A multi-layer circuit board solder resist quality inspection device

Abstract

The present invention relates to the technical field of multi-layer circuit board quality inspection, and in particular to a multi-layer circuit board solder mask quality inspection device. The present invention provides a multi-layer circuit board solder mask quality inspection device that can automatically test the adhesion of the circuit board solder mask layer, save manpower, and improve the efficiency of the circuit board solder mask quality inspection. A multi-layer circuit board solder mask quality inspection device includes a support frame and a conveyor belt, etc., and the support frame is provided with a conveyor belt. The present invention starts the vertical movement motor in the vertical movement component, drives the vertical movement screw rod to rotate, so that the slider moves, and then moves the scribing knife to scribing on the surface of the multi-layer circuit board solder mask layer. By starting the drive motor, the scribing knife is driven to rotate, and the scribing direction of the scribing knife is adjusted, so that the scribing knife scribing on the surface of the circuit board solder mask layer is formed into 1 mm × 1 mm small squares, forming a hundred-grid pattern, which can automatically draw a hundred-grid pattern on the surface of the circuit board solder mask layer, save manpower, and improve the efficiency of the circuit board solder mask quality inspection.

Description

Technical Field

[0001] The invention relates to the technical field of multi-layer circuit board quality inspection, and in particular to a multi-layer circuit board solder resist quality inspection device. Background Art

[0002] A multilayer circuit board is a circuit board made of multiple conductive layers and insulating layers stacked alternately. Multilayer circuit boards are widely used in modern electronic devices because they can provide higher wiring density, better electrical performance and more functions. When multilayer circuit boards are produced, the adhesion of the solder mask needs to be tested to ensure the reliability and performance of the circuit board.

[0003] The existing multi-layer circuit board adhesion test is to use a cutter to cut the surface of the circuit board's solder mask layer into small squares of 1 mm × 1 mm to form a hundred-grid pattern, then use tape to stick on the hundred-grid area and then quickly tear it off. By observing the area of ​​the solder mask layer torn off by the tape, it is judged whether the adhesion is qualified. However, since the above operation needs to be performed manually, it consumes manpower and is slow, resulting in low efficiency in circuit board solder mask quality inspection.

[0004] Therefore, a multilayer circuit board solder mask quality inspection device has been developed that can automatically test the adhesion of the circuit board solder mask layer, save manpower, and improve the efficiency of circuit board solder mask quality inspection. Summary of the invention

[0005] In order to overcome the shortcomings of the existing multi-layer circuit board adhesion test, which requires manual operation, consumes manpower, and is slow, resulting in low efficiency of circuit board solder mask quality inspection, the present invention provides a multi-layer circuit board solder mask quality inspection device which can automatically test the adhesion of the circuit board solder mask layer, save manpower, and improve the circuit board solder mask quality inspection efficiency.

[0006] The technical implementation scheme of the present invention is: a multi-layer circuit board solder mask quality inspection device, including a support frame, a conveyor belt, a mounting angle iron, a testing mechanism and a marking mechanism, the support frame is provided with a conveyor belt, and a plurality of mounting angle irons are connected to the front and rear sides of the lower part of the support frame. The support frame is provided with a testing mechanism capable of testing the solder mask quality of the circuit board, and the support frame is also provided with a marking mechanism capable of marking the solder mask layer of the circuit board.

[0007] Furthermore, the mounting angle irons are all provided with mounting holes.

[0008] Furthermore, the testing mechanism includes a stand, an electric push rod, a mounting frame, a tape wheel, a waste wheel, a servo motor, a pressing piece, a first spring and a tensioning assembly. The rear side of the right portion of the support frame is connected to the stand, the upper portion of the stand is connected to the electric push rod, the telescopic end of the electric push rod is connected to the mounting frame, the left portion of the mounting frame is rotatably connected to the tape wheel, the right portion of the mounting frame is rotatably connected to the waste wheel, the front sides of the left and right portions of the mounting frame are both connected to servo motors, the output shaft of the servo motor on the left is connected to the tape wheel, the output shaft of the servo motor on the right is connected to the waste wheel, the middle portion of the mounting frame is slidably connected to a pressing piece, and there is a pressure between the pressing piece and the mounting frame A first spring is connected, and a tensioning assembly is provided on the mounting frame. One end of the transparent tape on the tape wheel is pasted on the waste wheel so that the pressing piece is located on the upper side of the transparent tape. Then the electric push rod is started to push the mounting frame downward, and the servo motor is started at the same time to drive the tape wheel to rotate and loosen the transparent tape. The pressing piece is moved downward by the action of the first spring to press the transparent tape onto the grid pattern of the multi-layer circuit board. Then the mounting frame is moved upward, and the servo motor is started at the same time to drive the waste wheel to rotate and retract the transparent tape. The area of ​​the solder mask torn off the transparent tape is observed to determine whether the adhesion is qualified.

