Pixel defining layer preparation method

Abstract

The invention relates to a preparation method of a pixel defining layer, and aims to realize a colored pattern with a certain roughness value on an electrode substrate, so that stripping of a hole transport layer in a subsequent process is reduced, the reliability of a display is improved, and the service life of the display is prolonged. According to the present invention, when the post-baking treatment is performed, the surface flow is minimized at a high temperature, thereby having a certain roughness. According to the invention, the colored pattern with low water content is realized on the electrode substrate, so that the color becomes bright, the reliability of the display is improved, and the service life is prolonged. According to the present invention, the panel comprises the coloring agent, such that the water content after the post-baking treatment process is completed can achieve the minimum, and the sufficient heat and the sufficient time can be provided for the post-baking treatment step so as to achieve the minimum water generation in the panel state.

Description

[0001] Join by reference

[0002] This application claims the benefit of Korean Patent Application No. 10-2023-0130202, the entire contents of which are hereby incorporated by reference. Technical Field

[0003] The invention relates to a method for preparing a pixel defining layer of a light-emitting display device by utilizing a photosensitive composition. Background Art

[0004] Flat panel display devices widely use liquid crystal display devices (LCD: Liquid crystal display device), organic light emitting display devices (OLED: Organic light emitting display device), etc. Among them, organic light emitting display devices have the advantages of low power consumption, fast response speed, high color reproduction rate, high brightness, wide viewing angle, etc.

[0005] The purpose of using the polarizing film in the organic light emitting display device is to shield the light reflected from the panel after incident external light. However, the disadvantage is that due to the lack of bending properties, the polarizing film is not suitable for use in flexible devices.

[0006] In order to solve the above problems, it has been suggested to use color filters and black matrices and to form a light-shielding inorganic film on the upper substrate. However, this method has limitations in obtaining the desired level of anti-reflection effect, and no specific method for replacing the polarizing film is provided.

[0007] In addition, colored light shielding layers, especially black light shielding layers, are used in liquid crystal display devices to block color interference between red, green, and blue filters to improve image quality. Recently, in order to achieve the same purpose in organic light emitting displays and improve image visibility with low reflectivity, research is being conducted on how to use the colored light shielding layers.

[0008] When producing the colored pattern, not only a plurality of organic pigments but also carbon black and inorganic pigments are used as colorants, and a pigment dispersion prepared by mixing the same with other compositions is used to form a pattern.

[0009] When the organic light-emitting material is evaporated in the pattern thus formed, the hole transport layer HTL will be evaporated on the entire area of ​​the organic light-emitting display device, so the adhesion between the colored pattern is extremely important, and the colored pattern is used to divide the pixels. When the surface roughness (Roughness) of the colored pattern is low, the adhesion between the HTL material is low, so there is a high probability of peeling off in the subsequent evaporation process or peeling off due to external impact after the panel is formed, resulting in poor pixel quality. However, the colored pattern is not fully cross-linked in the post-baking process and has a high water content, so the water is removed by the post-baking process. Moreover, when the cross-linking is not sufficient in the post-baking process, external moisture will be absorbed instead. When there is a lot of water, problems such as pixel shrinkage, dark spots, and electrode oxidation will be caused, thereby shortening the life of the organic light-emitting display and reducing the brightness. Summary of the invention

[0010] Issues to be solved

[0011] In order to solve the above-mentioned drawbacks of the conventional technology, an implementation example of the present invention realizes a coloring pattern with a certain value of surface roughness on the electrode substrate. Therefore, after the hole transport layer (HTL) is evaporated, no peeling phenomenon will occur, and the reliability of the display can be improved and the life can be extended.

[0012] That is, after the post-baking treatment, when the roughness value of the colored pattern is low, the peeling of the hole transport layer may become a cause of pixel failure. Therefore, when the post-baking treatment is performed, it is set at a high temperature to minimize the flow of the surface.

[0013] Furthermore, an embodiment of the present invention aims to realize a coloring pattern with low water content and low moisture absorption rate on an electrode substrate, which can not only make the color clear but also improve the reliability and extend the life of the display.

[0014] That is, when the moisture content of the panel after post-baking is above 50ppm, it may become a cause of pixel shrinkage, resulting in reduced brightness and shortened life. Therefore, in order to minimize the moisture content after the post-baking process, it is necessary to fully remove the moisture in the post-baking step to block the absorption of external moisture and minimize the generation of moisture in the panel state.

[0015] Yet another implementation example provides an organic light emitting display device including a pixel defining layer prepared by the method.

[0016] Yet another implementation example provides an electronic device including the organic light emitting display device.

[0017] Problem Solution

[0018] The pixel defining layer preparation method according to the present invention comprises the steps of: coating and coating a photosensitive composition; pre-baking; exposure; development; and post-baking treatment. Preferably, the post-baking treatment step is carried out in an oven at 210°C to 300°C for 30 minutes to 120 minutes, the water content after the post-baking treatment step is below 50 ppm, and the surface roughness value is 1.48 nm to 3.0 nm.

[0019] Further preferably, the oven temperature of the post-baking step is 230 to 270°C.

[0020] More preferably, the post-baking step is performed for 60 minutes to 120 minutes.

[0021] Further preferably, after the post-baking treatment, the surface roughness is 1.48 nm to 2.7 nm.

[0022] Preferably, the photosensitive composition comprises a colorant.

[0023] Preferably, the colorant comprises one or more of an inorganic dye, an organic dye, an inorganic pigment and an organic pigment.

[0024] Preferably, the content of the colorant in the total amount of the photosensitive composition is 1 to 40 wt %.

[0025] Preferably, the colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

[0026] Preferably, the average particle size of the colorant is 20 nm to 110 nm.

[0027] Preferably, the photosensitive composition comprises a pattern forming resin, and the pattern forming resin comprises an acrylic binder resin, a cardo binder resin or a combination thereof.

[0028] Preferably, the acrylic binder resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

[0029] Preferably, the cardo-based binder resin includes a repeating structure represented by the following chemical formula 1:

[0030] <Chemical Formula 1>

[0031]

[0032] In the chemical formula 1,

[0033] 1) R 1 and R 2independently of one another: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group; C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0034] 2) R 1 and R 2 Rings can be formed between adjacent groups.

[0035] 3) m or n is independently an integer from 0 to 4,

[0036] 4) A 1 and A 2 Independently of each other, it is the following Chemical Formula 2 or Chemical Formula 3,

[0037] <Chemical Formula 2>

[0038]

[0039] <Chemical formula 3>

[0040]

[0041] In the chemical formula 2 and the chemical formula 3,

[0042] 4-1)* indicates the connected parts,

[0043] 4-2) R 3 ~R 6 independently of one another: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group;

[0044] C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0045] 4-3) R 3 ~R 6 Rings can be formed between adjacent bases.

[0046] 4-4)Y 1 and Y 2 Independently of each other, they are the following chemical formulas: Chemical formula 6 or Chemical formula 7,

[0047] <Chemical Formula 6>

[0048]

[0049] <Chemical Formula 7>

[0050]

[0051] In the chemical formula 6 and the chemical formula 7,

[0052] 4-4-1)* indicates the bonding position,

[0053] 4-4-2)R 9 is hydrogen or methyl ester;

[0054] 4-4-3)R 10 ~R 13 independently of one another: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group;

[0055] C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0056] 4-4-4)L 1 ~L 3 are independently: a single bond; a fluorenyl group; C 2 ~C 30 Alkylene; C 6 ~C 30 Arylene; C 2 ~C 30 Heterocyclic ring; C 1 ~C 30 Alkoxylene; C 2 ~C 30Alkyleneoxy; C 6 ~C 30 aryloxy group; C 2 ~C 30 The polyethyleneoxy group,

[0057] 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3,

[0058] 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein in the polymer chain, A 1 and A 2 The ratio is 9:1 to 1:9,

[0059] 6)X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5,

[0060] 6-1) R' and R" are independently: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group;

[0061] C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0062] 6-2) R' and R" can form a ring between adjacent groups,

[0063] <Chemical Formula 4>

[0064]

[0065] <Chemical Formula 5>

[0066]

[0067] In the chemical formula 4 and the chemical formula 5,

[0068] 6-3)* indicates the bonding position,

[0069] 6-4) R 7 ~R 8 independently of one another: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group;

[0070] C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0071] 6-5) o and p are independently integers from 0 to 4,

[0072] 7)X 2 It is C6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group; C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0073] 8) R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 may be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted with C 1 ~C 30 Alkyl group or C 6 ~C 30 aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C 1 ~C 30 Alkylthio group; C 1 ~C 30Alkoxy group; C 6 ~C 30 Aryl alkoxy group; C 1 ~C 30 Alkyl group; C 2 ~C 30 Alkenyl group; C 2 ~C 30 Alkinyl group; C 6 ~C 30 aryl group; C substituted with deuterium 6 ~C 30 aryl group; fluorenyl group; C 2 ~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C 3 ~C 30 Aliphatic ring group; C 7 ~C 30 Aryl alkyl group; C 8 ~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0074] Preferably, the weight average molecular weight of the cardo resin is 1,000 to

[0075] 100,000 g / mol.

