Repair method of display module packaging structure

Abstract

The invention provides a method for repairing a display module packaging structure, and the method comprises the steps: obtaining the position of a lampwick which emits light abnormally on a display module, removing a GU glue film layer and a UV glue film layer with a preset thickness on the display module, removing UV glue at the lampwick which emits light abnormally, exposing the lampwick which emits light abnormally, and repairing the display module packaging structure. And the lampwick is repaired, glue is supplemented, and secondary film pressing is carried out. According to the repairing method of the display module packaging structure, the GU adhesive film layer and the UV adhesive film layer with the preset thickness on the display module are removed firstly, after the abnormal light-emitting electric core is repaired, the new GU adhesive film layer and the UV adhesive film layer with the preset thickness are used for repairing the display module through the means of secondary film pressing, the problem of ink color difference cannot occur, and the repairing quality of the display module packaging structure is improved. Therefore, the problems of ink color appearance difference and repair point brightness difference after repair in the repair method of the display module packaging structure in the prior art are solved.

Description

Technical Field

[0001] The present invention relates to the technical field related to display devices, and in particular to a method for repairing a display module packaging structure. Background Art

[0002] With the development of LED display technology, small-pitch LED display modules with high resolution per unit area have become the mainstream products of LED. One way to integrate and package indoor small-pitch LED display products is to use COB (Chip On Board) light source. COB light source is a high-efficiency integrated surface light source technology that directly attaches LED chips to a mirror metal substrate with high reflectivity. This technology eliminates the concept of brackets, has no electroplating, no reflow soldering, and no patch process, so the process is reduced by nearly one-third and the cost is also saved by one-third. The COB process first covers the silicon wafer placement point on the substrate surface with thermal conductive epoxy resin, and then directly places the silicon wafer on the substrate surface, heat treats until the silicon wafer is firmly fixed to the substrate, and then uses wire welding to directly establish an electrical connection between the silicon wafer and the substrate. Among them, thermal conductive epoxy resin generally uses epoxy resin doped with silver particles, but epoxy resin will inevitably oxidize or age during use, resulting in color changes.

[0003] Due to the dense circuits and LED chip arrangement on the surface of the high-density packaging substrate, the integrated package display module will inevitably have problems such as dead lights and other bad points after packaging. When local dead lights and other bad points appear after the integrated package display module is sealed, the existing technology uses digging and repair, that is, lighting the light board → confirming the bad coordinates → removing the glue layer of the bad coordinates → de-crystallizing, repairing, and welding the bad chips → filling the bad points with glue.

[0004] However, the repair schemes in the prior art mainly have the following problems: there will inevitably be ink color differences between the original glue layer and the glue layer at the repair position due to differences in glue batches, curing time, aging degree, etc., and obvious repair points can be seen by the human eye; the repair effect on multi-layer adhesive films is poor, because the repair glue cannot be used to fill and repair multiple layers of materials. The existing schemes all use the surface adhesive film material for repair, and repair the bottom layer (black base) material separately. After the repair is completed, there is a certain brightness difference when the repair points are lit.

[0005] As can be seen from the above, the prior art method for repairing the display module packaging structure has the problem of differences in ink color appearance and brightness of the repair points after repair. Summary of the invention

[0006] The main purpose of the present invention is to provide a display module packaging structure rework method to solve the problem of ink color appearance difference and repair point brightness difference after rework in the display module packaging structure rework method in the prior art.

[0007] In order to achieve the above object, according to one aspect of the present invention, a method for repairing a display module packaging structure is provided, and the method for repairing a display module packaging structure comprises the following steps:

[0008] Obtain the position of the abnormally luminous wick on the display module;

[0009] Remove the GU film layer and the UV film layer of preset thickness on the display module;

[0010] Remove the UV colloid at the abnormally luminous wick to expose the abnormally luminous wick;

[0011] Wick repair;

[0012] Fill the glue and perform secondary lamination.

[0013] Further, removing the GU adhesive film layer and the UV adhesive film layer of a preset thickness on the display module includes:

[0014] During the first debonding, a grinding wheel is used to remove the GU film layer and the UV film layer of preset thickness.

[0015] Further, the preset thickness is one third of the total thickness of the UV film layer; and / or after removing the preset thickness, the thickness H of the remaining UV film layer satisfies, H≥the thickness of the wick of the display module+20um.

[0016] Further, removing the UV colloid at the lamp core with abnormal light emission to expose the lamp core with abnormal light emission includes:

[0017] The second time of degumming, laser cutting is used to remove UV colloid.

