phase change material connector is fastened to the side end of the load dynamic conductor. A dynamic feedback circuit is connected to the side end of the phase change material connector. The dynamic feedback circuit consists of a low-area feedback circuit and a high-area feedback circuit, and an optocoupler is connected inside the dynamic feedback circuit.

[0017] Preferably, the top of the five-stage cascaded T-shaped 1-to-2 power divider is securely connected to a sealed cover box. A filter is installed inside the sealed cover box, and a main amplifier and a secondary amplifier are installed inside the filter. The main amplifier and the secondary amplifier are connected in parallel via a circuit. A high-efficiency power converter is connected to the bottom of the main amplifier and the secondary amplifier. An HT connector is installed on the side of the five-stage cascaded T-shaped 1-to-2 power divider, and the HT connector forms a fan-shaped rectangular TE mode to HE mode conversion operation.

[0018] Preferably, the multi-band signal component includes:

[0019] The system includes a semiconductor heat sink assembly, a multi-band antenna array, a multi-band filter bank, and an antenna array access terminal. The side end of the antenna array access terminal is connected to the cavity slot antenna. The semiconductor heat sink assembly is located at the bottom of the side end of the multi-band antenna array and is securely connected to the internal surface of a five-stage cascaded T-shaped 1-to-2 power divider.

[0020] Preferably, the multi-band filter bank is installed inside the multi-band antenna array, an amplifier is connected to one side of the multi-band filter bank, an output signal terminal is installed on the other side of the multi-band filter bank, a processor is installed on the side of the antenna array access terminal, and a multi-frequency signal generator is installed on the side of the output signal terminal.

[0021] Preferably, the processor is electrically connected to a multi-band filter bank via a circuit, and a heat pipe is disposed in contact with the side surface of the multi-band filter bank. The bottom of the side end of the heat pipe is connected to the surface of the semiconductor heat sink assembly.

[0022] Compared with the prior art, the beneficial effects of the present invention are:

[0023] 1. In this invention, with the cooperation of the dynamic electromagnetic protection component of the mode converter, when the built-in current sensor detects the generated electromagnetic interference signal, it feeds it back to the external microprocessor controller, causing the external microprocessor controller to issue new control commands to the output control motor. This causes the output control motor to control the gear components and locking rod to rotate. Utilizing the connection with the synchronous rotating gear and multiple sets of locking slots, it synchronously drives the synchronous rotating gear and multiple sets of locking slots to rotate. Furthermore, when the synchronous rotating gear and multiple sets of locking slots rotate, the connecting L-rod enables the synchronous movement of the rotating positive charge accumulation ring. When the rotating positive charge accumulation ring is in a rotating state, it accumulates positive charges and forms an electric field, which facilitates the generation of positive charges in the circular waveguide. The device generates and transmits microwave signals to ensure efficient signal transmission. During instantaneous operation, it provides dynamic protection against electromagnetic interference. Based on feedback from the built-in current sensor, and with the synchronous rotating teeth and rotating positive charge accumulation ring in a rotating state, the external microprocessor controller drives a micro electromagnetic rod to guide and control the movement of the double-layer shielded absorbing arc plate. Through the movement of the micro electromagnetic rod, the joints at both ends of the double-layer shielded absorbing arc plate are pushed or brought back, allowing the double-layer shielded absorbing arc plate to dynamically adjust its left and right shielding absorption direction for electromagnetic waves based on the direction of the interference signal detected by the built-in current sensor, thus reducing interference.

[0024] 2. In this invention, the sliding position saddle is supported and guided by the annular rotating track to ensure its smooth movement. The sliding position saddle supports and guides the slot frame and its related structures, ensuring smooth movement. Then, the external microprocessor controller controls the angle rotation motor, thereby controlling the angle of the slot frame and its internal micro-pneumatic telescopic rod. This drives the protective shielding arc wave plate connected to the micro-pneumatic telescopic rod, achieving dynamic shielding. The operation of the micro-pneumatic telescopic rod facilitates the simultaneous protection of the inner top of the large-diameter circular waveguide and the interior of the tapered waveguide by the protective shielding arc wave plate. Furthermore, the annular rotating track operation simultaneously rotates the... The section located at the circular waveguide generating end rotates externally, driving the active signal wave generator to form a stable motion. The active signal wave generator actively protects against interference signals that are not effectively protected, based on the operating direction of the protective shielding arc wave plate. That is, it generates a signal opposite to the interference signal and dynamically adjusts the phase and amplitude of the signal to cancel each other out, thereby achieving dynamic interference elimination. The whole system can realize the mutual conversion between circular waveguide TM mode and rectangular waveguide TE mode, and can change the propagation direction of microwaves. At the same time, it can effectively reduce the strong electromagnetic interference of high-power microwave signals to surrounding electronic equipment, thereby affecting its normal operation, improving overall performance, and ensuring its stable operation under high-power signals.

