Screen assembly and electronic equipment

Abstract

The invention provides a screen assembly and electronic equipment, and belongs to the technical field of electronic equipment. The buffer layer is arranged on one side of the display screen; the heat dissipation piece is arranged on the side, away from the display screen, of the buffer layer; the shielding layer is arranged on the side, away from the buffer layer, of the heat dissipation piece; wherein the edge of the heat dissipation piece is correspondingly provided with at least one gap, the shielding layer covers the gap, the shielding layer is provided with a through hole, and the through hole is communicated with the gap.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic equipment, and specifically relates to a screen assembly and an electronic equipment. Background Art

[0002] In the related art, in order to improve the heat dissipation performance of electronic equipment, a heat sink is usually added to the buffer layer (SCF, Super Clear Film) on the back of the display screen, and an adhesive is provided around the heat sink, and the adhesive is bonded to the copper foil to ensure the adhesion between the display screen and the copper foil. However, due to process reasons, there is a gap between the heat sink and the adhesive. When using an ultrasonic fingerprint sensor, there is also a gap between the ultrasonic fingerprint sensor and the heat sink. When the component is subjected to a high-pressure degassing process, a pressure difference will occur on both sides of the copper foil corresponding to the gap position, which will cause the copper foil and the buffer layer to collapse. Visible marks can be produced on the display screen through the reflection of light, thus affecting the user experience. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a screen assembly and an electronic device that can effectively solve the technical problem of visible marks on the display screen.

[0004] In a first aspect, an embodiment of the present application provides a screen assembly, including:

[0005] Display screen;

[0006] A buffer layer is arranged on one side of the display screen;

[0007] A heat sink is arranged on a side of the buffer layer away from the display screen;

[0008] A shielding layer, arranged on a side of the heat sink away from the buffer layer;

[0009] There is at least one gap corresponding to the edge of the heat sink, the shielding layer covers the gap, the shielding layer has a through hole, and the through hole is connected to the gap.

[0010] As a possible implementation, the orthographic projection of the heat sink on the display screen has a plurality of side edges, each side edge in the orthographic projection of the heat sink on the display screen corresponds to at least one gap, and each gap is connected to at least one through hole.

[0011] As a possible implementation, the length of the side of the heat sink in the orthographic projection on the display screen is positively correlated with the length of the gap.

[0012] As a possible implementation, the length of the side of the heat sink in the orthographic projection on the display screen is positively correlated with the number of through holes.

[0013] As a possible implementation, the screen assembly further includes:

[0014] The covering member at least covers a side of the heat dissipating member away from the buffer layer.

[0015] As a possible implementation, the covering member and the buffer layer form a closed accommodating cavity, the heat sink is located in the accommodating cavity, and the gap is located on a side of the buffer layer away from the heat sink.

[0016] As a possible implementation, the screen assembly further includes:

[0017] The bonding member is arranged between the buffer layer and the shielding layer, the bonding member is located outside the heat sink, and there is at least one gap between the bonding member and the edge of the heat sink.

[0018] As a possible implementation, the heat sink has an avoidance hole, and both the outer edge of the heat sink and the inner edge of the heat sink have gaps.

[0019] As a possible implementation, the screen assembly further includes:

[0020] The fingerprint sensor is attached to the display screen or the buffer layer, and there is at least one gap between the fingerprint sensor and the edge of the heat sink.

[0021] In a second aspect, an embodiment of the present application provides an electronic device, including:

[0022] Frame;

[0023] As for the screen assembly provided in the embodiment of the first aspect, the screen assembly is arranged on a frame.

[0024] In an embodiment of the present application, the screen assembly includes a display screen, a buffer layer, a heat sink and a shielding layer. The buffer layer is arranged on one side of the display screen, the heat sink is arranged on the side of the buffer layer facing away from the display screen, and the shielding layer is arranged on the side of the heat sink facing away from the buffer layer.