[0018] Furthermore, before using laser to remove UV colloid, the corresponding power, temperature and time are set according to the thickness to be removed, the laser spot satisfies ≤0.2mm, and the spot band is ultraviolet 355nm; after the working time, the laser cutting is stopped, and the UV colloid around the abnormal wick is completely removed to form a hole structure to expose the wick with abnormal luminescence.

[0019] Furthermore, the glue filling and secondary lamination include:

[0020] Use repair film to seal the exposed wick with abnormal light emission. After curing, it will form a full-surface seal with the remaining UV film layer to complete the repair.

[0021] The new adhesive film having the GU adhesive film layer and the UV adhesive film layer of preset thickness is completely combined with the whole surface sealing and laminating operation to complete the secondary lamination.

[0022] Furthermore, during the secondary lamination process, the working temperature is set to meet 80-90° C., the working pressure is set to meet 0.9-1.3 kgf / ㎡, and the working time is 180 s.

[0023] Furthermore, after the glue is repaired and the secondary lamination is performed, the method for repairing the display module packaging structure further includes cutting the portion of the new glue film that is larger than the display module by laser cutting.

[0024] Furthermore, laser cutting of the portion of the new adhesive film that is larger than the display module includes sequentially arranging laser cutting and laser trimming.

[0025] Furthermore, after the glue is repaired and the secondary lamination is performed, the repair method of the display module packaging structure also includes product inspection, and the product inspection includes brightness inspection after the wick is lit, product appearance inspection and product tension inspection.

[0026] By applying the technical solution of the present invention, a method for repairing a display module packaging structure includes obtaining the position of a lamp wick with abnormal light emission on the display module, removing the GU adhesive film layer and a UV adhesive film layer of a preset thickness on the display module, removing the UV colloid at the lamp wick with abnormal light emission, exposing the lamp wick with abnormal light emission, repairing and filling the wick with glue, and performing secondary lamination.

[0027] As can be seen from the above, the repair method of the display module packaging structure of the present application adopts the method of first removing the GU adhesive film layer and the UV adhesive film layer of preset thickness on the display module to pre-process the display module. After the repair of the abnormal light-emitting cell is completed, the display module is repaired by means of secondary lamination with a new GU adhesive film layer and a UV adhesive film layer of preset thickness, and there will be no problem of ink color difference; the repair method of the present application realizes the complete covering of all wicks by the new adhesive film through secondary lamination, and there will be no brightness difference between multiple wicks, thereby achieving no difference between the repaired display module and the unrepaired display module, and completing non-destructive repair. The repair method of the display module packaging structure of the present application solves the problem of ink color difference and brightness difference after repair in the prior art.

[0028] The display module packaging structure rework method of the present application is suitable for simultaneously rework of multiple abnormally luminous wicks, is not limited by the number of abnormally luminous wicks, and is convenient for repairing wicks with different degrees and numbers of damage, which is beneficial to improving the applicability of display module rework and thereby improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0030] Figure 1A logic block diagram of a method for repairing a display module packaging structure of the present invention is shown;

[0031] Figure 2 A schematic diagram showing the structure of the display module of the present invention is shown;

[0032] Figure 3 A schematic diagram showing the structure of the display module of the present invention after polishing is shown;

[0033] Figure 4 A schematic diagram showing a hole-digging structure formed by a display module of the present invention is shown;

[0034] Figure 5 The schematic diagram of the structure of the display module after glue filling of the present invention is shown;

[0035] Figure 6 A schematic diagram showing secondary lamination of a display module of the present invention is shown;

[0036] Figure 7 A structural schematic diagram showing the display module of the present invention after repair is completed is shown.

[0037] The above drawings include the following reference numerals:

[0038] 10. GU film layer; 20. UV film layer; 210. hole structure; 220. remaining UV film layer; 30. substrate; 40. wick; 50. new film. DETAILED DESCRIPTION

[0039] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0040] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meanings as commonly understood by ordinary technicians in the technical field to which this application belongs.

[0041] In the present invention, unless otherwise specified, the directional words used, such as "up, down, top, bottom", usually refer to the directions shown in the drawings, or to the components themselves in the vertical, perpendicular or gravity directions; similarly, for ease of understanding and description, "inside and outside" refer to the inside and outside relative to the outline of each component itself, but the above-mentioned directional words are not used to limit the present invention.

[0042] In order to solve the problem that the rework method of the display module packaging structure in the prior art has ink color appearance difference and rework point brightness difference after rework, the present embodiment provides a display module packaging structure rework method.

[0043] The display module to which the display module packaging structure repair method of the present application is applied is a multi-layer film display module.

