Antenna device and automatic test equipment

Abstract

The present invention describes an antenna arrangement comprising: a printed circuit board (PCB) comprising an opening wherein at least two probes are arranged on or in the printed circuit board orthogonally to each other; a cavity between the portion of the PCB bearing the probe and the waveguide backplane, the cavity forming a dual polarized waveguide between the portion of the PCB bearing the probe and the waveguide backplane; wherein an opening in the printed circuit board is arranged in a central region around a central axis of the cavity; wherein the depth of the cavity is an integer multiple of a quarter wavelength lambda / 4 plus a half wavelength. An antenna design for use in a receptacle is provided for OTA testing using automated testing equipment that provides large bandwidth.

Description

Technical Field

[0001] Embodiments according to the present application relate to over-the-air testing of antenna modules, and more particularly to over-the-air (OTA) testing of packaged antenna modules using an antenna device integrated into a socket.

[0002] Embodiments according to the invention relate to antenna devices.

[0003] An embodiment according to the present invention relates to automated testing equipment.

[0004] Embodiments according to the present invention may be used for far-field and radiated near-field over-the-air testing, as well as applications such as 5G, 6G, WiGig, and millimeter-wave radar.

[0005] According to one aspect, embodiments according to the present invention may be applied to provide an optimized concept for OTA testing using automated test equipment. Background Art

[0006] Various antenna arrangements are currently known.

[0007] Using antenna devices in sockets for over-the-air (OTA) test and measurement can cause some problems. In OTA test and measurement applications, the requirements are different from the antenna design for antenna in package (AiP) antenna arrays. Therefore, simply copying the antenna topology used on AiP antenna arrays such as 5G modules will not bring advantages.

[0008] The important requirements for OTA applications are as follows:

[0009] 1. In OTA applications, the measurement antenna is (usually) a single antenna (not an array). Therefore, the size of the antenna is not important.

[0010] 2. The antenna gain is not important because it is used to radiate the near field and the entire measurement setup is calibrated.

[0011] 3. It is desirable (and in some cases even most important) to have a large bandwidth to cover all frequencies to be tested.

[0012] In view of the above, it would be desirable to create an antenna design for use (or usable) in a socket for OTA testing using automated test equipment that provides a large bandwidth. Summary of the invention

[0013] According to one embodiment of the present invention, an antenna device is created, such as an OTA socket measurement antenna device, such as a broadband antenna device, comprising: a printed circuit board (PCB), including an opening, such as an approximately square hole, wherein at least two (e.g. orthogonal) probes such as pins are arranged orthogonally to each other on or in the printed circuit board, such as to couple with two orthogonal modes of a waveguide; a cavity located between a portion of the PCB carrying the probes (e.g. an aperture cutout or multiple layers of the PCB carrying the probes) and a waveguide backplane, such as a backplane cavity, such as a cavity with a rectangular cross section or a square cross section or a circular cross section; and a waveguide backplane, which can be formed, for example, by a metal substrate, or can be formed, for example, by a multilayer PCB layer. The cavity forms a waveguide (preferably a dual-polarization waveguide), such as a rectangular hollow waveguide or a square hollow waveguide, or a circular hollow waveguide, between the portion of the PCB carrying the probes and the waveguide backplane. The opening in the printed circuit board is arranged in a central area around the central axis of the cavity. The depth of the cavity is: one quarter wavelength (eg, the guided wavelength in a waveguide formed by the cavity) λ / 4, plus an integer multiple of a half wavelength, where the integer may be zero or greater than zero; where the wavelength is set at the center frequency of the device.

[0014] It should be noted that technically reasonable tolerances should be taken into account. For example, an acceptable tolerance for a dimension (eg, relative to the depth of the cavity) may be + / - 1 / 16 of a wavelength, or may be + / - 1 / 8 of a wavelength.

[0015] It should be noted that the embodiments create an ultra-wideband device, so the wavelength will naturally change when moving from the center frequency to the edge of the band. In some cases, the change may exceed the specified 1 / 16 tolerance of the physical length of the backplane.

[0016] This embodiment according to the invention is based on the finding that providing a distance between the probe and the backplate of a quarter wavelength provides a broadband antenna operating frequency range in an antenna arrangement. Furthermore, this embodiment is based on the finding that an antenna structure with good performance can be achieved if the antenna comprises a waveguide transition with a backplate as described above. It has been found that for good or proper operation it is advantageous that the waveguide backplate has a quarter wavelength.

[0017] Therefore, there is no need to change the antenna to cover different frequency bands, minimizing the implementation cost.

[0018] Furthermore, it has been found that the described antenna geometry is well suited for coupling to one or more antennas of a device under test (DUT) in automated test equipment. For example, the cavity between the printed circuit board and the backplane can provide a good match and also facilitates effective coupling to the radiating near field of the DUT antenna. Furthermore, it has been found that the cavity improves the broadband characteristics of the antenna structure.

[0019] According to one embodiment, the probe is arranged in or on the printed circuit board, in a region of the printed circuit board that defines a cavity between the printed circuit board and the waveguide backplane, for example, such that the probe couples with an electromagnetic mode of the cavity. This arrangement of the probe, for example within an aperture cutout, is configured such that the probe excites a primary orthogonal mode of the waveguide. However, the geometry may also allow coupling with other modes of the waveguide, such as an evanescent mode that couples with the radiating near field of the DUT antenna.

[0020] According to one embodiment, the probes form at least one pair of orthogonal probes configured to excite at least two orthogonal modes of the waveguide, such as TE 10 and TE 01 This allows testing of devices that receive or transmit using different polarizations or that use circular polarization.

[0021] According to one embodiment, the probe is connected to at least two microstrip lines formed on or in the printed circuit board in an area of ​​the printed circuit board that does not define a cavity between the printed circuit board and the waveguide backplane, wherein the microstrip lines form a feeding network for the probe, e.g., the probe is connected to the port via a transmission line. This concept allows for a cost-effective implementation, since, for example, both the probe and the feeding can be implemented on a single printed circuit board. A suitable impedance or even an impedance matching function of the feed line can be achieved by a suitable geometrical layout (or design) (or impedance) of the feed line.

[0022] According to one embodiment, the feed network of the probe is connected to the corresponding differential port via a corresponding differential line transition. Differential feeding helps to provide symmetry to the antenna circuit, increase decoupling between orthogonal arms, and broaden the operating bandwidth. For example, the feed network can be connected to a differential line transition, such as using a 100 ohm differential interface. This provides versatility in antenna circuit integration with transceiver chain components on the same board.

[0023] According to one embodiment, a feed network of one or more probes having a first orientation and a feed network of one or more probes having a second orientation orthogonal to the first orientation, such as a first probe of an orthogonal pair and a second probe of an orthogonal pair, are arranged on different layers of a printed circuit board, such as on opposite layers, for example with a ground layer therebetween, so that even in the area where different feed networks include intersections visible in a projection on the PCB plane, the ground layer shields the different feed networks. Arranging the feed networks of the probes on opposite layers of the PCB provides ease of routing and high isolation. This makes the PCB process simple because no blind vias / buried vias are required. In addition, the manufacture of multilayer printed circuit boards is now a standard technology and allows cost-effective solutions with good characteristics. In addition, the simultaneous use of multilayer PCBs allows quasi-three-dimensional shaping of the probes using multiple layers.

[0024] According to one embodiment, the antenna device comprises four probes, which are arranged in two orthogonal pairs, which are arranged in or on the printed circuit board in the following area of ​​the printed circuit board: the area defines a cavity between the printed circuit board and the waveguide backplane, for example so that the probes are coupled to the mode of the cavity, and the two orthogonal pairs are configured to excite the main orthogonal mode TE of the waveguide 10 and TE 01 However, the probe can also (optionally) couple to other modes of the waveguide, which may be advantageous in near-field conditions.