[0076] Preferably, the content of the cardo-based resin in the total amount of the photosensitive composition is 1 to 30 weight %.

[0077] Preferably, as described above, the photosensitive composition comprises: the reactive unsaturated compound in an amount of 1 to 40 wt % in the total amount thereof.

[0078] Preferably, the photosensitive composition comprises: a photoinitiator in an amount of 0.01 to 10 wt % based on the total amount of the photosensitive composition.

[0079] In yet another specific example, preferably, the present invention provides a pixel defining layer prepared by the preparation method.

[0080] In yet another specific example, preferably, the present invention provides an organic light emitting display device including the pixel defining layer.

[0081] In yet another specific example, preferably, the present invention provides an electronic device, which includes the display device and a control unit for driving the display device.

[0082] Effects of the Invention

[0083] The purpose of the present invention is to realize a coloring pattern with a certain roughness value on an electrode substrate, thereby reducing the peeling of the hole transport layer (HTL) in the subsequent process, and improving the reliability and extending the life of the display. That is, after the post-baking treatment, when the roughness value of the pattern is low, it will become a cause of the peeling of the hole transport layer and pixel failure (pixel off) leading to a reduction in life. Therefore, when the present invention implements the post-baking treatment, it is placed at a high temperature to minimize the flow of the surface, thereby obtaining a certain roughness.

[0084] In addition, the present invention realizes a coloring pattern with low water content on the electrode substrate, thereby making the color vivid while improving the reliability and extending the life of the display. That is, after the post-baking process, when the water content in the panel is 50ppm or more, it may become a cause of pixel shrinkage, resulting in reduced brightness and shortened life. Therefore, the colorant of the present invention is included to minimize the water content after the post-baking process, thereby minimizing the shortening of life caused by moisture in the panel state. BRIEF DESCRIPTION OF THE DRAWINGS

[0085] Figure 1 and Figure 2 It is a schematic diagram of the water content of the pixel defining layer described in comparative examples 7 to 12.

[0086] Figures 3 to 6 This is a schematic diagram of the water content of the pixel definition layer described in Examples 13 to 24. DETAILED DESCRIPTION

[0087] Hereinafter, some embodiments of the present invention will be described in detail with reference to the schematic diagrams. When components of each drawing are denoted by reference symbols, the same components are given the same symbols as much as possible even if they are shown in other drawings.

[0088] In the process of describing the present invention, if it is considered that the detailed description of the relevant known structure or function will confuse the main points of the present invention, the detailed description thereof may be omitted. When the present invention adopts "including", "having", "comprising", etc., other parts may be added unless "to only" is used. When the constituent elements are expressed in the singular, unless otherwise clearly stated, the case of expressing them in the plural is included.

[0089] Furthermore, in describing the components of the present invention, terms such as first, second, A, B, (a), (b), etc. may be used. These terms are only used to distinguish the components from other components, and the nature, order, sequence or number of the components are not limited by these terms.

[0090] In the process of describing the positional relationship of constituent elements, when it is mentioned that two or more constituent elements are "connected", "combined" or "accessed", it should be understood that the two or more constituent elements can be directly "connected", "combined" or "accessed", but can also be further "carried with" the two or more constituent elements and other constituent elements to achieve "connection", "combination" or "access". Among them, the other constituent elements can include one or more of the two or more constituent elements that are "connected", "combined" or "accessed" to each other.

[0091] Furthermore, when a component such as a layer, film, region, or plate is located “on” or “over” another component, it should be understood that it includes not only the case where it is located “directly above” another component, but also the case where there is another component in between. Conversely, when a component is located “directly above” another part, it should be understood that there is no other part in between.

[0092] When describing the time flow relationship related to constituent elements, working methods, or manufacturing methods, for example, when describing the time sequence relationship or process sequence relationship such as "after", "next to", "then", "before", etc., since "immediately" or "directly" is not used, discontinuous situations can be further included.

[0093] In addition, when referring to the numerical value of a constituent element or the information corresponding thereto, even if not clearly stated separately, it should be interpreted that the numerical value or the information corresponding thereto includes: the error range caused by various factors (for example, engineering factors, internal or external impact, noise, etc.).

[0094] Unless otherwise described, the terms used in this specification and the appended claims are as follows within the scope that does not depart from the spirit of the present invention.

[0095] Unless otherwise described, the term "halo" or "halogen" used in the present application includes fluorine (F), chlorine (Cl), bromine (Br) and iodine (I).

[0096] Unless otherwise described, the term "alkyl" or "alkyl group" used in this application contains 1 to 60 carbon atoms connected by single bonds, and refers to a free radical of a saturated aliphatic functional group represented by a straight chain alkyl group, a branched chain alkyl group, a cycloalkyl (alicyclic) group, an alkyl-substituted cycloalkyl group, and a cycloalkyl-substituted alkyl group.

[0097] Unless otherwise described, the term "haloalkyl group" or "halogenalkyl group" used in the present application refers to an alkyl group substituted with halogen.

[0098] Unless otherwise described, the term "alkenyl" or "alkynyl" used in the present application respectively has a double bond or a triple bond, contains a straight chain or a side chain, and has 2 to 60 carbon atoms, but is not limited thereto.

[0099] Unless otherwise described, the term "cycloalkyl" used in the present application means a cyclic alkane having 3 to 60 carbon atoms, but is not limited thereto.

[0100] The term "alkoxy group" or "alkyloxy group" used in the present application refers to an alkyl group to which an oxygen radical is bonded, and unless otherwise specified, has 1 to 60 carbon atoms, but is not limited thereto.

[0101] The term "alkenoxyl group", "alkenoxygroup", "alkenyloxyl group" or "alkenyloxy group" used herein means an alkenyl group to which an oxygen radical is bonded, and unless otherwise specified, has 2 to 60 carbon atoms, but is not limited thereto.

[0102] Unless otherwise specified, the terms "aryl group" and "arylene group" used in this application have 6 to 60 carbon atoms, respectively, but are not limited thereto. In this application, aryl groups or arylene groups include monocyclic types, cyclopolymers, and fused polycyclic compounds. For example, the aryl group may include a phenyl group, a monovalent functional group of biphenyl, a naphthalene group, a cyclopentane ...

[0103] The arylene group may include a monovalent functional group of naphthalene, a fluorenyl group and a substituted fluorenyl group. The arylene group may include a fluorenylene group and a substituted fluorenylene group.

[0104] The term "ring assemblies" used in the present application is composed of two or more ring systems (single ring or fused ring systems) directly connected by a single bond or a double bond, indicating that the number of directly connected rings is less than the total number of ring systems contained in the compound by 1. The ring assemblies can be directly connected by the same or different ring systems through a single bond or a double bond.

[0105] In the present application, the aryl group includes a cyclopolymer, and thus, the aryl group includes biphenyl and terphenyl connected by a single bond to a benzene ring as a monocyclic aromatic. In addition, the aryl group also includes a compound in which an aromatic ring system combined with an aromatic monocyclic ring is connected by a single bond, and thus, for example, a compound in which an aromatic ring system combined with a benzene ring as an aromatic monocyclic ring, i.e., fluorene, is connected by a single bond.

[0106] The term "fused polycyclic ring system" used in this application refers to a fused ring that shares at least two atoms, including: a fused form of two or more hydrocarbon ring systems and a fused form of at least one heterocyclic ring system containing at least one heteroatom. The fused polycyclic ring system can be an aromatic ring, an aromatic heterocyclic ring, an aliphatic ring, or a combination of such rings. For example, an aryl group can be a naphthyl group, a phenanthrenyl group, a fluorenyl group, etc., but it is not limited thereto.

[0107] The term "spiro compound" used in the present application has a 'spiro union', which means that two rings share only one atom to form a connection. In this case, the atom shared by the two rings is called a 'spiro atom', and according to the number of spiro atoms contained in one compound, it is called a 'monospiro-', 'dispiro-', 'trispiro-' compound, respectively.

