Circuit board, circuit board replacement system, and circuit board replacement method

Abstract

According to one embodiment, the circuit board for device control includes: a processing unit configured to be capable of performing various processes; a storage unit configured to be capable of storing various data; a power supply line for supplying power to the processing unit and the storage unit; the signal line is used for signal transmission between the processing part and the storage part; a cutting unit capable of cutting at least one of the signal line and a portion of the power supply line to which power is supplied to the storage unit; and a connection unit capable of externally connecting at least one of a portion of the power supply line closer to the storage unit than the cut-off unit and a portion of the signal line closer to the storage unit than the cut-off unit.

Description

Technical Field

[0001] Embodiments of the present invention relate to a circuit substrate for controlling equipment mounted on equipment such as a refrigeration cycle device such as an air conditioner, a circuit substrate replacement system for replacing a circuit substrate for controlling equipment, and a circuit substrate replacement method for replacing a circuit substrate for controlling equipment, and in particular, to a control circuit substrate equipped with a memory storing various settings. Background Art

[0002] For example, Patent Document 1 discloses a method for easily transferring function settings when replacing a device. According to Patent Document 1, the indoor unit sends setting information related to various functions of the indoor unit stored in a non-volatile memory to a remote controller. The remote controller stores the received setting information in a non-volatile memory mounted on a circuit board. The operator cuts off the power supply to the indoor unit and replaces the indoor unit. When the power is turned on to the indoor unit after the replacement, the indoor unit determines whether its own setting information is registered in the non-volatile memory. If the indoor unit does not have its own setting information registered in the non-volatile memory, it obtains the setting information of the indoor unit stored in the non-volatile memory of the remote controller and registers it in its own non-volatile memory.

[0003] In addition, Patent Document 2 discloses an air conditioner having an air conditioning control unit, a data reading and writing unit, a data control unit, and an operating unit. According to Patent Document 2, the air conditioning control unit controls the operation of the air conditioning based on the operating information and the operation setting information. In the data reading and writing unit, the storage medium can be loaded and unloaded, and the operating information and the operation setting information sent from the air conditioning control unit can be written into the storage medium during the operation of the air conditioning, and the operating information and the operation setting information before the operation stops stored in the storage medium can be read when the air conditioning operation is restarted. The data control unit transfers the operating information and the operation setting information sent from the air conditioning control unit to the data reading and writing unit and writes them into the storage medium. Alternatively, the data control unit transfers the operating information and the operation setting information before the operation stops read from the storage medium by the data reading and writing unit to the air conditioning control unit. The operating unit can input the operation setting information for performing the operation of the air conditioning operation.

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: International Publication No. 2008 / 065923

[0007] Patent Document 2: Japanese Patent Application Publication No. 2013-234763 Summary of the invention

[0008] Technical problem to be solved by the invention

[0009] According to Patent Document 1, the data of the indoor unit before the indoor unit is replaced is pre-stored in the remote controller, and when there is no data on the indoor unit side after the indoor unit is replaced, the data can be obtained from the remote controller. However, in order to realize this function, it is necessary to set a special structure for realizing such a data transmission function in the remote controller and the indoor unit, and it is necessary to set different structures for the remote controller and the indoor unit respectively. Furthermore, if the circuit substrate of the indoor unit itself, such as the CPU on the circuit substrate, the peripheral circuit of the CPU, or the power supply circuit that supplies power to the CPU, fails, the data of the indoor unit cannot be sent to the remote controller, and as a result, the data cannot be transferred.

[0010] Patent document 2 discloses a technical solution using a removable storage medium, but in this case, the storage medium installed on the circuit substrate equipped with the control unit needs to be removable in advance. Since the storage medium is difficult to remove if it is soldered, components such as a socket that can install and remove the storage medium are required on the circuit substrate, and the number of components increases. In addition, a storage medium such as a general non-volatile memory is basically a very small memory chip of about 1 cm square, so it may also be damaged when being removed from the circuit substrate or installed.

[0011] Therefore, the present invention provides a circuit substrate, a circuit substrate replacement system, and a circuit substrate replacement method that set the substrates before and after replacement to the same structure and can safely and quickly transfer data between new and old substrates when transferring data in a non-volatile memory.

[0012] Solutions for solving the above technical problems

[0013] The circuit substrate of the present embodiment is a circuit substrate for device control, and comprises: a processing unit configured to perform various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a signal line for transmitting signals between the processing unit and the storage unit; a cutting unit capable of cutting off a portion of the power supply line that supplies power to the storage unit and the signal line; and a connecting unit capable of connecting a portion of the power supply line that is closer to the storage unit than the cutting unit and a portion of the signal line that is closer to the storage unit than the cutting unit to the outside.

[0014] Alternatively, the circuit substrate of the present embodiment is a circuit substrate for device control, comprising: a processing unit configured to perform various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit; and a connecting unit capable of connecting a portion of the power supply line that is closer to the storage unit than the cut-off unit to the outside.

[0015] Alternatively, the circuit substrate of the present embodiment is a circuit substrate for device control, comprising: a processing unit configured to perform various processes; a storage unit configured to store various data; a signal line used for signal transmission between the processing unit and the storage unit; a cutting unit capable of cutting off the signal line; and a connecting unit capable of connecting a portion of the signal line that is closer to the storage unit than the cutting unit to the outside.

[0016] The circuit substrate replacement system of the present embodiment is a system for replacing a circuit substrate for controlling an apparatus, wherein the substrate includes: a processing unit configured to execute various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a signal line for transmitting signals between the processing unit and the storage unit; a disconnection unit capable of disconnecting a portion of the power supply line that supplies power to the storage unit and the signal line; and a connection unit capable of connecting a portion of the power supply line that is closer to the storage unit than the disconnection unit and a portion of the signal line that is closer to the storage unit than the disconnection unit to the outside, wherein in the substrate before replacement, in a state where the portion of the power supply line that supplies power to the storage unit and the signal line are disconnected by the disconnection unit, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connection unit of the substrate before replacement, and in this connection state, the processing unit of the substrate after replacement performs data transmission processing, reads data stored in the storage unit of the substrate before replacement via the connection unit of the substrate before replacement, and stores the data in the storage unit of the substrate after replacement.

[0017] Alternatively, the circuit substrate replacement system of the present embodiment is a system for replacing a circuit substrate for device control, the substrate comprising: a processing unit configured to perform various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit; and a connecting unit capable of connecting a portion of the power supply line that is closer to the storage unit than the cut-off unit to the outside, in the substrate before replacement, when the portion of the power supply line that supplies power to the storage unit is cut off by the cut-off unit, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connecting unit of the substrate before replacement, and in this connection state, the processing unit of the substrate after replacement performs data transmission processing, reads data stored in the storage unit of the substrate before replacement via the connecting unit of the substrate before replacement and stores it in the storage unit of the substrate after replacement.