[0025] 3. In this invention, by combining a large-aperture circular waveguide, a power-tolerance chamfer, and a tapered waveguide, a compact, high-efficiency GW-level high-power microwave system adapted to the X-band is achieved. The large-aperture circular waveguide transmits high-power microwave signals, the power-tolerance chamfer reduces signal reflection and loss, and the tapered waveguide facilitates a smooth transition between the large and small-aperture circular waveguides, further reducing signal reflection and loss. The small-aperture circular waveguide then terminates signal transmission to prevent signal reflection and interference. Furthermore, the front-end circular waveguide forms a connection via a connecting waveguide ring, transmitting signals to subsequent components. The introduction of a gradually changing circular waveguide radius effectively suppresses impurities in the microwave input and the high-order modes excited by the circular waveguide TM mode during transmission. Simultaneously, its simple structure, ease of fabrication, and high power tolerance ensure stable conversion and transmission performance in high-power system applications. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the main structure of a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to the present invention.

[0027] Figure 2 This is a schematic diagram of the internal cross-sectional structure of a five-stage cascaded T-shaped one-to-two power divider adapted to a compact, high-efficiency, GW-level high-power microwave system in the X-band according to the present invention.

[0028] Figure 3 This is a schematic diagram of the structure of a multi-band signal component in a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to the present invention;

[0029] Figure 4 This is a schematic diagram of the mounting position structure of a rectangular waveguide in a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to the present invention.

[0030] Figure 5 This invention relates to a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band. Figure 4 A magnified structural diagram at point A;

[0031] Figure 6 This is a schematic diagram of the structure of a dynamic electromagnetic protection component for a mode converter in a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band, according to the present invention.

[0032] Figure 7 This is a schematic diagram of the internal structure of a dynamic electromagnetic protection component for a mode converter in a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band, according to the present invention.

[0033] Figure 8This is a partial structural schematic diagram of a dynamic electromagnetic protection component for a mode converter in a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band, according to the present invention.

[0034] Figure 9 This invention relates to a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band. Figure 7 A magnified structural diagram at point B;

[0035] Figure 10 This invention relates to a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band. Figure 8 A magnified structural diagram at point C;

[0036] Figure 11 The diagram shows the S11 curve of a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to the present invention.

[0037] Figure 12 This invention relates to a radiation pattern in a compact, high-efficiency, GW-level high-power microwave system adapted to the X-band.

[0038] In the diagram: 1. Mode converter dynamic electromagnetic protection component; 101. Large-diameter circular waveguide; 102. Small-diameter circular waveguide with terminal short circuit; 103. Power tolerance chamfer; 104. Docking waveguide ring; 105. Circular waveguide generating end; 106. Front-end circular waveguide; 107. Synchronous rotating gear; 108. Clamping slot; 109. Double-layer shielded absorbing arc plate; 1090. Rotating positive charge gathering ring; 1091. Connecting L-rod; 1092. Rotator section; 1094. Active signal wave generator; 1095. Output control motor; 1096. Gear component; 1097. Clamping rod; 1098. Circular rotating track; 1099. Sliding position saddle; 1010. Slot frame; 1011. Rotating hoop; 1012. Angle rotation motor; 1013. Miniature pneumatic extension. 1. Shrink rod; 1014. Joint ball; 1015. Miniature electromagnetic guide rod; 2. Rectangular waveguide; 3. Five-stage cascaded T-shaped 1-to-2 power divider; 4. HT connector; 5. Cavity slot antenna; 6. Sealed cover box; 7. Filter; 8. Main amplifier; 9. Secondary amplifier; 10. High-efficiency power converter; 11. Docking cavity end; 12. Multi-band signal assembly; 120. Semiconductor heat sink assembly; 121. Multi-band antenna array; 122. Antenna array access end; 123. Processor; 124. Amplifier; 125. Multi-band filter bank; 126. Output signal end; 127. Heat pipe; 13. Load dynamic conductor; 14. Metal high-conductor rod; 15. Phase change material connector; 16. Dynamic feedback circuit; 17. Optical coupler; 18. Multi-frequency signal generator. Detailed Implementation

