Package for sensors and method for manufacturing same

Abstract

Certain embodiments of the present disclosure relate to a sensor assembly including a substrate, a housing, and a sensor die. In some embodiments, the substrate includes an outer region, an inner region, and an intermediate region between the outer region and the inner region. In some embodiments, the substrate includes electrical contact pads located at least on the interior region. In some embodiments, the housing is coupled with the substrate at the intermediate region or the outer region to provide a hermetic seal. In some embodiments, the sensor die is coupled with the substrate at the interior region via the electrical contact pads. The sensor die is aligned with the substrate via an alignment feature that aligns the sensor die relative to the substrate within at least one of a first plane or a second plane.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to a sensor for monitoring and controlling, for example, gas flow rate. Background Art

[0002] Various manufacturing systems (e.g., for semiconductor applications) may include measurements of gas flow properties (e.g., flow rate, temperature, pressure, and the like). Sensors used to make such measurements may be incompatible with aggressive environments (e.g., corrosive environments, environments with high energy plasmas, environments with vacuums, environments with high temperatures and / or frequent temperature cycling, and the like) used in certain manufacturing systems. It can be challenging to create sensors and / or sensor packages with special geometries that do not adversely affect process gas properties while also being compatible with certain aggressive environments.

[0003] For example, in some manufacturing systems, process gases (e.g., gases used during a semiconductor manufacturing process) and / or cleaning gases (e.g., gases used to clean manufactured equipment and / or clean chambers used to manufacture electronic devices) may have precise delivery targets, including high mass flow rates and the ability to precisely control low flow rates. Conventional manufacturing systems typically use one or more mass flow controllers (MFCs) to measure and control the mass flow rates of process gases.

[0004] It would be advantageous to develop MFCs and / or other sensors that are compatible with aggressive manufacturing environments (e.g., resist corrosion and / or material contamination), remain vacuum-tight, are rugged, have long operating lives, are reliable, and have geometries that minimize adverse effects on gas flow properties. Summary of the invention

[0005] Certain embodiments of the present disclosure relate to a sensor assembly comprising a substrate, a housing, and a sensor die. In certain embodiments, the substrate comprises an outer region, an inner region, and an intermediate region positioned between the outer region and the inner region. In certain embodiments, the substrate further comprises an electrical contact pad located at least on the inner region. In certain embodiments, the housing is coupled to the substrate at the intermediate region or the outer region to provide an airtight seal. In certain embodiments, the sensor die is coupled to the substrate at the inner region via the electrical contact pad. The sensor die is aligned with the substrate via an alignment feature, and the alignment feature aligns the sensor die relative to the substrate in at least one of a first plane or a second plane.

[0006] In another aspect of the present disclosure, a gas flow sensor configured to be coupled to a gas flow tube via a flange includes a dielectric substrate having an outer region, an inner region, and an intermediate region between the outer region and the inner region. The dielectric substrate includes electrical contact pads formed between layers of the dielectric substrate. The electrical contact pads extend from the outer region through the dielectric substrate to the inner region. A housing is coupled to the dielectric substrate at the intermediate region to form an airtight seal. A sensor die is coupled to the dielectric substrate at the inner region via the electrical contact pads. The sensor die is aligned with the dielectric substrate via an alignment feature, and the alignment feature aligns the sensor die relative to the dielectric substrate in at least a first plane or a second plane.

[0007] In another aspect of the present disclosure, a method includes providing a substrate having an outer region, an inner region, and an intermediate region positioned between the outer region and the inner region. The substrate further includes electrical contact pads located at least on the inner region. The method further includes aligning a sensor die with the substrate at the inner region via one or more alignment features, the one or more alignment features aligning the sensor die relative to the substrate in a first plane or a second plane. The method further includes coupling the sensor die to the substrate at the inner region. The method further includes coupling the substrate to a housing at the intermediate region or the outer region to provide a hermetic seal.

[0008] In another aspect of the present disclosure, a sensor assembly includes a substrate having an outer region, an inner region, and an intermediate region between the outer region and the inner region. The substrate further includes an electrical contact pad located at least on the inner region. The sensor assembly further includes a housing coupled to the substrate at the intermediate region or the outer region to provide an airtight seal. The sensor assembly further includes a sensor die bonded to the substrate at the inner region. A metal bond bonds an electrode of the sensor die to the electrical contact pad. The metal bond includes platinum, and / or one or more metals selected from tin, indium, copper, aluminum, and / or nickel.

[0009] In another aspect of the present disclosure, a method of manufacturing a sensor assembly includes providing a substrate having an outer region, an inner region, and an intermediate region between the outer region and the inner region. The substrate further includes a first electrical contact pad and a second electrical contact pad located at least on the inner region. The method further includes providing a sensor die having a first electrode and a second electrode. The first electrode includes a first metal wire extending from the sensor die, and the second electrode includes a second metal wire extending from the sensor die. The method further includes positioning the sensor die on the inner region of the substrate so that a portion of the first metal wire covers the first electrical contact pad and the second metal wire covers the second electrical contact pad. The method further includes bonding the first metal wire to the first electrical contact pad by a first welding operation. The method further includes bonding the second metal wire to the second electrical contact pad by a second welding operation. The method further includes coupling the substrate to a housing at the intermediate region or the outer region of the substrate to provide a hermetic seal.

[0010] In another aspect of the present disclosure, a method of manufacturing a sensor assembly is provided. The method includes providing a substrate having an outer region, an inner region, and an intermediate region between the outer region and the inner region. The substrate further includes an electrical contact pad located at least on the inner region. The method further includes providing a sensor die having an electrode. The method further includes disposing a multilayer reactive foil on at least one of the following items: a) the electrical contact pad of the substrate, or b) the electrode of the sensor die. The method further includes positioning the sensor die on the inner region of the substrate so that the multilayer reactive foil is sandwiched between the electrical contact pad and the electrode. The method further includes igniting the multilayer reactive foil to form a metallic bond between the electrical contact pad of the substrate and the electrode of the sensor die. The method further includes coupling the substrate to a housing in the intermediate region or the outer region to provide a hermetic seal.

[0011] In another aspect of the present disclosure, a sensor assembly includes a housing having a first channel and a second channel, the first channel being configured to flow a gas in a first direction, the second channel being configured to flow the gas in a second direction. The housing is configured to be coupled to a gas flow assembly. A substrate is disposed within the housing. The substrate has an outer region, an inner region, and an intermediate region, the inner region being located within the first channel, the intermediate region being between the outer region and the inner region. The substrate further includes an electrical contact pad at least located on the inner region. A sensor die is coupled to the inner region of the substrate and has an electrical connection to the electrical contact pad. The sensor die is disposed within the gas flow path of the first channel.

[0012] In another aspect of the present disclosure, a gas stick assembly includes a first end having an input configured to receive gas from a gas source. The gas stick assembly further includes a second end having an output configured to deliver the gas to a destination. The gas stick assembly further includes a valve between the first end and the second end. The gas stick assembly further includes a sensor assembly between the first end and the second end. The sensor assembly includes a housing having a first channel and a second channel, the first channel being configured to receive the gas from an upstream component of the gas stick assembly, and the second channel being configured to guide the gas to a downstream component of the gas stick assembly. The sensor assembly further includes a substrate within the housing. The substrate has an outer region, an inner region, and an intermediate region, the inner region being located within the first channel, the intermediate region being between the outer region and the inner region. The substrate further includes an electrical contact pad located at least on the inner region. The sensor assembly further includes a sensor die coupled to the inner region of the substrate and having an electrical connection to the electrical contact pad. The sensor die is disposed within the gas flow path of the first channel.

[0013] In another aspect of the present disclosure, a processing device includes a processing chamber, a plurality of gas suppliers, and a plurality of gas stick assemblies. Each of the gas stick assemblies is coupled between the processing chamber and a corresponding gas supplier of the plurality of gas suppliers. The gas stick assembly includes a first end having an input, the input being configured to receive gas from the corresponding gas supplier coupled to the gas stick assembly. The gas stick assembly further includes a second end having an output, the output being configured to deliver the gas to the processing chamber. The gas stick assembly further includes a valve between the first end and the second end. The gas stick assembly further includes a sensor assembly between the first end and the second end. The sensor assembly includes a housing having a first channel and a second channel, the first channel being configured to receive the gas from an upstream component of the gas stick assembly, the second channel being configured to guide the gas to a downstream component of the gas stick assembly. The sensor assembly further includes a substrate within the housing. The substrate has an outer region, an inner region, and an intermediate region, the inner region being located within the first channel, the intermediate region being between the outer region and the inner region. The substrate further includes an electrical contact pad located at least on the interior region. The sensor assembly further includes a sensor die coupled to the interior region of the substrate and having an electrical connection to the electrical contact pad. The sensor die is disposed within the airflow path of the first channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present disclosure is illustrated by way of example and not limitation in the drawings of the accompanying drawings, in which like reference numerals represent like elements. It should be noted that different references to "a / one" embodiment in the present disclosure do not necessarily refer to the same embodiment, and such references refer to at least one.

[0015] Figure 1 An exemplary system according to an embodiment of the present disclosure is described that includes a processing chamber, a gas source, and a flow control device. Figure 1 An exemplary illustration is also provided that sensor assemblies according to embodiments of the present disclosure may be incorporated into various locations within a processing chamber and / or manufacturing system.

[0016] Figure 2 Exemplary flow control devices according to embodiments of the present disclosure are described.

[0017] Figure 3 Exemplary sensor devices that may be used in a sensor assembly according to embodiments of the present disclosure are described.

[0018] Figure 4A A perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0019] Figure 4B Explained Figure 4A Magnified view of area A in FIG.

[0020] Figure 4C A cross-sectional side view of an exemplary flow channel having a plurality of Figure 4A sensor components.

[0021] Figure 4D A cross-sectional view of a conformal coating formed on a surface of an exemplary sensor assembly in accordance with an embodiment of the present disclosure is illustrated.

[0022] Figure 5A A perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0023] Figure 5B Explained Figure 5A Magnified view of area B in FIG.

[0024] Figure 5C Embodiments according to the present disclosure are described, including Figure 5A A perspective view of the multilayer ceramic substrate in the sensor assembly.

[0025] Figure 5D Explained Figure 5C Side view of a multilayer ceramic substrate.

[0026] Figure 5E Explained Figure 5C Top view of a multilayer ceramic substrate.

[0027] Fig. 5F A cross-sectional side view of an exemplary flow channel having a plurality of Figure 5A sensor components.

[0028] Fig. 6A A perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0029] Figure 6B Explained Fig. 6A Magnified view of area C in FIG.

[0030] Figure 6C Embodiments according to the present disclosure are described, including Fig. 6A A perspective view of the substrate in the sensor assembly.

[0031] Fig.6D An embodiment according to the present disclosure is described, having Fig. 6A A cross-sectional side view of an exemplary flow channel of a sensor assembly.

[0032] Fig. 7A A perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0033] Figure 7B Embodiments according to the present disclosure are described, including Fig. 7A A perspective view of a multilayer ceramic substrate in a sensor assembly of FIG. 1 , wherein the multilayer ceramic substrate is coupled to a sensor device at an inner area.

[0034] Figure 7C Explained Figure 7B Side view of a multilayer ceramic substrate.

[0035] Fig.7D Explained Figure 7B Top view of a multilayer ceramic substrate.

[0036] Fig. 7E Explained Fig. 7A Front view of the middle section AA.

[0037] Fig. 8A A perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0038] Figure 8B Explained Fig. 7E Front view of the mid-section BB.

[0039] Fig.9AA perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0040] Fig. 9B Embodiments according to the present disclosure are described, including Fig.9A A perspective view of a multilayer ceramic substrate in a sensor assembly of FIG. 1 , wherein the multilayer ceramic substrate is coupled to a sensor device at an inner area.

[0041] Fig. 9C Explained Fig.9A Front view of the middle section CC.

[0042] Fig. 10A A perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0043] Fig. 10B Embodiments according to the present disclosure are described, including Fig. 10A A perspective view of the multilayer ceramic substrate in the sensor assembly.

[0044] Fig. 10C Explained Fig. 10A Front view of the mid-section DD.

[0045] Fig. 10D A cross-sectional side view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0046] Fig.11A A flow chart illustrating a method of adapting a sensor device for use in a flow control apparatus according to an embodiment of the present disclosure.

[0047] Fig. 11B A flow chart illustrating a method of manufacturing a sensor assembly according to an embodiment of the present disclosure is shown.

[0048] Fig. 11C Explains from Fig. 11B An illustration of method 1200 .

[0049] Fig. 12A -B illustrates a cross-sectional side view of an exemplary flow channel having a sensor assembly mounted thereon, according to an embodiment of the present disclosure.

[0050] Fig.13A A cross-sectional side view of an adapter / flange, a multilayer ceramic substrate, and a sensor device are illustrated in accordance with an embodiment of the present disclosure.

[0051] Fig. 13B An exploded cross-sectional side view of an adapter / flange, a multilayer ceramic substrate, and a sensor device are illustrated in accordance with an embodiment of the present disclosure.

[0052] Fig.14AA side view of a ceramic substrate and a sensor device according to an embodiment of the present disclosure is illustrated.

[0053] Fig. 14B An exploded side view of a ceramic substrate and a sensor device according to an embodiment of the present disclosure is illustrated.

[0054] Fig. 14C A partial bottom view of a ceramic substrate and a sensor device according to an embodiment of the present disclosure is illustrated.

[0055] Fig.14D An exploded partial bottom view of a ceramic substrate and a sensor device according to an embodiment of the present disclosure is illustrated.

[0056] Fig.15A -G illustrates a system for bonding a sensor device to a ceramic substrate according to an embodiment of the present disclosure.

[0057] Fig.16A -C illustrates a flow chart of a method for manufacturing a sensor assembly according to an embodiment of the present disclosure.

[0058] Fig.16D -F illustrates a flow chart of a method of bonding a sensor device to a substrate according to an embodiment of the present disclosure.

[0059] Fig.17A A perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0060] Fig. 17B Explained Fig.17A Front view of the mid-section EE.

[0061] Fig. 17C Explained Fig.17A Disassembled front view of the middle section EE.

[0062] Fig.17D Explained Fig.17A Front view of the mid-section FF.

[0063] Fig.17E A perspective view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0064] Fig.17F Explained Fig.17F Front view of the mid-section GG.

[0065] Figure 17G A cross-sectional view of a sensor assembly is illustrated in accordance with an embodiment of the present disclosure.

[0066] Fig.17H A schematic diagram of a sensor assembly coupled to a gas stick assembly according to an embodiment of the present disclosure is illustrated.

[0067] Fig.17I A perspective view of a sensor assembly coupled to a gas stick assembly is illustrated in accordance with an embodiment of the present disclosure.

[0068] Fig.18 is a block diagram illustrating a computer system for use in accordance with embodiments of the present disclosure. DETAILED DESCRIPTION

[0069] The embodiments described herein relate to a sensor assembly (also referred to as a sensor package) adapted for use in a mass flow control device, a system incorporating the sensor assembly, a method of adapting the sensor assembly for such use, and a method of using the sensor assembly. In certain embodiments, the sensor assembly may also be adapted for use other than as part of a mass flow control device. For example, the sensor assembly may be adapted for temperature control, pressure control, and similar uses. In some embodiments, the sensor assembly includes a sensor device (e.g., a MEMS device, a Hot-Wire Anemometry (HWA) device, or any other suitable sensor) having a self-contained sensing element that is to be disposed directly in the flow path of the airflow channel. In some embodiments, the sensor assembly also includes a substrate (e.g., a ceramic substrate) to which the sensor device is fixed (e.g., fixed via a metal bond or seal). In some embodiments, the sensor assembly also includes a housing to which the substrate is fixed (e.g., fixed via a metal seal). In some embodiments, the sensor device can be fixed to the substrate via a metal bond (e.g., by soldering, welding, using a multi-layer reactive foil, or brazing with a brazing alloy), and the substrate can be fixed to the housing via another metal bond or a seal (e.g., by soldering, welding, or brazing with a brazing alloy). In some embodiments, an O-ring can be further disposed between the substrate and the housing. In some embodiments, the various components of the sensor assembly are assembled together so that a hermetic seal is provided between the substrate (on which the sensor device is fixed) and the housing (on which the substrate is fixed at an outer region of the substrate or at an intermediate region of the substrate). In some embodiments, the various components of the sensor assembly can be connected so that continuous conductivity is established from the self-supporting sensing element, through the sensor assembly, to one or more external devices (e.g., a processing device), so that the properties measured by the sensing element can be transmitted to the processing device. The various components of the sensor assembly can also be connected so that the turbulent effects of the flow on the sensor measurement are minimized, and / or a hermetic seal is provided to accommodate high vacuum and minimize degassing or leakage. In some embodiments, the sensor assembly further includes a conformal coating (either on a portion of the assembly or on the entire assembly) to protect various portions of the sensor assembly from corrosive gases.

[0070] In general, it is advantageous to precisely control the temperature and flow rate of process gases used in a manufacturing process to better control the process and enable precise process constraints to be met. The low transient response rates of current flow sensors are not suitable for applications that benefit from precise control of gas dosage, such as delivery of small amounts of gas and continuous delivery of pulses of one or more gases.

[0071] Embodiments of the present disclosure advantageously overcome limitations of current sensors by providing fast and accurate flow feedback using a sensor device (e.g., a MEMS device, a hot wire anemometer (HWA), or any other suitable sensor) located directly within the flow path of the gas. In addition to flow feedback, the sensor device can also be advantageously used to provide fast and accurate temperature measurements at any location in the gas supply pipeline, including at the source, near the valve, near the entrance of the processing chamber (e.g., the delivery point), within the processing chamber, or in the foreline. The temperature measurements can be monitored in real time by a processing device, which can in turn transmit power output commands to heating units at different locations in the gas supply pipeline.

[0072] Certain embodiments advantageously adapt the sensor device to be inserted directly into the gas flow path while protecting the sensor device from corrosive chemicals. For example, embodiments described herein relate to sensor assemblies and materials for sensor assemblies that can be exposed to corrosive chemicals, such as corrosive chemicals used during semiconductor processing. The sensor assembly described herein can be adapted to protect the sensor device from corrosive chemicals while still protecting the electrical properties of the sensor device (e.g., establishing conductivity to the sensor), relative shape, and geometric configuration. In one embodiment, the sensing element is positioned (e.g., a nanowire portion) in the sensor device so that it is exposed to the flow path and can provide an accurate measurement of the gas flow. The sensor assembly can also be adapted to minimize the turbulent effects of the flow on the sensor device measurement, minimize corrosion, minimize deposition on the sensor die that may hinder the performance of the sensor, minimize degassing or leakage to the external environment, maintain vacuum, maintain thermal properties, maintain the sensitivity and / or measurement accuracy of the sensor device, and maintain the fast response of the sensor device.

[0073] In some embodiments, the sensor die and / or the substrate combined with the sensor die include one or more alignment features to facilitate alignment of the sensor die with the substrate in one or more planes. For example, a first alignment feature (e.g., alignment pins and / or holes) can be used to align the sensor die with the substrate in a first plane, the first plane being perpendicular to the interface between the sensor die and the substrate. Additionally or alternatively, a second alignment feature (e.g., a thickness-controlled solder joint) can be used to align the sensor die with the substrate in a second plane, the second plane being parallel to the interface between the sensor die and the substrate. The first alignment feature and / or the second alignment feature and / or the third alignment feature (e.g., a recess in the substrate, the size of which can accept at least a portion of the sensor die) can additionally or alternatively cause the sensor die to be positioned at a target location on the substrate, so that the sensor die is assembled. The one or more alignment features located in the center of the gas channel can then facilitate centering and / or placement of the sensor die at the target location, the target rotation and / or the target tilt of the sensor die relative to the substrate. By carefully controlling the placement, rotation, tilt and / or orientation of the sensor die relative to the substrate (and therefore relative to the airflow path in which the sensor assembly will be used), the configuration of the sensor assembly can be optimized. Slight variations in the rotation, tilt and / or placement of the sensor die on the substrate can have large effects on the measurements due to phenomena such as turbulence in the airflow path. By ensuring that there is little tilt, rotation, etc., and / or that the sensor die is centered in the airflow path, turbulence effects can be minimized and sensor-to-sensor repeatability can be improved.

[0074] In some embodiments, the sensor die is bonded to the substrate via a metal bond between the electrical contact pads of the substrate and the electrodes of the sensor die (e.g., brazing and / or welding). The metal bond may include platinum, tin, indium, copper, aluminum, or nickel. For example, in embodiments where the sensor assembly will be used in a corrosive environment (e.g., an environment containing chlorine, bromine, etc.), the metal bond may include platinum, aluminum, or nickel. In a benign environment (e.g., a non-corrosive environment), tin, indium, or copper may be used for the metal bond. In some embodiments, the metal bond may include layers of aluminum and nickel. For example, a multilayer reactive foil including multiple alternating layers of aluminum and nickel may be disposed between the electrodes of the sensor die and the electrical contact pads of the substrate. The foil may be ignited, causing the foil to react and bond to the electrodes and the electrical contact pads. In order to enhance the metal bond, in some embodiments, a metal adhesion layer may be added to the electrodes of the sensor die or to the electrical contact pads of the substrate. The metal adhesion layer may include an aluminum layer deposited on the electrodes or electrical contact pads. The metal adhesion layer may help bond the foil to the electrodes and / or electrical contact pads. Alternatively, in some embodiments, the metal binder includes a metal wire bonded to an electrode of the sensor die and an electrical contact pad of the substrate. The metal wire may be a platinum wire. The metal binder may reliably bond the sensor die to the substrate and establish reliable electrical connectivity between the sensor die and the substrate. Additionally, in some embodiments, the metal binder may be substantially corrosion resistant, thereby allowing the sensor assembly to be used in a corrosive environment (e.g., an environment with a corrosive gas). In a corrosive environment, degradation of the electrical connection may have a significant effect on the sensor's measurements. By ensuring that the sensor die is bonded to the substrate with a reliable and / or corrosion resistant binder, the sensor assembly may be effectively used in a corrosive environment without being adversely affected by corrosion.

[0075] In some embodiments, the housing of the sensor assembly includes a first channel and a second channel, the first channel being used to flow gas in a first direction, and the second channel being used to flow gas in a second direction. The sensor die may be disposed in the first channel and coupled to the substrate. The housing may be configured to be coupled to the base of the gas stick assembly by one or more fasteners (e.g., threaded fasteners). The bottom surface of the housing may be configured to interface with the gas stick assembly. The housing may be further configured to couple with auxiliary components (e.g., valves, filters, mass flow controllers, etc.) of the gas stick assembly. The top surface of the sensor assembly may be configured to interface with the auxiliary components. In some embodiments, the housing may be configured to be coupled between the base of the gas stick assembly and the auxiliary components. In some embodiments, the channel of the housing includes an opening on the top surface of the housing and on the bottom surface of the housing. The opening may have an area for receiving a sealing component (e.g., an O-ring, a seal, etc.) to seal the interface between the housing and the base of the gas stick assembly, and / or the interface between the housing and the auxiliary components. In some embodiments, the sensor assembly includes a plurality of sensors (e.g., a flow sensor, a temperature sensor, a pressure sensor, etc.). In some embodiments, the sensor housing includes a third channel that connects the first channel to the second channel within the housing. The housing can be configured to receive a plug to close the opening of the first channel and the opening of the second channel on the top surface of the housing to direct the airflow from the first channel to the second channel through the third channel. The sensor assembly can be included in the gas stick assembly by configuring the housing to be coupled to the gas stick assembly. For example, a component of the gas stick assembly (such as a valve or a filter) can be decoupled from the gas stick assembly, and the sensor assembly is coupled to the gas stick assembly to replace the component. Therefore, the sensor assembly can be substantially modular (e.g., able to be easily coupled to the gas stick assembly at multiple different locations). In addition, in some embodiments, the component can be coupled to the top of the sensor assembly. This sensor system allows the sensor assembly to be easily integrated into the gas stick assembly, and further provides a quick replacement of the sensor assembly on the gas stick assembly. Further, the sensor assembly can substantially resist the effects of corrosive gases that are dealt with by the gas stick assembly, resulting in a longer life of the sensor assembly than conventional systems or components.

