Copper-hafnium composite wire and processing technology thereof

Abstract

The invention discloses a copper-hafnium composite wire and a processing technology thereof, and the processing technology comprises the following steps: carrying out cleaning treatment, drying treatment and laser cladding treatment on the surface of a hafnium bar to obtain a copper-hafnium composite bar billet; and then the copper-hafnium composite rod blank is sequentially subjected to first-time scaling treatment, multi-pass hot rotary swaging deformation, annealing treatment, wire drawing treatment, recrystallization annealing treatment, second-time scaling treatment, finished product annealing treatment and polishing treatment, and the copper-hafnium composite wire is obtained. The copper-hafnium composite wire is prepared by compounding the copper metal on the surface of the hafnium metal, a metallurgical bonding layer can be formed after the copper-hafnium composite wire is brazed with the silver-copper alloy brazing filler metal for an electrode copper substrate, the electrical conductivity and the thermal conductivity of a whole electrode weld zone can be improved, and then the service life of an electrode is prolonged; and meanwhile, in the metal processing process of the copper-hafnium composite wire, the surface is protected by pure copper, so that the imperceptible loss of the hafnium material in the processing process can be reduced, and the production cost is reduced.

Description

Technical Field

[0001] The present invention belongs to the technical field of material processing, and in particular, relates to a copper-hafnium composite wire and a processing technology thereof. Background Art

[0002] Hafnium has a low electron work function and is often used as a plasma emitter in plasma cutting electrodes. Generally, the hafnium wire and the copper substrate are processed into electrodes by brazing. The cooling rate of the electrode affects the service life of the electrode, and the cooling effect of the electrode is closely related to the bonding effect between the emitter hafnium wire and the substrate copper. Brazing uses silver-copper alloy solder as a connecting solder. A ternary eutectic or a metal compound containing hafnium will be formed between the hafnium wire and the copper substrate, that is, the hafnium wire may not form a metallurgical bonding layer with the copper substrate. This will reduce the electrical conductivity and thermal conductivity of the entire electrode weld area, thereby affecting the service life of the electrode.

[0003] In view of this, the present invention is proposed. Summary of the invention

[0004] The present invention aims to solve one of the technical problems in the related art at least to a certain extent. To this end, the embodiment of the present invention provides a copper-hafnium composite wire processing process which is easy to operate and has strong process controllability.

[0005] An embodiment of the present invention provides a copper-hafnium composite wire processing process, comprising the following steps:

[0006] (1) Cleaning and drying the surface of the hafnium rod;

[0007] (2) performing laser cladding treatment on the surface of the dried hafnium rod to obtain a copper-hafnium composite rod blank;

[0008] (3) subjecting the copper-hafnium composite rod blank to a first stripping process through a wire drawing die;

[0009] (4) subjecting the copper-hafnium composite rod blank after the peeling treatment to multiple hot rotary forging deformation to obtain a copper-hafnium composite rotary forging rod;

[0010] (5) annealing the copper-hafnium composite rotary forging rod;

[0011] (6) subjecting the copper-hafnium composite rotary forging rod annealed in step (5) to wire drawing, intermediate product recrystallization annealing, and a second peeling treatment in sequence to obtain a copper-hafnium composite wire;

[0012] (7) performing a finished product annealing treatment on the copper-hafnium composite wire;

[0013] (8) Polishing the copper-hafnium composite wire after annealing in step (7) to obtain the copper-hafnium composite wire.

[0014] The embodiment of the present invention prepares a copper-hafnium composite wire by compounding copper metal on the surface of hafnium metal. When the copper-hafnium composite wire and the electrode copper substrate are brazed with a silver-copper alloy brazing material, a metallurgical bonding layer can be formed, which can improve the electrical conductivity and thermal conductivity of the entire electrode weld area, thereby improving the service life of the electrode; at the same time, during the metal processing process, the copper-hafnium composite wire can save invisible loss of hafnium during processing and reduce production costs because the pure copper material protects the surface; and the processing method is simple in process, easy to operate, and highly controllable.

[0015] In some embodiments of the present invention, in step (1), the cleaning agent used in the cleaning treatment is an alkaline degreasing agent;

[0016] And / or, the drying treatment is performed at a temperature of 46° C. to 82° C. and for a time of 0.5 h to 1 h.