[0039] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0040] In this invention, reference is made to Figure 1 - Figure 12 As shown: A compact, high-efficiency, GW-level high-power microwave system adapted to the X-band, comprising:

[0041] The mode converter dynamic electromagnetic protection component 1 is installed on the side of the rectangular waveguide 2. It is used to realize the mutual conversion between the circular waveguide TM01 mode and the rectangular waveguide TE10 mode, and can change the microwave propagation direction. At the same time, it can dynamically perform fixed-point and directional protection based on the working direction of the electromagnetic interference signal detected by the built-in current sensor, and actively generate a signal opposite to the interference signal to cancel it out, thereby eliminating interference.

[0042] The five-stage cascaded T-shaped one-to-two power divider 3 is installed at both ends of the rectangular waveguide 2 and connected to the docking cavity end 11 to improve the overall high-mode conversion rate through the internal adaptive low-power and high-efficiency amplification structure.

[0043] The cavity slot antenna 5 is mounted on the surface of the five-stage cascaded T-shaped one-to-two power divider 3 to form a rectangular waveguide feed, and the resulting 8×8 planar array is sequentially connected to other components to form a large-scale microwave transmission and radiation structure.

[0044] The load dynamic conductor 13 is embedded on the left and right surfaces of the rectangular waveguide 2 and forms an active adjustment with one end connector of the five-stage cascaded T-shaped one-to-two power divider 3.

[0045] The multi-band signal component 12 is installed symmetrically on the inner side of the five-stage cascaded T-shaped one-to-two power divider 3 to form a multi-band signal operation, ensuring that the response signal is effectively transmitted in different frequency bands and achieving full-band interference suppression.

[0046] In this invention, according to Figure 1 , Figure 4 , Figure 6 - Figure 10 As shown, the mode converter dynamic electromagnetic protection component 1 includes:

[0047] The system includes a large-diameter circular waveguide 101, a tapered waveguide, a short-circuited small-diameter circular waveguide 102, a power tolerance chamfer 103, and a front-end circular waveguide 106. A docking waveguide ring 104 is installed at the connection end of the large-diameter circular waveguide 101 and the front-end circular waveguide 106. The tapered waveguide is integrally formed on the side end of the large-diameter circular waveguide 101 and is synchronously formed integrally with the short-circuited small-diameter circular waveguide 102. A circular waveguide generating end 105 is installed inside the large-diameter circular waveguide 101, the tapered waveguide, and the short-circuited small-diameter circular waveguide 102. An output control motor 1095 is installed on the side wall surface of the large-diameter circular waveguide 101. A gear component 1096 and a locking rod 1097 are respectively connected to the bottom output end of the output control motor 1095. The locking rod 1097 and the gear component 1096 are installed together.

[0048] The gear component 1096 has a synchronous rotating tooth 107 meshing with its side end. Multiple sets of engagement grooves 108 are formed around the surface of the synchronous rotating tooth 107. The engagement rod 1097 and the multiple sets of engagement grooves 108 form a rotatable engagement. The side end of the synchronous rotating tooth 107 is fastened to a connecting L rod 1091. The bottom of the connecting L rod 1091 is fastened to a rotating positive charge gathering ring 1090. Multiple sets of mounting frames are fastened to the rotating positive charge gathering ring 1090 and the bottom of the synchronous rotating tooth 107. Miniature electromagnetic guide rods 1015 are symmetrically installed on the left and right ends inside the multiple sets of mounting frames.