[0076] Figure 1A system 100 according to an embodiment of the present disclosure is described, the system comprising a processing chamber 101, a gas source 160, and a flow control device 200. The processing chamber 101 can be used for processing that provides a corrosive plasma environment. For example, the processing chamber 101 can be a chamber for a plasma etcher or a plasma etching reactor, a plasma cleaner, etc. In alternative embodiments, other processing chambers can be used, which may or may not be exposed to a corrosive plasma environment. Some examples of chamber components include chemical vapor deposition (CVD) chambers, physical vapor deposition (PVD) chambers, ALD chambers, IAD chambers, etching chambers, and other types of processing chambers. In some embodiments, the processing chamber 101 can be any chamber used in an electronic device manufacturing system.

[0077] In one embodiment, the processing chamber 101 includes a chamber body 102 and a showerhead 130, which enclose an interior volume 106. The showerhead 130 can include a showerhead base and a showerhead gas distribution plate (GDP), and there can be a plurality of gas delivery holes 132 (also referred to herein as channels) throughout the GDP. Alternatively, the showerhead 130 can be replaced by a cover and nozzle in some embodiments, or by a plurality of pie-shaped showerhead compartments and a plasma generation unit in other embodiments. The chamber body 102 can be made of aluminum, stainless steel, or other suitable materials (e.g., titanium). The chamber body 102 generally includes sidewalls 108 and a bottom 110.

[0078] An outer liner 116 may be disposed adjacent the sidewall 108 to protect the chamber body 102. The outer liner 116 may be manufactured to include one or more holes. In one embodiment, the outer liner 116 is manufactured from aluminum oxide.

[0079] An exhaust port 126 may be defined in the chamber body 102 and may couple the interior volume 106 to a pump system 128. The pump system 128 may include one or more pumps and throttle valves that are used to evacuate and regulate the pressure of the interior volume 106 of the processing chamber 101.

[0080] A gas source 160 may be coupled to the processing chamber 101 to provide processing gas and / or cleaning gas to the interior volume 106 via the supply conduit 112 through the showerhead 130. A flow control device 200 may be coupled to the gas source 160 and the processing chamber 101. The flow control device 200 may be used to measure and control the flow of gas from the gas source 160 to the interior volume 106. Figure 2An exemplary flow control device 200 is described in more detail. In some embodiments, one or more gas panels 160 can be coupled to the process chamber 101 to provide gas to the interior volume 106. In such embodiments, one or more flow control systems 200 can be coupled to each gas source 160 and the process chamber 101. In other embodiments, a single flow control device 200 can be coupled to one or more gas panels 160. In some embodiments, the flow control device 200 can include a flow ratio controller to control the flow of gas to the process chamber 101 (e.g., via one or more supply conduits 112) or to other process chambers.

[0081] In some embodiments, a separate flow control device 200 is used for each gas supplied to the process chamber. In an embodiment, each flow control device 200 is or includes a gas stick assembly, as described below. Fig.17H -I Description and instructions.

[0082] A showerhead 130 may be supported on a sidewall 108 of the chamber body 102. The showerhead 130 (or lid) may be opened to allow access to the interior volume 106 of the process chamber 101 and may provide a seal for the process chamber 101 when closed. A gas source 160 may be coupled to the process chamber 101 to provide process gases and / or cleaning gases to the interior volume 106 through the showerhead 130 or lid and nozzle (e.g., through apertures in the showerhead or lid and nozzle).

[0083] In some embodiments, one or more sensor assemblies 170 can be disposed within the interior volume 106. For example, one or more sensor assemblies 170 can be located near (e.g., within 10 centimeters) the showerhead 130. As another example, one or more sensor devices can be located near (e.g., within 10 centimeters) the substrate 144, which can be used to monitor conditions near the reaction site.

[0084] In one embodiment, the substrate support assembly 148 includes a base 152 that supports an electrostatic chuck 150. The electrostatic chuck 150 further includes a thermally conductive base and an electrostatic puck bonded to the thermally conductive base by a bonding agent, which in one embodiment can be a silicone bonding agent. The thermally conductive base and / or the electrostatic puck of the electrostatic chuck 150 can include one or more optional embedded heating elements, embedded thermal insulators, and / or conduits to control the lateral temperature profile of the substrate support assembly 148. The electrostatic puck can further include a plurality of gas channels, such as grooves, mesas, and other surface features that can be formed in the upper surface of the electrostatic puck. The gas channels can be fluidly coupled to a source of thermally conductive (or backside) gas (e.g., helium) via holes drilled in the electrostatic puck. In operation, the backside gas can be provided to the gas channels at a controlled pressure to enhance thermal conduction between the electrostatic puck and the supported substrate 144. The electrostatic chuck 150 can include at least one clamping electrode controlled by a clamping power supply.

[0085] Figure 2 A flow control device 200 according to an embodiment of the present disclosure is described. The flow control device 200 can be configured to measure and control the mass flow rate of process gas and / or cleaning gas used in a manufacturing system, and thus can be considered a MFC. The flow control device 200 can be coupled to the gas source 160 and the chamber 101 via a gas flow channel 240. The gas flow channel can be connected to Figure 1 The flow control device 200 may be incorporated into a flow ratio controller or a pulsed mass flow system. In some embodiments, the flow control device 200 may be part of a gas stick assembly, as described below with reference to Fig.17H -I's elaboration.

[0086] In some embodiments, the flow control device 200 may include at least a flow modulator 210, a sensor assembly 220, and a processing device 230. Gas from the gas source 160 flows through the flow modulator 210 through a flow path 242 defined by a gas flow channel 240 and flows to the chamber 101. In other embodiments, the gas flow channel 240 may terminate somewhere outside the chamber 101. For example, the gas flow channel 240 may deliver gas to an open environment (such as an exhaust system) or a closed environment (such as a building or vehicle ventilation system). In some embodiments, the gas flow channel 240 is a gas pipeline, a branch channel of a gas pipeline, or a separate component whose inlet and outlet are assembled on the gas pipeline.

[0087] In some embodiments, the flow modulator 210 is configured to restrict the flow of gas through the flow path 242 and may include one or more flow modulating valves, each of which may be an actuatable valve, such as a solenoid valve or a piezoelectric valve. In some embodiments, in addition to the valves, the flow modulator includes other components, such as flow or temperature sensing components. In some embodiments, the flow modulator 210 functions as an MFC, such as a heat-based MFC, a pressure-based MFC, or a decay rate-based MFC.

[0088] In some embodiments where the flow modulator 210 functions as a heat-based MFC, the flow modulator 210 includes a capillary bypass channel that branches off the gas flow channel 240. Temperature sensors at the beginning and end of the capillary are used to calculate (e.g., by the processing device 230 or an onboard processing device) a temperature differential that is proportional to the gas flow rate.

[0089] In some embodiments, the sensor assembly 220 is disposed downstream of the flow modulator 210. The sensor assembly 220 may be a portion of the flow modulator 210 (e.g., adjacent to a flow modulating valve of the flow modulator 210), close to the flow modulator 210 (e.g., within 10 cm of it), close to the inlet of the chamber 101 or showerhead 130 (e.g., within 10 cm of it), or within the chamber 101 (e.g., within 10 cm of it). Figure 1 With respect to the description of sensor assembly 170, the sensor assembly may be the same as or similar to sensor assembly 220).

[0090] In some embodiments, the sensor assembly 220 includes a sensor device 222 that can be configured to generate one or more signals in response to airflow conditions. For example, the sensor device 222 can be configured to generate one or more signals indicating gas temperature or gas flow rate. Figures 4A to 10C An exemplary sensor assembly is described in more detail. In some embodiments, the sensor assembly 220 is coupled to the gas flow channel 240 so that the sensor device 222 is directly inserted into the flow path 242. The sensor assembly 220 is coupled to the gas flow channel to form a seal to prevent gas leakage. In some embodiments, the sensor assembly 220 also includes a housing, and the substrate and the sensor device 222 (e.g., a MEMS device, a hot-wire anemometer (Hot-Wire Anemometry; HWA)) are fixed to the housing via a seal (e.g., a metal seal).

[0091] In some embodiments, the processing device 230 includes a central processing unit (CPU), a microcontroller, a programmable logic controller (PLC), a system-on-chip (SoC), a server computer, or other suitable type of computing device. The processing device 230 can be configured to execute programming instructions related to the operation of the flow modulator 210. The processing device 230 receives feedback signals from the sensor device 222 and the optional flow modulator 210, and calculates the temperature, flow rate, and / or other parameters of the gas flow. The processing device 230 further transmits a control signal to the flow modulator 210 based on the received feedback signal. In some embodiments, the processing device 230 is configured for high-speed feedback processing and may include, for example, an EPM. In some embodiments, the processing device is configured to use the chamber 101 to perform a processing recipe for a manufacturing process, or one or more steps of a processing recipe. For example, a recipe may specify that a gas flow at a specific flow rate occurs at a specific time, for a specific duration, and for a specific gas. As another example, a recipe may specify a pulse of one or more gases.

[0092] Figure 3 300, which can be manufactured using manufacturing techniques familiar to those of ordinary skill in the art. Sensor device 300 includes a support structure 302 having a substantially planar shape. Support structure 302 can be formed of an insulating material or a semiconductor, such as silicon, silicon with one or more oxide layers formed thereon, or any other suitable material.

[0093] In some embodiments, sensor device 300 includes an interface region (interface region 304) at one end of the sensor device and a sensor region (e.g., sensor region 306) at the other end of the sensor device. Interface region 304 may be suitable for coupling sensor device 300 to an external device (e.g., a ceramic substrate or other substrate), for example, via electrical contact pads on the substrate (e.g., as will be described in detail in the accompanying drawings). Figures 4A to 10D and Fig.15A -G described in further detail). The sensor region 306 may define a cavity 312 across which the self-standing sensing element 308 is suspended.

[0094] Figure 3Also illustrated are electrical contacts 314 (also referred to as electrodes) that extend from one end of the sensor device 300 (e.g., one end of the interface region 304) to the other end of the sensor device 300 (e.g., the other end on the sensor region 306) and / or to the sensing element 308. The sensing element 308 can be suspended between two electrical contacts 314. In one embodiment, the sensing element 308 can be a nanowire. The electrical contacts 314 can be formed from one or more conductive metals. In certain embodiments, the sensing element 308 can be made from the same conductive metal as the electrical contacts 314. In one embodiment, the sensing element 308 and / or the electrical contacts 314 can be made from platinum. The electrodes can serve as electrical contacts to which one or more devices (e.g., the processing device 230) can be operably coupled. In some embodiments, a portion of the electrical contacts 314 can be fixed to a substrate (e.g., a ceramic substrate), as will be described below. Figures 4A to 10D The exemplary sensor assembly described in further detail in . Electrical contacts 314 may be used as electrical contacts for interfacing with such external devices, thereby forming a closed circuit during operation.

[0095] Certain embodiments described herein advantageously combine sensor devices (such as Figure 3 The sensor device described (or any other suitable sensor device) is adapted to be inserted directly into an air flow channel (such as Figure 2 240 in the process chamber, while protecting the sensor device from the corrosive effects of corrosive gases (e.g., halogen-containing gases such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, CH2F3, F, NF3, Cl2, CCl4, BCl3, SiF4, etc., and other gases such as O2 or N2O) that may be utilized in the process chamber (e.g., process chamber 101). Further embodiments described herein advantageously adapt the sensor device (e.g., Figure 3 The sensor devices described herein (or any other suitable sensor devices) include a housing configured to be mounted on a gas stick assembly. The housing of such a sensor device may include one or more channels that provide a gas flow path across a sensing element of the sensor die. In embodiments, such a sensor device may be similarly protected from corrosive effects of corrosive gases (e.g., halogen-containing gases such as C2F6, SF6, SiCl4, HBr, NF3, CF4, CHF3, CH2F3, F, NF3, Cl2, CCl4, BCl3, SiF4, etc., as well as other gases such as O2 or N2O) that may be utilized in a processing chamber (e.g., processing chamber 101).

[0096] In one example, embodiments described herein relate to sensor assemblies and materials for sensor assemblies that can be exposed to corrosive chemicals, such as those used during semiconductor processing. The sensor assemblies described herein can be adapted to protect sensor devices from corrosive chemicals while still maintaining the electrical properties, relative shapes, and geometric configurations of the sensor devices. The sensor assemblies can also be adapted to minimize the effects of turbulence on sensor device measurements (e.g., by carefully controlling the orientation and / or position of the sensor die relative to the substrate using one or more alignment features), minimize outgassing or leakage to the external environment, maintain vacuum, maintain thermal properties, maintain the sensitivity and / or measurement accuracy of the sensor device, and maintain the fast response of the sensor device. In certain embodiments, the sensor assemblies / packages described herein enable the use of fast-responding sensor devices (e.g., fast-responding MEMS-based hot-wire silicon flow sensors) in corrosive environments. In certain embodiments, the packaging described herein enables one to package and hermetically seal sensor devices (e.g., fast-responding MEMS-based hot-wire silicon flow sensors) and / or sensor assemblies without leaking to the external environment (e.g., leaks of vacuum and / or corrosive gases). In certain embodiments, the sensor assembly / package described herein enables one to position the sensor device to maximize its effectiveness in avoiding turbulent effects. In certain embodiments, the sensor assembly / package described herein enables one to position the sensor device in a symmetrical manner at the center of the flow path. In certain embodiments, the sensor assembly / package described herein enables one to optimize the coating thickness to reduce the impact on the sensitivity of the sensor device. Benefits of such an assembly / package The packaging enables the use of fast-responding sensor devices (e.g., fast-responding MEMS-based hot-wire silicon flow sensors) in corrosive environments while doing so in a compact manner (in terms of size) and in a cost-effective manner. This can advantageously provide fast and accurate measurements of gas flow and temperature almost anywhere in the tool (e.g., anywhere in a processing chamber).

[0097] Figure 4AA perspective view of a sensor assembly 400 is illustrated in accordance with an embodiment of the present disclosure. In one or more embodiments, a sensor assembly (e.g., sensor assembly 400) includes a substrate (e.g., substrate 402). In an embodiment, substrate 402 may be a ceramic substrate. In certain embodiments, a substrate (e.g., substrate 402) includes an outer region (e.g., outer region 402O) for coupling the substrate to a housing (e.g., housing 404), an inner region (e.g., inner region 402I) for coupling a sensor device (e.g., sensor device 300) to the substrate, and an intermediate region (e.g., intermediate region 402M) positioned between the outer region and the inner region. The term "external region" as used herein with respect to substrate 402 or any substrate described in any other figure refers to an area of ​​the substrate that is adjacent to an external environment outside of gas fluid channel 240. The term "internal region" as used herein with respect to substrate 402 or any substrate described in any other figure refers to an area of ​​the substrate that is adjacent to an internal environment inside gas fluid channel 240. The term “intermediate region” used herein with respect to substrate 402 or any substrate described in any other figure refers to a region of the substrate between the outer region and the inner region. In an embodiment, the intermediate region can be used to couple substrate 402 to housing 404.

[0098] In some embodiments, the substrate may be made of a dielectric material, such as sapphire. Sapphire may be a suitable substrate material because it has good corrosion resistance and can be machined into a suitable shape. In some embodiments, the substrate is a ceramic substrate. In some embodiments, the dielectric substrate (e.g., a sapphire substrate) can be machined into a suitable shape according to methods known to those skilled in the art. In some embodiments, the substrate 402 may have an elongated body (e.g., a cylindrical shape) with rounded edges. In some embodiments, the substrate 402 has a cylindrical shape in its outer region 402O and at least a portion of its middle region 402M, and the cylindrical shape transitions to a semi-cylindrical shape in its inner region 402I.

[0099] In certain embodiments, the substrate (e.g., substrate 402) may further include electrical contact pads (e.g., electrical contact pads 414) located at least on the inner region of the substrate. In one embodiment, substrate 402 includes electrical contact pads 414 on a flat surface of the semi-cylindrical shape of the inner region 402I. The electrical contacts 314 on the interface region of the sensor device 300 may be fixed to the electrical contact pads 414 on the inner region of the substrate (e.g., fixed via a metal seal or a bond). The electrical contacts 314 on the sensor device, the electrical contact pads 414 on the substrate, and one or more external devices (e.g., the processing device 230) together form a closed circuit during operation. The electrical contact pads (e.g., 414) on the substrate may be the same conductive material as the electrical contact pads 314 on the sensor device. For example, in one embodiment, the electrical contact pads 414 are made of platinum and may be metallized on the flat surface of the inner region 402I of the substrate 402 via a procedure known to a technician.

[0100] In an embodiment, alignment features in sensor device 300 and / or substrate 402 are used to align the sensor die with the substrate before and / or during bonding. Such alignment features will be referred to below. Figures 14A-15D , 16A and 16D-16F. In an embodiment, the sensor device 300 is bonded to the substrate 402 using one or more metal bonding techniques, such as reference Fig.15E -G and discussion of 16B-16C.

[0101] In some embodiments, the substrate (e.g., substrate 402) can be coupled to a housing (e.g., housing 404) at its outer region (e.g., 402O) to form an airtight seal. In some embodiments, the housing can be made of stainless steel, nickel alloys (e.g., C-276 alloy, which is an alloy of nickel, molybdenum and chromium), Kovar (e.g., a nickel-cobalt-iron alloy), or another suitable material. In one embodiment, the housing can be made of stainless steel. In certain embodiments, the substrate can be secured to the housing via a metal seal or bond (e.g., via brazing or via copper welding) to minimize gas leakage from the processing chamber environment to the external environment. In certain embodiments, the substrate can be further secured to the housing via at least one additional leak-proof seal (e.g., a countersunk C-shaped seal). In certain embodiments, an O-ring can be further disposed between the substrate and the housing to further promote an airtight seal between the substrate and the housing and to minimize and / or eliminate vacuum leaks and / or leakage of corrosive gases from the gas channel 240 through the sensor assembly 400. In certain embodiments, a cap can be placed between the substrate and the housing to engage (e.g., compress) the O-ring. In some embodiments, the cap can be secured to the housing by one or more fasteners (e.g., bolts, screws, etc.).

[0102] exist Figure 4A In the illustrated embodiment, the substrate 402 is further machined to define a conductor pin hole extending from the top of the outer region 402O through the middle region 402M to at least a portion of the inner region 402I over the entire length of the substrate. In certain embodiments, the substrate 402 further includes a conductor pin 416 within the conductor pin hole, wherein the conductor pin 416 extends into at least a portion of the inner region 402I of the substrate 402 over the entire inner region 402O and the middle region 402M of the substrate 402. In certain embodiments, the conductor pin 416 is fixed to an electrical contact pad 414 disposed on the inner region 402I of the substrate 402 via, for example, a metal seal. The electrical contacts 314 on the sensor device, the electrical contact pads 414 on the substrate, and the conductor pin 416, and one or more external devices (e.g., the processing device 230) together form a closed circuit during operation. The conductor pin (e.g., 416) extending over the entire substrate can be the same conductive material as the electrical contact pad 314 on the sensor device. For example, in one embodiment, the conductor pin 416 is made of platinum.

[0103] Figure 4B Explained Figure 4A FIG. 4 is an enlarged view of area A in which the connections between the sensor device 300, the substrate 402, the electrical contact pads 414 and the conductor pins 416 are enlarged. Figure 4B In the illustrated embodiment, the sensor device 300 is coupled to an electrical contact pad 414 on the interior region 402I of the substrate 402 via its electrical contacts 314. In one embodiment, the sensor device is coupled to the electrical contact pad 414 via a first seal or bond 420A (which may be a metal seal or bond). As discussed in more detail below, the first metal seal or bond may be a platinum-to-platinum bond (which, for example, comes from welding two platinum contacts) or a metal bond including multiple metals (e.g., multiple different metal layers) created using a multilayer reactive foil (e.g., a nano-laminated foil) having alternating layers of two different metals. In other embodiments, the sensor device is coupled to the electrical contact pad 414 via a welded joint (e.g., by electron beam welding or laser welding, etc.) or a brazed joint (e.g., using a brazing alloy). In certain embodiments, the sensor device is secured to the substrate such that the support structure (e.g., 302) of the sensor device (e.g., 300) is in a vertical orientation relative to the direction of the gas flow (e.g., 242), as will be described in detail below. Figure 4C In some embodiments, the sensor device is fixed to the substrate so that the elongated support structure of the sensor device is oriented parallel to the airflow direction, such as at least Fig.6DThe sensor assembly shown is further illustrated. Targeted orientation of the sensor device 300 relative to the substrate 402 can be achieved through the use of one or more alignment features, as further described below.

[0104] In one embodiment, the outer region 402O of the base plate 402 is coupled / secured to the housing 404 via a second seal or bond 420B (which may be a metal seal or bond), such as with a second braze alloy or welded joint. In certain embodiments, the outer region 402O of the base plate 402 may also be secured to the housing 404 via at least one additional leak-proof seal (e.g., a countersunk C-seal).

[0105] exist Figure 4B In the illustrated embodiment, the conductor pin 416 is coupled / fixed to the electrical contact pad 414 on the inner region 402I of the substrate 402. In one embodiment, the conductor pin 416 is fixed to the electrical contact pad 414 via a third seal or bond 420C (which may be a metal seal or bond), such as with a third braze alloy or welded joint, or a metal bond formed using a multi-layer reactive foil (e.g., a nano-laminated foil). In certain embodiments, the conductor pin 416 may be further fixed to the substrate 402 via a fourth seal or bond 420D (which may be a metal seal or bond), such as with a fourth braze alloy or weld, such as at the middle region 402M, to form a hermetic seal to minimize or eliminate vacuum leakage and / or gas (e.g., corrosive gas) from the gas channel 240 through the conductor pin holes in the substrate 402 (through which the conductor pin 416 passes).

[0106] Each of the first seal, the second seal, the third seal, and the fourth seal, if present, can independently include an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ni-Al alloy, a Ti alloy, or a combination thereof. In certain embodiments, the brazing alloy, the multilayer reactive foil, or the welding material used for all seals is the same. In other embodiments, two or more different brazing alloys or metal bond materials can be used for different seals. In one embodiment, at least one of seals 420A, 420B, 420C, or 420D includes Sn-Ag-Ti as a brazing alloy. It should be understood that the names of "first seal", "second seal", "third seal", "fourth seal", etc. should not be interpreted as binding on the order of combining the various components in the sensor assembly described herein, nor should they be interpreted as binding on the total number of seals in the sensor assembly. Instead, these names are used only for the convenience of distinguishing one seal from another. The following will be described in detail. Fig.11A-B and 16A-F describe in more detail exemplary methods for making the various sensor assemblies described herein.