[0017] In some embodiments of the present invention, in step (2), the cladding material used in the laser cladding process is pure copper powder or pure copper wire, and the cladding thickness is 1 mm to 2 mm.

[0018] In some embodiments of the present invention, in the step (3), during the first peeling process, the diameter of the copper-hafnium composite rod blank is removed by ≤0.3 mm.

[0019] In some embodiments of the present invention, in the step (4), the deformation amount of a single pass of the multi-pass hot rotary forging deformation is 9% to 25%, the total deformation amount is 35% to 60%, the heating temperature is 700° C. to 800° C., and the heating time is 0.2 h to 0.5 h;

[0020] And / or, the size of the copper-hafnium composite rotary forging rod is Φ8mm-Φ9mm.

[0021] In some embodiments of the present invention, in step (5), the annealing treatment is performed in a vacuum annealing furnace with a vacuum pressure of <1.33×10 -2 Pa, annealing temperature is 750℃~800℃, and holding time is 1h~2h.

[0022] In some embodiments of the present invention, in step (6), the deformation amount of a single pass of the wire drawing process is 9% to 12%, and a recrystallization annealing process is performed when the total deformation amount is 35% to 55%;

[0023] And / or, the annealing temperature of the intermediate product recrystallization annealing treatment is 650° C. to 750° C., and the holding time is 1 h to 2 h;

[0024] And / or, the thickness of the pure copper on the surface of the copper-hafnium composite wire is 0.1 mm to 0.3 mm, and the size of the copper-hafnium composite wire is Φ1 mm to Φ4 mm.

[0025] In some embodiments of the present invention, in step (7), the finished product annealing treatment is carried out in a vacuum annealing furnace with a vacuum pressure of <1.33×10 -2 Pa, annealing temperature is 650℃~750℃, and holding time is 1h~2h.

[0026] In some embodiments of the present invention, in step (8), the abrasive belt used for the polishing process is 600-1200 mesh silicon carbide; and after the polishing process, the diameter removal amount of the copper-hafnium composite wire is 0.013mm-0.07mm, and the surface roughness is ≤Ra0.4μm.

[0027] Another aspect of the embodiment of the present invention further provides a copper-hafnium composite wire, which is prepared by the above processing technology.

[0028] The copper-hafnium composite wire in the embodiment of the present invention has copper-hafnium as a metallurgical bonding surface. When used as an electrode cutting wire, a metallurgical bonding layer can be formed when brazing with a copper substrate using a silver-copper alloy solder, thereby increasing the service life of the electrode. DETAILED DESCRIPTION

[0029] Embodiments of the present invention are described in detail below. The embodiments are exemplary and intended to be used to explain the present invention, but should not be construed as limiting the present invention.

[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which the present invention belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention; the terms "including" and "having" in the description and claims of the present invention and any variations thereof are intended to cover non-exclusive inclusions.

[0031] In the description of the embodiments of the present invention, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present invention, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0032] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present invention. The appearance of the phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0033] "Scope" disclosed in the present invention is defined in the form of lower limit and upper limit, and a given range is defined by selecting a lower limit and an upper limit, and the selected lower limit and upper limit define the boundary of a particular range. The scope defined in this way can be including end values ​​or not including end values, and can be arbitrarily combined, that is, any lower limit can be combined with any upper limit to form a scope. For example, if the scope of 60-120 and 80-110 is listed for a particular parameter, it is understood that the scope of 60-110 and 80-120 is also expected. In addition, if the minimum range values ​​1 and 2 are listed, and if the maximum range values ​​3,4 and 5 are listed, the following scope can all be expected: 1-3, 1-4, 1-5, 2-3, 2-4 and 2-5. In the present invention, unless otherwise specified, the numerical range "ab" represents the abbreviation of any real number combination between a and b, wherein a and b are real numbers. For example, the numerical range "0-5" means that all real numbers between "0-5" are listed in this document, and "0-5" is just an abbreviation of these numerical combinations. In addition, when a parameter is expressed as an integer ≥ 2, it is equivalent to disclosing that the parameter is, for example, an integer of 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0034] In the description of the embodiments of the present invention, the term "and / or" is only a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0035] An embodiment of the present invention provides a copper-hafnium composite wire processing process, comprising the following steps:

[0036] (1) Surface treatment: Clean and dry the surface of the hafnium rod;

[0037] (2) Laser cladding: The surface of the dried hafnium rod is laser clad to obtain a copper-hafnium composite rod blank;

