Sealing gasket forming method, sealing gasket forming die and sealing gasket forming device

Abstract

The invention relates to a sealing gasket forming method for forming a sealing gasket on a workpiece. The method comprises the following steps in this order: an application step for applying an active energy ray-curable liquid to a cavity (41) of a transparent molding die (40); and a bonding step for bonding the molding die (40) to which the active energy ray-curable liquid has been applied to a workpiece. A curing step in which the applied active energy ray-curable liquid is cured by irradiation with active energy rays; and a release step in which the cured active energy ray-curable liquid is released from the molding die (40) together with the workpiece. In the bonding step, when the workpiece and the molding die (40) are bonded via the active energy ray-curable liquid, a part of the active energy ray-curable liquid or a gas is discharged to the atmosphere from a communication path (44) communicating with the cavity (41). As a result, the peeling force for peeling the gasket from the molding die can be reduced, and the dimensional accuracy of the gasket can be made uniform.

Description

Technical Field

[0001] The invention relates to a sealing gasket forming method, a sealing gasket forming mould and a sealing gasket forming device. Background Art

[0002] As a member for sealing between two members, a gasket is known. Such a gasket is generally molded by injection molding in which a mold having a cavity having a desired shape is filled with a molding resin such as a thermoplastic resin.

[0003] On the other hand, as another gasket molding method, for example, Patent Document 1 describes applying a molding resin to a workpiece in advance, pressing it from above with a molding die having a cavity of a desired shape, and curing the molding resin to mold the gasket into a workpiece.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: Japanese Patent Application Publication No. 2017-015240 Summary of the invention

[0007] Problems to be solved by the invention

[0008] However, in the gasket molding method described in Patent Document 1, after the molding resin is applied to the workpiece, it is pressed by the molding die, so a part of the molding resin overflowing from the mold cavity will also intrude between the molding bonding surface of the workpiece and the molding die, and the height of the gasket will increase accordingly by the amount of its thickness, or the molding resin will be insufficient in other parts, and the overall dimensional accuracy will deteriorate, and deviations between products will also occur. In addition, if it intrudes between the molding bonding surface of the workpiece and the molding die, the peeling force when peeling off the molding die may also increase.

[0009] On the other hand, after the molding resin is applied to the mold cavity of the molding die, even if the mold resin is bonded to the workpiece, the molding resin overflowing from the mold cavity may sometimes intrude between the mold bonding surface of the workpiece and the molding die, causing the same phenomenon as described above (see Figure 7 ). It should be noted that Figure 7 In the formula, H is the height of the gasket at the design value, and α is the increase in the height of the gasket due to the molding resin intruding between the workpiece and the molding die.

[0010] Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a gasket molding method, a gasket molding die, and a gasket molding device capable of reducing a peeling force for peeling a gasket from a molding die.

[0011] Another object of the present invention is to provide a gasket molding method, a gasket molding die, and a gasket molding device capable of making the dimensional accuracy of the gasket uniform.

[0012] Methods for solving problems

[0013] (1) One embodiment of the present invention is a gasket forming method for forming a gasket on a workpiece, comprising, in sequence: a coating step of coating an active energy ray-curable liquid on an annular mold cavity of a transparent molding mold, a bonding step of bonding the molding mold coated with the active energy ray-curable liquid to the workpiece, a curing step of curing the coated active energy ray-curable liquid by irradiation with active energy rays, and a demolding step of peeling the cured active energy ray-curable liquid together with the workpiece from the molding mold; in the bonding step, when the workpiece and the molding mold are bonded via the active energy ray-curable liquid, a portion of the active energy ray-curable liquid or gas is discharged to the atmosphere from a connecting path connected to the mold cavity.

[0014] (2) In the above-mentioned method (1), the above-mentioned molding die may also have a retreat groove, which is closed together with the above-mentioned mold cavity when the above-mentioned workpiece and the above-mentioned molding die are bonded together via the above-mentioned active energy ray-curable liquid, and the above-mentioned retreat groove has a width wider than the width of the above-mentioned mold cavity and a depth shallower than the depth of the above-mentioned mold cavity, and is connected to the open end side of the above-mentioned mold cavity.

[0015] (3) Another embodiment of the present invention is a gasket forming method for forming a gasket on a workpiece, comprising, in sequence: a coating step of coating an active energy ray-curable liquid on an annular cavity of a transparent molding mold, a bonding step of bonding the molding mold coated with the active energy ray-curable liquid to the workpiece, a curing step of curing the coated active energy ray-curable liquid by irradiation with active energy rays, and a demolding step of peeling the cured active energy ray-curable liquid together with the workpiece from the molding mold; the molding mold has a retreat groove, which is closed together with the cavity when the workpiece is bonded to the molding mold via the active energy ray-curable liquid, the retreat groove having a width wider than the width of the cavity and a depth shallower than the depth of the cavity, and is connected to the open end side of the cavity.

[0016] (4) In any one of the aspects (1) to (3) above, the cavity may be provided in a protrusion that protrudes further in a normal direction of a molding and bonding surface of the molding die than the annular inner region and outer region.

[0017] (5) In any one of the aspects (1) to (4) above, the coating step may be performed using a dispenser.

[0018] (6) In any one of the aspects (1) to (5) above, the cavity may be subjected to a release coating.

[0019] (7) Another embodiment of the present invention is a gasket molding mold, which molds a gasket on a workpiece by applying an active energy ray-curable liquid and curing and transferring it, wherein the gasket molding mold has a mold cavity and a connecting path, the mold cavity is annularly closed and arranged on the molding surface according to the shape of the gasket, and can be filled with active energy ray-curable liquid, and the connecting path is connected to the mold cavity and connected to the atmosphere; when the workpiece and the molding mold are bonded together via the active energy ray-curable liquid, a portion of the active energy ray-curable liquid or gas is discharged from the connecting path.

