Low-temperature rectifying column system and method for reducing power loss of reboiler

Abstract

The invention relates to the technical field of rectification equipment, and provides a low-temperature rectification tower system and a method for reducing power loss of a reboiler. The low-temperature rectifying tower system comprises a low-temperature rectifying tower, a reboiler, a wire, a vacuum cover and a heat conduction device. The lead is electrically connected with the reboiler so as to transmit electric energy to the reboiler; the vacuum cover is provided with a vacuum cavity, and the low-temperature rectifying tower and the reboiler are arranged in the vacuum cavity; the heat conduction device is used for transferring heat dissipated to the vacuum cavity by the wire to the low-temperature rectifying tower. According to the low-temperature rectifying tower system provided by the embodiment of the invention, heat accumulated outside the wire can be utilized and transferred to the low-temperature rectifying tower through the heat conduction device, so that the wire is promoted to transfer heat outwards to improve the heat dissipation condition of the wire, and the power loss of the wire is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of distillation equipment, and in particular to a low-temperature distillation tower system and a method for reducing reboiler power loss. Background Art

[0002] In the related art, the cryogenic distillation tower needs to maintain a stable low-temperature environment through thermal insulation measures. Usually, a vacuum cover is set on the outside of the distillation tower, and the vacuum cover is evacuated to a high vacuum degree to reduce the heat exchange between the cryogenic distillation tower and the outside. The reboiler is a heating device used to vaporize the distilled liquid of the cryogenic distillation tower, usually located at the bottom of the tower or outside the bottom of the tower. The cryogenic distillation tower and the reboiler are set underground, and the reboiler is connected to the power supply equipment located on the ground through a wire. As the use time of the reboiler increases, heat is continuously accumulated on the wire, resulting in a temperature rise and an increase in the wire resistance, resulting in a significant increase in the voltage loss and power loss of the wire. For example, the cryogenic distillation tower for the separation of low separation coefficient isotopes such as carbon and boron is as high as 100 meters. The reboiler wire located at the bottom of the tower or outside the bottom of the tower has a long power supply distance. The wire voltage drop and vacuum heat dissipation capacity drop sharply during long-distance transmission in a high vacuum, which will cause the wire heat to accumulate and cause the wire resistance to rise, and ultimately increase the wire power loss. Summary of the invention

[0003] In view of this, the embodiments of the present application are intended to provide a cryogenic distillation tower system and a method for reducing the power loss of a reboiler, which can reduce the power loss of the reboiler. The cryogenic distillation tower system comprises:

[0004] Cryogenic distillation tower;

[0005] a reboiler and a conductor, the conductor being electrically connected to the reboiler to deliver electrical energy to the reboiler;

[0006] A vacuum cover having a vacuum chamber, wherein the cryogenic distillation tower and the reboiler are arranged in the vacuum chamber;

[0007] A heat conducting device is used to transfer the heat dissipated from the wire to the vacuum chamber to the cryogenic distillation tower.

[0008] In some embodiments, the heat conducting device comprises:

[0009] The heat conducting medium has two ends connected to the cryogenic distillation tower and the conducting wire respectively.

[0010] In some embodiments, the heat conduction device further comprises:

[0011] The fixed plate is sleeved on the low-temperature distillation tower and is located between the low-temperature distillation tower and the inner wall of the vacuum cover. The heat-conducting medium is arranged on the fixed plate.

[0012] In some embodiments, the fixed plate has a limiting opening, the heat-conducting medium has a heat-conducting body and a heat-conducting ring that are connected to each other, the heat-conducting ring is arranged on the periphery of the limiting opening, the wire is passed through the limiting opening and contacts with the heat-conducting ring, and the two ends of the heat-conducting body are respectively connected to the heat-conducting ring and the low-temperature distillation tower.

[0013] In some embodiments, a plurality of the fixing plates are arranged at intervals in the up-down direction, and the heat-conducting medium is disposed on each of the fixing plates.

[0014] In some embodiments, the heat conduction device further comprises:

[0015] A clamping block connects the fixing plate and the vacuum cover so that the fixing plate and the vacuum cover are spaced apart.