[0107] In some embodiments, the sensor assembly (e.g., sensor assembly 400) further includes a non-conductive conformal coating on one or more surfaces or on at least a portion of the sensor assembly. The conformal coating may be an anti-corrosion coating. In some embodiments, the coating covers part or all of the sensor device (e.g., 300). In some embodiments, the coating covers part or all of the sensor region 306 and / or the interface region 304 of the sensor device 300. In some embodiments, the coating covers part or all of the sensor region 306, including part or all of the sensing element 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing element 308. In some embodiments, the coating covers part or all of the substrate 402. In some embodiments, the coating covers the electrodes of the sensor device 300, the electrical contact pads of the substrate 402, and / or the metal bonds between the sensor device 300 and / or the substrate 402. In some embodiments, the coating covers part or all of the outer region 402O, the middle region 402M, and / or the inner region 402I. In some embodiments, the coating covers part or all of the interior region 402I, including part or all of the electrical contact pads 414. In some embodiments, the coating covers part or all of the middle region 402M, including part or all of the conductor pins 416. In some embodiments, the coating covers part or all of the various seals (e.g., first seal 420A, second seal 420B, third seal 420C, and / or fourth seal 420D). In some embodiments, the sensor assembly can remain completely uncoated.

[0108] In some embodiments, the sensor assembly is first assembled so that electrical contacts are formed between all components of the sensor assembly (e.g., between the sensor device and the substrate, and between the substrate and the conductor pins), after which the assembled sensor assembly is coated so that the coating covers portions of the sensor assembly that are exposed to the airflow when the sensor assembly is coupled to the airflow channel, as described below. Figure 4C discussion.

[0109] In some embodiments, the coating is deposited using, for example, ALD, IAD, low pressure plasma spray (LPPS), chemical vapor deposition (CVD), plasma spray chemical vapor deposition (PS-CVD), sputtering, combinations thereof, or other techniques suitable for forming conformal coatings, or modifications thereof. In some embodiments, the coating comprises a ceramic material that is resistant to corrosion by the process gas or reactive species. For example, in some embodiments, the coating may comprise a plasma resistant ceramic coating comprising a rare earth ceramic selected from the group consisting of Y2O3, YZrO, Yx Zr y O z 、YZrOF、Y3Al5O 12 、Y4Al2O9、YF3、Y x O y F z 、YOF、Er2O3、Er3Al5O 12 、ErF3、E x O y F z , ErOF, La2O3, Lu2O3, Sc2O3, ScF3, ScOF, Gd2O3, Sm2O3, Dy2O3, Y2O3-ZrO2 solid solution, ceramics including Y2Al4O9 and Y2O3-ZrO2 solid solution, or combinations thereof. In some embodiments, the coating comprises Al2O3. In one embodiment, the coating comprises Al2O3 deposited by atomic layer deposition (ALD). In some embodiments, the coating is substantially uniform in thickness, conformal to the underlying surface being coated, free of pores and cracks, can act as a diffusion barrier to metallic contaminants, and has a high purity (e.g., greater than about 99% purity, or greater than about 99.95% purity). In certain embodiments, ALD can be advantageously used to coat all dimensions of the sensor assembly. In some embodiments, the coating can resist cracking and / or delamination at various temperatures (e.g., up to 350°C).

[0110] In certain embodiments, the coating can have a uniform thickness having a thickness variation of less than about + / - 20%, a thickness variation of less than about + / - 10%, a thickness variation of less than about + / - 5%, or less when the coating thickness at one location is compared to the coating thickness at another location (or when the coating thickness at one location is compared to an average thickness of the coating, or when the standard deviation of the coating thickness in several locations is evaluated).

[0111] In certain embodiments, the coating can be conformal to the underlying surface being coated, including underlying surface features and / or complex geometries and / or portions of the coating having a high aspect ratio. For example, the coating can conformally and uniformly coat portions having a high aspect ratio (e.g., length:width (L:W) or length:diameter (L:D) ranging from about 2:1 to about 500:1, about 5:1 to about 300:1, about 10:1 to about 150:1, about 15:1 to about 100:1, or about 20:1 to about 50:1).

[0112] In some embodiments, the coating can be very dense and have very low porosity, for example, a porosity of less than about 1%, less than about 0.5%, less than about 0.1%, or no porosity (0% porosity). In some embodiments, the coating can have a crack-free microstructure, be airtight, and have a high dielectric breakdown resistance.

[0113] In certain embodiments, the coating can be deposited at low deposition temperatures (eg, deposition temperatures up to 350° C.), which can enable it to be used with a wide variety of materials.

[0114] Figure 4D 1 illustrates a cross-sectional view of a conformal coating formed on a surface of an exemplary sensor assembly according to an embodiment of the present disclosure. Figure 4D A coating 420 on a portion of a sensor assembly 400 is illustrated, which portion may be any portion of the sensor assembly 400 described herein. In a similar manner, the coating 420 may be deposited on any portion of any other sensor assembly described herein. In some embodiments, the coating comprises a plurality of layers 422A-422D deposited in succession. In some embodiments, there may be more or less layers than shown, and the number of layers may range from 1 to 100 layers, up to 500 layers, or more layers. For example, multiple atomically thin or nearly atomically thin layers may be deposited, for example, using ALD. In some embodiments, the composition of each of the layers 422A-422D may be alternating. In some embodiments, the total thickness of the coating may range from 10 nanometers to 500 nanometers, any sub-range therein, or any single value therein. In certain embodiments, the thickness of the coating is optimized so as to reduce the effect of the coating on the measurement sensitivity while also protecting the sensor assembly (and the various components of the sensor assembly) from the effects of the corrosive chemicals to which the sensor assembly may be exposed during processing.

[0115] Figure 4C A cross-sectional side view of an exemplary flow channel (e.g., flow channel 240) is illustrated in accordance with an embodiment of the present disclosure. Figure 4A As shown in this figure, the sensor assembly 400 can be mounted on a manifold (e.g., a K1S T manifold (having a T-fitting 492)) via a suitable seal (e.g., a leak-proof seal (e.g., a C-seal)). The manifold can be coupled to the airflow channel 240 (e.g., a pipe) at opposite ends.

[0116] In some embodiments, the housing (e.g., housing 404) may include a gas-facing surface 460 and an opposing surface 470 that is opposite to the gas-facing surface. The housing 404 may have at least one slot (e.g., slot 480B) formed through the housing and configured to receive a substrate (e.g., substrate 402). The substrate 402 may be inserted into the slot (e.g., slot 480B) such that an interior region 402I of the substrate extends from the gas-facing surface 460, for example, to an interior environment of the gas flow channel (e.g., gas flow channel 240). In some embodiments, the housing 404 may include at least one additional slot (e.g., 480A and 480C) that may be configured to mount the housing 404 on the gas flow channel 240, for example, via a suitable manifold and / or a suitable seal (e.g., C-shaped seal 490) and / or via a suitable joint (e.g., T-shaped joint 492). The seal 490 may be a gas-tight seal to prevent gas from leaking from the gas flow channel 240 to the external environment. In some embodiments, seal 490 is a metal seal, such as formed by brazing or welding.

[0117] Figure 5A A perspective view of a sensor assembly 500 is illustrated in accordance with an embodiment of the present disclosure. In one or more embodiments, a sensor assembly (e.g., sensor assembly 500) includes a substrate (e.g., substrate 502). In some embodiments, the substrate (e.g., substrate 502) includes an outer region (e.g., outer region 502O) that is optionally used to couple the substrate to a housing (e.g., housing 504), an inner region (e.g., inner region 502I) that is used to couple a sensor device (e.g., sensor device 300) to the substrate, and an intermediate region (e.g., intermediate region 502M) that is positioned between the outer region and the inner region (and is optionally used to couple the substrate to the housing). In some embodiments, the dielectric substrate may be a multilayer ceramic made of a plurality of ceramic sheets. The multilayer ceramic substrate may be made of any dielectric ceramic material that can be formed into a suitable shape. In some embodiments, the dielectric multilayer ceramic substrate may be made of aluminum oxide (Al2O3) or aluminum nitride (AlN). In some embodiments, the substrate may be made of AlN, Si, SiC, Al2O3, SiO2, and the like. Multilayer ceramic substrates can be advantageously used due to their high strength, good insulation, low coefficient of thermal expansion, and good chemical stability. Multilayer ceramics can be made by methods known to those skilled in the art, such as by processing including, but not limited to, one or more of the following operations: tapecasting, tape cutting, framing, via punching, via filling, screen printing, lamination, cutting, co-firing, nickel plating, gold plating, or a combination thereof.

[0118] Figure 5C Embodiments according to the present disclosure are described, including Figure 5A A perspective view of the multilayer ceramic substrate in the sensor assembly. Figure 5D Explained Figure 5C Side view of a multilayer ceramic substrate. Figure 5E Explained Figure 5C A top view of a multilayer ceramic substrate. Figure 5C-5E In the illustrated embodiment, two ceramic sheets are shown (e.g., a first layer 502A and a second layer 502B covering a portion of the first layer 502A). In the depicted embodiment, the ceramic layers 502A and 502B are in contact so that an airtight seal is achieved between the layers. In the illustrated embodiment, an electrical contact pad 514 is formed / built-in between the layers of the multilayer ceramic substrate 502 (e.g., the electrical contact pad 514 is formed between the first ceramic layer 502A and the second ceramic layer 502B). The electrical contact pad 514 extends from its outer region 502O to its inner region 502I throughout the multilayer ceramic substrate. One advantage of such a substrate is that an airtight seal is achieved between the ceramic layers of the multilayer ceramic and between the electrical contact pads formed between the layers. Such an airtight seal reduces the number of fixed positions of the various components of the sensor assembly (optionally fixed via metal seals (e.g., via brazing or welding)) and minimizes potential locations for vacuum and / or gas leakage from the internal environment in the gas channel 240.

[0119] Although in Figure 5C-5E 5 shows substrate 502 as having sharp corners (e.g., each layer has a rectangular shape), but the present disclosure also contemplates multilayer ceramic substrates having rounded shapes with rounded edges, similar to the shape described for substrate 402 in sensor assembly 400. In certain embodiments, other substrate shapes may be used, and the present disclosure should not be construed as being limited to only the shapes shown in the drawings.

[0120] In a certain embodiment, the electrical contacts 314 on the interface region of the sensor device 300 can be fixed to the electrical contact pads 514 on the inner region 502I of the substrate 502 (for example, fixed via a metal seal). The electrical contacts 314 on the sensor device, the electrical contact pads 514 on the substrate, and one or more external devices (for example, the processing device 230) together form a closed circuit during operation. The electrical contact pads (for example, 514) located between the layers of the multilayer ceramic substrate 502 can be the same conductive material as the electrical contact pads 314 on the sensor device. For example, in one embodiment, the electrical contact pads 514 are made of platinum.

[0121] In some embodiments, the substrate (e.g., substrate 502) may be coupled to a housing (e.g., housing 504) at its outer region (e.g., 502O) or intermediate region. In some embodiments, the housing may be made of stainless steel, nickel alloy (e.g., The substrate may be made of a C-276 alloy, which is an alloy of nickel, molybdenum and chromium), Kovar (e.g., a nickel-cobalt-iron alloy), or another suitable material. In one embodiment, the housing may be made of stainless steel. In some embodiments, the substrate may be secured to the housing via a metal seal (e.g., via brazing or via copper welding) to minimize gas leakage from the processing chamber environment to the external environment. In some embodiments, the substrate may be further secured to the housing via at least one additional leak-proof seal (e.g., a countersunk C-seal).

[0122] In some embodiments, an O-ring 580 may be further disposed between the substrate 502 and the housing 504 to further promote a hermetic seal between the substrate and the housing and minimize and / or eliminate vacuum leaks and / or leakage of corrosive gases from the gas channel 240 through the sensor assembly 500. In some embodiments, a cap may be placed between the substrate and the housing to engage (e.g., compress) the O-ring. The cap may be tightened onto the housing using screws, bolts, or other fasteners to engage the O-ring.

[0123] Figure 5B Explained Figure 5A FIG. 5 is an enlarged view of area B in which the connection between the sensor device 300, the substrate 502 and the electrical contact pad 514 is enlarged. Figure 5B In the illustrated embodiment, the sensor device 300 is coupled to an electrical contact pad 514 on an interior region 502I of the substrate 502 via its electrical contacts 314. In one embodiment, the sensor device is coupled to the electrical contact pad 514 via a first seal or bond 520A, which may be a metal seal or bond formed by welding, using a multi-layer reactive foil, welding, or brazing (e.g., using a first brazing alloy). In certain embodiments, the sensor device is fixed to the substrate so that the support structure (e.g., 302) of the sensor device (e.g., 300) is in a vertical orientation relative to the direction of the airflow (e.g., 242), as will be described in detail below. Fig. 5F In some embodiments, the sensor device is fixed to the substrate so that the elongated support structure of the sensor device is oriented parallel to the airflow direction, such as at least Fig.6D The sensor assembly shown is further illustrated. In embodiments, the orientation and placement of the sensor device 300 relative to the substrate 502 can be controlled using one or more alignment features, as described in more detail below.

[0124] In one embodiment, the outer region 502O of the substrate 502 is coupled / secured to the housing 504 via a second seal or bond 520B (which may be a metal seal or bond), such as with a second braze alloy, welding, etc. In certain embodiments, the outer region 502O of the substrate 502 may also be secured to the housing 504 via at least one additional leak-proof seal (e.g., a countersunk C-seal). In certain embodiments, the substrate is secured to the housing via a hermetic seal to minimize and / or eliminate leakage of vacuum and / or gas from the gas passage 240.

[0125] Each of the first seal (520A) and the second seal (520B), if present, can independently include Al alloys, Ag alloys, Au alloys, Ni alloys, Si alloys, Au-Ni alloys, Ni-Pd alloys, Ni-Y alloys, Al-Ni alloys, Ti alloys, or combinations thereof. In certain embodiments, the alloy or metal used for all seals / combinations is the same. In other embodiments, two or more different alloys / metals may be used for different seals / combinations. In one embodiment, at least one of seals 520A or 520B includes Ag-Cu as a brazing alloy. It should be understood that the names of "first seal", "second seal", etc. should not be interpreted as binding on the order of combination of the various components in the sensor assembly described herein, nor should they be interpreted as binding on the total number of seals in the sensor assembly. Instead, these names are used only for the convenience of distinguishing one seal from another. The following will be described in detail. Fig.11A -B and Fig.16A -F describes in more detail exemplary methods for making the various sensor assemblies described herein.

[0126] In some embodiments, the sensor assembly (e.g., sensor assembly 500) further includes a non-conductive conformal coating on one or more surfaces or on at least a portion of the sensor assembly. The conformal coating may be an anti-corrosion coating. In some embodiments, the coating covers part or all of the sensor device (e.g., 300). In some embodiments, the coating covers part or all of the sensor region 306 and / or the interface region 304 of the sensor device 300. In some embodiments, the coating covers part or all of the sensor region 306, including part or all of the sensing element 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing element 308. In some embodiments, the coating covers part or all of the substrate 502. In some embodiments, the coating covers part or all of the outer region 502O, the middle region 502M, and / or the inner region 502I. In some embodiments, the coating covers part or all of the inner region 502I, including part or all of the electrical contact pads 514. In some embodiments, the coating covers part or all of the middle region 502M. In some embodiments, the coating covers part or all of the various seals (e.g., first seal 520A and / or second seal 520B). In some embodiments, sensor assembly 500 is first assembled to form electrical contacts between all components of the sensor assembly (e.g., between the sensor device and the substrate), and thereafter the assembled sensor assembly is coated such that the coating covers portions of the sensor assembly that are exposed to airflow when the sensor assembly is coupled to an airflow channel, as described below. Fig. 5F In some embodiments, the coating deposited on at least a portion of sensor assembly 500 can be similar to the coatings described above as suitable for coating at least a portion of sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, and the like). In certain embodiments, sensor assembly 500 remains completely free of coating.

[0127] Fig. 5F A cross-sectional side view of an exemplary flow channel (e.g., flow channel 240) is illustrated in accordance with an embodiment of the present disclosure. Figure 5A As shown in this figure, the sensor assembly 500 can be mounted on a manifold (e.g., a K1S T manifold (having a T-fitting 592)) via a suitable seal (e.g., a leak-proof seal (e.g., a C-shaped seal)). The manifold can be coupled to the airflow channel 240 (e.g., a pipe) at opposite ends.

[0128] In some embodiments, the housing (e.g., housing 504) may include a gas-facing surface 560 and an opposing surface 570 that is opposite to the gas-facing surface. The housing 504 may have at least one slot (e.g., slot 580B) formed through the housing and configured to receive a substrate (e.g., substrate 502). The substrate 502 may be inserted into the slot (e.g., slot 580B) such that an interior region 502I of the substrate extends from the gas-facing surface 560, e.g., to an interior environment of a gas flow channel (e.g., gas flow channel 240). In some embodiments, the housing 504 may include at least one additional slot (e.g., 580A and 580C) that may be configured to mount the housing 504 on the gas flow channel 240, e.g., via a suitable manifold and / or via a suitable seal (e.g., C-shaped seal 590) and / or via a suitable joint (e.g., T-shaped joint 592). The seal 590 may be a gas-tight seal to prevent gas from leaking from the gas flow channel 240 to the external environment. In some embodiments, seal 590 is a metal seal, such as formed by brazing or welding.

[0129] Although sensor assembly 400 and sensor assembly 500 illustrate embodiments in which sensor device 300 is fixed to a corresponding substrate such that the support structure of the sensor device is oriented vertically relative to the airflow direction (e.g., 242), in some embodiments, sensor device 300 may also be fixed to a substrate such that the support structure of the sensor device is oriented parallel to the airflow direction (e.g., 242). Such exemplary embodiments will at least Fig.6D The sensor assembly 600 is described in detail.

[0130] Fig. 6A A perspective view of a sensor assembly 600 is illustrated in accordance with an embodiment of the present disclosure. In one or more embodiments, a sensor assembly (e.g., sensor assembly 600) includes a substrate (e.g., substrate 602). In certain embodiments, the substrate (e.g., substrate 602) includes an outer region (e.g., outer region 602O) that is optionally used to couple the substrate to a housing (e.g., housing 604), an inner region (e.g., inner region 602I) that is used to couple a sensor device (e.g., sensor device 300) to the substrate, and an intermediate region (e.g., intermediate region 602M) that is positioned between the outer region and the inner region and is optionally used to connect the sensor device to the housing.

[0131] Figure 6C According to an embodiment of the present disclosure, a substrate (e.g., including Fig. 6A A perspective view of a substrate in a sensor assembly 600. Figure 6C In the embodiments described in , the substrate is made of a dielectric material, such as sapphire or ceramic. Figure 6C In the embodiment described in , the substrate is a machined sapphire with rounded edges. The substrate 602 shown has a cylindrical shape in its middle region 602M. In the illustrated embodiment, the cylindrical shape of region 602M transitions to a semi-cylindrical shape in the inner region 602I. In the illustrated embodiment, the cylindrical shape of region 602M continues into a portion of the outer region 602O until it reaches the top of the outer region 602O. In the illustrated embodiment, the top of the outer region 602O is configured as a disk having a diameter greater than the diameter of the cylindrical portion in regions 602O and 602M. The substrate shown further defines conductor pinholes 616H, which extend from the top of the outer region 602O of the substrate 602 to the bottom of the inner region 602I of the substrate 602 and are configured to receive conductor pins 616, as will be described in more detail below. In certain embodiments, a substrate with rounded edges (whether sapphire or multilayer ceramic) can relieve stress, which can extend the operating life of the sensor assembly. The base plate 602 may be machined into the shape shown or any other suitable shape by means known to those skilled in the art.

[0132] In a certain embodiment, the substrate (e.g., substrate 602) may further include electrical contact pads (e.g., electrical contact pads 614) located at least on the interior region of the substrate. The electrical contacts 314 on the interface region of the sensor device 300 may be fixed to the electrical contact pads 614 on the interior region of the substrate (e.g., fixed via a metal seal). The electrical contacts 314 on the sensor device, the electrical contact pads 614 on the substrate, and one or more external devices (e.g., processing device 230) together form a closed circuit during operation. The electrical contact pads (e.g., 614) on the substrate may be the same conductive material as the electrical contact pads 314 on the sensor device. For example, in one embodiment, the electrical contact pads 614 are platinum and can be metallized on the substrate (e.g., machined sapphire substrate 602) via procedures known to those skilled in the art.

[0133] In some embodiments, the substrate (e.g., substrate 602) may be coupled to a housing (e.g., housing 604) at its outer region (e.g., 602O) and / or middle region 602M. In some embodiments, the housing may be made of stainless steel, nickel alloy (e.g., The housing may be made of a C-276 alloy, which is an alloy of nickel, molybdenum and chromium), Kovar (e.g., a nickel-cobalt-iron alloy), or another suitable material. In one embodiment, the housing may be made of stainless steel. In certain embodiments, the substrate may be secured to the housing via a metal seal or bond (e.g., via brazing, welding, or via brazing) to minimize gas leakage from the processing chamber environment to the external environment.

[0134] In some embodiments, an O-ring may be further disposed between the substrate 602 and the housing 604 to further promote an airtight seal between the substrate and the housing and minimize and / or eliminate vacuum leaks and / or leakage of corrosive gases from the gas channel 240 through the sensor assembly 600. In some embodiments, a cap may be placed between the substrate and the housing to engage (e.g., compress) the O-ring. The cap may be secured by one or more fasteners (e.g., screws, bolts, etc.).

[0135] exist Fig. 6A In the illustrated embodiment, the substrate 602 further includes conductor pins 616 extending throughout the outer region 602O and the middle region 602M of the substrate 602, all the way to the bottom of the inner region 602I of the substrate 602. The conductor pins 616 are received in the substrate 602 through conductor pin holes 616H extending from the top of the outer region 602O of the substrate 602 to the bottom of the inner region 602I of the substrate 602. In some embodiments, the conductor pins 616 are fixed to electrical contact pads 614, which are disposed at the bottom of the inner region 602I of the substrate 602. The electrical contacts 314 on the sensor device, the electrical contact pads 614 on the substrate, and the conductor pins 616 and one or more external devices (e.g., the processing device 230) together form a closed circuit during operation. The conductor pins (e.g., 616) extending throughout the substrate can be made of the same conductive material as the electrical contact pads 314 on the sensor device. For example, in one embodiment, the conductor pins 616 are made of platinum.

