Micro-seismic rock fracture signal simulation device

By designing a micro-seismic rock rupture signal simulation device, using PC control software and sensor strike frames, the problem of difficulty in consistently simulating rock rupture vibration signals in the existing technology is solved, and the repeated production of consistent signals in the indoor environment is achieved, and the research and development and maintenance efficiency of micro-seismic monitoring systems is improved.

CN119738472AActive Publication Date: 2025-04-01HUBEI SEAQUAKE TECH CO LTD
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Patent Information

Application Number
CN202411793716.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-12-09
Publication Date
2025-04-01
Estimated Expiration
2044-12-09

AI Technical Summary

Technical Problem

The prior art is difficult to repeatedly and consistently simulate rock rupture vibration signals in indoor environments, affecting the research and development and maintenance of microseismic monitoring systems.

Method used

Design a micro-seismic rock rupture signal simulation device, including a micro-seismic signal simulation system and a micro-seismic monitoring system, and achieve precise control and repeated production of the tap signal through PC control software, tap circuit control board and sensor tap frame.

Benefits of technology

It realizes the generation of the same rock rupture vibration signal repeatedly in an indoor environment, improves the research and development and maintenance efficiency of the microseismic monitoring system, and calculates the time error of the microseismic collector through the time recording system.

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Abstract

The invention discloses a micro-seismic rock fracture signal simulation device, which comprises a micro-seismic signal simulation system and a micro-seismic monitoring system which are in coupling connection, the micro-seismic signal simulation system is used for repeatedly generating the same knocking signal for multiple times, and the micro-seismic signal simulation system comprises PC control software, a knocking circuit control board and a sensor knocking frame, the PC control software is connected with the knocking circuit control board to issue a working instruction, the knocking circuit control board transmits the instruction to the sensor knocking frame and controls the knocking strength and the knocking frequency of the sensor knocking frame, and the micro-seismic monitoring system receives a knocking signal generated by the sensor knocking frame and sends the knocking signal to the sensor knocking frame. And visual display is carried out. The device can repeatedly generate the same knocking signal for multiple times, and can also sequentially generate signals to simulate a rock fracture signal in an indoor environment for research, development and maintenance of a micro-seismic monitoring system.
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Description

Technical Field

[0001] The present application relates to the field of geotechnical engineering technology, and in particular to a microseismic rock fracture signal simulation device. Background Art

[0002] Acoustic emission refers to the phenomenon that when a research target is deformed or fractured under certain external and internal forces, it releases energy outward in the form of elastic waves. Rock fracture is a type of acoustic emission, which will suddenly and violently release the accumulated strain energy, causing brittle fracture of the rock mass, and even endanger engineering safety in severe cases.

[0003] At present, rock fracture signal monitoring is one of the most effective early warning methods for such engineering disasters. It mainly collects, processes and analyzes these signals through microseismic monitoring systems to achieve early warning of disasters. The accuracy of early warning depends on the microseismic monitoring system's ability to identify rock fracture signals. At present, in the development and maintenance of microseismic monitoring systems, most of the simulated rock fracture vibration signals are tested by manually knocking on the floor to create vibration waves. This method is not only difficult to control the knocking force, but also difficult to ensure the consistency of the waveform frequency, resulting in inconsistency of such signals each time, which is not conducive to the development and maintenance of microseismic monitoring systems. Summary of the invention

[0004] In order to solve the above problems, the present application provides a microseismic rock fracture signal simulation device, which can repeatedly generate the same knocking signal multiple times, so as to better simulate the rock fracture vibration signal in the indoor environment for the development and maintenance of the microseismic monitoring system. The technical solution is as follows:

[0005] The present application provides a microseismic rock fracture signal simulation device, including a coupled microseismic signal simulation system and a microseismic monitoring system, wherein the microseismic signal simulation system is used to repeatedly generate the same knocking signal or to knock in sequence to simulate rock fracture signals, and the microseismic signal simulation system includes PC control software, a knocking circuit control board and a sensor knocking frame, wherein the PC control software is connected to the knocking circuit control board to implement the issuance of work instructions, the knocking circuit control board transmits instructions to the sensor knocking frame and controls the knocking force and knocking frequency of the sensor knocking frame, and the microseismic monitoring system receives the knocking signal generated by the sensor knocking frame and displays it visually.