[0025] According to one embodiment, four probes are connected to corresponding microstrip lines in or on the printed circuit board in an area of ​​the printed circuit board that does not define a cavity between the printed circuit board and the waveguide backplane, wherein two probes with a first orientation, e.g., two collinear probes, are coupled to a first differential port, e.g., using corresponding microstrip lines and / or using two differential transmission lines, and wherein two probes with a second orientation, two other collinear probes, are coupled to a second differential port, e.g., using corresponding microstrip lines and / or using two other differential transmission lines. Differential feeding helps provide symmetry to the antenna circuit, increases decoupling between orthogonal arms, and broadens the operating bandwidth.

[0026] According to one embodiment, the printed circuit board comprises at least three layers, preferably four layers. Thus, a so-called "thick probe" can be created (e.g., using multiple layers of a printed circuit board, which layers can be connected using through-holes). Thus, for example, a good (e.g., broadband) coupling between the probe and the field within the waveguide can be achieved with little effort. For example, it has been found that thickening the probe along a dimension perpendicular to the PCB broadens the operating bandwidth. Furthermore, using multiple PCB layers helps to improve matching and broadband characteristics.

[0027] According to one embodiment, the printed circuit board is arranged (e.g. attached) on a surface (e.g. top) of a metal substrate and a cavity is formed in the metal substrate, e.g. in an upper part of the metal substrate, wherein e.g. the metal substrate also forms a waveguide backplane. Thus, an antenna device of reduced size is provided. Furthermore, the manufacturing is relatively simple, e.g. milling techniques can be used.

[0028] According to one embodiment, the printed circuit board is, for example, a thick multilayer printed circuit board, for example including more than 4 layers; for example including 8 layers or more; and the waveguide backplane is implemented using a layer of the printed circuit board (for example a metal layer) as a PCB layer; and / or the boundary of the cavity, for example a side wall boundary, is implemented using a through hole through the multilayer printed circuit board, for example using a plated through hole, which can, for example, extend through multiple layers of the PCB. Through holes can be provided within the aperture cutout to increase the antenna bandwidth. This approach allows the antenna structure to be manufactured economically and efficiently using PCB manufacturing technology. Although the characteristics of the cavity (for example the characteristics of the cavity wall) are not optimal using this approach, it has been found that the characteristics of this structure are still good enough for many test requirements.

[0029] According to one embodiment, the width of the cavity is half a wavelength λ / 2. It has been found that such dimensions lead to good characteristics of the antenna structure.

[0030] According to one embodiment, the length of the probe is equal to the depth of the cavity, within a tolerance of 1 / 16 of the wavelength. It has been recognized that such dimensions provide particularly good antenna characteristics.

[0031] According to one embodiment, the probe passes through several layers of the PCB connected by one or more probe vias. It has been recognized that this improves the broadband performance of the antenna structure while being achievable at a reasonable cost.

[0032] According to one embodiment, the antenna device further comprises an upper metal plate, wherein an additional waveguide portion is formed in the upper metal plate such that the additional waveguide portion is an extension of the waveguide formed by the cavity. The additional waveguide portion increases the antenna bandwidth.

[0033] According to one embodiment, the printed circuit board is arranged between the metal substrate and the upper metal plate. Thus, a two-part waveguide is provided. Furthermore, using this layout (or design) the feeding structure can be easily manufactured, for example by milling parts in the metal substrate or the upper metal plate, for example along the feeding traces on the printed circuit board.

[0034] According to one embodiment, the differential transmission line includes shielding thereon, providing improved isolation. For example, a metal substrate and / or an upper metal plate may be used to provide such shielding.

[0035] According to one embodiment, the antenna device includes one or more external connections, such as blind-mate waveguide connections, wherein a first external connection (e.g., a first waveguide connection) is coupled to one or more probes having a first orientation, and / or wherein a second external connection (e.g., a second waveguide connection) is coupled to one or more probes having a second orientation (which may be orthogonal to the first orientation). An improved wiring and isolation is then provided. Using such connections, the antenna device can, for example, be coupled to one or more signal sources and / or one or more signal receivers of automated test equipment. Thus, the antenna device can, for example, be coupled to a test head of automated test equipment using one or more external connectors.

[0036] According to one embodiment, one or more external connections are waveguide connections. It has been recognized that waveguide connections include particularly little wear and are therefore well suited for high volume testing, where antenna arrangements are frequently connected and disconnected from automated test equipment.

[0037] According to one embodiment, one or more external connections are blind-mate connections, such as blind-mate waveguide connections. For example, a blind-mate waveguide connection can be used to connect a measurement antenna millimeter wave signal to a measurement instrument of an automated test equipment. The blind-mate capability of the external connector allows for fast connection and disconnection, such as controlled by a robotic processor. Thus, high test throughput is achieved.

[0038] According to one embodiment, one or more external connections are aligned in a certain direction, for example, to make contact in the same direction as the main radiation direction of the antenna device. Thus, the antenna device can be placed on the "top" of the device under test, for example, it can be placed in a test socket arranged on the DUT board, and route the signal back in the direction towards the DUT board (for example, in the direction towards the opening in the DUT port where the high-frequency connection is located).

[0039] According to one embodiment, the antenna device comprises an electromagnetically permeable (e.g., electromagnetically transparent) cover covering the waveguide. Thus, the waveguide can be protected, and the cover can also be used to push the device under test into its desired position (e.g., into a test socket).

[0040] According to one embodiment, the cover is configured to push the device under test into a device under test position, for example into a test socket, while allowing electromagnetic radiation to be transmitted from the waveguide to the device under test and vice versa. Thus, the antenna device can (at least partially) take over the function of the push rod, which helps to reduce costs and speed up the replacement of the device under test.

[0041] According to one embodiment of the present invention, an automated test equipment (ATE) is created, which comprises an antenna device according to one of the preceding claims, wherein the automated test equipment is configured to test a device under test, such as a wireless device under test; such as a packaged antenna device under test, using the antenna device.

[0042] The automated test equipment according to this embodiment is based on the same considerations as the antenna device described above.In addition, the embodiments of the present disclosure may optionally be supplemented by any other features, functions and details disclosed herein in conjunction with the antenna device (whether used alone or in combination).

[0043] According to one embodiment of the present invention, an automated test device is created, wherein the automated test device comprises a device under test socket and one or more, for example, blind-mate high-frequency connectors, such as waveguide connectors, for example for establishing a high-frequency connection with an antenna device, wherein one or more high-frequency connectors are arranged next to the test socket.

[0044] The automated test equipment according to this embodiment is based on the same considerations as the antenna device described above.In addition, the embodiments of the present disclosure may optionally be supplemented by any other features, functions and details disclosed herein in conjunction with the antenna device (whether used alone or in combination).

[0045] According to one embodiment, the test socket and one or more high-frequency connectors are arranged so that one or more external connections of the antenna device mate with the one or more high-frequency connectors, and so that when the one or more external connections of the antenna device mate with the one or more high-frequency connectors, the cover of the antenna device pushes the device under test into the device under test socket.

