IC-type jumper package and printed circuit board equipped with same

Abstract

Disclosed are an IC-type jumper package and a printed circuit board having the same, which can greatly improve the degree of freedom of wiring design even if a single-sided printed circuit board is used. The jumper package has one or more conductive lead frames that are respectively isolated and insulated inside a molding compound composed of an epoxy resin.

Description

Technical Field

[0001] The present invention relates to an IC (integrated circuit) type jumper package and a printed circuit board on which the package is mounted, and more particularly to a jumper component that can simply insulate and cross a plurality of wirings in a printed circuit board when the wirings cross each other, without requiring separate operations, and a printed circuit board on which the component is mounted. Background Art

[0002] When manufacturing various IT equipment or electronic products, printed circuit boards (PCBs) are almost essential. In particular, the number of printed circuit boards used in large household appliances such as TVs is large and various types are used. In particular, as electronic products become more advanced, more parts are installed on printed circuit boards, and printed circuit board materials are required to be thin, flexible, and high value-added products.

[0003] On the other hand, the manufacturing cost of multi-layer printed circuit boards increases sharply compared with single-sided printed circuit boards. For example, the manufacturing cost of double-sided printed circuit boards is more than twice that of single-sided printed circuit boards, and the manufacturing cost of printed circuit boards with more than 4 layers will increase geometrically. However, in the case of gradually thinning printed circuit boards installed in large household appliances such as TVs, the thinner the thickness, the lower the manufacturing cost or the lower the purchase cost, the better, so single-sided printed circuit boards are required. However, in the case of using single-sided printed circuit boards, the wiring for electrical connection between a large number of parts becomes more complicated, so there is also a disadvantage of requiring more jumper parts for insulation between wiring. Insulated jumper parts for wiring in the past will also use resistors in the form of DIP (dual in-line package) with low values, such as resistors with a value close to 0 ohms or quadrilateral 0 ohm resistors. However, the DIP resistor has the disadvantage that the height of the parts is not high and cannot be installed on the surface of a thin printed circuit board, and the quadrilateral resistor is also installed one by one in each jumper wiring, so there is not only an increase in the working hours of the operation, but also an increase in cost. Summary of the invention

[0004] (Problems to be solved by the invention)

[0005] A technical problem to be solved by the present invention is to provide a jumper component in an IC type package to allow for more free wiring on a printed circuit board.

[0006] Another technical problem to be solved by the present invention is to provide an IC jumper package and a printed circuit board on which the package is mounted, so that when various components are mounted on the printed circuit board, various wiring jumpers can be completed through only one mounting action.

[0007] (Measures taken to solve the problem)

[0008] The present invention is characterized by an IC-type jumper package, comprising: a conductive lead frame; a molding portion, wrapping a part or all of the conductive lead frame; a contact portion, formed at two ends of the lead frame for electrical connection; wherein the contact portion protrudes downward by a predetermined distance compared to the lower surface of the molding portion, and the lead frame is formed with more than one and is separated and insulated from each other.

[0009] The present invention is characterized by a printed circuit board on which the IC jumper package is installed, wherein the IC jumper package comprises: a molded part, which includes a lead frame inside; and a contact part, which is formed at two ends of the lead frame for electrical connection; wherein the contact part protrudes downward by a predetermined distance compared to the lower surface of the molded part, and the lead frame is formed with more than one and is separated and insulated from each other. Through the contact part, a middle part of the wiring on the printed circuit board is cross-insulated from the wiring of another part and electrically connected to each other.

[0010] (Effects of the Invention)

[0011] According to an embodiment of the present invention, a jumper wire can be wired on a printed circuit board at a lower cost and with fewer operation steps.

[0012] According to an embodiment of the present invention, the wiring freedom of the printed circuit board is greatly improved, thereby providing a design that allows designers to freely jump wires without winding wires.

[0013] In addition, using a single-sided printed circuit board instead of an expensive double-sided printed circuit board can easily handle complex wiring, which is excellent in terms of cost saving.

[0014] In addition, since complex wiring can be handled using only one side of the printed circuit board, it is suitable for display screens and TVs that require thinness. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The IC-type jumper package of the present invention is shown mounted on a printed circuit board.

[0016] Figure 2 This is an embodiment of the present invention.

[0017] Figure 3 It is another embodiment of the present invention.

[0018] Figure 4 This is another embodiment of the present invention.

[0019] Figure 5 An embodiment of connecting a ground line or a power jumper is shown.

[0020] Figure 6 FIG. 1 is an example of a jumper that can be implemented in various forms.

[0021] Figure 7 This is an embodiment in which the protruding contact portion is formed into a flat shape.

[0022] Figure 8 This is an embodiment in which the protruding contact portion is in a spherical shape or has an additional spherical shape.

[0023] Fig. 9 Diagram illustrating the routing freedom afforded by various jumper package sizes. DETAILED DESCRIPTION

[0024] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those having ordinary knowledge in the technical field to which the present invention belongs can easily implement the present invention. The same reference numerals in the reference numerals shown in the various drawings represent the same components.

