Method and device for analyzing service life of copper wire in flexible circuit board and medium

Abstract

The invention discloses an analysis method and device for the service life of a copper wire in a flexible circuit board and a medium, and the method comprises the steps: building a flexible circuit board model, and obtaining the tensile strength and elastic modulus of the copper wire in the flexible circuit board; determining a stress fatigue curve of the copper wire based on the tensile strength and the elastic modulus; setting a preset constraint condition for the flexible circuit board model, applying a preset load, and determining a stress result of the copper wire under the preset constraint condition and the preset load; based on the periodic load type corresponding to the preset load received by the flexible circuit board, establishing a cyclic working condition of the flexible circuit board; and determining the fatigue life of the copper wire based on the stress fatigue curve, the stress result and the circulation working condition. According to the method, the fatigue life of the copper wire is determined by performing fatigue analysis on the copper wire in the flexible circuit board under a preset constraint condition and a preset load.

Description

Technical Field

[0001] The invention relates to the field of circuit board performance testing, and in particular to an analysis method, equipment and medium for the service life of copper wires inside a flexible circuit board. Background Art

[0002] Flexible Printed Circuit (FPC), also known as soft board, is a highly reliable and flexible printed circuit board made of polyimide or polyester film as the substrate. It is an indispensable and important connector for aviation, aerospace, military, automobile and consumer electronics products.

[0003] At present, flexible circuit boards have been widely used in various industries, such as the mobile phone industry and the camera industry in the electronic equipment industry. In particular, the flexible circuit boards installed in the fingerprint module may fail due to fatigue of the copper wire inside the flexible circuit board and bend the circuit board due to human operation, causing the components to not function properly. For example, the button module on the side of the mobile phone will be frequently pressed during years of use, which will cause the flexible circuit board to bend, and the copper wire inside it will also face the risk of fatigue failure due to years of bending. If the fatigue life does not meet the requirements, the copper wire breakage will cause poor function of the mobile phone.

[0004] Currently, major mobile phone manufacturers and fingerprint module manufacturers have not yet found a way to analyze the service life of the copper wires inside such flexible circuit boards. Summary of the invention

[0005] The embodiments of the present application provide a method, device and medium for analyzing the service life of copper wires inside a flexible circuit board. The analysis method determines the fatigue life of the copper wires by performing fatigue analysis on the copper wires inside the flexible circuit board under preset constraints and preset loads.

[0006] In a first aspect, the present invention provides the following technical solution through an embodiment of the present invention:

[0007] A method for analyzing the service life of copper wires inside a flexible circuit board, comprising:

[0008] A flexible circuit board model is established, and the tensile strength and elastic modulus of the copper wire inside the flexible circuit board are obtained; based on the tensile strength and the elastic modulus, a stress fatigue curve of the copper wire is determined; preset constraints are set for the flexible circuit board model, and a preset load is applied to determine the stress results of the copper wire under the preset constraints and the preset load; based on the periodic load corresponding to the preset load received by the flexible circuit board, a cyclic operating condition of the flexible circuit board is established; based on the stress fatigue curve, the stress results and the cyclic operating condition, the fatigue life of the copper wire is determined.

[0009] Preferably, the establishment of the flexible circuit board model includes: establishing a three-dimensional model of each stack in the flexible circuit board according to the design of the flexible circuit board, wherein the three-dimensional model includes a structural model of the copper wire inside the flexible circuit board; dividing the three-dimensional model into grids, establishing a connection relationship between each stack, and assigning material properties to each stack to establish a flexible circuit board model.

[0010] Preferably, the establishing of the connection relationship between the stacked layers includes: establishing a binding contact relationship between the components divided into grids to connect the stacked layers.

[0011] Preferably, the material properties of each laminate include: Young's modulus and Poisson's ratio.

[0012] Preferably, the flexible circuit board is arranged in a fingerprint button module, and the periodic load type is a periodic load of pressing and rebounding corresponding to the flexible circuit board when receiving pressing.

