Display device and method for manufacturing same

Abstract

A display device and a method for manufacturing the same are provided. The display device includes: a substrate; a light emitting element layer disposed on the substrate, the light emitting element layer including a plurality of light emitting elements configured to emit light; and a light control layer disposed on the light emitting element layer, the light control layer including a light transmitting layer configured to transmit light and a light blocking layer configured to block light. The display device further includes: a first layer including at least one of a thin film encapsulation layer and a touch sensor layer, where the first layer is disposed between the light emitting element layer and the light control layer; and a recess through at least a portion of the first layer, with the light blocking layer disposed in the recess.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0129845 filed on September 26, 2023 and all rights and benefits derived therefrom, the contents of which are incorporated herein by reference in their entirety. Technical Field

[0003] The present disclosure relates to a display device and a method for manufacturing the display device. Background Art

[0004] With the development of the information age, the demand for various forms of display devices for displaying images has increased. The display device may be a flat panel display device such as a liquid crystal display device, a field emission display device, and a light-emitting display device. The light-emitting display device may include an organic light-emitting display device including an organic light-emitting diode element as a light-emitting element or a light-emitting diode display device including an inorganic light-emitting diode element (such as a light-emitting diode (LED) as an example) as a light-emitting element.

[0005] In the case of a display device for a vehicle, if the display device is placed in front of a driver or a passenger and an image is displayed on the display device, the reflection of the image on the windshield at night may interfere with the driver's ability to effectively operate the vehicle. Accordingly, for example, a method for controlling the viewing angle of an image displayed on a display device for a vehicle is desired. In some aspects, for privacy protection, a method for controlling the viewing angle of an image displayed on a display device for a vehicle is desired so that the image displayed on the display device for a vehicle placed in front of the driver is not viewed by the passenger. Summary of the invention

[0006] An object of the present disclosure is to provide a display device in which viewing angle control characteristics are improved and a method for manufacturing the display device.

[0007] Another object of the present disclosure is to provide a display device in which reliability of a light management layer is improved and a method for manufacturing the display device.

[0008] The objects of the present disclosure are not limited to those mentioned above, and additional objects of the present disclosure that are not mentioned herein will be clearly understood by those skilled in the art from the following description of the present disclosure.

[0009] According to one aspect of the present disclosure, a display device is provided, which includes: a substrate; a light-emitting element layer, which is arranged on the substrate, and the light-emitting element layer includes a plurality of light-emitting elements configured to emit light; a light-control layer, which is arranged on the light-emitting element layer, and the light-control layer includes a light-transmitting layer configured to transmit light and a light-blocking layer configured to block light; a first layer, which includes at least one of a thin-film encapsulation layer and a touch sensor layer, wherein the first layer is arranged between the light-emitting element layer and the light-control layer; and a groove, which passes through at least a portion of the first layer, wherein the light-blocking layer is arranged in the groove.

[0010] In an embodiment, the light blocking layer overlaps the groove.

[0011] In an embodiment, at least a portion of the light blocking layer is disposed in the groove.

[0012] In an embodiment, the width of the groove is greater than the width of the light blocking layer.

[0013] In an embodiment, at least a portion of the light transmissive layer is disposed in the groove.

[0014] In an embodiment, the light-transmitting layer is disposed in the groove between a side surface of the groove and a side surface of the light-blocking layer.

[0015] In an embodiment, a side surface of the groove and a side surface of the light blocking layer may not directly contact each other in the groove.

[0016] In an embodiment, the touch sensor layer includes at least one touch electrode, and the groove does not overlap the touch electrode.

[0017] In an embodiment, the width of the groove is equal to the width of the light blocking layer.

[0018] In an embodiment, a side surface of the groove and a side surface of the light blocking layer may directly contact each other in the groove.

[0019] In an embodiment, the light-transmitting layer is not disposed in the groove.

[0020] In an embodiment, the display device may further include a capping layer disposed between the groove and the light-management layer.

[0021] In an embodiment, the capping layer covers the side and bottom surfaces of the recess.

[0022] In an embodiment, the display device may further include an overcoat layer disposed on the light management layer.

[0023] In an embodiment, a bottom surface of the groove overlaps the thin film encapsulation layer in a horizontal direction.

[0024] In an embodiment, the bottom surface of the groove overlaps the touch sensor layer in a horizontal direction.

[0025] According to one aspect of the present disclosure, a method for manufacturing a display device is provided, the method comprising: preparing a display panel, the display panel comprising: a substrate; a light-emitting element layer, disposed on the substrate, the light-emitting element layer comprising a plurality of light-emitting elements configured to emit light; and a first layer, disposed on the light-emitting element layer, the first layer comprising at least one of a thin film encapsulation layer and a touch sensor layer; forming a groove passing through at least a portion of the first layer; forming a plurality of light-transmitting layers on the groove; and forming a light-blocking layer between one of the plurality of light-transmitting layers and another light-transmitting layer, wherein the light-blocking layer is disposed in the groove.

[0026] In an embodiment, the width of the groove is greater than the width of the light blocking layer.

[0027] According to one aspect of the present disclosure, a method for manufacturing a display device is provided, the method comprising: preparing a display panel, the display panel comprising: a substrate; a light-emitting element layer, disposed on the substrate, the light-emitting element layer comprising a plurality of light-emitting elements configured to emit light; and a first layer, disposed on the light-emitting element layer, the first layer comprising at least one of a thin film encapsulation layer and a touch sensor layer; forming a light-transmitting material layer on the first layer; forming a plurality of light-transmitting layers by forming grooves passing through at least a portion of the first layer and the light-transmitting material layer; and forming a light-blocking layer between one of the plurality of light-transmitting layers and another light-transmitting layer, wherein the light-blocking layer is disposed in the grooves.

[0028] In an embodiment, the width of the groove is equal to the width of the light blocking layer.

[0029] In the display device and the method for manufacturing the display device according to the embodiment, the viewing angle control characteristic may be improved.

[0030] In the display device and the method for manufacturing the display device according to the embodiment, the reliability of the light control layer may be improved.

[0031] Effects according to the embodiments of the present disclosure are not limited to those mentioned above, and more various effects are included in the following description of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other aspects and features of the present disclosure will become more apparent by describing in detail embodiments of the present disclosure with reference to the accompanying drawings, in which:

[0033] Figure 1 is an exploded perspective view illustrating a display device according to an embodiment;

[0034] Figure 2 is a plan view illustrating a display device according to an embodiment;

[0035] Figure 3is an exploded perspective view illustrating a display device according to another embodiment;

[0036] Figure 4 The diagram shows Figure 2 A schematic cross-sectional view of the display device taken along line X1-X1';

[0037] Figure 5 is a schematic diagram illustrating that a display device according to an embodiment is applied to a vehicle;

[0038] Figure 6 is a cross-sectional view illustrating an example of a display panel according to an embodiment;

[0039] Fig. 7A is a cross-sectional view illustrating a display panel and a light control layer according to an embodiment;

[0040] Figure 7B is a cross-sectional view illustrating a display panel and a light control layer according to another embodiment;

[0041] Figure 8 The diagram shows Fig. 7A An enlarged view of area A;

[0042] Fig. 9 is a cross-sectional view illustrating a display panel and a light control layer in a normal mode area and a privacy mode area of ​​a display device according to an embodiment;

[0043] Fig.10 is a cross-sectional view illustrating a display panel and a light control layer of a display device according to still another embodiment;

[0044] Fig.11 The diagram shows Fig.10 An enlarged view of region B;

[0045] Fig.12 is a cross-sectional view illustrating a display panel, a capping layer, and a light control layer of a display device according to still another embodiment;

[0046] Fig.13 is a cross-sectional view illustrating a display panel, a light control layer, and an overcoat layer of a display device according to still another embodiment;

[0047] Fig.14 is a cross-sectional view illustrating a display panel and a light control layer of a display device according to still another embodiment;

[0048] Fig.15 is a flow chart illustrating a method for manufacturing a display device according to an embodiment;

[0049] Fig.16 The diagram shows Fig.15 A cross-sectional view of step S110;

[0050] Fig.17 The diagram shows Fig.15 A cross-sectional view of step S120;

[0051] Fig.18 The diagram shows Fig.15 A cross-sectional view of step S130;

[0052] Fig.19 The diagram shows Fig.15 A cross-sectional view of step S140;

[0053] Fig. 20 The diagram shows Fig.15 A cross-sectional view of step S150;

[0054] Fig.21 The diagram shows Fig.15 A cross-sectional view of step S160;

[0055] Fig. 22 is a flow chart illustrating a method for manufacturing a display device according to an embodiment;

[0056] Fig.23 The diagram shows Fig. 22 A cross-sectional view of step S210;

[0057] Fig.24 The diagram shows Fig. 22 A cross-sectional view of step S220;

[0058] Fig.25 The diagram shows Fig. 22 A cross-sectional view of step S230;

[0059] Fig.26 The diagram shows Fig. 22 A cross-sectional view of step S240; and

[0060] Fig. 27 The diagram shows Fig. 22 sectional view of step S250. DETAILED DESCRIPTION

[0061] The present invention will now be described more fully hereinafter with reference to the accompanying drawings, in which one or more example embodiments are illustrated. However, the aspects supported by the present disclosure may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, the example embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the example aspects of the present disclosure to those skilled in the art.

[0062] It will also be understood that when a layer is referred to as being “on” another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. Like reference numerals refer to like components throughout the specification.

[0063] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.

[0064] Figure 1 is an exploded perspective view illustrating a display device according to an embodiment. Figure 2 is a plan view illustrating a display device according to an embodiment. Figure 3 is an exploded perspective view illustrating a display device according to another embodiment.

[0065] refer to Figures 1 to 3 The display device 10 is a device that displays a moving image or a still image, and the display device 10 can be used as a display screen of various products such as televisions, laptop computers, monitors, billboards, and Internet of Things (IoT) devices, and a display screen of portable electronic devices such as mobile phones, smart phones, tablet personal computers (PCs), smart watches, watch phones, mobile communication terminals, electronic diaries, electronic books, portable multimedia players (PMPs), navigators, and ultra-mobile PCs (UMPCs). The display device 10 may be any one of an organic light-emitting display device, a liquid crystal display device, a plasma display device, a field emission display device, an electrophoretic display device, an electrowetting display device, a quantum dot light-emitting display device, and a micro LED display device. The following description will be based on an example in which the display device 10 is an organic light-emitting display device, but the embodiments of the present disclosure are not limited thereto.

[0066] The display device 10 according to the embodiment may include a display panel 100 , a display driving circuit 250 , a circuit board 300 , and a touch driving circuit 400 .