[0018] Alternatively, the circuit substrate replacement system of the present embodiment is a system for replacing a circuit substrate for device control, wherein the substrate comprises: a processing unit configured to perform various processes; a storage unit configured to store various data; a signal line used for signal transmission between the processing unit and the storage unit; a cutting unit capable of cutting the signal line; and a connecting unit capable of connecting a portion of the signal line that is closer to the storage unit than the cutting unit to the outside, wherein, in the substrate before replacement, when the signal line is cut by the cutting unit, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connecting unit of the substrate before replacement, and in this connection state, the processing unit of the substrate after replacement performs data transmission processing, reads data stored in the storage unit of the substrate before replacement via the connecting unit of the substrate before replacement and stores it in the storage unit of the substrate after replacement.

[0019] The circuit substrate replacement method of the present embodiment is a method for replacing a circuit substrate for controlling a device, wherein the substrate includes: a processing unit configured to execute various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a signal line for transmitting signals between the processing unit and the storage unit; a disconnection unit capable of disconnecting a portion of the power supply line that supplies power to the storage unit and the signal line; and a connection unit capable of connecting a portion of the power supply line that is closer to the storage unit than the disconnection unit and a portion of the signal line that is closer to the storage unit than the disconnection unit to the outside, wherein in the substrate before replacement, in a state where the portion of the power supply line that supplies power to the storage unit and the signal line are disconnected by the disconnection unit, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connection unit of the substrate before replacement, and in this connection state, data transmission processing is performed using the processing unit of the substrate after replacement, and data stored in the storage unit of the substrate before replacement is read via the connection unit of the substrate before replacement and stored in the storage unit of the substrate after replacement.

[0020] Alternatively, the circuit substrate replacement method of the present embodiment is a method for replacing a circuit substrate for device control, wherein the substrate comprises: a processing unit configured to perform various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit; and a connecting unit capable of connecting a portion of the power supply line that is closer to the storage unit than the cut-off unit to the outside, wherein, in the substrate before replacement, in a state in which the portion of the power supply line that supplies power to the storage unit is cut off by the cut-off unit, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connecting unit of the substrate before replacement, and in this connection state, data transmission processing is performed using the processing unit of the substrate after replacement, and data stored in the storage unit of the substrate before replacement is read via the connecting unit of the substrate before replacement and stored in the storage unit of the substrate after replacement.

[0021] Alternatively, the circuit substrate replacement method of the present embodiment is a method for replacing a circuit substrate for device control, wherein the substrate comprises: a processing unit configured to perform various processes; a storage unit configured to store various data; a signal line used for signal transmission between the processing unit and the storage unit; a cutting unit capable of cutting the signal line; and a connecting unit capable of connecting a portion of the signal line that is closer to the storage unit than the cutting unit to the outside, wherein, in the substrate before replacement, in a state in which the signal line is cut by the cutting unit, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connecting unit of the substrate before replacement, and in this connection state, data transmission processing is performed using the processing unit of the substrate after replacement, and data stored in the storage unit of the substrate before replacement is read via the connecting unit of the substrate before replacement and stored in the storage unit of the substrate after replacement. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a diagram schematically showing a configuration example of the air conditioner according to the first embodiment.

[0023] Figure 2 It is a diagram schematically showing a configuration example of a circuit board according to the first embodiment.

[0024] Figure 3 This is a diagram schematically showing a specific configuration example of a connection line portion in the circuit board according to the first embodiment.

[0025] Figure 4 This is a diagram schematically showing an example of a state in which the circuit board replacement system according to the first embodiment is constructed.

[0026] Figure 5 This is a flowchart schematically showing an example of the circuit board replacement method according to the first embodiment.

[0027] Figure 6 This is a flowchart schematically showing an example of the circuit board replacement method according to the second embodiment.

[0028] Figure 7 It is a diagram schematically showing a configuration example of a circuit board according to a third embodiment.

[0029] Figure 8 This is a diagram schematically showing an example of a state in which the circuit board replacement system according to the third embodiment is constructed.

[0030] Fig. 9 This is a diagram schematically showing a configuration example of a circuit board according to a fourth embodiment.

[0031] Fig.10 This is a diagram schematically showing an example of a state in which the circuit board replacement system according to the fourth embodiment is constructed. DETAILED DESCRIPTION

[0032] Hereinafter, with reference to the accompanying drawings, a plurality of embodiments of a circuit substrate for controlling a device, taking a circuit substrate mounted on an air conditioner as an example, will be described. In addition, with reference to the accompanying drawings, a plurality of embodiments of a circuit substrate replacement system and a circuit substrate replacement method for replacing the circuit substrate will be described. In the plurality of embodiments, substantially the same elements are denoted by the same reference numerals, and their descriptions are omitted.

[0033] (First embodiment)

[0034] like Figure 1 As illustrated, the circuit substrate 1 of the present disclosure is mounted on, for example, an outdoor unit 101 constituting an air conditioner 100. Hereinafter, the circuit substrate 1 is sometimes referred to as simply the substrate 1. The substrate 1 is a control circuit substrate that controls the outdoor unit 101 and the entire operation of the entire air conditioner 100. The outdoor unit 101 and the indoor unit 102 together constitute the air conditioner 100. The outdoor unit 101 is connected to a commercial AC power source AC, and the commercial AC power source AC supplies power required for operation. Hereinafter, the commercial AC power source AC is also referred to as the AC power source AC. The indoor unit 102 is similarly connected to the AC power source AC via a power line PL from the outdoor unit 101. In addition, the indoor unit 102 is also equipped with a control circuit substrate 1′ that operates in cooperation with the circuit substrate 1 of the outdoor unit 101. The circuit substrate 1 of the outdoor unit 101 is connected to the control circuit substrate 1′ of the indoor unit 102 via a communication line CL, and the operation of the entire air conditioner 100 is controlled while exchanging information with each other.

[0035] like Figure 2As shown in the example, the substrate 1 includes a CPU (Central Processing Unit) 2, a nonvolatile memory 3, a basic connector 4, a special connector 5, a connection line 6, and a power supply circuit 8. Each component on the circuit substrate 1 is fixed in a manner electrically connected to the printed circuit board by, for example, welding. The CPU 2 is combined with a ROM, a RAM, and its peripheral circuits, which are not shown, to form a processing unit. The CPU 2 is configured to be able to perform various processes related to the operation of the outdoor unit 101 and the indoor unit 102 based on the control program and various setting data stored in the ROM. The CPU 2 can perform data transmission processing, the details of which will be described later.

[0036] The nonvolatile memory 3 is an example of a storage unit made of semiconductors, and is configured to store various data. In addition, a control program for executing normal operation processing and a part of control data are stored in the ROM connected to the CPU 2. The nonvolatile memory 3 stores setting information related to various functions of the outdoor unit 101 and the air conditioner 100. Here, the stored information is not only the default information of the outdoor unit 101 when it is shipped from the factory, but also the setting content added or changed by the installation specialist or service personnel according to the installation status or the user's request after the air conditioner 100 is installed.

