Adaptive magnetic smart-adhesion structure soft gripper adapting to object surface topography
By designing a mushroom-shaped microstructure array and a magnetically controlled intelligent adhesion structure of an external field-sensitive polymer backing layer filled with magnetic particles, a soft gripper has been developed. This solves the problem of how soft grippers can quickly adapt to surfaces with different curvatures and achieve rapid gripping and release of objects. It achieves pollution-free and scratch-free adhesion gripping, and is suitable for non-destructive gripping in fields such as aerospace, medical and micro-nano manufacturing.
Patent Information
- Application Number
- CN202411781820.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-05
- Publication Date
- 2025-12-05
- Estimated Expiration
- 2044-12-05
AI Technical Summary
Existing soft grippers are difficult to adapt quickly to surfaces with different curvatures, which can easily damage objects during gripping and placement. Furthermore, traditional methods pose risks of contamination and scratches.
A magnetically controlled intelligent adhesive soft gripper that adapts to the surface morphology of objects is designed. It adopts a mushroom-shaped microstructure array and an external field-sensitive polymer backing layer filled with magnetic particles. The gripper can quickly grasp and release objects by deforming the external field-sensitive polymer backing layer and adjust the gripping force by using a magnetic field.
It achieves pollution-free and scratch-free adhesion and gripping, can quickly grasp and release objects, and can achieve precise control of gripping force by adjusting the magnetic field strength. It is suitable for non-destructive gripping needs in aerospace, medical facilities and micro-nano manufacturing and other fields.
Smart Images

Figure CN119734299B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a magnetically controlled intelligent adhesive soft gripper that adapts to the surface morphology of an object, belonging to the field of gripping and transportation. Background Technology
[0002] Fields such as aerospace, medical facilities, and micro / nano manufacturing often involve the assembly of various types of parts. However, this is an extremely challenging task because these parts not only vary in size and shape, but also require surfaces free from contamination, scratches, or damage. Traditional object gripping methods, such as mechanical grippers that rely on clamping force or suction, are prone to stress concentration at the contact area during operation, increasing the risk of object damage.
[0003] Flexible materials have brought new breakthroughs to the field of grippers. Due to their inherent deformability, soft grippers made from flexible materials have excellent adaptability to complex object surfaces. Compared with traditional mechanical grippers, they have potential applications in special working conditions, such as gripping thin, fragile objects. However, the technological development of soft grippers still faces some challenges, especially in the rapid picking and placing of objects with different curvatures. Therefore, developing a soft gripper design that can adapt to various object surface morphologies is a key problem that urgently needs to be solved. Summary of the Invention
[0004] One of the objectives of this invention is to provide a magnetically controlled intelligent adhesive soft gripper that adapts to the surface morphology of an object, enabling it to adhere and grasp the object surface without contamination or scratches; and to achieve rapid grasping and release of the object by deforming the external field-sensitive polymer backing layer in a magnetic field.
[0005] The second objective of this invention is to provide a method for preparing the magnetically controlled intelligent adhesive structure soft gripper, which can balance the application effect and preparation efficiency of the magnetically controlled intelligent adhesive structure soft gripper, and has the advantages of low cost and lightweight preparation.
[0006] The objective of this invention is achieved through the following technical solution:
[0007] The present invention discloses a magnetically controlled intelligent adhesive structure soft gripper that adapts to the surface morphology of an object, comprising the following two layers: an upper layer is an adhesive structure functional surface, and a lower layer is an external field sensitive polymer backing layer; the adhesive structure functional surface is a mushroom-shaped microstructure array, and the external field sensitive polymer backing layer is a polymer filled with magnetic particles.
[0008] Preferably, the adhesive structure functional surface material is polydimethylsiloxane; and the polymer material of the external field sensitive polymer backing layer is Ecoflex 00-30.
[0009] Preferably, the preparation method of the field-sensitive polymer backing layer is as follows: a backing layer mold structure with initial curvature is prepared, and a mixture of magnetic particles and Ecoflex 00-30 with a mass ratio of 1:1 is poured into the mold structure; the mold structure is placed in a vacuum drying oven at 60-80°C and cured for 40-120 minutes. After curing, a field-sensitive polymer backing layer containing magnetic particles is obtained.