[0013] Preferably, setting preset constraints on the flexible circuit board model includes: fixing the connection portion of the flexible circuit board model in the fingerprint button module to simulate a situation where the flexible circuit board is fixed in the fingerprint button module.

[0014] Preferably, determining the stress fatigue curve of the copper wire based on the tensile strength and the elastic modulus comprises: bringing the tensile strength and the elastic modulus into a preset fatigue analysis software to determine the stress fatigue curve of the copper wire.

[0015] Preferably, determining the fatigue life of the copper wire based on the stress fatigue curve, the stress result and the cycle condition includes: importing the stress fatigue curve, the stress result and the cycle condition into a preset fatigue analysis software to determine the fatigue life of the copper wire.

[0016] In a second aspect, the present invention provides the following technical solution through an embodiment of the present invention:

[0017] An electronic device comprises: a memory, a processor and a computer program stored in the memory and executable on the processor, wherein when the processor executes the program, the steps of any one of the methods described in the first aspect are implemented.

[0018] In a third aspect, the present invention provides the following technical solution through an embodiment of the present invention:

[0019] A computer-readable storage medium stores a computer program, which, when executed by a processor, implements the steps of any one of the methods described in the first aspect.

[0020] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0021] The analysis method for the service life of the copper wire inside the flexible circuit board provided by the embodiment of the present invention first establishes a flexible circuit board model, and estimates the stress fatigue curve of the copper wire based on the tensile strength and elastic modulus of the copper wire inside the flexible circuit board. This estimation method greatly shortens the acquisition time of the stress fatigue curve of the metal material; sets constraints on the flexible circuit board model, applies loads, determines the stress results of the copper wire, and sets cyclic working conditions; finally, determines the fatigue life of the copper wire based on the stress fatigue curve, stress results, and cyclic working conditions. This method can effectively analyze the fatigue life of the copper wire inside the flexible circuit board, estimate the service life of the flexible circuit board, and apply the analysis results to design improvements and application guidance, further improving the production quality of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 A flow chart of a method for analyzing the service life of copper wires inside a flexible circuit board provided by an embodiment of the present invention;

[0024] Figure 2 A schematic diagram of the structure of a flexible circuit board used in a fingerprint button module provided by an embodiment of the present invention;

[0025] Figure 3a A schematic diagram of a three-dimensional model structure of a traditional flexible circuit board provided in an embodiment of the present invention;

[0026] Figure 3b A schematic diagram of the three-dimensional model structure of each laminated layer of the flexible circuit board provided in an embodiment of the present invention;

[0027] Figure 4 A schematic diagram of the finite element model structure of a flexible circuit board provided in an embodiment of the present invention;

[0028] Figure 5 A schematic diagram of a flexible circuit board structure for establishing a connection relationship provided by an embodiment of the present invention;

[0029] Figure 6 A schematic diagram of the properties of various laminated materials provided in an embodiment of the present invention;

[0030] Figure 7A schematic diagram of estimating the SN curve based on tensile strength and elastic modulus provided in an embodiment of the present invention;

[0031] Figure 8 A schematic diagram of a stress fatigue curve provided by an embodiment of the present invention;

[0032] Fig. 9 A schematic diagram of the structure of the connection portion for fixing the flexible circuit board provided in an embodiment of the present invention;

[0033] Fig.10 A schematic diagram of simulation of a flexible circuit board under preset load and preset constraint conditions provided by an embodiment of the present invention;

[0034] Fig.11 A schematic diagram of stress results of a flexible circuit board provided by an embodiment of the present invention;

[0035] Fig.12 A schematic diagram of importing stress results into fatigue analysis software for analysis provided by an embodiment of the present invention;

[0036] Fig.13 A schematic diagram of the structure of a fingerprint button module under cyclic working conditions provided by an embodiment of the present invention;

[0037] Fig.14 A simplified structural diagram of a fingerprint key module under cyclic working conditions provided by an embodiment of the present invention;

[0038] Fig.15 A schematic diagram of fatigue life results of a copper wire provided by an embodiment of the present invention;

[0039] Fig.16 A schematic diagram of the structure of an electronic device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0040] The embodiments of the present application provide a method, device and medium for analyzing the service life of copper wires inside a flexible circuit board. The analysis method determines the fatigue life of the copper wires by performing fatigue analysis on the copper wires inside the flexible circuit board under preset constraints and preset loads.