[0037] The basic connector 4 is configured to be connectable to the outside. The basic connector 4 is a standard connector having six terminals soldered to the substrate 1, for example, in order to input data from outside the substrate 1. The special connector 5 is a standard six-terminal connector soldered to the substrate 1 in the same manner as the basic connector 4, and is configured to be connectable to the outside. The special connector 5 is an example of a connection portion, and is a connector specially provided separately from the basic connector 4 in order to implement the substrate replacement method of the present disclosure. In order to reduce the number of parts, it is preferred that the basic connector 4 and the special connector 5 use the same type of connector.

[0038] The connection line portion 6 electrically connects or connects the nonvolatile memory 3 and the special connector 5 to the CPU 2. A cut-off portion 7 is provided in the middle of the connection line portion 6. The nonvolatile memory 3 and the special connector 5 are connected to the CPU 2 through a plurality of connection lines constituting the connection line portion 6. On the other hand, the basic connector 4 is connected to the CPU 2 through a connection line group 44 that is not electrically connected to any of the connection lines constituting the connection line portion 6. Here, the portion of the connection lines constituting the connection line portion 6 other than the cut-off portion 7 is mainly composed of a conductive line pattern on the circuit substrate 1, and a lead wire may be used as a part thereof depending on the situation.

[0039] So far, Figure 2 The conceptual circuit diagram is explained, Figure 3The substrate 1 for implementing the circuit configuration is illustrated. The power supply circuit 8 is connected to the AC power supply AC via power supply terminals R such as two socket terminals provided on the substrate 1 and two connector terminals T connected to the AC power supply AC. The power supply circuit 8 is composed of various electrical / electronic components interconnected by soldering the circuit pattern on the substrate 1, and is a circuit that takes the AC voltage from the AC power supply AC as input and converts it into a stepped-down DC voltage, such as DC 5 volts (V) and other outputs. As the power supply circuit 8, a general AC-DC conversion circuit such as a combination of a rectifier circuit and a switching regulator or a series regulator can be used. All components on the substrate 1 such as the CPU 2 and the non-volatile memory 3 operate using the DC output of the power supply circuit 8 as a power source.

[0040] The connection line section 6 is composed of a plurality of connection lines, in this case, four connection lines. In this case, the connection line section 6 has one power supply line 6a, one reference potential line 6b, and two signal lines 6c and 6d. The power supply line 6a is a wiring for supplying power from the power supply circuit 8 to various components on the substrate 1, especially the CPU 2 and the non-volatile memory 3. The reference potential line 6b is a connection line that becomes a reference potential of the circuit substrate 1, such as 0 volts (V). The signal lines 6c and 6d are connection lines for transmitting data and signals. A DC voltage, such as DC5V, is applied from the power supply circuit 8 between the power supply line 6a and the reference potential line 6b.

[0041] The nonvolatile memory 3 has eight terminals, namely ports [1] to [8]. Two input / output ports [5] and [6] are connected to signal lines 6c and 6d, respectively, ports [1] to [4] and [7] are connected to reference potential line 6b, and port [8] is connected to power supply line 6a. Therefore, the nonvolatile memory 3 is connected to other circuits on the substrate 1 only through the power supply line 6a, reference potential line 6b, and signal lines 6c and 6d constituting the connection line section 6. In addition to the connection line section 6, the nonvolatile memory 3 is not connected to the circuits on the substrate 1 except for simple elements such as a resistor r provided on the substrate 1 in the middle of the power supply line 6a for stabilizing the power supply voltage and a capacitor C connected between the power supply line 6a and the reference potential line 6b, i.e., elements with a low probability of failure alone.

[0042] The non-volatile memory 3 operates by applying a voltage between the ports [7] and [8] which are power ports. In other words, the non-volatile memory 3 does not operate when no voltage is applied between the power ports [7] and [8]. However, since it is a non-volatile memory 3, the data stored during operation will not be erased even if the power voltage is interrupted later, and the stored state will be maintained. Therefore, as long as the power is turned on again, the data stored in the non-volatile memory 3 before the power is turned off can be read. In addition, the non-volatile memory 3 can exchange electrical signals with external devices via its input and output ports [5] and [6] to store input data or provide data stored inside to the outside. In this control, the CPU 2 writes the information to be stored into the non-volatile memory 3 or reads the data stored in the non-volatile memory 3 via the input and output ports [5] and [6] of the non-volatile memory 3.

[0043] The cutting portion 7 is composed of a plurality of jumper wires 7a to 7d, in this case, four jumper wires 7a to 7d corresponding to the number of connection wires constituting the connection wire portion 6. The jumper wires 7a to 7d are wirings that connect two circuit patterns that are not connected on the substrate 1 through a space on the substrate 1. The jumper wires 7a to 7d are thin metal wires that are electrically conductive and are not covered and exposed. The jumper wire 7a is provided in the middle of the power supply line 6a, in this case, in the portion of the power supply line 6a that supplies power to the non-volatile memory 3. In addition, the power supply line 6a passes through a branch portion located closer to the power supply circuit 8 than the jumper wire 7a, that is, at Figure 3 The wiring branching from the branch portion indicated by the midpoint K supplies power to the CPU 2. The jumper 7b is provided at the midway portion of the reference potential line 6b. The jumper 7c is provided at the midway portion of the signal line 6c. The jumper 7d is provided at the midway portion of the signal line 6d. As described later, in order to avoid the influence of other circuits in the failed substrate 1, it is preferable to provide the jumpers 7a to 7d as close to the non-volatile memory 3 as possible in the connection lines 6a to 6d. If all the jumpers 7a to 7d are cut off, all eight terminals of the non-volatile memory 3, i.e., ports [1] to [8], are separated from the CPU 2 and the power supply circuit 8 as active elements / circuits on the substrate 1, and the influence of these circuits on the substrate 1 on the non-volatile memory 3 disappears.

[0044] The special connector 5 uses four of the six terminals having pins [1] to [6], and is connected to the connection line portion 6 branched on the nonvolatile memory 3 side relative to the jumper wires 7a to 7d in the connection line portion 6. That is, the connection line portion 6 is divided into two from the CPU 2 side at the front end of the jumper wire 7, that is, closer to the nonvolatile memory 3 than the jumper wire 7, one of which is connected to the nonvolatile memory 3 and the other is connected to the special connector 5. For example, the connection wiring from the branched portion to the special connector 5 is formed by a conductive pattern provided on the substrate 1. The pins [1] and [4] of the special connector 5 are not used, the pin [2] is connected to the reference potential line 6b, the pin [3] is connected to the power supply line 6a, and the pins [5] and [6] are connected to the signal lines 6c and 6d, respectively.