[0038] (3) Surface treatment: The copper-hafnium composite rod blank is subjected to a first peeling treatment through a wire drawing die;

[0039] (4) hot rotary forging deformation: the copper-hafnium composite rod blank after the peeling treatment is subjected to multiple hot rotary forging deformations to obtain a copper-hafnium composite rotary forging rod;

[0040] (5) Annealing: annealing the copper-hafnium composite rotary forging rod;

[0041] (6) Wire drawing: the copper-hafnium composite rotary forging rod annealed in step (5) is subjected to wire drawing, intermediate product recrystallization annealing, and a second peeling treatment in sequence to obtain a copper-hafnium composite wire material;

[0042] (7) Annealing: performing a finished product annealing treatment on the copper-hafnium composite wire;

[0043] (8) Polishing: polishing the copper-hafnium composite wire after annealing in step (7) to obtain the copper-hafnium composite wire.

[0044] In some specific embodiments, in step (1), the cleaning agent used in the cleaning treatment is an alkaline degreasing agent;

[0045] And / or, the drying treatment is performed at a temperature of 46° C. to 82° C. and for a time of 0.5 h to 1 h.

[0046] In some specific embodiments, in step (2), the cladding material used in the laser cladding process is pure copper powder or pure copper wire, and the cladding thickness is 1 mm to 2 mm. The inventors have found that if the cladding thickness is too thick, it will lead to material waste, and the excess copper composite layer needs to be removed in the final wire drawing and peeling; but if the cladding thickness is too thin, the copper composite layer will fall off and expose the hafnium matrix due to deformation, thinning, surface damage and other factors during the wire drawing process. Therefore, it is advantageous to control the cladding thickness between 1 mm and 2 mm in the embodiment of the present invention.

[0047] In some specific embodiments, in the step (3), during the first peeling process, the diameter of the copper-hafnium composite rod blank is removed by ≤0.3 mm.

[0048] In some specific embodiments, in the step (4), the deformation of a single pass of the multi-pass hot rotary forging deformation is 9% to 25%, the total deformation is 35% to 60%, the heating temperature is 700°C to 800°C, and the heating time is 0.2h to 0.5h. The inventors have found that if the deformation of a single pass is too large, defects such as folding will appear on the surface of the rotary forged bar; but if the deformation of a single pass is too small, stress cracking defects will occur due to repeated forging of the metal bar. Therefore, the embodiment of the present invention controls the deformation of a single pass within the range of 9% to 25%.

[0049] And / or, the size of the copper-hafnium composite rotary forging rod is Φ8mm-Φ9mm.

[0050] In some specific embodiments, in step (5), the annealing treatment is performed in a vacuum annealing furnace with a vacuum pressure of <1.33×10 -2 Pa, annealing temperature is 750℃~800℃, and holding time is 1h~2h. Through annealing treatment, the metal material in the copper-hafnium composite rotary forging rod can be completely recrystallized, the metal plasticity is improved, and it is beneficial to the subsequent metal processing deformation; and the embodiment of the present invention controls the annealing temperature between 750℃~800℃. If the annealing temperature is too high, it will cause the metal grains to grow and reduce the metal plasticity; but if the annealing temperature is too low, the metal material will not be completely recrystallized, which will also reduce the metal plasticity.

[0051] In some specific embodiments, in step (6), the deformation amount of a single pass of the wire drawing process is 9% to 12%, and a recrystallization annealing process is performed when the total deformation amount is 35% to 55%;

[0052] And / or, the annealing temperature of the recrystallization annealing treatment of the intermediate product is 650°C to 750°C, and the holding time is 1h to 2h; by performing recrystallization annealing on the copper-hafnium composite rotary forging rod after wire drawing, the plasticity of the metal material can be improved; and if the recrystallization annealing temperature is too high, the metal grains will grow and the metal plasticity will be reduced; but if the recrystallization annealing temperature is too low, the metal material will not be completely recrystallized, which also reduces the metal plasticity.

[0053] And / or, the thickness of the pure copper on the surface of the copper-hafnium composite wire is 0.1mm-0.3mm, and the size of the copper-hafnium composite wire is Φ1mm-Φ4mm. By peeling the copper-hafnium composite swaging rod, the thickness of the metal copper on the wire surface and the diameter of the final finished wire can be effectively controlled.