[0009] Furthermore, the tensioning assembly includes a tensioning frame, a tensioning wheel and a torsion spring. The lower sides of the left and right parts of the mounting frame are rotatably connected to the tensioning frame, the upper part of the tensioning frame is rotatably connected to the tensioning wheel, and the front and rear parts of the tensioning frame are connected to the mounting frame with a torsion spring.

[0010] The cam is provided with a lifting assembly, a lateral movement assembly, a vertical movement assembly, a driving motor and a scriber. The lifting assembly is provided on the upper middle side of the supporting frame, the lifting assembly includes a lifting frame, a lifting motor and a lifting screw rod. The upper middle side of the supporting frame is connected to the lifting frame, the upper left side of the lifting frame is connected to the lifting motor, the lifting screw rod is connected to the output shaft of the lifting motor, and the lifting screw rod is rotatably connected to the lifting frame. The lifting assembly is provided with a lateral movement assembly, the lateral movement assembly includes a lateral movement frame, a lateral movement motor and a lateral movement screw rod. The lateral movement frame is slidably connected to the front side of the lifting frame, the lateral movement frame is threadedly connected to the lifting screw rod, the lateral movement frame is connected to the lateral movement motor on the left side, the lateral movement motor output shaft is connected to the lateral movement screw rod, the lateral movement screw rod is rotatably connected to the lateral movement frame on the right side, the lateral movement assembly is provided with a vertical movement assembly, the vertical movement assembly includes a vertical movement frame, a vertical movement motor, a vertical movement screw rod and a slider. The lateral movement frame is slidably connected to the vertical movement frame, and the vertical movement frame is threadedly connected to the lateral movement screw rod. A vertical motor is connected to the front side of the vertical moving frame, a vertical screw rod is connected to the output shaft of the vertical moving motor, the vertical screw rod is rotatably connected to the vertical moving frame, a slider is threadedly connected to the vertical screw rod, the slider is slidably connected to the vertical moving frame, a driving motor is connected to the lower side of the slider, a marking knife is connected to the output shaft of the driving motor, the lifting motor in the lifting assembly is started to drive the lifting screw rod to rotate, so that the transverse moving assembly moves downward, and then according to the test position of the solder mask layer of the multi-layer circuit board, the transverse moving motor in the transverse moving assembly is started to drive the transverse moving screw rod to rotate, so that the vertical moving assembly moves, and the position of the marking knife is adjusted, and then the vertical motor in the vertical moving assembly is started to drive the vertical screw rod to rotate, so that the slider moves, and then the marking knife moves to mark the surface of the solder mask layer of the multi-layer circuit board, and the driving motor is started to drive the marking knife to rotate, and the marking direction of the marking knife is adjusted, so that the marking knife marks small squares of 1 mm × 1 mm on the surface of the solder mask layer of the circuit board to form a hundred-grid pattern.

[0011] Furthermore, it also includes a clamping mechanism, which includes a fixed seat, a rotating frame, a clamping piece, a toggle frame, a connecting frame, a pushing piece and a second spring. The upper right side of the support frame is connected to two front and rear fixed seats, the fixed seats are rotatably connected to the rotating frame, the left and right parts of the rotating frame are connected to the clamping pieces, the middle part of the rotating frame is connected to the toggle frame, the front and rear sides of the middle part of the mounting frame are connected to the connecting frame, the connecting frame is slidably connected to the pushing piece, the pushing piece is movably connected to the adjacent toggle frame, and the pushing piece is connected to the connected connecting frame with a second spring. When the mounting frame moves downward, the connecting frame is driven downward to move the pushing piece downward, and the pushing piece is driven downward to push the toggle frame to rotate through the action of the second spring, so that the rotating frame rotates, driving the clamping piece to rotate and press down on the circuit board.

