Radiator structure

Abstract

A heat sink structure according to the present invention comprises: a cover plate on one surface of which a printed circuit board having a heat-generating element is mounted, the cover plate receiving heat from the heat-generating element; the inner space of the radiator main body part is divided into an accommodating space and a refrigerant chamber by the cover plate, the printed circuit board is accommodated in the accommodating space, and the refrigerant chamber is filled with a refrigerant; wherein a plurality of refrigerant condensation grooves are formed in at least one surface of the refrigerant chamber, and the gaseous refrigerant which exchanges heat with the cover plate flows in the plurality of refrigerant condensation grooves and is condensed at the same time. Accordingly, the gas refrigerant which exchanges heat with the heat generated from the heat generating element is quickly condensed, and thus the heat generated from the heat generating element can be quickly dissipated.

Description

Technical Field

[0001] The present invention relates to a heat sink structure, and more particularly, to a heat sink structure for dissipating heat generated from a heat source such as an antenna element mounted on a printed circuit board. Background Art

[0002] Wireless communication technology, for example, Multiple Input Multiple Output (MIMO) technology is a technology that uses multiple antennas to significantly increase data transmission capacity. It is a spatial multiplexing technique in which different data is transmitted through each transmitting antenna in the transmitter and the transmitted data is distinguished by appropriate signal processing in the receiver.

[0003] Therefore, as the number of transmitting and receiving antennas increases, the channel capacity also increases, allowing more data to be transmitted. For example, if the number of antennas is increased to 10, the channel capacity can be secured approximately 10 times that of the current single-antenna system using the same frequency band.

[0004] In 4G LTE-Evolution, up to 8 antennas are used. In the current 5G stage, base station equipment with 64 or 128 antennas or more is developed, which is called massive MIMO technology. In contrast to the current two-dimensional cell operation, massive multiple-input multiple-output technology can achieve three-dimensional beamforming, so it is also called full-dimensional multiple-input multiple-output (FD-MIMO).

[0005] In massive MIMO technology, as the number of ANTs (antennas) increases, the number of transmitters and filters also increases. However, due to the rental costs or space constraints of the installation site, the reality is that RF components (antennas, filters, power amplifiers, transceivers, etc.) need to be small, lightweight, and inexpensive, so massive MIMO requires high power to expand coverage, and the power consumption and heat generated by this high power play a negative role in reducing weight and size.

[0006] In particular, when installing a MIMO antenna that is a module that combines RF devices and digital components in a stacked structure in a limited space, in order to maximize the installation convenience and space utilization, the need to compact and miniaturize the multiple layers that constitute the MIMO antenna is receiving attention. In this case, the design of a new heat dissipation structure for the heat generated by the communication components mounted on the multiple layers is required.

[0007] Korean Patent Publication No. 10-2019-0118979 (published on October 21, 2019; hereinafter referred to as "prior art") discloses a multi-input and output antenna device, which is applicable to a heat dissipation structure for compacting and miniaturizing multiple layers constituting a MIMO antenna.

[0008] The prior art includes a heat dissipation body and a plurality of unit heat dissipation bodies, wherein the heat dissipation body is provided with a heat dissipation fin protruding from the heat dissipation body, and the plurality of unit heat dissipation bodies are provided on the heat dissipation body. The plurality of unit heat dissipation bodies are configured so that one end thereof contacts the heating element of the antenna substrate, and a plurality of sub-heat dissipation fins are provided at the other end thereof to dissipate the heat conducted from the heating element to the outside.

[0009] However, the prior art is that the structure for dissipating the heat of the heating element is only a mechanical structure of an air-cooled heat dissipation structure that exchanges heat with the external air, so it is difficult to dissipate heat quickly. Moreover, more mechanical heat dissipation structures are required for rapid heat dissipation, so there is a problem of increased size. Summary of the invention

[0010] (Problem to be solved)

[0011] The problem to be solved by the present invention is to provide a radiator structure that quickly condenses the gaseous refrigerant that exchanges heat with the heat generated by the heating element, thereby quickly dissipating the heat generated by the heating element and improving the heat dissipation performance while minimizing the size.

[0012] The subjects of the present invention are not limited to the subjects mentioned above, and other subjects not mentioned can be clearly understood by those skilled in the art to which the present invention belongs from the following description.

[0013] (Methods to solve the problem)

[0014] In order to achieve the above-mentioned problem, the radiator structure of the present invention includes a cover plate and a radiator body. A printed circuit board having a heating element is mounted on one side of the cover plate. The cover plate receives heat from the heating element. The internal space of the radiator body is divided into a storage space and a refrigerant chamber by the cover plate. The storage space is used to store the printed circuit board. The refrigerant chamber is filled with refrigerant. A plurality of refrigerant condensation grooves are formed on at least one side of the refrigerant chamber. The gaseous refrigerant that exchanges heat with the cover plate flows through the plurality of refrigerant condensation grooves while the gaseous refrigerant condenses.