[0046] The antenna device and the automated test equipment may optionally be supplemented by any of the features, functions and details disclosed herein (throughout the document), whether used alone or in combination. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The preferred embodiments of the present application are described below with reference to the accompanying drawings, in which:

[0048] Figure 1 An antenna device according to an embodiment is shown;

[0049] Figure 2a shows an antenna device according to an embodiment in a disassembled state;

[0050] Figure 2b The assembled state of the device according to the embodiment is shown. Figure 2a Antenna device;

[0051] Figure 2c The assembled state of the device according to the embodiment is shown. Figure 2aA cross-sectional view of an antenna device;

[0052] Figure 3a shows an antenna device according to an embodiment in an assembled state;

[0053] Figure 3b The assembled state of the device according to the embodiment is shown without the top metal plate. Figure 3a Antenna device;

[0054] Figure 3c Schematically shows a Figure 2a Antenna device;

[0055] Figure 4a An antenna device according to an embodiment is shown;

[0056] Figure 4b It shows that according to the embodiment Figure 4a A rear view of the antenna device;

[0057] Figure 4c It shows that according to the embodiment Figure 4a An enlarged cross-sectional view of an antenna device;

[0058] Figure 4d Schematically shows a Figure 4a An enlarged cross-sectional view of an antenna device;

[0059] Figure 5a An antenna device according to an embodiment is shown;

[0060] Figure 5b The embodiment shown is located in the housing Figure 5a Antenna device;

[0061] Figure 5c The disassembled state according to the embodiment is shown. Figure 5b Antenna device;

[0062] Figure 5d shows an example of an embodiment in operation Figure 5a Antenna device;

[0063] Figure 6a shows antenna simulation results of the antenna device according to the embodiment;

[0064] Figure 6b shows antenna simulation results of the antenna device according to the embodiment;

[0065] Figure 7a An automated testing device according to an embodiment is shown;

[0066] Figure 7bAn automated testing device according to an embodiment is shown. DETAILED DESCRIPTION

[0067] Figure 1 The antenna device 100 according to the embodiment is shown. The antenna device 100 includes a printed circuit board (PCB) 110, and the printed circuit board 110 includes an opening 111 and at least two probes 112 arranged orthogonally to each other in the printed circuit board. The opening 111 is, for example, a nearly square hole. Figure 1 Two orthogonal probes 112 are shown, but in this embodiment, four probes forming two orthogonal pairs may be arranged in the printed circuit board 110 .

[0068] The antenna device 100 comprises a backshort 120 , which may be formed, for example, from a metal substrate, or may be formed, for example, from a multi-layer PCB layer.

[0069] The antenna device 100 includes a cavity 130 located between a portion of the PCB 110 carrying the probe 112 (e.g., an aperture cutout or multiple layers of the PCB 110 carrying the probe 112) and the backplane 120. The cavity 130 can have, for example, a rectangular cross-section or a square cross-section. The cavity 130 forms a waveguide between the portion of the PCB 110 carrying the probe 112 and the backplane 120 (e.g., a waveguide backplane 120). The opening 111 in the printed circuit board 110 is arranged in a central area around the central axis of the cavity 130. The depth of the cavity 130 is: a quarter wavelength (e.g., a guided wavelength in a waveguide formed by the cavity) λ / 4, plus an integer multiple of a half wavelength, where the integer can be equal to zero or greater than zero; where the wavelength is set at the center frequency of the device.

[0070] The probe 112 is disposed on (or in) the printed circuit board 110 in a region 113 of the printed circuit board 110 that defines the cavity 130 , such that the probe 112 is coupled to a mode of the cavity 130 .

[0071] The probes 112 form a pair of orthogonal probes 112 configured to excite at least two orthogonal modes of the waveguide.

[0072] The probe 112 is connected to at least two microstrip lines 114, which are formed on or in the printed circuit board 110 and are located in an area 115 of the printed circuit board 110, which area 115 does not define the cavity 130. The microstrip lines 114 form a feeding network for the probe, which is connected to the port, for example, via a transmission line. In one embodiment, the feeding network of the probe 112 can be connected to the corresponding differential port, for example, via a corresponding differential line conversion.

[0073] A feeding network having one or more probes 1121 with a first orientation and a feeding network having one or more probes 1122 with a second orientation orthogonal to the first orientation are arranged on different (e.g., opposite) layers of the printed circuit board 110, for example with a ground layer in between, so that the ground layer shields different feeding networks.

[0074] However, it should be noted that the antenna device 100 may optionally be supplemented by any of the features, functions and details disclosed herein, whether used alone or in combination.

[0075] Figure 2a to Figure 2c An antenna arrangement 200 according to an embodiment is shown.

[0076] Figure 2a The antenna device 200 is shown in a disassembled state. Figure 2a As shown, the antenna device 200 includes a printed circuit board (PCB) 210, and the printed circuit board 210 includes an opening 211 and four probes 212, and the four probes 212 are arranged in two orthogonal pairs. The opening 211 is an approximately square hole. The opening 211 is a through hole for increasing the bandwidth of the antenna.

[0077] The antenna device 200 includes a back plate 220. The back plate 220 is formed of a metal substrate. The printed circuit board 210 is arranged (e.g. attached) on top of the metal substrate, and a cavity 230 is formed in the upper part of the metal substrate, wherein the metal substrate also forms the waveguide back plate 220. The cavity 230 has a shape substantially corresponding to the opening 211.

[0078] Thus, the antenna device 200 includes a cavity 230 located between the portion of the PCB 210 that carries the probe 212 (i.e., the aperture cutout) and the backplate 220. The cavity 230 is shown as having a square cross-section. However, the cavity 230 may, for example, have a rectangular cross-section, a circular cross-section, or an elliptical cross-section. The cavity 230 forms a waveguide between the portion of the PCB 210 that carries the probe 212 and the waveguide backplate 220. The opening 211 in the printed circuit board 210 is arranged in a central region around the central axis of the cavity 230. The depth of the cavity 230 is: a quarter wavelength (e.g., a guided wavelength in a waveguide formed by the cavity) λ / 4, plus an integer multiple of a half wavelength, where the integer may be equal to zero or greater than zero; where the wavelength is set at the center frequency of the device.

[0079] The probes 212 are arranged as two orthogonal pairs, which are disposed on the printed circuit board 210 in an area 213 of the printed circuit board 210, which defines a cavity 230 between the printed circuit board 210 and the waveguide backplane 220, so that the probes couple with the electromagnetic mode of the cavity, and the two orthogonal pairs are configured to excite the main orthogonal mode TE of the waveguide. 10 and TE 01 .

[0080] Four probes 212 are connected to corresponding microstrip lines 214 on the printed circuit board 210 in an area 215 of the printed circuit board 210 that does not define a cavity 230. Two probes 2121 have a first orientation and represent two collinear probes. The two probes 2121 use corresponding microstrip lines 2141 and are coupled to a first differential port 2171 using a differential line 2161. Two probes 2122 have a second orientation and represent another two collinear probes. The two probes 2122 use corresponding microstrip lines 2142 and are coupled to a second differential port 2172 using another differential line 2162. The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry for the antenna circuit, increases decoupling between orthogonal arms, and broadens the operating bandwidth. For example, the differential transmission line may include a shield thereon.

[0081] The metal substrate 220 includes components configured to accommodate the microstrip line 2142 and the differential line 2162, such as a channel 229 made in an upper portion of the metal substrate 220 corresponding to the microstrip line 2142 and the differential transmission line 2162. The metal substrate 220 also includes a cutout, such as an open cutout, corresponding to the second differential port 2172.

[0082] A feeding network of two probes 2121 having a first orientation and a feeding network of two probes 2122 having a second orientation orthogonal to the first orientation are arranged on opposite layers of the printed circuit board 210, for example with a ground layer therebetween, so that the ground layer shields different feeding networks. Arranging the feeding networks on opposite layers of the PCB 210 provides convenience of wiring and high isolation. This makes the PCB process simple because no blind or buried vias are required. The feeding network is connected to the differential line 216 via a 100 ohm differential interface. This provides versatility of antenna circuit integration for transceiver chain components on the same board.

[0083] The width of cavity 230 is half a wavelength λ / 2. The electrical length of probe 212 is preferably (at least approximately) equal to the depth of the cavity, for example within a tolerance of 1 / 16 of the wavelength. For example, the length of the probe may depend on the specific dielectric of the PCB. For example, if an aluminum oxide substrate is used, the probe is shorter (e.g., shorter than the depth of the cavity). However, for example, for different materials, the electrical length (i.e., wavelength) can be considered to be approximately the same.