[0020] (8) In the above-mentioned method (7), it is also possible that there is a retreat groove having a width wider than the width of the above-mentioned mold cavity and a depth shallower than the depth of the above-mentioned mold cavity, and the above-mentioned retreat groove is connected to the open end side of the above-mentioned mold cavity. When the above-mentioned workpiece is bonded to the above-mentioned molding surface via the above-mentioned active energy ray-curing liquid, the above-mentioned retreat groove is closed together with the above-mentioned mold cavity.

[0021] (9) Another embodiment of the present invention is a gasket molding mold, which molds a gasket on a workpiece by applying an active energy ray-curable liquid and curing and transferring it, wherein the gasket molding mold has a mold cavity and a retreat groove, the mold cavity is annularly closed according to the shape of the gasket and is arranged on the molding bonding surface, and can be filled with the active energy ray-curable liquid, the retreat groove is closed together with the mold cavity when the workpiece and the molding mold are bonded via the active energy ray-curable liquid, the retreat groove has a width wider than the width of the mold cavity, and has a depth shallower than the depth of the mold cavity, and is connected to the open end side of the mold cavity.

[0022] (10) In any one of the above aspects (7) to (9), the cavity may be provided in a protrusion that protrudes further in the normal direction of the molding surface than the annular inner region and outer region.

[0023] (11) In any one of the aspects (7) to (10) above, the cavity may be subjected to a release coating.

[0024] (12) Another embodiment of the present invention is a sealing gasket forming device, which comprises: a coating device for discharging an active energy ray-curing liquid by means of a dispenser, a bonding device comprising a transparent forming mold and bonding the workpiece to the forming mold, a driving device for moving the forming mold and the dispenser relative to each other, and an active energy ray irradiation device for irradiating the active energy ray-curing liquid with active energy rays; the forming mold has a mold cavity and a connecting path, the mold cavity is annularly closed and arranged on a forming bonding surface according to the shape of the sealing gasket, and can be filled with active energy ray-curing liquid, the connecting path is connected to the mold cavity and to the atmosphere; when the workpiece is bonded to the forming bonding surface via the active energy ray-curing liquid, a portion of the active energy ray-curing liquid or gas is discharged from the connecting path.

[0025] (13) Another embodiment of the present invention is a sealing gasket forming device, which comprises: a coating device for discharging an active energy ray-curing liquid by means of a dispenser, a bonding device comprising a transparent forming mold and bonding a workpiece to the above-mentioned forming mold, a driving device for moving the above-mentioned forming mold and the above-mentioned dispenser relative to each other, and an active energy ray irradiation device for irradiating the above-mentioned active energy ray-curing liquid with active energy rays; the above-mentioned forming mold comprises a cavity and a retreat groove, the cavity is annularly closed and arranged on the forming bonding surface according to the shape of the sealing gasket, and can be filled with the active energy ray-curing liquid, and the retreat groove is closed together with the above-mentioned cavity when the workpiece is bonded to the above-mentioned forming mold via the above-mentioned active energy ray-curing liquid; the above-mentioned retreat groove has a width wider than the width of the above-mentioned cavity and has a depth shallower than the depth of the above-mentioned cavity, and is connected to the open end side of the above-mentioned cavity.

[0026] Effects of the Invention

[0027] According to the present invention, it is possible to provide a gasket molding method, a gasket molding die, and a gasket molding device capable of reducing the peeling force for peeling a gasket from a molding die.

[0028] In addition, a gasket molding method, a gasket molding die, and a gasket molding device capable of making the dimensional accuracy of the gasket uniform can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 It is a schematic plan view showing a workpiece on which a gasket is molded.

[0030] Figure 2A 1 is a flowchart showing a gasket molding method according to an embodiment of the present invention.

[0031] Figure 2B It is an operation diagram showing the gasket molding method according to the embodiment of the present invention.

[0032] Figure 3A It is a schematic perspective view showing a molding die according to an embodiment of the present invention.

[0033] Figure 3B Yes Figure 3A A cross-sectional stereogram showing an enlarged view of area A in FIG.

[0034] Figure 4 It is a schematic cross-sectional view showing a fuel cell.

[0035] Figure 5 This is a flow chart showing a sealing method for sealing between two components.

[0036] Figure 6 It is a cross-sectional perspective view of a molding die showing a modified embodiment of the present invention.

[0037] Figure 7 This is a schematic cross-sectional view showing a gasket molded using a conventional molding die. DETAILED DESCRIPTION

[0038] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the embodiments of the present specification, the same reference numerals are given to the same components throughout the text.

[0039] First, before describing the gasket molding method according to the embodiment of the present invention, the workpiece 10 for molding the gasket 30 will be briefly described. Figure 1 It is a schematic plan view showing the workpiece 10 on which the gasket 30 is molded.

[0040] The workpiece 10 is one or the other part when two parts are assembled with each other via the gasket 30, and has a desired size and shape, and is made of metal such as iron, aluminum, stainless steel, magnesium, titanium, carbon, polyvinyl chloride, polyethylene naphthalate, polyethylene terephthalate, polyethylene, polypropylene, polycarbonate, and the like. It should be noted that the workpiece 10 of the present embodiment is a rectangular plate.

[0041] The workpiece 10 is formed with one or more openings 10a or one or more recesses 10b. The gasket 30 is formed around the openings 10a and recesses 10b. The workpiece 10 preferably has a flat surface on which the gasket 30 is formed, but may also have a gently inclined surface.

[0042] However, the workpiece 10 may not have the opening 10 a and the recess 10 b , and another member may have the opening 10 a and the recess 10 b .

[0043] Next, a gasket molding apparatus used in the gasket molding method according to the embodiment of the present invention will be briefly described.