[0108] Unless otherwise described, the terms "fluorenyl group", "fluorenylene group" and "fluorene-triyl group" used in this application respectively represent monovalent, divalent or trivalent functional groups in which R, R', R" and R'" are all hydrogen in the following structures, and "substituted fluorenyl group", "substituted fluorenyl group" or "substituted fluorene-triyl group" means that at least one of the substituents R, R', R", R'" is a substituent other than hydrogen, including the case where R and R' are bonded to each other and form a spiro compound together with the carbon to which they are bonded. In this specification, the fluorenyl group, fluorenylene group and fluorene-triyl group may be named as fluorenyl group without considering the equivalent number of monovalent, divalent and trivalent.

[0109]

[0110] Furthermore, the R, R', R" and R'" may be independently selected from: an alkyl group having 1 to 20 carbon atoms, an alkenyl group having 1 to 20 carbon atoms, an aryl group having 6 to 30 carbon atoms, or a heterocyclyl group having 2 to 30 carbon atoms. For example, the aryl group may be phenyl, biphenyl, naphthalene, anthracene or phenanthrene, and the heterocyclyl group may be pyrrole, furan, thiophene, pyrazole, imidazole, triazole, pyridine, pyrimidone, pyridazine, pyrazine, triazine, indole, benzofuran, or the like. For example, the substituted fluorenyl group and the fluorenylene group may be monovalent or divalent functional groups of 9,9-dimethylfluorene, 9,9-diphenylfluorene, and 9,9'-spirobi [9H-fluorene], respectively.

[0111] The term "heterocyclyl group" used in this application includes not only aromatic rings such as "heteroaryl group" or "heteroarylene group", but also non-aromatic rings. Unless otherwise described, they respectively represent rings containing one or more heteroatoms and having a carbon number of 2 to 60, but are not limited thereto. Unless otherwise described, the term "heteroatom" used in this application represents N, O, S, P or Si, and heterocyclyl group represents a monocyclic type, cyclopolymer, fused polycyclic system, spiro compound, etc. containing heteroatoms.

[0112] For example, a "heterocyclyl group" can also replace a ring carbon, including: the following compounds, containing SO 2 , P=O and other heteroatom terminal groups.

[0113]

[0114] The term "ring" used in the present application includes monocyclic and polycyclic rings, and of course, hydrocarbon rings include heterocyclic rings, the heterocyclic rings contain at least one heteroatom, and include aromatic and non-aromatic rings.

[0115] The term "polycyclic" as used in this application includes ring assemblies such as biphenyl and terphenyl and fused polycyclic systems and spiro compounds, including not only aromatic but also non-aromatic rings. Of course, hydrocarbon rings include heterocyclic rings that contain at least one heteroatom.

[0116] The term "aliphatic cyclo group" used in this application refers to cyclic hydrocarbons other than aromatic hydrocarbons, including monocyclic types, cyclopolymers, fused polycyclic systems, spiro compounds, etc., and unless otherwise specified, refers to a ring with a carbon number of 3 to 60, but is not limited thereto. For example, when fused aromatic cyclobenzene and non-aromatic cyclohexane are also equivalent to aliphatic rings.

[0117] Furthermore, when prefixes are used consecutively, it means that the substituents are arranged in the order of the description. For example, aryl alkoxy group means an alkoxy group substituted with an aryl group, alkoxy carbonyl group means a carbonyl group substituted with an alkoxy group, and aryl carbonyl alkenyl group means an alkenyl group substituted with an arylcarbonyl group, wherein aryl carbonyl group is a carbonyl group substituted with an aryl group.

[0118] Furthermore, unless otherwise expressly described, in the term "substituted or unsubstituted" used in the present application, "substituted" means substituted with one or more substituents selected from the group consisting of deuterium, halogen, amino group, nitrile group, nitro group, C 1 ~C 30 Alkyl group, C 1 ~C 30 Alkoxy group, C 1 ~C 30 Alkyl amine group, C 1 ~C 30 alkyl thiophene group, C 6 ~C 30 arylthiophene group, C 2 ~C 30 The alkenyl group, C 2 ~C 30 Alkinyl group, C 3 ~C 30 Cycloalkyl group, C 6 ~C 30 aryl group, C substituted with deuterium 6 ~C 30 The aryl

[0119] group), C 8 ~C 30 aryl alkenyl group, silane

[0120] group), boron, germanium and C 2 ~C 30 The heterocyclic group, the C 2 ~C 20 The heterocyclic group includes at least one heteroatom selected from the group consisting of O, N, S, Si and P. And, it is not limited by the substituents thereof.

[0121] In the present application, the 'functional group name' corresponding to the aryl group, arylene group, heterocyclyl group, etc. described in each label and its substituent examples can be recorded as 'functional group name reflecting valence' or as 'name of the parent compound'. For example, 'phenanthrene' as an aryl group' can be classified and recorded as the name of the 'group' according to the valence, such as recording the monovalent 'group' as 'phenanthryl (group)' and recording the divalent 'group' as 'phenanthryl (group)', etc. However, it can also be recorded as the name of the parent compound 'phenanthrene' without considering the valence.

[0122] Similarly, pyrimidone can be recorded as 'pyrimidone' regardless of the valence, or recorded as pyrimidinyl (base) when it is monovalent, and can be recorded as the 'name of the base' of the corresponding valence when it is divalent, such as pyrimidinylene (base), etc. Therefore, in the present application, when the type of substituent is recorded as the name of the parent compound, it can represent: an n-valent 'base' formed by the desorption of hydrogen atoms bonded to carbon atoms and / or heteroatoms of the parent compound.

[0123] In addition, in the present specification, when describing the names of compounds or substituents, the numbers or alphabets indicating the positions may be omitted.

[0124] In the present invention, benzofuran[2,3-d]pyrimidone is recorded as pyrido pyrimidone, benzofuran[2,3-d]pyrimidone is recorded as benzo furanpyrimidone, 9,9-dimethyl-9H-fluorene is recorded as dimethylfluorene, etc. Therefore, benzo[g]quinoxaline or benzo[f]quinoxaline can be recorded as benzo quinoxaline.

[0125] Furthermore, unless otherwise specified, the chemical formulae used in this application are also subject to the definitions of substituents according to the index definitions of the following chemical formulae.

[0126]

[0127] Wherein, when a is an integer of 0, it indicates that the substituent R 1 When a is 0, the carbon atoms forming the benzene ring are all bonded with hydrogen atoms. In this case, the symbol of the hydrogen atoms bonded with carbon atoms can be omitted and the chemical formula or compound can be recorded. 1 When a is an integer of 2 or 3, the bonding can be as follows. When a is an integer of 4 to 6, it can also be bonded to the carbon of the benzene ring by a similar method. When a is an integer of 2 or more, R 1 Can be the same or different.

[0128]

[0129] In the present application, unless otherwise described, forming a ring means that adjacent groups are bonded to each other to form a monocyclic ring or a fused polycyclic ring. The monocyclic ring and the fused polycyclic ring formed include not only hydrocarbon rings but also heterocyclic rings. The heterocyclic ring contains at least one heteroatom and may include aromatic and non-aromatic rings.

[0130] In addition, in this specification, unless otherwise described, when a condensed ring is represented, in the term "number-condensed ring", the number represents the number of condensed rings. For example, a condensed form of three rings can be represented as a 3-condensed ring, such as anthracene, phenanthrene, benzo quinozoline, etc.

[0131] In addition, unless otherwise described, the term "bridged bicyclic compound" used in the present application refers to a compound in which two rings share three or more atoms to form a ring. In this case, the shared atoms may include carbon or heteroatoms.

[0132] In the present application, an organic electrical element refers to a component(s) between an anode and a cathode, or refers to an organic light emitting diode including anode and cathode and a component(s) therebetween.

[0133] Furthermore, depending on the circumstances, the display device of the present application refers to an organic electrical element, an organic light emitting diode and a panel including the same, or an electronic device including a panel and a circuit. For example, the electronic device includes all lighting devices, solar cells, portable or mobile terminals (for example, smart phones, tablet computers, PDAs, electronic dictionaries, PMPs, etc.), navigation terminals, game consoles, various TVs, various computer displays, etc., but is not limited thereto, and any form of device is acceptable as long as it includes the aforementioned (several) components.

[0134] Hereinafter, an implementation example of the present invention will be described in detail. However, this is for illustrative purposes only and the present invention is not limited thereto. The present invention is only defined by the scope of the following claims.

[0135] According to an implementation example of the present invention, a composition including a colorant may be used to prepare a red pattern, a green pattern, a blue pattern or a black matrix, and a pixel definition layer (PDL).

[0136] According to an implementation example of the present invention, the black pixel defining layer (PDL) may further include an additional colorant in addition to the colorant contained in the colorant, that is, an organic black pigment or a black dye. For example, the organic pigment can be used alone or mixed with the organic pigment and the coloring pigment. The advantage at this time is that, due to the mixed coloring pigment with insufficient light-shielding property, even if the amount of the colorant is relatively increased, the strength of the film (layer) or the adhesion of the substrate will not decrease. According to an implementation example of the present invention, the negative pixel defining layer (Negative PDL (Pixel define layer)) may include an additional colorant, that is, a black pigment or a black dye, to replace the colorant contained in the colorant.