[0084] The antenna device 200 further comprises an upper metal plate 240 , wherein an additional waveguide portion 250 is formed in the upper metal plate 240 , such that the additional waveguide portion 250 is an extension of the waveguide formed by the cavity 230 .

[0085] The upper metal plate may include channels corresponding to the microstrip line 2141 and the differential line 2161, for example, made in the bottom of the upper metal plate 240. The upper metal plate 240 may also include a cutout, for example an open cutout, for example Figure 2b The cutout 241 shown corresponds to the first differential port 2171 .

[0086] The printed circuit board 210 is disposed between the metal base plate 220 and the upper metal plate 240. As shown in the following figure, the printed circuit board 210 is pressed between the metal base plate 220 and the upper metal plate 240.

[0087] The antenna arrangement may include, for example, one or more external connections, such as blind-mate waveguide connections, wherein a first external connection (e.g., a first waveguide connection) is coupled to one or more probes having a first orientation, and / or wherein a second external connection (e.g., a second waveguide connection) is coupled to one or more probes having a second orientation (which may be orthogonal to the first orientation).

[0088] The one or more external connections may be, for example, waveguide connections.

[0089] The one or more external connections may be, for example, a blind-mate connection, such as a blind-mate waveguide connection.

[0090] One or more external connections may, for example, be aligned towards a certain direction, such as making contacts in the same direction as a main radiation direction of the antenna arrangement 200 .

[0091] Figure 2b The assembled state of the device according to the embodiment is shown. Figure 2a Antenna device. Figure 2b As shown, the PCB 210 is disposed between the metal base plate 220 and the upper metal plate 240. The PCB 210 is pressed between the metal base plate 220 and the upper metal plate 240.

[0092] Cavity 230 and the corresponding waveguide in Figure 2b 2, as the cavity 230 is arranged in the top of the waveguide back plate 220 and is enclosed by the PCB 210 and the top plate 240. The additional waveguide portion 250 is shown to be formed in the upper metal plate 240.

[0093] The cutouts 241 are formed at the bottom of the upper metal plate 240, one cutout at each of the two adjustment sides of the upper metal plate 240. The cutouts 241 are arranged above the corresponding microstrip lines 2141 arranged on the upper portion of the printed circuit board 210 in the area 215 of the printed circuit board 210 that does not define the cavity 230. The cutouts are generally rectangular.

[0094] Figure 2cA cross-sectional view of an antenna device 200 according to an embodiment is shown in an assembled state.

[0095] like Figure 2c As shown, PCB 210 includes multiple layers. PCB 210 may include at least three layers, for example, preferably four layers. Probe 212 utilizes (eg, extends through or passes through) several PCB layers connected by probe vias 218.

[0096] Cavity 230 Figure 2c As shown, the additional cutout 221 is arranged in the top of the waveguide backplane 220 between the waveguide backplane 220 and the PCB 210. The additional cutout 221 is arranged in the upper part of the waveguide backplane 220. For example, the depth of the additional cutout 221 can be at least twice (or 2 times) smaller than the depth of the cavity 230. However, it should be noted that there is no strict requirement for the cutout depth. For example, it is preferably (but not necessarily) not too small so as not to affect the transmission line impedance. The additional cutout 221 is formed to accommodate the corresponding microstrip line 2142 and the other two differential transmission lines 2162, which couple the probe 2122 to the second differential port 2172.

[0097] For example, the cavity 230 may have a square cross-section. The cavity 230 forms a waveguide between the portion of the PCB 210 carrying the probe 212 and the waveguide backplane 220. The opening 211 in the printed circuit board 210 is arranged in a central region around the central axis of the cavity 230. The depth of the cavity 230 is: a quarter wavelength (e.g., a guided wavelength in the waveguide formed by the cavity) λ / 4, plus an integer multiple of a half wavelength, where the integer may be equal to zero or greater than zero; where the wavelength is set at the center frequency of the device.

[0098] However, it should be noted that the antenna device 200 may optionally be supplemented by any of the features, functions and details disclosed herein, whether used alone or in combination.

[0099] Figure 3a to Figure 3c An antenna arrangement 300 according to an embodiment is shown.

[0100] Figure 3a The antenna device 300 is shown in an assembled state. Figure 3a As shown, the antenna device 300 includes a printed circuit board (PCB) 310, and the printed circuit board 310 includes an opening 311 and four probes 312, and the four probes 312 are arranged in two orthogonal pairs. The opening 311 is shown as an approximately square hole. However, the opening 311 can also have, for example, an approximately rectangular hole, an approximately elliptical hole, or an approximately circular hole. The corners of the square are shown as circles. The opening 311 is a through hole for increasing the bandwidth of the antenna.

[0101] The antenna device 300 includes a back plate 320. The back plate 320 is formed of a metal substrate. The printed circuit board 310, which may correspond to the printed circuit board 210, is arranged (e.g., attached) on top of the metal substrate, and a cavity (not shown) is formed in the upper part of the metal substrate, wherein the metal substrate also forms the waveguide back plate 320.

[0102] The antenna device 300 further comprises an upper metal plate 340, wherein an additional waveguide portion 350 is formed in the upper metal plate 340 such that the additional waveguide portion 350 is an extension of a waveguide formed by a cavity (not shown).

[0103] The printed circuit board 310 is arranged (eg, pressed) between the metal base plate 320 and the upper metal plate 340 .

[0104] The four probes 312 are connected to corresponding microstrip lines on the printed circuit board 310 (not visible under the upper metal plate 340) in an area 315 of the printed circuit board 310 that does not define a cavity. The two probes 3121 have a first orientation and are shown as two co-linear probes. The two probes 3121 are coupled to a first port (e.g., in the form of a coaxial connector 3601) using a microstrip line 3171 (which may extend partially under the upper metal plate 340), using a differential line 3161 (not visible under the upper metal plate 340), and using another microstrip line 3141, wherein the microstrip line 3171 is connected to the first port (e.g., in the form of a coaxial connector 3601). l There may be a balanced-unbalanced converter 319 ( Figure 3a ). The two probes 3122 have a second orientation and represent two additional co-linear probes. The two probes 3122 are coupled to a second port (e.g., in the form of a coaxial connector 3602) using a microstrip line, using (e.g., two) differential lines (not shown), and using corresponding microstrip lines (not shown), wherein there may be a balanced-unbalanced transformer (not shown) between the microstrip line and the differential line. The first orientation is orthogonal to the second orientation. The differential feed provides symmetry to the antenna circuit, increases decoupling between the orthogonal arms, and broadens the operating bandwidth. For example, the differential transmission line may include a shield thereon.

[0105] PCB 310 is shown extending beyond the dimensions of metal base plate 320 and upper metal plate 340. The dimensions of metal plate 320 and PCB 310 may vary, and the ratio between them may be arbitrary. This depends on the mechanics, not the operation of the device.

[0106] Two coaxial connectors 360 are mounted on the PCB 310. The first coaxial connector 3601 is arranged to connect the first microstrip line 3171 to a measuring instrument. The second coaxial connector 3602 is arranged to connect the second microstrip line (not shown) to a measuring instrument.

[0107] Figure 3b The antenna device 300 is shown in an assembled state without the top metal plate 340. Figure 3b As shown, a printed circuit board (PCB) 310 includes an opening 311 and four probes 312 arranged in two orthogonal pairs.

[0108] Four probes 312 are connected to corresponding microstrip lines 314 on the printed circuit board 310 in an area 315 of the printed circuit board 310 that does not define a cavity 330. Two probes 3121 have a first orientation and represent two collinear probes. The two probes 3121 use corresponding microstrip lines 3141 and are coupled to a first differential port 3181 using a differential line 3161. Two probes 3122 have a second orientation and represent another two collinear probes. The two probes 3122 use corresponding microstrip lines (not shown) and are coupled to a second differential port (not visible) using another differential line (not shown). The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry for the antenna circuit, increases decoupling between orthogonal arms, and broadens the operating bandwidth. For example, the differential transmission line may include a shield thereon.