[0044] The gasket molding device mainly includes a coating device, a laminating device, an XYZ axis driving device, an active energy ray irradiation device 60, a demolding device, and a control device.

[0045] The coating device can apply the liquid to the coating object, and it can be a coating device such as a dispenser, a sprayer, or a coating device for a coating method such as inkjet, screen printing, or gravure printing, among which a dispenser is preferred. The coating device of this embodiment is composed of a dispenser 50 that discharges the liquid from the nozzle toward the coating object, a tank or syringe that stores the liquid, and a pump that supplies the liquid. It should be noted that a rotating mechanism that rotates the nozzle around the Z axis can also be provided.

[0046] The bonding device may be a clamshell type bonding device composed of a fixed table holding one bonding object (molding mold 40), a movable table holding another bonding object (workpiece 10), and a flip driving mechanism that flips the movable table toward the fixed table and away from the fixed table. However, the structure of the bonding device is not limited to the clamshell type.

[0047] In addition, the laminating device also includes a CCD camera or other photographing device for photographing the laminating object, so that the position and inclination of the laminating object can be confirmed during laminating. Furthermore, the laminating device is also used as a demoulding device for separating the laminating object. However, the demoulding device and the laminating device can also be provided independently.

[0048] The XYZ axis driving device includes an X axis moving unit that moves the dispenser 50 in the left-right direction, a Y axis moving unit that moves the dispenser 50 in the front-back direction, and a Z axis moving unit that moves the dispenser 50 in the up-down direction. However, the XYZ axis driving device can be any combination as long as it can move the dispenser 50 relative to the coating object along the three-dimensional XYZ axis. For example, it can be composed of an XY table that holds the dispenser 50 and a Z table that holds the coating object.

[0049] The active energy ray irradiation device 60 irradiates light such as ultraviolet rays or electron beams having a wavelength of about 320 nm to 450 nm, and is configured as a linear light source or a planar light source by using a UV lamp or UV-LED.

[0050] In addition, if the active energy ray irradiation device 60 can irradiate with 500 mW / cm 2 Above and 5000mW / cm 2 Below, preferably 1500mW / cm 2 Above and 5000mW / cm 2Active energy rays with a peak illuminance of 0.5 or less are preferred because they can suppress the curing shrinkage of the active energy ray-curable liquid 20 and improve the dimensional stability. Furthermore, the accumulated light amount can be adjusted by setting the irradiation time.

[0051] The active energy ray irradiation device 60 is provided movably or fixedly relative to the coating object. However, the active energy ray irradiation device 60 may be provided behind the moving direction of the dispenser 50 to cure the liquid while coating the liquid.

[0052] The control device uniformly controls the coating device, the laminating device (demolding device), the XYZ axis driving device, and the active energy ray irradiation device 60, for example, by controlling the rotation speed (rotation speed, rotation angle) of the pump to adjust the discharge volume of the dispenser 50, or by controlling the rotation speed (rotation angle) of the flip driving unit to adjust the laminating load and the pressing amount, to perform load control or position control of the movable table, or drive each driving unit of the XYZ axis driving device to perform position control and speed control of the dispenser 50, or control the supply power of the active energy ray irradiation device 60 to adjust the irradiation output of the light source.

[0053] Next, a gasket molding method for molding the gasket 30 on the workpiece 10 using the active energy ray-curable liquid 20 will be described.

[0054] FIG. 2 shows a gasket forming method according to an embodiment of the present invention. Figure 2A It is a flow chart. Figure 2B It's an action picture.

[0055] The active energy ray-curable liquid 20 is an ultraviolet-curable resin that reacts and cures by irradiation with active energy rays (eg, ultraviolet rays), and may be, for example, a (meth)acrylate composition that undergoes radical polymerization or an epoxy composition that undergoes cation polymerization.

[0056] It should be noted that, in the present invention, "liquid" means liquid at 25°C. In addition, the viscosity of the active energy ray-curable liquid 20 at 25°C is not particularly limited, for example, it is 500Pa·s or less, preferably 0.01Pa·s or more and 400Pa·s or less, more preferably 0.1Pa·s or more and 350Pa·s or less, and particularly preferably 1Pa·s or more and 300Pa·s or less. In addition, the structural viscosity ratio of the active energy ray-curable liquid 20 at 25°C is not particularly limited, for example, it is 1.0 or more and 10 or less, preferably 1.1 or more and 8 or less, more preferably 1.3 or more and 7 or less, and particularly preferably 2.0 or more and 6 or less. By making these viscosities or structural viscosity ratios within the above range, it is more suitable for the gasket molding method of the present invention. The above viscosity and structural viscosity ratio can be obtained using a rheometer. In addition, the curing shrinkage of the active energy ray-curable liquid 20 is not particularly limited, for example, it is preferably 10% or less, and more preferably 2% to 10%.