[0025] In the description of the present invention, if it is judged that the detailed description of the related known technology may make the key points of the present invention unclear, the detailed description will be omitted.

[0026] The terms “first”, “second”, etc. may be used to describe various components, but the components are not limited by the terms, and the terms are used only for the purpose of distinguishing one component from another.

[0027] Figure 1 FIG. 2 shows a cross section of a jumper package 100 of the present invention mounted on a printed circuit board 200. Figure 1, describing an embodiment of the present invention. The jumper package 100 of the present invention is composed of a molded portion 110, a lead frame 120 and contact portions 131, 133. The lead frame 120 is wrapped by the molded portion 110, and the contact portions 131, 133 are exposed or protruded outside the molded portion 110 for the purpose of electrical connection with the printed circuit board 200. The molded portion 110 can be made of various materials. In terms of cost, a molded composite material composed of epoxy resin is preferred, and ceramic materials can sometimes be used. The lead frame 120 wrapped by the molded portion 110 is composed of the material mainly used in plastic packaged ICs, that is, a metal material or alloy material including iron, copper, etc. with excellent electrical and thermal conductivity. The lead frame 120 extends to the outside of the molded portion 110 and is exposed or protruded to form the contact portions 131, 133. The contact portion is parallel to the bottom surface of the molded portion 110 or protrudes a predetermined distance (d) from the bottom surface before it can be soldered and mounted on the printed circuit board 200. When used as a jumper, it is spaced apart from the crossed wiring due to the height difference, which can maintain the insulation distance when the component of the present invention performs the jumper function. The contact portion can be formed by extending the lead frame, and various metal materials can be coated as needed, so it can include the material of the lead frame. Various wirings are crossed on the printed circuit board 200. These wirings are patterned with ordinary copper foil, but can also be formed with conductive materials as needed. The jumper package 100 of the present invention crosses and crosses a part of the wiring 211, 213, 215 in the middle of these wirings to electrically connect the other part of the wiring 217, 219 to complete the jumper function.

[0028] The jumper package 100 of the present invention has various advantages. For example, the technology of wrapping the lead frame 120 with a non-conductive resin, such as an epoxy resin mold frame, has been established as a subsequent process technology for packaging semiconductor chips. Therefore, when used for complex wiring jumpers, there is no need to develop equipment or packaging technology separately. Instead, the present invention can directly use existing technology by changing the concept, thereby greatly reducing development costs.

[0029] Figures 2 to 4As a top view and a cross-sectional view of the jumper package 100 of the present invention, the situation of 3 groups of jumpers, the situation of 4 groups of jumpers and the situation of 5 groups of jumpers are respectively shown. It can be known from these drawings that the jumper package 100 of the present invention can be built with multiple jumpers according to the number of internal lead frames, so when it is installed on the printed circuit board, only one installation process can be used to perform wiring jumpers equivalent to the number of lead frames. Therefore, compared with using individual jumper resistors, the process steps of the jumper operation are reduced to once, so it has the advantages of improving productivity and saving costs. For this advantage, because the number of printed circuit boards used in gradually larger display screens or TVs continues to increase, the effect of this advantage is more apparent. Even in some models of recent large display screens, the number of wirings that need to use jumpers is more than hundreds, so the advantages of the present invention are more apparent.

[0030] In addition, when a power line or ground line with large current is connected by jumper, Figure 5 As in the embodiment of the present invention shown, more than two jumpers are connected simultaneously, thereby also having the advantage of reducing the heat generated by the voltage drop (IR Drop) or ohmic resistance on the power line pattern or the ground line pattern.

[0031] The jumper package of the present invention is not only used in the case of wiring of a linear simple jumper printed circuit board, but can also be used in a variety of ways. For example, Figure 6 As shown, it can also be flexibly used for "T"-shaped wiring connection. Figure 6 The embodiment shows that, in the jumper groups using four lead frames 120 respectively, three signal lines are respectively formed into a "T" shape through three jumper groups located on the right side and connected by upper and lower jumpers, and dotted lines are artificially added in the figure for easy identification. Therefore, it can be seen from this embodiment that even if multiple wirings pass through the lower part of the jumper package of the present invention or wirings of various shapes connected by jumpers, there is no need to specially change or wrap the wiring design, and the jumper package of the present invention can be flexibly used.

[0032] Generally, the size of the jumper package of the present invention is several millimeters to several tens of millimeters, which is suitable for installation on a thin printed circuit board, and the size of the contact parts 131 and 133 is also suitable to be in the range of several tens of millimeters to several hundred millimeters. However, the wiring of the printed circuit board has various thicknesses and spacings, so the size of the jumper package of the present invention, the size and spacing of each jumper pin can also be variously modified.

[0033] In addition, the package jumper of the present invention is preferably in the same shape as the IC, and is therefore mainly manufactured in a quadrilateral shape, which can be more conveniently used in processes such as surface mounting.

[0034] In order to mount on a printed circuit board, rather than penetrate through, it is more advantageous for the contact portions 131, 133 to be parallel to the bottom surface of the molded portion or to protrude downward more than the bottom surface. Figure 1 As shown, it can also protrude toward the outer peripheral surface of the molded portion, such as Figures 2 to 4 As shown, it can also be formed into a shape that protrudes downward toward the bottom surface of the molded portion.