[0010] As a further preferred embodiment, the preparation method of the field-sensitive polymer backing layer is as follows: a backing layer mold structure with initial curvature is prepared, and a mixture of magnetic particles and Ecoflex 00-30 with a mass ratio of 1:1 is poured into the mold structure; the mold structure is placed in a vacuum drying oven at 80°C and cured for 40 minutes. After curing, a field-sensitive polymer backing layer containing magnetic particles is obtained.
[0011] The method for preparing the magnetically controlled intelligent adhesive soft gripper is as follows: First, a mold structure of a mushroom-shaped microstructure array is prepared, and polydimethylsiloxane is filled into the mold structure; then, the polydimethylsiloxane is degassed to fill the cavity; next, a magnetically filled external field-sensitive polymer backing layer is placed on top of the mushroom-shaped microstructure array mold and flattened with a weight; finally, the mold structure is placed in a vacuum drying oven at 80°C for 40 minutes to cure. After curing, a mushroom-shaped microstructure array with excellent adhesion properties is obtained.
[0012] Preferably, the magnetic particle-filled field-sensitive polymer backing layer has a length and width of 20-30 mm and a thickness of 1-3 mm.
[0013] Preferably, the dimensions of a single mushroom-shaped microstructure in the mushroom-shaped microstructure array are as follows: the height of the mushroom-shaped structure is 60-70 μm, the diameter of the stem of the mushroom-shaped structure is 40-45 μm, the diameter of the head of the mushroom-shaped structure is 60-70 μm, and the spacing between two adjacent mushroom-shaped microstructures is 60-70 μm.
[0014] Preferably, the magnetic particles are one or more of carbonyl iron powder, iron(II,III) oxide, neodymium iron boron and hydroxyl iron powder, and the particle size of the magnetic particles is 1-5 μm.
[0015] The present invention discloses a method for operating a magnetically controlled intelligent adhesion soft gripper that adapts to the surface morphology of an object, comprising the following steps:
[0016] In the first step, under no magnetic field conditions, the external field sensitive polymer backing layer remains in its initial state, and the functional surface of the adhesive structure exhibits weak gripping force.
[0017] The second step involves applying a magnetic field, which causes the external field-sensitive polymer backing layer to deform, resulting in adhesive contact between the functional surface of the adhesive structure and the object, and the object is successfully grasped.
[0018] According to the following formula, the gripping force can be adjusted by changing the magnetic field strength:
[0019] F = -3.258 × 10 -8 B 3 +4.338×10 -5 B 2 -1.072×10 -2 B+0.8959
[0020] Where: F is the grasping force, measured in Newtons (N); B is the magnetic field strength, measured in millite (mT);
[0021] In the third step, after the magnetic field is removed, the deformation of the external field-sensitive polymer backing layer disappears, and the functional surface of the adhesive structure recovers its initial morphology under the action of elastic strain energy, and the object is successfully released.
[0022] Beneficial effects:
[0023] 1. The present invention discloses a magnetically controlled intelligent adhesive structure soft gripper that adapts to the surface morphology of an object. Based on the adhesive structure functional surface of a mushroom-shaped microstructure array, it can achieve non-polluting and non-scratching adhesive gripping of object surfaces. Through the deformation of the external field sensitive polymer backing layer in a magnetic field, it can achieve rapid gripping and release of objects.
[0024] 2. The present invention discloses a magnetically controlled intelligent adhesive soft gripper that adapts to the surface morphology of an object, and constructs a formula model for adjusting the gripping force by changing the magnetic field strength, thereby realizing quantitative and precise adjustment of the gripping force.
[0025] 3. This invention discloses a magnetically controlled intelligent adhesive structure soft gripper that adapts to the surface morphology of an object and its preparation method. The functional surface material of the adhesive structure is polydimethylsiloxane; the polymer material of the external field sensitive polymer backing layer is Ecoflex 00-30. A mold structure with an initial curvature is prepared, and a mixture of magnetic particles and Ecoflex 00-30 at a mass ratio of 1:1 is poured into the mold structure. The mold structure is placed in a vacuum drying oven at 60-80°C and cured for 40-120 minutes. After curing, an external field sensitive polymer backing layer containing magnetic particles is obtained. This not only improves the efficiency of preparing a magnetically controlled intelligent adhesive structure soft gripper that adapts to the surface morphology of an object, but also enables the magnetically controlled intelligent adhesive structure soft gripper to adapt to the object surface under the action of a magnetic field.