[0054] In some specific embodiments, in step (7), the finished product annealing treatment is carried out in a vacuum annealing furnace with a vacuum pressure of <1.33×10 -2 Pa, annealing temperature is 650℃~750℃, and holding time is 1h~2h. By annealing the copper-hafnium composite wire, the plasticity of the metal material can be improved, the resistance can be reduced, and the conductivity can be improved.

[0055] In some specific embodiments, in step (8), the sanding belt used for the polishing process is 600-1200 mesh silicon carbide; and after the polishing process, the diameter of the copper-hafnium composite wire is reduced by 0.013 mm to 0.07 mm, and the surface roughness is ≤ Ra0.4 μm. By polishing the copper-hafnium composite wire, it can be ensured that the wire surface has good roughness.

[0056] Another aspect of the embodiment of the present invention further provides a copper-hafnium composite wire, which is prepared by the above processing technology.

[0057] The technical solution of the present invention is further described in detail below in conjunction with specific examples. Unless otherwise specified, the various raw materials used in the examples are conventional commercial products, or can be prepared by known methods, and the experimental methods without specific conditions in the examples are conventional methods and conventional conditions well known in the art.

[0058] Example 1

[0059] A copper-hafnium composite wire processing process comprises the following steps:

[0060] (1) Surface treatment: Use an alkaline degreasing agent to clean the surface of the Φ9 mm hafnium rod to remove oil stains, and then dry it at 60°C for 0.5 h;

[0061] (2) Laser cladding: The surface of the dried hafnium rod is subjected to laser cladding treatment, and the cladding material is pure copper powder, and the cladding thickness is controlled to be 1 mm to obtain a copper-hafnium composite rod blank;

[0062] (3) Surface treatment: The copper-hafnium composite rod blank is subjected to the first peeling treatment through the wire drawing die to remove impurities on the surface of the copper-hafnium composite rod blank;

[0063] (4) Hot rotary forging deformation: The copper-hafnium composite rod blank after peeling treatment is continuously subjected to multiple hot rotary forging deformation on a rotary forging device, and the deformation amount of each pass is controlled to be about 10%, and the total deformation amount is about 60%. The heating temperature is 700°C and the heating time is 0.5h to obtain a copper-hafnium composite rotary forging rod with a size of Φ8mm;

[0064] (5) Annealing: The copper-hafnium composite rotary forging rod is annealed in a vacuum annealing furnace, wherein the vacuum pressure is less than 1.33×10 -2 Pa, annealing temperature is 780℃, holding time is 2h;

[0065] (6) Wire drawing: The copper-hafnium composite rotary forging rod annealed in step (5) is first subjected to wire drawing treatment on a wire drawing device, and the deformation amount of a single pass is controlled to be 10%; when the total deformation amount reaches 55%, the intermediate product is subjected to recrystallization annealing treatment, and the annealing temperature is 720° C. and the holding time is 1 h; then a second peeling treatment is performed, and the thickness of the pure copper on the surface of the copper-hafnium composite wire is reserved to be 0.2 mm, and a copper-hafnium composite wire with a size of Φ2.4 mm is obtained;

[0066] (7) Annealing: The copper-hafnium composite wire is subjected to a finished product annealing treatment in a vacuum annealing furnace, wherein the vacuum pressure is less than 1.33×10 -2 Pa, annealing temperature is 700℃, holding time is 2h;

[0067] (8) Polishing: The copper-hafnium composite wire annealed in step (7) is polished on a wire abrasive belt polishing device, the abrasive belt is 800 mesh silicon carbide, the diameter removal amount of the copper-hafnium composite wire is 0.02 mm, and the surface roughness after polishing is ≤ Ra0.4 μm, thereby obtaining the copper-hafnium composite wire.