[0035] If necessary, Figure 8 As shown, the contact parts 131, 133 protruding below the bottom surface of the molded part can also be formed in a spherical shape, or although not shown in detail, a spherical shape or a flat shape can be attached.

[0036] The jumper package of the present invention can be made into various sizes. Fig. 9 The example shows that the wiring of the printed circuit board can be more diversely and freely configured by using the relatively large jumper package 100a and the relatively small jumper packages 100b and 100c. Not only can various signal lines, power lines and ground lines be connected by jumpers through the large jumper package 100a, but signal lines, ground lines and power lines can also be connected by jumpers through the small jumper packages 100b and 100c after passing under the large jumper package 100a.

[0037] As described above, when the jumper package of the present invention is used, the degree of freedom in wiring of the printed circuit board is greatly improved, and the advantage of providing a design that allows designers to freely jump the wires without the need for winding wires is provided.

[0038] In addition, since the degree of freedom in wiring design is increased, a single-sided printed circuit board can be used instead of an expensive double-sided printed circuit board, and complex wiring can be easily handled, which has an excellent effect in terms of cost saving.

[0039] In addition, since complex wiring can be handled using only one side of the printed circuit board, it is suitable for thin displays and TVs.

[0040] The present invention is described with reference to the embodiments shown in the drawings, but this is only exemplary, and a person with ordinary knowledge in the relevant technical field can understand that various modifications and other equivalent embodiments can be made therefrom. Therefore, the true technical protection scope of the present invention should be defined by the technical ideas of the claims.

Claims

1. An IC jumper package, comprising: a plurality of conductive lead frames; a molding portion, wrapping at least a portion of the conductive lead frame; and Contact portions formed at both ends of the lead frame for electrical connection and exposed or protruding outside the molded portion; The lead frames are separated and insulated from each other within the molded portion.

2. The IC jumper package according to claim 1, characterized in that: The contact portion is parallel to the lower surface of the molding portion or protrudes downward by a predetermined distance compared to the lower surface of the molding portion.

3. The IC jumper package according to claim 1, characterized in that: The molded part is a mold compound composed of a non-conductive resin.

4. The IC jumper package according to claim 1, characterized in that: The exposure or protrusion of the contact portion is exposure or protrusion toward the outside of the outer peripheral surface of the molding portion.

5. The IC jumper package according to claim 4, characterized in that: The contact portion is formed in a flat shape on the bottom surface of the mold portion.

6. The IC jumper package according to claim 1, characterized in that: The contact portion includes the same conductive metal material as the lead frame.

7. The IC jumper package according to claim 1, characterized in that: The contact portion is a conductive metal material with a spherical or flat shape attached thereto.

8. The IC jumper package according to claim 1, characterized in that: The molded portion is formed in a quadrilateral shape.

9. The IC jumper package according to claim 1, characterized in that: A "T"-shaped jumper connection can be achieved through the contact portion.

10. A printed circuit board mounted with the IC type jumper package, characterized in that: a plurality of conductive lead frames; a molding portion encapsulating at least a portion of the conductive lead frame; and Contact portions formed at both ends of the lead frame for electrical connection and exposed or protruding outside the molded portion; The lead frames are separated and insulated from each other in the molded part; Through the contact portion, a portion of the wiring on the printed circuit board is electrically connected to the wiring of another portion while being cross-insulated.

11. The printed circuit board for mounting the IC type jumper package according to claim 10, characterized in that: The contact portion is parallel to the lower surface of the molding portion or protrudes downward by a predetermined distance compared to the lower surface of the molding portion.

12. The printed circuit board for mounting the IC type jumper package according to claim 10, characterized in that: The molded part is a mold compound composed of a non-conductive resin.

13. The printed circuit board for mounting the IC type jumper package according to claim 10, characterized in that: The exposure or protrusion of the contact portion is exposure or protrusion toward the outside of the outer peripheral surface of the molding portion.

14. The printed circuit board for mounting the IC type jumper package according to claim 13, characterized in that: The contact portion is formed in a flat shape on the bottom surface of the mold portion.

15. The printed circuit board for mounting the IC type jumper package according to claim 10, characterized in that: The contact portion includes the same conductive metal material as the lead frame.

16. The printed circuit board for mounting the IC type jumper package according to claim 10, characterized in that: The contact portion is a conductive metal material with a spherical or flat shape attached thereto.

17. The printed circuit board for mounting the IC-type jumper package according to claim 10, characterized in that: The molded portion is formed in a quadrilateral shape.

18. The printed circuit board for mounting the IC type jumper package according to claim 10, characterized in that: The printed circuit board is mounted with two or more of the IC-type jumper packages.

19. The printed circuit board for mounting the IC type jumper package according to claim 18, characterized in that: The sizes of the IC type jumper packages are different from each other.

20. The printed circuit board for mounting the IC type jumper package according to claim 10, characterized in that: A "T"-shaped jumper connection can be achieved through the contact portion.

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