[0025] Among them, due to process reasons, at least one gap will be left at the edge of the heat sink, and a through hole is provided on the shielding layer, and the through hole and the gap are connected. Then, when the high-pressure degassing process is carried out, the through hole can connect the two sides of the shielding layer, thereby reducing or eliminating the pressure difference on both sides of the shielding layer, and reducing the possibility of the buffer layer and the shielding layer collapsing at the gap, thereby reducing the technical problem of the screen assembly having a visible imprint and improving the appearance of the screen assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0027] Figure 1 A schematic diagram of a screen assembly provided by an embodiment of the present application is shown;

[0028] Figure 2 A schematic diagram showing a buffer layer, a heat sink, a bonding member and a shielding layer in a screen assembly provided by an embodiment of the present application is shown;

[0029] Figure 3 A schematic diagram of a buffer layer, a heat sink, a bonding member, a shielding layer, and a fingerprint sensor in a screen assembly provided by an embodiment of the present application is shown;

[0030] Figure 4 A schematic diagram of a bonding member and a heat sink in a screen assembly provided by an embodiment of the present application is shown;

[0031] Figure 5 A schematic diagram of a bonding member and a heat sink in a screen assembly provided by an embodiment of the present application is shown;

[0032] Figure 6 A schematic diagram of a screen assembly provided by an embodiment of the present application is shown;

[0033] Figure 7 A schematic diagram showing a shielding layer in a screen assembly provided by an embodiment of the present application is shown;

[0034] Figure 8 A schematic diagram of a heat sink and a fingerprint sensor in a screen assembly provided by an embodiment of the present application is shown;

[0035] Fig. 9 A schematic diagram of an electronic device provided by an embodiment of the present application is shown.

[0036] Figures 1 to 9 Reference numerals:

[0037] 100 screen assembly, 110 display screen, 120 buffer layer, 130 heat sink, 132 avoidance hole, 140 gap, 150 shielding layer, 152 through hole, 160 covering part, 162 accommodating cavity, 170 adhesive part, 180 fingerprint sensor, 200 electronic device, 210 frame. DETAILED DESCRIPTION

[0038] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0039] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0040] In the description of the present application, it should be understood that the terms "upper", "inner", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0041] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0042] Combine the following Figures 1 to 9 A screen assembly 100 and an electronic device 200 according to an embodiment of the present application are described.

[0043] First, as Figure 1 , Figure 2 and Figure 3 As shown, an embodiment of the present application provides a screen assembly 100, including: a display screen 110; a buffer layer 120, arranged on one side of the display screen 110; a heat sink 130, arranged on the side of the buffer layer 120 away from the display screen 110; a shielding layer 150, arranged on the side of the heat sink 130 away from the buffer layer 120; wherein, the edge of the heat sink 130 corresponds to at least one gap 140, the shielding layer 150 covers the gap 140, and the shielding layer 150 has a through hole 152, and the through hole 152 is connected to the gap 140.

[0044] In the embodiment of the present application, the screen assembly 100 includes a display screen 110, a buffer layer 120, a heat sink 130 and a shielding layer 150. The buffer layer 120 is arranged on one side of the display screen 110, the heat sink 130 is arranged on the side of the buffer layer 120 away from the display screen 110, and the shielding layer 150 is arranged on the side of the heat sink 130 away from the buffer layer 120.

[0045] Among them, due to process reasons, at least one gap 140 will be left between the edge of the heat sink 130 and other components, and a through hole 152 is provided on the shielding layer 150, and the through hole 152 is connected to the gap 140. Then, when the high-pressure degassing process is performed, the through hole 152 can connect the two sides of the shielding layer 150, thereby reducing or eliminating the pressure difference on both sides of the shielding layer 150, and reducing the possibility of the buffer layer 120 and the shielding layer 150 collapsing at the gap 140, thereby reducing the technical problem of the screen assembly 100 having a visible imprint and improving the appearance of the screen assembly 100.

[0046] The present application provides a through hole 152 on the shielding layer 150, and the through hole 152 can be of any shape, for example, circular, elliptical, polygonal or linear, and connects the two sides of the shielding layer 150 through the through hole 152, that is, the through hole 152 connects the gap 140 and the side of the shielding layer 150 away from the gap 140. In this way, during the degassing process, there will be no pressure difference between the gap 140 and the side of the shielding layer 150 away from the gap 140. The degassing pressure directly acts on the foam to press the buffer layer, which can solve the problem of mold imprint on the display screen 110 caused by collapse or warping of the buffer layer.