[0016] In some embodiments, the heat conducting device comprises:

[0017] A reflector is disposed between the cryogenic distillation tower and the vacuum cover, and is used to reflect the heat of the wire to the cryogenic distillation tower. The wire is disposed between the reflector and the cryogenic distillation tower.

[0018] The cryogenic distillation tower system provided in the embodiment of the present application can utilize the heat accumulated outside the wire through the heat conduction device and transfer it to the cryogenic distillation tower, thereby promoting the wire to transfer heat outward to improve the heat dissipation of the wire and reduce the power loss of the wire.

[0019] The present application also provides a method for reducing the power loss of a reboiler, wherein the reboiler provides electrical energy through a wire for heat exchange with a cryogenic distillation tower, and the method comprises:

[0020] determining a heat accumulation rate under operating conditions of the conductor;

[0021] A heat transfer device is arranged according to the heat accumulation rate.

[0022] In some embodiments, the step of determining the heat accumulation rate of the conductor under working conditions includes:

[0023] determining the conductor power under the conductor operating conditions;

[0024] Determining the heat dissipation power of the vacuum chamber to the wire;

[0025] The heat accumulation rate is determined according to the wire power and the heat dissipation power.

[0026] In some embodiments, the step of determining the conductor power under the conductor working condition includes:

[0027] Obtaining the current I of the wire under working conditions;

[0028] Obtaining the resistivity ρ of the conductor under working conditions;

[0029] The conductor power Q of the conductor is calculated as follows: R Specifically, the conductor power Q is calculated according to the following functional relationship: R :

[0030]

[0031] Wherein, L represents the length of the wire, and S represents the cross-sectional area of ​​the wire.

[0032] In some embodiments, the step of determining the heat dissipation power of the vacuum chamber to the wire includes:

[0033] Obtaining a heat dissipation area A of the wire, a temperature T1 of the wire under working conditions, and a temperature T2 of the distillation tower under working conditions;

[0034] The heat dissipation power Q of the wire is calculated as follows: E Specifically, the heat dissipation power Q of the wire is calculated according to the following functional relationship: E :

[0035]

[0036] Where σ is the emissivity of the wire and ε is the Stefan-Boltzmann constant.

[0037] The method for reducing the reboiler power loss provided in the embodiment of the present application has the same beneficial effects as the above-mentioned cryogenic distillation tower system. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] Figure 1 is a schematic diagram of a cryogenic distillation tower system in one embodiment of the present application;

[0039] Figure 2 for Figure 1 The enlarged schematic diagram at A in the middle;

[0040] Figure 3 is a schematic diagram of a cryogenic distillation tower system in another embodiment of the present application;

[0041] Figure 4 It is a schematic flow chart of a method for reducing reboiler power loss in one embodiment of the present application.

[0042] Description of Reference Numerals

[0043] 100. cryogenic distillation tower system; 10. cryogenic distillation tower; 20. conducting wire; 30. vacuum cover; 40. heat conducting device; 41. heat conducting medium; 411. heat conducting body; 412. heat conducting ring; 42. fixing plate; 42a. limiting opening; 43. block; 44. reflecting plate. DETAILED DESCRIPTION

[0044] The following is a further detailed description of the implementation of the present application in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present application but cannot be used to limit the scope of the present application.

[0045] It should be noted that in the embodiments of the present application, the directions or positional relationships such as "upward and downward directions" and "circumferential directions" are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present application. The present application is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0046] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0047] In the embodiments of the present application, unless otherwise clearly specified and limited, a first feature being "on" or "below" a second feature may mean that the first feature and the second feature are in direct contact, or the first feature and the second feature are in indirect contact through an intermediate medium.

[0048] In the description of this specification, the description with reference to the terms "some embodiments", "exemplarily", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the embodiments of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine different embodiments or examples described in this application and the features of different embodiments or examples without contradiction.

[0049] In the related art, the cryogenic distillation tower and the reboiler are arranged underground, and the reboiler is located at the bottom of the tower or outside the bottom of the tower. The reboiler is connected to the power supply equipment located on the ground through a wire. As the reboiler is used for a longer time, heat is accumulated on the wire, resulting in a temperature rise and an increase in the wire resistance, which leads to a significant increase in the voltage loss and power loss of the wire.