[0109] The first differential port 3181 is connected to the microstrip line 3171 via the balun 319. The microstrip line 3171 is connected to the first coaxial connector 3601, thereby connecting the first differential port 3181 to a corresponding measuring instrument.

[0110] The second coaxial connector 3602 is arranged inverted relative to the first coaxial connector 3601 so as to connect the second differential port located on the bottom side of the PCB 310 to a corresponding measuring instrument.

[0111] The first and second coaxial connectors 360 are attached (eg, fixed) to the adjustment side of the PCB 310 by screws 362. The first and second coaxial connectors 360 are attached inverted to each other, such as placed in planes rotated 180 degrees from each other.

[0112] A plurality of plated through holes 390 form sidewalls of the back plate 320 , and correspondingly form sidewalls of the cavity 330 .

[0113] Cavity sidewalls or waveguide sidewalls, eg sidewall boundaries, of the cavity 330 are realized using through-holes 390 through the multi-layer printed circuit board 310 , such as plated through-holes, which may, for example, extend through multiple layers of the PCB 310 .

[0114] A plurality of through holes (eg, plated through holes) 391 form shielding for corresponding microstrip lines, such as wiring.

[0115] Figure 3c An antenna arrangement 300 is schematically shown. Figure 3cOnly the PCB 310 (top view) and the coaxial connector 360 of the antenna device 300 are shown.

[0116] like Figure 3c As shown, the antenna device 300 includes a printed circuit board (PCB) 310 including an opening 311 and four probes 312 arranged in two orthogonal pairs.

[0117] The probes 312 are arranged in two orthogonal pairs in a region 313 of the printed circuit board 310 which defines a cavity 330 between the printed circuit board 310 and the waveguide backplane 320, whereby the probes couple with the electromagnetic mode of the cavity.

[0118] Four probes 312 are connected to corresponding microstrip lines 314 on the printed circuit board 310 in an area 315 of the printed circuit board 310 that does not define the cavity 330. Two probes 3121 use corresponding microstrip lines 3141 and are coupled to the first differential port 3181 using differential lines 3161. The two probes 3122 have a second orientation and represent two additional co-linear probes.

[0119] It should be noted that the differential line portion 316 (e.g., comprising a differential line 3161 having two conductors, wherein a first conductor of the two conductors is coupled to a first microstrip line 3141, and wherein a second conductor of the two conductors is coupled to a second microstrip line 3142) is defined by (e.g., between) a balun 319 and a junction of a pair of microstrip feed lines 3141.

[0120] The feed network of two probes 3121 having a first orientation and the feed network of two probes 3122 having a second orientation orthogonal to the first orientation are arranged on opposite layers of the printed circuit board 310, for example with a ground layer therebetween, so that the ground layer shields the different feed networks. Arranging the feed networks on opposite layers of the PCB 310 provides convenience of wiring and high isolation. This makes the PCB process simple because no blind or buried vias are required.

[0121] A plurality of plated through holes 390 form sidewalls of the back plate 320 , and correspondingly form sidewalls of the cavity 330 .

[0122] The boundaries of the cavity 330 , such as the sidewall boundaries, are realized using through-holes 390 through the multi-layer printed circuit board 310 , such as plated through-holes, which may, for example, extend through multiple layers of the PCB 310 .

[0123] A plurality of through holes (eg, plated through holes) 391 form shielding for the corresponding microstrip lines.

[0124] However, it should be noted that the antenna device 300 may optionally be supplemented by any features, functions and details disclosed herein, whether used alone or in combination.

[0125] Figures 4a to 4d An antenna arrangement 400 according to an embodiment is shown.

[0126] like Figure 4a As shown, the antenna device 400 includes a printed circuit board (PCB) 410, and the printed circuit board 410 includes an opening 411 and four probes 412, and the four probes 412 are arranged in two orthogonal pairs. The opening 411 is an approximately square hole. The opening 411 is a through hole for increasing the bandwidth of the antenna.

[0127] The antenna device 400 includes a back plate 420 ( Figure 4a not shown).

[0128] The printed circuit board 410 is, for example, a thick multilayer printed circuit board. The PCB 410 includes more than 4 layers, or preferably includes 8 layers or more. The waveguide backplane 420 is implemented using a layer (for example, a metal layer) of the printed circuit board as a PCB layer. The bottom PCB layer is used as the metal backplane 420.

[0129] The thickness of PCB 410 is defined as

[0130]

[0131] where ε r is the dielectric constant of the PCB substrate (dielectric) material.

[0132] Thus, the antenna device 400 includes a cavity 430 located between the portion of the PCB 410 that carries the probe 412 (i.e., the aperture cutout) and the backplate 420. For example, the cavity 430 may have a square cross-section. The cavity 430 forms a waveguide between the portion of the PCB 410 that carries the probe 412 and the waveguide backplate 420. The opening 411 in the printed circuit board 410 is arranged in a central region around the central axis of the cavity 430. The depth of the cavity 430 is: a quarter wavelength in the PCB substrate material (e.g., the guided wavelength in the waveguide formed by the cavity) λ / 4, divided by √ε r Add an integer multiple of half a wavelength, where the integer may be equal to zero or greater than zero; where the wavelength is set at the center frequency of the device.

[0133] The boundaries of the cavity 430 , such as the sidewall boundaries, are realized using through-holes 490 through the multi-layer printed circuit board 410 , such as plated through-holes, which may, for example, extend through multiple layers of the PCB 410 .

[0134] like Figures 4a to 4dAs can be further seen in FIG. 4 , a plurality of plated through holes 490 form side walls of the back plate 420 and, correspondingly, side walls of the cavity 430 .

[0135] The boundaries of the cavity 430 , such as the sidewall boundaries, are realized using through-holes 490 through the multi-layer printed circuit board 410 , such as plated through-holes, which may, for example, extend through multiple layers of the PCB 410 .

[0136] like Figure 4a , Figure 4c and Figure 4d As can be seen in FIG. 4 , a plurality of through holes (eg, plated through holes) 491 form shielding for the corresponding microstrip lines.

[0137] like Figure 4a , Figure 4c and Figure 4d As shown, the probes 412 are arranged as two orthogonal pairs, which are arranged on the printed circuit board 410 in an area 413 of the printed circuit board 410, which defines a cavity 430 between the printed circuit board 410 and the waveguide backplane 420, so that the probes are coupled to the mode of the cavity, and the two orthogonal pairs are configured to excite the main orthogonal mode TE of the waveguide 10 and TE 01 .

[0138] Four probes 412 are connected to corresponding microstrip lines 414 on the printed circuit board 410 in an area 415 of the printed circuit board 410 that does not define the cavity 430. Two probes 4121 have a first orientation and represent two collinear probes. The two probes 4121 use corresponding microstrip lines 4141 and are coupled to a first differential port 4181 using a differential line 4161. Two probes 4122 have a second orientation and represent another two collinear probes. The two probes 4122 use corresponding microstrip lines (not shown) and are coupled to a second differential port (not shown) using another differential line (not shown). The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry for the antenna circuit, increases decoupling between orthogonal arms, and broadens the operating bandwidth. For example, the differential transmission line may include a shield thereon.