[0041] The overall idea of ​​the technical solution of the embodiment of the present application is as follows:

[0042] A method for analyzing the service life of copper wires inside a flexible circuit board comprises: establishing a flexible circuit board model, and obtaining the tensile strength and elastic modulus of the copper wires inside the flexible circuit board; determining a stress fatigue curve of the copper wire based on the tensile strength and the elastic modulus; setting preset constraints on the flexible circuit board model, and applying a preset load to determine the stress result of the copper wire; establishing a cyclic working condition of the flexible circuit board based on a periodic load corresponding to the preset load received by the flexible circuit board; and determining the fatigue life of the copper wire based on the stress fatigue curve, the stress result and the cyclic working condition.

[0043] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0044] It should be noted that the tensile strength referred to in this application refers to the resistance to the maximum uniform plastic deformation of the copper wire, the elastic modulus refers to the stress of the copper wire under a unidirectional stress state divided by the strain in that direction, the stress fatigue curve refers to the relationship curve between fatigue stress and fatigue life, and the preset load refers to the external force borne by the flexible circuit board.

[0045] In a first aspect, an embodiment of the present invention provides a method for analyzing the service life of copper wires inside a flexible circuit board. Specifically, Figure 1 As shown, the method includes the following steps S101 to S105.

[0046] Step S101, establishing a flexible circuit board model, and obtaining the tensile strength and elastic modulus of the copper wire inside the flexible circuit board.

[0047] It can be understood that the flexible circuit board targeted by the present application can be a flexible circuit board included in various types of components provided in the device, for example, a fingerprint module, a button module, a fingerprint button module and other components in a mobile phone.

[0048] In order to facilitate the understanding of the technical solution of the present application, the analysis method provided in this embodiment will be described in detail below by taking a fingerprint button module as an example.

[0049] like Figure 2 As shown, it is a schematic diagram of the structure of a flexible circuit board used in a fingerprint button module, 101 is a flexible circuit board. Due to uneven force during the pressing process, the fingerprint button module will rotate to a certain extent, the flexible circuit board will bend to a certain extent, and the internal copper wire will also bend, thus facing fatigue failure.

[0050] In the specific implementation process, establishing a flexible circuit board model may include: establishing a three-dimensional model of each stacked layer in the flexible circuit board according to the design of the flexible circuit board, wherein the three-dimensional model includes a structural model of the copper wire inside the flexible circuit board; dividing the three-dimensional model into grids, establishing a connection relationship between each stacked layer, and assigning material properties to each stacked layer to establish a flexible circuit board model.

[0051] Specifically, in order to truly reflect the model of the copper wire inside the flexible circuit board, a three-dimensional model of each layer of the flexible circuit board can be built in the software according to the design schematic of the flexible circuit board, such as Figure 3a As shown in FIG. 1 , it is a schematic diagram of the structure of a flexible circuit board under a conventional general structural design. Figure 3b , which is a schematic diagram of the three-dimensional model structure of each stacked layer of the flexible circuit board established in this application, 102 is a copper wire structure.

[0052] Next, the three-dimensional model of the entire flexible circuit board is meshed to establish a finite element model, such as Figure 4 As shown, it is a schematic diagram of the finite element model structure of a flexible circuit board, wherein the method for obtaining a finite element model includes meshing, boundary conditions and loading. Meshing is to replace the three-dimensional solid model with a finite element approximation for calculation. The finite element type here can be a first-order hexahedral reduced integral unit, i.e., C3D8R. The meshing process is automatically generated in the meshing software according to the division logic instruction. For example, the meshing process can use hexahedral units to divide the mesh, and refine the mesh at the connection between the fingerprint button module and the flexible circuit board. Refining the mesh refers to encrypting the mesh to improve the calculation accuracy, but the type of the encrypted unit remains unchanged, which is also C3D8R. Meshing can convert the three-dimensional model into a finite unit, complete the solution of the shape function in the unit, and complete the finite element simulation.