[0049] The side end of the miniature electromagnetic rod 1015 is connected to a segment ball 1014 via a contact block. The bottom of the segment ball 1014 is rotatably connected to a double-layer shielded wave-absorbing arc plate 109. The top surface of the segment ball 1014 is rotatably connected to a connecting rod. The connecting rod, the rotating positive charge accumulation ring 1090, and the bottom wall side surface of the synchronous rotating tooth 107 are fastened together. The inside of the synchronous rotating tooth 107 is equally divided and fastened to a top L rod. The top of the top L rod is equipped with an annular rotating rail 1098. The inside of the annular rotating rail 1098 is slidably connected to a sliding position saddle 1099. The side end surface of the sliding position saddle 1099 is fastened to a slot frame 1010. The inside of the slot frame 1010 is rotatably connected to a rotating hoop 1011.

[0050] An angle rotation motor 1012 is installed on the side end of the slot frame 1010. A miniature pneumatic telescopic rod 1013 is installed inside the slot frame 1010. A protective shielding arc wave plate is fastened to the side end of the miniature pneumatic telescopic rod 1013. The protective shielding arc wave plate and the double-layer shielding wave-absorbing arc plate 109 have the same structure. A rotator section 1092 is fastened to the top of the top L rod. Active signal wave generators 1094 are evenly installed on the circumferential surface of the rotator section 1092.

[0051] In a specific scheme, when adapting to compact, high-efficiency, GW-level high-power microwave operations in the X-band, a large-aperture circular waveguide 101 is used to transmit high-power microwave signals. A power-tolerance chamfer 103 reduces signal reflection and loss. A tapered waveguide is used to achieve a smooth transition between the large-aperture circular waveguide 101 and a short-circuited small-aperture circular waveguide 102, further reducing signal reflection and loss. Then, the short-circuited small-aperture circular waveguide 102 terminates signal transmission to prevent signal reflection and interference. Next, a front-end circular waveguide 106 is used to form a connection via a docking waveguide ring 104, transmitting signals to subsequent components for operation. Finally, when an internal current sensor detects electromagnetic interference signals, it feeds them back to an external microprocessor. The controller sends new control commands to the output control motor 1095, causing the output control motor 1095 to control the gear 1096 and the engaging rod 1097 to rotate. Utilizing its connection with the synchronous rotating gear 107 and multiple sets of engaging slots 108, it synchronously drives the synchronous rotating gear 107 and multiple sets of engaging slots 108 to rotate. While the synchronous rotating gear 107 and multiple sets of engaging slots 108 are rotating, the connecting L-rod 1091 enables the synchronous movement of the rotating positive charge gathering ring 1090. When the rotating positive charge gathering ring 1090 is rotating, it gathers positive charges, forming an electric field. This facilitates the generation and transmission of microwave signals at the circular waveguide generator end 105, ensuring efficient signal transmission, especially during instantaneous operation. To provide dynamic electromagnetic interference protection, when the built-in current sensor detects feedback and the synchronous rotating gear 107 and the rotating positive charge accumulation ring 1090 are in a rotating state, the external microprocessor controller drives the micro electromagnetic guide rod 1015 to guide and control the movement of the double-layer shielded absorbing arc plate 109. Through the drive of the micro electromagnetic guide rod 1015, the joint balls 1014 at both ends of the double-layer shielded absorbing arc plate 109 are pushed or brought back respectively. This allows the double-layer shielded absorbing arc plate 109 to dynamically adjust its left and right shielding absorption direction for electromagnetic waves according to the direction of the interference signal detected by the built-in current sensor, reducing interference. Then, with the cooperation of the annular rotating track 1098, the support and guide slide... The sliding saddle 1099 ensures smooth movement. Under the action of the sliding saddle 1099, the slot frame 1010 and its related structures are supported and guided, ensuring smooth movement. Then, through control commands from an external microprocessor controller, the drive angle rotation motor 1012 is controlled. With the cooperation of the angle rotation motor 1012, the angle of the slot frame 1010 and its internal miniature pneumatic telescopic rod 1013 is controlled, driving the protective shielding arc wave plate connected to the miniature pneumatic telescopic rod 1013 to achieve dynamic shielding. The operation of the miniature pneumatic telescopic rod 1013 facilitates the simultaneous protection of the inner top of the large-diameter circular waveguide 101 and the interior of the tapered waveguide by the protective shielding arc wave plate. Specifically, under the operation of the annular rotating track 1098...Synchronization causes the rotating section 1092, located at the circular waveguide generating end 105, to rotate externally relative to the device body, driving the active signal wave generator 1094 to form a smooth motion. The active signal wave generator 1094, based on the operating direction of the protective shielding arc wave plate, actively protects against unprotected interference signals by generating a signal opposite to the interference signal and dynamically adjusting its phase and amplitude to cancel out the interference signal, thus dynamically eliminating interference. The entire system achieves mutual conversion between the circular waveguide TM01 mode and the rectangular waveguide TE10 mode, and can change the microwave propagation direction. Simultaneously, it effectively reduces the strong electromagnetic interference generated by high-power microwave signals on surrounding electronic equipment, preventing it from affecting normal operation, improving overall performance, and ensuring stable operation under high-power signals. Furthermore, the introduction of a gradually changing circular waveguide radius structure effectively suppresses impure high-order modes present during microwave input and high-order modes excited by the circular waveguide TM01 mode during transmission. Its simple structure, easy fabrication, and high power tolerance ensure stable conversion and transmission performance in high-power system applications.