[0136] Figure 6B Explained Fig. 6A FIG. 6 is an enlarged view of area C in FIG. 60 , in which the connection between the sensor device 300 and the substrate 602 is enlarged. Figure 6B In the illustrated embodiment, the sensor device 300 is coupled to an electrical contact pad 614 on an interior region 602I of the substrate 602 via its electrical contacts 314. In one embodiment, the sensor device is coupled to the electrical contact pad 614 via a first seal or bond 620A (which may be a metal seal or bond), such as with metal welding, a first brazing alloy, or a multilayer reactive foil (e.g., a nanolaminated foil). The first seal 620A may include a welded seal (e.g., a welded joint). In certain embodiments, the sensor device is secured to the substrate such that a support structure (e.g., 302) of the sensor device (e.g., 300) is in a parallel orientation relative to an airflow direction (e.g., 242), such as will be described in detail below. Fig.6DFurther explained. One of the main differences between sensor assembly 600 and sensor assembly 400 is the orientation of sensor device 300. In some embodiments, measurements obtained from a sensor assembly having a sensor device fixed in a parallel orientation can be less affected by recirculation and / or turbulence of the gas flow, and the conductivity through the flow path can be improved. In some embodiments, a sensor device (e.g., sensor device 300) fixed to a substrate in a parallel orientation (relative to the gas flow direction, such as 242) causes recirculation of gas further away from the sensor tip, which has minimal effect on the accuracy of the sensor measurement. In an embodiment, one or more alignment features can ensure proper alignment of sensor device 300 with substrate 602.

[0137] In one embodiment, the outer region 602O and / or the middle region 602M of the substrate 602 are coupled / secured to the housing 604 via a second seal or bond 620B (which may be a metal seal or bond), for example, using a second brazing alloy, a weld joint, etc., and / or via a third seal or bond 620C (which may also be a metal seal or bond), for example, using a third brazing alloy, a weld joint, etc. In certain embodiments, the outer region 602O of the substrate 602 may be further secured to the housing 604 via at least one additional seal, for example, a leak-proof seal (e.g., a countersunk C-shaped seal).

[0138] exist Figure 6B In the illustrated embodiment, the conductor pin 616 can be coupled / fixed to the electrical contact pad 614 and / or to the sensor device 300 at the bottom of the inner region 602I of the substrate 602 via a fourth seal or bond 620D (which can be a metal seal or bond), for example, using a fourth brazing alloy, welding, etc. In some embodiments, the conductor pin 616 can also be fixed to the substrate 602 (e.g., at the bottom of the inner region 602I), for example, using a fifth brazing alloy, via a fifth seal 620E (which can be a metal seal). In some embodiments, the conductor pin 616 can be fixed to the substrate 602 via a seal to minimize and / or eliminate vacuum leakage and / or corrosive gas leakage from the gas channel 240 through the sensor assembly 600 (e.g., through the conductor pin hole 616H through which the conductor pin 616 passes).

[0139] Each of the first seal (620A), the second seal (620B), the third seal (620C), the fourth seal (620D) and the fifth seal (620E), if present, can independently include an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, an Al-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ti alloy or a combination thereof. In certain embodiments, the brazing alloy or weld used for all seals / combinations is the same. In other embodiments, two or more different brazing alloys or metal welds can be used for different seals / combinations. In one embodiment, at least one of seals 620A, 620B, 620C, 620D or 620E includes Sn-Ag-Ti as the brazing alloy. It should be understood that the names of "first seal", "second seal", "third seal", "fourth seal", "fifth seal", etc. should not be interpreted as binding on the order of combining the various components in the sensor assembly described herein, nor should they be interpreted as binding on the total number of seals in the sensor assembly. Instead, these names are used only for the convenience of distinguishing one seal from another. Fig.11A -B and 16A-F describe in more detail exemplary methods for making the various sensor assemblies described herein.

[0140] In some embodiments, the sensor assembly (e.g., sensor assembly 600) further includes a non-conductive conformal coating on one or more surfaces or on at least a portion of the sensor assembly. The conformal coating may be an anti-corrosion coating. In some embodiments, the coating covers part or all of the sensor device (e.g., 300). In some embodiments, the coating covers part or all of the sensor region 306 and / or the interface region 304 of the sensor device 300. In some embodiments, the coating covers part or all of the sensor region 306, including part or all of the sensing element 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing element 308. In some embodiments, the coating covers part or all of the substrate 602. In some embodiments, the coating covers part or all of the outer region 602O, the middle region 602M, and / or the inner region 602I. In some embodiments, the coating covers part or all of the inner region 602I, including part or all of the electrical contact pads 614 and / or the conductor pins 616. In some embodiments, the coating covers part or all of the middle region 602M. In some embodiments, the coating covers part or all of the various seals (e.g., first seal 620A, second seal 620B, third seal 620C, fourth seal 620D, and / or fifth seal 620E). In some embodiments, the sensor assembly is first assembled so that electrical contacts are formed between all components of the sensor assembly (e.g., between the sensor device, the conductor pins, and the substrate), and thereafter the assembled sensor assembly is coated so that the coating covers at least portions of the sensor assembly that are exposed to the airflow when the sensor assembly is coupled to the airflow channel, as described below. Fig.6D . In some embodiments, if the coating covers the conductor pin 616 at a top side portion of the outer region 602O of the substrate 602 (e.g., the top side portion is the portion that is exposed to the external environment and extends from the opposite surface 670 of the housing that is opposite to the gas-facing surface 660), then a portion of the coating can be uncovered (e.g., etched) to expose at least a portion of the conductor pin 616. However, the exposed portion of the conductor pin 616 (in the external environment) can be coupled to one or more external devices (e.g., the processing device 230) to form a closed circuit during operation. In some embodiments, the sensor assembly 600 remains completely uncoated.

[0141] In some embodiments, the coating deposited on at least a portion of sensor assembly 600 can be similar to the coating described above as suitable for coating at least a portion of sensor assembly 400 (e.g., similar in deposition technique, coating composition / materials, and / or coating uniformity, conformality, porosity, architecture, and the like).

[0142] Fig.6DA cross-sectional side view of an exemplary flow channel (e.g., flow channel 240) is illustrated in accordance with an embodiment of the present disclosure. Fig. 6A The sensor assembly 600 is coupled.

[0143] In some embodiments, the housing (e.g., housing 604) may include a gas-facing surface 660 and an opposing surface 670 that is opposite to the gas-facing surface. The housing 604 may have at least one slot (e.g., slot 680B) formed through the housing and configured to receive a substrate (e.g., substrate 602). The substrate 602 may be inserted into the slot (e.g., slot 680B) such that an interior region 602I of the substrate extends from the gas-facing surface 660, for example, to an interior environment of a gas flow channel (e.g., gas flow channel 240). In some embodiments, the housing 604 may include at least one additional slot (e.g., 680A and 680C) that may be configured to mount the housing 604 on the gas flow channel 240, for example, via a suitable manifold (e.g., K1H manifold) and / or via a suitable seal (e.g., C-shaped seal 690) and / or via a suitable joint. The seal 690 may be a gas-tight seal to prevent gas from leaking from the gas flow channel 240. In some embodiments, seal 690 is a metal seal, such as formed by brazing or welding.

[0144] In some embodiments, the size of sensor assembly 600 is larger than the size of sensor assemblies 400 and 500 because substrate 602 is inserted into slot 680B with sensor device 300 secured to substrate 602 in a parallel orientation relative to the direction of airflow 242 (rather than a perpendicular orientation as shown in sensor assemblies 400 and 500). In some embodiments, slot 680B can be configured to accommodate insertion of substrate 602 with sensor device 300 coupled thereto in a parallel orientation without sensing element 308 contacting the perimeter of slot 680B.

[0145] Fig. 7AA perspective view of a sensor assembly 700 is illustrated in accordance with certain other embodiments of the present disclosure. In one or more embodiments, a sensor assembly (e.g., sensor assembly 700) includes a substrate (e.g., substrate 702). In certain embodiments, the substrate (e.g., substrate 702) includes an outer region (e.g., outer region 702O), an inner region (e.g., inner region 702I) for coupling a sensor device (e.g., sensor device 300) to the substrate, and an intermediate region (e.g., intermediate region 702M) positioned between the outer region and the inner region. In certain embodiments, the substrate may be coupled to a housing (e.g., housing 704) at the intermediate region 702M and / or the outer region 702O. In certain embodiments, the substrate 702 may be a multilayer ceramic made of a plurality of ceramic sheets, similar to the multilayer ceramic substrate 502 described with respect to the sensor assembly 500.

[0146] Figure 7B Embodiments according to the present disclosure are described, including Fig. 7A 7 is a perspective view of a multilayer ceramic substrate in a sensor assembly of FIG. 7 , with the sensor device 300 coupled to the substrate 702 at an inner region 702I. Figure 7C Explained Figure 7B Side view of a multilayer ceramic substrate. Fig.7D Explained Figure 7B A top view of a multilayer ceramic substrate. Figures 7B-7D In the illustrated embodiment, two ceramic sheets are shown (e.g., a first layer 702A and a second layer 702B covering a portion of the first layer 702A, at a middle region 702M). In the depicted embodiment, the ceramic layers 702A and 702B are in contact so that an airtight seal is achieved between the layers (similar to the multilayer ceramic substrate 502). In the illustrated embodiment, an electrical contact pad 714 is formed / built-in between the layers of the multilayer ceramic substrate 702 (e.g., the electrical contact pad 714 is formed between the first ceramic layer 702A and the second ceramic layer 702B). The electrical contact pad 714 extends from its outer region 702O to its inner region 702I throughout the multilayer ceramic substrate. An advantage of such a substrate (like the substrate 502) is that an airtight seal is achieved between the ceramic layers of the multilayer ceramic substrate and between the electrical contact pads formed between the layers. Such an airtight seal reduces the number of locations where the various components of the sensor assembly are fixed via metal seals (e.g., via brazing or welding, etc.).

[0147] Ceramic substrate 702 may be made of any suitable plasma resistant ceramic, which may be configured into a suitable multilayer ceramic according to methods known to those skilled in the art, as explained above with respect to substrate 502. Similarly, ceramic substrate 702 may be made of materials similar to those described above with respect to substrate 502.

[0148] In a certain embodiment, the electrical contacts 314 on the interface region of the sensor device 300 can be fixed to the electrical contact pads 714 on the inner region of the substrate 702 (for example, fixed via a metal seal). The electrical contacts 314 on the sensor device, the electrical contact pads 714 on the substrate, and one or more external devices (for example, the processing device 230) together form a closed circuit during operation. The electrical contact pads (for example, 714) located between the layers of the multilayer ceramic substrate 702 can be the same conductive material as the electrical contact pads 314 on the sensor device. For example, in one embodiment, the electrical contact pads 714 are made of platinum.

[0149] In some embodiments, the substrate (e.g., substrate 702) may be coupled to a housing (e.g., housing 704) at its middle region (e.g., 702M). In some embodiments, the housing may be made of stainless steel, nickel alloy (e.g., C-276 alloy, which is an alloy of nickel, molybdenum and chromium), Kovar (e.g., a nickel-cobalt-iron alloy), or another suitable material. In one embodiment, the housing can be made of stainless steel. In some embodiments, the substrate can be secured to the housing via a metal seal or bond (e.g., via brazing, laser welding, electron beam welding, etc.) to minimize gas leakage from the processing chamber environment to the external environment. In some embodiments, an O-ring can be disposed between the substrate 702 and the housing 704. In some embodiments, a cap configured to engage (e.g., compress) the O-ring can be disposed between the substrate 702 and the housing 704. The cap can be secured by one or more fasteners (e.g., one or more bolts, screws, etc.).

[0150] In an embodiment, the sensor device 300 is coupled to an electrical contact pad 714 on an inner region 702I of the substrate 702 via its electrical contacts 314. In one embodiment, the sensor device is coupled to the electrical contact pad 714 via a first seal or combination 720A, which may be a metal seal or combination formed by welding, using a multi-layer reactive foil, welding or brazing (e.g., with a first brazing alloy). In some embodiments, the first seal / combination 720A is formed by a welding operation (e.g., an electron beam welding operation, a laser beam welding operation, etc.). In some embodiments, the sensor device is fixed to the substrate so that the support structure (e.g., 302) of the sensor device (e.g., 300) is in a parallel orientation relative to the airflow direction (e.g., 242). In some embodiments, the sensor device may be fixed to the substrate 702 so that the support structure of the sensor device is in a vertical orientation relative to the airflow direction (not shown). One or more alignment features may provide accurate positioning and / or alignment of the sensor device 300 relative to the substrate 702.

[0151] In one embodiment, the middle region 702M of the substrate 702 is coupled / fixed to the housing 704 via a second seal or bond 720B (which may be a metal seal or bond), such as with a second braze alloy, metal welding, etc. In certain embodiments, the substrate 702 may be fixed to the housing 704 via a hermetic seal to minimize leakage of vacuum and / or gas from the process chamber environment and / or from the gas channel 240 to the external environment.

[0152] Each of the first seal / combination (720A) and the second seal / combination (720B), if present, may independently include an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ni-Al alloy, a Ti alloy, or a combination thereof. In certain embodiments, the brazing alloy or metal combination used for all seals is the same. In other embodiments, two or more different brazing alloys or metals may be used for different seals / combinations. In one embodiment, at least one of the seals / combinations 720A or 720B includes Ag-Cu as the brazing alloy. It should be understood that the names of "first seal", "second seal", etc. should not be interpreted as binding on the order of combination of the various components in the sensor assembly described herein, nor should they be interpreted as binding on the total number of seals in the sensor assembly. Instead, these names are used only for the convenience of distinguishing one seal from another. The following will be described in detail. Fig.11A -B and 16A-F describe in more detail exemplary methods for making the various sensor assemblies described herein.

[0153] In some embodiments, the sensor assembly (e.g., sensor assembly 700) further includes a non-conductive conformal coating on one or more surfaces or on at least a portion of the sensor assembly. The conformal coating may be an anti-corrosion coating. In some embodiments, the coating covers part or all of the sensor device (e.g., 300). In some embodiments, the coating covers part or all of the sensor region 306 and / or the interface region 304 of the sensor device 300. In some embodiments, the coating covers part or all of the sensor region 306, including part or all of the sensing element 308. In other embodiments, the conformal coating covers the sensor region 306 without covering the sensing element 308. In some embodiments, the coating covers part or all of the substrate 702. In some embodiments, the coating covers part or all of the outer region 702O, the middle region 702M, and / or the inner region 702I. In some embodiments, the coating covers part or all of the inner region 702I, including part or all of the electrical contact pads 714. In some embodiments, the coating covers part or all of the middle region 702M. In some embodiments, the coating covers part or all of the various seals (e.g., first seal 720A and / or second seal 720B). In some embodiments, sensor assembly 700 is first assembled so that electrical contacts are formed between all components of the sensor assembly (e.g., between the sensor device and the substrate), after which the assembled sensor assembly is coated so that the coating covers portions of the sensor assembly that are exposed to the airflow when the sensor assembly is coupled to the airflow channel. In some embodiments, the coating deposited on at least a portion of sensor assembly 700 can be similar to the coating described above as suitable for coating at least a portion of sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or uniformity, conformality, porosity, architecture, and the like of the coating). In certain embodiments, sensor assembly 700 remains completely uncoated.

[0154] Fig. 7E Explained Fig. 7A Front view of section AA. In some embodiments, the housing (e.g., housing 704) may include a gas-facing surface 760 and an opposing surface 770 that is opposite to the gas-facing surface. The housing 704 may be configured as an airflow channel, similar to the airflow channel 240. The diameter or width and / or height of the housing (if the shape of the housing is not cylindrical / tube) may be greater than the diameter of the airflow channel (e.g., 240). The larger diameter or width and / or height of the housing 704 may be configured to provide space for the sensor assembly without restricting the airflow, so that there is minimal (or substantially no) effect on the airflow parameter being measured by the sensor device.

[0155] The housing 704 can have at least one slot (e.g., slot 780A) formed therethrough and configured to receive a substrate (e.g., substrate 702). The substrate 702 can be inserted into the slot (e.g., slot 780A) such that an inner region 702I of the substrate extends from the gas-facing surface 760, e.g., into an interior environment of a gas flow channel (e.g., gas flow channel 240). In certain embodiments, the substrate 702 can be inserted into the slot 780A and secured to the housing 704 in a cantilever orientation at a middle region 702M of the substrate 702 such that the inner region 702I of the substrate extends from the gas-facing surface 760 into the interior environment of the gas flow channel and the outer region 702O of the substrate extends from an opposing surface 770 into an exterior region, e.g., Fig. 7E The front view of section AA is shown in FIG.

[0156] In certain embodiments, such as Fig. 8A and 8B As illustrated in FIG. 1 , housing 704 has a first slot 780A formed at a first end 765A (e.g., from gas-facing surface 760 to an opposite surface 770 opposite to the gas-facing surface) and a second slot 780B formed at an opposite second end 765B (e.g., from gas-facing surface 760 to an opposite surface 770 opposite to the gas-facing surface). Such a housing can accommodate a substrate 802, which can be similar to substrate 702. In some embodiments, substrate 802 is a multi-layer ceramic substrate. An advantage of substrate 802 (like substrates 502 and 702) is that an airtight seal is achieved between ceramic layers of the multi-layer ceramic substrate and between electrical contact pads formed between the layers. Such an airtight seal reduces the number of locations where various components of the sensor assembly are secured via metal seals (e.g., via brazing or welding, etc.).

[0157] Ceramic substrate 802 may be made of any suitable plasma resistant ceramic, which may be configured into a suitable multilayer ceramic according to methods known to those skilled in the art, as explained above with respect to substrate 502. Similarly, ceramic substrate 802 may be made of materials similar to those described above with respect to substrate 502.

[0158] The multilayer ceramic substrate 802 may include a first end 802A and a second end 802B opposite to the first end. The first end 802A of the substrate 802 may include a first outer region 802O1, an inner region 802I, and a first intermediate region 802M1 positioned between the first outer region 802O1 and the inner region 802I. The second end 802B of the substrate 802 may include a second outer region 802O2, the same inner region 802I, and a second intermediate region 802M2 positioned between the second outer region 802O2 and the inner region 802I. The multilayer ceramic substrate 802 may include an electrical contact pad 814 formed between the layers of the multilayer ceramic substrate 802. The electrical contact pad 814 may extend from the first end 802A to the second opposite end 802B throughout the multilayer ceramic substrate 802, as shown in FIG. Figure 8B The cross section BB is shown in a front view.

[0159] The multilayer ceramic substrate 802 may be fixed to the housing 704 at the first middle region 802M1 and at the second middle region 802M2. In some embodiments, the multilayer ceramic substrate may be inserted into the housing 704 via the first slot 780A, which extends to the second slot 780B over the entire diameter (or width) of the housing 704. The first end 802A of the multilayer ceramic substrate 802 may be disposed by the first slot 780A, and the second opposite end 802B of the multilayer ceramic substrate 802 may be disposed by the second opposite slot 780B. In this configuration, the first outer region 802O1 of the substrate 802 may extend from the opposite surface 770 of the housing 704 at the first end 765A to the outer region at the first end. In addition, in this configuration, the second outer region 802O2 of the substrate 802 may extend from the opposite surface 770 of the housing 704 at the second opposite end 765B to the outer region at the second opposite end. Further, in this configuration, the interior region 802I of the substrate 802 can extend from the gas-facing surface 760 of the housing 704 at the first end 765A to the gas-facing surface 760 of the housing 704 at the second end 765B. In some embodiments, the substrate 802 can be fixed to the housing (e.g., the first end 765A of the housing 704 is fixed to the first middle region 802M1 of the substrate 802, and the second end 765B of the housing 704 is fixed to the second middle region 802M2 of the substrate 802) via a metal seal (e.g., via brazing) to form an airtight seal to minimize leakage of gas from the processing chamber environment to the external environment. The seal between the housing 704 and the substrate 802 (or between the housing 704 and the substrate 702) can be an airtight seal to prevent gas leakage and / or vacuum leakage from the gas flow channel 240. In some embodiments, the seal is a metal seal formed, for example, by brazing or welding using any of the brazing alloys described above. Various sealing configurations can be used as appropriate, such as will be described in detail in detail in detail in detail. Figures 9A-9C and 10A-10D are described and illustrated in more detail.

[0160] exist Figures 8A-8B In the illustrated embodiment, the sensor device 300 can be coupled / fixed to the substrate 802 at the inner region 802I. As described with respect to the sensor assembly previously described, the sensor device 300 can be fixed to the substrate via a metal seal / bond between the electrical contacts 314 (on the sensor device 300) and the electrical contact pads 814 on the substrate 802. The metal seal / bond can be formed by brazing, soldering, welding (e.g., laser welding or electron beam welding), using a multi-layer reactive foil, etc. The electrical contacts 314 on the sensor device and the electrical contact pads 814 on the substrate and one or more external devices (e.g., the processing device 230) together form a closed circuit during operation. The electrical contact pads (e.g., 814) located between the layers of the multi-layer ceramic substrate 802 can be the same conductive material as the electrical contact pads 314 on the sensor device. For example, in one embodiment, the electrical contact pads 814 are made of platinum.

[0161] The sensor device 300 can be fixed on the substrate 802 so that the support structure (e.g., 302) is in a parallel orientation relative to the airflow direction (e.g., 242). In some embodiments, the sensor device can be fixed on the substrate 802 so that the support structure of the sensor device is in a vertical orientation relative to the airflow direction (not shown).

[0162] In some embodiments, Figures 8A-8BThe sensor assembly shown further includes a non-conductive conformal coating on one or more surfaces or on at least a portion of the sensor assembly. The conformal coating can be an anti-corrosion coating. In some embodiments, the coating covers part or all of the sensor device (e.g., 300). In some embodiments, the coating covers part or all of the sensor area 306 and / or the interface area 304 of the sensor device 300. In some embodiments, the coating covers part or all of the sensor area 306, including part or all of the sensing element 308. In other embodiments, the conformal coating covers the sensor area 306 without covering the sensing element 308. In some embodiments, the coating covers part or all of the substrate 802. In some embodiments, the coating covers part or all of the outer regions 802O1 and 802O2, the middle regions 802M1 and 802M2, and / or the inner region 802I. In some embodiments, the coating covers part or all of the inner region 802I, including part or all of the electrical contact pads 814. In some embodiments, the coating covers part or all of the various seals (e.g., a first seal 820A between the sensor device 300 and the substrate 802, and / or a second seal 820B between the first intermediate region 802M1 of the substrate 802 and the first end 765A of the housing 704, and / or a third seal 820C between the second intermediate region 802M2 of the substrate 802 and the second end 765B of the housing 704). In some embodiments, the sensor assembly 800 is first assembled so that electrical contacts are formed between all components of the sensor assembly (e.g., between the sensor device and the substrate), after which the assembled sensor assembly is coated so that the coating covers portions of the sensor assembly that are exposed to the airflow when the sensor assembly is coupled to the airflow channel. In some embodiments, the coating deposited on at least a portion of the sensor assembly 800 can be similar to the coating described above as suitable for coating at least a portion of the sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or uniformity, conformality, porosity, architecture, and the like of the coating). In certain embodiments, the sensor assembly 800 remains completely uncoated.

[0163] It should be understood that the names of "first seal", "second seal", "third seal" and the like should not be interpreted as binding on the order of combining the various components in the sensor assembly described herein, nor should they be interpreted as binding on the total number of seals in the sensor assembly. Instead, these names are used only to distinguish one seal from another. Fig.11A -B and 16A-F describe in more detail exemplary methods for making the various sensor assemblies described herein.

[0164] As previously described, the substrate (e.g., 702 or 802) can be joined to the housing (e.g., 704) at the intersection between the perimeter of the slot through the housing (e.g., the perimeter of slot 780A or slot 780B) and the perimeter of the middle region of the substrate (e.g., 702M, 802M1, or 802M2). However, in some embodiments, the middle region of the substrate and the slot through the housing can also be configured to allow face-to-face joining between the two. It is believed that, without being interpreted as limiting, the face-to-face joining between the substrate (e.g., at the middle region) and the housing can reduce stress that may be generated during joining. Figures 9A-9C Such exemplary face-to-face bonding is illustrated in FIGS. 10A-10D .