[0050] In view of this, please refer to Figure 1-Figure 3 The embodiment of the present application provides a cryogenic distillation tower system 100, comprising a cryogenic distillation tower 10, a reboiler and a wire, a vacuum cover 30 and a heat transfer device 40. The wire 20 is electrically connected to the reboiler to transfer electric energy to the reboiler; the vacuum cover 30 has a vacuum cavity, and the cryogenic distillation tower 10 and the reboiler are arranged in the vacuum cavity; the heat transfer device 40 is used to transfer the heat dissipated from the wire 20 to the vacuum cavity to the cryogenic distillation tower 10.

[0051] The cryogenic distillation tower 10 is a device that performs distillation at low temperature, provides a low temperature environment sufficient to liquefy the material to be separated, utilizes the difference in volatility of each component in the material to be separated, and makes the gas-liquid two-phase contact and mass transfer in the low temperature environment, thereby separating the components with different boiling points in the cryogenic distillation tower 10. The reboiler is a heating device used to vaporize the distilled liquid in the cryogenic distillation tower 10. The vacuum cover 30 is used to provide a high vacuum environment to reduce heat leakage between the cryogenic distillation tower 10 and the external environment, so as to stabilize the low temperature environment and save cooling capacity.

[0052] The heat conducting device 40 is used to transfer the accumulated heat of the wire 20 to the outside, reduce the accumulated heat of the wire 20, and reduce the wire resistance increased by the temperature rise of the wire 20. The heat outside the wire 20 is utilized and transferred to the cryogenic distillation tower 10 to reduce the power loss of the wire 20.

[0053] In order to achieve the purpose of transferring the heat outside the wire 20 to the cryogenic distillation tower 10, heat transfer measures such as heat conduction or heat radiation can be used.

[0054] For some examples, see Figure 1 The heat conducting device 40 includes a heat conducting medium 41, and two ends thereof are respectively connected to the cryogenic distillation tower 10 and the conductor 20.

[0055] The heat conducting medium 41 can conduct the heat outside the wire 20 to the cryogenic distillation tower 100 through heat conduction. The material and shape of the heat conducting medium 41 are not limited, as long as it can facilitate the heat outside the wire 20 to be conducted to the cryogenic distillation tower 10. For example, the material of the heat conducting medium 41 can be set to a metal material such as copper.

[0056] Exemplarily, the heat conducting medium 41 may be configured as a heat conducting heat pipe to quickly conduct heat.

[0057] The number of heat-conducting media 41 is not limited, and one, two, or more than two heat-conducting media 41 may be provided.

[0058] Exemplarily, a plurality of heat transfer media 41 are arranged at intervals along the outer circumference of the cryogenic distillation tower 100 in the horizontal direction to form a heat transfer unit.

[0059] Exemplarily, a plurality of heat conducting units are arranged at intervals in the vertical direction.

[0060] For example, see Figure 1 The heat conducting device 40 further includes a fixing plate 42 which is sleeved on the cryogenic distillation tower 10 and located between the cryogenic distillation tower 10 and the inner wall of the vacuum cover 30 . The heat conducting medium 41 is arranged on the fixing plate 42 .

[0061] The fixing plate 42 can provide an installation position for the heat-conducting medium 41 and fix the heat-conducting medium 41. The fixing plate 42 is sleeved on the cryogenic distillation tower 10, and the vacuum cover 30 is sleeved outside the cryogenic distillation tower 10 and the fixing plate 42. Exemplarily, the cross section of the fixing plate 42 along the up-down direction is annular, and the inner periphery of the fixing plate 42 contacts the outer wall of the cryogenic distillation tower 10.

[0062] It is understandable that the number of heat-conducting media 41 disposed on each fixing plate 42 is not limited and can be adaptively disposed according to requirements. For example, the fixing plate 42 is annular, and in order to improve the heat conduction effect, multiple heat-conducting media 41 can be disposed at intervals along the circumference of the fixing plate 42.

[0063] The wire 20 passes through the fixing plate 42 and extends to the ground to be connected to the power supply device. Exemplarily, the fixing plate 42 has a limiting opening 42a, and the wire 20 passes through the limiting opening 42a and extends to the ground to be connected to the power supply device.