[0015] The plurality of refrigerant condensation grooves may be formed on a surface of the refrigerant chamber that faces the other surface of the cover plate.

[0016] The cover plate may be composed of a first cover portion and a second cover portion. The first cover portion may be a portion corresponding to the heating element. The second cover portion may be extended from one side of the first cover portion. The plurality of refrigerant condensation grooves may be formed in a portion corresponding to the second cover portion.

[0017] A plurality of heat exchange grooves may be formed on a surface of the first cover portion facing the refrigerant chamber, and the plurality of heat exchange grooves may perform heat exchange with the refrigerant.

[0018] The width of the refrigerant chamber may be smaller than the width of the accommodation space. The cover plate may cover one side of an opening in the refrigerant chamber that is communicated with the accommodation space.

[0019] The surface facing the other surface of the cover plate in the refrigerant chamber may be composed of a first facing surface and a second facing surface. The first facing surface may face the first cover portion. The second facing surface may face the second cover portion. The plurality of refrigerant condensation grooves may be formed on the second facing surface. The plurality of refrigerant condensation grooves may be formed as an inclined portion on one side facing the first facing surface.

[0020] The inclined portion may be formed of a plurality of first step portions.

[0021] A second step portion may be formed on the frame of the refrigerant chamber. The frame of the cover plate may be mounted on the second step portion. The other surface of the cover plate may be spaced from a surface facing the other surface of the cover plate in the refrigerant chamber.

[0022] A third step portion may be formed on the frame of the cover plate, and the third step portion may be mounted on the second step portion.

[0023] A plurality of support protrusions may be formed on the other surface of the cover plate. The plurality of support protrusions may support the other surface of the cover plate so as to be spaced apart from a surface facing the other surface of the cover plate in the refrigerant chamber.

[0024] A plurality of supporting grooves may be formed on a surface of the refrigerant chamber facing the other surface of the cover plate, and the plurality of supporting protrusions may be respectively inserted into the plurality of supporting grooves.

[0025] A plurality of mounting grooves may be formed on one side of the cover plate, the printed circuit board may be mounted in the plurality of mounting grooves, and the plurality of mounting grooves may extend toward the inside of the plurality of supporting protrusions, respectively.

[0026] A plurality of welding grooves may be formed in the outer side surface of the heat sink body at a portion corresponding to the plurality of support protrusions. The plurality of welding grooves may be used to laser weld the plurality of support protrusions to the heat sink body, respectively.

[0027] A plurality of welding point protrusions may be formed on the outer side surface of the heat sink body, and the plurality of welding grooves may be formed on the plurality of welding point protrusions, respectively.

[0028] A plurality of welding joints may be formed protrudingly on the outer side of the heat sink body. The ends of a plurality of heat sinks may be respectively joined at the plurality of welding joints by laser welding. The plurality of welding joints may be formed extending in the width direction of the refrigerant chamber. The plurality of welding point protrusions may extend from one side of the plurality of welding joints.

[0029] Specific items of other embodiments are included in the detailed description and drawings.

[0030] (Effects of the Invention)

[0031] The radiator structure of the present invention is that a plurality of refrigerant condensation grooves are formed on at least one side of the refrigerant chamber. The plurality of refrigerant condensation grooves are used to allow the gaseous refrigerant for heat exchange with the cover plate to pass through while condensing the gaseous refrigerant. Therefore, the gaseous refrigerant can be quickly condensed, and the heat generated by the heating element can be quickly dissipated. The size can be minimized while also improving the heat dissipation performance.

[0032] The effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned can be clearly understood by those skilled in the art from the description of the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a perspective view showing a heat sink structure according to the present invention;

[0034] Figure 2 yes Figure 1 Exploded stereogram of

[0035] Figure 3 It is shown Figure 2 A bottom three-dimensional view and a partially enlarged view of the cover plate;

[0036] Figure 4 It is shown Figure 2 A cutaway stereogram and a partially enlarged diagram of a cover plate;

[0037] Figure 5 It is shown Figure 2 A cutaway perspective view and a partially enlarged view of the main body of the radiator;

[0038] Figure 6 It is shown Figure 2 A bottom perspective view and a partially enlarged view of the main body of the radiator;

[0039] Figure 7 is a side sectional view of a heat sink structure in a combined state according to an embodiment of the present invention.

[0040] (Explanation of Reference Numerals)

[0041] 100: Cover plate 106: Third step

[0042] 110: first cover part 120: second cover part

[0043] 131, 132: Support protrusions 141, 142: Mounting grooves

[0044] 150: heat exchange tank 200: radiator body

[0045] 210: Accommodation space 220: Refrigerant chamber

[0046] 221: first facing surface 222: second facing surface

[0047] 226: second step 231, 232: support groove

[0048] 250: Refrigerant condensation tank 255: Inclined portion

[0049] 255A: First step 271, 272: Welding point protrusions

[0050] 281, 282: Welding slot DETAILED DESCRIPTION

[0051] Hereinafter, a heat sink structure according to an embodiment of the present invention will be described with reference to the accompanying drawings.