[0012] Furthermore, it also includes a positioning mechanism, which includes a cylinder, a mounting plate, a contact piece and a third spring. Two front and rear cylinders are connected to the upper left side of the support frame, and the telescopic ends of the cylinders are connected to mounting plates. Contact pieces are slidably connected to the mounting plates, and third springs are connected between the left and right parts of the contact pieces and the connected mounting plates. When the circuit board moves between the contact pieces, the cylinder is started to push the mounting plates to move closer to each other until the contact pieces contact the circuit board. The contact pieces are buffered by the action of the third spring to prevent the contact pieces from damaging the circuit board.

[0013] Furthermore, it also includes a marking mechanism, which includes a camera, a support frame and a paint marker. The camera is connected to the middle of the mounting frame, the support frame is connected to the upper right front side of the support frame, the support frame is connected to the paint marker, the paint marker is electrically connected to the camera, the camera takes a picture of the solder mask layer on the transparent tape, and when it is detected that the solder mask layer area exceeds the qualified standard, the paint marker is controlled to spray the paint mark onto the circuit board.

[0014] Further, the paint marker is composed of a water pump and a paint box.

[0015] Furthermore, it also includes a distance adjustment mechanism, which includes a control motor and a blocking frame. A plurality of control motors are connected to the upper sides of the front and rear parts of the support frame, and the blocking frames are connected to the output shafts of the control motors. When the conveyor belt transports the circuit board, the control motors are started in sequence from left to right to rotate the blocking frame to the level with the conveyor belt, so that the circuit board stops in contact with the blocking frame when it moves to the positioning, marking and pasting areas respectively.

[0016] The present invention has the following advantages: 1. The present invention starts the vertical movement motor in the vertical movement assembly, drives the vertical movement screw rod to rotate, causes the slider to move, and then causes the scribing knife to move to scribble on the surface of the solder mask layer of the multi-layer circuit board. By starting the driving motor, the scribing knife is driven to rotate, and the scribing direction of the scribing knife is adjusted, so that the scribing knife scribes the surface of the solder mask layer of the circuit board into small squares of 1 mm × 1 mm, forming a hundred-grid pattern, thereby achieving the effect of being able to automatically scribble out a hundred-grid pattern on the surface of the solder mask layer of the circuit board, saving manpower, and improving the efficiency of the solder mask quality inspection of the circuit board.

[0017] 2. The present invention starts the electric push rod to push the mounting frame to move downward, and starts the servo motor at the same time to drive the tape wheel to rotate, loosen the transparent tape, and through the action of the first spring, the pressing piece moves downward to press the transparent tape onto the grid pattern of the multi-layer circuit board, and then moves the mounting frame upward, and starts the servo motor at the same time to drive the waste wheel to rotate and retract the transparent tape, thereby achieving the effect of automatically performing a pasting test on the solder mask layer of the multi-layer circuit board, saving manpower, and improving the efficiency of the solder mask quality inspection of the circuit board.

[0018] 3. The present invention drives the connecting frame to move downward while the mounting frame moves downward, so that the pushing member moves downward. The pushing member drives the toggle frame to rotate through the action of the second spring, so that the rotating frame rotates, and drives the clamping member to rotate and press down on the circuit board, thereby clamping the circuit board and ensuring the adhesion effect of the solder mask layer of the circuit board.

[0019] 4. When the circuit board moves between the contact pieces, the present invention starts the cylinder to push the mounting plates to move closer to each other until the contact pieces come into contact with the circuit board. The contact pieces are buffered by the action of the third spring to prevent the contact pieces from damaging the circuit board, thereby achieving the effect of centering the circuit board and preventing the circuit board position deviation from affecting the detection accuracy.

[0020] 5. The present invention uses a camera to shoot the sticking condition of the solder mask layer on the transparent tape. When it is detected that the area of ​​the solder mask layer exceeds the qualified standard, the water pump in the paint marker is controlled to start, and the paint in the paint box is sprayed and marked on the circuit board, thereby achieving the effect of marking unqualified circuit boards for subsequent processing.

[0021] 6. When the present invention transports circuit boards through a conveyor belt, the control motors are started in sequence from left to right, so that the blocking frame rotates to be level with the conveyor belt, so that the circuit boards are respectively contacted with the blocking frame when they move to the positioning, marking and pasting areas, thereby achieving the effect of being able to control the distance between the circuit boards and ensure the precise alignment of the circuit boards. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0023] Figure 2 It is a three-dimensional structural schematic diagram of the testing mechanism and the clamping mechanism of the present invention.