[0139] like Figure 4cAs shown, probe 412 utilizes (e.g., extends through or passes through) several PCB layers of a thick PCB connected by probe vias 419. Probe 412 connects the upper layers of the PCB layers. Probe 412 utilizes, for example, at least three PCB layers, for example, at least three upper PCB layers are connected by probe vias 419. For example, not all PCB layers are utilized by probe 412. In some implementations, for example, probe 412 may utilize less than half of the PCB layers. However, it should be noted that the desired (or required) number of layers in the probe depends, for example, on the required antenna bandwidth. The probe utilizes at least one or two metal layers. The probe does not necessarily utilize the top side layers - they (e.g., the layers utilized) may also be hidden in the inner layers.

[0140] from Figure 4d It can also be seen in FIG. 4 that the probe 412 is formed as a multi-layer probe.

[0141] However, it should be noted that the antenna device 400 may optionally be supplemented by any of the features, functions and details disclosed herein, whether used alone or in combination.

[0142] Figure 5a to Figure 5d An antenna arrangement 500 and / or components thereof according to an embodiment is shown.

[0143] Figure 5a A printed circuit board (PCB) 510 is shown, and the printed circuit board 510 includes an opening 511 and four probes 512, and the four probes 512 are arranged in two orthogonal pairs. The opening 511 is an approximately square hole. The opening 511 is a through hole for increasing the bandwidth of the antenna. Although the opening 511 is shown as an approximately square hole, the opening 511 may also be, for example, an approximately rectangular hole, an approximately circular hole, or an approximately elliptical hole, or the opening may include a key shape or an X shape. However, holes of other shapes may also be used.

[0144] Four probes 512 are connected to corresponding microstrip lines 514 on the printed circuit board 510 in an area 515 of the printed circuit board 510 that does not define a cavity 530. Two probes 5121 have a first orientation and represent two co-linear probes. The two probes 5121 use corresponding microstrip lines 5141 and are coupled to a first (e.g., differential) waveguide transition 5941 using differential lines 5161. Two probes 5122 have a second orientation and represent another two co-linear probes. The two probes 5122 use corresponding microstrip lines (not shown) and are coupled to a second (e.g., differential) waveguide transition (not visible) using another differential line (not shown). The first orientation is orthogonal to the second orientation. Differential feeding provides symmetry for the antenna circuit, increases decoupling between orthogonal arms, and broadens the operating bandwidth. For example, the differential transition line may include a shield thereon.

[0145] Figure 5bThe antenna device 500 is shown in an assembled state, for example in a metal housing 560 , for example in a ready-to-use state.

[0146] The backplane of the antenna 500 is formed, for example, by a metal substrate (for example, by the plate 570 or by the plate 580) or by a layer (for example, the bottom layer) of a printed circuit board. The printed circuit board 510 is arranged (for example, attached) on top of the metal substrate 570, and a cavity (not shown) is formed, for example, in the upper part of the metal substrate 570, wherein, for example, the metal substrate 570 also forms the waveguide backplane 520.

[0147] The various parts of the metal casing such as Figure 5c The upper layer 568 of the metal base plate is shown to include mounting holes 528 for screws configured to secure the components of the metal housing together.

[0148] The additional waveguide portion is formed in the upper metal plate 568 such that the additional waveguide portion is an extension of the waveguide formed by the cavity (not shown).

[0149] In the assembled state of the antenna 500 , the printed circuit board 510 is arranged (eg, pressed) between the upper metal plate 568 and the middle metal plate 570 .

[0150] In addition to the upper metal plate 568, the metal housing further includes two metal layers 570 (e.g., designated as the middle metal layer) and 580 (e.g., designated as the lower metal layer), both of which have (respectively) central parts 571, 581 and two pairs of (respectively) peripheral parts 572, 573, 582, 583. For example, the central parts 571, 581 of the two metal layers 570, 580 respectively have shapes that are similar to the shapes of the PCB 510 (e.g., approximately rectangular or square) and the upper metal plate 568. For example, the first peripheral parts 572, 582 of the two metal layers 570, 580 respectively extend from two opposite sides of the central parts 571, 581 at a certain angle and form metal plates. For example, the second peripheral parts 573, 583 of the two metal layers 570, 580 respectively extend from the first peripheral parts 572, 582 at a certain angle and form metal plates. The second peripheral parts 573, 583 are, for example, arranged parallel to the central parts 571, 581, for example, the sides of the second peripheral parts 573, 583 are parallel to the corresponding sides of the central parts 571, 581. One metal layer 570 includes mounting holes 574 for mounting the upper metal plate 568 to the intermediate metal plate 570 and the lower metal layer 580. For example, the metal layer may also include alignment means, such as alignment pins or alignment holes. The other (lower) metal layer 580 includes two waveguide structures 575, 576 for the first and second polarizations. For example, the metal layers 570, 580 both include mounting holes 578, 588 for fixing the antenna 500 in the metal housing, and mounting holes for attaching the antenna 500 in the metal housing 560 to a corresponding test bench or test equipment.

[0151] Figure 5d The antenna device 500 is shown in an assembled state, for example in a metal housing 560, and attached to a test bench 580a. The test bench has an upper portion 583a and a lower portion 584a. The lower portion 584a stands on a stable base 585a and is attached to the stable base 585 by screws 586a. The components of the metal housing 560 are fixed to the test bench 580a, for example, by metal fixtures 581a. The metal fixtures 581a generally have an n-shape. The metal fixtures 581a hold the second peripheral components 573, 583 (or the entire antenna device 500) in a hollow cutout 582a of the test bench 580a. The hollow cutout 582a has a shape corresponding to the metal housing 560. The metal fixtures 581a are attached to the upper portion 583a of the test bench 580a by screws 587a, for example, each metal fixture 581a is attached by four screws 587a.

[0152] The first and second coaxial connectors 590a, 591a are attached to waveguide transitions 592a, 593a, which establish electromagnetic coupling with the waveguide structures 575, 576. Therefore, the coaxial connectors are effectively coupled to the antenna through the waveguide transitions 592a, 593a, the waveguide structures 575, 576, and the transmission line traces (e.g., the waveguide coupling structure 5941, the differential line 5161, and the microstrip line 5141) on the printed circuit board 510. Therefore, the first coaxial connector 590a is associated with the first polarization, and the second coaxial connector 591a is associated with the second polarization.

[0153] However, it should be noted that the antenna device 500 may optionally be supplemented by any of the features, functions and details disclosed herein, whether used alone or in combination.

[0154] Figure 6a and Figure 6b 1 shows the antenna simulation results of the antenna device according to the embodiment. Figure 1 2, 3, 4 and 5, any one of the antenna devices 100, 200, 300, 400 and 500 shown in FIG. Figure 6a and Figure 6b Results similar to the performance shown in .

[0155] Figure 6a The antenna 3D radiation pattern is shown, as well as the antenna radiation patterns in plane E (electric field plane) and plane H (magnetic field plane) at frequencies F1 = 24.25 GHz, F2 = 29.5 GHz, F3 = 37 GHz, F4 = 40 GHz.

[0156] Figure 6b Graphs showing the frequency dependence of antenna aiming gain and antenna reflection coefficient.

[0157] like Figure 6a and Figure 6b As can be seen in FIG. 1 , the electrical performance of the antenna device according to the embodiment can be characterized as follows:

[0158] 1. The operating frequency band is: 22-43GHz (65%), considering 10dB RL;

[0159] 2. The insertion loss in the antenna circuit ranges from 0.75 to 1.35 dB within the frequency band (based on Megtron6 ​​board);

[0160] 3. The antenna gain range is: between 6 and 9.5dBi within the frequency band;

[0161] 4. Port-to-port leakage is less than -80dB within the frequency band; and

[0162] 5. The cross-polarization component in the far field is identified as: higher than 55dB within the frequency band.

[0163] Meanwhile, the mechanical properties of the antenna device according to the embodiment can be characterized as follows:

[0164] 1. The antenna circuit only occupies 2×2λ0 area in the PCB, where λ0 is calculated at a center frequency of 32.5GHz;

[0165] 2. The antenna PCB utilizes at least 3 layers, where its processing does not require blind or buried vias.