[0052] It should be noted that in order to suppress the impure higher-order modes contained in the microwave input and the higher-order modes excited by the circular waveguide TM01 mode during transmission, a tapered waveguide structure for transforming the circular waveguide radius is added to the mode converter. Since the adjacent higher-order mode of the circular waveguide TM01 mode is TE21, the radius of the small-diameter circular waveguide 102 with short-circuited terminals in the mode converter can be obtained from the following formula for calculating the cutoff frequency when the circular waveguide transmits the TE mode.

[0053]

[0054] In the formula, represents the derivative of the Bessel function (i.e., ), which can be obtained by consulting the Bessel function formula table. The radius of the small-aperture circular waveguide is also used as the longer side dimension of the output rectangular waveguide; the remaining dimensions are all obtained through optimization to meet the power tolerance and minimum constraint conditions.

[0055] It should be noted that the mode converter of the present invention operates in the X-band, with a conversion efficiency of up to 94% and a return loss of less than -20dB at the operating frequency. It can efficiently and stably realize the mutual conversion between the circular waveguide TM01 mode and the rectangular waveguide TE10 mode.

[0056] It should be noted that the metal surface breakdown threshold under continuous wave action and the metal surface breakdown threshold under short pulse action (where the pulse width of the short pulse is 1) at the center frequency can be calculated by the following formulas respectively, so that the metal surface breakdown threshold when working at the center frequency (pulse width of 20ns) is not less than 1 MV / cm.

[0057]

[0058]

[0059] In this invention, according to Figure 1 , Figure 2 , Figure 4 and Figure 5 As shown, a metal high guide rod 14 is installed inside the load dynamic conductor 13. A phase change material connector 15 is fastened to the side end of the load dynamic conductor 13. A dynamic feedback line 16 is connected to the side end of the phase change material connector 15. The dynamic feedback line 16 consists of a low-area feedback line and a high-area feedback line. An optocoupler 17 is connected inside the dynamic feedback line 16.

[0060] The top of the five-stage cascaded T-shaped 1-to-2 power divider 3 is securely connected to a sealed cover box 6. A filter 7 is installed inside the sealed cover box 6. A main amplifier 8 and a secondary amplifier 9 are installed inside the filter 7. The main amplifier 8 and the secondary amplifier 9 are connected in parallel through a circuit. A high-efficiency power converter 10 is connected to the bottom of the main amplifier 8 and the secondary amplifier 9. An HT connector 4 is installed on the side of the five-stage cascaded T-shaped 1-to-2 power divider 3. The HT connector 4 forms a fan-shaped rectangular TE mode to HE mode conversion operation.