[0024] Figure 3 It is a schematic diagram of the three-dimensional structure of the testing mechanism of the present invention.

[0025] Figure 4 It is a schematic diagram of the three-dimensional structure of the clamping mechanism of the present invention.

[0026] Figure 5 It is a partial three-dimensional structural schematic diagram of the clamping mechanism of the present invention.

[0027] Figure 6 It is a schematic diagram of the three-dimensional structure of the scribing mechanism of the present invention.

[0028] Figure 7 It is a partial three-dimensional structural schematic diagram of the scribing mechanism of the present invention.

[0029] Figure 8 It is a three-dimensional structural schematic diagram of the positioning mechanism and the distance adjustment mechanism of the present invention.

[0030] Fig. 9 It is a schematic diagram of the three-dimensional structure of the marking mechanism and the distance adjustment mechanism of the present invention.

[0031] The meanings of the reference numerals in the figure are as follows: 1: support frame, 11: transmission belt, 12: mounting angle iron, 2: testing mechanism, 20: stand, 21: electric push rod, 22: mounting frame, 23: tape wheel, 24: waste wheel, 25: servo motor, 26: pressing member, 27: first spring, 28: tensioning assembly, 3: clamping mechanism, 30: fixed seat, 31: rotating frame, 32: clamping member, 33: toggle frame, 34: connecting frame, 3 5: Pushing member, 36: Second spring, 4: Marking mechanism, 40: Lifting assembly, 41: Lateral movement assembly, 42: Vertical movement assembly, 43: Driving motor, 44: Marking knife, 5: Positioning mechanism, 50: Cylinder, 51: Mounting plate, 52: Contact member, 53: Third spring, 6: Marking mechanism, 60: Camera, 61: Support frame, 62: Paint marker, 7: Distance adjustment mechanism, 70: Control motor, 71: Blocking frame. DETAILED DESCRIPTION

[0032] The present invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0033] A multi-layer circuit board solder mask quality inspection device, such as Figure 1-Figure 9 As shown, it includes a support frame 1, a conveyor belt 11, a mounting angle iron 12, a testing mechanism 2 and a marking mechanism 4. The support frame 1 is provided with a conveyor belt 11. Three mounting angle irons 12 are connected to the front and rear sides of the lower part of the support frame 1. The mounting angle irons 12 are provided with mounting holes for easy installation and fixation. The support frame 1 is provided with a testing mechanism 2, and the support frame 1 is also provided with a marking mechanism 4.

[0034] like Figure 1-Figure 3As shown, the test mechanism 2 includes a stand 20, an electric push rod 21, a mounting frame 22, a tape wheel 23, a waste wheel 24, a servo motor 25, a pressing member 26, a first spring 27 and a tensioning assembly 28. The right rear side of the support frame 1 is connected to the stand 20, the upper part of the stand 20 is connected to the electric push rod 21, the telescopic end of the electric push rod 21 is connected to the mounting frame 22, the left part of the mounting frame 22 is rotatably connected to the tape wheel 23, the right part of the mounting frame 22 is rotatably connected to the waste wheel 24, and the front sides of the left and right parts of the mounting frame 22 are both connected to the servo motor 25. The output shaft of the servo motor 25 on the left is connected to the tape wheel 23, and the output shaft of the servo motor 25 on the right is connected to the waste wheel 24. A pressing piece 26 is slidably connected to the middle of the mounting frame 22, and a first spring 27 is connected between the pressing piece 26 and the mounting frame 22. A tensioning assembly 28 is provided on the mounting frame 22, and the tensioning assembly 28 includes a tensioning frame, a tensioning wheel and a torsion spring. The lower sides of the left and right parts of the mounting frame 22 are rotatably connected to the tensioning frames, and the tensioning wheels are rotatably connected to the tensioning frames. The front and rear parts of the tensioning frame are connected to the mounting frame 22 with torsion springs.