[0047] like Figure 4 , Figure 5 and Figure 6 As shown, as a possible implementation, the heat sink 130 has a plurality of side edges in its orthographic projection on the display screen, each side edge in the orthographic projection of the heat sink 130 on the display screen corresponds to at least one gap 140 , and each gap 140 is connected to at least one through hole 152 .

[0048] Specifically, the orthographic projection of the heat sink 130 on the display screen has multiple side edges, and each side edge in the orthographic projection of the heat sink 130 on the display screen corresponds to at least one gap 140, that is, each side edge of the circumference of the heat sink 130 corresponds to a gap 140, and the number of gaps 140 can be one, two, or more, etc., thereby ensuring the installation effect of the heat sink 130.

[0049] Furthermore, each gap 140 is connected to at least one through hole 152, so as to ensure that each gap 140 can balance the pressure difference, thereby solving the problem of mold imprint on the display screen 110 caused by the collapse or warping of the buffer layer.

[0050] At least two sides of the heat sink 130 in the orthographic projection on the display screen may correspond to the same gap 140 , or each side of the heat sink 130 in the orthographic projection on the display screen may correspond to at least one gap 140 .

[0051] Also, the side of the heat sink 130 in the orthographic projection on the display screen can be a straight line or a curve, etc. That is, the orthographic projection of the heat sink 130 on the display screen can be a polygon, a circle, an ellipse, an oval, or other shapes composed of straight lines and curves, etc.

[0052] like Figure 5 and Figure 6 As shown, as a possible implementation, each side of the heat sink 130 in the orthographic projection on the display screen corresponds to at least one through hole 152 .

[0053] Specifically, the heat sink 130 has at least one through hole 152 next to each side of the orthographic projection on the display screen. Correspondingly, each side of the heat sink 130 in the orthographic projection on the display screen is correspondingly provided with a gap 140. Combining the gap 140 and the through hole 152, it is possible to adapt to the installation process of the screen assembly 100 while ensuring the effect of balancing the pressure difference of the gap 140 through the through hole 152.

[0054] like Figure 4 and Figure 5 As shown, as a possible implementation, the heat sink 130 has an avoidance hole 132 , and both the outer edge and the inner edge of the heat sink 130 have a gap 140 .

[0055] Specifically, the heat sink 130 is provided with an avoidance hole 132, which is used to avoid other components, such as a fingerprint sensor 180, a camera or a light sensor, etc. The outer edge of the heat sink 130 and the inner edge of the heat sink 130 both have gaps, and the shielding layer 150 is provided with a through hole 152 corresponding to the gap at the outer edge of the heat sink 130, and the shielding layer 150 is provided with a through hole 152 corresponding to the gap 140 at the inner edge of the heat sink 130, thereby ensuring the effect of balancing the pressure difference in the gap 140 through the through hole 152.

[0056] The number of the avoidance holes 132 may be one, two or more.

[0057] Optionally, the number of through holes 152 located on the outer side of the heat sink 130 is greater than the number of through holes 132 located on the inner side of the heat sink 130 .

[0058] like Figure 5 As shown, as a possible implementation, the length of the side of the heat sink 130 in the orthographic projection on the display screen 110 is positively correlated with the length of the gap 140 .

[0059] Specifically, the length of the side of the heat sink 130 in the orthographic projection on the display screen 110 is positively correlated with the length of the gap 140, that is, the longer the side of the heat sink 130, the longer the gap 140 corresponding to it, and the shorter the side of the heat sink 130, the shorter the gap 140 corresponding to it, thereby adapting to the installation process of the heat sink 130.

[0060] For example: the length H1 of the orthographic projection of the heat sink 130 on the display screen along the first direction EF is greater than the length H2 along the second direction CD. The first direction EF and the second direction CD are two perpendicular directions. In the orthographic projection of the heat sink 130 on the display screen, the length H3 of the gap 140 corresponding to the side extending along the first direction EF is greater than the length H4 of the gap 140 corresponding to the side extending along the second direction CD.

[0061] Specifically, the length H1 of the orthographic projection of the heat sink 130 on the display screen along the first direction EF is greater than the length H2 along the second direction CD. The first direction EF and the second direction CD are two perpendicular directions, thereby adapting to the shape of the display screen. In the orthographic projection of the heat sink 130 on the display screen, the length H3 of the gap 140 corresponding to the side extending along the first direction EF is greater than the length H4 of the gap 140 corresponding to the side extending along the second direction CD, thereby ensuring that each side of the heat sink 130 has sufficient gap 140 to adapt to the installation process of the screen assembly 100.