[0061] In one specific scheme, a high-conductivity metal rod 14 is used as the signal transmission path for the load dynamic conductor 13, reducing energy loss during signal transmission and ensuring efficient signal transmission. Under the action of the phase change material connector 15, heat is absorbed and released, maintaining temperature stability and improving the overall thermal management effect of the load dynamic conductor 13 during transmission. Then, with the cooperation of the dynamic feedback line 16, the load impedance change generated during signal transmission by the load dynamic conductor 13 is monitored in real time. The resulting load impedance change is fed back to the low-area feedback line and the high-area feedback line for timely switching and adjustment, effectively ensuring optimal load impedance matching during signal transmission. Next, under the action of the optocoupler 17, the feedback signal is isolated and transmitted, ensuring signal stability and reliability. The five-stage cascaded T-shaped 1-to-2 power divider 3 divides the input signal... The signal is evenly distributed between the two load dynamic conductors 13 and the docking cavity end 11 to ensure efficient signal transmission. Filter 7 is used to filter out unwanted frequency components, reduce the influence of interference signals, and ensure signal purity. Then, the gain and bias of the main amplifier 8 and the auxiliary amplifier 9 connected in parallel are automatically adjusted according to the frequency band of the signal filtered by the filter 7 to ensure efficient signal transmission and amplification. Then, with the cooperation of the high-efficiency power converter 10, a stable power supply is provided to the filter 7, the main amplifier 8, and the auxiliary amplifier 9 to reduce energy loss during the power conversion process and ensure efficient power conversion and stable power supply. The HT connector 4 realizes the fan-shaped rectangular TE mode to HE mode operation, ensuring efficient signal transmission and conversion, and effectively improving the overall performance and reliability of the compact, high-efficiency, GW-level high-power microwave system adapted to the X-band.

[0062] It should be noted that the HT connector 4 can achieve a 1-to-2 power split, with the two output ports short-circuited. The antenna element of the cavity slot antenna 5 adopts a metal cavity structure with four rectangular slots etched on it. The element is fed by a rectangular waveguide, which can ensure a certain power capacity while obtaining a high gain. According to the theory of rectangular resonant cavities, each slot operates in the TE110 mode, while the metal cavity operates in the TE220 mode. The main parameters of the rectangular cavity slot antenna 5 can be calculated using the following formula.

[0063]

[0064] In order to better utilize the electric field inside the metal cavity and adjust the impedance matching of the antenna elements of the cavity slot antenna 5, the S11 of the antenna elements of the cavity slot antenna 5 in the corresponding operating frequency band is less than -15dB, the element gain in the frequency band is above 13dB, and the 3dB beamwidth of the element at the operating center frequency is 39.6°.

[0065] in Figure 11 and Figure 12 The S11 curve and radiation pattern of a high-power microwave system in an embodiment of the present invention are shown.

[0066] The resulting 8×8 rectangular cavity slot antenna 5, HT connector 4, and five-stage cascaded T-shaped 1-to-2 power divider 3 are connected sequentially to form a single-pulse cavity slot array antenna. Since the rectangular waveguide apertures at the input end of the power divider network and the output end of the TM01-TE10 mode converter are different, a horn waveguide is added between the two parts as a transition connection structure to form the entire high-power microwave system. Within the operating bandwidth, the S11 of this system is less than -15dB, and the radiation gain of the antenna array is greater than 30dB.

[0067] In this invention, according to Figure 2 and Figure 3 As shown, the multi-band signal component 12 includes:

[0068] The semiconductor heat sink assembly 120, the multi-band antenna array 121, the multi-band filter group 125, and the antenna array access terminal 122 are connected to the side end of the antenna array access terminal 122 and the cavity slot antenna 5. The semiconductor heat sink assembly 120 is located at the bottom of the side end of the multi-band antenna array 121 and is firmly connected to the internal surface of the five-stage cascaded T-shaped one-to-two power divider 3.

[0069] A multi-band filter bank 125 is installed inside a multi-band antenna array 121. An amplifier 124 is connected to one side of the multi-band filter bank 125. An output signal terminal 126 is installed on the other side of the multi-band filter bank 125. A processor 123 is installed on the side of the antenna array access terminal 122. A multi-frequency signal generator 18 is installed on the side of the output signal terminal 126.

[0070] The processor 123 is electrically connected to the multi-band filter group 125 via a circuit. The side surface of the multi-band filter group 125 is in contact with the heat pipe 127, and the bottom of the side end of the heat pipe 127 is in contact with the surface of the semiconductor heat sink group 120.