[0052] Figure 1 is a perspective view showing a heat sink structure according to the present invention; Figure 2 yes Figure 1 Exploded three-dimensional diagram.

[0053] In the following description, one side may be Figure 1 and Figure 2 The upper side is shown in the drawings, and the other side may be Figure 1 and Figure 2 The following is shown in the drawings.

[0054] Reference Figure 1 and Figure 2 The heat sink structure according to the embodiment of the present invention may include a cover plate 100 and a heat sink body 200 .

[0055] A printed circuit board (not shown) having a heating element may be mounted on one side of the cover plate 100 .

[0056] The heating element may be a component mounted on the printed circuit board to generate heat. The heating element may include an electronic component that generates predetermined heat while supplying power for driving. For example, the heating element may be an Rx and Tx element responsible for outputting and transmitting signals in an antenna device.

[0057] Since the printed circuit board is mounted on one side of the cover plate 100 , the heat generated by the heating element can be transferred to the cover plate 100 , and the cover plate 100 can receive the heat of the heating element.

[0058] The cover plate 100 may be made of aluminum or aluminum alloy, or may be made of any other known metal material having excellent heat dissipation performance.

[0059] The heat sink body 200 may have an internal space. The heat sink body 200 may be a part of a housing having a sealed internal space. The internal space of the heat sink body 200 may be open on one side. The heat sink body 200 is generally formed in a hexahedron shape and one side may be open. The internal space of the heat sink body 200 is also formed in a hexahedron shape and one side may be open.

[0060] The internal space of the heat sink body 200 can be divided into a storage space 210 and a refrigerant chamber 220 by the cover plate 100. That is, the cover plate 100 is disposed inside the heat sink body 200, and the internal space of the heat sink body 200 can be divided into the storage space 210 and the refrigerant chamber 220. Here, the storage space 210 can be a space for storing the printed circuit board, and the refrigerant chamber 220 can be a space filled with refrigerant.

[0061] When the cover plate 100 divides the internal space of the heat sink body 200 into the storage space 210 and the refrigerant chamber 220 , the storage space 210 may be a space disposed on one side of the cover plate 100 , and the refrigerant chamber 220 may be a space disposed on the other side of the cover plate 100 .

[0062] The refrigerant chamber 220 may be formed on the bottom surface of the storage space 210. However, the refrigerant chamber 220 is not necessarily formed on the bottom surface of the storage space 210, but may be formed on the bottom surface and at least one of the four side surfaces of the storage space 210. A plurality of refrigerant chambers 220 may also be formed, in which case the cover plate 100 is composed of a plurality of cover plates 100, and the plurality of cover plates 100 may respectively partition the plurality of refrigerant chambers 220 in the storage space 210.

[0063] The width of the refrigerant chamber 220 may be smaller than the width of the accommodation space 210. The cover plate 100 may cover one side of the opening in the refrigerant chamber 220 that communicates with the accommodation space 210. The cover plate 100 covers one side of the opening of the refrigerant chamber 220, and the internal space of the heat sink body 200 may be divided into the accommodation space 210 and the refrigerant chamber 220.

[0064] However, the width of the refrigerant chamber 220 does not necessarily have to be smaller than the width of the accommodating space 210, but can also be the same as or larger than the width of the accommodating space 210. In this case, the cover plate 100 can also divide the internal space of the radiator body 200 into the accommodating space 210 and the refrigerant chamber 220.

[0065] The cover plate 100 may include a first cover portion 110 and a second cover portion 120 .

[0066] The width of the first cover portion 110 may be smaller than the width of the second cover portion 120, and the width of the second cover portion 120 may be greater than the width of the first cover portion 110. The length of the first cover portion 110 may be the same as the length of the second cover portion 120.

[0067] The first cover 110 may be a portion corresponding to the heating element. That is, a portion of the printed circuit board where the heating element is installed is installed on one side of the first cover 110, and the first cover 110 may receive heat from the heating element. The printed circuit board may be formed to have the same size as one side of the cover 100 or a size larger than one side of the cover 100, and may be installed on the entire side of the cover 100. In this case, the heating element may be installed on the portion of the printed circuit board installed on the first cover 110, and may not be installed on the portion of the printed circuit board installed on the second cover 120. Alternatively, the printed circuit board may be formed to have a size smaller than one side of the cover 100, and may be installed on one side of the first cover 110, and may not be installed on one side of the second cover 120.

[0068] The second cover 120 may extend from one side of the first cover 110. The first cover 110 may be formed in a plate shape forming one side of the cover 100, and the second cover 120 may be formed in a plate shape forming the remaining portion of the cover 100, that is, the other side.

[0069] The heat sink body 200 is made of aluminum or aluminum alloy material, and may also be made of various known metal materials having excellent heat dissipation performance.