[0006] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, the microseismic signal simulation system also includes a GPS antenna connected to the knocking circuit control board, and the GPS antenna is used to send a pulse signal to the knocking circuit control board to achieve time correction of the knocking circuit control board, and send the time to the PC control software via Ethernet.

[0007] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, the PC control software transmits operation instructions to the knocking circuit control board through Ethernet, and the knocking circuit control board is connected to and controls the sensor knocking frame through IIC and IO protocols.

[0008] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, the sensor knocking frame includes a digital potentiometer, a DC adjustable power supply, a mutual inductor circuit and a solenoid valve connected by a circuit, the knocking circuit control board is connected to the digital potentiometer through the IIC protocol to realize remote control of the PC control software, the digital potentiometer inputs the analog signal issued by the knocking circuit control board into the DC adjustable power supply, the DC adjustable power supply imports the output current into the mutual inductor circuit, the knocking circuit control board transmits the instructions issued by the PC control software to the sensor knocking frame through the IO protocol, thereby controlling the solenoid valve to knock, the mutual inductor circuit generates a feedback signal when the solenoid valve knocks, and the microseismic monitoring system records the feedback signal and converts it into a numerical signal, so as to realize data intercommunication and correction between the microseismic signal simulation system and the microseismic monitoring system during the maintenance and development of the microseismic monitoring system.

[0009] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, the microseismic monitoring system includes connected microseismic sensors, microseismic acquisition instruments, microseismic timing servers and PC microseismic monitoring software. The microseismic sensor is coupled to the sensor knocking frame to receive the vibration generated by the sensor knocking frame in the first time. The microseismic acquisition instrument sends the knocking time of the sensor knocking frame and the vibration time when the microseismic sensor is knocked to the PC microseismic monitoring software, thereby realizing time recording during the development and maintenance of the microseismic monitoring system. The PC microseismic monitoring software is connected to the microseismic acquisition instrument to implement the issuance of operation instructions.

[0010] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, the transformer circuit includes a current transformer, the solenoid valve is arranged adjacent to the current transformer, and collector channels connected to the microseismic collector are provided at both ends of the current transformer. When the solenoid valve is knocked, the current transformer synchronously generates an induced current, and the microseismic collector converts the induced current signal into a digital signal and transmits it to the PC microseismic monitoring software, thereby recording the exact knocking time of the sensor knocking frame.

[0011] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, the GPS antenna is responsible for receiving Beidou satellite time information, and sending an electric frequency time signal to the knocking circuit control board based on the IEEE1588 v2 protocol function, and storing the time information in a time register module in the knocking circuit control board. The PC control software transmits the GPS time information recorded in the knocking circuit control board to the solid state hard disk of the computer where the PC control software is installed through the IEEE1588 v2 protocol, and displays the GPS time through the software.

[0012] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, the microseismic monitoring system includes several microseismic collectors, each of which is connected to several microseismic sensors, and the microseismic signal simulation system includes several sensor knocking racks connected to the knocking circuit control board, each of the microseismic sensors is connected to the sensor knocking rack in a one-to-one correspondence, and the PC control software controls multiple sensor knocking racks to knock simultaneously or sequentially, or the PC control software controls each sensor knocking rack to knock at a certain time interval.

[0013] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, the microseismic timing server is connected to each of the microseismic acquisition instruments, and performs time synchronization timing on each of the microseismic acquisition instruments to ensure that the striking time recorded by each of the microseismic acquisition instruments is unified.

[0014] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, after the microseismic timing server provides time to each of the microseismic collectors, the microseismic collector, when receiving the induced current of the current transformer, inputs the numerical value of the induced current and the time information recorded in the time register of the microseismic collector to the PC microseismic monitoring software through the data network cable. The PC microseismic monitoring software has a visualization function, and the knocking time and number of the sensor knocking frame are recorded through the PC microseismic monitoring software.

