Potting method for cellular board potting holes

Abstract

The invention relates to a cellular board potting hole potting method, which comprises the following steps of: inserting a cellular block into a potting hole, so that a potting adhesive flows from a lower opening to an upper opening of the potting hole to fill the cellular hole of the cellular block, and air in the cellular hole is discharged from the upper opening; the honeycomb blocks are flush with the honeycomb plates after being inserted in place; due to the fact that the density of the pouring sealant is much larger than that of air, the pouring sealant can be flushed into the honeycomb holes of the honeycomb block to discharge the air, the air discharging direction is consistent with the pouring sealant filling direction, and the air cannot reversely pass through the pouring sealant and cannot form bubbles. The rapid honeycomb potting method is easy to operate, low in cost, high in efficiency, complete in potting and filling after potting, free of bubble problems in honeycomb hole grids and suitable for potting operation of honeycomb cores with different thicknesses and different potting sizes.

Description

Technical Field

[0001] The invention relates to a composite material honeycomb core processing technology and to a potting method for potting holes of a honeycomb plate. Background Art

[0002] Composite honeycomb sandwich structures have the advantages of light weight, high bending strength and stiffness, strong anti-instability ability, fatigue and aging resistance, good sound absorption, sound insulation and heat insulation performance, etc., and have been widely used in the aerospace field. When composite honeycomb sandwich structures are assembled in the honeycomb area, in order to prevent damage to the sandwich structure and improve the mechanical properties of the parts, the honeycomb area needs to be potted. Due to the high viscosity of the potting glue and the small size and large number of honeycomb cells, the honeycomb potting area is difficult to be completely filled; and the potting glue is easily wrapped with gas, resulting in a large number of bubbles inside the potting glue, affecting the quality of the potting area of ​​the honeycomb sandwich structure and the subsequent manufacturing and assembly efficiency of the potting area. In the prior art, since the honeycomb panel is fixed on the work surface, the potting glue is injected from the potting hole, and the air will be discharged in reverse through the potting glue, causing the air to form bubbles.

[0003] Recent inventions for honeycomb potting methods are as follows:

[0004] 1) A device for resin potting of a honeycomb structure and a method for resin potting of a honeycomb structure using the device (application number CN112109255A): This patent is a method in which, after the non-potting area of ​​the honeycomb is sealed, the honeycomb is placed on a vacuum power part, a vacuum adsorption part and an isolation breathable part, potting glue is poured into the potting positioning part on the honeycomb, and then the vacuum power part under the honeycomb is turned on to form a vacuum condition under the honeycomb so that the potting glue flows into the honeycomb pores. This invention requires the design and manufacture of a potting device, the potting cost is relatively high, and the vacuum pressure needs to be accurately controlled. If the vacuum pressure is too high, the potting glue will flow into the pores of the vacuum adsorption part after passing through the isolation breathable part, causing the vacuum adsorption part to fail to work. If the vacuum pressure is too low, the vacuum potting effect cannot be achieved, affecting the potting quality and efficiency.

[0005] 2) Pre-potting molding tooling for honeycomb sandwich parts and its process (authorization number: CN102275342B): The honeycomb is placed on the mold, the mold and the honeycomb core are connected by positioning pins, and a retaining strip is placed around the honeycomb. After placing a potting sample on the honeycomb, the potting glue is placed on the honeycomb, and a pressing plate is placed on the potting glue. The potting glue is filled into the honeycomb cells through the pressing plate by using a paste vacuum bag to evacuate. This invention is not suitable for potting honeycomb parts with external shapes after processing, and the gas in the honeycomb cells is not discharged smoothly, and is easily retained in the potting glue, forming potting bubbles, resulting in poor potting quality.

[0006] 3) A method for forming a honeycomb sandwich part with potting glue (application number: CN115352101A): potting glue is evenly injected into the core cells of the honeycomb sandwich raw material, and processed into a filling module after curing. Potting holes are opened on the honeycomb according to the shape of the potting area, and the filling modules are wrapped with a compensating glue layer and placed in the honeycomb potting holes to realize the manufacture of honeycomb potting parts. The potting operation of the potting module still has the problems of low efficiency and low potting quality, and the subsequent manufacturing costs of curing, processing and bonding of the filling module are relatively high.

[0007] In summary, the honeycomb potting operation can be realized by using the above-mentioned honeycomb potting tooling and potting method, but there are problems such as complex potting operation, high manufacturing cost, and low potting quality, which cannot meet the manufacturing requirements of high quality, high efficiency and low cost. Summary of the invention

[0008] The purpose of the present invention is: the present invention proposes a method to effectively solve the technical problems of low efficiency of honeycomb potting operation and many bubbles in the potting glue, improve the quality and efficiency of honeycomb potting, and realize low-cost, high-efficiency and high-quality operation of large-area honeycomb potting, which can be widely applicable to the potting operation of honeycomb cores of different specifications and sizes.