[0137] Hereinafter, each component is described in detail.

[0138] 1. The preparation process of the negative pixel defining layer is as follows.

[0139] (1) Coating and coating steps

[0140] The photosensitive composition is a low-viscosity liquid reagent. In order to form a coating with a certain thickness after coating on a substrate, a spin coater or a slit coater is used. The advantage of a spin coater is that the higher the number of rotations, the thinner the thickness, but the flatness deviation in the area is reduced. In order to form a coating on a large-area substrate, a slit coater is preferably used compared to a spin coater, but its disadvantage is that after the coating is formed, the surface exhibits fluidity due to the residual solvent, resulting in a decrease in flatness. In order to overcome this drawback, VCD (vacuum chamber dry) is used to locally remove the solvent to reduce the fluidity of the surface.

[0141] (2) Pre-baking step

[0142] This process uses a hot plate or oven to heat the substrate of the coating at a certain temperature and time to partially remove the solvent contained in the coating film. If the surface or deep part of the coating film is not dry, it will cause photomask contamination when the next process is exposed. When irradiated with ultraviolet light, the exposed part is not well cured. If it is not cured, it will cause the development process to not form and remove the pattern.

[0143] (3) Exposure Step

[0144] When the pre-baking process is completed, the process uses a photomask with a pattern to irradiate actinic rays (ultraviolet rays) to cure the formed film. The types of lamps that generate actinic rays include LED lamps or metal (mercury) lamps, and the wavelengths include g-line (436nm), h-line (405nm), i-line (365nm), and Deep UV (<260nm), which can be used separately or in combination.

[0145] (4) Development step

[0146] When the exposure step irradiates actinic rays, the photomask is divided into an exposed part and a non-exposed part. In the case of a positive type, the exposed part is dissolved by a developer, while the non-exposed part resists the developer and leaves a pattern. In the case of a negative type, the exposed part is cured and resistant to the developer, while the non-exposed part is developed. The black pixel defining layer (Black PDL) prepared using a composition containing the colorant of the present invention is a negative type, which can be divided into an exposed part (cured) and a non-exposed part (developed) to form a pattern.

[0147] (5) Post-baking step

[0148] In this process, the developed substrate is heated at a high temperature of 230°C or above to remove residual solvent and moisture. If the process does not completely remove the solvent and moisture, the residual solvent and moisture in the process will affect the components after the post-baking treatment, thereby causing black spots or shrinkage of pixels, which will affect the life of the components.

[0149] In the present invention, the oven temperature of the post-baking step is 210 to 300° C., and more preferably, the treatment is performed at an oven temperature of 230 to 270° C. Moreover, the treatment time of the post-baking step is 30 to 120 minutes, and more preferably, 60 to 120 minutes.

[0150] Preferably, after the post-baking step, the surface roughness is 1.48 nm to 3.0 nm.

[0151] More preferably, the surface roughness value is 1.48 nm to 2.7 nm.

[0152] In the present invention, the water content after the post-baking step is 50 ppm or less, preferably 40 ppm or less, and more preferably 30 ppm or less.

[0153] 2. The composition for forming the negative pixel defining layer including the colorant is as follows.

[0154] (1) Pattern forming resin

[0155] According to an embodiment of the present invention, the pattern forming resin may include a cardo-based binder resin.

[0156] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including one or more acrylic repeating units.

[0157] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer containing one or more carboxyl groups, and specific examples thereof include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof. The content of the first ethylenically unsaturated monomer in the total amount of the acrylic binder resin may be 5 wt % to 50 wt %, for example, 10 wt % to 40 wt %.

[0158] The second ethylenically unsaturated monomer may be an aromatic vinyl compound such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether, etc.; an unsaturated carboxylic acid ester compound such as methyl (meta)acrylate, ethyl (meta)acrylate, butyl (meta)acrylate, 2-hydroxyethyl (meta)acrylate, 2-hydroxybutyl (meta)acrylate, benzyl (meta)acrylate, cyclohexyl (meta)acrylate, benzene (meta)acrylate, etc.; an unsaturated carboxylic acid aminoalkyl ester compound such as 2-aminoethyl (meta)acrylate, 2-dimethylaminoethyl (meta)acrylate, etc.; a carboxylic acid vinyl ester compound such as vinyl acetate; an unsaturated carboxylic acid glycidyl ester compound such as glycidyl (meta)acrylate, a vinyl cyanide compound such as (meta)acrylonitrile, an unsaturated amide compound such as (meta)acrylamide, etc., and the like may be used alone or in combination of two or more.

[0159] Specific examples of the acrylic binder resin include: (meta) acrylic acid / benzyl methacrylate copolymer, (meta) acrylic acid / benzyl methacrylate / styrene copolymer, (meta) acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meta) acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, etc., but it is not limited to this. They can also be used alone or in combination of two or more. The weight average molecular weight of the acrylic binder resin can be 3,000 g / mol to 150,000 g / mol, for example, 5,000 g / mol to 50,000 g / mol, for example, 20,000 g / mol to 30,000 g / mol.

[0160] The cardo-based resin includes a repeating structure represented by the following Chemical Formula 1.

[0161] <Chemical Formula 1>

[0162]

[0163] In the chemical formula 1,

[0164] 1) R 1 and R 2 independently of one another: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group; C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C20 Alkoxy carbonyl group,

[0165] 2) R 1 and R 2 Rings can be formed between adjacent bases.

[0166] 3) m or n is independently an integer from 0 to 4,

[0167] 4) A 1 and A 2 Independently of each other, it is the following Chemical Formula 2 or Chemical Formula 3,

[0168] <Chemical Formula 2>

[0169]

[0170] <Chemical formula 3>

[0171]

[0172] In the chemical formula 2 and the chemical formula 3,

[0173] 4-1)* indicates the connected parts,

[0174] 4-2) R 3 ~R 6 independently of one another: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group;

[0175] C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0176] 4-3) R 3 ~R 6 Rings can be formed between adjacent bases.

[0177] 4-4)Y 1 and Y 2 Independently of each other, it is the following Chemical Formula 6 or Chemical Formula 7,

[0178] <Chemical Formula 6>

[0179]

[0180] <Chemical Formula 7>

[0181]

[0182] In the chemical formula 6 and the chemical formula 7,

[0183] 4-4-1)* indicates the bonding position,

[0184] 4-4-2)R 9 is hydrogen or methyl ester;

[0185] 4-4-3)R 10 ~R 13 independently of one another: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group;

[0186] C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0187] 4-4-4)L 1 ~L 3 are independently: a single bond; a fluorenyl group; C 2 ~C 30 Alkylene; C 6 ~C 30 Arylene; C 2 ~C 30 Heterocyclic ring; C 1 ~C 30 Alkoxylene; C 2 ~C 30 Alkyleneoxy; C 6 ~C 30 aryloxy group; C 2 ~C 30 The polyethyleneoxy group,

[0188] 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3,

[0189] 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein in the polymer chain, A 1 and A 2 The ratio is 9:1 to 1:9,

[0190] 6)X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5,

[0191] 6-1) R' and R" are independently: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P;2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group;

[0192] C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0193] 6-2) R' and R" can form a ring between adjacent groups,

[0194] <Chemical Formula 4>

[0195]

[0196] <Chemical Formula 5>

[0197]

[0198] In the chemical formula 4 and the chemical formula 5,

[0199] 6-3)* indicates the bonding position,

[0200] 6-4) R 7 ~R 8 independently of one another: hydrogen; deuterium; halogen; C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group;

[0201] C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C 20 Alkoxy carbonyl group,

[0202] 6-5) o and p are independently integers from 0 to 4,

[0203] 7)X 2 It is C 6 ~C 30 an aryl group; a C containing at least one heteroatom selected from O, N, S, Si and P; 2 ~C 30 Heterocyclyl group; C 6 ~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C 1 ~C 20 Alkyl group; C 2 ~C 20 Alkenyl group; C 2 ~C 20 Alkinyl group; C 1 ~C 20 Alkoxy group; C 6 ~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C 1 ~C20 Alkoxy carbonyl group,

[0204] 8) R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 may be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted with C 1 ~C 30 Alkyl group or C 6 ~C 30 aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group, C 1 ~C 30 Alkylthio group; C 1 ~C 30 Alkoxy group; C 6 ~C 30 Aryl alkoxy group; C 1 ~C 30 Alkyl group; C 2 ~C 30 Alkenyl group; C 2 ~C 30 Alkinyl group; C 6 ~C 30 aryl group; C substituted with deuterium 6 ~C 30 aryl group; fluorenyl group; C 2 ~C 30 A heterocyclic group comprising at least one heteroatom selected from the group consisting of O, N, S, Si and P; C 3 ~C 30 Aliphatic ring group; C 7 ~C 30Aryl alkyl group; C 8 ~C 30 and combinations thereof, and adjacent substituents may form a ring.