[0070] The bottom surface of the refrigerant chamber 220 may include a first facing surface 221 and a second facing surface 222. The bottom surface of the refrigerant chamber 220 may be a surface facing the other surface of the cover plate 100. Here, the first facing surface 221 may face the first cover portion 110 of the cover plate 100, and the second facing surface 222 may face the second cover portion 120 of the cover plate 100.

[0071] The width of the first facing surface 221 may be smaller than the width of the second facing surface 222, and the width of the second facing surface 222 may be larger than the width of the first facing surface 221. The length of the first facing surface 221 may be the same as the length of the second facing surface 222.

[0072] The width of the first facing surface 221 may be the same as the width of the first cover portion 110, and the length of the first facing surface 221 may be the same as the length of the first cover portion 110. The width of the second facing surface 222 may be the same as the width of the second cover portion 120, and the length of the second facing surface 222 may be the same as the length of the second cover portion 120.

[0073] A plurality of refrigerant condensation grooves 250 may be formed on the second facing surface 222 of the refrigerant chamber 220. However, the plurality of refrigerant condensation grooves 250 are not necessarily formed on the second facing surface 222 of the refrigerant chamber 220, but may be formed on at least one of the bottom surface and four side surfaces of the refrigerant chamber 220. That is, the plurality of refrigerant condensation grooves 250 may be formed on at least one surface of the refrigerant chamber 220.

[0074] A plurality of refrigerant condensation grooves 250 may be formed on a surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100 .

[0075] A plurality of refrigerant condensation grooves 250 may be formed at a portion corresponding to the second cover portion 120 of the cover plate 100 .

[0076] The gaseous refrigerant can be condensed while flowing in the plurality of refrigerant condensation grooves 250 and exchanging heat with the cover plate 100. However, in the present embodiment, since the plurality of refrigerant condensation grooves 250 are formed on the second facing surface 222, the gaseous refrigerant can be condensed while flowing in the plurality of refrigerant condensation grooves 250 and exchanging heat with the first cover portion 110 on the first facing surface 221 and then flowing toward the second facing surface 222.

[0077] The plurality of refrigerant condensation grooves 250 may be formed to extend in the width direction of the cover plate 100. The plurality of refrigerant condensation grooves 250 may be formed to extend in the direction in which the first cover portion 110 and the second cover portion 120 are arranged. The plurality of refrigerant condensation grooves 250 may be formed to extend in the width direction of the refrigerant chamber 220. The plurality of refrigerant condensation grooves 250 may be formed to extend in the direction in which the first facing surface 221 and the second facing surface 222 are arranged.

[0078] Figure 3 It is shown Figure 2 A three-dimensional view of the bottom surface of the cover plate and a partially enlarged view; Figure 4 It is shown Figure 2 A cutaway stereogram and a partially enlarged diagram of a cover plate; Figure 5 It is shown Figure 2 A cutaway perspective view and a partially enlarged view of the main body of the radiator; Figure 6 It is shown Figure 2 A bottom perspective view and a partially enlarged view of the main body of the radiator; Figure 7 is a side sectional view of a heat sink structure in a combined state according to an embodiment of the present invention.

[0079] Reference Figures 2 to 7 A plurality of heat exchange grooves 150 may be formed on the other side of the first cover 110, and the plurality of heat exchange grooves 150 perform heat exchange with the refrigerant. Here, the other side of the first cover 110 may be a side facing the refrigerant chamber 220. That is, a plurality of heat exchange grooves 150 for performing heat exchange with the refrigerant may be formed on the side facing the refrigerant chamber 220 in the first cover 110.

[0080] The plurality of heat exchange tanks 150 may be formed in a circular shape. However, the plurality of heat exchange tanks 150 may also be formed in a polygonal shape such as a triangle or a quadrilateral.

[0081] As for the cover plate 100, since the shape of the part on which the component is mounted should be changed according to the shape of the component mounted on the printed circuit board, the thickness of the cover plate 100 has to be increased. In this way, when the cover plate 100 is formed to be thicker, the heat of the heating element mounted on the printed circuit board cannot be quickly transferred to the refrigerant chamber 220 through the cover plate 100 due to the thickness of the cover plate 100. Even if the cover plate 100 is formed to be thicker, since the first cover portion 110 is formed with a plurality of heat exchange grooves 150, the contact area with the refrigerant located on the first facing surface 221 can be enlarged. Therefore, the heat of the heating element mounted on the printed circuit board is quickly transferred to the refrigerant in the refrigerant chamber 220 through the first cover portion 110, and heat exchange can be performed with the refrigerant.

[0082] The plurality of refrigerant condensation grooves 250 may have a side facing the first facing surface 221 formed as an inclined portion 255. The refrigerant exchanging heat with the heat of the heating element through the first cover 110 in the first facing surface 221 can easily flow through the plurality of refrigerant condensation grooves 250 through the inclined portions 255 formed in the plurality of refrigerant condensation grooves 250.