[0026] 4. The present invention discloses a magnetically controlled intelligent adhesive structure soft gripper that adapts to the surface morphology of an object and its preparation method. The height of the mushroom-shaped structure is 60-70 μm, the diameter of the stem of the mushroom-shaped structure is 40-45 μm, the diameter of the head of the mushroom-shaped structure is 60-70 μm, and the distance between two adjacent mushroom-shaped microstructures is 60-70 μm. The dimensions can not only improve the gripping force of the magnetically controlled intelligent adhesive structure soft gripper, but also realize the gripping function on rough object surfaces.
[0027] 5. This invention discloses a magnetically controlled intelligent adhesive soft gripper with adaptive surface morphology and its preparation method. The magnetic particles are one or more of carbonyl iron powder, iron(II,III) oxide, neodymium iron boron, and hydroxyl iron powder. The particle size of the magnetic particles is 1-5 μm. The mixture of carbonyl iron powder, iron(II,III) oxide, neodymium iron boron, and hydroxyl iron powder with Ecoflex00-30, which has excellent deformability, can achieve quantitative and precise adjustment of the gripping force by selecting the magnetic particle material and the mass ratio with Ecoflex00-30.
[0028] 6. The magnetically controlled intelligent adhesion structure soft gripper that adapts to the surface morphology of an object disclosed in this invention is more suitable for the needs of grasping and releasing without pollution or scratches in fields such as transfer and transportation, and micro-nano manufacturing. Attached Figure Description
[0029] Figure 1 This is a schematic diagram of the magnetically controlled intelligent adhesion soft gripper structure of the present invention.
[0030] Figure 2 This is a flowchart illustrating the fabrication process of the external field-sensitive polymer backing layer in the magnetically controlled intelligent adhesion soft gripper structure of this invention.
[0031] Figure 3 This is a flowchart illustrating the fabrication process of the functional surface of the adhesive structure in the magnetically controlled intelligent adhesive soft gripper structure of this invention.
[0032] Figure 4 This is a SEM image of the magnetically controlled intelligent adhesive soft gripper of the present invention.
[0033] Figure 5 This is a schematic diagram of the forces acting on the magnetically controlled intelligent adhesive soft gripper of the present invention in a magnetic field. Wherein a is a schematic diagram of the forces acting on the magnetically controlled intelligent adhesive soft gripper in a magnetic field; b is a mechanical model of the magnetically controlled intelligent adhesive soft gripper in contact with a rigid substrate under the action of a magnetic field.
[0034] Figure 6 This is the theoretical deformation of the magnetically controlled intelligent adhesive soft gripper of the present invention in a magnetic field.
[0035] Figure 7This diagram shows the actual deformation of the magnetically controlled intelligent adhesive soft gripper of the present invention in a magnetic field. Here, a represents the initial morphology of the magnetically controlled intelligent adhesive soft gripper in the absence of a magnetic field; b represents the deformation morphology of the magnetically controlled intelligent adhesive soft gripper under the influence of a magnetic field, where b(i) represents a magnetic field strength of 400 mT and b(ii) represents a magnetic field strength of 600 mT.
[0036] Figure 8 This invention relates the gripping force of the magnetically controlled intelligent adhesive soft gripper to the strength of the magnetic field.
[0037] Figure 9 This is a schematic diagram illustrating the grasping and releasing process of the magnetically controlled intelligent adhesive soft gripper of the present invention on a curved object.
[0038] Wherein: 1—adhesive structure functional surface, 2—external field sensitive polymer backing layer, 3—SEM of mushroom-shaped microstructure array of adhesive structure functional surface, 4—SEM of magnetic particle filling Ecoflex 00-30 of external field sensitive polymer backing layer. Detailed Implementation
[0039] To better illustrate the purpose and advantages of the present invention, the invention will be further described below in conjunction with the accompanying drawings and examples.
[0040] Example 1:
[0041] like Figure 1 As shown in the figure, this embodiment discloses a magnetically controlled intelligent adhesive structure soft gripper that adapts to the surface morphology of an object, comprising the following two layers: an upper layer is an adhesive structure functional surface, and a lower layer is an external field sensitive polymer backing layer; the adhesive structure functional surface is a mushroom-shaped microstructure array, and the external field sensitive polymer backing layer is a polymer filled with magnetic particles.
[0042] The adhesive structure functional surface material is polydimethylsiloxane; the polymer material of the external field sensitive polymer backing layer is Ecoflex 00-30.