[0035] like Figure 1 , Figure 6 and Figure 7 As shown, the marking mechanism 4 includes a lifting component 40, a lateral movement component 41, a vertical movement component 42, a driving motor 43 and a marking knife 44. A lifting component 40 is provided on the upper middle side of the support frame 1. The lifting component 40 includes a lifting frame, a lifting motor and a lifting screw rod. The upper middle side of the support frame 1 is connected to the lifting frame, the upper left side of the lifting frame is connected to the lifting motor, the lifting screw rod is connected to the output shaft of the lifting motor, and the lifting screw rod is rotatably connected to the lifting frame. A lateral movement component 41 is provided on the lifting component 40. The lateral movement component 41 includes a lateral movement frame, a lateral movement motor and a lateral movement screw rod. The front side of the lifting frame is slidably connected to the lateral movement frame, and the lateral movement frame is threadedly connected to the lifting screw rod. A transverse motor is connected to the left side of the frame, a transverse screw is connected to the output shaft of the transverse motor, and the right side of the transverse screw is rotatably connected to the transverse frame. A vertical assembly 42 is provided on the transverse assembly 41, and the vertical assembly 42 includes a vertical frame, a vertical motor, a vertical screw and a slider. The transverse frame is slidably connected to the vertical frame, and the vertical frame is threadedly connected to the transverse screw. The front side of the vertical frame is connected to the vertical motor, a vertical screw is connected to the output shaft of the vertical motor, and the vertical screw is rotatably connected to the vertical frame. A slider is threadedly connected to the vertical screw, and the slider is slidably connected to the vertical frame. A driving motor 43 is connected to the lower side of the slider, and a marking knife 44 is connected to the output shaft of the driving motor 43.

[0036] When using the invention, first install the support frame 1 in the multi-layer circuit board solder mask quality inspection area by installing the angle iron 12, then start the conveyor belt 11, place the multi-layer circuit boards one by one on the conveyor belt 11 and transport them to the right, when the multi-layer circuit board moves to the scribing knife 44, start the lifting motor in the lifting assembly 40 to drive the lifting screw rod to rotate, so that the transverse movement assembly 41 moves downward, and then start the transverse movement motor in the transverse movement assembly 41 according to the test position of the solder mask layer of the multi-layer circuit board, drive the transverse movement screw rod to rotate, so that the vertical movement assembly 42 moves, and adjusts the scribing knife. 44 is positioned, and then the vertical movement motor in the vertical movement assembly 42 is started to drive the vertical movement lead screw to rotate, so that the slider moves, and then the scribing knife 44 moves to scribing on the surface of the solder mask layer of the multi-layer circuit board, and the driving motor 43 is started to drive the scribing knife 44 to rotate, and the scribing direction of the scribing knife 44 is adjusted, so that the scribing knife 44 scratches the surface of the solder mask layer of the circuit board into small squares of 1 mm × 1 mm, forming a hundred-grid pattern, thereby playing a role in automatically scratching the surface of the solder mask layer of the circuit board, saving manpower, and improving the efficiency of the solder mask quality inspection of the circuit board. After the marking of the multi-layer circuit board is completed, the conveyor belt 11 conveys the multi-layer circuit board to the stand 20, so that the grid pattern is located below the pressing piece 26, and then one end of the transparent tape on the tape wheel 23 is pasted on the waste wheel 24, so that the pressing piece 26 is located on the upper side of the transparent tape, and then the electric push rod 21 is started to push the mounting frame 22 to move downward, and the servo motor 25 is started at the same time to drive the tape wheel 23 to rotate, so as to loosen the transparent tape, and the pressing piece 26 is moved downward by the action force of the first spring 27 to press the transparent tape on the grid pattern of the multi-layer circuit board, and then the mounting frame 22 is moved upward, and the servo motor 25 is started at the same time to drive the waste wheel 24 to rotate, so as to retract the transparent tape, observe the area of ​​the solder mask layer torn off the transparent tape, and judge whether the adhesion is qualified, thereby playing the role of automatically testing the solder mask layer of the multi-layer circuit board, saving manpower, and improving the efficiency of the solder mask quality inspection of the circuit board. During the test, the tensioning wheel on the tensioning frame is always in contact with the transparent tape to tension it by the action force of the torsion spring.

[0037] like Figure 1 , Figure 4 and Figure 5 As shown, it also includes a clamping mechanism 3, which includes a fixed seat 30, a rotating frame 31, a clamping piece 32, a toggle frame 33, a connecting frame 34, a pushing piece 35 and a second spring 36. The upper right side of the support frame 1 is connected to the front and rear fixed seats 30, and the fixed seats 30 are rotatably connected to the rotating frame 31. The left and right parts of the rotating frame 31 are connected to the clamping piece 32, the middle part of the rotating frame 31 is connected to the toggle frame 33, the front and rear sides of the middle part of the mounting frame 22 are connected to the connecting frame 34, and the connecting frame 34 is slidably connected to the pushing piece 35. The pushing piece 35 is movably connected to the adjacent toggle frame 33, and the second spring 36 is connected between the pushing piece 35 and the connected connecting frame 34.