[0062] like Figure 6 As shown, as a possible implementation, the length of the side of the heat sink 130 in the orthographic projection on the display screen 110 is positively correlated with the number of the through holes 152 .

[0063] Specifically, the length of the side of the heat sink 130 in the orthographic projection on the display screen 110 is positively correlated with the number of through holes 152, that is, the longer the side of the heat sink 130, the more through holes 152 it corresponds to, and the shorter the side of the heat sink 130, the fewer through holes 152 it corresponds to, thereby ensuring the effect of balancing the pressure difference on both sides of the shielding layer 150.

[0064] For example: Figure 6 As shown, in the orthographic projection of the heat sink 130 on the display screen, the number of through holes 152 corresponding to the side extending along the first direction EF is greater than the number of through holes 152 corresponding to the side extending along the second direction CD.

[0065] Specifically, in the orthographic projection of the heat sink 130 on the display screen, the number of through holes 152 corresponding to the side extending along the first direction EF is greater than the number of through holes 152 corresponding to the side extending along the second direction CD, thereby ensuring that the through holes 152 corresponding to each side can smoothly balance the pressure difference and ensuring the effect of reducing the visible imprint of the screen assembly 100.

[0066] In which, each side of the heat sink 130 in the orthographic projection on the display screen corresponds to a gap 140, and the number of through holes 152 connected to the gaps 140 corresponding to the sides extending along the first direction EF is greater than the number of through holes 152 connected to the gaps 140 corresponding to the sides extending along the second direction CD.

[0067] For example, the orthographic projection of the heat sink 130 on the display screen may be a quadrilateral, and each gap 140 corresponding to each side in the orthographic projection of the heat sink 130 on the display screen is connected to at least one through hole 152. Specifically, the orthographic projection of the heat sink 130 on the display screen is generally a rectangular structure, and the side extending along the first direction EF corresponds to two through holes 152, and the side extending along the second direction CD corresponds to one through hole 152. The heat sink 130 may also be a triangular structure, a pentagonal structure, or a hexagonal structure, etc.

[0068] Among them, Figure 6 As shown, as a possible implementation, the length of the gap 140 is positively correlated with the number of through holes 152 , thereby ensuring the effect of balancing the pressure difference on both sides of the shielding layer 150 .

[0069] like Figure 2 and Figure 3 As shown, as a possible implementation, it further includes: a covering member 160 , which covers at least one side of the heat dissipation member 130 away from the buffer layer 120 .

[0070] Specifically, the screen assembly 100 also includes a covering 160, which covers at least one side of the heat sink 130 away from the buffer layer 120, thereby reducing the risk of the heat sink 130 entering the interior of the electronic device 200 through the through hole 152 in the event of damage, thereby improving the reliability of the electronic device 200.

[0071] The covering member 160 may be flexible or rigid, and the covering member 160 covers the heat sink 130 , thereby improving the integrity of the heat sink 130 and reducing the risk of the heat sink 130 breaking.

[0072] The thickness of the covering member 160 ranges from 0.001 mm to 0.03 mm. Specifically, the thickness of the covering member 160 may be 0.001 mm, 0.005 mm, 0.01 mm, 0.015 mm, 0.02 mm, 0.025 mm or 0.03 mm.

[0073] like Figure 2 and Figure 3 As shown, as a possible implementation, the covering member 160 and the buffer layer 120 form a closed accommodating cavity 162 , the heat sink 130 is located in the accommodating cavity 162 , and the gap 140 is located on a side of the buffer layer 120 away from the heat sink 130 .

[0074] Specifically, the covering 160 and the buffer layer 120 form a closed accommodating cavity 162, and the heat sink 130 is located in the accommodating cavity 162, thereby ensuring that debris of the heat sink 130 will not spread to the outside of the covering 160, thereby improving the reliability of the electronic device 200, and ensuring that the heat sink 130 and the buffer layer 120 are in contact with each other, thereby ensuring the heat dissipation effect.