[0015] The beneficial effects brought about by a microseismic rock fracture signal simulation device provided by some embodiments of the present application are as follows: the present application can repeatedly generate the same knocking signal multiple times, and can also generate signals in sequence to simulate rock fracture signals in an indoor environment for the development and maintenance of a microseismic monitoring system, and on this basis, add a time recording system to calculate the time error of each microseismic collector, so as to better simulate rock fracture vibration signals in an indoor environment for the development and maintenance of a microseismic monitoring system. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0017] Figure 1 This is a schematic diagram of the microseismic rock fracture signal simulation device of the present application;

[0018] Figure 2 The schematic diagram of the system connection for the development and maintenance process of the sensor knocking rack for microseismic monitoring;

[0019] Figure 3 The schematic diagram of the current mutual inductance for the sensor knock rack. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0021] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0022] The present application provides a microseismic rock fracture signal simulation device, comprising a coupled microseismic signal simulation system and a microseismic monitoring system, wherein the microseismic signal simulation system is used to repeatedly generate the same knocking signal or knock in sequence to simulate rock fracture signals.

[0023] like Figure 1As shown, the microseismic signal simulation system includes PC control software, GPS antenna, knocking circuit control board and sensor knocking frame, the PC control software is connected to the knocking circuit control board via Ethernet to realize the issuance of work instructions; the GPS antenna is directly connected to the knocking circuit control board, and is used to send a pulse signal to the knocking circuit control board to realize the time correction of the knocking circuit control board, and send the time to the PC control software via Ethernet; the knocking circuit control board transmits the instructions issued by the PC control software to the sensor knocking frame through the transmission protocol and cable, so as to control the knocking force and knocking frequency of the sensor knocking frame, and the microseismic monitoring system receives the knocking signal generated by the sensor knocking frame and displays it visually.

[0024] Specifically, the GPS antenna is responsible for receiving Beidou satellite time information, and sending an electric frequency time signal to the knocking circuit control board based on the IEEE1588 v2 protocol function, and storing the time information in the time register module in the knocking circuit control board. The PC control software transmits the GPS time information recorded in the knocking circuit control board to the solid-state hard disk of the computer where the PC control software is installed through the IEEE1588 v2 protocol, and the GPS time can be displayed through the software.

[0025] The knocking circuit control board connects and controls the sensor knocking frame through IIC (Inter-Integrated Circuit) and IO protocol. The IIC protocol includes a clock information line and a data transmission line, which can greatly reduce the occupation of hardware resources and space, thereby increasing the stability of the system.

[0026] like Figure 1As shown, the sensor knocking frame includes a digital potentiometer, a DC adjustable power supply, a mutual inductor circuit and a solenoid valve connected by a circuit. The knocking circuit control board is connected to the digital potentiometer through the IIC protocol to realize the remote control of the PC control software. The digital potentiometer is a new type of CMOS digital and analog mixed signal processing integrated circuit that replaces the traditional mechanical potentiometer (analog potentiometer). It can fine-tune and scale the analog signal sent by the knocking circuit control board according to the switch, and input the signal into the DC adjustable power supply. The DC adjustable power supply imports the output current into the mutual inductor circuit. The DC adjustable power supply is an electronic instrument that converts the power energy of the industrial frequency grid into a special form of high-voltage power supply, which can form a stable and controllable DC power; the mutual inductor circuit ... The digital potentiometer is a new type of CMOS digital and analog mixed signal processing integrated circuit that replaces the traditional mechanical potentiometer (analog potentiometer). The digital potentiometer is a new type of CMOS digital and analog mixed signal processing integrated circuit that replaces the traditional mechanical potentiometer (analog potentiometer). The digital potentiometer is a new type of The induction switch detects the current and records the timestamp of the output voltage and the collected feedback voltage at the same time. The timestamp unit is microseconds, and the timestamp signal is transmitted to the knocking circuit control board. The knocking circuit control board transmits the instructions issued by the PC control software to the sensor knocking frame through the IO protocol, thereby controlling the solenoid valve to knock, and controlling the knocking force and knocking frequency. The greater the input voltage, the greater the knocking force, and the higher the frequency of the input current, the faster the knocking frequency; the mutual inductor circuit generates a feedback signal when the solenoid valve knocks, and the microseismic monitoring system records the feedback signal and converts it into a numerical signal, so as to realize data intercommunication and correction between the microseismic signal simulation system and the microseismic monitoring system during the maintenance and development of the microseismic monitoring system.