[0053] Since the internal layers of the flexible circuit board are connected by gluing, the connection properties between the layers are established as binding, such as Figure 5 The figure shows a schematic diagram of the flexible circuit board structure with established connection relationships. The established relationship here can be understood as bonding the components into a whole through glue. During the finite element model simulation process, the components need to establish a binding contact relationship so that the components (layers) are connected together. It should be noted that the glue layer of the glue connection of each layer of the flexible circuit board is also divided into meshes and converted into finite elements, and the glue layer of the finite element of each layer is also consistent.

[0054] Next, the material properties of each laminate can be assigned based on the preset material property library. For example, the material properties of each laminate can include: Young's modulus and Poisson's ratio. The size of Young's modulus indicates the rigidity of the material. The larger the Young's modulus, the less likely it is to deform. Poisson's ratio refers to the absolute value of the ratio of the lateral strain caused by the uniformly distributed longitudinal stress to the corresponding longitudinal strain within the proportional limit of the material. Figure 6 As shown, the material property values ​​corresponding to each stacked layer are established. The established material properties are assigned to each component to establish a flexible circuit board model.

[0055] As an example, the stacked layers may include a capping layer, copper, a base plate, a solid mask, and glue, such as Figure 6 As shown, when the stacking layer material is a cover layer, the Young's modulus of the stack is 2200 MPa and the Poisson's ratio is 0.35; when the stacking layer material is copper, the Young's modulus of the stack is 115000 MPa and the Poisson's ratio is 0.33; when the stacking layer material is a base board, the Young's modulus of the stack is 6800 MPa and the Poisson's ratio is 0.4; when the stacking layer material is a solid mask, the Young's modulus of the stack is 3300 MPa and the Poisson's ratio is 0.3; when the stacking layer material is glue, the Young's modulus of the stack is 2500 MPa and the Poisson's ratio is 0.38.

[0056] Step S102: determining a stress fatigue curve of the copper wire based on the tensile strength and the elastic modulus.

[0057] In a specific embodiment, based on the tensile strength and elastic modulus, the stress fatigue curve of the copper wire is determined, which may specifically include: bringing the tensile strength and elastic modulus into a preset fatigue analysis software to determine the stress fatigue curve of the copper wire (ie, the SN curve).

[0058] like Figure 7 As shown in the figure, it is a schematic diagram of SN curve estimation based on the tensile strength and elastic modulus of copper wire. The schematic diagram of SN curve estimation indicates that when the material is subjected to a force of 228.132MPa, its fatigue life is 104 times; when the material is subjected to a force of 118.355MPa, its fatigue life is 107 times. The data software in the middle will automatically perform interpolation processing.

[0059] like Figure 8 The figure shows the stress fatigue curve of the copper wire inside the flexible circuit board. The vertical axis represents the stress magnitude in MPa, and the horizontal axis represents the fatigue value. The horizontal axis appears in the form of a logarithm with a base of 10, because the range of high-cycle fatigue calculation is 10. 4 ~10 7 , so more than 107 Not considered.

[0060] Step S103, setting preset constraints on the flexible circuit board model, and applying a preset load, to determine the stress result of the copper wire under the preset constraints and the preset load.

[0061] In a specific embodiment, setting preset constraints for the flexible circuit board model may specifically include: fixing the connection portion of the flexible circuit board model in the fingerprint button module to simulate the situation where the flexible circuit board is fixed in the fingerprint button module.