[0075] After installing the heat sink 130 , the covering member 160 can be bonded to the buffer layer 120 to form a closed accommodating cavity 162 , and the heat sink 130 is covered therein, thereby ensuring that debris detached from the heat sink 130 will not enter the interior of the electronic device 200 through the through hole 152 .

[0076] As a possible implementation, the covering member 160 is a resin covering member; and the heat sink 130 is a graphite heat sink.

[0077] Specifically, the covering 160 is a resin covering, which has high reliability and strong sealing. The heat sink 130 is a graphite heat sink, which is usually formed by powder pressing. When the electronic device 200 falls, the heat sink 130 may shed chips. Therefore, covering the heat sink 130 with the covering 160 can reduce the possibility of chips of the heat sink 130 entering the interior of the electronic device 200 through the through hole 152.

[0078] Since graphite material is conductive, if debris from the heat sink 130 enters the interior of the electronic device 200 through the through hole 152, it may easily cause a short circuit in other components inside the electronic device 200. Therefore, adding the covering 160 can reduce the risk of short circuits in components inside the electronic device 200 and improve the stability of the electronic device 200.

[0079] The material of the package may be a resin material, such as polyethylene terephthalate (PET), polycarbonate (PC) or polyimide (PI).

[0080] Of course, in other embodiments of the present application, the material of the covering member 160 may also be metal material or plastic material.

[0081] The heat sink 130 may be a pyrolytic graphite sheet (PGS) or a metal sheet.

[0082] like Figure 1 , Figure 2 and Figure 3 As shown, as a possible implementation, it also includes: an adhesive member 170, which is arranged between the buffer layer 120 and the shielding layer 150, and the adhesive member 170 is located on the outside of the heat dissipation member 130, and there is at least one gap 140 between the adhesive member 170 and the edge of the heat dissipation member 130.

[0083] Specifically, the screen assembly 100 also includes an adhesive member 170, which is disposed on the side of the buffer layer 120 away from the display screen 110, and the adhesive member 170 is located on the outside of the heat sink 130, that is, the adhesive member 170 surrounds the peripheral side of the heat sink 130, and the shielding layer 150 is disposed on the side of the adhesive member 170 and the heat sink 130 away from the buffer layer 120, and then the buffer layer 120 and the shielding layer 150 are bonded by the adhesive member 170, so that the screen assembly 100 forms a whole.

[0084] Among them, there is at least one gap 140 between the edge of the heat sink 130 and the adhesive 170, and a through hole 152 is provided on the shielding layer 150, and the through hole 152 is connected to the gap 140. Then, when the high-pressure degassing process is performed, the through hole 152 can connect the two sides of the shielding layer 150, thereby reducing or eliminating the pressure difference on both sides of the shielding layer 150, and reducing the possibility of the buffer layer 120 and the shielding layer 150 collapsing at the gap 140, thereby reducing the technical problem of the screen assembly 100 having a visible imprint and improving the appearance of the screen assembly 100.

[0085] Specifically, the gap 140 may surround a circumference of the heat sink 130 , and there are at least two through holes 152 , and the at least two through holes 152 are arranged at intervals.

[0086] Specifically, the adhesive member 170 is an annular structure, surrounding the entire heat sink 130, so that the gap 140 surrounds the heat sink 130. Therefore, at least two through holes 152 are provided, and the at least two through holes 152 are provided at intervals, so that various parts of the gap 140 can be exhausted and air intake more evenly, ensuring that there is no risk of collapse of the buffer layer and the shielding layer 150 in the entire gap 140.

[0087] The heat sink 130 can be prepared in a circular, polygonal or irregular shape according to actual conditions. The adhesive member 170 is arranged around the entire heat sink 130 to ensure the bonding strength between the shielding layer 150 and the buffer layer 120 .

[0088] like Figure 3 , Figure 6 and Figure 8 As shown, as a possible implementation, it also includes: a fingerprint sensor 180 attached to the display screen 110 or the buffer layer 120, and there is at least one gap 140 between the fingerprint sensor 180 and the edge of the heat sink 130.

[0089] Specifically, the screen assembly 100 further includes a fingerprint sensor 180 , which is attached to the display screen 110 or the buffer layer 120 , thereby realizing a fingerprint recognition function of the screen assembly 100 .

