Semiconductor plastic package thickness detection device

Abstract

The invention relates to the technical field of semiconductor packaging, and provides a semiconductor plastic package thickness detection device which comprises a rack and a laser detector installed on the rack, a detection head is arranged on the laser detector, and a thickness regulation and control mechanism is arranged on the side, close to the detection head, of the laser detector. The thickness regulation and control mechanism comprises a shell connected with the laser detector, a lower induction column is arranged at the bottom of the shell, the bottom of the lower induction column extends out of the shell, the bottom of the lower induction column is rotationally connected with a ball, an upper induction column is arranged at the top of the shell, and the upper induction column is correspondingly arranged below the detection head. The laser detector overcomes the defects in the prior art, is reasonable in design and compact in structure, enlarges the tiny thickness change of the surface of the plastic package body through the lever unit, enhances the sensitivity of the laser detector, and improves the detection precision. And the wiping mechanism and the thickness change of the surface of the plastic package body form linkage, so that misjudgment caused by pollution of the lens of the detection head is avoided, and the accuracy of a detection result is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, and in particular to a semiconductor plastic packaging thickness detection device. Background Art

[0002] In the field of semiconductor packaging, the thickness of the plastic package is a key quality indicator in the packaging. In the current plastic packaging process, the mold is designed as a variable floating mold, and the cavity thickness of the mold is not fixed. During the molding process, the thickness of the plastic package may exceed the standard value due to various reasons such as mold deformation, foreign matter, and resin weight. Therefore, the detection of the thickness of the plastic package is indispensable in the plastic packaging process.

[0003] After molding, the plastic package body may have extremely slight thickness exceeding the standard in certain positions, and the existing detection devices often find it difficult to accurately capture these tiny thickness differences, and there is a risk of missed detection. Therefore, we propose a semiconductor plastic package thickness detection device. Summary of the invention

[0004] 1. Technical issues to be resolved

[0005] In view of the shortcomings of the prior art, the present invention provides a semiconductor plastic package thickness detection device, which overcomes the shortcomings of the prior art, has a reasonable design and a compact structure, and solves the problem that the existing detection devices are often difficult to accurately capture these tiny thickness differences and there is a risk of missed detection.

[0006] (II) Technical solution

[0007] To achieve the above objectives, the present invention is implemented through the following technical solutions: a semiconductor plastic package thickness detection device, including a frame and a laser detector installed thereon, the laser detector is provided with a detection head, and a thickness adjustment mechanism is provided on the side of the laser detector close to the detection head, the thickness adjustment mechanism includes a shell connected to the laser detector, a lower sensing column is provided at the bottom of the shell, the bottom of the lower sensing column extends out of the shell, and a ball is rotatably connected to the bottom, an upper sensing column is provided at the top of the shell, and the upper sensing column is correspondingly arranged below the detection head, and a lever unit is hinged in the shell, and the lever unit is respectively connected to the lower sensing column and the upper sensing column to increase the relative displacement of the upper sensing column.

[0008] Preferably, the lever unit includes a first lever and a second lever hinged in the shell, one end of the two levers are connected by a connecting rod so that the first lever can drive the second lever to move, the bottom of the first lever is connected to the inner wall of the shell by a spring so that the first lever and the second lever maintain a balanced state, the first lever is hinged to the lower sensing column at one end away from the connecting rod, and the first lever is provided with a first rotating shaft connected to the shell on both sides of the end close to the lower sensing column to control the displacement of the two ends of the first lever, the second lever is hinged to the upper sensing column at one end away from the connecting rod, and the second lever is provided with a second rotating shaft connected to the shell on both sides of the end close to the connecting rod to control the displacement distance of the two ends of the second lever.

[0009] Preferably, a wiping mechanism is provided on the shell, and the wiping mechanism includes a rotating column rotatably connected to the top of the shell, a carrying box is provided on one side of the rotating column, a wiping port is provided on the carrying box, a wiping cloth is installed in the wiping port, and the wiping port is located below the detection head so that the wiping cloth fits the lens of the detection head.

[0010] Preferably, the internal structure of the carrier box is symmetrical up and down, and a mounting roller, a first guide roller and a second guide roller are installed in pairs in the carrier box. The mounting rollers are detachably connected to the carrier box, and a wiping cloth roller is installed on one of the mounting rollers. The wiping cloth on the wiping cloth roller passes through the first guide roller and the second guide roller in sequence and is connected to the other mounting roller, so that the top of the wiping cloth fits the lens of the detection head, and one end of the mounting roller connected to the tail end of the wiping cloth is connected to a motor.