[0067] The display panel 100 may include a plurality of pixels PX arranged in the first direction DR1 and the second direction DR2. Each of the pixels PX may be a pixel of a plane shape such as a rectangular shape, a square shape, or a diamond shape. For example, as illustrated in the figure, each of the pixels PX may have a square plane shape, but is not limited thereto. Each of the pixels PX may be a pixel of various shapes on a plane such as other polygonal shapes, a circular shape, and an elliptical shape.

[0068] In the illustrated drawings, the first direction DR1 and the second direction DR2 are horizontal directions and intersect each other. For example, the first direction DR1 and the second direction DR2 may be orthogonal to each other. The third direction DR3 intersects the first direction DR1 and the second direction DR2 and may be, for example, a vertical direction orthogonal to the first direction DR1 and the second direction DR2.

[0069] The display panel 100 may include a main area MA and a protrusion area PA protruding from one side of the main area MA.

[0070] The main area MA may be formed in a plane of a rectangular shape having a short side (relatively short side) in a first direction DR1 and a long side (relatively long side) in a second direction DR2 intersecting the first direction DR1. The corner at which the short side in the first direction DR1 intersects the long side in the second direction DR2 may be rounded according to a predetermined curvature, or may be formed as a right angle. The planar shape of the display device 10 is not limited to a rectangular shape, and may be formed into other polygonal shapes, a circular shape, or an elliptical shape. The main area MA may be formed to be flat, but is not limited thereto. The main area MA may include curved portions formed at the left and right ends of the main area MA. In this case, for example, the curved portion may have a constant curvature or a variable curvature.

[0071] The main area MA includes a display area DA in which pixels PX are formed to display an image and a non-display area NDA which is a peripheral area of ​​the display area DA.

[0072] The pixels PX and the scan lines, data lines, and power lines connected to the pixels PX may be disposed in the display area DA. In an example in which the main area MA includes a curved portion, the display area DA may be disposed in the curved portion. In this case, for example, an image of the display panel 100 may be viewed even in the curved portion.

[0073] The non-display area NDA may be defined as a region from the outside of the display area DA to the edge of the display panel 100. A scan driver for applying a scan signal to a scan line may be disposed in the non-display area NDA, and a link line for connecting a data line with the display driving circuit 250 may be disposed in the non-display area NDA.

[0074] The protruding area PA may protrude from one side of the main area MA. Figure 2 As illustrated in FIG. 1 , the protrusion area PA may protrude from the lower side of the main area MA. A length of the protrusion area PA in the first direction DR1 may be shorter than a length of the main area MA in the first direction DR1.

[0075] The protruding area PA may include a bending area BA and a pad area PDA. In this case, for example, the pad area PDA may be disposed on one side of the bending area BA, and the main area MA may be disposed on the other side of the bending area BA. For example, the pad area PDA may be disposed below the bending area BA, and the main area MA may be disposed above the bending area BA.

[0076] The display panel 100 may be flexibly formed to be bent, folded, or curled. Therefore, the display panel 100 may be bent in the thickness direction (i.e., the third direction DR3) in the bending area BA. In this case, for example, one surface of the pad area PDA of the display panel 100 is upward before the display panel 100 is bent, and the same surface of the pad area PDA of the display panel 100 is downward after the display panel 100 is bent. As a result, the pad area PDA is disposed below the main area MA, and therefore, may overlap the main area MA.

[0077] Pads electrically connected to the display driving circuit 250 and the circuit board 300 may be provided in the pad area PDA of the display panel 100 .

[0078] The display driver circuit 250 outputs a signal and a voltage for driving the display panel 100. For example, the display driver circuit 250 may supply a data voltage to a data line. In some aspects, the display driver circuit 250 may supply a power supply voltage to a power supply line and supply a scan control signal to a scan driver. The display driver circuit 250 may be formed by an integrated circuit (IC), and the display driver circuit 250 may be mounted in a pad area PDA, on the display panel 100 in a chip on glass (COG) mode, a chip on plastic (COP) mode, or an ultrasonic bonding mode, but is not limited thereto. For example, the display driver circuit 250 may be mounted on a circuit board 300.

[0079] The pads may include a display pad electrically connected to the display driving circuit 250 and a touch pad electrically connected to the touch line.

[0080] The circuit board 300 can be attached to the pad by using an anisotropic conductive film. Therefore, the leads of the circuit board 300 can be electrically connected to the pad. The circuit board 300 can be a flexible printed circuit board, a rigid printed circuit board, or a flexible film such as a chip on film.

[0081] The touch driving circuit 400 may be connected to the touch sensor layer TSU (see Figure 4 ) of the touch electrode. The touch driving circuit 400 applies a driving signal to the touch sensor layer TSU (see Figure 4) and measures the capacitance value of the touch electrode. The driving signal may be a signal having a plurality of driving pulses. The touch driving circuit 400 may determine whether a touch input is received based on the capacitance value, and the touch driving circuit 400 may calculate the touch coordinates where the touch input is input.

[0082] The touch driving circuit 400 may be provided on the circuit board 300. The touch driving circuit 400 may be formed of an integrated circuit (IC) and mounted on the circuit board 300.

[0083] In the display device 10 according to one or more embodiments of the present disclosure, the display panel 100 may further include a light control layer LCL.

[0084] The light control layer LCL may be directly disposed in the main area MA of the display panel 100. For example, the light control layer LCL may be embedded in the display panel 100 and directly disposed in the main area MA of the display panel 100. Since the light control layer LCL is embedded in the display panel 100, the thickness and manufacturing cost of the display device 10 may be reduced compared to a case where a separate light control film is attached thereto.

[0085] In some embodiments, the light control layer LCL may be disposed in the display area DA of the main area MA. The light control layer LCL may adjust a viewing angle of light emitted from the display panel 100 .

[0086] On a plane, the size of the light control layer LCL may be greater than that of the display area DA In this case, for example, the light control layer LCL may overlap both the display area DA and the non-display area NDA.

[0087] The light control layer LCL may include transmission areas OA arranged in the first direction DR1 and the second direction DR2 and non-transmission areas LSA surrounding the transmission areas OA.

[0088] The transmission region OA may be a region in which the light blocking layer LS (also referred to herein as the light shielding layer LS) is not disposed (see Fig. 7A The transmission area OA may be a region through which light is transmitted, and may extend along the third direction DR3.

[0089] Each of the transmissive areas OA may be as follows Figure 1 and Figure 2 The transmission area OA is a rectangular shape on a plane as shown in FIG. 1 , but is not limited thereto. Each of the transmission areas OA may be a circular shape, an elliptical shape, or other polygonal shape on a plane.

[0090] In another embodiment, the transmission area OA may be a transmission area of ​​a shape extending in the first direction DR1 or the second direction DR2. Figure 3 As illustrated in FIG. 1 , the transmission area OA may extend in the first direction DR1 and may be disposed along the second direction DR2. In another example, the transmission area OA may extend in the second direction DR2 and may be disposed along the first direction DR1.

[0091] like Figure 1 As illustrated in FIG. 1 , in an example in which the transmission area OA is disposed along the first direction DR1 and the second direction DR2, the viewing angle may be controlled in both the first direction DR1 and the second direction DR2. Figure 3 As illustrated in FIG. 1 , in an example in which the transmission area OA is disposed along the first direction DR1 or the second direction DR2, the viewing angle may be controlled in the first direction DR1 or the second direction DR2. That is, the arrangement and shape of the transmission area OA may be variously modified based on a target control direction of the viewing angle (e.g., a target control direction associated with achieving the viewing angle).

[0092] The non-transmission area LSA may be a remaining area of ​​the light control layer LCL different from the transmission area OA. The non-transmission area LSA may be an area in which the light blocking layer LS (see Fig. 7A ) area.

[0093] In the drawings, the non-transmission area LSA is illustrated as being disposed to surround the transmission area OA, but aspects of the present disclosure are not limited thereto. In some embodiments, the non-transmission area LSA may extend in the same direction as the transmission area OA and may be disposed to alternate with the transmission area OA. Figure 3 As illustrated in FIG, in an example in which the transmission area OA extends in the first direction DR1, the non-transmission area LSA may extend in the first direction DR1 and may be disposed to alternate with the transmission area OA in the second direction DR2. Expressed in another way, instances of the non-transmission area LSA and the transmission area OA may be alternately disposed in a direction (e.g., the second direction DR2).

[0094] The light control layer LCL may include a light emitting layer 172 (see Figure 6 ) light-blocking layer LS (see Fig. 7A ) and a light-transmitting layer LT that transmits the light (see Fig. 7A ). Fig. 7A To describe the detailed structure of the light control layer LCL.

[0095] Figure 4 The diagram shows Figure 2Schematic cross-sectional view of the display device 10 taken along line X1 - X1 ′.

[0096] refer to Figure 4 The display device 10 may include a display panel 100 in which a light control layer LCL is embedded. The display panel 100 may include a base member BS, a thin film transistor layer TFTL, a light emitting element layer EML, a thin film encapsulation layer TFEL, a touch sensor layer TSU, and a light control layer LCL.

[0097] The base member BS may include a substrate. The substrate may be formed of an insulating material such as glass, quartz or a polymer resin. Examples of polymer materials may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP) or a combination thereof. Alternatively or additionally, the substrate may include a metal material.

[0098] The substrate may be a rigid substrate, or may be a flexible substrate that can be subjected to bending, folding, curling, etc. In an example in which the substrate is a flexible substrate, the substrate may be formed of polyimide (PI), but is not limited thereto.

[0099] The thin film transistor layer TFTL may be disposed on the base member BS. Scan lines, data lines, power lines, scan control lines, routing lines connecting pads with data lines, other connection components, and thin film transistors of each pixel may be formed in the thin film transistor layer TFTL. Each of the thin film transistors may include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode.

[0100] The thin film transistor layer TFTL may be disposed in the display area DA and the non-display area NDA. In detail, the scan line, the data line, the power line of the thin film transistor layer TFTL, and the thin film transistor of each pixel may be disposed in the display area DA. The scan control line of the thin film transistor layer TFTL, the routing line connecting the pad with the data line, and other connection components may be disposed in the non-display area NDA.

[0101] The light emitting element layer EML may be disposed on the thin film transistor layer TFTL. The light emitting element layer EML may include a light emitting element including a first electrode (also referred to as a first light emitting electrode), a light emitting layer, and a second electrode (also referred to as a second light emitting electrode), and a pixel defining layer for defining a pixel. The light emitting layer may be an organic light emitting layer including an organic material. In this case, for example, the light emitting layer may include a hole transport layer, an organic light emitting layer, and an electron transport layer. In an example in which a predetermined voltage is applied to the first electrode and a cathode voltage is applied to the second electrode by a thin film transistor of the thin film transistor layer TFTL, holes and electrons move to the organic light emitting layer through the hole transport layer and the electron transport layer, respectively, and recombine with each other in the organic light emitting layer to emit light. The light emitting element of the light emitting element layer EML may be disposed in the display area DA.