[0090] Among them, the fingerprint sensor 180 is located on the inner side of the heat sink 130, the heat sink 130 surrounds the outer side of the fingerprint sensor 180, and there is at least one gap between the edge of the heat sink 130 and the fingerprint sensor 180, and a through hole 152 is provided on the shielding layer 150, and the through hole 152 is connected to the gap 140, and then when the high-pressure degassing process is performed, the through hole 152 can connect the two sides of the shielding layer 150, thereby reducing or eliminating the pressure difference on both sides of the shielding layer 150, and reducing the possibility of the buffer layer 120 and the shielding layer 150 collapsing at the gap 140, thereby reducing the technical problem of the screen assembly 100 having a visible imprint and improving the appearance of the screen assembly 100.

[0091] The fingerprint sensor 180 may be an ultrasonic fingerprint sensor 180 , an optical fingerprint sensor, a semiconductor fingerprint sensor 180 , a radio frequency fingerprint sensor 180 , or the like.

[0092] The fingerprint sensor 180 can be attached to the side of the buffer layer 120 facing away from the display screen 110, and then through a degassing process, pressure is directly applied to the buffer layer 120, so that the buffer layer 120 is compressed, and the through hole 152 can balance the pressure difference between the gap 140 and the side of the shielding layer 150 facing away from the gap 140.

[0093] like Figure 6 and Figure 8 As shown, as a possible implementation, the gap 140 surrounds the fingerprint sensor 180, and there are at least two through holes 152, and the at least two through holes 152 are arranged at intervals.

[0094] Specifically, the gap 140 surrounds the entire fingerprint sensor 180, so at least two through holes 152 are set, and the at least two through holes 152 are set at intervals, so that various parts of the gap 140 can be exhausted and inlet more evenly, ensuring that there is no risk of collapse of the buffer layer and the shielding layer 150 in the entire gap 140.

[0095] Optionally, a fingerprint sensor 180 is disposed on the inner side of the heat sink 130 , an adhesive member 170 is disposed on the outer side of the heat sink 130 , at least one gap 140 is provided between the heat sink 130 and the adhesive member 170 , and at least one gap 140 is provided between the heat sink 130 and the fingerprint sensor 180 .

[0096] As a possible implementation, Figure 7 As shown, along the circumference of the heat sink 130, the length L1 of the through hole 152 is greater than or equal to 0.1 mm; Figure 3 As shown, the width L2 of the gap 140 ranges from 0.1 mm to 1 mm, and along the width direction AB of the gap 140 , the length L3 of the through hole 152 ranges from 0.01 mm to 0.3 mm.

[0097] Specifically, Figure 3 and Figure 7 As shown, along the circumference of the heat sink 130, the length L1 of the through hole 152 is greater than or equal to 0.1 mm; the width L2 of the gap 140 ranges from 0.1 mm to 1 mm, and along the width direction AB of the gap 140, the length L3 of the through hole 152 ranges from 0.01 mm to 0.3 mm. Through the above size limitations, the size of the through hole 152 will not affect the shielding effect of the shielding layer 150, and can ensure the flux and ventilation speed of the through hole 152, so as to ensure the effect of suppressing the collapse of the shielding layer 150 and the buffer layer 120.

[0098] Among them, along the circumference of the heat sink 130, the length of the through hole 152 can be 0.1mm, 0.12mm, 0.15mm, 0.2mm, 0.5mm, 1mm, 2mm, 3mm, 4mm or 5mm, etc. The width of the gap 140 can be 0.1mm, 0.2mm, 0.3mm, 0.5mm, 0.7mm, 0.9 or 1mm, etc. Along the width direction of the gap 140, the length of the through hole 152 can be 0.01mm, 0.02mm, 0.05mm, 0.1mm, 0.15mm, 0.2mm, 0.25mm or 0.3mm, etc.

[0099] As a possible implementation, the shielding layer 150 may be copper foil, aluminum foil or silver foil, etc., so as to achieve anti-interference of the display screen 110, improve the heat dissipation effect, and achieve an anti-static effect.

[0100] As a possible implementation manner, the adhesive member 170 may be polyethylene terephthalate and is located around the heat dissipation member 130 to enhance the adhesive force between the buffer layer 120 and the shielding layer 150 .