[0045] The connection line group 44 has four independent wirings. The wirings are composed of one power supply line 4a, one reference potential line 4b, and two signal lines 4c and 4d. The power supply line 4a is connected to, for example, point K, which is a DC output terminal of the power supply circuit 8, similarly to the power supply line 6a. The reference potential line 4b is connected to a reference potential portion of the substrate 1, similarly to the reference potential line 6b. The two signal lines 4c and 4d are connected to the input and output terminals of the CPU 2. The CPU 2 can send and receive electrical signals that can read, write, and erase data in the nonvolatile memory 3 via the two signal lines 4c and 4d as needed.

[0046] The basic connector 4 also uses four of the six terminals [1] to [6] pins, similarly to the special connector 5, and does not use the [1] and [4] pins. The [2] pin of the basic connector 4 is connected to the reference potential line 4b, the [3] pin is connected to the power supply line 4a, and the [5] and [6] pins are connected to the signal lines 4c and 4d extending from the CPU 2, respectively.

[0047] The substrate 1 includes a switch unit 10 that functions as an operation unit and a display unit. The switch unit 10 includes, for example, a tact switch 11, a display 12, and a rotary switch 13. The tact switches 11 are provided in plurality, in this case, three, and switch between an on state and an off state according to a pressing operation by an operator. The display 12 is composed of five 7-segment light emitting diodes in this case. The rotary switches 13 are provided in plurality, in this case, three, and can adjust an input value according to a rotation operation by an operator. The input value adjusted by the rotation operation of the rotary switch 13 is displayed on the display 12.

[0048] The substrate 1 constructed as described above is mounted on the air conditioner 100, and there are the following situations, for example: it is replaced during maintenance, inspection, or when some bad situation occurs. The most frequent occurrence is the failure of the substrate 1. A plurality of electrical components and electronic components are mounted on the substrate 1. Even if one of them fails, the original normal operation cannot be performed, and the substrate 1 needs to be replaced. Next, an example of a method for replacing the substrate 1 in this case is described in detail. In the present disclosure, the substrate 1 before replacement that has been mounted on the air conditioner 100 and the substrate 1 after replacement that is newly mounted on the air conditioner 100 are both the structure of the above-mentioned substrate 1. That is, the substrate 1 before replacement and the substrate 1 after replacement have the same circuit structure. In addition, in the following description of the replacement of the substrate 1, in the case of replacing the outdoor unit 101 itself, that is, when the original outdoor unit 101 is removed and replaced with a new outdoor unit 101, the data of the substrate of the original outdoor unit 101 is transferred to the substrate of the new outdoor unit 101, which can also be applied.

[0049] Hereinafter, for convenience of explanation, the substrate 1 before replacement, i.e., the old substrate 1, is sometimes referred to as the substrate 1A, and the substrate 1 after replacement, i.e., the new substrate 1, is sometimes referred to as the substrate 1B. In addition, the CPU 2, the nonvolatile memory 3, the basic connector 4, the special connector 5, the connection line portion 6, the disconnection portion 7, and the switch portion 10 included in the substrate 1A before replacement are sometimes referred to as the CPU 2A, the nonvolatile memory 3A, the basic connector 4A, the special connector 5A, the connection line portion 6A, the disconnection portion 7A, and the switch portion 10A, respectively, and the CPU 2, the nonvolatile memory 3, the basic connector 4, the special connector 5, the connection line portion 6, the disconnection portion 7, and the switch portion 10 included in the substrate 1B after replacement are sometimes referred to as the CPU 2B, the nonvolatile memory 3B, the basic connector 4B, the special connector 5B, the connection line portion 6B, the disconnection portion 7B, and the switch portion 10B, respectively.

[0050] Assuming that a certain malfunction occurs in the substrate 1, the operator removes the old substrate 1 storing setting data, i.e., the malfunctioning substrate 1, from the outdoor unit 101, and removes the wiring of the AC power source AC from the power terminal R. Then, the operator installs a new substrate 1 in which the setting data, etc. are not stored in the nonvolatile memory 3 as a new substrate 1 at a predetermined position of the outdoor unit 101, and connects the wiring of the AC power source AC to the power terminal R. Next, the operator cuts off the cut-off portion 7 of the old substrate 1.

[0051] The cutting operation of the cutting portion 7 is performed by an external operation such as cutting off all or any specified one of the jumper wires 7a to 7d located on the substrate 1 using a tool such as pliers. At this time, the operator can cut off all the jumper wires 7a to 7d, or only the jumper wire 7a among the jumper wires 7a to 7d, or only the jumper wires 7c and 7d among the jumper wires 7a to 7d. However, if only the jumper wire 7a among the jumper wires 7a to 7d is cut off, the ground potential of the components on the substrate 1 connected to the power supply line 6a becomes unstable. Therefore, when the jumper wire 7a is cut off, it is preferable to cut off the jumper wire 7b at the same time. In addition, there is no restriction on the order of the operation of cutting off the cutting portion 7 of the old substrate 1 and the operation of installing the new substrate 1 at the specified position of the outdoor unit 101.

[0052] The cut-off unit 7 cuts off all the jumper wires 7a to 7d from the outside, thereby forming a state where the power supply line 6a, the reference potential line 6b, and the signal lines 6c and 6d are cut off. Alternatively, the cut-off unit 7 cuts off only the jumper wire 7a, or both the jumper wires 7a and 7b from the outside, thereby forming a state where only the portion of the power supply line 6a that supplies power to the nonvolatile memory 3 is cut off. Alternatively, the cut-off unit 7 cuts off only the jumper wires 7c and 7d from the outside, thereby forming a state where only the signal lines 6c and 6d connected to the CPU 2A are cut off.

[0053] The selective cutting states of the jumper wires 7a to 7d in the above three types of cutting parts 7 are:

[0054] (1) A state in which the power supply line 6a, the reference potential line 6b, and the signal lines 6c and 6d are all cut off;

[0055] (2) A state in which only the power supply line 6a, or only the power supply line 6a and the reference potential line 6b are cut off;

[0056] (3) State where only the signal lines 6c and 6d are cut off

[0057] Any state is included in the concept of "a state in which the cutting portion 7 is cut off".

[0058] Hereinafter, in the drawings, the cut portion 7 in the “uncut state” is indicated by a solid line, and the cut portion 7 in the “cut state” is indicated by a gap.

[0059] like Figure 4As illustrated, the operator cuts off the cut-off portion 7A in the substrate 1A before replacement. At this time, the operator does not cut off the cut-off portion 7B for the substrate 1B after replacement. Then, the operator connects the non-volatile memory 3A of the substrate 1A to the CPU 2B of the substrate 1B after replacement via the special connector 5A of the substrate 1A before replacement and the basic connector 4B of the substrate 1B after replacement, while cutting off the cut-off portion 7A of the substrate 1A before replacement. Thus, a circuit substrate replacement system 1S is constructed in which the substrate 1A before replacement and the substrate 1B after replacement are connected in a manner that allows data transmission. At this time, in the connection between the special connector 5A of the substrate 1A and the basic connector 4B of the substrate 1B, a lap wiring of a wired cable such as a harness 20 can be used.