[0071] In one specific scheme, when the cavity slot antenna 5 performs microwave transmission and radiation operations, the connection formed between the antenna array access terminal 122 and the cavity slot antenna 5 allows the multi-band antenna array 121 to receive signals from different frequency bands, supporting the X-band and other related frequency bands. This ensures that the signal is transmitted to the multi-band filter bank 125. Then, with the cooperation of the multi-band filter bank 125, unwanted frequency components are filtered out, reducing the influence of interference signals. This allows for the selection of appropriate filter types based on the signal frequency band, ensuring signal purity. Next, the amplifier 124 amplifies the filtered signal, ensuring both signal strength and quality for different frequency bands. Simultaneously, synchronous adjustment and amplification are performed to achieve the best amplification effect. Then, the processor 123 is used to process and control the amplified signals of different frequency bands to ensure efficient signal transmission and processing, and to optimize and process the signals. Afterwards, under the action of the multi-frequency signal generator 18, signals of different frequency bands are generated to ensure the diversity and adaptability of the signals. The semiconductor heat sink 120 can ensure that the temperature of the multi-frequency filter group 125 is controlled within a safe range when operating at high power. The heat pipe 127 effectively controls the temperature of the multi-frequency filter group 125 when operating at high power and forms contact with the surface of the semiconductor heat sink 120 to ensure efficient heat conduction.

[0072] The wiring diagrams for the active signal wave generator 1094, rotating positive charge gathering ring 1090, output control motor 1095, angle rotation motor 1012, miniature pneumatic telescopic rod 1013, miniature electromagnetic guide rod 1015, and built-in current sensor in this invention are common knowledge in the field. Their working principles are well-known technologies, and the appropriate models are selected according to actual use. Therefore, the control methods and wiring arrangements for the active signal wave generator 1094, rotating positive charge gathering ring 1090, output control motor 1095, angle rotation motor 1012, miniature pneumatic telescopic rod 1013, miniature electromagnetic guide rod 1015, and built-in current sensor will not be explained in detail.

[0073] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A compact, high-efficiency, GW-level high-power microwave system adapted to the X-band, characterized in that: Including: The mode converter dynamic electromagnetic protection component (1) is installed on the side of the rectangular waveguide (2) to realize the mutual conversion between the circular waveguide TM01 mode and the rectangular waveguide TE10 mode, and to change the microwave propagation direction. At the same time, it dynamically performs fixed-point and directional protection based on the working direction of the electromagnetic interference signal detected by the built-in current sensor, and actively generates a signal opposite to the interference signal to cancel it out, thereby eliminating interference. The five-stage cascaded T-shaped one-to-two power divider (3) is installed at the left and right ends of the rectangular waveguide (2) and connected to the docking cavity end (11) to improve the overall high mode conversion rate through the internal adaptive low-power and high-efficiency amplification structure. The cavity slot antenna (5) is mounted on the surface of the five-stage cascaded T-shaped one-to-two power divider (3) to form a rectangular waveguide feed and is connected in sequence with other components to form a large-scale microwave transmission and radiation structure. The load dynamic conductor (13) is embedded on the left and right surfaces of the rectangular waveguide (2) and forms an active adjustment with one end of the five-stage cascaded T-shaped one-to-two power divider (3); The multi-band signal component (12) is installed in a symmetrical configuration on the inner side of the five-stage cascaded T-shaped one-to-two power divider (3) to form a multi-band signal operation, ensuring that the response signal is effectively transmitted in different frequency bands and achieving full-band interference suppression.

2. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 1, characterized in that: The mode converter dynamic electromagnetic protection component (1) includes: The system comprises a large-diameter circular waveguide (101), a tapered waveguide, a short-circuited small-diameter circular waveguide (102), a power-tolerant chamfer (103), and a front-end circular waveguide (106). A docking waveguide ring (104) is installed at the connection end of the large-diameter circular waveguide (101) and the front-end circular waveguide (106). The tapered waveguide is integrally formed on the side end of the large-diameter circular waveguide (101) and is synchronously formed integrally with the short-circuited small-diameter circular waveguide (102). A circular waveguide generator (105) is installed inside the large-diameter circular waveguide (101), the tapered waveguide, and the small-diameter circular waveguide (102) with short-circuited terminals. An output control motor (1095) is installed on the side wall surface of the large-diameter circular waveguide (101). A gear component (1096) and a locking rod (1097) are respectively connected to the bottom output end of the output control motor (1095). The locking rod (1097) and the gear component (1096) are installed together.

3. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 2, characterized in that: The gear component (1096) is meshed with a synchronous rotating tooth (107) on its side end. Multiple sets of engagement grooves (108) are formed around the surface of the synchronous rotating tooth (107). The engagement rod (1097) and the multiple sets of engagement grooves (108) form a rotational engagement. The synchronous rotating tooth (107) is fastened to a connecting L rod (1091) on its side end. The bottom of the connecting L rod (1091) is fastened to a rotating positive charge gathering ring (1090). Multiple sets of mounting frames are fastened to the bottom of the rotating positive charge gathering ring (1090) and the synchronous rotating tooth (107). Miniature electromagnetic guide rods (1015) are symmetrically installed on the left and right ends inside the multiple sets of mounting frames.

4. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 3, characterized in that: The side end of the miniature electromagnetic rod (1015) is connected to a segment ball (1014) via a contact block. The bottom of the segment ball (1014) is rotatably connected to a double-layer shielded wave-absorbing arc plate (109). The top surface of the segment ball (1014) is rotatably connected to a connecting rod. The connecting rod is fastened to the bottom wall side surface of the rotating positive charge accumulation ring (1090) and the synchronous rotating tooth (107). The inside of the synchronous rotating tooth (107) is equally divided and fastened to a top L rod. The top of the top L rod is equipped with an annular rotating rail (1098). The inside of the annular rotating rail (1098) is slidably connected to a sliding position saddle (1099). The side end surface of the sliding position saddle (1099) is fastened to a slot frame (1010). The inside of the slot frame (1010) is rotatably connected to a rotating hoop (1011).

5. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 4, characterized in that: An angle rotation motor (1012) is installed on the side end of the slot frame (1010). A miniature pneumatic telescopic rod (1013) is installed inside the slot frame (1010). A protective shielding arc wave plate is fastened to the side end of the miniature pneumatic telescopic rod (1013). The protective shielding arc wave plate and the double-layer shielding wave-absorbing arc plate (109) have the same structure. A rotator section (1092) is fastened to the top of the top L rod. Active signal wave generators (1094) are evenly installed on the circumferential surface of the rotator section (1092).

6. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 1, characterized in that: The load dynamic conductor (13) is internally installed with a metal high guide rod (14). The side end of the load dynamic conductor (13) is fastened with a phase change material connector (15). The side end of the phase change material connector (15) is connected to a dynamic feedback line (16). The dynamic feedback line (16) is composed of a low-area feedback line and a high-area feedback line. The inside of the dynamic feedback line (16) is connected with an optocoupler (17).

7. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 1, characterized in that: The top of the five-stage cascaded T-shaped one-to-two power divider (3) is securely connected to a sealed cover box (6). A filter (7) is installed inside the sealed cover box (6). A main amplifier (8) and a secondary amplifier (9) are installed inside the filter (7). The main amplifier (8) and the secondary amplifier (9) are connected in parallel through a circuit. A high-efficiency power converter (10) is connected to the bottom of the main amplifier (8) and the secondary amplifier (9). An HT connector (4) is installed on the side of the five-stage cascaded T-shaped one-to-two power divider (3). The HT connector (4) forms a fan-shaped rectangular TE mode to HE mode conversion operation.

8. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 1, characterized in that: The multi-band signal component (12) includes: The semiconductor heat sink assembly (120), multi-band antenna array (121), multi-band filter group (125) and antenna array access terminal (122) are connected to the side end of the antenna array access terminal (122) and the cavity slot antenna (5). The semiconductor heat sink assembly (120) is located at the bottom of the side end of the multi-band antenna array (121) and is tightly connected to the internal surface of the five-stage cascaded T-shaped one-to-two power divider (3).

9. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 8, characterized in that: The multi-band filter bank (125) is installed inside the multi-band antenna array (121). An amplifier (124) is connected to one side of the multi-band filter bank (125). An output signal terminal (126) is installed on the other side of the multi-band filter bank (125). A processor (123) is installed on the side of the antenna array access terminal (122). A multi-frequency signal generator (18) is installed on the side of the output signal terminal (126).

10. The compact, high-efficiency, GW-level high-power microwave system adapted to the X-band according to claim 9, characterized in that: The processor (123) is electrically connected to a multi-band filter bank (125) via a line. A heat pipe (127) is disposed on the side surface of the multi-band filter bank (125). The bottom of the side of the heat pipe (127) is in contact with the surface of the semiconductor heat sink assembly (120).

Images