[0205] The R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 When it is an aryl group, preferably, it can be C 6 ~C 30 The aryl group, further preferably, may be C 6 ~C 18 The aryl group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, etc.

[0206] The R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 When it is a heterocyclic group, preferably, it can be C 2 ~C 30 The heterocyclic group (heterocyclyl group), further preferably, can be C 2 ~C 18 The heterocyclyl group may be, for example, dibenzo furan, dibenzothiophene, naphtho benzo thiophene, naphtho benzofuran, or the like.

[0207] The R', R", R 1 ~R 8 and R 10 ~R 13When it is a fluorenyl group, preferably, it may be 9,9-dimethyl-9H-fluorene, 9,9-diphenyl-9H-fluorenyl, 9,9'-spirobifluorene, or the like.

[0208] The L 1 ~L 3 When it is an arylene group, preferably, it can be C 6 ~C 30 The arylene group, further preferably, may be C 6 ~C 18 The arylene group may be, for example, phenyl, biphenyl, naphthyl, terphenyl, or the like.

[0209] The R', R", X 2 , R 1 ~R 8 and R 10 ~R 13 When it is an alkyl group, preferably, it can be C 1 ~C 10 The alkyl group may be, for example, a methyl group, a t-butyl group, or the like.

[0210] The R', R", X 2 , R 1 ~R 8 and R 10 ~R 13 When it is an alkoxy group, preferably, it can be C 1 ~C 20 The alkoxy group, further preferably, may be C 1 ~C 10 The alkoxy group may be, for example, methoxy, t-butoxy, or the like.

[0211] The R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 The ring formed by bonding adjacent groups of6 ~C 60 Aromatic ring group; fluorenyl group; C containing at least one hetero atom among O, N, S, Si and P 2 ~C 60 or C 3 ~C 60 For example, when adjacent groups are bonded to each other to form an aromatic ring, preferably, C 6 ~C 20 The aromatic ring may preferably form a C 6 ~C 14 The aromatic ring can form, for example, benzene, naphthalene, phenanthrene, etc.

[0212] For example, the cardo resin can be prepared by mixing two or more of the following components: fluorene-containing compounds such as 9,9-bis(4-oxiranemethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic dianhydride, naphthalenetetracarboxylic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, pyromellitic dianhydride, cyclobutanetetracarboxylic dianhydride, perylenetetracarboxylic dianhydride, tetrahydrofurantetracarboxylic dianhydride, and tetrahydrophthalic anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; ethanol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol monomethyl ether acetate and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and ammonium or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyldiethylammonium, triethylammonium, tributylammonium, and benzyltriethylammonium chloride.

[0213] The weight average molecular weight of the cardo resin is 1,000 to 100,000 g / mol, preferably 1,000 to 50,000 g / mol, and more preferably 1,000 to 30,000 g / mol. If the weight average molecular weight of the resin is included in the range, no residue is generated when preparing the light-shielding layer, the pattern forming effect is good, and there is no loss in film thickness during development, and a good pattern can be obtained. In the total amount of the photosensitive resin composition, the content of the resin is 1 to 30% by weight, and more preferably, the content can be 3 to 20% by weight. When the content of the resin is included in the range, excellent sensitivity, developability and adhesion (tightness) can be obtained.

[0214] (2) Reactive unsaturated compounds

[0215] The reactive unsaturated compound is an essential component of the negative pattern and has an ethylene unsaturated double bond. Therefore, when the pattern forming process is exposed, it can initiate sufficient polymerization to form a pattern with excellent heat resistance, light resistance and chemical resistance.

[0216] Specific examples of the reactive unsaturated compound include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, 1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol triacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, bisphenol A epoxy acrylate, ethylene glycol monomethyl ether acrylate, trimethylolpropane triacrylate, tripentaerythritol octaacrylate, and the like.

[0217] Commercially available products of the reactive unsaturated compound are, for example, the following.

[0218] For example, the difunctional esters of (meth)acrylic acid include: aronyx M-210, M-240, M-6200, etc. from Toa Synthetic Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, R-604, etc. from Nippon Chemical Co., Ltd.; V-260, V-312, V-335HP, etc. from Osaka Organic Chemical Industry Co., Ltd.

[0219] For example, the trifunctional esters of (meth)acrylic acid include: aronyx M-309, M-400, M-405, M-450, M-7100, M-8030, M-8060, etc. of Toa Synthetic Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, DPCA-60, DPCA-120, etc. of Nippon Chemical Co., Ltd.; V-295, V-300, V-360, etc. of Osaka Organic Chemical Industry Co., Ltd.

[0220] The above products can be used alone or in combination of two or more.

[0221] In order to have a better developability, the reactive unsaturated compound may be used after being treated with an acid anhydride. In the total amount of the photosensitive resin composition, the content of the reactive unsaturated compound may be 1 to 40% by weight, for example, 1 to 20% by weight. When the content of the reactive unsaturated compound is included in the range, sufficient curing is induced when the pattern forming process is exposed, so that the reliability is excellent, the heat resistance, light resistance and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent.

[0222] (3) Photoinitiator

[0223] In order to present a negative pattern through a photolithography machine, a photoradical initiator is required. The molar absorption coefficient of the photoinitiator in the 330 to 380 nm region is 10,000 (L / mol·cm) or more, and the temperature at which the photoinitiator loses 5% by weight is below 200°C. The molar absorption coefficient can be calculated by the beer-Lambert Law. In addition, the weight loss was detected by TGA in a nitrogen atmosphere at a rate of 5°C per minute to 300°C.

[0224] The photopolymerization initiator is generally used in a photosensitive resin composition, and for example, acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, triazine compounds, etc. may be used.

[0225] For example, the acetophenone compounds include: 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butane-1-one, etc.

[0226] For example, the benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.

[0227] For example, the thioxanthone compounds include thioxanthone, 2-chlorothiazolone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chlorothioxanthone and the like.

[0228] For example, the benzoic acid ketone-based compounds include benzoic acid ketone, benzoic acid ketone methyl ether, benzoic acid ketone ethyl ether, benzoic acid ketone isopropyl ether, benzoic acid ketone isobutyl ether, benzyl dimethyl ketal, and the like.

[0229] For example, the triazine compounds include: 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, (Trichloromethyl)-s-triazine, 2-biphenyl 4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-ol)-4,6-bis(trichloromethyl)-s-triazine, 2-4-trichloromethyl (piperonyl)-6-triazine, 2-4-trichloromethyl (4'-methoxyphenylvinyl)-6-triazine, etc.

[0230] In addition to compounds, the photoinitiator may also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, and the like.

[0231] The photoinitiator is a free radical polymerization initiator, and may be a peroxide compound, an azobis compound, or the like.

[0232] For example, the peroxide compounds include: ketone peroxides such as methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, acetylacetone peroxide, etc.; diacyl peroxides such as isobutyryl peroxide, 2,4-dichlorobenzoyl peroxide, o-methylbenzoyl peroxide, di-3,5,5-trimethylhexanoyl peroxide, etc.; hydroperoxides such as 2,4,4,-trimethylpentyl-2-hydroperoxide, diisopropylbenzene hydroperoxide, isopropylbenzene hydroperoxide, t-butyl hydroperoxide, etc.; diisopropylbenzene peroxide, 2,5-dimethyl-2,5-di(t-butylperoxide) dialkyl peroxides such as butyl peroxy (butyl) hexane, 1,3-bis (t-butoxyisopropyl) benzene, t-butyl peroxy valerate, etc.; alkyl succinates such as 2,4,4-trimethylpentyl peroxy phenoxy acetate, α-peroxy neodecanoate cumyl, t-butyl peroxy benzoic acid, di-t-butyl peroxy trimethyl adipic acid, etc.; percarbonates such as di-3-methoxy butyl peroxy dicarbonate, di-2-ethylhexyl peroxy dicarbonate, bis-4-t-cyclohexyl peroxy dicarbonate, diisopropyl peroxy dicarbonate, acetyl peroxy cyclohexyl sulfonyl, t-butyl peroxy carbonate, etc.