[0057] As the above-mentioned (meth)acrylate composition for free radical polymerization, for example, a composition containing a (meth)acryloyl-containing oligomer, a (meth)acryloyl-containing reactive diluent, and a photoradical initiator can be cited. As the above-mentioned (meth)acryloyl-containing oligomer, there is no particular limitation, and for example, polycarbonate-based carbamate (meth)acrylate, polyether-based carbamate (meth)acrylate, polyester-based carbamate (meth)acrylate, castor oil-based carbamate (meth)acrylate, polybutadiene-based carbamate (meth)acrylate, hydrogenated polybutadiene-based carbamate (meth)acrylate, polyisobutylene-based (meth)acrylate, silicone-based (meth)acrylate, isoprene-based (meth)acrylate, hydrogenated isoprene-based (meth)acrylate, acrylic polymer containing (meth)acrylic group, etc., are cited, and polyisobutylene-based (meth)acrylate is particularly preferred. The reactive diluent containing a (meth)acryloyl group is not particularly limited, and examples thereof include ethyl (meth)acrylate, n-butyl (meth)acrylate, tert-butyl (meth)acrylate, isobutyl methacrylate, 2-ethylhexyl (meth)acrylate, isodecyl (meth)acrylate, glycidyl (meth)acrylate, lauryl (meth)acrylate, stearyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, cyclohexyl (meth)acrylate, tert-butylcyclohexyl (meth)acrylate, trimethylcyclohexyl (meth)acrylate, dicyclopentyl (meth)acrylate, dicyclopentenyl (meth)acrylate, and dicyclopentenyl (meth)acrylate. Pentenyloxy ester, isobornyl (meth)acrylate, adamantyl (meth)acrylate, benzyl (meth)acrylate, phenyl (meth)acrylate, phenoxyethyl (meth)acrylate, nonylphenoxyethyl (meth)acrylate, butoxyethyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, acryloyl morpholine, morpholinoethyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, N,N-dimethylaminopropyl (meth)acrylate, and the like. In addition, the above-mentioned photoradical initiator is not particularly limited, and examples thereof include acetophenone-based photoradical polymerization initiators, benzoin-based photoradical polymerization initiators, benzophenone-based photoradical polymerization initiators, thioxanthone-based photoradical polymerization initiators, acylphosphine oxide-based photoradical polymerization initiators, and titanocene-based photoradical polymerization initiators.

[0058] As the epoxy composition for cationic polymerization, for example, a composition containing a cationic polymerizable compound and a photocationic initiator can be cited. In addition, as the cationic polymerizable compound, there is no particular limitation, and for example, epoxy resins, alicyclic epoxy resins, oxetane compounds, vinyl ether compounds, etc. can be cited. In addition, as the photocationic initiator, there is no particular limitation, and for example, onium salts such as aromatic iodonium salts and aromatic sulfonium salts can be cited.

[0059] A thixotropy-imparting agent may be contained in order to impart thixotropy to the active energy ray-curable liquid 20. The thixotropy-imparting agent is not particularly limited, and examples thereof include silica, amide wax, and hydrogenated castor oil, among which silica is preferred.

[0060] Examples of the silica include hydrophilic silica, hydrophobic silica, etc. As the hydrophobic silica, silica treated with hydrophobicity using organochlorosilanes, polyorganosiloxane, hexamethyldisilazane, etc. can be used.

[0061] Furthermore, the gasket molding method according to the embodiment of the present invention includes a coating step S1 , a bonding step S2 , a curing step S3 , and a demolding step S4 in sequence.

[0062] In the coating step S1 , first, the active energy ray-curable liquid 20 is applied into a desired gasket shape while being moved in a cavity 41 of a molding die 40 described later, for example, in a stroke trajectory, by a dispenser 50 .

[0063] Here, the molding die 40 will be briefly described.

[0064] Figure 3A It is a schematic perspective view showing a molding die 40 according to an embodiment of the present invention. Figure 3B It is a magnified representation Figure 3A A cross-sectional stereogram of area A in FIG.

[0065] The molding die 40 is held on a fixed table of the laminating device and has a mold cavity 41 having a shape corresponding to the gasket 30 to be molded. The mold cavity 41 is, for example, a circular ring, an elliptical ring, or a rectangular ring, but may also be a closed shape such as a trajectory of a stroke that does not overlap with other trajectories, or a closed shape such as overlapping with other trajectories, and any shape may be adopted.

[0066] The molding die 40 is formed of one or more materials selected from the group consisting of transparent materials through which light can pass, for example, polymethyl methacrylate, cycloolefin polymer, polycarbonate, and glass.

[0067] return Figure 2A , the description of coating step S1 is continued.

[0068] In the coating step S1, the dispenser 50 preferably discharges 100% or more of the volume of the cavity 41, that is, the discharge amount per unit length is preferably 100% or more of the volume per unit length, so that the active energy ray-curable liquid 20 slightly overflows from the cavity 41. It should be noted that the upper limit of the discharge amount may be about 110%.

[0069] Next, in the bonding process S2, the fixed table of the bonding device holding the molding mold 40 coated with the active energy ray-curable liquid 20 and the movable table holding the workpiece 10 are flipped relative to each other, and the molding mold 40 and the workpiece 10 are bonded via the uncured active energy ray-curable liquid 20.

[0070] At this time, the bonding is performed with a bonding load of less than 1 MPa. It should be noted that the bonding load can be performed while measuring the bonding pressure (fastening force) and performing pressure control, or while measuring the bonding amount (pressing amount) and performing position control. In this way, the sealing gasket 30 can be formed by bonding with a low load, thereby reducing the load on the workpiece 10.

[0071] Next, in the curing step S3 , the active energy ray curing liquid 20 interposed between the molding die 40 and the workpiece 10 is cured by irradiating the active energy ray with the active energy ray irradiation device 60 .

[0072] At this time, the active energy ray irradiation device 60 is disposed on the surface side opposite to the molding bonding surface of the molding die 40 formed with the mold cavity 41, and the irradiated active energy ray passes through the transparent molding die 40 and reaches the active energy ray curable liquid 20. It should be noted that in the case of a transparent workpiece 10, the active energy ray can also be irradiated to the molding die 40 from the workpiece 10 side.

[0073] In the demolding step S4 , the movable table is reversed so as to be separated from the fixed table in the bonding device as a demolding device, and the cured active energy ray-curable liquid 20 (as the gasket 30 ) is peeled off from (the cavity 41 of) the molding die 40 together with the workpiece 10 .

[0074] Thereafter, the workpiece 10 is removed from the movable table, and the molding step S10 is completed, so that the workpiece 10 having the sealing gasket 30 directly provided on the surface can be obtained.