[0068] Example 2

[0069] A copper-hafnium composite wire processing process comprises the following steps:

[0070] (1) Surface treatment: Use an alkaline degreasing agent to clean the surface of the Φ8mm hafnium rod to remove oil stains, and then dry it at 60°C for 0.5h;

[0071] (2) Laser cladding: The surface of the dried hafnium rod is subjected to laser cladding treatment, and the cladding material is pure copper powder, and the cladding thickness is controlled to be 1 mm to obtain a copper-hafnium composite rod blank;

[0072] (3) Surface treatment: The copper-hafnium composite rod blank is subjected to the first peeling treatment through the wire drawing die to remove impurities on the surface of the copper-hafnium composite rod blank;

[0073] (4) Hot rotary forging deformation: The copper-hafnium composite rod blank after peeling treatment is continuously subjected to multiple hot rotary forging deformation on a rotary forging equipment, and the deformation amount of each pass is controlled to be about 10%, and the total deformation amount is about 60%. The heating temperature is 700°C and the heating time is 0.5h to obtain a copper-hafnium composite rotary forging rod with a size of 7mm;

[0074] (5) Annealing: The copper-hafnium composite rotary forging rod is annealed in a vacuum annealing furnace, wherein the vacuum pressure is less than 1.33×10 -2 Pa, annealing temperature is 780℃, holding time is 2h;

[0075] (6) Wire drawing: The copper-hafnium composite rotary forging rod annealed in step (5) is first subjected to wire drawing treatment on a wire drawing device, and the deformation amount of a single pass is controlled to be 10%; when the total deformation amount reaches 55%, the intermediate product is subjected to recrystallization annealing treatment, and the annealing temperature is 720° C. and the holding time is 1 h; then a second peeling treatment is performed, and the thickness of the pure copper on the surface of the copper-hafnium composite wire is reserved to be 0.2 mm, and a copper-hafnium composite wire with a size of Φ2.0 mm is obtained;

[0076] (7) Annealing: The copper-hafnium composite wire is subjected to a finished product annealing treatment in a vacuum annealing furnace, wherein the vacuum pressure is less than 1.33×10 -2 Pa, annealing temperature is 700℃, holding time is 2h;

[0077] (8) Polishing: The copper-hafnium composite wire annealed in step (7) is polished on a wire abrasive belt polishing device, the abrasive belt is 800 mesh silicon carbide, the diameter removal amount of the copper-hafnium composite wire is 0.02 mm, and the surface roughness after polishing is ≤ Ra0.4 μm, thereby obtaining the copper-hafnium composite wire.

[0078] Example 3

[0079] A copper-hafnium composite wire processing process comprises the following steps:

[0080] (1) Surface treatment: Use an alkaline degreasing agent to clean the surface of the Φ10 mm hafnium rod to remove oil stains, and then dry it at 60°C for 0.5 h;

[0081] (2) Laser cladding: The surface of the dried hafnium rod is subjected to laser cladding treatment, and the cladding material is pure copper powder, and the cladding thickness is controlled to be 1 mm to obtain a copper-hafnium composite rod blank;

[0082] (3) Surface treatment: The copper-hafnium composite rod blank is subjected to the first peeling treatment through the wire drawing die to remove impurities on the surface of the copper-hafnium composite rod blank;

[0083] (4) Hot rotary forging deformation: The copper-hafnium composite rod blank after peeling treatment is continuously subjected to multiple hot rotary forging deformation on a rotary forging device, and the deformation amount of each pass is controlled to be about 10%, and the total deformation amount is about 60%. The heating temperature is 700°C and the heating time is 0.5h to obtain a copper-hafnium composite rotary forging rod with a size of Φ8mm;

[0084] (5) Annealing: The copper-hafnium composite rotary forging rod is annealed in a vacuum annealing furnace, wherein the vacuum pressure is less than 1.33×10 -2 Pa, annealing temperature is 780℃, holding time is 2h;

[0085] (6) Wire drawing: The copper-hafnium composite rotary forging rod annealed in step (5) is first subjected to wire drawing treatment on a wire drawing device, and the deformation amount of a single pass is controlled to be 10%; when the total deformation amount reaches 55%, the intermediate product is subjected to recrystallization annealing treatment, and the annealing temperature is 720° C. and the holding time is 1 h; then a second peeling treatment is performed, and the thickness of the pure copper on the surface of the copper-hafnium composite wire is reserved to be 0.2 mm, and a copper-hafnium composite wire with a size of Φ3.0 mm is obtained;

[0086] (7) Annealing: The copper-hafnium composite wire is subjected to a finished product annealing treatment in a vacuum annealing furnace, wherein the vacuum pressure is less than 1.33×10 -2 Pa, annealing temperature is 700℃, holding time is 2h;

[0087] (8) Polishing: The copper-hafnium composite wire annealed in step (7) is polished on a wire abrasive belt polishing device, the abrasive belt is 800 mesh silicon carbide, the diameter removal amount of the copper-hafnium composite wire is 0.02 mm, and the surface roughness after polishing is ≤ Ra0.4 μm, thereby obtaining the copper-hafnium composite wire.