[0009] The technical solution of the present invention is:

[0010] The present invention provides a potting method for potting holes of a honeycomb panel, which can solve the problems of incomplete honeycomb potting filling, bubbles in the potting and potting cracking, and improve the efficiency and quality of honeycomb potting.

[0011] In order to achieve the purpose of the present invention, a potting method for a honeycomb panel potting hole comprises the following steps:

[0012] Step 1, determining the potting opening position of the honeycomb panel, and opening the potting hole by machining; obtaining a honeycomb block having the same size as the potting hole opening space;

[0013] Use tape to isolate and protect the non-potting area on the honeycomb board, fix the honeycomb board on the work surface, and place blocking strips on the honeycomb board around the potting holes;

[0014] Step 2: injecting potting glue into the potting hole for filling;

[0015] Step 3, insert the honeycomb block into the potting hole, so that the potting glue flows from the lower opening to the upper opening of the potting hole to fill the honeycomb holes of the honeycomb block, and the air in the honeycomb holes is discharged from the upper opening; after being inserted into place, the honeycomb block is flush with the honeycomb panel; (Since the density of the potting glue is much greater than that of the air, the potting glue will rush into the honeycomb holes of the honeycomb block to discharge the air, and the air discharge direction is consistent with the potting glue filling direction, and the air will not pass through the potting glue in reverse, and no bubbles will be formed)

[0016] Step 4: remove the blocking strips around the potting hole and remove the excess potting glue, so that the potting glue is higher than the potting hole; and solidify the potting glue in the potting hole, first at room temperature and then at high temperature, so that the solidified potting glue protrudes from the potting hole;

[0017] Step 5: Machining the potting glue protruding after curing so that the potting glue is flush with the honeycomb panel.

[0018] Furthermore, the diameter of the honeycomb holes is less than 3.2 mm.

[0019] Furthermore, the machining method for opening the potting hole is to punch the hole with a punch, and the punched honeycomb block is used for filling in step 3.

[0020] Furthermore, the machining method for opening the potting holes is to use a rod milling cutter to destructively open the holes, and the honeycomb blocks are individually machined by a milling cutter.

[0021] Furthermore, the potting glue is a two-component epoxy resin glue, preferably, the brand is FM490A. Furthermore, the weight ratio of the matrix to the curing agent in the two-component epoxy resin glue is 100:20.

[0022] Furthermore, before the injection in step 2, the potting glue is evacuated and exhausted.

[0023] Furthermore, the diameter of the potting hole is not less than 15 mm.

[0024] Furthermore, the outer diameter of the honeycomb block is 1-2 mm smaller than the inner diameter of the potting hole.

[0025] Furthermore, the heat dissipation time of the room temperature curing is not less than 24 hours.

[0026] Furthermore, the high temperature curing temperature is 120-127°C, the curing time is 90 minutes, and the heating and cooling rate is not higher than 1.5°C / min.

[0027] The advantages of the present invention are: the honeycomb rapid potting method of the present invention is simple to operate, low in cost, and efficient, and after potting, the potting is completely filled and there is no bubble problem in the honeycomb cells, and it can be applied to the potting operation of honeycomb cores of different thicknesses and different potting sizes. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a relative position relationship diagram of various parts in the present invention;

[0029] Among them: 1-working table, 2-adhesive tape, 3-honeycomb board, 4-potting glue, 5-block, 6-cut-off honeycomb block. DETAILED DESCRIPTION

[0030] The disclosed examples will be more fully described with reference to the accompanying drawings, in which some (but not all) of the disclosed examples are shown. In fact, many different examples may be described and these examples should not be construed as limited to the examples set forth herein. Instead, these examples are described so that this disclosure will be thorough and complete and will fully convey the scope of the disclosure to those skilled in the art.

[0031] The present invention provides a potting method for potting holes of a honeycomb panel, which can solve the problems of incomplete honeycomb potting filling, bubbles in the potting and potting cracking, and improve the efficiency and quality of honeycomb potting.

[0032] In order to achieve the purpose of the present invention, a method for rapid potting of large-area honeycombs comprises the following steps:

[0033] Step 1, determining the potting opening position of the honeycomb panel, and opening the potting hole by machining; obtaining a honeycomb block having the same size as the potting hole opening space;

[0034] Use tape to isolate and protect the non-potting area on the honeycomb board, fix the honeycomb board on the work surface, and place blocking strips on the honeycomb board around the potting holes;

[0035] Step 2: injecting potting glue into the potting hole for filling;

[0036] Step 3, insert the honeycomb block into the potting hole, so that the potting glue flows from the lower opening to the upper opening of the potting hole to fill the honeycomb holes of the honeycomb block, and the air in the honeycomb holes is discharged from the upper opening; after being inserted into place, the honeycomb block is flush with the honeycomb panel; (Since the density of the potting glue is much greater than that of the air, the potting glue will rush into the honeycomb holes of the honeycomb block to discharge the air, and the air discharge direction is consistent with the potting glue filling direction, and the air will not pass through the potting glue in reverse, and no bubbles will be formed)

[0037] Step 4: remove the blocking strips around the potting hole and remove the excess potting glue, so that the potting glue is higher than the potting hole; and solidify the potting glue in the potting hole, first at room temperature and then at high temperature, so that the solidified potting glue protrudes from the potting hole;

[0038] Step 5: Machining the potting glue protruding after curing so that the potting glue is flush with the honeycomb panel.