[0011] Preferably, the top of the carrying box is covered with a box cover.

[0012] Preferably, both ends of the mounting roller pass through the carrying box, and both ends are screws, and the outer walls of the screws are threadedly connected with nuts so that the mounting roller is installed on the carrying box, and there is a gap between the nuts on both sides and the side walls of the carrying box to facilitate the mounting roller to rotate relative to the carrying box.

[0013] Preferably, the rotating column is a hollow column, and an arc-shaped groove is provided in the internal circumference thereof and is obliquely opened along its inner wall. A pull rod is provided inside the rotating column, and an insert rod is provided on the outer wall of the top of the pull rod to be inserted into the arc-shaped groove. The bottom of the pull rod is hinged to the top of the second lever to control the rotation of the rotating column through the deflection of the second lever.

[0014] Preferably, the frame is provided with a bracket adjustment mechanism, and the bracket adjustment mechanism includes a first chain, a first guide rail is installed at one end of the first chain, a second guide rail is provided at the bottom of the first guide rail and is perpendicular to the direction of the first guide rail for the first guide rail to slide thereon, a sensor bracket is slidably connected to the first guide rail, and a second chain connected to the sensor bracket is provided on one side of the first guide rail to drive the sensor bracket to move in the direction of the first guide rail, and the sensor bracket is symmetrically provided with laser detectors above and below to simultaneously detect the upper and lower surfaces of the plastic package body.

[0015] Preferably, a track for carrying the plastic package body is provided on the top of the frame, a pushing mechanism is provided in the track, the pushing mechanism includes a third chain, a cylinder is provided on the third chain, and a push plate for pushing the plastic package body is provided at the output end of the cylinder.

[0016] (III) Beneficial effects

[0017] The embodiment of the present invention provides a semiconductor plastic package thickness detection device, which has the following beneficial effects:

[0018] 1. The lever unit amplifies the tiny thickness changes on the surface of the plastic package, which enhances the sensitivity of the laser detector and improves the detection accuracy.

[0019] 2. The wiping mechanism is linked to the thickness change of the plastic package surface, avoiding misjudgment caused by contamination of the lens of the detection head and ensuring the accuracy of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a main perspective schematic diagram of the overall structure of the present invention;

[0021] Figure 2 For the present invention Figure 1 A right-side perspective diagram of the structure;

[0022] Figure 3 For the present invention Figure 1 Schematic diagram of the back of the structure;

[0023] Figure 4 It is a three-dimensional schematic diagram of the structure of the laser detector of the present invention;

[0024] Figure 5 It is a three-dimensional schematic diagram of the housing structure of the present invention;

[0025] Figure 6 It is a top-down stereoscopic schematic diagram of the carrier box structure of the present invention after it is opened;

[0026] Figure 7 It is a schematic cross-sectional perspective view of the housing structure of the present invention;

[0027] Figure 8It is a schematic cross-sectional perspective view of the rotating column structure of the present invention.

[0028] In the figure: 1, frame; 2, laser detector; 3, detection head; 41, shell; 42, first lever; 421, lower sensing column; 422, ball; 423, first rotating shaft; 43, second lever; 431, upper sensing column; 432, second rotating shaft; 44, connecting rod; 45, spring; 51, rotating column; 511, arc groove; 512, pull rod; 513, insertion rod; 52, carrying box; 53, mounting roller; 54, first guide roller; 55, second guide roller; 56, motor; 57, box cover; 58, wiping port; 6, first chain; 7, first guide rail; 8, second guide rail; 9, sensor bracket; 10, second chain; 11, track; 12, third chain; 13, cylinder; 14, push plate. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] See attached Figure 1-8 A semiconductor plastic package thickness detection device includes a frame 1 and a laser detector 2 installed thereon to measure the thickness of the plastic package body. The laser detector 2 is provided with a detection head 3 for emitting and receiving laser signals. A thickness control mechanism is provided on the side of the laser detector 2 close to the detection head 3. The thickness control mechanism includes a shell 41 connected to the laser detector 2. A lower sensing column 421 is provided at the bottom of the shell 41. The lower sensing column 421 can only move in a vertical direction under the restriction of the shell 41. The bottom of the lower sensing column 421 extends out of the shell 41, and a ball 422 is rotatably connected to the bottom of the lower sensing column 421. The ball 422 is a spherical structure, and its bottom exceeds the lower sensing column 421. An upper sensing column 431 is provided on the top of the shell 41. The upper sensing column 431 can only move in a vertical direction under the restriction of the shell 41. The upper sensing column 431 is correspondingly arranged below the detection head 3. A lever unit is hinged in the shell 41. The lever unit is respectively connected to the lower sensing column 421 and the upper sensing column 431 to increase the relative displacement of the upper sensing column 431.