[0088] The copper-hafnium composite wire material obtained by the processing technology of the embodiment of the present invention has good electrical and thermal conductivity when brazed with the copper substrate of the plasma cutting electrode with silver-copper alloy after being processed into an emitter electrode, thereby extending the service life of the electrode. Compared with the pure hafnium electrode and the copper substrate of the plasma cutting electrode brazed with silver-copper alloy, the two are not metallurgically bonded, so they have higher resistance, generate higher heat during use, and the electrode is easy to burn.

[0089] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0090] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A copper-hafnium composite wire processing process, characterized in that: The steps include: (1) Cleaning and drying the surface of the hafnium rod; (2) performing laser cladding treatment on the surface of the dried hafnium rod to obtain a copper-hafnium composite rod blank; (3) subjecting the copper-hafnium composite rod blank to a first stripping process through a wire drawing die; (4) subjecting the copper-hafnium composite rod blank after the peeling treatment to multiple hot rotary forging deformation to obtain a copper-hafnium composite rotary forging rod; (5) annealing the copper-hafnium composite rotary forging rod; (6) subjecting the copper-hafnium composite rotary forging rod annealed in step (5) to wire drawing, intermediate product recrystallization annealing, and second peeling in sequence to obtain a copper-hafnium composite wire; (7) performing a finished product annealing treatment on the copper-hafnium composite wire; (8) Polishing the copper-hafnium composite wire after annealing in step (7) to obtain the copper-hafnium composite wire.

2. The copper-hafnium composite wire processing process according to claim 1, characterized in that: In the step (1), the cleaning agent used in the cleaning treatment is an alkaline degreasing agent; And / or, the drying treatment is performed at a temperature of 46° C. to 82° C. and for a time of 0.5 h to 1 h.

3. The copper-hafnium composite wire processing process according to claim 1, characterized in that: In the step (2), the cladding material used in the laser cladding process is pure copper powder or pure copper wire, and the cladding thickness is 1 mm to 2 mm.

4. The copper-hafnium composite wire processing process according to claim 1, characterized in that: In the step (3), during the first peeling process, the diameter of the copper-hafnium composite rod blank is removed by ≤0.3 mm.

5. The copper-hafnium composite wire processing process according to claim 1, characterized in that: In the step (4), the deformation amount of a single pass of the multi-pass hot rotary forging deformation is 9% to 25%, the total deformation amount is 35% to 60%, the heating temperature is 700° C. to 800° C., and the heating time is 0.2 h to 0.5 h; And / or, the size of the copper-hafnium composite rotary forging rod is Φ8mm-Φ9mm.

6. The copper-hafnium composite wire processing process according to claim 1, characterized in that: In the step (5), the annealing treatment is carried out in a vacuum annealing furnace with a vacuum pressure of <1.33×10 -2 Pa, annealing temperature is 750℃~800℃, and holding time is 1h~2h.

7. The copper-hafnium composite wire processing process according to claim 1, characterized in that: In the step (6), the deformation amount of a single pass of the wire drawing process is 9% to 12%, and a recrystallization annealing process is performed when the total deformation amount is 35% to 55%; And / or, the annealing temperature of the intermediate product recrystallization annealing treatment is 650° C. to 750° C., and the holding time is 1 h to 2 h; And / or, the thickness of the pure copper on the surface of the copper-hafnium composite wire is 0.1 mm to 0.3 mm, and the size of the copper-hafnium composite wire is Φ1 mm to Φ4 mm.

8. The copper-hafnium composite wire processing process according to claim 1, characterized in that: In step (7), the finished product annealing treatment is carried out in a vacuum annealing furnace with a vacuum pressure of <1.33×10 -2 Pa, annealing temperature is 650℃~750℃, and holding time is 1h~2h.

9. The copper-hafnium composite wire processing process according to claim 1, characterized in that: In the step (8), the sanding belt used for the polishing process is 600-1200 mesh silicon carbide; and after the polishing process, the diameter removal amount of the copper-hafnium composite wire is 0.013mm-0.07mm, and the surface roughness is ≤Ra0.4μm.

10. A copper-hafnium composite wire, characterized in that: The copper-hafnium composite wire is prepared by the processing technology described in any one of claims 1-9.