[0083] The inclined portion 255 may be formed of a plurality of first stepped portions 255A. The plurality of first stepped portions 255A may expand a contact area with the refrigerant located in the plurality of refrigerant condensation grooves 250, thereby rapidly condensing the refrigerant.

[0084] A second step portion 226 may be formed on the frame of the refrigerant chamber 220. The frame of the cover plate 100 is mounted on the second step portion 226, and the other side of the cover plate 100 may be spaced from the side of the refrigerant chamber 220 facing the other side of the cover plate 100. That is, the cover plate 100 may be configured such that the side facing the bottom of the refrigerant chamber 220 may be spaced from the bottom of the refrigerant chamber 220. The second step portion 226 increases the contact area with the frame of the cover plate 100, thereby allowing the heat of the heating element to be transferred to the second step portion 226 as much as possible through the frame of the cover plate 100.

[0085] A third step portion 106 may be formed on the frame of the cover plate 100, and the third step portion 106 is installed on the second step portion 226 of the refrigerant chamber 220. The third step portion 106 increases the contact area with the second step portion 226, so that the heat of the heating element can be transferred to the second step portion 226 as much as possible through the third step portion 106 of the cover plate 100.

[0086] A plurality of support protrusions 131 and 132 may be formed on the other surface of the cover plate 100. The plurality of support protrusions 131 and 132 may support the other surface of the cover plate 100 to be spaced from the surface of the refrigerant chamber 220 that faces the other surface of the cover plate 100. The plurality of support protrusions 131 and 132 may be formed on a surface of the cover plate 100 that faces the bottom surface of the refrigerant chamber 220, and may support a surface of the cover plate 100 that faces the bottom surface of the refrigerant chamber 220 to be spaced from the bottom surface of the refrigerant chamber 220.

[0087] The plurality of support protrusions 131 and 132 may include a plurality of first support protrusions 131 formed on the other surface of the first cover portion 110 and a plurality of second support protrusions 132 formed on the other surface of the second cover portion 120 .

[0088] The plurality of first support protrusions 131 may be formed on a surface of the first cover portion 110 facing the first facing surface 221 , and the plurality of second support protrusions 132 may be formed on a surface of the second cover portion 120 facing the second facing surface 222 .

[0089] The plurality of first support protrusions 131 may be arranged in two rows in the width direction of the first cover portion 110 , and the plurality of second support protrusions 132 may be arranged in three rows in the width direction of the second cover portion 120 .

[0090] The plurality of first support protrusions 131 and the plurality of second support protrusions 132 may be formed in the same shape. However, the plurality of first support protrusions 131 and the plurality of second support protrusions 132 may also be formed in mutually different shapes. In the present embodiment, the plurality of first support protrusions 131 and the plurality of second support protrusions 132 may be formed in the same circular shape, or may also be formed in a polygonal shape such as a triangle or a quadrilateral.

[0091] Then, a plurality of support grooves 231, 232 may be formed in the refrigerant chamber 220 on the surface facing the other surface of the cover plate 100, and the plurality of support protrusions 131, 132 may be respectively inserted into the plurality of support grooves 231, 232. The plurality of support grooves 231, 232 are formed on the bottom surface of the refrigerant chamber 220, and the ends of the plurality of support protrusions 131, 132 may be respectively inserted into the plurality of support grooves 231, 232.

[0092] The plurality of supporting grooves 231 , 232 may include a plurality of first supporting grooves 231 and a plurality of second supporting grooves 232 . The first supporting grooves 231 are formed on the first facing surface 221 , and the second supporting grooves 232 are formed on the second facing surface 222 .

[0093] The ends of the first supporting protrusions 131 may be respectively inserted into the first supporting grooves 231 , and the ends of the second supporting protrusions 132 may be respectively inserted into the second supporting grooves 232 .

[0094] A plurality of first supporting grooves 231 may be formed on one side of the refrigerant chamber 220 facing the other side of the first cover 110 , and a plurality of second supporting grooves 232 may be formed on one side of the refrigerant chamber 220 facing the other side of the second cover 120 .

[0095] The plurality of first support grooves 231 may be formed at positions corresponding to the plurality of first support protrusions 131, respectively, and the plurality of second support grooves 232 may be formed at positions corresponding to the plurality of second support protrusions 132, respectively. That is, the plurality of first support grooves 231 may be arranged in two rows in the width direction of the first facing surface 221, and the plurality of second support grooves 232 may be arranged in three rows in the width direction of the second facing surface 222.

[0096] The plurality of first support grooves 231 and the plurality of second support grooves 232 may be formed in shapes different from each other. However, the plurality of first support grooves 231 and the plurality of second support grooves 232 may also be formed in the same shape. In the present embodiment, the plurality of first support grooves 231 and the plurality of second support grooves 232 are formed in shapes different from each other, the plurality of first support grooves 231 are formed in a circular shape, and the plurality of second support grooves 232 are formed in a quadrilateral shape. However, the plurality of first support grooves 231 and the plurality of second support grooves 232 may also be formed in various shapes, such as a circular shape or a polygon such as a triangle or a quadrilateral shape.