[0044] In this embodiment, if Figures 2 to 7 As shown, the display module includes a substrate 30, a wick 40, a UV film layer 20 and a GU film layer 10, wherein the wick 40 is arranged on the substrate 30, the UV film layer 20 is a white transparent layer covering the wick 40, and the GU film layer 10 is ink-colored and covers the side of the UV film layer 20 away from the substrate 30.

[0045] like Figure 1 As shown, the repair method of the display module packaging structure includes the following steps:

[0046] Obtaining the position of the abnormally luminous wick 40 on the display module;

[0047] Removing the GU film layer 10 and the UV film layer 20 of a preset thickness on the display module;

[0048] Removing the UV colloid at the abnormally luminescent wick 40 to expose the abnormally luminescent wick 40;

[0049] Wick 40 rework;

[0050] Fill the glue and perform secondary lamination.

[0051] Specifically, the repair method of the display module packaging structure of the present application adopts the method of first removing the GU adhesive film layer 10 and the UV adhesive film layer 20 of preset thickness on the display module to pre-treat the display module. After the repair of the abnormal light-emitting cell is completed, the display module is repaired by means of secondary lamination with a new GU adhesive film layer 10 and a UV adhesive film layer 20 of preset thickness, and there will be no problem of ink color difference; the repair method of the present application realizes the complete covering of all wicks 40 by the new adhesive film 50 through secondary lamination, and there will be no brightness difference between multiple wicks 40, thereby achieving no difference between the repaired display module and the unrepaired display module, and completing non-destructive repair. The repair method of the display module packaging structure of the present application solves the problem of ink color difference and brightness difference after repair in the prior art.

[0052] In the present embodiment, in the step of obtaining the position of the abnormally luminous wick 40 on the display module, the wick 40 is lit, and the position of the abnormally luminous wick 40 is determined by comparing the light colors of multiple wicks 40. After obtaining the abnormally luminous wick 40, the position of the abnormally luminous wick 40 can be identified by marking.

[0053] In this embodiment, if Figure 2 and Figure 3As shown, removing the GU adhesive film layer 10 and the UV adhesive film layer 20 of a preset thickness on the display module includes the first adhesive removal. Specifically, a grinding wheel is used to remove the GU adhesive film layer 10 and the UV adhesive film layer 20 of a preset thickness, wherein the GU adhesive film layer 10 is firstly polished by the grinding wheel to completely remove the GU adhesive film layer 10, and then the UV adhesive film layer 20 is continuously polished to form a flat adhesive cover after the polishing is completed.

[0054] It should be noted that grinding with a grinding wheel removes the entire adhesive film layer of the display module, rather than grinding a specific area, which is conducive to the formation of a new adhesive cover.

[0055] Among them, the preset thickness is approximately one-third of the total thickness of the UV film layer 20 on the display module. It can be understood that the preset thickness provided in this embodiment can be adaptively adjusted according to actual conditions. Specifically, after removing the preset thickness, the thickness H of the remaining UV film layer 220 satisfies, H≥the thickness of the wick 40 of the display module + 20um. In the thickness of the wick 40 of the display module + the UV film layer 20 with a thickness of 20um, the UV film layer 20 with a thickness of 20um forms a protective layer at the end of the wick 40, which is beneficial to avoid damage to the wick 40 during operation. At the same time, the UV film layer 20 with a preset thickness is removed, which is convenient for the later repair of the abnormally luminous wick 40, thereby improving the repair efficiency.

[0056] In this embodiment, the preset thickness may be 0, that is, the GU film layer 10 is removed only by grinding with a grinding wheel.

[0057] In this embodiment, if Figure 3 and Figure 4 As shown, the step of removing the UV colloid at the abnormally luminescent wick 40 to expose the abnormally luminescent wick 40 includes a second degumming process in which the UV colloid is removed by laser cutting.

[0058] In order to avoid the phenomenon that the UV colloid removal tool damages the wick 40 during the process of removing the UV colloid, the laser cutting technology is used in this embodiment to remove the UV colloid around the abnormally luminous chip.

[0059] Specifically, before using laser to remove UV colloid, the corresponding power, temperature and time are set according to the thickness to be removed, the laser spot satisfies ≤0.2mm, and the spot band is ultraviolet 355nm; after the working time, the laser cutting is stopped, and the UV colloid around the abnormal wick 40 is completely removed to form a hole structure 210 to expose the wick 40 with abnormal light emission.

[0060] The time is set to be greater than 1S-2S, and the temperature and power are adaptively set according to the thickness of the UV colloid that the laser emitting device is expected to remove.