[0165] Fig.9A 900 is a perspective view of a sensor assembly 900 according to an embodiment of the present disclosure. Fig.9A As can be seen, the sensor assembly 900 can include a housing 904, which can be similar to the housing 704. The housing 904 can also have a gas-facing surface 960 and an opposing surface 970 opposite the gas-facing surface. The housing 904 can also have a slot 980A therethrough. In some embodiments, the housing 904 can include a tapered region at the periphery of the slot 980A, the tapered region being configured to establish a flat surface at the periphery of the slot 980A, into which the middle region 902M of the substrate 902 can be joined in a parallel orientation.

[0166] Fig. 9B A perspective view of a multilayer ceramic substrate 902 is illustrated, with a sensor device 300 coupled thereto at an inner region. As with the other multilayer ceramic substrates described above, the multilayer ceramic substrate 902 can be prepared by methods known to those skilled in the art. The multilayer ceramic substrate 902 can have an inner region 902I, an outer region 902O, and an intermediate region 902M positioned between the inner region 902I and the outer region 902O, and the sensor device 300 can be fixed to the inner region. In some embodiments, the thickness and / or length of the intermediate region 902M is greater than the inner region 902I and / or the outer region 902O. In some embodiments, the intermediate region 902M has a first surface 902M1 and a second surface 902M2 opposite to the first surface. When the substrate 902 is fixed to the housing 904, the first surface 902M1 can be adjacent to the opposite surface 970 of the housing 904, and can be combined in a face-to-face configuration.

[0167] In some embodiments, the shape of substrate 902 is formed by multiple ceramic layers by methods known to those skilled in the art. In some embodiments, an airtight seal is achieved between the layers of the multilayer ceramic substrate. In some embodiments, electrical contact pads 914 are formed / built-in between the layers of the multilayer ceramic substrate 902 (extending from the outer region 902O to the inner region 902I across the substrate 902), maintaining an airtight seal even with the electrical contact pads 914 between the layers.

[0168] Ceramic substrate 902 may be made of any suitable plasma resistant ceramic, which may be configured into a suitable multilayer ceramic according to methods known to those skilled in the art, as explained above with respect to substrate 502. Similarly, ceramic substrate 902 may be made of materials similar to those described above with respect to substrate 502.

[0169] At least a portion or all of sensor assembly 900 may be coated with a protective coating, as described above for other sensor assemblies. The coating deposited on at least a portion of sensor assembly 900 may be similar to the coating described above as suitable for coating at least a portion of sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, corrosion resistance, and the like). In certain embodiments, sensor assembly 900 may remain completely uncoated.

[0170] Fig. 9C Explained Fig.9A Front view of the middle cross section CC. Fig. 9C As shown, sensor assembly 900 is similar to sensor assembly 700 except for the bonding between substrate 902 and housing 904. In sensor assembly 900, multilayer ceramic substrate 902 having sensor device 300 affixed thereto (at interior region 902I) in a parallel orientation (relative to airflow 242) is inserted into slot 980A (shown in FIG. 1 ) in a cantilever configuration. Fig. 9C 902M1 of the intermediate region 902M of the substrate contacts (face to face) the tapered perimeter of the slot 980A (which is located on the opposite surface 970 of the housing 904). The substrate assembly 902 can then be secured to the housing 904, for example, via a metal seal (e.g., with a brazing alloy) to form a hermetic seal to minimize leakage of gas and / or vacuum from the gas channel 240 to the external environment.

[0171] Although not shown in the figures, sensor assembly 900 may also be modified so that the substrate extends from one end of the housing to the other end of the housing, similar to sensor assembly 800. With this modification, each end of the modified substrate may be secured to each corresponding end of the housing via a face-to-face bond similar to the bond described with respect to sensor assembly 900.

[0172] Fig. 10A FIG. 1 illustrates a perspective view of a sensor assembly 1000 according to an embodiment of the present disclosure. Fig. 10A As can be seen, the sensor assembly 1000 can include a housing 1004, which can be similar to housings 704 and 904. The housing 1004 can also have a gas-facing surface 1060 and an opposing surface 1070 that is opposite the gas-facing surface. The housing 1004 can also have a slot 1080A therethrough. In some embodiments, the housing 1004 can include a tapered region at the periphery of the slot 1080A, the tapered region being configured to establish a flat surface at the periphery of the slot 1080A, into which the middle region 1002M of the substrate 1002 can be joined in a parallel orientation. Alternatively, as Fig. 10A As shown, the housing 1004 may have a region 1004M with square or rectangular flat sidewalls, to which the middle region 1002 of the substrate 1002 may be bonded in a parallel face-to-face orientation. In some embodiments, the housing 1004 may have tubular gas passages 1004C extending from two opposite sides of the region 1004M with square or rectangular flat sidewalls.

[0173] Fig. 10B A perspective view of a multilayer ceramic substrate 1002 is illustrated. As with the other multilayer ceramic substrates described above, the multilayer ceramic substrate 1002 can be prepared by methods known to those skilled in the art. The multilayer ceramic substrate 1002 can have an inner region 1002I, an outer region 1002O, and an intermediate region 1002M positioned between the inner region 1002I and the outer region 1002O, and the sensor device 300 can be fixed to the inner region. In some embodiments, the thickness and / or length of the intermediate region 1002M is greater than the inner region 1002I and / or the outer region 1002O. In some embodiments, the intermediate region 1002M is configured as a disk with rounded edges (e.g., oval or circular), and has a first surface 1002M1 and a second surface 1002M2 opposite to the first surface. When the substrate 1002 is fixed to the housing 1004, the first surface 1002M1 can be adjacent to the opposite surface 1070 of the housing 1004, and can be combined in a face-to-face configuration.

[0174] In some embodiments, the shape of the substrate 1002 is formed using multiple ceramic layers by methods known to those skilled in the art. In some embodiments, an airtight seal is achieved between the layers of the multilayer ceramic substrate. In some embodiments, electrical contact pads 1014 are formed / built-in between the layers of the multilayer ceramic substrate 1002 (extending from the outer region 1002O to the inner region 1002I across the substrate 1002), maintaining an airtight seal even with the electrical contact pads 1014 between the layers.

[0175] Ceramic substrate 1002 may be made of any suitable plasma resistant ceramic, which may be configured into a suitable multilayer ceramic according to methods known to those skilled in the art, as explained above with respect to substrate 502. Similarly, ceramic substrate 1002 may be made of materials similar to those described above with respect to substrate 502.

[0176] In certain embodiments, the sensor assembly 1000 further includes an adapter / flange 1300. The adapter / flange 1300 can be configured as a flat plate having a ring defined by a central region thereof, the ring being configured to surround a portion of the ceramic substrate 1002. The adapter / flange 1300 can have a first side 1300S1 (e.g., a side facing the housing) and a second side 1300S2 (e.g., a side facing the substrate) opposite the first side. The adapter / flange 1300 can have a rounded perimeter (e.g., an oval or circular perimeter, or a rectangular shape with curved edges). The adapter / flange 1300 can be coupled to the housing 1004 (e.g., an opposing surface 1070 of the housing 1004) near the location of the slot 1080A (e.g., around the perimeter of the slot 1080A), for example. For example, the flange / adapter 1300 can be welded (e.g., via electron beam welding) to the housing 1004 so that the first side 1300S1 of the adapter / flange 1300 is adjacent to the housing 1004 (e.g., the opposing surface 1070 of the housing 1004), such as by Fig. 10D 1300D in FIG. In some embodiments, the flange / adapter 1300 can be brazed, welded, or soldered to the housing 1004. The adapter / flange 1300 can be fixed to the housing 1004 in a parallel face-to-face configuration.

[0177] The adapter / flange 1300 may be made of a material having a coefficient of thermal expansion between the coefficient of thermal expansion of the multilayer ceramic substrate 1002 and the coefficient of thermal expansion of the housing 1004. In some embodiments, the housing 1004 has a first coefficient of thermal expansion (CTE1), the substrate 1002 has a second coefficient of thermal expansion (CTE2), and the adapter / flange 1300 has a third coefficient of thermal expansion (CTE3). In some embodiments, the value of CTE3 is between CTE1 and CTE2. For example, the housing 1004 may be made of stainless steel having CTE1, the dielectric multilayer ceramic substrate may be made of ceramic having CTE2, and the adapter / flange 1300 may be made of Kovar (a nickel-cobalt-iron alloy) having CTE3 between CTE1 and CTE2. In some embodiments, the adapter / flange 1300 includes stainless steel, a nickel alloy, a nickel-chromium-molybdenum alloy, a nickel-cobalt-iron alloy, or a combination thereof. In certain embodiments, the substrate 1002 is secured to the adapter / flange 1300 such that the first surface 1002M1 may be adjacent to the second side 1300S2 of the adapter / flange 1300 and may be coupled thereto in a face-to-face configuration.

[0178] The substrate 1002 may be secured to the adapter / flange 1300 (if present) or to the housing 1004 (if the adapter / flange 1300 is absent) via a first metal seal 1300A (e.g., by welding or brazing using any of the metal alloys described above or any other suitable metal alloy). In one embodiment, the substrate 1002 may be secured to the adapter / flange 1300 using an Al alloy via brazing.

[0179] In some embodiments, a back-up ring 1500 may be further disposed around a portion of the substrate 1002 between the flange 1300 and the housing 1004. The back-up ring may be configured as a flat plate having a ring defined in a central region thereof that is configured to surround a portion of the ceramic substrate 1002. The back-up ring may include a housing-facing side and a substrate-facing side opposite the housing-facing side. In some embodiments, the substrate-facing side of the back-up ring may be secured to the housing-facing side of the flange / adapter 1300 via a second metal seal 1300B. The second metal seal 1300B may be a metal braze seal or weld formed with any of the metal alloys described above or any other suitable metal alloy. In some embodiments, the ceramic back-up ring 1500 is configured to reduce stress in a joint, such as a joint between the flange / adapter 1300 and the housing 1004. The back-up ring 1500 may be configured to reduce thermal stress in the joint when the joint is formed. The support ring 1500 may be secured to the flange / adapter 1300 and / or the housing 1004 via a parallel, face-to-face configuration.

[0180] The support ring 1500 may be made of a material having a thermal expansion coefficient between the thermal expansion coefficient of the multilayer ceramic substrate 1002 and the thermal expansion coefficient of the housing 1004. In some embodiments, the support ring 1500 is made of a ceramic material. In some embodiments, the support ring 1500 may be made of the same material as the substrate 1002 and / or the housing 1004.

[0181] In some embodiments, after the support ring 1500 and the adapter / flange 1300 are secured to the substrate 1002, a sensor device (e.g., sensor device 300) may be secured to the interior region of the substrate 1002 via the third seal 1300C. Thereafter, the substrate 1002 with the support ring 1500, the adapter / flange 1300, and the sensor device 300 may be inserted into the housing 1004, and the adapter / flange 1300 may be secured (e.g., via electron beam welding) to the housing 1004 to form a hermetic seal to minimize vacuum and / or gas leakage from the gas passage 240 to the external environment.

[0182] Each of the first seal 1300A, the second seal 1300B, the third seal 1300C and the optional fourth seal 1300D (if not welded), if present, can independently include Al alloy, Ag alloy, Au alloy, Ni alloy, Si alloy, Au-Ni alloy, Ni-Pd alloy, Ni-Y alloy, Ti alloy or a combination thereof. In some embodiments, the brazing alloy used for all seals is the same. In other embodiments, two or more different brazing alloys may be used for different seals. It should be understood that the names of "first seal", "second seal", "third seal", "fourth seal", etc. should not be interpreted as binding on the order of combination of the various components in the sensor assembly described herein, nor should they be interpreted as binding on the total number of seals in the sensor assembly. Instead, these names are used only for the convenience of distinguishing one seal from another. The following will be described in detail. Fig.11A -B and 16A-F describe in more detail exemplary methods for making the various sensor assemblies described herein.

[0183] At least a portion or all of sensor assembly 1000 may be coated with a protective coating, as described above for other sensor assemblies. The coating deposited on at least a portion of sensor assembly 1000 may be similar to the coating described above as suitable for coating at least a portion of sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or coating uniformity, conformality, porosity, architecture, corrosion resistance, and the like). In some embodiments, sensor assembly 1000 may be completely uncoated.

[0184] Fig. 10C Explained Fig. 10A Front view of cross section CC. Fig. 10C As shown, sensor assembly 1000 is similar to sensor assemblies 700 and 900, except for the bonding between substrate 1002 and housing 1004. In sensor assembly 1000, multilayer ceramic substrate 1002 having sensor device 300 fixed thereto (at inner region 1002I) in a parallel orientation (relative to airflow 242) is inserted into slot 1080A (shown in FIG. 10F) in a cantilever configuration until first surface 1002M1 of middle region 1002M of substrate contacts (face to face) either of the tapered perimeter (not shown) of slot 1080A or second side 1300S2 of adapter / flange 1300 (which may be located on opposite surface 1070 of housing 1004). Substrate assembly 1002 may then be fixed to adapter / flange 1300, for example, via a metal seal (e.g., with a braze alloy or a welded joint).

[0185] Although not shown in the drawings, sensor assembly 1000 may also be modified so that the substrate extends from one end of the housing to the other end of the housing, similar to sensor assembly 800. With this modification, each end of the modified substrate may be secured to each corresponding end of the housing via an intermediate adapter / flange via a face-to-face bond similar to that described with respect to sensor assembly 1000.

[0186] Fig.11A A method 1100 for adapting a sensor device for use in a flow control device according to an embodiment of the present disclosure is described. At block 1110, a substrate is provided. The substrate may have an outer region, an inner region, and an intermediate region positioned between the outer region and the inner region, and may further have an electrical contact pad at least located on its inner region. Such exemplary substrates are shown in the sensor assembly described above, such as substrates 402, 502, 602, 702, 802, 902, and 1002. In some embodiments, before providing the substrate, the substrate may be machined into the shape described above or any other suitable shape. In some embodiments, the electrical contact pad may be metallized into the inner region of the substrate. In some embodiments, before providing the substrate, the substrate may be formed into a multilayer ceramic substrate having any shape described above (or any other suitable shape), and having electrical contact pads formed between the layers of the multilayer ceramic substrate so that the electrical contact pads extend from the outer region to the inner region on the entire multilayer ceramic substrate.

[0187] At block 1120, a sensor device (eg, Figure 3The sensor device 300 described in or any other suitable sensor device) can be coupled to the substrate at the inner region of the substrate. The sensor device can be based on the following Fig.15A -G and 16A-F are coupled to a substrate. In some embodiments, the sensor device includes a support structure that includes an interface region (e.g., interface region 304) located at one end of the sensor device and a sensor region (e.g., sensor region 306) located at the other end of the sensor device. The sensor region may include a self-standing sensing element (e.g., sensing element 308) suspended at the sensor region. The sensor device may further include electrical contacts (e.g., electrical contacts 314) that extend from the sensing element to the top of the interface region over the entire length of the elongated support structure. The sensor device can be fixed / coupled to the substrate so that the electrical contacts on the sensor device contact the electrical contact pads on the substrate to establish a continuous and closed circuit to transmit signals from the sensor device to a processing device (e.g., processing device 230).

[0188] In some embodiments, the sensor device may be secured to the substrate by forming a first seal / bond between electrical contact pads (e.g., 414, 514, 614, 714, 814, 914, or 1014) on the substrate and electrical contacts on the sensor device (e.g., 314). Fig.15A -G and 16B-F describe some embodiments of fixing the sensor device on the substrate by forming a first seal / combination. In certain embodiments, the sensor device in any sensor assembly considered herein can be fixed on the substrate via brazing, soldering, using a multilayer reactive foil or welding (or any other chemical mode of attaching the sensor device to the substrate). In certain embodiments, the sensor device in any sensor assembly considered herein can be fixed on the substrate via a heat source (e.g., laser welding, electron beam welding, etc.). In an embodiment, the sensor device and / or the substrate is substantially transparent to the radiation wavelength used by the electron beam welder or the laser welder. Therefore, radiation (e.g., light) from the welder can pass through the sensor device or the substrate to heat the interface of the sensor device and the substrate to form a weld. The sensor device can be fixed on the substrate in a vertical orientation (e.g., in sensor assemblies 400 and 500) or a parallel orientation (e.g., in sensor assemblies 600, 700, 800, 900, and 1000). In an embodiment, one or more alignment features can be used to ensure the correct orientation of the sensor device relative to the substrate.

[0189] In certain embodiments in which the substrate includes conductor pins extending over the entire outer region and intermediate region of the substrate into at least a portion of an inner region of the substrate (e.g., substrates 402 and 602), the method may further include securing the conductor pins to electrical contact pads at the inner region of the substrate (e.g., as described with sensor assemblies 400 and 600), for example, using a third metal seal (e.g., via brazing).

[0190] At block 1130, the substrate is inserted into a slot in a housing (e.g., any of the housings 404, 504, 604, 704, 904, or 1004 described above) such that an inner region of the substrate extends from a gas-facing surface of the housing. In certain embodiments, the substrate is then coupled / fixed to the housing with a second seal (e.g., via welding and / or brazing with a suitable brazing alloy) to form a sensor assembly. In certain embodiments, the substrate may be fixed to the housing at an outer region of the substrate, as shown with sensor assemblies 400, 500, and 600. In certain embodiments, the substrate may be fixed to the housing in a cantilever configuration at a middle region of the substrate, as shown with sensor assemblies 700 and 900. In certain embodiments, the substrate may be inserted into two slots at two opposite ends of the housing in an extended configuration and may be coupled / fixed to the housing at two middle regions of the substrate, as shown with sensor assembly 800. In certain embodiments, the substrate may be fixed to the housing via a face-to-face configuration at its middle region, as shown with sensor assembly 900. In some embodiments, the substrate can be fixed to the adapter / flange at its middle region via a face-to-face configuration, and the adapter / flange can be coupled (e.g., welded) to the housing, as shown in sensor assembly 1000 and in the Fig. 11B Described in more detail.

[0191] In certain embodiments, forming one or more of the metal seals / combinations described herein (e.g., the first seal, the second seal, the third seal, and any additional metal seals) may include: brazing one component to another component (e.g., brazing a sensor device to a substrate, brazing a substrate to a housing, or brazing a conductor pin to an electrical contact pad), welding one component to another component (e.g., via laser welding or electron beam welding), or bonding one component to another component using a metal bond formed from multiple layers of reactive foil. The brazing alloy used for any seal may independently include an Al alloy, an Ag alloy, an Au alloy, a Ni alloy, a Si alloy, an Au-Ni alloy, a Ni-Pd alloy, a Ni-Y alloy, a Ti alloy, or a combination thereof. In certain embodiments, another O-ring may be placed between the substrate and the housing (optionally, another cap configured to engage or compress the O-ring may be placed between the substrate and the housing) to enhance the hermetic seal between the substrate and the housing. In some embodiments, the seal provides a hermetic seal to minimize vacuum and / or hermetic leakage from the gas channel 240 to the external environment (e.g., minimize leakage in the interface between the substrate and the housing, and / or minimize leakage through a pinhole through which a conductor pin may pass). In some embodiments, one or more of the metal seals / bonds described herein may include welding one component to another (e.g., by electron beam welding, laser welding, etc.).

[0192] At block 1140, a conformal coating may be deposited onto the sensor assembly to coat at least a portion of the sensor assembly. The coating may be an anti-corrosion coating. In some embodiments, the conformal coating is a non-conductive material, such as a non-conductive ceramic material. In some embodiments, the conformal coating covers at least a portion of the sensing element 308. In other embodiments, the conformal coating covers the sensor area and does not coat, or only minimally coats, the sensing element. In some embodiments, the coating covers part or all of the substrate (including its inner region, one or more intermediate regions, and one or more outer regions). In some embodiments, the coating covers part or all of the electrical contact pads on the substrate. In some embodiments, the coating covers part or all of the conductor pins extending from the substrate. In some embodiments, the coating covers part or all of the various seals (e.g., seals between the substrate and the sensor device, seals between the substrate and the conductor pins, seals between the conductor pins and the electrical contact pads on the substrate, seals between the substrate and the housing, seals between the substrate and the adapter / flange, and similar seals). In some embodiments, the sensor assembly is first assembled so that electrical contacts are formed between all components of the sensor assembly (e.g., between the sensor device and the substrate and / or between the substrate and the conductor pins, if present), after which the assembled sensor assembly is coated such that the coating covers portions of the sensor assembly that are exposed to the airflow when the sensor assembly is coupled to the airflow channel. In some embodiments, the coating deposited on at least a portion of the sensor assembly can be similar to the coating described above as suitable for coating at least a portion of the sensor assembly 400 (e.g., similar in deposition technique, coating composition / material, and / or uniformity, conformality, porosity, architecture, corrosion resistance, and the like of the coating). In certain embodiments, the sensor assembly can remain completely uncoated.

[0193] In some embodiments, the conformal coating is deposited using one or more of ALD, IAD, LPPS, CVD, PS-CVD, or sputtering. In some embodiments, the conformal coating comprises a plasma resistant ceramic coating comprising a rare earth ceramic selected from the group consisting of Y2O3, YZrO, Y x Zr y O z 、YZrOF、Y3Al5O 12 、Y4Al2O9、YF3、Y x O y F z 、YOF、Er2O3、Er3Al5O 12 、ErF3、E x O y F z, ErOF, La2O3, Lu2O3, Sc2O3, ScF3, ScOF, Gd2O3, Sm2O3, Dy2O3, Y2O3-ZrO2 solid solution, ceramics including Y2Al4O9 and Y2O3-ZrO2 solid solution, or combinations thereof. In some embodiments, the conformal coating comprises Al2O3. In some embodiments, the conformal coating comprises ALD deposited Al2O3. In some embodiments, the conformal coating comprises a plurality of layers. In some embodiments, the thickness of the conformal coating is from about 10 nanometers to about 500 nanometers, or any sub-range or single value therein.

[0194] In some embodiments, a sensor assembly (eg, Fig. 10D The sensor assembly described in Fig. 11B The flowchart and Fig. 11C 1. A method 1200 is illustrated in FIG. 12. First, a substrate (e.g., substrate 1002) having an outer region 1002O, an inner region 1002I, and an intermediate region 1002M (which is positioned between the outer region 1002O and the inner region 1002I) is provided, according to block 1210. Thereafter, a metal flange / adapter 1300 can be secured to the substrate via a first seal 1300A in a parallel face-to-face configuration between a substrate-facing side of the flange / adapter 1300 and a first side of the intermediate region 1002M of the substrate, according to block 1220. Thereafter, a support ceramic ring 1500 can be secured via a second seal 1300B in a parallel face-to-face configuration between a substrate-facing side of the support ceramic ring and a housing-facing side of the flange / adapter 1300.

[0195] Thereafter, per block 1240, a sensor device (e.g., sensor device 300) may be secured to the interior region 1002I of the substrate 1002 such that electrical contacts on the sensor device contact electrical contact pads on the substrate to establish a continuous and closed circuit to transmit signals from the sensor device to a processing device (e.g., processing device 230). In certain embodiments, the sensor device may be secured to the substrate by forming a third seal 1300C between the electrical contact pads on the substrate and the electrical contacts on the sensor device. The sensor device may be secured to the substrate in a vertical orientation or a parallel orientation.