[0062] like Fig. 9 As shown, it is a schematic diagram of the connection structure for fixing the flexible circuit board. This application is for the fingerprint button module on the side of the mobile phone. The position 201 is pressed and displaced downward by 0.2mm. The connection part 202 is bonded to other parts by glue for fixed constraint. The stress of the copper wire is analyzed when the position 201 is displaced downward by 0.2mm.

[0063] like Fig.10 As shown, it is a simulation diagram of a flexible circuit board under preset load and preset constraint conditions. The forced displacement load is applied at position 201, with a downward displacement of 0.2 mm. The position 202 is bonded to other parts by glue as a preset constraint.

[0064] Specifically, preset constraints are set for the flexible circuit board model, and preset loads are applied to determine the stress results of the copper wire, including: importing the preset constraints and preset loads into finite element software ABAQUS to determine the stress results of the copper wire.

[0065] Specifically, based on the principle of finite element simulation calculation, the material properties are assigned to the discretized model (fixed points and applied loads are specified in the simulation software), and the stress results of the copper wire are determined by the deformation balance of the stiffness matrix under the action of external forces. Optionally, the simulation here is calculated in the form of linear algebra, and the calculation principle is the balance between the deformation of the stiffness matrix and the external force, and the stress results are calculated by this method. Fig.11 As shown in the figure, it is a schematic diagram of the stress results of the copper wire inside the flexible circuit board. The darker the color, the greater the stress at that position. For example, the stress at position 203 is smaller, and the stress at position 204 is larger.

[0066] like Fig.12 As shown, after obtaining the stress results of the copper wire, the stress results are exported to fatigue analysis software (for example: FE-SAFE software).

[0067] Step S104: establishing a cyclic working condition of the flexible circuit board based on a periodic load corresponding to a preset load received by the flexible circuit board.

[0068] Specifically, the flexible circuit board is arranged in the fingerprint button module, and the cyclic load type here is the cyclic load of the flexible circuit board corresponding to the pressing and rebounding when receiving the pressing. Fig.13 As shown in the figure, it is a schematic diagram of the structure of the fingerprint button module under cyclic working conditions. The module is pressed downward by 0.2mm. When the pressing force is released, the module rebounds upward by 0.2mm. Therefore, the module cycles back and forth between 0.2mm downward and 0.2mm upward, forming a cyclic load of pressing and rebounding, and establishing a cyclic working condition of the flexible circuit board.

[0069] like Fig.14 As shown, it is a simplified structural diagram of the fingerprint button module under cyclic conditions, where 1 and -1 represent alternating symmetrical cycles, 1 represents a downward displacement of the module by 0.2 mm, and -1 represents an upward displacement of the module by 0.2 mm.

[0070] Step S105, determining the fatigue life of the copper wire based on the stress fatigue curve, the stress result and the cycle condition.

[0071] In a specific embodiment, the stress fatigue curve, stress results and cycle conditions are imported into the preset fatigue analysis software to determine the fatigue life of the copper wire. Specifically, the elastic modulus and tensile strength (ie, breaking strength) of the material are input into the FE-SAFE software for calculation to obtain the SN curve, wherein the horizontal coordinate of the SN curve is stress and the vertical coordinate is fatigue life, so that the fatigue life corresponding to each stress magnitude can be obtained according to the SN curve. And because different working conditions correspond to different average stresses, it is also necessary to input the working conditions into the FE-SAFE software, calculate the average stress under the working condition under the correction algorithm, and then calculate the fatigue life under the working condition based on the average stress and the SN curve. Fig.15 The figure shows the fatigue life results of copper wire. The darkest color represents 3.54x105 times of service life, and the lightest color represents 107 or permanent life.

[0072] In summary, this application builds a three-dimensional model of a flexible circuit board based on the design schematic of the flexible circuit board, analyzes the stress results of the copper wire according to the actual situation, and then imports the analyzed stress results of the copper wire into the fatigue analysis software. When importing into the fatigue analysis software, only the stress results of the copper wire are imported. Then, the SN curve is estimated based on the tensile strength and elastic modulus of the copper wire, and finally the fatigue life of the copper wire is analyzed.