[0038] The clamping mechanism 3 of the device can be used to clamp the circuit board. When the mounting frame 22 moves downward, it drives the connecting frame 34 to move downward, so that the pushing member 35 moves downward. The pushing member 35 drives the toggle frame 33 to rotate through the force of the second spring 36, so that the rotating frame 31 rotates, driving the clamping member 32 to rotate and press down on the circuit board, thereby clamping the circuit board and ensuring the bonding effect of the solder mask layer of the circuit board. When the mounting frame 22 drives the connecting frame 34 to move upward, the connecting frame 34 moves upward in the pushing member 35, and then the pushing member 35 drives the toggle frame 33 to reset through the force of the second spring 36, so that the clamping member 32 is separated from the circuit board.

[0039] like Figure 1 and Figure 8 As shown, it also includes a positioning mechanism 5, which includes a cylinder 50, a mounting plate 51, a contact piece 52 and a third spring 53. The upper left side of the support frame 1 is connected to two front and rear cylinders 50, and the telescopic ends of the cylinders 50 are connected to the mounting plates 51, and the mounting plates 51 are slidably connected to the contact pieces 52. The third spring 53 is connected between the left and right parts of the contact pieces 52 and the connected mounting plates 51.

[0040] The positioning mechanism 5 of the device can be used to position the circuit board. When the circuit board moves between the contact pieces 52, the cylinder 50 is started to push the mounting plates 51 to move closer to each other until the contact pieces 52 contact the circuit board. The contact pieces 52 are buffered by the force of the third spring 53 to prevent the contact pieces 52 from damaging the circuit board, thereby centering the circuit board and preventing the circuit board from being offset and affecting the detection accuracy.

[0041] like Figure 1 and Fig. 9 As shown, it also includes a marking mechanism 6, which includes a camera 60, a support frame 61 and a paint marker 62. The camera 60 is connected to the middle of the mounting frame 22, and the support frame 61 is connected to the upper right front side of the support frame 1. The support frame 61 is connected to the paint marker 62, and the paint marker 62 is composed of a water pump and a paint box. The paint marker 62 is electrically connected to the camera 60.

[0042] The marking mechanism 6 of the device can be used to mark unqualified circuit boards. The camera 60 takes a picture of the solder mask layer on the transparent tape. When it is detected that the solder mask layer area exceeds the qualified standard, the water pump in the paint marker 62 is controlled to start, and the paint in the paint box is sprayed and marked on the circuit board, thereby marking the unqualified circuit boards for subsequent processing.

[0043] like Figure 1 and Fig. 9 As shown, it also includes a distance adjustment mechanism 7, which includes a control motor 70 and a blocking frame 71. Three control motors 70 are connected to the upper sides of the front and rear parts of the support frame 1, and the blocking frames 71 are connected to the output shafts of the control motors 70.

[0044] By using the distance adjustment mechanism 7 of the device, the spacing between circuit boards can be controlled. When the conveyor belt 11 transports the circuit boards, the control motors 70 are started in sequence from left to right, so that the blocking frame 71 rotates to be level with the conveyor belt 11, so that the circuit boards are respectively contacted with the blocking frame 71 when they move to the positioning, marking and pasting areas, thereby playing a role in controlling the spacing between the circuit boards and ensuring the precise alignment of the circuit boards.

[0045] The above descriptions are merely embodiments of the present invention and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A multi-layer circuit board solder mask quality inspection device, characterized by: The invention comprises a support frame (1), a conveyor belt (11), a mounting angle iron (12), a testing mechanism (2) and a marking mechanism (4); the support frame (1) is provided with a conveyor belt (11); a plurality of mounting angle irons (12) are connected to both the front and rear sides of the lower part of the support frame (1); the support frame (1) is provided with a testing mechanism (2) capable of testing the solder resist quality of a circuit board; and the support frame (1) is also provided with a marking mechanism (4) capable of marking the solder resist layer of the circuit board.