[0060] In the connection between the special connector 5A of the substrate 1A before replacement and the basic connector 4B of the substrate 1B after replacement, the pin numbers of the respective connectors are connected in a manner consistent with each other. That is, for example, the [2] pin of the special connector 5A of the substrate 1A is wired to the [2] pin of the basic connector 4B of the substrate 1B after replacement through the bridging wiring.

[0061] In the circuit board replacement system 1S, the replaced board 1B is directly supplied with power from the AC power source AC, but not the replaced board 1A. Therefore, the replaced board 1B supplied with power from the AC power source AC is indirectly supplied with power to the nonvolatile memory 3A of the replaced board 1A via the [2] and [3] pins of the basic connector 4B of the board 1B connected to the [2] and [3] pins of the special connector 5A of the board 1A. That is, when the replaced board 1B is connected to the AC power source AC, the DC output from the power supply circuit 8B is connected to the [3] pin of the special connector 5A of the replaced board 1A via the [3] pin of the basic connector 4B, flows to the power supply line 6a of the board 1A at the front end thereof, and supplies power to the nonvolatile memory 3A.

[0062] Similarly, since the pin [2] of the basic connector 4B of the substrate 1B is electrically connected to the pin [2] of the special connector 5A of the substrate 1A before replacement, the reference potentials of the substrate 1B and the substrate 1A are at the same level. As a result, the nonvolatile memory 3A of the substrate 1A before replacement can operate normally.

[0063] Then, in this connected state, the operator performs a predetermined operation on the switch unit 10B of the replaced substrate 1B. The predetermined operation may be, for example, the following operations: rotating the rotary switch 13 to select the substrate replacement mode, and pressing the touch switch 11 while the code number of the substrate replacement mode is displayed on the display 12.

[0064] When the switch section 10B is operated in this manner, the CPU 2B of the replaced substrate 1B starts data transfer processing. The data transfer processing is a process in which the CPU 2B of the replaced substrate 1B reads the data stored in the nonvolatile memory 3A of the substrate 1A before the replacement through the special connector 5A of the substrate 1A and the basic connector 4B of the substrate 1B, and stores the data in the nonvolatile memory 3B of the replaced substrate 1B, which is a so-called copy process.

[0065] If we explain the flow path of data, i.e., electrical signals at this time, the CPU 2B sends and receives signals via the two signal lines 4c and 4d of the substrate 1B. The signals flowing through the signal lines 4c and 4d of the substrate 1B reach the signal lines 6c and 6d of the substrate 1A via the [5] and [6] pins of the basic connector 4B of the substrate 1B and the [5] and [6] pins of the special connector 5A connected to the pins, and are connected to the non-volatile memory 3A. Therefore, the CPU 2B can extract all the data and information stored in the non-volatile memory 3A via the basic connector 4B and the special connector 5A. Then, the CPU 2B stores the data and information extracted from the substrate 1A in the non-volatile memory 3B of its own substrate 1B through the connecting line portion 6B.

[0066] According to such data transfer processing, various data stored in the nonvolatile memory 3A of the substrate 1A before replacement can be copied to the nonvolatile memory 3B of the substrate 1B after replacement while being retained in the substrate 1A. In addition, in addition to data related to device settings, various data such as fault history data can be stored in the nonvolatile memory 3A. For such fault history data, it is mostly unnecessary to copy to the new substrate 1B. Therefore, when copying data, the CPU 2B can select the required data and copy only the required data from the nonvolatile memory 3A to the nonvolatile memory 3B.

[0067] Next, an example of a control flow of the replacement system 1S and the replacement method of the substrate 1 will be described in detail. Figure 5As illustrated, when the power supply to the substrate 1B is turned on, the CPU 2B of the replaced substrate 1B confirms whether the data transfer from the non-volatile memory 3A of the substrate 1A before the replacement to the non-volatile memory 3B of the replaced substrate 1B is not completed, and whether the data transfer is in the incomplete state (S1). That is, the CPU 2B confirms whether it is in the insufficient data state that the required data has not been stored in the non-volatile memory 3B of the substrate 1B, and whether the flag (which will be described later in detail) during copying is in the running (on) state. In addition, whether it is in the insufficient data state can be determined, for example, based on whether data is stored in a plurality of predetermined data items. Here, the case where the flag during copying is in the running state means that the copying process of the data from the non-volatile memory 3A to the non-volatile memory 3B is in the middle, and the case where the flag during copying is in the off state means that the copying process of the data from the non-volatile memory 3A to the non-volatile memory 3B is not in the middle.

[0068] When the data is not insufficient and the copying flag is off, the CPU 2B determines that the data transfer is not incomplete (S1: No). Then, the CPU 2B performs a normal startup (S2) and controls the operation of the air conditioner 100 based on the control program and various data stored in the non-volatile memory 3B. In this case, the operation of the outdoor unit 101 is mainly controlled.

[0069] When the data is insufficient or the copying flag is in the running state, the CPU 2B determines that the data transfer is not completed (S1: Yes). Then, the CPU 2B waits until a predetermined operation is performed in the switch unit 10B (S3: No). Then, when a predetermined operation is performed in the switch unit 10B (S3: Yes), the CPU 2B switches the copying flag to the running state (S4).

[0070] Then, the CPU 2B starts the data transfer process (S5), and repeatedly reads the data from the non-volatile memory 3A of the substrate 1A, writes the data to the non-volatile memory 3B of the substrate 1B, and verifies the data written to the non-volatile memory 3B. Then, when the CPU 2B completes writing and verifying all the data stored in the non-volatile memory 3A of the substrate 1A to the non-volatile memory 3B of the substrate 1B (S6: Yes), it switches the copying flag to the off state (S7), and ends the control flow. Moreover, it is preferable that the operator turns off the power supply to the substrate 1B after the control flow ends.

[0071] If it is assumed that the control flow is transferred to the normal start (S2) after the completion of the data transmission process (S6: Yes), for example, the air conditioner 100 may be operated in a state where the substrate 1A and the substrate 1B are connected by the harness 20 or the like, or the air conditioner 100 may be operated in a state where the safety of the power supply or the like is not ensured, which is not preferable. Therefore, when the above control flow ends, that is, when the data transmission process is completed, it is preferable that the operator temporarily disconnects the power supply to the substrate 1B. In this way, as long as the power supply to the substrate 1B is not reconnected, it is possible to avoid the substrate 1B from accidentally starting normally.

[0072] After the power supply is turned off, if the power supply is turned on again to the substrate 1B, the CPU 2B checks whether the data transfer is incomplete (S1). At this time, the nonvolatile memory 3B of the substrate 1B stores the required data, and the copying mark is in the closed state, so the CPU 2B determines in step S1 that the data transfer is not incomplete (S1: No), and transfers to step S2 to start normal startup.