[0073] In a second aspect, based on the same inventive concept, this embodiment provides an electronic device 500, such as Fig.16As shown, it includes: a memory 501, a processor 502 and a computer program 503 stored in the memory and executable on the processor. When the processor 501 executes the program, the steps of the method for analyzing the service life of the copper wire inside the flexible circuit board described in the first aspect are implemented.

[0074] Those skilled in the art will readily appreciate other embodiments of the invention after considering the specification and practicing the invention disclosed herein. The present invention is intended to cover any variations, uses or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art that are not disclosed in this disclosure. The description and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0075] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Therefore, the present invention may take the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware. Moreover, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0076] The present invention is described with reference to flowcharts and / or block diagrams of methods, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowchart and / or block diagram. Figure 1 A process or multiple processes and / or boxes Figure 1 A module that specifies functions in one or more boxes.

[0077] These computer program instructions may also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory produce a manufactured product including an instruction module, which is implemented in the process Figure 1 A process or multiple processes and / or boxes Figure 1 A function specified in one or more boxes.

[0078] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operating steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing instructions for implementing the process in the computer or other programmable device. Figure 1 A process or multiple processes and / or boxes Figure 1 The steps for the functions specified in one or more boxes.

[0079] Although the preferred embodiments of the present invention have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0080] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for analyzing the service life of copper wires inside a flexible circuit board, characterized in that: include: Establishing a flexible circuit board model and obtaining the tensile strength and elastic modulus of the copper wire inside the flexible circuit board; Determining a stress fatigue curve of the copper wire based on the tensile strength and the elastic modulus; Setting preset constraints on the flexible circuit board model and applying a preset load to determine the stress result of the copper wire under the preset constraints and the preset load; Establishing a cyclic working condition of the flexible circuit board based on a periodic load corresponding to a preset load received by the flexible circuit board; Based on the stress fatigue curve, the stress result and the cycle condition, the fatigue life of the copper wire is determined.

2. The method according to claim 1, characterized in that The method of establishing a flexible circuit board model comprises: According to the design of the flexible circuit board, a three-dimensional model of each stacked layer in the flexible circuit board is established, wherein the three-dimensional model includes a structural model of the copper wire inside the flexible circuit board; The three-dimensional model is divided into grids, the connection relationship between the various laminated layers is established, and the material properties of each laminated layer are assigned to establish a flexible circuit board model.

3. The method according to claim 2, characterized in that The establishing of the connection relationship between the stacked layers includes: Establish binding contact relationships between the components divided into meshes to connect the layers.

4. The method according to claim 2, characterized in that The material properties of each laminate include Young's modulus and Poisson's ratio.

5. The method according to claim 1, characterized in that The flexible circuit board is arranged in the fingerprint button module, and the periodic load is the periodic load corresponding to the pressing and rebounding of the flexible circuit board when receiving the pressing.

6. The method according to claim 3, characterized in that The setting of preset constraint conditions for the flexible circuit board model includes: The connection part of the flexible circuit board model in the fingerprint button module is fixed to simulate the situation that the flexible circuit board is fixed in the fingerprint button module.

7. The method according to claim 1, characterized in that The step of determining a stress fatigue curve of the copper wire based on the tensile strength and the elastic modulus includes: The tensile strength and the elastic modulus are brought into a preset fatigue analysis software to determine the stress fatigue curve of the copper wire.

8. The method according to claim 1, characterized in that The step of determining the fatigue life of the copper wire based on the stress fatigue curve, the stress result and the cycle condition includes: The stress fatigue curve, the stress result and the cycle condition are imported into a preset fatigue analysis software to determine the fatigue life of the copper wire.

9. An electronic device, characterized in that: include: A memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the method according to any one of claims 1 to 8 when executing the program.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the steps of the method described in any one of claims 1 to 8 are implemented.

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