[0102] The thin film encapsulation layer TFEL may be disposed on the light emitting element layer EML. The thin film encapsulation layer TFEL may be used to prevent oxygen or moisture from penetrating into the light emitting element layer EML. In some aspects, the thin film encapsulation layer TFEL may include at least one inorganic layer. The inorganic layer may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but is not limited thereto. In some aspects, the thin film encapsulation layer TFEL may be used to protect the light emitting element layer EML from particles such as dust. In some aspects, the thin film encapsulation layer TFEL may include at least one organic layer. The organic layer may be an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, but is not limited thereto.

[0103] The thin film encapsulation layer TFEL may be disposed in both the display area DA and the non-display area NDA. In detail, the thin film encapsulation layer TFEL may be disposed to cover the light emitting element layer EML of the display area DA and the non-display area NDA and to cover the thin film transistor layer TFTL of the non-display area NDA.

[0104] The touch sensor layer TSU may be disposed on the thin film encapsulation layer TFEL. According to one or more embodiments of the present disclosure, since the touch sensor layer TSU is directly disposed on the thin film encapsulation layer TFEL, the thickness of the display device 10 may be reduced compared to other devices in which a separate touch panel including the touch sensor layer TSU is attached to the thin film encapsulation layer TFEL.

[0105] The touch sensor layer TSU may include touch electrodes for sensing a user's touch input in a capacitive manner and touch wires for connecting pads with the touch electrodes. For example, the touch sensor layer TSU may sense a user's touch input in a self-capacitive manner or a mutual-capacitive manner.

[0106] The touch electrodes of the touch sensor layer TSU may be disposed in the touch sensor area overlapping the display area DA. The touch wires of the touch sensor layer TSU may be disposed in the touch peripheral area overlapping the non-display area NDA.

[0107] The light control layer LCL may be disposed on the touch sensor layer TSU. The light control layer LCL may be disposed so that the light control layer LCL overlaps the display area DA. The light control layer LCL may be used to absorb or block light that is shifted by a predetermined angle relative to the third direction DR3 among the light emitted from the light emitting element layer EML. That is, the light control layer LCL may control the viewing angle.

[0108] Although not shown, the display device 10 may further include a cover window. The cover window may be additionally provided on the light control layer LCL. In this case, for example, the light control layer LCL and the cover window may be attached to each other by a transparent adhesive member such as an optically clear adhesive (OCA) film.

[0109] Figure 5 is a schematic diagram illustrating that the display device according to the embodiment is applied to a vehicle.

[0110] refer to Figure 5 The display device 10 according to the embodiment may be, for example, a display device applied to a vehicle. The vehicle may include a vehicle body constituting the exterior of the vehicle and an interior space defined by the vehicle body. The vehicle body may include a windshield W that protects a driver and a passenger from external influences and provides a field of view for the driver. Figure 5 As illustrated in FIG. 1 , the display device 10 may be provided in the interior space.

[0111] In an embodiment, the display device 10 may be provided on a dashboard provided in an interior space. For example, the display device 10 may be provided on a dashboard in front of a driver's seat and configured to provide speed information and other vehicle information to the driver, may be provided on a dashboard in front of a passenger seat and configured to provide entertainment information, etc. to the passenger, or may be provided in the center of the dashboard and configured to provide map information, etc. Figure 5 The figure shows an example of a display device 10 provided on a dashboard in front of a driver's seat and a driver viewing a display screen of the display device 10. In some embodiments, a vehicle may include a plurality of display devices 10 (not shown).

[0112] The driver can recognize (or view) the display screen of the display device 10 through the light LGT1 emitted from the display device 10 toward the driver. However, some of the light LGT2 emitted from the display device 10 may be reflected by the surrounding windshield W and then provided to the driver. In this case, for example, the light reflected on the windshield W may interfere with the driver's driving. In the case of the display device 10 according to the embodiment, various aspects of the display device 10 support the adjustment of the front viewing angle (the viewing angle when the driver faces forward), especially the vertical viewing angle, of the light LGT1 and LGT2 emitted from the display device 10, thereby preventing a portion of the light LGT2 emitted from the display device 10 from being reflected by the surrounding windshield W. Accordingly, for example, the display device 10 can prevent a portion of the light LGT2 from being provided to the driver from the surrounding windshield W.

[0113] In some aspects, some of the light LGT2 emitted from the display device 10 may be provided or emitted toward a passenger. In this case, for example, the display device 10 may be weak in terms of privacy protection. However, in the case of the display device 10 according to the embodiment, various aspects of the display device 10 support adjustment of the front viewing angle (the driver's viewing angle toward the front), especially the horizontal viewing angle, of the light LGT1 and LGT2 emitted from the display device 10, thereby preventing some of the light LGT1 and LGT2 emitted from the display device 10 from being emitted toward the passenger. That is, for example, with respect to the display device 10 disposed in front of the driver of the vehicle, various aspects of the display device 10 support preventing the image displayed on the display device 10 from being provided to the passenger.

[0114] The viewing angle can be adjusted by the light control layer LCL. The viewing angle can be limited to a predetermined angle range by the light control layer LCL. In an example in which the driver faces forward (for example, the driver is horizontally located in front of the display device 10) and a virtual line extending in a direction perpendicular to the display surface of the display device 10 is a normal line, the viewing angle can be an angle within 35° from the normal line. In some embodiments, an angle within 35° from the normal line can be defined as an effective viewing angle, but is not limited thereto. The display device 10 described herein supports any appropriate viewing angle that supports the various features of the display device 10 (for example, light blocking, reducing reflections or glare toward the driver, and privacy protection, etc.).

[0115] Figure 6 1 is a cross-sectional view illustrating an example of a display panel according to an embodiment. Figure 6 In the figure, for the convenience of description, the light control layer LCL is omitted.

[0116] refer to Figure 6The display panel 100 may include a display layer DU and a touch sensor layer TSU. The display layer DU may include a base member BS, a thin film transistor layer TFTL, a light emitting element layer EML, and a thin film encapsulation layer TFEL.

[0117] The base member BS may include a first substrate SUB1, a first buffer layer BF1 disposed on the first substrate SUB1, and a second substrate SUB2 disposed on the first buffer layer BF1.

[0118] The first substrate SUB1 and the second substrate SUB2 may be formed of an insulating material such as glass, quartz or a polymer resin. Examples of polymer materials may include polyethersulfone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyallyl ester, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof. Alternatively or additionally, the substrate may include a metal material.

[0119] Each of the first substrate SUB1 and the second substrate SUB2 may be a rigid substrate. Additionally or alternatively, one or more of the first substrate SUB1 and the second substrate SUB2 may be a flexible substrate capable of being bent, folded, or curled, etc. In an example where the substrate (e.g., the first substrate SUB1 and / or the second substrate SUB2) is a flexible substrate, the substrate may be formed of polyimide (PI), but is not limited thereto.

[0120] The first buffer layer BF1 may be a layer for protecting the first thin film transistor ST1 and the light emitting layer 172 from moisture penetrating the first substrate SUB1 and the second substrate SUB2 susceptible to moisture penetration. The first buffer layer BF1 may include a plurality of inorganic layers alternately stacked. For example, the first buffer layer BF1 may be formed of a multilayer in which a plurality of inorganic layers among silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers are alternately stacked.

[0121] The thin film transistor layer TFTL may include a lower metal layer BML, a second buffer layer BF2, a first thin film transistor ST1, a first gate insulating layer GI1, an interlayer insulating layer 140 (including a first interlayer insulating layer 141 and a second interlayer insulating layer 142), a first capacitor electrode CAE1, a first anode connection electrode ANDE1, a first organic layer 160, a second anode connection electrode ANDE2, and a second organic layer 180.

[0122] The lower metal layer BML may be disposed on the second substrate SUB2. The lower metal layer BML may be disposed so that the lower metal layer BML overlaps with the first active layer ACT1 of the first thin film transistor ST1 in the third direction DR3 so as to prevent leakage current from occurring when light is incident on the first active layer ACT1 of the first thin film transistor ST1. The lower metal layer BML may be formed by a single layer or multiple layers formed of one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof. In some embodiments, the lower metal layer BML may be omitted.

[0123] The second buffer layer BF2 may be disposed on the lower metal layer BML. The second buffer layer BF2 is a layer for protecting the first thin film transistor ST1 and the light emitting layer 172 from moisture penetrating the first substrate SUB1 and the second substrate SUB2 susceptible to moisture penetration. The second buffer layer BF2 may include a plurality of inorganic layers alternately stacked. For example, the second buffer layer BF2 may be formed of a multilayer in which a plurality of inorganic layers among a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are alternately stacked.

[0124] The first active layer ACT1 of the first thin film transistor ST1 may be disposed on the second buffer layer BF2. The first active layer ACT1 of the first thin film transistor ST1 includes polycrystalline silicon (e.g., low temperature polycrystalline silicon), single crystal silicon, amorphous silicon, or an oxide semiconductor. Since the first active layer ACT1 of the first thin film transistor ST1, which is not covered by the first gate insulating layer GI1 and is exposed, is doped with impurities or ions, the first active layer ACT1 of the first thin film transistor ST1 may have conductivity. Therefore, a first source electrode TS1 and a first drain electrode TD1 of the first active layer ACT1 of the first thin film transistor ST1 may be formed.

[0125] The first gate insulating layer GI1 may be disposed on the first active layer ACT1 of the first thin film transistor ST1. Figure 5 , the first gate insulating layer GI1 is illustrated as being disposed between the first gate electrode TG1 of the first thin film transistor ST1 and the first active layer ACT1, but is not limited thereto. The first gate insulating layer GI1 may be disposed between the first interlayer insulating layer 141 and the first active layer ACT1 and between the first interlayer insulating layer 141 and the second buffer layer BF2. The first gate insulating layer GI1 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer.

[0126] The first gate electrode TG1 of the first thin film transistor ST1 may be disposed on the first gate insulating layer GI1. The first gate electrode TG1 of the first thin film transistor ST1 may overlap the first active layer ACT1 in the third direction DR3. The first gate electrode TG1 of the first thin film transistor ST1 may be formed by a single layer or a multilayer formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0127] The first interlayer insulating layer 141 may be disposed on the first gate electrode TG1 of the first thin film transistor ST1. The first interlayer insulating layer 141 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The first interlayer insulating layer 141 may include a plurality of inorganic layers.

[0128] The first capacitor electrode CAE1 may be disposed on the first interlayer insulating layer 141. The first capacitor electrode CAE1 may overlap the first gate electrode TG1 of the first thin film transistor ST1 in the third direction DR3. The first interlayer insulating layer 141 has a predetermined dielectric constant, and a capacitor may be formed by the first capacitor electrode CAE1, the first gate electrode TG1, and the first interlayer insulating layer 141 disposed between the first capacitor electrode CAE1 and the first gate electrode TG1. The first capacitor electrode CAE1 may be formed by a single layer or a multilayer formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0129] The second interlayer insulating layer 142 may be disposed on the first capacitor electrode CAE1. The second interlayer insulating layer 142 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The second interlayer insulating layer 142 may include a plurality of inorganic layers.