[0039] The diameter of the honeycomb hole is 3.2mm.

[0040] The machining method for opening the potting hole is to punch the hole with a punch, and the punched honeycomb block is used for filling in step 3.

[0041] The machining method for opening the potting holes is to use a rod milling cutter to destructively open the holes, and the honeycomb blocks are individually processed by a milling cutter.

[0042] The potting glue is a two-component epoxy resin glue, brand FM490A. The weight ratio of the base and the curing agent in the two-component epoxy resin glue is 100:20.

[0043] Before the injection in step 2, the potting glue is evacuated and exhausted.

[0044] The diameter of the potting hole is not less than 15 mm.

[0045] The outer diameter of the honeycomb block is 1-2 mm smaller than the inner diameter of the potting hole.

[0046] The heat dissipation time of the room temperature curing is not less than 24 hours.

[0047] The high temperature curing temperature is 120-127°C, the curing time is 90 minutes, and the heating and cooling rate is not higher than 1.5°C / min.

[0048] The description of different advantageous arrangements has been presented for purposes of illustration and description, but the description is not intended to be exclusive or limited to examples of the disclosed form. Many modifications and variations will be apparent to those of ordinary skill in the art. Additionally, different advantageous examples may describe different advantages over other advantageous examples. The selected example or examples are chosen and described in order to best illustrate the principles of the examples, the practical application, and to enable those of ordinary skill in the art to understand the disclosure with various examples with various modifications suitable for the particular use contemplated.

Claims

1. A potting method for potting holes of honeycomb panels, characterized in that: The steps include: Step 1, determining the potting opening position of the honeycomb panel, and opening the potting hole by machining; obtaining a honeycomb block having the same size as the potting hole opening space; Use tape to isolate and protect the non-potting area on the honeycomb board, fix the honeycomb board on the work surface, and place blocking strips on the honeycomb board around the potting holes; Step 2: injecting potting glue into the potting hole for filling; Step 3, inserting the honeycomb block into the potting hole, so that the potting glue flows from the lower opening to the upper opening of the potting hole to fill the honeycomb holes of the honeycomb block, and the air in the honeycomb holes is discharged from the upper opening; After being inserted into place, the honeycomb block is flush with the honeycomb panel; Step 4: remove the blocking strips around the potting hole and remove the excess potting glue, so that the potting glue is higher than the potting hole; and solidify the potting glue in the potting hole, first at room temperature and then at high temperature, so that the solidified potting glue protrudes from the potting hole; Step 5: Machining the potting glue protruding after curing so that the potting glue is flush with the honeycomb panel.

2. A method for potting a honeycomb panel potting hole according to claim 1, characterized in that: The diameter of the honeycomb holes is less than 3.2 mm.

3. A method for potting a honeycomb panel potting hole according to claim 1, characterized in that: The machining method for opening the potting hole is to punch the hole with a punch, and the punched honeycomb block is used for filling in step 3.

4. A potting method for potting holes of a honeycomb panel as claimed in claim 1, characterized in that: The machining method for opening the potting holes is to use a rod milling cutter to open the holes in a destructive manner, and the honeycomb blocks are processed separately by a milling cutter.

5. A method for potting a honeycomb panel potting hole according to claim 1, characterized in that: The potting glue is a two-component epoxy resin glue. Preferably, the brand is FM490A. Furthermore, the weight ratio of the base and the curing agent in the two-component epoxy resin glue is 100:

20.

6. A method for potting a honeycomb panel potting hole according to claim 1, characterized in that: Before the injection in step 2, the potting glue is evacuated and exhausted.

7. A method for potting a honeycomb panel potting hole according to claim 1, characterized in that: The diameter of the potting hole is not less than 15 mm.

8. A method for potting a honeycomb panel potting hole according to claim 1, characterized in that: The outer diameter of the honeycomb block is 1-2 mm smaller than the inner diameter of the potting hole.

9. A method for potting a honeycomb panel potting hole according to claim 1, characterized in that: The heat dissipation time of the room temperature curing is not less than 24 hours.

10. A method for potting a honeycomb panel potting hole according to claim 1, characterized in that: The high temperature curing temperature is 120-127°C, the curing time is 90 minutes, and the heating and cooling rate is not higher than 1.5°C / min.

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