[0097] The plurality of second supporting grooves 232 may connect a portion of the plurality of refrigerant condensation grooves 250 to each other. The depth of the plurality of second supporting grooves 232 may be the same as the maximum depth of the plurality of refrigerant condensation grooves 250.

[0098] If the refrigerant in the refrigerant chamber 220 is vaporized by heat exchange with the first cover portion 110, the pressure in the refrigerant chamber 220 increases, and the plurality of support protrusions 131, 132 are inserted into the plurality of support grooves 231, 232, thereby preventing the cover plate 100 from expanding laterally due to the increased pressure in the refrigerant chamber 220.

[0099] A plurality of mounting grooves 141 and 142 may be formed on one side of the cover plate 100. That is, in the cover plate 100, a plurality of mounting grooves 141 and 142 may be formed on one side on which the printed circuit board is mounted. The printed circuit board may be mounted on the plurality of mounting grooves 141 and 142. That is, the printed circuit board may be mounted on one side of the cover plate 100 by fastening members such as screws fastened to the plurality of mounting grooves 141 and 142.

[0100] The plurality of mounting grooves 141 and 142 may extend toward the inside of the plurality of supporting protrusions 131 and 132 , respectively. Thus, the plurality of mounting grooves 141 and 142 may be formed to have a greater depth, so that the printed circuit board may be firmly mounted on the cover plate 100 .

[0101] The plurality of mounting grooves 141 , 142 may include a plurality of first mounting grooves 141 and a plurality of second mounting grooves 142 . The plurality of first mounting grooves 141 are formed on one side of the first cover 110 , and the plurality of second mounting grooves 142 are formed on one side of the second cover 120 .

[0102] The plurality of first mounting grooves 141 may extend toward the inside of the plurality of first supporting protrusions 131 , respectively, and the plurality of second mounting grooves 142 may extend toward the inside of the plurality of second supporting protrusions 132 , respectively.

[0103] The plurality of first mounting grooves 141 may be formed at positions corresponding to the plurality of first supporting protrusions 131, and the plurality of second mounting grooves 142 may be formed at positions corresponding to the plurality of second supporting protrusions 132. That is, the plurality of first mounting grooves 141 may be arranged in two rows in the width direction of the first cover portion 110, and the plurality of second mounting grooves 142 may be arranged in three rows in the width direction of the second cover portion 120.

[0104] The plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 may be formed in the same shape. However, the plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 may also be formed in different shapes. In the present embodiment, the plurality of first mounting grooves 141 and the plurality of second mounting grooves 142 are formed in the same circular shape, or may also be formed in a polygonal shape such as a triangle or a quadrilateral.

[0105] A plurality of welding grooves 281 and 282 may be formed on the other surface of the heat sink body 200 at portions corresponding to the plurality of support protrusions 131 and 132. That is, a plurality of welding grooves 281 and 282 may be formed on the outer side surface of the heat sink body 200 at portions corresponding to the plurality of support protrusions 131 and 132.

[0106] The plurality of welding grooves 281 and 282 can be used to laser weld the plurality of support protrusions 131 and 132 to the heat sink body 200. That is, after the ends of the plurality of support protrusions 131 and 132 are brought into contact with the bottom surface of the refrigerant chamber 220, lasers are irradiated to the plurality of welding grooves 281 and 282, respectively, so that the ends of the plurality of support protrusions 131 and 132 can be laser welded to the bottom surface of the refrigerant chamber 220.

[0107] When a plurality of supporting grooves 231 , 232 are formed on a surface of the refrigerant chamber 220 facing the other surface of the cover plate 100 , a plurality of welding grooves 281 , 282 may be formed at portions corresponding to the plurality of supporting grooves 231 , 232 .

[0108] The multiple welding grooves 281, 282 may include a multiple first welding grooves 281 and a multiple second welding grooves 282, wherein the multiple first welding grooves 281 are formed in the outer side surface of the radiator main body 200 corresponding to the multiple first support protrusions 131, and the multiple second welding grooves 282 are formed in the outer side surface of the radiator main body 200 corresponding to the multiple second support protrusions 132.

[0109] When a plurality of support grooves 231, 232 are formed on the surface facing the other surface of the cover plate 100 in the refrigerant chamber 220, a plurality of first welding grooves 281 can be formed in the portion of the outer surface of the radiator main body 200 corresponding to the plurality of first support grooves 231, and a plurality of second welding grooves 282 can be formed in the portion of the outer surface of the radiator main body 200 corresponding to the plurality of second support grooves 232.

[0110] The plurality of first welding grooves 281 may be used to laser weld the plurality of first support protrusions 131 to the heat sink body 200 , and the plurality of second welding grooves 282 may be used to laser weld the plurality of second support protrusions 132 to the heat sink body 200 .