[0130] The first anode connection electrode ANDE1 may be disposed on the second interlayer insulating layer 142. The first anode connection electrode ANDE1 may be connected to the first drain electrode TD1 of the first thin film transistor ST1 through the first anode contact hole ANCT1, which exposes the first drain electrode TD1 of the first thin film transistor ST1 by passing through the first interlayer insulating layer 141 and the second interlayer insulating layer 142. The first anode connection electrode ANDE1 may be formed by a single layer or a multilayer formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0131] The first organic layer 160 for planarization may be disposed on the first anode connection electrode ANDE 1. The first organic layer 160 may be formed of an organic layer such as, for example, acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin.

[0132] The second anode connection electrode ANDE2 may be disposed on the first organic layer 160. The second anode connection electrode ANDE2 may be connected to the first anode connection electrode ANDE1 through a second anode contact hole ANCT2 that exposes the first anode connection electrode ANDE1 by passing through the first organic layer 160. The second anode connection electrode ANDE2 may be formed by a single layer or a multilayer formed of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu), or an alloy thereof.

[0133] The second organic layer 180 may be disposed on the second anode connection electrode ANDE2. The second organic layer 180 may be formed of an organic layer such as, for example, acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin.

[0134] exist Figure 6 In the embodiment, the first thin film transistor ST1 is formed in a top gate mode in which the first gate electrode TG1 is located above the first active layer ACT1, but is not limited thereto. The first thin film transistor ST1 may be formed in a bottom gate mode in which the first gate electrode TG1 is disposed below the first active layer ACT1 or in a dual gate mode in which the first gate electrode TG1 is disposed above and below the first active layer ACT1.

[0135] The light emitting element layer EML may be disposed on the second organic layer 180. The light emitting element layer EML may include light emitting elements 170 and a bank 190. Each of the light emitting elements 170 may include a first light emitting electrode 171, a light emitting layer 172, and a second light emitting electrode 173.

[0136] The first light emitting electrode 171 may be formed on the second organic layer 180 . The first light emitting electrode 171 may be connected to the second anode connection electrode ANDE2 through the third anode contact hole ANCT3 that exposes the second anode connection electrode ANDE2 by passing through the second organic layer 180 .

[0137] In the top emission structure in which light is emitted toward the second light emitting electrode 173 based on the light emitting layer 172, the first light emitting electrode 171 may be formed of a metal material having high reflectivity, such as a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, and a stacked structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0138] The bank 190 may be formed to partition the first light emitting electrode 171 on the second organic layer 180 so as to define the light emitting area EA. The bank 190 may be formed to cover the edge of the first light emitting electrode 171. The bank 190 may be formed of an organic layer such as, for example, acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0139] The emission area EA refers to a region where the first emission electrode 171 , the emission layer 172 , and the second emission electrode 173 are sequentially stacked so that holes from the first emission electrode 171 and electrons from the second emission electrode 173 recombine with each other in the emission layer 172 to emit light.

[0140] The light emitting layer 172 is formed on the first light emitting electrode 171 and the bank 190. The light emitting layer 172 may include an organic material and be configured to emit light of a predetermined color. For example, the light emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer.

[0141] The second light emitting electrode 173 may be disposed on the light emitting layer 172. The second light emitting electrode 173 may be formed so that the second light emitting electrode 173 covers the light emitting layer 172. The second light emitting electrode 173 may be a common layer formed in all light emitting regions EA. In some embodiments, although not shown, a capping layer may be formed on the second light emitting electrode 173.

[0142] In the top emission structure, the second light emitting electrode 173 may be formed of a transparent conductive oxide (TCO) such as indium tin oxide (ITO) and indium zinc oxide (IZO) or a semi-transmissive conductive material such as magnesium (Mg), silver (Ag) or an alloy of magnesium (Mg) and silver (Ag). In an example in which the second light emitting electrode 173 is formed of a semi-transmissive conductive material, light emitting efficiency may be enhanced by a microcavity.

[0143] The thin film encapsulation layer TFEL may be disposed on the second light emitting electrode 173. The thin film encapsulation layer TFEL may include at least one inorganic layer to prevent oxygen or moisture from penetrating into the light emitting element layer EML. The thin film encapsulation layer TFEL may also include at least one organic layer to protect the light emitting element layer EML from particles such as dust. For example, the thin film encapsulation layer TFEL may include a first encapsulation layer TFE1, a second encapsulation layer TFE2, and a third encapsulation layer TFE3.

[0144] The first encapsulation layer TFE1 (e.g., a first inorganic encapsulation layer) may be disposed on the second light emitting electrode 173. The first encapsulation layer TFE1 may be a single-layer or multi-layer inorganic layer. The first encapsulation layer TFE1 may be formed of a multilayer in which a plurality of inorganic layers among silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers are alternately stacked, or a single layer formed of one of the above inorganic layers.

[0145] The second encapsulation layer TFE2 (e.g., the first organic encapsulation layer) may be disposed on the first encapsulation layer TFE1. The second encapsulation layer TFE2 may be a single-layer or multi-layer organic layer. The second encapsulation layer TFE2 may include a polymer material. The polymer material may include polyethylene terephthalate, polyethylene naphthalate, polycarbonate, polyimide, polyethylene sulfonate, polyoxymethylene, polyarylate, hexamethyldisiloxane, acrylic resin (e.g., polymethyl methacrylate or polyacrylic acid, etc.) or any combination thereof.

[0146] The third encapsulation layer TFE3 (e.g., the second inorganic encapsulation layer) may be disposed on the second encapsulation layer TFE2. The third encapsulation layer TFE3 may be a single-layer or multi-layer inorganic layer. The material contained in the third encapsulation layer TFE3 may be the same as the material contained in the first encapsulation layer TFE1. For example, the third encapsulation layer TFE3 may be formed by a multilayer in which a plurality of inorganic layers among silicon nitride layers, silicon oxynitride layers, silicon oxide layers, titanium oxide layers, and aluminum oxide layers are alternately stacked, or by a single layer formed by one of the above inorganic layers.

[0147] The touch sensor layer TSU may be disposed on the thin film encapsulation layer TFEL. The touch sensor layer TSU may include a plurality of touch electrodes for sensing a user's touch input in a capacitive manner and a touch line for connecting the plurality of touch electrodes to a touch driving circuit. For example, the touch sensor layer TSU may sense a user's touch input in a mutual capacitance manner or a self-capacitance manner.

[0148] In another embodiment, the touch sensor layer TSU may be provided on a separate substrate provided on the display layer DU. In this case, for example, the substrate for supporting the touch sensor layer TSU may be an encapsulation member for encapsulating the display layer DU.

[0149] A plurality of touch electrodes of the touch sensor layer TSU may be disposed in a touch sensor region overlapping the display region. A touch line of the touch sensor layer TSU may be disposed in a touch peripheral region overlapping the non-display region.

[0150] The touch sensor layer TSU may include a first touch insulating layer SIL1 , a first touch electrode REL, a second touch insulating layer SIL2 , a second touch electrode TEL, and a third touch insulating layer SIL3 .

[0151] The first touch insulating layer SIL1 may be disposed on the thin film encapsulation layer TFEL. The first touch insulating layer SIL1 may have an insulating function and an optical function. The first touch insulating layer SIL1 may include at least one inorganic layer. For example, the first touch insulating layer SIL1 may be an inorganic layer including at least one of a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer. Optionally, the first touch insulating layer SIL1 may be omitted.

[0152] The first touch electrode REL may be disposed on the first touch insulating layer SIL1. In some embodiments, the first touch electrode REL may not overlap the light emitting element 170. The first touch electrode REL may be formed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or indium tin oxide (ITO), or may be formed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0153] The second touch insulating layer SIL2 may cover the first touch electrode REL and the first touch insulating layer SIL1. The second touch insulating layer SIL2 may have an insulating function and an optical function. For example, the second touch insulating layer SIL2 may be formed of a material exemplified as the first touch insulating layer SIL1.

[0154] The second touch electrode TEL may be disposed on the second touch insulating layer SIL2. In some embodiments, the second touch electrode TEL may not overlap the light emitting element 170. The second touch electrode TEL may be formed of a single layer of molybdenum (Mo), titanium (Ti), copper (Cu), aluminum (Al), or indium tin oxide (ITO), or may be formed of a stacked structure of aluminum and titanium (Ti / Al / Ti), a stacked structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a stacked structure of an APC alloy and ITO (ITO / APC / ITO).

[0155] The third touch insulating layer SIL3 may cover the second touch electrode TEL and the second touch insulating layer SIL2. The third touch insulating layer SIL3 may have an insulating function and an optical function. The third touch insulating layer SIL3 may be formed of a material exemplified as the first touch insulating layer SIL1.

[0156] In some embodiments, the first touch insulating layer SIL1, the second touch insulating layer SIL2, and the third touch insulating layer SIL3 may be organic layers. For example, the first touch insulating layer SIL1, the second touch insulating layer SIL2, and the third touch insulating layer SIL3 may be organic layers such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin.

[0157] The touch sensor layer TSU may further include a planarization layer PAS for planarization. The planarization layer PAS may be formed of an organic layer such as, for example, acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin.

[0158] Fig. 7A is a cross-sectional view illustrating a display panel and a light control layer according to an embodiment. Figure 7B is a cross-sectional view illustrating a display panel and a light control layer according to another embodiment. Figure 8 The diagram shows Fig. 7A Magnified view of area A.

[0159] Apart from Figures 1 to 3 In addition, refer to Fig. 7A and Figure 7B as well as Figure 8 , the light control layer LCL may be disposed on the touch sensor layer TSU. The light control layer LCL may control the viewing angle of light emitted from the light emitting layer 172. In an example in which the light emitted from the light emitting layer 172 travels at a predetermined angle or less with respect to the third direction DR3, the light may be emitted to the outside. In some embodiments, in an example in which the light emitted from the light emitting layer 172 travels at an angle greater than a predetermined angle with respect to the third direction DR3, the light may be absorbed or blocked by the light blocking layer LS and thus may not be emitted to the outside.

[0160] The light control layer LCL may include a light transmitting layer LT and a light blocking layer LS.

[0161] The light blocking layer LS may be disposed in the non-transmission area LSA. In an embodiment, the light blocking layer LS may be disposed to alternate with the light transmitting layer LT in the first direction DR1 or the second direction DR2. In another embodiment, the light blocking layer LS may include a plurality of openings disposed in the transmission area OA, such as Figure 1 In this case, for example, the light blocking layer LS may surround the light transmitting layer LT.