[0061] Laser debonding is used to form the hole structure 210 to expose the abnormally luminous wick 40. Laser debonding has the advantage of high precision to avoid damaging the abnormally luminous wick 40 and the normally luminous wick 40 as well as the UV colloid corresponding to the normally luminous wick 40 during the debonding process.

[0062] The exposed abnormally luminous wick 40 is repaired by performing a lamp wick 40 repair operation. In the lamp wick 40 repair step, the abnormally luminous wick 40 is decrystalline, tinned, recrystalline, and welded to complete the repair of the lamp wick 40.

[0063] like Figure 4 and Figure 5 As shown, after the repair, the lamp core 40 is repaired with anti-repair glue, which is made of the same material as the UV film. The hollow structure is filled with the anti-repair glue to seal the exposed lamp core 40 with abnormal light emission. After the sealing is completed, it is cured to form a full-surface sealing with the remaining UV film layer 220.

[0064] Among them, the present application performs a glue filling operation on the hollowed-out structure so that the anti-repair glue fills the hole structure 210 to form a surface coplanar with the remaining UV glue film layer 220, that is, the thickness of the UV colloid at the original wick 40 with abnormal luminescence is the same as the thickness of the UV colloid at other wicks 40.

[0065] In this embodiment, if Figure 5 , Figure 6 and Figure 7 As shown, after the glue repair is completed, secondary lamination is performed, and the secondary lamination includes completely combining the new glue film 50 having the GU glue film layer 10 and the UV glue film layer 20 of preset thickness with the entire surface sealing glue lamination operation to complete the secondary lamination.

[0066] Specifically, the new adhesive film is combined with the remaining UV adhesive film layer 220 by lamination. Since the entire surface of the adhesive sealant has been formed at this time, the new adhesive film can be completely adhered to the entire surface of the adhesive sealant after lamination.

[0067] The new adhesive film has a GU adhesive film layer 10 and a UV adhesive film layer 20 of preset thickness. During the lamination operation, the UV adhesive film layer 20 of preset thickness is combined with the remaining UV adhesive film layer 220, further ensuring that the new adhesive film is completely adhered to the entire surface of the sealing glue.

[0068] In this embodiment, the secondary lamination requires the lamination equipment to perform the secondary lamination operation in a dust-free workshop. During the secondary lamination process, the working temperature is set to meet 80-90°C, the working pressure is set to meet 0.9-1.3kgf / ㎡, and the working time is 180s. Among them, the working temperature is the temperature provided by the lamination equipment during the secondary lamination operation, the pressure is the pressure provided by the lamination equipment during the secondary lamination operation, and the time is the operating time of the lamination equipment during the secondary lamination operation. Among them, too high or too low working temperature and working pressure will affect the lamination effect and the bonding effect.

[0069] Among them, the laminating equipment has built-in temperature sensors and pressure sensors to detect the working temperature and working pressure.

[0070] In this embodiment, after the glue is repaired and the secondary lamination is performed, the method for repairing the display module packaging structure further includes cutting the portion of the glue film larger than the display module by laser cutting. The laser cutting method is used to achieve the neatness of the display module.

[0071] Specifically, the laser cutting step of this embodiment includes laser cutting and laser trimming arranged in sequence, using two cutting actions to ensure the removal of excess film, ensure the flatness and precision of the surface of the repaired display module, and avoid burrs or cracks.

[0072] The repair method of the display module packaging structure provided in this embodiment is not limited to repairing one abnormally luminous wick 40. When multiple abnormally luminous wicks 40 appear, the repair method of the display module packaging structure of this application can also achieve non-destructive repair, and the operation method is the same as the above-mentioned repair method. The repair method of the display module packaging structure provided in this embodiment is not limited by the number of abnormally luminous wicks 40, and is convenient for repairing wicks 40 damaged to different degrees and in different quantities, which is conducive to improving the applicability of the display module repair, thereby improving the user experience.

[0073] In this embodiment, after the glue is repaired and the secondary lamination is performed, the repair method of the display module packaging structure also includes product inspection, and the product inspection at least includes brightness inspection after the wick 40 is lit, product appearance inspection and product tension inspection.

[0074] The brightness detection after the wicks 40 are lit includes lighting the wicks 40 and observing whether the brightness and light color of the light emitted by each wick 40 are abnormal.

[0075] Among them, the product appearance inspection checks whether there are excess colloids, burrs, cracks and pits on the outer surface of the repaired display module.

[0076] The tensile test is a destructive test, which detects the critical bonding force between the new adhesive film 50 and the remaining UV adhesive film layer 220 by applying tensile force, and then determines whether the new adhesive film and the remaining UV adhesive film layer 220 are completely bonded by the bonding force.