[0166] Figure 7a and Figure 7b An automated test device with an antenna arrangement 700 is shown.

[0167] The automated test equipment includes an antenna device 700. The automated test equipment is configured to use the antenna device 700 to test a device under test 792, such as a wireless device under test; for example, a packaged antenna device under test.

[0168] The automated test equipment carries a device under test 792 in an electrical receptacle and includes a blind-mate connector 793 . Figure 7a Two blind-mate connectors 793 are shown in FIG. However, the automated test equipment may include one or more blind-mate connectors 793. The blind-mate connectors 793 may be, for example, high-frequency connectors, such as waveguide connectors, such as Figure 7a As shown. The blind-mate connector 793 is configured, for example, to establish a high-frequency connection with the antenna device 700. The connector 793 is arranged next to the test socket.

[0169] The antenna device 700 (e.g., OTA measurement antenna) in the metal housing is fixed in the socket cover 790. A push rod 791 is attached to the antenna device 700. The push rod 791 is made of a radio transparent material. The push rod 791 is installed to push the device under test 792 into the electrical socket. In one embodiment, the push rod 791 can also be configured as a cover for the antenna device 700.

[0170] After the socket cover 790 is installed on the automated test equipment, the first and second (preferably blind-mate) waveguide connectors 794 are interconnected with the blind-mate waveguide 793. The blind-mate waveguide 793 connects the measurement antenna millimeter wave signals to the ATE measurement instrument.

[0171] The antenna assembly 700 includes two external connections 794, which are preferably waveguide connections. Figure 7a Two external connections 794 are shown, but antenna device 700 may include one or more external connections 794.

[0172] The test socket 792 and connector 793 are arranged so that the external connection 794 of the antenna device 700 mates with the connector 793, and so that when the connection 794 of the antenna device 700 mates with the connector 793, the push rod 791 of the antenna device 700 pushes the device under test 792 into the device under test socket.

[0173] Figure 7b The antenna device 700 is shown fixed on an automated test equipment.

[0174] However, it should be noted that the automated testing device 700 may optionally be supplemented by any features, functions and details disclosed herein, whether used alone or in combination.

[0175] Further embodiments and aspects

[0176] In the following, further aspects and embodiments according to the present invention will be described, which may be used alone or in combination with any other embodiments disclosed herein.

[0177] In addition, the embodiments disclosed in this section can optionally be supplemented by any of the features, functions, and details disclosed herein, whether alone or in combination.

[0178] In the following, an antenna layout (or design) for integration in a socket, over-the-air (OTA) testing of an antenna-in-package (AiP) module for applications such as 5G, will be described.

[0179] In an embodiment according to the invention, it can be used for far-field and radiated near-field OTA testing.

[0180] The antenna layout (or design) according to an embodiment of the present invention is optimized for use in a socket for OTA testing using automated test equipment. In OTA test and measurement applications, a different antenna layout (or design) than the known antenna array of AiP is required, so it is found to be advantageous to use antenna technology that is different from the antenna topology used on the AiP antenna array of 5G modules, etc.:

[0181] - Because in OTA applications, the measurement antenna is a single antenna element (not an antenna array), the size of the antenna is not important;

[0182] - Antenna gain is not important since it is used to radiate near field (unlike a base station in a real OTA scenario, which is close to the DUT), what is important is to have a large bandwidth to cover all frequencies to be tested.

[0183] Hereinafter, the basic idea of ​​embodiments of the present invention will be described.

[0184] Antenna design (or antenna layout)

[0185] Figure 2a to Figure 2c The antenna design (or antenna layout) shown includes a dual-polarized waveguide (230), a waveguide backplane (220) and a PCB (210). Two pairs of orthogonal differentially fed microstrip probes (212) are arranged in the aperture cutout region (211) so as to excite the main orthogonal modes (TE 10 and TE 01 ).

[0186] Differential feeding helps provide symmetry to the antenna circuit, increases decoupling between the orthogonal arms, and broadens the operating bandwidth.

[0187] The probe's feed network is arranged on opposite layers of the PCB for ease of routing and high isolation. This makes the PCB process simple as no blind / buried vias are required. The feed network is connected to the differential line or differential line conversion (216) via a 100 ohm differential interface. This provides the versatility of antenna circuit integration for transceiver chain components on the same board.

[0188] Finally, the probe utilizes several PCB layers connected by probe vias (218) ("thick probe") and has a via (211) inside the aperture cutout for increasing the antenna bandwidth. According to one aspect of the invention, another possibility for testing using magnetic interactions is to include additional new circuits for structural testing in the DFT component, thereby having the additional possibility to generate dynamic magnetic fields by induction, such as intervening SCAN tests. A disadvantage of complex logic is that the scan chains must be loaded frequently to achieve a sufficiently high test coverage (which should be >99% for high-quality products). However, large parts of the circuit area are easily accessible, but the chains must always be fully loaded, so additional test options in complex areas have a significant impact on test time and test costs.

[0189] Antenna simulation results are as follows: Figure 6a and Figure 6b shown.

[0190] Electrical properties

[0191] Operating frequency band: 22-43GHz (65%), considering 10dB RL

[0192] Insertion loss in antenna circuit: 0.75…1.35dB in the band (based on Megtron6 ​​board)

[0193] Antenna gain: 6-9.5dBi within the frequency band

[0194] Port leakage: <-80dB within the frequency band

[0195] Cross-polarization component discrimination in the far field: >55dB within the band

[0196] Mechanical properties

[0197] The antenna circuit only occupies an area of ​​2×2λ0 in the PCB (λ0 is calculated at the center frequency of 32.5GHz);

[0198] The antenna PCB uses at least 3 layers, and its process does not require blind or buried vias

[0199] OTA antenna prototype Figure 5a to Figure 5d shown.

[0200] Antenna integration in ATE socket Figure 7a to Figure 7b shown.

[0201] Furthermore, it should be noted that the embodiments and processes may be used as described in this section, and may optionally be supplemented by any of the features, functions, and details disclosed herein (throughout the document), whether used alone or in combination.

[0202] However, features, functions and details described in any other sections may also optionally be introduced into an embodiment according to the present invention.

[0203] In addition, the embodiments described in the above chapters can be used alone and can also be supplemented by any features, functions and details in another chapter.

[0204] In addition, it should be noted that the various aspects described herein can be used alone or in combination. Therefore, details can be added to each of the various aspects without adding details to another aspect of the various aspects.

[0205] Specifically, embodiments are described in the claims. The embodiments described in the claims may optionally be supplemented by any of the features, functions and details described herein, whether used alone or in combination.

[0206] Furthermore, any of the features and functions described herein may be implemented in hardware or software, or using a combination of hardware and software, as described in the “Implementation Alternatives” section.

[0207] Implementation Alternatives

[0208] Although some aspects are described in the context of an apparatus, it is clear that these aspects also represent a description of a corresponding method, where a block or apparatus corresponds to a method step or a feature of a method step. Similarly, aspects described in the context of a method step also represent a description of a corresponding block or item or feature of a corresponding apparatus. Some or all of the method steps may be performed by (or using) a hardware device, such as a microprocessor, a programmable computer, or an electronic circuit. In some embodiments, one or more of the most important method steps may be performed by such a device.

[0209] Depending on certain implementation requirements, embodiments of the present invention may be implemented in hardware or in software. The implementation may be performed using a digital storage medium, such as a floppy disk, DVD, Blu-ray, CD, ROM, PROM, EPROM, EEPROM, or flash memory, on which electronically readable control signals are stored, which cooperate (or can cooperate) with a programmable computer system to perform the corresponding method. Therefore, the digital storage medium may be computer readable.

[0210] Some embodiments according to the invention comprise a data carrier having electronically readable control signals, which are capable of cooperating with a programmable computer system, such that one of the methods described herein is performed.