[0162] The light blocking layer LS may absorb or block light emitted from the light emitting layer 172. The light blocking layer LS may include a light blocking organic material. For example, the light blocking layer LS is a photosensitive resin capable of absorbing or shielding light, and may include an organic material including an organic black pigment such as carbon black.

[0163] The light-transmitting layer LT may be disposed in the transmissive area OA. In an embodiment, the light-transmitting layer LT may be disposed to alternate with the light-blocking layer LS in the first direction DR1 or the second direction DR2. Figure 3 In another embodiment, the light-transmitting layer LT may be disposed in the opening of the light-blocking layer LS, as shown in FIG. Figure 1 As shown in the figure, and may be surrounded by a light blocking layer LS.

[0164] The light-transmitting layer LT may transmit light emitted from the light-emitting layer 172. The light-transmitting layer LT may include a transparent organic material. For example, the light-transmitting layer LT may include an organic layer such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. In another embodiment, the light-transmitting layer LT may include silicon oxynitride or silicon oxide.

[0165] In some embodiments, the width W_LT of the light-transmitting layer LT may be greater than the width W_LS of the light-blocking layer LS. For example, the width W_LT of the light-transmitting layer LT may be 2 to 5 times the width W_LS of the light-blocking layer LS. For example, the width W_LS of the light-blocking layer LS may be about 2 μm to about 10 μm, but is not limited thereto.

[0166] In some embodiments, Fig. 7A As shown in the figure, the light blocking layer LS may be disposed in an area other than the light emitting area EA. In some embodiments, the light blocking layer LS may be disposed only in an area other than the light emitting area EA. In some other embodiments, the light blocking layer LS may be disposed so that the light blocking layer LS partially overlaps with the light emitting area EA. For example, the light blocking layer LS may overlap with the embankment 190 in the third direction DR3. In this case, for example, light having a low viewing angle (e.g., below a threshold value) among the light generated from the light emitting layer 172 is relatively less blocked than light having a relatively high viewing angle, thereby preventing the brightness of the display device 10 from being reduced.

[0167] In another embodiment, if Figure 7BAs shown in the figure, the light blocking layer LS may be disposed in the light emitting area EA and in an area other than the light emitting area EA. In another embodiment, although not shown in the figure, the light blocking layer LS may be disposed in the light emitting area EA but not outside the light emitting area EA. In the example in which the light blocking layer LS is also disposed in the light emitting area EA, the viewing angle control characteristics of the light control layer LCL may be improved. Therefore, the total thickness of the light control layer LCL, that is, the thickness of the light control layer LCL in the third direction DR3 may be reduced.

[0168] That is, the positional relationship between the light blocking layer LS and the light emitting area EA may be formed in various ways according to the viewing angle control characteristics and brightness characteristics of the display device 10. Fig.10 In the following embodiments described in the drawings and other drawings, for the convenience of description, the light blocking layer LS is illustrated as being disposed only in the region other than the light emitting region EA, but is not limited thereto. In the following embodiments, the light blocking layer LS may be disposed in the light emitting region EA and in the region other than the light emitting region EA, or may be disposed only in the light emitting region EA.

[0169] The display device 10 according to one or more embodiments of the present disclosure may include a groove GRV passing through at least a portion of the thin film encapsulation layer TFEL and at least a portion of the touch sensor layer TSU.

[0170] In an embodiment, the groove GRV may overlap the second encapsulation layer TFE2 and the third encapsulation layer TFE3 of the thin film encapsulation layer TFEL and the first touch insulating layer SIL1, the second touch insulating layer SIL2, the third touch insulating layer SIL3 and the planarization layer PAS of the touch sensor layer TSU in a horizontal direction. For example, the groove GRV may pass through a portion of the second encapsulation layer TFE2 of the thin film encapsulation layer TFEL, the third encapsulation layer TFE3 and the first touch insulating layer SIL1, the second touch insulating layer SIL2, the third touch insulating layer SIL3 and the planarization layer PAS of the touch sensor layer TSU. The bottom surface of the groove GRV may be located between the upper surface and the lower surface of the second encapsulation layer TFE2 in the third direction DR3.

[0171] The groove GRV may overlap the light blocking layer LS in the third direction DR3. In an example in which a plurality of light blocking layers LS are arranged along the horizontal direction, the groove GRV may be arranged in the horizontal direction while overlapping the light blocking layer LS in the third direction DR3. In some embodiments, the light blocking layer LS and the groove GRV may not overlap the first touch electrode REL and the second touch electrode TEL in the third direction DR3. The light blocking layer LS and the groove GRV may be arranged between the first touch electrode REL and the second touch electrode TEL in the horizontal direction.

[0172] At least a portion of the light blocking layer LS may overlap with the groove GRV in the horizontal direction. For example, a lower end portion of the light blocking layer LS may be disposed in the groove GRV. The light blocking layer LS may be disposed on the bottom surface GRVa of the groove GRV. The lower end portion of the light blocking layer LS may overlap with at least a portion of the thin film encapsulation layer TFEL and at least a portion of the touch sensor layer TSU in the horizontal direction.

[0173] In an embodiment, at least a portion of the light-transmitting layer LT may be disposed in the groove GRV. For example, in an area where the groove GRV is not disposed, the light-transmitting layer LT may be disposed on the touch sensor layer TSU, and in an area where the groove GRV is disposed, the light-transmitting layer LT may be disposed on the bottom surface GRVa of the groove GRV.

[0174] In an embodiment, the width W_GRV of the groove GRV may be greater than the width W_LS of the light blocking layer LS. Fig.15 The method S1 for manufacturing a display device according to the embodiment described (see Fig.15 ), in which the light-transmitting material layer LTM (see Fig.18 ), in an example where the groove GRV is first formed before , considering a design tolerance for forming the light blocking layer LS in the groove GRV, the width W_GRV of the groove GRV may be formed to be greater than the width W_LS of the light blocking layer LS.

[0175] In the present disclosure, the width W_GRV of the groove GRV, the width W_LS of the light blocking layer LS, and the width W_LT of the light transmitting layer LT represent the average value of the width in the horizontal direction. For example, in the figure, the sides of the groove GRV, the light blocking layer LS, and the light transmitting layer LT are illustrated as vertical surfaces, but are not limited to this. In an example in which the sides of the groove GRV, the light blocking layer LS, and the light transmitting layer LT are inclined or curved, the width W_GRV of the groove GRV, the width W_LS of the light blocking layer LS, and the width W_LT of the light transmitting layer LT may be different for each point in the third direction DR3. In this case, for example, the width W_GRV of the groove GRV, the width W_LS of the light blocking layer LS, and the width W_LT of the light transmitting layer LT represent the average value of the width in the horizontal direction.

[0176] In some embodiments, the side of the groove GRV may not contact the side of the light blocking layer LS. For example, the light-transmitting layer LT may be disposed in the groove GRV between the side of the light blocking layer LS and the side of the groove GRV. Therefore, the side of the groove GRV may not contact the side of the light blocking layer LS.

[0177] The display device 10 according to one or more embodiments of the present disclosure may include a groove GRV passing through at least a portion of the thin film encapsulation layer TFEL and at least a portion of the touch sensor layer TSU, thereby increasing the thickness H_LS of the light blocking layer LS. For example, since the thickness H_LS of the light blocking layer LS increases, the viewing angle control characteristics of the light control layer LCL can be improved.

[0178] In some aspects, since the display device 10 according to one or more embodiments of the present disclosure may include the groove GRV, the distance between the light blocking layer LS and the light emitting layer 172 in the third direction DR3 may be reduced. Therefore, for example, based on the reduced distance, the viewing angle control characteristics of the light control layer LCL may be improved.

[0179] In some aspects, since the display device 10 according to one or more embodiments of the present disclosure includes the groove GRV, the amount of the light-transmitting layer LT that increases together when the thickness H_LS of the light-blocking layer LS increases can be minimized. For example, since the display device 10 includes the groove GRV, the amount of the light-transmitting layer LT that increases together when the thickness H_LS of the light-blocking layer LS increases can be equal to the amount of the light-transmitting layer LT that is disposed in the groove GRV, except for the amount that is equal to the thickness H_LT of the light-transmitting layer LT that does not overlap with the groove GRV. As a result, in the display device 10 according to one or more embodiments of the present disclosure, the total amount of the light-transmitting layer LT can be less than the amount of the light-transmitting layer LT that is disposed when the same thickness H_LS of the light-blocking layer LS is formed on the touch sensor layer TSU without the groove GRV. This is because the thin film encapsulation layer TFEL and the touch sensor layer TSU that are not removed are disposed between the groove GRV.

[0180] Since the increase amount of the light-transmitting layer LT is minimized as described herein, the method S1 and S2 for manufacturing a display device (see Fig.15 and Fig. 22 ) of step S130 (see Fig.18 ) and step S220 (see Fig.24 ), the amount of exhaust gas discharged due to heat can be minimized. Therefore, aspects of methods S1 and S2 can prevent the film rupture phenomenon of the light-transmitting layer LT caused by the exhaust gas.

[0181] In some aspects, since the increase amount of the light-transmitting layer LT is minimized, as will be described later in the methods S1 and S2 for manufacturing a display device (see Fig.15 and Fig. 22 ) of step S140 (see Fig.19 ) and step S230 (see Fig.25), during the patterning process of the light-transmitting layer LT, the thickness of the second hard mask HM2 and the third hard mask HM3 can be minimized. For example, aspects of methods S1 and S2 can support determining the thickness of the second hard mask HM2 and the third hard mask HM3 in consideration of the amount of the light-transmitting layer LT and the etching rates of the light-transmitting layer LT and the second hard mask HM2 and the third hard mask HM3. Since the increase in the amount of the light-transmitting layer LT is minimized, the increase in the thickness of the second hard mask HM2 and the third hard mask HM3 can also be minimized. As a result, bending of the display panel 100 due to the weight of the hard mask during the patterning process can be prevented.

[0182] Fig. 9 is a cross-sectional view illustrating a display panel and a light control layer in a normal mode area and a privacy mode area of ​​a display device according to an embodiment.

[0183] Apart from Figures 1 to 3 , Fig. 7A , Figure 7B and Figure 8 In addition, refer to Fig. 9 In some embodiments, the display device 10 may include a normal mode area NMA and a privacy mode area PVA.

[0184] A normal mode area NMA and a privacy mode area PVA may be included in the display area DA. The normal mode area NMA may refer to an area in which the light blocking layer LS is not disposed, and the privacy mode area PVA may refer to an area in which the light blocking layer LS is disposed.

[0185] In the normal mode area NMA, only the transmissive area OA (in which the light shielding layer LS is not disposed) may be disposed. In the normal mode area NMA, only the light transmitting layer LT may be disposed.

[0186] The non-transmission areas LSA and the transmission areas OA may be alternately disposed in the privacy mode area PVA. The light-transmitting layers LT and the light-blocking layers LS may be alternately disposed in the privacy mode area PVA.