[0101] As a possible implementation, the buffer layer 120 may be a combination of a buffer foam (cushion) and an embossing glue (embo), etc. The buffer layer 120 may protect the back of the display screen 110 and reflect external light into the display screen 110 to improve contrast.

[0102] like Figure 2 and Figure 3 As shown, as a possible implementation, the orthographic projection of the through hole 152 toward the side of the display screen 110 and the orthographic projection of the gap 140 toward the side of the display screen 110 at least partially overlap, and the orthographic projection of the through hole 152 toward the side of the display screen 110 and the orthographic projection of the covering 160 toward the side of the display screen 110 at least partially overlap, completely overlap or are separated.

[0103] As a possible implementation, the display screen 110 may be an active-matrix organic light-emitting diode (AMOLED) panel, an organic light-emitting diode panel, or a liquid crystal display screen 110 , etc.

[0104] Second, as Fig. 9 As shown, an embodiment of the present application provides an electronic device 200 , including: a frame 210 ; and a screen assembly 100 as provided in the embodiment of the first aspect, wherein the screen assembly 100 is disposed on the frame 210 .

[0105] The electronic device 200 provided in the embodiment of the present application includes: the screen assembly 100 provided in the embodiment of the first aspect, and therefore has all the beneficial effects of the screen assembly 100 provided in the embodiment of the first aspect, which will not be stated one by one here.

[0106] The electronic device 200 may be a terminal, or may be another device other than the electronic device 200. For example, the electronic device 200 may be a mobile phone, a tablet computer, a laptop computer, a PDA, a music player, a private network communication terminal device (such as a walkie-talkie), a mobile Internet device (Mobile Internet Device, MID), an augmented reality / virtual reality / mixed reality device, a robot, a wearable device, an ultra-mobile personal computer (Ultra-Mobile Personal Computer, UMPC), a netbook or a personal digital assistant (Personal Digital Assistant, PDA), etc., and the embodiments of the present application are not specifically limited.

[0107] In the description of this specification, the description with reference to the terms "one embodiment" or "specific embodiment" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0108] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A screen assembly, characterized in that: include: Display screen; A buffer layer, arranged on one side of the display screen; A heat sink, arranged on a side of the buffer layer away from the display screen; A shielding layer, arranged on a side of the heat sink away from the buffer layer; There is at least one gap corresponding to the edge of the heat sink, the shielding layer covers the gap, the shielding layer has a through hole, and the through hole is connected to the gap.

2. The screen assembly according to claim 1, characterized in that: The orthographic projection of the heat sink on the display screen has a plurality of side edges, each side edge in the orthographic projection of the heat sink on the display screen corresponds to at least one of the gaps, and each of the gaps is connected to at least one of the through holes.

3. The screen assembly according to claim 2, characterized in that: The length of the side of the heat sink in the orthographic projection on the display screen is positively correlated with the length of the gap.

4. The screen assembly according to claim 2, characterized in that: The length of the side of the heat sink in the orthographic projection on the display screen is positively correlated with the number of the through holes.

5. The screen assembly according to claim 1, characterized in that: Also includes: The covering member at least covers a side of the heat dissipation member away from the buffer layer.

6. The screen assembly according to claim 5, characterized in that: The covering member and the buffer layer form a closed accommodating cavity, the heat sink is located in the accommodating cavity, and the gap is located on a side of the buffer layer away from the heat sink.

7. The screen assembly according to any one of claims 1 to 6, characterized in that: The heat sink has an avoidance hole, and both the outer edge of the heat sink and the inner edge of the heat sink have the gap.

8. The screen assembly according to any one of claims 1 to 6, characterized in that: Also includes: The bonding member is arranged between the buffer layer and the shielding layer, the bonding member is located outside the heat sink, and there is at least one gap between the bonding member and the edge of the heat sink.

9. The screen assembly according to any one of claims 1 to 6, characterized in that: Also includes: The fingerprint sensor is attached to the display screen or the buffer layer, and there is at least one gap between the fingerprint sensor and the edge of the heat sink.

10. An electronic device, characterized in that: include: Frame; The screen assembly as described in any one of claims 1 to 9, wherein the screen assembly is arranged on the frame.

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