[0027] like Figure 2 As shown, the microseismic monitoring system includes connected microseismic sensors, microseismic collectors, microseismic timing servers and PC microseismic monitoring software. The top of the sensor knocking frame is tightly coupled to the bottom of the microseismic sensor by bolts, so that the microseismic sensor can receive the vibration generated by the sensor knocking frame in the first time. The microseismic collector sends the knocking time of the sensor knocking frame and the vibration time when the microseismic sensor is knocked to the PC microseismic monitoring software, thereby realizing time recording during the development and maintenance of the microseismic monitoring system. The PC microseismic monitoring software is connected to the microseismic collector via a data network cable to implement the issuance of operation instructions. At the same time, the microseismic collector also transmits recorded data to the PC microseismic monitoring software.

[0028] For example, in the microseismic rock fracture signal simulation device provided in one embodiment, Figure 2As shown, the microseismic monitoring system includes several microseismic acquisition instruments, each of which is connected to several microseismic sensors, and the microseismic signal simulation system includes several sensor knocking racks connected to the knocking circuit control board, each of the microseismic sensors is connected to the sensor knocking rack in a one-to-one correspondence, and the PC control software controls multiple sensor knocking racks to knock simultaneously or sequentially, or the PC control software controls each sensor knocking rack to knock according to a certain time interval.

[0029] like Figure 3 As shown, the transformer circuit includes a current transformer, the solenoid valve is arranged adjacent to the current transformer, and collector channels connected to the microseismic collector are provided at both ends of the current transformer. When the solenoid valve is knocked, the current transformer synchronously generates an induced current, and the microseismic collector converts the induced current signal into a digital signal and transmits it to the PC microseismic monitoring software, thereby recording the exact knocking time of the sensor knocking frame.

[0030] Specifically, Figure 3 As shown, the transformer circuit is composed of a current transformer, a No. 1 battery, a 2M resistor, an S-POW power supply, collector channel 1, collector channel 2 and a solenoid valve. The S-POW is responsible for controlling the voltage amplitude and current frequency passing through the transformer circuit, thereby determining the amplitude and frequency of the vibration of the sensor knocking frame.

[0031] The knocking circuit control board transmits the instructions issued by the PC control software to the sensor knocking rack through the IO protocol, thereby controlling the solenoid valve in the sensor knocking rack to knock. The PC control software can control multiple sensor knocking racks to knock simultaneously or sequentially through the "event" mode, and can also control a single sensor knocking rack to knock through the "sensor" mode.

[0032] Specifically, the sensor knocking frame can be knocked individually or in multiples simultaneously or sequentially. Each time it is knocked, the current transformer will generate a weak induced current, which can be connected to the microseismic collector through the collector channel cable, and then the microseismic collector converts the current signal into a digital signal, thereby realizing data communication and correction between the two during the maintenance and development of the microseismic monitoring system. This digital signal is transmitted to the PC microseismic monitoring software through the data network cable, thereby recording the exact knocking time of the sensor knocking frame.

[0033] In order to make the knocking time recorded by multiple microseismic acquisition instruments uniform, thereby reducing the error of the knocking recording time during the maintenance and development of multiple microseismic acquisition instruments, for example, in the microseismic rock fracture signal simulation device provided in an embodiment, Figure 2As shown, the microseismic timing server is connected to each of the microseismic acquisition instruments, and performs time synchronization timing on each of the microseismic acquisition instruments, so that the knocking time recorded by each of the microseismic acquisition instruments is unified.