[0111] That is, after the ends of the plurality of first support protrusions 131 are brought into contact with the first facing surface 221 of the refrigerant chamber 220, lasers are irradiated to the plurality of first welding grooves 281, respectively, so that the ends of the plurality of first support protrusions 131 can be laser-welded to the first facing surface 221. Then, after the ends of the plurality of second support protrusions 132 are brought into contact with the second facing surface 222 of the refrigerant chamber 220, lasers are irradiated to the plurality of second welding grooves 282, respectively, so that the ends of the plurality of second support protrusions 132 can be laser-welded to the second facing surface 222 of the refrigerant chamber 220.

[0112] In addition, when a plurality of support grooves 231 and 232 are formed on the surface of the refrigerant chamber 220 facing the other surface of the cover plate 100, the ends of the plurality of first support protrusions 131 are respectively contacted with the plurality of first support grooves 231, and then the laser is respectively irradiated to the plurality of first welding grooves 281, and then the ends of the plurality of first support protrusions 131 can be laser-welded to the plurality of first support grooves 231. Then, the ends of the plurality of second support protrusions 132 are respectively contacted with the plurality of second support grooves 232, and then the laser is respectively irradiated to the plurality of second welding grooves 282, and then the ends of the plurality of second support protrusions 132 can be laser-welded to the plurality of second support grooves 232.

[0113] The plurality of first welding grooves 281 and the plurality of second welding grooves 282 may be formed in the same shape. However, the plurality of first welding grooves 281 and the plurality of second welding grooves 282 may also be formed in different shapes from each other. In the present embodiment, the plurality of first welding grooves 281 and the plurality of second welding grooves 282 may be formed in the same circular shape, or may be formed in a polygonal shape such as a triangle or a quadrilateral.

[0114] A plurality of welding point protrusions 271, 272 may be formed on the other side of the heat sink body 200. That is, a plurality of welding point protrusions 271, 272 may be formed on the outer side of the heat sink body 200. A plurality of welding grooves 281, 282 may be formed on the plurality of welding point protrusions 271, 272, respectively.

[0115] The plurality of welding point protrusions 271 and 272 can make it easy for the worker to see the laser welding position, thereby increasing the thickness of the heat sink body 200 and preventing the heat sink body 200 from being deformed due to the heat generated during laser welding.

[0116] The plurality of welding point protrusions 271 and 272 may include a plurality of first welding point protrusions 271 and a plurality of second welding point protrusions 272 . The plurality of first welding point protrusions 271 respectively form a plurality of first welding grooves 281 , and the plurality of second welding point protrusions 272 respectively form a plurality of second welding grooves 282 .

[0117] The plurality of first welding point protrusions 271 and the plurality of second welding point protrusions 272 may be formed in the same shape. However, the plurality of first welding point protrusions 271 and the plurality of second welding point protrusions 272 may be formed in different shapes from each other.

[0118] A plurality of welding joints 260 may be formed protrudingly on the other side of the heat sink body 200, and the plurality of welding joints 260 are respectively connected to a plurality of heat sinks (not shown) by laser welding. That is, a plurality of welding joints 260 may be formed protrudingly on the outer side of the heat sink body 200 to respectively connect the plurality of heat sinks by welding. Here, the heat sink is formed in a thin plate shape, which can ensure an area in contact with the outside air, and can be used to easily dissipate the heat of the heating element.

[0119] The plurality of welded joints 260 may be formed to extend in the width direction of the refrigerant chamber 220. The ends of the plurality of heat sinks are respectively welded to the plurality of welded joints 260 by laser welding. A plurality of welding point protrusions 271 and 272 may extend from one side of the plurality of welded joints 260.

[0120] Specifically, the plurality of welding joints 260 may include a first heat sink support portion 261 and a second heat sink support portion 262, respectively. The first heat sink support portion 261 and the second heat sink support portion 262 may be formed to extend in the width direction of the refrigerant chamber 220. The first heat sink support portion 261 and the second heat sink support portion 262 may be spaced apart from each other in the length direction of the refrigerant chamber 220. The second heat sink support portion 262 is spaced apart from the first heat sink support portion 261 in the length direction of the refrigerant chamber 220 and may be disposed opposite to the first heat sink support portion 261. After the ends of the plurality of heat sinks are respectively inserted between the spaced first heat sink support portion 261 and the second heat sink support portion 262, laser welding may be performed on at least one of the first heat sink support portion 261 and the second heat sink support portion 262.

[0121] The plurality of welding point protrusions 271 and 272 may extend from one side of the first fin supporting portion 261. However, the plurality of welding point protrusions 271 and 272 may extend from one side of any one of the first fin supporting portion 261 and the second fin supporting portion 262.

[0122] As described above, the heat sink structure according to the embodiment of the present invention is that a refrigerant chamber 220 is formed in the heat sink body 200, the refrigerant chamber 220 is covered by the cover plate 100 on which the printed circuit board is installed and filled with refrigerant, and a plurality of refrigerant condensation grooves 250 are formed on the bottom surface 222 of the refrigerant chamber 220, and the plurality of refrigerant condensation grooves 250 are used for allowing a gaseous refrigerant for heat exchange with the heat generated from the heating element installed on the printed circuit board to pass through while condensing the gaseous refrigerant, so that the gaseous refrigerant for heat exchange with the heat generated from the heating element is quickly condensed, the heat generated from the heating element can be quickly dissipated, and the heat dissipation performance is also improved while minimizing the size.