2. A multi-layer circuit board solder mask quality inspection device according to claim 1, characterized in that: The mounting angle iron (12) is provided with mounting holes.

3. A multi-layer circuit board solder mask quality inspection device according to claim 1, characterized in that: The testing mechanism (2) comprises a stand (20), an electric push rod (21), a mounting frame (22), a tape wheel (23), a waste wheel (24), a servo motor (25), a pressing member (26), a first spring (27) and a tensioning assembly (28); the right rear side of the support frame (1) is connected to the stand (20); the upper part of the stand (20) is connected to the electric push rod (21); the telescopic end of the electric push rod (21) is connected to the mounting frame (22); the left part of the mounting frame (22) is rotatably connected to the tape wheel (23); the right part of the mounting frame (22) is rotatably connected to the waste wheel (24); the front sides of the left and right parts of the mounting frame (22) are both connected to the servo motor (25); the output shaft of the servo motor (25) on the left side is connected to the tape wheel (23); the output shaft of the servo motor (25) on the right side is connected to the waste wheel (24); the middle part of the mounting frame (22) is slidably connected to the tape wheel (23); A pressing piece (26) is provided, and a first spring (27) is connected between the pressing piece (26) and the mounting frame (22). A tensioning assembly (28) is provided on the mounting frame (22). One end of the transparent tape on the tape wheel (23) is pasted on the waste wheel (24) so ​​that the pressing piece (26) is located on the upper side of the transparent tape. Then, the electric push rod (21) is started to push the mounting frame (22) to move downward, and the servo motor (25) is started at the same time to drive the tape wheel (23) to rotate and loosen the transparent tape. The pressing piece (26) is moved downward by the action force of the first spring (27) to press the transparent tape onto the grid pattern of the multi-layer circuit board. Then, the mounting frame (22) is moved upward, and the servo motor (25) is started at the same time to drive the waste wheel (24) to rotate and retract the transparent tape. The area of ​​the solder mask layer torn off the transparent tape is observed to determine whether the adhesion is qualified.

4. A multi-layer circuit board solder mask quality inspection device according to claim 3, characterized in that: The tensioning assembly (28) comprises a tensioning frame, a tensioning wheel and a torsion spring. The lower sides of the left and right parts of the mounting frame (22) are both rotatably connected to the tensioning frame, the upper side of the tensioning frame is both rotatably connected to the tensioning wheel, and the front and rear parts of the tensioning frame are both connected to the mounting frame (22) with a torsion spring.

5. A multi-layer circuit board solder mask quality inspection device according to claim 3, characterized in that: The marking mechanism (4) comprises a lifting assembly (40), a lateral movement assembly (41), a vertical movement assembly (42), a driving motor (43) and a marking knife (44). The lifting assembly (40) is provided on the upper middle part of the support frame (1). The lifting assembly (40) comprises a lifting frame, a lifting motor and a lifting screw rod. The upper middle part of the support frame (1) is connected to the lifting frame, the upper left part of the lifting frame is connected to the lifting motor, the lifting screw rod is connected to the output shaft of the lifting motor, and the lifting screw rod is rotatably connected to the lifting frame. The lifting assembly (40) is provided with a lateral movement assembly ( 41), the transverse moving assembly (41) includes a transverse moving frame, a transverse moving motor and a transverse moving screw rod, the front side of the lifting frame is slidably connected to the transverse moving frame, the transverse moving frame is threadedly connected to the lifting screw rod, the left side of the transverse moving frame is connected to the transverse moving motor, the output shaft of the transverse moving motor is connected to the transverse moving screw rod, the right side of the transverse moving screw rod is rotatably connected to the transverse moving frame, the transverse moving assembly (41) is provided with a vertical moving assembly (42), the vertical moving assembly (42) includes a vertical moving frame, a vertical moving motor, a vertical moving screw rod and a slider, the transverse moving frame is slidably connected to the vertical moving frame, the vertical moving frame is threadedly connected to the transverse moving screw rod, The front side of the vertical moving frame is connected to a vertical moving motor, the output shaft of the vertical moving motor is connected to a vertical moving screw rod, the vertical moving screw rod is rotatably connected to the vertical moving frame, a slider is threadedly connected to the vertical moving screw rod, the slider is slidably connected to the vertical moving frame, a driving motor (43) is connected to the lower side of the slider, a scribing knife (44) is connected to the output shaft of the driving motor (43), the lifting motor in the lifting assembly (40) is started, the lifting screw rod is driven to rotate, so that the lateral moving assembly (41) moves downward, and then the lateral moving assembly (41) is started according to the test position of the solder mask layer of the multi-layer circuit board. The motor drives the lateral screw rod to rotate, so that the vertical moving assembly (42) moves, and the position of the scribing knife (44) is adjusted. Then, the vertical moving motor in the vertical moving assembly (42) is started to drive the vertical moving screw rod to rotate, so that the slider moves, and then the scribing knife (44) moves to scribing on the surface of the solder mask layer of the multi-layer circuit board. By starting the driving motor (43), the scribing knife (44) is driven to rotate, and the scribing direction of the scribing knife (44) is adjusted, so that the scribing knife (44) scribing on the surface of the solder mask layer of the circuit board into small squares of 1 mm×1 mm, forming a hundred-grid pattern.