[0034] The microseismic timing server sends time synchronization signals to each microseismic acquisition instrument through a network switch according to the communication protocol of the IEEE1588 v2 standard and the number of microseismic data acquisition clocks of the terminal. The specific timing process is as follows:

[0035] The time when timing device # receives the Sync message is recorded as T2. At T3, timing device # sends a Dealy_Req message to the microseismic timing server. The microseismic timing server receives the Dealy_Req message and records the receiving time T4. The microseismic timing server sends a Dealy_Resq message carrying the T4 timestamp information to timing device 1#. After the master-slave message interaction is completed within one cycle, timing device 1# calculates the time difference Offest and path delay Delay between the two based on the four timestamp information of T1, T2, T3, and T4.

[0036] Offest=((T4-T3)-(T2-T1)) / 2 and Delay=((T4-T3)+(T2-T1)) / 2. Time difference Offest and path delay Delay can effectively eliminate the time synchronization error and timing delay of multiple microseismic acquisition instruments. The equipment uses high-precision constant temperature crystal to ensure that the synchronization accuracy of local time and GPS / Beidou timing clock is within 100ns, thereby achieving high-precision time synchronization.

[0037] After the microseismic timing server provides time to each of the microseismic collectors, each microseismic collector has a built-in time. When the microseismic collector receives the induced current from the current transformer, the microseismic collector inputs the numerical value of the induced current and the time information recorded in the time register of the microseismic collector to the PC microseismic monitoring software through the data network cable. The PC microseismic monitoring software has a visualization function. The user can realize simultaneous or sequential knocking of multiple sensor knocking racks by selecting the event mode, or can select the sensor mode to realize the knocking of a single sensor knocking rack. The PC microseismic monitoring software will record the knocking time and number of the knocking racks, and the rock fracture signal simulated by the sensor knocking rack can be visualized through the visualization function of the PC microseismic monitoring software.

[0038] This application can simulate a microseismic rock fracture signal that is close to reality through a microseismic rock fracture signal simulation device. The specific steps of simulating rock fracture signals are as follows: the microseismic signal simulation system first performs GPS positioning, sets two output control terminals, selects the sensor mode, and sets the time interval for each sensor knocking frame to knock; then the microseismic signal simulation system controls the sensor knocking frame to knock according to the set time interval, outputs two control paths, current paths, and the busbar is turned on. At this time, the current flows, the transformer circuit is connected, and the current transformer generates an induced current signal. The microseismic acquisition instrument collects this signal through the acquisition instrument channel and records the timestamp at this time. Randomly test multiple groups of data, compare the data, and compare and analyze the timestamps recorded by this device with the timestamps recorded by multiple microseismic acquisition instruments to determine the timing time errors of multiple microseismic acquisition instruments.

[0039] To sum up, the microseismic rock fracture signal simulation device of the present application is used to repeatedly generate the same knocking signal, and can also generate signals in sequence to simulate rock fracture signals in an indoor environment for the development and maintenance of microseismic monitoring systems, and on this basis, add a time recording system to calculate the time error of each microseismic collector, so that it can better simulate rock fracture vibration signals in an indoor environment for the development and maintenance of microseismic monitoring systems.

[0040] Although the implementation scheme of the present application has been disclosed as above, it is not limited to the applications listed in the specification and implementation modes, and it can be fully applicable to various fields suitable for the present application. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present application is not limited to the specific details and the illustrations shown and described herein.

Claims

1. A microseismic rock fracture signal simulation device, characterized in that: It includes a coupled microseismic signal simulation system and a microseismic monitoring system, wherein the microseismic signal simulation system is used to repeatedly generate the same knocking signal or knock in sequence to simulate rock fracture signals, and the microseismic signal simulation system includes PC control software, a knocking circuit control board and a sensor knocking frame, wherein the PC control software is connected to the knocking circuit control board to implement the issuance of work instructions, the knocking circuit control board transmits instructions to the sensor knocking frame and controls the knocking force and knocking frequency of the sensor knocking frame, and the microseismic monitoring system receives the knocking signal generated by the sensor knocking frame and displays it visually.

2. The microseismic rock fracture signal simulation device according to claim 1, characterized in that: The microseismic signal simulation system also includes a GPS antenna connected to the knocking circuit control board, and the GPS antenna is used to send a pulse signal to the knocking circuit control board to achieve time correction of the knocking circuit control board and send the time to the PC control software via Ethernet.