[0075] Here, a case where a fuel cell component 101 is used as the workpiece 10 for molding the gasket 30 and the gasket molding method of the present embodiment is applied to a method for manufacturing the fuel cell 100 will be described. Figure 4 1 is a schematic cross-sectional view showing the fuel cell 100 .

[0076] Examples of the fuel cell component 101 include a separator 101a, an electrolyte membrane 101d, a frame 101f, and an electrolyte membrane / electrode assembly 101e that constitute the fuel cell 100 (cell) (see Figure 4 ), and a sealing gasket 30 is molded on them.

[0077] Among them, it is preferable to mold the sealing gasket 30 on the diaphragm 101a made of aluminum, stainless steel, titanium, graphite, carbon, etc. Figure 4 In the figure, 101b is a fuel electrode, 101c is an air electrode, and 101g is a cooling water passage.

[0078] Moreover, the manufacturing method of the fuel cell 100 includes, in sequence: a coating step S1 of coating the active energy ray-curable liquid 20 in the mold cavity 41 of the molding mold 40, a bonding step S2 of bonding the molding mold 40 coated with the active energy ray-curable liquid 20 to the fuel cell component 101, a curing step S3 of curing the coated active energy ray-curable liquid 20 by irradiation with active energy rays, and a demolding step S4 of peeling the cured active energy ray-curable liquid 20 together with the fuel cell component 101 from the molding mold 40.

[0079] Furthermore, a case where the gasket molding method of the present embodiment is applied to a sealing method for sealing between two members will be described. Figure 5 This is a flow chart showing a sealing method for sealing between two components.

[0080] The sealing method for sealing two components includes a molding step S10 of molding the gasket 30 on one component (for example, the workpiece 10 ) and a crimping step S20 of crimping the one component to the other component.

[0081] The molding step S10 is the same as the above-mentioned gasket molding method, and therefore the description thereof is omitted.

[0082] The crimping step S20 is a step of placing another component on the gasket 30 formed on one component and crimping one component to the other component. In the crimping step S20, a crimping device such as the laminating device used in the laminating step S2 can be used, and position control and pressure control can also be performed. However, as long as the two components are fastened and fixed to each other by threads (bolts), it can be performed by threaded fastening, or the two components can be crimped to each other by riveting.

[0083] It should be noted that this sealing method can be applied not only to the above-mentioned fuel cell 100 but also to any relatively small component such as a main seal of a liquid crystal display panel.

[0084] Here, return Figure 3A , the molding die 40 is described.

[0085] The cavity 41 formed on the surface of the molding die 40 (hereinafter referred to as the "molding bonding surface") is formed so that its cross section is substantially rectangular, substantially trapezoidal, substantially triangular (mountain-shaped), substantially semicircular, or the like, which is the same as the desired cross-sectional shape of the gasket 30. It should be noted that the cross section of the cavity 41 may be a cross section in which the depth H is greater than the width, or vice versa, a cross section in which the width is greater than the depth.

[0086] The cavity 41 is closed in an annular shape so as to divide the inner region and the outer region. It should be noted that the cavity 41 is not only composed of a single member, but may also be composed of a combination of a plurality of B-shaped annular members, for example.

[0087] Furthermore, the mold cavity 41 is provided with a protrusion 42 that protrudes further in the normal direction of the molding and bonding surface than the divided inner and outer regions. The protrusion 42 may have a projection area such that the ratio of the projection area when the mold cavity 41 is projected from above is in the range of 30% to 99%. It should be noted that the surface (molding and bonding surface) of the protrusion 42 is located on the same plane except for the mold cavity 41.

[0088] On the other hand, air holes 45 capable of communicating with the atmosphere are provided in the inner region defined by the cavity 41 .

[0089] And, if Figure 3B As shown, the molding die 40 has one or more communication paths 44 that are connected to the mold cavity 41 and to the atmosphere. The communication paths 44 are formed so that when the workpiece 10 and the molding bonding surface (the surface of the protrusion 42) of the molding die 40 are bonded via the active energy ray-curable liquid 20, a part of the active energy ray-curable liquid 20 or gas (the air enclosed between the workpiece 10 and the molding die 40, the exhaust gas generated during curing, etc.) can be discharged.

[0090] The communication passage 44 is a groove-shaped communication passage with a depth h provided in a manner recessed from the molding bonding surface of the protrusion 42, but may also be provided, for example, as a through hole penetrating the wall of the protrusion 41 and communicating with the cavity 41. For example, the depth (height) h of the communication passage 44 is shallower than the depth H of the cavity 41, and may be, for example, 5% or more and 20% or less of the depth H of the cavity 41.

[0091] In addition, the communication passage 44 may be provided in a linear portion instead of a curved portion in the cavity 41. In addition, the protrusion 42 of the communication passage 44 may be provided in a linear portion.

[0092] In addition, for the surfaces of the protrusion 42 (molding bonding surface), the cavity 41 and the connecting path 44, in order to easily peel off the cured active energy ray-curable liquid 20 (sealing gasket 30), surface treatment to improve the demolding properties, such as fluorine coating, can be implemented in the demolding step S4.

[0093] Here, a molding die 40 according to a modified embodiment of the present invention will be described.

[0094] Figure 6 It is a cross-sectional perspective view of a molding die 40 showing a modified form of the present invention.

[0095] The molding mold 40 of the above-mentioned embodiment only has a connecting path 44, but the molding mold 40 of the modified form additionally has a retreat groove 43, so that even when the active energy ray-curing liquid 20 of about 110% of the volume of the mold cavity 41 is applied, the height of the molding gasket 30 can be formed according to the design value.