[0031] When in use, the ball 422 moves along the surface of the plastic package body. When the surface thickness of the plastic package body exceeds the standard, the ball 422 will contact the top of the plastic package body and be pushed upward. At this time, the lower sensing column 421 will also be pushed upward. At this time, the upper sensing column 431 will also be pushed upward under the drive of the lever unit. At this time, under the action of the lever unit, the upward movement distance of the upper sensing column 431 is significantly greater than the upward movement distance of the ball 422 and the lower sensing column 421, thereby relatively amplifying the slight changes in the surface thickness of the plastic package body, enhancing the sensitivity of the laser detector 2 to thickness changes, and thus improving the detection accuracy.

[0032] In order to amplify the displacement of the upper sensing column 431, the lever unit includes a first lever 42 and a second lever 43 hinged in the shell 41, the two levers are horizontally arranged up and down, one end of the two levers is connected by a connecting rod 44, so that the first lever 42 can drive the second lever 43 to move, the bottom of the first lever 42 is connected to the inner wall of the shell 41 by a spring 45, so that the first lever 42 and the second lever 43 maintain a balanced state, one end of the first lever 42 away from the connecting rod 44 is hinged to the lower sensing column 421, and the first lever 42 is provided with a first rotating shaft 423 connected to the shell 41 on both sides of the end of the lower sensing column 421, so that the first lever 42 can move. To control the displacement of both ends of the first lever 42, one end of the second lever 43 away from the connecting rod 44 is hinged to the upper sensing column 431, and the second lever 43 is provided with second rotating shafts 432 connected to the shell 41 on both sides of the end of the connecting rod 44 to control the displacement distance of both ends of the second lever 43. When the ball 422 at the bottom of the lower sensing column 421 is squeezed by the plastic package body, the first lever 42 rotates around the first rotating shaft 423, and drives the second lever 43 to rotate around the second rotating shaft 432 through the connecting rod 44, thereby amplifying the relative displacement of the upper sensing column 431, so that the laser detector 2 can more easily sense the change of the surface thickness of the plastic package body.

[0033] In order to keep the lens of the detection head 3 clean, a wiping mechanism is provided on the shell 41, and the wiping mechanism includes a rotating column 51 rotatably connected to the top of the shell 41, and a carrying box 52 is provided on one side of the rotating column 51. The carrying box 52 is provided with a wiping port 58, and a wiping cloth is installed in the wiping port 58. The wiping cloth is made of microfiber cloth and is located under the detection head 3 so that the wiping cloth can fit the lens of the detection head 3. By controlling the rotation of the rotating column 51, the carrying box 52 can drive the wiping cloth to rotate. In this process, the wiping cloth can wipe the lens of the detection head 3 without the need for regular manual wiping.

[0034] The internal structure of the carrying box 52 is symmetrical from top to bottom. A mounting roller 53, a first guide roller 54 and a second guide roller 55 are installed in pairs in the carrying box 52. The mounting roller 53 is detachably connected to the carrying box 52. A wiping cloth roller is installed on one of the mounting rollers 53. The wiping cloth on the wiping cloth roller passes through the first guide roller 54 and the second guide roller 55 in sequence and is connected to the other mounting roller 53. The wiping cloth can be kept in a taut state so that the top of the wiping cloth fits the lens of the detection head 3, and one end of the mounting roller 53 connected to the tail end of the wiping cloth is connected to a motor 56. When the motor 56 is started, the mounting roller 53 connected thereto will rotate, thereby winding the wiping cloth to prevent the wiping cloth that contacts the lens of the detection head 3 from being contaminated with more impurities and affecting the wiping effect.

[0035] The top of the carrying box 52 is covered with a box cover 57 to protect the wiping cloth from external contamination.