3. The microseismic rock fracture signal simulation device according to claim 2, characterized in that: The PC control software transmits operation instructions to the knocking circuit control board through Ethernet, and the knocking circuit control board is connected to and controls the sensor knocking frame through IIC and IO protocols.

4. The microseismic rock fracture signal simulation device according to claim 3, characterized in that: The sensor knocking frame includes a digital potentiometer, a DC adjustable power supply, a mutual inductor circuit and a solenoid valve connected through a circuit. The knocking circuit control board is connected to the digital potentiometer through the IIC protocol to realize remote control of the PC control software. The digital potentiometer inputs the analog signal issued by the knocking circuit control board into the DC adjustable power supply, and the DC adjustable power supply imports the output current into the mutual inductor circuit. The knocking circuit control board transmits the instructions issued by the PC control software to the sensor knocking frame through the IO protocol, thereby controlling the solenoid valve to knock. The mutual inductor circuit generates a feedback signal when the solenoid valve knocks. The microseismic monitoring system records the feedback signal and converts it into a numerical signal to realize data intercommunication and correction between the microseismic signal simulation system and the microseismic monitoring system during the maintenance and development of the microseismic monitoring system.

5. The microseismic rock fracture signal simulation device according to claim 4, characterized in that: The microseismic monitoring system includes connected microseismic sensors, microseismic acquisition instruments, microseismic timing servers and PC microseismic monitoring software. The microseismic sensors are coupled to the sensor knocking frame to receive the vibration generated by the sensor knocking frame in the first time. The microseismic acquisition instrument sends the knocking time of the sensor knocking frame and the vibration time when the microseismic sensor is knocked to the PC microseismic monitoring software, thereby realizing time recording during the development and maintenance of the microseismic monitoring system. The PC microseismic monitoring software is connected to the microseismic acquisition instrument to implement the issuance of operation instructions.

6. The microseismic rock fracture signal simulation device according to claim 5, characterized in that: The transformer circuit includes a current transformer, the solenoid valve is arranged adjacent to the current transformer, and collector channels connected to the microseismic collector are provided at both ends of the current transformer. When the solenoid valve is knocked, the current transformer synchronously generates an induced current, and the microseismic collector converts the induced current signal into a digital signal and transmits it to the PC microseismic monitoring software, thereby recording the exact knocking time of the sensor knocking frame.

7. The microseismic rock fracture signal simulation device according to claim 6, characterized in that: The GPS antenna is responsible for receiving Beidou satellite time information, and sending an electric frequency time signal to the knocking circuit control board based on the IEEE1588 v2 protocol function, and storing the time information in a time register module in the knocking circuit control board. The PC control software transmits the GPS time information recorded in the knocking circuit control board to the solid-state hard disk of the computer where the PC control software is installed through the IEEE1588 v2 protocol, and displays the GPS time through the software.

8. The microseismic rock fracture signal simulation device according to claim 7, characterized in that: The microseismic monitoring system includes several microseismic acquisition instruments, each of which is connected to several microseismic sensors. The microseismic signal simulation system includes several sensor knocking racks connected to the knocking circuit control board. Each of the microseismic sensors is connected to the sensor knocking rack in a one-to-one correspondence. The PC control software controls multiple sensor knocking racks to knock simultaneously or sequentially, or the PC control software controls each of the sensor knocking racks to knock at a certain time interval.

9. The microseismic rock fracture signal simulation device according to claim 8, characterized in that: The microseismic timing server is connected to each of the microseismic acquisition instruments and performs time synchronization and timing on each of the microseismic acquisition instruments so that the knocking time recorded by each of the microseismic acquisition instruments is unified.

10. The microseismic rock fracture signal simulation device according to claim 9, characterized in that: After the microseismic timing server provides time to each of the microseismic collectors, the microseismic collector, when receiving the induced current from the current transformer, inputs the numerical value of the induced current and the time information recorded in the time register of the microseismic collector to the PC microseismic monitoring software through the data network cable. The PC microseismic monitoring software has a visualization function, and the knocking time and number of the sensor knocking frame are recorded through the PC microseismic monitoring software.

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