[0064] Exemplarily, the material of the fixing plate 42 is set to be a material with insulation and high thermal resistance, for example, the fixing plate 42 can be set to be a plastic material.

[0065] For example, see Figure 1 and Figure 2 The fixed plate 42 has a limiting opening 42a, the heat-conducting medium 41 has a heat-conducting body 411 and a heat-conducting ring 412 connected to each other, the heat-conducting ring 412 is arranged on the periphery of the limiting opening 42a, the wire 20 is passed through the limiting opening 42a and contacts with the heat-conducting ring 412, and the two ends of the heat-conducting body 411 are respectively connected to the heat-conducting ring 412 and the low-temperature distillation tower 10.

[0066] The heat conducting ring 412 is arranged on the periphery of the limiting opening 42a so that the wire 20 can contact the heat conducting ring 412 when passing through the limiting opening 42a, so that the heat conducting ring 412 can obtain the heat outside the wire 20 and conduct it to the low-temperature distillation tower 10 through the heat conducting body 411.

[0067] Exemplarily, the fixing plate 42 is in a horizontal direction, and the thickness direction is in the up-down direction.

[0068] The number of the fixing plates 42 is not limited and can be adaptively arranged according to the needs of the heat-conducting medium 41. In some embodiments, a plurality of fixing plates 42 are arranged at intervals in the vertical direction. A heat-conducting medium 41 is arranged on each fixing plate 42 to improve the utilization rate of the external heat of the wire 20, and the heat-conducting medium 41 is supported by the fixing plate 42.

[0069] In order to reduce the heat loss of the wire 20 and reduce the possibility of heat outside the wire 20 being transferred to the vacuum cover 30, in some embodiments, refer to Figure 1 The heat conducting device 40 further includes a clamping block 43, which connects the fixing plate 42 and the vacuum cover 30 so that the fixing plate 42 and the vacuum cover 30 are spaced apart.

[0070] The clamping block 43 is disposed between the fixing plate 42 and the vacuum cover 30 to prevent the fixing plate 42 from directly contacting the vacuum cover 30, thereby reducing the possibility of heat outside the wire 20 being conducted to the vacuum cover 30. Exemplarily, the outer periphery of the fixing plate 42 is fixed to the vacuum cover 30 by the clamping block 43, and the clamping block 43 can support and fix the outer periphery of the fixing plate 42.

[0071] The shape, size and number of the block 43 are not limited and can be adaptively arranged according to the fixing effect and the spacing effect between the fixing plate 42 and the vacuum cover 30 .

[0072] Exemplarily, the contact surface of the block 43 facing the vacuum cover 30 is matched with the inner wall of the vacuum cover 30, and the contact area with the vacuum cover 30 is minimized to reduce the heat transfer between the wire 20 and the vacuum cover 30; the contact surface of the block 43 facing the fixing plate 42 is matched with the outer wall of the fixing plate 42, so that the block 43 can be stably clamped between the fixing plate 42 and the vacuum cover 30. Exemplarily, the cross section of the block 43 along the up and down direction can be set to be fan-shaped.

[0073] Exemplarily, the material of the block 43 is set to be a material with insulation and high thermal resistance, for example, the block 43 can be set to be a plastic material.

[0074] For example, the blocks 43 may be arranged at intervals along the outer periphery of the fixing plate 42 and arranged in pairs on both sides of the cryogenic distillation tower 10 to improve the fixing and supporting effect of the fixing plate 42. Figure 3 The heat conducting device 40 includes a reflective plate 44 disposed between the cryogenic distillation tower 10 and the vacuum cover 30 for reflecting the heat of the wire 20 onto the cryogenic distillation tower 10 . The wire 20 is disposed between the reflective plate 44 and the cryogenic distillation tower 10 .