[0233] For example, the azobis compounds include: 1,1'-azobiscyclohexane-1-carbonitrile, 2,2'-azobis(2,4-dimethylvaleronitrile), 2,2,-azobis(methyl isobutyrate), 2,2'-azobis(4-methoxy-2,4-dimethylvaleronitrile), α,α'-azobis(isobutyronitrile) and 4,4'-azobis(4-cyanovaleric acid).

[0234] After the photoinitiator absorbs light and transitions to an excited state, it transfers its energy and is used together with a photosensitizer that undergoes a chemical reaction. For example, the photosensitizer includes: triethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate, and the like.

[0235] The content of the photoinitiator in the total amount of the photosensitive composition may be 0.01 to 10% by weight, for example, 0.1 to 5% by weight. When the content of the photoinitiator is within the above range, sufficient curing is induced when the pattern forming process is exposed, so that the reliability is excellent, the heat resistance, light resistance and chemical resistance of the pattern are excellent, and the clarity and adhesion are also excellent. In addition, the reduction of transmittance caused by the unreacted initiator can be prevented.

[0236] (4) Colorant

[0237] Both organic pigments and inorganic pigments and dyes can be used as the colorant.

[0238] The colorant may be a red pigment, a green pigment, a blue pigment, a yellow pigment, a black pigment, or the like.

[0239] For example, the red pigment includes: CI red pigment 254, CI red pigment 255, CI red pigment 264, CI red pigment 270, CI red pigment 272, CI red pigment 177, CI red pigment 89 and the like.

[0240] For example, the green pigment includes: halogen-substituted copper phthalocyanine pigments, such as CI green pigment 36, CI green pigment 7, and the like.

[0241] For example, the blue pigment includes copper phthalocyanine pigments such as CI blue pigment 15:6, CI blue pigment 15, CI blue pigment 15:1, CI blue pigment 15:2, CI blue pigment 15:3, CI blue pigment 15:4, CI blue pigment 15:5, and CI blue pigment 16.

[0242] For example, the yellow pigment includes isoindoline pigments such as CI yellow pigment 139, quinophthalone pigments such as CI yellow pigment 138, nickel composite pigments such as CI yellow pigment 150, and the like.

[0243] For example, the black pigment includes lactam black, aniline black, perylene black, titanium black, carbon black and the like.

[0244] Furthermore, according to an implementation example, the colorant in the photosensitive resin composition may include a pigment, a dye, or a combination thereof. For example, the dye may include a phthalocyanine compound.

[0245] The above components can be used alone or in combination of two or more as the pigment and dye, but are not limited thereto.

[0246] The black pigment in the above components can be used to effectively shield the light from the light shielding layer. When the black pigment is used, it can also be used together with a color-correcting agent such as anthraquinone pigments, perylene pigments, phthalocyanine pigments, and azo pigments.

[0247] In order to disperse the pigment on the photosensitive resin composition, a dispersant may be used together. Specifically, the pigment may be used after surface pretreatment with a dispersant, or, when preparing the photosensitive resin composition, a dispersant may be added together with the pigment before use.

[0248] The dispersant may be a nonionic dispersant, anionic dispersant, cationic dispersant, etc. Specific examples of the dispersant include polyalkylene glycol and its esters, polyoxyalkylene, oxyalkylene polyol ester additives, alcohol alkylene oxide additives, sulfonic acid esters, sulfonic acid salts, carboxylates, carboxylates, oxyalkylene alkylamide additives, alkyl amines, etc., which may be used alone or in combination of two or more.

[0249] The dispersant products on sale include, for example, DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001, etc. produced by BYK;

[0250] EFKA-47, EFKA-47EA, EFKA-48, EFKA-49, EFKA-100, EFKA-400, EFKA-450, etc. from EFKA Chemical Company; Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse17000, Solsperse 20000, Solsperse 24000GR, Solsperse27000, Solsperse 28000, etc. from Zeneka Company; or PB711, PB821, etc. from Ajinomoto Company.

[0251] The content of the dispersant in the total amount of the photosensitive resin composition may be 0.1 wt % to 15 wt %. When the content of the dispersant is within the above range, the composition has excellent dispersibility, and accordingly, when preparing a light shielding layer, the stability, developability and patternability are excellent.

[0252] The pigment can also be pre-treated with a water-soluble inorganic salt and a wetting agent before use. When the pigment is used after the pre-treatment, the average particle size of the pigment can be refined.

[0253] The pretreatment is achieved by kneading the pigment together with a water-soluble inorganic salt and a wetting agent; and then filtering and washing the pigment obtained in the kneading step.

[0254] The kneading may be performed at a temperature of 40° C. to 100° C., and the filtering and washing may be performed by washing the inorganic salt with water or the like and filtering.

[0255] For example, the water-soluble inorganic salts include sodium chloride, potassium chloride, etc., but are not limited thereto.

[0256] The wetting agent uniformly mixes the pigment and the water-soluble inorganic salt, thereby playing the role of a medium that makes the pigment easy to crush. For example, the wetting agent includes: alkylene glycol monoalkyl ethers such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, and diethylene glycol monomethyl ether; alcohols such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, and glycerin polyethylene glycol, and the like. These can be used alone or in combination of two or more.

[0257] The pigment after the kneading step may have an average particle size of 100 nm or less. When the average particle size of the pigment is within the above range, not only heat resistance and light resistance are excellent, but also a fine pattern can be effectively formed.

[0258] The content of the pigment in the total amount of the photosensitive resin composition may be 1% to 40% by weight, more specifically, 17% to 35% by weight. When the pigment is included within the above range, the color reproduction rate is excellent, and the curability and adhesion of the pattern are also excellent.

[0259] (5) Solvent

[0260] The solvent is compatible with the cardo-based resin, the reactive unsaturated compound, the pigment, the cardo-based compound, and the initiator, and a non-reactive substance may be used.

[0261] For example, the solvent includes: alcohols such as methanol and ethanol; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, anisole, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; ethyl acetate glycol ethers such as methoxyethyl acetate, ethoxyethyl acetate, and diethoxyethyl acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol Propylene glycol alkyl ether acetates such as methyl ether acetate and propylene glycol propyl ether acetate; aromatic hydrocarbons such as toluene and xylene; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-di-n-amyl ketone, 2-heptanone; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate; lactic acid esters such as methyl lactate and ethyl lactate; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, methyl oxyacetate, butyl oxyacetate; methoxy Alkoxyacetic acid alkyl esters such as methyl acetate, methoxyethyl acetate, methoxybutyl acetate, ethoxymethyl acetate, ethoxyethyl acetate, etc.; 3-oxopropionic acid alkyl esters such as methyl 3-oxopropionate, ethyl 3-oxopropionate, etc.; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; 2-oxopropionic acid alkyl esters such as methyl 2-oxopropionate, ethyl 2-oxopropionate, propyl 2-oxopropionate, etc.; methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, etc. 2-alkoxypropionic acid alkyl esters such as ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate; 2-oxy-2-methylpropionic acid esters such as methyl 2-oxy-2-methylpropionate and ethyl 2-oxy-2-methylpropionate; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; esters such as ethyl 2-hydroxypropionate, ethyl 2-hydroxy-2-methylpropionate, ethyl hydroxyacetate, methyl 2-hydroxy-3-methylbutanoate; keto acid esters such as ethyl pyruvate, etc.

[0262] In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and ethylene glycol phenyl acetate can be used.

[0263] Taking into account the compatibility and reactivity of the solvent, glycol ethers such as ethylene glycol monoethyl ether (ethylene glycolmonoethyl ether); ethylene glycol acetate alkoxy ethers such as ethoxyethyl acetate; ethers such as ethyl 2-hydroxypropionate; carbitols such as diethylene glycol monomethyl ether; propylene glycol alkyl ether acetates such as propylene glycol methyl ether acetate and propylene glycol propyl ether acetate can be used.

[0264] In the total amount of the photosensitive resin composition, the solvent may be included as a balance, specifically, the content may be 40 to 90% by weight. When the content of the solvent is included in the range, the photosensitive resin composition may have an appropriate viscosity, thereby achieving excellent processability when preparing a pattern layer.

[0265] (6) Other additives

[0266] In order to prevent the occurrence of marks or spots, improve the leveling performance and prevent the generation of residues due to undevelopment when applying the photosensitive composition, the photosensitive composition may further contain additives such as malonic acid; 3-amino-1,2-propanediol; a silane coupling agent containing a vinyl or (meth)acryloxy group; a leveling agent; a fluorine-based surfactant; and a free radical polymerization initiator.

[0267] For example, in order to improve adhesion to a substrate, the photosensitive resin composition may further include a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group.

[0268] For example, the silane coupling agent includes trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltrioxysilane, γ-glycidyloxypropyltrimethoxysilane, β-epoxycyclohexylethyltrimethoxysilane, etc., which can be used alone or in combination of two or more.