[0123] Personnel with common knowledge in the technical field to which the present invention belongs can understand that it can be implemented into other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all aspects and not restrictive. The scope of the present invention should be reflected by the scope of the claims compared to the detailed description, and should be interpreted as all changes or deformations derived from the meaning and scope of the claims and from equivalent concepts are included in the scope of the present invention.

[0124] Industrial Applicability

[0125] The present invention provides a radiator structure, which can quickly condense a gaseous refrigerant that exchanges heat with heat generated by a heating element, thereby quickly dissipating the heat generated by the heating element and improving the heat dissipation performance while minimizing the size.

Claims

1. A heat sink structure, comprising: A cover plate, on one side of which a printed circuit board with a heating element is mounted, receiving heat from the heating element; and The heat sink body has an internal space divided by the cover into a storage space and a refrigerant chamber, wherein the storage space stores the printed circuit board and the refrigerant is filled in the refrigerant chamber; A plurality of refrigerant condensation grooves are formed on at least one side of the refrigerant chamber, and the gaseous refrigerant that exchanges heat with the cover plate flows through the plurality of refrigerant condensation grooves while the gaseous refrigerant condenses.

2. The heat sink structure according to claim 1, characterized in that: The plurality of refrigerant condensation grooves are formed on a surface of the refrigerant chamber that faces the other surface of the cover plate.

3. The heat sink structure according to claim 2, characterized in that: The cover plate comprises: The first cover portion is a portion corresponding to the heating element; and A second cover portion extending from one side of the first cover portion; The plurality of refrigerant condensation grooves are formed at a portion corresponding to the second cover portion.

4. The heat sink structure according to claim 3, characterized in that: A plurality of heat exchange grooves are formed on a surface of the first cover portion that faces the refrigerant chamber, and the plurality of heat exchange grooves perform heat exchange with the refrigerant.

5. The heat sink structure according to claim 1, characterized in that: The width of the refrigerant chamber is smaller than the width of the accommodating space; The cover plate covers one side of an opening in the refrigerant chamber that is communicated with the accommodating space.

6. The heat sink structure according to claim 3, characterized in that: The surface facing the other surface of the cover plate in the refrigerant chamber includes: a first facing surface, facing the first cover portion; and a second facing surface, facing the second cover portion and forming the plurality of refrigerant condensation grooves; The plurality of refrigerant condensation grooves are formed as inclined portions on one side facing the first opposing surface.

7. The heat sink structure according to claim 6, characterized in that: The inclined portion is formed by a plurality of first step portions.

8. The heat sink structure according to claim 1, characterized in that: forming a second step portion on the frame of the refrigerant chamber; The frame of the cover plate is mounted on the second step portion, and the other surface of the cover plate is disposed at a distance from a surface of the refrigerant chamber that faces the other surface of the cover plate.

9. The heat sink structure according to claim 8, characterized in that: A third step portion is formed on the frame of the cover plate, and the third step portion is installed on the second step portion.

10. The heat sink structure according to claim 1, characterized in that: A plurality of support protrusions are formed on the other surface of the cover plate, and the plurality of support protrusions support the other surface of the cover plate so as to be spaced apart from a surface facing the other surface of the cover plate in the refrigerant chamber.

11. The heat sink structure according to claim 10, characterized in that: A plurality of support grooves are formed on a surface of the refrigerant chamber that faces the other surface of the cover plate, and the plurality of support protrusions are respectively inserted into the plurality of support grooves.

12. The heat sink structure according to claim 10, characterized in that: A plurality of mounting grooves are formed on one side of the cover plate, and the printed circuit board is mounted in the plurality of mounting grooves; The plurality of mounting grooves extend toward the inside of the plurality of supporting protrusions respectively.

13. The heat sink structure according to claim 10, characterized in that: A plurality of welding grooves are formed on the outer side surface of the heat sink body at portions corresponding to the plurality of support protrusions, and the plurality of welding grooves are used to laser weld the plurality of support protrusions to the heat sink body, respectively.

14. The heat sink structure according to claim 13, characterized in that: A plurality of welding point protrusions are also formed on the outer side surface of the heat sink main body; The plurality of welding grooves are respectively formed at the plurality of welding point protrusions.

15. The heat sink structure according to claim 14, characterized in that: A plurality of welding joints are protrudingly formed on the outer side surface of the heat sink main body, and the plurality of welding joints are respectively connected to the ends of a plurality of heat sinks by laser welding; The plurality of welded joints are formed to extend in the width direction of the refrigerant chamber; The plurality of welding point protrusions extend from one side of the plurality of welding joints.

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