[0036] Both ends of the mounting roller 53 pass through the supporting box 52, and both ends are screws, and nuts are threadedly connected to the outer walls of the screws so that the mounting roller 53 can be installed on the supporting box 52. There is a gap between the nuts on both sides and the side walls of the supporting box 52 to facilitate the rotation of the mounting roller 53 relative to the supporting box 52, making it convenient to disassemble the mounting roller 53 and replace it with a new wiping cloth roller.

[0037] The rotating column 51 is a hollow column, and an arc groove 511 is provided in its internal circumference along its inner wall. A pull rod 512 is provided inside the rotating column 51, and an outer wall at the top of the pull rod 512 is provided with an insertion rod 513 inserted into the arc groove 511. The bottom of the pull rod 512 is hinged to the top of the second lever 43 to control the rotation of the rotating column 51 by the deflection of the second lever 43. When the ball 422 is lifted by the top of the plastic package body, the second lever 43 will deflect, further causing the pull rod 512 to be pulled downward. At this time, the insertion rod 513 moves downward in the arc groove 511, causing the rotating column 51 to deflect, further causing the carrier box 52 to drive the wiping sheet to deflect and wipe the lens of the detection head 3, thereby realizing the linkage control of the wiping of the lens of the detection head 3 and the change of the surface thickness of the plastic package body, effectively preventing the problem of misjudgment of the surface thickness of the plastic package body caused by contamination of the lens surface of the detection head 3, and ensuring the accuracy of the detection result.

[0038] In order to realize the detection of different positions of the plastic-sealed body, a bracket adjustment mechanism is provided on the frame 1, and the bracket adjustment mechanism includes a first chain 6, a first guide rail 7 is installed at one end of the first chain 6, and a second guide rail 8 is provided at the bottom of the first guide rail 7 in a perpendicular state to the direction thereof, so that the first guide rail 7 can slide thereon, the first chain 6 moves and drives the first guide rail 7 to move along the second guide rail 8, a sensor bracket 9 is slidably connected to the first guide rail 7, and a second chain 10 connected to the sensor bracket 9 is provided on one side thereof to drive the sensor bracket 9 to move in the direction of the first guide rail 7, the second chain 10 moves and drives the sensor bracket 9 to move along the first guide rail 7, thereby realizing the detection of different positions of the plastic-sealed body, the first chain 6 drives the first guide rail 7 to move and the second chain 10 drives the sensor bracket 9 to move, which belongs to the prior art and is not described in detail in this application, and the sensor bracket 9 is symmetrically provided with a laser detector 2 above and below to simultaneously detect the upper and lower surfaces of the plastic-sealed body to improve the detection efficiency.

[0039] A track 11 for carrying the plastic-sealed body is provided on the top of the frame 1. The plastic-sealed body moves along the track 11. A pushing mechanism is provided in the track 11. The pushing mechanism includes a third chain 12. A cylinder 13 is provided on the third chain 12. The third chain 12 can drive the cylinder 13 to move and belongs to the prior art. No specific details are given in this application. A push plate 14 for pushing the plastic-sealed body is provided at the output end of the cylinder 13. When the plastic-sealed body needs to be pushed, the third chain 12 drives the cylinder 13 and the push plate 14 to move. At this time, the push plate 14 pushes the plastic-sealed body to move along the track 11. After the push plate 14 pushes the plastic-sealed body to a suitable position, the output end of the cylinder 13 is controlled to retract, so that the push plate 14 can move downward. Then, after the third chain 12 is controlled to reset to its initial position, the output end of the cylinder 13 is controlled to extend upward, so that the push plate 14 can continue to push the plastic-sealed body at that location.

[0040] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0041] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A semiconductor plastic package thickness detection device, comprising a frame (1) and a laser detector (2) mounted thereon, wherein the laser detector (2) is provided with a detection head (3), characterized in that: A thickness control mechanism is provided on a side of the laser detector (2) close to the detection head (3), and the thickness control mechanism comprises a shell (41) connected to the laser detector (2); a lower sensing column (421) is provided at the bottom of the shell (41); the bottom of the lower sensing column (421) extends out of the shell (41), and a ball (422) is rotatably connected to the bottom of the lower sensing column (421); an upper sensing column (431) is provided at the top of the shell (41), and the upper sensing column (431) is correspondingly arranged below the detection head (3); a lever unit is hinged in the shell (41), and the lever unit is respectively connected to the lower sensing column (421) and the upper sensing column (431) to increase the relative displacement of the upper sensing column (431).