[0196] Thereafter, per block 1250, the substrate 1002 (which is assembled with the metal flange 1300, which is doubly brazed on one side to the substrate and on the other side to the ceramic support ring 1500) and the sensor device, can be inserted into a slot in a housing (e.g., 1004 described above) such that the interior region of the substrate extends from the gas-facing surface of the housing. In certain embodiments, per block 1250, the metal flange 1300 is then coupled / fixed to the housing with a fourth seal 1300D (which can be welded (e.g., electron beam welded), soldered, and / or brazed with a suitable brazing alloy) to form a sensor assembly (e.g., sensor assembly 1000). In certain embodiments, the substrate can be fixed to the housing in a cantilever configuration at a middle region of the substrate. In certain embodiments, the substrate can be inserted into two slots at two opposite ends of the housing in an extended configuration and can be coupled / fixed to the housing at two middle regions of the substrate. In some embodiments, at least a portion of the substrate assembly assembled according to method 1200 may be coated, as described above with respect to block 1140 in method 1100 and throughout this specification with respect to various sensor assemblies. In some embodiments, the substrate assembly assembled according to method 1200 may remain completely uncoated.

[0197] Thereafter, whether the sensor assembly is in accordance with Fig.11A Method 1100 or Fig. 11B The sensor assembly can be manufactured by the method 1200 in the embodiment of the present invention, and the sensor assembly can be mounted to the air flow channel or attached (e.g., welded) to the piping, or attached (e.g., via threaded fasteners) to the air stick assembly, for example, by suitable connectors (e.g., one or more VCR connectors). The sensor assembly can be further connected to one or more external devices (e.g., processing device 230) to form a closed air flow measurement and control circuit. In some embodiments, before connecting the sensor assembly to the one or more external devices, certain portions of the sensor assembly (e.g., the external portion of the conductor pin in the sensor assembly 600) can be at least partially de-coated (e.g., laser etched) to expose the conductive portion that can be connected to the external device to form a closed circuit during operation.

[0198] For ease of explanation, the method of the present disclosure is depicted and described as a series of actions. However, unless otherwise stated, the actions according to the present disclosure may occur in various orders and / or in parallel, and occur together with other actions not proposed and described herein. In addition, it is not necessary to implement the method according to the disclosed technical solution without all the actions shown. In addition, those skilled in the art will understand and appreciate that the method may alternatively be represented as a series of interrelated states via a state diagram or an event. In addition, it should be understood that the method disclosed in this specification can be stored on a manufactured article, so that the instructions for executing this method can be transported and transferred to a computing device. The term "manufactured article" used herein is intended to include a computer program accessible from any computer-readable device or storage medium.

[0199] Fig. 12A A cross-sectional side view of a sensor assembly 1201A is illustrated in accordance with an embodiment of the present disclosure. In some embodiments, the sensor assembly 1201A includes a substrate 1202 (e.g., substrate 402, 502, 602, 702, 802, 902, or 1002). The substrate may include an electrical contact pad 1214 (e.g., electrical contact pad 414, 514, 614, 714, 814, 914, or 1014). In some embodiments, the sensor assembly 1201A includes a sensor device 300 coupled (e.g., joined, bonded, attached, etc.) to the substrate 1202 (e.g., at an inner portion of the substrate 1202). In some embodiments, the substrate 1202 is a ceramic substrate. In some embodiments, the substrate 1202 may be a plastic substrate. In some embodiments, the substrate 1202 is an insulating substrate. The substrate 1202 may be electrically insulating and / or thermally insulating. In some embodiments, the substrate 1202 is a dielectric substrate. The substrate 1202 may be a multilayer ceramic substrate, a PCB substrate, or a ceramic substrate. In some embodiments, substrate 1202 may include a PCB ceramic coating. In some embodiments, substrate 1202 may include a PCB insulating polymer (e.g., polyimide). Fig. 12B As described, the base plate 1202 can be joined to the adapter / flange 1300 by brazing (e.g., with a suitable brazing alloy), by welding, and / or by another technique. In some embodiments, the adapter / flange 1300 is coupled to the housing 1204 (e.g., housing 704, 904, or 1004) by one or more screws 1278. The screws 1278 can be threaded fasteners (e.g., screws, bolts, etc.). An O-ring 1280 can be disposed between the adapter / flange 1300 and the top surface of the housing 1204. The screws 1278 can be tightened to seal the adapter / flange 1300 to the housing 1204. When the screws 1278 are tightened, the O-ring 1280 can be compressed and form an airtight seal.

[0200] Fig. 12B 1B is a cross-sectional side view of a sensor assembly 1201B according to an embodiment of the present disclosure. In some embodiments, the adapter / flange 1300 is brazed to the housing 1204 along the braze line 1203. As described above, the adapter / flange 1300 can be brazed using a suitable braze alloy. The adapter / flange 1300 can be brazed to the housing 1204 to form a hermetic seal.

[0201] Fig.13A A cross-sectional side view of an adapter / flange, a multilayer ceramic substrate, and a sensor device are illustrated in accordance with an embodiment of the present disclosure. Fig. 13B An exploded cross-sectional side view of an adapter / flange, a multilayer ceramic substrate, and a sensor device are illustrated in accordance with an embodiment of the present disclosure.

[0202] Substrate 1302 (e.g., substrate 402, 502, 602, 702, 802, 902, or 1002) can be coupled to flange 1399 (e.g., adapter / flange 1300). In some embodiments, flange 1399 includes recess 1303 to receive features of substrate 1302. Recess 1303 can be a circular recess formed in the surface of flange 1399 to position substrate 1302 so that sensor device 300 is positioned at a predetermined position in a gas tube (e.g., a gas tube of housing 704, 904, or 1004). Recess 1303 can prevent substrate 1302 from moving relative to flange 1399. Substrate 1302 can be inserted through a hole in flange 1399 until the features of substrate 1302 lock into recess 1303. In some embodiments, substrate 1302 can be configured to couple with a gas flow tube (e.g., via flange 1399).

[0203] Figures 14A-14D Various alignment features are described that can be used in embodiments to position, align, and / or orient a sensor device relative to a substrate. In embodiments, the sensor features can ensure that the sensor device has a desired orientation (e.g., rotation, tilt, etc.) and position relative to the substrate in one or more planes. In embodiments, these alignment features can be used to Figures 4A-10D any sensor component.

[0204] Fig.14A A side view of a substrate 1402 (eg, a ceramic substrate) and a sensor device 1401 is illustrated after the sensor device 1401 has been positioned and oriented relative to the substrate 1402 for bonding, in accordance with an embodiment of the present disclosure. Fig. 14B An exploded side view of substrate 1402 and sensor device 1401 is illustrated prior to positioning sensor device 1401 relative to substrate 1402 in accordance with an embodiment of the present disclosure. Figures 14A-14BA system 1400 for aligning and / or attaching a sensor device 1401 to a substrate 1402 is shown in accordance with an embodiment of the present disclosure. Fig.14A -B, the sensor device 1401 is oriented so that the sensor face of the sensor device 1401 is orthogonal to the direction of the airflow 1450, where the airflow is in the X direction.

[0205] Sensor device 1401 may correspond to sensor device 300 and may be coupled (e.g., attached, bonded, etc.) to substrate 1402 (which may correspond, for example, to substrates 402, 502, 602, 702, 802, 902, or 1002) using one or more alignment features. The one or more alignment features may align sensor device 1401 relative to substrate 1402 in a first plane and / or a second plane (e.g., the first plane is parallel to the gas flow through the housing of the sensor assembly and / or perpendicular to the interface between sensor device 1401 and substrate 1402, and the second plane is substantially perpendicular to the first plane, such as parallel to the interface between sensor device 1401 and substrate). In some embodiments, the one or more alignment features cause sensor device 1401 to be positioned at a target location on substrate 1402 such that the sensor die is located in the center of the gas channel during use. In some embodiments, the one or more alignment features cause sensor device 1401 to be positioned such that sensor device 1401 is substantially deterministically positioned in the gas channel during use of the sensor assembly. In one embodiment, the first plane in which the orientation of the sensor device 1401 relative to the substrate 1402 is controlled is as follows Fig.14A Thus, the alignment features of the sensor device and the substrate can control the tilt of the sensor device relative to the airflow direction in the XY plane.

[0206] In some embodiments, Fig.14A As shown, the alignment features include one or more alignment features 1412 (e.g., one or more protrusions) extending from the sensor device 1401 and corresponding one or more recesses or holes in the substrate, which are positioned and configured to receive the one or more protrusions. The alignment features may additionally or alternatively include one or more recesses or holes in the sensor device 1401 and corresponding protrusions in the substrate, which are configured to fit into the one or more recesses or holes. The alignment features may additionally or alternatively include one or more alignment marks 1422, which can be used by a technician or a visually assisted robotic arm to position and orient the sensor device 1401 relative to the substrate 1402.

[0207] In some embodiments, the alignment feature additionally or alternatively includes a recess or notch 1420 in the substrate that is configured to receive a portion of the sensor device 1401. For example, Figures 14A-14B As shown, one end and a portion of both sides of the sensor device 1401 fit tightly into the recess 1420. The recess 1420 can provide stability for the sensor device 1401, can limit the freedom of possible positions / orientations of the sensor device 1401 relative to the substrate 1402, and / or can control the positioning of the sensor device 1401 placed on the substrate 1402 (for example, to ensure that when the sensor assembly is installed in a gas assembly or a gas pipeline, the sensor device 1401 is located at the center of a plane orthogonal to the gas flow direction).

[0208] In some embodiments, the sensor device 1401 includes an alignment feature 1412 and the substrate 1402 includes an alignment feature 1414, which together align the sensor device 1401 relative to the substrate 1402. The alignment features 1412, 1414 can control the tilt of the sensor device 1401 relative to the substrate 1402 in a first plane, which is parallel to the interface of the sensor device 1401 and the substrate 1402. In some embodiments, the alignment feature 1412 includes a crest / protrusion and the alignment feature 1414 includes a corresponding groove / hole / recess to receive the crest / protrusion of the alignment feature 1412. In some embodiments, the alignment feature 1412 includes a substantially cylindrical protrusion and the alignment feature 1414 includes a corresponding cylindrical hole to receive the cylindrical protrusion. In some embodiments, the alignment feature 1412 includes a conical protrusion and the alignment feature 1414 includes a corresponding conical hole to receive the conical protrusion. The use of conical protrusions and holes can simplify the process of placing alignment feature 1412 into alignment feature 1414. In some embodiments, alignment feature 1412 and alignment feature 1414 have square, rectangular, trapezoidal, circular, oval, spherical, dome-shaped, or other shapes. In an embodiment, the shape of alignment feature 1412 is the negative of the shape of alignment feature 1414, or the shape of alignment feature 1414 is the negative of the shape of alignment feature 1412, so that the matching of alignment feature 1412 and alignment feature 1414 can be controlled. In some embodiments, the alignment feature can be inside and / or outside of substrate 1402 and / or sensor device 1401. In some embodiments, alignment feature 1414 is machined into substrate 1402 by a computer-controlled machining process. Alignment feature 1414 can be drilled in the surface of substrate 1402 or milled in the surface of substrate 1402. In some embodiments, alignment feature 1412 can be combined with box 1416 (e.g., a plastic box).

[0209] In some embodiments, two pairs of opposing alignment features are used (e.g., first pair of alignment features 1412 and corresponding alignment features 1414, and second pair of alignment features 1412 and corresponding alignment features 1414). In one embodiment, at least three pairs of opposing alignment features are used (e.g., first pair of alignment features 1412 and corresponding alignment features 1414, second pair of alignment features 1412 and corresponding alignment features 1414, and third pair of alignment features 1412 and corresponding alignment features 1414).

[0210] In some embodiments, sensor device 1401 includes one or more lateral protrusions 1410 extending laterally from sensor device 1401. In an embodiment, lateral protrusions 1410 may extend in a plane parallel to a top surface of sensor device 1401. In an embodiment, the lateral protrusions may each include one or more alignment features (e.g., at their distal ends) that extend orthogonally to the plane parallel to the top surface of sensor device 1401.

[0211] As previously described, the sensor device 1401 can be formed, for example, of silicon or another material. The sensor device 1401 can be connected to a box 1416 (e.g., a plastic box), and the alignment features 1412 and / or lateral projections 1410 can be coupled to the box 1416. In one example, the lateral projections 1410 can be posts coupled to the box 1416 of the sensor device 1401 to align the sensor device 1401 relative to the substrate 1402. In some embodiments, the projections 1410 can be metal projections combined with the box 1416. In some embodiments, the projections 1410 are machined by a computer-controlled machining process. Similarly, the projections 1410 can be combined with the box 1416 using a computer-controlled robot and a combination process. In an embodiment, after the sensor device is combined with the substrate 1402, the box can be removed from the sensor device 1401. As shown in the figure, in some embodiments, each of the lateral projections 1410 can include an alignment feature 1412 at the distal end of the lateral projections. Alignment features 1414 may be configured to receive corresponding corresponding alignment features 1412 attached to lateral protrusions 1410. In some embodiments, alignment features 1414 may be configured to receive corresponding protrusions (e.g., protrusions of alignment features 1412). Each of alignment features 1412 may be received by alignment features 1414 formed in substrate 1402. In some embodiments (e.g., Fig.14A-B), the sensor device 1401 may include three lateral protrusions 1410, each of which has a corresponding alignment feature 1412, and the substrate 1402 includes three corresponding alignment features 1414. However, in some embodiments, more or fewer lateral protrusions 1410, alignment features 1412, and / or alignment features 1414 may be included in the system 1400. Fitting each of the alignment features 1412 into the alignment features 1414 may cause the sensor device to be aligned in a first plane (e.g., the plane of the page as shown). In response to each of the alignment features 1412 being inserted into the corresponding alignment feature 1414, the sensor device 1401 may be substantially prevented from moving (e.g., moving sideways, or tilting, etc.) along a plane (e.g., the plane of the page as shown).

[0212] In some embodiments, the substrate 1402 includes one or more alignment marks (e.g., visual alignment features) 1422. The alignment marks 1422 can provide visual cues for the alignment of the sensor device 1401 relative to the substrate 1402 in a first plane. In one embodiment, the alignment marks 1422 include L-shaped marks that indicate where the corners of the sensor device 1401 should be placed. A technician (e.g., an operator, an engineer, an assembler, etc.) or an assembly robot (e.g., via an imaging sensor) can verify the alignment of the sensor device 1401 relative to the alignment marks 1422 in the first plane. In some embodiments, the alignment marks 1422 are engraved on the substrate 1402. In some embodiments, the marks 1422 are engraved on the sensor device 1401.

[0213] Fig. 14C A cross-sectional view of a substrate (eg, a ceramic substrate) 1404 that cooperates with a sensor device 1403 is illustrated in accordance with an embodiment of the present disclosure. Fig.14D An exploded cross-sectional view of a substrate 1404 and a sensor device 1403 is illustrated in accordance with an embodiment of the present disclosure. Figures 14C-14D Shows the Fig.14A -B is a vertical view. Figures 14A-14B In the XY plane, Figures 14C-14D In the XZ plane. As shown, a set of alignment features 1418 (e.g., posts or protrusions) of substrate 1404 are inserted into a set of alignment features 1417 (e.g., holes or recesses) of sensor device 1403. The set of alignment features 1417 and the set of alignment features 1418 are configured to substantially fix sensor device 1403 relative to substrate 1404 in a first plane (e.g., the XY plane) in response to the set of alignment features 1417 receiving the set of alignment features 1418.

[0214] Although sensor device 1401 is described above as including one or more protrusions and substrate 1402 is described as including one or more corresponding holes, it is contemplated that in some embodiments, substrate 1402 may also include one or more protrusions to be inserted into one or more alignment holes formed in sensor device 1401. Similarly, although substrate 1404 is described above as including one or more protrusions and sensor device 1403 is described as including one or more corresponding holes, it is contemplated that in some embodiments, sensor device 1403 may also include one or more protrusions to be inserted into one or more alignment holes formed in substrate 1404.

[0215] Figures 15A-15D Various alignment features are described that can be used in embodiments to position, align, and / or orient a sensor device relative to a substrate. In embodiments, sensor features can ensure that the sensor device has a desired orientation (e.g., rotation, tilt, etc.) and positioning relative to the substrate in one or more planes. These alignment features can be used in embodiments Figures 4A-10D any sensor assembly and can be used with the embodiments Figures 14A-14D alignment features.

[0216] Fig.15A -G illustrates a system for bonding a sensor device to a substrate 1502 (e.g., a ceramic substrate) according to an embodiment of the present disclosure. In some embodiments, sensor device 1503 may correspond to sensor device 300 and / or may be bonded to substrate 1502 (e.g., substrates 402, 502, 602, 702, 802, 902, or 1002) by soldering, brazing, fusing, welding, flash bonding (e.g., using a multilayer reactive foil), or any combination thereof. Specifically, an electrode 1515 (e.g., an electrical contact) of sensor device 1503 may be bonded to an electrical contact pad 1514 of substrate 1502. Electrode 1515 may be bonded to electrical contact pad 1514 as described below. In an embodiment, one or more alignment features (e.g., solder 1518, electrode 1515, electrical contact pad 1514) may be used to align sensor device 1503 to substrate 1502. For embodiments where there is direct contact between the contact pad and the electrode, the alignment features may include contact pads / electrodes of the sensor device and / or the substrate itself. The alignment features may additionally or alternatively include carefully controlled solder joints (e.g., of uniform thickness) for bonding the contact pad to the electrode. In embodiments, the alignment features may be used to control the orientation and / or tilt of the sensor device 1503 relative to the substrate 1502 in a plane perpendicular to the interface of the sensor device and the substrate (e.g., in the XZ plane).

[0217] refer to Fig.15A , according to an embodiment of the present disclosure, a system 1501A combining a sensor device 1503 with a substrate 1502 is shown. In some embodiments, a certain amount of solder 1518 (e.g., solder bumps) can be placed on each of the electrical contact pads 1514. The solder 1518 can be roughly spherical when placed on the electrical contact pads 1514. Then, the top surface of the solder 1518 can be flattened by a coining operation to produce a substantially cylindrical shape. The coining operation can flatten the solder 1518 to a controlled thickness. In some embodiments, the coining operation can flatten each solder bump in a plurality of solder bumps to a controlled thickness that is substantially similar to the controlled thickness of the remaining solder bumps in the plurality of solder bumps. Next, the sensor device 300 can be placed on the substrate 1502 so that the electrode 1515 contacts the flattened solder 1518. Solder 1518 can then be combined with electrode 1515 to form a solder joint between sensor device 300 and substrate 1502. Solder 1518 can form a joint that couples electrode 1515 to electrical contact pad 1514. Because the solder joints have a uniform thickness, the tilt of the sensor device relative to the substrate can be controlled or minimized. For example, due to the use of alignment features (e.g., coined solder bumps 1518), sensor device 1503 can be parallel to substrate 1502. Fig.14A -D The one or more alignment features discussed above may further include solder joints as described above. In some embodiments, the solder joints may align the sensor device 300 in a second plane (eg, an XZ plane).

[0218] refer to Fig. 15B, according to an embodiment of the present disclosure, a system 1501B for bonding a sensor device 1503 to a substrate 1502 is shown. In some embodiments, the sensor device 1503 is placed in a jig 1512. In some embodiments, the substrate 1502 is placed in the jig 1512. The jig 1512 can form a recess to receive the sensor device 1503. In some embodiments, the jig 1512 includes a vacuum port 1504. A vacuum can be provided at the vacuum port 1504 to fix the sensor device 1503 in the jig 1512 during a bonding process (e.g., a bonding process as described herein). The sensor device 1503 can be placed in the jig 1512 so that the electrode 1515 is exposed (e.g., facing up, as shown). The substrate 1502 can be placed on the sensor device 1503. In some embodiments, the substrate 1502 forms a through hole 1516. An electrical contact pad 1514 can extend from the surface of the substrate 1502 into each through hole 1516. Through hole 1516 can be aligned with electrode 1515. In some embodiments, substrate 1502 forms two through holes 1516, and sensor device includes two electrodes 1515. Each through hole 1516 can be aligned with one of the two electrodes 1515. Substrate 1502 can be placed on (e.g., adjacent to) sensor device 1503. Solder 1518 can be placed in through hole 1516 to at least partially fill through hole 1516. In some embodiments, solder 1518 at least partially fills through hole 1516. Solder 1518 can make electrical contact between electrode 1515 and electrical contact pad 1514. Solder 1518 can form a solder joint between substrate 1502 and sensor device 1503. In some embodiments, the one or more alignment features as described above include solder joints discussed herein. The solder joints discussed herein can align sensor device 1503 within a second plane.

[0219] refer to Fig. 15C, according to an embodiment of the present disclosure, a system 1501C for combining a sensor device with a substrate is shown. In some embodiments, an electrical contact pad 1514 can be disposed between two layers of a substrate 1502. In such an embodiment, the electrical contact pad 1514 can be exposed within the inner surface of a through hole 1516. In addition, in some embodiments, a lamination layer 1526 can also be deposited on the solder 1518. The lamination layer 1526 can be deposited on a portion of the surface of the substrate 1502 near the through hole 1516. In some embodiments, the lamination layer 1526 can be a conformal coating, as described above. The lamination layer 1526 can be an anti-corrosion layer to protect the solder 1518 and / or the joint formed between the sensor device 300 and the substrate 1502. The solder 1518 can form a solder joint between the substrate 1502 and the sensor device 1503. In some embodiments, the one or more alignment features described above include the solder joints discussed herein. The solder joints discussed herein can align the sensor device 1503 within the second plane.

[0220] refer to Fig.15D , according to an embodiment of the present disclosure, a system 1501D for combining a sensor device with a substrate is shown. In some embodiments, an electrical contact pad 1514 of a substrate 1502 can be placed in contact with an electrode 1515 of a sensor device 1503. In some embodiments, radiation from a welder can be directed to a metal contact area formed by the electrical contact pad 1514 and the electrode 1515. The metal contact area can be irradiated with radiation 1524 to create a fusion joint 1522 (e.g., by ultraviolet, infrared, or CO2 laser radiation). In some embodiments, a laser beam can be used to irradiate the electrical contact pad 1514 and the electrode 1515. The irradiated electrical contact pad 1514 and the electrode 1515 can be heated by the radiation 1524 and at least partially melted. The electrical contact pad 1514 and the electrode 1515 can fuse as they cool. In some embodiments, the metal contact area functions as one of the one or more alignment features as described above. In some embodiments, the fusion joint between the electrical contact pad and the electrode functions as one of the one or more alignment features as described above.

[0221] In some embodiments, to facilitate fusing the electrical contact pad 1514 and the electrode 1515 by irradiation (e.g., via the emitted radiation 1524), the substrate 1502 and / or the sensor device 1503 are substantially transparent to the wavelength of the radiation 1524 used. For example, the substrate 1502 may be substantially transparent to a laser beam of a given wavelength used to fuse the electrical contact pad 1514 and the electrode 1515. As used herein, "substantially transparent" means that at least about 80% or at least 90% or more of the radiation 1524 is transmitted through the substrate 1502 and / or the sensor device 1503 (e.g., up to 20% absorption). In some embodiments, the substrate 1502 may be made of glass, quartz, or a silicate material. In such embodiments, the substrate 1502 may be sufficiently transparent to the wavelength of the radiation 1524 emitted from the radiation source to heat the electrical contact pad 1514 and the electrode 1515 to a melting point. In some embodiments, the transparency of the substrate 1502 and / or the sensor device 1503 may be increased by reducing reflections. In some embodiments, the surfaces of substrate 1502 and sensor device 1503 may be textured to increase transparency.