[0211] Generally, embodiments of the present invention can be implemented as a computer program product with a program code, wherein the program code is operable to perform one of the methods when the computer program product runs on a computer. The program code can, for example, be stored on a machine-readable carrier.

[0212] Other embodiments comprise the computer program for performing one of the methods described herein, stored on a machine readable carrier.

[0213] In other words, therefore, one embodiment of the inventive method is a computer program having a program code for performing one of the methods described herein, when the computer program runs on a computer.

[0214] Therefore, a further embodiment of the inventive method is a data carrier (or a digital storage medium, or a computer-readable medium) on which is recorded the computer program for performing one of the methods described herein. The data carrier, the digital storage medium or the recorded medium is typically tangible and / or non-transitory.

[0215] A further embodiment of the inventive method is, therefore, a data stream or a sequence of signals representing the computer program for performing one of the methods described herein.The data stream or the sequence of signals may, for example, be configured to be transmitted via a data communication connection, for example via the Internet.

[0216] A further embodiment comprises a processing means, for example a computer or a programmable logic device, configured to or adapted to perform one of the methods described herein.

[0217] A further embodiment comprises a computer having installed thereon the computer program for performing one of the methods described herein.

[0218] Another embodiment according to the invention comprises an apparatus or system configured to transmit (e.g., electronically or optically) a computer program for performing one of the methods described herein to a receiver. The receiver may be, for example, a computer, a mobile device, a storage device, etc. For example, the apparatus or system may comprise a file server for transmitting the computer program to the receiver.

[0219] In some embodiments, a programmable logic device (e.g., a field programmable gate array) may be used to perform some or all of the functions of the methods described herein. In some embodiments, a field programmable gate array may be used in conjunction with a microprocessor to perform one of the methods described herein. Typically, these methods are preferably performed by any hardware device.

[0220] The devices described herein may be implemented using hardware devices, or using computers, or using a combination of hardware devices and computers.

[0221] An apparatus described herein or any component of an apparatus described herein may be implemented at least partially in hardware and / or software.

[0222] The methods described herein may be performed using a hardware device, or using a computer, or using a combination of a hardware device and a computer.

[0223] Any component of the methods described herein or the apparatus described herein may be performed at least in part by hardware and / or software.

[0224] The embodiments described herein are only used to illustrate the principles of the present invention. It should be understood that modifications and variations of the arrangements and details described herein will be apparent to other persons skilled in the art. Therefore, it is intended that the scope of the present invention be limited only by the scope of the pending patent claims, and not by the specific details proposed by describing and explaining the embodiments herein.

Claims

1. An antenna device, comprising: Printed circuit board (PCB), including openings, wherein at least two probes are arranged orthogonally to each other on or in the printed circuit board; a cavity, located between a portion of the PCB carrying the probe and a waveguide backplane, the cavity forming a dual-polarization waveguide between the portion of the PCB carrying the probe and the waveguide backplane; wherein the opening in the printed circuit board is arranged in a central region around a central axis of the cavity; The depth of the cavity is a quarter wavelength λ / 4 plus an integer multiple of a half wavelength, within a tolerance of + / - 1 / 16 of the wavelength.

2. The antenna device according to claim 1, wherein: The probe is disposed in or on the printed circuit board in an area of ​​the printed circuit board that defines the cavity between the printed circuit board and the waveguide backplate.

3. The antenna device according to any one of the preceding claims, wherein: The probes form at least one pair of orthogonal probes configured to excite at least two orthogonal modes of the waveguide.

4. The antenna device according to any one of the preceding claims, wherein: The probe is connected to at least two microstrip lines formed on or in the printed circuit board in an area of ​​the printed circuit board that does not define the cavity between the printed circuit board and the waveguide backplane, wherein the microstrip lines form a feed network for the probe.

5. The antenna device according to claim 4, wherein: The feed network of the probe is connected to the corresponding differential port via a corresponding differential line conversion.

6. The antenna device according to any one of the preceding claims, wherein: A feed network of one or more probes having a first orientation and a feed network of one or more probes having a second orientation orthogonal to the first orientation are disposed on different layers of the printed circuit board.

7. The antenna device according to any one of the preceding claims, comprising: four probes, the four probes being arranged in two orthogonal pairs, the two orthogonal pairs being disposed in or on the printed circuit board in a region of the printed circuit board that defines the cavity between the printed circuit board and the waveguide backplane, and the two orthogonal pairs being configured to excite a primary orthogonal mode TE of the waveguide 10 and TE 01 .

8. The antenna device according to claim 7, wherein: The four probes are connected to corresponding microstrip lines in or on the printed circuit board in an area of ​​the printed circuit board that does not define the cavity between the printed circuit board and the waveguide backplane, wherein two probes having a first orientation are coupled to a first differential port, and Therein, two probes having a second orientation are coupled to the second differential port.

9. The antenna device according to any one of the preceding claims, wherein: The printed circuit board comprises at least three layers, preferably four layers.

10. Antenna device according to any one of the preceding claims, in, The printed circuit board is arranged on the surface of the metal substrate, and Wherein, the cavity is formed in the metal substrate.

11. The antenna device according to any one of the preceding claims, wherein: The printed circuit board is a multi-layer printed circuit board; and wherein the waveguide backplane is implemented using a layer of the printed circuit board; and / or Wherein, the boundary of the cavity is realized using a through hole passing through the multi-layer printed circuit board.

12. The antenna device according to any one of the preceding claims, wherein: The width of the cavity is half the wavelength λ / 2.

13. The antenna device according to any one of the preceding claims, wherein: The length of the probe is equal to the depth of the cavity, within a tolerance of 1 / 16 of the wavelength.

14. The antenna device according to any one of the preceding claims, wherein: The probe passes through several layers of the PCB connected by one or more probe vias.

15. The antenna device according to any one of the preceding claims, further comprising: An upper metal plate, wherein an additional waveguide portion is formed in the upper metal plate such that the additional waveguide portion is an extension of the waveguide formed by the cavity.

16. The antenna device according to claim 15, wherein: The printed circuit board is disposed between the metal base plate and the upper metal plate.

17. The antenna device according to any one of the preceding claims, wherein: The differential conversion line includes a shield thereon.

18. Antenna device according to any one of the preceding claims, in, The antenna device comprises one or more external connections, wherein the first external connection is coupled to one or more probes having a first orientation, and / or Wherein the second external connection is coupled to one or more probes having a second orientation.

19. The antenna device according to claim 18, wherein: The one or more external connections are waveguide connections.

20. The antenna device according to claim 18 or 19, wherein: The one or more external connections are blind-mate connections.

21. The antenna device according to one of claims 18 to 20, wherein: The one or more external connections are aligned towards the same direction as a main radiation direction of the antenna arrangement.

22. An antenna device according to any one of the preceding claims, wherein: The antenna arrangement comprises a radio transparent cover covering the waveguide.

23. The antenna device according to claim 22, wherein: The cover is configured to push a device under test into a device under test position while allowing electromagnetic radiation to be transmitted from the waveguide to the device under test and vice versa.

24. An automated test equipment (ATE), in, The automated testing device comprises an antenna arrangement according to one of the preceding claims, The automated testing equipment is configured to use the antenna device to test a device under test.

25. The automated testing device according to claim 24, in, The automated test equipment comprises a device under test socket and one or more high-frequency connectors, The one or more high-frequency connectors are arranged beside the test socket.

26. The automated testing equipment according to claim 25, wherein: The test socket and the one or more high-frequency connectors are arranged so that the one or more external connections of the antenna device mate with the one or more high-frequency connectors, and so that when the one or more external connections of the antenna device mate with the one or more high-frequency connectors, the cover of the antenna device pushes the device under test into the device under test socket.

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