[0075] The reflective plate 44 can reflect the heat outside the conductor 20 to the cryogenic distillation tower 10, while reducing the cold leakage of the vacuum cover 30 to the outside. Exemplarily, the material of the reflective plate 44 is set to a material with high reflectivity, low thermal conductivity and low outgassing rate to enhance radiation heat transfer and reduce the impact on the vacuum degree in the vacuum cover 30. For example, the reflective plate 44 can be set to a multi-layer insulation material formed by stacking a double-sided aluminum-plated film and a non-woven fabric, which has high reflectivity, low thermal conductivity and low outgassing rate. Exemplarily, the reflective plate 44 is arranged around the circumference of the cryogenic distillation tower 10 to form a reflective cylinder, the axial direction of the reflective cylinder is arranged along the height direction of the cryogenic distillation tower 10, the reflective cylinder is spaced apart from the outer wall of the cryogenic distillation tower 10, and the conductor 20 is arranged between the reflective cylinder and the cryogenic distillation tower 10.

[0076] Exemplarily, the number of the reflective plates 44 is not limited, and may be one, two, or more than two reflective plates 44. When multiple reflective plates 44 are provided, the reflective plates 44 are arranged outwardly in sequence in a radial direction of the cryogenic distillation tower. The radial direction refers to the extension direction of the radius on the cross section of the cryogenic distillation tower along the horizontal direction.

[0077] The cryogenic distillation tower system 100 provided in the embodiment of the present application can utilize the heat accumulated outside the wire 20 through the heat conduction device 40 and transfer it to the cryogenic distillation tower 10, thereby promoting the wire 20 to transfer heat outward to improve the heat dissipation of the wire 20 and reduce the power loss of the wire 20.

[0078] The present application also provides a method for reducing the power loss of the reboiler. Figure 4 , the reboiler provides electrical energy through a conductor for heat exchange with a cryogenic distillation tower, the method comprising:

[0079] Determine the rate of heat accumulation under the conductor's operating conditions;

[0080] Set the thermal device according to the heat accumulation rate.

[0081] The higher the heat accumulation rate outside the wire, the more heat dissipation effect outside the wire can be increased by increasing the heat transfer capacity of the heat conducting device. For example, the number of heat conducting devices can be increased, the position of the heat conducting device can be adjusted; or, when the heat conducting device includes a heat conducting medium, a material with better heat conduction performance can be selected, or the number of heat conducting media or the cross-sectional area of ​​conduction can be increased; or, when the heat conducting device includes a reflector, a material with better reflective performance can be selected, or the number of reflectors can be increased, or the extension length of the reflector along the height direction of the cryogenic distillation tower can be increased.

[0082] In some embodiments, the step of determining the heat accumulation rate of the conductor under working conditions includes:

[0083] Determine the conductor power under conductor operating conditions;

[0084] Determine the heat dissipation power of the vacuum chamber to the wire;

[0085] Determine the heat accumulation rate based on the conductor power and the heat dissipation power.

[0086] According to Q A =Q R -Q E Calculate the heat accumulation rate, where Q A is the heat accumulation rate, Q R is the conductor power, Q E Heat dissipation capacity for the environment.

[0087] The power of the conductor can be calculated, and the heat dissipation capacity of the environment can be measured or calculated. For example, a test device can be placed in the vacuum chamber, and the heat loss of the test device within a certain period of time can be measured to obtain the heat dissipation capacity of the vacuum chamber to the test device, which is used as the heat dissipation power of the vacuum chamber to the conductor 20. A certain current can also be applied to the conductor in the vacuum chamber to generate a certain power, and the heat dissipation power can be determined based on the difference △T between the theoretical temperature rise and the actual temperature rise of the conductor caused by the electric power within a certain period of time. Where C is the heat capacity of the wire, m is the mass of the wire, and t is the test time.

[0088] In some embodiments, the step of determining the conductor power under working conditions includes:

[0089] Obtain the current I of the conductor under working conditions;

[0090] Obtain the resistivity ρ of the conductor under working conditions;

[0091] The conductor power Q of the conductor is calculated R Specifically, the conductor power Q is calculated according to the following functional relationship: R :

[0092]

[0093] Wherein, L represents the length of the wire and S represents the cross-sectional area of ​​the wire.

[0094] Through this step, the conductor power under the working condition can be obtained.