2. A semiconductor plastic package thickness detection device as claimed in claim 1, characterized in that: The lever unit comprises a first lever (42) and a second lever (43) hinged in a housing (41), one end of the first lever (42) and the second lever (43) being connected via a connecting rod (44) so ​​that the first lever (42) can drive the second lever (43) to move, the bottom of the first lever (42) being connected to the inner wall of the housing (41) via a spring (45) so that the first lever (42) and the second lever (43) are kept in a balanced state, and one end of the first lever (42) away from the connecting rod (44) is in contact with the lower sensing column (42). 1) hinged, the first lever (42) is provided with a first rotating shaft (423) connected to the housing (41) on both sides of one end thereof close to the lower sensing column (421) to control the displacement of the two ends of the first lever (42), the second lever (43) is hinged with an upper sensing column (431) on one end thereof away from the connecting rod (44), and the second lever (43) is provided with a second rotating shaft (432) connected to the housing (41) on both sides of one end thereof close to the connecting rod (44) to control the displacement distance of the two ends of the second lever (43).

3. A semiconductor plastic package thickness detection device as claimed in claim 2, characterized in that: The housing (41) is provided with a wiping mechanism, the wiping mechanism comprising a rotating column (51) rotatably connected to the top of the housing (41), a carrying box (52) is provided on one side of the rotating column (51), the carrying box (52) is provided with a wiping port (58), a wiping cloth is installed in the wiping port (58), and the wiping port (58) is located below the detection head (3) so that the wiping cloth fits the lens of the detection head (3).

4. A semiconductor plastic package thickness detection device as claimed in claim 3, characterized in that: The internal structure of the carrier box (52) is symmetrical in the upper and lower parts. A mounting roller (53), a first guide roller (54) and a second guide roller (55) are installed in pairs in the carrier box (52). The mounting rollers (53) are detachably connected to the carrier box (52). A wiping cloth roller is installed on one of the mounting rollers (53). The wiping cloth on the wiping cloth roller passes through the first guide roller (54) and the second guide roller (55) in sequence and is then connected to the other mounting roller (53), so that the top of the wiping cloth fits the lens of the detection head (3), and one end of the mounting roller (53) connected to the tail end of the wiping cloth is connected to a motor (56).

5. A semiconductor plastic package thickness detection device as claimed in claim 3 or 4, characterized in that: The top of the carrying box (52) is covered with a box cover (57).

6. A semiconductor plastic package thickness detection device as claimed in claim 4, characterized in that: Both ends of the installation roller (53) pass through the carrier box (52), and both ends are screws, and the outer wall of the screw is threadedly connected with a nut, so that the installation roller (53) is installed on the carrier box (52), and there is a gap between the nuts on both sides and the side wall of the carrier box (52), so that the installation roller (53) can rotate relative to the carrier box (52).

7. A semiconductor plastic package thickness detection device as claimed in claim 4, characterized in that: The rotating column (51) is a hollow column, and an arc groove (511) is provided on its inner circumference and obliquely opened along its inner wall. A pull rod (512) is provided inside the rotating column (51), and an insert rod (513) is provided on the outer wall of the top of the pull rod (512) to be inserted into the arc groove (511). The bottom of the pull rod (512) is hinged to the top of the second lever (43) to control the rotation of the rotating column (51) through the deflection of the second lever (43).

8. A semiconductor plastic package thickness detection device as claimed in claim 7, characterized in that: The frame (1) is provided with a bracket adjustment mechanism, the bracket adjustment mechanism comprising a first chain (6), one end of the first chain (6) is provided with a first guide rail (7), the bottom of the first guide rail (7) is provided with a second guide rail (8) which is perpendicular to the direction of the first guide rail (7) so that the first guide rail (7) can slide thereon, a sensor bracket (9) is slidably connected to the first guide rail (7), one side of the first guide rail is provided with a second chain (10) connected to the sensor bracket (9) so as to drive the sensor bracket (9) to move along the direction of the first guide rail (7), and the sensor bracket (9) is symmetrically provided with laser detectors (2) above and below so as to detect the upper and lower surfaces of the plastic package body at the same time.

9. A semiconductor plastic package thickness detection device as claimed in claim 8, characterized in that: A track (11) for carrying the plastic-encapsulated body is provided on the top of the frame (1), a material pushing mechanism is provided inside the track (11), the material pushing mechanism comprises a third chain (12), a cylinder (13) is provided on the third chain (12), and a push plate (14) for pushing the plastic-encapsulated body is provided at the output end of the cylinder (13).

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