[0187] In some embodiments, the normal mode area NMA and the privacy mode area PVA may be alternately arranged in the entire display area DA. For example, the normal mode area NMA and the privacy mode area PVA may be arranged like Figure 1 The pixels PX are arranged along the first direction DR1 and the second direction DR2. In this case, for example, the normal mode area NMA and the privacy mode area PVA may be alternately arranged along the first direction DR1 and the second direction DR2.

[0188] When the user operates in the normal mode, the light emitting layer 172 of one or more pixels PX disposed in the normal mode area NMA may emit light, and other instances of the light emitting layer 172 disposed in other areas different from the normal mode area NMA may suppress the emission of light. When the user operates in the privacy mode, the light emitting layer 172 of the pixels PX disposed in the privacy mode area PVA may emit light, and other instances of the light emitting layer 172 disposed in other areas different from the privacy mode area PVA may suppress the emission of light.

[0189] Therefore, the viewing angle control effect of the light control layer LCL is not generated in the normal mode, and the viewing angle control effect of the light control layer LCL may be generated in the privacy mode, but embodiments of the present disclosure are not limited thereto.

[0190] As referenced in this article Fig. 7A As described, when the light blocking layer LS is disposed throughout the entire display area DA, the display device 10 may include only the privacy mode area PVA.

[0191] Hereinafter, other embodiments of the display device according to the embodiment will be described. In the following embodiments, the same elements as those in the previous embodiments will be given the same reference numerals, and their redundant descriptions will be omitted or simplified, and the following description will be based on the differences from the previous embodiments.

[0192] Fig.10 is a cross-sectional view illustrating a display panel and a light control layer of a display device according to still another embodiment. Fig.11 The diagram shows Fig.10 Magnified view of area B.

[0193] refer to Fig.10 and Fig.11 , the display device 10 includes a reference Fig. 7A The display device 10 according to one or more embodiments of the present disclosure is similar to the display device 10 according to the reference 1. Fig. 7A The display device 10 of the described embodiment is different in that the width W_GRV of the groove GRV and the width W_LS of the light blocking layer LS are equal to each other.

[0194] In more detail, the width W_GRV of the groove GRV may be equal to the width W_LS of the light blocking layer LS. Fig. 22 The method S2 described for manufacturing a display device according to another embodiment (see Fig. 22 ), wherein a light-transmitting material layer LTM (see Fig.24), in the example where the groove GRV is formed after ), the width W_GRV of the groove GRV may be equal to the width W_LS of the light blocking layer LS.

[0195] In some embodiments, the side of the groove GRV may contact the side of the light blocking layer LS. For example, in the groove GRV, the light-transmitting layer LT may not be disposed between the side of the light blocking layer LS and the side of the groove GRV. Therefore, the side of the groove GRV may contact the side of the light blocking layer LS. That is, the side of the light blocking layer LS in the groove GRV may contact the thin film encapsulation layer TFEL and the touch sensor layer TSU.

[0196] The display device 10 according to one or more embodiments of the present disclosure may include a groove GRV passing through at least a portion of the thin film encapsulation layer TFEL and at least a portion of the touch sensor layer TSU, thereby increasing the thickness H_LS of the light blocking layer LS (and in some cases, only increasing the thickness H_LS of the light blocking layer LS) without increasing the thickness H_LT of the light transmitting layer LT. Since the thickness H_LS of the light blocking layer LS is increased, the viewing angle control characteristics of the light control layer LCL can be improved.

[0197] In some aspects, since the display device 10 according to one or more embodiments of the present disclosure may include the groove GRV, the distance between the light blocking layer LS and the light emitting layer 172 in the third direction DR3 may be reduced. Therefore, the viewing angle control characteristics of the light control layer LCL may be improved.

[0198] In some aspects, since the thickness H_LT of the light-transmitting layer LT is not increased, the method S1 and S2 for manufacturing a display device (see Fig.15 and Fig. 22 ) of step S130 (see Fig.18 ) and step S220 (see Fig.24 ) in the example of performing the process of forming the light-transmitting layer LT as shown in the figure, the discharge amount of the exhaust gas caused by heat can be minimized. Therefore, the film breakage phenomenon of the light-transmitting layer LT caused by the exhaust gas can be avoided.

[0199] In some aspects, since the thickness H_LT of the light-transmitting layer LT is not increased, the method S1 and S2 for manufacturing a display device (see Fig.15 and Fig. 22 ) of step S140 (see Fig.19 ) and step S230 (see Fig.25), during the patterning process of the light-transmitting layer LT, the thickness of the second hard mask HM2 and the third hard mask HM3 may be minimized. For example, the thickness of the second hard mask HM2 and the third hard mask HM3 may be determined in consideration of the thickness H_LT of the light-transmitting layer LT and the etching rates of the light-transmitting layer LT and the second hard mask HM2 and the third hard mask HM3. In this case, for example, since the thickness H_LT of the light-transmitting layer LT is not increased, the thickness of the second hard mask HM2 and the third hard mask HM3 may not be increased. As a result, bending of the display panel 100 due to the weight of the hard mask during the patterning process may be prevented.

[0200] Fig.12 is a cross-sectional view illustrating a display panel, a capping layer, and a light control layer of a display device according to still another embodiment.

[0201] refer to Fig.12 , the display device 10 includes a reference Fig. 7A and Fig.10 The display device 10 according to one or more embodiments of the present disclosure is similar to the display device 10 described in the present disclosure, and repeated descriptions of similar elements are omitted for brevity. Fig. 7A and Fig.10 The display device 10 of the described embodiment is different in that the display device 10 further includes a capping layer CPL.

[0202] In more detail, the display device 10 according to one or more embodiments of the present disclosure may further include a capping layer CPL.

[0203] The capping layer CPL may be disposed on the groove GRV. For example, the capping layer CPL may be disposed on the groove GRV, the thin film encapsulation layer TFEL, and the touch sensor layer TSU. The capping layer CPL may completely cover the upper surface and side surfaces of the groove GRV, the thin film encapsulation layer TFEL, and the touch sensor layer TSU.

[0204] In the drawings, the capping layer CPL is illustrated as one layer, but is not limited thereto. The capping layer CPL may include one layer or a plurality of stacked structures.

[0205] The capping layer CPL can prevent oxygen or moisture from penetrating into the light emitting element layer EML. In some aspects, the capping layer CPL may include at least one inorganic layer. The inorganic layer may be a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, but is not limited thereto.

[0206] The capping layer CPL can protect the light emitting element layer EML from particles such as dust. In some aspects, the capping layer CPL may include at least one organic layer. The organic layer may be an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin, but is not limited thereto.

[0207] In some embodiments, the material included in the capping layer CPL may be the same as the material included in the thin film transistor layer TFEL. In an example in which the capping layer CPL includes at least one inorganic layer, the capping layer CPL may include the same material (at least one inorganic layer) as the material included in the first encapsulation layer TFE1 and / or the third encapsulation layer TFE3. In an example in which the capping layer CPL includes at least one organic layer, the capping layer CPL may include the same material (at least one organic layer) as the material included in the second encapsulation layer TFE2.

[0208] Since the display device 10 according to one or more embodiments of the present disclosure may further include a capping layer CPL, even if a portion of the thin film encapsulation layer TFEL is penetrated by the groove GRV, the penetration of oxygen and moisture and the influence of dust may be avoided. Therefore, the reliability of the display device 10 may be improved.

[0209] Fig.13 is a cross-sectional view illustrating a display panel, a light control layer, and an overcoat layer of a display device according to still another embodiment.

[0210] refer to Fig.13 , the display device 10 includes a reference Fig. 7A , Fig.10 and Fig.12 The display device 10 according to one or more embodiments of the present disclosure is similar to the display device 10 described in the present disclosure, and repeated descriptions of similar elements are omitted for brevity. Fig. 7A , Fig.10 and Fig.12 The display device 10 of the described embodiment is different in that the display device 10 further includes an overcoat layer OC.

[0211] In more detail, the display device 10 according to one or more embodiments of the present disclosure may further include an overcoat layer OC.

[0212] The overcoat layer OC may be disposed on the light control layer LCL. For example, the overcoat layer OC may be disposed on the light transmissive layer LT and the light blocking layer LS. In an embodiment, the overcoat layer OC may be disposed over the entire surface of the light control layer LCL.

[0213] The overcoat layer OC may flatten the upper surface of the light control layer LCL and protect the light control layer LCL. In some aspects, the overcoat layer OC may include an organic material. For example, the overcoat layer OC may include at least one of an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and a polyimide resin.

[0214] Since the display device 10 according to one or more embodiments of the present disclosure further includes an overcoat layer OC, the durability of the light control layer LCL may be improved. Therefore, the reliability of the display device 10 may be improved.

[0215] Fig.14 is a cross-sectional view illustrating a display panel and a light control layer of a display device according to still another embodiment.

[0216] refer to Fig.14 , the display device 10 includes a reference Fig. 7A , Fig.10 , Fig.12 and Fig.13 The display device 10 according to one or more embodiments of the present disclosure is similar to the display device 10 described in the present disclosure, and repeated descriptions of similar elements are omitted for brevity. Fig. 7A , Fig.10 , Fig.12 and Fig.13 The display device 10 of the described embodiment is different in the depth of the groove GRV.

[0217] In more detail, the depth of the groove GRV in the display device 10 according to one or more embodiments of the present disclosure may be different from the depth of the groove GRV in the display device 10 according to the aforementioned embodiments.

[0218] In an embodiment, as illustrated in the figure, the bottom surface GRVa of the groove GRV may be disposed in the touch sensor layer TSU in the third direction DR3. For example, the bottom surface GRVa of the groove GRV may be disposed between the upper surface of the first touch insulation layer SIL1 and the lower surface of the third touch insulation layer SIL3 in the third direction DR3.

[0219] In this case, for example, the depth of the groove GRV in the display device 10 according to one or more embodiments of the present disclosure may be smaller than the depth of the groove GRV in the display device 10 according to the previous embodiments, but is not limited thereto.

[0220] The depth of the groove GRV may be modified in various ways. For example, the depth of the groove GRV may be modified in various ways based on a target thickness H_LS of the light-blocking layer LS (e.g., a target thickness associated with achieving target characteristics of the light-blocking layer LS according to one or more embodiments of the present disclosure). Fig.14 As illustrated in FIG. 1 , the bottom surface GRVa of the groove GRV may overlap the touch sensor layer TSU in the horizontal direction. In another example, as in the embodiments described herein, the bottom surface GRVa of the groove GRV may overlap the thin film encapsulation layer TFEL in the horizontal direction.