[0077] From the above description, it can be seen that the above embodiments of the present invention achieve the following technical effects:

[0078] The repair method of the display module packaging structure of the present application adopts the method of first removing the GU adhesive film layer 10 and the UV adhesive film layer 20 of preset thickness on the display module to pre-treat the display module. After the repair of the abnormal light-emitting cell is completed, the display module is repaired by means of secondary lamination with a new GU adhesive film layer 10 and a UV adhesive film layer 20 of preset thickness, and there will be no problem of ink color difference; the repair method of the present application realizes the complete covering of all wicks 40 by the new adhesive film 50 through secondary lamination, and there will be no brightness difference between multiple wicks 40, thereby achieving no difference between the repaired display module and the unrepaired display module, and completing non-destructive repair. The repair method of the display module packaging structure of the present application solves the problem of ink color difference and brightness difference after repair in the prior art.

[0079] The repair method of the display module packaging structure of the present application is suitable for repairing multiple abnormal light-emitting wicks 40 at the same time, is not limited by the number of abnormal light-emitting wicks 40, and is convenient for repairing wicks 40 with different degrees and different numbers of damage, which is beneficial to improving the applicability of the display module repair and further improving the user experience.

[0080] Obviously, the above-described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0081] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0082] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0083] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A method for repairing a display module packaging structure, characterized in that: The steps include: Obtaining the position of the abnormally luminous wick (40) on the display module; Removing the GU adhesive film layer (10) and the UV adhesive film layer (20) of a preset thickness on the display module; Removing the UV colloid at the abnormally luminescent wick (40) to expose the abnormally luminescent wick (40); Wick (40) rework; Fill the glue and perform secondary lamination.

2. The method for repairing the display module packaging structure according to claim 1, characterized in that: The method of removing the GU adhesive film layer (10) and the UV adhesive film layer (20) of a preset thickness on the display module comprises: In the first debonding, a grinding wheel is used to remove the GU adhesive film layer (10) and the UV adhesive film layer (20) of a preset thickness.

3. The method for repairing the display module packaging structure according to claim 2, characterized in that: The preset thickness is one third of the total thickness of the UV adhesive film layer (20); and / or After removing the UV adhesive film layer (20) of the preset thickness, the thickness H of the remaining UV adhesive film layer (220) satisfies: H≥the thickness of the lamp core (40) of the display module+20 um.

4. The method for repairing the display module packaging structure according to claim 1, characterized in that: The step of removing the UV colloid at the abnormally luminescent wick (40) to expose the abnormally luminescent wick (40) comprises: The second time of degumming, laser cutting is used to remove UV colloid.

5. The method for repairing the display module packaging structure according to claim 4, characterized in that: Before using laser to remove the UV colloid, the corresponding power, temperature and time are set according to the thickness of the UV colloid to be removed, the laser spot meets the requirement of ≤0.2mm, and the spot wavelength is ultraviolet 355nm; Laser is used to completely remove UV colloid around the abnormal lamp core (40) to form a hole-digging structure (210) to expose the lamp core (40) with abnormal light emission.

6. The method for repairing the display module packaging structure according to claim 1, characterized in that: The glue filling and secondary lamination comprises: The exposed lamp core (40) with abnormal light emission is sealed with a repair adhesive film, and after curing, the film is coplanar with the remaining UV adhesive film layer (220) to form a full-surface seal, thereby completing the adhesive repair; The new adhesive film (50) having the GU adhesive film layer (10) and the UV adhesive film layer (20) of a preset thickness is completely combined with the entire surface after the adhesive sealing and lamination operation, thereby completing the secondary lamination.

7. The method for repairing the display module packaging structure according to claim 6, characterized in that: During the secondary lamination process, the working temperature is set to meet 80-90° C., the working pressure is set to meet 0.9-1.3 kgf / ㎡, and the working time is 180 seconds.

8. The method for repairing the display module packaging structure according to claim 6, characterized in that: After the glue repair and secondary lamination, the display module packaging structure repair method further comprises using laser cutting to cut the portion of the new glue film (50) that is larger than the display module.

9. The method for repairing the display module packaging structure according to claim 8, characterized in that: The laser cutting for cutting the portion of the new adhesive film (50) that is larger than the display module includes laser cutting and laser trimming that are sequentially arranged.

10. The method for repairing the display module packaging structure according to claim 1, characterized in that: After the glue repair and secondary lamination, the display module packaging structure rework method further includes product inspection, wherein the product inspection includes brightness inspection after the wick (40) is lit, product appearance inspection and product tension inspection.

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