[0222] In some embodiments, the electrical contact pad 1514 and the electrode 1515 are made of different metals. In other embodiments, the electrical contact pad 1514 and the electrode 1515 are made of the same metal (e.g., platinum). In some embodiments, the electrical contact pad 1514 and the electrode 1515 are made of metals that can be compatible and fused together as described above.

[0223] refer to Fig.15E , according to an embodiment of the present disclosure, a system 1501E is shown that combines a sensor device 1503 with a ceramic substrate 1502. In some embodiments, the electrical contact pad 1514 and the electrode 1515 are combined with a metal bond. As described above, in some embodiments, the electrical contact pad 1514 and the electrode 1515 include a platinum conductor. The metal bond may include one or more layers of a metal selected from platinum, tin, indium, copper, aluminum and / or nickel. In some embodiments, the metal bond includes a metal that is corrosion-resistant and / or compatible with the chemical substances of the gas to be flowed through the sensor assembly, and the substrate 1502 and the sensor device 1503 are part of the sensor assembly. In some embodiments, the metal bond includes one or more metal bonding layers. In one embodiment, each metal bonding layer may include aluminum and / or nickel. The metal bond provides an electrical connection between the electrode 151 and the electrical contact pad 1514.

[0224] The metal bond can mechanically bond the electrical contact pad 1514 and the electrode 151, and can be produced using a multilayer reactive foil 1519. In one embodiment, a layer of metal bonding material is used, which includes aluminum and / or nickel. Alternatively, other metals can also be used. In addition, the metal bond can include a thin layer of aluminum and / or nickel (whose thickness is, for example, about 2-4 mils in one embodiment) between two other metal layers (for example, between two tin layers). In one embodiment, the thin layer is initially a reactive multilayer foil (referred to herein as a reactive foil) consisting of alternating nanoscale layers of reactive materials such as aluminum and nickel. During the room temperature metal bonding process, the reactive foil can be activated (e.g., ignited) to produce a nearly instantaneous reaction, producing temperatures above 1500 degrees Celsius. This can cause the upper and lower layers of metal acting as solder to melt and reflow to bond the electrode 1515 to the electrical contact pad 1514. In one embodiment, the reactive foil is manufactured by Indium Corporation of the United States.

[0225] In one example, foil 1519 may include alternating layers of nickel alloy and aluminum alloy. Foil 1519 may be cut into tabs and disposed between electrical contact pads 1514 and electrodes 1515. During the manufacturing process, as described below with reference to Fig. 16B As discussed, in some embodiments, the foil 1519 can be ignited (e.g., ignited by applying an electric current to the foil 1519) to cause the foil 1519 to reactively bond to both the electrical contact pad 1514 and the electrode 1515. For example, a voltage can be applied to the foil 1519 to induce an electric current through the foil 1519 to cause the foil 1519 to reactively bond and conform to the shape of the electrical contact pad 1514 and / or the shape of the electrode 1515. In some embodiments, the bond produced by the reactively bonded foil 1519 is a conductive bond between the electrical contact pad 1514 and the electrode 1515. In some embodiments, an anti-corrosion coating is disposed on the exposed portion of the bond. The anti-corrosion coating can be a perfluoropolymer monolayer coating, a silane-based coating (e.g., a fluorinated alkylsilane coating, a perfluorooctylitriethoxysilane coating, etc.), or an inorganic oxide coating.

[0226] refer to Fig.15F, according to an embodiment of the present disclosure, a system 1501F for bonding a sensor device to a ceramic substrate is shown. In some embodiments, a metal adhesion layer 1517 is deposited onto the electrical contact pad 1514 and / or the electrode 1515. In some embodiments, one or more metal adhesion layers 1517 are deposited onto the electrical contact pad 1514 and / or the electrode 1515. The metal adhesion layer 1517 can facilitate bonding a multi-layer reactive foil 1519 to the electrical contact pad 1514 and / or the electrode 1515. In some embodiments, the metal adhesion layer 1517 can be an aluminum alloy layer or a nickel alloy layer. The foil 1519 can be disposed on the metal adhesion layer 1517 of either the electrical contact pad 1514 or the electrode 1515 prior to bonding. The electrical contact pad 1514 and the electrode 1515 can be bonded via the multi-layer reactive foil 1519, as described above with reference to Fig.15E Description.

[0227] refer to Figure 15G , according to an embodiment of the present disclosure, a system 1501G is shown that combines a sensor device 1503 with a substrate 1502. In some embodiments, the sensor device 1503 can be combined with the substrate 1502 through one or more welded joints. For example, the sensor device 1503 can be welded to the substrate 1502 (e.g., welded via the electrode 1515 and the electrical contact pad 1514). A metal wire 1521 (e.g., a platinum wire) can be welded to each electrode 1515. The metal wire 1521 can be welded to each electrode 1515 by a welding operation (e.g., an electron beam welding operation or a laser welding operation). Alternatively, the electrode 1515 can be a metal wire (e.g., a platinum wire) extending from the sensor device 1503. The sensor device 1503 can be placed on the substrate 1502 so that at least a portion of the metal wire 1521 covers the corresponding electrical contact pad 1514. The metal wire 1521 can be welded to the electrical contact pad 1514 by another welding operation (e.g., an electron beam welding operation or a laser beam welding operation, etc.). Metal wires 1521 soldered to electrical contact pads 1514 and / or electrodes 1515 may bond sensor device 300 to substrate 1502 .

[0228] In some embodiments, by reference Fig.15A The bonded joints (e.g., solder joints, fusion joints, welding joints, etc.) formed by the processes and methods described in -G are included in the one or more alignment features as described above. The bonded joints can align and / or fix the sensor device 300 relative to the substrate 1502 in the first plane and the second plane.

[0229] Fig.16A -C illustrates a flow chart of a method for manufacturing a sensor assembly according to an embodiment of the present disclosure. Fig.16A, according to an embodiment of the present disclosure, a flow chart of a method 1600A of manufacturing a sensor assembly is shown.

[0230] At block 1602, in some embodiments, a substrate having an outer region, an inner region, and an intermediate region is provided. The substrate may further include one or more electrical contact pads located at least on the inner region. The substrate may be a multilayer ceramic substrate.

[0231] At block 1604, in some embodiments, the sensor die (e.g., sensor device 300) is coupled to the substrate via one or more alignment features that align the sensor die relative to the substrate in at least one of the first plane or the second plane. The one or more alignment features may be protrusions (e.g., Fig.14A -D's lateral protrusions 1410), alignment marks (e.g., visual alignment features, e.g. Figures 14A-14B In some embodiments, at block 1606, a first set of protrusions protruding from the sensor die are inserted into a first set of alignment holes (e.g., Fig.14A -D alignment holes). In some embodiments, the first set of protrusions are formed from a plastic box (e.g. Fig.14A , B box 1416) protrudes. Then, the sensor device can be combined with the substrate while the alignment features (e.g., protrusions, solder bumps, etc.) of the sensor device are engaged with the alignment features (e.g., holes, solder bumps, etc.) of the substrate.

[0232] At block 1608, in some embodiments, the substrate is coupled to the housing at an outer region of the substrate to provide an airtight seal. As described above, the substrate can be welded and / or brazed to the housing. In some embodiments, the substrate can be coupled to the housing via a flange (e.g., flange / adapter 1300).

[0233] refer to Fig. 16B , according to an embodiment of the present disclosure, a flow chart of a method 1600B for manufacturing a sensor assembly is shown. In some embodiments, at block 1612, a substrate is provided. The substrate may have an outer region, an inner region, and an intermediate region. The substrate may further include one or more electrical contact pads located at least on the inner region. At block 1614, in some embodiments, a sensor die (e.g., sensor device 300) is provided. The sensor die may have one or more electrodes.

[0234] At block 1616, in some embodiments, a multilayer reactive foil is disposed on each of the one or more electrical contact pads of the substrate and / or the electrodes of the sensor die. The multilayer reactive foil may include a plurality of alternating layers of two reactive metals (e.g., nickel and aluminum). In some embodiments, a metal adhesion layer (e.g., an aluminum alloy layer or a nickel alloy layer) is deposited on the electrical contact pads and / or electrodes before the multilayer reactive foil is disposed on the one or more electrical contact pads and / or electrodes.

[0235] At block 1618, in some embodiments, the sensor die is positioned on the interior region of the substrate such that the multilayer reactive foil is sandwiched between the one or more electrical contact pads and the one or more electrodes. At block 1620, in some embodiments, the multilayer reactive foil may be ignited to form a metal bond between the one or more electrical contact pads of the substrate and the one or more electrodes of the sensor die. In some embodiments, the multilayer reactive foil may be ignited by inducing an electric current through the foil (e.g., by applying a voltage to the foil). The metal bonding process using the reactive multilayer foil may be a room temperature metal bonding process in which the reactive foil may be initiated (e.g., ignited) to create a near instantaneous reaction at an interface of two surfaces to be bonded that produces more than 1500 degrees Celsius. This may cause the upper and lower layers of metal (e.g., metal adhesion layers) that may act as solder to melt and reflow to bond the electrodes to the electrical contact pads.

[0236] In some embodiments, after the metal bonding process is completed (eg, via ALD, CVD, etc.), an anti-corrosion coating (eg, as discussed above) is deposited on at least the exposed portion of the metal bond.

[0237] At block 1622, in some embodiments, the substrate is coupled to the housing at the exterior region to provide an airtight seal. As described above, the substrate can be welded and / or brazed to the housing. In some embodiments, the substrate can be coupled to the housing via a flange (e.g., flange / adapter 1300).

[0238] refer to Fig. 16C , according to an embodiment of the present disclosure, a flow chart of a method 1600C for manufacturing a sensor assembly is shown. In some embodiments, at block 1632, a substrate is provided. The substrate may have an outer region, an inner region, and an intermediate region. The substrate may further include one or more electrical contact pads located at least on the inner region. At block 1634, in some embodiments, a sensor die (e.g., sensor device 300) is provided. The sensor die may include one or more electrodes.

[0239] At block 1636, in some embodiments, a metal wire may be bonded to each of the one or more electrodes by a first welding operation. In some embodiments, the one or more electrodes include platinum and the metal wire may be a platinum wire. The first welding operation may be a laser welding operation or an electron beam welding operation. The first end of the metal wire may be bonded to each electrode by a welding operation. In some embodiments, the electrode itself is a metal wire extending from the sensor device, and therefore the operation of block 1636 may be skipped.

[0240] At block 1638, in some embodiments, the sensor die is positioned on the interior area of ​​the substrate so that at least a portion of the metal wire or electrode overlies a corresponding electrical contact pad of the one or more electrical contact pads. At block 1640, in some embodiments, the metal wire is bonded to the corresponding electrical contact pad by a second welding operation (or a first welding operation if the electrode is a metal wire). The welding operation may be a laser welding operation or an electron beam welding operation. In some embodiments, the welding operation includes welding along a first side of the metal wire and a second side of the metal wire. The welding operation may bond the corresponding metal wire to the corresponding electrical contact pad.

[0241] At block 1642, in some embodiments, the substrate is coupled to the housing at the exterior region to provide an airtight seal. As described above, the substrate can be welded and / or brazed to the housing. In some embodiments, the substrate can be coupled to the housing via a flange (e.g., flange / adapter 1300).

[0242] Fig.16D -F illustrates a flow chart of a method for bonding a sensor device to a substrate according to an embodiment of the present disclosure. Fig.16D , according to an embodiment of the present disclosure, a flow chart of a method 1600D for bonding a sensor device to a substrate is described. At block 1652, in some embodiments, a first solder bump is placed on a first electrical contact pad (e.g., an electrical contact pad of a substrate). At block 1654, in some embodiments, a second solder bump is placed on a second electrical contact pad. The first solder bump and the second solder bump may include a first amount of solder. In some embodiments, the first solder bump and the second solder bump are substantially spherical.

[0243] At block 1656, in some embodiments, the block includes: flattening the top surface of each of the first solder bump and the second solder bump by coining. The coining process can form each of the first solder bump and the second solder bump into a substantially cylindrical shape. The coined solder bumps can each have the same or substantially the same size and / or thickness. At block 1658, in some embodiments, the first electrode and the second electrode of the sensor die are placed on the top surface of the flattened first solder bump and the second solder bump to join the sensor die to the substrate. In some embodiments, the sensor die is placed on the substrate by an end effector of a robotic arm (e.g., a robotic arm of a manufacturing robot). Electrical connectivity can be established between the sensor die and the substrate via electrical contact pads, solder bumps, and electrodes. Then, welding or soldering can be performed to combine the electrical contact pads with the electrodes using solder bumps.

[0244] refer to Fig.16E , a flow chart of a method 1600E for bonding a sensor device to a substrate is illustrated according to an embodiment of the present disclosure. At block 1662, in some embodiments, a sensor die is placed in a fixture. The first electrode and the second electrode of the sensor die can be exposed in response to the sensor die being placed in the fixture. For example, the sensor die can be placed in a recess of the fixture with the electrodes facing upward (e.g., as shown in FIG. 16A ). Fig. 15B shown).

[0245] At block 1664, in some embodiments, the first through hole and the second through hole formed by the substrate are aligned with the first electrode and the second electrode, respectively. At block 1666, the substrate can be placed adjacent to (e.g., on) the sensor die. In some embodiments, the substrate is placed on the sensor die by an end effector of a robotic arm (e.g., a robotic arm of a manufacturing robot).

[0246] At block 1668, in some embodiments, the first through-hole and the second through-hole are each filled with a first amount of solder to join the sensor die to the substrate. In some embodiments, the first amount of solder may at least partially fill the first through-hole and the second through-hole. The solder may establish electrical connectivity between the sensor die and the substrate via the electrodes and the electrical contact pads.

[0247] At block 1670, in some embodiments, a lamination layer is deposited on the solder. The lamination layer can protect the solder from being used in the sensor assembly (e.g., in reference Figure 1 The lamination layer may be deposited on the solder and at least a portion of the substrate surface adjacent to the first through hole and the second through hole.

[0248] refer to Fig.16F, a flow chart of a method 1600F for bonding a sensor device to a substrate is illustrated according to an embodiment of the present disclosure. At block 1672, in some embodiments, a sensor die is placed on the substrate with electrodes of the sensor die resting on electrical contact pads of the substrate. In some embodiments, the sensor die is placed by an end effector of a robotic arm (e.g., a robotic arm of a manufacturing robot).

[0249] At block 1674, in some embodiments, the electrode and / or the electrical contact pad is irradiated to fuse the electrode to the electrical contact pad. In some embodiments, the electrode and / or the electrical contact pad is irradiated with a radiation source. The radiation source can be a laser radiation source, a UV radiation source, and / or an infrared radiation source. In some embodiments, the radiation source is a CO2 laser. In some embodiments, the sensor die and / or substrate is made of a material that is substantially transparent to the predetermined radiation wavelength, as described above with reference to Fig.15D The fusion bonding of the electrodes and the electrical contact pads can establish electrical connectivity between the sensor die and the substrate via the electrodes and the electrical contact pads.

[0250] For ease of explanation, the method of the present disclosure is depicted and described as a series of actions. However, unless otherwise stated, the actions according to the present disclosure may occur in various orders and / or in parallel, and occur together with other actions not proposed and described herein. In addition, it is not necessary to implement the method according to the disclosed technical solution without all the actions shown. In addition, those skilled in the art will understand and appreciate that the method may alternatively be represented as a series of interrelated states via a state diagram or an event. In addition, it should be understood that the method disclosed in this specification can be stored on a manufactured article, so that the instructions for executing this method can be transported and transferred to a computing device. The term "manufactured article" used herein is intended to include a computer program accessible from any computer-readable device or storage medium.

[0251] In some embodiments, a sensor assembly including a substrate, a sensor die / sensor device and a housing includes one or more channels that provide an airflow path. In such an embodiment, the housing may not be fixed to the gas pipeline to extend the sensor die / sensor device into the airflow path in the gas pipeline. Conversely, the airflow path may be shunted by the one or more channels of the sensor assembly and then returned to the gas pipeline. An example of a sensor assembly configuration that includes its own channel to provide an airflow path is a sensor assembly configuration designed for use with a gas stick assembly. The sensor assembly may be configured to fit a standard base on the base of the gas stick assembly (e.g., a base that generally receives a valve, filter, or other component for the gas stick assembly) in its size and shape. For such an embodiment, a substrate may be disposed within at least a portion of the housing, and a sensor device / sensor die coupled to the substrate may be located within an internal channel of the housing. In an embodiment, the sensor device / sensor die is located at the center of a cross section of a channel in the housing.

[0252] Figures 17A-17H Embodiments of sensor assemblies that may be used on gas stick assemblies are described.

[0253] Fig.17A A perspective view of a sensor assembly 1700A is illustrated in accordance with an embodiment of the present disclosure. Fig. 17B Explained Fig.17A Front view of the mid-section EE. Fig. 17C Explained Fig.17A Disassembled front view of the middle section EE. Fig.17D Explained Fig.17A Front view of the mid-section FF.

[0254] In some embodiments, sensor assembly 1700A includes housing 1708. In some embodiments, housing 1708 is made of a stainless steel alloy. Alternatively, housing 1708 can be made of any housing material discussed elsewhere herein. Housing 1708 can be substantially cubic in shape, or can have a cylindrical or other shape. Housing 1708 can include one or more holes for mounting on a base of an air stick assembly (e.g., an air stick assembly (e.g., Fig.17H-I gas stick assembly 1750) on the base). In addition, the one or more holes for mounting can be configured to couple the housing 1708 to an auxiliary component. The bottom surface of the sensor assembly 1700A can be sealed to the base or base of the gas stick assembly, and the top surface of the sensor assembly 1700A can be optionally sealed to an auxiliary component (such as a filter or a valve). The holes can be configured to receive fasteners (such as screws or bolts, etc.) to fasten the sensor assembly 1700A to the gas stick assembly. The top and bottom surfaces of the housing 1708 may include one or more grooves or recessed areas configured to receive a sealing component (such as a metal seal). Once the housing 1708 is fastened to the base and / or auxiliary component of the gas stick assembly via fasteners, the sealing component can be compressed and a seal can be formed between the housing 1708 and the base of the gas stick assembly and / or between the housing 1708 and the auxiliary component.

[0255] The housing 1708 may include one or more air flow channels. For example, the housing 1708 may be configured to allow air to flow in a first direction (e.g., in a Fig. 17B The housing 1708 may further be formed to allow gas to flow in a second direction (e.g., vertically upward in the air) (e.g., from an air stick assembly, an air flow assembly, etc.). Fig. 17B The second direction can be opposite to the first direction. For example, the first channel can cause the gas to flow upward, while the second channel can cause the gas to flow downward (e.g., Fig.17A -C). The first channel may include a first opening 1781 in the bottom surface of the housing 1708 and a second opening 1782 in the top surface of the housing 1708. Gas may be received from the gas stick assembly via the first opening 1781. Gas may be supplied to auxiliary components (e.g., valves, regulators, filters, regulators, mass flow controllers, etc.) mounted on the top of the sensor assembly 1700A via the second opening 1782. In some embodiments, the second channel may include a third opening 1783 in the top surface of the housing 1708 to receive gas from the auxiliary components. The second channel may include a fourth opening in the bottom surface of the housing 1708 to supply gas to the gas stick assembly. The second channel may form a return gas flow path to provide gas to the downstream components of the gas stick assembly. In some embodiments, the housing 1708 receives gas from the upstream components of the gas stick assembly. Similarly, in some embodiments, the housing 1708 is used to supply gas to the downstream components of the gas stick assembly.

[0256] In some embodiments, the first opening 1781, the second opening 1782, the third opening 1783, and / or the fourth opening 1784 include an area configured to receive a sealing component. For example, the second opening 1782 may include a recess to receive an O-ring. The O-ring may be made of a material suitable for sealing the interface between the housing 1708 and the auxiliary component. In some embodiments, the second opening 1782 and the third opening 1783 are configured to receive an end plug (e.g., Fig.17E , F end plug 1786) to guide the gas from the first channel to the second channel. In some embodiments, the sealing portion of the first opening 1781 seals the interface between the housing 1708 and the substrate portion (eg, body) of the gas stick assembly.

[0257] In some embodiments, filter / layered element 1722 is arranged in the passage of housing 1708. In some embodiments, filter / layered element 1722 is a screen. Filter / layered element 1722 can be combined with the inner surface of the first passage of housing 1708. In some embodiments, filter / layered element 1722 can promote laminar airflow through the first passage and / or the second passage of housing 1708. When gas flows through filter / layered element 1722, airflow can be straightened (for example, straightened by the opening of filter / layered element 1722). The straightened airflow can flow in a laminar manner.

[0258] In some embodiments, housing 1708 forms a recess in the side surface of housing 1708, and substrate 1702 (e.g., substrate 402, 502, 602, 702, 802, 902, or 1002) is mounted in the recess. Substrate 1702 may include electrical contact pads 1714 and electrical connections to one or more electrodes of sensor device 300, which may be combined with substrate 1702 via any combination technology described herein. In some embodiments, sensor device 300 may have been positioned and / or oriented relative to substrate 1702 using any one or more alignment features and / or technology described herein. In some embodiments, sensor device 300 is disposed in a first channel. In some embodiments, sensor device 300 is disposed in a second channel. Disposing sensor device 300 in the second channel may help establish a laminar airflow flowing through housing 1708. In some embodiments, the sensor assembly 1700A includes two substrates 1702 and two sensor devices 300 (each sensor device is attached to one of the two substrates), each of which is disposed in one of the first channel or the second channel. In some embodiments, the substrate 1702 is coupled to the housing via a flange / adapter 1300. In an embodiment, the flange / adapter 1300 can be made of a stainless steel alloy, or can be made of a Kovar alloy. In some embodiments, the substrate 1702 is combined with the flange / adapter 1300 by welding or brazing, as described above. In some embodiments, the flange / adapter 1300 is combined with the housing 1708 by welding or brazing, as described above. In some embodiments, the substrate 1702 is coupled to the housing 1708 to form an airtight seal. In some embodiments, the support ring 1703 (e.g., support ring 1500) is brazed or welded to the adapter / flange 1300 to reduce mechanical and / or thermal stresses at one or more joints (e.g., welded joints, brazed joints, etc.) between the substrate 1702, the adapter / flange 1300, and / or the housing 1708. In some embodiments, each of the adapter / flange 1300 and the support ring 1703 may include a through hole to receive the substrate 1702 (e.g., Fig. 17C Likewise, the housing 1708 may include a hole to receive the substrate 1702 (e.g., Fig. 17C ). In some embodiments, the sensor assembly 1700A includes a second sensor disposed within the housing. The second sensor may be attached to the second substrate. The second sensor may be selected from the group consisting of a temperature sensor, a flow sensor, or a pressure sensor. The second sensor may be configured to sense a condition of a gas flowing through either the first channel or the second channel. In some embodiments, a pressure sensor configured to sense gas pressure is disposed in the first channel, and a flow sensor (e.g., sensor device 300) is disposed in the second channel.