[0096] The escape groove 43 is connected to the open end side of the cavity 41, and has a depth h2 that is shallower than the depth H of the cavity 41 with a width wider than the width of the cavity 41. The depth h2 of the escape groove 43 may be, for example, 5% or more and 20% or less of the depth H of the cavity 41. In addition, the depth h2 of the escape groove 43 is preferably equal to or deeper than the depth h of the communication path 44, but may be shallower.

[0097] Furthermore, the escape groove 43 may be provided along the entire circumference of the cavity 41 or may be provided intermittently or partially. It should be noted that when the escape groove 43 is provided locally, it may be provided in a linear portion, avoiding a curved portion of the annular cavity 41 .

[0098] Here, when the molding die 40 is provided with the escape groove 43, when the workpiece 10 is attached to the molding die 40, the escape groove 43 is sealed together with the cavity 41. Therefore, after the gasket 30 is molded, the active energy ray-curable liquid 20 overflowing into the escape groove 43 is also cured and becomes burr-shaped and is integrally molded with the gasket 30, but the height of the gasket 30 is maintained at H (mm), so the sealing performance of the gasket 30 is not affected, and the burr-shaped portion does not need to be removed.

[0099] As described above, the cavity 41 is provided in the protrusion 42 that protrudes further in the normal direction of the molding bonding surface than the annular inner region and outer region, so the escape groove 43 is also provided in the protrusion 42. In this case, the protrusion 42 may also have a projection area such that the ratio of the projection area when the cavity 41 and the escape groove 43 are projected from above is within a range of 30% or more and 99% or less.

[0100] In addition, the surfaces of the protrusion 42 (molding bonding surface), the cavity 41 , the escape groove 43 , and the communication path 44 may be subjected to a surface treatment for improving mold release properties, such as fluorine coating.

[0101] Furthermore, the communication passage 44 may not be directly communicated with the cavity 41 but may be communicated with the escape groove 43 to be indirectly communicated with the cavity 41 .

[0102] As described above, the sealing gasket molding method of an embodiment of the present invention is a sealing gasket molding method for molding a sealing gasket 30 on a workpiece 10, and sequentially includes: a coating step S1 of coating an active energy ray-curable liquid 20 on a mold cavity 41 of a transparent molding mold 40, a bonding step S2 of bonding the molding mold 40 coated with the active energy ray-curable liquid 20 to the workpiece 10, a curing step S3 of curing the coated active energy ray-curable liquid 20 by irradiation with active energy rays, and a demolding step S4 of peeling the cured active energy ray-curable liquid 20 together with the workpiece 10 from the molding mold 40; in the bonding step S2, when the workpiece 10 and the molding mold 40 are bonded via the active energy ray-curable liquid 20, a part of the active energy ray-curable liquid 20 or gas is discharged to the atmosphere from the connecting path 44 connected to the mold cavity 41.

[0103] In addition, the sealing gasket molding mold 40 of the embodiment involved in the present invention is a sealing gasket molding mold 40 that molds the sealing gasket 30 on the workpiece 10 by applying the active energy ray-curing liquid 20 and curing and transferring it, and has a mold cavity 41 and a connecting path 44; the mold cavity 41 is annularly closed and arranged on the molding bonding surface of the molding mold 40 according to the shape of the sealing gasket 30, and can be filled with the active energy ray-curing liquid 20; the connecting path 44 is connected to the mold cavity 41 and is connected to the atmosphere; when the workpiece 10 and the molding bonding surface are bonded via the active energy ray-curing liquid 20, a part of the active energy ray-curing liquid 20 or gas is discharged from the connecting path 44.

[0104] Therefore, even if the active energy ray-curing liquid 20 overflows from the mold cavity 41, it will not seep between the molding and bonding surfaces of the workpiece 10 and the molding mold 40, but can be discharged to the outside of the molding mold 40. In addition, the molding and bonding surfaces of the workpiece 10 and the molding mold 40 are in direct contact, closing (sealing) the mold cavity 41, and the height of the sealing gasket 30 is formed according to the depth H of the mold cavity 41, so that the size of the sealing gasket 30 can be stabilized.

[0105] In addition, when the sealing gasket 30 is peeled off from the molding die 40, a discontinuous overflow portion caused by the connecting path 44 is formed on the periphery of the outer or inner periphery of the sealing gasket 30, and air can easily enter between the sealing gasket 30 and the molding die 40, which can reduce the peeling force and facilitate peeling.

[0106] Furthermore, generally, if the active energy ray-curable liquid 20 is cured while the molding die 40 and the workpiece 10 are attached to each other, the active energy ray-curable liquid 20 is stretched by the surface of the cavity 41 and the surface of the workpiece 10 while being cured, so the cured gasket 30 is affected by the curing shrinkage. This curing shrinkage is more obvious in curved portions and bends such as corners of the gasket 30 than in straight portions. However, as in the embodiment, by providing the connecting passage 44, the workpiece 10 and the cavity 41 are not completely sealed, so that the curing shrinkage of the active energy ray-curable liquid 20 can be suppressed, the dimensional accuracy of the gasket 30 can be made uniform, and the deviation can be suppressed.

[0107] A modified form of the sealing gasket forming method of the present invention is a sealing gasket forming method for forming a sealing gasket 30 on a workpiece 10, and includes, in sequence: a coating step S1 of coating an active energy ray-curable liquid 20 on a cavity 41 of a transparent molding mold 40, a bonding step S2 of bonding the molding mold 40 coated with the active energy ray-curable liquid 20 to the workpiece 10, a curing step S3 of curing the coated active energy ray-curable liquid 20 by irradiation with active energy rays, and a demolding step S4 of peeling the cured active energy ray-curable liquid 20 together with the workpiece 10 from the molding mold 40; the molding mold 40 has a retreat groove 43 that is closed together with the cavity 41 when the workpiece 10 and the molding mold 40 are bonded via the active energy ray-curable liquid 20, the retreat groove 43 has a width wider than the width of the cavity 41, and has a depth h2 shallower than the depth H of the cavity 41, and is connected to the open end side of the cavity 41.