[0043] like Figure 2 The diagram shows the process flow chart for preparing the field-sensitive polymer backing layer. The preparation method is as follows: a mold structure containing an initial curvature is prepared; a mixture of magnetic particles and Ecoflex00-30 at a mass ratio of 1:1 is poured into the mold structure; the magnetic particles are carbonyl iron powder with a particle size of 5 μm; the mold structure is placed in a vacuum drying oven at 80°C and cured for 40 minutes. After curing, the field-sensitive polymer backing layer containing magnetic particles is obtained.
[0044] like Figure 3The method for preparing the magnetically controlled intelligent adhesive soft gripper is shown below: First, a mold structure of a mushroom-shaped microstructure array is prepared, and polydimethylsiloxane is filled into the mold structure; then, the polydimethylsiloxane is degassed to fill the cavity; next, a magnetically filled external field-sensitive polymer backing layer is placed on top of the mushroom-shaped microstructure array mold and flattened with a weight; finally, the mold structure is placed in a vacuum drying oven at 80°C for 40 minutes to cure. After curing, a mushroom-shaped microstructure array with excellent adhesion properties is obtained.
[0045] The magnetic particle-filled field-sensitive polymer backing layer has a length and width of 20 mm and a thickness of 2 mm.
[0046] The dimensions of a single mushroom-shaped microstructure in the mushroom-shaped microstructure array are as follows: the height of the mushroom-shaped structure is 60-70 μm, the diameter of the stem of the mushroom-shaped structure is 40-45 μm, the diameter of the head of the mushroom-shaped structure is 60-70 μm, and the spacing between two adjacent mushroom-shaped microstructures is 60-70 μm.
[0047] like Figure 4 The image shown is an SEM image of a magnetically controlled intelligent adhesive soft gripper. The overall structure consists of two layers: the upper layer is a mushroom-shaped microstructure array on the functional surface of the adhesive structure, and the lower layer is an external field-sensitive polymer backing layer filled with magnetic particles.
[0048] like Figure 5 The diagram shows the force distribution of a magnetically controlled smart adhesive soft gripper in a magnetic field. Considering that the height of the mushroom-shaped microstructure in the magnetically controlled smart adhesive soft gripper is negligible compared to the thickness of the field-sensitive polymer backing layer, and that the mushroom-shaped microstructure does not contain magnetic particles, the force diagram only considers the force on the field-sensitive polymer backing layer under the influence of the magnetic field. Figure 5 As shown in Figure a, when an external magnetic field is introduced, the field-sensitive polymer backing layer bends and deforms, thus forming contact with the horizontal substrate. The greater the magnetic field strength, the larger the contact area between the field-sensitive polymer backing layer and the horizontal substrate, and the greater the gripping force. To analyze the deformation of the magnetically controlled intelligent adhesive soft gripper under different magnetic field strengths, this invention, based on beam theory, establishes a theoretical model of the adhesion contact of a uniformly curved beam on a rigid horizontal substrate under magnetic force, as shown in Figure a. Figure 5As shown in b, a rectangular coordinate system (x, y) and a curvilinear coordinate system (s, θ) are introduced to describe the deformation of the field-sensitive polymer backing layer. Considering the symmetrical configuration of the field-sensitive polymer backing layer, half of it is chosen as the research object, and the origins of the two coordinate systems are set at the midpoint of the field-sensitive polymer backing layer. The relationship between the two coordinate systems is: dx / ds = cosθ, dy / ds = sinθ, where s is the arc length of the neutral layer, and θ is the angle between the tangent at any point on the neutral layer after deformation and the x-axis. θ1 is the angle between the tangent at any point on the neutral layer and the x-axis in the initial state of the field-sensitive polymer backing layer. The adhesive contact length between the field-sensitive polymer backing layer and the substrate under the action of magnetic force is defined as l. L is half the arc length of the field-sensitive polymer backing layer. ρ is the initial radius of curvature of the field-sensitive polymer backing layer. Neglecting the gravitational potential energy of the field-sensitive polymer backing layer, the total potential energy of the entire field-sensitive polymer backing layer at any distance from the permanent magnet is:
[0049] In equation (1), the first and second terms on the right-hand side represent the bending strain energy of the external field-sensitive polymer backing layer in segments ol and lL, respectively. Here, D is the bending stiffness of the external field-sensitive polymer backing layer. Within the ol range, the external field-sensitive polymer backing layer is in a planar state under the action of the magnetic field force, therefore θ(s) = 0 (0 ≤ s ≤ l), y(s) = 0 (0 ≤ s ≤ l). The third and fourth terms represent the magnetic field potentials in ol and lL, respectively, where q(y) is the magnetic force experienced by the external field-sensitive polymer backing layer when the distance between it and the permanent magnet is d.