[0073] According to the above-exemplified embodiment, the substrate 1 mounted on the air conditioner 100 includes: a CPU 2, which is configured to execute various processes; a non-volatile memory 3, which is configured to store various data; a special connector 5, which is configured to be connected to the outside; a connecting line portion 6, which connects the non-volatile memory 3 and the special connector 5 to the CPU 2; and a disconnection portion 7, which disconnects the portion of the connecting line portion 6 that connects the CPU 2 and the non-volatile memory 3, thereby forming a replacement form in which the CPU 2 is separated from the non-volatile memory 3 and only the special connector 5 is connected to the non-volatile memory 3.

[0074] The cut-off unit 7 can cut off only the portion of the power supply line 6a that supplies power to the nonvolatile memory 3 by cutting off only the jumper line 7a among the plurality of jumper lines 7a to 7d. Alternatively, the cut-off unit 7 can cut off only the signal lines 6c and 6d by cutting off only the jumper lines 7c and 7d among the plurality of jumper lines 7a to 7d.

[0075] According to the substrate 1 constructed in this way, in a state where a plurality of jumper wires 7a to 7d of the cutting portion 7A are appropriately selected and cut in the substrate 1A before replacement, the non-volatile memory 3A of the substrate 1A before replacement is connected to the CPU 2B of the substrate 1B after replacement via the special connector 5A, wiring such as the wiring harness 20, and the basic connector 4B. In this connection state, the CPU 2B of the substrate 1B after replacement can perform data transmission processing in which the data stored in the non-volatile memory 3A of the substrate 1A before replacement is read via the special connector 5A of the substrate 1A before replacement and stored in the non-volatile memory 3B of the substrate 1B after replacement.

[0076] According to this configuration example, the substrate 1A before replacement and the substrate 1B after replacement are set to the same configuration, and when transferring data from the non-volatile memory 3A to the non-volatile memory 3B, the data transfer can be safely and quickly implemented between the new and old substrates 1A and 1B. Moreover, by setting the new and old substrates 1A and 1B to the same configuration, the types of components can be reduced. When transferring data between the two substrates 1A and 1B, only the overlapping wiring for connecting the two connectors is required, and no special tools are required. In addition, the special connector 5 and the basic connector 4 use connectors of the same configuration as a single body, so the wiring for connecting the two connectors has no connection direction, and connection errors will not occur. In addition, even after data is transmitted to the replaced substrate 1B, the data can be retained on the substrate 1A before replacement, and the saved data can be effectively used, for example, when the cause of a fault is found in the future.

[0077] The cut-off portion 7 is composed of a jumper wire that electrically connects two or more patterns on the substrate 1. Therefore, the cut-off portion 7 can be realized at a low cost. Once the jumper wire is cut, it is difficult or impossible to restore to the original connection state. Therefore, the cut-off portion 7 may also be a DIP switch, for example. Using the DIP switch, even if it is cut off by mistake, that is, disconnected, it can be easily restored to the original connection state.

[0078] The cut-off section 7 may be configured to cut off only the portion of the connection line section 6 composed of the four connection lines 6a to 6d that supplies power to the nonvolatile memory 3, that is, the portion of the power supply line 6a that is closer to the nonvolatile memory 3 than the jumper line 7a, or the portion of the power supply line 6a that is closer to the nonvolatile memory 3 than the jumper line 7a and the reference potential line 6b. This can prevent the CPU 2A of the substrate 1A before replacement from being supplied with power from the substrate 1A after replacement to the substrate 1B after replacement before, during, or after data transmission from the substrate 1A before replacement to the substrate 1B after replacement, thereby preventing the CPU 2A of the substrate 1A before replacement from accidentally operating and causing adverse effects on data transmission. In addition, even if the portion of the power supply line 6a that supplies power to the nonvolatile memory 3 is cut off in the substrate 1A before replacement, power can be supplied from the substrate 1B after replacement to the nonvolatile memory 3A via the terminal [6] pin of the special connector 5A and the terminal [6] pin of the normal connector 4B.

[0079] Alternatively, the cut-off portion 7 may be configured to cut off at least the signal lines 6c and 6d in the connection line portion 6. According to this configuration, even if power is supplied from the replaced substrate 1B to the CPU 2A of the substrate 1A before replacement, it is possible to prevent the CPU 2A from transmitting a signal to the nonvolatile memory 3A in the substrate 1A. Therefore, the CPU 2B of the replaced substrate 1B can exchange data with the nonvolatile memory 3A of the substrate 1A before replacement without being hindered by the CPU 1A of the substrate 1A before replacement.

[0080] Alternatively, the cut-off portion 7 may be configured not to include the reference potential line 6 b . Thus, when power is supplied from the replaced substrate 1B to the unreplaced substrate 1A, the substrate 1A can be maintained at the reference potential or the ground potential.

[0081] Generally, there are various reasons for the failure that require replacement of the substrate 1A. For example, the CPU 1A may no longer operate, or the circuit and wiring of the power supply circuit 8A may be disconnected or short-circuited due to changes over time. Therefore, in order to transfer or copy data from the non-volatile memory 3A to the non-volatile memory 3B in the safest way, it is preferable not to use the circuit on the substrate 1A or the pattern on the substrate 1A, that is, the power path, as much as possible, and even if used, the use should be limited to the minimum necessary range.

[0082] From this point of view, it is most preferable that the cutting section 7 cuts off all the connection lines included in the connection line section 6, that is, the power supply line 6a, the reference potential line 6b, and the signal lines 6c and 6d. In this way, all the terminals of the nonvolatile memory 3 are electrically separated from the power supply circuit 8, the CPU 2 and its peripheral circuits. Therefore, even if a failure occurs in various parts of the substrate 1A, the influence of the failure can be avoided to the greatest extent, and the nonvolatile memory 3 can be reliably connected to the special connector 5 for replacement.

[0083] When the switch unit 10B provided on the replaced substrate 1B is operated, the CPU 2B of the replaced substrate 1B starts the data transfer process, that is, reads data from the nonvolatile memory 3A and writes the data to the nonvolatile memory 3B. According to this configuration example, the data transfer process can be started based on the operator's intentional operation of the switch unit 10B, and the data transfer process can be prevented from being started against the operator's intention.

[0084] (Second embodiment)

[0085] In the first embodiment, the data transmission process is started based on the manual operation of the operator, but there are cases where it is desired to quickly implement it without relying on the operator's operation. Figure 6In the illustrated control flow, when the CPU2B of the replaced substrate 1B is in a power-on state where the power to the substrate 1B is turned on and in a data transfer incomplete state where the data transfer from the non-volatile memory 3A of the substrate 1A before replacement to the non-volatile memory 3B of the replaced substrate 1B is incomplete (S1: Yes), if the non-volatile memory 3A of the substrate 1A before replacement is connected to the CPU2B of the replaced substrate 1B via the special connector 5A of the substrate 1A before replacement in a state in which a replacement form is formed by the cutting portion 7A in the substrate 1A before replacement, that is, if the circuit substrate replacement system 1S is constructed, regardless of whether the prescribed operation is performed in the switch portion 10B, the copying mark is switched to the running state (S4) by the CPU2B of the replaced substrate 1B, and then the data transfer processing (S5) is started.

