Gallium nitride radio frequency device structure with high long-term reliability and preparation method thereof
By etching grooves in gallium nitride radio frequency devices and depositing back metal to form a grounding path, the problem of hole accumulation in the device is solved, and the long-term stability and reliability of the device are significantly improved.
CN119730294APending Publication Date: 2025-03-28GUANGZHOU INSTITUTE OF TECHNOLOY XIDIAN UNIVERSITY +1
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Patent Information
- Application Number
- CN202411639160.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-03-28
AI Technical Summary
Technical Problem
The accumulation of holes in the buffer layer of GaN RF devices leads to long-term stability and reliability problems of the device.
Method used
The grooves are etched inside the substrate of the gallium nitride radio frequency device and the III-N composite buffer layer and deposit the back metal in the grooves to form a ground path to extract holes accumulated in the buffer layer.
Benefits of technology
It effectively suppresses hole accumulation caused by high drain voltage during off-state operation, and improves the long-term stability and reliability of the device.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the technical field of semiconductor devices and manufacturing thereof, and discloses a gallium nitride radio frequency device structure with high long-term reliability and a preparation method of the gallium nitride radio frequency device structure. A source electrode and a drain electrode are arranged at two ends of the surface of a barrier layer, a gate electrode is arranged between the source electrode and the drain electrode, grooves are etched in a substrate layer and an III-N composite buffer layer; the metal layer is attached to the bottom of the substrate layer and the inner side wall of the groove, and is also attached to the side wall of the III-N composite buffer layer in the groove and the bottom of the channel layer, the groove is located near the gate electrode and close to one side of the drain electrode, and the channel layer and the barrier layer form a heterojunction. Two-dimensional electron gas 2DEG is formed on one side, close to the channel layer, of a heterojunction interface formed by the channel layer and the barrier layer and serves as a conducting channel of the gallium nitride device, and the metal layer can extract holes accumulated in the III-N composite buffer layer in a grounding mode. Therefore, hole accumulation in the composite buffer layer caused by high drain voltage during off-state operation is suppressed, and long-term stability and reliability of the device are improved.
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