[0050]
[0051] Where B is the magnetic field strength of the permanent magnet, which can be obtained by testing and fitting the magnetic field strength on the surface of the permanent magnet:
[0052] B = 0.000027 / (0.0331 + d) 3 (3)
[0053] Where φ is the volume fraction of magnetic particles (~12%), and μ is the relative permeability of magnetic particles (786.4).
[0054] The fifth term represents the interface interaction potential. The sixth and seventh terms represent additional terms introduced by the geometric relationship between the rectangular coordinate system (x,y) and the curvilinear coordinate system (s,θ), where λ1 and λ2 are Lagrange multipliers. To minimize the total potential energy of the system by ensuring that the first variation of the total potential energy with respect to θ and l is zero, we can obtain:
[0055]
[0056] Combining the relevant boundary conditions, we get:
[0057]
[0058] Equation (5) is the governing equation for the external field sensitive polymer backing layer to reach equilibrium under the action of magnetic force, and Equation (6) is the boundary condition corresponding to the governing equation.
[0059] like Figure 6 The diagram illustrates the theoretical deformation of the magnetically controlled intelligent adhesive soft gripper of this invention in a magnetic field. For better theoretical analysis, the parameters of the field-sensitive polymer backing layer are set as follows: elastic modulus E = 0.8 MPa, thickness h = 2 mm, radius ρ = 20 mm, length L = 20 mm, and interfacial adhesion energy Δγ = 0.4 N / m. Clearly, with other parameters remaining constant, as the magnetic field strength gradually increases, the length of the magnetically controlled intelligent adhesive soft gripper coinciding with the x-axis also gradually increases. This is because a stronger magnetic field results in greater magnetic potential energy, which overcomes more bending strain energy, leading to a longer adhesive contact length between the magnetically controlled intelligent adhesive soft gripper and the x-axis, and thus a greater gripping force. When the magnetic force is sufficiently large, the magnetic potential energy can overcome the bending strain energy of the magnetically controlled intelligent adhesive soft gripper, at which point the gripper is completely adhered to the x-axis, and the gripping force reaches its maximum.
[0060] like Figure 7 The diagram shows the actual deformation of the magnetically controlled intelligent adhesive soft gripper of this invention under the action of a magnetic field. As the magnetic field strength gradually increases, the adhesive contact area between the magnetically controlled intelligent adhesive soft gripper and the horizontal substrate increases accordingly. When the magnetic field strength increases to 600 mT, the magnetically controlled intelligent adhesive soft gripper can completely unfold into a planar state, achieving complete adhesive contact with the substrate. At this point, the gripping force reaches its maximum, which is consistent with the theoretical deformation results. Figure 6 Maintain consistency in qualitative analysis.
[0061] like Figure 8 The diagram illustrates the relationship between the gripping force and magnetic field strength of the magnetically controlled intelligent adhesive soft gripper of this invention. When the magnetic field strength is relatively high (600 mT), the magnetically controlled intelligent adhesive soft gripper can achieve a gripping force of approximately 3 N; as the magnetic field strength decreases, the gripping force also decreases. Furthermore, the gripping force can be adjusted by changing the magnetic field strength according to the following formula:
[0062] F = -3.258 × 10 -8 B 3 +4.338×10 -5 B 2 -1.072×10 -2 B+0.8959
[0063] Where: F is the grasping force, measured in Newtons (N); B is the magnetic field strength, measured in millite (mT);
[0064] like Figure 9 The following is a method for implementing a magnetically controlled intelligent adhesive soft gripper that adapts to the surface morphology of an object, as disclosed in this embodiment. The specific implementation steps are as follows:
[0065] In the first step, under no magnetic field conditions, the external field sensitive polymer backing layer remains in its initial state, and the functional surface of the adhesive structure exhibits weak gripping force.
[0066] The second step involves applying a magnetic field, which causes the external field-sensitive polymer backing layer to deform, resulting in adhesive contact between the functional surface of the adhesive structure and the object, and the object is successfully grasped.