6. A multi-layer circuit board solder mask quality inspection device according to claim 5, characterized in that: The support frame (1) further comprises a clamping mechanism (3), which comprises a fixed seat (30), a rotating frame (31), a clamping member (32), a toggle frame (33), a connecting frame (34), a pushing member (35) and a second spring (36). The upper right side of the support frame (1) is connected to two front and rear fixed seats (30), the fixed seats (30) are rotatably connected to the rotating frame (31), the left and right parts of the rotating frame (31) are connected to the clamping member (32), the middle part of the rotating frame (31) is connected to the toggle frame (33), and the front and rear sides of the middle part of the mounting frame (22) are connected to the connecting frame (34). 34), a pusher (35) is slidably connected to the connecting frame (34), the pusher (35) is movably connected to the adjacent toggle frame (33), a second spring (36) is connected between the pusher (35) and the connected connecting frame (34), when the mounting frame (22) moves downward, the connecting frame (34) is driven to move downward, so that the pusher (35) moves downward, and the action force of the second spring (36) causes the pusher (35) to push the toggle frame (33) to rotate, so that the rotating frame (31) rotates, and drives the clamping member (32) to rotate and press down on the circuit board.

7. A multi-layer circuit board solder mask quality inspection device according to claim 6, characterized in that: The invention also comprises a positioning mechanism (5), which comprises a cylinder (50), a mounting plate (51), a contact piece (52) and a third spring (53). The upper left side of the support frame (1) is connected to two front and rear cylinders (50). The telescopic ends of the cylinders (50) are connected to the mounting plates (51). The mounting plates (51) are slidably connected to the contact pieces (52). The third spring (53) is connected between the left and right parts of the contact pieces (52) and the mounting plates (51) connected thereto. When the circuit board moves between the contact pieces (52), the cylinder (50) is started to push the mounting plates (51) to move closer to each other until the contact pieces (52) contact the circuit board. The contact pieces (52) are buffered by the action force of the third spring (53) to prevent the contact pieces (52) from damaging the circuit board.

8. A multi-layer circuit board solder mask quality inspection device according to claim 7, characterized in that: The device also comprises a marking mechanism (6), the marking mechanism (6) comprising a camera (60), a support frame (61) and a pigment marker (62), the camera (60) being connected to the middle of the mounting frame (22), the support frame (61) being connected to the upper right front side of the support frame (1), the support frame (61) being connected to the pigment marker (62), the pigment marker (62) being electrically connected to the camera (60), the camera (60) photographing the sticking condition of the solder resist layer on the transparent tape, and when it is detected that the area of ​​the solder resist layer exceeds the qualified standard, the pigment marker (62) is controlled to spray the pigment marker onto the circuit board.

9. A multi-layer circuit board solder mask quality inspection device according to claim 8, characterized in that: The pigment marker (62) consists of a water pump and a pigment box.

10. A multi-layer circuit board solder mask quality inspection device according to claim 8, characterized in that: The invention also comprises a distance adjustment mechanism (7), which comprises a control motor (70) and a blocking frame (71). The upper sides of the front and rear parts of the support frame (1) are connected to a plurality of control motors (70), and the output shafts of the control motors (70) are connected to the blocking frames (71). When the conveyor belt (11) conveys the circuit board, the control motors (70) are started in sequence from left to right, so that the blocking frame (71) rotates to the level with the conveyor belt (11), so that the circuit board contacts the blocking frame (71) and stops when it moves to the positioning, marking and pasting areas.

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