[0108] In addition, the sealing gasket molding mold 40 of the modified form of the present invention is a sealing gasket molding mold 40 that molds the sealing gasket 30 on the workpiece 10 by applying an active energy ray-curing liquid 20 and curing and transferring it, and has a mold cavity 41 and a retreat groove 43; the mold cavity 41 is annularly closed according to the shape of the sealing gasket 30 and is arranged on the molding bonding surface of the molding mold 40, and can be filled with the active energy ray-curing liquid 20; the retreat groove 43 is closed together with the mold cavity 41 when the workpiece 10 and the molding mold 40 are bonded via the active energy ray-curing liquid 20; the retreat groove 43 has a width wider than the width of the mold cavity 41, and has a depth h2 shallower than the depth H of the mold cavity 41, and is connected to the open end side of the mold cavity 41.

[0109] Therefore, the active energy ray-curable liquid 20 overflowing from the mold cavity 41 will not overflow between the molding bonding surfaces of the workpiece 10 and the molding mold 40. The molding bonding surfaces of the workpiece 10 and the molding mold 40 are in direct contact, closing (sealing) the mold cavity 41 and the retreat groove 43. The height of the sealing gasket 30 is formed according to the depth H of the mold cavity 41, so that the size of the sealing gasket 30 can be stabilized.

[0110] In the molding die 40 of the embodiment, the mold cavity 41 is provided at a protrusion 42 that protrudes further in the normal direction of the molding bonding surface of the molding die 40 than the annular inner area and outer area. Thus, in the bonding process S2, the pressing force (fastening force) acts only on the periphery of the mold cavity 41, so that the pressing force per unit area can be increased and can be pressed uniformly. In addition, compared with the case of pressing the entire surface of the molding die 40, the overall pressing force can be reduced, and the adjustment of the pressing force becomes easy. Moreover, the damage to the workpiece 10 due to the pressing force can also be reduced.

[0111] The coating step S1 of the embodiment is performed using a dispenser 50. Thus, in the coating step S1, it is possible to easily control the discharge amount of the liquid. In this case, for example, when the dispenser 50 is operated in a trajectory of a single stroke, no overlapping portion of the coating trajectory will be generated, thereby simplifying the position and speed control of the dispenser 50. In addition, the active energy ray-curable liquid 20 can be used to mold the gasket 30 at a low pressure.

[0112] The cavity 41 of the molding die 40 of the embodiment is subjected to mold release coating. Thus, the molded gasket 30 can be easily peeled off from the cavity 41 of the molding die 40.

[0113] The fuel cell 100 of the embodiment includes the gasket 30 obtained by the above-mentioned gasket molding method, and the workpiece 10 is a fuel cell component 101. The fuel cell component 101 is selected from the group consisting of a separator 101a, an electrolyte membrane 101d, a frame 101f, and an electrolyte membrane / electrode assembly 101e.

[0114] The manufacturing method of the fuel cell 100 of the embodiment includes: a coating step S1 of coating an active energy ray-curable liquid 20 in a mold cavity 41 of a molding mold 40, a bonding step S2 of bonding the molding mold 40 coated with the active energy ray-curable liquid 20 to a fuel cell component 101, a curing step S3 of curing the coated active energy ray-curable liquid 20 by irradiation with active energy rays, and a demolding step S4 of peeling off the cured active energy ray-curable liquid 20 together with the fuel cell component 101 from the molding mold 40.

[0115] Thus, the gasket molding method can also be applied to the method for manufacturing the fuel cell 100. In addition, the gasket molding method of the present invention can be molded at low pressure and can form the gasket 30 by laminating at low load, thereby reducing the load on the fuel cell component 101.

[0116] The sealing method of the embodiment is a sealing method for sealing two components, and includes a molding step S10 of molding a gasket 30 on one component by the above-mentioned gasket molding method, and a crimping step S20 of arranging another component on the gasket 30 molded into one component and crimping one component to the other component. In this way, the gasket molding method can also be applied to the sealing method.

[0117] As mentioned above, although the preferred embodiment of the present invention has been described in detail, the present invention is not limited to the above-mentioned embodiment, and various modifications and changes can be made within the scope of the gist of the present invention described in the claims.

[0118] (Variation Example)

[0119] The curing process S3 of the above-mentioned embodiment is a single process of curing the active energy ray-curable liquid 20 until it is completely cured using the active energy ray irradiation device 60, but it can also be a two-stage process, for example, of performing the following temporary curing process and formal curing process. In the temporary curing process, a portion of the active energy ray-curable liquid 20 is cured and temporarily cured to a degree that can maintain morphological stability. Thereafter, in the formal curing process, the active energy ray is irradiated again to completely cure it through the demolding process S4 of peeling it off from the molding mold 40 together with the workpiece 10.

[0120] In this case, in the temporary curing step S3, the applied active energy ray-curable liquid 20 may be irradiated with a wavelength of 320 nm to 450 nm and a power of 500 mW / cm 2 Above and 5000mW / cm 2 The active energy rays have a peak illuminance of less than 100 mJ / cm2, and the cumulative light intensity (e.g., 100 mJ / cm2) is such that the reaction rate calculated from the IR spectrum is 20% or more and 85% or less. 2 Above and 500mJ / cm 2 In the main curing step, the irradiation is performed at a cumulative light intensity (e.g., 1000 mJ / cm 2 Above and 10000mJ / cm 2 Below) active energy rays.