[0221] In an embodiment, the bottom surface GRVa of the groove GRV may overlap with the planarization layer PAS in the horizontal direction. In another embodiment, the bottom surface GRVa of the groove GRV may overlap with the third touch insulation layer SIL3 in the horizontal direction. In another embodiment, the bottom surface GRVa of the groove GRV may overlap with the second touch insulation layer SIL2 in the horizontal direction. In another embodiment, the bottom surface GRVa of the groove GRV may overlap with the first touch insulation layer SIL1 in the horizontal direction. In another embodiment, the bottom surface GRVa of the groove GRV may overlap with the third encapsulation layer TFE3 in the horizontal direction. In another embodiment, the bottom surface GRVa of the groove GRV may overlap with the second encapsulation layer TFE2 in the horizontal direction. In another embodiment, the bottom surface GRVa of the groove GRV may overlap with the first encapsulation layer TFE1 in the horizontal direction.

[0222] Hereinafter, a method for manufacturing a display device according to an embodiment will be described.

[0223] In the description of the method herein, operations may be performed in an order different from the order shown or described, or operations may be performed in a different order or at a different time. Certain operations may also be excluded from the method, one or more operations may be repeated, or other operations may be added.

[0224] Fig.15 is a flowchart illustrating a method S1 for manufacturing a display device according to an embodiment. Fig.16 The diagram shows Fig.15 FIG. 5 is a cross-sectional view of step S110 . Fig.17 The diagram shows Fig.15 FIG. 5 is a cross-sectional view of step S120 . Fig.18 The diagram shows Fig.15 sectional view of step S130. Fig.19 The diagram shows Fig.15 FIG. 5 is a cross-sectional view of step S140 . Fig. 20 The diagram shows Fig.15 sectional view of step S150. Fig.21 The diagram shows Fig.15 sectional view of step S160.

[0225] refer to Figures 15 to 21According to the embodiment, the method S1 for manufacturing a display device may include: a step S110 of preparing a display panel; a step S120 of forming a groove passing through at least a portion of the thin film encapsulation layer and at least a portion of the touch sensor layer; a step S130 of forming a light-transmitting material layer on the groove; a step S140 of forming a light-transmitting layer by patterning the light-transmitting material layer; a step S150 of forming a light-blocking material layer (also referred to as a light-shielding material layer) between and on the light-transmitting layers; and a step S160 of forming a light-blocking layer by removing the light-blocking material layer disposed on the light-transmitting layer.

[0226] First, in the step S110 of preparing a display panel, the method S1 may include: preparing a display panel 100 including a thin film encapsulation layer TFEL and a touch sensor layer TSU.

[0227] Second, in step S120 of forming a groove passing through at least a portion of the thin film encapsulation layer and at least a portion of the touch sensor layer, method S1 may include removing at least a portion of the thin film encapsulation layer TFEL and at least a portion of the touch sensor layer TSU.

[0228] For example, the method S1 may include etching a portion of the second encapsulation layer TFE2 , the third encapsulation layer TFE3 , the first to third touch insulation layers SIL1 , SIL2 , and SIL3 , and the planarization layer PAS using the first hard mask HM1 .

[0229] Thus, a groove GRV passing through a portion of the second encapsulation layer TFE2 , the third encapsulation layer TFE3 , the first to third touch insulation layers SIL1 , SIL2 , and SIL3 , and the planarization layer PAS may be formed.

[0230] However, as described herein, since the depth of the groove GRV may be variously modified, the depth of the removed layer may be variously modified.

[0231] Third, in step S130 of forming a light-transmitting material layer on the groove, the method S1 may include: disposing a light-transmitting material layer LTM on the groove GRV. The light-transmitting material layer LTM may completely fill the inside of the groove GRV. In an example in which the inside of the groove GRV is completely filled, the light-transmitting material layer LTM may be stacked on the touch sensor layer TSU.

[0232] In an embodiment, the light-transmitting material layer LTM may include an organic layer such as, for example, acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. In another embodiment, the light-transmitting material layer LTM may include silicon oxynitride or silicon oxide.

[0233] Fourth, in the step S140 of forming the light-transmitting layer by patterning the light-transmitting material layer, the method S1 may include: removing at least a portion of the light-transmitting material layer LTM.

[0234] For example, the method S1 may include etching at least a portion of the light-transmitting material layer LTM using the second hard mask HM2. The etched portion of the light-transmitting material layer LTM may overlap with the groove GRV in the third direction DR3. The method S1 may include forming a hole HOL in the etched portion of the light-transmitting material layer LTM. Thus, the light-transmitting layer LT may be formed.

[0235] Fifth, in step S150 of forming a light blocking material layer between and on the light transmitting layers, the method S1 may include: disposing a light blocking material layer LSM between and on the light transmitting layers LT. The light blocking material layer LSM may completely fill the inside of the hole HOL. In an example where the inside of the hole HOL is completely filled, a portion of the light blocking material layer LSM may overflow onto the light transmitting layer LT, so that the light blocking material layer LSM is even disposed on the light transmitting layer LT.

[0236] The light blocking material layer LSM may include a light blocking organic material, for example, a photosensitive resin capable of absorbing or shielding light, and may include an organic material including an organic black pigment such as carbon black.

[0237] Sixth, in the step S160 of forming the light blocking layer by removing the light blocking material layer disposed on the light transmitting layer, the method S1 may include removing the light blocking material layer LSM overflowing onto the light transmitting layer LT.

[0238] For example, the light blocking material layer LSM disposed on the light transmitting layer LT may be removed by a polishing process such as a chemical mechanical polishing (CMP) process. Therefore, the light blocking material layer LSM disposed between the light transmitting layers LT may be retained, and the light blocking layer LS may be formed. In some examples, only the light blocking material layer LSM disposed between the light transmitting layers LT may be retained, and the light blocking layer LS may be formed.

[0239] However, in some embodiments, in examples where the light blocking material layer LSM does not overflow onto the light transmitting layer LT in step S150 , step S160 may be omitted.

[0240] In the method S1 for manufacturing a display device according to one or more embodiments of the present disclosure, a groove GRV is formed that passes through at least a portion of the thin film encapsulation layer TFEL and at least a portion of the touch sensor layer TSU, so that the thickness H_LS of the light blocking layer LS can be increased. For example, since the thickness H_LS of the light blocking layer LS is increased, the viewing angle control characteristics of the light control layer LCL can be improved.

[0241] In some aspects, in the method S1 for manufacturing a display device according to one or more embodiments of the present disclosure, since the groove GRV is formed, the distance between the light blocking layer LS and the light emitting layer 172 in the third direction DR3 can be reduced. Therefore, the viewing angle control characteristics of the light control layer LCL can be improved.

[0242] In some aspects, in the method S1 for manufacturing a display device according to one or more embodiments of the present disclosure, as described herein, in an example in which the thickness H_LS of the light blocking layer LS is increased, the amount of the light-transmitting layer LT that is increased together with the thickness H_LS of the light blocking layer LS can be minimized. Since the increase amount of the light-transmitting layer LT is minimized, the amount of exhaust gas discharged due to heat can be minimized during the process of forming the light-transmitting layer LT. Therefore, the aspects of the method S1 described herein can prevent the film rupture phenomenon of the light-transmitting layer LT caused by the exhaust gas.

[0243] In some aspects, since the increase amount of the light-transmitting layer LT is minimized, the thickness of the second hard mask HM2 can be minimized during the patterning process of the light-transmitting layer LT. For example, since the increase amount of the light-transmitting layer LT is minimized, the increase in the thickness of the second hard mask HM2 can be minimized. As a result, bending of the display panel 100 due to the weight of the hard mask during the patterning process can be prevented.

[0244] Hereinafter, other embodiments of the display device according to the embodiment will be described. In the following embodiments, the same elements as those of the previous embodiments will be given the same reference numerals, and their redundant descriptions will be omitted or simplified, and the following description will be based on the differences from the previous embodiments.

[0245] Fig. 22 is a flowchart illustrating a method S2 for manufacturing a display device according to an embodiment. Fig.23 The diagram shows Fig. 22 sectional view of step S210. Fig.24 The diagram shows Fig. 22 FIG. 5 is a cross-sectional view of step S220 . Fig.25 The diagram shows Fig. 22 sectional view of step S230. Fig.26 The diagram shows Fig. 22 sectional view of step S240. Fig. 27 The diagram shows Fig. 22 sectional view of step S250.

[0246] refer to Figure 22 to Figure 27 , method S2 includes reference Fig.15The method S2 for manufacturing a display device according to one or more embodiments of the present disclosure is similar to the method S1 described in the reference. Fig.15 The method S1 for manufacturing a display device of the described embodiment is different in that the groove GRV is formed after forming the light-transmitting material layer LTM.

[0247] In more detail, the method S2 for manufacturing a display device according to an embodiment may include: a step S210 of preparing a display panel; a step S220 of forming a light-transmitting material layer on a touch sensor layer; a step S230 of forming a light-transmitting layer by forming a groove passing through at least a portion of the thin film encapsulation layer, at least a portion of the touch sensor layer, and the light-transmitting material layer; a step S240 of forming a light-blocking material layer (also referred to as a light-shielding material layer) between the light-transmitting layers (inside the groove) and on the light-transmitting layers; and a step S250 of forming a light-blocking layer by removing the light-blocking material layer disposed on the light-transmitting layer.

[0248] First, in step S210 of preparing a display panel, the method S2 may include: preparing a display panel 100 including a thin film encapsulation layer TFEL and a touch sensor layer TSU.

[0249] Second, in step S220 of forming a light-transmitting material layer on the touch sensor layer, method S2 may include: disposing a light-transmitting material layer LTM on the touch sensor layer TSU. The light-transmitting material layer LTM may be disposed on the upper surface of the touch sensor layer TSU. In an embodiment, the light-transmitting material layer LTM may be disposed on the entire upper surface of the touch sensor layer TSU.

[0250] Third, in step S230 of forming a light-transmitting layer by forming a groove passing through at least a portion of the thin film encapsulation layer, at least a portion of the touch sensor layer, and the light-transmitting material layer, method S2 may include: removing at least a portion of the light-transmitting material layer LTM, at least a portion of the thin film encapsulation layer TFEL, and at least a portion of the touch sensor layer TSU.

[0251] For example, the method S2 may include etching a portion of the light-transmitting material layer LTM, the second encapsulation layer TFE2 , the third encapsulation layer TFE3 , the first to third touch insulation layers SIL1 , SIL2 , and SIL3 , and the planarization layer PAS using the third hard mask HM3 .

[0252] Thus, a groove GRV passing through the light-transmitting material layer LTM, a portion of the second encapsulation layer TFE2 , the third encapsulation layer TFE3 , the first to third touch insulation layers SIL1 , SIL2 , and SIL3 , and the planarization layer PAS may be formed.

[0253] However, as described herein, since the depth of the groove GRV may be variously modified, the depth of the removed layer may be variously modified.