[0086] According to this control example, even if the operator does not need to operate the switch unit 10B, the data transmission process can be automatically started in response to the satisfaction of a predetermined condition, in this case, in response to the establishment of the circuit board replacement system 1S. This can reduce the operator's workload caused by replacing the board 1.

[0087] (Third embodiment)

[0088] Figure 7 The illustrated substrate 1 does not include the base connector 4. According to the substrate 1, the nonvolatile memory 3 includes an address switching switch 30. The address switching switch 30 is configured to be able to switch the nonvolatile memory 3 between an open state and a grounded state by opening and closing the switch. The address switching switch 30 can switch the address of the nonvolatile memory 3 by switching the nonvolatile memory 3 between an open state and a grounded state.

[0089] exist Figure 8 , a state where the circuit board replacement system 1S is constructed by connecting two substrates 1A and 1B each having an address switching switch 30 in the nonvolatile memory 3 is illustrated. In this case, in the substrate 1A before replacement, the nonvolatile memory 3A is switched to an open state by the address switching switch 30A, thereby switching the address of the nonvolatile memory 3A to a predetermined first address. On the other hand, in the substrate 1B after replacement, the nonvolatile memory 3B is switched to a grounded state by the address switching switch 30B, thereby switching the address of the nonvolatile memory 3B to a predetermined second address.

[0090] In the circuit board replacement system 1S, two nonvolatile memories 3A and 3B are connected to the CPU 2B of the replaced substrate 1B. The addresses of the two nonvolatile memories 3A and 3B are switched to different addresses by the address switching switches 30A and 30B, respectively. Therefore, the CPU 2B of the substrate 1B can recognize the two nonvolatile memories 3A and 3B without confusion. In addition, according to this configuration example, the basic connector 4 is not required, and only the special connector 5 is provided. Therefore, the number of connectors mounted on the substrate 1 can be reduced, and the configuration of the substrate 1 can be simplified.

[0091] (Fourth embodiment)

[0092] Fig. 9 The illustrated substrate 1 does not include the basic connector 4. According to the substrate 1, the connection line portion 6 includes a connection line 40 connecting the CPU 2 and the nonvolatile memory 3, a connection line 41 connecting the CPU 2 and the special connector 5, and a connection line 42 connecting the nonvolatile memory 3 and the special connector 5. The connection lines 40, 41, and 42 include connection lines such as a power supply line and a signal line. According to the substrate 1, the connection lines 40, 41, and 42 are respectively provided with a cutter 7.

[0093] exist Fig.10 , a state where the circuit board replacement system 1S is constructed by connecting two substrates 1A and 1B each having a cutter 7 in the connection lines 40, 41, and 42 is illustrated. In this case, in the substrate 1A before replacement, the connection lines 40A and 41A are cut by the cutter 7A, and the connection line 42A is in a connected state without being cut by the cutter 7A. On the other hand, in the substrate 1B after replacement, the connection line 42B is cut by the cutter 7B, and the connection lines 40B and 41B are in a connected state without being cut by the cutter 7B.

[0094] According to the circuit board replacement system 1S configured in this way, the CPU 2B of the replaced board 1B can read the data stored in the nonvolatile memory 3A of the board 1A before replacement through the special connector 5A of the board 1A and the special connector 5B of the board 1B, and store the data in the nonvolatile memory 3B of the replaced board 1B. In addition, according to this configuration example, the basic connector 4 can be unnecessary. As a result, the number of connectors mounted on the board 1 can be reduced, and the configuration of the board 1 can be simplified.

[0095] (Other embodiments)

[0096] The content of the present disclosure is not limited to the above-mentioned multiple embodiments, and can be appropriately deformed and expanded within the scope of the main purpose. For example, the above-mentioned multiple embodiments can be implemented in combination as appropriate. The substrate 1 can be, for example, a substrate mounted on the indoor unit 102, or a substrate mounted on a device other than an air conditioner. The substrate 1A before replacement and the substrate 1B after replacement are preferably the same substrate, but as long as at least the parts involved in the main part of the present disclosure are of the same structure, the parts that are not the main part of the present disclosure can also be of different structures.

[0097] The above describes a plurality of embodiments of the present invention, but these embodiments are merely provided as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and can be modified by various omissions, substitutions, changes, appropriate partial combinations or substitutions between a plurality of embodiments without departing from the gist of the invention. This embodiment and its modifications are included in the scope and gist of the invention, and are included in the invention described in the claims and the scope of its equivalent.

[0098] Description of Reference Numerals

[0099] 1 substrate (circuit board)

[0100] 1S circuit board replacement system

[0101] 2, 2A, 2B CPU (processing unit)

[0102] 3.3A, 3B Non-volatile memory (storage unit)

[0103] 4, 4A, 4B basic connector

[0104] 5, 5A, 5B special connector (connection part)

[0105] 6, 6A, 6B connecting line

[0106] 6a Power supply line

[0107] 6b Reference potential line

[0108] 6c, 6d signal line (non-power supply line)

[0109] 7, 7A, 7B cutting part

[0110] 10, 10A, 10B switch part (operating part)

[0111] 100 air conditioners.

Claims

1. A circuit substrate for device control, characterized in that: have: a processing unit configured to execute various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; A signal line, used for signal transmission between the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit and the signal line; The connection section can connect a portion of the power supply line that is closer to the storage section than the cutoff section and a portion of the signal line that is closer to the storage section than the cutoff section to the outside.

2. A circuit substrate for device control, characterized in that: have: a processing unit configured to execute various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit; The connection section can connect a portion of the power supply line that is closer to the storage section than the cutoff section to the outside.

3. A circuit substrate for device control, characterized in that: have: a processing unit configured to execute various processes; a storage unit configured to store various data; A signal line, used for signal transmission between the processing unit and the storage unit; a cutting unit capable of cutting the signal line; The connection portion can connect a portion of the signal line that is closer to the storage portion than the cutting portion to the outside.

4. The circuit board according to any one of claims 1 to 3, wherein: The cut-off portion is a jumper wire.

5. The circuit substrate according to claim 1, wherein: The power supply line has a portion connecting the processing unit and the connection unit and a portion connecting the storage unit and the connection unit, and the cutting portion is provided at the portion connecting the processing unit and the connection unit. The signal line includes a portion connecting the processing unit and the connection unit and a portion connecting the storage unit and the connection unit, and the cutoff portion is provided at the portion connecting the processing unit and the connection unit.