[0067] In the third step, after the magnetic field is removed, the deformation of the external field-sensitive polymer backing layer disappears, and the functional surface of the adhesive structure recovers its initial morphology under the action of elastic strain energy, and the object is successfully released.
[0068] The above detailed description further illustrates the purpose, technical solution, and beneficial effects of the invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.
Claims
1. A soft gripper with adaptive magnetic smart-adhesion structure to the surface topography of an object, characterized by: It comprises two layers, the upper layer is an adherent structure functional surface, and the lower layer is an external field sensitive polymer backing layer; the adherent structure functional surface is a mushroom-shaped microstructure array, and the external field sensitive polymer backing layer is a magnetic particle filled polymer; The adherent structure functional surface material is polydimethylsiloxane; and the polymer material of the external field sensitive polymer backing layer is Ecoflex 00-30. The preparation method of the external field sensitive polymer backing layer comprises the following steps: a backing layer mold structure containing an initial curvature is prepared, a mixture of magnetic particles and Ecoflex 00-30 with a mass ratio of 1:1 is poured into the backing layer mold structure, the backing layer mold structure is placed in a vacuum drying box at 60-80 DEG C for curing for 40-120 minutes, and the external field sensitive polymer backing layer containing magnetic particles is obtained after curing. The method for preparing the magnetic control intelligent adherent structure soft gripper comprises the following steps: first, a mold structure of a mushroom-shaped microstructure array is prepared, and polydimethylsiloxane is filled in the mold structure; then, the polydimethylsiloxane is filled in the cavity through degassing treatment; subsequently, the external field sensitive polymer backing layer filled with magnetic particles is placed above the mold structure of the mushroom-shaped microstructure array, and a weight is used to flatten it; finally, the mold structure of the mushroom-shaped microstructure array is placed in a vacuum drying box at 60-80 DEG C for curing for 40-120 minutes, and the mushroom-shaped microstructure array with excellent adhesion performance is obtained after curing.
2. The adaptive magnetic smart-adhesion structure soft gripper for object surface topography according to claim 1, wherein: The preparation method of the external field sensitive polymer backing layer comprises the following steps: a backing layer mold structure containing an initial curvature is prepared, a mixture of magnetic particles and Ecoflex 00-30 with a mass ratio of 1:1 is poured into the backing layer mold structure, the backing layer mold structure is placed in a vacuum drying box at 80 DEG C for curing for 40 minutes, and the external field sensitive polymer backing layer containing magnetic particles is obtained after curing.
3. The magnetically controlled intelligent adhesion soft gripper with adaptive object surface morphology as described in claim 1, characterized in that: The length and width of the external field sensitive polymer backing layer filled with magnetic particles are both 20-30 mm, and the thickness is 1-3 mm.
4. The smart-adhesive structure soft gripper with self-adaptive object surface topography as claimed in claim 1, wherein: The size of a single mushroom-shaped microstructure in the mushroom-shaped microstructure array is that the height of the mushroom-shaped structure is 60-70 μm, the diameter of the stem of the mushroom-shaped structure is 40-45 μm, the diameter of the head of the mushroom-shaped structure is 60-70 μm, and the distance between two adjacent mushroom-shaped microstructures is 60-70 μm.
5. The soft gripper of claim 1, wherein: The magnetic particles are one or more of carbonyl iron powder, ferroferric oxide, neodymium iron boron and hydroxyl iron powder, and the particle size of the magnetic particles is 1-5 μm.
6. A soft gripper of adaptive object surface topography magnetic smart adhesive structure as claimed in claim 1, wherein: The working method comprises the following steps, In the first step, in the absence of a magnetic field, the external field sensitive polymer backing layer remains in the initial state, and the adherent structure functional surface presents weak gripping force; In the second step, after a magnetic field is applied, the external field sensitive polymer backing layer deforms, resulting in that the adherent structure functional surface forms adherent contact with the object, and the object is successfully gripped; The gripping force is adjusted by changing the magnetic field strength according to the following formula: F =-3.258×10 -8 B 3 +4.338×10 -5 B 2 -1.072×10 -2 B +0.8959 wherein: F is the gripping force, in Newton (N); B is the magnetic field strength, in milliTesla (mT); In the third step, after the magnetic field is removed, the deformation of the external field sensitive polymer backing layer disappears, the adherent structure functional surface restores the initial morphology under the action of elastic strain energy, and the object is successfully released.
Citation Information
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