[0254] Fourth, in step S240 of forming a light blocking material layer between the light transmitting layers (inside the groove) and on the light transmitting layers, the method S2 may include: disposing a light blocking material layer LSM between the light transmitting layers LT and on the light transmitting layers LT.

[0255] For example, the light blocking material layer LSM may be completely filled between the light transmitting layers LT, for example, inside the groove GRV. In an example where the inside of the groove GRV is completely filled, a portion of the light blocking material layer LSM may overflow onto the light transmitting layer LT, so that the light blocking material layer LSM is even disposed on the light transmitting layer LT.

[0256] Fifth, in the step S250 of forming the light blocking layer by removing the light blocking material layer disposed on the light transmitting layer, the method S2 may include removing the light blocking material layer LSM overflowing onto the light transmitting layer LT.

[0257] For example, the light blocking material layer LSM disposed on the light transmitting layer LT may be removed by a polishing process such as a chemical mechanical polishing (CMP) process. Therefore, the light blocking material layer LSM disposed between the light transmitting layers LT may be retained, and the light blocking layer LS may be formed. In some examples, only the light blocking material layer LSM disposed between the light transmitting layers LT may be retained, and the light blocking layer LS may be formed.

[0258] However, in some embodiments, in examples where the light blocking material layer LSM does not overflow onto the light transmitting layer LT in step S240 , step S250 may be omitted.

[0259] In the method S2 for manufacturing a display device according to one or more embodiments of the present disclosure, since the display device includes a groove GRV passing through at least a portion of the thin film encapsulation layer TFEL and at least a portion of the touch sensor layer TSU, the thickness H_LS of the light blocking layer LS can be increased (in some cases, only the thickness H_LS of the light blocking layer LS is increased) without increasing the thickness H_LT of the light transmitting layer LT. Since the thickness H_LS of the light blocking layer LS is increased, the viewing angle control characteristics of the light control layer LCL can be improved.

[0260] In some aspects, in the method S2 for manufacturing a display device according to one or more embodiments of the present disclosure, since the groove GRV is formed, the distance between the light blocking layer LS and the light emitting layer 172 in the third direction DR3 can be reduced. Therefore, the viewing angle control characteristics of the light control layer LCL can be improved.

[0261] In the method S2 for manufacturing a display device according to one or more embodiments of the present disclosure, since the thickness H_LT of the light-transmitting layer LT is not increased, the amount of exhaust gas discharged due to heat can be minimized during the process of forming the light-transmitting layer LT. Therefore, various aspects of the method S2 described herein can prevent the film rupture phenomenon of the light-transmitting layer LT caused by the exhaust gas.

[0262] In some aspects, since the thickness H_LT of the light-transmitting layer LT is not increased, the thickness of the third hard mask HM3 may be minimized during the patterning process of the light-transmitting layer LT. For example, since the thickness H_LT of the light-transmitting layer LT is not increased, the thickness of the third hard mask HM3 may not be increased. As a result, bending of the display panel 100 due to the weight of the hard mask during the patterning process may be prevented.

[0263] Various embodiments supported by the present disclosure have been described herein with reference to the accompanying drawings, in which one or more example embodiments are illustrated. However, various aspects supported by the present disclosure may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Instead, these example embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the various example aspects of the present invention to those skilled in the art.

[0264] Terms such as first and second, etc., can be used to describe various components, but these components should not be limited by these terms. The terms used herein can distinguish a component from other components. For example, without departing from the scope of the present disclosure, a first component can be referred to as a second component, and similarly, a second component can also be referred to as a first component. Unless otherwise specified, a term in the singular form can include a plural form.

[0265] The terms used herein are only used to describe the purpose of specific embodiments, and are not intended to be limited. As used herein, "one", "the (described)" and "at least one" do not represent the limitation of quantity, and are intended to include both the singular and the plural, unless the context clearly states otherwise. For example, "an element" has the same meaning as "at least one element", unless the context clearly states otherwise. "At least one" should not be interpreted as limiting "one". "Or" means "and / or". As used herein, the term "and / or" includes any and all combinations of one or more related listed items. It will be further understood that when used in this specification, the terms "include" and / or "comprising" and their variants specify the presence of the features, regions, wholes, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, regions, wholes, steps, operations, elements, parts and / or their groups.

[0266] As used herein, the terms "about" or "approximately" include the stated value and include a suitable range of deviation for that particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the particular quantity. The term "about" can mean within one or more standard deviations, or, for example, within ±30%, ±20%, ±10%, ±5% of the stated value.

[0267] As used herein, the term "substantially" means approximately or substantially equal (e.g., within a threshold percentage of being equal). As used herein, the term "substantially simultaneously" means approximately or substantially simultaneous (e.g., within a threshold percentage of being equal). As used herein, the term "substantially the same" means approximately or substantially the same (e.g., within a threshold difference amount).

[0268] For ease of description, spatially relative terms such as "below", "below", "down", "above", and "above" may be used herein to describe the relationship of one element or feature to another (some) element or feature as illustrated in the figure. It will be understood that, in addition to the orientation depicted in the figure, the spatially relative terms are intended to cover different orientations of the device in use or operation. For example, if the device in the figure is turned over, the elements described as "below" or "below" other elements or features will then be oriented as "above" other elements or features. Therefore, the term "below" can cover both above and below. The device can be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially relative descriptors used in this article should be interpreted accordingly.

[0269] Embodiments are described herein with reference to cross-sectional illustrations as schematic illustrations of idealized embodiments. As such, variations in the illustrated shapes due to, for example, manufacturing techniques and / or tolerances are expected. Therefore, the embodiments described herein should not be construed as being limited to the specific shapes of the zones illustrated herein, but will include deviations in shapes caused by, for example, manufacturing. For example, a zone illustrated or described as flat may typically have rough and / or nonlinear features. In addition, the illustrated sharp corners may be rounded. Therefore, the zones illustrated in the accompanying drawings are schematic in nature, and their shapes are not intended to illustrate the precise shapes of the zones, and are not intended to limit the scope of the present disclosure.

[0270] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those commonly understood by those of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and the present disclosure, and will not be interpreted in an idealized or overly formal sense unless explicitly defined as such in this article.

[0271] It should be appreciated that the various embodiments of the present disclosure and the terms used herein are not intended to limit the technical features set forth herein to specific embodiments, but include various variations, equivalents or replacements for corresponding embodiments. With regard to the description of the accompanying drawings, similar reference numerals may be used to refer to similar or related elements. It will be understood that, unless the relevant context clearly indicates otherwise, the singular form of the noun corresponding to the project may include one or more things. As used herein, each of the terms such as "A or B", "at least one of A and B", "A, B or C" and "at least one of A, B and C" may include any one or all possible combinations of the items listed together in a corresponding term of these terms.

[0272] It will be understood that if an element (e.g., a first element) is referred to as being “coupled” or “connected” to, “coupled to” or “connected to” another element (e.g., a second element), with or without the term “operably” or “communicatively”, it means that the element can be coupled to the other element directly (e.g., wired), wirelessly, or via a third element.

[0273] At the end of the detailed description, those skilled in the art will appreciate that many changes and modifications may be made to the preferred embodiment without substantially departing from the principles of the present disclosure.Therefore, the disclosed exemplary embodiments are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

1. A display device, comprising: substrate; a light emitting element layer disposed on the substrate, the light emitting element layer comprising a plurality of light emitting elements configured to emit light; a light control layer, disposed on the light emitting element layer, the light control layer comprising a light-transmitting layer configured to transmit the light and a light-blocking layer configured to block the light; a first layer comprising at least one of a thin film encapsulation layer and a touch sensor layer, wherein the first layer is disposed between the light emitting element layer and the light control layer; and a groove extending through at least a portion of the first layer, Wherein, the light blocking layer is arranged in the groove.

2. The display device according to claim 1, wherein: The light blocking layer overlaps with the groove.

3. The display device according to claim 1, wherein: At least a portion of the light blocking layer is disposed in the groove.

4. The display device according to claim 1, wherein: The width of the groove is greater than the width of the light blocking layer.

5. The display device according to claim 4, wherein: At least a portion of the light-transmitting layer is disposed in the groove.

6. The display device according to claim 5, wherein: The light-transmitting layer is arranged in the groove between a side surface of the groove and a side surface of the light-blocking layer.

7. The display device according to claim 6, wherein: The side surface of the groove and the side surface of the light blocking layer do not directly contact each other in the groove.

8. The display device according to claim 1, wherein: The touch sensor layer includes at least one touch electrode, and The groove does not overlap with the touch electrode.

9. The display device according to claim 1, wherein: The width of the groove is equal to the width of the light blocking layer.

10. The display device according to claim 9, wherein: A side surface of the groove and a side surface of the light blocking layer are in direct contact with each other in the groove.

11. The display device according to claim 10, wherein: The light-transmitting layer is not disposed in the groove.

12. The display device according to claim 1, further comprising: The capping layer is arranged between the groove and the light control layer.

13. The display device according to claim 12, wherein: The capping layer covers the side surfaces and the bottom surface of the groove.

14. The display device according to any one of claims 1 to 13, further comprising: An outer coating layer is disposed on the light control layer.

15. The display device according to claim 1, wherein: A bottom surface of the groove overlaps the thin film encapsulation layer in a horizontal direction.

16. The display device according to claim 1, wherein: A bottom surface of the groove overlaps the touch sensor layer in a horizontal direction.

17. A method for manufacturing a display device, the method comprising: Prepare a display panel, the display panel comprising: a substrate; a light-emitting element layer disposed on the substrate, the light-emitting element layer comprising a plurality of light-emitting elements configured to emit light; and a first layer disposed on the light-emitting element layer, the first layer comprising at least one of a thin film encapsulation layer and a touch sensor layer; forming a groove through at least a portion of the first layer; forming a plurality of light-transmitting layers on the groove; and A light-blocking layer is formed between one light-transmitting layer and another light-transmitting layer among the plurality of light-transmitting layers, Wherein, the light blocking layer is arranged in the groove.

18. The method according to claim 17, wherein: The width of the groove is greater than the width of the light blocking layer.

19. A method for manufacturing a display device, the method comprising: A display panel is prepared, the display panel comprising: a substrate; a light-emitting element layer disposed on the substrate, the light-emitting element layer comprising a plurality of light-emitting elements configured to emit light; and a first layer disposed on the light-emitting element layer, the first layer comprising at least one of a thin film encapsulation layer and a touch sensor layer, forming a light-transmitting material layer on the first layer; forming a plurality of light-transmitting layers by forming grooves passing through at least a portion of the first layer and the light-transmitting material layer; and A light-blocking layer is formed between one light-transmitting layer and another light-transmitting layer among the plurality of light-transmitting layers, Wherein, the light blocking layer is arranged in the groove.

20. The method according to claim 19, wherein: The width of the groove is equal to the width of the light blocking layer.

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