Radio frequency feedthrough component, coaxial radio frequency feedthrough component and package for radio frequency circuit
By depositing non-ferrous conductors on a ceramic body to form a hermetically sealed RF feedthrough component, the problems of complex manufacturing and high cost of existing glass-metal feedthrough components are solved, and low-cost, high-performance RF signal transmission is achieved.
CN223666606UActive Publication Date: 2025-12-12INTEGRATED MICROWAVE CORP
0 Cites 0 Cited by
Patent Information
- Application Number
- CN202423089655.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-01-31
- Filing Date
- 2024-12-13
- Publication Date
- 2025-12-12
- Estimated Expiration
- 2034-12-13
AI Technical Summary
Technical Problem
Existing glass-metal feedthrough components are complex and costly to manufacture, and are poor conductors of RF energy, leading to RF signal attenuation and passive intermodulation distortion.
Method used
By combining a ceramic body with non-ferrous conductors and conductive leads, an airtight seal is formed by depositing non-ferrous conductors on the ceramic body. Flexible metal mesh or thick film technology is used to enhance conductivity and flexibility, thereby reducing RF energy loss.
Benefits of technology
It achieves low-cost, high-performance, hermetic RF feedthrough components, reducing RF signal attenuation and passive intermodulation distortion, and improving conductivity and flexibility.
✦ Generated by Eureka AI based on patent content.
Abstract
The utility model relates to a radio frequency feed-through component, a coaxial radio frequency feed-through component and a packaging piece for a radio frequency circuit. A radio frequency (RF) feedthrough component having an impedance greater than 20 ohms is disclosed. The radio frequency feedthrough component includes a ceramic body having a flexible non-ferrous conductor adhered to an outer peripheral surface of the ceramic body and to an inner peripheral surface of a hole passing through the ceramic body. A non-ferrous conductive lead is disposed through the aperture and projects from at least one side of the aperture. A non-ferrous hermetic seal is formed between a portion of the non-ferrous conductive lead disposed in the hole and a non-ferrous conductor adhered to an inner circumferential surface of the hole. The RF feedthrough component may be assembled in the opening of the conductive housing to form an electromagnetic shielding package for the circuit.
Need to check novelty before this filing date? Find Prior Art