[0095] In some embodiments, the step of determining the heat dissipation power of the vacuum chamber to the wire includes:

[0096] Obtain the heat dissipation area A of the wire, the temperature T1 of the wire under working conditions, and the temperature T2 of the distillation tower under working conditions;

[0097] Calculate the heat dissipation power Q of the wire E Specifically, the heat dissipation power Q of the conductor is calculated according to the following functional relationship: E:

[0098]

[0099] Among them, σ is the emissivity of the wire, ε is the Stefan-Boltzmann constant. A represents the emission area, that is, the heat dissipation area A of the wire; T1 represents the emission temperature, that is, the temperature T1 of the wire under working conditions; T2 represents the receiving temperature, that is, the temperature T2 of the distillation tower under working conditions.

[0100] In this way, the heat dissipation power of the vacuum chamber to the wire can be obtained. A =Q R -Q E The heat accumulation rate Q is calculated A .

[0101] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A cryogenic distillation tower system, characterized in that: The cryogenic distillation tower system comprises: Cryogenic distillation tower; a reboiler and a conductor, the conductor being electrically connected to the reboiler to deliver electrical energy to the reboiler; A vacuum cover having a vacuum chamber, wherein the cryogenic distillation tower and the reboiler are arranged in the vacuum chamber; A heat conducting device is used to transfer the heat dissipated from the wire to the vacuum chamber to the cryogenic distillation tower.

2. The cryogenic distillation tower system according to claim 1, characterized in that: The heat conducting device comprises: The heat conducting medium has two ends connected to the cryogenic distillation tower and the conducting wire respectively.

3. The cryogenic distillation tower system according to claim 2, characterized in that: The heat conducting device further comprises: The fixed plate is sleeved on the low-temperature distillation tower and is located between the low-temperature distillation tower and the inner wall of the vacuum cover. The heat-conducting medium is arranged on the fixed plate.

4. The cryogenic distillation tower system according to claim 3, characterized in that: The fixing plate has a limiting opening, the heat-conducting medium has a heat-conducting body and a heat-conducting ring connected to each other, the heat-conducting ring is arranged on the periphery of the limiting opening, the wire is passed through the limiting opening and contacts the heat-conducting ring, and the two ends of the heat-conducting body are respectively connected to the heat-conducting ring and the low-temperature distillation tower.

5. The cryogenic distillation tower system according to claim 3, characterized in that: The plurality of fixing plates are arranged at intervals in the up-down direction, and the heat conducting medium is arranged on each fixing plate.

6. The cryogenic distillation tower system according to claim 3, characterized in that: The heat conducting device further comprises: A clamping block connects the fixing plate and the vacuum cover so that the fixing plate and the vacuum cover are spaced apart.

7. The cryogenic distillation tower system according to claim 1, characterized in that: The heat conducting device comprises: A reflector is disposed between the cryogenic distillation tower and the vacuum cover, and is used to reflect the heat of the wire to the cryogenic distillation tower. The wire is disposed between the reflector and the cryogenic distillation tower.

8. A method for reducing reboiler power loss, characterized in that: The reboiler provides electrical energy through a conductor for heat exchange with a cryogenic distillation tower, and the method comprises: determining a heat accumulation rate under operating conditions of the conductor; A heat transfer device is arranged according to the heat accumulation rate.

9. The method according to claim 8, characterized in that The step of determining the heat accumulation rate of the conductor under working conditions comprises: determining the conductor power of the conductor under operating conditions; Determining the heat dissipation power of the vacuum chamber to the wire; The heat accumulation rate is determined according to the wire power and the heat dissipation power.

10. The method according to claim 9, characterized in that The step of determining the conductor power under the conductor working condition comprises: Obtaining the current I of the wire under working conditions; Obtaining the resistivity ρ of the conductor under working conditions; The conductor power Q of the conductor is calculated as follows: R Specifically, the conductor power Q is calculated according to the following functional relationship: R : Wherein, L represents the length of the wire, and S represents the cross-sectional area of ​​the wire.

11. The method according to claim 9, characterized in that The step of determining the heat dissipation power of the vacuum chamber to the wire comprises: Obtaining a heat dissipation area A of the wire, a temperature T1 of the wire under working conditions, and a temperature T2 of the distillation tower under working conditions; The heat dissipation power Q of the wire is calculated as follows: E Specifically, the heat dissipation power Q of the wire is calculated according to the following functional relationship: E : Where σ is the emissivity of the wire and ε is the Stefan-Boltzmann constant.

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