[0259] Fig.17E A perspective view of a sensor assembly 1700B is illustrated in accordance with an embodiment of the present disclosure. Fig.17F Explained Fig.17F 1700B includes similar features as sensor 1700A described above (e.g., housing 1708, substrate 1702, first opening 1781, sensor device 300, filter / layered element 1722, etc.). In some embodiments, sensor assembly 1700B includes end plug 1786. End plug 1786 can be bonded to the top surface of housing 1708 (e.g., via welding, brazing, soldering, etc.). In some embodiments, end plug 1786 is bonded to second opening 1782 and third opening 1783 (e.g., Fig.17A , the second opening and the third opening of D) are combined. In some embodiments, the end plug 1786 plugs the second opening 1782 and the third opening 1783. The housing 1708 and / or the end plug 1786 may include a channel (e.g., a third channel) that connects the first channel and the second channel to direct the gas flow from the first channel to the second channel. In some embodiments, the housing 1708 of the sensor assembly 1700B is configured to receive gas from the gas stick assembly via the first opening 1781 and to guide the gas back to the gas stick assembly via the fourth opening 1784. In some embodiments, the sensor assembly 1700B includes a second sensor disposed in the housing. The second sensor may be selected from a group consisting of a temperature sensor, a flow sensor, or a pressure sensor. The second sensor may be configured to sense the condition of the gas flowing through either the first channel or the second channel.

[0260] Figure 17G 1700C is a cross-sectional view of a sensor assembly 1700C according to an embodiment of the present disclosure. In some embodiments, the sensor assembly 1700C includes a pressure sensor 1792 disposed within the housing 1708. The pressure sensor 1792 can sense the pressure of gas flowing through one or more channels of the housing 1708. In some embodiments, the sensor assembly 1700C includes a sensor device 300 coupled to the substrate 1702. The sensor device 300 can be disposed in a gas return channel of the housing 1708. In some embodiments, the placement of the sensor device 300 can facilitate laminar gas flow through the housing 1708.

[0261] Fig.17HA schematic diagram of a sensor assembly (e.g., sensor assembly 1700A or 1700B) coupled to a gas stick assembly is illustrated in accordance with an embodiment of the present disclosure. Multiple gas stick assemblies can receive gas from multiple gas suppliers. For example, a processing device can include a different gas stick assembly for each gas delivered to a processing chamber. As shown, the gas flows through the gas stick assembly from left to right. In some embodiments, the gas stick assembly 1750 includes a mixing valve 1751, which can be the first component of the gas stick assembly 1750. The mixing valve can include a manual valve and a valve (e.g., a pneumatic valve, an electric valve, etc.) that can be automatically actuated. The mixing valve 1751 can receive gas from a gas source (not shown). The mixing valve 1751 can direct the gas to the purge valve 1752 via one or more channels. The purge valve 1752 can be configured to purge the gas stick assembly 1750. In some embodiments, the gas stick assembly 1750 includes a regulator 1753. The regulator 1753 can receive gas from the purge valve 1752. Regulator 1753 can regulate the gas flow through gas stick assembly 1750. In some embodiments, sensor assembly 1700A, 1700B (e.g., sensor assembly 1700A or 1700B) can be coupled downstream of regulator 1753. Sensor assembly 1700A, 1700B can be a gas flow sensor of gas stick assembly 1750. In some embodiments, filter 1754 is connected to sensor assembly 1700A, 1700B and receives gas flow from sensor assembly 1700A, 1700B (e.g., via Fig.17A -C). Filter 1754 can provide airflow back to sensor assemblies 1700A, 1700B (e.g., to Figures 17A-17D 1783 of the gas stick assembly 1750). In some embodiments, the upstream valve 1755 can receive gas from the sensor assembly 1700A, 1700B and direct the gas flow to the mass flow controller 206. In some embodiments, the sensor assembly 1700A, 1700B acts as a mass flow controller and no additional mass flow controller is included in the gas stick assembly 1750. The mass flow controller 1756 and / or the sensor assembly 1700A, 1700B can control the gas flow through the gas stick assembly 1750. In some embodiments, the downstream valve 1757 receives gas from the mass flow controller or other upstream component. The downstream valve 1757 can direct the gas to the gas destination (e.g., a processing chamber; not shown).

[0262] Although the sensor assemblies 1700A, 1700B are illustrated and described as being disposed below the filter 1754 along the airflow path, those skilled in the art will recognize that the sensor assemblies 1700A, 1700B may alternatively be located anywhere along the airflow path of the air stick assembly 1750. For example, the sensor assemblies 1700A, 1700B may be located upstream and / or downstream of any of the components of the air stick assembly described above. As another example, the sensor assemblies 1700A, 1700B may be located below any of the devices described above. The sensor assemblies 1700A, 1700B may receive airflow from an upstream component of the air stick assembly 1750 and direct the airflow to a downstream component of the air stick assembly 1750.

[0263] Fig.17I A perspective view of a sensor assembly (e.g., sensor assembly 1700A) coupled to a gas stick assembly 1750 is illustrated in accordance with an embodiment of the present disclosure. Multiple gas stick assemblies can receive gas from multiple gas supplies. For example, a processing apparatus can include a different gas stick assembly for each gas delivered to a processing chamber. As shown, the gas flows through the gas stick assembly from left to right.

[0264] In some embodiments, the gas stick assembly 1750 includes a base 1759. The gas stick assembly 1750 can receive gas (e.g., from a gas source) via a gas coupler 1758. In some embodiments, the gas stick assembly 1750 includes a mixing valve 1751, a purge valve 1752, a regulator 1753, a sensor assembly 1700A, a filter 1754, an upstream valve 1755, a mass flow controller 1756, and / or a downstream valve 1757. In some embodiments, each of the mixing valve 1751, the purge valve 1752, the regulator 1753, the sensor assembly 1700A, the filter 1754, the upstream valve 1755, the mass flow controller 1756, and / or the downstream valve 1757 is coupled to the gas stick assembly base 1759. In some embodiments, the filter 1754 can be coupled to the top surface of the sensor assembly 1700A. As can be appreciated by those skilled in the art, the sensor assembly 1700A can be coupled between the base 1759 and any of the mixing valve 1751, the purge valve 1752, the regulator 1753, the sensor assembly 1700A, the filter 1754, the upstream valve 1755, the mass flow controller 1756, and / or the downstream valve 1757. Likewise, in some embodiments, any of the mixing valve 1751, the purge valve 1752, the regulator 1753, the sensor assembly 1700A, the filter 1754, the upstream valve 1755, the mass flow controller 1756, and / or the downstream valve 1757 can be coupled to the top surface of the sensor assembly 1700A. In some embodiments, the sensor assembly 1700A is coupled between the base 1759 and a pressure sensor (not shown).

[0265] Fig.18 A diagrammatic representation of a machine in the exemplary form of a computer system 1800 is illustrated, in which a set of instructions (e.g., for causing the machine to perform any one or more of the methodologies discussed herein) can be executed. In alternative embodiments, the machine can be connected (e.g., networked) with other machines in a LAN, WAN, intranet, extranet, or internet. The machine can operate as a server or client machine in a client and server network environment, or as a peer machine in a peer (or distributed) network environment. The machine can be a personal computer (PC), a tablet PC, a PDA, a cellular phone, a web appliance, a server, a network router, a switch or a bridge, or any machine capable of executing a set of instructions (in sequence or otherwise) that specify actions to be taken by the machine. Further, although only a single machine is shown, the term "machine" should also be considered to include a collection of any machines that individually or collectively execute a set (or multiple sets) of instructions to perform any one or more of the methodologies discussed herein. Some or all of the components of computer system 1800 may be utilized by or describe any electronic components described herein (eg, processing device 230 or any electronic components utilized in conjunction with operation of chamber 101 or flow modulator 210).

[0266] The exemplary computer system 1800 includes a processing device (processor) 1802, a main memory 1804 (e.g., ROM, flash memory, dynamic random access memory (DRAM) such as synchronous DRAM (SDRAM) or Rambus DRAM (RDRAM)), etc.), a static memory 1806 (e.g., flash memory, static random access memory (SRAM), etc.), and a data storage device 1820 that communicate with each other via a bus 1810.

[0267] Processor 1802 represents one or more general processing devices such as a microprocessor, a central processing unit, etc. In more detail, processor 1802 may be a complex instruction set computing (CISC) microprocessor, a reduced instruction set computing (RISC) microprocessor, a very long instruction word (VLIW) microprocessor, or a processor that implements other instruction sets, or a processor that implements a combination of instruction sets. Processor 1802 may also be one or more special-purpose processing devices, such as an application-specific integrated circuit (ASIC), a field programmable gate array (FPGA), a digital signal processor (DSP), a network processor, etc. Processor 1802 is configured to execute instructions 1840 to perform the operations and steps discussed herein.

[0268] The computer system 1800 may further include a network interface device 1808. The computer system 1800 may also include a video display unit 1812 (e.g., a liquid crystal display (LCD) or a cathode ray tube (CRT) or a touch screen), an alphanumeric input device 1814 (e.g., a keyboard), a cursor control device 1816 (e.g., a mouse), and a signal generating device 1822 (e.g., a speaker).

[0269] The power supply device 1818 can monitor the power level of a battery used to power the computer system 1800 or one or more components thereof. The power supply device 1818 can provide one or more interfaces to provide indications of power levels, a time window remaining before the computer system 1800 or one or more components thereof shuts down, power consumption rates, indicators of whether the computer system is utilizing external power or battery power, and other power-related information. In some embodiments, indications related to the power supply device 1818 can be accessed remotely (e.g., can be accessed by a remote backup management module via a network connection). In some embodiments, the battery utilized by the power supply device 1818 can be an uninterruptible power system (UPS) local or remote to the computer system 1800. In such embodiments, the power supply device 1818 can provide information about the power level of the UPS.

[0270] The data storage device 1820 may include a computer-readable storage medium 1824 (e.g., a non-transitory computer-readable storage medium) having stored thereon one or more sets of instructions 1840 (e.g., software) embodying any one or more of the methodologies or functions described herein. These instructions 1840 may also reside completely or at least partially within the main memory 1804 and / or within the processor 1802 during execution of the instructions by the computer system 1800, the main memory 1804 and the processor 1802 also constituting computer-readable storage media. The instructions 1840 may further be transmitted or received over the network 1830 via the network interface device 1808. Although the computer-readable storage medium 1824 is shown as a single medium in an exemplary embodiment, it is to be understood that the computer-readable storage medium 1824 may also include a single medium or multiple media (e.g., a centralized or distributed database and / or associated caches and servers) storing the one or more sets of instructions 1840.

[0271] In the above description, many details are described. However, it will be understood by those of ordinary skill in the art who benefit from the present disclosure that the present disclosure can be practiced without these specific details. Although specific embodiments are described herein, it should be understood that they are presented by way of example and not limitation. The breadth and scope of this application should not be limited to any embodiment described herein, but should only be defined in accordance with the claims and their equivalents presented below and thereafter. In fact, in addition to the embodiments described herein, various other embodiments of the present disclosure and modifications to the present disclosure can also be seen from the foregoing description and drawings for those of ordinary skill in the art. Therefore, such other embodiments and modifications are intended to fall within the scope of the present disclosure.

[0272] Reference is made to the accompanying drawings, which form part of this description, in which specific embodiments are shown in an illustrative manner. Although the disclosed embodiments are described in sufficient detail to enable those skilled in the art to practice them, it should be understood that these embodiments are not restrictive, and other embodiments may be used, and changes may be made to the disclosed embodiments without departing from the spirit and scope of the disclosed embodiments. For example, the individual blocks of the method shown and described herein are not necessarily executed in the order indicated in some other embodiments. In addition, in some other embodiments, the disclosed method may include more or fewer blocks than the described blocks. As another example, some blocks described herein as separate blocks may be combined in some other embodiments. On the contrary, what may be described herein as a single block may be implemented in multiple blocks in some other embodiments. In addition, unless otherwise indicated, where appropriate, the conjunction "or" is intended to have an inclusive meaning herein; that is, the statement "A, B or C" is intended to include the possibility of "A", "B", "C", "A and B", "B and C", "A and C" and "A, B and C".

[0273] The words "example" or "exemplary" are used herein to refer to serving as an example, instance, or illustration. Any aspect or design described herein as an "example" or "exemplary" is not necessarily to be construed as being preferred or advantageous over other aspects or designs. Rather, the use of the words "example" or "exemplary" is intended to present concepts in a concrete manner. When the term "about" or "approximately" is used herein, the term is intended to mean that the accuracy of the nominal value presented is within ±10%.

[0274] In addition, the articles "a / an" used herein and in the appended claims should generally be interpreted as meaning "one or more," unless otherwise specified or the context clearly indicates a singular form. References throughout this specification to "a / one embodiment," "some embodiments," or "certain embodiments" indicate that a particular feature, structure, or characteristic described in conjunction with the embodiments is included in at least one embodiment. Therefore, the phrases "a / one embodiment," "some embodiments," or "certain embodiments" appearing in various places throughout this specification do not necessarily all refer to the same embodiment.

[0275] Some portions of the detailed description may be presented in the form of algorithms and symbolic representations of operations performed on data bits within a computer memory. These algorithmic descriptions and representations are the means by which those skilled in the art of data processing most effectively communicate their work to other technicians in the field. In this article, generally speaking, an algorithm is considered to be a self-consistent sequence of steps that leads to a desired result. These steps are steps that require physical manipulation of physical quantities. Typically, although not necessarily, these quantities take the form of electrical or magnetic signals that can be stored, transmitted, combined, compared or otherwise manipulated. It turns out that it is sometimes convenient, mainly for common reasons, to refer to these signals as bits, values, elements, symbols, characters, terms, numbers, or the like.

[0276] It should be remembered, however, that all of these and similar terms are to be associated with the appropriate physical quantities and are merely convenient labels applied to these quantities. Unless specifically stated otherwise, it will be understood from the following discussion that throughout the description, discussions utilizing terms such as "receive," "capture," "transmit," "compute," "generate," "process," "reprocess," "add," "subtract," "multiply," "divide," "optimize," "calibrate," "detect," "execute," "analyze," "determine," "enable," "identify," "modify," "convert," "apply," "result," "store," "compare," or similar terms refer to the actions and processes of a computer system or similar electronic computing device that manipulates and transforms data represented as physical (e.g., electronic) quantities within the computer system's registers and memories into other data similarly represented as physical quantities within the computer system's registers or memories or other such information storage, transmission, or display devices.

[0277] Furthermore, while the present disclosure has been described herein in the context of specific embodiments, in a specific environment, for a specific purpose, one of ordinary skill in the art will recognize that its usefulness is not limited thereto, and that the present disclosure can be advantageously implemented in any number of environments for any number of purposes. Accordingly, the claims set forth below should be interpreted in light of the full breadth and spirit of the present disclosure as described herein, and the full scope of equivalents to which such claims are entitled.

Claims

1. A sensor assembly, comprising: a substrate comprising an outer region, an inner region, and an intermediate region positioned between the outer region and the inner region, the substrate further comprising one or more electrical contact pads positioned at least on the inner region; a housing coupled to the substrate at the intermediate region or the outer region to provide a hermetic seal; as well as A sensor die is coupled to the substrate at the inner region via the electrical contact pads, wherein the sensor die is aligned with the substrate via one or more alignment features, and the one or more alignment features align the sensor die relative to the substrate in at least one of a first plane or a second plane.

2. The sensor assembly of claim 1 , wherein the one or more alignment features align the sensor die relative to the substrate in the first plane, wherein the first plane is perpendicular to an interface between the sensor die and the substrate, wherein the one or more alignment features include a first set of protrusions protruding from the sensor die, wherein the substrate forms a first set of alignment holes, each alignment hole in the first set of alignment holes being configured to receive a corresponding protrusion in the first set of protrusions, and wherein the first set of protrusions and the first set of alignment holes are configured to substantially fix the sensor die relative to the substrate in the first plane in response to the first set of alignment holes receiving the first set of protrusions.

3. The sensor assembly of claim 1 , wherein the one or more alignment features align the sensor die relative to the substrate in the first plane, wherein the first plane is perpendicular to an interface between the sensor die and the substrate, wherein the one or more alignment features include a first set of protrusions protruding from the substrate, wherein the sensor die forms a first set of alignment holes, each alignment hole in the first set of alignment holes is configured to receive a corresponding protrusion in the first set of protrusions, and wherein the first set of protrusions and the first set of alignment holes are configured to substantially fix the sensor die relative to the substrate in the first plane in response to the first set of alignment holes receiving the first set of protrusions. 4 . The sensor assembly of claim 1 , wherein the one or more alignment features cause the sensor die to be positioned at a target location on the substrate such that the sensor die is centered in a gas channel during use of the sensor assembly.

5. The sensor assembly of claim 1 , wherein the one or more alignment features align the sensor die relative to the substrate within the second plane, wherein the one or more alignment features include a plurality of solder joints, wherein each of the plurality of solder joints has a controlled thickness that is substantially the same as the controlled thickness of the remaining solder joints in the plurality of solder joints, and wherein the second plane is parallel to an interface of the sensor die and the substrate.

6. The sensor assembly of claim 5, wherein the plurality of solder joints comprises: a first solder joint coupling a first electrode of the sensor die to a first electrical contact pad of the one or more electrical contact pads; as well as A second solder joint couples the second electrode of the sensor die to a second electrical contact pad of the one or more electrical contact pads.

7. The sensor assembly of claim 6, wherein: the first electrode being substantially aligned with a first through-hole formed in the substrate, and wherein the first solder joint includes a first amount of solder that at least partially fills the first through-hole to join the sensor die to the substrate; as well as The second electrode is substantially aligned with a second via formed in the substrate, and wherein the second solder joint includes the first amount of solder that at least partially fills the second via to join the sensor die to the substrate.

8. The sensor assembly according to claim 7, further comprising: A lamination layer is disposed on the first amount of solder and on at least a portion of a surface of the substrate adjacent to the first through-hole and the second through-hole.

9. The sensor assembly of claim 1 , wherein a first electrical contact pad of the one or more electrical contact pads is fused to a first electrode of the sensor die to form the one or more alignment features, and wherein one or more of the sensor die or the substrate comprises a material that is substantially transparent to a predetermined radiation wavelength.

10. The sensor assembly of claim 1, further comprising a conformal coating disposed on one or more exterior surfaces of the sensor assembly.

11. The sensor assembly of claim 1 , wherein the one or more alignment features include a first set of alignment features and a second set of alignment features, wherein the first set of alignment features aligns the sensor die relative to the substrate in the first plane, and the second set of alignment features aligns the sensor die relative to the substrate in the second plane, wherein the second plane is perpendicular to the first plane.

12. A gas flow sensor configured to be coupled to a gas flow tube via a flange, the gas flow sensor comprising: a dielectric substrate comprising an outer region, an inner region, and an intermediate region positioned between the outer region and the inner region, the dielectric substrate comprising one or more electrical contact pads formed between layers of the dielectric substrate, wherein the one or more electrical contact pads extend through the dielectric substrate from the outer region to the inner region; a housing coupled to the dielectric substrate at the intermediate region to form a hermetic seal; as well as A sensor die is coupled to the dielectric substrate at the inner region via the electrical contact pads, wherein the sensor die is aligned with the dielectric substrate via one or more alignment features, and the one or more alignment features align the sensor die relative to the dielectric substrate in at least one of a first plane or a second plane.

13. The gas flow sensor of claim 12 , wherein the one or more alignment features align the sensor die relative to the dielectric substrate in the first plane, wherein the first plane is perpendicular to an interface between the sensor die and the dielectric substrate, wherein the one or more alignment features include a first set of protrusions protruding from the sensor die, wherein the dielectric substrate forms a first set of alignment holes, each alignment hole in the first set of alignment holes being configured to receive a corresponding protrusion in the first set of protrusions, and wherein the first set of protrusions and the first set of alignment holes are configured to substantially fix the sensor die relative to the dielectric substrate in the first plane in response to the first set of alignment holes receiving the first set of protrusions.

14. The gas flow sensor of claim 12, wherein the one or more alignment features cause the sensor die to be positioned at a target location on the dielectric substrate such that the sensor die is centered in a gas channel during use of the gas flow sensor.

15. The gas flow sensor of claim 12, wherein the one or more alignment features align the sensor die relative to the dielectric substrate within the second plane, wherein the one or more alignment features include a plurality of solder joints, wherein each of the plurality of solder joints has a controlled thickness that is substantially the same as the controlled thickness of the remaining solder joints in the plurality of solder joints, and wherein the second plane is parallel to an interface of the sensor die and the dielectric substrate.

16. A method of manufacturing a sensor assembly, the method comprising: providing a substrate, the substrate comprising an outer region, an inner region, and an intermediate region positioned between the outer region and the inner region, the substrate further comprising one or more electrical contact pads positioned at least on the inner region; aligning a sensor die with the substrate at the interior region via one or more alignment features, the one or more alignment features aligning the sensor die relative to the substrate in at least one of a first plane or a second plane; coupling the sensor die to the substrate at the interior region; as well as The substrate is coupled to a housing at the intermediate region or the outer region to provide a hermetic seal.

17. The method of claim 16, wherein aligning the sensor die to the substrate via the one or more alignment features comprises: A first set of protrusions protruding from the sensor die are inserted into a first set of alignment holes formed by the substrate, wherein the first set of protrusions and the first set of alignment holes are configured to substantially fix the sensor die relative to the substrate in the first plane in response to the first set of alignment holes receiving the first set of protrusions.

18. The method of claim 16, wherein aligning the sensor die to the substrate via the one or more alignment features comprises: placing a first solder bump on a first electrical contact pad of the one or more electrical contact pads; placing a second solder bump on a second electrical contact pad of the one or more electrical contact pads; flattening a top surface of each of the first solder bump and the second solder bump by a coining process so that each of the first solder bump and the second solder bump each forms a substantially cylindrical shape; as well as Placing a first electrode of the sensor die on the flattened first solder bump and placing a second electrode of the sensor die on the flattened second solder bump to bond the sensor die to the substrate via the first solder bump and the second solder bump.

19. The method according to claim 16, further comprising: placing the sensor die in a fixture, wherein the first electrode of the sensor die and the second electrode of the sensor die are exposed in response to the sensor die being placed in the fixture; aligning a first through hole formed by the substrate and a second through hole formed by the substrate with the first electrode and the second electrode, respectively; placing the substrate adjacent to the sensor die; as well as Each of the first and second vias is filled with a first amount of solder to at least partially fill the first and second vias to bond the sensor die to the substrate.

20. The method of claim 16, further comprising: directing radiation from a welder through at least one of the sensor die or the substrate and onto a first metal contact region of a first electrode of the sensor die and a first electrical contact pad of the one or more electrical contact pads to fuse the first electrode to the first electrical contact pad of the substrate, wherein the first metal contact region functions as a first alignment feature of the one or more alignment features, and wherein at least one of the sensor die or the substrate comprises a material that is substantially transparent to a wavelength of the radiation; as well as Radiation from the welder is directed through at least one of the sensor die or the substrate and onto a second metal contact area of ​​a second electrode of the sensor die and a second electrical contact pad of the one or more electrical contact pads to fuse the second electrode to the second electrical contact pad of the substrate, wherein the second electrical contact pad and the second electrode function as a second alignment feature of the one or more alignment features.

Images