[0269] The weight part of the silane coupling agent may be 0.01 parts by weight to 10 parts by weight in 100 parts by weight of the photosensitive resin composition. When the weight part of the silane coupling agent is within the above range, the adhesion and storage properties are excellent.

[0270] Furthermore, the photosensitive resin composition may further include a surfactant, such as a fluorine-based surfactant, as required. The surfactant has the effects of improving coating properties and preventing defects.

[0271] The fluorine-based surfactant can be the following fluorine-based surfactants available on the market: etc.; Megaface F from Dainippon Ink & Chemicals Co., Ltd. Megaface F Megaface F

[0272] Megaface F Mekafac F etc.; Fluorad from Sumitomo 3M Co., Ltd. etc.; Saffron from Asahi Glass Co., Ltd. etc.; Toray Silicon Co., Ltd. wait.

[0273] In 100 parts by weight of the photosensitive resin composition, the weight of the surfactant can be 0.001 parts by weight to 5 parts by weight. When the weight of the surfactant is within the range, the coating uniformity can be ensured, no streaking occurs, and the wettability of the glass substrate is excellent. In addition, the photosensitive resin composition can be added with a certain amount of antioxidants, stabilizers and other additives within the range that does not damage the physical properties.

[0274] In another implementation example, the photosensitive resin composition can be used to perform patterning on a pixel separation portion of an organic light emitting element electrode.

[0275] Hereinafter, the synthesis examples and examples of the present invention will be described in detail, but the synthesis examples and examples of the present invention are not limited thereto.

[0276] (Preparation of black photosensitive composition)

[0277] Synthesis Example 1: (Chemical formula 8 represents the preparation of 9,9-Bis[4-(glycidyloxy)phenyl]fluorene)

[0278] 20 g of 9,9'-bisphenol fluorene (Sigma Aldrich), 8.67 g of glycidyl chloride (Sigma Aldrich), 30 g of anhydrous potassium carbonate and 100 ml of dimethylformamide were poured into a 300 ml 3-necked round-bottom flask equipped with a distillation tube, heated to 80°C, and reacted for 4 hours, then cooled to 25°C, and the reaction liquid was filtered. Then, the filtrate was stirred and dropped into 1000 ml of water, and the precipitated powder was filtered, then washed with water, reduced pressure at 40°C and dried to obtain the following compound 8 represented by 9,9-bis(4-epoxypropyloxyphenyl)fluorene (9,9-Bis[4-

[0279] The purity of the powder was determined by HPLC analysis, and the result showed that the purity was 98%.

[0280] <Chemical Formula 8>

[0281]

[0282] Synthesis Example 2: Preparation of Cardo-based binder resin

[0283] 25 g (54 mmol) of compound 1 obtained in Synthesis Example 1, 8 g of acrylic acid (Oi Kakin Co., Ltd.), 0.2 g of benzyl triethylammonium chloride (Oi Kakin Co., Ltd.), 0.2 g of hydroquinone (Oi Kakin Co., Ltd.) and 52 g of propylene glycol methyl ether acetate (Sigma Aldrich Co., Ltd.) were poured into a 300 ml 3-neck round bottom flask equipped with a distillation tube, and stirred at 110° C. for 6 hours. After the reaction was completed, 8 g of biphenyltetracarboxylic dianhydride (Mitsubishi Gas Co., Ltd.) and 1.8 g of tetrahydrophthalic acid (Sigma Aldrich Co., Ltd.) were further poured, and then stirred at 110° C. for 6 hours. After the reaction was completed, the reaction solution was recovered and analyzed, and as a result, a cardo-based binder resin having a molecular weight of 4,580 and a solid powder content of 45% was obtained.

[0284] Preparation Example 1: Preparation of black pigment dispersion

[0285] Using a paint shaker (Asada), 15 g of Irgaphor Black S100CF (black pigment / BASF), 8.5 g of Disperbyk 163 (BYK), 6.5 g of SR-3613 (SMS), 70 g of propylene glycol methyl ether acetate, and 100 g of zirconia beads with a diameter of 0.5 mm (Toray) were dispersed for 10 hours to obtain a dispersion.

[0286] The photosensitive composition solution was prepared using the components in Table 1 below.

[0287] Specifically, an initiator is dissolved in a solvent, and then stirred at room temperature, wherein a binder resin and a polymerizable compound are added, and stirred at room temperature. Then, a colorant and other additives are added to the obtained reactant, and stirred at room temperature. Then, the resultant is filtered three times to remove impurities, and a photosensitive resin composition is prepared.

[0288]

Table 1

[0289]

[0290]

[0291] The method for preparing a negative pixel definition layer (negative PDL) using the photosensitive composition is as follows.

[0292] (1) Coating and coating steps

[0293] On a cleaned and metal-evaporated 10cm*10cm substrate, a photosensitive composition is coated with a specific thickness using a spin coater, and then a portion of the solvent is removed using a vacuum chamber dry (VCD) to form a coating film. The thickness of the coating of the photosensitive composition after VCD is 2.0 microns to 1.7 microns.

[0294] (2) Pre-baking step

[0295] The obtained coating film is heated at 80° C. to 120° C. for 50 to 200 seconds on a hot plate to remove the solvent contained in the obtained coating film. This process removes a certain amount of solvent so as to reduce the mask contamination of the pixel morphology when implementing the next process (exposure) step and prepare a clean pattern.

[0296] (3) Exposure Step

[0297] A mask of a given shape is interspersed on the coating film obtained above to form a desired pattern and a certain thickness. Then, 190nm to 600nm actinic rays are irradiated by an exposure machine. Preferably, a metal or LED light source with ghi-line can be irradiated to form a pattern. The exposure amount for pattern formation is 20 to 150mJ / cm 2 The photoresist material of the negative type has a transmittance of three sections, namely, 0% (non-exposed part), 20 to 50% (half-tone), and 100% (full-tone), to form a pattern.

[0298] (4) Development step

[0299] After the exposure step is implemented, the image is then developed by dipping using a 2.38wt% developer of TMAH (tetramethylhydroxyammonium) at 23±2°C for a certain time (minutes), the development time being 30 to 60 seconds, and then rinsed with deionized water (DI water) to dissolve and remove the unexposed parts, leaving only the exposed parts to form an image pattern.

[0300] (5) Post-baking step

[0301] In order to obtain the image pattern obtained by the development, post baking was carried out in an oven at 210 to 300° C. for 30 to 120 minutes to completely remove the solvent and deionized water (DI water) absorbed by the coating film in the development step, solidify the pattern to form a film, and then detect the roughness and water content.

[0302] (6) Surface roughness testing

[0303] The evaluation substrate including a negative pixel definition layer was used as a sample for roughness detection. The negative pixel definition layer was formed by coating, exposing, developing and post-baking a composition containing a colorant on a glass surface. The physical properties of the evaluation substrate were detected using an atomic force microscope (AFM, parksystems / XE-100) in non-contact mode with a scan rate of 0.3 (Hz) and a set point (11.26nm) for an area of ​​2μm x 2μm.

[0304] (7) Hole transport layer evaporation and adhesion evaluation

[0305] After forming the coloring pattern through the preparation process, the hole transport layer (HTL) was evaporated with a thickness of 120 to 140 nm using an evaporator. After forming 100 sections on the evaporated test piece by cross-cutting, the NICHIBAN peeling tape (CT-24) was pasted on the section without bubbles. When implementing the tape peeling, the UTM (QM 100S) equipment of Coretech Korea was used, fixed on a 90° fixture, and peeled at a constant force of 300 mm / min. The number of tearing of the section before and after the peeling test was detected to confirm the adhesion.

[0306]

Table 2

[0307]

[0308]

[0309] After the post-baking step, the substrate obtained in the process was used to compare the surface roughness and the film peeling (adhesion) with the hole transport layer (HTL). Referring to Comparative Examples 1 to 6 in Table 2 above, it was confirmed that the surface roughness was less than 1.48 nm with the increase of the post-baking temperature and time. After the post-baking treatment, when the surface roughness was reduced to less than 1.48 nm, as described above, the adhesion with the hole transport layer (HTL) was reduced, resulting in an increase in the number of peelings.

[0310] (8) Water content detection

[0311] The photosensitive composition described in Example 1 was used to form a pattern on a substrate through the above steps (1), (2), (3), (4) and (5), and then the water content of an area of ​​10 cm x 10 cm was detected. The coating thickness was 1.45 to 1.55 μm after the post-baking treatment, and the weight of the photosensitive composition coated on the 10 cm x 10 cm substrate and post-baking was 11 to 12 g. Using Brookfield's Vapor Pro XL, the moisture of the substrate was captured at 120°C for 5 minutes. Products made by changing the process conditions such as the development time and temperature of the development step, the heating temperature and heat treatment time of the post-baking step were used as samples, and the detection amount of each moisture test was compared.