6. The circuit board according to any one of claims 1 to 3, wherein: The storage unit is a nonvolatile memory having a plurality of connection terminals, and all of the connection terminals can be disconnected by the disconnection unit.

7. The circuit board according to any one of claims 1 to 3, wherein: A connector mounted on the circuit board and connectable to the outside is provided as the connection portion.

8. The circuit board according to any one of claims 1 to 3, wherein: A power supply circuit is provided which is connected to an AC power supply and supplies power to the power supply line.

9. A circuit board replacement system, which is a system for replacing a circuit board for equipment control, characterized in that: The substrate comprises: a processing unit configured to execute various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; A signal line, used for signal transmission between the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit and the signal line; a connecting portion capable of connecting a portion of the power supply line closer to the storage portion than the cutoff portion and a portion of the signal line closer to the storage portion than the cutoff portion to the outside, In the substrate before replacement, in a state where the portion of the power supply line that supplies power to the storage unit and the signal line are cut off by the cutting unit, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connecting unit of the substrate before replacement. In this connection state, the processing unit of the substrate after replacement performs data transmission processing, reads data stored in the storage unit of the substrate before replacement via the connecting unit of the substrate before replacement, and stores it in the storage unit of the substrate after replacement.

10. A circuit board replacement system, which is a system for replacing a circuit board for equipment control, characterized in that: The substrate comprises: a processing unit configured to execute various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit; a connecting portion capable of connecting a portion of the power supply line closer to the storage portion than the cutting portion to the outside, In the substrate before replacement, in a state in which the portion of the power supply line that supplies power to the storage unit is cut off by the cutting unit, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connecting unit of the substrate before replacement, and in this connection state, the processing unit of the substrate after replacement performs data transmission processing, reads the data stored in the storage unit of the substrate before replacement via the connecting unit of the substrate before replacement, and stores it in the storage unit of the substrate after replacement.

11. A circuit board replacement system, which is a system for replacing a circuit board for equipment control, characterized in that: The substrate comprises: a processing unit configured to execute various processes; a storage unit configured to store various data; A signal line, used for signal transmission between the processing unit and the storage unit; a cutting unit capable of cutting the signal line; a connecting portion capable of connecting a portion of the signal line closer to the storage portion than the cutting portion to the outside, In the substrate before replacement, in a state in which the signal line is cut off by the cutting portion, the storage portion of the substrate before replacement is connected to the processing portion of the substrate after replacement via the connecting portion of the substrate before replacement. In this connection state, the processing portion of the substrate after replacement performs data transmission processing, reads the data stored in the storage portion of the substrate before replacement via the connecting portion of the substrate before replacement, and stores it in the storage portion of the substrate after replacement.

12. The circuit board replacement system according to any one of claims 9 to 11, characterized in that: When the operation unit of the replaced substrate is operated, the processing unit of the replaced substrate starts the data transfer process.

13. The circuit board replacement system according to any one of claims 9 to 11, characterized in that: In a state where power is turned on to the replaced substrate and where data transmission from the storage unit of the substrate before replacement to the storage unit of the replaced substrate is in an incomplete state, if the storage unit of the substrate before replacement is connected to the processing unit of the replaced substrate via the connecting unit of the substrate before replacement in a state where the cutting unit in the substrate before replacement is cut off, the processing unit of the replaced substrate starts the data transmission processing.

14. The circuit substrate replacement system according to claim 9, wherein: The power supply line has a portion connecting the processing unit and the connection unit and a portion connecting the storage unit and the connection unit, and the cutting portion is provided at the portion connecting the processing unit and the connection unit. The signal line includes a portion connecting the processing unit and the connection unit and a portion connecting the storage unit and the connection unit, and the cutoff portion is provided at the portion connecting the processing unit and the connection unit.

15. A circuit substrate replacement method, which is a method for replacing a circuit substrate for device control, characterized in that: The substrate comprises: a processing unit configured to execute various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; A signal line, used for signal transmission between the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit and the signal line; a connecting portion capable of connecting a portion of the power supply line closer to the storage portion than the cutoff portion and a portion of the signal line closer to the storage portion than the cutoff portion to the outside, In the substrate before replacement, in a state where the portion of the power supply line that supplies power to the storage unit and the signal line are cut off by the cutting portion, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connecting portion of the substrate before replacement. In this connection state, data transmission processing is performed using the processing unit of the substrate after replacement, and data stored in the storage unit of the substrate before replacement is read via the connecting portion of the substrate before replacement and stored in the storage unit of the substrate after replacement.

16. A circuit substrate replacement method, which is a method for replacing a circuit substrate for device control, characterized in that: The substrate comprises: a processing unit configured to execute various processes; a storage unit configured to store various data; a power supply line for supplying power to the processing unit and the storage unit; a cut-off unit capable of cutting off a portion of the power supply line that supplies power to the storage unit; a connecting portion capable of connecting a portion of the power supply line closer to the storage portion than the cutting portion to the outside, In the substrate before replacement, in a state where the portion of the power supply line that supplies power to the storage unit is cut off by the cutting portion, the storage unit of the substrate before replacement is connected to the processing unit of the substrate after replacement via the connecting portion of the substrate before replacement. In this connection state, data transmission processing is performed using the processing unit of the substrate after replacement, and data stored in the storage unit of the substrate before replacement is read via the connecting portion of the substrate before replacement and stored in the storage unit of the substrate after replacement.

17. A method for replacing a circuit substrate, which is a method for replacing a circuit substrate for controlling a device, characterized in that: The substrate comprises: a processing unit configured to execute various processes; a storage unit configured to store various data; A signal line, used for signal transmission between the processing unit and the storage unit; a cutting unit capable of cutting the signal line; a connecting portion capable of connecting a portion of the signal line closer to the storage portion than the cutting portion to the outside, In the substrate before replacement, in a state in which the signal line is cut off by the cutting portion, the storage portion of the substrate before replacement is connected to the processing portion of the substrate after replacement via the connecting portion of the substrate before replacement. In this connection state, data transmission processing is performed using the processing portion of the substrate after replacement, and data stored in the storage portion of the substrate before replacement is read via the connecting portion of the substrate before replacement and stored in the storage portion of the substrate after replacement.

18. The circuit board replacement method according to any one of claims 15 to 17, characterized in that: When the operation unit of the replaced substrate is operated, the data transfer process is started by the processing unit of the replaced substrate.

19. The circuit board replacement method according to any one of claims 15 to 17, characterized in that: In a state where power is turned on to the replaced substrate and where data transmission from the storage unit of the substrate before replacement to the storage unit of the replaced substrate is in an incomplete state, if the storage unit of the substrate before replacement is connected to the processing unit of the replaced substrate via the connecting unit of the substrate before replacement in a state where the cutting unit is cut off in the substrate before replacement, the data transmission processing is started using the processing unit of the replaced substrate.

Images