[0121] Description of Reference Numerals

[0122] 10: workpiece, 10a: opening, 10b: recess, 20: active energy ray-curable liquid, 30: sealing gasket, 40: molding die, 41: cavity, 42: land portion (protrusion), 43: retreat groove, 44: connecting path, 45: air hole, 50: distributor, 60: active energy ray irradiation device, 100: fuel cell, 101: component for fuel cell, 101a: diaphragm, 101b: fuel electrode, 101c: air electrode, 101d: electrolyte membrane, 101e: electrolyte membrane / electrode assembly, 101f: frame, 101g: cooling water passage.

Claims

1. A sealing gasket forming method, which is a sealing gasket forming method for forming a sealing gasket on a workpiece, comprising: A coating step of coating an active energy ray-curable liquid on a ring-shaped cavity of a transparent molding die; a bonding step of bonding the molding die coated with the active energy ray-curable liquid to the workpiece; a curing step of curing the applied active energy ray-curable liquid by irradiating active energy rays; as well as a demolding step of peeling the cured active energy ray-curable liquid together with the workpiece from the molding die, In the bonding step, when the workpiece and the molding die are bonded together via the active energy ray-curable liquid, a portion of the active energy ray-curable liquid or gas is discharged to the atmosphere from a communication path communicating with the cavity.

2. The sealing gasket forming method according to claim 1, wherein: The molding die includes an escape groove that is closed together with the cavity when the workpiece and the molding die are bonded together via the active energy ray-curable liquid. The escape groove has a width wider than a width of the cavity and a depth shallower than a depth of the cavity, and communicates with an open end side of the cavity.

3. A sealing gasket forming method, which is a sealing gasket forming method for forming a sealing gasket on a workpiece, comprising: A coating step of coating an active energy ray-curable liquid on a ring-shaped cavity of a transparent molding die; a bonding step of bonding the molding die coated with the active energy ray-curable liquid to the workpiece; a curing step of curing the applied active energy ray-curable liquid by irradiating active energy rays; as well as a demolding step of peeling the cured active energy ray-curable liquid together with the workpiece from the molding die, The molding die includes an escape groove that is closed together with the cavity when the workpiece and the molding die are bonded together via the active energy ray-curable liquid. The escape groove has a width wider than a width of the cavity and a depth shallower than a depth of the cavity, and communicates with an open end side of the cavity.

4. The sealing gasket molding method according to any one of claims 1 to 3, wherein: The cavity is provided in a protruding portion that protrudes further in a normal direction of a molding and bonding surface of the molding die than the annular inner region and the outer region.

5. The sealing gasket forming method according to claim 1 or 3, wherein: The coating process is performed using a dispenser.

6. The sealing gasket forming method according to claim 1 or 3, wherein: The mold cavity was release coated.

7. A gasket forming mold, which forms a gasket on a workpiece by applying an active energy ray-curable liquid, curing it, and transferring it. The sealing gasket forming mold comprises: a mold cavity, which is closed in an annular shape according to the shape of the gasket and is arranged on the molding and fitting surface, and can be filled with an active energy ray-curable liquid; and a communication passage, which is in communication with the mold cavity and with the atmosphere, When the workpiece and the molding bonding surface are bonded together via the active energy ray-curable liquid, a portion of the active energy ray-curable liquid or gas is discharged from the communication path.

8. The gasket molding die according to claim 7, comprising an escape groove having a width wider than a width of the cavity and a depth shallower than a depth of the cavity, The retreat groove is communicated with the open end side of the mold cavity, When the workpiece and the molding bonding surface are bonded together via the active energy ray-curable liquid, the escape groove is closed together with the cavity.

9. A gasket forming die, which forms a gasket on a workpiece by applying an active energy ray-curable liquid, curing it, and transferring it. The sealing gasket forming mold comprises: a mold cavity, which is closed in an annular shape according to the shape of the gasket and is arranged on the molding and fitting surface, and can be filled with an active energy ray-curable liquid; and a retreat groove which is closed together with the mold cavity when the workpiece and the molding die are bonded together via the active energy ray-curable liquid, The escape groove has a width wider than a width of the cavity and a depth shallower than a depth of the cavity, and communicates with an open end side of the cavity.

10. The gasket forming die according to any one of claims 7 to 9, wherein: The cavity is provided in a protrusion that protrudes further in a normal direction of the molding and bonding surface than the annular inner region and the outer region.

11. The gasket forming mold according to claim 7 or 9, wherein: The mold cavity was release coated.

12. A sealing gasket forming device, comprising: a coating device that discharges an active energy ray-curable liquid using a dispenser; A laminating device, which comprises a transparent forming mold and is used to laminat the workpiece to the forming mold; a driving device for moving the molding die and the dispenser relative to each other; and an active energy ray irradiation device for irradiating the active energy ray to the active energy ray curable liquid, The molding die has: The mold cavity is closed in an annular shape according to the shape of the gasket and is arranged on the molding bonding surface, and can be filled with an active energy ray-curable liquid; as well as a communication passage, which is in communication with the mold cavity and with the atmosphere, When the workpiece and the molding bonding surface are bonded together via the active energy ray-curable liquid, a portion of the active energy ray-curable liquid or gas is discharged from the communication path.

13. A sealing gasket forming device, comprising: a coating device that discharges an active energy ray-curable liquid using a dispenser; A laminating device, comprising a transparent forming mold and laminating the workpiece to the forming mold; a driving device for moving the molding die and the dispenser relative to each other; and an active energy ray irradiation device for irradiating the active energy ray to the active energy ray curable liquid, The molding die has: A mold cavity, which is closed in an annular shape according to the shape of the gasket and is provided on the molding and fitting surface, and can be filled with an active energy ray-curable liquid; and a retreat groove which is closed together with the mold cavity when the workpiece and the molding die are bonded together via the active energy ray-curable liquid, The escape groove has a width wider than a width of the cavity and a depth shallower than a depth of the cavity, and communicates with an open end side of the cavity.

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