[0312] (9) Component reliability evaluation

[0313] When comparing the outgassing detection amounts, the minimum and maximum outgassing detection amounts for each process condition were confirmed, and a patterned substrate of a pixel define layer (PDL) was formed according to each condition. Then, in order to evaluate the reliability of the components, organic materials were evaporated and reliability inspection factors such as high-temperature driving, pixel shrinkage, dark spots, and life time were confirmed.

[0314] (Preparation of Component Substrate)

[0315] like Figures 1 to 6 As shown, for the OLED element substrate, on the glass surface, The evaluation substrate is obtained by forming an electrode with a thickness of , and the evaluation substrate includes: on the electrode, a negative pixel definition layer is formed by coating, exposing, developing and post-baking a composition containing a colorant. The physical properties of the evaluation substrate are as follows: when tested by an ultraviolet spectrometer (UV-Vis. Spectrometer), the reflectivity at 550nm reaches more than 95%, and when the roughness of the ITO surface is tested by an atomic force microscope (AFM), it reaches less than 2nm.

[0316]

Table 3

[0317]

[0318]

[0319] The substrates obtained in the post-process of the post-baking step were tested and compared for moisture generation. From Comparative Examples 7 to 12 in Table 3 above, it can be confirmed that the post-baking temperature is low, so even if the post-baking time is increased, the moisture content after the post-baking is above 50 ppm. It has been confirmed that when the moisture content after the post-baking increases, Figure 1 As shown, black spots are generated during device driving. Reference Examples 13 to 24 confirm that black spots and life problems do not occur when the water content after post-baking is 50 ppm or less.

[0320] The above description is merely an example of the present invention, and a person skilled in the art in the art to which the present invention belongs can make various modifications without departing from the essential characteristics of the present invention.

[0321] Therefore, the embodiments disclosed in this specification are used to describe the present invention, rather than to limit the present invention, and the idea and scope of the present invention are not limited by such embodiments. The scope of the claims of the present invention should be interpreted according to the following claims, and should be interpreted as including all technologies within the scope equivalent thereto falling within the scope of the claims of the present invention.

Claims

1. A method for preparing a pixel defining layer, characterized in that: The invention comprises the steps of: coating and coating a photosensitive composition; pre-baking; exposure; development; and post-baking treatment, wherein the post-baking treatment step is carried out in an oven at 210° C. to 300° C. for 30 minutes to 120 minutes, the water content after the post-baking treatment step is below 50 ppm, and the surface roughness value is 1.48 nm to 3.0 nm.

2. The method for preparing a pixel defining layer according to claim 1, wherein: The oven temperature of the post-baking step is 230 to 270°C.

3. The method for preparing a pixel defining layer according to claim 1, wherein: The post-baking step is performed for 60 minutes to 120 minutes.

4. The method for preparing a pixel defining layer according to claim 1, wherein: After the post-baking treatment, the surface roughness is 1.48 nm to 2.7 nm.

5. The method for preparing a pixel defining layer according to claim 1, wherein: The photosensitive composition includes a colorant.

6. The method for preparing a pixel defining layer according to claim 5, characterized in that: The colorant includes one or more of an inorganic dye, an organic dye, an inorganic pigment and an organic pigment.

7. The method for preparing a pixel defining layer according to claim 5, wherein: The content of the colorant is 1 to 40% by weight in the total amount of the photosensitive composition.

8. The method for preparing a pixel defining layer according to claim 5, characterized in that: The colorant is pretreated with a dispersant; or a water-soluble inorganic salt and a wetting agent.

9. The method for preparing a pixel defining layer according to claim 5, characterized in that: The colorant has an average particle size of 20 nm to 110 nm.

10. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition includes a pattern forming resin, and the pattern forming resin includes an acrylic binder resin, a cardo binder resin, or a combination thereof.

11. The method for preparing a pixel defining layer according to claim 10, characterized in that: The acrylic binder resin has a weight average molecular weight of 3,000 g / mol to 150,000 g / mol.

12. The method for preparing a pixel defining layer according to claim 10, characterized in that: The cardo-based binder resin includes a repeating structure represented by the following chemical formula 1: <Chemical Formula 1> In the chemical formula 1, 1) R 1 and R 2 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 2) R 1 and R 2 Rings can be formed between adjacent groups. 3) m or n is independently an integer from 0 to 4, 4) A1 and A2 are independently of each other represented by the following chemical formula 2 or chemical formula 3, <Chemical Formula 2> <Chemical formula 3> In the chemical formula 2 and the chemical formula 3, 4-1)* indicates the connected parts, 4-2) R 3 ~R 6 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 4-3) R 3 ~R 6 Rings can be formed between adjacent groups. 4-4)Y 1 and Y 2 Independently of each other, it is the following Chemical Formula 6 or Chemical Formula 7, <Chemical Formula 6> <Chemical Formula 7> In the chemical formula 6 and the chemical formula 7, 4-4-1)* indicates the bonding position, 4-4-2)R 9 is hydrogen or methyl ester; 4-4-3)R 10 ~R 13 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 4-4-4)L 1 ~L 3 are independently: a single bond; a fluorenyl group; C2~C 30 Alkylene; C6~C 30 Arylene; C2~C 30 Heterocyclic ring; C1~C 30 Alkoxylene; C2~C 30 Alkyleneoxy; C6~C 30 aryloxy group; C2~C 30 The polyethyleneoxy group, 4-4-5) q and r are independently integers from 0 to 3; however, q+r=3, 5) The resin includes a repeating unit represented by Chemical Formula 1, wherein within the polymer chain, the ratio of A1 to A2 is 9:1 to 1:9, 6)X 1 is a single bond; O; CO; SO2; CR'R"; SiR'R"; the following chemical formula 4; or chemical formula 5, 6-1) R' and R" are independently: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 Heterocyclyl group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 6-2) R' and R" can form a ring between adjacent groups, <Chemical Formula 4> <Chemical Formula 5> In the chemical formula 4 and the chemical formula 5, 6-3)* indicates the bonding position, 6-4) R 7 ~R 8 Independently of each other: hydrogen; deuterium; halogen; C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 6-5) o and p are independently integers from 0 to 4, 7)X 2 It is C6~C 30 an aryl group; a C2-C 30 heterocyclic group; C6~C 30 A fused ring group of an aliphatic ring and an aromatic ring (cyclo group); C1~C 20 Alkyl group; C2~C 20 alkenyl group; C2~C 20 Alkinyl group; C1~C 20 Alkoxy group; C6~C 30 aryloxy group; fluorenyl group; carbonyl group; ether group; or C1~C 20 Alkoxy carbonyl group, 8) R', R", X 2 , L 1 ~L 3 , R 1 ~R 8 and R 10 ~R 13 may be further substituted with one or more substituents selected from the group consisting of the following components: deuterium; halogen; substituted or unsubstituted C1-C 30 Alkyl group or C6~C 30 aryl group, silane group, siloxane group, boron group, germanium group, cyano group, amino group, nitro group; C1~C 30 Alkylthio group; C1~C 30 Alkoxy group; C6~C 30 Aryl alkoxy group; C1~C 30 Alkyl group; C2~C 30 Alkenyl group; C2~C 30 Alkinyl group; C6~C 30 aryl group; C6~C 30 aryl group; fluorenyl group; C2~C 30 A heterocyclic group (heterocyclyl group), which contains at least one heteroatom (hetero atom) selected from the group consisting of O, N, S, Si and P; C3~C 30 Aliphatic ring group; C7~C 30 Aryl alkyl group; C8~C 30 and combinations thereof, and adjacent substituents may form a ring.

13. The method for preparing a pixel defining layer according to claim 10, characterized in that: The cardo-based resin has a weight average molecular weight of 1,000 to 100,000 g / mol.

14. The method for preparing a pixel defining layer according to claim 10, characterized in that: The content of the cardo-based resin in the total amount of the photosensitive composition is 1 to 30 weight %.

15. The method for preparing a pixel defining layer according to claim 1, wherein: The photosensitive composition includes: a reactive unsaturated compound in an amount of 1 to 40 wt % based on the total amount thereof.

16. The method for preparing a pixel defining layer according to claim 1, characterized in that: The photosensitive composition comprises: a photoinitiator in an amount of 0.01 to 10 wt % based on the total amount of the photosensitive composition.

17. A pixel defining layer prepared according to claim 1. 18 . An organic light emitting display device comprising the pixel defining layer according to claim 17 .

19. An electronic device, characterized in that: The invention comprises the display device according to claim 18 and a control unit for driving the display device.

Images